Manufacturing method of light-emitting panel and light-emitting panel

Abstract

The invention discloses a manufacturing method of a light-emitting panel and the light-emitting panel. The manufacturing method comprises the following steps: controlling a first discharge port of a first transfer device to be in contact with a first chip unit so as to adhere the first chip unit through a first color conversion fluid at the first discharge port; in response to the first transfer device, driving the first chip unit to move to a first position where the first chip unit is opposite to the first electrode of the target substrate, the deformation unit is controlled to compress the first containing cavity so that part of the first color conversion fluid adhered to the first chip unit can be separated from the first color conversion fluid in the first containing cavity under the action of the gravity of the first chip unit, and then the first chip unit gets close to and is electrically connected with the first electrode under the action of the gravity of the first chip unit. The first color conversion fluid adheres to and transfers the first chip unit, and part of the first color conversion fluid is separated from the first transfer device along with the first chip unit, so that the first color conversion fluid is synchronously manufactured on the first chip unit, and the process is simplified.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and particularly to a method for manufacturing a light-emitting panel and a light-emitting panel. Background Art

[0002] With the continuous development of modern display technology, light-emitting diodes (LEDs) are widely used in display modules and display devices due to their energy-saving, high efficiency, long lifespan, excellent light quality, and environmental friendliness.

[0003] When manufacturing a display module using light-emitting diodes, a color conversion layer is usually fabricated on the LED chip. Meanwhile, it is necessary to ensure good alignment among the LED chip, the color conversion layer, and the target substrate. Additionally, a huge number of LED chips need to be transferred. The entire manufacturing process requires high precision and complex processes. Therefore, it is necessary to improve the manufacturing process and enhance related performance. Summary of the Invention

[0004] To solve the above technical problems existing in the prior art, the present application provides a method for manufacturing a light-emitting panel and a light-emitting panel.

[0005] To solve the above problems, the present application provides a method for manufacturing a light-emitting panel. The manufacturing method includes: controlling the first discharge port of the first transfer device to contact the first chip unit, so as to adhere to the first chip unit through the first color conversion fluid at the first discharge port. Wherein, the first transfer device is provided with a first accommodation cavity, the first discharge port communicates with the first accommodation cavity, and the first accommodation cavity accommodates the first color conversion fluid; in response to the first transfer device driving the first chip unit to move to a first position where the first chip unit is opposite to the first electrode of the target substrate, controlling the deformation unit to compress the first accommodation cavity so that a part of the first color conversion fluid adhered to the first chip unit is separated from the first color conversion fluid in the first accommodation cavity under the action of the self-gravity of the first chip unit, thereby enabling the first chip unit to approach and be electrically connected to the first electrode under the action of its own gravity.

[0006] In some embodiments, before the step of controlling the first discharge port of the first transfer device to contact the first chip unit, so as to adhere to the first chip unit through the first color conversion fluid at the first discharge port, the manufacturing method includes: processing the first color conversion slurry and the adhesion glue to obtain the first color conversion fluid; filling the first color conversion fluid into the first accommodation cavity.

[0007] In some embodiments, after the step of the control deformation unit compressing the first accommodation cavity to separate a part of the first color conversion fluid adhered to the first chip unit from the first color conversion fluid in the first accommodation cavity under the action of the self-gravity of the first chip unit, the manufacturing method includes a return step: controlling the first discharge port of the first transfer device to contact the first chip unit, so as to adhere the first chip unit through the first color conversion fluid at the first discharge port until each first electrode of the target substrate is connected to the first chip unit.

[0008] In some embodiments, the manufacturing method includes: detecting the number of connections between the first electrode and the first chip unit on the target substrate; if the number of connections is greater than or equal to a preset threshold, filling the first color conversion fluid into the accommodation cavity.

[0009] In some embodiments, the manufacturing method includes: controlling the second discharge port of the second transfer device to contact the second chip unit, so as to adhere the second chip unit through the second color conversion fluid at the second discharge port, wherein the second transfer device is provided with a second accommodation cavity, the second discharge port communicates with the second accommodation cavity, the second accommodation cavity accommodates the second color conversion fluid, and the color conversion slurries of the second color conversion fluid and the first color conversion fluid are different; in response to the second transfer device driving the second chip unit to move to a second position where the second chip unit is opposite to the second electrode of the target substrate, controlling the deformation unit to compress the second accommodation cavity to separate a part of the second color conversion fluid adhered to the second chip unit from the second color conversion fluid in the second accommodation cavity under the action of the self-gravity of the second chip unit, so that the second chip unit approaches and is electrically connected to the second electrode under the action of its own gravity.

[0010] In some embodiments, when the first discharge port of the first transfer device is in contact with the first chip unit, the second transfer device is in the second position, and when the second discharge port of the second transfer device is in contact with the second chip unit, the first transfer device is in the first position.

