Key circuit board and keyboard

Abstract

The invention discloses a key circuit board and a keyboard, and relates to the technical field of keyboard backlight, and the key circuit board comprises a backlight circuit board and a keyboard backlight circuit. The keyboard backlight circuit is arranged on the same surface of the backlight circuit board, the keyboard backlight circuit comprises a power supply wire, a ground wire, a signal wire and a plurality of rows of LED packaging units, and each row of LED packaging units comprises a plurality of LED packaging units; the LED packaging units are connected in series, in the series connection direction, the foremost LED packaging unit is connected with the signal line through the first data port bonding pad of the foremost LED packaging unit, and in every two adjacent LED packaging units, the second data port bonding pad of the front LED packaging unit is electrically connected with the first data port bonding pad of the rear LED packaging unit. Due to the fact that the LED packaging units are connected in series, the structure of the keyboard backlight circuit can be simplified, the keyboard backlight circuit can be arranged on the same surface of the backlight circuit board, and the overall thickness of the key circuit board is smaller.

Description

Technical Field

[0001] The present invention relates to the technical field of keyboard backlighting, and particularly to a key circuit board and a keyboard. Background Art

[0002] At present, some keyboards have a backlighting function, enabling users to clearly see the key symbols even in a relatively dark environment, which facilitates the use of the keyboard and makes the keyboard more aesthetically pleasing.

[0003] The keyboard backlighting circuit realizes the backlighting of the keyboard by controlling the light emission of LED (light-emitting diode) chips. Generally, the keyboard backlighting circuit includes an input line, a ground wire, and a lighting circuit connected between the input line and the ground wire. The lighting circuit is provided with LED chips. When a high level is input to the input line, the LED chips are powered on and emit light. In this way, the LED chips connected to the same input line will emit light or go out simultaneously, making it difficult to produce more diverse lighting effects.

[0004] The inventor has found through research that integrating the LED chips and the control chips to form an LED packaging unit is conducive to achieving more diverse lighting effects. One LED packaging unit is provided under each key. The control chip can receive instructions from the main control board and then control the corresponding LED chips to emit light. In this way, the LED chips under each key can emit light independently, thus realizing relatively diverse lighting effects. However, there are still some areas for improvement.

[0005] For example, the thickness of the LED packaging unit may be relatively thick, resulting in an increase in the thickness of the keyboard circuit board, which is not conducive to the thin and light design of electronic devices.

[0006] For another example, if the LED packaging unit can only control the corresponding LED to emit light or not emit light according to the control instruction, its function is relatively single. Moreover, since the keyboard usually has a dedicated circuit for key detection, when it is stacked with the backlighting circuit board where the LED packaging unit is located, the overall thickness will be further increased.

[0007] For another example, the key detection circuit needs to be able to detect keys and also has the function of preventing ghost keys. Usually, diodes are set in the key detection circuit to achieve the function of preventing ghost keys, resulting in a complex circuit structure and high cost.

[0008] For another example, when a certain LED packaging unit fails, the backlighting function of the corresponding key will immediately fail, which is not conducive to the reliable implementation of the keyboard backlighting function. In addition, the LED packaging units connected to the failed LED packaging unit may not be able to receive instructions from the main control board, resulting in the simultaneous failure of the backlighting functions of multiple keys.

[0009] For another example, the backlight of the keyboard needs to be calibrated so that the brightness of each key is basically the same. However, the luminous brightness of the produced LEDs is not consistent. The traditional method is to group the LEDs according to their brightness and install the LEDs with similar brightness on the same keyboard. However, this will result in a large difference in the backlight brightness of different keyboards and also cause a large number of LEDs to be unusable. In addition, after the keycaps are installed, the backlight of the keyboard will be interfered by the keycaps, resulting in poor consistency of the backlight of the keyboard.

[0010] Therefore, it is necessary to improve the existing technology to overcome the above-mentioned defects in the existing technology.

[0011] The above content is only used to help understand the technical solution of the present application and does not constitute an admission of the above as the prior art. Summary of the Invention

[0012] The object of the present invention is to provide a key circuit board and a keyboard to solve at least one of the technical problems proposed in the background art.

[0013] To achieve the above object of the invention, in a first aspect, the present invention provides a key circuit board, comprising:

[0014] A backlight circuit board;

[0015] A keyboard backlight circuit disposed on the same surface of the backlight circuit board. The keyboard backlight circuit includes a power supply line, a ground line, a signal line, and multiple rows of LED package units. Each row of the LED package units includes a plurality of LED package units;

[0016] The LED package unit includes an LED chip, a control chip, and a port component packaged together. The port component is electrically connected to the control chip and includes a power supply port pad connected to the power supply line, a ground port pad connected to the ground line, and a first data port pad and a second data port pad for signal transmission;

[0017] The LED package units are connected in series. In the series direction, the foremost LED package unit is connected to the signal line through its first data port pad. Among two adjacent LED package units, the second data port pad of the preceding LED package unit is electrically connected to the first data port pad of the following LED package unit.

[0018] In a second aspect, the present invention further provides a keyboard including the above key circuit board.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] According to at least one embodiment of the present invention, a key circuit board includes a backlight circuit board and a keyboard backlight circuit. The keyboard backlight circuit is disposed on the same surface of the backlight circuit board. The keyboard backlight circuit includes a power supply line, a ground line, a signal line, and multiple rows of LED packaging units. Each row of the LED packaging units includes a plurality of LED packaging units; the LED packaging unit includes an LED chip, a control chip, and a port component packaged together. The port component is electrically connected to the control chip, and includes a power supply port pad connected to the power supply line, a ground port pad connected to the ground line, and a first data port pad and a second data port pad for signal transmission; the LED packaging units are connected in series. In the series connection direction, the foremost LED packaging unit is connected to the signal line through its first data port pad. Among two adjacent LED packaging units, the second data port pad of the preceding LED packaging unit is electrically connected to the first data port pad of the following LED packaging unit. Since the LED packaging units are connected in series, the structure of the keyboard backlight circuit can be simplified, enabling a single signal line to input control signals to all LED packaging units. Moreover, the keyboard backlight circuit can be disposed on the same surface of the backlight circuit board, reducing the overall thickness of the key circuit board, facilitating manufacturing, and helping to reduce costs. Description of the Drawings

[0021] Figure 1 is a cross-sectional schematic view of an LED packaging unit in some embodiments of the present invention.

[0022] Figure 2 is Figure 1 a schematic diagram showing the positions of the port pads, circuits, control chip, and LED chip of the LED packaging unit shown.

[0023] Figure 3 is Figure 1 a schematic diagram of the LED packaging unit shown when provided with a glue film layer.

[0024] Figure 4 is a cross-sectional schematic view of an LED packaging unit in some embodiments of the present invention.

[0025] Figure 5 is Figure 4 a schematic diagram showing the positions of the circuits, control chip, and LED chip of the LED packaging unit shown.

[0026] Figure 6 is a schematic diagram showing the positions of the port pads in some embodiments of the present invention.

[0027] Figure 7 is Figure 1 a schematic diagram of the LED packaging unit shown when provided with an isolation layer.

[0028] Figure 8 isFigure 4 Schematic diagram of the LED packaging unit shown when it is provided with an isolation layer.

[0029] Figure 9 is Figure 1 Schematic diagram of the LED packaging unit shown when it is provided with an annular retaining wall.

[0030] Figure 10 is Figure 4 Schematic diagram of the LED packaging unit shown when it is provided with an annular retaining wall.

[0031] Figure 11 is Figure 1 Schematic diagram of the LED packaging unit shown when it is provided with both an isolation layer and an annular retaining wall.

[0032] Figure 12 is Figure 4 Schematic diagram of the LED packaging unit shown when it is provided with both an isolation layer and an annular retaining wall.

[0033] Figure 13 Schematic diagram of the position of the annular retaining wall and the LED chip in a top view direction in some embodiments of the present invention.

[0034] Figure 14 Schematic diagram of the structure of the LED packaging unit in some embodiments of the present invention. In the figure, the top of the LED chip is flush with the package body.

[0035] Figure 15 Schematic diagram of the structure of the LED packaging unit in some embodiments of the present invention. In the figure, the port pad is provided with nickel-palladium-gold.

[0036] Figure 16 Schematic diagram of the adhesive film layer provided with a light-transmitting area in some embodiments of the present invention. In the figure, the light-transmitting area is a hole.

[0037] Figure 17 Schematic diagram of the adhesive film layer provided with a light-transmitting area in some embodiments of the present invention. In the figure, the light-transmitting area is made of a transparent material.

[0038] Figure 18 Schematic diagram of the position of the adhesive film layer and the LED chip in some embodiments of the present invention.

[0039] Figure 19 Schematic diagram of the position of the adhesive film layer and the LED chip in some embodiments of the present invention.

[0040] Figure 20 Schematic diagram of the position of the adhesive film layer and the LED chip in some embodiments of the present invention.

[0041] Figure 21It is a schematic structural diagram of an LED packaging unit in some embodiments of the present invention. In the figure, a control chip is built-in with a memory.

[0042] Figure 22 is the molding in some embodiments of the present invention Figure 1 schematic diagram of the process of the LED packaging unit shown.

[0043] Figure 23 is a schematic diagram of the process of preparing an insulating layer in some embodiments of the present invention.

[0044] Figure 24 is a schematic diagram of simultaneously molding a film layer and an insulating layer in some embodiments of the present invention.

[0045] Figure 25 is the molding in some embodiments of the present invention Figure 11 schematic diagram of the process of the LED packaging unit shown.

[0046] Figure 26 is the molding in some embodiments of the present invention Figure 4 schematic diagram of the process of the LED packaging unit shown.

[0047] Figure 27 is a schematic diagram of the process of steps C7 to C9 in some embodiments of the present invention.

[0048] Figure 28 is a schematic diagram of step C10 in some embodiments of the present invention.

[0049] Figure 29 is the molding in some embodiments of the present invention Figure 12 schematic diagram of the process of the LED packaging unit shown.

[0050] Figure 30 is a schematic diagram of a keyboard backlight circuit in some embodiments of the present invention. In the figure, each LED packaging unit group includes one LED packaging unit.

[0051] Figure 31 is a schematic diagram of a keyboard backlight circuit in some embodiments of the present invention. In the figure, each LED packaging unit group includes three LED packaging units.

[0052] Figure 32 is Figure 31 schematic diagram of the LED packaging unit group in.

[0053] Figure 33 is a schematic diagram of a keyboard backlight circuit in some embodiments of the present invention.

[0054] Figure 34 is a schematic diagram of a keyboard backlight circuit without installing an LED packaging unit in some embodiments of the present invention.

[0055] Figure 35 It is a schematic diagram of the keyboard backlight circuit in some embodiments of the present invention.

[0056] Figure 36 It is a schematic diagram of the keyboard backlight circuit in some embodiments of the present invention disposed on the backlight circuit board.

[0057] Figure 37 It is a cross-sectional schematic diagram of the key circuit board in some embodiments of the present invention.

[0058] Figure 38 It is a cross-sectional schematic diagram of the key circuit board in some embodiments of the present invention.

[0059] Figure 39 It is a schematic diagram of the first circuit board in some embodiments of the present invention.

[0060] Figure 40 It is a schematic diagram of the spacer layer in some embodiments of the present invention.

