A transfer device, a manufacturing method of a light emitting panel and a light emitting panel

Abstract

The application discloses a transfer device, a manufacturing method of a light-emitting panel and the light-emitting panel. The transfer device comprises a slurry accommodating part, a clamping main body part and a limiting unit. The slurry accommodating part is provided with an accommodating cavity for accommodating color conversion slurry, and the accommodating cavity is provided with a discharge port. The clamping main body part is connected to one side of the slurry accommodating part with the discharge port, and the clamping main body part cooperates with the slurry accommodating part to form a clamping groove which is communicated with the discharge port, so as to allow the color conversion slurry in the accommodating cavity to enter the clamping groove through the discharge port. The limiting unit is connected to one side of the clamping main body part which faces the clamping groove, and the limiting unit is used for limiting a chip unit located in the clamping groove. The transfer device sprays the color conversion slurry on the chip unit while transferring the chip unit to manufacture a color conversion layer, so that the steps of additionally manufacturing the color conversion layer and transferring and aligning and adhering the color conversion layer to the chip unit are not needed, the process is simplified, and the color conversion slurry can be accurately sprayed on the surface of the chip unit.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a transfer device, a method for manufacturing a light-emitting panel, and the light-emitting panel itself. Background Technology

[0002] With the development of display technology, MiniLED and MicroLED display devices have begun to be used. Typically, a color conversion layer needs to be made on the light-emitting chip through photolithography, printing and other methods to obtain LED chips with different emitting colors. At the same time, a large number of LED chips need to be transferred and assembled to manufacture display devices, making the whole process relatively complex.

[0003] Currently, the entire process of manufacturing LED chips of different emitting colors and transferring chips in large quantities is relatively complex, and the manufacturing efficiency needs to be improved. Therefore, it is necessary to simplify the manufacturing process to improve efficiency. Summary of the Invention

[0004] In order to solve the above-mentioned technical problems in the prior art, this application provides a transfer device, a method for manufacturing a light-emitting module, and a light-emitting panel.

[0005] To address the aforementioned issues, this application provides a transfer device comprising a slurry receiving portion, a clamping main body, and a limiting unit. The slurry receiving portion has a receiving cavity for receiving color conversion slurry, and the receiving cavity has a discharge port. The clamping main body is connected to the side of the slurry receiving portion having the discharge port, and the clamping main body cooperates with the slurry receiving portion to form a clamping groove communicating with the discharge port, so as to allow the color conversion slurry in the receiving cavity to enter the clamping groove through the discharge port. The limiting unit is connected to the side of the clamping main body facing the clamping groove, and the limiting unit is used to limit the chip unit located in the clamping groove.

[0006] Furthermore, the limiting unit is annular and arranged around the discharge port.

[0007] Furthermore, the limiting unit includes at least one pair of limiting unit groups, and each pair of limiting unit groups includes two sub-limiting units that are opposite to each other and spaced apart.

[0008] Furthermore, the transfer device also includes a control circuit connected between the clamping body and the slurry receiving part, the control circuit being used to control the limiting unit to limit the chip unit.

[0009] Furthermore, the transfer device also includes a pressurizing unit connected to the slurry receiving portion. The pressurizing unit is used to compress the receiving cavity so that the color conversion slurry in the receiving cavity enters the clamping groove through the discharge port.

[0010] Furthermore, the slurry receiving portion forms a plurality of spaced-apart receiving cavities, and the clamping main body portion cooperates with the slurry receiving portion to form a plurality of clamping grooves. Each clamping groove is connected to the discharge port of one of the receiving cavities. The number of limiting units is plurality of, and each limiting unit is connected to the clamping main body portion. Each clamping groove has at least one limiting unit.

[0011] To address the aforementioned problems, this application provides a method for manufacturing a light-emitting panel. The method includes: in response to the aforementioned transfer device being located at a clamping station, controlling the limiting unit of the transfer device to limit the chip unit located in the clamping groove; applying color conversion paste from the receiving cavity of the paste receiving portion to the chip unit through the discharge port to form a color conversion layer; in response to the transfer device moving from the clamping station to a processing station, controlling the limiting unit to release the limiting state on the chip unit, wherein, at the processing station, the electrodes of the chip unit and the target substrate are electrically connected.

