Substrate processing apparatus

Abstract

Disclosed is a substrate processing apparatus capable of reducing stress applied to a chuck pin while simultaneously driving a guide ring unit and the chuck pin, a substrate processing apparatus includes a cup having an internal processing space and an open top, a support unit for supporting a substrate in the processing space, a liquid supply unit for supplying a processing liquid to the substrate supported by the support unit, and a contact portion provided to be movable in a vertical direction, the support unit includes a rotatable support plate on which the substrate is placed, a chuck pin provided on the support plate and supporting the substrate on a side of the substrate, and a chuck pin support coupled with the chuck pin and supporting the chuck pin, the contact portion being in contact with an inclined surface formed on the chuck pin support when raised, the chuck pin is provided to move between a spaced position, which is a position spaced apart from the substrate supported by the support unit, and a support position, which is a position supporting a side portion of the substrate supported by the support unit, by the up-down movement of the contact portion.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority and benefit of Korean Patent Application No. 10 - 2023 - 0196046, filed with the Korean Intellectual Property Office on December 29, 2023, the entire content of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to an apparatus and method for processing a substrate, and more particularly, to a substrate processing apparatus capable of reducing stress applied to a chuck pin while simultaneously driving a guide ring unit and a chuck pin. Background Art

[0004] Semiconductor processes include processes for cleaning thin films, foreign substances, particles, etc. on a substrate. The cleaning process is performed by placing the substrate on a support unit and supplying a processing liquid to the upper surface of the substrate while rotating the support unit. The substrate supported by the support unit is fixed by chuck pins. The chuck pins support the substrate at the sides of the substrate. However, when supporting the sides of the substrate, as the rotation speed of the support unit increases, the support force of the chuck pins and the centrifugal force applied to the chuck pins may cancel each other out, so the support force of the chuck pins may weaken.

[0005] Therefore, as disclosed in Korean Patent No. 10 - 0873153, a contact holder is provided to maintain the support force of the chuck pins by compensating for the canceled support force. When the support unit rotates, the contact holder generates a centripetal force in the direction toward the center of the support unit. Therefore, the support force of the chuck pins can be maintained. However, if the rotation speed continues to increase, the centripetal force generated by the contact holder becomes stronger, and the support force of the chuck pins may increase excessively. In this case, the risk of damage or deformation of the chuck pins increases, and the force transmitted to the substrate becomes stronger, which may cause the substrate to bend or be damaged.

[0006] In addition, as the rotation speed of the support unit increases, the amount and range of scattering of the processing liquid scattered from the substrate may increase. Therefore, it is necessary to recover the processing liquid scattered at a position closer to the substrate than the cup - shaped member. However, when a configuration for recovering the processing liquid at a position closer to the substrate than the cup - shaped member is provided, there is a problem of interference with a transfer robot that enters the support unit to load or unload the substrate. Summary of the Invention

[0007] The present invention is directed to providing a substrate processing apparatus capable of preventing excessive increase in stress applied to a chuck pin.

[0008] The present invention is also directed to providing a substrate processing apparatus capable of preventing the substrate from bending or being damaged.

[0009] The present invention is also directed to providing a substrate processing apparatus capable of effectively recovering a processing liquid scattered from a rotating substrate.

[0010] The present invention is also directed to providing a substrate processing apparatus capable of eliminating interference between a transfer robot for loading or unloading a substrate and a guide ring unit for recovering a processing liquid scattered from the substrate at a position adjacent to the substrate.

[0011] The present invention is also directed to providing a substrate processing apparatus capable of driving a guide ring unit while moving a chuck pin.

[0012] The present invention is also directed to providing a substrate processing apparatus capable of transferring a substrate without adjusting the height of a rotating chuck in a substrate processing apparatus provided with a guide ring and a back nozzle.

[0013] The problems to be solved by the present invention are not limited to the above problems, and those skilled in the art will clearly understand the problems not mentioned from the following description.

[0014] Exemplary embodiments of the present invention provide an apparatus for processing a substrate, the apparatus including: a cup-shaped body having an internal processing space and an open top; a support unit for supporting the substrate in the processing space; a liquid supply unit for supplying a processing liquid to the substrate supported by the support unit; and a contact part arranged to be movable in a vertical direction, wherein the support unit includes: a support plate for placing the substrate thereon and arranged to be rotatable; a chuck pin arranged on the support plate and for supporting the substrate on a side portion of the substrate; and a chuck pin support member coupled to the chuck pin and supporting the chuck pin, and when the contact part rises, the contact part contacts an inclined surface formed on the chuck pin support member, and the chuck pin is arranged to move between a spaced position and a support position by the vertical movement of the contact part, the spaced position being a position spaced apart from the substrate supported by the support unit, and the support position being a position capable of supporting a side portion of the substrate supported by the support unit.

[0015] According to an exemplary embodiment of the present invention, when the chuck pin is in the support position, the movement of the chuck pin support member in a direction away from the center of the support plate can be blocked by the contact part arranged on the movement path of the chuck pin support member.

[0016] According to an exemplary embodiment of the present invention, the chuck pin can be moved to the spaced position by a first elastic member mounted on the chuck pin support member.

[0017] According to an exemplary embodiment of the present invention, the inclined surface is formed at a lower end of an extension portion extending vertically from an inner end of the chuck pin support member, and the extension portion may include a vertical surface that contacts the contact part when the chuck pin is in the support position.

[0018] According to an exemplary embodiment of the present invention, when the chuck pin is in the spaced position, the inclined surface and the contact portion are arranged to partially overlap in a top view, and the contact portion may have a surface that contacts the inclined surface in a curved surface form.

[0019] According to an exemplary embodiment of the present invention, the inclined surface may be arranged to slope downward toward the support plate.

[0020] According to an exemplary embodiment of the present invention, the apparatus may further include: a guide ring unit for guiding the processing liquid scattered from the substrate to the cup; and a driver for adjusting the height of the guide ring unit, wherein the guide ring unit further includes: a guide ring for guiding the processing liquid scattered from the substrate to the cup; and a guide ring support member on which the guide ring is mounted, and the contact portion may be formed on the guide ring support member.

[0021] According to an exemplary embodiment of the present invention, the driver adjusts the height of the guide ring unit such that the guide ring unit is located at a process position and a waiting position, the process position is a position higher than the support plate, the waiting position is a position lower than the support plate, when the guide ring unit moves to the process position, the chuck pin is moved to the support position, and when the guide ring unit moves to the waiting position, the chuck pin is moved to the spaced position.

