Electric tool, power supply device and battery pack
By using 3D printing technology to accurately coat and layer-by-layer protective layers on PCB boards, the problems of low efficiency and material waste in the prior art are solved, and efficient PCB board surface packaging protection is achieved.
Patent Information
- Application Number
- CN202311788977.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-22
- Publication Date
- 2025-07-01
AI Technical Summary
In the prior art, the surface protection of PCB boards adopts manual hand brushing G6 silicone process, which is inefficient and has serious waste of materials, making it difficult to achieve automated operations.
3D printing technology is used to accurately coat the PCB board, and the protective layer is stacked layer by layer, and the manual glue brushing process is replaced by automated equipment.
It greatly improves protection efficiency, reduces material waste, and achieves efficient PCB board surface packaging protection.
Smart Images

Figure CN120239189A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to an electric control device, and more particularly to a power tool, a power supply device, and a battery pack. Background Art
[0002] Printed Circuit Boards (PCBs) are widely used in electric control devices. After the PCB is manufactured, its surface needs to be protected. Currently, the surface protection of the PCB of the product adopts the process of manually brushing G6 silicone glue. This method is inefficient, wastes a lot of glue materials, and the excess glue needs to be removed at the appearance inspection station, resulting in more material waste and making it difficult to achieve automated operation. Summary of the Invention
[0003] One object of the present application is to solve or at least alleviate some or all of the above problems. To this end, one object of the present application is to provide a power tool, a power supply device, and a battery pack.
[0004] To achieve this object, the present invention adopts the following technical solutions:
[0005] A power tool, comprising:
[0006] A motor including a drive shaft that rotates about a drive axis;
[0007] An output part driven by the motor to output power;
[0008] A housing that houses the motor;
[0009] At least one PCB electrically connected to the motor, and at least part of at least one of the PCBs is covered with a 3D printed protective layer.
[0010] In some embodiments, the thickness of the 3D printed protective layer is greater than or equal to 20 μm and less than or equal to 2000 μm.
[0011] In some embodiments, the thickness of the 3D printed protective layer covering at least two regions on the PCB is different.
[0012] In some embodiments, any region of the PCB is covered with a 3D printed enclosure layer.
[0013] In some embodiments, a protective layer different from the 3D printed protective layer can be covered within the region enclosed by the enclosure layer.
[0014] In some embodiments, the 3D printed protective layer is formed on the PCB by multiple spray coatings.
[0015] In some embodiments, the thickness of a single spray coating is greater than or equal to 20 μm.
[0016] A power supply device, comprising:
[0017] An installation shell having an installation cavity;
[0018] A first connection terminal disposed in the installation shell for electrical connection with an external power supply;
[0019] A second connection terminal disposed in the installation shell for power output;
[0020] At least one PCB board electrically connected to both the first connection terminal and the second connection terminal, and at least part of at least one of the PCB boards is covered with a 3D printed protective layer.
[0021] In some embodiments, the thickness of the 3D printed protective layer covering at least two regions on the PCB board is different.
[0022] In some embodiments, any region of the PCB board is covered with a 3D printed enclosure layer.
[0023] In some embodiments, a protective layer different from the 3D printed protective layer can be covered in the region enclosed by the enclosure layer.
[0024] In some embodiments, the 3D printed protective layer is formed on the PCB board by multiple spray coatings.
[0025] In some embodiments, the thickness of a single spray coating is greater than or equal to 20 μm.
[0026] A battery pack, comprising:
[0027] A housing having an accommodation cavity;
[0028] A battery cell disposed in the accommodation cavity;
[0029] At least one PCB board electrically connected to the battery cell, and at least part of at least one of the PCB boards is covered with a 3D printed protective layer.
[0030] In some embodiments, the thickness of the 3D printed protective layer covering at least two regions on the PCB board is different.
[0031] In some embodiments, any region of the PCB board is covered with a 3D printed enclosure layer.