[0012] The step of applying the color conversion paste in the receiving cavity of the paste receiving section to the chip unit through the discharge port to form a color conversion layer includes: controlling the pressurization unit of the transfer device to compress the receiving cavity so that the color conversion paste in the receiving cavity is applied to the chip unit through the discharge port to form a color conversion layer.

[0013] The manufacturing method includes filling a receiving cavity with a color conversion slurry, wherein the color conversion slurry includes a color conversion material, an adhesive, and anchoring particles.

[0014] To address the aforementioned issues, this application provides a light-emitting panel comprising a target substrate, a chip unit, and a color conversion layer, wherein the light-emitting panel is obtained using the aforementioned fabrication method.

[0015] Unlike existing technologies, the transfer device of this application includes a slurry receiving section, a clamping body section, and a limiting unit. The slurry receiving section has a receiving cavity for receiving color conversion slurry, and the receiving cavity is provided with a discharge port. The clamping body section is connected to the side of the slurry receiving section with the discharge port, and the clamping body section cooperates with the slurry receiving section to form a clamping groove communicating with the discharge port, so as to allow the color conversion slurry in the receiving cavity to enter the clamping groove through the discharge port. The limiting unit is connected to the side of the clamping body section facing the clamping groove, and the limiting unit is used to limit the chip unit located in the clamping groove. Through the above implementation method, the limiting unit changes the size of the clamping groove, thereby limiting and clamping the side wall of the chip unit on the side wall of the clamping groove. The color conversion paste in the receiving cavity enters the clamping groove through the discharge port, so that the color conversion paste can be sprayed onto the surface of the chip unit through the discharge port. This allows the transfer device to spray the color conversion paste onto the chip unit to create a color conversion layer while transferring the chip unit. This eliminates the need for additional steps of creating a color conversion layer and transferring the color conversion layer to the chip unit for alignment and adhesion. This greatly simplifies the process and ensures precise spraying of the color conversion paste onto the surface of the chip unit. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the first embodiment of the transfer device provided in this application;

[0018] Figure 2 yes Figure 1 The diagram shows the structure of the transfer device in its working state;

[0019] Figure 3 This is a bottom view schematic diagram of the first embodiment of the transfer device provided in this application;

[0020] Figure 4 This is a bottom view schematic diagram of the second embodiment of the transfer device provided in this application.

[0021] Figure 5 This is a bottom view of the third embodiment of the transfer device provided in this application;

[0022] Figure 6 This is a schematic diagram of the fourth embodiment of the transfer device provided in this application;

[0023] Figure 7 This is a schematic flowchart of an embodiment of the method for manufacturing a light-emitting panel provided in this application;

[0024] Figure 8 This is a schematic diagram of an embodiment of the method for manufacturing a light-emitting panel provided in this application;

[0025] Figure 9 This is a partial structural schematic diagram of a light-emitting panel obtained using the manufacturing method of the light-emitting panel provided in this application.

[0026] Reference numerals in the attached figures: Transfer device 1; Slurry receiving part 10; Receiving cavity 110; Discharge port 120; Clamping main body 20; Limiting unit 210; Limiting unit group 2110; Sub-limiting unit 2111; Clamping groove 30; Control circuit 40; Pressurizing unit 50; Chip unit 2; Target substrate 3; Electrode 31; Color conversion slurry 4. Detailed Implementation

[0027] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "setting," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium. Those skilled in the art will understand the specific meanings of the above terms within the context of this application.

[0030] With the development of display technology, MiniLED and MicroLED display devices have begun to be used. Typically, a color conversion layer needs to be made on the light-emitting chip through photolithography, printing and other methods to obtain LED chips with different emitting colors. At the same time, a large number of LED chips need to be transferred and assembled to manufacture display devices, making the whole process relatively complex.