[0011] In some embodiments, the manufacturing method includes: controlling the third discharge port of the third transfer device to contact the third chip unit, so as to adhere the third chip unit through the third color conversion fluid at the third discharge port, wherein the third transfer device is provided with a third accommodation cavity, the third discharge port communicates with the third accommodation cavity, and the third accommodation cavity contains the third color conversion fluid; wherein, the color conversion slurries of the first color conversion fluid, the second color conversion fluid, and the third color conversion fluid are a red conversion slurry, a green conversion slurry, and a blue conversion slurry respectively; in response to the third transfer device driving the third chip unit to move to a third position where the third chip unit is opposite to the third electrode of the target substrate, controlling the deformation unit to compress the third accommodation cavity so that a part of the third color conversion fluid adhered to the third chip unit is separated from the third color conversion fluid in the third accommodation cavity under the action of the self-gravity of the third chip unit, and further enabling the third chip unit to approach and be electrically connected to the third electrode under the action of its own gravity.

[0012] In some embodiments, the target substrate includes at least three target regions, each target region includes at least one of the first electrode, the second electrode, and the third electrode. In a state where the first transfer device is located at a first position opposite to the first electrode of the first target region, the second transfer device is located at a second position opposite to the second electrode of the second target region, and the third transfer device is located at a third position opposite to the third electrode of the third target region.

[0013] In some embodiments, the manufacturing method includes: irradiating the first color conversion fluid with a light source to cure the first color conversion fluid on the first chip unit to form a first color conversion layer; and / or irradiating the second color conversion fluid with a light source to cure the second color conversion fluid on the second chip unit to form a second color conversion layer; and / or irradiating the third color conversion fluid with a light source to cure the third color conversion fluid on the third chip unit to form a third color conversion layer.

[0014] To solve the above problems, the present application provides a light-emitting panel, which is obtained by the manufacturing method as described above.

[0015] Compared with the prior art, the method for manufacturing a light-emitting panel of the present application includes controlling the first discharge port of the first transfer device to contact the first chip unit, so as to adhere the first chip unit through the first color conversion fluid at the first discharge port. Wherein, the first transfer device is provided with a first accommodation cavity, the first discharge port communicates with the first accommodation cavity, and the first accommodation cavity accommodates the first color conversion fluid; in response to the first transfer device driving the first chip unit to move to a first position where the first chip unit is opposite to the first electrode of the target substrate, controlling the deformation unit to compress the first accommodation cavity so that a part of the first color conversion fluid adhered to the first chip unit is separated from the first color conversion fluid in the first accommodation cavity under the action of the self-gravity of the first chip unit, and further enabling the first chip unit to approach and be electrically connected to the first electrode under the action of its own gravity. Through the above implementation manner, the first chip unit is adhered and transferred to a position opposite to the first electrode of the target substrate through the first color conversion fluid in the accommodation cavity of the transfer device, and the deformation unit separates a part of the first color conversion fluid to the first chip unit while separating the first chip unit from the first transfer device, so that while the first transfer device transfers the first chip unit to the target substrate, the first transfer device synchronously manufactures the first color conversion fluid on the first chip unit, simplifies the manufacturing process, and improves the alignment degree of the first color conversion fluid and the first chip unit at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 is a schematic flowchart of the first embodiment of the method for manufacturing a light-emitting panel provided by the present application;

[0018] Figure 2 is a process diagram of the first embodiment of the method for manufacturing a light-emitting panel provided by the present application;

[0019] Figure 3 is Figure 1 a schematic flowchart of an embodiment before step S101;

[0020] Figure 4 is a schematic flowchart of the second embodiment of the method for manufacturing a light-emitting panel provided by the present application;

[0021] Figure 5 is a process diagram of the second embodiment of the method for manufacturing a light-emitting panel provided by the present application;

[0022] Figure 6It is a process diagram of the third embodiment of the method for manufacturing a light-emitting panel provided by this application;

[0023] Figure 7 It is a schematic flowchart of the third embodiment of the method for manufacturing a light-emitting panel provided by this application;

[0024] Figure 8 It is a process diagram of the fourth embodiment of the method for manufacturing a light-emitting panel provided by this application;

[0025] Figure 9 It is a process diagram of the fifth embodiment of the method for manufacturing a light-emitting panel provided by this application;

[0026] Figure 10 It is a schematic diagram of a partial structure of a light-emitting panel obtained by using the method for manufacturing a light-emitting panel provided by this application.

[0027] Reference numerals in the drawings: First transfer device 10; First discharge port 110; First color conversion fluid 120; First accommodation cavity 130; First chip unit 20; Second transfer device 30; Second discharge port 310; Second color conversion fluid 320; Second accommodation cavity 330; Second chip unit 40; Third transfer device 50; Third discharge port 510; Third color conversion fluid 520; Third accommodation cavity 530; Third chip unit 60; Target substrate 70; First electrode 710; Second electrode 720; Third electrode 730; First target area 740; Second target area 750; Third target area 760; Deformation unit 80; Temporary substrate 90. Detailed implementation manners

[0028] The following will further describe this application in detail in conjunction with the drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate this application, but do not limit the scope of this application. Similarly, the following embodiments are only partial embodiments of this application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

[0029] Referring to "embodiment" herein means that the specific features, structures or characteristics described in connection with the embodiment may be included in at least one embodiment of this application. The phrase appears at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0030] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "install", "set", "connect", and "link" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0031] With the continuous development of modern display technology, light-emitting diodes (LEDs) are widely used in display modules and display devices due to their energy-saving, high efficiency, long lifespan, excellent light quality, and environmental friendliness.