[0022] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus including: a cup having an internal processing space and an open top; a support unit for supporting the substrate in the processing space; a liquid supply unit for supplying a processing liquid to an upper surface of the substrate supported by the support unit; a guide ring unit for guiding the processing liquid scattered from the substrate to the cup; and a driver for adjusting the height of the guide ring unit, wherein the support unit includes: a support plate on which the substrate is placed and arranged to be rotatable; a chuck pin provided on the support plate and for supporting the substrate on a side portion of the substrate; and a chuck pin support member coupled to the chuck pin and supporting the chuck pin, wherein the guide ring unit further includes: a guide ring for guiding the processing liquid scattered from the substrate to the cup; and a guide ring support member on which the guide ring is mounted, the guide ring unit is movable between a process position higher than the support plate and a waiting position lower than the support plate by the driver, and the guide ring support member contacts the chuck pin support member to move the chuck pin when the guide ring unit moves.

[0023] According to an exemplary embodiment of the present invention, the chuck pin is arranged to be movable between a support position and a spaced position through the chuck pin support member, the support position is a position where the chuck pin supports the substrate on a side portion of the substrate, and the spaced position may be a position where the chuck pin is spaced apart from the substrate.

[0024] According to an exemplary embodiment of the present invention, the chuck pin support is formed with an extension portion extending in the vertical direction from the inner end of the chuck pin support, the guide ring support is formed with a contact portion that contacts the extension portion when the guide ring unit moves to the process position, in a top view, when the guide ring unit moves to the waiting position, the extension portion and the contact portion partially overlap each other, and the extension portion may be located closer to the rotation axis than the contact portion.

[0025] According to an exemplary embodiment of the present invention, the side wall of the extension portion includes an inclined surface, the inclined surface is arranged to be inclined downward toward the rotation axis, and the surface of the contact portion may be formed as a curved surface.

[0026] According to an exemplary embodiment of the present invention, when the guide ring unit moves to the process position, the contact portion contacts the vertical wall in the side wall of the extension portion, and the chuck pin may move from the spaced position to the support position.

[0027] According to an exemplary embodiment of the present invention, a second elastic member may be provided at the inner end of the chuck pin support, and when the chuck pin moves to the support position, the second elastic member is compressed.

[0028] According to an exemplary embodiment of the present invention, the processing liquid is provided as a first processing liquid or a second processing liquid different from the first processing liquid, the guide ring includes: an upper ring; a lower ring facing the upper ring in the up-down direction; and an intermediate ring disposed between the upper ring and the lower ring, the upper ring, the intermediate ring, and the lower ring are fixed to each other by fixing rods, the fixing rods are connected to the guide ring support, and when the guide ring unit is located at the process position, the height of the intermediate ring corresponds to the height of the substrate supported by the support unit.

[0029] According to an exemplary embodiment of the present invention, the liquid supply unit may include: a first nozzle for discharging the first processing liquid onto the upper surface of the substrate; and a second nozzle for discharging the second processing liquid onto the lower surface of the substrate.

[0030] According to an exemplary embodiment of the present invention, the cup-shaped body includes a plurality of cup-shaped members, the plurality of cup-shaped members are arranged to surround different cup-shaped members, and the first processing liquid and the second processing liquid can be recovered into different cup-shaped members.

[0031] Exemplary embodiments of the present invention provide an apparatus for processing a substrate. The apparatus includes: a cup-shaped body having an internal processing space and an open top; a support unit for supporting the substrate within the processing space; a guide ring unit for guiding the processing liquid scattered from the substrate to the cup-shaped body; a liquid supply unit including a first nozzle for supplying a first processing liquid to the upper surface of the substrate supported by the support unit, a second nozzle for supplying a second processing liquid to the lower surface of the substrate, and a drive unit for driving the guide ring unit and the support unit. The cup-shaped body includes a plurality of cup-shaped members arranged to surround different cup-shaped members, and the first processing liquid and the second processing liquid are recovered into different cup-shaped members. The support unit includes: a support plate for placing the substrate thereon; chuck pins provided on the support plate and for supporting the substrate on the side portion of the substrate; a rotating shaft for supporting the support plate at the center of the lower surface of the support plate; and a chuck pin support for coupling with the chuck pins to support the chuck pins. The guide ring unit includes: a guide ring for guiding the first processing liquid and the second processing liquid scattered from the substrate to the cup-shaped body; a guide ring support on which the guide ring is mounted and is installed inside the support plate by penetrating from the lower part of the support plate to the inside of the support plate. The guide ring unit is moved between a process position above the support plate and a waiting position below the support plate by the drive unit. The drive unit includes: a first driver for adjusting the relative height between the guide ring unit and the support plate; and a second driver for rotating the rotating shaft. A connection portion connecting the guide ring unit and the first driver is detachably provided when processing the substrate. The chuck pins are arranged to be movable between a support position and a spaced position by the chuck pin support. The support position is the position where the chuck pins support the substrate on the side portion of the substrate, and the spaced position is the position where the chuck pins are spaced apart from the substrate. The chuck pin support is formed with an extension portion extending vertically from the inner end of the chuck pin support. The side wall of the extension portion has a vertical surface and an inclined surface extending downwardly and obliquely from the vertical surface toward the rotating shaft. The guide ring support is formed with a contact portion that contacts the extension portion when the guide ring unit moves to the process position. A curved surface is formed on the surface of the contact portion. When the guide ring unit moves to the waiting position, the extension portion and the contact portion partially overlap each other in a top view. The extension portion is positioned closer to the rotating shaft than the contact portion. When the guide ring unit moves to the process position, the contact portion sequentially contacts the inclined surface and the vertical surface of the extension portion to move the chuck pins from the spaced position to the support position. A second elastic member is provided at the inner end of the chuck pin support, and the second elastic member can be arranged to be compressed when the chuck pins move to the support position.

[0032] According to an exemplary embodiment of the present invention, the guide ring includes: an upper ring; a lower ring facing the upper ring in the vertical direction; and an intermediate ring disposed between the upper ring and the lower ring. The upper ring, the intermediate ring, and the lower ring are fixed to each other by fixing rods, and the fixing rods are coupled to a guide ring support. When the guide ring unit is in the process position, the height of the intermediate ring corresponds to the height of the substrate supported by the support unit.

[0033] According to an exemplary embodiment of the present invention, a first elastic member may be installed below the guide ring support, and the first elastic member applies an elastic force to the guide ring support such that the guide ring support faces upward.

[0034] According to an exemplary embodiment of the present invention, it is possible to prevent the stress applied to the chuck pin from increasing excessively.

[0035] In addition, according to an exemplary embodiment of the present invention, it is possible to prevent the substrate from being bent or damaged.

[0036] In addition, according to an exemplary embodiment of the present invention, it is possible to effectively recover the processing liquid scattered from the rotating substrate.

[0037] In addition, according to an exemplary embodiment of the present invention, it is possible to eliminate interference between a transfer robot that enters to load or unload a substrate and a guide ring unit that recovers the processing liquid scattered from the substrate at a position adjacent to the substrate.

[0038] In addition, according to an exemplary embodiment of the present invention, it is possible to drive the guide ring unit while moving the chuck pin.

