Display device

Abstract

Disclosed is a display device in which a gap size between bond pads provided on a circuit film is increased even if the number of signal lines for driving high resolution and high frequency display and the number of power supply lines for low speed operation are increased. The display device includes: a display panel; a printed circuit board; and a circuit film disposed between the display panel and the printed circuit board and connected to the display panel and the printed circuit board, in which the circuit film includes an input-side bonding area connected to the printed circuit board and an output-side bonding area connected to the display panel, the input-side bonding region includes a plurality of input pads connected to the output-side bonding region, where the plurality of input pads are arranged in two rows.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] With the development of the information society and the development of various portable electronic devices such as mobile communication terminals and laptop computers, the demand for display devices suitable for these portable electronic devices is gradually increasing.

[0003] Display devices include liquid crystal display devices (LCDs) using liquid crystals and organic light emitting diode (OLED) display devices using organic light emitting diodes. Summary of the Invention

[0004] In a display device, the number of signal lines for driving high-resolution and high-frequency displays and the number of power lines for low-speed operation increase. As the number of signal lines and power lines increases, the size of the gap between bonding pads provided on a circuit film becomes smaller, which may cause interference between them.

[0005] Therefore, as the number of signal lines and power lines of a display device increases, it is necessary to increase the size of the gap between bonding pads provided on the circuit film.

[0006] An object of an embodiment according to the present disclosure is to provide a display device in which, even when the number of signal lines for driving high-resolution and high-frequency displays and the number of power lines for low-speed operation increase, the size of the gap between bonding pads provided on the circuit film increases.

[0007] In addition, an object of an embodiment according to the present disclosure is to provide a display device in which input pads and output pads that are directly connected to each other among bonding pads of a circuit film are arranged in two rows to increase the size of the gap between the bonding pads.

[0008] The object according to the present disclosure is not limited to the above object. Other objects and advantages according to the present disclosure that are not mentioned can be understood based on the following description and can be more clearly understood based on embodiments according to the present disclosure. In addition, it will be easily understood that the objects and advantages according to the present disclosure can be achieved by using the means shown in the claims or combinations thereof.

[0009] A display device according to an aspect of the present disclosure may include: a display panel; a printed circuit board; and a circuit film provided between the display panel and the printed circuit board and connected to the display panel and the printed circuit board, wherein the circuit film includes an input-side bonding region connected to the printed circuit board and an output-side bonding region connected to the display panel, wherein the input-side bonding region includes a plurality of input pads connected to the output-side bonding region, and wherein the plurality of input pads are arranged in two rows.

[0010] A display device according to another aspect of the present disclosure may include: a printed circuit board including pads for outputting a plurality of voltages and a plurality of control signals; a display panel including a display area and a non-display area surrounding the display area, wherein a plurality of sub-pixels are provided in the display area and pads are provided in the non-display area; a circuit film including an input-side bonding area bonded to the pads of the printed circuit board and an output-side bonding area bonded to the pads of the display panel, wherein the input-side bonding area includes a plurality of input pads, and at least two of the plurality of input pads are respectively provided in at least two rows; and a source driver mounted on the circuit film, wherein the source driver is electrically connected to the printed circuit board via the input-side bonding area and electrically connected to the display panel via the output-side bonding area.

[0011] According to an embodiment of the present disclosure, input pads and output pads that are directly connected to each other among the bonding pads of the circuit film are arranged in two rows to increase the gap size between the bonding pads, thereby implementing a display device that requires high resolution and high-frequency display.

[0012] In addition, according to an embodiment of the present disclosure, the gap between the bonding pads can be increased without increasing the width of the circuit film.

[0013] In addition, according to an embodiment of the present disclosure, by increasing the gap between the bonding pads to reduce interference therebetween, the image quality in terms of high resolution and high-frequency display can be improved.

[0014] In addition, according to an embodiment of the present disclosure, the pitch between the bonding pads can be increased, thereby improving the processing ability.

[0015] According to an embodiment of the present disclosure, production energy can be reduced by optimizing the process.

[0016] The effects of the present disclosure are not limited to the effects mentioned above, and those skilled in the art will clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A display device according to an embodiment of the present disclosure is schematically illustrated.

[0018] Figure 2 The connection relationship of the circuit film in the display device according to an embodiment of the present disclosure is shown.

[0019] Figure 3 It is a top view of the circuit film of the display device according to an embodiment of the present disclosure.

[0020] Figure 4 It is a cross-sectional view of one side of the circuit film in the display device according to an embodiment of the present disclosure.

[0021] Figure 5 A cross-sectional view of the other side of the circuit film in the display device according to an embodiment of the present disclosure.

[0022] Figure 6 A bottom view and a top view for inspecting the bonding state of the circuit film in the display device according to an embodiment of the present disclosure are shown. Detailed Description

[0023] Advantages and features of the present disclosure, and methods for realizing these advantages and features, will become apparent by referring to embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below, but may be embodied in various different forms. Therefore, these embodiments are described only to make the present disclosure complete and to fully convey the scope of the present disclosure to those of ordinary skill in the art to which the present disclosure pertains, and the present disclosure is defined only by the scope of the claims.