[0032] In some embodiments, a protective layer different from the 3D printed protective layer can be covered in the region enclosed by the enclosure layer.
[0033] In some embodiments, the 3D printed protective layer is formed on the PCB board by multiple spray coatings.
[0034] In some embodiments, the thickness of the single-layer spraying is less than or equal to 30 μm.
[0035] The advantages of this application are as follows:
[0036] A PCB board is used as a control unit in an electric tool, a power supply device, and a battery pack provided by this application. When a 3D printing protective layer is covered on the PCB board, an automated device is used to precisely coat the areas on the PCB board that need protection, and the 3D printing protective layer can be stacked layer by layer, replacing the manual gluing process, greatly improving the efficiency and reducing the waste of materials. BRIEF DESCRIPTION OF THE DRAWINGS
[0037] Figure 1 is a schematic diagram of an electric tool according to an embodiment of this application;
[0038] Figure 2 is a schematic diagram of a power supply device according to an embodiment of this application;
[0039] Figure 3 is a schematic diagram of another power supply device according to an embodiment of this application;
[0040] Figure 4 is a schematic diagram of yet another electric tool according to an embodiment of this application;
[0041] Figure 5 is a schematic diagram of a battery pack according to an embodiment of this application;
[0042] Figure 6 is a schematic diagram of a PCB board according to an embodiment of this application.
[0043] In the figure:
[0044] 100, electric tool; 10, housing; 11, output part; 200, power supply device; 20, mounting shell; 21, first connection terminal; 22, second connection terminal; 300, battery pack; 30, housing; 31, power terminal; 32, communication terminal; 4, PCB board; 41, enclosure layer. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0045] Before explaining any embodiment of this application in detail, it should be understood that this application is not limited to the structural details and component arrangements set forth in the following description or shown in the above drawings.
[0046] In this application, the terms "comprise", "include", "have" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element.
[0047] In this application, the term "and / or" describes the relationship between associated objects and indicates that three relationships can exist. For example, A and / or B can represent three cases: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, in this application, the character " / " generally indicates that the associated objects before and after are in an "and / or" relationship.
[0048] In this application, the terms "connect", "combine", "couple", "mount" can be direct connection, combination, coupling or mounting, or can be indirect connection, combination, coupling or mounting. Among them, by way of example, direct connection means that two parts or components are connected together without the need to set up an intermediate piece, and indirect connection means that two parts or components are respectively connected to at least one intermediate piece, and these two parts or components are connected through the intermediate piece. In addition, "connect" and "couple" are not limited to physical or mechanical connection or coupling, and can include electrical connection or coupling.
[0049] In this application, those of ordinary skill in the art will understand that relative terms used in combination with a quantity or condition (such as "about", "approximately", "substantially", etc.) are intended to include the stated value and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances caused by manufacturing, assembly, use, etc. associated with a particular value. Such terms should also be considered to disclose a range defined by the absolute values of two endpoints. Relative terms may refer to a plus or minus a certain percentage (such as 1%, 5%, 10% or more) of the indicated value. A numerical value without using a relative term should also be disclosed as a specific value with a tolerance. In addition, when expressing a relative angular position relationship (such as substantially parallel, substantially perpendicular), "substantially" may refer to a plus or minus a certain number of degrees (such as 1 degree, 5 degrees, 10 degrees or more) based on the indicated angle.
[0050] In this application, those of ordinary skill in the art will understand that the functions performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the functions performed by a part can also be performed by one part, one component, or a combination of multiple parts.
[0051] In this application, the orientation terms such as "upper", "lower", "left", "right", "front", and "rear" are described based on the orientation and positional relationship shown in the drawings, and should not be construed as limiting the embodiments of this application. In addition, in the context, it should also be understood that when it is mentioned that one element is connected "above" or "below" another element, it can not only be directly connected "above" or "below" another element, but also be indirectly connected "above" or "below" another element through an intermediate element. It should also be understood that the orientation terms such as the upper side, the lower side, the left side, the right side, the front side, and the rear side not only represent the positive orientation, but can also be understood as the side orientation. For example, the lower side can include directly below, lower left, lower right, lower front, and lower rear, etc.