[0031] Currently, the entire process of manufacturing LED chips of different emitting colors and transferring chips in large quantities is relatively complex, and the manufacturing efficiency needs to be improved. Therefore, it is necessary to simplify the manufacturing process to improve efficiency.

[0032] To address the related technical problems, this application provides a transfer device, see [link to relevant documentation]. Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the first embodiment of the transfer device provided in this application. Figure 2 yes Figure 1 The diagram shows the structure of the transfer device in operation.

[0033] The transfer device 1 includes a slurry receiving part 10 and a clamping main body 20. The slurry receiving part 10 has a receiving cavity 110 for receiving color conversion slurry 4 and a discharge port 120. The clamping main body 20 is connected to the side of the slurry receiving part 10 with the discharge port 120. The clamping main body 20 cooperates with the slurry receiving part 10 to form a clamping groove 30 communicating with the discharge port 120, so as to allow the color conversion slurry 4 in the receiving cavity 110 to enter the clamping groove 30 through the discharge port 120. The limiting unit 210 is connected to the side of the clamping main body 20 facing the clamping groove 30. The limiting unit 210 is used to limit the chip unit 2 located in the clamping groove 30.

[0034] The transfer device 1 can expand the limiting unit 210 to limit and clamp the chip unit 2. The transfer device 1 can apply color conversion paste 4 to the chip unit 2 in the clamping groove 30 through the discharge port 120. The clamping body 20 is located below the paste receiving part 10 and has left and right parts located on both sides of the paste receiving part 10. The discharge port 120 is located on the bottom wall of the clamping groove 30, and the limiting unit 210 is located on the two side walls of the clamping groove 30. The limiting unit 210 and the bottom of the paste receiving part 10 are spaced apart to avoid the limiting unit 210 from affecting the discharge port 120 when it expands. When the limiting unit 210 expands, it can reduce the size of the clamping groove 30, thereby limiting and clamping the chip unit 2 located in the clamping groove 30. When the limiting unit 210 contracts and recovers, the size of the clamping groove 30 increases, and the chip unit 2 is released. The limiting unit 210 changes the size of the clamping groove 30 by deformation (expansion or contraction) to limit and clamp or release the chip unit 2. The limiting unit 30 can be made of electrostrictive materials (such as lead zirconate titanate ceramic, which deforms when the power is turned on and off), magnetostrictive materials (such as nickel-based alloy magnetostrictive materials, which generate a magnetic field when the power is turned on, and deforms through the magnetic field), photostrictive materials (such as lead vanadate ceramic, which deforms by absorbing light source), etc., as long as it can generate deformation to change the size of the clamping groove 30.

[0035] Through the above implementation method, the limiting unit 210 expands to change the size of the clamping groove 30, thereby limiting and clamping the side surface of the chip unit 2 on the side wall of the clamping groove 30. The color conversion paste 4 in the receiving cavity 110 enters the clamping groove 30 through the discharge port 120, so that the color conversion paste 4 can be sprayed onto the surface of the chip unit 2 through the discharge port 120. This allows the transfer device 1 to spray the color conversion paste 4 onto the surface of the chip unit 2 to create a color conversion layer while transferring the chip unit 2. This eliminates the need for additional steps of creating a color conversion layer and aligning and bonding the color conversion layer with the chip unit 2, which greatly simplifies the process and ensures that the color conversion paste 4 is accurately sprayed onto the surface of the chip unit 2.

[0036] See Figure 3 , Figure 4 and Figure 5 , Figure 3 This is a bottom view schematic diagram of the first embodiment of the transfer device 1 provided in this application. Figure 4 This is a bottom view schematic diagram of the second embodiment of the transfer device 1 provided in this application. Figure 5 This is a bottom view of the third embodiment of the transfer device 1 provided in this application.