[0024] For simplicity and clarity of illustration, elements in the drawings are not necessarily drawn to scale. The same reference numerals in different drawings denote the same or similar elements and thus perform similar functions. Additionally, for simplicity of description, the description and details of well-known steps and elements are omitted. Furthermore, in the following detailed description of the present disclosure, many specific details are set forth to provide a thorough understanding of the present disclosure. However, it will be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, processes, components, and circuits are not described in detail so as not to unnecessarily obscure aspects of the present disclosure. Examples of various embodiments are further illustrated and described below. It will be understood that the description herein is not intended to limit the claims to the specific embodiments described. Instead, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the present disclosure as defined by the appended claims.

[0025] The shapes, sizes, proportions, angles, quantities, etc. disclosed in the drawings for illustrating the embodiments of the present disclosure are illustrative, and the present disclosure is not limited thereto.

[0026] The terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the present disclosure. As used herein, the singular forms “a,” “an” are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that when the terms “comprises,” “comprising,” “has,” are used in this specification, the presence of the stated features, integers, operations, elements, and / or components is specified, but one or more other features, integers, operations, elements, components, and / or portions thereof are not excluded. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of” before a list of elements can modify the entire list of elements and may not modify a single element of the list. In the interpretation of numerical values, errors or tolerances may occur even without explicit description.

[0027] It will be understood that when an element or layer is referred to as “connected to” or “coupled to” another element or layer, it can be directly on the other element or layer, or connected to or coupled to the other element or layer, or there may be one or more intermediate elements or layers. Further, it will also be understood that when an element or layer is referred to as being “between” two elements or layers, it can be the only element or layer between the two elements or layers, or there may also be one or more intermediate elements or layers.

[0028] In addition, as used herein, when a layer, film, region, plate region, etc. is disposed “on” or “above” another layer, film, region, plate region, etc., the former may directly contact the latter or another layer, film, region, plate region, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate region, etc. is directly disposed “on” or “above” another layer, film, region, plate region, etc., the former directly contacts the latter and no other layer, film, region, plate region, etc. is disposed between the former and the latter. In addition, as used herein, when a layer, film, region, plate region, etc. is disposed “under” or “below” another layer, film, region, plate region, etc., the former may directly contact the latter or another layer, film, region, plate region, etc. may be disposed between the former and the latter. As used herein, when a layer, film, region, plate region, etc. is directly disposed “under” or “below” another layer, film, region, plate region, etc., the former directly contacts the latter and no other layer, film, region, plate region, etc. is disposed between the former and the latter.

[0029] In the description of temporal relationships (such as the temporal sequence relationships such as “after,” “subsequent to,” “before,” etc. between two events), unless “directly after,” “directly subsequent to,” “directly before” is indicated, another event may occur therebetween.

[0030] When a particular embodiment can be embodied differently, the functions or operations specified in a particular block can occur in an order different from that specified in the flowchart. For example, two consecutive blocks can actually be executed substantially in parallel, or the two blocks can be executed in the reverse order depending on the functions or operations involved.

[0031] It will be understood that although the terms “first,” “second,” “third,” etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section described below may be referred to as a second element, component, region, layer, or section without departing from the spirit and scope of the present disclosure.

[0032] Spatially relative terms, such as “below,” “beneath,” “lower,” “under,” “above,” “upper,” etc., may be used herein for ease of explanation to describe the relationship of one element or feature to another element or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, when the device in the figures is turned over, an element described as “below” or “beneath” or “lower” than another element or feature will then be oriented “above” the other element or feature. Thus, the exemplary terms “below” and “beneath” can include both the orientation of above and below. The device may be otherwise oriented, such as rotated 90 degrees or at other orientations, and the spatially relative descriptors used herein should be interpreted accordingly.

[0033] The features of the various embodiments of the present disclosure can be partially or fully combined with each other and can be technically related or interoperable with each other. The embodiments can be implemented independently of each other and can be implemented together in an associated relationship.

[0034] When interpreting a numerical value, unless it is explicitly described separately, the numerical value is interpreted as including the error range.

[0035] Unless otherwise defined, all terms used herein, including technical terms and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept belongs. It will be further understood that terms (such as those defined in a common dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0036] As used herein, terms such as "embodiment", "example", "aspect", etc. should not be construed as making any aspect or design described superior to or better than other aspects or designs.

[0037] In addition, the term "or" means "inclusive or" rather than "exclusive or". That is, unless otherwise stated or clear from the context, the expression "x uses a or b" means that any one of the combinations is naturally included.

[0038] The terms used in the following description have been selected to be common and general in the relevant technical field. However, there may be other terms in addition to those based on the development and / or changes of the technology, conventions, preferences of those skilled in the art, etc. Therefore, the terms used in the following description should not be construed as limiting the technical concept, but should be understood as examples of the terms used to illustrate the embodiments.

[0039] In addition, in specific cases, the terms can be arbitrarily selected by the applicant, and in such cases, their detailed meanings will be described in the corresponding description part. Therefore, the terms used in the following description should be understood not only based on the name of the terms, but on the meanings of the terms and the content throughout the specific implementation.