[0032] When manufacturing a display module using light-emitting diodes, a color conversion layer is usually fabricated on the LED chip. At the same time, it is necessary to ensure good alignment among the LED chip, the color conversion layer, and the target substrate, and a large number of LED chips need to be transferred. The entire manufacturing process requires high precision and complex technology. Therefore, it is necessary to improve its manufacturing process and enhance related performance.

[0033] To solve the technical problems existing in the related art, the present application provides a method for manufacturing a light-emitting panel. Refer to Figure 1 and Figure 2 . Figure 1 is a schematic flowchart of the first embodiment of the method for manufacturing a light-emitting panel provided by the present application. Figure 2 is a process diagram of the first embodiment of the method for manufacturing a light-emitting panel provided by the present application, specifically including the following steps S101 to step S102.

[0034] Step S101: Control the first discharge port 110 of the first transfer device 10 to contact the first chip unit 20, so as to adhere to the first chip unit 20 through the first color conversion fluid 120 at the first discharge port 110.

[0035] The first transfer device 10 is provided with a first accommodating chamber 130, and the first discharge port 110 is connected to the first accommodating chamber 130. The first accommodating chamber 130 contains a first color conversion fluid 120. The first chip unit 20 has a light-emitting surface and a pin, and the light-emitting surface is located on the side of the first chip unit 20 away from the pin. A plurality of first chip units 20 are stored on a temporary substrate at intervals, and the pins of the first chip unit 20 are in contact with the temporary substrate. The first chip unit 20 is adhered to the first color conversion fluid 120 at the first discharge port 110 through the light-emitting surface. The size of the first discharge port 110 is smaller than the surface size of the first chip unit 20. Before adhering the first chip unit 20, the first discharge port 110 of the first transfer device 10 is first moved to align above the center of the light-emitting surface to make the adhesion more stable. The first color conversion fluid 120 is in a semi-solid state and has adhesive properties, and the first discharge port 110 is relatively small (in the order of micrometers), so the intermolecular force or surface tension inside the first color conversion fluid 120 can prevent it from dripping out of the first discharge port 110 due to gravity (similar to capillary phenomenon). Only under the action of external force can the first color conversion fluid 120 drip from the first discharge port 110.

[0036] Step S102: In response to the first transfer device 10 driving the first chip unit 20 to move to the first position where the first chip unit 20 is relative to the first electrode 710 of the target substrate 70, the deformation unit 80 is controlled to compress the first accommodating cavity 130 so that a portion of the first color conversion fluid 120 adhered to the first chip unit 20 is separated from the first color conversion fluid 120 in the first accommodating cavity 130 under the action of the first chip unit 20's own gravity, thereby allowing the first chip unit 20 to approach and be electrically connected to the first electrode 710 under the action of its own gravity.

[0037] The first discharge port 110 protrudes from the first accommodating cavity 130, and the size of the first discharge port 110 is smaller than the first accommodating cavity 130. The first transfer device 10 adheres the first chip unit 20 through the first color conversion fluid 120 at the first discharge port 110 to move it to the top of the target substrate 70, so that the pins of the first chip unit 20 are aligned with the first electrode 710, that is, the first chip unit 20 is in the first position. It should be noted that the spacing between the two pins of the first chip unit 20 and the spacing between the two pole pieces of the first electrode 710 are set to be the same; there is a certain spacing between the first position and the first electrode 710, so as to provide space for the first chip unit 20 and the first transfer device 10 to separate.

[0038] The deformation units 80 are arranged on both sides of the first accommodation cavity 130, and they can be electrostrictive materials, such as lead zirconate titanate ceramics, ferroelectric materials, etc., so that the deformation units 80 can expand to compress the first accommodation cavity 130 when powered on. Part of the first color conversion fluid 120 adhered to the first chip unit 20 is gradually extruded from the first discharge port 110, reducing the contact area between the first chip unit 20 and the first discharge port 110. Eventually, gravity overcomes the intermolecular force of the first color conversion fluid 120, causing the first chip unit 20 to drive the part of the first color conversion fluid 120 adhered to it to separate from the first transfer device 10 and move vertically onto the first electrode 710, making the pins of the first chip unit 20 contact and electrically connect with the first electrode 710. It should be noted that the spacing distance between the first position and the first electrode 710 is relatively small (in the order of micrometers), preferably the thickness dimension of the first chip unit 20, which ensures that while the first chip unit 20 separates from the first transfer device 10, the pins of the first chip unit 20 can also make good contact with the first electrode 710 (preventing a large deviation between the first chip unit 20 and the first electrode 710 due to an overly long dropping path of the first chip unit 20).

[0039] Through the above implementation manner, the first color conversion fluid 120 passing through the first discharge port 110 adheres to the first chip unit 20, enabling the first transfer device 10 to transfer the first chip unit 20 to the first position opposite the first electrode 710 of the target substrate 70. When the deformation unit 80 compresses the first accommodation cavity 130 to separate part of the first color conversion fluid 120 from the first transfer device 10, the first chip unit 20 also separates from the first transfer device 10. Thus, while using the first transfer device 10 to adhesively transfer the first chip unit 20, the first color conversion fluid 120 is coated on the light-emitting surface of the first chip unit 20 to form a color conversion layer. Since the first discharge port 110 is attached to the first chip unit 20, the alignment between the first color conversion fluid 120 and the first chip unit 20 is ensured, and at the same time, the process manufacturing flow is simplified.

