Substrate image measuring system and method based on fluorescence

Abstract

The invention discloses a fluorescence-based substrate image measuring system and a method thereof. The fluorescence-based substrate image measuring system comprises an exciting light generating device, a line scanning image capturing device, an image measuring device and an analyzing device, the exciting light generating device provides exciting light to the substrate on the to-be-detected area, so that the substrate generates fluorescent light. The line scanning image capturing device is used for capturing an image of a substrate to obtain a two-dimensional fluorescence image. The image measuring device is connected or coupled with the line scanning image capturing device and generates two-dimensional line contour information according to the two-dimensional fluorescence image. The analysis device receives and analyzes the two-dimensional line contour information to establish substrate measurement information. According to the invention, the whole substrate is subjected to comprehensive measurement application through the fluorescent image, so that the accuracy of circuit measurement can be improved, and the quality of image circuit measurement is improved.

Description

Technical Field

[0001] The present invention relates to a substrate image measurement system and method, and particularly to a fluorescence-based substrate image measurement system and method. Background Art

[0002] Fluorescence detection of a circuit board is performed by irradiating excitation light onto the circuit board. Through the response of organic substances on the circuit board to the excitation light, fluorescence is emitted, and this detection method is used to check for defects on the circuit board, such as cracks, notches, or excessive solder.

[0003] The advantages of the fluorescence detection method are high sensitivity, which can detect very subtle features. For example, fluorescence detection can display extremely subtle defects, such as tiny cracks, weak solder joints, or micro short circuits, which may be overlooked in other types of image detection methods. In addition, in terms of detection, fluorescence detection can obtain quite detailed features of the object to be measured.

[0004] Existing machines (such as QV equipment) use a structure of a surface scanning image capture device, which can only measure a small area of the substrate at a time, and the time required for each measurement is very long. Summary of the Invention

[0005] The main object of the present invention is to provide a fluorescence-based substrate image measurement system, including an excitation light generation device, a line scanning image capture device, an image measurement device, and an analysis device. The excitation light generation device provides excitation light to the substrate on the area to be measured, causing the substrate to emit fluorescence. The line scanning image capture device is used to capture an image of the substrate to obtain a two-dimensional fluorescence image. The image measurement device is connected or coupled to the line scanning image capture device, and based on the two-dimensional fluorescence image, two-dimensional line profile information is generated. The analysis device receives and analyzes the two-dimensional line profile information to establish a substrate measurement information.

[0006] Optionally, the substrate measurement information includes line width, line pitch, aperture diameter, polygon perimeter, radian, circularity, or concentricity.

[0007] Optionally, the analysis device analyzes the two-dimensional line profile information to generate a substrate distribution information.

[0008] Optionally, the substrate distribution information is displayed in the form of a heat map or a grayscale map to present the distribution of the two-dimensional line profile information of the substrate.

[0009] Optionally, the substrate distribution information includes a line anomaly distribution information and a line accuracy distribution information.

[0010] Optionally, the analysis device compares the two-dimensional line profile information with the expected line size information at the corresponding positions to obtain an error value information, and generates the abnormal distribution of all the lines on the substrate based on the error value information to establish the line abnormal distribution information.

[0011] Optionally, the analysis device generates the distribution of the two-dimensional line profile information of all the measurement targets on the substrate based on a measurement target on the substrate to establish the line accuracy distribution information.

[0012] Optionally, the analysis device obtains the process capability index according to the maximum value, the minimum value and the average value in the two-dimensional line profile information of all the measurement targets, and combines with the expected line size information of the measurement targets.

[0013] Optionally, the image measurement device generates a plurality of measurement point information corresponding to the substrate according to the two-dimensional fluorescence image.

[0014] Another object of the present invention is to provide a fluorescence-based substrate image measurement method, including: providing excitation light to a substrate; capturing a fluorescence image of the substrate; processing the fluorescence image to generate a line profile information of the substrate; and analyzing the full-page measurement information according to the fluorescence image and the line profile information to generate a line information distribution trend graph.

[0015] Optionally, the line profile information includes line width, line pitch, aperture, polygon perimeter, radian, roundness or concentricity.

[0016] Optionally, further analyze the two-dimensional line profile information to generate a substrate distribution information.

[0017] Optionally, the substrate distribution information is displayed in the form of a heat map or a grayscale map to present the distribution of the two-dimensional line profile information of the substrate.

[0018] Optionally, the substrate distribution information includes a line abnormal distribution information and a line accuracy distribution information.

[0019] Optionally, the establishment of the line abnormal distribution information is to compare the two-dimensional line profile information with the expected line size information at the corresponding positions to obtain an error value information, and generate the abnormal distribution of all the lines on the substrate based on the error value information to establish the line abnormal distribution information.

[0020] Optionally, the establishment of the line accuracy distribution information is to generate the distribution of the two-dimensional line profile information of all the measurement targets on the substrate based on a measurement target on the substrate to establish the line accuracy distribution information.

[0021] Optionally, based on the maximum value, minimum value, and average value in the two-dimensional line profile information of all measurement targets, and in combination with the expected line size information of the measurement target, a process capability index is obtained.