[0037] Furthermore, the limiting unit 210 is arranged in a ring shape and surrounds the discharge port 120, that is, the limiting unit 210 is arranged around the side wall of the clamping groove 30, so that the transfer device 1 clamps the side surface of the chip unit 2, and the top surface of the chip unit 2 is arranged parallel to the bottom wall of the clamping groove 30 and spaced apart, and the top surface of the chip unit 2 is also arranged parallel to the discharge port 120, so that the transfer device 1 can spray the color conversion paste 4 onto the top surface of the chip unit 2 through the discharge port 120.

[0038] The limiting unit 210 includes at least one pair of limiting unit groups 2110, and each pair of limiting unit groups 2110 includes two sub-limiting units 2111 that are opposite to each other and spaced apart. That is, the limiting unit groups 2110 are disposed on two opposite side walls of the clamping groove 30. The limiting unit groups 2110 can be one pair, two pairs, etc. In one embodiment, one pair of limiting unit groups 2110 is disposed on two opposite side walls of the clamping groove 30. In another embodiment, two pairs of limiting unit groups 2110 are spaced apart and disposed on four side walls of the clamping groove 30. Of course, multiple limiting unit groups 2110 can also be interconnected and arranged around the side walls of the clamping groove 30, which makes the limiting clamping of the chip unit 2 more stable. The chip unit 2 has electrode pins. The dimension of the limiting unit 210 in the side wall direction of the clamping groove 30 is set to be greater than the thickness of the chip unit 2 excluding the electrode pins, so that the limiting unit 210 acts on the side surface of the chip unit 2, preventing the limiting unit 210 from expanding to the surface of the chip unit 2, thereby avoiding affecting the spraying of the color conversion paste 4 on the top surface of the chip unit 2.

[0039] The transfer device 1 also includes a control circuit 40, which is connected between the clamping body 20 and the slurry receiving part 10. The control circuit 40 is used to control the limiting unit 210 to limit its position. The control circuit 40 is electrically connected to the limiting unit 210, which is clamped between the bottom of the slurry receiving part 10 and the limiting unit 210. By switching the power on and off to the limiting unit 210 through the control circuit 40, the limiting unit 210 expands or contracts to achieve limiting clamping or limiting release of the chip unit 2. It should be noted that in order for the transfer device 1 to better clamp and release the chip unit 2, the maximum size of the clamping groove 30 (before the limiting unit 210 expands) is greater than the size of the chip unit 2. The maximum size of the clamping groove 30 can be set to within the range of the size of the chip unit 2 to 1.2 times the size of the chip unit 2. The minimum size of the clamping groove 30 (after the limiting unit 210 is fully expanded) should be smaller than the size of the chip unit 2 so that the clamping body 20 can apply clamping force to the chip unit 2. The minimum size of the clamping groove 30 can be set to between 0.8 times the size of the chip unit 2 and the chip unit size.

[0040] The transfer device 1 also includes a pressurizing unit 50, which is connected to the slurry receiving section 10. The pressurizing unit 50 is used to compress the receiving cavity 110 so that the color conversion slurry 4 in the receiving cavity 110 enters the clamping groove 30 through the discharge port 120. Preferably, the pressurizing unit 50 is positioned above the receiving cavity 110 and opposite to the discharge port 120. The pressurizing unit 50 can also be made of an electrostrictive material, which expands when energized to compress the color conversion slurry 4 in the receiving cavity 110, causing the color conversion slurry 4 to be ejected through the discharge port 120. The pressurizing unit 50 can also be an electrically controlled slider, which compresses the receiving cavity 110 by circuit control. It should be noted that the size of the discharge port 120 is small. When the pressurizing unit 50 is not working and there is no external force, the color conversion slurry 4 at the discharge port 120 will not drip from the discharge port 120 because the intermolecular force is greater than its own weight, similar to the capillary principle. There are multiple discharge ports 120, which are evenly spaced on the bottom wall of the clamping groove 30 so that the color conversion paste 4 can be sprayed more evenly on the top surface of the chip unit 2.

[0041] See Figure 6 , Figure 6 This is a schematic diagram of the fourth embodiment of the transfer device provided in this application.

