Earphone

Abstract

The invention provides an earphone, and relates to the technical field of electronic equipment. The earphone comprises a shell and at least one waterproof acoustic module. At least one accommodating cavity and at least one sound through hole are formed in the inner wall of the shell, and the at least one sound through hole penetrates through the shell and is communicated with the at least one accommodating cavity; the waterproof acoustic module comprises a communication hole and a waterproof assembly, the waterproof assembly is configured to prevent liquid from entering the waterproof acoustic module through the communication hole, and the at least one waterproof acoustic module is arranged in the at least one containing cavity and covers the at least one sound passing hole. The liquid is prevented from entering the internal space of the housing through the at least one sound through hole. By using the waterproof acoustic module, the sensitivity difference value of the acoustic sensor installed in the earphone can be controlled, so that the sensitivity difference value between different earphones is ensured to be within a deviation range, and the consistency of the different earphones is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and particularly to a headset. Background Art

[0002] There are usually multiple acoustic sensors in a headset. When the headset is used in the wild or a humid environment, liquid can easily enter the headset through the sound holes provided on the headset. For example, when a user is doing underwater activities (such as swimming) with the headset on, water will enter the headset through the sound holes. Therefore, it is necessary to add a moisture-proof and waterproof design for the headset working in a humid environment.

[0003] Since the sensitivity of the acoustic sensor will be affected during the process of assembling it into the headset, and due to the requirements of moisture-proof and liquid-proof, the acoustic sensor needs to be sealed and installed in the headset in combination with a waterproof structure, making it difficult to disassemble and adjust. As a result, it is also very difficult to adjust the sensitivity of the acoustic sensor, making it difficult to ensure that the sensitivity difference of the headsets in the same batch is within the ideal deviation range, and the yield rate of the headsets in the same batch is relatively low.

[0004] Therefore, it is necessary to design a headset and an acoustic module accessory for the headset, the structure of which takes into account waterproofness and can solve the problem of the relatively low yield rate of the headsets in the same batch as described above. Summary of the Invention

[0005] This specification provides a headset. The headset includes a housing and at least one waterproof acoustic module; at least one accommodation cavity and at least one sound hole are formed on the inner wall of the housing, the at least one sound hole penetrates through the housing and communicates with the at least one accommodation cavity; at least one waterproof acoustic module, the waterproof acoustic module includes a communication hole and a waterproof component, the waterproof component is configured to prevent liquid from entering the interior of the waterproof acoustic module through the communication hole, wherein the at least one waterproof acoustic module is disposed in the at least one accommodation cavity and covers the at least one sound hole to prevent the liquid from entering the internal space of the housing through the at least one sound hole.

[0006] In some embodiments, the at least one waterproof acoustic module includes a first waterproof acoustic module and a second waterproof acoustic module, the at least one accommodation cavity includes a first accommodation cavity and a second accommodation cavity, the at least one sound hole includes a first sound hole and a second sound hole, wherein the first waterproof acoustic module is disposed in the first accommodation cavity and covers the first sound hole; the second waterproof acoustic module is disposed in the second accommodation cavity and covers the second sound hole.

[0007] In some embodiments, the inner wall of the housing includes a housing bottom wall and a housing side wall; the first accommodation cavity is disposed on the housing bottom wall, the second accommodation cavity is disposed on the housing side wall, and the first waterproof acoustic module and the second waterproof acoustic module are connected by a flexible circuit board.

[0008] In some embodiments, the first waterproof acoustic module and the second waterproof acoustic module respectively include a first acoustic sensor and a second acoustic sensor, and the first acoustic sensor and the second acoustic sensor are a microphone or a speaker.

[0009] In some embodiments, the first waterproof acoustic module and the second waterproof acoustic module respectively include a first circuit board and a second circuit board; the inner wall of the housing forms a first accommodation side wall of the first accommodation cavity and a second accommodation side wall of the second accommodation cavity; the height of the first accommodation side wall is higher than the upper surface of the first circuit board, so as to form a first accommodation space to accommodate a sealing material, and / or, the height of the second accommodation side wall is higher than the upper surface of the second circuit board, so as to form a second accommodation space to accommodate a sealing material.

[0010] In some embodiments, the first circuit board and the second circuit board are connected by a flexible circuit board.

[0011] In some embodiments, each accommodation cavity includes an accommodation side wall and an accommodation bottom wall, and each sound transmission hole penetrates through the corresponding accommodation bottom wall to communicate the internal space and the external space of the housing: each waterproof acoustic module includes a base, a waterproof component, an acoustic component, and a circuit board; the base includes a base side wall, a base bottom wall, and a communication hole, the base side wall and the base bottom wall form a base accommodation cavity, the communication hole penetrates through the base bottom wall and communicates with the base accommodation cavity, and the base is hermetically connected to the accommodation cavity; the waterproof component is in the base accommodation cavity and covers the communication hole to prevent liquid from entering the base accommodation cavity through the communication hole; the acoustic component includes an acoustic sensor, and the acoustic sensor is placed on a side of the waterproof component away from the base bottom wall; and the circuit board is located between the acoustic sensor and the waterproof component and is mechanically connected to the acoustic sensor.

[0012] In some embodiments, a first seal and a second seal are further included, the base bottom wall abuts against the accommodation bottom wall to form a first gap, and the base side wall and the accommodation side wall form a second gap; and the first seal seals the first gap, and the second seal seals the second gap.

[0013] In some embodiments, the first seal is obtained by providing a fluid sealing material to the first gap and then curing it, and / or the second seal is obtained by providing a fluid sealing material to the second gap and then curing it.

[0014] In some embodiments, the first seal is a prefabricated gasket.

[0015] In some embodiments, a first limiting portion is circumferentially provided on the bottom wall of the base along the communication hole; and a second limiting portion is circumferentially provided on the bottom wall of the accommodation along the sound passage hole. The first limiting portion and the second limiting portion cooperate and abut against each other to form a third gap.

[0016] In some embodiments, a third seal is further included. The third seal seals the third gap and is obtained by providing a fluid sealing material to the third gap and then curing it; and the first limiting portion and the second limiting portion cooperate and abut against each other to prevent the fluid sealing material from flowing into the sound passage hole.

[0017] In some embodiments, the first limiting portion includes a groove provided on the base along the circumference of the communication hole; and the second limiting portion includes a corresponding protrusion provided on the bottom wall of the accommodation along the circumference of the sound passage hole.

[0018] In some embodiments, the circuit board passes over the side wall of the accommodation from the target section of the side wall of the accommodation and then is connected to the flexible circuit board, wherein the target section of the side wall of the accommodation has a smoother design than other parts of the side wall of the accommodation to reduce the bending of the side wall of the accommodation on the circuit board.

[0019] In some embodiments, the target section includes a guiding opening provided on the side wall of the accommodation and an inclined guiding surface. The guiding opening is connected to the inner wall of the housing through the guiding surface to support the circuit board.

[0020] In some embodiments, the aperture of the sound passage hole on the inner wall of the housing is less than or equal to the aperture of the sound passage hole on the outer wall of the housing.

[0021] In some embodiments, the central axis of the sound passage hole is inclined with respect to the bottom wall of the accommodation cavity.