[0022] Therefore, through the application of full-panel comprehensive measurement of the substrate using fluorescence images in the present invention, the accuracy of line measurement can be improved, thereby enhancing the quality of image line measurement. In addition, by using fluorescence detection in the present invention, the image of the object to be measured forms an effect similar to backlight and silhouette, which can avoid the image interference caused by surface contamination and oxidation of the object to be measured, achieving the highlighting of boundary features and reducing the impact of false defects generated by image measurement caused by oxidation scratches and contamination on the surface of the object to be measured. In addition, using the architecture of a line-scanning image capture device, compared with a surface-scanning image capture device, a fast measurement effect can be achieved. Brief Description of the Drawings

[0023] Figure 1 It is a block diagram of the substrate image measurement system of the present invention.

[0024] Figure 2 It is a block diagram of one embodiment of the fluorescence image measurement device of the present invention.

[0025] Figure 3 It is a schematic diagram showing the representation of the substrate and control points in the present invention.

[0026] Figure 4 (a) to (f) are schematic diagrams of the appearances of different line types in the present invention.

[0027] Figure 5 It is a top view schematic diagram of the substrate line of the present invention.

[0028] Figure 6 It is a top view schematic diagram of one embodiment of the line turning in the present invention.

[0029] Figure 7 It is a top view schematic diagram of one embodiment of the circular pad area in the present invention.

[0030] Figure 8 It is a top view schematic diagram of one embodiment of the metal ring in the present invention.

[0031] Figure 9 It is a top view schematic diagram of one embodiment of the circular hole on the substrate in the present invention.

[0032] Figure 10 It is a full-panel anomaly distribution diagram in the present invention.

[0033] Figure 11 It is a substrate measurement information diagram in the present invention.

[0034] Figure 12 It is a sub-region anomaly distribution diagram of the substrate in the present invention.

[0035] Figure 13 It is the circuit accuracy distribution information diagram in the present invention.

[0036] Figure 14 It is the flow schematic diagram of the substrate image measurement method in the present invention.

[0037] The markings in the figure are as follows:

[0038] 100 Substrate image measurement system

[0039] W Substrate

[0040] 10 Excitation light generation device

[0041] 20 Line scan image capture device

[0042] 30 Image measurement device

[0043] 40 Analysis device

[0044] 50 Human-machine operation interface

[0045] 51 Host computer

[0046] 52 Display

[0047] 53 Input device

[0048] Ld1 Excitation light

[0049] J1 Diffuse fluorescence

[0050] BD1 Circuit

[0051] BD2 Organic layer

[0052] AR Sub-region

[0053] Y1 Control point / measurement point

[0054] UW Upper width of the circuit

[0055] DW Lower width of the circuit

[0056] S1 First side line width

[0057] S2 Second side line width

[0058] LR Circuit length

[0059] Ar Arc

[0060] AD Arc center

[0061] R Distance

[0062] MD Center of the circle

[0063] R1 Distance

[0064] R2 Distance

[0065] Outer Edge Boundary of B1 Metal Ring

[0066] Center of MD1

[0067] Inner Edge Boundary of B2 Metal Ring

[0068] Center of MD2

[0069] DT Distance

[0070] Bottom Surface Characteristic Region H1

[0071] Defect Region H2

[0072] Wall Characteristic Region H3

[0073] Top Surface Characteristic Region H4

[0074] Width L1

[0075] Width L2

[0076] Length L4

[0077] Width L5

[0078] Abnormal Distribution Information Diagram of Circuit I1

[0079] Upper Region K1

[0080] Lower Region K2

[0081] Substrate Measurement Information Diagram of Circuit I2

[0082] Abnormal Distribution Diagram of Sub - Region of Substrate of Circuit I3

[0083] Line Width Defect F1

[0084] Arc Defect F2

[0085] Concentricity Defect F3

[0086] Circuit Precision Distribution Information Diagram of Circuit I4

[0087] Sub - Region Sb1

[0088] Characteristic Impedance Line Rd1

[0089] Analysis Method of Substrate Etching Information 300 Specific Embodiment

[0090] The detailed description and technical content of the present invention will now be described with reference to the accompanying drawings. For the convenience of description, the scale of the drawings in the present invention is not necessarily drawn according to the actual scale and there may be an exaggeration. These drawings and their scales are not intended to limit the scope of the present invention.

[0091] In the present invention, the various materials and data described can be stored in any non-transitory storage device, such as stored on a local server device or a cloud server device, which is not limited in the present invention; or the various materials and data can be stored in the storage device of an individual device or in the database of a central control system, which is also not limited in the present invention.

[0092] In the present invention, the "module" and its corresponding functions can be loaded into the storage device and executed in cooperation by a single chip or a combination of multiple chips. The number of these chip configurations is not within the scope of what the present invention intends to limit. In addition, the chips can be, but are not limited to, a combination of devices such as a processor, a central processing unit (CPU), a microprocessor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a programmable logic device (PLD), etc., which is not limited in the present invention. The "storage device" described in the present invention can be, but is not limited to, a cache memory, a dynamic random access memory (DRAM), a persistent memory, etc., which are devices or combinations thereof that can be used for storing and retrieving data, and are not limited in the present invention.

