Curable composition for inkjet and electronic component

Abstract

The present invention provides a curable composition for inkjet, which is capable of improving thermocycling characteristics. This curable composition for inkjet contains a cyclized polymerizable compound, a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent. When a cured product is obtained by irradiating a curable composition for ink jet with light having a cumulative light amount of 300 mJ / cm < 2 > so that an illuminance at a wavelength of 365 nm becomes 3000 mW / cm < 2 > and then heating the irradiated composition at 170 DEG C for 2 hours, the glass transition temperature of the cured product is 100 DEG C or more, and the photocurable compound has an alicyclic skeleton. And the storage modulus of the cured product at 125 DEG C is 400 MPa or less.

Description

Technical Field

[0001] The present invention relates to a curable composition for inkjet use which is used by coating with an inkjet device. Further, the present invention relates to an electronic component using the curable composition for inkjet use. Background Art

[0002] In recent years, LED devices including light-emitting diode (LED) chips have been widely used. In order to improve the light extraction efficiency of light emitted from the LED chip, methods of disposing a partition wall or a reflective layer at the peripheral portion of the LED chip have been studied.

[0003] For example, Patent Document 1 below discloses a method for manufacturing an LED device having: a substrate; an LED element mounted on the substrate; a wavelength conversion layer covering the LED element; and a reflective layer formed on the substrate and outside the peripheral portion of the mounting area of the LED element. This manufacturing method includes the following steps. (1) A mounting step of mounting the LED element on the substrate. (2) A reflective layer forming step of coating a composition for forming a reflective layer containing light diffusing particles, an organosilicon compound, and a solvent on the substrate, and drying and curing the composition for forming a reflective layer to form the reflective layer. (3) A wavelength conversion layer forming step of coating a composition for a wavelength conversion layer containing phosphor particles and a binder component so as to cover the LED element, and forming the wavelength conversion layer.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2014-158011 Summary of the Invention

[0007] Technical Problem to be Solved by the Invention

[0008] As a method for forming a partition wall at the peripheral portion of an LED chip, a method of coating a curable composition for inkjet use in a frame shape with an inkjet device and curing the coated curable composition for inkjet use to form a partition wall is considered.

[0009] However, conventional curable compositions for inkjet use and their cured products sometimes have poor thermal cycle characteristics (thermal shock resistance). Therefore, in an electronic component using a conventional curable composition for inkjet use, when heating and cooling are repeatedly performed during use, the cured product of the curable composition for inkjet use sometimes peels off from the substrate or cracks are generated in the cured product.

[0010] An object of the present invention is to provide a curable composition for inkjet use capable of improving thermal cycle characteristics, and an electronic component using the curable composition for inkjet use.

[0011] Means for solving the technical problem

[0012] In this specification, the following curable compositions for inkjet and electronic components are disclosed. Items 5 to 11 are preferred modes of the first constitution when the curable composition for inkjet particularly satisfies the first constitution. Item 12 is a preferred mode of the second constitution when the curable composition for inkjet particularly satisfies the second constitution.

[0013] Item 1. A curable composition for inkjet, which comprises a cyclopolymerizable compound, a photocurable compound, a photoinitiator, a thermosetting compound, and a thermosetting agent, and the curable composition for inkjet satisfies the following first constitution or the following second constitution.

[0014] First constitution: The photocurable compound comprises a photocurable compound having an alicyclic skeleton.

[0015] Second constitution: When the curable composition for inkjet is irradiated with light having an accumulated light amount of 300 mJ / cm 2 in such a manner that the illuminance at a wavelength of 365 nm becomes 3000 mW / cm 2 and then heated at 170°C for 2 hours to obtain a cured product, the glass transition temperature of the cured product is 100°C or higher, and the storage modulus of the cured product at 125°C is 400 MPa or lower.

[0016] Item 2. The curable composition for inkjet according to Item 1, which satisfies the first constitution.

[0017] Item 3. The curable composition for inkjet according to Item 1, which satisfies the second constitution.

[0018] Item 4. The curable composition for inkjet according to Item 1, which satisfies both the first constitution and the second constitution.

[0019] Item 5. The curable composition for inkjet according to any one of Items 1, 2, and 4, wherein the photocurable compound having an alicyclic skeleton comprises a photocurable compound having a dicyclopentadiene skeleton, a photocurable compound having a norbornene skeleton, or a photocurable compound having an adamantane skeleton.

[0020] Item 6. The curable composition for inkjet according to any one of Items 1, 2, 4, and 5, wherein the photocurable compound having an alicyclic skeleton comprises a photocurable compound having two or more photocurable functional groups.

[0021] Item 7. The curable composition for inkjet according to any one of Items 1, 2, and 4 to 6, wherein the photocurable compound having an alicyclic skeleton contains tricyclodecane dimethanol di(meth)acrylate.

[0022] Item 8. The curable composition for inkjet according to any one of Items 1, 2, and 4 to 7, wherein, in 100% by weight of the curable composition for inkjet, the total content of the cyclopolymerizable compound and the photocurable compound having an alicyclic skeleton is 20% by weight or more and 75% by weight or less.

[0023] Item 9. The curable composition for inkjet according to any one of Items 1, 2, and 4 to 8, which further contains a photocurable compound different from both the cyclopolymerizable compound and the photocurable compound having an alicyclic skeleton.

[0024] Item 10. The curable composition for inkjet according to Item 9, wherein the photocurable compound different from both the cyclopolymerizable compound and the photocurable compound having an alicyclic skeleton contains a photocurable compound having two or more (meth)acryloyl groups and a photocurable compound having one (meth)acryloyl group.

[0025] Item 11. The curable composition for inkjet according to any one of Items 1, 2, and 4 to 10, wherein, with respect to 100 parts by weight of the total content of the cyclopolymerizable compound and the photocurable compound having an alicyclic skeleton, the content of the thermosetting compound is 10 parts by weight or more and 150 parts by weight or less.

[0026] Item 12. The curable composition for inkjet according to any one of Items 1, 3, and 4, wherein the storage modulus of the cured product at 125 °C is 250 MPa or less.

[0027] Item 13. The curable composition for inkjet according to any one of Items 1 to 12, wherein the cyclopolymerizable compound has two or more carbon-carbon double bonds.

[0028] Item 14. The curable composition for inkjet according to any one of Items 1 to 13, wherein the cyclopolymerizable compound has an allyl ether group.

[0029] Item 15. The curable composition for inkjet according to any one of Items 1 to 14, wherein the cyclopolymerizable compound has a structure represented by the following formula (1).

[0030] [Chemical formula 1]

[0031]

[0032] In formula (1), R represents an organic group having 1 to 200 carbon atoms.

[0033] Item 16. The curable composition for inkjet according to any one of Items 1 to 15, wherein the cyclopolymerizable compound contains methyl-2-(allyloxymethyl)acrylate.

[0034] Item 17. The curable composition for inkjet according to any one of Items 1 to 16, wherein, in 100% by weight of the curable composition for inkjet, the content of the cyclopolymerizable compound is 5% by weight or more and 80% by weight or less.

[0035] Item 18. The curable composition for inkjet according to any one of Items 1 to 17, wherein, based on 100 parts by weight of the content of the component having a photocurable functional group, the content of the photoinitiator is 6 parts by weight or more and 35 parts by weight or less.

[0036] Item 19. The curable composition for inkjet according to any one of Items 1 to 18, wherein the thermosetting compound contains a thermosetting compound having a cyclic ether group or a thermosetting compound having a cyclic thioether group.

[0037] Item 20. The curable composition for inkjet according to any one of Items 1 to 19, wherein the thermosetting agent contains 1,3-bis(3-aminophenoxy)benzene.

[0038] Item 21. The curable composition for inkjet according to any one of Items 1 to 20, which is used for forming partition walls in electronic components.

[0039] Item 22. An electronic component, comprising: a substrate, an electronic element disposed on a first surface of the substrate, and a partition wall disposed on the first surface of the substrate, the partition wall being disposed on the first surface of the substrate so as to surround the electronic element, and the partition wall being a cured product of the curable composition for inkjet according to any one of Items 1 to 21.

[0040] Advantages of the Invention

[0041] The curable composition for inkjet of the present invention contains a cyclopolymerizable compound, a photocurable compound, a photoinitiator, a thermosetting compound, and a thermosetting agent. The curable composition for inkjet of the present invention satisfies the first configuration or the second configuration. In the curable composition for inkjet of the present invention, due to having the above configuration, the thermal cycle characteristics can be improved. Description of the Drawings

[0042] Figure 1 Figure 1 ​​(a) is a top view schematically showing an LED module obtained using the curable composition for inkjet of the first embodiment of the present invention. Figure 1 (b) is a cross-sectional view schematically showing the LED module.

[0043] Figure 2 Figure 2 is a cross-sectional view schematically showing an LED module obtained using the curable composition for inkjet of the second embodiment of the present invention.

[0044] Figure 3 Figure 3 (a) to (c) are cross-sectional views for explaining each process of the manufacturing method of the LED module shown. Figure 1 The LED module shown.

[0045] Figure 4 Figure 4 (d) to (f) are cross-sectional views for explaining each process of the manufacturing method of the LED module shown. Figure 1 The LED module shown.

[0046] Figure 5 Figure 5 (g) is a cross-sectional view for explaining each process of the manufacturing method of the LED module shown. Figure 1 The LED module shown. Detailed Description of the Invention

[0047] Hereinafter, the present invention will be described in detail.

[0048] (Curable Composition for Inkjet)

[0049] The curable composition for inkjet of the present invention (hereinafter, sometimes simply referred to as "curable composition") is used by being coated using an inkjet device. The curable composition of the present invention is different from the curable composition coated by screen printing and different from the curable composition coated by a dispenser.

[0050] The curable composition for inkjet of the present invention contains (A) a cyclopolymerizable compound, (B) a photocurable compound, (C) a photoinitiator, (D) a thermosetting compound, and (E) a thermosetting agent. The curable composition for inkjet of the present invention satisfies the following first constitution or the following second constitution.

[0051] First Constitution: (B) The photocurable compound contains (B1) a photocurable compound having an alicyclic skeleton

[0052] Second Constitution: The curable composition for inkjet is irradiated with a cumulative light amount of 300 mJ / cm 2 so that the illuminance at a wavelength of 365 nm becomes 3000 mW / cm 2 ​​​​​​​​When a cured product is obtained by heating for 2 hours at 170°C after irradiation with light, the glass transition temperature of the cured product is 100°C or higher, and the storage modulus of the cured product at 125°C is 400 MPa or lower.

[0053] The curable composition for inkjet of the present invention can satisfy the first configuration or the second configuration. The curable composition for inkjet of the present invention only needs to satisfy at least one of the first configuration and the second configuration.

[0054] The curable composition for inkjet that satisfies at least the first configuration among the first configuration and the second configuration is referred to as a first curable composition for inkjet (or a first curable composition). This first curable composition for inkjet satisfies at least the first configuration. This first curable composition for inkjet may or may not satisfy the second configuration.

[0055] The first curable composition for inkjet (first curable composition) of the present invention contains (A) a cyclopolymerizable compound, (B1) a photocurable compound having an alicyclic skeleton, (C) a photoinitiator, (D) a thermosetting compound, and (E) a thermosetting agent.

[0056] The curable composition for inkjet that satisfies at least the second configuration among the first configuration and the second configuration is referred to as a second curable composition for inkjet (or a second curable composition). This second curable composition for inkjet satisfies at least the second configuration. This second curable composition for inkjet may or may not satisfy the first configuration.

[0057] The second curable composition for inkjet (second curable composition) of the present invention contains (A) a cyclopolymerizable compound, (B) a photocurable compound, (C) a photoinitiator, (D) a thermosetting compound, and (E) a thermosetting agent. In the second curable composition of the present invention, when the second curable composition is irradiated with a cumulative light amount of 300 mJ / cm 2 so that the illuminance at a wavelength of 365 nm becomes 3000 mW / cm 2 and then heated at 170°C for 2 hours to obtain a cured product, the glass transition temperature of the cured product is 100°C or higher. In the second curable composition of the present invention, the storage modulus of the cured product at 125°C is 400 MPa or lower.

[0058] Conventional curable compositions have the technical problem that it is difficult to improve the thermal cycle characteristics (thermal shock resistance). Therefore, in electronic components using conventional curable compositions, when heating and cooling are repeatedly performed during use, the cured product of the curable composition sometimes peels off from the substrate (the component to which the curable composition is applied), or cracks occur in the cured product.

[0059] In addition, conventional curable compositions have the technical problem that it is difficult to improve reflow soldering resistance. Therefore, in electronic components using conventional curable compositions, after the reflow soldering process, the cured product of the curable composition sometimes peels off from the substrate, or cracks occur in the cured product.

[0060] In order to improve the thermal cycle characteristics and reflow soldering resistance, fillers are sometimes added to the curable composition. However, when a large amount of filler is added to the curable composition, ejection defects sometimes occur when the curable composition is ejected using an inkjet device.

[0061] In addition, for example, when forming a partition wall at the peripheral portion of an LED chip using a conventional curable composition, since the use of the conventional curable composition for forming a partition wall is not envisaged, the partition wall sometimes cannot be formed well. In particular, in conventional curable compositions for inkjet, it is sometimes impossible to form a partition wall with a large aspect ratio well using an inkjet device.

[0062] On the other hand, since the curable compositions (the first curable composition and the second curable composition) of the present invention have the above-described configuration, they can improve the thermal cycle characteristics (thermal shock resistance). Specifically, in the curable compositions of the present invention, the adhesive strength between the substrate (the component to which the curable composition is applied) and the cured product of the curable composition can be improved. As a result, in electronic components using the curable composition, even when heating and cooling are repeatedly performed during use, it is possible to prevent the cured product of the curable composition from peeling off from the substrate. In addition, in electronic components using the curable composition, even when heating and cooling are repeatedly performed during use, it is possible to prevent cracks from occurring in the cured product of the curable composition. In the curable compositions of the present invention, as high thermal cycle characteristics, two effects of high peel suppression and high crack suppression can be exhibited.