[0022] As can be seen from the above technical solutions, the earphones provided in this specification adopt an acoustic sensor mounting structure with a liquid-proof effect. Since the sensitivity of the acoustic sensor is affected during the process of assembling it into the earphone, and due to the requirements of moisture-proof and liquid-proof, the acoustic sensor needs to be sealed and installed in the housing in combination with a waterproof component, making it very difficult to disassemble and adjust. As a result, it is also very difficult to adjust the sensitivity of the acoustic sensor, so it is difficult to ensure that the sensitivity difference of earphones in the same batch is within the ideal range, thus affecting the yield rate of the earphones. In this specification, the acoustic sensor and the waterproof component are placed in a prefabricated acoustic module, and then the acoustic module is installed in the earphone. According to the preset sensitivity difference requirements, the acoustic module adapted to the earphone is adjusted. Therefore, the sensitivity difference of multiple acoustic sensors in the same earphone can be flexibly adjusted, and then the sensitivity difference of earphones in the same batch can be ensured to be within the ideal range, ensuring the yield rate of the earphones.

[0023] Other functions of the earphones provided in this specification will be partially listed in the following description. The creative aspects of the earphones provided in this specification can be fully explained through practice or by using the methods, devices, and combinations described in the detailed examples below. Brief Description of the Drawings

[0024] To more clearly illustrate the technical solutions in the embodiments of this specification, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this specification. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1A Shows a schematic structural diagram of the earphones provided in some embodiments of this specification;

[0026] Figure 1B Shows in accordance with this specification Figure 1A The A-A cross-sectional view of the earphones shown;

[0027] Figure 2A Shows a schematic diagram of the waterproof acoustic module installed in the accommodation cavity provided in some embodiments of this specification;

[0028] Figure 2B Shows a schematic diagram of the waterproof acoustic module provided in some embodiments of this specification;

[0029] Figure 2C Shows in accordance with this specification Figure 2B The B-B cross-sectional view of the waterproof acoustic module shown;

[0030] Figure 3 Shows a schematic structural diagram of another waterproof acoustic module provided in the embodiments of this specification;

[0031] Figure 4A Shows a schematic structural diagram of an acoustic component and a receiving cavity provided according to some embodiments of the present specification;

[0032] Figure 4B Shows another A-A cross-sectional view of the earphone shown in FIG. 1 of the present specification;

[0033] Figure 4C Shows provided according to the present specification Figure 4B An enlarged view of part C shown;

[0034] Figure 5 Shows a schematic structural diagram of a first waterproof acoustic module provided according to some embodiments of the present specification;

[0035] Figure 6 Shows a schematic diagram of a first receiving sidewall provided according to some embodiments of the present specification;

[0036] Figure 7A Shows a line graph of the sensitivity of an acoustic sensor under Scheme A provided according to some embodiments of the present specification;

[0037] Figure 7B Shows a line graph of the sensitivity of an acoustic sensor under Scheme B provided in some embodiments of the present specification. Detailed implementation manners

[0038] The following description provides specific application scenarios and requirements of the present specification, aiming to enable those skilled in the art to manufacture and use the content of the present specification. For those skilled in the art, various partial modifications to the disclosed embodiments are obvious, and the general principles defined here can be applied to other embodiments and applications without departing from the spirit and scope of the present specification. Therefore, the present specification is not limited to the shown embodiments, but has the broadest scope consistent with the claims.

[0039] The terms used here are only for the purpose of describing specific example embodiments and are not restrictive. For example, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" used here may also include the plural forms. When used in this specification, the terms "include", "comprise" and / or "contain" mean that the associated integers, steps, operations, elements and / or components exist, but do not exclude the existence of one or more other features, integers, steps, operations, elements, components and / or groups, or the addition of other features, integers, steps, operations, elements, components and / or groups in the system / method.

[0040] In this application, the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe this application and its embodiments, and are not used to limit that the indicated device, element, or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0041] Moreover, in addition to being used to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to the specific circumstances.

[0042] In addition, the terms "mounted", "arranged", "provided with", "connected", "linked" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can also be internal communication between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0043] In this specification, "X includes at least one of A, B, or C" means that X includes at least A, or X includes at least B, or X includes at least C. That is to say, X can include only any one of A, B, C, or can include any combination of A, B, C and other possible contents / elements at the same time. Any combination of A, B, C can be A, B, C, AB, AC, BC, or ABC.

[0044] In this specification, unless otherwise clearly stated, the association relationship generated between structures can be a direct association relationship or an indirect association relationship. For example, when describing "A is connected to B", unless it is clearly stated that A is directly connected to B, it should be understood that A can be directly connected to B, or can be indirectly connected to B; for another example, when describing "A is above B", unless it is clearly stated that A is directly above B (A and B are adjacent and A is above B), it should be understood that A can be directly above B, or A can be indirectly above B (there are other elements between A and B, and A is above B). And so on.

[0045] In view of the following description, these features of the present specification and other features, as well as the operation and functions of the relevant elements of the structure, and the combination and manufacturing economy of the components can be significantly improved. Referring to the attached drawings, all of these form a part of the present specification. However, it should be clearly understood that the drawings are only for illustrative and descriptive purposes and are not intended to limit the scope of the present specification. It should also be understood that the drawings are not drawn to scale.

[0046] When the earphone 01 has two or more acoustic sensors, usually due to installation errors, differences in acoustic sensor elements, etc., there are differences in sensitivity (i.e., Sgap) between each acoustic sensor assembled on the earphone 01, which further results in poor consistency of the assembled sensitivity (also known as the assembly sensitivity) among the earphones 01 during the assembly process, affecting the yield of the earphone 01. Among them, the assembly sensitivity consistency is the difference in Sgap between different earphones 01, and poor assembly sensitivity consistency means that the Sgap difference among the earphones 01 is relatively large. In this case, the sensitivity consistency among multiple earphones 01 can be modulated through a preset algorithm. For example, the assembly sensitivity difference among multiple acoustic sensors in earphone A is Sgap A ; the assembly sensitivity difference among multiple acoustic sensors in earphone B is Sgap B ; the assembly sensitivity difference among multiple acoustic sensors in earphone C is Sgap C . For earphone A, earphone B, and earphone C, it is desired to use the same circuit design or algorithm to adjust the Sgap among multiple acoustic sensors. Therefore, it is required that Sgap A , Sgap B and Sgap C The difference between any two Sgaps is kept within the preset value range, that is, to ensure good assembly sensitivity consistency. However, usually, there is a certain threshold range for algorithm adjustment, and it is difficult to simultaneously improve the sensitivity consistency among multiple earphones and ensure the yield.

[0047] Therefore, the present application provides an earphone using a waterproof acoustic module. The waterproof acoustic module is a separate module detached from the housing. The waterproof acoustic module has been treated against liquid (water), so the assembly sensitivity of the waterproof acoustic module is basically fixed. By setting a separate acoustic module 20, the assembly sensitivity difference of the earphone 01 can be flexibly adjusted, thereby improving the assembly sensitivity consistency of different earphones 01. That is, it can ensure that the difference between the assembly sensitivity differences Sgap of different earphones 01 is within the preset range, thereby ensuring the yield of the earphone 01.

[0048] The following will detail the present application through specific embodiments:

[0049] Figure 1AThe schematic structural diagram of the earphone 01 provided according to some embodiments of the present specification is shown. Figure 1B It shows in the present specification Figure 1A The A-A cross-sectional view of the shown earphone 01. Figure 1A The earphone shown in the present specification is a wireless earphone. It can be known that the wireless earphone can be a bone conduction earphone, an air conduction earphone or a bone-air conduction earphone, and the earphone can also be a wired earphone. As Figure 1B shown, the earphone 01 can include a housing 10 and at least one waterproof acoustic module 20.