[0093] The "substrate" described in the present invention may include, for example, but is not limited to, a printed circuit board (PCB), a flexible printed circuit (FPC), a ceramic substrate, a multilayer circuit board, or an integrated circuit board such as a wafer or chip, which is not limited in the present invention. The "circuit" described in the present invention may include, for example, but is not limited to, a metal circuit or an etched circuit on the substrate, which is not limited in the present invention. The substrate in the present invention may be a single board including only a set of circuit features or a composite board composed of multiple substrate sub-regions, and these embodiments are not limited in the present invention. In the embodiment of the composite board, the shape and size of each substrate sub-region may be the same or different. Generally, in mass production, multiple substrate sub-regions are usually integrated on a single board, and the substrate sub-regions are cut in the backend process to obtain multiple independent substrate modules.

[0094] Please first refer to the following Figure 1 , which is a block diagram of the substrate image measurement system of the present invention. This embodiment discloses a substrate image measurement system 100 that provides excitation light to the substrate W to cause the substrate W to generate fluorescence, uses the fluorescence to highlight the circuit profile of the substrate circuit, and then captures and processes the fluorescence image of the substrate W to generate two-dimensional circuit profile information of the substrate W, thereby measuring the circuit on the substrate W through the two-dimensional circuit profile information. The substrate image measurement system 100 mainly includes an excitation light generation device 10, a line scan image capture device 20, an image measurement device 30, and an analysis device 40.

[0095] The excitation light generating device 10 is configured to provide excitation light to a substrate W on a region to be measured, causing the substrate W to generate fluorescence. The line scan image capturing device 20 is configured to capture an image of the substrate W to obtain a two-dimensional fluorescence image. For providing viewing and operation by personnel, the substrate image measurement system 100 further includes a human-machine operation interface 50, which is configured to display the two-dimensional fluorescence image of the substrate W and two-dimensional line profile information for personnel reference. The human-machine operation interface 50 may include a computer device, and the computer device includes a host 51, a display 52 connected to the host 51, and an input device 53 (such as a mouse, a keyboard, etc.) connected to the host 51 for personnel to operate. In addition to being available for personnel to perform visual inspection, the human-machine operation interface 50 is also available for personnel to perform appropriate operations, such as generating various reference images or quantification charts based on the two-dimensional fluorescence image and two-dimensional line profile information, so as to facilitate subsequent use as a basis for correcting and compensating various variables in the substrate manufacturing process. In another embodiment, the human-machine operation interface 50 may also be replaced by a networked external device. The external device may include, for example, but is not limited to, a computer, a laptop computer, a mobile device, a server, or a network attached storage device (NAS), etc. These variations of the embodiments are not limited in the present invention.

[0096] Next, please refer to Figure 2 simultaneously, which is a block diagram of an embodiment of the fluorescence image measurement device of the present invention. The position irradiated by the excitation light Ld1 of the excitation light generating device 10 may be a peripheral region on the substrate W adjacent to the line BD1, causing the organic matter (such as the organic layer BD2) on the peripheral surface of the line to be excited to generate diffuse fluorescence J1, creating a brightness difference between the peripheral region of the line and the line BD1, thereby obtaining two-dimensional line profile information. The excitation light provided by the excitation light generating device 10 may include, for example, but is not limited to, ultraviolet light, X-ray, or any other specific light source that can excite organic matter to generate fluorescence, which is not limited in the present invention.

[0097] The line scan image capturing device 20 is used in conjunction with a moving stage to dynamically capture a top-down image of an entire surface. In one embodiment, a fluorescence filter is provided on the lens of the line scan image capturing device 20 to filter out the reflected excitation light and other ambient light through the fluorescence filter and allow the fluorescence to pass through, thereby eliminating noise in the fluorescence image.

[0098] The described image measurement device 30 can load the storage device through the processor and execute the corresponding image processing program to perform image processing functions. The image processing program can, for example, include but is not limited to an image pre-processing program, image segmentation and positioning, defect detection (gradientation, region growing, growth compensation, etc.), a machine learning system (Machine Learning), a deep learning system (Deep Learning), etc. The image measurement device 30 can perform an image pre-processing procedure (such as image enhancement, noise removal, contrast enhancement, edge enhancement, feature capture, image compression, image conversion, etc.), and segment or capture the boundary of the image after the image pre-processing procedure to divide the region of interest (Region of Interest, ROI). The capture method for the region of interest can, for example, include but is not limited to using binarization or segmenting the image features of different regions from the image by a neural network such as a machine learning system (Machine Learning) or a deep learning system (Deep Learning) after system training. This is not limited in the present invention.

[0099] In one embodiment, the "two-dimensional line profile information" described in the present invention can, for example, include but is not limited to information such as line width, line pitch, aperture, polygon perimeter, radian, roundness, or concentricity.