[0040] See Figure 3 , Figure 3 is Figure 1 a schematic flow chart of an embodiment before step S101 in

[0041] Step S301: Process the first color conversion slurry and the adhesion glue to obtain the first color conversion fluid 120.

[0042] The adhesive is mainly used to adhere to the first chip unit 20. The adhesive can be an ultraviolet curable adhesive (UV adhesive). The first color conversion slurry is used to receive the light emitted by the first chip unit 20 and convert it into light of different colors. The first color conversion slurry can be a quantum dot material or a color resist material. The quantum dot material or the color resist material can receive light and emit red light, blue light, green light, yellow light, etc. It should be noted that the first chip unit 20 itself can also emit light, and it can be pre-fabricated as a chip unit that emits red light, blue light, or green light. The proportion of the adhesive in the first color conversion fluid 120 should not be too much or too little. If the proportion is too much, it may affect the light emission conversion effect of the first color conversion fluid 120. If the proportion is too little, the first color conversion fluid 120 may not firmly adhere to the first chip unit 20.

[0043] Step S302: Fill the first color conversion fluid 120 into the first accommodating cavity 130.

[0044] The first color conversion fluid 120 can be extruded and filled into the first accommodating cavity 130 through the first discharge port 110. Since the first color conversion fluid 120 is in a semi-solid state, after filling a certain amount into the first accommodating cavity 130, the first transfer device 10 can be shaken to make the first color conversion fluid 120 fully fill the first accommodating cavity 130. At the same time, it is necessary to ensure that the first discharge port 110 is also filled with the first color conversion fluid 120, so that the first discharge port 110 can adhere to the first chip unit 20 through the first color conversion fluid 120.

[0045] Further, after performing step S102, return to the step: control the first discharge port 110 of the first transfer device 10 to contact the first chip unit 20, so as to adhere to the first chip unit 20 through the first color conversion fluid 120 at the first discharge port 110 until each first electrode 710 of the target substrate 70 is connected to the first chip unit 20.

[0046] A plurality of first chip units 20 are stored at intervals on the temporary substrate 90, and a plurality of first electrodes 710 are correspondingly arranged at intervals on the target substrate 70. When the first transfer device 10 transfers the first first chip unit 20 on the temporary substrate 90 to the target substrate 70 and contacts and connects with the first first electrode 710, then it returns from the target substrate 70 to the position of the second first chip unit 20 on the temporary substrate 90, and then transfers the second first chip unit 20 to the target substrate 70 and contacts and connects with the second first electrode 710, and repeats the above steps until each first chip unit 20 on the temporary substrate 90 is connected to each first electrode 710 of the target substrate 70.

[0047] Further, during the process of repeatedly transferring multiple first chip units 20 to the target substrate 70 by using the first transfer device 10, the connection quantity between the first electrodes 710 on the target substrate 70 and the first chip units 20 is detected. If the connection quantity is greater than or equal to a preset threshold value, the first color conversion fluid 120 is filled into the accommodation cavity.

[0048] Because each time the first transfer device 10 transfers the first chip unit 20 to the target substrate 70, the deformation unit 80 compresses the first accommodation cavity 130, causing part of the first color conversion fluid 120 to separate from the first chip unit 20 along with the first transfer device 10. That is, each time a first chip unit 20 is transferred, part of the first color conversion fluid 120 is consumed. Therefore, when the connection quantity reaches a certain number, there may be too little first color conversion fluid 120 in the first accommodation cavity 130, such that when the deformation unit 80 compresses the first accommodation cavity 130, the first color conversion fluid 120 at the first discharge port 110 cannot be extruded from the first discharge port 110, or there is too little first color conversion fluid 120 at the first discharge port 110 to effectively adhere to the first chip unit 20. Therefore, when the connection quantity is greater than or equal to the preset threshold value, the first color conversion fluid 120 is replenished into the first accommodation cavity 130 to ensure the normal operation of the first transfer device 10; when the connection quantity is less than the preset threshold value, the first color conversion fluid 120 in the first accommodation cavity 130 is sufficient. After the deformation unit 80 compresses the first accommodation cavity 130 and the part of the first color conversion fluid 120 adhered to the first chip unit 20 separates from the first transfer device 10, the first color conversion fluid 120 can automatically fill to the first discharge port 110, enabling the first transfer device 10 to operate normally. The preset threshold value can be 50. Of course, it can also be adjusted to other values according to the situation, such as 100, 200, etc. However, it is necessary to ensure that the first transfer device 10 can operate normally when the connection quantity is less than or equal to the preset threshold value to transfer the first chip unit 20 to the target substrate 70 and the first electrodes 710 are connected normally.

[0049] Because each time the first transfer device 10 transfers the first electrodes 710 to the target substrate 70 and the first electrodes 710 are connected, the deformation unit 80 will work once to separate the first chip unit 20 from the first transfer device 10 and to make the color conversion glue on the surface of the first chip unit 20. Therefore, the connection quantity between the first electrodes 710 and the first chip units 20 can also be obtained through the number of working times of the deformation unit 80.

