Processing control method, device, equipment, system and storage medium

Abstract

The embodiment of the invention discloses a processing control method, device, equipment and system and a storage medium, and the method comprises the steps: determining whether a to-be-processed region has an easy-to-ignite region or not according to the distribution density of to-be-processed lines; and if the easy-to-ignite area exists in the to-be-processed area, outputting a first processing early warning prompt. Therefore, on one hand, the easy-to-ignite area is determined from the distribution density of the to-be-processed lines in the to-be-processed pattern, so that the ignition risk caused by repeated processing in the same area due to the complex pattern when the to-be-processed pattern is too complex even if the processing parameters are detected correctly can be avoided; therefore, the accuracy of fire risk early warning in the processing process is improved. And on the other hand, the first early warning prompt can be performed according to the determined easy-to-fire area before the laser processing equipment performs processing, so that the fire risk is reduced, and the fire risk prevention can be realized.

Description

Technical Field

[0001] This application relates to the field of processing technologies, and in particular, to a processing control method, apparatus, device, system, and storage medium. Background Art

[0002] Currently, when processing a material to be processed by a laser processing device, since high temperature or sparks are usually easily generated during the processing, if there are flammable substances around, or the material to be processed itself is flammable, a fire is likely to be triggered. If continuous processing is carried out, heat accumulation may be faster, resulting in too high a temperature and increasing the fire risk.

[0003] In related technologies, for the fire risk existing in the processing process, it is usually to deal with it in time after a fire occurs. However, there will be a large amount of dust after the fire is extinguished, making the processing effect of the material to be processed poor, resulting in material waste; and it is usually to detect and identify whether there is a fire in the processing process through a camera or a sensor, which is prone to problems such as camera dead angles, sensor failures, and misjudgments, thus causing difficulties in detecting and executing a fire generated during the processing, and resulting in a poor user experience. Summary of the Invention

[0004] To solve the above technical problems, embodiments of the present application provide a processing control method, apparatus, device, system, and storage medium, so as to be able to more accurately warn of the fire risk existing in the processing process and achieve fire risk prevention.

[0005] According to one aspect of the embodiments of the present application, a processing control method is provided, including: obtaining a pattern to be processed; obtaining the distribution density of the lines to be processed in the pattern to be processed; determining whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed; if there is an easily ignitable area in the area to be processed, outputting a first processing warning prompt.

[0006] In another exemplary embodiment, the obtaining the distribution density of the lines to be processed in the pattern to be processed includes: dividing the pattern to be processed into grid areas of the same size according to a preset size; obtaining the total length of the line segments of all the lines to be processed in each grid area, and the distribution density includes the total length of the line segments.

[0007] In another exemplary embodiment, the obtaining the distribution density of the lines to be processed in the pattern to be processed includes: obtaining the bounding boxes corresponding to all the lines to be processed in the pattern to be processed; obtaining the total length of the line segments of all the lines to be processed in each bounding box area, and the distribution density includes the total length of the line segments.

[0008] In another exemplary embodiment, determining whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed includes: if there is an area where the distribution density is greater than the distribution density of a preset density threshold, it is confirmed that there is an easily ignitable area in the area to be processed, and the area corresponding to the distribution density greater than the preset density threshold is determined as the easily ignitable area.

[0009] In another exemplary embodiment, determining whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed includes: obtaining the interval distance between each line to be processed; obtaining the material type of the material to be processed, and determining a distance threshold according to the material type of the material to be processed; if there is an area where the distribution density is greater than the preset density threshold and the interval distance within the area is less than the distance threshold, it is confirmed that there is an easily ignitable area in the area to be processed, and the area where the distribution density is greater than the preset density threshold and the interval distance is less than the distance threshold is determined as the easily ignitable area.

[0010] In another exemplary embodiment, before obtaining the distribution density of the lines to be processed in the pattern to be processed, the method further includes: obtaining the processing parameters corresponding to the pattern to be processed; performing a fire risk detection on the processing parameters to obtain a detection result; in the case where the detection result is that there is a fire risk in the processing parameters, outputting a second processing warning prompt for the processing parameters.

[0011] In another exemplary embodiment, after outputting a first processing warning prompt if there is an easily ignitable area in the area to be processed, the method further includes: in response to a confirmation operation for the first processing warning prompt, adjusting the processing parameters of the pattern to be processed to obtain adjusted processing parameters; wherein, the processing parameters include at least one of the rated power of the laser head, the percentage of the output power to the rated power, and the moving speed of the laser head; processing the pattern to be processed according to the adjusted processing parameters.

[0012] In another exemplary embodiment, after outputting a first processing warning prompt if there is an easily ignitable area in the area to be processed, the method further includes: in response to a confirmation operation for the first processing warning prompt, adjusting the processing path of the pattern to be processed to obtain an adjusted processing path; processing the pattern to be processed according to the adjusted processing path so that the multiple lines to be processed within the easily ignitable area are not processed continuously.

[0013] In another exemplary embodiment, the adjustment of the processing path for the pattern to be processed includes: inserting the processing order of the to-be-processed lines in other regions between the to-be-processed lines adjacent in the processing order in the easily ignitable region, so as to obtain an adjusted processing path.

[0014] According to one aspect of the embodiments of the present application, a processing control device is provided. The device includes: a first acquisition module, a second acquisition module, and a determination module; wherein, the first acquisition module is configured to acquire a pattern to be processed; the second acquisition module is configured to acquire the distribution density of the to-be-processed lines in the pattern to be processed; the determination module is configured to determine whether there is an easily ignitable region in the to-be-processed area according to the distribution density of the to-be-processed lines; a warning prompt module, which is configured to output a first processing warning prompt if there is an easily ignitable region in the to-be-processed area.