[0039] In addition, according to an exemplary embodiment of the present invention, in a substrate processing apparatus provided with a guide ring and a back nozzle, it is possible to transfer a substrate without adjusting the height of the rotating chuck.

[0040] The effects of the present invention are not limited to the above effects, and those skilled in the art can clearly understand the effects not mentioned from this specification and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] After reading the detailed description in conjunction with the drawings, various features and advantages of the non-limiting exemplary embodiments of this specification will become apparent. The drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless otherwise specified, the drawings are not considered to be drawn to scale. For clarity, various dimensions in the figures may be exaggerated.

[0042] Figure 1 is a diagram schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0043] Figure 2 is schematically showing Figure 1 an exemplary embodiment of a liquid processing chamber of

[0044] Figure 3 A diagram that more specifically shows Figure 2 the support unit and guide ring unit in the liquid processing chamber.

[0045] Figure 4 A diagram that shows when Figure 2 in the liquid processing chamber, the chuck pins and the support of the chuck pins when the chuck pins support the substrate.

[0046] Figure 5 A diagram that shows the state when viewed from above when the first plate and the second plate are in the first position.

[0047] Figure 6 A diagram that shows the state when viewed from above when the first plate and the second plate are in the second position.

[0048] Figure 7 A diagram that schematically shows Figure 1 another exemplary embodiment of the liquid processing chamber of

[0049] Figure 8 A diagram that more specifically shows Figure 7 the support unit of

[0050] Figure 9 A cross-sectional view that shows a cross-section of the liquid processing chamber according to an exemplary embodiment of the present invention before loading the substrate onto the support unit.

[0051] Figures 10 to 12 A diagram that shows the forms of the extension part and the contact part when the guide ring unit moves to the process position and the chuck pins move to the support position.

[0052] Figure 13 A diagram that shows the state of processing the substrate in the liquid processing chamber according to an exemplary embodiment of the present invention. Detailed Description

[0053] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. The exemplary embodiments are provided to make the present disclosure thorough and to fully convey the scope to those skilled in the art. Many specific details are set forth, such as examples of specific components, devices, and methods, to provide a thorough understanding of the embodiments of the present disclosure. Those skilled in the art will understand that it is not necessary to employ the specific details, and the exemplary embodiments may be implemented in many different forms and should not be construed as limiting the scope of the present disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

[0054] The terms used herein are for the purpose of describing particular exemplary embodiments only and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, when no quantity is specified and the article "the" is also used, it is also intended to include the plural form. The terms "comprises," "comprising," and "having" are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as necessarily requiring that they be performed in the particular order discussed or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be employed.

[0055] When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it can be directly on, engaged, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, intervening elements or layers may not be present. Other words used to describe the relationship between elements should be interpreted in a like manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0056] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless the context clearly indicates otherwise. Thus, a first element, first component, first region, first layer, or first section discussed below may be referred to as a second element, second component, second region, second layer, or second section without departing from the teachings of the exemplary embodiments.

[0057] For ease of description, this document may use spatial relative terms such as "inner", "outer", "beneath", "below", "lower", "above", "upper", etc. to describe the relationship between one element or feature and another element or feature as shown in the figures. In addition to the orientations depicted in the figures, the spatial relative terms are intended to also encompass different orientations of the device during use or operation. For example, if the device in the figure is flipped, an element described as "below" or "beneath" other elements or features will be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or to other orientations) and the spatial relative descriptions used herein are to be interpreted accordingly.

[0058] When the terms "same" or "equivalent" are used in the description of the exemplary embodiments, it should be understood that there may be some imprecision. Thus, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within the manufacturing or operating tolerance range (e.g., ±10%).

[0059] When the terms "about" or "substantially" are combined with a numerical value, it should be understood that the associated numerical value includes the manufacturing or operating tolerance close to the said numerical value (e.g., ±10%). In addition, when the words "generally" and "substantially" are combined with a geometric shape, it should be understood that precision of the geometric shape is not required, but the degree of freedom of the shape is within the scope of the present disclosure.

[0060] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments belong. It should also be understood that terms (including terms defined in common dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted as being idealized or overly formal, unless expressly so defined herein.

[0061] In the present exemplary embodiment, a wafer will be used as an example to describe the object to be processed. However, in addition to wafers, the technical spirit of the present invention can also be applied to devices for processing other types of substrates.

[0062] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0063] Figure 1 is a top view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0064] Reference Figure 1, the substrate processing apparatus includes a transfer module 10, a processing module 20, and a controller. According to an exemplary embodiment, the transfer module 10 and the processing module 20 are arranged in one direction. Hereinafter, the arrangement direction of the transfer module 10 and the processing module 20 is referred to as the first direction 91, and when viewed from above, the direction perpendicular to the first direction 91 is referred to as the second direction 92, and the direction perpendicular to the first direction 91 and the second direction 92 is referred to as the third direction 93.

[0065] The transfer module 10 transfers the substrate W from the container 80 for accommodating the substrate W to the processing module 20, and accommodates the substrate W that has been completely processed in the processing module 20 into the container 80. The length direction of the transfer module 10 is provided along the second direction 92. The transfer module 10 includes a loading port 12 and a transfer rack 14. Based on the transfer rack 14, the loading port 12 is located on the side opposite to the processing module 20. The container 80 for accommodating the substrate W is arranged on the loading port 12. A plurality of loading ports 12 may be provided, and a plurality of loading ports 12 may be arranged along the second direction 92.

[0066] As the container 80, an airtight container such as a front-opening unified pod (FOUP) may be used. The container 80 may be placed on the loading port 12 by a transfer device (not shown) such as an overhead handling system, an overhead conveyor, or an automated guided vehicle, or by an operator.

[0067] The transfer rack 14 is provided with a transfer robot 120. A guide rail 140 with a length direction of the second direction 92 is provided inside the transfer rack 14, and the transfer robot 120 can be arranged to be movable on the guide rail 140. The transfer robot 120 includes a hand 122 for placing the substrate W thereon, and the hand 122 can be arranged to be movable back and forth, rotatable about the third direction 93, and movable along the third direction 93. A plurality of hands 122 are spaced apart in the vertical direction, and the hands 122 are independently movable back and forth.

[0068] The processing module 20 includes a buffer unit 200, a transfer chamber 300, and a processing chamber 400. The buffer unit 200 provides a space for the substrate W loaded into the processing module 20 and the substrate W unloaded from the processing module 20 to stay temporarily. The processing chamber 400 performs a processing process of liquid-treating the substrate W by supplying a liquid to the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid processing chamber 400.

[0069] The transfer chamber 300 may be set to have a length direction of the first direction 91. The buffer unit 200 may be provided between the transfer module 10 and the transfer chamber 300. A plurality of liquid processing chambers 400 may be provided and may be arranged on the side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be arranged along the second direction 92. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0070] According to the example, the liquid processing chambers 400 are respectively arranged on both sides of the transfer chamber 300. On each side of the transfer device 300, the liquid processing chambers 400 can be arranged in an array A×B (both A and B are natural numbers of 1 or greater than 1) along the first direction 91 and the third direction 93.