[0040] When describing the flow of a signal, for example, when a signal is delivered from node A to node B, unless the wording "immediate transmission" or "direct transmission" is used, it may include the case where the signal is transmitted from node A to node B via another node.

[0041] Hereinafter, display devices according to embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0042] Figure 1 A display device according to an embodiment of the present disclosure is schematically shown.

[0043] Referring to Figure 1 , a display device 100 according to an embodiment of the present disclosure may include a display panel 110, a data driving circuit 120, and a timing controller 140.

[0044] In the display panel 110, signal lines (such as a plurality of data lines DL and a plurality of gate lines GL) may be provided on the substrate. A plurality of sub-pixels SP may be provided in the display panel 110 and may be electrically connected to the plurality of data lines DL and the plurality of gate lines GL.

[0045] The display panel 110 may include a display area AA for displaying an image and a non-display area NA for not displaying an image. A plurality of sub-pixels SP for displaying an image may be provided in the display area AA, and pads connected to the data driving circuit 120 or the gate driving circuit 130 may be provided in the non-display area NA. In one example, the gate driving circuit 130 may be provided on each of opposite sides of the non-display area NA of the display panel.

[0046] The sub-pixels may include a plurality of red sub-pixels that emit red light, a plurality of green sub-pixels that emit green light, and a plurality of blue sub-pixels that emit blue light. To increase the brightness, a plurality of white sub-pixels may be included therein. Each sub-pixel may include a light-emitting element and a driving circuit for driving the light-emitting element. In one example, the light-emitting element may be an organic light-emitting diode.

[0047] The data driving circuit 120 may be a circuit configured to drive a plurality of data lines DL, convert the image data DATA received from the timing controller 140 into a data voltage, and supply the data voltage to the plurality of data lines DL.

[0048] The data driving circuit 120 may include one or more source drivers (SDIC: Source Driver Integrated Circuit). Each source driver SDIC may be connected to the display panel 110 using tape automated bonding (TAB), may be connected to the bonding pads of the display panel 110 using chip on glass (COG), or may be implemented in a chip on film (COF) manner and electrically connected to the display panel 110.

[0049] The gate driving circuit 130 may be a circuit configured to drive a plurality of gate lines GL and supply a gate signal (referred to as a scan signal) to the plurality of gate lines GL.

[0050] The gate driving circuit 130 may output a gate signal of a conductive level voltage or a gate signal of a cut-off level voltage under the control of the timing controller 140. The gate driving circuit 130 sequentially outputs a gate signal of a conductive level voltage to the plurality of gate lines GL to sequentially drive the plurality of gate lines GL.

[0051] The gate driving circuit 130 may be provided on the substrate of the display panel 110 or connected to the substrate of the display panel 110. When the gate driving circuit 130 is embodied in a gate-in-panel (GIP) manner, the gate driving circuit may be provided in the non-display area NA of the substrate.

[0052] The timing controller 140 may provide image data DATA and a data control signal DCS to the data driving circuit 120. In addition, the timing controller 140 may provide a gate control signal GCS to the gate driving circuit 130.

[0053] The timing controller 140 may be configured to start scanning according to the timing implemented in each frame, convert the image data input from an external source into a data signal format conforming to that used by the data driving circuit 120, provide the converted image data DATA to the data driving circuit 120, and control the data driving time according to the scanning.

[0054] The timing controller 140 may receive various timing signals including a vertical synchronization signal Vsync, a horizontal synchronization signal Hsync, a data enable signal DE, and a clock signal CLK, as well as input image data from a host system.

[0055] To control the data driving circuit 120 and the gate driving circuit 130, the timing controller 140 may receive timing signals including a vertical synchronization signal Vsync, a horizontal synchronization signal Hsync, an input data enable signal DE, and a clock signal CLK, generate a data control signal DCS and a gate control signal GC based on the received timing signals, and provide the data control signal DCS and the gate control signal GC to the data driving circuit 120 and the gate driving circuit 130, respectively.

[0056] In one example, the data control signal DCS may include a source start pulse SSP, a source sampling clock SSC, etc. The gate control signal GCS may include a gate start pulse GSP, a gate shift clock GSC, and a gate output enable signal GOE.

[0057] Figure 2 The connection relationship of circuit films in a display device according to an embodiment of the present disclosure is shown.

[0058] Refer to Figure 2 , a display device according to an embodiment of the present disclosure may include a display panel 110, a circuit film COF connected to the display panel 110, a printed circuit board 150 connected to the circuit film COF, and a source driver SDIC mounted on the circuit film COF.

[0059] For ease of explanation, Figure 2 one circuit film COF is shown. However, at least two circuit films COF may be connected to the display panel 110 and the printed circuit board 150 and disposed between the display panel 110 and the printed circuit board 150.

[0060] One end of the circuit film COF can be connected to the printed circuit board 150, and the other end thereof can be connected to the display panel 110. In this regard, the end of the circuit film COF connected to the printed circuit board 150 can be defined as the input-side bonding region of the circuit film COF. The other end of the circuit film COF connected to the display panel 110 can be defined as the output-side bonding region of the circuit film COF.