[0015] According to one aspect of the embodiments of the present application, a laser processing device is provided. The laser processing device includes: a laser processing head, a communication component, and a controller; wherein, the laser processing head is arranged in the laser processing device; the communication component is used to receive a processing instruction corresponding to a pattern to be processed, and the processing instruction is obtained based on the processing control method described in any of the above embodiments; the controller controls the laser processing head to process a to-be-processed material based on the processing instruction corresponding to the pattern to be processed.

[0016] According to one aspect of the embodiments of the present application, a processing system is provided. The system includes: a laser processing device and a terminal device communicating with the laser processing device; wherein, the laser processing device includes a laser processing head, a communication component, and a controller; the terminal device is used to execute the processing control method described in any one of the above.

[0017] According to one aspect of the embodiments of the present application, a computer-readable storage medium is provided, on which computer-readable instructions are stored. When the computer-readable instructions are executed by a processor of a computer, the computer is made to execute the above-mentioned processing control method.

[0018] In the technical solution provided by the embodiment of the present application, by obtaining the pattern to be processed; obtaining the distribution density of the lines to be processed in the pattern to be processed; determining whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed; if there is an easily ignitable area in the area to be processed, output a first processing warning prompt. In this way, on the one hand, by starting from the distribution density of the lines to be processed in the pattern to be processed to determine the easily ignitable area, it is possible to avoid the fire risk caused by repeatedly processing in the same area when the pattern to be processed is too complex, even if the processing parameters are detected correctly, thus improving the accuracy of the fire risk warning during the processing; on the other hand, by being able to give the first warning prompt according to the determined easily ignitable area before the laser processing equipment performs processing, the fire risk is reduced, and thus the prevention of the fire risk can be achieved.

[0019] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts. In the drawings:

[0021] Figure 1 is a schematic structural diagram of a processing system shown in an exemplary embodiment of the present application;

[0022] Figure 2 is a flowchart of a processing control method shown in an exemplary embodiment of the present application;

[0023] Figure 3 is Figure 2 a flowchart of a method for obtaining the distribution density of the lines to be processed in the pattern to be processed in step S220 in the shown embodiment in an exemplary embodiment;

[0024] Figure 4 is Figure 2 a flowchart of a method for obtaining the distribution density of the lines to be processed in the pattern to be processed in step S220 in another exemplary embodiment in the shown embodiment;

[0025] Figure 5 is Figure 2 a flowchart of a method for determining whether there is an easily ignitable area in the area to be processed in step S230 in an exemplary embodiment in the shown embodiment;

[0026] Figure 6 Yes Figure 2 The flowchart of step S230 in the illustrated embodiment is for a method of determining whether there is an easily ignitable area in the area to be processed in another exemplary embodiment;

[0027] Figure 7 The flowchart of a processing control method shown in another exemplary embodiment of the present application;

[0028] Figure 8 The flowchart of a processing control method shown in still another exemplary embodiment of the present application;

[0029] Figure 9 The flowchart of a processing control method shown in yet another exemplary embodiment of the present application;

[0030] Figure 10 The application schematic diagram of optimizing the processing path shown in an exemplary embodiment of the present application;

[0031] Figure 11 The structural schematic diagram of a processing control device shown in an exemplary embodiment of the present application;

[0032] Figure 12 The structural schematic diagram of a computer system of an exemplary electronic device of the present application. Detailed Description of the Embodiments

[0033] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments of the present application. On the contrary, they are merely examples of devices and methods that are the same as some aspects of the present application as detailed in the appended claims.

[0034] The block diagrams shown in the drawings are only functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in the form of application programs, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor devices and / or microcontroller devices.

[0035] The flowcharts shown in the drawings are only exemplary illustrations and do not necessarily include all the contents and operations / steps, nor do they necessarily need to be executed in the described order. For example, some operations / steps can be decomposed, while some operations / steps can be combined or partially combined, so the actual execution order may change according to the actual situation.

[0036] It should be noted that in this application, "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the front and back associated objects.

[0037] The following is an introduction and explanation of the technical terms and background technology involved in this application:

[0038] Laser processing equipment: includes equipment such as laser cutting machines and laser engraving machines; the laser processing equipment is used to process the material to be processed according to the pattern to be processed.

[0039] Area to be processed: refers to the processing area in the laser processing equipment for placing the material to be processed.

[0040] Fire-prone area: When using laser processing equipment, such as when the laser processing equipment processes flammable materials like wooden boards, if the pattern to be processed is very complex and the distribution of the lines to be processed is dense in a very small area, a lot of heat will accumulate in this area at this time, and such an area is called a fire-prone area. In some embodiments, the area to be processed can be divided into multiple grid areas, and it is judged by the density of the line distribution of the pattern to be processed in each grid area, so as to determine whether this grid area is a fire-prone area.

[0041] Processing parameters: refer to the rated power of the laser head, the percentage of the output power to the rated power, and the moving speed of the laser head, etc.

[0042] Gcode: Also known as G language, it is a commonly used language in numerical control programming. It is mainly used to tell the machine tools controlled by the computer what to do and how to do it. This language is implemented by defining a series of instructions, including but not limited to the movement path of the tool, speed, and in some cases, size settings, plane selection, etc. Gcode is widely used in the automation field, especially in 3D printing and laser processing equipment. It guides how the laser head moves, when to move, and at what speed to move, so as to achieve precise laser processing or engraving.

