Mixed type polishing brush and polishing machining method thereof
By designing a hybrid polishing brush, the combined structure of water-absorbing sponge and polishing rubber wire is used to solve the problem of uneven supply of polishing liquid, achieving uniform distribution and efficient polishing effect of polishing liquid, and extending the service life of the brush.
Patent Information
- Application Number
- CN202510444822.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2025-07-01
AI Technical Summary
Traditional polishing equipment cannot achieve uniform and continuous supply of polishing liquid, resulting in uneven polishing of product surfaces and affecting the polishing quality.
A hybrid polishing brush is designed, including a base, a water-absorbing sponge and a polishing rubber wire. The water-absorbing sponge is located between the base and the polishing rubber wire. The polishing liquid is continuously supplied through capillary action. Combined with the spacing design of water-absorbing sponge and polishing rubber wire of specific thickness and density, it ensures that the polishing liquid is evenly distributed.
The uniform and stable supply of polishing liquid is achieved, the uniformity and efficiency of polishing is improved, the service life of the brush is extended, and the polishing accuracy is ensured.
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Figure CN120228640A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of polishing equipment, and particularly to a hybrid polishing brush and a polishing processing method thereof. Background Art
[0002] In current industrial production, the polishing process is widely applied in many fields, such as metal processing, electronic manufacturing, optical instrument production, etc. The purpose is to improve the surface finish of products and improve the appearance and performance of products. Many problems that need to be solved urgently have emerged in traditional polishing technologies and equipment during long-term practice.
[0003] Common polishing equipment often fails to achieve uniform and continuous supply of polishing liquid. Some equipment uses the method of directly spraying the polishing liquid, which results in uneven distribution of the polishing liquid on the product surface, and it is easy to have the situation of excessive or insufficient local polishing, seriously affecting the overall polishing quality of the product. Summary of the Invention
[0004] In order to solve the technical problems existing in the background art, the present invention proposes a hybrid polishing brush and a polishing processing method thereof.
[0005] A hybrid polishing brush proposed by the present invention includes: a base, a water-absorbing sponge disposed on the base, and polishing filaments disposed on the water-absorbing sponge; the water-absorbing sponge is located between the base and the polishing filaments, and is used for storing the polishing liquid and continuously supplying the polishing liquid to the polishing filaments through capillary action.
[0006] Preferably, the thickness of the water-absorbing sponge is 5 - 15 mm, and its density is 20 - 50 kg / m 3 , so as to optimize the adsorption and release performance of the polishing liquid.
[0007] Preferably, the polishing filaments are evenly spaced and implanted at the bottom of the water-absorbing sponge, and the distance between adjacent polishing filaments is 2 - 5 mm.
[0008] Preferably, a polishing liquid inlet is provided on the base, and the polishing liquid inlet penetrates through the base and communicates with the water-absorbing sponge, and is used for injecting the polishing liquid into the water-absorbing sponge.
[0009] Preferably, the polishing liquid inlet is a plurality of conduits, and is annularly arrayed along the upper surface of the base, and the base is made of PVC material.
[0010] Preferably, the roots of the polishing filaments are embedded inside the water-absorbing sponge to enhance the bonding strength between the polishing filaments and the water-absorbing sponge.
[0011] A polishing processing method includes the following steps:
[0012] Clamp the product to be processed onto the polishing equipment;
[0013] Inject polishing liquid into the absorbent sponge through the polishing liquid inlet;
[0014] Start the equipment and use the synergistic effect of polishing rubber wire and absorbent sponge to evenly distribute the polishing liquid on the surface of the product for polishing.
[0015] Preferably, the injection amount of the polishing liquid is 70-90% of the saturated adsorption amount of the absorbent sponge to ensure continuous supply of the polishing liquid and avoid overflow.