[0042] In some embodiments, the slurry receiving portion 10 is formed with a plurality of spaced-apart receiving cavities 110, and the clamping main body portion 20 is formed with a plurality of clamping grooves 30 in cooperation with the slurry receiving portion 10. Each clamping groove 30 is connected to the outlet 120 of a receiving cavity 110. The number of limiting units 210 is plurality of, and each limiting unit 210 is connected to the clamping main body portion 20. Each clamping groove 30 has at least one limiting unit 210.

[0043] By providing multiple clamping slots 30, the transfer device 1 can clamp and transfer multiple chip units 2 at once. The number of clamping slots 30 can be 3, 4, 5, etc. Each clamping slot 30 is correspondingly provided with a discharge port 120 and a receiving cavity 110, and each limiting unit 210 is provided on the side wall of each clamping slot 30. Multiple chip units 2 are usually arranged at intervals on a substrate. The size of the clamping body part 20 between two adjacent clamping slots 30 is set to be smaller than the interval size between the two chip units 2, so that the transfer device 1 can clamp and transfer multiple chip units 2 simultaneously.

[0044] In summary, the transfer device 1 expands and changes the size of the clamping groove 30 through the limiting unit 210, thereby limiting and clamping the side surface of the chip unit 2 on the side wall of the clamping groove 30. The color conversion paste 4 in the receiving cavity 110 enters the clamping groove 30 through the discharge port 120, so that the color conversion paste 4 can be sprayed onto the surface of the chip unit 2 through the discharge port 120. This allows the transfer device 1 to spray the color conversion paste 4 onto the surface of the chip unit 2 to create a color conversion layer while transferring the chip unit 2. This eliminates the need for additional steps of creating a color conversion layer and aligning and bonding the color conversion layer with the chip unit 2, which greatly simplifies the process and ensures precise spraying of the color conversion paste 4 onto the surface of the chip unit 2.

[0045] See Figure 7 and Figure 8 , Figure 7 This is a schematic flowchart of an embodiment of the method for manufacturing a light-emitting panel provided in this application. Figure 8 This is a schematic diagram of an embodiment of the manufacturing method of the light-emitting panel provided in this application.

[0046] To address the related technical problems, this application provides a method for manufacturing a light-emitting panel, the method comprising steps S701 to S703.

[0047] Step S701: In response to the transfer device 1 being located at the clamping station, the limiting unit 210 of the transfer device 1 is controlled to limit the chip unit 2 located in the clamping groove 30.

[0048] Multiple chip units 2 are spaced apart on a temporary storage substrate. Each chip unit 2 has electrode pins on one side. Multiple electrodes 31 are disposed on the target substrate 3 corresponding to the multiple chip units 2. The chip units 2 need to be transferred to the target substrate 3 so that the electrode pins and electrodes 31 are aligned and connected. During the transfer of chip units 2, the transfer device 1 is first moved to align with the chip unit 2. Then, the transfer device 1 is moved so that the chip unit 2 is located within the clamping groove 30, i.e., the transfer device 1 is positioned at the clamping station. Then, the control circuit 40 energizes the limiting unit 210 to expand it and clamp the chip unit 2. It should be noted that there is a certain gap between the surface of the chip unit 2 and the discharge port 120, i.e., a certain gap between the chip unit 2 and the bottom wall of the clamping groove 30, to facilitate subsequent manufacturing processes. The transfer device 1 can be provided with one clamping slot 30 or multiple clamping slots 30; each clamping slot 30 has a control circuit 40 to control the on and off state of its limit unit 210, so that the transfer device 1 with multiple clamping slots 30 can clamp multiple chip units 2 simultaneously, or control some clamping slots 30 to work to clamp one or some chip units 2.

[0049] Step S702: The color conversion paste 4 in the receiving cavity 110 of the paste receiving section 10 is applied to the chip unit 2 through the discharge port 120 to form a color conversion layer.