[0061] The input-side bonding region of the circuit film COF can be bonded to pads (not shown) provided on the printed circuit board 150. The printed circuit board 150 can be connected to the input-side bonding regions of one or more circuit films COF. For example, multiple circuit films can be connected to one printed circuit board 150.

[0062] The printed circuit board 150 can be a control printed circuit board or a source printed circuit board. The timing controller 140 and a power management circuit (not shown) can be mounted on the printed circuit board 150. The timing controller 140 can be electrically connected to the data driver circuit 120 and the gate driver circuit 130 via the printed circuit board 150 and the circuit film COF.

[0063] The input-side bonding region of the circuit film COF can include multiple first input pads 152a, multiple second input pads 152b, and multiple third input pads 151. Each of the first input pads 152a, the second input pads 152b, and the third input pads 151 can be bonded to the pads provided on the printed circuit board 150 thereon.

[0064] The first input pads 152a can be arranged in the first row ILB1 of the input-side bonding region of the circuit film COF, and the second input pads 152b can be arranged in the second row ILB2 of the input-side bonding region of the circuit film COF. The third input pads 151 can be arranged in its first row ILB1 or second row ILB2 or arranged in a single row as a combination of the first row ILB1 and the second row ILB2.

[0065] The first input pads 152a can be provided on each of two opposite sides of the input-side bonding region of the circuit film COF. The second input pads 152b can be provided on each of two opposite sides of the input-side bonding region of the circuit film COF. The multiple first input pads 152a and the multiple second input pads 152b can be directly and respectively connected to the multiple first output pads 162a and the multiple second output pads 162b of the output-side bonding region of the circuit film COF through respective connection wirings 171 without being connected to the source driver SDIC. In one example, the first input pads 152a can be directly connected to the first output pads 162a. Additionally, the second input pads 152b can be directly connected to the second output pads 162b.

[0066] In this regard, a plurality of voltages and a plurality of control signals transmitted through the wirings of the printed circuit board 150 may be applied to the first input pad 152a and the second input pad 152b. For example, the voltage applied to the sub-pixel SP of the display panel 110, the voltage applied to the gate driving circuit 130, the gate control signal GCS, the GIP signal, the clock signal, the touch signal, etc. may be applied to the first input pad 152a and the second input pad 152b.

[0067] The third input pad 151 may be arranged in a single row that is a combination of the first row and the second row and may be disposed at the center of the input side bonding region. The third input pad 151 may be indirectly connected to the third output pad 161a and the fourth output pad 161b via the source driver SDIC.

[0068] In this regard, digital signals may be applied to the third input pad 151. For example, the image data DATA, the data control signal DCS, and the clock signal for data sampling may be applied to the third input pad 151.

[0069] The output side bonding region of the circuit film COF may be bonded to pads (not shown) provided in the non-display region of the display panel 110. In one example, the circuit film COF may be bonded to pads located on the front surface of the display panel 110 and may be bent toward the back surface of the display panel 110.

[0070] The output side bonding region of the circuit film COF may include a plurality of first output pads 162a, a plurality of second output pads 162b, a plurality of third output pads 161a, and a plurality of fourth output pads 161b. Each of the first output pad 162a, the second output pad 162b, the third output pad 161a, and the fourth output pad 161b may be bonded to pads provided in the non-display region of the display panel 110.

[0071] The first output pad 162a may be arranged in the first row OLB1 of the output side bonding region of the circuit film COF, and the second output pad 162b may be arranged in the second row OLB2 of the output side bonding region of the circuit film COF. The third output pad 161a may be arranged in the first row OLB1 of the output side bonding region of the circuit film COF. The fourth output pad 161b may be arranged in the second row OLB2 of the output side bonding region of the circuit film COF.

[0072] The first output pad 162a may be disposed on each of two opposite sides of the output-side bonding region. The second output pad 162b may be disposed on each of two opposite sides of the output-side bonding region. Each of the third output pad 161a and the fourth output pad 161b may be disposed at the center of the output-side bonding region.

[0073] The first output pad 162a and the second output pad 162b may be directly and respectively connected to the first input pad 152a and the second input pad 152b in the input-side bonding region of the circuit film COF via respective connection wirings 171.

[0074] In one example, the first output pad 162a and the second output pad 162b may receive the voltage of the sub-pixel SP, the voltage of the gate driving circuit 130, the gate control signal GCS, the GIP signal, the clock signal, the touch signal, etc. from the first input pad 152a and the second input pad 152b, respectively.

[0075] Each of the first output pad 162a and the second output pad 162b may be bonded to a pad disposed in the non-display region of the display panel 110, and may transmit the voltage of the sub-pixel SP, the voltage of the gate driving circuit 130, the gate control signal GCS, the GIP signal, the clock signal, the touch signal, etc. to the display panel 110.

[0076] In addition, each of the third output pad 161a and the fourth output pad 161b may receive a data voltage corresponding to the image data DATA from the source driver SDIC. The third output pad 161a and the fourth output pad 161b may be bonded to a pad disposed in the non-display region of the display panel 110 and may output the data voltage corresponding to the image data DATA to the display panel 110.