[0043] When processing the material to be processed by the laser processing equipment, since high temperature or sparks are usually easily generated during the processing, if there are flammable substances around, or the material to be processed itself is flammable, it is easy to cause a fire. If continuous processing is carried out, the heat accumulation may be faster, resulting in too high a temperature and increasing the fire risk.

[0044] In the related art, for the fire risk existing in the processing process, it is usually processed in time after a fire occurs. However, there will be a large amount of dust after the fire is extinguished, resulting in poor processing effect of the material to be processed and material waste. And usually, cameras or sensors are used to detect and identify whether there is a fire in the processing process, and problems such as camera blind spots, sensor failures, and misjudgments are likely to occur, which brings difficulties to the detection and execution of fires generated during the processing process and results in poor user experience. When preventing fires during the processing process in the related art, it is usually only to detect the processing parameters of the laser processing equipment, and give an early warning when dangerous processing parameters are detected. However, detecting only a single factor of the processing parameters is not accurate enough and is likely to lead to poor accuracy of fire risk early warning.

[0045] Based on this, the embodiments of the present application propose a processing control method, device, equipment, system and storage medium. By obtaining the pattern to be processed; obtaining the distribution density of the lines to be processed in the pattern to be processed; determining whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed; if there is an easily ignitable area in the area to be processed, output a first processing warning prompt. In this way, on the one hand, by identifying the easily ignitable area in advance from the distribution density of the lines to be processed in the pattern to be processed, it is possible to avoid the fire risk caused by repeated processing in the same area due to the complexity of the pattern to be processed even when the processing parameters are detected correctly, thereby improving the accuracy of fire risk early warning during the processing process. On the other hand, by being able to give the first warning prompt according to the determined easily ignitable area before the laser processing equipment performs processing, the fire risk is reduced, and thus the prevention of fire risk can be achieved.

[0046] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of a processing system shown in an exemplary embodiment of the present application. As Figure 1 shown, the processing system includes a terminal device 110 and a laser processing device 120. Among them, a wired or wireless communication connection is established in advance between the terminal device 110 and the laser processing device 120. The laser processing device 120 includes a laser processing head, a communication component and a controller.

[0047] The terminal device 110 may be a device such as a mobile phone, a tablet computer, or a computer, but is not limited thereto. The terminal device 110 can be used to execute the processing control method in this application. The terminal device 110 can generally refer to one of multiple terminals, and only the terminal device 110 is used as an example in this embodiment. Those skilled in the art can know that the number of the above-mentioned terminal devices can be more or less. For example, the above-mentioned terminal can be only one, or the above-mentioned terminals are multiple. At this time, the implementation environment of the above-mentioned processing control method further includes other terminals. The embodiments of this application do not limit the number and type of terminal devices. The user can obtain the distribution density of the to-be-processed lines in the to-be-processed pattern through the terminal device 110, and then determine whether there is an easily ignitable area in the to-be-processed area according to the distribution density of the to-be-processed lines; in the case where there is an easily ignitable area in the to-be-processed area, output a first processing warning prompt. The terminal device 110 can also send a processing instruction corresponding to the to-be-processed pattern to the laser processing device 120.

[0048] The laser processing device 120 may include devices such as a laser engraving machine or a laser cutting machine. In some embodiments, the laser processing device may include a laser processing head, a communication component, and a controller. The laser processing head is disposed inside the laser processing device; the communication component is used to receive a processing instruction corresponding to the to-be-processed pattern; the controller controls the laser processing head to process the to-be-processed material based on the processing instruction corresponding to the to-be-processed pattern. Among them, the processing instruction can be obtained based on the processing control method provided in the embodiments of this application.

[0049] According to the implementation requirements, the technical solution of this application can be applied to the laser processing device 120, or can be applied to the terminal device 110, or can be jointly implemented by the laser processing device 120 and the terminal device 110. This application does not make special limitations on this. Exemplarily, the terminal device 110 can obtain the to-be-processed pattern according to the technical solution of this application, then obtain the distribution density of the to-be-processed lines in the to-be-processed pattern, and determine whether there is an easily ignitable area in the to-be-processed area according to the distribution density of the to-be-processed lines; if there is an easily ignitable area in the to-be-processed area, output a first processing warning prompt. Or, the controller inside the laser processing device 120 obtains the to-be-processed pattern according to the technical solution of this application, then obtains the distribution density of the to-be-processed lines in the to-be-processed pattern, and determines whether there is an easily ignitable area in the to-be-processed area according to the distribution density of the to-be-processed lines; if there is an easily ignitable area in the to-be-processed area, output a first processing warning prompt. The specific content of the technical solution can refer to the processing control method in the following text and will not be elaborated here.

[0050] Please refer to Figure 2 , Figure 2It is a flowchart of a processing control method shown in an exemplary embodiment of the present application. This method can be applied to a terminal device, which includes but is not limited to a computer, a tablet computer, a mobile phone, etc.

[0051] Hereinafter, the terminal device will be used as the specific execution subject to introduce in detail the processing control method proposed in the embodiments of the present application. The laser processing device is similar as the execution subject and will not be elaborated.

[0052] As Figure 2 shown, in an exemplary embodiment, the processing control method at least includes steps S210 to S240, which are introduced in detail as follows:

[0053] Step S210, obtain the pattern to be processed.

[0054] In the embodiments of the present application, a processing editing software used in conjunction with the laser processing device is set in the terminal device. In response to an image import operation for the processing editing software, the imported image is mapped to the editable interface of the processing editing software for display, and the imported image is determined as the pattern to be processed. Alternatively, a pattern can also be edited on the processing editing software to obtain the pattern to be processed.