[0061] Figure 41 It is a schematic diagram of the backlight circuit board in some embodiments of the present invention.

[0062] Figure 42 It is a cross-sectional schematic diagram of the key circuit board in some embodiments. Detailed implementation manners

[0063] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. It can be understood that the specific embodiments described herein are only for explaining the present application, rather than limiting the present application. Additionally, it should be noted that for the sake of convenience of description, only the parts related to the present application are shown in the drawings, rather than all the structures. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0064] The terms "include" and "have" and any variations thereof in the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.

[0065] References to "embodiments" in this specification mean that particular features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment each time, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0066] Some embodiments of the present application disclose an LED packaging unit, as Figure 1 and Figure 2 shown, which includes a package body 10, an LED chip 11, a control chip 12, and a wiring layer 13.

[0067] The package body 10 is made of an insulating material, such as a resin material, and includes a bottom surface 100 and a top surface 101 located at both ends in its thickness direction. The top surface 101 is used for the light of the LED chip 11 to emit.

[0068] Both the LED chip 11 and the control chip 12 are disposed within the package body 10. The control chip 12 is arranged on one side in the radial direction of the LED chip 11. The radial direction refers to the direction perpendicular to the thickness direction of the package body 10. The thickness direction of the package body 10 is consistent with the thickness direction of the LED packaging unit. The control chip 12 and the LED chip 11 are arranged to be spaced apart in the horizontal direction, which can reduce the thickness H of the LED packaging unit 1.

[0069] The LED chip 11 generally includes two electrodes 110 (a positive electrode and a negative electrode). The control chip 12 has a plurality of pads 121. The electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 are both oriented towards the bottom surface 100. The control chip 12 and the LED chip 11 are electrically connected to control the LED chip 11 to emit light.

[0070] The wiring layer 13 includes a circuit 132 disposed on the side where the bottom surface 100 of the package body 10 is located and a port component 131 connected to the circuit 132. The port component 131 includes a plurality of port pads. The circuit 132 is used to achieve electrical connections between the port pads, the LED chip 11, and the control chip 12. For example, it can have a portion connected between a certain pad 121 of the control chip 12 and a certain port pad to achieve electrical connection therebetween, it can have a portion connected between a certain pad 121 of the control chip 12 and a certain electrode 110 of the LED chip 11 to achieve electrical connection therebetween, and it can have a portion connected between a certain electrode 110 of the LED chip 11 and a certain port pad to achieve electrical connection therebetween.

[0071] In the above embodiments, since the LED packaging unit does not include components such as a substrate (or support plate) for carrying the LED chip 11 or the control chip 12 that a general packaging unit has, the overall thickness H can be effectively reduced. At the same time, the LED chip 11 and the control chip 12 are arranged at intervals along the radial direction, which can further make the whole thinner. Moreover, the electrodes 110 of the LED chip 11 and the pads of the control chip 12 face the same side, which is more convenient for wiring and reduces the processing difficulty.

[0072] In addition, it can be understood that in the LED packaging unit, the control chip 12 can control the LED chip 11 to emit light according to the received control signal. When the LED packaging unit is applied to the keyboard backlight circuit and is correspondingly arranged under different keycaps, each LED packaging unit under the keycaps can be independently driven to emit light, and it is not necessary to emit light or not emit light simultaneously, and a richer lighting effect can be achieved. It can be understood that at least part of the keycap is made of a transparent material for the light of the LED packaging unit to emit and achieve the backlight effect.

[0073] In some embodiments, the port component includes four port pads, as Figure 2 shown, which are the power supply port pad 1310, the first data port pad 1311, the second data port pad 1312, and the ground port pad 1313 respectively. The power supply port pad 1310 is used to connect with the power supply line to provide a high-level driving voltage for the control chip 12 and the LED chip 11. The first data port pad 1311 and the second data port pad 1312 are used for signal transmission, such as input and output signals, to receive or send data. The ground port pad 1313 is used to connect with the ground wire. The power supply port pad 1310, the first data port pad 1311, the second data port pad 1312, and the ground port pad 1313 are all connected to the corresponding pads of the control chip 12 through the line 132 to realize the electrical connection with the control chip 12. The LED chip 11 is electrically connected to the power supply port pad 1310 or the ground port pad 1313. In some embodiments, as Figure 2 shown, the power supply port pad 1310 is connected to one electrode 110 (positive electrode) of the LED chip 11, and the other electrode 110 (negative electrode) of the LED chip 11 is connected to the pad 121 of the control chip 12. When the LED packaging unit 1 has multiple LED chips 11, the multiple LED chips 11 are common anode. In some other embodiments, the ground port pad 1313 is connected to one electrode 110 (negative electrode) of the LED chip 11, and the other electrode 110 (positive electrode) of the LED chip 11 is connected to the pad 121 of the control chip 12. When the LED packaging unit 1 has multiple LED chips 11, the multiple LED chips 11 are common cathode.

[0074] Optionally, the LED packaging unit includes an insulating layer 130 filled in the space between the bottom surface 100, the port pads, and the circuit 132 to improve the insulation performance.

[0075] In some embodiments, such as Figure 1 and Figure 2 shown, the circuit 132 and the port pads are located on the same layer to further reduce the overall thickness. The circuit 132 includes a plurality of conductive wires, and by reasonably arranging the conductive wires, short circuits between the conductive wires can be avoided due to contact. Figure 2 In, the circuit 132 includes conductive wires 132a to 132h. The LED packaging unit includes an insulating layer 130 filled in the space between the bottom surface 100, the port pads, and the circuit 132. Specifically, the insulating layer 130 separates the conductive wires and port pads that need to be insulated to ensure the insulation effect.

[0076] In some embodiments, such as Figures 4 to 6 shown, Figure 4 shows a cross-sectional schematic diagram of the LED packaging unit in some embodiments, Figure 5 shows a layout schematic diagram of the circuit 132 of the LED packaging unit in some embodiments, Figure 6 shows a schematic diagram of the positions of the pads of the LED packaging unit in some embodiments. All the port pads are located on the same layer. The circuit 132 and the port pads are spaced apart along the thickness direction of the package 10. The circuit 132 and the port pads are separated by the insulating layer 130 in the thickness direction of the package 10 and are connected to the port pads to be connected through conductive connectors 133 passing through the insulating layer 130. Figure 5 In, the circuit 132 also includes conductive wires 132a to 132h, wherein the conductive wires 132a, 132c, 132d, and 132e are respectively connected to the power supply port pad 1310, the first data port pad 1311, the second data port pad 1312, and the ground port pad 1313 located on the outermost layer through conductive connectors 133.

[0077] It can be understood that although separating the port pad and the circuit 132 by the insulating layer 130 will increase the overall thickness of the LED packaging unit, it can enable the port pad to have a larger area. For example, the projection of the port pad along the thickness direction of the LED packaging unit can directly cover the control chip 12 and / or the LED chip 11 and / or the circuit 132 (i.e., the port pad is at least partially disposed opposite to the control chip 12 and / or the LED chip 11 and / or the circuit 132), without worrying about causing a short circuit. Moreover, the arrangement position of the port pad can be more diversified and is not overly affected by the circuit 132. Optionally, the total area of all the port pads accounts for no less than 22% of the area of the projection region of the LED packaging unit along its thickness direction, so as to make full use of the space, increase the area of the port pad, be more convenient for wiring with an external circuit, and at the same time increase the structural strength of the LED packaging unit. Further optionally, the total area of all the port pads accounts for no less than 40% of the area of the projection region of the LED packaging unit along its thickness direction. Even further optionally, the total area of all the port pads accounts for no less than 70% of the area of the projection region of the LED packaging unit along its thickness direction. Optionally, the area of each port pad is the same.

[0078] In some embodiments, the power supply port pad 1310, the first data port pad 1311, the second data port pad 1312, and the ground port pad 1313 are respectively located at the four corners of the LED packaging unit, so as to facilitate wiring and connection with an external circuit.

[0079] In some embodiments, the LED chip 11 is at least partially located at the center of the bottom surface 100 of the package 10, so as to facilitate uniform light emission and the length of the conductive wire will not be too long, which is convenient for wiring. Optionally, the control chip 12 is located on one side of the center of the bottom surface 100, and most (more than half) of the LED chip 11 is located on the other side of the center of the bottom surface 100 to further ensure the effect.

[0080] Optionally, there is a gap between the LED chip 11 and the top surface 101 of the package 10 to protect the LED chip 11. Further optionally, referring to Figure 1 , the distance D between the LED chip 11 and the top surface 101 of the package 10 is 5 μm to 30 μm, for example, it can be 0.01 mm, which is beneficial to protecting the LED chip 11 while reducing the loss of the light emitted by the LED chip 11.

[0081] In some embodiments, the LED packaging unit includes only one LED chip 11. In other embodiments, the LED packaging unit includes at least two LED chips 11 that emit light of different colors. Optionally, the LED packaging unit includes three LED chips 11 that emit red, green, and blue light respectively. By controlling the emission of light from the LED chips 11 of different colors, a variety of different colors can be mixed to achieve a more diverse lighting effect. When the LED packaging unit includes multiple LED chips 11, the electrodes of each LED chip 11 are connected to different pads of the control chip 12 so that the control chip 12 can independently control the emission of light from each LED chip 11. In the embodiments of this specification, "multiple" includes the case of two.

[0082] In some embodiments, in addition to the three-color LED chips 11, the LED packaging unit further includes white light LED chips to improve the purity of the white light emitted by the LED packaging unit. Optionally, the white light LED chips emit white light through a monochromatic LED light-emitting diode plus the corresponding phosphor.

[0083] Optionally, the LED chips 11 are in the shape of a cuboid, and the three LED chips 11 are arranged at intervals along their width direction. The control chip 12 is located on one side in the length direction of the LED chips 11. Among the three LED chips 11, the middle LED chip 11 is at least partially located at the center of the bottom surface 100 of the package 10 to make full use of the space and facilitate wiring. Optionally, the control chip 12 is located on one side of the center of the bottom surface 100, and most (more than half) of the whole formed by the three LED chips 11 is located on the other side of the center of the bottom surface 100 to further ensure the effect.

[0084] In some embodiments, the package 10 is made of a transparent material so that the light of the LED chips 11 can be emitted. It can be understood that when the LED chips 11 emit light, their light irradiates on the circuit 132 and the port pads and is reflected by the copper. When observed from the top surface 101, the color of the copper will be mixed with the light of the LED chips 11, resulting in interference of different colors in the reflection.

[0085] In some embodiments, such as Figure 7 and Figure 8As shown in the figure, the LED packaging unit includes an isolation layer 17 located between the package body 10 and the wiring layer 13. By providing the isolation layer 17 to isolate the LED chip 11 and the wiring layer 13, it is possible to prevent the formation of reflective color interference and reduce color difference. As a feasible example, the isolation layer 17 is made of a reflective material, such as a dielectric mirror polymer material, etc., which can reflect the light of the LED chip 11 and improve the light efficiency. As another feasible example, the isolation layer 17 is made of a white material, which can effectively reduce the reflective color difference. The white material can be, for example, white resin. In some embodiments, as Figure 9 and Figure 10 As shown in the figure, the LED packaging unit includes an annular retaining wall 16 located within the package body 10. The LED chip 11 is located within the annular retaining wall 16. By using the annular retaining wall 16 to isolate the light emitted laterally by the LED chip 11, it is possible to prevent the formation of reflective color interference and reduce color difference. At the same time, it can avoid the lateral color interference caused by the reflection of components (such as the control chip 12) around the LED chip 11, further reducing the color difference. In addition, it can also reduce the lateral leakage of the light of the LED chip 11 from the LED packaging unit. As a feasible example, the annular retaining wall 16 is made of a reflective material, such as a resin doped with a highly reflective filler or a silicone resin doped with a highly reflective filler, etc., which can reflect the color of the LED chip 11 and improve the light efficiency. As another feasible example, the annular retaining wall 16 is made of a white material, which can effectively reduce the reflective color difference. The white material can be, for example, white resin. As yet another feasible embodiment, the annular retaining wall 16 is made of a black material.