[0016] The hybrid polishing brush and the polishing method thereof proposed by the present invention have the following advantages:
[0017] 1. The polishing liquid inlet ducts distributed in a circular array on the base, combined with the absorbent sponge of specific thickness and density, allow the polishing liquid to be evenly adsorbed and stably and continuously supplied to the polishing rubber wire through capillary action, ensuring that sufficient and uniform polishing liquid can be obtained everywhere on the product surface, significantly improving the uniformity and efficiency of polishing. The polishing rubber wires are evenly planted at the bottom of the absorbent sponge at intervals of 2-5mm, which not only ensures sufficient polishing coverage area, but also prevents the polishing liquid from penetrating and damaging the product due to the density of the rubber wires, ensuring efficient and safe polishing operations. The root of the polishing rubber wire is embedded in the absorbent sponge, which greatly enhances the bonding strength between the two. During high-speed rotation polishing, the polishing rubber wire is not easy to fall off, which extends the service life of the brush and ensures the stability of the polishing work.
[0018] 2. In the polishing processing method, strict product clamping requirements ensure the polishing accuracy; the injection amount of the polishing liquid is controlled at 70-90% of the saturated adsorption amount of the absorbent sponge to avoid overflow waste and environmental pollution while ensuring the continuous supply of polishing liquid; the equipment speed, polishing time and other parameters can also be flexibly adjusted according to product characteristics to achieve accurate and high-quality polishing. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is the overall structural diagram of the hybrid polishing brush proposed by the present invention;
[0020] Figure 2 It is a side view of the hybrid polishing brush proposed by the present invention. DETAILED DESCRIPTION
[0021] refer to Figure 1-2 The present invention provides a hybrid polishing brush, comprising:
[0022] Base 1: Base 1 is made of PVC material. PVC material has good corrosion resistance, insulation and certain mechanical strength, and can stably support the entire polishing brush structure. The base 1 is provided with a polishing liquid inlet 4. These polishing liquid inlets 4 are multiple conduits and are distributed in a circular array along the upper surface of the base 1. This design can make the injected polishing liquid more evenly dispersed to all parts of the water-absorbing sponge 2, ensuring that the water-absorbing sponge 2 absorbs the polishing liquid evenly, laying the foundation for the subsequent stable supply of polishing liquid;
[0023] Water-absorbing sponge 2: The water-absorbing sponge 2 is arranged on the base 1, and its thickness is designed to be 5-15mm, and its density is controlled at 20-50kg / m 3 After a large number of experimental verifications, it was found that within this thickness and density range, the absorbent sponge 2 can optimize the adsorption and release performance of the polishing liquid. The moderate thickness can ensure that there is enough storage space to accommodate the polishing liquid, while the efficiency of the capillary action will not be affected by excessive thickness; the appropriate density makes the internal pore structure of the sponge reasonable, which is convenient for rapid adsorption of the polishing liquid and can stably supply the polishing rubber wire 3 with the polishing liquid through capillary action during the working process. The absorbent sponge 2 is located between the base 1 and the polishing rubber wire 3, and plays a key role in storing the polishing liquid. It is the core component of the entire brush to achieve continuous and uniform polishing;
[0024] Polishing rubber wire 3: The polishing rubber wire 3 is evenly spaced and planted at the bottom of the absorbent sponge 2. The spacing between adjacent polishing rubber wires 3 is 2-5mm. This spacing setting can not only ensure that there is enough polishing coverage area on the product surface, but also avoid the problem that the rubber wire is too dense, resulting in difficulty in uniform penetration of the polishing liquid and excessive friction that damages the product surface. The root of the polishing rubber wire 3 is embedded in the absorbent sponge 2. Through this embedding method, the bonding strength between the polishing rubber wire 3 and the absorbent sponge 2 is greatly enhanced, so that during high-speed rotation polishing, the polishing rubber wire 3 will not easily fall off the absorbent sponge 2, thereby ensuring the service life of the brush and the stability of the polishing work.