[0050] The chip unit 2 has good alignment within the clamping groove 30 and the discharge port 120, allowing the color conversion paste 4 to be precisely applied to the surface of the chip unit 2, ensuring good alignment between the formed color conversion layer and the chip unit 2. The transfer device 1 can both clamp and position the chip unit 2 and process the chip unit 2 to create the color conversion layer.

[0051] Step S703: In response to the transfer device 1 moving from the clamping station to the processing station, the control limiting unit 210 releases the limiting state of the chip unit 2, wherein at the processing station, the electrode 31 of the chip unit 2 and the target substrate 3 are electrically connected.

[0052] The processing station is the position of the electrode 31 on the target substrate 3 corresponding to the electrode pin of the chip unit 2. The chip unit 2 is electrically connected to the electrode 31 of the target substrate 3 through the electrode pin. When the transfer device 1 with multiple clamping slots 30 simultaneously clamps multiple chip units 2 and transfers them to the target substrate 3, if the electrode 31 corresponding to each chip unit 2 is not in an adjacent position, the transfer device 1 can be moved to one of the processing stations, the corresponding clamping slot 30 releases the corresponding chip unit 2, and the remaining clamping slots 30 continue to clamp the corresponding chip units 2. Then the transfer device 1 continues to move to the next processing station to release the corresponding chip units 2. This operation is repeated until all chip units 2 are transferred to the corresponding processing station and make contact with the electrode 31 on the target substrate 3 for conductive connection, so that the transfer device 1 can work flexibly. It should be noted that step S702 can also be placed after step S703, that is, the chip unit 2 is first moved from the clamping station to the processing station, and then the color conversion paste 4 is applied to the chip unit 2 to form a color conversion layer.

[0053] Furthermore, the step of applying the color conversion paste in the receiving cavity of the paste receiving section to the chip unit through the discharge port to form a color conversion layer includes: controlling the pressurization unit of the transfer device to compress the receiving cavity so that the color conversion paste in the receiving cavity is applied to the chip unit through the discharge port to form a color conversion layer.

[0054] Color conversion paste 4 is uniformly sprayed onto the surface of chip unit 2 through multiple discharge ports 120. Under the action of surface tension, color conversion paste 4 spreads evenly on the surface of chip unit 2. Then, the transfer device 1 is removed to cure the color conversion paste 4, resulting in a color conversion layer. The color conversion layer can adhere well to the chip unit 2. This allows the transfer device 1 to simultaneously and accurately fabricate the color conversion layer on the surface of chip unit 2 when transferring chip unit 2 from the temporary substrate to the target substrate 3. It eliminates the need to fabricate the color conversion layer separately and align it with the chip unit 2 during transfer, simplifying the manufacturing process and simultaneously improving the alignment accuracy between the color conversion layer and the chip unit 2.

[0055] It should be noted that when the transfer device 1 is provided with multiple clamping slots 30, the pressure units 50 corresponding to the multiple clamping slots 30 can work synchronously to spray color conversion paste 4 onto the surface of multiple chip units 2 simultaneously. When it is inconvenient for the transfer device 1 to spray color conversion paste 4 onto multiple chip units 2, the pressure unit 50 corresponding to one of the clamping slots 30 can be made to work first to spray color conversion paste 4 onto the surface of the corresponding chip unit 2. Then, the transfer device 1 can be controlled to move to the next processing station and release the chip unit 2 in the corresponding clamping slot 30 and make the corresponding pressure unit 50 work to spray color conversion paste 4 into the corresponding receiving cavity 110. In other words, the transfer device 1 can simultaneously apply color conversion paste 4 from multiple receiving cavities 110 to multiple chip units 2, or it can apply color conversion paste 4 from multiple receiving cavities 110 to multiple chip units 2 one by one.

[0056] Typically, the transfer device 1 needs to transfer and process multiple chip units 2. After the transfer and processing of one chip unit 2 is completed, the transfer device 1 moves to the next clamping station to clamp and transfer the next chip unit 2. That is, after completing step S703, it returns to step S701.