[0086] In some embodiments, as Figure 11 and Figure 12 As shown in the figure, the LED packaging unit includes both the isolation layer 17 and the annular retaining wall 16.

[0087] Optionally, as Figure 13 As shown in the figure, when the LED packaging unit 1 includes multiple LED chips 11, all the LED chips 11 are located within the same annular retaining wall 16.

[0088] In some embodiments, as Figure 14 As shown in the figure, the package body 10 is made of an opaque material, such as a frosted material or white, etc., to reduce the color difference. At this time, the LED chip 11 is exposed from the top surface 101 of the package body 10 so that the light of the LED chip 11 can be emitted outward. Optionally, the top of the LED chip 11 is flush with the top surface 101.

[0089] In some embodiments, as Figure 3 、 Figure 14 and Figure 15As shown, the LED packaging unit further includes a film layer 14 disposed on the top surface 101 to provide better protection for the LED packaging unit. The material of the film layer 14 can be, for example, a resin material. Optionally, the film layer 14 covers the entire top surface 101.

[0090] In some embodiments, the film layer 14 is made of a transparent material and is transparent as a whole for light to emit. When the LED packaging unit is in use, the film layer 14 can be retained or torn off. When the film layer 14 is torn off, light loss can be reduced.

[0091] In other embodiments, as Figure 16 and Figure 17 shown, the film layer 14 includes a light-transmitting area 141 and a light-shielding portion 140 made of an opaque material located outside the light-transmitting area 141. The position of the light-transmitting area 141 corresponds to the position of the LED chip 11 so that the light of the LED chip 11 can emit. Since the area of the light-transmitting area 141 is relatively smaller, the light-emitting angle of the LED chip 11 can be restricted through the light-transmitting area 141, so that the light emitted by the LED chip 11 from the film layer 14 is limited to a smaller area. When illuminating the light-transmitting area (such as characters or indicator lights) on the keycap, the light leaking from the gaps or other positions of the keycap can be reduced, and the backlight effect is better. In addition, through the shielding of the light-shielding portion 140, even if the isolation layer 17 or the annular retaining wall 16 is not provided, the interference of the reflected light color difference and the side color difference on the light color of the LED chip 11 can be reduced. Optionally, the light-shielding portion 140 is made of a black material. Optionally, the whole formed by the light-transmitting area 141 and the light-shielding portion 140 covers the entire top surface 101.

[0092] As a feasible example, as Figure 16 shown, the light-transmitting area 141 is a hole, and the light of the LED chip 11 directly penetrates through the hole, which can reduce the light output loss. As another feasible example, the light-transmitting area 141 is made of a transparent material to strengthen the protection of the LED chip 11. Optionally, when the light-transmitting area 141 is a hole, the top of the LED chip 11 and the top surface 101 are spaced apart to protect the LED chip 11 through the package 10.

[0093] In some embodiments, the LED packaging unit includes at least two LED chips 11, as Figure 18As shown, as a feasible example, each LED chip 11 is correspondingly provided with a light-transmitting area 141. The LED chips 11 emit light outward through their respective light-transmitting areas 141. It can be understood that the size of the light-transmitting area 141 limits the light-emitting area. Optionally, the light-transmitting area 141 is smaller than the length L of the LED chip 11. Further optionally, the light-transmitting area 141 is less than or equal to the width B of the LED chip 11. As another feasible example, three LED chips 11 share a light-transmitting area 141. As Figure 19 shown, the projection of the light-transmitting area 141 along the thickness direction of the LED chip packaging unit covers all the LED chips 11. It can completely surround all the LED chips 11, or a part of some of the LED chips 11 is located outside the light-transmitting area 141. The size of the light-transmitting area 141 can be set as needed. It can be understood that the arrangement of the LED chips 11 is not limited to the Figure 19 arrangement shown, and other arrangements can also be adopted, such as Figure 20 the arrangement shown.

[0094] It can be understood that the LED packaging unit can be provided with only one of the adhesive film layer 14, the annular retaining wall 16 and the isolation layer 17, or multiple ones can be provided at the same time. When the LED packaging unit is provided with both the adhesive film layer 14 with the light-shielding part 140 and the annular retaining wall 16 at the same time, the lateral light leakage of the LED packaging unit can be effectively reduced, and the light is concentrated to emit from the light-transmitting area 141. Optionally, both the light-shielding part 140 and the annular retaining wall 16 are made of black materials.

[0095] It can be understood that, as Figure 21 shown, the port component 131 is not limited to only including the above four pads. In some embodiments, the port component 131 further includes a detection port pad 1314 electrically connected to the control chip 12. The detection port pad 1314 is connected to the corresponding pad of the control chip 12 through a wire ( Figure 21 the conductive wire 132i in). The detection port pad 1314 can be connected to a switch circuit in series with a key switch for detecting the voltage level of the port pad. When the key is pressed, the key switch is triggered, resulting in a change in the voltage received by the control chip 12. In this way, the control chip 12 can identify whether the key is pressed, and the control chip 12 sends the information of whether the key is pressed to the main control board of the keyboard, and the function of key detection can be realized, making the LED packaging unit have more diverse functions.

[0096] In some embodiments, as Figure 21As shown, the LED packaging unit further includes a memory 120 that stores brightness parameters corresponding to the LED chip 11 of the LED packaging unit, so as to facilitate the normalization processing of the brightness of the LED chip 11. The relevant content of this part will be described below. The memory 120 can be built into the control chip 12 or can be an independent memory 120 electrically connected to the control chip 12. It is encapsulated in the package 10 together with the control chip 12 and the LED chip 11. At this time, it can be connected to the control chip 12 through the above-mentioned circuit.

[0097] Some embodiments of the present invention also disclose a method for manufacturing an LED packaging unit to manufacture the LED packaging unit of some of the above embodiments. For the sake of convenient description, it is hereinafter simply referred to as the first method for manufacturing an LED packaging unit.

[0098] As Figure 22 shown, the first method for manufacturing an LED packaging unit includes the following steps:

[0099] A1. Provide a substrate 15;

[0100] A2. Fix the LED chip 11 and the control chip 12 to the substrate 15, and make the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 face the substrate 15. In some embodiments, the substrate 15 is a copper carrier plate, and a double-sided adhesive 150 is provided on its surface. The LED chip 11 and the control chip 12 are fixed to the substrate 15 by means of chip bonding.

[0101] A3. Set an insulating material 151 on the substrate 15 so that the insulating material 151 covers the LED chip 11 and the control chip 12. In some embodiments, the insulating material 151 covering the LED chip 11 and the control chip 12 is formed on the substrate 15 by means of potting. It can be understood that the insulating material 151 is subsequently used to form the package 10, and the surface of the insulating material 151 connected to the substrate 15 is the bottom surface 100 of the package 10.

[0102] A4. Flatten the surface of the insulating material 151 facing away from the substrate 15 to form the package 10; the flattened surface is more conducive to the emission of light and can reduce the overall thickness. The flattening method can be, for example, grinding or plasma treatment, etc.

[0103] A5. Remove the substrate 15 to expose the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. In some embodiments, the viscosity of the double-sided adhesive is reduced by heating, thereby facilitating the removal of the substrate 15.

[0104] A6. Prepare circuit 132 and port pads on the exposed surface of the insulating material. The exposed surface is the surface of the insulating material that exposes the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. The circuit 132 and the port pads are located on the same layer. The circuit 132 and the port pads can be formed, for example, by evaporation or sputtering, or can be formed by printing photoresist, exposure, development, seed layer production, and electroplating thickening.

[0105] A7. Prepare an insulating layer 130 that fills the space between the exposed surface, the port pads, and the circuit 132. The insulating layer 130 can be formed, for example, by printing or laminating. Optionally, the material of the insulating layer 130 is an insulating resin.

[0106] It can be understood that the above steps can form, for example Figure 1 and Figure 2 the LED packaging unit of the embodiment shown, in which the port pads and the circuit 132 are located on the same layer.

[0107] In some embodiments, the insulating layer 130 formed in step A7 covers the surface of the circuit 132 but not the surface of the port pads, which can improve the insulation performance. In other embodiments, as Figure 22 shown, the insulating layer 130 formed in step A7 does not cover the surface of the port pads and the surface of the circuit 132 to further reduce the thickness. In specific implementation, a whole-surface insulating layer 130 can be first formed on the surfaces of the circuit 132 and the port pads, and then part of the insulating layer 130 can be removed as needed to expose the port pads or the circuit 132. As Figure 23 described, step A7 includes step A70 of first forming a whole-surface insulating layer 130 on the surfaces of the circuit 132 and the port pads and step A71 of removing part of the insulating layer 130 to expose the port pads and the circuit 132.

[0108] In some embodiments, the method for preparing the LED packaging unit further includes the following steps:

[0109] Set a film layer 14 on the flat surface of the insulating material 151. The material of the film layer 14 can be, for example, a resin material. The film layer 14 can protect the package 10 and its internal components. Optionally, this step is carried out simultaneously with the setting of the insulating layer 130 in step A7, as Figure 24 shown.

[0110] In some embodiments, the method for preparing the LED packaging unit further includes the following steps:

[0111] A8. Perform surface treatment on the port pads and electroplate nickel-palladium-gold to improve the solderability of the port pads and ensure the reliability and stability of the welding quality.

[0112] Some embodiments of the present invention also propose a method for preparing an LED packaging unit provided with an isolation layer 17 and an annular retaining wall 16. For the convenience of description, it is hereinafter simply referred to as the second method for preparing an LED packaging unit.

[0113] As Figure 25 shown, the second method for preparing an LED packaging unit includes the following steps:

[0114] B1. Provide a substrate 15;

[0115] B2. Fix the LED chip 11 and the control chip 12 to the substrate 15, and make the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12 face the substrate 15. In some embodiments, the substrate 15 is a copper carrier plate, and a double-sided adhesive 150 is provided on its surface. The LED chip 11 and the control chip 12 are fixed to the substrate 15 by means of chip mounting.

[0116] B3. Prepare an annular retaining wall 16 on the substrate 15, and the annular retaining wall 16 surrounds the outside of the LED chip 11. In some embodiments, an annular retaining wall 16 is formed outside the LED chip 11 by means of dispensing.

[0117] B4. Set an insulating material 151 on the substrate 15 so that the insulating material 151 covers the LED chip 11, the control chip 12, and the annular retaining wall 16. In some embodiments, an insulating material 151 covering the LED chip 11, the control chip 12, and the annular retaining wall 16 is formed on the substrate 15 by means of potting. It can be understood that the insulating material 151 is subsequently used to form the package 10, and the surface of the insulating material 151 connected to the substrate 15 is the bottom surface 100 of the package 10.