[0063] In addition, the curable compositions of the present invention can improve reflow soldering resistance. In electronic components using the curable compositions of the present invention, after the reflow soldering process, it is possible to prevent the cured product of the curable composition from peeling off from the substrate and to prevent cracks from occurring in the cured product of the curable composition.

[0064] In addition, in the curable composition of the present invention, when the curable composition is used to form a partition wall at the peripheral portion of an electronic component (such as an LED chip), a partition wall with a large aspect ratio can be formed. In the curable composition of the present invention, a partition wall having an aspect ratio (height / width) required for a light-emitting device can be formed.

[0065] In addition, in the curable composition of the present invention, the curable composition can be coated with high precision near the light-emitting device using an inkjet device, so that the resulting electronic component can be miniaturized.

[0066] In addition, in the curable composition of the present invention, even when no filler is added or a small amount of filler is added, the thermal cycle characteristics and reflow soldering resistance can be improved. In the curable composition of the present invention, there is no need to add a filler, so that the curable composition can be ejected well using an inkjet device, and the curable composition can be coated with high precision near the light-emitting device, so that the resulting electronic component can be miniaturized.

[0067] From the viewpoint of more effectively exerting the above effects of the present invention, the curable composition of the present invention preferably satisfies both the first constitution and the second constitution.

[0068] The first curable composition contains a (B1) photocurable compound having an alicyclic skeleton and a (D) thermosetting compound, and thus is a photo- and thermosetting composition. Since the second curable composition contains a (B) photocurable compound and a (D) thermosetting compound, it is a photo- and thermosetting composition. The curable composition (the first curable composition and the second curable composition) is preferably cured by light irradiation and heating for use. The curable composition is preferably cured by heating after being cured by light irradiation for use.

[0069] In the curable composition, when a cured product is obtained by irradiating the curable composition with a cumulative light amount of 300 mJ / cm 2 at an illuminance of 3000 mW / cm 2 at a wavelength of 365 nm and then heating at 170°C for 2 hours, preferably the glass transition temperature of the cured product is 80°C or higher, and the storage modulus of the cured product at 125°C is 1000 MPa or lower. In the curable composition, when a cured product is obtained by irradiating the curable composition with a cumulative light amount of 300 mJ / cm 2 at an illuminance of 3000 mW / cm 2When a cured product is obtained by heating at 170°C for 2 hours after irradiation with light, it is more preferable that the glass transition temperature of the cured product is 100°C or higher, and the storage modulus of the cured product at 125°C is 400 MPa or lower. In these cases, the thermal cycle characteristics (inhibitory property of peeling and inhibitory property of cracks) can be further improved.

[0070] The cured product is obtained, for example, by the following method. After coating the curable composition on the surface of a polyethylene terephthalate (PET) film using an inkjet device, the cumulative light amount is irradiated in such a manner that the illuminance at a wavelength of 365 nm becomes 3000 mW / cm 2 to obtain 300 mJ / cm 2 of ultraviolet rays (UV-LED) to prepare a B-stage product of the curable composition. The obtained B-stage product is heated at 170°C for 2 hours to form a cured product (C-stage product) of the curable composition with a thickness of 200 μm.

[0071] The glass transition temperature (Tg) of the cured product is preferably 80°C or higher, more preferably 90°C or higher, still more preferably 100°C or higher, further preferably 110°C or higher, still more preferably 115°C or higher, particularly preferably 120°C or higher, and most preferably 125°C or higher. When the glass transition temperature (Tg) of the cured product is at or above the lower limit, the thermal cycle characteristics (inhibitory property of peeling and inhibitory property of cracks) can be further improved. The upper limit of the glass transition temperature (Tg) of the cured product is not particularly limited. The higher the glass transition temperature (Tg) of the cured product, the more preferable. The glass transition temperature (Tg) of the cured product can be 400°C or lower, can be 350°C or lower, and can be 300°C or lower.

[0072] When the (B) photocurable compound contains a (B1) photocurable compound having an alicyclic skeleton (when the curable composition satisfies the first constitution), the glass transition temperature (Tg) of the cured product is preferably 80°C or higher, more preferably 90°C or higher, further preferably 100°C or higher, particularly preferably 110°C or higher, and most preferably 115°C or higher. When the (B) photocurable compound does not contain a (B1) photocurable compound having an alicyclic skeleton (when the curable composition does not satisfy the first constitution), the glass transition temperature (Tg) of the cured product is 100°C or higher, preferably 110°C or higher, more preferably 115°C or higher, further preferably 120°C or higher, and particularly preferably 125°C or higher. When the glass transition temperature (Tg) of the cured product is at or above the lower limit, the thermal cycle characteristics (inhibitory property of peeling and inhibitory property of cracks) can be further improved.

[0073] The glass transition temperature of the cured product can be determined, for example, by cutting out a measurement sample from the cured product and using a dynamic viscoelasticity measurement device (e.g., "DVA-200" manufactured by IT Measurement Control Co., Ltd.). The maximum value of the loss modulus / storage modulus under the measurement conditions of a tensile condition, a frequency of 10 Hz, a strain of 0.1%, a temperature range of -40°C to 250°C, and a heating rate of 10°C / minute is obtained. It should be noted that the dimensions of the measurement sample are, for example, 30 mm to 50 mm in length, 3 mm to 10 mm in width, and 150 μm to 300 μm in thickness.

[0074] As a method for adjusting the glass transition temperature of the cured product to a preferred range, the following methods, etc., can be cited. (A) A method for adjusting the content of the cyclopolymerizable compound, (B) A method for adjusting the content of the photocurable compound. (B) A method using a photocurable compound having a specific structure described later as the photocurable compound. (D) A method for adjusting the content of the thermosetting compound. As the (D) thermosetting compound, a method using a thermosetting compound having a specific structure described later.

[0075] The storage modulus of the cured product at 125°C is preferably 1000 MPa or less, more preferably 400 MPa or less, still more preferably 300 MPa or less, further preferably 250 MPa or less, still more preferably 200 MPa or less, particularly preferably 150 MPa or less, and most preferably 100 MPa or less. When the storage modulus of the cured product at 125°C is below the above upper limit, the thermal cycling characteristics (inhibitory property of peeling and inhibitory property of cracks) can be further improved. The lower limit of the storage modulus of the cured product at 125°C is not particularly limited. The smaller the storage modulus of the cured product at 125°C, the more preferable. The storage modulus of the cured product at 125°C can be 0.01 MPa or more, can be 0.1 MPa or more, or can be 1 MPa or more.

[0076] When the (B) photocurable compound contains a (B1) photocurable compound having an alicyclic skeleton (when the curable composition satisfies the first constitution), the storage modulus of the cured product at 125°C is preferably 1000 MPa or less, more preferably 400 MPa or less, still more preferably 300 MPa or less, further preferably 250 MPa or less, particularly preferably 200 MPa or less, and most preferably 150 MPa or less. When the (B) photocurable compound does not contain a (B1) photocurable compound having an alicyclic skeleton (when the curable composition does not satisfy the first constitution), the storage modulus of the cured product at 125°C is 400 MPa or less, preferably 300 MPa or less, more preferably 250 MPa or less, further preferably 200 MPa or less, particularly preferably 150 MPa or less, and most preferably 100 MPa or less. When the storage modulus of the cured product at 125°C is below the above upper limit, the thermal cycle characteristics (inhibitory properties of peeling and cracks) can be further improved.

[0077] The storage modulus of the cured product at 25°C is preferably 1000 MPa or more, more preferably 1250 MPa or more, and still more preferably 1500 MPa or more. When the storage modulus of the cured product at 25°C is above the above lower limit, the adhesive strength between the substrate and the cured product of the curable composition at 25°C can be improved. There is no particular limitation on the upper limit of the storage modulus of the cured product at 25°C. The storage modulus of the cured product at 25°C can be 5000 MPa or less, can be 4500 MPa or less, or can be 4000 MPa or less.

[0078] The storage modulus of the cured product at 25°C and 125°C can be determined as follows, for example: A measurement sample is cut out from the cured product, and using a dynamic viscoelasticity measurement device (for example, "DVA-200" manufactured by IT Measurement Control Co., Ltd.), the measurement is carried out under the measurement conditions of a tensile condition, a frequency of 10 Hz, a strain of 0.1%, a temperature range of -40°C to 250°C, and a heating rate of 10°C / minute, and thus determined. The storage modulus of the cured product at 25°C and 125°C is obtained from the graph of the obtained tensile storage modulus. It should be noted that the dimensions of the measurement sample are, for example, 30 mm to 50 mm in length, 3 mm to 10 mm in width, and 150 μm to 300 μm in thickness.

[0079] As a method for adjusting the storage modulus of the cured product to a preferred range at 25°C and 125°C, the following methods etc. can be cited. (A) A method for adjusting the content of the cyclopolymerizable compound, (B) A method for adjusting the content of the photocurable compound. (B) A method using a photocurable compound having a specific structure described later as the photocurable compound. (D) A method for adjusting the content of the thermosetting compound. As the (D) thermosetting compound, a method using a thermosetting compound having a specific structure described later.

[0080] Hereinafter, the details of each component contained in the curable composition will be described. In this specification, “(meth)acryloyl” means one or both of “acryloyl” and “methacryloyl”, and “(meth)acrylate” means one or both of “acrylate” and “methacrylate”. Further, in this specification, the CH2═C(H or CH3) group possessed by (meth)acryloyl is not included in the vinyl group.

[0081] <(A) Cyclopolymerizable compound>

[0082] The curable composition contains (A) a cyclopolymerizable compound. The (A) cyclopolymerizable compound is a compound capable of cyclopolymerization. The (A) cyclopolymerizable compound has a cyclopolymerizable group. The (A) cyclopolymerizable compound can form a polymer having a cyclic skeleton. The (A) cyclopolymerizable compound preferably can form a polymer having a cyclic skeleton in the main chain.

[0083] (A) The cyclopolymerizable compound preferably cyclizes by radical polymerization. The (A) cyclopolymerizable compound preferably can form a polymer having a cyclic skeleton by radical polymerization, and more preferably can form a polymer having a cyclic skeleton in the main chain by radical polymerization. The (A) cyclopolymerizable compound preferably undergoes a radical polymerization reaction while cyclizing.

[0084] From the viewpoint of improving the adhesive strength between the substrate and the cured product of the curable composition and further improving the thermal cycle characteristics (especially the suppression of peeling), the (A) cyclopolymerizable compound preferably can form a five-membered ring structure or a six-membered ring structure, and more preferably can form a five-membered ring ether structure or a six-membered ring ether structure. From the viewpoint of improving the adhesive strength between the substrate and the cured product of the curable composition and further improving the thermal cycle characteristics (especially the suppression of peeling), the (A) cyclopolymerizable compound preferably can form a five-membered ring structure, and more preferably can form a five-membered ring ether structure.

[0085] From the viewpoint of further effectively exerting the effects of the present invention, the (A) cyclopolymerizable compound is preferably a photocurable compound (cyclopolymerizable photocurable compound). From the viewpoint of further effectively exerting the effects of the present invention, the (A) cyclopolymerizable compound preferably has a photocurable functional group. When the (A) cyclopolymerizable compound has a photocurable functional group, the cyclopolymerizable compound having a photocurable functional group corresponds to a component having a photocurable functional group. From the viewpoint of further effectively exerting the effects of the present invention, the (A) cyclopolymerizable compound is preferably a compound having a photocurable functional group and a cyclopolymerizable group. In the (A) cyclopolymerizable compound, the photocurable functional group may be a part of the cyclopolymerizable group or a side chain of the cyclopolymerizable group. In the (A) cyclopolymerizable compound, the photocurable functional group and the cyclopolymerizable group may share a part of atoms or a part of the skeleton.

[0086] (A) The cyclopolymerizable compound may have 1, may have 2, may have more than 2, may have more than 3, may have more than 4, may have more than 5, or may have more than 6. (A) The cyclopolymerizable compound may have 12 or fewer of the cyclopolymerizable groups, may have 8 or fewer, or may have 6 or fewer.

[0087] From the viewpoint of further effectively exerting the effects of the present invention, the (A) cyclopolymerizable compound preferably contains a photocurable compound having 1 cyclopolymerizable group. From the viewpoints of further improving photocurability, favorably forming a partition wall having a larger aspect ratio, and increasing the glass transition temperature (Tg) of the cured product of the curable composition, and further improving the thermal cycle characteristics (especially crack inhibition), the (A) cyclopolymerizable compound preferably contains a photocurable compound having 2 or more cyclopolymerizable groups.

[0088] (A) The cyclic polymerizable compound may have one or more photocurable functional groups. The photocurable functional group in the (A) cyclic polymerizable compound may be a group that does not undergo cyclic polymerization, and the photocurable functional group in the (A) cyclic polymerizable compound may be a group that is not included in the ring structure after cyclization (a group that does not form a ring structure after cyclization). When the (A) cyclic polymerizable compound has a photocurable functional group, the (A) cyclic polymerizable compound may have one photocurable functional group, two photocurable functional groups, more than two photocurable functional groups, more than three photocurable functional groups, more than four photocurable functional groups, or more than five photocurable functional groups. The (A) cyclic polymerizable compound may have ten or fewer photocurable functional groups. From the viewpoint of more effectively exerting the effects of the present invention, the (A) cyclic polymerizable compound preferably contains a photocurable compound having one photocurable functional group. From the viewpoints of further improving photocurability, favorably forming a partition wall having a larger aspect ratio, and increasing the glass transition temperature (Tg) of the cured product of the curable composition, and further improving the thermal cycle characteristics (especially crack inhibition), the (A) cyclic polymerizable compound preferably contains a photocurable compound having two or more photocurable functional groups.