[0025] A polishing method includes the following steps: product clamping: accurately clamping the product to be processed to the polishing equipment. During the clamping process, the product position must be strictly ensured to be accurately fixed to avoid displacement during the polishing process, which affects the polishing accuracy. Products of different shapes and sizes may need to be adapted to different clamping fixtures. Appropriate fixtures should be selected according to the specific characteristics of the product to ensure the firmness and stability of the clamping;
[0026] Polishing liquid injection: The polishing liquid is injected into the water-absorbing sponge 2 through the polishing liquid inlet 4. Since the polishing liquid inlets 4 are distributed in an annular array on the upper surface of the base 1, the injection can be carried out slowly during injection, so that the polishing liquid can be evenly absorbed by the water-absorbing sponge 2. At the same time, the injection amount of the polishing liquid is controlled within 70-90% of the saturated adsorption capacity of the water-absorbing sponge 2. This proportion range has been actually tested, which can not only ensure that the water-absorbing sponge 2 stores enough polishing liquid to continuously supply the polishing rubber filaments 3 during the subsequent polishing process, but also effectively avoid the waste caused by the overflow of the polishing liquid due to excessive injection amount and the possible pollution to the equipment and the working environment;
[0027] Start the equipment for polishing: After starting the polishing equipment, the equipment drives the hybrid polishing brush to rotate at a high speed. At this time, the polishing rubber filaments 3 and the water-absorbing sponge 2 cooperate. The water-absorbing sponge 2 continuously transports the stored polishing liquid to the polishing rubber filaments 3 through capillary action. The polishing rubber filaments 3 evenly apply the polishing liquid on the surface of the product during the high-speed rotation process. Due to the reasonable distribution spacing of the polishing rubber filaments 3, the polishing liquid can evenly cover all areas of the product surface, thereby achieving an efficient and uniform polishing effect. During the polishing process, the parameters such as the rotation speed and polishing time of the polishing equipment can be appropriately adjusted according to the material, hardness and required polishing accuracy of the product to achieve the best polishing quality.
[0028] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and the inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.
Claims
1. A mixed polishing brush, characterized in that: include: A base (1), a water-absorbing sponge (2) arranged on the base (1), and a polishing rubber wire (3) arranged on the water-absorbing sponge (2); the water-absorbing sponge (2) is located between the base (1) and the polishing rubber wire (3), and is used to store polishing liquid and continuously supply the polishing liquid to the polishing rubber wire (3) through capillary action.
2. A hybrid polishing brush according to claim 1, characterized in that: The thickness of the water-absorbing sponge (2) is 5-15 mm, and its density is 20-50 kg / m 3 , in order to optimize the adsorption and release performance of the polishing liquid.
3. A hybrid polishing brush according to claim 2, characterized in that: The polishing rubber threads (3) are evenly spaced and implanted at the bottom of the water-absorbing sponge (2), and the distance between adjacent polishing rubber threads (3) is 2-5 mm.
4. A hybrid polishing brush according to claim 3, characterized in that: The base (1) is provided with a polishing liquid inlet (4), which passes through the base (1) and is connected to the water-absorbing sponge (2) for injecting polishing liquid into the water-absorbing sponge (2).
5. A hybrid polishing brush according to claim 4, characterized in that: The polishing liquid inlet (4) is a plurality of conduits and is distributed in a circular array along the upper surface of the base (1); the base (1) is made of PVC material.
6. A hybrid polishing brush according to claim 5, characterized in that: The root of the polishing rubber thread (3) is embedded in the water-absorbing sponge (2) to enhance the bonding strength between the polishing rubber thread (3) and the water-absorbing sponge (2).
7. A polishing method, applicable to the hybrid polishing brush according to any one of claims 1 to 6, characterized in that: The following steps are involved: Clamp the product to be processed into the polishing equipment; Injecting polishing liquid into the absorbent sponge (2) through the polishing liquid inlet (4); The equipment is started, and the polishing liquid is evenly distributed on the surface of the product to perform polishing by utilizing the coordinated action of the polishing rubber wire (3) and the water-absorbing sponge (2).
8. The polishing method according to claim 7, characterized in that: The injection amount of the polishing liquid is 70-90% of the saturated adsorption amount of the absorbent sponge (2) to ensure the continuous supply of the polishing liquid and avoid overflow.