[0118] B5. Flatten the surface of the insulating material 151 facing away from the substrate 15 to form the package 10; the flattened surface is more conducive to light emission and can reduce the overall thickness. The flattening method can be, for example, grinding or plasma treatment, etc.

[0119] B6. Remove the substrate 15 to expose the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12. In some embodiments, the viscosity of the double-sided adhesive is reduced by heating, thereby facilitating the removal of the substrate 15.

[0120] B7. Prepare an isolation layer 17 on the exposed surface of the insulating material 151, and expose the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. The exposed surface is the surface of the insulating material 151 that exposes the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12. The isolation layer 17 can be formed, for example, by printing or spraying. In step B7, a whole layer of the isolation layer 17 can be first prepared on the exposed surface of the insulating material 151 by printing or spraying, and then the parts corresponding to the electrodes 110 of the LED chip 11 and the pads 121 of the control chip 12 can be removed by laser etching to expose them.

[0121] B8. Prepare a circuit 132 and a port pad on the surface of the isolation layer 17 facing away from the insulating material 151, and the circuit 132 and the port pad are on the same layer. The circuit 132 and the port pad can be formed, for example, by evaporation or sputtering, or can be formed by printing a photoresist, exposing, developing, making a seed layer, and electroplating and thickening.

[0122] B9. Prepare an insulating layer 130 to fill the space between the exposed surface, the port pad, and the circuit 132. The insulating layer 130 can be formed, for example, by laminating. Optionally, the material of the insulating layer 130 is resin.

[0123] It can be understood that the above steps can form, for example Figure 11 the LED packaging unit of the embodiment shown, and its port pad and circuit 132 are on the same layer.

[0124] It can be understood that when it is necessary to prepare an LED packaging unit without the annular retaining wall 16 as Figure 7 shown, step B3 can be omitted, and at the same time, the insulating material 151 in step B4 does not need to cover the annular retaining wall 16 either. When it is necessary to prepare an LED packaging unit without the isolation layer 17 as Figure 9 shown, step B7 can be omitted, and at the same time, in step B8, only the circuit 132 and the port pad need to be prepared on the exposed surface of the insulating material 151.

[0125] Some embodiments of the present invention also propose a method for preparing an LED packaging unit in which the port pad and the circuit are not on the same layer. For the sake of convenient expression, it is hereinafter simply referred to as the third method for preparing an LED packaging unit.

[0126] As Figure 26 shown, the preparation method of the third LED packaging unit includes the following steps:

[0127] C1. Provide a substrate 15;

[0128] C2. Fix the LED chip 11 and the control chip 12 to the substrate 15, and make the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12 face the substrate 15. In some embodiments, the substrate 15 is a copper carrier plate with double-sided adhesive on its surface, and the LED chip 11 and the control chip 12 are fixed to the substrate 15 by means of chip bonding.

[0129] C3. Set the insulating material 151 on the substrate 15 so that the insulating material 151 covers the LED chip 11 and the control chip 12. In some embodiments, the insulating material 151 covering the LED chip 11 and the control chip 12 is formed on the substrate 15 by means of potting. It can be understood that the insulating material 151 is subsequently used to form the package 10, and the surface of the insulating material 151 connected to the substrate 15 is the bottom surface 100 of the package 10.

[0130] C4. Flatten the surface of the insulating material 151 facing away from the substrate 15 to form the package 10; the flattened surface is more conducive to light emission and can reduce the overall thickness. The flattening method can be, for example, grinding or plasma treatment, etc.

[0131] C5. Remove the substrate 15 to expose the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12. In some embodiments, the viscosity of the double-sided adhesive is reduced by heating, thereby facilitating the removal of the substrate 15.

[0132] C6. Prepare the circuit 132 on the exposed surface of the insulating material. The exposed surface is the surface of the insulating material that exposes the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12 (i.e., the bottom surface 100). The circuit 132 can be formed, for example, by evaporation or sputtering, or can be formed by printing photoresist, exposure, development, seed layer fabrication, and electroplating thickening.

[0133] C7. Prepare the insulating layer 130 on the exposed surface and make the insulating layer 130 cover the surface of the circuit 132. In some embodiments, the insulating layer 130 is formed by means of laminating. The material of the insulating layer 130 can be, for example, resin.

[0134] C8. Prepare a through hole 1300 communicating with the circuit 132 on the surface of the insulating layer 130; the through hole 1300 can be formed, for example, by laser.

[0135] C9. Prepare a conductive layer on the surface of the insulating layer 130. The part of the conductive layer located inside the through hole 1300 forms the conductive connection 133, and the part located outside the insulating layer 130 forms the port pad. The conductive layer can be formed, for example, by sputtering or evaporation, or can be formed by printing photoresist, exposure, development, seed layer fabrication, and electroplating thickening.

[0136] Similar to the forming method of the first LED packaging unit, in some embodiments, the forming method of the third LED packaging unit includes the following steps:

[0137] A glue film layer 14 is provided on the flattened surface. The material of the glue film layer 14 can be resin, for example. The glue film layer 14 can protect the package 10 and the components therein. Optionally, this step is carried out simultaneously with step C7 and the preparation of the insulating layer 130. When the glue film layer 14 is formed simultaneously in step C7, the schematic diagram of the LED packaging unit in the subsequent steps is referred to Figure 27 .

[0138] In some embodiments, as Figure 28 shown, the preparation method of the third LED packaging unit further includes the following steps:

[0139] C10. Perform surface treatment on the port pad and electroplate nickel-palladium-gold 134 to improve the solderability of the port pad and ensure the reliability and stability of the welding quality.

[0140] Some embodiments of the present invention also propose an LED packaging unit preparation method for preparing an LED packaging unit provided with an isolation layer 17 and an annular retaining wall 16 and the port pad and the circuit are not on the same layer. For the sake of convenient description, it is hereinafter simply referred to as the fourth LED packaging unit preparation method.

[0141] As Figure 29 shown, the preparation method of the fourth LED packaging unit includes the following steps:

[0142] D1. Provide a substrate 15;

[0143] D2. Fix the LED chip 11 and the control chip 12 to the substrate 15, and make the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12 face the substrate 15. In some embodiments, the substrate 15 is a copper carrier plate with double-sided adhesive on its surface, and the LED chip 11 and the control chip 12 are fixed to the substrate 15 by means of chip mounting.

[0144] D3. Prepare an annular retaining wall 16 on the substrate 15, and the annular retaining wall 16 surrounds the outside of the LED chip 11. In some embodiments, the annular retaining wall 16 can be formed by dispensing glue.

[0145] D4. An insulating material 151 is provided on the substrate 15 such that the insulating material 151 covers the LED chip 11, the control chip 12, and the annular retaining wall 16. In some embodiments, the insulating material 151 that covers the LED chip 11, the control chip 12, and the annular retaining wall 16 is formed on the substrate 15 by potting. It can be understood that the insulating material 151 is subsequently used to form the package 10, and the surface of the insulating material 151 connected to the substrate 15 is the bottom surface 100 of the package 10.

[0146] D5. The surface of the insulating material 151 facing away from the substrate 15 is flattened to form the package 10; the flattened surface is more conducive to light emission and can reduce the overall thickness. The flattening method can be, for example, grinding or plasma treatment, etc.

[0147] D6. The substrate 15 is removed to expose the electrode 110 of the LED chip 11 and the pad of the control chip 12. In some embodiments, the viscosity of the double-sided tape is reduced by heating, thereby facilitating the removal of the substrate 15.

[0148] D7. An isolation layer 17 is prepared on the exposed surface of the insulating material 151, and the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12 are exposed. The exposed surface is the surface of the insulating material 151 that exposes the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12 (i.e., the bottom surface 100). The isolation layer 17 can be formed, for example, by printing or spraying. In step D7, a whole layer of the isolation layer 17 can be first prepared on the exposed surface of the insulating material 151 by printing or spraying, and then the portions corresponding to the electrode 110 of the LED chip 11 and the pad 121 of the control chip 12 are removed by laser etching to expose them.

[0149] D8. A circuit 132 is prepared on the surface of the isolation layer 17 facing away from the insulating material 151. The circuit 132 can be formed, for example, by evaporation or sputtering, etc., or can be formed by printing a photoresist, exposure, development, seed layer fabrication, and electroplating thickening.

[0150] D9. An insulating layer 130 is provided on the surface of the isolation layer 17 facing away from the insulating material 151, and the insulating layer 130 covers the surface of the circuit 132. In some embodiments, the insulating layer 130 is formed by laminating. The material of the insulating layer 130 can be, for example, resin.

[0151] D10. A through hole 1300 communicating with the circuit 132 is prepared on the surface of the insulating layer 130; the through hole 1300 can be formed, for example, by laser.

[0152] D11. A conductive layer is prepared on the surface of the insulating layer 130. The part of the conductive layer located inside the through hole 1300 forms a conductive connection member 133, and the part located outside the insulating layer 130 forms a port pad. The conductive layer can be formed, for example, by sputtering or evaporation, or can be formed by printing photoresist, exposure, development, seed layer fabrication, and electroplating thickening.

[0153] It can be understood that the above steps can form, for example Figure 12 the LED packaging unit of the embodiment shown, whose port pad and circuit 132 are located on different layers.

[0154] It can be understood that when an LED packaging unit without the annular retaining wall 16 as Figure 8 shown needs to be prepared, step D3 can be omitted, and at the same time, the insulating material 151 in step D4 does not need to cover the annular retaining wall 16 either. When an LED packaging unit without the isolation layer 17 as Figure 10 shown needs to be prepared, step D7 can be omitted, and at the same time, in step D8, a circuit 132 is prepared on the exposed surface of the insulating material 151, and in step D9, an insulating layer 130 is prepared on the exposed surface of the insulating material 151.

[0155] The above-mentioned LED packaging unit can be used in a keyboard backlight circuit to achieve the backlight effect of the keyboard. Next, this specification will describe the keyboard backlight circuit.

[0156] In some embodiments of the present invention, as Figure 30 shown, the keyboard backlight circuit includes a power supply line 20, a ground line 21, an LED packaging unit 1, and a main control board 22. For convenience, the LED packaging unit 1 is shown in the circuit by a simplified schematic diagram.

[0157] The power supply line 20 is used to provide a positive voltage, which supplies power to electronic components such as the LED chip 11 and the control chip 12, enabling the keyboard backlight circuit to work properly.

[0158] The LED packaging unit 1 can be the LED packaging unit 1 in the above-mentioned embodiments, and the specific description of this LED packaging unit 1 can be referred to above. It can be understood that although the LED packaging unit 1 in the keyboard backlight circuit is introduced herein by taking the above-mentioned LED packaging unit 1 as an example, the LED packaging unit 1 in the keyboard backlight circuit can also be other LED packaging units. For example, it can include a substrate.

[0159] Specifically, the LED packaging unit 1 includes an LED chip 11, a control chip 12, and a port component 131 packaged together. The port component 131 includes a power supply port pad 1310 connected to the power supply line 20, a ground port pad 1313 connected to the ground line 21, and a first data port pad 1311 for signal transmission. The power supply port pad 1310 is electrically connected to the control chip 12.