[0057] Furthermore, the method for manufacturing the light-emitting panel also includes: filling the receiving cavity 110 with a color conversion paste 4, wherein the color conversion paste 4 includes a color conversion material, an adhesive, and anchoring particles. The color conversion material can be a quantum dot material or a color resist material, which can receive light and convert it to emit various colors of light, such as red, green, blue, and orange. The adhesive is used to enable the color conversion paste 4 to adhere to the chip unit 2, and the adhesive can be a UV-curable adhesive (UV adhesive). During the process of the transfer device 1 transferring the chip unit 2 from the clamping station to the processing station, the color conversion paste 4 in the receiving cavity 110 can be applied to the surface of the chip unit 2 simultaneously, and the adhesive in the color conversion paste 4 is used to temporarily adhere the chip unit 2, further preventing the chip unit 2 from falling off during the transfer process. Anchoring particles are used to make the color conversion paste 4 spread more evenly on the surface of the chip unit 2. The adhesive has a certain fluidity, and the anchoring particles cause the adhesive to adhere to its vicinity, thereby making the color conversion paste 4 spread more evenly on the surface of the chip unit 2. The anchoring particles can be selected as silica particles. The color conversion material, adhesive, and anchoring particles are mixed to obtain the color conversion paste 4. The proportion of adhesive in the color conversion paste 4 is preferably 10%-30%, and the proportion of anchoring particles in the color conversion paste 4 is preferably 5%-15%.

[0058] In some embodiments, the color conversion material is selected as a first color conversion material, a second color conversion material, and a third color conversion material that receive light and convert it to emit red, green, and blue light. When the transfer device 1 is provided with multiple receiving cavities 110, the first color conversion material, the second color conversion material, and the third color conversion material can be filled into the multiple receiving cavities 110 respectively. Alternatively, one or two color conversion materials can be filled into all the receiving cavities 110. By flexibly filling the multiple receiving cavities 110 with color conversion materials to adapt to different situations, the number of the transfer device 1, the receiving cavities 110, and the clamping grooves 30 can all be set to multiple, such as 3, 4, 5, etc. By flexibly combining and setting the number of the transfer device 1, the receiving cavities 110, and the clamping grooves 30, and flexibly filling the receiving cavities 110 with the first color conversion material, the second color conversion material, and the third color conversion material, the transfer device 1 can flexibly transfer multiple chip units 2. For example, in some embodiments, two transfer devices 1 are provided, each transfer device 1 having a receiving cavity 110 and a clamping groove 30, and the receiving cavities 110 in the two transfer devices 1 are filled with a first color conversion material and a second color conversion material, respectively; in some embodiments, one transfer device 1 is provided, the transfer device 1 having three clamping grooves 30 and three receiving cavities 110, and the three receiving cavities 110 are filled with a first color conversion material, a second color conversion material and a third color conversion material, respectively.

[0059] Chip unit 2 can emit light itself. Chip unit 2 can be a light-emitting chip that emits red light, green light, blue light, etc. In one embodiment, chip unit 2 is selected as a light-emitting chip that emits blue light uniformly. In this case, when making color conversion paste 4, since chip unit 2 emits blue light itself, there is no need for color conversion material. It is only necessary to mix adhesive and anchoring particles to obtain color conversion paste 4, so that the blue light emitted by chip unit 2 can be emitted through color conversion paste 4.

[0060] See Figure 9 , Figure 9 This is a partial structural schematic diagram of a light-emitting panel obtained using the manufacturing method of the light-emitting panel provided in this application.

[0061] After transferring all chip units 2 to the target substrate 3 through the transfer device 1 to make the electrode pins and electrodes 31 of chip units 2 make contact and conduction connection, the electrode pins and electrodes 31 of chip units 2 are then welded and fixed. Finally, a resin material is coated on the target substrate 3 to make an encapsulation layer covering the chip units 2. The resin material is preferably black resin to avoid light crosstalk between chip units 2 and reduce the reflection of ambient light, while also encapsulating and protecting the chip units 2 and the color conversion paste 4.