[0055] Step S220, obtain the distribution density of the lines to be processed in the pattern to be processed. Herein, the lines to be processed refer to the complete lines that need to be processed in the pattern to be processed. Each line includes two processing endpoints, namely the processing start point and the processing end point. One line may be processed multiple times or may be processed once.

[0056] In the embodiments of the present application, if the pattern to be processed is very complex, the lines to be processed in a very small area will be densely distributed. At this time, a lot of heat will accumulate in this area. Therefore, such an area is called an easily ignitable area, or also called a dense area. A dense area detection algorithm is set in the processing editing software of the terminal device. By calculating the pattern to be processed through this dense area detection algorithm, the distribution density of the lines to be processed in the pattern to be processed can be obtained. The dense area detection algorithm includes the grid division method and the neighborhood density method. In some embodiments, a preset neural network model can also be trained by inputting training samples with labels, so as to obtain an identification model capable of identifying the distribution density, so that the dense degree of the lines to be processed in each area can be automatically judged after inputting the pattern to be processed; among them, the training samples can be the patterns to be processed, and the labels can be the corresponding distribution densities of the lines to be processed in the patterns to be processed.

[0057] The grid division method refers to dividing the pattern to be processed into grid regions of the same size according to a preset size, and then calculating the distribution density of the lines to be processed in each grid region of the pattern to be processed.

[0058] The neighborhood density method refers to obtaining the bounding box of each line to be processed in the pattern to be processed. The bounding box can be a circle, a rectangle, or other shapes that can envelope a complete line to be processed; then calculating the distribution density of the lines to be processed in the bounding box area.

[0059] In some embodiments, please refer to Figure 3 , Figure 3 is Figure 2 The flowchart of the method for obtaining the distribution density of the lines to be processed in the pattern to be processed in step S220 in the embodiment shown, at least includes steps S310 to S320, which are introduced in detail as follows:

[0060] Step S310, divide the pattern to be processed into grid regions of the same size according to a preset size.

[0061] In the embodiments of the present application, the preset size can refer to the size of the grid regions of the same size obtained by division, or the number of grid regions of the same size obtained by division.

[0062] For example, if the preset size is the size of the grid regions of the same size obtained by division, for example, the size of the grid region is 5*5, then the pattern to be processed is divided into multiple grid regions of 5*5 size. And in the case where the preset size is the number of grid regions of the same size obtained by division, for example, it is 10*10 = 100, then according to the size of the pattern to be processed, the pattern to be processed is divided into 100 grid regions of the same size. If the pattern to be processed is a 100*100 rectangular image, then the pattern to be processed is divided into 100 grid regions of the same size, and the size of each grid region is 10*10.

[0063] Step S320, obtain the total length of the line segments of all the lines to be processed in each grid region, and the distribution density includes the total length of the line segments.

[0064] It can be understood that after dividing the pattern to be processed into grid regions of the same size, the complete lines to be processed in the pattern to be processed may be cut into multiple line segments by the grid regions. Therefore, the total length of the line segments in each grid region refers to the total length of the line segments of all the lines to be processed in the same grid region.

[0065] In the embodiments of the present application, the total line segment length of all to-be-processed lines in each grid area can be obtained in the following manner, including: extracting the line segment contour lengths of all to-be-processed lines in the same grid area, and summing up all the line segment contour lengths to obtain the total line segment length of all to-be-processed lines in each grid area.

[0066] In the embodiments of the present application, after obtaining the total line segment length in each grid area, the total line segment length can be determined as the distribution density, so that the complexity of the to-be-processed pattern in each grid area can be effectively determined, which is more convenient for accurately determining the easily ignitable area.

[0067] In some embodiments, please refer to Figure 4 , Figure 4 is Figure 2 the flowchart of the method for obtaining the distribution density of the to-be-processed lines in the to-be-processed pattern in another exemplary embodiment of step S220 in the illustrated embodiment, including at least steps S410 to S420, which are introduced in detail as follows:

[0068] Step S410, obtaining the bounding boxes respectively corresponding to all the to-be-processed lines in the to-be-processed pattern.

[0069] In the embodiments of the present application, the bounding box of a to-be-processed line can usually be represented in the following manner: the upper left corner coordinates and the lower right corner coordinates. By specifying the upper left corner coordinates and the lower right corner coordinates of the bounding box, a unique envelope box can be determined, and the envelope box can be other shapes such as a circle or a rectangle. In some embodiments, the bounding box in the embodiments of the present application is a rectangular box.

[0070] The abscissa of the upper left corner coordinate of the bounding box of the to-be-processed line is the abscissa of the point with the smallest abscissa of the to-be-processed line in the horizontal axis, and the ordinate of the upper left corner coordinate of the bounding box of the to-be-processed line is the ordinate of the point with the largest ordinate of the to-be-processed line in the vertical axis.

[0071] The abscissa of the lower right corner coordinate of the bounding box of the to-be-processed line is the abscissa of the point with the largest abscissa of the to-be-processed line in the horizontal axis, and the ordinate of the lower right corner coordinate of the bounding box of the to-be-processed line is the ordinate of the point with the smallest ordinate of the to-be-processed line in the vertical axis.

[0072] Step S420, obtaining the total line segment length of all the to-be-processed lines in each bounding box area, and the distribution density includes the total line segment length.

[0073] It can be understood that the bounding box area corresponding to each line to be processed may include partial line segments of other lines to be processed. Therefore, the total length of the line segments within each bounding box area in the embodiments of the present application refers to the sum of the length of the line to be processed corresponding to the bounding box area and the partial line segments of other lines to be processed within the bounding box area.