[0160] The main control board 22 is electrically connected to the first data port pad 1311 of at least one LED packaging unit 1. Specifically, the keyboard backlight circuit further includes a signal line 26 connected between the main control board 22 and the first data port pad 1311. The main control board 22 can emit a control signal, and the control signal includes data information corresponding to driving the LED chip 11 to emit light (hereinafter referred to as light-emitting information), such as one or more of the brightness of light emission, the time of light emission, and the color of light emission, etc. The main control board 22 transmits the control signal to the control chip 12 through the first data port pad 1311, and the control chip 12 controls the LED chip 11 to emit light according to the control signal input from the first data port pad 1311, and it can generate an electrical signal for controlling the LED chip 11 to emit light corresponding to the control signal.

[0161] The LED chip 11 of each LED packaging unit 1 is controlled to emit light through the control signal of the main control board 22, and each LED packaging unit 1 can be independently driven to emit light, thereby generating a more abundant lighting effect.

[0162] It can be understood that the keys of the keyboard include keycaps, and at least one LED packaging unit 1 is correspondingly arranged for each keycap so that the keycap can be illuminated by the LED packaging unit 1.

[0163] In some embodiments, the main control board 22 is connected to the first data port pad 1311 of each LED packaging unit 1 to input a corresponding control signal to each LED packaging unit 1.

[0164] In some embodiments, such as Figure 30As shown, multiple LED packaging units 1 are connected in series. The main control board 22 is connected to the first data port pad 1311 of the first LED packaging unit 1 among the multiple LED packaging units 1 through a signal line 26, sends a control signal thereto, and transmits the control signal backward through the link formed by the LED packaging units 1. In this embodiment, the LED packaging unit 1 further includes a second data port pad 1312, and the second data port pad 1312 is used to be connected to the first data port pad 1311 of other LED packaging units 1 to send the control signal received by the LED packaging unit 1 to other LED packaging units 1. Specifically, in the series direction (i.e., the transmission direction of the control signal), the second data port pad 1312 of the previous LED packaging unit 1 is connected to the first data port pad 1311 of the next LED packaging unit 1 to send the control signal received by the previous LED packaging unit 1 to the next LED packaging unit 1, and the first data port pad 1311 of the foremost LED packaging unit 1 is connected to the main control board 22. It can be understood that the LED packaging unit 1 that receives the control signal first is more forward than the LED packaging unit 1 that receives the control signal later.

[0165] Multiple serially connected LED packaging units 1 form a link. After the main control board 22 sends a control signal to the first LED packaging unit 1, the control signal is sequentially transmitted to the subsequent LED packaging units 1 through the control chips 12 of each LED packaging unit 1. The control signal includes the address information of the LED chip 11 and the light-emitting information corresponding to the address information. The LED packaging unit 1 can judge and identify the light-emitting information corresponding to the LED chip 11 included therein according to the address information, control the corresponding LED chip 11 to emit light according to the light-emitting information, and at the same time, the control chip 12 will continue to transmit the control signal backward so that the subsequent LED chips 11 can receive the control signal and emit light according to the light-emitting information corresponding to their own addresses in the control signal.

[0166] By the way of connecting multiple LED packaging units 1 in series, the number of ports of the main control board 22 used to be connected to the first data port pads 1311 can be saved. In some embodiments, all the LED packaging units 1 on the keyboard are connected in series to form only one link. At this time, only one signal port 382 needs to be prepared and connected to the LED packaging unit 1. In other embodiments, the multiple LED packaging units 1 on the keyboard are divided into multiple links, and the LED packaging units 1 in each link are connected in series. At this time, only the ports corresponding to the number of links need to be prepared.

[0167] In some embodiments, the LED packaging unit 1 includes LED chips 11 of at least two different emitting colors. For example, it includes three LED chips 11 that emit red, green, and blue light respectively. The color information in the control signal can also be implemented through the address information of the LED chips 11, and different color LED chips 11 are controlled to emit light through the address information.

[0168] In some embodiments, each keycap corresponds to an LED packaging unit 1, and the backlight of the keycap is realized through an LED packaging unit 1.

[0169] In other embodiments, each keycap is correspondingly provided with at least two LED packaging units 1, and the backlight of the keycap is realized through the at least two LED packaging units 1, which is beneficial to improving the brightness and uniformity of the backlight. Optionally, the number of LED packaging units 1 corresponding to each keycap is the same.

[0170] The LED packaging units 1 corresponding to the same keycap belong to the same LED packaging unit group, as Figure 31 and Figure 32 shown, Figure 31 In the figure, two groups of LED packaging unit groups are schematically shown by dashed boxes, and each LED packaging unit group includes three LED packaging units 1. Figure 32 schematically shows Figure 31 a schematic diagram of a group of LED packaging unit groups in the figure. In some embodiments, referring to Figure 31 and Figure 32 , the first data port pads 1311 of the LED packaging units 1 belonging to the same LED packaging unit group are connected, the second data port pads 1312 of the LED packaging units 1 belonging to the same LED packaging unit group are connected, and the first data port pads 1311 of the LED packaging units 1 of the subsequent LED packaging unit group are connected to the second data port pads 1312 of the LED packaging units 1 of the previous LED packaging unit group, realizing the series connection of each LED packaging unit group.

[0171] It can be understood that Figure 30 the embodiments shown can be regarded as instances when each LED packaging unit group only includes one LED packaging unit 1. When each LED packaging unit group only includes one LED packaging unit 1, when a certain LED packaging unit 1 fails, it will cause the control signal not to be transmitted backward, resulting in the backlight failure of the keycap where the faulty LED packaging unit 1 is located and the subsequent keycaps. When each LED packaging unit group includes two or more LED packaging units 1, as Figure 31 and Figure 32As shown, even if a certain LED packaging unit 1 in the LED packaging unit group fails, the control signal can still be transmitted backward through other LED packaging units 1 in the LED packaging unit group, ensuring the reliability of the keyboard backlight.

[0172] In some embodiments, the control chip 12 of the LED packaging unit 1 can detect the state of itself and / or the LED chip 11 included in the LED packaging unit 1, and send it to the main control board 22, so that the main control board 22 can grasp the working state of each LED packaging unit 1 in real time and discover the fault information immediately. When the LED packaging units in each group are connected in series, the fault information of the LED packaging unit 1 in the subsequent LED packaging unit group is sent to the second data port pad 1312 of the LED packaging unit 1 in the previous LED packaging unit group through its first data port pad 1311, and is transmitted forward like this until the first LED packaging unit group sends the signal to the main control board 22 through the first data port pad 1311 of its LED packaging unit 1.

[0173] Optionally, under normal circumstances (that is, when the LED packaging units 1 in the LED packaging unit group do not fail), the light-emitting information corresponding to each LED packaging unit 1 in the same LED packaging unit group contained in the control signal is the same. For example, each LED packaging unit 1 emits light of the same color, and the light-emitting duration and brightness are the same.

[0174] Optionally, when a certain LED packaging unit 1 fails, the brightness of other LED packaging units 1 in the same group as the LED packaging unit 1 is increased. For example, the brightness information corresponding to the LED chip 11 of the other LED packaging unit 1 in the control signal can be increased to increase the brightness of the other LED packaging unit 1, or the brightness information corresponding to the LED chip 11 of the other LED packaging unit 1 in the control signal can be kept unchanged, and a higher duty cycle electrical signal is generated by the control chip 12 of the other LED packaging unit 1 to increase the brightness of the LED packaging unit 1. Since the LED packaging unit 1 cannot emit light normally when it fails, the backlight of the keycap will become dim. By increasing the brightness of the other LED packaging units 1, the backlight brightness of this keycap can be made more consistent with that of other keycaps.

[0175] In some embodiments, the power supply line 20, the ground line 21, and all the LED packaging units 1 are located on the same surface of the backlight circuit board. In this way, the circuit can be formed on the circuit board surface by silver paste printing, and then the corresponding LED packaging unit 1 can be installed at the corresponding position on the circuit board. It can also be designed through the FPC of the single-sided board, which is beneficial to greatly reducing the cost. Moreover, the overall thickness of the circuit board is smaller, which is beneficial to realizing the thin and light of the electronic device. As Figure 33As shown, exemplarily, the LED packaging units 1 are arranged in multiple rows (three rows in the figure), each row includes a plurality of LED packaging units 1. The transmission direction of the control signals of the LED packaging units 1 in the same row is the same, and the transmission directions of the control signals of adjacent rows are opposite. Figure 33 In Figure 33 , the transmission direction of the control signals of the LED packaging units 1 in the bottom row is from left to right, the transmission direction of the control signals of the LED packaging units 1 in the middle row is from right to left, and the transmission direction of the control signals of the LED packaging units 1 at the top is from left to right. In this way, among the two adjacent LED packaging units 1 at the ends of adjacent rows, the first data port pad 1311 of one later LED packaging unit 1 (such as 1a in Figure 33 and the second data port pad 1312 of the other previous LED packaging unit 1 (such as 1b in Figure 33 are located on the same side, which can be conveniently connected by the circuit 24, facilitating wiring. All the LED packaging units 1 can be transmitted control signals through the input terminal of the same control signal. Further, a ground wire (sub-ground wire 210) and a power supply wire (sub-power supply wire 200) are respectively provided on both sides of each row of LED packaging units, so as to be connected to the LED packaging units 1 in this row. Among the adjacent three rows of LED packaging units 1, the adjacent two rows of LED packaging units 1 share the same ground wire 21 (sub-ground wire 210) located between them, and the other adjacent two rows of LED packaging units 1 share the same power supply wire 20 (sub-power supply wire 200) located between them, so as to make the circuit structure more compact. During preparation, as Figure 34 shown, the circuit can be first formed on the same side of the circuit board by silver paste printing or other means. The circuit is formed with pads 25 for connecting to the port pads of each LED packaging unit 1, and then the corresponding LED packaging units 1 can be connected to the pads 25 to form the Figure 33 shown circuit.

[0176] In some embodiments, as Figure 35As shown, the LED packaging unit 1 further includes a detection port pad 1314 connected to the switch circuit 23. The switch circuit 23 is provided with a key switch 230. The detection port pad 1314 is used to detect whether the key switch 230 is pressed. When the key switch 230 switches between the open and closed states, the detection port pad 1314 can detect the voltage change, thereby identifying the state of the key switch 230. The control chip 12 can send the state of the key switch 230 to the main control board 22 through the first data port pad 1311, enabling the main control board 22 to identify which key is pressed, and thus realizing the function of key detection. In this way, the keyboard backlight circuit can simultaneously realize the function of key detection, making the function of the keyboard backlight circuit more diverse, and there is no need to set components such as diodes to realize the anti-ghosting function, which is beneficial to simplifying the circuit, reducing the circuit board of the keyboard and the overall thickness of the keyboard, and reducing the complexity of the circuit. When the LED packaging unit groups are connected in series, the key detection information of the LED packaging unit 1 in the subsequent LED packaging unit group is sent to the second data port pad 1312 of the LED packaging unit 1 in the previous LED packaging unit group through its first data port pad 1311, and is transmitted forward like this until the first LED packaging unit group sends the signal to the main control board 22 through the first data port pad 1311 of its LED packaging unit 1.

[0177] One end of the switch circuit 23 is connected to the detection port pad 1314, and the other end is connected to the power supply line 20 or the ground line 21.