[0052] In this application, the terms "device", "module", or "unit" can be implemented in the form of hardware or software in order to achieve a specific function.
[0053] In this application, the terms "calculate", "judge", "control", "determine", "identify", etc. refer to the operations and processes of a computer system or a similar electronic computing device (for example, a controller, a processor, etc.).
[0054] As Figure 1 and Figure 6 shown, the present invention provides a power tool. In Figure 1Among them, the power tool 100 is a drill. However, it should be understood that the present application is not limited to the disclosed embodiments, but can be applied to other types of power tools 100, such as electric drills, pruning machines, sanders, etc. Alternatively, the power tool 100 can also be a bench-type tool, such as a table saw, a miter saw, etc. Alternatively, the power tool 100 can also be a walk-behind power tool, such as a walk-behind lawn mower, a walk-behind snow blower. Alternatively, the power tool 100 can also be a ride-on power tool, such as a ride-on lawn mower, a ride-on vehicle, an all-terrain vehicle, etc. Alternatively, the power tool 100 can also be a robotic tool, such as a lawn mowing robot, a snow blowing robot, etc. In some embodiments, the power tool 100 can be a drill, an electric vehicle, etc. In some embodiments, the power tool 100 can also be a gardening tool, such as a pruning machine, a blower, a lawn mower, a chain saw, etc. Alternatively, the power tool 100 can also be a decoration tool, such as a screwdriver, a nail gun, a circular saw, a sander, etc. In some embodiments, the power tool 100 can also be a vegetation care tool, such as a weed trimmer, a lawn mower, a pruning machine, a chain saw, etc. Alternatively, the power tool 100 can also be a cleaning tool, such as a blower, a snow blower, a washer, etc. Alternatively, the power tool 100 can also be a drilling tool, such as a drill, a screwdriver, a wrench, a jackhammer, etc. Alternatively, the power tool 100 can also be a sawing tool, such as a reciprocating saw, a jigsaw, a circular saw, etc. Alternatively, the power tool 100 can also be a bench-type tool, such as a table saw, a miter saw, a metal cutting machine, a router, etc. Alternatively, the power tool 100 can also be a grinding tool, such as an angle grinder, a sander, etc. Alternatively, the power tool 100 can also be other tools, such as a processing machine tool, a fan, etc.
[0055] The power tool 100 includes a motor, an output part 11, a housing 10, and at least one PCB board 4. The motor includes a drive shaft that rotates about a drive axis; the output part 11 is driven by the motor to output power; the housing 10 is used to house the motor, and at least one PCB board 4 is electrically connected to the motor. In the present embodiment, the PCB board can be a motor control board or a control board for other additional functions in the power tool 100, such as a lighting circuit board, a switch circuit board, etc. Here, the motor control board is taken as an example for illustration. A variety of electronic components on the PCB board that can be electrically coupled to the motor control circuit can at least control the start, stop, forward and reverse rotation, and speed of the motor, so as to drive the output part 11 to output driving force to drive the tool accessory to work, such as driving a drill bit to drill holes. As the control center of the power tool 100, there are many electronic components on the PCB board 4. Therefore, during the manufacturing process, the surface needs to be protected. At present, the surface protection of the PCB board 4 of the product adopts the process of manually brushing G6 silicone by hand. This method has low efficiency, wastes a lot of glue materials, and the redundant glue needs to be removed at the appearance inspection station, resulting in a relatively complex process.
[0056] In order to solve the above problems, in the embodiment of the present application, automated equipment is used to adopt 3D printing technology to accurately coat the areas that need to be protected on the PCB board 4, and the 3D printed protective layer can be stacked layer by layer, replacing the manual glue brushing process, greatly improving efficiency and reducing material waste.