[0089] Examples of the cyclic polymerizable group, the group containing the cyclic polymerizable group, or the photocurable functional group include (meth)acryloyl group, α-(allyloxymethyl)acryloyl group, and vinyl group.

[0090] From the viewpoint of improving cyclic polymerizability, the cyclic polymerizable group or the group containing the cyclic polymerizable group of the (A) cyclic polymerizable compound is preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. From the viewpoint of improving photocurability, the photocurable functional group of the (A) cyclic polymerizable compound is preferably a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group. From the viewpoints of improving cyclic polymerizability and photocurability, the (A) cyclic polymerizable compound preferably has a (meth)acryloyl group or an α-(allyloxymethyl)acryloyl group.

[0091] (A) The cyclic polymerizable compound may have one (meth)acryloyl group or α-(allyloxymethyl)acryloyl group, may have two (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, may have more than two (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, may have more than three (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, may have more than four (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups, may have more than five (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups. (A) The cyclic polymerizable compound may have ten or fewer (meth)acryloyl groups or α-(allyloxymethyl)acryloyl groups.

[0092] (A) The cyclic polymerizable compound may be a monofunctional (meth)acrylate or monofunctional α-(allyloxymethyl)acrylic acid, or may be a polyfunctional (meth)acrylate or polyfunctional α-(allyloxymethyl)acrylic acid. (A) The cyclic polymerizable compound may contain a difunctional (meth)acrylate compound or difunctional α-(allyloxymethyl)acrylic acid, may contain a trifunctional (meth)acrylate compound or trifunctional α-(allyloxymethyl)acrylic acid, may contain a tetrafunctional (meth)acrylate compound or tetrafunctional α-(allyloxymethyl)acrylic acid, may contain a pentafunctional (meth)acrylate compound or pentafunctional α-(allyloxymethyl)acrylic acid, may contain a hexafunctional (meth)acrylate compound or hexafunctional α-(allyloxymethyl)acrylic acid. (A) The cyclic polymerizable compound may contain a (meth)acrylate compound having seven or more functional groups or α-(allyloxymethyl)acrylic acid having seven or more functional groups. (A) The cyclic polymerizable compound may contain a (meth)acrylate compound having ten or fewer functional groups or α-(allyloxymethyl)acrylic acid having ten or fewer functional groups.

[0093] From the viewpoint of further improving the cyclic polymerizability, further improving the photocurability, and favorably forming a partition wall having a larger aspect ratio, (A) the cyclic polymerizable compound preferably contains a polyfunctional (meth)acrylate or polyfunctional α-(allyloxymethyl)acrylic acid. The polyfunctional (meth)acrylate may be a difunctional (meth)acrylate or difunctional α-(allyloxymethyl)acrylic acid, or may be a trifunctional (meth)acrylate or trifunctional α-(allyloxymethyl)acrylic acid, or may be a tetrafunctional (meth)acrylate or tetrafunctional α-(allyloxymethyl)acrylic acid, or may be a pentafunctional (meth)acrylate or pentafunctional α-(allyloxymethyl)acrylic acid, or may be a hexafunctional (meth)acrylate or hexafunctional α-(allyloxymethyl)acrylic acid.

[0094] Examples of the monofunctional (meth)acrylate or monofunctional α-(allyloxymethyl)acrylic acid include methyl-2-(allyloxymethyl)acrylic acid, 2-methoxyethyl-2-(allyloxymethyl)acrylic acid, tetrahydrofuran-2-ylmethyl-2-(allyloxymethyl)acrylic acid, 2-phenoxyethyl-2-(allyloxymethyl)acrylic acid, cyclohexyl-2-(allyloxymethyl)acrylic acid, and isobornyl-2-(allyloxymethyl)acrylic acid, etc.

[0095] Examples of the difunctional (meth)acrylate or difunctional α-(allyloxymethyl)acrylic acid include tripropylene glycol di-2-(allyloxymethyl)acrylic acid, 1,6-hexanediol di-2-(allyloxymethyl)acrylic acid, neopentyl glycol di-2-(allyloxymethyl)acrylic acid, and tricyclodecane dimethanol di-2-(allyloxymethyl)acrylic acid, etc.

[0096] Examples of the trifunctional (meth)acrylate or trifunctional α-(allyloxymethyl)acrylic acid include trimethylolpropane tri-2-(allyloxymethyl)acrylic acid, etc.

[0097] Examples of the hexafunctional (meth)acrylate or hexafunctional α-(allyloxymethyl)acrylic acid include dipentaerythritol hexa-2-(allyloxymethyl)acrylic acid, etc.

[0098] From the viewpoint of more effectively exerting the effects of the present invention, the (A) cyclopolymerizable compound preferably has two or more carbon-carbon double bonds. The (A) cyclopolymerizable compound may have 12 or fewer carbon-carbon double bonds, may have 8 or fewer, or may have 6 or fewer.

[0099] From the viewpoint of more effectively exerting the effects of the present invention, the (A) cyclopolymerizable compound preferably has an allyl ether group. From the viewpoint of more effectively exerting the effects of the present invention, in the (A) cyclopolymerizable compound, the cyclopolymerizable group is preferably an allyl ether group.

[0100] From the viewpoints of further improving the thermal cycle characteristics, further improving the reflow soldering resistance, and forming partitions with a larger aspect ratio, the cyclopolymerizable group or the group containing a cyclopolymerizable group is preferably vinyl, (meth)acryloyl, or α-(allyloxymethyl)acryloyl, more preferably (meth)acryloyl or α-(allyloxymethyl)acryloyl. From the viewpoints of further improving the thermal cycle characteristics, further improving the reflow soldering resistance, and forming partitions with a larger aspect ratio, the photocurable functional group is preferably vinyl, (meth)acryloyl, or α-(allyloxymethyl)acryloyl, more preferably (meth)acryloyl or α-(allyloxymethyl)acryloyl. From the viewpoints of further improving the thermal cycle characteristics, further improving the reflow soldering resistance, and forming partitions with a larger aspect ratio, the (A) cyclopolymerizable compound preferably has vinyl, (meth)acryloyl, or α-(allyloxymethyl)acryloyl, more preferably has (meth)acryloyl or α-(allyloxymethyl)acryloyl.

[0101] From the viewpoint of further effectively exerting the effects of the present invention, the (A) cyclopolymerizable compound preferably has a structure represented by the following formula (1).

[0102] [Chemical formula 2]

[0103]

[0104] In formula (1), R represents an organic group having 1 to 200 carbon atoms.

[0105] When the (A) cyclopolymerizable compound has the structure represented by the formula (1), the (A) cyclopolymerizable compound can form a polymer having a five-membered ring ether structure in the main chain by radical polymerization.

[0106] In the formula (1), the number of carbon atoms of R is 1 or more and 200 or less, preferably 150 or less, more preferably 100 or less. In the formula (1), R is preferably an alkyl group. In the formula (1), R may be a linear alkyl group, a branched alkyl group, or a cyclic alkyl group. In the formula (1), R may contain an ether bond.

[0107] In the formula (1), examples of R include methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, isobutyl, phenyl, pentyl, vinyl, allyl, crotyl, cyclopropyl, cyclobutyl, cyclohexyl, tetrahydrofurfuryl, methoxymethyl, methoxyethyl, ethoxymethyl, ethoxyethyl, phenoxyethyl, vinyloxyethyl, epoxy group, isobornyl, adamantyl, dicyclopentadienyl, and oxetanyl.

[0108] From the viewpoint of ejecting the curable composition well using an inkjet device, in the formula (1), R is preferably methyl or ethyl, more preferably methyl.

[0109] (A) The cyclopolymerizable compound may have an alicyclic skeleton. (A) The cyclopolymerizable compound may be a cyclopolymerizable compound having an alicyclic skeleton. (A) The cyclopolymerizable compound may have a cyclopolymerizable group and have an alicyclic skeleton. When the curable composition for inkjet contains a compound having a cyclopolymerizable group and having an alicyclic skeleton, the compound having a cyclopolymerizable group and having an alicyclic skeleton is classified as (A) the cyclopolymerizable compound.

[0110] Examples of the cyclopolymerizable compound (A) having an alicyclic skeleton include cyclohexyl-2-(allyloxymethyl)acrylate, isobornyl-2-(allyloxymethyl)acrylate, and tricyclodecane dimethanol di-2-(allyloxymethyl)acrylate.

[0111] From the viewpoint of more effectively exerting the effects of the present invention, (A) the cyclopolymerizable compound preferably contains methyl-2-(allyloxymethyl)acrylate (that is, methyl 2-(allyloxymethyl)acrylate).

[0112] In 100% by weight of the curable composition, the content of the cyclopolymerizable compound (A) is preferably 5% by weight or more, more preferably 10% by weight or more, further preferably 15% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less, further preferably 65% by weight or less, particularly preferably 60% by weight or less, and most preferably 50% by weight or less. When the content of the cyclopolymerizable compound (A) is above the lower limit and below the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. In addition, when the content of the cyclopolymerizable compound (A) is above the lower limit, the thermal cycle characteristics (especially the suppression of cracks) can be further improved.

[0113] When the (A) cyclic polymerizable compound has a photocurable functional group, in 100% by weight of the component having the photocurable functional group, the content of the (A) cyclic polymerizable compound is preferably 5% by weight or more, more preferably 10% by weight or more, still more preferably 15% by weight or more, preferably 90% by weight or less, more preferably 85% by weight or less, and still more preferably 80% by weight or less. When the content of the (A) cyclic polymerizable compound is within the above lower limit and the above upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. In addition, when the content of the (A) cyclic polymerizable compound is at least the above lower limit, the thermal cycle characteristics (especially the suppression of cracks) can be further improved.

[0114] In 100% by weight of the total content of the (A) cyclic polymerizable compound and the (B) photocurable compound, the content of the (A) cyclic polymerizable compound is preferably 5% by weight or more, more preferably 10% by weight or more, still more preferably 15% by weight or more, preferably 90% by weight or less, more preferably 85% by weight or less, and still more preferably 80% by weight or less. When the content of the (A) cyclic polymerizable compound is within the above lower limit and the above upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. In addition, when the content of the (A) cyclic polymerizable compound is at least the above lower limit, the flexibility of the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of cracks) can be further improved.

[0115] In 100% by weight of the total content of the (A) cyclic polymerizable compound and the (B1) photocurable compound having an alicyclic skeleton, the content of the (A) cyclic polymerizable compound is preferably 5% by weight or more, more preferably 10% by weight or more, still more preferably 15% by weight or more, preferably 90% by weight or less, more preferably 85% by weight or less, and still more preferably 80% by weight or less. When the content of the (A) cyclic polymerizable compound is within the above lower limit and the above upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. In addition, when the content of the (A) cyclic polymerizable compound is at least the above lower limit, the thermal cycle characteristics (especially the suppression of cracks) can be further improved.

[0116] In the total content of 100% by weight of (A) a cyclopolymerizable compound, (B) a photocurable compound, and (D) a thermosetting compound, the content of (A) the cyclopolymerizable compound is preferably 10% by weight or more, more preferably 15% by weight or more, still more preferably 20% by weight or more, preferably 85% by weight or less, more preferably 80% by weight or less, and still more preferably 70% by weight or less. When the content of (A) the cyclopolymerizable compound is within the above lower limit and the above upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. In addition, when the content of (A) the cyclopolymerizable compound is at least the above lower limit, the flexibility of the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of cracks) can be further improved.

[0117] <(B) photocurable compound>

[0118] The curable composition contains (B) a photocurable compound. (B) The photocurable compound is a compound capable of photocuring. (B) The photocurable compound has a photocurable functional group. (B) The photocurable compound corresponds to a component having a photocurable functional group. (B) The photocurable compound may be used alone or in combination of two or more.

[0119] (B) The photocurable compound may have one photocurable functional group, may have two photocurable functional groups, may have two or more photocurable functional groups, may have three or more photocurable functional groups, may have four or more photocurable functional groups, or may have five or more photocurable functional groups. (B) The photocurable compound may have 10 or less photocurable functional groups. From the viewpoint of further improving the photocurability, favorably forming a partition wall having a larger aspect ratio, and increasing the glass transition temperature (Tg) of the cured product of the curable composition, and further improving the thermal cycle characteristics (especially the suppression of cracks), (B) the photocurable compound preferably contains a photocurable compound having two or more photocurable functional groups. From the viewpoint of further improving the photocurability, favorably forming a partition wall having a larger aspect ratio, and increasing the glass transition temperature (Tg) of the cured product of the curable composition, and further improving the thermal cycle characteristics (especially the suppression of cracks), it is preferably to contain a photocurable compound having three or more photocurable functional groups. From the viewpoint of significantly improving the photocurability, favorably forming a partition wall having a considerably large aspect ratio, and increasing the glass transition temperature (Tg) of the cured product of the curable composition, and further improving the thermal cycle characteristics (especially the suppression of cracks), it is preferably to contain a photocurable compound having six or more photocurable functional groups.

[0120] Examples of the photocurable functional group include (meth)acryloyl group, vinyl group, and the like.

[0121] From the viewpoint of improving photocurability, the photocurable functional group of the (B) photocurable compound is preferably a (meth)acryloyl group. From the viewpoint of improving photocurability, the (B) photocurable compound preferably has a (meth)acryloyl group.

[0122] (B) The photocurable compound may have one (meth)acryloyl group, two (meth)acryloyl groups, two or more (meth)acryloyl groups, three or more (meth)acryloyl groups, four or more (meth)acryloyl groups, or five or more (meth)acryloyl groups. (B) The photocurable compound may have ten or less (meth)acryloyl groups.