[0050] See Figure 4 and Figure 5 , Figure 4 is a schematic flowchart of the second embodiment of the manufacturing method of the light-emitting panel provided by the present application, Figure 5 is a process diagram of the second embodiment of the manufacturing method of the light-emitting panel provided by the present application.

[0051] In some embodiments, a second transfer device 30 is further included. The manufacturing method includes steps S401 to S404. The first transfer device 10 adheres to the first chip unit 20. After the first transfer device 10 transfers the first chip unit 20 and connects it to the first electrode 710, the second transfer device 30 adheres to the second chip unit 40, and the second transfer device 30 transfers the second chip unit 40 and connects it to the second electrode 720.

[0052] Step S401: Control the first discharge port 110 of the first transfer device 10 to contact the first chip unit 20, so as to adhere to the first chip unit 20 through the first color conversion fluid 120 at the first discharge port 110.

[0053] Step S402: In response to the first transfer device 10 driving the first chip unit 20 to move to a first position where the first chip unit 20 is opposite to the first electrode 710 of the target substrate 70, control the deformation unit 80 to compress the first accommodation cavity 130 so that a part of the first color conversion fluid 120 adhered to the first chip unit 20 is separated from the first color conversion fluid 120 in the first accommodation cavity 130 under the action of the self-gravity of the first chip unit 20. Furthermore, the first chip unit 20 approaches and is electrically connected to the first electrode 710 under the action of its own gravity.

[0054] Steps S401 and S402 are equivalent to Figure 1 Steps S101 and S102 shown, and for details, reference may be made to the description of steps S101 and S102 above.

[0055] Step S403: Control the second discharge port 310 of the second transfer device 30 to contact the second chip unit 40, so as to adhere to the second chip unit 40 through the second color conversion fluid 320 at the second discharge port 310. Among them, the second transfer device 30 is provided with a second accommodation cavity 330, the second discharge port 310 communicates with the second accommodation cavity 330, and the second accommodation cavity 330 contains the second color conversion fluid 320.

[0056] Transfer the second chip unit 40 through the second transfer device 30. The principle of adhesively transferring the second chip unit 40 by the second transfer device 30 is the same as that of the first transfer device 10. The difference lies in that the color conversion slurries of the second color conversion fluid 320 and the first color conversion fluid 120 are different, and the structural settings of the second transfer device 30 and the first transfer device 10 are the same. The second color conversion fluid 320 also includes an adhesion glue and a second color conversion slurry. The difference is that the quantum dot material or color resistance material used in the second color conversion slurry is different from that in the first color conversion slurry. The color of the light received and converted by the second color conversion slurry is different from that of the first color conversion slurry. For example, the second color conversion slurry can use a quantum dot material or color resistance material that can convert and emit green light, and the first color conversion slurry can use a quantum dot material or color resistance material that can convert and emit red light. It should be noted that the colors of the light emitted by the first chip unit 20 and the second chip unit 40 can be the same or different. For example, both the first chip unit 20 and the second chip unit 40 are LED chips that emit red light, or the first chip unit 20 and the second chip unit 40 are LED chips that emit green light and blue light respectively. In this embodiment, both the first chip unit 20 and the second chip unit 40 are LED chips that emit blue light.

[0057] Step S404: In response to the second transfer device 30 driving the second chip unit 40 to move to a second position where the second chip unit 40 is opposite to the second electrode 720 of the target substrate 70, control the deformation unit 80 to compress the second accommodation cavity 330 so that a part of the second color conversion fluid 320 adhered to the second chip unit 40 is separated from the second color conversion fluid 320 in the second accommodation cavity 330 under the action of the self-gravity of the second chip unit 40, thereby enabling the second chip unit 40 to approach and be electrically connected to the second electrode 720 under the action of its own gravity.

[0058] Similar to the working principle of the first transfer device 10, the second transfer device 30 adhesively transfers the second chip unit 40 from the temporary substrate 90 to a position above the target substrate 70 and opposite to the second electrode 720, that is, the second position. The deformation unit 80 works to compress the second accommodation cavity 330 so that the second chip unit 40 and a part of the second color conversion fluid 320 adhesively attached thereto are separated from the second transfer device 30 to be electrically connected to the second electrode 720, and the second color conversion fluid 320 is coated thereon synchronously during the process of electrically connecting the second chip unit 40 and the second electrode 720. There are also multiple second chip units 40 and second electrodes 720. After electrically connecting the first second chip unit 40 and the first second electrode 720, the second transfer device 30 returns to the position of the second chip unit on the temporary substrate 90 and transfers it to the target substrate 70 to be electrically connected to the second second electrode 720, and the above steps are repeated until all the second chip units 40 and all the second electrodes 720 are electrically connected. During the repeated transfer process, it is also necessary to detect the number of electrical connections between the second chip unit 40 and the second electrode 720. When the connection number reaches the preset threshold, it is necessary to timely replenish the second color conversion fluid 320 into the second accommodation cavity 330.

[0059] It should be noted that the execution steps of the manufacturing method can be sequentially executed according to the steps S401 to S404 as shown Figure 4 , and in some other embodiments, the execution order of steps S401 to S404 can also be reasonably and flexibly adjusted. For example, in some embodiments, step S401 and step S403 are executed synchronously, and then step S402 and step S404 are executed synchronously, that is, the first transfer device 10 adhesively attaches the first chip unit 20 and the second transfer device 30 adhesively attaches the second chip unit 40 synchronously, and then the first transfer device 10 transfers the first chip unit 20 to be electrically connected to the first electrode 710 and the second transfer device 30 transfers the second chip unit 40 to be electrically connected to the second electrode 720 synchronously.