[0100] In one embodiment, the image measurement device 30 establishes a plurality of measurement point information corresponding to the substrate W based on the two-dimensional fluorescence image. Specifically, the image measurement device 30 can perform a large number of high-precision measurements on the surface of the substrate W by establishing a plurality of control points in the image. The present invention uses a large number of control point measurements to improve the overall accuracy and details of the measurement. The specific method can, for example, set a plurality of sampling control points for measurement, set a large number of control points or measurement points, or set all measurement points (for all measurement points of the object to be measured, such as the point cloud for constructing a three-dimensional image) for the object to be measured. The above control points refer to a plurality of reference points selected on the substrate before the measurement work, and the coordinate positions of the points are determined by a precision measuring instrument; the measurement points are control points with arbitrary measurement data attached.

[0101] Specifically, please refer to Figure 3, which is a schematic diagram of the substrate and control points in the present invention. In one embodiment, for example, the substrate is divided into multiple sub-regions AR (such as 2 to the power of N, which is 64 in the figure), and the center of gravity of the sub-region AR is defined as the control point / measurement point Y1 for sampling measurement. In other embodiments, for example, the number of samples can be determined according to odd or even sub-regions AR or other methods; it can also be based on a percentage (such as 70%) of the number of sub-regions AR for random measurement of the control points of the sub-regions AR. The principle of a large number of control points and sampling measurement is just that the number of sub-regions AR is larger and a comprehensive measurement is carried out, and all 100% of the sub-regions AR need to be measured. All measurement points are used to establish a point cloud by measuring the plane of the substrate to obtain the coordinate information of all points of the object to be measured.

[0102] Next, please refer to Figure 4 , Figure 4 Figures (a) to (f) in are the schematic appearance diagrams of different types of circuits in the present invention.

[0103] Taking the embodiment of single-lens shooting as an example, a top view image of the substrate W can be obtained through the line-scanning image capturing device 20. Among them, the partially enlarged top view image can present, for example but not limited to, a straight line as shown in Figure 4 (a), an arc bent between straight lines as shown in Figure 4 (b), a round hole as shown in Figure 4 (c), a rectangular area as shown in Figure 4 (d), a circular area as shown in Figure 4 (e), or an irregular area or any other form of circuit structure as shown in Figure 4 (f). The present invention does not limit this. The line-scanning image capturing device 20 can obtain various two-dimensional circuit profile information including line width, line pitch, aperture, polygon perimeter, radian, roundness, concentricity, etc. through the two-dimensional fluorescence image of the substrate W. The method for obtaining the two-dimensional circuit profile information will be described in the following paragraphs, and it is stated here in advance.

[0104] Next, please refer to Figure 5 , which is a top view schematic diagram of the substrate circuit of the present invention, and please also refer to Figure 2 .

[0105] The circuit of the substrate W mainly includes the following several two-dimensional circuit profile information: the upper width UW of the circuit, the lower width DW of the circuit, the first side line width S1, the second side line width S2, and the circuit length LR.

[0106] In one embodiment, the first side line width S1 and the second side line width S2 can be obtained by calculating from a top view image. For example, the adjacent boundaries between the upper width UW and the lower width DW of the line in the top view image can be obtained respectively. Regarding the acquisition of the polygon perimeter and the line length LR, it can be directly obtained by pixel conversion after segmenting the polygon area from the image. Regarding the acquisition of radian, circularity, and concentricity, they are obtained in the following disclosed manner.

[0107] Regarding the acquisition of radian, please refer to Figure 6 , which is a top view schematic diagram of an embodiment of the line turning of the present invention. Radian is a unit for measuring angles, which is basically the ratio of arc length to radius, and the basic formula can be expressed as follows:

[0108]

[0109] where α is the radian, L is the arc length, and r is the radius of the arc. As Figure 6 shown, the image measuring device 30 measures the length of the arc Ar from the top view to obtain the arc length L, and then measures the distance R from the arc Ar to the arc center AD to obtain the radius r. Thus, according to the position and shape information of the radian, the value of the radian is calculated.

[0110] Regarding the acquisition of circularity, please refer to Figure 7 , which is a top view schematic diagram of an embodiment of the circular pad area of the present invention. Circularity is expressed by the radial offset of its actual contour relative to an ideal circle, that is, the difference between the maximum radius and the minimum radius with respect to the same center of the circle. Specifically, it can be expressed by the following formula:

[0111] Δ = R MAX - R min ;

[0112] where Δ is the circularity, R MAX is the maximum radius of the selected center of the circle, and R min is the minimum radius of the selected center of the circle. As Figure 6 shown, the solid line part is the actual circular pad area, and the dashed line part is a virtual circle set with the center of the circular pad area. The image measuring device 30 selects the center of the circle MD from the top view and measures the distance R1 from the center of the circle MD to the farthest arc boundary of the circular pad area to obtain R MAX , measures the distance R2 from the center of the circle MD to the nearest arc boundary of the circular pad area to obtain R min , and the circularity of the circular pad area or the circular hole can be obtained through the above method.

[0113] Regarding the acquisition of concentricity, please refer to Figure 8 , which is a top view schematic diagram of an embodiment of the metal ring of the present invention. Concentricity measures whether the centers of two circles are equal or very close. As Figure 8As shown in the figure, the image measuring device 30 selects the center MD1 of the circle formed by the outer edge boundary B1 of the metal ring from the top view, selects the center MD2 of the circle formed by the inner edge boundary B2 of the metal ring, measures the distance DT between the center MD1 and the center MD2, and the concentricity between the outer edge boundary B1 and the inner edge boundary B2 of the metal ring can be obtained in the above manner.