[0178] Some embodiments of the present invention also propose a key circuit board, which includes the LED packaging unit described above or the keyboard backlight circuit described above.

[0179] In some embodiments, as Figure 36 shown, the key circuit board includes a backlight circuit board 38 and a keyboard backlight circuit.

[0180] The keyboard backlight circuit is arranged on the same surface of the backlight circuit board 38. It includes a power supply line 20, a ground line 21, a signal line 26, and multiple rows of LED packaging units. Each row of LED packaging units includes multiple LED packaging units 1. The signal line 26 is used to connect to the main control board 22 to input a control signal. The relevant structure of the keyboard backlight circuit can refer to the above description.

[0181] The specific structure of the LED packaging unit 1 can be referred to the above text. Of course, it can also be other LED packaging units. The LED packaging unit 1 includes an LED chip 11, a control chip 12, and a port component 131 packaged together. The port component 131 is electrically connected to the control chip 12 and includes a power supply port pad 1310 connected to the power supply line 20, a ground port pad 1313 connected to the ground line 21, and a first data port pad 1311 and a second data port pad 1312 for signal transmission.

[0182] The LED packaging units 1 are connected in series. In the series direction, the foremost LED packaging unit 1 is connected to the signal line 26 through its first data port pad 1311. Among two adjacent LED packaging units 1, the second data port pad 1312 of the preceding LED packaging unit 1 is electrically connected to the first data port pad 1311 of the following LED packaging unit 1. In this way, signals can be transmitted to the LED packaging units 1 on the link in sequence.

[0183] Since the LED packaging units 1 are connected in series, the structure of the keyboard backlight circuit can be simplified, enabling a single signal line 26 to input control signals to all the LED packaging units 1. Moreover, the keyboard backlight circuit can be arranged on the same surface of the backlight circuit board 38, making the overall thickness of the key circuit board smaller, more convenient to manufacture, and with lower costs.

[0184] In some embodiments, the power supply line 20 includes a plurality of sub - power supply lines 200 arranged at intervals, and the ground line 210 includes a plurality of sub - ground lines 21 arranged at intervals. The sub - power supply lines 200 and the sub - ground lines 210 are arranged in an interleaved manner, that is, a sub - ground line 210 is arranged between two adjacent sub - power supply lines 200, or a sub - power supply line 200 is arranged between two adjacent sub - ground lines 210. A row of LED packaging units is provided between adjacent sub - power supply lines 200 and sub - ground lines 210. The power supply port pad 1310 and the ground port pad 1313 of the LED packaging units in this row are respectively connected to the adjacent sub - power supply line 200 and sub - ground line 210. Optionally, the power supply port pad 1310 is closer to the sub - power supply line 200 than the ground port pad 1313 to shorten the lengths of the lines connecting the power supply port pad 1310 and the sub - power supply line 200, and the lines connecting the ground port pad 1313 and the sub - ground line 210. Optionally, the power supply port pad 1310 and the ground port pad 1313 are respectively located at the diagonals of the LED packaging unit 1.

[0185] By arranging the sub - power supply lines 200 and the sub - ground lines 210 on both sides of a row of LED packaging units respectively, two adjacent rows of LED packaging units can share a sub - ground line 210 or a sub - power supply line 200, which can make the lines on the key circuit board more compact and make full use of the space thereon.

[0186] In some embodiments, the keyboard backlight circuit further includes a power supply port 380, a ground port 381, and a signal port 382 provided on the backlight circuit board 38. The power supply port 380, the ground port 381, and the signal port 382 can be connected to the main control board 22. The power supply line 20 includes a peripheral power supply line 201 connected between the power supply port 380 and the sub-power supply line 200. The ground line 21 includes a peripheral ground line 211 connected between the sub-ground line 210 and the ground port pad 1313. The signal line 26 is connected between the signal port 382 and the first data port pad 1311 of the foremost LED packaging unit 1. The peripheral power supply line 201 and the peripheral ground line 211 are respectively located on both sides of the arrangement direction of the LED packaging units 1 in the same row.

[0187] In some embodiments, the power supply port 380, the ground port 381, and the signal port 382 are adjacently arranged, and the signal port 382 is located between the power supply port 380 and the ground port 381. The three ports are closely arranged for easy wiring.

[0188] The key circuit board is also integrated with the function of key detection to detect which key is pressed during use.

[0189] In some embodiments, as Figure 37 shown, the key circuit board includes a first circuit board 30 and a second circuit board 31 arranged at an upper and lower interval, and a spacer layer 32 connected between the first circuit board 30 and the second circuit board 31. The first circuit board 30 is located above the second circuit board 31.

[0190] A key detection circuit is provided on the first circuit board 30. The key detection circuit includes a key switch 230. The key switch 230 includes a first contact 2300 located on the first circuit board 30 and a second contact 2301 located on the second circuit board 31. The two contacts are arranged at a relative interval. The spacer layer 32 is provided with a cavity 320 for the first contact 2300 and the second contact 2301 to be exposed. The structure of the key detection circuit can adopt the structure of the key detection circuit in the prior art. When the two contacts of the key switch 230 are in contact and conducting, it can be detected that the key switch 230 is pressed.

[0191] The backlight circuit board 38 is located on the side of the second circuit board 31 away from the first circuit board 30. The projections of the LED packaging unit 1 and the key switch 230 in the thickness direction of the key circuit board are staggeredly arranged (that is, there is no overlapping part in their projections), and the LED packaging unit 1 at least extends into the second circuit board 31. In this way, the thickness W of the key circuit board can be reduced, making the overall structure more compact.

[0192] In this embodiment, the key detection circuit and the keyboard backlight circuit are respectively controlled by two functional modules, and the functions are independent.

[0193] In some embodiments, the LED packaging unit 1 extends into the spacer layer 32 and is covered by the first circuit board 30, which can protect the LED packaging unit 1. At least the part of the first circuit board 30 opposite to the LED packaging unit 1 is made of a transparent material so that the light of the LED packaging unit 1 can emit.

[0194] In some embodiments, the LED packaging unit 1 extends beyond the first circuit board 30 to improve the light efficiency and make the backlight brightness brighter.

[0195] Optionally, the button circuit board further includes a metal plate 36 and a solder mask layer 37. The metal plate 36 is connected to the second circuit board 31. Specifically, it is connected to the side of the second circuit board 31 facing away from the first circuit board 30. The metal plate 36 can improve the overall structural strength and can be, for example, an iron plate. The solder mask layer 37 is connected between the metal plate 36 and the backlight circuit board 38. Optionally, the metal plate 36 is bonded to the second circuit board 31 and the solder mask layer 37 through an adhesive layer 39. The spacer layer 32, the second circuit board 31, the metal plate 36, and the solder mask layer 37 are jointly provided with a relief hole 300, and the LED packaging unit 1 is located in the relief hole 300. The first circuit board 30 covers the surface of the LED packaging unit 1, which can protect the LED packaging unit 1. At least the area of the first circuit board 30 corresponding to the LED packaging unit 1 is made of a transparent material for the light to transmit through.

[0196] The thickness W of the button circuit board of this structure is relatively small and can be less than 500 μm.

[0197] In some other embodiments, as Figure 35 shown, the port component further includes a detection port pad 1314. The detection port pad 1314 is connected to the switch circuit 23 and is used to detect whether the button switch 230 is pressed. It can be understood that the control chip 12 of the LED packaging unit 1 can send the state of the button switch 230 to the main control board 22 through the first data port pad 1311 to realize the function of button detection.

[0198] When the port component further includes a detection port pad 1314, the button circuit board can adopt the following structure: as Figure 38 shown, the button circuit board includes a first circuit board 30 and a spacer layer 32 connected between the first circuit board 30 and the backlight circuit board 38. The switch circuit 23 includes a button switch 230. The button switch 230 includes a first contact 2300 located on the first circuit board 30 and a second contact 2301 located on the backlight circuit board 38. The first contact 2300 and the second contact 2301 are relatively spaced apart.

[0199] The projection of the LED packaging unit 1 and the key switch 230 in the thickness direction of the key circuit board is offset (i.e., there is no overlapping part between their projections), and the LED packaging unit 1 extends beyond the first circuit board 30, as Figure 38 shown. Avoidance holes 300 for the exposure of the LED packaging unit 1 are provided on the spacer layer 32 and the first circuit board 30, so that the LED packaging unit 1 can be exposed. In this way, the thickness W of the key circuit board is smaller, and the light extraction efficiency can be improved, increasing the brightness of the keycap 35. It can be understood that, compared with the Figure 37 shown key circuit board, the thickness of the key circuit board in this embodiment can be made smaller.

[0200] In this embodiment, each key can control the keyboard backlight and key detection distributively through the same digital chip, which is beneficial to reducing costs.

[0201] Since the LED packaging unit 1 under each key can detect the state of the key switch 230, the structure of the key detection circuit can be simplified, and there is no need to set up structures such as diodes to prevent ghost keys. In some embodiments, as Figures 39 to 41 shown, Figures 39 to 41 schematically shows the circuit diagrams on the first circuit board 30, the spacer layer 32 and the backlight circuit board 38 in sequence. The backlight circuit board 38 includes a third contact 383 electrically connected to the power supply line 20. The first circuit board 30 is provided with a fourth contact 301 corresponding to the position of the third contact 383. The third contact 383 and the fourth contact 301 are electrically connected, for example, by conductive glue. The fourth contact 301 is electrically connected to the first contact 2300. In addition to the cavity 320 for accommodating the first contact 2300 and the second contact 2301, the spacer layer 32 is also provided with a hollow hole 321 corresponding to the positions of the LED packaging unit 1, the third contact 383 and the fourth contact 301.

[0202] It can be understood that the third contact 383 can also be electrically connected to the ground wire 20.

[0203] Optionally, as Figure 38 shown, the key circuit board further includes a metal plate 36 connected to the bottom of the backlight circuit board 38 to improve the overall structural strength. The metal plate 36 can be, for example, an iron plate. Since the keyboard backlight circuit and the second contact 2301 are located on the same circuit board, the thickness of the above-mentioned key circuit board can be made smaller, which is beneficial to making the keyboard and the electronic device using the keyboard thinner and lighter. The thickness W of the key circuit board with this structure can be made less than 400 μm.

[0204] Figure 42It is a schematic structural diagram of a key circuit board of a keyboard known to the inventor. From top to bottom, it is successively provided with an upper layer 40, a middle layer 41, a lower layer 42, an adhesive layer 43, an iron plate 44, an adhesive layer 45, a surface layer 46, a mylar layer 47, a solder mask layer 48, and a bottom layer 49. An LED 50 is arranged on the bottom layer 49. Compared with the key circuit board of Figure 37 and Figure 38 shown, the key circuit board of this structure has relatively more layers and a more complex process, resulting in a greater thickness W (about 700 μm in thickness) and a higher manufacturing cost.

[0205] As Figure 37 and Figure 38 shown, a reset member 33 and a keycap 35 are correspondingly arranged above the key switch 230. The reset member 33 can be made of an elastic material such as rubber or silicone. When pressing the keycap 35, the keycap 35 presses down the reset member 33 and the key switch 230, so that the first contact 2300 and the second contact 2301 are in contact, and the switch circuit 23 is turned on. When releasing the keycap 35, the keycap 35 resets under the elastic force of the reset member 33, and the switch circuit 23 is disconnected. At least part of the keycap 35 is made of a transparent material, so that the light of the LED packaging unit 1 can penetrate from the transparent material to achieve a backlight effect. In some embodiments, a light-transmitting area 350 made of a transparent material is arranged on the keycap 35. The light-transmitting area 350 can be, for example, consistent with the symbols (such as letters or graphics) marked on the keycap 35, so that the light of the LED packaging unit 1 can illuminate the symbols of the keycap 35, making it more beautiful.