[0077] The source driver SDIC may receive the image data DATA, the data control signal DCS, and the sampling clock signal via the third input pad 151, and may convert the image data DATA into a data voltage as an analog signal. Then, the source driver SDIC may supply the data voltage to the display panel 110 via the third output pad 161a and the fourth output pad 161b.

[0078] Figure 3 is a top view of a circuit film of a display device according to an embodiment of the present disclosure.

[0079] Referring to Figure 3 the source driver SDIC may be mounted on the circuit film COF. In one example, the source driver SDIC may be disposed at the center of the circuit film COF and may be mounted on the circuit film COF in a chip-on-film manner.

[0080] The circuit film COF may include a first input pad 152a, a second input pad 152b, and a third input pad 151 connected to the printed circuit board 150.

[0081] The first input pad 152a may be disposed in the first row ILB1 of the input side bonding region, and the second input pad 152b may be disposed in the second row ILB2 of the input side bonding region. The first input pad 152a may be provided on each of two opposite sides of the input side bonding region of the circuit film COF. The second input pad 152b may be provided on each of two opposite sides of the input side bonding region of the circuit film COF. The third input pad 151 may be disposed in a single row that is a combination of the first row and the second row and may be provided at the center of the input side bonding region.

[0082] In one example, the first input pad 152a and the second input pad 152b may be arranged in a staggered manner based on a reference line I. For example, the first input pad 152a may be provided on the right side around the reference line I, and the second input pad 152 may be provided on the left side around the reference line I.

[0083] In addition, the circuit film COF may include a plurality of first output pads 162a, a plurality of second output pads 162b, a plurality of third output pads 161a, and a plurality of fourth output pads 161b connected to the display panel 110.

[0084] The first output pad 162a may be disposed in the first row OLB1 of the output side bonding region of the circuit film COF, and the second output pad 162b may be disposed in the second row OLB2 of the output side bonding region of the circuit film COF. The first output pad 162a may be provided on each of two opposite sides of the output side bonding region. The second output pad 162b may be provided on each of two opposite sides of the output side bonding region.

[0085] In one example, the first output pad 162a and the second output pad 162b may be arranged in a zigzag pattern or a staggered pattern based on the reference line I. For example, the first output pad 162a may be provided on the right side around the reference line I, and the second output pad 162b may be provided on the left side around the reference line I.

[0086] In addition, the first input pad 152a and the first output pad 162a may be located in different layers, but may be arranged in the same column and directly connected to each other via connection wirings respectively. In addition, the second input pad 152b and the second output pad 162b may be located in different layers, but may be arranged in the same column and directly connected to each other via vias and connection wirings respectively.

[0087] Each of the third output pad 161a and the fourth output pad 161b may be disposed at the center of the output-side bonding region. In this regard, the third output pad 161a may be arranged in the first row OLB1 of the output-side bonding region of the circuit film COF. The fourth output pad 161b may be arranged in the second row OLB2 of the output-side bonding region of the circuit film COF.

[0088] In one example, the third input pad 151 disposed at the center of the input-side bonding region of the circuit film COF, the third output pad 161a and the fourth output pad 161b disposed at the center of the output-side bonding region of the circuit film COF may be arranged in the same column. The third input pad 151, the third output pad 161a, and the fourth output pad 161b may be indirectly connected to each other via the source driver SDIC.

[0089] The source driver SDIC may receive the image data DATA via the third input pad 151. The source driver SDIC may convert the image data DATA into a data voltage and output the data voltage to the third output pad 161a and the fourth output pad 161b.

[0090] Figure 4 is a cross-sectional view of one side of the circuit film in the display device according to an embodiment of the present disclosure. In one example, Figure 4 shows Figure 3 a cross-sectional view taken between I-I in

[0091] Referring to Figure 4 , the circuit film may include a first input pad 152a and a second input pad 152b formed in the top surface of the input-side bonding region. The first input pad 152a and the second input pad 152b may be respectively connected to a first output pad 162a and a second output pad 162b formed in the bottom surface of the output-side bonding region via vias and wirings.

[0092] The circuit film may include a plurality of first inspection pads 181 and a plurality of second inspection pads 182 for inspecting the bonding state at the bottom surface of the cutting region CA cut during shipment. The first inspection pads 181 may be electrically connected to the first input pad 152a and the first output pad 162a via vias and wirings. The second inspection pads 182 may be electrically connected to the second input pad 152b and the second output pad 162b via other vias and wirings.

[0093] A test signal can be applied via a first input pad 152a and a second input pad 152b. It can be determined whether the output signal is normally output through a first inspection pad 181 and a second inspection pad 182 to check the bonding state of the circuit film. The first inspection pad 181 and the second inspection pad 182 can be cut and removed together with a cutting area CA to be cut during shipment.

[0094] In one example, for inspection of the circuit film, the input pads can extend outside the circuit film, and an inspection signal can be applied to the input pads. Then, it can be checked whether the output signal is normally output through the first inspection pad 181 and the second inspection pad 182 connected to the input pads via vias and wirings. The cutting area CA of the input pads extending outside the circuit film can be removed during shipment.