[0050] The housing 10 can be the installation component of the earphone 01. Other components of the earphone 01 (such as the waterproof acoustic module 20, etc.) can be installed with the housing 10 as the carrier. The housing 10 can include an inner wall and an outer wall. The outer wall can be the appearance surface of the earphone 01 finally presented to the user. The outer wall can be a smooth curved surface. The inner wall can be provided with grooves or protrusions for easy assembly. As Figure 2A shown, the inner wall of the housing 10 can include a housing bottom wall 110 and a housing side wall 120. The housing bottom wall 110 and the housing side wall 120 jointly enclose an internal space, and other components of the earphone 01 can be arranged in the internal space.

[0051] The shape of the housing 10 can be any shape. For example, it can be a runway shape (rounded rectangle) or a circular shape. In some embodiments, the housing 10 can include two parts. After assembling other components, the two parts are snapped together to form the appearance of the earphone 01 seen by the user. The shape of the housing 10 can be any shape. For example, the housing 10 of the earphone 01 can be a shape that conforms to the contour of the human ear, so that the wireless earphone can be worn more stably on the user's ear. The material of the housing 10 can be any material, such as metal material, plastic material, polymer material, etc. The present application does not limit the shape and material of the housing 10.

[0052] As Figure 1B shown, at least one accommodation cavity 130 can be formed on the inner wall of the housing 10. Specifically, the inner wall of the housing 10 can form an accommodation side wall 131 and an accommodation bottom wall 132 of the accommodation cavity 130. For example, the housing bottom wall 110 of the housing 10 forms the accommodation side wall 131 and the accommodation bottom wall 132. Or the housing bottom wall 110 forms a part of the accommodation side wall 131 and the accommodation bottom wall 132, and the housing side wall 120 forms the other part of the accommodation side wall 131 and the accommodation bottom wall 132. In some embodiments, the accommodation cavity 130 can also be a space enclosed by other components.

[0053] The inner wall of the housing 10 may further form at least one sound - conducting hole 140. The at least one sound - conducting hole 140 penetrates through the housing 10 and communicates with at least one accommodating cavity 130. For example, a sound - conducting hole 140 may be provided on the accommodating bottom wall 132 of each accommodating cavity 130. The sound - conducting hole 140 may penetrate through the accommodating bottom wall 132 to communicate the internal space of the housing 10 with the external space. In some embodiments, the aperture diameter of the sound - conducting hole 140 on the inner wall of the housing 10 may be smaller than the aperture diameter of the sound - conducting hole 140 on the outer wall of the housing 10. The aperture diameter here refers to the opening diameter of the sound - conducting hole on the wall surface. That is to say, the sound - conducting hole 140 may be in the shape of a horn with a larger outer diameter and a smaller inner diameter. By designing the sound - conducting hole 140 in the shape of a horn, on the one hand, it is convenient for users to clean foreign matters such as solids or liquids entering the sound - conducting hole 140, and on the other hand, it enables smooth die - drawing during the processing of the sound - conducting hole 140.

[0054] In some embodiments, the central axis of the sound - conducting hole 140 may be inclined with respect to the accommodating bottom wall 132 to prevent water from entering the interior of the housing 10 through the sound - conducting hole 140. Wherein, the central axis of the sound - conducting hole 140 may be the connection line between the center of the first opening of the sound - conducting hole 140 on the inner wall of the housing 10 and the center of the second opening on the outer wall of the housing 10. The inclination angle of the central axis of the second sound - conducting hole 140 with respect to the accommodating bottom wall 132 may be selected according to the design and processing requirements of the product on the premise of not affecting the acoustic performance of the earphone 01. In some embodiments, the value range of the inclination angle may be [30, 90) degrees. Among them, when the inclination angle is in the range of [60, 90) degrees, while ensuring a certain degree of inclination, it also reduces the processing difficulty of the second sound - conducting hole 111 - C. When the inclination angle is in the range of [30, 60] degrees, ensuring that the inclination angle is within this range can further enhance the ability to prevent water from entering the interior of the housing 10 through the sound - conducting hole 140. In some application scenarios, such as swimming, by arranging the sound - conducting hole 140 in an inclined manner, when the earphone 01 is subjected to dynamic water pressure, the water flow will not directly rush into the sound - conducting hole 140, thereby improving the waterproof ability of the earphone 01 under dynamic water pressure. The shape of the sound - conducting hole 140 may be any shape such as circular, oval, square, rectangular, L - shaped, etc. The present specification does not limit the shape of the sound - conducting hole 140 here.

[0055] In some embodiments, the earphone 01 may include at least one receiving cavity 130 for receiving a plurality of components respectively, such as at least one waterproof acoustic module 20. In some embodiments, the receiving cavity 130 may include a first receiving cavity and a second receiving cavity. The first receiving cavity may include a first sound passing hole, and the second receiving cavity may include a second sound passing hole. The first receiving cavity may be provided on the bottom wall 110 of the housing. The second receiving cavity may be provided on the side wall 120 of the housing so that the sound passing holes 140 in different receiving cavities can receive sounds in different directions or transmit sounds in different directions. In some embodiments, the first receiving cavity and the second receiving cavity may both be provided on the bottom wall 110 or the side wall 120 of the housing to enhance the ability of the sound passing holes 140 to receive sounds in the same direction or transmit sounds in the same direction.

[0056] At least one waterproof acoustic module 20 may be disposed in at least one receiving cavity 130 and cover at least one sound passing hole 140 to prevent liquid from entering the internal space of the housing 10 through at least one sound passing hole 140. Figure 2A The schematic diagram of the waterproof acoustic module 20 provided according to some embodiments of the present specification installed in the receiving cavity 130 is shown. Figure 2B The schematic diagram of the waterproof acoustic module 20 provided according to some embodiments of the present specification is shown. Figure 2C Shown in the present specification Figure 2B The B-B cross-sectional view of the waterproof acoustic module 20 shown. Wherein, the waterproof acoustic module 20 may include a base 210, a waterproof component 220, an acoustic component 230, and a communication hole 240.

[0057] As Figure 2A shown, the overall shape of the base 210 may be adapted to the receiving space of the receiving cavity 130 for installation in the receiving cavity 130. As Figure 2CAs shown, the base 210 may include a base sidewall 211 and a base bottom wall 212. The base sidewall 211 and the base bottom wall 212 form a base accommodation cavity 213 to accommodate other components (such as a waterproof component 220, an acoustic component 230, etc.). The base 210 may be provided with a communication hole 240. The communication hole 240 may penetrate through the base bottom wall 212 and communicate with the base accommodation cavity 213. For example, the communication hole 240 may be provided on the base bottom wall 212. After the base 210 is installed in the accommodation cavity 130, the communication hole 240 may communicate with the sound transmission hole 140 on the accommodation cavity 130 to ensure that sound can be transmitted into or out of the two holes. In some embodiments, the openings of the communication hole 240 and the sound transmission hole 140 on the wall surface of the accommodation bottom wall 132 facing the base 210 are not coaxial. In some embodiments, the communication hole 240 may be coaxial with the opening of the sound transmission hole 140 on the wall surface of the accommodation bottom wall 132 facing the base 210, so that the sound transmission path is the shortest and the earphone 01 has good acoustic performance. Among them, the communication hole 240 may be coaxial with the opening of the sound transmission hole 140 on the wall surface of the accommodation bottom wall 132 facing the base 210, which may mean that the central axis of the communication hole 240 coincides with the central axis of the opening of the sound transmission hole 140 on the wall surface of the accommodation bottom wall 132 facing the base 210.