[0123] (B) The photocurable compound preferably contains a photocurable compound having two or more photocurable functional groups, and more preferably contains a photocurable compound having two or more (meth)acryloyl groups. In these cases, the photocurability can be further improved, the partition walls having a larger aspect ratio can be formed well, and the glass transition temperature (Tg) of the cured product of the curable composition can be increased, and the thermal cycle characteristics (especially the suppression of cracks) can be further improved.

[0124] In 100% by weight of the curable composition, the content of the (B) photocurable compound is preferably 10% by weight or more, more preferably 15% by weight or more, further preferably 20% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and further preferably 65% by weight or less. When the content of the (B) photocurable compound is not less than the lower limit and not more than the upper limit, the partition walls having a larger aspect ratio can be formed well, and the thermal cycle characteristics (the suppression of peeling and the suppression of cracks) can be further improved.

[0125] In 100% by weight of the component having a photocurable functional group, the content of the (B) photocurable compound is preferably 10% by weight or more, more preferably 15% by weight or more, further preferably 20% by weight or more, preferably 90% by weight or less, more preferably 85% by weight or less, and further preferably 80% by weight or less. If the content of the (B) photocurable compound is not less than the lower limit and not more than the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be increased, and the glass transition temperature (Tg) of the cured product of the curable composition can be increased, and the thermal cycle characteristics (the suppression of peeling and the suppression of cracks) can be further improved.

[0126] In 100% by weight of the curable composition, the total content of (A) a cyclopolymerizable compound and (B) a photocurable compound is preferably 20% by weight or more, more preferably 30% by weight or more, still more preferably 40% by weight or more, particularly preferably 50% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and still more preferably 65% by weight or less. When the total content of (A) the cyclopolymerizable compound and (B) the photocurable compound is at least the lower limit, a partition wall having a larger aspect ratio can be formed well. When the total content of (A) the cyclopolymerizable compound and (B) the photocurable compound is at most the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (particularly, suppression of peeling) can be further improved.

[0127] With respect to 100 parts by weight of the content of (A) the cyclopolymerizable compound, the content of (B) the photocurable compound is preferably 10 parts by weight or more, more preferably 20 parts by weight or more, still more preferably 30 parts by weight or more, preferably 1000 parts by weight or less, more preferably 500 parts by weight or less, and still more preferably 200 parts by weight or less. When the content of (B) the photocurable compound is at least the lower limit and at most the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, the flexibility of the cured product of the curable composition can be improved, and the thermal cycle characteristics (suppression of peeling and suppression of cracks) can be further improved.

[0128] (B1) A photocurable compound having an alicyclic skeleton:

[0129] From the viewpoints of improving the adhesive strength between the substrate and the cured product of the curable composition, increasing the glass transition temperature (Tg) of the cured product of the curable composition, and further improving the thermal cycle characteristics (suppression of peeling and suppression of cracks), the (B) photocurable compound preferably contains (B1) a photocurable compound having an alicyclic skeleton. The first curable composition contains (B1) a photocurable compound having an alicyclic skeleton (hereinafter, sometimes simply referred to as “(B1) photocurable compound”). The (B1) photocurable compound is a photocurable compound having an alicyclic skeleton. The (B1) photocurable compound has an alicyclic skeleton and a photocurable functional group. The (B1) photocurable compound corresponds to a component having a photocurable functional group. The (B1) photocurable compound having an alicyclic skeleton may be used alone or in combination of two or more.

[0130] From the viewpoint of improving photocurability, the photocurable functional group of the (B1) photocurable compound is preferably a (meth)acryloyl group. From the viewpoint of improving photocurability, the (B1) photocurable compound preferably has a (meth)acryloyl group.

[0131] (B1) The photocurable compound may have one (meth)acryloyl group, two (meth)acryloyl groups, more than two (meth)acryloyl groups, more than three (meth)acryloyl groups, more than four (meth)acryloyl groups, or more than five (meth)acryloyl groups. (B1) The photocurable compound may have ten or less (meth)acryloyl groups.

[0132] From the viewpoint of further improving the photocurability and favorably forming a partition wall with a larger aspect ratio, (B1) the photocurable compound preferably contains a photocurable compound having two or more photocurable functional groups, and more preferably contains a photocurable compound having two or more (meth)acryloyl groups.

[0133] Examples of the alicyclic skeleton include a cyclopropane skeleton, a cyclobutane skeleton, a cyclopentane skeleton, a cyclohexane skeleton, a cycloheptane skeleton, a cyclooctane skeleton, a cyclononane skeleton, a cyclodecane skeleton, a cycloundecane skeleton, a cyclododecane skeleton, a naphthalene skeleton, a tetracyclododecene skeleton, a cubane skeleton, a basketane skeleton, a dicyclopentadiene skeleton, a norbornene skeleton, and an adamantane skeleton.

[0134] (B1) The alicyclic skeleton of the photocurable compound having an alicyclic skeleton is preferably a dicyclopentadiene skeleton, a norbornene skeleton, or an adamantane skeleton, and more preferably a dicyclopentadiene skeleton. (B1) The photocurable compound having an alicyclic skeleton preferably contains a photocurable compound having a dicyclopentadiene skeleton, a photocurable compound having a norbornene skeleton, or a photocurable compound having an adamantane skeleton. (B1) The photocurable compound having an alicyclic skeleton more preferably contains a photocurable compound having a dicyclopentadiene skeleton. In these cases, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the glass transition temperature (Tg) of the cured product of the curable composition can be increased, further improving the thermal cycle characteristics (inhibitory properties of peeling and cracks).

[0135] Examples of the photocurable compound having a dicyclopentadiene skeleton include dicyclopentadiene (meth)acrylate and tricyclodecane dimethanol di(meth)acrylate.

[0136] Examples of the photocurable compound having a norbornene skeleton include isobornyl (meth)acrylate.

[0137] Examples of the photocurable compound having an adamantane skeleton include 1-adamantyl (meth)acrylate, 3-hydroxy-1-adamantyl (meth)acrylate, 2-ethyl-2-adamantyl (meth)acrylate, 2-isopropyl-2-adamantyl (meth)acrylate, 1,3-adamantanediol di(meth)acrylate, and 2-methyl-2-adamantyl (meth)acrylate.

[0138] From the viewpoint of more effectively exerting the effects of the present invention, the photocurable compound (B) (the photocurable compound (B1) having an alicyclic skeleton) preferably contains tricyclodecane dimethanol di(meth)acrylate.

[0139] (B) The photocurable compound (the photocurable compound (B1) having an alicyclic skeleton) may or may not have a cyclic ether group.

[0140] In 100% by weight of the curable composition, the content of the photocurable compound (B1) having an alicyclic skeleton is preferably 10% by weight or more, more preferably 15% by weight or more, still more preferably 20% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and still more preferably 65% by weight or less. When the content of the photocurable compound (B1) having an alicyclic skeleton is within the above lower limit and the above upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. In addition, when the content of the photocurable compound (B1) having an alicyclic skeleton is at least the above lower limit, the glass transition temperature (Tg) of the cured product of the curable composition can be increased, and the thermal cycle characteristics (especially the suppression of cracks) can be further improved.

[0141] In 100% by weight of the component having a photocurable functional group, the content of the photocurable compound (B1) having an alicyclic skeleton is preferably 10% by weight or more, more preferably 15% by weight or more, still more preferably 20% by weight or more, preferably 90% by weight or less, more preferably 85% by weight or less, and still more preferably 80% by weight or less. When the content of the photocurable compound (B1) having an alicyclic skeleton is within the above lower limit and the above upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. In addition, when the content of the photocurable compound (B1) having an alicyclic skeleton is at least the above lower limit, the glass transition temperature (Tg) of the cured product of the curable composition can be increased, and the thermal cycle characteristics (especially the suppression of cracks) can be further improved.

[0142] In 100% by weight of the curable composition, the total content of (A) a cyclopolymerizable compound and (B1) a photocurable compound having an alicyclic skeleton is preferably 20% by weight or more, more preferably 30% by weight or more, still more preferably 40% by weight or more, and particularly preferably 50% by weight or more. In 100% by weight of the curable composition, the total content of (A) a cyclopolymerizable compound and (B1) a photocurable compound having an alicyclic skeleton is preferably 75% by weight or less, more preferably 70% by weight or less, still more preferably 65% by weight or less. When the total content of (A) a cyclopolymerizable compound and (B1) a photocurable compound having an alicyclic skeleton is not less than the lower limit and not more than the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (inhibitory properties of peeling and cracks) can be further improved. In 100% by weight of the curable composition, the total content of (A) a cyclopolymerizable compound and (B1) a photocurable compound having an alicyclic skeleton is preferably not less than the lower limit and not more than the upper limit.

[0143] With respect to 100 parts by weight of the content of (A) a cyclopolymerizable compound, the content of (B1) a photocurable compound having an alicyclic skeleton is preferably 10 parts by weight or more, more preferably 20 parts by weight or more, still more preferably 30 parts by weight or more, preferably 1000 parts by weight or less, more preferably 500 parts by weight or less, and still more preferably 200 parts by weight or less. When the content of (B1) a photocurable compound having an alicyclic skeleton is not less than the lower limit and not more than the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (inhibitory properties of peeling and cracks) can be further improved.

[0144] (B2) Other photocurable compounds:

[0145] The curable composition may or may not contain (A) a cyclopolymerizable compound and (B1) a photocurable compound other than the photocurable compound having an alicyclic skeleton. The curable composition may or may not contain a photocurable compound different from both (A) the cyclopolymerizable compound and (B1) the photocurable compound having an alicyclic skeleton (hereinafter sometimes referred to as "(B2) other photocurable compound"). From the viewpoint of further improving photocurability and forming a partition wall with a larger aspect ratio well, the curable composition preferably further contains a photocurable compound different from both (A) the cyclopolymerizable compound and (B1) the photocurable compound having an alicyclic skeleton. (B2) The other photocurable compound is a photocurable compound having no cyclopolymerizable group and no alicyclic skeleton. (B2) The other photocurable compound corresponds to a component having a photocurable functional group. The curable composition may contain (A) a cyclopolymerizable compound, (B1) a photocurable compound having an alicyclic skeleton, and (B2) other photocurable compounds. (B2) The other photocurable compound may not have a thermosetting functional group. (B2) The other photocurable compound is preferably a photocurable compound different from the photo- and thermosetting compounds. (B2) The other photocurable compound may be used alone or in combination of two or more.

[0146] From the viewpoint of further improving photocurability and forming a partition wall with a larger aspect ratio well, the curable composition preferably further contains (B2) other photocurable compounds.

[0147] (B2) The other photocurable compound has the above-mentioned photocurable functional group.

[0148] From the viewpoint of improving photocurability, the photocurable functional group of (B2) the other photocurable compound is preferably a (meth)acryloyl group. From the viewpoint of improving photocurability, (B2) the other photocurable compound preferably has a (meth)acryloyl group.

[0149] (B2) The other photocurable compound may have one (meth)acryloyl group, two (meth)acryloyl groups, two or more (meth)acryloyl groups, three or more (meth)acryloyl groups, four or more (meth)acryloyl groups, or five or more (meth)acryloyl groups. (B2) The other photocurable compound may have ten or less (meth)acryloyl groups.

[0150] From the viewpoint of further improving the photocurability and forming partition walls with a larger aspect ratio well, (B2) other photocurable compounds preferably include photocurable compounds having two or more photocurable functional groups, and more preferably include photocurable compounds having two or more (meth)acryloyl groups.

[0151] From the viewpoint of further improving the photocurability and forming partition walls with a larger aspect ratio well, (B2) other photocurable compounds more preferably include photocurable compounds having two or more photocurable functional groups and photocurable compounds having one photocurable functional group. From the viewpoint of further improving the photocurability and forming partition walls with a larger aspect ratio well, (B2) other photocurable compounds more preferably include photocurable compounds having two or more (meth)acryloyl groups and photocurable compounds having one (meth)acryloyl group.

[0152] (B2) Other photocurable compounds can be monofunctional (meth)acrylate or polyfunctional (meth)acrylate. (B2) Other photocurable compounds can include difunctional (meth)acrylate compounds, can include trifunctional (meth)acrylate compounds, can include tetrafunctional (meth)acrylate compounds, can include pentafunctional (meth)acrylate compounds, can include hexafunctional (meth)acrylate compounds. (B2) Other photocurable compounds can include (meth)acrylate compounds having seven or more functional groups. (B2) Other photocurable compounds can include (meth)acrylate compounds having ten or less functional groups.

[0153] From the viewpoint of further improving the photocurability and forming partition walls with a larger aspect ratio well, (B2) other photocurable compounds preferably include polyfunctional (meth)acrylate. The polyfunctional (meth)acrylate can be difunctional (meth)acrylate, can be trifunctional (meth)acrylate, can be tetrafunctional (meth)acrylate, can be pentafunctional (meth)acrylate, or can be hexafunctional (meth)acrylate.

[0154] Examples of the monofunctional (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono(meth)acrylate, 2-ethylhexyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, and stearyl (meth)acrylate, etc.

[0155] Examples of the difunctional (meth)acrylate include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butylethylpropanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, and dipropylene glycol di(meth)acrylate, etc.

[0156] Examples of the trifunctional (meth)acrylate include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl) ether, isocyanuric acid alkylene oxide-modified tri(meth)acrylate, dipentaerythritol tri(meth)acrylate propionate, tris((meth)acryloyloxyethyl) isocyanurate, and sorbitol tri(meth)acrylate, etc.

[0157] Examples of the tetrafunctional (meth)acrylate include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, bis(trimethylolpropane) tetra(meth)acrylate, and dipentaerythritol tetra(meth)acrylate propionate, etc.