[0071] The transfer chamber 300 includes a transfer robot 320. A guide rail 340 with its length direction along the first direction 91 is provided in the transfer chamber 300, and the transfer robot 320 can be arranged to be movable on the guide rail 340. The transfer robot 320 includes a hand 322 for placing the substrate W therein, and the hand 322 can be arranged to be movable forward and backward, rotatable about the third direction 93, and movable along the third direction 93. A plurality of hands 322 are arranged at intervals in the vertical direction, and the hands 322 can move forward and backward independently of each other.

[0072] The buffer unit 200 includes a plurality of buffer parts 220, and the substrate W is placed on the buffer parts 220. The buffer parts 220 can be arranged to be spaced apart from each other along the third direction 93. The front and back of the buffer unit 200 are open. The front is the surface facing the indexing module 10, and the back is the surface facing the transfer chamber 300. The indexing robot 120 can approach the buffer unit 200 through the front, and the transfer robot 320 can approach the buffer unit 200 through the back.

[0073] Figure 2 is a diagram schematically showing Figure 1 an exemplary embodiment of the liquid processing chamber, and Figure 3 is a diagram showing in more detail Figure 2 the support unit and the guide ring unit in the liquid processing chamber. Referring to Figure 2 and Figure 3 , the liquid processing chamber 400 includes a housing 410, a cup-shaped body 420, a lifting unit 430, a liquid supply unit 440, a support unit 450, a guide ring unit 460, a drive unit 480, and a controller.

[0074] The housing 410 is arranged in a substantially rectangular parallelepiped shape. The housing provides an internal space. The configurations to be described below can be arranged in the housing 410. An opening (not shown) can be formed at the side of the housing 410 as a passage for the substrate W.

[0075] The cup-shaped body 420 has a top-open processing space where the substrate W undergoes liquid processing. The relative height between the cup-shaped body 420 and the support unit 450 is adjusted by the lifting unit 430. The cup-shaped body 420 includes a plurality of cup-shaped members. The plurality of cup-shaped members are arranged to surround different cup-shaped members. The plurality of cup-shaped members can recover different processing liquids for each cup-shaped member. According to an example, the cup-shaped body 420 includes a plurality of cup-shaped members 422, 424, and 426. Each of the cup-shaped members 422, 424, and 426 has a recovery space for recovering the liquid used for processing the substrate. The respective recovery containers 422, 424, 426 are arranged in a ring surrounding the support unit 450. During the liquid processing, the processing liquid scattered by the rotation of the substrate W is introduced into the recovery space through the inlets 422a, 424a, 426a of the respective recovery containers 422, 424, 426. According to an example, the cup-shaped body 420 includes an inner cup-shaped member 422, a middle cup-shaped member 424, and an outer cup-shaped member 426. The inner cup-shaped member 422 is arranged to surround the support unit 430, the middle cup-shaped member 424 is arranged to surround the inner cup-shaped member 422, and the outer cup-shaped member 426 is arranged to surround the middle cup-shaped member 424. The second inlet 424a for the liquid to flow into the middle cup-shaped member 424 can be located above the first inlet 422a for the liquid to flow into the inner cup-shaped member 422, and the third inlet 426a for the liquid to flow into the outer cup-shaped member 426 can be located above the second inlet 424a. The bottom of the inner cup-shaped member 422 is connected to a first discharge pipe 422b, and the processing liquid recovered through the first inlet 422a is discharged through the first discharge pipe 422b. The bottom of the middle cup-shaped member 424 is connected to a second discharge pipe 424b, and the processing liquid recovered through the second inlet 424a is discharged through the second discharge pipe 424b. The bottom of the outer cup-shaped member 426 is connected to a third discharge pipe 426b, and the processing liquid recovered through the third inlet 426a is discharged through the third discharge pipe 426b.

[0076] The lifting unit 430 moves the cup-shaped body 420 in the vertical direction. By moving the cup-shaped body 420 up and down, the relative height between the cup-shaped body 420 and the substrate W is changed. Therefore, since the cup-shaped members 422, 424, and 426 for recovering the processing liquid are switched according to the type of liquid supplied to the substrate W, the liquid can be separated and recovered.

[0077] The liquid supply unit 440 supplies a processing liquid to a substrate supported by the support unit 450. The liquid supply unit 440 includes a first nozzle 441 and a second nozzle 442. The first nozzle 441 supplies a first processing liquid to the upper surface of the substrate W supported by the chuck pins 432. The first nozzle 441 is supported by a nozzle support 443. The nozzle support 443 moves the first nozzle 441 between a process position and a waiting position. The first nozzle 441 supplies the first processing liquid to the substrate W on the support plate 451 located at the process position, and the nozzle 441 that has completed the supply of the first processing liquid waits at the waiting position. According to an example, the first processing liquid may be a chemical or ultrapure water. The second nozzle 442 may be set as a back nozzle. When the second nozzle is set as a back nozzle, the second nozzle 442 is mounted on the upper surface of the support plate 451 described later. In addition, a through hole for mounting the back nozzle may be formed at the center of the support plate 451. The second nozzle 442 supplies a second processing liquid to the lower surface of the substrate W supported by the chuck pins 432. According to an example, the second processing liquid may be ultrapure water.

[0078] The support unit 450 supports the substrate W in a processing space. The support unit 450 includes a support plate 451, chuck pins 452, a rotating shaft 453, and a chuck pin support 500.

[0079] The support plate 451 supports the substrate W. The upper surface of the support plate 451 is generally set to be circular and may have a diameter larger than that of the substrate W. Support pins 451a for supporting the back surface of the substrate W are provided at the central portion of the support plate 451. A plurality of support pins 451a are provided. The support pins 451a are arranged in combination to form an overall ring shape. The support pins 451a are set to have a tip protruding from the support plate 451 such that the substrate W is spaced apart from the support plate 451 by a certain distance. A space is formed inside the support plate 451. The chuck pin support 500, a first elastic member 471, and a second elastic member 472 (to be described below) may be installed inside the support plate 451. Hereinafter, the radial direction away from the center of the support plate 451 is referred to as the fifth direction 95, and the direction opposite to the fifth direction 95 is referred to as the sixth direction 96.

[0080] The rotating shaft 453 is set to be rotatable by a second driver 482. The rotating shaft 453 is fixedly coupled to the center of the lower surface of the support plate 451. Therefore, the second driver 482 described below can rotate the support plate 451.