[0058] As Figure 2C As shown, the waterproof component 220 may be installed in the base accommodation cavity 213, be hermetically connected to the base accommodation cavity 213 and cover the communication hole 240, thereby preventing liquid (water) from entering the base accommodation cavity 213 through the communication hole 240. The acoustic component 230 may be placed on the side of the waterproof component 220 away from the base bottom wall 212.

[0059] In some embodiments, the waterproof component 220 may include a waterproof film 221 and a buffer member 222. Among them, the waterproof film 221 may allow air to pass through and block water from passing through. A central hole 222-A may be formed in the buffer member 222. The buffer member 222 may be in contact with the edge region of the waterproof film 221. Specifically, the non-aperture edge region of the buffer member 222 is in contact with the edge region of the waterproof film 221. In some embodiments, the openings of the central hole 222-A and the sound passage hole 140 on the inner wall of the housing 10 are not coaxial. In some embodiments, the openings of the central hole 222-A and the sound passage hole 140 on the inner wall of the housing 10 may be coaxial, so that the waterproof film 221 can uniformly receive the water pressure of the water flowing in from the sound passage hole 140, so that the waterproof film 221 is not easily damaged due to uneven water pressure, resulting in a reduction or even failure of the waterproof effect of the waterproof component 220. Among them, the openings of the central hole 222-A and the sound passage hole 140 on the inner wall of the housing 10 being coaxial may mean that the central axis of the central hole 222-A coincides with the central axis of the opening of the sound passage hole 140 on the inner wall of the housing 10. The shape of the central hole 222-A may be any shape such as circular, oval, square, rectangular, etc., and the present specification does not limit the shape of the central hole 222-A here. In some embodiments, the shape of the central hole 222-A may be adapted to the shape of the sound passage hole 140, and the aperture of the sound passage hole 140 may be less than or equal to the aperture of the central hole 222-A, so that a larger area of the waterproof film 221 can bear the water pressure and is not easily damaged. Among them, the aperture mentioned here refers to the diameter of the hole.

[0060] In some embodiments, the waterproof component 220 may have an adhesive surface, so that after the waterproof component 220 is placed in the base accommodation cavity 213, the adhesive surface can be bonded to the bottom wall 212 of the base, thereby realizing the sealed connection between the two and fixing the waterproof component 220. For example, the waterproof component 220 may have a first adhesive surface 222-B and a second adhesive surface 222-C. Among them, the first adhesive surface 222-B may bond the waterproof component 220 in the base accommodation cavity 213 after being subjected to an external pressure. The external pressure may be the gravity of the acoustic component 230 or the pressure applied by a pressure jig. The second adhesive surface 222-C may seal and bond the waterproof component 220 and the acoustic component 230 when the waterproof component 220 and the acoustic component 230 are in contact.

[0061] Specifically, the waterproof component 220 may have two buffer members 222, which are distributed on both sides of the waterproof film 221. The two surfaces of the buffer member 222 facing the base accommodation cavity 213 and the acoustic component 230 may have adhesiveness. By providing the adhesive surface, the waterproof component 220 is fixed in the base accommodation cavity 213 by bonding, achieving the waterproof effect while ensuring the simplicity and convenience of the operation process.

[0062] Further, the buffer member 222 can also be elastic. The buffer member 222 can evenly disperse the high-speed physical pressure (impact energy) received by the waterproof component 220. Thus, during the installation process of the waterproof component 220, the buffer member 222 can protect the waterproof film 221 from wrinkling due to a large impact, thereby affecting its waterproof performance and acoustic performance. In some embodiments, the buffer member 222 can be a foam adhesive or an elastic acrylic adhesive or a foam substrate + elastic acrylic adhesive. In some embodiments, the thickness range of a single buffer member 222 is greater than or equal to 0.1 mm. When the buffer member 222 has a certain thickness, it can increase the height / thickness of the waterproof component 220, so that the waterproof component 220 adapts to the assembly space reserved by the housing 10, for example, adapts to the depth of the base accommodation cavity 213. And when the buffer member 222 has a certain thickness, it can increase the deformability of the waterproof component 220, so as to be able to adapt to the manufacturing errors of different base accommodation cavities 213 and make it easier to assemble the waterproof component 220 into the base 210.

[0063] The acoustic component 230 includes an acoustic sensor 231 and a circuit board 232. The acoustic sensor 231 is disposed on a side of the waterproof component 220 away from the base bottom wall 212. The circuit board 232 can be disposed between the acoustic sensor 231 and the waterproof component 220.

[0064] The acoustic sensor 231 can include a sound transmission hole 231-A. In some embodiments, the acoustic sensor 231 can include at least one microphone. The microphone can receive ambient sound passing through the waterproof component 220 through the sound transmission hole 231-A. In some embodiments, the acoustic sensor 231 can include at least one speaker. When the speaker works, it can emit a target sound. The target sound can pass through the sound transmission hole 231-A and then pass through the waterproof component 220 to be transmitted out of the earphone 01. The waterproof component 220 covers the communication hole 240 to prevent water from contacting the acoustic sensor 231 through the waterproof component 220.

[0065] The circuit board 232 can be mechanically connected to the acoustic sensor 231. The mechanical connection mentioned herein can be bonding, welding, seaming connection, riveting, etc. For example, the acoustic sensor 231 can be fixed on the circuit board 232 by welding. As mentioned above, the acoustic component 230 can be bonded to the waterproof component 220 through the second bonding surface 222-C. Specifically, the circuit board 232 can be bonded to the waterproof component 220 through the second bonding surface 222-C. In some embodiments, pressure can be further applied to the acoustic component 230 so that the circuit board 232 can be bonded to the second bonding surface 222-C more firmly. For example, the acoustic component 230 is pressed down by a pressure jig to apply pressure to it. For another example, a heavy object is placed on the acoustic component 230 to apply pressure to it.

[0066] In some embodiments, the circuit board 232 may be at least partially located within the base accommodation cavity 213. In some embodiments, the circuit board 232 may also be located outside the base accommodation cavity 213. For example, the circuit board 232 may be located outside the base accommodation cavity 213 and abut against the top surface of the base sidewall 211.

[0067] In some embodiments, the circuit board 232 may be flush with the edge of the base 210. For example, as Figure 2A shown, the edge of the circuit board 232 is flush with the edge of the base sidewall 211. In some embodiments, the coverage area of the circuit board 232 may exceed the base 210. Figure 3 FIG. shows a schematic structural diagram of another waterproof acoustic module 20 provided according to an embodiment of the present specification. As Figure 3 shown, the right side of the circuit board 232 extends beyond the edge of the base sidewall 211. The protruding portion of the circuit board 232 may extend beyond the base sidewall 211 and then be bent to contact the bottom wall 110 or the sidewall 120 of the housing. By designing the circuit board 232 to extend beyond the base 210, it is convenient to connect the waterproof acoustic modules 20 in the case of multiple waterproof acoustic modules 20.