[0074] In the embodiments of the present application, the total length of the line segments of all lines to be processed within each bounding box area can be obtained through the following method, including: extracting the contour length of the line to be processed corresponding to the bounding box area, and extracting the contour lengths of the line segments of other lines to be processed within the bounding box area, and summing up the contour length and the contour lengths of the line segments to obtain the total length of the line segments of all lines to be processed within each bounding box area.

[0075] In the embodiments of the present application, after obtaining the total length of the line segments of all lines to be processed within each bounding box area, the total length of the line segments can be determined as the distribution density, so as to more effectively determine the complexity of the pattern to be processed in each grid area, which is more convenient for accurately determining the easily ignitable area.

[0076] Step S230, determine whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed.

[0077] It can be understood that after obtaining the distribution density of the lines to be processed in each sub-area of the pattern to be processed, a preset density threshold can be used to determine whether each sub-area in the pattern to be processed is an easily ignitable area, which is convenient for early warning prompts and further processing control. Among them, the sub-area is a grid area obtained by grid division method or a bounding box area obtained by domain density method.

[0078] In some embodiments, please refer to Figure 5 , Figure 5 is Figure 2 a flowchart of the method for determining whether there is an easily ignitable area in the area to be processed in step S230 in the illustrated embodiment in an exemplary embodiment, including at least step S510 to step S530, which are introduced in detail as follows:

[0079] Step S510, determine whether there is a distribution density greater than the preset density threshold. If not, execute step S520; if so, execute step S530.

[0080] In the embodiments of the present application, if the distribution density of the to-be-processed lines in a sub-region of the to-be-processed area is greater, it can be considered that the laser processing equipment needs to perform repeated processing in this sub-region in a short period of time, which may lead to overheating and cause a fire risk. Therefore, by judging the distribution density of the to-be-processed lines, it is possible to accurately determine whether there is an easily ignitable area in the to-be-processed area. In some embodiments, the distribution density threshold can be collected by conducting multiple experiments in advance. If the distribution density is greater than the preset density threshold, the corresponding area is considered an easily ignitable area; if it is not greater than the preset density threshold, the corresponding area can be considered not an easily ignitable area.

[0081] Step S520: Confirm that there is no easily ignitable area in the to-be-processed area.

[0082] Step S530: Confirm that there is an easily ignitable area in the to-be-processed area, and determine the area corresponding to the distribution density greater than the preset density threshold as the easily ignitable area.

[0083] In some embodiments, after obtaining the distribution density of all sub-regions in the to-be-processed area, if there is a situation where the distribution density of a region is greater than the preset density threshold, it is confirmed that there is an easily ignitable area in the to-be-processed area, and the area corresponding to the distribution density greater than the preset density threshold is determined as the easily ignitable area. If there is no region with a distribution density greater than the preset density threshold, it is confirmed that there is no easily ignitable area in the to-be-processed area.

[0084] In some embodiments, based on the distribution density of the to-be-processed lines, it is also possible to further judge by combining the material type and the interval distance between the lines, so as to more accurately determine whether there is an easily ignitable area in the to-be-processed area. Combining Figure 6 As shown Figure 6 is Figure 2 a flowchart of the method for determining whether there is an easily ignitable area in the to-be-processed area in another exemplary embodiment of step S230 in the shown embodiment, including at least steps S610 to S660, which are introduced in detail as follows:

[0085] Step S610: Obtain the interval distance between each to-be-processed line.

[0086] In the embodiments of the present application, the interval distance between the to-be-processed lines in the area corresponding to the distribution density can be obtained in the following manner, including: obtaining the area image corresponding to the distribution density; inputting the area image into a preset recognition model to obtain the interval distance between the to-be-processed lines in the area image. Among them, the preset recognition model is used to recognize the interval distance between different to-be-processed lines.

[0087] Step S620: Obtain the material type of the material to be processed, and determine the distance threshold according to the material type of the material to be processed.

[0088] It can be understood that different material types of the material to be processed correspond to different distance thresholds. For example, when using laser to process the material to be processed, if the material type of the material to be processed is corrugated paper, it is considered that this type of material is relatively easy to catch fire during processing, so the distance threshold of the lines to be processed in this area is set to 1.75 mm; therefore, if the interval distance of the lines to be processed in an area is greater than 1.75 mm, it is not easy to catch fire; if it is less than or equal to 1.75 mm, it is considered that a lot of heat will accumulate during processing in this area and it is easy to catch fire, so this area is an easily ignitable area. If the material type of the material to be processed is basswood board, it is considered that this type of material is not as easy to catch fire as corrugated paper during processing. Therefore, the distance threshold of the lines to be processed in the area can be set closer, such as 1 mm; therefore, if the interval distance of the lines to be processed in an area is greater than 1 mm, it is not easy to catch fire; if it is less than or equal to 1 mm, it is considered that a lot of heat will accumulate during processing in this area and it is easy to catch fire, so this area is an easily ignitable area.

[0089] In some embodiments, the laser processing device is provided with a camera device; obtaining the material type of the material to be processed includes: obtaining an image of the material to be processed through the camera device, and inputting the image of the material to be processed into a preset material type recognition model to obtain the material type of the material to be processed.

[0090] In some embodiments, the laser processing device includes a light emitting device and a detection device. The light emitting device is used to emit light of a specific wavelength to the surface of the material to be processed placed in the processing area of the laser processing device, and the detection device is used to collect the light reflected back from the surface of the material to be processed;

[0091] Obtaining the material type of the material to be processed includes: emitting light of a specific wavelength to the surface of the material to be processed placed in the processing area of the laser processing device through the light emitting device, and obtaining the reflected light intensity of the light reflected back from the surface of the material to be processed through the detection device; calculating according to the reflected light intensity to obtain the reflectivity; matching the material type corresponding to the reflectivity from a preset database; wherein, the preset database stores the corresponding relationship between the reflectivity and the material type of the material to be processed.