[0114] The above methods for obtaining various two-dimensional line profile information such as line width, line pitch, aperture, polygon perimeter, radian, roundness, concentricity, etc. are only one example of the present invention and are not used to limit the present invention. Other methods for obtaining two-dimensional line profile information also fall within the scope of protection of the present invention.

[0115] In addition to the above-described embodiment of using a dual lens for shooting, the measurement of the substrate W can also be achieved by a single lens. For example, a top view image of the substrate W can be obtained by a camera disposed in the top view direction of the substrate W, and the image measuring device 30 can obtain line profile information such as the upper width UW of the line, the lower width DW of the line, line pitch, rectangle length and width, radian, roundness, concentricity, line length, or line shape from the top view image.

[0116] Next, please refer to Figure 9 , which is a top view schematic diagram of an embodiment of the substrate round hole of the present invention, and please also refer to Figure 2 .

[0117] The following also takes Figure 2 Shooting with a single lens. According to the reflection characteristics of the round hole on the substrate W with respect to the light source 13, the two-dimensional fluorescence image can be divided into two parts: a wall characteristic region or a surface characteristic region. The image of the region of interest can be segmented by, for example, but not limited to, binarization processing and boundary extraction (or algorithms such as detecting step edges or watershed segmentation algorithms to segment image blocks), and the wall characteristic region and the surface characteristic region can be directly segmented, and further the boundary of the round hole can be obtained from the region characteristics, and then four parts, namely, the bottom surface characteristic region H1, the defect region H2, the wall characteristic region H3, and the top surface characteristic region H4, can be obtained, and the detection information can be obtained from the boundaries of the above regions. Specifically, the value of the lower aperture can be obtained by substituting the width L1 of the boundary of the bottom surface characteristic region H1 into the viewing distance calculation; the value of the upper aperture can be obtained by substituting the width L2 of the boundary between the wall characteristic region H3 and the top surface characteristic region H4 into the viewing distance calculation; the defect length, defect width, and defect position can be obtained by substituting the length L4, width L5 of the boundary of the defect region H2 and the position in the two-dimensional image into the viewing distance calculation, and even the defect type can be further obtained from the above values. On the other hand, the wall characteristic region H3 of the round hole can be more clearly presented in the side view image, which is beneficial for detecting wall defects of the hole.

[0118] The described image analysis device 20 analyzes based on the aforementioned two-dimensional fluorescence image and two-dimensional circuit contour information to generate a substrate distribution information map. In one embodiment, the substrate distribution information map is displayed in the form of a heat map or a grayscale map to present the distribution of the two-dimensional circuit contour information of the substrate W. A heat map is a data visualization technique that displays the absolute quantity of a phenomenon in the form of colors in a two-dimensional space. The color form of the heat map is, for example but not limited to, using rainbow color mapping, colors of different shades, intensities, or hues, or any other way that enables personnel to intuitively see the distribution of the circuit information of the substrate W from the image. The concept of the present invention uses continuous changes in colors or grayscale to present the abnormal change amount and distribution of the circuits on the substrate W, and the selection or definition of individual colors is only for illustration and is not limited in the present invention. Depending on the detection target and functional differences, the substrate distribution information map may include, for example but not limited to, a circuit abnormal distribution information map and a circuit accuracy distribution information map. In a preferred embodiment, the circuit abnormal distribution information map and the circuit accuracy distribution information map may be full-page information obtained after full-page measurement. Fluorescence detection, through full-page measurement, compared with traditional measurement devices, such as measurement devices based on area scanning, can only measure partial areas of the object to be measured and cannot achieve the efficiency of full-page measurement of the object to be measured in the present invention.

[0119] To establish standard data for anomaly detection, in one embodiment, before the product goes on the production line, a standard wafer can be sent to the device of the present invention to establish substrate distribution information through the line scan image capture device 20, the image measurement device, and the analysis device. Thus, various two-dimensional circuit contour information of the standard wafer is obtained first, and the obtained two-dimensional circuit contour information is stored in the database indexed by the circuit position (such as coordinates) as the expected circuit size information of each circuit coordinate. When the device enters the production line, the image analysis device 20 obtains the circuit contour information based on the two-dimensional fluorescence image, subtracts it from the expected circuit size information at the corresponding position of the standard wafer, obtains the error value information indexed by coordinates, and determines whether the circuit is abnormal and measures the error based on whether the error value information exceeds a reasonable threshold. In one embodiment, the expected circuit size information may be, for example but not limited to, the standard wafer image, the original Computer-Aided Manufacturing (CAM) file, or other similar data stored in the database in advance; the standard wafer may be, for example, a master wafer or a good wafer, which is not limited in the present invention. In another embodiment, the expected circuit size information may be, for example but not limited to, including the circuit position, the standard circuit size, and / or a reasonable threshold (Threshold). In one embodiment, the error value information can be expressed not only as a pure difference value but also in other ways such as percentage error, range, etc., which is not limited in the present invention.