[0068] In some embodiments, a plurality of positioning holes 232-A may be provided on the circuit board 232, and a plurality of corresponding positioning protrusions 232-B may be provided on the top surface of the base sidewall 211. By providing the positioning holes 232-A and the positioning protrusions 232-B, it is possible to facilitate the relative setting of the sound transmission holes 231-A and the central holes 222-A of the buffer member 222, so as to ensure the shortest sound transmission path and ensure that the earphone 01 has good acoustic performance. Among them, the number of the positioning protrusions 232-B and the positioning holes 232-A may be Figure 2B 3 as shown. The present specification does not limit the number of the positioning protrusions and the positioning holes here. In some embodiments, the plurality of positioning protrusions 232-B may be approximately evenly distributed around the waterproof component 220 or the acoustic sensor 231, so as to facilitate positioning. For example, Figure 2B the connection lines of the 3 positioning protrusions 232-B in form a triangle and are approximately evenly distributed around the acoustic sensor 231.

[0069] In some embodiments, the positioning protrusion 232-B may be cylindrical, as Figure 2B shown. In some embodiments, the positioning protrusion 232-B may also be frustum-shaped with a narrow top and a wide bottom, so as to avoid interference with the positioning hole 232-A during installation. In some embodiments, the positioning protrusion 232-B includes a column body and an enlarged column head. Among them, the column body is inserted into the corresponding positioning hole 232-A.

[0070] In some embodiments, the circuit board 232 may be a Printed Circuit Board (PCB for short). The PCB is not easily bent and has a certain hardness, so it can well support the acoustic sensor 231.

[0071] In some embodiments, the circuit board 232 may be a Flexible Printed Circuit (FPC for short). As mentioned above, in order to enhance the local thickness or hardness of the FPC and ensure the flatness of the FPC, local or overall strengthening treatment can be performed on the FPC. In some embodiments, the acoustic component 230 may further include a steel plate or a PI (Polymide, PI for short) material as a reinforcing plate 233 to reinforce the FPC. Among them, the PI material is an engineering plastic with excellent mechanical properties, having the characteristics of light weight, thin thickness, and good bendability. The reinforcing plate 233 for enhancing the strength of the circuit board 232 may be located between the circuit board 232 and the waterproof component 220, as Figure 2C shown. The reinforcing plate 233 may be in contact with the top surface of the base side wall 211. In some embodiments, the thickness range of the reinforcing plate 233 may be 0.05 mm to 0.5 mm to reduce the occupied space while ensuring the strength of the circuit board 232 is enhanced.

[0072] Therefore, a plurality of positioning holes 232-A may be provided on the reinforcing plate 233. As Figure 2B shown, 3 positioning holes 232-A are provided on the reinforcing plate 233 and the 3 positioning holes 232-A are approximately evenly distributed in a triangular shape around the acoustic sensor 231.

[0073] In some embodiments, the positioning protrusion 232-B is made of a heat-melting material, and the end of the positioning protrusion 232-B forms a swollen head after being heat-melted and pressed. The method of heat-melting and pressing is used to form a structure similar to a rivet for the positioning protrusion 232-B. This not only has simple operation and high efficiency, but also the heat-melting material seals the gap between the positioning protrusion 232-B and the positioning hole 232-A at the same time, eliminating the need for re-sealing the gap between the positioning protrusion 232-B and the positioning hole 232-A, with simple operation, high efficiency, and reduced costs.

[0074] Figure 4A Shows a schematic structural diagram of the waterproof acoustic module 20 and the accommodating cavity 130 provided according to some embodiments of the present specification. Figure 4B Shows another A-A cross-sectional view of the earphone 01 shown in FIG. 1 of the present specification. Figure 4C Shows provided according to the present specification Figure 4B The enlarged view of part C shown.

[0075] To reduce the assembly difficulty between the waterproof acoustic module 20 and the accommodating cavity 130, the size of the waterproof acoustic module 20 can be slightly smaller than that of the accommodating cavity 130. Therefore, there can be a gap between the waterproof acoustic module 20 and the accommodating sidewall 131. In some embodiments, a second gap I2 is formed between the base sidewall 211 and the accommodating sidewall 131, as Figure 4A shown. The second seal 40 for sealing the second gap I2 can be obtained by providing a fluid sealing material to the second gap and then curing it. For example, the second seal 40 is silicone, hot melt adhesive, UV adhesive, etc. The above-mentioned sealants all have the advantages of strong adhesion, low pollution, and fast curing.

[0076] In some embodiments, after the waterproof acoustic module 20 is installed in the accommodating cavity 130, the base bottom wall 212 of the base 210 abuts against the accommodating bottom wall 132 and forms a first gap I1, as Figure 4A shown. The first gap I1 can be sealed using the first seal 30.

[0077] In some embodiments, the first seal 30 can be a prefabricated gasket. The first seal 30 is pre-bonded to the accommodating bottom wall 132, and then the waterproof acoustic module 20 is placed on the first seal 30 to fix the waterproof acoustic module 20 in the accommodating cavity 130. In some embodiments, the gasket can be double-sided tape, foam adhesive, or a foam substrate + double-sided tape.

[0078] As described above, the accommodating sidewall 131 and the accommodating bottom wall 132 of the accommodating cavity 130 can be formed inside the housing 10. In some embodiments, the accommodating bottom wall 132 can include a first step. As Figure 4B shown, the first step can divide the accommodating bottom wall 132 into a first bottom wall 132-A and a second bottom wall 132-B. Among them, the communication hole 240 penetrates through the first bottom wall 132-A and communicates with the accommodating cavity 130. The base 210 can abut against the second bottom wall 132-B. The above-mentioned first gap I1 can be formed between the base 210 and the first bottom wall 132-A. The first seal 30 can be in the first gap I1 and seal the first gap I1. At this time, the first seal 30 can be obtained by providing a fluid sealing material to the first gap I1 and then curing it.

[0079] Since the fluid sealing material may enter the sound passage hole 140 during the flowing process, resulting in partially or completely filling the sound passage hole 140, thereby affecting the sound inlet. And when the sound passage hole 140 is inclined, it is more difficult to clean the fluid sealing material flowing into the hole. In some embodiments, by providing a limiting portion on the base bottom wall 212 and the accommodating bottom wall 132, the fluid sealing material can be prevented from flowing into the sound passage hole 140.

[0080] In some embodiments, a first limiting portion 212-A is circumferentially arranged along the communication hole 240 on the bottom wall 212 of the base; a second limiting portion is circumferentially arranged along the sound transmission hole 240 on the accommodating bottom wall 132. For example, as Figure 4B shown, a first limiting portion 212-A is arranged in a circle along the orifice of the communication hole 240 on the bottom wall 212 of the base. A second limiting portion 212-B is arranged in a circle along the orifice of the sound transmission hole 140 on the accommodating bottom wall 132. Among them, a first limiting portion 212-A is provided on the side of the bottom wall 212 of the base facing the accommodating cavity 130. The first limiting portion 212-A and the first limiting portion 212-B cooperate and abut against each other, thereby preventing the fluid sealing material from flowing into the sound transmission hole 140. By providing a first limiting portion 212-A in a circle and a second limiting portion 212-B in a circle, all the paths through which the fluid sealing material can flow into the sound transmission hole 140 are blocked.