[0158] Examples of the penta-functional (meth)acrylate include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0159] Examples of the hexa-functional (meth)acrylate include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and an alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0160] In the curable composition, the content of the (B2) other photocurable compound may be 0% by weight or may be 0% by weight or more. In 100% by weight of the curable composition, the content of the (B2) other photocurable compound is preferably 0.5% by weight or more, more preferably 1.0% by weight or more, further preferably 2.0% by weight or more, particularly preferably 2.5% by weight or more, most preferably 5.0% by weight or more, preferably 15% by weight or less, more preferably 10% by weight or less, and further preferably 5% by weight or less. When the content of the (B2) other photocurable compound is within the above lower limit and the above upper limit, the photocurability can be further improved, and a partition wall having a larger aspect ratio can be formed well. In addition, the thermal cycle characteristics (inhibitory properties of peeling and cracks) can be further improved.

[0161] <(C) Photoinitiator>

[0162] The curable composition contains a (C) photoinitiator. Only one kind of the (C) photoinitiator may be used, or two or more kinds may be used in combination.

[0163] Examples of the (C) photoinitiator include a photo radical polymerization initiator and a photo cationic polymerization initiator. The (C) photoinitiator is preferably a photo radical polymerization initiator.

[0164] The photo radical polymerization initiator is a compound that generates radicals by irradiation with light and initiates a radical polymerization reaction.

[0165] As the photo radical polymerization initiator, examples thereof include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkyl phenyl ketone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; aminobenzophenone compounds such as 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, N,N-dimethylaminoacetophenone, and polyethylene glycol bis(β-4-[4-(2-dimethylamino-2-benzyl)butyryl)phenyl]piperazine) propionate; anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, and 2-tert-butylanthraquinone; thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzil dimethyl ketal; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, ethyl phenyl(2,4,6-trimethylbenzoyl)phosphonate, and polymeric ethyl(2,4,6-trimethylbenzoyl)-phenylphosphinate; oxime ester compounds such as 1,2-octanedione-1-[4-(phenylthio)-2-(o-benzoyl oxime)] and acetone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(o-acetoxime); titanocene compounds such as bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-di-chloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)phenyl)titanium. The photo radical polymerization initiator may be used alone or in combination of two or more.

[0166] A photo-polymerization initiator aid can also be used together with the photo-radical polymerization initiator. Examples of the photo-polymerization initiator aid include (methylimino)diethylidene-bis[4-(dimethylamino)benzoate], polyethylene glycol di-(p-dimethylaminobenzoate) (Polyethylene Glycol(200)di(beta-(4(pac etyl phenyl)piperazine))propionate), ethyl N,N-dimethylaminobenzoate, isoamyl N,N-dimethylaminobenzoate, pentyl 4-dimethylaminobenzoate, triethylamine, and triethanolamine. Photo-polymerization initiator aids other than these can also be used. The photo-polymerization initiator aid can be used alone or in combination of two or more.

[0167] In addition, a titanocene compound such as CGI-784 (manufactured by Ciba Specialty Chemicals) having absorption in the visible light region can be used to promote the photoreaction.

[0168] Examples of the photo-cationic polymerization initiator include sulfonium salts, iodonium salts, metallocene compounds, and benzoin tosylate. The photo-cationic polymerization initiator can be used alone or in combination of two or more.

[0169] In the curable composition of 100% by weight, the content of the (C) photo-polymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, further preferably 1% by weight or more, preferably 30% by weight or less, more preferably 20% by weight or less, and further preferably 10% by weight or less. When the content of the (C) photo-polymerization initiator is within the above lower limit and the above upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed. In addition, the thermal cycle characteristics (inhibitory effect on peeling and cracking) can be further improved.

[0170] Relative to 100 parts by weight of the content of the component having a photocurable functional group, the content of the (C) photo-polymerization initiator is preferably 6 parts by weight or more, more preferably 8 parts by weight or more, further preferably 10 parts by weight or more, preferably 35 parts by weight or less, more preferably 30 parts by weight or less, and further preferably 25 parts by weight or less. When the content of the (C) photo-polymerization initiator is within the above lower limit and the above upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed. When the content of the (C) photo-polymerization initiator is within the above upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the inhibitory effect on peeling) can be further improved.

[0171] Based on 100 parts by weight of the total content of (A) a cyclopolymerizable compound and (B) a photocurable compound, the content of (C) a photopolymerization initiator is preferably 6 parts by weight or more, more preferably 8 parts by weight or more, still more preferably 10 parts by weight or more, preferably 45 parts by weight or less, more preferably 40 parts by weight or less, still more preferably 35 parts by weight or less. When the content of (C) the photopolymerization initiator is at or above the lower limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed. When the content of (C) the photopolymerization initiator is at or below the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved.

[0172] Based on 100 parts by weight of the total content of (A) a cyclopolymerizable compound and (B1) a photocurable compound having an alicyclic skeleton, the content of (C) a photopolymerization initiator is preferably 5 parts by weight or more, more preferably 10 parts by weight or more, still more preferably 15 parts by weight or more, preferably 45 parts by weight or less, more preferably 40 parts by weight or less, still more preferably 35 parts by weight or less. When the content of (C) the photopolymerization initiator is at or above the lower limit and at or below the upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed. When the content of (C) the photopolymerization initiator is at or below the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved.

[0173] Based on 100 parts by weight of the content of (A) a cyclopolymerizable compound, the content of (C) a photopolymerization initiator is preferably 10 parts by weight or more, more preferably 15 parts by weight or more, still more preferably 20 parts by weight or more, preferably 200 parts by weight or less, more preferably 100 parts by weight or less, still more preferably 50 parts by weight or less. When the content of (C) the photopolymerization initiator is at or above the lower limit and at or below the upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed. When the content of (C) the photopolymerization initiator is at or below the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved.

[0174] Based on 100 parts by weight of the content of the (B) photocurable compound, the content of the (C) photopolymerization initiator is preferably 10 parts by weight or more, more preferably 15 parts by weight or more, still more preferably 20 parts by weight or more, preferably 150 parts by weight or less, more preferably 100 parts by weight or less, and still more preferably 50 parts by weight or less. When the content of the (C) photopolymerization initiator is at or above the lower limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed. When the content of the (C) photopolymerization initiator is at or below the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved.

[0175] Based on 100 parts by weight of the content of the (B1) photocurable compound having an alicyclic skeleton, the content of the (C) photopolymerization initiator is preferably 10 parts by weight or more, more preferably 15 parts by weight or more, still more preferably 20 parts by weight or more, preferably 150 parts by weight or less, more preferably 100 parts by weight or less, and still more preferably 50 parts by weight or less. When the content of the (C) photopolymerization initiator is at or above the lower limit and at or below the upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed. When the content of the (C) photopolymerization initiator is at or below the upper limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved.

[0176] <(D) thermosetting compound>

[0177] The curable composition contains a (D) thermosetting compound. The (D) thermosetting compound is a compound capable of thermosetting. The (D) thermosetting compound has a thermosetting functional group. The (D) thermosetting compound can be used alone or in combination of two or more.

[0178] Examples of the (D) thermosetting compound include a thermosetting compound having a maleimide group, a thermosetting compound having a cyclic ether group, a thermosetting compound having a cyclic thioether group, a thermosetting compound having an episulfide group, and a thermosetting compound having a vinyl group.

[0179] From the viewpoint of improving the thermosetting property, the (D) thermosetting compound preferably has a cyclic ether group or a cyclic thioether group, and more preferably has an epoxy group. From the viewpoint of improving the thermosetting property, the (D) thermosetting compound preferably contains a thermosetting compound having a cyclic ether group or a thermosetting compound having a cyclic thioether group. From the viewpoint of improving the thermosetting property, the (D) thermosetting compound more preferably contains an epoxy compound.

[0180] Examples of the epoxy compound include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, cresol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton, etc.

[0181] The epoxy compound may be a glycidyl ether type epoxy compound. The glycidyl ether type epoxy compound refers to an epoxy compound having at least one glycidyl ether group. In addition, the epoxy compound may be a glycidylamine type epoxy compound. The glycidylamine type epoxy compound refers to an epoxy compound having at least one glycidylamine group.

[0182] From the viewpoint of improving the adhesive strength between the substrate and the cured product of the curable composition and further improving the thermal cycle characteristics (especially the suppression of peeling), the (D) thermosetting compound preferably has an aromatic skeleton, and more preferably is a bisphenol A type epoxy compound or a bisphenol F type epoxy compound.

[0183] (D) The thermosetting compound may have a (meth)acryloyl group or may not have a (meth)acryloyl group. (D) The thermosetting compound may contain a thermosetting compound having a (meth)acryloyl group or may not contain a thermosetting compound having a (meth)acryloyl group. When the (D) thermosetting compound has a photocurable functional group such as a (meth)acryloyl group, the thermosetting compound having a photocurable functional group corresponds to the component having a photocurable functional group.

[0184] The (D) thermosetting compound having a (meth)acryloyl group is a photo- and thermosetting compound.

[0185] Examples of the photo- and thermosetting compound include glycidyl (meth)acrylate, and glycidyl ether of 4-hydroxybutyl (meth)acrylate, etc.

[0186] In 100% by weight of the curable composition, the content of the (D) thermosetting compound is preferably 5% by weight or more, more preferably 10% by weight or more, still more preferably 15% by weight or more, preferably 45% by weight or less, more preferably 40% by weight or less, still more preferably 35% by weight or less, and particularly preferably 30% by weight or less. When the content of the (D) thermosetting compound is at least the above lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of the (D) thermosetting compound is at most the above upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0187] Based on 100 parts by weight of the content of the component having a photocurable functional group, the content of the (D) thermosetting compound is preferably 10 parts by weight or more, more preferably 15 parts by weight or more, still more preferably 20 parts by weight or more, preferably 65 parts by weight or less, more preferably 55 parts by weight or less, still more preferably 50 parts by weight or less. When the content of the (D) thermosetting compound is at least the above lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of the (D) thermosetting compound is at most the above upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0188] Based on 100 parts by weight of the total content of the (A) cyclopolymerizable compound and the (B) photocurable compound, the content of the (D) thermosetting compound is preferably 10 parts by weight or more, more preferably 20 parts by weight or more, still more preferably 30 parts by weight or more, preferably 150 parts by weight or less, more preferably 100 parts by weight or less, still more preferably 50 parts by weight or less. When the content of the (D) thermosetting compound is at least the above lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of the (D) thermosetting compound is at most the above upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0189] Based on 100 parts by weight of the total content of (A) the cyclopolymerizable compound and (B1) the photocurable compound having an alicyclic skeleton, the content of (D) the thermosetting compound is preferably 10 parts by weight or more, more preferably 20 parts by weight or more, still more preferably 30 parts by weight or more, preferably 150 parts by weight or less, more preferably 100 parts by weight or less, and still more preferably 50 parts by weight or less. When the content of (D) the thermosetting compound is at least the above lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of (D) the thermosetting compound is at most the above upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0190] Based on 100 parts by weight of the content of (A) the cyclopolymerizable compound, the content of (D) the thermosetting compound is preferably 25 parts by weight or more, more preferably 45 parts by weight or more, still more preferably 50 parts by weight or more, particularly preferably 60 parts by weight or more, still more preferably 70 parts by weight or more, preferably 600 parts by weight or less, more preferably 400 parts by weight or less, and still more preferably 200 parts by weight or less. When the content of (D) the thermosetting compound is at least the above lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of (D) the thermosetting compound is at most the above upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0191] Based on 100 parts by weight of the content of (B) the photocurable compound, the content of (D) the thermosetting compound is preferably 25 parts by weight or more, more preferably 45 parts by weight or more, still more preferably 60 parts by weight or more, preferably 600 parts by weight or less, more preferably 400 parts by weight or less, and still more preferably 200 parts by weight or less. When the content of (D) the thermosetting compound is at least the above lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of (D) the thermosetting compound is at most the above upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0192] With respect to 100 parts by weight of the content of the photocurable compound having an alicyclic skeleton (B1), the content of the (D) thermosetting compound is preferably 25 parts by weight or more, more preferably 50 parts by weight or more, further preferably 70 parts by weight or more, preferably 600 parts by weight or less, more preferably 400 parts by weight or less, and further preferably 200 parts by weight or less. When the content of the (D) thermosetting compound is above the lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of the (D) thermosetting compound is below the upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0193] <(E) Thermal curing agent>

[0194] The curable composition contains an (E) thermal curing agent. The (E) thermal curing agent thermally cures the (D) thermosetting compound.

[0195] Examples of the (E) thermal curing agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. As the (E) thermal curing agent, modified polyamine compounds such as amine-epoxy adducts can be used. The (E) thermal curing agent can be used alone or in combination of two or more.

[0196] The amine compound refers to a compound having one or more primary to tertiary amino groups. Examples of the amine compound include (1) aliphatic amines, (2) alicyclic amines, (3) aromatic amines, (4) hydrazides, and (5) guanidine derivatives. As the amine compound, adducts such as epoxy compound-added polyamines (reactants of epoxy compounds and polyamines), Michael addition polyamines (reactants of α,β-unsaturated ketones and polyamines), Mannich addition polyamines (condensates of polyamines, formalin, and phenols), thiourea addition polyamines (reactants of thioureas and polyamines), and ketone-capped polyamines (reactants of ketone compounds and polyamines [ketimines]) can be used.

[0197] Examples of the (1) aliphatic amines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0198] Examples of the (2) alicyclic amines include menthenediamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5,5]undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0199] Examples of the (3) aromatic amine include m-phenylenediamine, p-phenylenediamine, o-xylenediamine, m-xylenediamine, p-xylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenyl ether, 4,4-diamino-3,3-diethyl-5,5-dimethyldiphenylmethane, diphenylmethane, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenyl sulfone, etc.