[0206] Optionally, the first circuit board 30, the second circuit board 31, and the backlight circuit board 38 are all thin-film circuits, and the circuits can be formed by silver paste printing or FPC.

[0207] Some embodiments of the present invention also propose a keyboard, which includes the LED packaging unit described above, or the keyboard backlight circuit described above, or the key circuit board described above.

[0208] It can be understood that when the LED packaging unit 1 is installed on the keyboard, its brightness needs to be calibrated to make the backlight brightness of each keycap more consistent. Next, the content related to the backlight brightness calibration of the keyboard will be introduced.

[0209] It should be noted that in the following, the backlight brightness calibration of the keyboard will be described by taking the LED packaging unit 1 described above as an example. However, it is not limited to the LED packaging unit 1 of the above-described embodiments, and it can also be applied to other LED packaging units 1.

[0210] The LED packaging unit 1 includes an LED chip 11, a control chip 12, a memory 120, and a port component 131.

[0211] The control chip 12 is electrically connected to the LED chip 11 and is used to generate an electrical signal for controlling the LED chip 11 to emit light.

[0212] The memory 120 stores the brightness parameters of the LED chip 11. The brightness parameters are the actual brightness information when the LED chip 11 emits light. When the LED chip 11 is produced, the parameter information of the LED chip 11 itself can be measured by a spectrometer or other equipment.

[0213] The port component 131 includes a first data port pad 1311 electrically connected to the control chip 12. The first data port pad 1311 is used to receive a control signal. The light-emitting information in the control signal includes the light-emitting brightness, which is the brightness required when the LED chip 11 emits light. The control chip 12 can perform normalization processing on the brightness of the LED chip 11 according to the brightness parameters, so that the actual light-emitting brightness of the LED chip 11 approaches the light-emitting brightness in the light-emitting information. In this way, the actual light-emitting brightness of the LED chip 11 can be closer to the required light-emitting brightness, or even consistent with the required light-emitting brightness. In this way, the actual light-emitting brightness of the LED chip is closer to the required light-emitting brightness. When the LED packaging unit is applied to a keyboard, the light-emitting brightness of each keycap can be closer, which is beneficial to ensuring the consistency of the backlight brightness.

[0214] It can be understood that the brightness parameters of each LED chip 11 are different. For example, under the same driving voltage, the actual brightness of each LED chip 11 will be different. When these different LED chips 11 are applied to a keyboard, it will affect the consistency of the keyboard backlight brightness. During the normalization process, the light-emitting brightness of the LED chip 11 is controlled according to the brightness parameter of each LED chip 11 itself and the required light-emitting brightness. For example, when the brightness parameter of the LED chip 11 itself is too high, the light-emitting brightness of the LED chip 11 can be lowered to make it close to or consistent with the required light-emitting brightness.

[0215] In some embodiments, the brightness parameter includes the actual brightness value corresponding to the LED chip 11 under different driving voltages. For example, the brightness parameter is a voltage-brightness curve. Of course, the voltage-brightness curve is stored in the memory 120 in the form of data.

[0216] Optionally, the normalization process includes adjusting the voltage of the electrical signal. For example, during the normalization process, first, according to the light-emitting brightness requirement of the light-emitting information, the driving voltage corresponding to the light-emitting brightness is obtained from the brightness parameters, and the driving voltage is used as the voltage of the electrical signal for driving the LED chip 11 to emit light. By adjusting the voltage, the actual light-emitting brightness of the LED chip 11 is made close to or consistent with the required light-emitting brightness.

[0217] Optionally, the normalization process includes adjusting the duty cycle of the electrical signal. The electrical signal is a pulse signal. Within a unit time, the larger the duty cycle of the electrical signal, the longer the actual light-emitting time of the LED chip 11, and the higher the brightness perceived by the human eye. Conversely, the smaller the duty cycle of the electrical signal, the shorter the actual light-emitting time of the LED chip 11, and the lower the brightness perceived by the human eye. By adjusting the duty cycle of the electrical signal, the brightness of the LED chip 11 can be changed. For example, when the LED chip 11 emits light at a constant high level (duty cycle 100%) under a certain voltage and the emitted brightness is N, then when it needs to emit M% of the brightness of N, only the duty cycle of the electrical signal needs to be adjusted to M%. Optionally, the voltage-brightness curve of the LED chip 11 is the relationship curve between the brightness and voltage when the driving voltage signal has a duty cycle of 100%, and the voltage of the power supply line 20 of the keyboard backlight circuit remains constant all the time, that is, the voltage of the electrical signal driving the LED chip 11 to emit light is always the same, so as to simplify the circuit. At this time, the emitted brightness contained in the emission information is generally less than or equal to the actual brightness of the LED chip 11 under the voltage of the power supply line 20, so as to achieve the actual brightness by reducing the duty cycle. During the normalization process, first obtain the actual brightness value of the LED chip 11 according to the voltage of the electrical signal, and then obtain the duty cycle of the electrical signal based on the required emitted brightness in the emission information and the actual brightness value. When the voltage-brightness curve of the LED chip 11 is the relationship curve between the brightness and voltage when the driving voltage signal has a duty cycle of 100%, the ratio of the calculated emitted brightness to the obtained actual brightness value can be used as the duty cycle of the electrical signal, which can simplify the calculation. For example, the voltage of the power supply line supplying power to the LED chip 11 is 3V (the voltage of the power supply line is the voltage of the electrical signal), the actual brightness value corresponding to the brightness parameter and the driving voltage of 3V is 100, and the required emitted brightness in the emission information is 90, then the duty cycle of the electrical signal is 90%.

[0218] In other embodiments, the voltage-brightness curve of the LED chip 11 can also be the relationship curve between the brightness and voltage when the driving voltage signal has a duty cycle less than 100%; at this time, the emitted brightness contained in the emission information can be less than, equal to, or greater than the actual brightness of the LED chip 11 under the voltage of the power supply line 20, and the brightness requirement can be met by increasing or decreasing the duty cycle.

[0219] In some embodiments, the brightness parameter includes the light-emitting duration of the LED chip 11 and the corresponding brightness data, such as the aging curve of the LED. It can be understood that the aging curve is also stored in the memory 120 in the form of data. During the use of the LED chip 11, as the light-emitting time increases, its brightness will gradually decay, which will also result in different light-emitting brightnesses of different LED chips 11, thereby affecting the uniformity of the backlight brightness. By storing the light-emitting duration of the LED chip 11 and the corresponding brightness data in the memory 120, the current theoretically actual brightness of the LED chip 11 can be obtained according to its usage duration, and then its actual light-emitting brightness can be adjusted to be closer to the required light-emitting brightness by adjusting the duty cycle. Specifically, during the normalization process, first obtain the actual brightness value of the LED chip 11 according to the actual light-emitting duration of the LED chip 11 and the voltage of the electrical signal, and then obtain the duty cycle of the electrical signal of the LED chip 11 according to the actual brightness value and the required light-emitting brightness. It can be understood that the actual light-emitting duration of the LED chip 11 is recorded and stored in the memory 120 in real time during its light-emitting process.

[0220] In some embodiments, the brightness parameter includes a curve in three dimensions of voltage-aging-brightness. The control chip 12 performs normalization processing on the brightness according to this curve, which can make the actual light-emitting brightness of the LED chip 11 closer to the required light-emitting brightness of the light-emitting information. During the normalization process, the control chip 12 first obtains the actual brightness value according to the voltage of the electrical signal and the actual light-emitting duration of the LED chip 11, and then obtains the duty cycle of the electrical signal of the LED chip 11 according to the actual brightness value and the required light-emitting brightness.

[0221] During the normalization process, the voltage or the duty cycle of the electrical signal can be adjusted separately, or both can be adjusted simultaneously.

[0222] In some embodiments, the LED packaging unit 1 includes at least two LED chips 11 with different light-emitting colors. For example, it includes three LED chips 11 that emit red, green, and blue light respectively. The memory 120 stores the brightness parameters corresponding to each LED chip 11. When controlling the corresponding LED chip 11 to emit light, the corresponding brightness parameters are called for normalization processing.

[0223] In some embodiments, the memory 120 is built into the control chip 12, which can reduce the occupation of the pads of the control chip 12. In other embodiments, the memory 120 is an independent memory 120 electrically connected to the control chip 12, and it is packaged together with the control chip 12 and the LED chip 11 in the package 10.

[0224] When the keyboard application has an LED packaging unit 1 provided with a memory 120, each LED packaging unit 1 can perform brightness normalization according to the brightness parameters of its own LED chip 11, so that the brightness emitted by each LED packaging unit 1 is more consistent with the required brightness in the control signal. When the keyboard maintains a constant backlight effect, the brightness consistency of the characters on each keycap is better, which is more convenient for accurately identifying the characters of the keys and is also more beautiful.

[0225] The keyboard includes a plurality of keycaps and LED packaging units 1 provided corresponding to the keycaps. The keycaps are provided with symbols illuminated by light. Due to reasons such as different symbols on the keycaps, different relative positions of the LED chip 11 and the symbols, even if the brightness of the light emitted by the LED chips 11 under two keycaps is exactly the same, there will still be differences in the brightness of the symbols on the keycaps. For example, some keycaps have larger symbol areas, corresponding larger light-transmitting areas, and higher brightness. Some symbols on the keycaps are directly above the LED chip 11, and the brightness of the symbols is brighter. When the symbol on the keycap is on one side of the LED chip 11, the brightness of the symbol is relatively reduced. Therefore, there may still be a problem of inconsistent backlight brightness of the keycaps on the keyboard.

[0226] To solve the above problems, some embodiments of the present invention propose a method for calibrating the backlight brightness of a keyboard, which is performed when the keycaps of the keyboard are installed. Each keycap is correspondingly provided with at least one LED packaging unit 1. The LED packaging unit includes an LED chip 11 and a control chip 12. The control chip 12 is used to generate an electrical signal for driving the LED chip 11 to emit light according to the received control signal. The method for calibrating the backlight brightness of the keyboard includes the following steps:

[0227] S1. The control chip 12 receives the control signal and identifies the light-emitting information corresponding to the LED chip 11. The light-emitting information includes the light-emitting brightness.

[0228] S2. The control chip 12 generates a compensated electrical signal according to the light-emitting brightness corresponding to the LED chip 11 and the compensation coefficient, and controls the LED chip 11 to emit light through the compensated electrical signal.

[0229] In step S2, generating a compensated electrical signal through the light-emitting brightness of the LED chip 11 and the compensation coefficient can adjust the brightness of each keycap, so that the brightness of each keycap is more consistent when the backlight is constantly on, which is beneficial to more clearly identifying the symbols of the keys and improving the aesthetics.

[0230] In step S1, the control signal includes address information and light-emitting information corresponding to the LED chip 11. The control chip 12 identifies the light-emitting information corresponding to each LED chip 11 according to the address information, so that the LED chip 11 emits light according to the control signal.