[0081] In some embodiments, the first limiting portion 212-A includes a groove circumferentially arranged along the communication hole 240 on the bottom wall 212 of the base, and the second limiting portion 251-B includes a second step circumferentially arranged along the sound transmission hole 140 on the accommodating bottom wall 132, as Figure 4B shown. By providing the second step or a similar protrusion, the fluid sealing material is blocked from flowing into the sound transmission hole 140. By providing the corresponding groove, the bottom wall 212 of the base can better abut and cooperate with the second limiting portion 251-B, so as to better block the fluid sealing material from flowing into the sound transmission hole 140. By providing the groove and the second step, not only can the fluid sealing material be prevented from flowing into the sound transmission hole 140, but also a positioning function is achieved when the waterproof acoustic module 20 is placed in the accommodating cavity 130.

[0082] In some embodiments, considering the manufacturing precision error and reducing the assembly difficulty between the waterproof acoustic module 20 and the accommodating cavity 130, the notch of the groove can be slightly larger than the second step. Therefore, a third gap can be formed between the first limiting portion 212-A and the second limiting portion 212-B. Refer to Figure 4C , the third gap can be sealed by a third seal 50. Among them, the third seal 50 can be obtained by providing the fluid sealing material to the third gap and then curing it. In some embodiments, the third sealant 50 can be UV glue, silicone glue or hot melt glue, etc. In some embodiments, if there is an excess amount after the fluid sealing material of the first seal 30 flows into the first gap, the third gap can be further sealed by the first seal 30. The existence of the third gap not only ensures that the fluid sealing material does not flow into the sound transmission hole 140, but also extends the accommodation path of the fluid sealing material, so that more fluid sealing material can be placed between the waterproof acoustic module 20 and the accommodating cavity 130, enhancing the firmness of their connection.

[0083] As described above, the earphone 01 may include at least one waterproof acoustic module 20. In some embodiments, the earphone 01 may also include a single acoustic module 20. In some embodiments, the earphone 01 may also include multiple acoustic modules 20, thereby including multiple acoustic sensors 231 to achieve more functions. Any two circuit boards in the circuit board 232 of the waterproof acoustic module 20 may be connected by a flexible circuit board, thereby connecting two waterproof acoustic modules. Any two circuit boards in the circuit board 232 of the waterproof acoustic module 20 may also be directly connected, thereby connecting two waterproof acoustic modules.

[0084] In some embodiments, the earphone 01 may include two acoustic modules 20, thereby including two acoustic sensors 231. For example, when the acoustic sensor 231 is a microphone, setting two microphones in the earphone can achieve a noise reduction effect. One microphone may be a microphone used for ordinary user calls to collect human voices. The other microphone may have a noise collection function to facilitate the collection of ambient noise.

[0085] As described above, the housing 10 may include two accommodation cavities 130. The two accommodation cavities 130 may respectively accommodate two waterproof acoustic modules 20, a first waterproof acoustic module 20-A and a second waterproof acoustic module 20-B (not shown in the figure). Figure 5 The structural schematic diagram of the first waterproof acoustic module 20-A provided according to some embodiments of the present specification is shown.

[0086] The first waterproof acoustic module 20-A is disposed in the first accommodation cavity 130-A and covers the first sound passage hole 140-A. The first waterproof acoustic module 20-A may include a first acoustic sensor 231-A and a first circuit board 232-A. As described above, the inner wall of the housing 10 may form a first accommodation side wall 130-A1 of the first accommodation cavity 130-A. The height of the first accommodation side wall 130-A1 is higher than the upper surface of the first circuit board 232-A, thereby forming a first accommodation space S1 to accommodate the sealing material. The sealing material may be the above-mentioned sealant.

[0087] The second waterproof acoustic module is disposed in the second accommodation cavity and covers the second sound passage hole. The second waterproof acoustic module may include a second acoustic sensor and a second circuit board. As described above, the inner wall of the housing 10 may form a second accommodation side wall of the second accommodation cavity. The height of the second accommodation side wall may be higher than the upper surface of the second circuit board, thereby forming a second accommodation space to accommodate the sealing material. The structure of the second accommodation space may be similar to the above-mentioned first accommodation space.

[0088] Among them, the first circuit board and the second circuit board may be directly connected or connected by another flexible circuit board, thereby realizing the connection between the first waterproof acoustic module and the second waterproof acoustic module.

[0089] In some embodiments, both the first circuit board 232-A and the second circuit board may be the circuit board 232 that extends beyond the edge of the base sidewall 211 as described above. Therefore, the extended portions of the first circuit board 232-A and the second circuit board can cross their respective base sidewalls 211, and after being bent, they can contact at the bottom wall 110 or the sidewall 120 of the housing. In some embodiments, the first circuit board 232-A and the second circuit board can be in contact, and the contact portions can be directly welded together. In some embodiments, when the first circuit board 232-A and the second circuit board are PCBs, they can also be electrically connected through a board-to-board connector (abbreviated as BTB connector). In some embodiments, the portions of the first circuit board 232-A and the second circuit board extending outside the base sidewall 211 cannot contact each other. The two circuit boards 232 can be connected through another connecting circuit board. Among them, the connecting circuit board can be an FPC or a PCB.

[0090] As described above, the first circuit board 232-A can be an FPC and the right side of the first circuit board 232-A can extend beyond the edge of the corresponding base sidewall. Therefore, when the height of the first accommodating sidewall 130-A1 is higher than the upper surface of the first circuit board 232-A, the first circuit board 232-A needs to be bent within the first accommodating cavity 130-A, extend out of the first accommodating cavity 130-A, cross the first accommodating sidewall 130-A1, and then be bent to the bottom wall 110 / sidewall 120 of the housing to be connected to the connecting circuit board or the second circuit board.

[0091] Figure 6 The schematic diagram of the first accommodating sidewall 130-A1 provided according to some embodiments of the present specification is shown. Figure 6 The portion of the first circuit board 232-A that extends beyond the edge of the first base sidewall 130-A1 is not shown. To reduce the degree of bending of the first circuit board 232-A when crossing the first accommodating cavity 130-A and prevent the first circuit board 232-A from being damaged due to excessive bending at the first accommodating sidewall 130-A1, a target segment 131-A as shown in Figure 6 can be provided on the first accommodating sidewall 130-A1. The first circuit board 232 can cross the first accommodating sidewall 130-A1 from the target segment 131-A of the first accommodating sidewall 130-A1.

[0092] The target section 131-A may have a gentler design compared to other parts of the first accommodating sidewall 130-A1, thereby reducing the bending degree of the first circuit board 232-A at the first accommodating sidewall 130-A1, and further improving the lifespan of the first circuit board 232-A. For example, the edges and corners of other parts of the first accommodating sidewall 130-A1 are all sharp right angles, and a gentler design of the target section 131-A can be that the edges and corners are rounded. For another example, the edges and corners of other parts of the first accommodating sidewall 130-A1 are rounded corners with a small angle, and a gentler design of the target section 131-A can be rounded corners with a larger angle. For still another example, the height difference between other parts of the first accommodating sidewall 130-A1 and the inner wall of the housing 10 is relatively high, and a gentler design of the target section 131-A can be that the height difference between it and the inner wall of the housing 10 is smaller, and there is a ramp support between it and the inner wall of the housing 10. As Figure 6 shown, the target section 131-A may include a guiding opening 131-a1 formed in the first accommodating sidewall 130-A1 and an inclined guiding surface 131-a2. Among them, the upper surface of the first circuit board 232-A can be flush with the upper surface of the guiding opening 131-a1, so that the first circuit board 232-A does not need to be bent to cross the first accommodating sidewall 130-A1. The guiding opening 131-a1 and the inner wall of the housing 10 can be connected through the inclined guiding surface 131-a2. Since there is a certain height difference between the guiding opening 131-a1 and the inner wall of the housing 10, setting the guiding surface 131-a2 can support the circuit board 232, prevent the circuit board 232 from being suspended, and reduce the risk of damage to the circuit board 232.