[0060] For example, in some embodiments, steps S403, S404, S401, and S402 can also be executed first, that is, the second transfer device 30 adhesively attaches the second chip unit 40 first, then the second transfer device 30 transfers the second chip unit 40 to be electrically connected to the second electrode 720, then the first transfer device 10 adhesively attaches the first chip unit 20, and finally the first transfer device 10 transfers the first chip unit 20 to be electrically connected to the first electrode 710.

[0061] See Figure 6 , Figure 6 which is a process diagram of the third embodiment of the manufacturing method of the light-emitting panel provided by the present application.

[0062] Further, in a state where the first discharge port 110 of the first transfer device 10 contacts the first chip unit 20, the second transfer device 30 is in the second position, and in a state where the second discharge port 310 of the second transfer device 30 contacts the second chip unit 40, the first transfer device 10 is in the first position.

[0063] The first transfer device 10 and the second transfer device 30 can work separately to transfer the first chip unit 20 and the second chip unit 40 respectively, or the first transfer device 10 and the second transfer device 30 can work simultaneously. When the first transfer device 10 and the second transfer device 30 work simultaneously, in order for them to work better, the first transfer device 10 and the second transfer device 30 can work alternately on the temporary substrate 90 and the target substrate 70 to avoid mutual influence between them, especially when there is a space limitation between the first chip unit 20 and the second chip unit 40 or between the first electrode 710 and the second electrode 720.

[0064] See Figure 7 and Figure 8 , Figure 7 is a schematic flowchart of the third embodiment of the manufacturing method of the light-emitting panel provided by the present application, Figure 8 is a process diagram of the fourth embodiment of the manufacturing method of the light-emitting panel provided by the present application.

[0065] In some embodiments, a third transfer device 50 is further included. The manufacturing method includes sequentially performing step S701 to step S706, where step S701 and step S702 are equivalent to Figure 1 step S101 and step S102 in Figure 4 , and step S703 and step S704 are equivalent to

[0066] step S403 and step S404 in

[0067] For a specific description, reference can be made to the description of step S101, step S102, step S403 and step S404 above.

[0068] Step S703: Control the second discharge port 310 of the second transfer device 30 to contact the second chip unit 40, so as to adhere to the second chip unit 40 through the second color conversion fluid 320 at the second discharge port 310.

[0069] Step S704: In response to the second transfer device 30 driving the second chip unit 40 to move to a second position where the second chip unit 40 is opposite to the second electrode 720 of the target substrate 70, control the deformation unit 80 to compress the second accommodation cavity 330 so that a part of the second color conversion fluid 320 adhered to the second chip unit 40 is separated from the second color conversion fluid 320 in the second accommodation cavity 330 under the action of the self - gravity of the second chip unit 40, and further enable the second chip unit 40 to approach and be electrically connected to the second electrode 720 under the action of its own gravity.

[0070] Step S705: Control the third discharge port 510 of the third transfer device 50 to contact the third chip unit 60, so as to adhere to the third chip unit 60 through the third color conversion fluid 520 at the third discharge port 510. Among them, the third transfer device 50 is provided with a third accommodation cavity 530, the third discharge port 510 communicates with the third accommodation cavity 530, the third accommodation cavity 530 contains a third color conversion fluid 520, and the color conversion slurries of the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 are a red conversion slurry, a green conversion slurry, and a blue conversion slurry respectively.

[0071] The structure and working principle of the third transfer device 50 are the same as those of the first transfer device 10 and the second transfer device 30. The third color conversion fluid 520 is processed from an adhesive and a third color conversion slurry (i.e., blue slurry), so that the third color conversion fluid 520 can receive the light emitted by the third chip unit 60 and convert and emit blue light. The third chip unit 60 can also be an LED chip that emits red, green, blue, etc. light. In this application, the third chip unit 60 and the first chip unit 20, the second chip unit 40 select LED chips that emit the same blue light. At this time, the third color conversion fluid 520 can be composed only of the adhesive and does not require the third color conversion slurry.

[0072] Step S706: In response to the third transfer device 50 driving the third chip unit 60 to move to a third position where the third chip unit 60 is opposite to the third electrode 730 of the target substrate 70, control the deformation unit 80 to compress the third accommodation cavity 530 so that a part of the third color conversion fluid 520 adhered to the third chip unit 60 is separated from the third color conversion fluid 520 in the third accommodation cavity 530 under the action of the self - gravity of the third chip unit 60, and further enable the third chip unit 60 to approach and be electrically connected to the third electrode 730 under the action of its own gravity.