[0081] The chuck pins 452 support the sides of the substrate such that the substrate W does not separate from the support unit 450 during rotation. According to this example, a groove 452a is formed in the chuck pin 452, and the substrate W is supported by the groove 452a. The chuck pins 452 are provided at the edge portion of the support plate 451. The chuck pins 452 are arranged further away from the center of the support plate 451 than the support pins 451a. The chuck pins 452 are provided to protrude upward from the support plate 451. A plurality of chuck pins 452 are provided. The chuck pins 452 are provided to be movable in the radial direction of the support plate 451. The chuck pins 452 are provided to be movable between a support position C1 and a spaced position C2. The support position C1 is the position where the chuck pins 452 support the sides of the substrate W placed on the support plate 452. During the processing of the substrate W, the chuck pins 452 are located at the support position C1. The spaced position C2 is the position where the chuck pins 452 are spaced apart from the substrate W. When loading the substrate W onto the support unit 450 or unloading it from the support unit 450, the chuck pins 452 are located at the spaced position C2. According to the example, the chuck pins 452 can be provided to linearly move between the support position C1 and the spaced position C2.

[0082] Figure 4 is a diagram showing when Figure 2 in the liquid processing chamber of, the chuck pins and the chuck pin support when the chuck pins support the substrate. When there is no substrate W, the groove 452a of the chuck pin at the support position C1 is provided to be closer to the center of the substrate W than the end of the substrate W. Therefore, when the chuck pin 452 supports the substrate W, the chuck pin 452 is provided in a bent state, and the restoring force of the chuck pin 452 allows the chuck pin 452 to support the substrate W.

[0083] The chuck pin supports 500 are provided in a number corresponding to the number of the chuck pins 452. One chuck pin 452 is coupled to each chuck pin support 500. The chuck pin supports 500 are provided inside the support plate 451. The chuck pin supports 500 are provided to move along a fifth direction 95 or a sixth direction 96. According to the example, a guiding portion for inducing movement along the fifth direction 95 or the sixth direction 96 is provided inside the support plate 451, and the chuck pin supports 500 can be mounted in the guiding portion. The chuck pin supports 500 extend to the outside of the support plate 451 along the fifth direction 95. The chuck pin supports 500 penetrate the side wall of the support plate 451. The chuck pins 452 are coupled to the outer ends 510 of the chuck pin supports 500. According to the example, the outer ends 510 of the chuck pin supports are inserted into the lower portions of the chuck pins 452, and the chuck pins 452 are fixed by fixing members 520.

[0084] The chuck pin support 500 has an extension portion 540 extending in a fourth direction 94 from an inner end 530 of the chuck pin support. The extension portion 540 has a first side wall 541 facing the rotation axis 453 and a second side wall 542 located on the opposite side. The second side wall 542 includes a vertical surface 542a and an inclined surface 542b. The vertical surface 542a is located above the inclined surface 542b. The inclined surface 542b has a shape extending from the vertical surface 542a. The inclined surface 542b is formed to slope downward in a direction toward the rotation axis 453. The inclined surface 542b may be provided as a flat surface or a curved surface. A groove 550 may be formed in a region adjacent to the second side wall 542. The groove 550 may be provided in a shape with a lower opening. The groove 550 may be provided in a shape for inserting a contact portion 462a described later. When the groove 550 is formed, the vertical surface 542a may be a part of the side wall of the groove.

[0085] A first elastic member 471 is installed at the inner end 530 of the chuck pin support 500. The first elastic member 471 is installed along a fifth direction 95 of the chuck pin support 500. The first elastic member 471 may be installed on a support member 451b extending from the upper surface of the support plate 451 into the support plate 451. When the chuck pin 452 is in the support position C1, the first elastic member 471 is compressed. The chuck pin 452 may move to the spaced position C2 by the first elastic member 471. According to an example, the first elastic member 471 may be provided as a spring.

[0086] The guide ring unit 460 guides the processing liquid scattered from the substrate W to the cup-shaped body 420. The guide ring unit 460 may include a guide ring 461 and a guide ring support 462. The guide ring 461 may be provided adjacent to the support plate 451. The guide ring 461 may be provided to surround the support plate 451. The guide ring 461 may be provided to slope downward in a direction away from the support plate 451. The guide ring 461 may be provided to slope in a direction between the fourth direction 94 and the fifth direction 95. Additionally, the guide ring 461 may have a shape that slopes more downward from the end of the guide ring 461. Thus, the guide ring may be provided with two-stage inclination.

[0087] The guide ring 461 includes an upper ring 461a, a middle ring 461b, a lower ring 461c, and a fixing rod 461d. The upper ring 461a, the middle ring 461b, and the lower ring 461c are arranged to overlap in a top view. The upper ring 461a is located above the middle ring 461b. The middle ring 461b is located between the upper ring 461a and the lower ring 461c. The lower ring 461c is located at a position facing the upper ring in the up-down direction. The lower ring 461c, the middle ring 461b, and the upper ring 461a are positioned in the third direction 93 in the order of the lower ring 461c, the middle ring 461b, and the upper ring 461a. The upper ring 461a, the middle ring 461b, and the lower ring 461c are coupled to the fixing rod 461d. The fixing rod 461d can be arranged to penetrate through the edge regions of the upper ring 461a, the middle ring 461b, and the lower ring 461c along the third direction 93. Additionally, the guide ring support 462 can be connected to the fixing rod 461d.

[0088] The guide ring support 462 is located below the guide ring 461. The guide ring 461 is mounted on the guide ring support 462 through the fixing rod 461d. The guide ring support 462 is inserted into the support plate 451 by penetrating the lower end of the support plate 451. A contact portion 462a is formed on the guide ring support 462. The number of the contact portions 462a corresponds to the number of the chuck pin supports 500. The surface of the contact portion 462a may include a curved surface. According to an example, the vertical cross-section of the contact portion 462a may be circular, while its horizontal cross-section may be rectangular. The contact portion 462a is formed to contact the extension portion when the guide ring unit 460 moves to the process position P2. When the guide ring unit 460 is in the waiting position P1 and the chuck pin 452 is in the spaced position C2, the contact portion 462a is formed to overlap the inclined surface 542b in a top view. The contact portion 462a is formed at a position where the guide ring unit 460 contacts the inclined surface 542b of the extension portion when the guide ring unit 460 rises to the process position P2. The contact portion 462a may be formed to be inserted into the slot 550 when the guide ring support is in the process position P2.

[0089] The contact portion 462a is formed to be farther from the rotation axis 453 than the extension portion 540. According to an example, when the guide ring unit 460 moves from the waiting position P1 to the process position P2, the contact portion 462a contacts the inclined surface 542b and moves while pushing the inclined surface 542b.

[0090] A connecting portion 462b is formed on the guide ring support 462. The connecting portion 462b has a shape extending in a fourth direction 94 from a portion of the guide ring support 462 inserted into the support plate 451. The connecting portion 462b is coupled to the first driver 481. The guide ring support 462 may include a plurality of connecting portions 462b. When a plurality of connecting portions 462b are provided, the connecting portions 462b and the chuck pin support 500 may be staggered with each other in the support plate 451. According to an example, three chuck pin supports 500 and three connecting portions 462b are respectively provided. When viewed from above, the connecting portions 462b-1 are arranged to form 120 degrees with each other. The connecting portion 462b-1 is disposed between the pin support 500-1 and the chuck pin support 500-2. The chuck pin support 500-2 may be disposed between the connecting portion 462b-1 and the connecting portion 462b-2. The connecting portion 462b may be detachably provided. Thus, the guide ring unit 460 and the first driver 481 are separated from each other, and the guide ring unit 460 may rotate together with the support unit 450.