[0092] Exemplarily, the light emitting device can be a laser processing head in the laser processing device, or an auxiliary light emitter separately provided in the laser processing device; the detection device can be a photosensitive chip, a spectrometer or a CCD / CMOS camera and other devices.

[0093] For example, by calculating based on the reflected light intensity, the reflectivity is obtained, including: by calculating to obtain the reflectivity; where R is the reflectivity, I r is the reflected light intensity, I0 is the incident light intensity, and I dark is the background noise. Among them, the incident light intensity can be measured and obtained by a light source (i.e., a light emission device), and the background noise is the background noise without a light source, such as the degree change of the detection device caused by ambient light and dark current.

[0094] Alternatively, the material type of the material to be processed can also be identified based on spectra, images, etc.

[0095] In some embodiments, obtaining the material type of the material to be processed includes: in response to an input operation on the material type text box for a preset application program, determining the text input by the user as the material type of the material to be processed. In this way, in the embodiments of the present application, not only can the material type be automatically identified by the camera device in the laser processing equipment, but also the material type can be manually input by the user in the display interface of the terminal device.

[0096] Furthermore, determining the distance threshold according to the material type of the material to be processed includes: matching the distance threshold corresponding to the material type of the material to be processed from a preset database; where the corresponding relationship between the material type of the material to be processed and the distance threshold is stored in the preset database. In this way, by pre-collecting the corresponding relationships between multiple distance thresholds and material types and storing them in the corresponding database, it is convenient to improve the efficiency of obtaining the distance threshold.

[0097] Step S630, determine whether there is a distribution density greater than the preset density threshold; if so, execute step S640, if not, execute step S650.

[0098] Step S640, determine whether there is a situation where the interval distance between each line to be processed is less than the distance threshold; if not, execute step S650; if so, execute step S660.

[0099] Step S650, confirm that there is no easily ignitable area in the area to be processed.

[0100] Step S660, confirm that there is an easily ignitable area in the area to be processed, and determine the area where the distribution density is greater than the preset density threshold and the interval distance is less than the distance threshold as the easily ignitable area.

[0101] In the embodiments of the present application, since the determination of the easily ignitable area is related not only to the complexity of the pattern to be processed, but also to the material type, the distribution density of the lines to be processed and the material type of the material to be processed can be used to more accurately determine whether there is an easily ignitable area in the area to be processed and the specific location of the easily ignitable area, so as to facilitate more accurate early warning.

[0102] In some embodiments, if there is a distribution density greater than the density threshold in the distribution density of the lines to be processed and there is a case where the interval distance is less than the distance threshold, it is confirmed that there is an easily ignitable area in the area to be processed, and the area corresponding to the interval distance greater than the preset density threshold and less than the distance threshold is determined as the easily ignitable area. If there is no distribution density greater than the density threshold in the distribution density of the lines to be processed; or, there is no case where the interval distance is less than the distance threshold, it is confirmed that there is no easily ignitable area in the area to be processed.

[0103] In another embodiment, the following method can also be used to determine whether there is an easily ignitable area in the processing area, including: obtaining the material type of the material to be processed, and determining the preset density threshold corresponding to the material to be processed according to the material type; if there is an area where the distribution density is greater than the preset density threshold, it is determined that there is an easily ignitable area in the area to be processed, and the area where the distribution density is greater than the preset density threshold is determined as the easily ignitable area.

[0104] It can be understood that for the same processing pattern, the fire risks of the wooden material to be processed, the plastic material to be processed and the metal material to be processed are different. Therefore, even if the processing patterns are the same (i.e., the complexity of the processing patterns is the same), due to the different material types, the fire risks will also be different. Therefore, different preset density thresholds can be set for different material types, so as to more accurately judge the easily ignitable area in the area to be processed.

[0105] In some embodiments, determining the preset density threshold corresponding to the material to be processed according to the material type includes: matching the preset density threshold corresponding to the material type of the material to be processed from a preset database; wherein, the corresponding relationship between the material type of the material to be processed and the preset density threshold is stored in the preset database.

[0106] Please continue to refer to Figure 7 , Figure 7 which is a flowchart of the processing control method shown in another exemplary embodiment of the present application. Before obtaining the distribution density of the lines to be processed in the pattern to be processed, the processing control method further includes steps S710 to S730, which are introduced in detail as follows:

[0107] Step S710, obtaining the processing parameters corresponding to the pattern to be processed.

[0108] It is understandable that the processing parameters can be manually set by the user, or the preset default parameters can be used as the processing parameters. In some embodiments, the user can input the processing parameters in the preset application interface of the terminal device, and the terminal device uses the input parameter values as the processing parameters for the current processing.

[0109] Step S720, perform a fire risk detection on the processing parameters to obtain a detection result.

[0110] In the embodiments of the present application, the fire risk detection of the processing parameters is the initial detection of the processing process. If there are risks in the parameter settings, for example, the user sets the processing speed lower than the preset speed threshold and the processing power greater than the power threshold, it is considered that the current processing parameters are risky. A warning will be popped up first, informing the user that the current parameters may cause a fire, do not leave the machine, or adjust the processing parameters.