[0073] Similarly, the third accommodation cavity 530 is compressed by the deformation unit 80 to squeeze the third color conversion fluid 520, so that the third chip unit 60 and a part of the third color conversion fluid 520 adhered thereto are separated from the third transfer device 50 under the action of gravity. When the third chip unit 60 is transferred to be electrically connected to the third electrode 730, the third color conversion fluid 520 is coated on its light-emitting surface. There are also multiple third chip units 60 and third electrodes 730. After the first third chip unit 60 and the first third electrode 730 are electrically connected, the third transfer device 50 returns to the position of the second third chip unit 60 on the temporary substrate 90 and transfers it to the target substrate 70 to be electrically connected to the second third electrode 730. The above steps are repeated until all the third chip units 60 and all the third electrodes 730 are electrically connected. Similar to the first transfer device 10 and the second transfer device 30, during the process of the third transfer device 50 repeatedly transferring the third chip unit 60, it is necessary to detect the number of connections between the third chip unit 60 and the third electrode 730. When the number of connections reaches a preset threshold, the third color conversion fluid 520 is replenished into the third accommodation cavity 530.

[0074] It should be noted that the execution steps of the manufacturing method can be executed in sequence according to steps S701 to S706 as shown in Figure 7 . In some other embodiments, the execution order of steps S701 to S706 can also be reasonably and flexibly adjusted. For example, in some embodiments, steps S701, S703, and S705 can be executed synchronously first, and then steps S702, S704, and S706 can be executed synchronously.

[0075] For example, in some embodiments, steps S701, S702, S705, S706, S703, and S704 can also be executed in sequence.

[0076] See Figure 9 , Figure 9 which is a process diagram of the fifth embodiment of the manufacturing method of the light-emitting panel provided by the present application.

[0077] In some embodiments, the target substrate 70 includes at least three target areas, and each target area includes at least one first electrode 710, a second electrode 720, and a third electrode 730. In a state where the first transfer device 10 is located at a first position opposite to the first electrode 710 of the first target area, the second transfer device 30 is located at a second position opposite to the second electrode 720 of the second target area, and the third transfer device 50 is located at a third position opposite to the third electrode 730 of the third target area.

[0078] At this time, it is necessary to transfer the first chip unit 20, the second chip unit 40, and the third chip unit 60 on the temporary substrate 90 to the target substrate 70 and electrically connect them to the first electrode 710, the second electrode 720, and the third electrode 730 respectively. The first transfer device 10, the second transfer device 30, and the third transfer device 50 can work independently, or two of the transfer devices can work, or all three can work synchronously; when all three work synchronously, in order to make them better not affect each other, the target substrate 70 is divided into a first target area 740, a second target area 750, and a third target area 760. The first electrodes 710, the second electrodes 720, and the third electrodes 730 in the three target areas are mutually offset, so that the first transfer device 10, the second transfer device 30, and the third transfer device 50 work offset in the three target areas.

[0079] In some embodiments, the manufacturing method further includes: irradiating the first color conversion fluid 120 with a light source to cure the first color conversion fluid 120 on the first chip unit 20 to form a first color conversion layer; and / or, irradiating the second color conversion fluid 320 with a light source to cure the second color conversion fluid 320 on the second chip unit 40 to form a second color conversion layer; and / or, irradiating the third color conversion fluid 520 with a light source to cure the third color conversion fluid 520 on the third chip unit 60 to form a third color conversion layer.

[0080] The adhesive is usually in a liquid state. Therefore, the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 still have a certain fluidity. After the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 spread and cover the light-emitting surfaces of the first chip unit 20, the second chip unit 40, and the third chip unit 60 under the action of gravity and surface tension, the adhesive reacts and is converted into a solid state by irradiating with a light source, so that the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 are cured to better adhere to the light-emitting surfaces of the first chip unit 20, the second chip unit 40, and the third chip unit 60. It should be noted that the light source type is selected corresponding to the type of the adhesive. The adhesive can only absorb a specific type of light. For example, if the selected adhesive is a UV adhesive, the light source uses ultraviolet light, so that the adhesive can absorb ultraviolet light and cure the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 to form the first color conversion layer, the second color conversion layer, and the third color conversion layer.

[0081] After irradiating and curing the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 of the first chip unit 20, the second chip unit 40, and the third chip unit 60 with light, the pins of the first chip unit 20, the second chip unit 40, and the third chip unit 60 are welded and fixed to the first electrode 710, the second electrode 720, and the third electrode 730 respectively; finally, a black resin material is coated on the target substrate 70 to cover the first chip unit 20, the second chip unit 40, and the third chip unit 60 to fabricate a packaging layer, avoiding light crosstalk between chip units and weakening the reflection of ambient light, and at the same time packaging and protecting the chip units.

[0082] In summary, the first chip unit 20, the second chip unit 40, and the third chip unit 60 are adhesively transferred by using the adhesiveness of the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520. After transferring the chip units to the target substrate 70, the deformation unit 80 is controlled to compress the accommodation cavity of the transfer device, so that a part of the color conversion fluid adhered to the chip units is separated from the chip units and the transfer device. When the transfer device transfers the chip units, a color conversion fluid is coated on the surface of the chip units to fabricate a color conversion layer, which greatly simplifies the process flow and effectively improves the alignment between the color conversion layer and the chip units.

[0083] See Figure 10 , Figure 10 is a partial structural schematic diagram of a light-emitting panel obtained by using the manufacturing method of the light-emitting panel provided in this application.