[0095] Figure 5 is a cross-sectional view of the other side of the circuit film in a display device according to an embodiment of the present disclosure. In one example, Figure 5 shows Figure 3 a cross-sectional view taken between II-II in

[0096] Referring to Figure 5 , the circuit film can include a third input pad 151 formed in the top surface of the input-side bonding region, and a third output pad 161a and a fourth output pad 161b respectively formed in two rows and formed at the bottom surface of the output-side bonding region. The third input pad 151 can be connected to the source driver SDIC via wiring, and the third output pad 161a and the fourth output pad 161b can be connected to the source driver SDIC through respective vias and wirings.

[0097] The circuit film can include a first inspection pad 181 and a second inspection pad 182 for inspecting the bonding state at the bottom surface of a cutting area CA cut during shipment. The first inspection pad 181 can be electrically connected to the third output pad 161a and the source driver SDIC through wiring and vias. The second inspection pad 182 can be electrically connected to the fourth output pad 161b and the source driver SDIC via other wiring and vias.

[0098] A test signal is applied via the third input pad 151. It can be checked whether the output signal is normally output through the first inspection pad 181 and the second inspection pad 182 to determine the bonding state of the circuit film and the connection state of the source driver SDIC.

[0099] In one example, a test signal can be applied to the third input pad 151 to check the circuit film. It can be checked whether the output signal is normally output through the first inspection pad 181 and the second inspection pad 182 that are electrically connected to the output pad and the source driver SDIC via wirings and vias, so as to determine the bonding state of the circuit film and the connection state of the source driver SDIC. After the circuit film is inspected, the cutting area CA including the first inspection pad 181 and the second inspection pad 182 can be removed.

[0100] Figure 6 A bottom view and a top view for checking the bonding state of a circuit film in a display device according to an embodiment of the present disclosure are shown.

[0101] Referring to Figure 6 , in the cutting area CA to be cut, the circuit film may include a first test pin ILB1 TP, a second test pin ILB2 TP, a third test pin OLB1 TP, and a fourth test pin OLB2 TP. The test pins may be at least one of a plurality of first inspection pads 181 and a plurality of second inspection pads 182.

[0102] When checking the circuit film, an external test device (not shown) can apply a test signal to the first row ILB1 of the input-side bonding area of the circuit film COF via the first test pin ILB1 TP for signal input corresponding to the first row ILB1 to perform the inspection. In this regard, the first test pin ILB1 TP for signal input corresponding to the first row ILB1 of the input-side bonding area can be provided in the cutting area CA of the circuit film and can be removed after the inspection.

[0103] In addition, when checking the circuit film, the test device can check the condition of the circuit film based on the detection result of the output signal through the third test pin OLB1 TP for signal output inspection corresponding to the first row OLB1 of the output-side bonding area of the circuit film. In this regard, the third test pin OLB1 TP for signal output inspection corresponding to the first row OLB1 can be provided in the cutting area CA of the circuit film and can be removed after the inspection.

[0104] In addition, in the inspection of the circuit film, the test device can apply a test signal to the second row ILB2 of the input-side bonding area of the circuit film via the second test pin ILB2 TP for signal input corresponding to the second row ILB2 of the input-side bonding area of the circuit film COF to perform the inspection. In this regard, the second test pin ILB2 TP for signal input corresponding to the second row ILB2 of the input-side bonding area can be provided in the cutting area CA of the circuit film and can be removed after the inspection.

[0105] In addition, when inspecting the circuit film, the test device may inspect the state of the circuit film based on the detection result of the output signal of the fourth test pin OLB2 TP for signal output inspection of the second row OLB2 corresponding to the output-side bonding region of the circuit film. In this regard, the fourth test pin OLB2 TP for signal output inspection of the second row OLB1 corresponding to the output-side bonding region may be provided in the cutting area CA of the circuit film and may be removed after the inspection.

[0106] In this way, the input-side bonding region of the circuit film may include a plurality of input pads, and among the plurality of input pads directly connected to the output pads of the output-side bonding region, the input pads other than the input pads connected to the source driver SDIC are arranged in two rows. The test pins may be configured to enable inspection of the input pads and output pads arranged in two rows. In this way, the state of the circuit film may be inspected.

[0107] A display device according to some aspects and embodiments of the present disclosure may be configured as follows.

[0108] A first aspect of the present disclosure may provide a display device including: a display panel; a printed circuit board; and a circuit film disposed between the display panel and the printed circuit board and connected to the display panel and the printed circuit board, wherein the circuit film includes an input-side bonding region connected to the printed circuit board and an output-side bonding region connected to the display panel, wherein the input-side bonding region includes a plurality of input pads connected to the output-side bonding region, and wherein the plurality of input pads are arranged in two rows.

[0109] According to some embodiments of the first aspect, the output-side bonding region includes a plurality of output pads, and wherein the plurality of output pads are arranged in two rows.

[0110] According to some embodiments of the first aspect, the plurality of input pads of the input-side bonding region of the circuit film include: first input pads respectively provided on opposite sides of the input-side bonding region and arranged in the first row; second input pads respectively provided on opposite sides of the input-side bonding region and arranged in the second row; and third input pads provided at the center of the input-side bonding region and arranged in the first row, the second row, or a single row as a combination of the first row and the second row.