[0057] In one embodiment, an image or graphic of the spraying area of the PCB board to be sprayed with the protective layer can be pre-set in the 3D printing automation equipment. After the PCB board is prevented from being in the preset position, the automation equipment can respond to the printing operation to spray the protective material to the area to be protected. In this embodiment, the spraying accuracy of the automation equipment when 3D printing the protective layer can reach 0.3mm or higher. This application does not explain too much about the automation equipment that implements the automated 3D printing technology.
[0058] In this embodiment, a 3D printed protective layer can be applied to at least one PCB board in the power tool 100. For example, the PCB board to which the 3D printed protective layer is applied can be selected based on the complexity of the component arrangement on the PCB board or the number of components.
[0059] In one embodiment, the thickness of the 3D printed protective layer is greater than or equal to 20μm and less than or equal to 2000μm, or greater than or equal to 30μm and less than or equal to 1000μm, or greater than or equal to 20μm and less than or equal to 500μm, or greater than or equal to 20μm, for example, 32μm, 31μm, 32μm, 35μm...50μm, 51μm, 52μm... In one embodiment, the thickness of the 3D printed protective layer is greater than 25μm or greater than or equal to 35μm, etc. By adopting 3D printing technology, UV-LED (ultraviolet light emitting diode) cures and stacks the glue layer by layer to achieve three protections (anti-mold, anti-moisture, anti-salt spray) and potting and other protective effects. Moreover, by accurately controlling the thickness of the 3D printed protective layer, the packaging protection effect is ensured while saving the use of glue. Moreover, after UV-LED printing, it is immediately cured and formed to form a 3D printed protective layer in 3D form, without waiting for curing, shielding, carriers and other processes. Moreover, two layers of spraying can meet general requirements and achieve thin layer coating.
[0060] In some embodiments, at least two areas on the PCB board 4 are covered with a 3D printed protective layer of different thicknesses. The PCB board 4 can be divided into different functional areas according to actual needs, and the thickness of the 3D printed protective layer is set according to different functional areas, so as to meet the requirements of flexible packaging and protection of different functional areas. Moreover, when the 3D printed protective layer is covered on the PCB board 4, it is precisely sprayed to the position that needs protection, without overflowing glue, splashing, and saving materials.
[0061] In some embodiments, any area of the PCB board 4 is covered with a 3D-printed enclosure layer 41. By printing the enclosure layer 41, adjacent components in different functional areas can be separated, so that when the functional areas are covered and encapsulated subsequently, it is ensured that the glue is only within the area formed by the enclosure layer 41 and will not flow to other functional areas, ensuring the smooth progress of the encapsulation process. When printing the enclosure layer 41, the height of the enclosure layer 41 needs to be set according to the height and spacing of the components arranged on the PCB board 4. After the enclosure layer 41 is printed, the area enclosed by the enclosure layer 41 is filled. Moreover, the enclosure layer 41 can achieve waterproof sealing, so that the chassis can be cancelled.
[0062] In some embodiments, a protective layer different from the 3D-printed protective layer can be covered within the area enclosed by the enclosure layer 41. For the PCB board 4 with higher requirements for local components, after the components are encapsulated by the fence layer, glue with better protective performance can be selected for filling, and for other components, UV glue can be used for covering to achieve different levels of local protection and balance efficiency and reliability.
[0063] In some embodiments, a 3D-printed protective layer is formed on the PCB board 4 by multiple sprays. By stacking multiple sprays, a thicker 3D-printed protective layer can be obtained, forming a 3D shape with a certain mechanical strength to meet the protection needs of products with high protection requirements.
[0064] In some embodiments, the thickness of a single spray is greater than or equal to 20 μm, for example, it can be 25 μm, 28 μm, 30 μm, 32 μm, 35 μm... By setting the thickness of a single spray, after spraying 2 layers, general protection requirements can be met, thus ensuring the efficiency of single-layer spraying and taking into account the solidification of the glue, so as to achieve efficient encapsulation protection.