[0084] To solve the technical problems existing in the related art, this application also provides a light-emitting panel, which is obtained by the above-mentioned manufacturing method of the light-emitting panel.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, rather than to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered by the scope of the claims and the description of this application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. This application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for manufacturing a light-emitting panel, characterized in that: The production method comprises: Controlling a first discharge port of a first transfer device to contact with a first chip unit, so as to adhere the first chip unit through a first color conversion fluid at the first discharge port, wherein the first transfer device is provided with a first accommodating cavity, the first discharge port is connected to the first accommodating cavity, and the first accommodating cavity accommodates the first color conversion fluid; In response to the first transfer device driving the first chip unit to move to a first position where the first chip unit is opposite to the first electrode of the target substrate, the deformation unit is controlled to compress the first accommodating cavity so that a portion of the first color conversion fluid adhered to the first chip unit is separated from the first color conversion fluid in the first accommodating cavity under the action of the first chip unit's own gravity, thereby making the first chip unit approach and be electrically connected to the first electrode under the action of its own gravity.

2. The method for manufacturing a light emitting panel according to claim 1, characterized in that: Before the step of controlling the first material outlet of the first transfer device to contact the first chip unit so as to adhere the first chip unit through the first color conversion fluid at the first material outlet, the manufacturing method includes: Processing the first color conversion paste and the adhesive to obtain the first color conversion fluid; The first color conversion fluid is filled into the first receiving chamber.

3. The method for manufacturing a light emitting panel according to claim 1, characterized in that: After the step of controlling the deformation unit to compress the first accommodating cavity so that a portion of the first color conversion fluid adhering to the first chip unit is separated from the first color conversion fluid in the first accommodating cavity under the action of the first chip unit's own gravity, the manufacturing method includes: Return step: control the first discharge port of the first transfer device to contact the first chip unit, so as to adhere the first chip unit through the first color conversion fluid at the first discharge port, until each of the first electrodes of the target substrate is connected to the first chip unit.

4. The method for manufacturing a light emitting panel according to claim 3, characterized in that: The production method comprises: Detecting the number of connections between the first electrode and the first chip unit on the target substrate; If the connection quantity is greater than or equal to a preset threshold, the first color conversion fluid is filled into the containing cavity.

5. The method for manufacturing a light emitting panel according to claim 1, characterized in that: The production method comprises: Controlling the second discharge port of the second transfer device to contact with the second chip unit, so as to adhere the second chip unit through the second color conversion fluid at the second discharge port, wherein the second transfer device is provided with a second accommodating cavity, the second discharge port is connected to the second accommodating cavity, the second accommodating cavity accommodates the second color conversion fluid, and the second color conversion fluid and the first color conversion fluid have different color conversion slurries; In response to the second transfer device driving the second chip unit to move to a second position where the second chip unit is opposite to the second electrode of the target substrate, the deformation unit is controlled to compress the second accommodating cavity so that a portion of the second color-conversion fluid adhered to the second chip unit is separated from the second color-conversion fluid in the second accommodating cavity under the action of the second chip unit's own gravity, thereby allowing the second chip unit to approach and be electrically connected to the second electrode under the action of its own gravity.

6. The method for manufacturing a light emitting panel according to claim 5, characterized in that: When the first discharge port of the first transfer device contacts the first chip unit, the second transfer device is in the second position, and when the second discharge port of the second transfer device contacts the second chip unit, the first transfer device is in the first position.

7. The method for manufacturing a light emitting panel according to claim 5, characterized in that: The production method comprises: The third discharge port of the third transfer device is controlled to contact with the third chip unit, so as to adhere the third chip unit through the third color conversion fluid at the third discharge port, wherein the third transfer device is provided with a third accommodating chamber, the third discharge port is connected to the third accommodating chamber, and the third accommodating chamber accommodates the third color conversion fluid; wherein the color conversion paste of the first color conversion fluid, the color conversion paste of the second color conversion fluid, and the color conversion paste of the third color conversion fluid are red conversion paste, green conversion paste, and blue conversion paste, respectively; In response to the third transfer device driving the third chip unit to move to a third position where the third chip unit is relative to the third electrode of the target substrate, the deformation unit is controlled to compress the third accommodating cavity so that a portion of the third color conversion fluid adhered to the third chip unit is separated from the third color conversion fluid in the third accommodating cavity under the action of the third chip unit's own gravity, thereby making the third chip unit approach and be electrically connected to the third electrode under the action of its own gravity.

8. The method for manufacturing a light emitting panel according to claim 7, characterized in that: The target substrate includes at least three target areas, each target area includes at least one of the first electrode, the second electrode and the third electrode. When the first transfer device is located at a first position relative to the first electrode of the first target area, the second transfer device is located at a second position relative to the second electrode of the second target area, and the third transfer device is located at a third position relative to the third electrode of the third target area.

9. The method for manufacturing a light emitting panel according to claim 7, characterized in that: The production method comprises: irradiating the first color conversion fluid with a light source so that the first color conversion fluid is solidified on the first chip unit to form a first color conversion layer; and / or, irradiating the second color conversion fluid with a light source so that the second color conversion fluid is solidified on the second chip unit to form a second color conversion layer; And / or, the third color conversion fluid is irradiated by a light source, so that the third color conversion fluid is solidified on the third chip unit to form a third color conversion layer.

10. A light-emitting panel, characterized in that: The light-emitting panel is obtained by the method for manufacturing a light-emitting panel according to any one of claims 1 to 9.

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