[0111] According to some embodiments of the first aspect, each of the first input pads and the second input pads is bonded to a pad of the printed circuit board and is directly connected to the output-side bonding region.

[0112] According to some embodiments of the first aspect, a plurality of voltages and a plurality of control signals from the printed circuit board are applied to the first input pads and the second input pads.

[0113] According to some embodiments of the first aspect, the third input pad is bonded to a pad of a printed circuit board and connected to an output-side bonding region through a source driver mounted at the center of the circuit film.

[0114] According to some embodiments of the first aspect, the third input pad receives a digital signal from the printed circuit board.

[0115] According to some embodiments of the first aspect, the output-side bonding region of the circuit film includes: first output pads respectively disposed on opposite sides of the output-side bonding region and arranged in a first row; second output pads respectively disposed on opposite sides of the output-side bonding region and arranged in a second row; third output pads arranged in the first row and disposed at the center of the output-side bonding region; and fourth output pads arranged in the second row and disposed at the center of the output-side bonding region.

[0116] According to some embodiments of the first aspect, each of the first output pads and the second output pads is bonded to a pad of the display panel and directly connected to the input-side bonding region.

[0117] According to some embodiments of the first aspect, the third output pads and the fourth output pads are bonded to pads of the display panel and connected to the input-side bonding region through a source driver mounted at the center of the circuit film.

[0118] According to some embodiments of the first aspect, the first input pad and the second input pad are arranged in a staggered manner based on a reference line, the first output pad and the second output pad are arranged in a staggered manner based on the reference line, and the third input pad, the third output pad, and the fourth output pad are arranged in the same column.

[0119] According to some embodiments of the first aspect, the first input pad and the second input pad are located in different layers and in the same column, and the first output pad and the second output pad are located in different layers and in the same column.

[0120] A second aspect of the present disclosure may provide a display device including: a printed circuit board including pads for outputting a plurality of voltages and a plurality of control signals; a display panel including a display area and a non-display area surrounding the display area, wherein a plurality of sub-pixels are provided in the display area, and pads are provided in the non-display area; a circuit film including an input-side bonding region bonded to the pads of the printed circuit board and an output-side bonding region bonded to the pads of the display panel, wherein the input-side bonding region includes a plurality of input pads, and at least two of the plurality of input pads are respectively provided in at least two rows; and a source driver mounted on the circuit film, wherein the source driver is electrically connected to the printed circuit board via the input-side bonding region and electrically connected to the display panel via the output-side bonding region.

[0121] According to some embodiments of the second aspect, the output side bonding region of the circuit film includes a plurality of output pads arranged in two rows.

[0122] According to some embodiments of the second aspect, the input side bonding region includes: a first input pad arranged in the first row; a second input pad arranged in the second row; and a third input pad arranged in the first row, the second row, or a single row that is a combination of the first row and the second row.

[0123] According to some embodiments of the second aspect, the first input pads are respectively provided on opposite sides of the input side bonding region, wherein the second input pads are respectively provided on opposite sides of the input side bonding region, and wherein the third input pad is provided at the center of the input side bonding region.

[0124] According to some embodiments of the second aspect, each of the first input pad and the second input pad is directly connected to the output side bonding region of the circuit film via respective connection wirings, and the third input pad is connected to the output side bonding region of the circuit film via a source driver.

[0125] According to some embodiments of the second aspect, the output side bonding region includes: a first output pad arranged in the first row; a second output pad arranged in the second row; a third output pad arranged in the first row; and a fourth output pad arranged in the second row.

[0126] According to some embodiments of the second aspect, the first output pads are respectively provided on opposite sides of the output side bonding region, wherein the second output pads are respectively provided on opposite sides of the output side bonding region, wherein the third output pad is provided at the center of the output side bonding region, and wherein the fourth output pad is provided at the center of the output side bonding region.

[0127] According to some embodiments of the second aspect, the first input pad and the second input pad are arranged in a staggered manner based on a reference line, the first output pad and the second output pad are arranged in a staggered manner based on the reference line, and the third input pad, the third output pad, and the fourth output pad are arranged in the same column.

[0128] According to an embodiment of the present disclosure, the input pads and the output pads that are directly connected to each other among the bonding pads of the circuit film are arranged in two rows to increase the gap size between the bonding pads, thereby realizing a display device that requires high resolution and high frequency display.

[0129] In addition, according to an embodiment of the present disclosure, the gap between the bonding pads can be increased without increasing the width of the circuit film.

[0130] In addition, according to an embodiment of the present disclosure, by increasing the gap between bonding pads to reduce interference therebetween, the image quality in high-resolution and high-frequency displays can be improved.

[0131] In addition, according to an embodiment of the present disclosure, the spacing between bonding pads can be increased, thereby improving the processing ability.

[0132] According to an embodiment of the present disclosure, the production energy can be reduced by optimizing the process.

[0133] Although the embodiments of the present disclosure have been described with reference to the accompanying drawings, the present disclosure is not limited to the above embodiments and can be implemented in various different forms. Those skilled in the art can understand that the present disclosure can be practiced in other specific forms without changing the technical spirit or essential features of the present disclosure. Therefore, it should be recognized that the embodiments described above are illustrative rather than restrictive in all respects.