[0091] A second elastic member 472 is installed in the support plate 451. The second elastic member 472 may be arranged in a compressed state along the fourth direction 94. One end of the second elastic member 472 may be arranged to contact the lower wall of the support plate 451. The other end of the second elastic member 472 may be arranged to contact the guide ring support 462. According to an example, the second elastic member 472 may be arranged as a spring, and the connecting portion 462b may be inserted into the spring. Thus, the guide ring unit 460 may be lifted along the third direction 93 by the elastic force of the second elastic member 472.

[0092] The driving unit 480 may include a first driver 481 and a second driver 482. The first driver 481 is connected to the guide ring support 462. The guide ring support 462 may be moved along the third direction 93 or the fourth direction 94 by the first driver 481. According to an example, the first driver 481 may be arranged as a cylinder. The first driver 481 moves the guide ring unit 460 between a waiting position P1 and a process position P2. The waiting position P1 may be a position where the guide ring unit 460 descends. The waiting position P1 may be a position with a relatively low relative height with respect to the support plate 451. The waiting position P1 may be a position that does not interfere with the transfer robot 320 that transfers the substrate W when loading the substrate W onto the support plate 451 or unloading the substrate W from the support plate 451. The process position P2 may be a position where the guide ring unit 460 ascends. The process position P2 may be a position with a relatively higher relative height with respect to the support plate 451 than the waiting position P1. The process position P2 is a position where scattered processing liquid can be separated and guided when processing the substrate W. The second driver 482 provides a rotational force to the rotating shaft 483. Thus, the substrate W supported on the support plate 451 may be subjected to liquid processing while rotating.

[0093] According to the example, the driving unit 480 may further include a first plate 483 and a second plate 484. In this case, the first plate 483 may be connected to the guide ring support 462, and the second plate 484 may be connected to the first driver 482. The first plate 483 may have a shape surrounding the rotation axis 453. The first plate 483 may be provided as an annular plate. A first protrusion 483a and a first groove 483b may be formed on the outer side of the first plate 483. A plurality of the first protrusion 483a and the first groove 483b may be provided. The second plate 484 may be provided as an annular plate. The second plate 484 may have a shape surrounding the first plate. The second plate 484 may be located above the first plate 483. The second plate 484 may be provided to be spaced apart from the first plate 483 in the third direction 93. A second groove 484b may be formed on the inner side of the second plate 484, and its position and shape correspond to those of the first protrusion. In addition, a second protrusion 484a may be formed at a position and shape corresponding to the first groove 483b. Therefore, the first plate 483 and the second plate 484 may form a keyway structure. The first plate 483 may be rotated together with the rotating chuck 451 by the second driver 482. Figure 5 is a plan view showing a state when the first plate and the second plate are in the first position, Figure 6 is a plan view showing a state when the first plate and the second plate are in the second position. Refer to Figure 5 and Figure 7 , when the first plate 483 rotates, in a plan view, the first protrusion 483a and the second protrusion 484a may partially or entirely overlap. This position is defined as the first position R1. In addition, the position where the first protrusion 483a and the second protrusion 484a do not overlap is defined as the second position R2. According to an exemplary embodiment, except when the rotating chuck 451 is being managed or replaced, the first plate 483 and the second plate 484 may always be in the first position R1.

[0094] Figure 7 is a schematic diagram showing Figure 1 another exemplary embodiment of the liquid processing chamber of Figure 8 is a diagram showing in more detail Figure 7 the support unit of Figure 7 and Figure 8 , the liquid processing chamber 400 may include a housing 410, a cup-shaped body 420, a lifting unit 430, a liquid supply unit 440, a support unit 450, a contact portion 600, and a driver 490. Different from the above example, this exemplary embodiment does not include the guide ring unit 460.

[0095] The contact portion 600 may be a contact portion separately provided with a contact portion 462a formed on the above-described guide ring support 462. The number of the contact portions 600 corresponds to the number of the chuck pin supports 500. The contact portion 600 may include a curved surface on the surface in contact with the inclined surface. According to an example, the vertical cross-section of the contact portion 600 may be circular, and the horizontal cross-section may be quadrilateral. When the chuck pin 452 is in the spaced position C2, the contact portion 600 is arranged such that the contact portion and the inclined surface 542b partially overlap in a top view. When the chuck pin 452 is in the support position C2, the contact portion contacts the vertical surface 542a. Further, in a top view, the extension portion 540, the contact portion 600, and the chuck pin 452 are arranged to be aligned in order along a direction away from the center of the support plate 451.

[0096] The driver 490 may be the above-described first driver 481. The driver 490 is connected to the contact portion 600. The driver 490 moves the contact portion 600 in the vertical direction. The contact portion 600 is lifted by the driver 490 to contact the inclined surface 542b and push the inclined surface 542b, and the chuck pin 452 moves from the spaced position C2 to the support position C1.

[0097] The process of loading the substrate W, processing the substrate W, and unloading the substrate W using the substrate processing apparatus according to an exemplary embodiment of the present invention will be described below.

[0098] Figure 9 is a cross-sectional view showing a cross-section of the liquid processing chamber according to an exemplary embodiment of the present invention before loading the substrate onto the support unit. Refer to Figure 9 , the guide ring unit 460 is located at the waiting position P1. The first driver 481 drives the guide ring unit 460 in the fourth direction 94. The second elastic member 472 is compressed in the fourth direction 94. The chuck pin 452 is located at the spaced position C2. The first elastic member 471 radially pushes the chuck pin support 500. Then, the transfer robot 320 loads the substrate W onto the support plate 451.

[0099] Figures 10 to 12 is a view showing the form of the extension portion and the contact portion when moving the guide ring unit to the process position and moving the chuck pin to the support position. Refer to Figures 10 to 12, the first driver 471 is driven to move the guide ring unit 460 in the third direction 93. The second elastic member 472 applies an elastic force to the guide ring unit 460 in the third direction 93. The guide ring unit 460 moves to the process position P2. While the guide ring unit 460 moves to the process position P2, the contact portion 462a also moves in the third direction. The contact portion 462a comes into contact with the extension portion 540. The contact portion 462a moves along the A axis. The A axis is an axis parallel to the third direction 93. The extension portion 540 moves along the B axis. The B axis is an axis parallel to the fifth direction 95. The contact portion 462a comes into contact with the inclined surface 542b of the extension portion. The contact portion 462a applies a force in a direction perpendicular to the surface of the extension portion 540. This force is divided into a component in the direction toward the center of the upper surface of the support plate 451 and a component in the third direction 93. The vertical component is offset by installing the chuck pin support 500 in the guide portion. Therefore, the extension portion 540 moves in the direction toward the center of the upper surface of the support plate 451 by the force of the horizontal component. Therefore, the chuck pin 452 can move from the spaced position C2 to the support position C1. The contact portion 462a continues to move in the third direction while pushing the inclined surface 542b of the extension portion 540. Thereafter, when the chuck pin 452 is located at the support position C1, the contact portion 462a comes into contact with the vertical surface 542a of the extension portion.