[0065] As Figures 2 - 4 、 Figure 6 shown, in some embodiments, a power supply device 200 is also provided. The power supply device 200 can be, but is not limited to, an inverter, an adapter, and a charger. An inverter is a converter that converts direct current into alternating current. A charger can convert alternating current into direct current, or step down or step up direct current and supply it to a charging device. An adapter is an interface converter. It can be an independent hardware interface device that allows a hardware or electronic interface to be connected to other hardware or electronic interfaces, or it can be an information interface. For example, a power adapter, a tripod base adapter component, a USB-to-serial port adapter device, etc. An adapter is a power supply conversion device for small portable electronic devices and electronic appliances.
[0066] In some embodiments, the power supply device 200 includes an installation housing 20, a first connection terminal 21, a second connection terminal 22, and at least one PCB board 4. The installation housing 20 has an installation cavity; the first connection terminal 21 is fixedly arranged in the installation housing 20, and the first connection terminal 21 is electrically connected to an external power supply; the second connection terminal 22 is arranged in the installation housing 20 for power output. The PCB board 4 is electrically connected to both the first connection terminal 21 and the second connection terminal 22. The PCB board 4 can be used to implement functions such as AC-DC conversion, step-down, and step-up. As the control center of the power supply device 200, the surface of the PCB board 4 needs to be protected during the manufacturing process. Currently, the surface protection of the PCB board 4 of the product adopts the process of manually brushing G6 silicone glue. This method has low efficiency, wastes a lot of glue materials, and the excess glue needs to be removed at the appearance inspection station, resulting in a relatively complex process.
[0067] To solve the above problems, in some embodiments, at least a part of at least one PCB board 4 is covered with a 3D printed protective layer. By using an automated device to precisely coat the areas that need to be protected on the PCB board 4 using 3D printing technology, and the 3D printed protective layer can be stacked layer by layer, replacing the manual glue brushing process, greatly improving the efficiency and reducing the waste of materials.
[0068] In some embodiments, the thicknesses of the 3D printed protective layers covering at least two areas on the PCB board 4 are different. Different functional areas can be divided on the PCB board 4 according to actual needs, and the thickness of the 3D printed protective layer can be set corresponding to different functional areas, so as to achieve the effect of flexible encapsulation and protection of different functional areas. Moreover, when covering the 3D printed protective layer on the PCB board 4, it is precisely sprayed to the positions that need to be protected, without glue overflow or splashing, saving materials.
[0069] In some embodiments, a 3D printed enclosure layer 41 is covered on any area of the PCB board 4. By printing the enclosure layer 41, adjacent components in different functional areas can be separated, so that when covering and encapsulating the functional areas subsequently, it is ensured that the glue is only within the area formed by the enclosure layer 41 and will not flow to other functional areas, ensuring the smooth progress of the encapsulation process. When printing the enclosure layer 41, the height of the enclosure layer 41 needs to be set according to the height and spacing of the components arranged on the PCB board 4. After the enclosure layer 41 is printed, the area enclosed by the enclosure layer 41 is filled. Moreover, the enclosure layer 41 can achieve waterproof sealing, so that the casing can be cancelled.
[0070] In some embodiments, a protective layer different from the 3D printed protective layer can be covered in the area surrounded by the enclosure layer 41. For the PCB board 4 with high requirements for local components, after the components are encapsulated by the enclosure layer, a glue with better protective performance can be selected for filling, and for other components, UV glue can be used for covering to achieve different levels of local protection, taking into account both efficiency and reliability.
[0071] In some embodiments, a 3D printed protective layer is formed on the PCB board 4 by multiple sprays. By stacking multiple layers of sprays, a thicker 3D printed protective layer can be obtained, forming a 3D shape with certain mechanical strength to meet the protection needs of products with high protection requirements.