[0093] In some embodiments, the bending degree of the first circuit board 232-A at the sidewall section of the first accommodating sidewall 130-A1 can be measured by the bending angle of the first circuit board 232-A. The smaller the bending angle, the lower the bending degree. For example, when the bending angle is an acute angle, the bending degree is lower than when the bending angle is a right angle. When there is no guiding surface 131-a2, the first circuit board 232-A needs to bend at a right angle along the first accommodating sidewall 130-A1. As Figure 6 shown, due to the setting of the inclined guiding surface 131-a2, when the first circuit board 232-A bends downward, a sharp bending angle can be avoided. With the support of the guiding surface 131-a2, the bending angle of the first circuit board 232-A is an acute angle and the angle is very small. In some embodiments, compared with the right-angle design of other sections, a rounded-corner design can be adopted at the target section 131-A, so that when the first circuit board 232-A passes over the first accommodating sidewall 130-A1, it can bend along the rounded corner and will not have a direct bend, thereby reducing the damage to the first circuit board 232-A.

[0094] In some embodiments, the second receiving cavity (mainly the second receiving sidewall) for receiving the second waterproof acoustic module may have the same design as the first receiving cavity, which will not be elaborated herein. By providing a target section on the second receiving sidewall, when the second circuit board is bent, a sharp bending angle can be avoided, thereby reducing the damage to the second circuit board.

[0095] As described above, the waterproof acoustic module 20 is made into a standard component that is separated from the housing 10, and the acoustic module 20 has been treated against liquid (water). Therefore, the overall sensitivity of the acoustic module 20 is basically fixed. By providing a separate acoustic module 20, the sensitivity difference of the earphone 01 can be flexibly adjusted, and the sensitivity consistency of different earphones 01 can be improved. That is, it can ensure that the difference between the sensitivity differences Sgap of different earphones 01 is within a preset range, thereby ensuring the yield of the earphone 01. Therefore, when the earphone 01 includes two acoustic sensors, at least one of the two acoustic sensors is from the waterproof acoustic module 20. In some embodiments, two acoustic waterproof modules 20 are respectively provided in the earphone 01, so that it is easier to control the sensitivity after the acoustic sensors are assembled, and further ensure the consistency of different earphones 01.

[0096] Figure 7A The line graph of the acoustic sensor sensitivity under Solution A provided according to some embodiments of the present specification is shown.

[0097] Figure 7B The line graph of the acoustic sensor sensitivity under Solution B provided according to some embodiments of the present specification is shown. Taking the example that the earphone 01 is provided with two acoustic sensors, and the two acoustic sensors are microphones (MIC1 and MIC2) for introduction.

[0098] Solution A is the line graph of the sensitivity when the earphone 01 does not use the waterproof acoustic module 20. Figure 7A Among them, three earphones A, B, and C among many earphones are shown. The sensitivity values of MIC1 and MIC2 of each earphone 01 at 200HZ - 4KHZ are shown. Among them, the sensitivity of the microphones of the same earphone 01 is shown by the same broken line. The sensitivity difference between the two microphones is denoted as Sgap. The average value of the sensitivity differences between the two microphones of earphone A is Sgap A . The average value of the sensitivity differences between the two microphones of earphone B is Sgap B . The average value of the sensitivity differences between the two microphones of earphone C is Sgap C . Among them, Sgap A and Sgap B The difference Sgap between them A-B is approximately 1.07dB; Sgap A and Sgap CThe difference Sgap A-C is approximately 1.9 dB; Sgap B and Sgap C The difference Sgap B-C is approximately 0.83 dB. That is to say, if the sensitivity consistency between each headphone needs to be adjusted at this time, the adjustment threshold is at least 1.9 dB.

[0099] Scenario B is the sensitivity line graph when one microphone in headphone 01 comes from the waterproof acoustic module 20 and the other microphone does not come from the waterproof acoustic module 20. Figure 7B shows the sensitivity values of MIC1 and MIC2 of three headphones A', B', and C' among many headphones in the range of 200HZ to 4KHZ. Among them, the sensitivity of the microphones of the same headphone 01 is shown by the same broken line. The sensitivity difference between the two microphones is denoted as Sgap'. The average value of the sensitivity difference between the two microphones of headphone A' is Sgap A '. The average value of the sensitivity difference between the two microphones of headphone B' is Sgap B '. The average value of the sensitivity difference between the two microphones of headphone C' is Sgap C '. Among them, Sgap A ' and Sgap B ' The difference Sgap A ' -B ' is approximately 0.47 dB; Sgap A ' and Sgap C ' The difference Sgap A ' -C ' is approximately 0.85 dB; Sgap B ' and Sgap C ' The difference Sgap B '- C ' is approximately 0.38 dB. That is to say, if the sensitivity consistency between each headphone needs to be adjusted at this time, the adjustment threshold only needs to reach 0.85 dB.

[0100] From the above data, it can be seen that the maximum difference between Sgap' after using at least one waterproof acoustic module 20 (Scenario B) is much smaller than the maximum difference between Sgap after not using the waterproof acoustic module 20 (Scenario A). After detecting and counting the microphone sensitivities of nearly a hundred headphones using Scenario A and nearly a hundred headphones using Scenario B respectively, it is obtained that: the average value of the difference in Sgap of the headphones in Scenario A is approximately 0.83 dB to 2.1 dB. The average value of the difference in Sgap' of the headphones in Scenario B is approximately 0.3 dB to 0.84 dB. Therefore, it can be considered that the headphones 01 after using the waterproof acoustic module 20 have higher consistency and higher yield.

[0101] Therefore, it is not difficult to conclude that when the two microphones of the earphone 01 come from two waterproof acoustic modules 20, that is, when the two waterproof modules 20 are respectively installed inside the housing 10, the above effects can also be achieved. In particular, when two waterproof acoustic modules 20 are respectively installed in the earphone 01, the sensitivities of the two waterproof acoustic modules 20 can be measured respectively. When the difference in sensitivity is too large compared with other earphones 01, any one of the two waterproof acoustic modules 20 can be replaced, so as to adjust the sensitivity difference between the two waterproof acoustic modules 20, and then install the appropriate waterproof acoustic module 20 into the housing 10. Therefore, by making the waterproof acoustic module 20 into a standard part, not only can the waterproof acoustic module 20 be mass-produced, but also the difference between the sensitivity differences of different earphones 01 can be ensured to be within a preset range, ensuring the yield rate of the same batch of earphones 01.

[0102] The specific embodiments of this specification have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve the desired result. Additionally, the processes depicted in the figures do not necessarily require a specific order or a sequential order to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0103] In summary, after reading this detailed disclosure, those skilled in the art will understand that the foregoing detailed disclosure may be presented only by way of example and may not be restrictive. Although not explicitly stated here, those skilled in the art can understand that this specification is intended to encompass various reasonable changes, improvements, and modifications to the embodiments. These changes, improvements, and modifications are intended to be proposed by this specification and are within the spirit and scope of the exemplary embodiments of this specification.