[0120] Next, please refer to Figure 10 and Figure 11 , which are the full - version abnormality distribution map and the substrate measurement information map in the present invention, and please also refer to Figure 1 .

[0121] In one embodiment, the analysis device 40 can compare two - dimensional line profile information with expected line size information at corresponding positions to obtain error value information, and generate the abnormal distribution of all lines on the substrate based on the error value information to establish a line abnormality distribution information map.

[0122] For example, as Figure 1 the human - machine operation interface 50 (refer to Figure 1 ) can present the abnormal distribution of the entire substrate W, so that personnel can intuitively understand the line abnormality distribution trend of the substrate W. In an alternative embodiment, as Figure 10 shown, color marks (represented by gray scale in the figure, and their colors are not limited in the present invention) are marked on the line abnormality distribution information map I1, so as to highlight the line segments or areas recognized as abnormal on the image. When performing a full - board inspection of the substrate W, these color marks can show the overall abnormal distribution of the substrate W, and thus present the line abnormality distribution trend of the full version.

[0123] It can be seen from the line abnormality distribution information map I1 that the number of abnormal points in the upper region K1 of the substrate W is much larger than that in the lower region K2 of the substrate W, and the abnormal points in both the upper region K1 and the lower region K2 of the substrate W are concentrated in the lower positions. In addition, the change of line abnormality can be seen from the distribution of the above - mentioned abnormal points, so as to facilitate subsequent judgment and adjustment of various variables of the substrate manufacturing process. In an alternative embodiment, the line abnormality distribution information map I1 can not only present the distribution of abnormal points on the substrate W, but also present the distribution of abnormal points in a selected local area to obtain the statistical quantity of the number of abnormal points in the local area of the substrate W, which is not limited in the present invention.

[0124] In an alternative embodiment, as Figure 10 shown, the display standard of the color marks, for example but not limited to, is based on whether the line has line size abnormality, line type abnormality, line position abnormality, etc. or other similar discrimination methods for display, which is not limited in the present invention. In an alternative embodiment, the abnormal points presented by the line abnormality distribution information map I1 (substrate distribution information) as Figure 10 described can be further statistically quantified based on the number of abnormal points of different line types, as Figure 11The substrate measurement information diagram I2 shows that in the histogram part, the number of abnormal line widths is approximately 36,000, the number of abnormal line spacings is approximately 10,000, the number of abnormal apertures is approximately 4,000, the number of abnormal polygon perimeters is approximately 7,000, the number of abnormal arcs is approximately 4,600, the number of abnormal roundnesses is approximately 7,600, and the number of abnormal concentricities is approximately 5,400; in the pie chart part, the abnormal line width accounts for 10% of the total line width quantity, the abnormal line spacing accounts for 1% of the total line spacing quantity, the abnormal aperture accounts for 45% of the total aperture quantity, the abnormal polygon perimeter accounts for 48% of the total polygon perimeter quantity, the abnormal arc accounts for 38% of the total arc quantity, the abnormal roundness accounts for 15% of the total roundness quantity, and the abnormal concentricity accounts for 6% of the total concentricity quantity. Looking at the specification as a whole in this way. In one embodiment, the substrate measurement information diagram is presented, for example but not limited to, in the form of bar charts, pie charts, histograms or other forms of charts or tables, and the present invention does not limit this.

[0125] Next, please refer to Figure 12 together, which is the abnormal distribution diagram of the substrate sub-region in the present invention, and please refer to Figure 1 together.

[0126] In one embodiment, the analysis device 40 determines whether the two-dimensional line profile information is abnormal according to the error magnitude of the error value information, and colors the corresponding lines determined to be abnormal to establish the abnormal distribution diagram I3 of the substrate sub-region. Specifically, the analysis device 40 can mark the line width defect F1, mark the arc defect F2 and mark the concentricity defect F3 on the abnormal distribution diagram I3 of the substrate sub-region. By coloring the lines, analyze the distribution positions of the abnormal lines to evaluate the abnormal distribution trend of the substrate sub-region.

[0127] Next, please refer to Figure 13 together, which is the line precision distribution information diagram in the present invention, and please refer to Figure 1 together.

[0128] In one embodiment, the analysis device 40 takes the measurement targets on the substrate as a reference to generate the distribution of the two-dimensional line profile information of all the measurement targets on the substrate W to establish the line precision distribution information diagram.