[0111] In some embodiments, the following process can be used to perform a fire risk detection on the processing parameters:

[0112] Step S721, compare the processing parameters with the preset parameter thresholds; wherein, the processing parameters include at least one of the rated power of the laser head, the percentage of the output power to the rated power, and the moving speed of the laser head;

[0113] Step S722, if there are processing parameters that exceed the parameter thresholds, confirm that the detection result is that the processing parameters have a fire risk;

[0114] Step S722, if there are no processing parameters that exceed the parameter thresholds, confirm that the detection result is that the processing parameters do not have a fire risk.

[0115] In this way, through the preliminary detection of the processing parameters, the initial detection of the fire risk of the processing process can be realized. Subsequently, it is also possible to determine whether there are easily ignitable areas in the to-be-processed area based on the distribution density of the to-be-processed lines, realizing the secondary detection of the fire risk, and achieving the purpose of reducing the fire risk in advance.

[0116] Step S730, in the case where the detection result is that the processing parameters have a fire risk, output a second processing warning prompt for the processing parameters.

[0117] In the embodiments of the present application, the second processing warning prompt can be the same as the first processing warning prompt. Exemplarily, the second processing warning prompt can include: the current processing parameters may cause a fire, do not leave the machine, and adjust the processing parameters or the processing path. In this way, by performing a fire risk detection on the processing parameters, it can be ensured that the processing parameter settings are correct, which is convenient for subsequent analysis of the complexity of the to-be-processed pattern.

[0118] It should be noted that the step content related in the embodiments of the present application is consistent with the corresponding step content recorded in the foregoing embodiments. Therefore, for the detailed description of these steps, please refer to the records in the foregoing embodiments, and the embodiments of the present application will not be elaborated herein.

[0119] Step S240, if there is an easily ignitable area in the area to be processed, output a first processing warning prompt. Exemplarily, the first processing warning prompt may include: there is a fire risk in the current processing process, do not leave the machine, or adjust the processing parameters or processing path.

[0120] In the embodiments of the present application, after determining the easily ignitable areas, multiple adjacent easily ignitable areas can be merged into a large area. By merging adjacent easily ignitable areas, it is convenient for users to adjust the processing parameters or processing path more conveniently, thereby realizing fire prevention.

[0121] Please continue to refer to Figure 8 , Figure 8 which is a flowchart of a processing control method shown in an exemplary embodiment of the present application. After outputting the first processing warning prompt, the processing control method further includes steps S810 to S820, which are introduced in detail as follows:

[0122] Step S810, in response to a confirmation operation for the first processing warning prompt, adjust the processing parameters of the pattern to be processed to obtain adjusted processing parameters; wherein, the processing parameters include at least one of the rated power of the laser head, the percentage of the output power to the rated power, and the moving speed of the laser head.

[0123] It can be understood that when there is an easily ignitable area in the area to be processed, the terminal device outputs the first processing warning prompt through a pop-up window, displaying "the current processing parameters may cause a fire, do not leave the machine, or adjust the processing parameters". If the user clicks to confirm to modify the processing parameters, the parameters modified by the user in the preset text box are used as the adjusted processing parameters, thereby realizing the adjustment of the processing parameters of the pattern to be processed.

[0124] Step S820, process the pattern to be processed according to the adjusted processing parameters.

[0125] In this way, on the basis of the embodiments of the present application, combined with the method shown in the above Figure 7 , it is possible to adjust the processing parameters twice before processing the material to be processed, so that the adjusted processing parameters can be more accurate, thereby reducing the fire risk during processing and realizing fire prevention.

[0126] It should be noted that the step content related to the embodiments of the present application is consistent with the corresponding step content recorded in the foregoing embodiments. Therefore, for the detailed description of these steps, please refer to the records in the foregoing embodiments, and the embodiments of the present application will not be elaborated herein.

[0127] Please continue to refer to Figure 9 , Figure 9 which is a flowchart of a processing control method shown in another exemplary embodiment of the present application. When there is an easily ignitable area in the area to be processed, after outputting the first processing warning prompt, the processing control method further includes steps S910 to S920, which are introduced in detail as follows:

[0128] Step S910: In response to the confirmation operation for the first processing warning prompt, adjust the processing path of the pattern to be processed to obtain an adjusted processing path.

[0129] It can be understood that in the present application, in addition to the method of adjusting processing parameters to reduce the fire risk, the fire risk during the processing can also be reduced by adjusting the processing path.

[0130] In some embodiments, the processing path of the pattern to be processed can be adjusted in the following manner, including: inserting the processing order of the to-be-processed lines in other areas between the to-be-processed lines adjacent in the processing order in the easily ignitable area to obtain an adjusted processing path. Herein, the other area can be another easily ignitable area in the area to be processed or another normal area in the area to be processed, and no limitation is imposed thereon. Whether it is another easily ignitable area or another normal area, it can achieve the effects of avoiding heat accumulation in a single area, reducing the ignition probability, and improving the processing effect.

[0131] It can be understood that in the embodiments of the present application, by inserting the processing order of the to-be-processed lines in other areas between the to-be-processed lines adjacent in the processing order in the easily ignitable area, the initial processing path of the to-be-processed material generated can be adjusted to obtain an adjusted processing path. This can increase the empty running distance of the laser processing head, so that it does not continuously process multiple to-be-processed lines in the easily ignitable area. By sacrificing a small amount of time, heat accumulation in a single area can be avoided, achieving the effects of reducing the ignition probability and improving the processing effect.