[0072] In some embodiments, the thickness of a single-layer spray is greater than or equal to 20 μm, for example, it can be 25 μm, 28 μm, 30 μm, 32 μm, 35 μm... By setting the thickness of a single-layer spray, after spraying 2 layers, general protection requirements can be met, thus ensuring the efficiency of single-layer spraying and taking into account the solidification of the glue, so as to achieve efficient encapsulation protection.
[0073] In some embodiments, a battery pack 300 is also provided. The battery pack 300 in the embodiments of the present application can be a liquid lithium-ion battery with a polymer shell 10, or a soft-pack battery, or a hard-pack battery using a hard material as the battery shell 10. For example, the shell 10 of the hard-pack battery can be made of plastic, steel, or aluminum. The battery cells or battery cores in the battery pack 300 can be cylindrical battery cores, square battery cores, or sheet-shaped battery cores. The battery pack 300 can be a lithium iron phosphate battery, a ternary lithium battery, a sodium-ion battery, etc.
[0074] As Figure 5 and Figure 6 shown, in some embodiments, the battery pack 300 includes a housing 30, battery cores, and at least one PCB board 4. The housing 30 has an accommodation cavity; the battery cores are arranged in the accommodation cavity; the PCB board 4 is electrically connected to the battery cores. Moreover, a power terminal 31 and a communication terminal 32 are arranged on the battery pack 300. The power terminal 31 is used for transmitting power; the communication terminal 32 is used for transmitting communication data; the PCB board 4 is electrically connected to the power terminal 31 and the communication terminal 32 and can perform discharge control or charge control. The PCB board 4 serves as the control center of the battery pack 300, and during the manufacturing process, its surface needs to be protected. Currently, the surface protection of the PCB board 4 of the product adopts the process of manually brushing G6 silica gel. This method has low efficiency, wastes a lot of glue materials, and the redundant glue needs to be removed at the appearance inspection station, resulting in a relatively complex process.
[0075] To solve the above problems, in some embodiments, at least a part of at least one PCB board 4 is covered with a 3D printed protective layer. By using an automated device to precisely coat the areas on the PCB board 4 that need protection with 3D printing technology, and the 3D printed protective layer can be stacked layer by layer, replacing the manual glue brushing process, greatly improving the efficiency and reducing material waste.
[0076] In some embodiments, the thicknesses of the 3D printed protective layer covering at least two areas on the PCB board 4 are different. Different functional areas can be divided on the PCB board 4 according to actual needs, and the thickness of the 3D printed protective layer can be set correspondingly according to different functional areas, so as to achieve the effect of flexible encapsulation and protection for different functional areas. Moreover, when covering the 3D printed protective layer on the PCB board 4, it is precisely sprayed to the position that needs protection, without glue overflow and without splashing, saving materials.
[0077] In some embodiments, a surrounding layer 41 printed by 3D is covered on any area of the PCB board 4. By printing the surrounding layer 41, adjacent components in different functional areas can be separated, so that when covering and encapsulating the functional areas subsequently, it is ensured that the glue is only within the area formed by the surrounding layer 41 and will not flow to other functional areas, ensuring the smooth progress of the encapsulation process. When printing the surrounding layer 41, the height of the surrounding layer 41 needs to be set according to the height and spacing of the components arranged on the PCB board 4. After the surrounding layer 41 is printed, the area surrounded by the surrounding layer 41 is filled. Moreover, the surrounding layer 41 can achieve waterproof sealing, so the chassis can be cancelled.
[0078] In some embodiments, a protective layer different from the 3D printed protective layer can be covered in the area surrounded by the surrounding layer 41. For the PCB board 4 with higher requirements for local components, for the components after the enclosure layer encapsulation, glue with better protective performance can be selected for filling, and for other components, UV glue can be used for covering to achieve different levels of local protection, achieving both efficiency and reliability.
[0079] In some embodiments, the 3D printed protective layer is formed by multiple sprays on the PCB board 4. By using multi-layer spray stacking, a thicker 3D printed protective layer can be obtained, forming a 3D shape with certain mechanical strength to meet the protection needs of products with high protection requirements.