[0200] Examples of the (4) hydrazide include carbodihydrazide, adipic dihydrazide, sebacic dihydrazide, dodecanedioic dihydrazide, and isophthalic dihydrazide, etc.

[0201] Examples of the (5) guanidine derivative include dicyandiamide, 1-o-tolylbiguanide, α-2,5-dimethylguanidine, α,ω-diphenylguanidine, α,α-bis(amidino)guanidine diphenyl ether, p-chlorophenylbiguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)]biguanide, phenylbiguanide oxalate, acetylguanidine, and diethyl cyanoacetylguanidine, etc.

[0202] Examples of the phenolic compound include polyphenolic compounds, etc. Examples of the polyphenolic compound include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, phenol novolak resin containing a naphthalene skeleton, phenol novolak resin containing a xylylene skeleton, phenol novolak resin containing a dicyclopentadiene skeleton, and phenol novolak resin containing a fluorene skeleton, etc.

[0203] Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecylsuccinic anhydride, chlorendic anhydride, pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, methylcyclohexene tetracarboxylic dianhydride, trimellitic anhydride, and polynonanoic anhydride, etc.

[0204] From the viewpoint of enabling good ejection of the curable composition using an inkjet device, the (E) thermal curing agent preferably contains an aromatic amine. The aromatic amine may have one benzene ring, two benzene rings, more than two benzene rings, or more than three benzene rings. The aromatic amine may have ten or fewer benzene rings. The aromatic amine may have one amino group, two amino groups, more than two amino groups, or more than three amino groups. The aromatic amine may have ten or fewer amino groups. From the viewpoint of enabling good ejection of the curable composition using an inkjet device, the aromatic amine preferably has more than two benzene rings and more than two amino groups.

[0205] From the viewpoint of enabling good ejection of the curable composition using an inkjet device, in the aromatic amine, adjacent benzene rings are preferably bonded through an oxygen atom or a sulfur atom. From the viewpoint of enabling good ejection of the curable composition using an inkjet device, in the aromatic amine, the adjacent benzene rings are preferably bonded through an ether bond or a thioether bond.

[0206] Examples of the aromatic amine having more than two benzene rings, more than two amino groups, and adjacent benzene rings bonded through an oxygen atom or a sulfur atom include bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4-diaminodiphenylsulfone, and 4,4-diaminodiphenyl ether. From the viewpoint of enabling good ejection of the curable composition using an inkjet device, the aromatic amine more preferably contains 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone, and further preferably contains 1,3-bis(3-aminophenoxy)benzene. From the viewpoint of enabling good ejection of the curable composition using an inkjet device, the (E) thermal curing agent preferably contains 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone, and more preferably contains 1,3-bis(3-aminophenoxy)benzene.

[0207] In 100% by weight of the curable composition, the content of the (E) thermal curing agent is preferably 1% by weight or more, more preferably 5% by weight or more, further preferably 8% by weight or more, preferably 40% by weight or less, more preferably 30% by weight or less, and further preferably 25% by weight or less. When the content of the (E) thermal curing agent is at or above the lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of the (E) thermal curing agent is at or below the upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0208] With respect to 100 parts by weight of the content of the (D) thermosetting compound, the content of the (E) thermosetting agent is preferably 25 parts by weight or more, more preferably 30 parts by weight or more, still more preferably 35 parts by weight or more, preferably 90 parts by weight or less, more preferably 80 parts by weight or less, and still more preferably 70 parts by weight or less. When the content of the (E) thermosetting agent is at or above the lower limit, the adhesive strength between the substrate and the cured product of the curable composition can be improved, and the thermal cycle characteristics (especially the suppression of peeling) can be further improved. When the content of the (E) thermosetting agent is at or below the upper limit, the photocurability can be further improved, and a partition wall with a larger aspect ratio can be formed.

[0209] <Curing accelerator>

[0210] The curable composition may or may not contain a curing accelerator. Only one kind of the curing accelerator may be used, or two or more kinds may be used in combination.

[0211] Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, and urea compounds.

[0212] In 100% by weight of the curable composition, the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, preferably 10% by weight or less, and more preferably 5% by weight or less.

[0213] <Solvent>

[0214] The curable composition may or may not contain a solvent. Only one kind of the solvent may be used, or two or more kinds may be used in combination.

[0215] Examples of the solvent include water and organic solvents.

[0216] From the viewpoint of further improving the removability of the residue, the solvent is preferably an organic solvent.

[0217] Examples of the organic solvent include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and mesitylene, cellosolves, methyl cellosolves, butyl cellosolves, carbitols, methyl carbitols, butyl carbitols, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether; esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum solvents such as petroleum ether and naphtha.

[0218] From the viewpoint of further improving the thickness accuracy of the curable composition layer, the content of the solvent in the curable composition is preferably as small as possible.

[0219] The curable composition preferably contains the solvent in an amount of 5% by weight or less, or does not contain the solvent, based on 100% by weight of the curable composition. When the curable composition contains the solvent, the content of the solvent is preferably 5% by weight or less, more preferably 1% by weight or less, and still more preferably 0.5% by weight or less, based on 100% by weight of the curable composition. The curable composition most preferably does not contain the solvent.

[0220] <Other components>

[0221] The curable composition may contain other components in addition to the above components. Examples of the other components include coupling agents, curing accelerators, flame retardants, colorants, fillers, leveling agents, defoaming agents, antioxidants, and polymerization inhibitors.

[0222] The curable composition may or may not contain a filler. From the viewpoint of miniaturizing the resulting electronic component by ejecting the curable composition well using an inkjet device and coating the curable composition with high precision near the light-emitting device, the curable composition preferably contains the filler in an amount of 30% by weight or less, or does not contain the filler, based on 100% by weight of the curable composition. When the curable composition contains the filler, the content of the filler is preferably 20% by weight or less, more preferably 10% by weight or less, and still more preferably 5% by weight or less, based on 100% by weight of the curable composition. From the viewpoint of miniaturizing the resulting electronic component by ejecting the curable composition well using an inkjet device and coating the curable composition with high precision near the light-emitting device, the curable composition most preferably does not contain the filler.

[0223] (Other details of the curable composition)

[0224] The curable composition is applied using an inkjet device and is therefore usually in a liquid state at 25°C. The liquid state also includes a paste state. The viscosity of the curable composition at 25°C and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, still more preferably 10 mPa·s or more, further preferably 30 mPa·s or more, still more preferably 40 mPa·s or more, particularly preferably 60 mPa·s or more, and most preferably 80 mPa·s or more. The viscosity of the curable composition at 25°C and 10 rpm is preferably 1000 mPa·s or less, more preferably 500 mPa·s or less, further preferably 400 mPa·s or less, particularly preferably 300 mPa·s or less, and most preferably 160 mPa·s or less. From the viewpoints of further improving the inkjet ejection property, further improving the thickness accuracy of the curable composition layer, and further making the curable composition layer less likely to generate voids, the viscosity of the curable composition at 25°C and 10 rpm is particularly preferably 10 mPa·s or more and 160 mPa·s or less.

[0225] The viscosity is measured in accordance with JIS K2283 using an E-type viscometer (e.g., "TVE22L" manufactured by Toki Sangyo Co., Ltd.) under the conditions of 25°C and 10 rpm.

[0226] The curable composition is, for example, suitable for forming a partition (use of the curable composition for forming a partition). The curable composition can be used to form a partition. The curable composition is preferably used for forming a partition. The curable composition is preferably a curable composition for partition formation. The curable composition is preferably used for forming a partition in an electronic component (use of the curable composition for forming a partition in an electronic component). The curable composition is particularly suitable for forming a partition in an LED module (use of the curable composition for forming a partition in an LED module). The curable composition is preferably a curable composition for partition formation. The curable composition is suitable for forming a partition in the gap between a plurality of LED chips (use of the curable composition for forming a partition in the gap between a plurality of LED chips). The curable composition is suitable for forming a partition at the peripheral portion of the mounting area of an LED chip (use of the curable composition for forming a partition at the peripheral portion of the mounting area of an LED chip). Thereby, the utilization efficiency of light generated from the LED chip can be improved, and color change when the LED module is observed obliquely can be suppressed. It should be noted that in the case where the LED chip is an LED chip that emits ultraviolet light (UV-LED chip), the luminous efficiency of the LED chip itself is sometimes low. By using the curable composition, the light extraction efficiency can be improved, and therefore the curable composition is particularly suitable for the case where the LED chip is an LED chip that emits ultraviolet light.

[0227] The curable composition is preferably used by coating the first surface of the substrate so as to surround a light-emitting component (LED chip) disposed on the first surface of the substrate. The curable composition is preferably coated in a frame shape on the first surface of the substrate for use. The curable composition is preferably used for forming a frame-shaped partition wall (use of the curable composition for forming a frame-shaped partition wall). Preferably, a light-emitting component (LED chip) is present inside the frame-shaped partition wall. Preferably, an internal space is present inside the partition wall. Preferably, a void portion is present inside the partition wall.

[0228] In addition, the curable composition can also be used for purposes other than forming the partition wall. Examples of such purposes include uses as a marking material, an adhesive, a coating material, and a light-shielding material. By using the curable composition of the present invention, peeling and cracking can be effectively suppressed. Therefore, by using the curable composition of the present invention for a marking material, an adhesive, a coating material, or a light-shielding material, the reliability can be improved. The curable composition of the present invention can perform fine coating, which is a characteristic of inkjet, and thus can be more suitably used as a marking material in an electronic component, an adhesive in an electronic component, a coating material in an electronic component, or a light-shielding material in an electronic component.

[0229] (Electronic component (such as an LED module) and method for manufacturing an electronic component (such as an LED module))

[0230] In this specification, an invention of an electronic component (such as an LED module) and a method for manufacturing an electronic component (such as an LED module) is also disclosed. The electronic component disclosed below is preferably an LED module. The method for manufacturing the electronic component disclosed below is preferably a method for manufacturing an LED module. The electronic element described below is preferably an LED chip.

[0231] The electronic component (such as an LED module) of the present invention includes a substrate, an electronic element (such as an LED chip) disposed on the first surface of the substrate, and a partition wall disposed on the first surface of the substrate. In the electronic component (such as an LED module), the partition wall is disposed on the first surface of the substrate so as to surround the electronic element (LED chip). In the electronic component (such as an LED module), the partition wall is a cured product of the curable composition for inkjet.

[0232] In addition, the manufacturing method of the electronic component (such as an LED module) of the present invention includes the following steps. (1) A step of preparing a curable composition for inkjet containing a cyclopolymerizable compound, a photocurable compound, a photopolymerization initiator, a thermosetting compound, and a thermosetting agent. (2) A coating step of coating the curable composition in a frame shape on the first surface of a substrate by an inkjet method to form a composition layer. (3) A photocuring step of irradiating light on the composition layer to form a B-stage product. (4) A thermosetting step of thermosetting the B-stage product by heating to form a partition wall. (5) A step of disposing an electronic component (such as an LED module) inside the region surrounded by the partition wall on the first surface of the substrate.

[0233] In the electronic component (such as an LED module) and the manufacturing method of the electronic component (such as an LED module) of the present invention, due to the above configuration, the thermal cycling characteristics can be improved. In addition, in the electronic component (such as an LED module) and the manufacturing method of the electronic component (such as an LED module) of the present invention, due to the above configuration, the reflow soldering resistance can be improved. Further, in the electronic component (such as an LED module) and the manufacturing method of the electronic component (such as an LED module) according to the present invention, due to the above configuration, the light extraction efficiency of light generated from an electronic element (such as an LED chip) can be improved.

[0234] Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. In the embodiments described below, the electronic component is an LED module and the electronic element is an LED chip. It should be noted that in the following drawings, for the convenience of illustration, the size, thickness, shape, etc. are sometimes different from the actual size, thickness, shape, etc.

[0235] Figure 1 (a) is a top view schematically showing an LED module obtained by using the curable composition of the first embodiment of the present invention. Figure 1 (b) is a cross-sectional view schematically showing the LED module. Figure 1 (b) is a cross-sectional view along the Figure 1 I-I line of (a).

[0236] Figure 1The LED module 1 shown includes a substrate 11, an LED chip 12 disposed on the first surface 11a of the substrate 11, and a partition wall 13 disposed on the first surface 11a of the substrate 11. In the LED module 1, the partition wall 13 is disposed on the first surface 11a of the substrate 11 so as to surround the LED chip 12. In the LED module 1, the partition wall 13 is a cured product of the curable composition. The outer side surface of the LED chip 12 is spaced apart from the inner side surface of the partition wall 13. There is a space between the outer side surface of the LED chip 12 and the inner side surface of the partition wall 13. In the LED module 1, the partition wall 13 is formed of the curable composition. The partition wall 13 is not disposed (formed) on the surface of the LED chip 12. The upper surface of the LED chip 12 is not covered by the partition wall 13. The shape of the partition wall 13 is a frame shape.

[0237] Figure 2 FIG. is a cross-sectional view schematically showing an LED module obtained by using the curable composition of the second embodiment of the present invention.

[0238] Figure 2 The LED module 1A shown further includes a substrate 11, an LED chip 12 disposed on the first surface 11a of the substrate 11, a partition wall 13 disposed on the first surface 11a of the substrate 11, and a reflective film 14 on the inner wall surface (inner side surface) of the partition wall 13. The outer side surface of the LED chip 12 is spaced apart from the inner side surface of the partition wall 13. There is a space between the outer side surface of the LED chip 12 and the inner side surface of the partition wall 13. The outer side surface of the LED chip 12 is spaced apart from the inner side surface of the reflective film 14. There is a space between the outer side surface of the LED chip 12 and the inner side surface of the reflective film 14. The LED module 1A differs from the LED module 1 only in the presence or absence of the reflective film 14. The LED module may or may not have a reflective film on the inner wall surface of the partition wall.