[0104] In addition, certain terms in this specification have been used to describe the embodiments of this specification. For example, "one embodiment", "an embodiment", and / or "some embodiments" mean that the specific features, structures, or characteristics described in connection with that embodiment may be included in at least one embodiment of this specification. Therefore, it should be emphasized and understood that the two or more references to "an embodiment" or "one embodiment" or "alternative embodiments" in various parts of this specification do not necessarily all refer to the same embodiment. Additionally, the specific features, structures, or characteristics may be appropriately combined in one or more embodiments of this specification.

[0105] It should be understood that in the foregoing description of the embodiments of this specification, in order to help understand a feature and for the purpose of simplifying this specification, this specification combines various features in a single embodiment, drawing or its description. However, this does not mean that the combination of these features is necessary. When reading this specification, it is entirely possible for a person skilled in the art to extract some of the features and understand them as separate embodiments. In other words, the embodiments in this specification can also be understood as the integration of multiple secondary embodiments. This is also true when the content of each secondary embodiment is less than all the features of a single aforementioned disclosed embodiment.

[0106] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, articles, etc., cited herein may be incorporated herein by reference in its entirety for all purposes, except for any prosecution document history related thereto, any equivalent that may be inconsistent or conflicting with this document, or any equivalent prosecution document history that may have a limiting effect on the broadest scope of the claims now or later associated with this document. For example, if there is any inconsistency or conflict between the description, definition, and / or use of a term associated with any of the incorporated materials and the term, description, definition, and / or use associated with this document, the term in this document shall control.

[0107] Finally, it should be understood that the embodiments of the application disclosed herein are explanations of the principles of the embodiments of this specification. Other modified embodiments are also within the scope of this specification. Therefore, the embodiments disclosed in this specification are only used as examples and not as limitations. Those skilled in the art can adopt alternative configurations according to the embodiments in this specification to implement the applications in this specification. Therefore, the embodiments of this specification are not limited to the embodiments accurately described in the application.

Claims

1. An earphone, characterized in that, Comprising: A housing, at least one accommodation cavity and at least one sound transmission hole are formed on the inner wall of the housing, the at least one sound transmission hole penetrates through the housing and communicates with the at least one accommodation cavity; and At least one waterproof acoustic module, the waterproof acoustic module includes a communication hole and a waterproof component, the waterproof component is configured to prevent liquid from entering the interior of the waterproof acoustic module through the communication hole, wherein The at least one waterproof acoustic module is disposed in the at least one accommodation cavity and covers the at least one sound transmission hole to prevent the liquid from entering the internal space of the housing through the at least one sound transmission hole.

2. The earphone according to claim 1, wherein, The at least one waterproof acoustic module includes a first waterproof acoustic module and a second waterproof acoustic module, the at least one accommodation cavity includes a first accommodation cavity and a second accommodation cavity, the at least one sound transmission hole includes a first sound transmission hole and a second sound transmission hole, wherein The first waterproof acoustic module is disposed in the first accommodation cavity and covers the first sound transmission hole; The second waterproof acoustic module is disposed in the second accommodation cavity and covers the second sound transmission hole.

3. The earphone according to claim 2, wherein The inner wall of the housing includes a housing bottom wall and a housing side wall; The first accommodation cavity is disposed on the housing bottom wall, the second accommodation cavity is disposed on the housing side wall, and the first waterproof acoustic module and the second waterproof acoustic module are connected by a flexible circuit board.

4. The earphone according to claim 2 or 3, characterized in that, The first waterproof acoustic module and the second waterproof acoustic module respectively include a first acoustic sensor and a second acoustic sensor, and the first acoustic sensor and the second acoustic sensor are microphones or speakers.

5. The earphone according to claim 2, wherein The first waterproof acoustic module and the second waterproof acoustic module respectively include a first circuit board and a second circuit board; The inner wall of the housing forms a first accommodation side wall of the first accommodation cavity and a second accommodation side wall of the second accommodation cavity; The height of the first accommodation side wall is higher than the upper surface of the first circuit board, so as to form a first accommodation space for accommodating a sealing material, and / or, The height of the second accommodation side wall is higher than the upper surface of the second circuit board, so as to form a second accommodation space for accommodating a sealing material.

6. The earphone according to claim 5, wherein The first circuit board and the second circuit board are connected by a flexible circuit board.

7. The earphone according to claim 1, wherein, Each of the accommodation cavities includes an accommodation side wall and an accommodation bottom wall, and each of the sound transmission holes penetrates through the corresponding accommodation bottom wall to communicate the internal space of the housing with the external space: Each of the waterproof acoustic modules includes: A base, including a base side wall, a base bottom wall and the communication hole, the base side wall and the base bottom wall form a base accommodation cavity, the communication hole penetrates through the base bottom wall and communicates with the base accommodation cavity, and the base is hermetically connected to the accommodation cavity; The waterproof component, in the base accommodation cavity and covering the communication hole to prevent liquid from entering the base accommodation cavity through the communication hole; An acoustic component, including an acoustic sensor, the acoustic sensor is disposed on a side of the waterproof component away from the base bottom wall; and A circuit board, located between the acoustic sensor and the waterproof component and mechanically connected to the acoustic sensor.

8. The earphone according to claim 7, wherein It also includes a first seal and a second seal, The bottom wall of the base abuts against the accommodating bottom wall and forms a first gap, and the side wall of the base forms a second gap with the accommodating side wall; and The first seal seals the first gap, and the second seal seals the second gap.

9. The earphone according to claim 8, characterized in that, The first seal is obtained by providing a fluid sealing material to the first gap and then curing it, and / or The second seal is obtained by providing a fluid sealing material to the second gap and then curing it.

10. The earphone according to claim 8, wherein, The first seal is a prefabricated gasket.

11. The earphone according to claim 8, wherein A first limiting portion is circumferentially provided on the bottom wall of the base along the communication hole; and A second limiting portion is circumferentially provided on the accommodating bottom wall along the sound passage hole, and the first limiting portion and the second limiting portion cooperate and abut to form a third gap.

12. The earphone according to claim 11, wherein It further includes a third seal, the third seal seals the third gap, and the third seal is obtained by providing a fluid sealing material to the third gap and then curing it; and The first limiting portion and the second limiting portion cooperate and abut to prevent the fluid sealing material from flowing into the sound passage hole.

13. The earphone according to claim 11, wherein The first limiting portion includes a groove provided on the base along the circumference of the communication hole; and The second limiting portion includes a corresponding protrusion provided on the accommodating bottom wall along the circumference of the sound passage hole.

14. The earphone according to claim 7, wherein The circuit board passes over the accommodating side wall from the target section of the accommodating side wall and then is connected to the flexible circuit board, wherein the target section of the accommodating side wall has a smoother design than other parts of the accommodating side wall to reduce the bending of the accommodating side wall on the circuit board.

15. The earphone according to claim 14, characterized in that, The target section includes a guiding opening provided on the accommodating side wall and an inclined guiding surface, and the guiding opening is connected to the inner wall of the housing through the guiding surface to support the circuit board.

16. The earphone according to claim 1, characterized in that, The aperture of the sound passage hole on the inner wall of the housing is less than or equal to the aperture of the sound passage hole on the outer wall of the housing.

17. The earphone according to claim 1, characterized in that, The central axis of the sound passage hole is inclined with respect to the accommodating bottom wall of the accommodating cavity.

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