[0080] In some embodiments, the thickness of a single-layer spray is greater than or equal to 20 μm, for example, it can be 25 μm, 28 μm, 30 μm, 32 μm, 35 μm... By setting the thickness of a single-layer spray, after spraying 2 layers, general protection requirements can be met, thus ensuring the efficiency of single-layer spraying and taking into account the solidification of the glue, so as to achieve efficient encapsulation and protection.
[0081] The basic principles, main features and advantages of the present application have been shown and described above. Those skilled in the art should understand that the above embodiments do not limit the present application in any form. Any technical solutions obtained by means of equivalent replacement or equivalent transformation fall within the protection scope of the present application.
Claims
1. An electric tool, characterized in that, Comprising: A motor including a drive shaft that rotates about a drive axis; An output part (11) driven by the motor to output power; A housing (10) that houses the motor; At least one PCB board (4) electrically connected to the motor, and at least part of at least one of the PCB boards (4) is covered with a 3D printed protective layer.
2. The power tool according to claim 1, characterized in that, The thickness of the 3D printed protective layer is greater than or equal to 20 μm and less than or equal to 2000 μm.
3. The power tool according to claim 1, characterized in that, The thicknesses of the 3D printed protective layer covered by at least two regions on the PCB board (4) are different.
4. The power tool according to claim 1, characterized in that, Any region of the PCB board (4) is covered with a 3D printed enclosure layer (41).
5. The power tool according to claim 4, characterized in that, A protective layer different from the 3D printed protective layer can be covered in the region enclosed by the enclosure layer (41).
6. The electric tool according to claim 1, characterized in that, The 3D printed protective layer is formed on the PCB board (4) by multiple spray coatings.
7. The electric tool according to claim 6, characterized in that, The thickness of a single-layer spray coating is greater than or equal to 20 μm.
8. A power supply device, characterized in that, Comprising: An installation shell (20) having an installation cavity; A first connection terminal (21) provided in the installation shell (20) and electrically connected to an external power supply; A second connection terminal (22) provided in the installation shell (20) for power output; At least one PCB board (4) electrically connected to both the first connection terminal (21) and the second connection terminal (22), and at least part of at least one of the PCB boards (4) is covered with a 3D printed protective layer.
9. The power supply device according to claim 8, wherein The thicknesses of the 3D printed protective layer covered by at least two regions on the PCB board (4) are different.
10. The power supply device according to claim 8, characterized in that, Any region of the PCB board (4) is covered with a 3D printed enclosure layer (41).
11. The power supply device according to claim 10, wherein, A protective layer different from the 3D printed protective layer can be covered in the region enclosed by the enclosure layer (41).
12. The power supply device according to claim 8, characterized in that, The 3D printed protective layer is formed on the PCB board (4) by multiple spray coatings.
13. The power supply device according to claim 12, wherein The thickness of a single-layer spray coating is greater than or equal to 20 μm.
14. A battery pack, characterized in that, Comprising: A housing (30) having an accommodation cavity; A battery cell provided in the accommodation cavity; At least one PCB board (4) electrically connected to the battery cell, and at least part of at least one of the PCB boards (4) is covered with a 3D printed protective layer.
15. The battery pack according to claim 14, characterized in that, The thicknesses of the 3D printed protective layer covered by at least two regions on the PCB board (4) are different.
16. The battery pack according to claim 14, characterized in that, Any region of the PCB board (4) is covered with a 3D printed enclosure layer (41).
17. The battery pack according to claim 16, wherein, A protective layer different from the 3D printed protective layer can be covered in the region enclosed by the enclosure layer (41).
18. The battery pack according to claim 14, wherein The 3D printed protective layer is formed on the PCB board (4) by multiple spray coatings.
19. The battery pack according to claim 18, characterized in that, The thickness of a single-layer spray coating is greater than or equal to 20 μm.