[0239] Refer to Figure 3 (a) to (c), Figure 4 (d) to (f) and Figure 5 (g), an example of the manufacturing method of the LED module 1 shown will be described. Figure 1

[0240] First, a curable composition for inkjet (curable composition) containing a cyclopolymerizable compound, a photocurable compound, a photoinitiator, a thermosetting compound, and a thermosetting agent is prepared.

[0241] Figure 3 Next, as (a) shows, the curable composition is applied on the first surface 11a of the substrate 11 by an inkjet method to form a composition layer 13A (coating step). The curable composition is ejected from the ejection portion 51 of the inkjet device.

[0242] ​In addition, as Figure 3 (b) shows, light is irradiated from the light irradiation unit 52 of the inkjet device onto the composition layer 13A to cure the composition layer 13A, and a B-stage product 13B is formed (photo-curing step). The B-stage product 13B is a pre-cured product of the curable composition.

[0243] It should be noted that in the manufacturing method of the LED module, after coating the curable composition in a specific area, light can be irradiated onto the entire coated curable composition to form a B-stage product. In the manufacturing method of the LED module, each time multiple drops of the curable composition are coated, light can be irradiated onto the coated curable composition to form a B-stage product. In the manufacturing method of the LED module, each time 1 drop of the curable composition is coated, light can be irradiated onto the coated curable composition to form a B-stage product.

[0244] After the photo-curing step, it is determined whether to repeat the coating step and the photo-curing step. In the case of repeating the coating step and the photo-curing step, the curable composition is coated on the surface side of the formed B-stage product 13B opposite to the substrate 11 side.

[0245] Figure 3 (c) and Figure 4 (d) are diagrams showing the second coating step and the second photo-curing step respectively. As Figure 3 (c) shows, using an inkjet device, the curable composition is coated on the surface of the B-stage product 13B opposite to the substrate 11 side, and a composition layer 13A is formed on the surface of the B-stage product 13B. Then, as Figure 4 (d) shows, light is irradiated from the light irradiation unit 52 of the inkjet device onto the coated composition layer 13A to form a B-stage product 13B.

[0246] Figure 3 、 Figure 4 In, the coating step and the photo-curing step are performed in the thickness direction of the composition layer Figure 3 (a) and Figure 3 (b) and Figure 3 (c) and Figure 4 (d) twice. By performing the coating step and the photo-curing step multiple times in the thickness direction of the composition layer respectively, the thickness of the B-stage product can be increased, and the aspect ratio (thickness / width) of the B-stage product can be increased. The coating step and the photo-curing step can be performed more than 2 times respectively, or can be performed more than 3 times.

[0247] By repeating the coating step and the photo-curing step, a Figure 4 (e)-shown frame-shaped B-stage product 13B is formed.

[0248] Next, as Figure 4As shown in (f), the B-stage compound 13B is thermally cured by heating (thermal curing step). By heating Figure 4 the structure including the substrate 11 and the B-stage compound 13B obtained in (e), the B-stage compound 13B is thermally cured. Thereby, the partition wall 13 is formed. The partition wall 13 is a cured product layer of the curable composition.

[0249] Next, as Figure 5 shown in (g), the LED chip 12 is disposed inside the region surrounded by the partition wall 13 on the first surface 11a of the substrate 11. In this way, the Figure 1 LED module 1 as shown can be obtained.

[0250] It should be noted that, after the thermal curing step shown in (f) and Figure 4 before the step of disposing the LED chip 12 shown in (g), a reflective film may be further formed on the inner wall surface of the partition wall 13. In the case where a reflective film is further formed on the inner wall surface of the partition wall 13, the Figure 5 LED module 1A as shown is manufactured. Figure 2

[0251] The curable composition is preferably ejected in a state heated to 40°C or higher and 100°C or lower when ejected by the inkjet device. From the viewpoint of continuously ejecting the curable composition for a long time, it is preferable to perform coating while circulating the curable composition.

[0252] In the case of circulating the curable composition while heating it, the temperature of the curable composition can be adjusted by introducing a heater into the ink tank of the inkjet device or using a heater in the circulation flow path portion.

[0253] In the photocuring step, it is preferable to irradiate ultraviolet rays. The illuminance and irradiation time of the ultraviolet rays in the photocuring step can be appropriately changed according to the composition of the curable composition and the coating thickness of the curable composition. The illuminance of the ultraviolet rays in the photocuring step can be, for example, 1000 mW / cm 2 or more, can be 2000 mW / cm 2 or more, can be 5000 mW / cm 2 or more, can be 10000 mW / cm 2 or less, can be 8000 mW / cm 2 or less. The irradiation time of the ultraviolet rays in the photocuring step can be, for example, 0.01 second or more, can be 0.1 second or more, can be 400 seconds or less, can be 100 seconds or less.

[0254] ​The time from the coating step to the irradiation of ultraviolet rays can be appropriately changed according to the composition (especially curability) of the curable composition and the coating thickness. The time from the coating step to the irradiation of ultraviolet rays can be 0.001 seconds or more, can be 0.01 seconds or more, can be 0.1 seconds or more, can be within 40 seconds, can be within 4 seconds, and can also be within 0.4 seconds. The time from the coating step to the irradiation of ultraviolet rays can be adjusted by the ejection speed of the inkjet device and the distance between the ejection part and the light irradiation part of the inkjet device.

[0255] The heating temperature and heating time in the thermosetting step can be appropriately changed according to the composition of the curable composition and the thickness of the B-stage compound. The heating temperature in the thermosetting step can be, for example, 100°C or more, can be 120°C or more, can be 250°C or less, and can be 200°C or less. The heating time in the thermosetting step can be, for example, 5 minutes or more, can be 30 minutes or more, can be 600 minutes or less, and can be 300 minutes or less.

[0256] In the LED module of the present invention, it is preferable that the partition is arranged in a frame shape. In the LED module, it is preferable that the partition is not arranged in the central part of the substrate. From the viewpoint of improving the brightness of the LED module, in the LED module, it is preferable that a space is provided between the outer side surface of the LED chip and the inner side surface of the partition.

[0257] The width, height, etc. of the partition can be appropriately changed.

[0258] The width of the partition can be 30μm or more, can be 50μm or more, can be 70μm or more, can be 1000μm or less, can be 800μm or less, and can be 700μm or less.

[0259] From the viewpoint of further improving the light extraction efficiency of the light generated from the LED chip, the height of the LED chip is preferably 10μm or more, more preferably 20μm or more, further preferably 50μm or more, preferably 300μm or less, more preferably 200μm or less, and further preferably 150μm or less.

[0260] From the viewpoint of further improving the light extraction efficiency of the light generated from the LED chip, the height of the partition is preferably 100μm or more, more preferably 250μm or more, further preferably 400μm or more, preferably 3000μm or less, more preferably 2000μm or less, and further preferably 1500μm or less.

[0261] From the viewpoint of further improving the light extraction efficiency of light generated from the LED chip, the height of the partition wall is preferably 50 μm or more higher than the height of the LED chip, more preferably 100 μm or more higher, and further preferably 200 μm or more higher.

[0262] The aspect ratio (height / width) of the partition wall is preferably 3 or more, more preferably 4 or more, and further preferably 5 or more. The aspect ratio (height / width) of the partition wall can be 100 or less, can be 50 or less, can be 25 or less, and can be 15 or less.

[0263] The substrate may be a transparent member or may not be a transparent member. Examples of the substrate include a circuit board and a silicon substrate. Examples of the electronic component include a semiconductor component. The electronic component is preferably a semiconductor component. Examples of the semiconductor component include an LED chip. The semiconductor component is preferably an LED chip.

[0264] The LED chip may be a red LED chip, a blue LED chip, a green LED chip, a UV-LED chip, or a combination of these LED chips. The UV-LED chip may be a deep ultraviolet UV-LED chip.

[0265] From the viewpoint of further improving the light extraction efficiency of light generated from the LED chip, the LED module preferably further includes a reflective film on the inner wall surface of the partition wall. The reflective film may be formed on the outer wall surface of the partition wall or may not be formed.

[0266] From the viewpoint of further improving the light extraction efficiency of light generated from the LED chip, the manufacturing method of the LED module preferably further includes a step of forming a reflective film on the inner wall surface of the partition wall.

[0267] Examples of the material of the reflective film include silver, chromium, copper, niobium, niobium oxide, hafnium, hafnium oxide, silicon, silicon dioxide, titanium, and aluminum. The material of the reflective film may use only one type or may use two or more types in combination. From the viewpoint of further improving the utilization efficiency of light generated by the LED chip, the material of the reflective film is preferably aluminum.

[0268] As a method for forming the reflective film on the inner wall surface of the partition wall, there can be mentioned a method using electroless plating, a method using electroplating, a method using physical impact, a method using mechanochemical reaction, a physical film-forming method, or a method using physical adsorption, and a method of coating the surface of the partition wall with metal powder or a paste containing metal powder and binder, etc. The method for forming the reflective film on the inner wall surface of the partition wall is preferably a method using electroless plating, electroplating or physical impact. As the physical film-forming method, there can be mentioned methods such as vacuum evaporation, ion plating and ion sputtering. In addition, as a method based on the physical impact, THETA COMPOSER (manufactured by Tokushu Kikou Co., Ltd.) etc. can be used.

[0269] The shape of the LED module is not particularly limited. The shape of the LED module can be circular, rectangular, or triangular.

[0270] Hereinafter, examples are given to explain the present invention in more detail. The present invention is not limited to the following examples.

[0271] Prepare the following materials.

[0272] ((A) Cyclic polymerizable compound)

[0273] Methyl-2-(allyloxymethyl)acrylate (manufactured by Nippon Shokubai Co., Ltd. "AOMA," monofunctional cyclic polymerizable compound)

[0274] 2-Methoxyethyl-2-(allyloxymethyl)acrylate (ME-AMA, monofunctional cyclic polymerizable compound)

[0275] Tetrahydrofuran-2-ylmethyl-2-(allyloxymethyl)acrylate (THFM-AMA, monofunctional cyclic polymerizable compound)

[0276] 2-Phenoxyethyl-2-(allyloxymethyl)acrylate (PE-AMA, monofunctional cyclic polymerizable compound)

[0277] Cyclohexyl-2-(allyloxymethyl)acrylate (CH-AMA, monofunctional cyclic polymerizable compound having an alicyclic skeleton)

[0278] Isobornyl-2-(allyloxymethyl)acrylate (IB-AMA, cyclic polymerizable compound having an alicyclic skeleton)

[0279] Tripropylene glycol di-2-(allyloxymethyl)acrylate (TPG-AMA, difunctional cyclic polymerizable compound)

[0280] 1,6-Hexanediol di-2-(allyloxymethyl)acrylate (HD-AMA, difunctional cyclic polymerizable compound)

[0281] Neopentyl glycol di-2-(allyloxymethyl) acrylate (NPGD-AMA, difunctional cyclopolymerizable compound)

[0282] Tricyclodecane dimethanol di-2-(allyloxymethyl) acrylate (TCDDM-AMA, difunctional cyclopolymerizable compound with alicyclic skeleton)

[0283] Trimethylolpropane tri-2-(allyloxymethyl) acrylate (TMPT-AMA, trifunctional cyclopolymerizable compound)

[0284] Dipentaerythritol hexa-(allyloxymethyl) acrylate (DPH-AMA, hexafunctional cyclopolymerizable compound)

[0285] It should be noted that each (A) cyclopolymerizable compound other than methyl-2-(allyloxymethyl) acrylate is synthesized using triethylamine, allyl alcohol, and the corresponding 2-halomethyl acrylate of each (A) cyclopolymerizable compound. Then, 1H-NMR measurement is performed using an NMR measuring device ("ECX-400" manufactured by JEOL Ltd.) 1 to confirm the progress of each synthesis reaction. 1 The 1H-NMR measurement is carried out using deuterated chloroform as a solvent under the conditions of a sample concentration of 1 wt%, 25 °C, a measurement frequency of 400 MHz, and 16 accumulations.

[0286] ((B) photocurable compound)

[0287] (B1) Photocurable compound with alicyclic skeleton:

[0288] Tricyclodecane dimethanol diacrylate ("IRR214K" manufactured by DAICEL-ALLNEX, difunctional (meth)acrylate compound with dicyclopentadiene skeleton)

[0289] Isobornyl acrylate ("IBOA" manufactured by DAICEL-ALLNEX, monofunctional (meth)acrylate compound with norbornene skeleton)

[0290] (Meth)acrylic acid 2-methyladamantan-2-yl ester ("MADA" manufactured by Osaka Organic Chemical Industry Co., Ltd., monofunctional (meth)acrylate compound with adamantane skeleton)

[0291] (B2) Other photocurable compounds:

[0292] Dipropylene glycol diacrylate ("DPGDA" manufactured by DAICEL-ALLNEX, difunctional (meth)acrylate compound)

[0293] Dipentaerythritol hexaacrylate (“DPHA” manufactured by DAICEL-ALLNEX, a hexa-functional (meth)acrylate compound)

[0294] Trimethylolpropane triacrylate (“A-TMPT” manufactured by Shin-Nakamura Chemical Co., Ltd., a tri-functional (meth)acrylate compound)

[0295] 1,9-Nonanediol diacrylate (“1,9-NDDA” manufactured by Osaka Organic Chemical Industry Co., Ltd., a di-functional (meth)acrylate compound)

[0296] 4-Hydroxybutyl acrylate (“4HBA” manufactured by Osaka Organic Chemical Industry Co., Ltd., a mono-functional (meth)acrylate compound)

[0297] ((C) Photoinitiator)

[0298] 2-(Dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (“Omnirad379” manufactured by IGM)

[0299] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide (“TPO” manufactured by IGM)

[0300] ((D) Thermosetting compound)

[0301] Bisphenol F type liquid epoxy resin (“830CRP” manufactured by DIC)

[0302] Bisphenol A type liquid epoxy resin (“850CRP” manufactured by DIC)

[0303] Dicyclopentadiene dimethanol diglycidyl ether (“EP-4088S” manufactured by ADEKA)

[0304] Bisphenol A type epoxy resin (“YD-127” manufactured by NIPPON STEEL Chemical&Material)

[0305] Dicyclopentadiene type epoxy compound (“HP-7200L” manufactured by DIC)

[0306] Naphthalene type epoxy compound (“HP-4710” manufactured by DIC)

[0307] ((E) Thermosetting agent)

[0308] 1,3-Bis(3-aminophenoxy)benzene (“APB-N” manufactured by Mitsui Chemicals)

[0309] Bis[4-(3-aminophenoxy)phenyl]sulfone (“BAPSM” manufactured by SEIKA)

[0310] Coupling agent

[0311] 3-Glycidoxypropylmethyldimethoxysilane (“KBM-402” manufactured by Shin-Etsu Chemical Co., Ltd.)