[0100] During the above process, the first elastic member 471 is compressed in the direction toward the center of the support plate 451.

[0101] Figure 13 FIG. is a view showing a state of processing a substrate in a liquid processing chamber according to an exemplary embodiment of the present invention. Refer to Figure 13 , the chuck pin 452 rotates together with the support plate 451 by the second driver 482. A centrifugal force is generated between the chuck pin 452 and the chuck pin support 500. Due to the centrifugal force, the chuck pin 452 moves radially on the upper surface of the support plate 451, so that the supporting force for supporting the substrate W by the chuck pin 452 may be weakened. However, even if the chuck pin 452 attempts to move away from the substrate W, the extension portion 540 of the chuck pin support is blocked by the contact portion 462a from moving radially on the upper surface of the support plate 451.

[0102] When the processing of the substrate is completed, the separated connection part 462b is joined again. The first driver 481 moves the guide ring unit 460 in the fourth direction. The guide ring unit 460 moves to the waiting position P1. The second elastic member 472 is compressed in the fourth direction 94. The contact part 462a moves in the fourth direction 94. The contact part 462a sequentially passes through the vertical surface 542a and the inclined surface 542b of the extension part. When the contact part 462a passes through the inclined surface 542b, the first elastic member 471 moves the chuck pin support 500 in the fifth direction 95. Accordingly, the chuck pin 452 moves to the spaced position C2. The substrate W is supported again by the support pin 451a. Subsequently, the transfer robot 320 unloads the substrate W from the support plate 451.

[0103] According to an exemplary embodiment of the present invention, even if the rotation speed of the support unit 450 increases and the centrifugal force applied to the chuck pin 452 becomes stronger, since the contact part 462a is arranged on the moving path of the extension part 540, the extension part 540 can cancel the force advancing in the fifth direction 95 by the centrifugal force. Accordingly, even if the rotation speed of the support unit 450 increases, it is possible to prevent the chuck pin 452 from moving in the fifth direction, thereby preventing the supporting force from decreasing due to the centrifugal force. In addition, by removing the configuration for compensating the centrifugal force, it is possible to prevent excessive stress from being applied to the chuck pin 452 and the substrate W, thereby preventing deformation or damage.

[0104] In addition, by installing the guide ring unit 460 between the support plate 451 and the cup-shaped body 420, the separation and recovery rate of the processing liquid can be improved. In addition, even if the guide ring unit 460 is provided, when the substrate W is loaded onto the support unit 450 or unloaded from the support unit 450, the chuck pin 452 also moves to the spaced position C2 at the same time, so that the interference between the guide ring unit 450 and the transfer robot 320 can be eliminated.

[0105] In addition, since the chuck pin 452 and the guide ring unit 460 are simultaneously driven by one first driver 481 without installing a separate driver, the complexity of the structure can be avoided.

[0106] In addition, since the second elastic member 472 applies an elastic force to the guide ring unit 460 in the third direction 93, it is possible to prevent the guide ring unit 460 from descending or the chuck pin 452 from moving away from the support position C1 when the support plate 451 rotates.

[0107] In addition, since the support unit 450 is fixed during the transfer of the substrate W, a back nozzle can be provided for the support unit 450.

[0108] In the above example, the present invention has been described by taking the case where only the first nozzle is provided as the nozzle for supplying the processing liquid to the upper surface of the substrate W as an example. However, the present invention is not limited thereto, and a plurality of nozzles may be provided for supplying the processing liquid to the upper surface of the substrate W. In this case, the added nozzle may supply another type of processing liquid to the substrate. In addition, the added nozzle is supported by a different arm and can be moved independently. Alternatively, the first nozzle 452 and the added nozzle may be mounted on the same arm and moved simultaneously.

[0109] In addition, in the above embodiment, the present invention has been described by taking the case where the substrate W is treated with the processing liquid as an example. However, the present invention is not limited thereto, and a configuration for ejecting a drying gas to the substrate W may be added to dry the processing liquid.

[0110] In addition, in the above embodiment, the present invention has been described by taking the case where the connecting portion 462b is integrally provided with the guide ring support portion 462 as an example. However, the present invention is not limited thereto, and the connecting portion 462b may also be provided as a separate component and coupled to the guide ring support portion 462.

Claims

1. A device for processing a substrate, the device comprising: a cup-shaped body having an interior processing space and an open top; a supporting unit for supporting a substrate in the processing space; a liquid supply unit for supplying a processing liquid to the substrate supported by the support unit; as well as a contact portion, which is arranged to be movable in the up-down direction, The support unit comprises: a support plate for placing the substrate thereon and configured to be rotatable; a chuck pin disposed on the support plate and used to support the substrate on a side of the substrate; and a chuck pin support member coupled to and supporting the chuck pin, and When the contact portion rises, the contact portion contacts an inclined surface formed on the chuck pin support member, The chuck pin is configured to move between a spacing position and a supporting position by up and down movement of the contact portion, The spaced position is a position spaced apart from the substrate supported by the supporting unit, and The supporting position is a position that supports the side portion of the substrate supported by the supporting unit.

2. The device according to claim 1, wherein when the chuck pin is located at the supporting position, the chuck pin support is prevented from moving in a direction away from the center of the support plate by the contact portion arranged on a moving path of the chuck pin support.

3. The device of claim 1, wherein the chuck pin is moved to the spaced position by a first elastic member mounted on the chuck pin support member.

4. The device according to claim 2, wherein the inclined surface is formed at a lower end of an extension portion extending vertically from an inner end of the chuck pin support, and the extension portion includes a vertical surface that contacts the contact portion when the chuck pin is located at the supporting position.

5. The device according to claim 1, wherein when the chuck pin is in the spaced position, the inclined surface and the contact portion are arranged to partially overlap in a plan view, and the contact portion has a surface that contacts the inclined surface in a curved form. The device according to claim 1 , wherein the inclined surface is configured to be inclined downward toward the support plate.

7. The apparatus according to claim 1, further comprising: A guide ring unit, used for guiding the processing liquid scattered from the substrate to the cup-shaped body; as well as a driver for adjusting the height of the guide ring unit, The guide ring unit further comprises: A guide ring for guiding the processing liquid scattered from the substrate to the cup-shaped body; as well as a guide ring support on which the guide ring is mounted, and The contact portion is formed on the guide ring support.