[0062] In summary, the manufacturing method provided in this application expands the limiting unit 210 in the clamping groove 30 of the transfer device 1 to limit and clamp the chip unit 2, so that the transfer device 1 clamps and transfers the chip unit 2 from the temporary substrate to the target substrate 3. The transfer device 1 can spray the color conversion paste 4 located in the receiving cavity 110 onto the chip unit 2 located in the clamping groove 30 through the discharge port 120, so as to simultaneously use the transfer device 1 to accurately spray the color conversion paste 4 on the surface of the chip unit 2 to create a color conversion layer. This avoids the process of separately creating the color conversion layer and transferring the color conversion layer to the chip unit 2 for alignment and adhesion, simplifies the manufacturing process steps, and ensures the alignment of the color conversion layer and the chip unit 2.

[0063] This application also provides a light-emitting panel, which includes a target substrate, a chip unit, and a color conversion layer, and the light-emitting panel is obtained by the above-described manufacturing method.

[0064] In the description of this application, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0066] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the function involved, as will be understood by those skilled in the art to which embodiments of this application pertain.

[0067] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a ordered list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (which may be a personal computer, server, network device, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0068] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A transfer device, characterized in that, The transfer device includes: The slurry receiving section has a receiving cavity for receiving color conversion slurry, and the receiving cavity is provided with a discharge port; A clamping main body is connected to the side of the slurry receiving part having the outlet. The clamping main body cooperates with the slurry receiving part to form a clamping groove communicating with the outlet, so as to allow the color conversion slurry in the receiving cavity to enter the clamping groove through the outlet. A limiting unit is connected to the clamping body on the side facing the clamping groove, and the limiting unit is used to limit the chip unit located in the clamping groove.

2. The transfer device according to claim 1, characterized in that, The limiting unit is ring-shaped and arranged around the discharge port.

3. The transfer device according to claim 1, characterized in that, The limiting unit includes at least one pair of limiting unit groups, and each pair of limiting unit groups includes two sub-limiting units that are opposite to each other and spaced apart.

4. The transfer device according to claim 1, characterized in that, The transfer device further includes a control circuit connected between the clamping body and the slurry receiving part, the control circuit being used to control the limiting unit to limit the chip unit.

5. The transfer device according to claim 1, characterized in that, The transfer device further includes a pressurizing unit connected to the slurry receiving section. The pressurizing unit is used to compress the receiving cavity so that the color conversion slurry in the receiving cavity enters the clamping groove through the discharge port.

6. The transfer device according to any one of claims 1 to 5, characterized in that, The slurry receiving portion has a plurality of spaced-apart receiving cavities, and the clamping main body portion cooperates with the slurry receiving portion to form a plurality of clamping grooves. Each clamping groove is connected to the discharge port of one of the receiving cavities. The number of limiting units is plurality of, and each limiting unit is connected to the clamping main body portion. Each clamping groove has at least one limiting unit.

7. A method for manufacturing a light-emitting panel, characterized in that, The manufacturing method includes: In response to the transfer device as described in any one of claims 1 to 6 being located at the clamping station, the limiting unit of the transfer device is controlled to limit the chip unit located in the clamping groove; The color conversion slurry in the cavity of the slurry container is applied to the chip cell through the outlet to form a color conversion layer; In response to the transfer device moving from the clamping station to the processing station, the limiting unit is controlled to release the limiting state of the chip unit, wherein at the processing station, the electrodes of the chip unit and the target substrate are electrically connected.

8. The manufacturing method according to claim 7, characterized in that, The step of applying the color conversion paste from the cavity of the paste container to the chip cell through the outlet to form a color conversion layer includes: The pressurization unit of the transfer device is controlled to compress the receiving cavity so that the color conversion slurry in the receiving cavity is applied to the chip unit through the discharge port to form the color conversion layer.

9. The manufacturing method according to claim 7, characterized in that, The manufacturing method includes: The color conversion slurry is filled into the receiving cavity, wherein the color conversion slurry includes color conversion material, adhesive and anchoring particles.

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