[0312] Polymerization inhibitor

[0313] Aluminum N-nitrosophenylhydroxylamine (“Q1301” manufactured by Fujifilm Wako Pure Chemical Corporation)

[0314] (Examples 1 to 57 and Comparative Examples 1 to 5)

[0315] (Preparation of curable composition for inkjet):

[0316] Mix the components shown in the table in the blending amounts (parts by weight) shown in the table uniformly to obtain a curable composition for inkjet (curable composition).

[0317] (Formation of partition walls):

[0318] Prepare an aluminum nitride substrate with a surface roughness Ra of 0.4 μm. On the surface of the substrate, while circulating the obtained curable composition at 75°C, repeat the coating process and the first photocuring process (UV-LED lamp with a main wavelength of 365 nm, 4000 mW / cm 2 、 irradiate for 0.1 second 0.2 seconds after coating), to form a laminate with a width of 2 mm × a length of 1.5 mm × a height of 1 mm. Then, cure it through the second light irradiation process (metal halide lamp, 1000 mW / cm 2 、 10 seconds). Then, heat it at 170°C for 2 hours for thermal curing to obtain a laminate with partition walls formed on the surface of the substrate (laminate for evaluating thermal cycle characteristics).

[0319] (Evaluation)

[0320] (1) Glass transition temperature of cured product

[0321] After coating the obtained curable composition on the surface of a PET film using an inkjet device, irradiate with a cumulative light amount of 300 mJ / cm 2 in such a way that the illuminance at a wavelength of 365 nm becomes 3000 mW / cm 2Ultraviolet (UV-LED), prepare the B-stage compound of the curable composition. Heat the obtained B-stage compound at 170 °C for 2 hours to form a cured product (C-stage compound) of the curable composition with a thickness of 200 μm. Cut out a measurement sample from the obtained cured product. For the glass transition temperature of the cured product, use a dynamic viscoelasticity measurement device ("DVA-200" manufactured by IT Measurement Control Co., Ltd.), and obtain the glass transition temperature of the cured product from the maximum value of the loss modulus / storage modulus under the measurement conditions of a tensile condition, a frequency of 10 Hz, a strain of 0.1%, a temperature range of -40 °C to 250 °C, and a heating rate of 10 °C / min. It should be noted that the size of the measurement sample is 30 mm in length, 4 mm in width, and 200 μm in thickness.

[0322] (2) Storage modulus of the cured product at 125 °C

[0323] (1) For the measurement sample prepared at the glass transition temperature of the cured product, use a dynamic viscoelasticity measurement device ("DVA-200" manufactured by IT Measurement Control Co., Ltd.), and measure the storage modulus of the cured product under the measurement conditions of a tensile condition, a frequency of 10 Hz, a strain of 0.1%, a temperature range of -40 °C to 250 °C, and a heating rate of 10 °C / min. Obtain the storage modulus of the cured product at 125 °C from the obtained graph of the tensile storage modulus.

[0324] (3) Thermal cycle characteristics

[0325] (3-1) Inhibitory effect on peeling

[0326] For the obtained laminate, use a thermal cycle of cooling at -40 °C for 15 minutes, heating at a heating rate of 100 °C / min to 125 °C, heating at 125 °C for 15 minutes, and cooling at a cooling rate of 100 °C / min to -40 °C as one cycle, and repeat 1000 times. For the laminate before and after the thermal cycle test, use a chip shear strength measurement device ("DAGE4000PXY" manufactured by Nordson Corporation), and press against the partition at a height of 50 μm from the substrate surface under the conditions of a blade length of 2 mm and a speed of 10 μm / s to measure the chip shear strength. Let the chip shear strength before the thermal cycle test be F1, and the chip shear strength after the thermal cycle test be F2, and calculate the ratio (F2 / F1). Judge the inhibitory effect on peeling according to the following criteria.

[0327] [Judgment criteria for inhibitory effect on peeling]

[0328] ○○: The ratio (F2 / F1) is 0.50 or more

[0329] ○: The ratio (F2 / F1) is 0.30 or more and less than 0.50

[0330] △: The ratio (F2 / F1) is 0.15 or more and less than 0.30

[0331] × (F2 / F1) is less than 0.15

[0332] (3-2) Crack inhibition

[0333] For the obtained laminate, the thermal cycle of cooling at -40°C for 15 minutes, heating at a heating rate of 100°C / minute to 125°C, heating at 125°C for 15 minutes, and cooling at a cooling rate of 100°C / minute to -40°C is taken as one cycle, and it is repeated 1000 times. For the laminates after 250 cycles, 500 cycles, and 1000 cycles, a microscope (KEYENCE Corporation's "VH X-5000") is used to observe whether cracks occur in the partition walls. The crack inhibition is judged according to the following criteria.

[0334] [Judgment criteria for crack inhibition]

[0335] ○○: No cracks after 1000 cycles

[0336] ○: No cracks after 500 cycles and cracks after 1000 cycles

[0337] △: No cracks after 250 cycles and cracks after 500 cycles

[0338] ×: Cracks after 250 cycles

[0339] (4) Formation of partition walls with a large aspect ratio

[0340] Using an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device, the obtained curable composition is coated on the first member (coating step). Then, the coated curable composition is irradiated with ultraviolet rays to form a B-stage layer (photo-curing step). The coating step and the photo-curing step are repeated in the thickness direction of the formed B-stage layer. Then, the obtained B-stage layer is heated to thermally cure it to form a partition wall (photo- and thermo-cured layer) (thermal curing step). Using a laser microscope (Olympus Corporation's "OLS4100"), the shape of the partition wall is observed. The formation of partition walls with a large aspect ratio is judged according to the following criteria.

[0341] [Judgment criteria for the formation of partition walls with a large aspect ratio]

[0342] ○○: It is possible to form a partition wall with a width of 200 μm and a height of 1 mm;

[0343] ○: It is possible to form a partition wall with a width of 300 μm and a height of 1 mm;

[0344] ×: A partition wall with a width of 300 μm and a height of 1 mm cannot be formed.

[0345] The composition and results are shown in Tables 1 to 26 below.

[0346] [Table 1]

[0347]

[0348] [Table 2]

[0349]

[0350] [Table 3]

[0351]

[0352] [Table 4]

[0353]

[0354] [Table 5]

[0355]

[0356] [Table 6]

[0357]

[0358] [Table 7]

[0359]

[0360] [Table 8]

[0361]

[0362] [Table 9]

[0363]

[0364] [Table 10]

[0365]

[0366] [Table 11]

[0367]

[0368] [Table 12]

[0369]

[0370] [Table 13]

[0371]

[0372] [Table 14]

[0373]

[0374] [Table 15]

[0375]

[0376] [Table 16]

[0377]

[0378] [Table 17]

[0379]

[0380] [Table 18]

[0381]

[0382] [Table 19]

[0383]

[0384] [Table 20]

[0385]

[0386] [Table 21]

[0387]

[0388] [Table 22]

[0389]

[0390] [Table 23]

[0391]

[0392] [Table 24]

[0393]

[0394] [Table 25]

[0395]

[0396] [Table 26]

[0397]

[0398] It should be noted that in the evaluation of the (3) thermal cycle characteristics of the table, the results of the laminate (laminate for thermal cycle characteristic evaluation) obtained by heating at 170°C for 2 hours after the first and second photo-curing processes to thermally cure it are shown. The evaluation results of the (3) thermal cycle characteristics of the laminate obtained by heating at 180°C for 2 hours after the first and second photo-curing processes to thermally cure it are the same as the evaluation results of the (3) thermal cycle characteristics of the laminate obtained by heating at 170°C for 2 hours after the first and second photo-curing processes to thermally cure it.

[0399] Symbol Explanation

[0400] 1, 1A... LED module

[0401] 11... Substrate

[0402] 11a... First surface

[0403] 12... LED chip

[0404] 13... Partition wall

[0405] 13A... Composition layer

[0406] 13B... B-stage compound

[0407] 14... Reflective film

[0408] 51... Ejection part

[0409] 52... Light irradiation part

Claims

1. A curable composition for inkjet, comprising: Cyclopolymerizable compounds, Photocurable compounds, Photopolymerization initiator, Thermosetting compounds, and Thermal curing agent, The curable composition for inkjet satisfies the following first constitution or the following second constitution, First configuration: the photocurable compound includes a photocurable compound having an alicyclic skeleton, Second configuration: The illuminance at a wavelength of 365 nm is 3000 mW / cm 2 The curable composition for inkjet was irradiated with a cumulative light amount of 300 mJ / cm 2 When a cured product is obtained by heating at 170° C. for 2 hours after being exposed to light, the glass transition temperature of the cured product is 100° C. or higher, and the storage modulus of the cured product at 125° C. is 400 MPa or lower. 2 . The curable composition for inkjet according to claim 1 , which satisfies the first constitution. 3 . The curable composition for inkjet according to claim 1 , which satisfies the second configuration. 4 . The curable composition for inkjet according to claim 1 , which satisfies both the first constitution and the second constitution.

5. The curable composition for inkjet according to any one of claims 1, 2 and 4, wherein The photocurable compound having an alicyclic skeleton comprises: A photocurable compound having a dicyclopentadiene skeleton, A photocurable compound having a norbornene skeleton, or A photocurable compound having an adamantane skeleton.

6. The curable composition for inkjet according to any one of claims 1, 2, 4 and 5, wherein The photocurable compound having an alicyclic skeleton includes a photocurable compound having two or more photocurable functional groups.

7. The curable composition for inkjet according to any one of claims 1, 2, and 4 to 6, wherein The photocurable compound having an alicyclic skeleton includes tricyclodecane dimethanol di(meth)acrylate.

8. The curable composition for inkjet according to any one of claims 1, 2, and 4 to 7, wherein In 100 wt % of the curable composition for inkjet, the total content of the cyclopolymerizable compound and the photocurable compound having an alicyclic skeleton is 20 wt % or more and 75 wt % or less.

9. The curable composition for inkjet according to any one of claims 1, 2, and 4 to 8, further comprising: A photocurable compound different from both the cyclopolymerizable compound and the photocurable compound having an alicyclic skeleton.

10. The curable composition for inkjet according to claim 9, wherein The photocurable compound different from both the cyclopolymerizable compound and the photocurable compound having an alicyclic skeleton includes a photocurable compound having two or more (meth)acryloyl groups and a photocurable compound having one (meth)acryloyl group.

11. The curable composition for inkjet according to any one of claims 1, 2, and 4 to 10, wherein The content of the thermosetting compound is 10 parts by weight or more and 150 parts by weight or less relative to 100 parts by weight of the total content of the cyclopolymerizable compound and the photocurable compound having an alicyclic skeleton.

12. The curable composition for inkjet according to any one of claims 1, 3 and 4, wherein The storage modulus of the cured product at 125° C. is 250 MPa or less.

13. The curable composition for inkjet according to any one of claims 1 to 12, wherein The cyclopolymerizable compound has two or more carbon-carbon double bonds.

14. The curable composition for inkjet according to any one of claims 1 to 13, wherein The cyclopolymerizable compound has an allyl ether group.

15. The curable composition for inkjet according to any one of claims 1 to 14, wherein The cyclopolymerizable compound has a structure represented by the following formula (1): [Chemical formula 1] In formula (1), R represents an organic group having 1 to 200 carbon atoms.

16. The curable composition for inkjet according to any one of claims 1 to 15, wherein The cyclopolymerizable compound includes methyl-2-(allyloxymethyl)acrylic acid.

17. The curable composition for inkjet according to any one of claims 1 to 16, wherein The content of the cyclopolymerizable compound in 100% by weight of the curable composition for inkjet is 5% by weight or more and 80% by weight or less.

18. The curable composition for inkjet according to any one of claims 1 to 17, wherein The content of the photopolymerization initiator is 6 parts by weight or more and 35 parts by weight or less relative to 100 parts by weight of the component having a photocurable functional group.

19. The curable composition for inkjet according to any one of claims 1 to 18, wherein The heat curable compound comprises: A thermosetting compound having a cyclic ether group, or A thermosetting compound having a cyclic sulfide group.

20. The curable composition for inkjet according to any one of claims 1 to 19, wherein The thermal curing agent includes 1,3-bis(3-aminophenoxy)benzene. 21 . The curable composition for inkjet according to claim 1 , which is used for forming partition walls in an electronic component.

22. An electronic component comprising: substrate, an electronic component disposed on the first surface of the substrate, and a partition wall disposed on the first surface of the substrate, The partition wall is arranged on the first surface of the substrate so as to surround the electronic component. The partition wall is a cured product of the curable composition for inkjet according to any one of claims 1 to 21.

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