Claims

1. A display device, comprising: Display panel; Printed circuit boards; as well as a circuit film disposed between the display panel and the printed circuit board and connected to the display panel and the printed circuit board, wherein the circuit film includes an input side bonding area connected to the printed circuit board and an output side bonding area connected to the display panel, wherein the input side bonding area includes a plurality of input pads connected to the output side bonding area, Wherein, the plurality of input pads are arranged in two rows.

2. The display device according to claim 1, wherein: The output-side bonding area includes a plurality of output pads, wherein the plurality of output pads are arranged in two rows.

3. The display device according to claim 2, wherein: The plurality of input pads of the input side bonding area of ​​the circuit film include: first input pads, respectively disposed on opposite sides of the input-side bonding area and arranged in a first row; second input pads, respectively disposed on opposite sides of the input-side bonding area and arranged in a second row; and A third input pad is provided at the center of the input-side bonding area and is arranged in the first row, in the second row, or in a single row which is a combination of the first row and the second row.

4. The display device according to claim 3, wherein: Each of the first input pad and the second input pad is bonded to a pad of the printed circuit board and is directly connected to the output-side bonding area.

5. The display device according to claim 4, wherein: A plurality of voltages and a plurality of control signals from the printed circuit board are applied to the first input pad and the second input pad.

6. The display device according to claim 3, wherein: The third input pad is bonded to a pad of the printed circuit board and is connected to the output side bonding area through a source driver mounted at the center of the circuit film.

7. The display device according to claim 6, wherein: The third input pad receives a digital signal from the printed circuit board.

8. The display device according to claim 3, wherein: The output side bonding area of ​​the circuit film includes: first output pads, respectively disposed on opposite sides of the output side bonding area and arranged in a first row; second output pads, respectively disposed on opposite sides of the output side bonding area and arranged in a second row; a third output pad arranged in the first row and disposed at a center of the output-side bonding area; and A fourth output pad is arranged in the second row and disposed at the center of the output-side bonding area.

9. The display device according to claim 8, wherein: Each of the first output pad and the second output pad is bonded to a pad of the display panel and is directly connected to the input-side bonding area.

10. The display device according to claim 8, wherein: The third output pad and the fourth output pad are bonded to pads of the display panel and connected to the input side bonding area through a source driver installed at the center of the circuit film.

11. The display device according to claim 8, wherein: The first input pad and the second input pad are arranged in a staggered manner based on a reference line, the first output pad and the second output pad are arranged in a staggered manner based on the reference line, and the third input pad, the third output pad, and the fourth output pad are arranged in the same column.

12. The display device according to claim 8, wherein: The first input pad and the second input pad are located in different layers and in the same column, and the first output pad and the second output pad are located in different layers and in the same column.

13. A display device, comprising: A printed circuit board including pads for outputting a plurality of voltages and a plurality of control signals; A display panel, comprising a display area and a non-display area surrounding the display area, wherein a plurality of sub-pixels are arranged in the display area, and a pad is arranged in the non-display area; a circuit film comprising an input-side bonding region bonded to the pad of the printed circuit board and an output-side bonding region bonded to the pad of the display panel, wherein the input-side bonding region comprises a plurality of input pads, wherein at least two of the plurality of input pads are respectively arranged in at least two rows; and A source driver is mounted on the circuit film, wherein the source driver is electrically connected to the printed circuit board via the input-side bonding area and is electrically connected to the display panel via the output-side bonding area.

14. The display device according to claim 13, wherein: The output-side bonding area of ​​the circuit film includes a plurality of output pads arranged in two rows.

15. The display device according to claim 14, wherein: The input side bonding area comprises: first input pads arranged in a first row; second input pads arranged in a second row; and The third input pads are arranged in the first row, in the second row, or in a single row which is a combination of the first row and the second row.

16. The display device according to claim 15, wherein: The first input pads are respectively arranged at two opposite sides of the input side bonding area, Wherein, the second input pads are respectively arranged on two opposite sides of the input side bonding area, Wherein, the third input pad is arranged at the center of the input side bonding area.

17. The display device according to claim 16, wherein: Each of the first input pad and the second input pad is directly connected to the output-side bonding region of the circuit film via respective connection wirings, and the third input pad is connected to the output-side bonding region of the circuit film via the source driver.

18. The display device according to claim 15, wherein: The output side joint area includes: first output pads arranged in a first row; second output pads arranged in a second row; a third output pad arranged in the first row; and A fourth output pad is arranged in the second row.

19. The display device according to claim 18, wherein: The first output pads are respectively arranged on two opposite sides of the output side bonding area, Wherein, the second output pads are respectively arranged on two opposite sides of the output side bonding area, Wherein, the third output pad is arranged at the center of the output side bonding area, Wherein, the fourth output pad is arranged at the center of the output side bonding area.

20. The display device according to claim 18, wherein: The first input pad and the second input pad are arranged in a staggered manner based on a reference line, the first output pad and the second output pad are arranged in a staggered manner based on the reference line, and the third input pad, the third output pad, and the fourth output pad are arranged in the same column.

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