[0129] For example, the human-machine operation interface 50 (refer to Figure 1)It is possible to present a line accuracy distribution information map of the measurement target for personnel to intuitively observe the line accuracy distribution trend of the entire substrate W. In a selected embodiment, the human-machine operation interface 50 can be operated by personnel to select any type of line segment, and use the two-dimensional line profile information of the selected line segment as the measurement reference, thereby obtaining the line accuracy distribution information map I4 of the entire substrate W. Specifically, by selecting any line segment in any substrate sub-region of the substrate W and using the two-dimensional line profile information of the selected line segment as the measurement reference, the relative values of the two-dimensional line profile information of the corresponding line segments at the positions corresponding to the selected line segment on other substrate sub-regions are quantified, and then the differences are presented in colors, thereby analyzing the overall accuracy distribution trend of the selected line segment and all corresponding line segments of the entire substrate W through image analysis. As Figure 13 shown in the left table, taking the characteristic impedance line Rd1 of the sub-region Sb1 as an example, first select multiple target line segments by means of frame selection, and after selecting a line segment from the multiple target line segments, select and confirm to determine the specified line segment (i.e., the characteristic impedance line Rd1); then select the measurement target of the specified line segment (in this embodiment, the lower line width (Lower Width) is selected), the lower line width value of the selected line segment is 54.636, and the maximum value (in this embodiment, it is 73.12) and the minimum value (in this embodiment, it is 40.861) of the corresponding line segments of the entire circuit board (i.e., the lower line widths of the corresponding line segments in other sub-blocks) are respectively used as the limit values of color marking (for example, green is the upper limit value, blue is the lower limit value, and white is the standard value), and the lower line width values measured for the corresponding line segments of each sub-region are mapped to the colors between the upper limit value and the lower limit value to show the full-board trend of the specified line segment.

[0130] In a selected embodiment, for example, from Figure 13 it can be seen that based on the two-dimensional line profile information of the selected line segment, the line accuracy distribution information map I4 of the corresponding line segments of the entire substrate W is established. Among them, the areas with colors closer to white indicate that the line profile information of the corresponding line segments is closer to the two-dimensional line profile information of the selected line segment, the areas with colors closer to dark green indicate that the two-dimensional line profile information of the corresponding line segments is greater than the two-dimensional line profile information of the selected line segment, and the areas with colors closer to dark blue indicate that the two-dimensional line profile information of the corresponding line segments is less than the two-dimensional line profile information of the selected line segment. Personnel can intuitively observe the full-board line accuracy distribution trend of the entire substrate W for a specific line segment from the different color blocks presented in the line accuracy distribution information map I4. In a selected embodiment, Figure 13 the colors in the line accuracy distribution information map I4 can be converted into grayscale images. Since different colors have different brightness levels, the differences in the hot zone distribution can be presented through different shades of grayscale. For example, the change trend of electrical accuracy can be shown through the depth change of grayscale.

[0131] In a selected embodiment, the analysis device 40 can obtain the Capability Process Index (CPK) based on the maximum value, minimum value, and average value in the two-dimensional line profile information of all measurement targets, and in combination with the expected line size information of the measurement targets. Specifically, through the expected line size information obtained using the standard wafer as described above, plus the standard deviation (σ) allowed in the process, the upper specification limit (USL) and lower specification limit (LSL) of the selected line segment can be obtained, that is, the maximum and minimum values allowed in the process, and the average value (μ) of the line profile information of the entire substrate W for a specific line segment can be obtained through the full-panel line accuracy distribution diagram I4. Substituting the above values into the following calculation formula can calculate the Capability Process Index (CPK):

[0132]

[0133] Through the above formula, a unitless CPK value can be obtained to evaluate the process capability. When the CPK value is greater than or equal to 1.33, it indicates that the process capability is good. If the CPK value is less than 1.33, it indicates that the process needs to be improved.

[0134] Next, please refer to Figure 14 together, which is a schematic flowchart of the substrate image measurement method in the present invention. Based on the above substrate image measurement system 100, the present invention further discloses a substrate etching information analysis method 300, including the following steps:

[0135] First, the excitation light generating device 10 provides excitation light to the substrate on the area to be measured, causing the substrate to generate fluorescence (step S01).

[0136] Next, the line scan image capturing device 20 captures an image of the substrate to obtain a two-dimensional fluorescence image (step S02).

[0137] Next, the image measurement device 30 generates two-dimensional line profile information based on the two-dimensional fluorescence image (step S03). In the two-dimensional fluorescence image of the substrate W taken in the present invention, two-dimensional line profile information such as but not limited to line width, line pitch, aperture, polygon perimeter, radian, roundness, or concentricity can be measured and obtained.

[0138] Next, the analysis device 40 analyzes the two-dimensional line profile information to establish substrate measurement information (step S04). The "substrate measurement information" is statistical data of various measurement data generated based on the line profile, such as statistical data charts of the upper line width / line pitch, lower line width / line pitch, rectangle length and width, radian, roundness, concentricity, aperture, and so on.

[0139] Finally, the analysis device 40 analyzes the two-dimensional line profile information to generate a substrate distribution information map (step S05). In one embodiment, the substrate distribution information map is displayed in the form of a heat map or a grayscale map to present the distribution of the two-dimensional line profile information of the substrate W. In one embodiment, the substrate distribution information map includes line anomaly distribution information and line accuracy distribution information. Among them, the line anomaly distribution information is established by comparing the two-dimensional line profile information with the expected line size information at the corresponding position to obtain error value information, and generating the distribution of all line anomalies on the substrate based on the error value information to establish a line anomaly distribution information map; the line accuracy distribution information is established by taking the measurement targets on the substrate as a reference and generating the distribution of the substrate measurement information of all measurement targets on the substrate to establish the line accuracy distribution information.