8. The device according to claim 7, wherein the driver adjusts the height of the guide ring unit so that the guide ring unit is located at a process position and a waiting position, The process position is a position higher than the support plate, The waiting position is a position lower than the support plate, When the guide ring unit moves to the process position, the chuck pin moves to the supporting position, and when the guide ring unit moves to the waiting position, the chuck pin moves to the spacing position.

9. An apparatus for processing a substrate, the apparatus comprising: a cup-shaped body having an interior processing space and an open top; a supporting unit for supporting a substrate in the processing space; a liquid supply unit for supplying a processing liquid to an upper surface of the substrate supported by the support unit; A guide ring unit, used for guiding the processing liquid scattered from the substrate to the cup-shaped body; as well as a driver for adjusting the height of the guide ring unit, The support unit comprises: a support plate for placing the substrate thereon and configured to be rotatable; a chuck pin disposed on the support plate and used to support the substrate on a side of the substrate; and a chuck pin support member coupled to and supporting the chuck pin, and The guide ring unit further comprises: a guide ring for guiding the processing liquid scattered from the substrate to the cup-shaped body; and a guide ring support on which the guide ring is mounted, and The guide ring unit is moved between a process position above the support plate and a waiting position below the support plate by the driver, and the guide ring support is in contact with the chuck pin support to move the chuck pin when the guide ring unit moves.

10. The device according to claim 9, wherein the chuck pin is arranged to be movable between a supporting position and a spaced position by the chuck pin support, The supporting position is a position where the chuck pins support the substrate on the side of the substrate, and The spaced apart position is a position where the chuck pins are spaced apart from the substrate.

11. The device according to claim 10, wherein the chuck pin support is formed with an extension extending from an inner end of the chuck pin support in a vertical direction, The guide ring support is formed with a contact portion, and when the guide ring unit moves to the process position, the contact portion contacts the extension portion, and When viewed from above, when the guide ring unit moves to the waiting position, the extending portion and the contact portion partially overlap each other, and the extending portion is located closer to the rotation axis than the contact portion.

12. The device of claim 11, wherein the side wall of the extension comprises an inclined surface, The inclined surface is arranged to be inclined downward toward the rotating shaft, and A surface of the contact portion is formed with a curved surface. 13 . The apparatus according to claim 12 , wherein when the guide ring unit moves to the process position, the contact portion contacts a vertical wall among the side walls of the extension portion, and the chuck pin moves from the spaced position to the supporting position.

14. The device according to claim 13, wherein a second elastic member is provided at an inner end of the chuck pin supporting member, and the second elastic member is configured to be compressed when the chuck pin moves to the supporting position.

15. The device according to claim 9, wherein the treatment liquid is configured as a first treatment liquid or a second treatment liquid different from the first treatment liquid, The guide ring comprises: Sheung Wan; a lower ring facing the upper ring in the up-down direction; and an intermediate ring, which is arranged between the upper ring and the lower ring, wherein the upper ring, the middle ring and the lower ring are fixed to each other by a fixing rod, The fixing rod is connected to the guide ring support, and When the guide ring unit is located at the process position, a height of the intermediate ring corresponds to a height of the substrate supported by the supporting unit.

16. The device according to claim 15, wherein the liquid supply unit comprises: a first nozzle for discharging the first processing liquid onto an upper surface of the substrate; as well as The second nozzle is used to discharge the second processing liquid onto the lower surface of the substrate.

17. The device according to claim 16, wherein the cup-shaped body comprises a plurality of cup-shaped members, The plurality of cups are arranged to surround different cups, and The first process liquid and the second process liquid are recovered into different cups.

18. An apparatus for processing a substrate, the apparatus comprising: a cup-shaped body having an interior processing space and an open top; a supporting unit for supporting a substrate in the processing space; A guide ring unit, used for guiding the processing liquid scattered from the substrate to the cup-shaped body; a liquid supply unit including a first nozzle for supplying a first processing liquid to an upper surface of the substrate supported by the support unit and a second nozzle for supplying a second processing liquid to a lower surface of the substrate; as well as a driving unit, which is used to drive the guide ring unit and the supporting unit, The cup-shaped body comprises a plurality of cup-shaped parts. The plurality of cups are arranged to surround different cups, and The first processing liquid and the second processing liquid are recovered into different cup-shaped members, The support unit comprises: a support plate for placing the substrate thereon; a chuck pin disposed on the support plate and supporting the substrate on a side of the substrate; a rotation shaft supporting the support plate at the center of a lower surface of the support plate; and a chuck pin support member for supporting the chuck pin by coupling with the chuck pin, The guide ring unit comprises: a guide ring for guiding the first processing liquid and the second processing liquid scattered from the substrate to the cup-shaped body; and a guide ring support, the guide ring being mounted on the guide ring support and being mounted inside the support plate by penetrating from the lower portion of the support plate to the inside of the support plate, and The guide ring unit moves between a process position higher than the support plate and a waiting position lower than the support plate through the driving unit. The driving unit comprises: a first driver for adjusting a relative height between the guide ring unit and the support plate; and a second drive for rotating the rotating shaft, The connecting portion connecting the guide ring unit and the first driver is detachably arranged during processing of the substrate. The chuck pin is arranged to be movable between a supporting position and a spaced position by the chuck pin support, the supporting position being a position where the chuck pin supports the substrate on a side of the substrate, and the spaced position being a position where the chuck pin is spaced apart from the substrate, The chuck pin support is formed with an extension portion extending from an inner end of the chuck pin support in a vertical direction, The side wall of the extension portion has a vertical surface and an inclined surface extending while being inclined downward from the vertical surface toward the rotation axis, The guide ring support is formed with a contact portion that contacts the extension portion when the guide ring unit moves to the process position. A curved surface is formed on the surface of the contact portion, When the guide ring unit moves to the waiting position, the extending portion and the contact portion partially overlap each other when viewed from above, and the extending portion is located closer to the rotation axis than the contact portion. When the guide ring unit moves to the process position, the contact portion sequentially contacts the inclined surface and the vertical surface of the extension portion to move the chuck pin from the spacing position to the supporting position. A second elastic member is provided at the inner end of the chuck pin support member, and The second elastic member is configured to be compressed when the chuck pin moves to the supporting position.

19. The device of claim 18, wherein the guide ring comprises: Sheung Wan; a lower ring facing the upper ring in an up-down direction; as well as an intermediate ring, which is arranged between the upper ring and the lower ring, wherein the upper ring, the middle ring and the lower ring are fixed to each other by a fixing rod, The fixing rod is connected to the guide ring support, and When the guide ring unit is located at the process position, a height of the intermediate ring corresponds to a height of the substrate supported by the supporting unit. 20 . The device according to claim 19 , wherein a first elastic member is installed below the guide ring support member, and the first elastic member applies elastic force to the guide ring support member so that the guide ring support member faces upward.

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