[0231] In some embodiments, the compensation coefficient is obtained through simulation, theoretical calculation, or empirical estimation based on the area of the character on each keycap and the relative position between the character and the LED chip 11, etc.

[0232] In some embodiments, the compensation coefficient is obtained through the following steps:

[0233] E1. Apply a control signal to all LED packaging units 1 to cause the required LED chips 11 to emit light, and the emission brightness in the emission information of the control signal for different LED chips 11 is the same.

[0234] E2. Detect the brightness values of all keycaps.

[0235] E3. Set a target brightness value, and divide the target brightness value by the brightness value of each keycap to obtain the compensation coefficient corresponding to the keycap. That is, the compensation coefficient is the ratio of the target brightness value to the brightness value of each keycap.

[0236] For example, if the detected brightness value of the keycap is 100 and the target brightness value is 90, then the compensation coefficient is 0.9. By compensating the electrical signal, the brightness of the light emitted by the LED chip 11 is 0.9 times the original, so that the actual brightness of the keycap is close to the target brightness value. When the emission brightness of all keycaps is close to the target brightness value through compensation, the backlight brightness of the keyboard is more consistent.

[0237] In step E1, the required LED chips 11 are controlled by the control signal to emit light with the same brightness, so as to accurately obtain the compensation coefficients corresponding to each keycap, and there will be a more consistent backlight brightness during the subsequent actual backlight use.

[0238] In step E2, for example, the brightness value of each keycap can be measured by an imaging luminance meter. It can be understood that since only the symbol of the keycap emits light, the brightness value of the keycap can be understood as the brightness value of its symbol. The brightness of different parts of the symbol is not exactly the same. Optionally, the brightness value of the keycap refers to the average brightness value of the symbol, and the average brightness value can also be obtained by an imaging luminance meter.

[0239] In some embodiments, in step S2, the step in which the control chip 12 generates a compensated electrical signal according to the emission brightness and the compensation coefficient corresponding to the LED chip 11 includes:

[0240] S21. Generate an initial electrical signal according to the emission brightness;

[0241] S22. Multiply the duty cycle of the initial electrical signal by the compensation coefficient to obtain the compensated electrical signal.

[0242] In step S21, the initial electrical signal is generated according to the required luminous brightness of the control signal, which can adopt a traditional generation method or be generated through a voltage-brightness curve or an aging curve or a combination of both as described above.

[0243] In step S22, the duty cycle of the initial electrical signal is multiplied by a compensation factor, which can adjust the duty cycle of the electrical signal, and then adjust the brightness of the LED chip 11 to make the brightness of each keycap close. For example, if the duty cycle of the initial electrical signal generated by the control chip 12 according to the luminous brightness is 90%, and the compensation factor is 0.9, then the duty cycle of the compensated electrical signal is 90% * 0.9 = 0.81, and the brightness of the keycap will be further reduced.

[0244] It can be understood that due to the blocking of light by the keycaps, the brightness of the keycaps is usually lower than that of the LED chip 11. Therefore, the brightness of the keycaps is usually less than the luminous brightness in the luminous information.

[0245] In some embodiments, the target brightness value is less than or equal to the average brightness value of all the keycaps, so that the brightness of most keycaps can be compensated to be close to the target brightness value. It can be understood that when the duty cycle of the electrical signal of the LED chip 11 is adjusted to 100%, the brightness cannot be further increased by increasing the duty cycle. Therefore, if the target brightness value is too high, it may cause a large gap between the brightness of many keycaps and the target brightness value even when the brightness of their LED chips 11 is adjusted to the maximum. By setting the target brightness value to be less than or equal to the average brightness value of all the keycaps, the brightness of all or most keycaps can be close to the target brightness value, which is beneficial to ensuring the consistency of the keyboard backlight brightness and having a better overall brightness. The average brightness value of all the keycaps is the ratio of the sum of the brightness of all the keycaps to the number of keycaps.

[0246] In some embodiments, the target brightness value is less than or equal to the brightness value of the keycap with the lowest brightness among all the keycaps. In this way, the LED chips 11 of all the keycaps can reduce the luminous brightness by reducing the duty cycle, making the backlight brightness of each keycap close to the same.

[0247] In some embodiments, the LED packaging unit 1 only includes one LED chip 11, and the luminous colors of the LED chips 11 of each LED packaging unit 1 are the same. In step D1, when making the required LED chip 11 emit light, all the LED chips 11 are made to emit light to check the brightness of all the keycaps.

[0248] In some other embodiments, the LED packaging unit 1 includes at least two LED chips 11 with different emitting colors. When the required LED chips 11 are made to emit light, the LED chips 11 of the same color in all the LED packaging units 1 are made to emit light. For example, when the LED packaging unit 1 includes LED chips 11 of three colors, namely red light LED chips, green light LED chips, and blue light LED chips, all the red light LED chips in all the LED packaging units 1 can be made to emit light first, and steps E1 to E3 are executed. Then, all the green light LED chips in all the LED packaging units 1 are made to emit light, and steps E1 to E3 are executed. Finally, all the blue light LED chips in all the LED packaging units 1 are made to emit light, and steps E1 to E3 are executed. By obtaining the compensation coefficients of the LED chips 11 of different colors in batches, the brightness of all the keycaps can be made more consistent, and when the lights are mixed subsequently, the keycaps can also have similar brightness performances.

[0249] In some embodiments, the LED packaging unit 1 includes a memory 120, and the compensation coefficients are stored in the memory 120. The control chip 12 obtains the compensation coefficients corresponding to the LED chips 11 by retrieving the stored coefficients in the memory 120, with a higher degree of intelligence.

[0250] It can be understood that the keyboard proposed by the present invention can execute the keyboard backlight brightness calibration method described above.

[0251] The present invention also proposes an electronic device, which includes the LED packaging unit 1 described above, or includes the keyboard backlight circuit described above, or includes the keyboard described above.

[0252] The electronic device can be, for example, a mobile phone with keys, a laptop computer, a desktop computer, a game console, or other devices with keys.

[0253] It should be noted that, without conflict, the embodiments in this article can be combined with each other to obtain more implementation schemes.

[0254] The above is only the specific implementation manner of the present invention, and any improvement made on the premise of the concept of the present invention is regarded as the protection scope of the present invention.

Claims

1. A key circuit board, characterized in that: include: Backlight circuit board (38); A keyboard backlight circuit is arranged on the same surface of the backlight circuit board (38), the keyboard backlight circuit comprising a power supply line (20), a ground line (21), a signal line (26) and a plurality of rows of LED packaging units, each row of the LED packaging units comprising a plurality of LED packaging units (1); The LED packaging unit (1) comprises an LED chip (11), a control chip (12) and a port component (131) which are packaged together; the port component (131) is electrically connected to the control chip (12), and comprises a power supply port pad (1310) connected to the power supply line (20), a ground port pad (1313) connected to the ground line (21), and a first data port pad (1311) and a second data port pad (1312) for signal transmission; The LED packaging units (1) are connected in series. In the series connection direction, the front LED packaging unit (1) is connected to the signal line (26) via its first data port solder pad (1311), and in two adjacent LED packaging units (1), the second data port solder pad (1312) of the front LED packaging unit (1) is electrically connected to the first data port solder pad (1311) of the rear LED packaging unit (1).

2. The key circuit board according to claim 1, characterized in that: The power supply line (20) comprises a plurality of sub-power supply lines (200) arranged at intervals, and the ground line (21) comprises a plurality of sub-ground lines (210) arranged at intervals, the sub-power supply lines (200) and the sub-ground lines (210) are arranged in a staggered manner, and a row of LED packaging units is provided between adjacent sub-power supply lines (200) and sub-ground lines (210), and the power supply port pads (1310) and the ground port pads (1313) of the LED packaging units in the row are respectively connected to the adjacent sub-power supply lines (200) and sub-ground lines (210).

3. The key circuit board according to claim 2, characterized in that: Two adjacent rows of LED packaging units share one of the sub-power supply lines (200) or one of the sub-ground lines (210).

4. The key circuit board according to claim 2, characterized in that: The keyboard backlight circuit also includes a power supply port (380), a ground port (381) and a signal port (382) arranged on the backlight circuit board (38); the power supply line (20) includes a peripheral power supply line (201) connected between the power supply port (380) and the sub-power supply line (200); the ground line (21) includes a peripheral ground line (211) connected between the sub-ground line (210) and the ground port solder pad (1313); and the signal line (26) is connected between the signal port (382) and the first data port solder pad (1311) of the frontmost LED packaging unit (1).

5. The key circuit board according to claim 4, characterized in that: The power supply port (380), the ground port (381) and the signal port (382) are arranged adjacent to each other, and the signal port (382) is located between the power supply port (380) and the ground port (381).

6. The key circuit board according to any one of claims 1 to 5, characterized in that: It also includes: A first circuit board (30); A second circuit board (31); a spacer layer (32) connected between the first circuit board (30) and the second circuit board (31); and A key switch (230), comprising a first contact (2300) located on the first circuit board (30) and a second contact (2301) located on the second circuit board (31), wherein the first contact (2300) and the second contact (2301) are arranged relative to each other with a spacing therebetween; The backlight circuit board (38) is located on the side of the second circuit board (31) away from the first circuit board (30), the projections of the LED packaging unit (1) and the key switch (230) in the thickness direction of the key circuit board are staggered, and the LED packaging unit (1) at least extends into the second circuit board (31).

7. The key circuit board according to claim 6, characterized in that: The LED packaging unit (1) extends into the spacer layer (32) and is covered by the first circuit board (30), and at least a region of the first circuit board (30) corresponding to the LED packaging unit (1) is made of a transparent material; or, The LED packaging unit (1) extends beyond the first circuit board (30).

8. The key circuit board according to claim 7, characterized in that: It also includes: a metal plate (36) connected to the second circuit board (31); and A solder resist layer (37) connected between the metal plate (36) and the backlight circuit board (38); The spacer layer (32), the metal plate (36), the solder resist layer (37) and the backlight circuit board (38) together form an avoidance hole (300) for accommodating the LED packaging unit (1).

9. The key circuit board according to any one of claims 1 to 5, characterized in that: The port assembly further comprises a detection port pad (1314), wherein the detection port pad (1314) is connected to a switch circuit (23), and the switch circuit (23) is provided with a key switch (230).

10. The key circuit board according to claim 9, characterized in that: It also includes: a first circuit board (30); and A spacer layer (32) connected between the first circuit board (30) and the backlight circuit board (38); The key switch (230) comprises a first contact point (2300) located on the first circuit board (30) and a second contact point (2301) located on the backlight circuit board (38), wherein the first contact point (2300) and the second contact point (2301) are arranged relatively spaced apart; The projections of the LED packaging unit (1) and the key switch (230) in the thickness direction of the key circuit board are staggered, and the LED packaging unit (1) extends beyond the first circuit board (30).

11. The key circuit board according to claim 10, characterized in that: The backlight circuit board (38) is provided with a third contact (383) electrically connected to the power supply line (20) or the ground line (21); the first circuit board (30) is provided with a fourth contact (301) corresponding to the position of the third contact (383); the third contact (383) is electrically connected to the fourth contact (301); and the fourth contact (301) is electrically connected to the first contact (2300).

12. A keyboard, characterized in that: Comprising a key circuit board as described in any one of claims 1 to 11.

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