[0140] In an alternative embodiment, the analysis device 40 can obtain the process capability index (CPK) according to the maximum value, minimum value, and average value of the substrate measurement information of all measurement targets, and in combination with the expected line size information of the measurement targets. When the process capability index is greater than or equal to 1.33, it indicates that the process capability is good. If the CPK value is less than 1.33, it indicates that the process needs to be improved.

[0141] In summary, the present invention can improve the accuracy of line measurement by comprehensively measuring the entire substrate through fluorescence images, thereby improving the quality of image line measurement. In addition, the present invention uses fluorescence detection to make the image of the object to be measured form an effect similar to backlight and silhouette, which can avoid the image interference caused by surface contamination and oxidation of the object to be measured, highlight the boundary features, and reduce the influence of false defects generated by image measurement caused by oxidation scratches and contamination on the surface of the object to be measured. In addition, using the architecture of the line scan image capture device can achieve the effect of fast measurement compared with the area scan image capture device.

[0142] The present invention has been described in detail above. The above description is only one preferred embodiment of the present invention. It should not be used to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A fluorescence-based substrate image measurement system, characterized in that: include: An excitation light generating device provides an excitation light to a substrate on a region to be tested, so that the substrate generates fluorescence; A line scanning image capturing device for capturing an image of the substrate to obtain a one- or two-dimensional fluorescent image; as well as an image measuring device connected or coupled to the line scanning image capturing device to generate two-dimensional line contour information according to the two-dimensional fluorescent image; as well as An analysis device receives and analyzes the two-dimensional line profile information to establish substrate measurement information.

2. The fluorescence-based substrate image measurement system according to claim 1, characterized in that: The substrate measurement information includes line width, line spacing, aperture, polygon perimeter, arc, roundness or concentricity.

3. The fluorescence-based substrate image measurement system according to claim 1, characterized in that: The analyzing device analyzes the two-dimensional circuit profile information to generate substrate distribution information.

4. The fluorescence-based substrate image measurement system according to claim 3, characterized in that: The substrate distribution information is displayed in a heat map format or a grayscale map to present the distribution of the two-dimensional circuit profile information of the substrate.

5. The fluorescence-based substrate image measurement system according to claim 3, characterized in that: The substrate distribution information includes line abnormality distribution information and line accuracy distribution information.

6. The fluorescence-based substrate image measurement system according to claim 4, characterized in that: The analyzing device compares the two-dimensional line profile information with the expected line size information of the corresponding position to obtain error value information, and generates abnormal distribution of all lines on the substrate based on the error value information to establish the abnormal line distribution information.

7. The fluorescence-based substrate image measurement system according to claim 4, characterized in that: The analyzing device uses a measurement target on the substrate as a reference to generate the distribution of the two-dimensional line profile information of all the measurement targets on the substrate to establish line accuracy distribution information.

8. The fluorescence-based substrate image measurement system according to claim 7, characterized in that: The analyzing device obtains a process capability index based on the maximum value, minimum value and average value of the two-dimensional line profile information of all the measurement targets and combined with the expected line size information of the measurement targets.

9. The fluorescence-based substrate image measurement system according to claim 1, characterized in that: The image measuring device generates a plurality of measurement point information corresponding to the substrate according to the two-dimensional fluorescent image.

10. A fluorescence-based substrate image measurement method, characterized in that: include: Providing excitation light to a substrate on a region to be tested, so that the substrate generates fluorescence; capturing an image of the substrate to obtain a one- or two-dimensional fluorescent image; Generating one- and two-dimensional line contour information according to the two-dimensional fluorescent image; as well as The two-dimensional line profile information is analyzed to establish substrate measurement information.

11. The fluorescence-based substrate image measurement method according to claim 10, characterized in that: The line profile information includes line width, line spacing, aperture, polygon perimeter, arc, roundness or concentricity.

12. The fluorescence-based substrate image measurement method according to claim 11, characterized in that: The two-dimensional line profile information is further analyzed to generate substrate distribution information.

13. The fluorescence-based substrate image measurement method according to claim 12, characterized in that: The substrate distribution information is displayed in a heat map format or a grayscale map to present the distribution of the two-dimensional circuit profile information of the substrate.

14. The fluorescence-based substrate image measurement method according to claim 12, characterized in that: The substrate distribution information includes line abnormality distribution information and line accuracy distribution information.

15. The fluorescence-based substrate image measurement method according to claim 14, characterized in that: The line abnormal distribution information is established by comparing the two-dimensional line contour information with the expected line size information of the corresponding position to obtain an error value information, and based on the error value information, the abnormal distribution of all lines on the substrate is generated to establish the line abnormal distribution information.

16. The fluorescence-based substrate image measurement method according to claim 14, characterized in that: The establishment of the line accuracy distribution information is based on a measurement target on the substrate, and the distribution of the two-dimensional line contour information of all the measurement targets on the substrate is generated to establish the line accuracy distribution information.

17. The fluorescence-based substrate image measurement method according to claim 16, characterized in that: A process capability index is obtained according to the maximum value, the minimum value and the average value in the two-dimensional line profile information of all the measurement targets and combined with the expected line size information of the measurement targets.

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