[0132] For example, after the terminal device outputs the first processing warning prompt, if the user performs a confirmation operation, the initial processing path is adjusted through the preset path optimization algorithm to generate a safer and more sophisticated Gcode processing path code to achieve the purpose of reducing the risk of fire in advance. If the user chooses not to perform a confirmation operation, the initial processing path with a fire risk but higher efficiency is still used. In some embodiments, the path optimization algorithm refers to optimizing the original processing path so that the paths in the fire-prone area are staggered for processing, in order to leave a certain amount of time for the fire-prone area to dissipate heat and avoid heat accumulation, thereby achieving the purpose of reducing the risk of fire.

[0133] In some embodiments, the processing order of the lines to be processed in other areas is inserted between the lines to be processed with adjacent processing orders in the ignition-prone area to obtain an adjusted processing path, including: determining the target lines to be processed from at least one other area, and inserting the processing order of the target lines to be processed between the lines to be processed with adjacent processing orders in the ignition-prone area.

[0134] It is understandable that there is a corresponding relationship between the number of target lines to be processed and the number of adjacent lines to be processed in the ignition-prone area. In some embodiments, the number of target lines to be processed is not less than the number of adjacent lines to be processed in the ignition-prone area.

[0135] For example, if the number of pairs of lines to be processed with adjacent processing sequences in the ignition-prone region is 5, then the number of target lines to be processed is at least 5. That is, between the processing sequences of each pair of lines to be processed with adjacent processing sequences in the ignition-prone region, at least one processing sequence of the target line to be processed is inserted.

[0136] In some embodiments, the target lines to be processed can be determined from at least one other area in the following manner, including: if the other areas include other ignition-prone areas, then the lines to be processed that are not adjacent in processing order in the other ignition-prone areas are determined as the target lines to be processed; if the other areas include other normal areas, then any lines to be processed in the other normal areas are determined as the target lines to be processed.

[0137] In some embodiments, in the initial processing path, when the lines to be processed are processed multiple times continuously, other lines to be processed can be inserted between the multiple processing times to interrupt the continuous multiple processing of the lines to be processed to avoid heat accumulation in the same area.

[0138] Step S920 , processing the pattern to be processed according to the adjusted processing path, so that the multiple lines to be processed in the ignition-prone area are processed discontinuously.

[0139] In some embodiments, the process control method further comprises the following steps:

[0140] If it is recognized that there is an easily ignitable area, when the first warning prompt is output, an effect diagram of the machining formed according to the current machining path is output.

[0141] In this way, the user can more clearly judge the impact of ignition on the machining effect based on the machining effect diagram, and then can more clearly choose whether to adjust the machining path.

[0142] In some embodiments, the machining control method further includes the following steps:

[0143] If it is recognized that there is an easily ignitable area, when the first warning prompt is output, the easily ignitable area is displayed.

[0144] In this way, the user can more clearly understand which places may have the risk of ignition.

[0145] The machining control method provided by the embodiments of the present application can achieve the effect of reducing the fire risk by starting from the prevention stage. Prevention has higher cost performance and higher priority compared with detection and execution. Prevention is greater than cure. In related technologies, more attention is paid to how to identify flames and extinguish flames. However, the present application designs an algorithm to achieve dense area detection by focusing on the distribution density of the machining lines in the pattern to be machined, and can detect easily ignitable areas; and after detecting the easily ignitable areas, by optimizing the machining path, the ignition probability of the dense pattern can be reduced, making up for the disadvantage of poor warning accuracy based on machining parameters in the existing technology, and achieving more accurate fire warning for complex patterns.

[0146] Combined with Figure 10 as shown, Figure 10 is an application schematic diagram of optimizing the machining path shown in an exemplary embodiment of the present application. Figure 10 is a comparison diagram of the initial machining path and the adjusted machining path of the pattern to be machined. Figure 10 In the upper part is a schematic diagram of the initial machining path, and in the lower part is a schematic diagram of the adjusted machining path for the initial machining path; from the comparison of the two, it can be seen that the adjusted machining path increases the empty running distance of the laser head, so that it will not continuously machine in a single area, and finally the pattern to be machined as shown on the far right can also be obtained. This can avoid heat accumulation in a single area, achieve the effect of reducing the ignition probability and improving the machining effect.

[0147] It should be noted that the step content related in the embodiments of the present application is the same as the corresponding step content recorded in the foregoing embodiments. Therefore, for the detailed description of these steps, please refer to the records in the foregoing embodiments, and the embodiments of the present application will not be repeated.

[0148] Combined with Figure 11As shown in the figure, in an exemplary embodiment of the present application, a processing control device 1100 is provided, which includes a first acquisition module 1110, a second acquisition module 1120, a determination module 1130, and a warning prompt module 1140. The first acquisition module 1110 is configured to acquire a pattern to be processed; the second acquisition module 1120 is configured to acquire the distribution density of the lines to be processed in the pattern to be processed; the determination module 1130 is configured to determine whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed; the warning prompt module 1140 is configured to output a first processing warning prompt if there is an easily ignitable area in the area to be processed.

[0149] By using the processing control device 1100 provided in the embodiment of the present disclosure, on the one hand, by starting from the distribution density of the lines to be processed in the pattern to be processed to determine the easily ignitable area, it is possible to avoid the fire risk caused by repeatedly processing in the same area when the pattern to be processed is too complex, even if the processing parameters are detected correctly. Thus, the accuracy of the fire risk warning during the processing is improved; on the other hand, by being able to perform the first warning prompt according to the determined easily ignitable area before the laser processing equipment performs processing, the fire risk is reduced, and thus the prevention of the fire risk can be achieved.

[0150] In some embodiments, the second acquisition module 1120 is configured to acquire the distribution density of the lines to be processed in the pattern to be processed in the following manner, including: dividing the pattern to be processed into grid areas of the same size according to a preset size; acquiring the total line segment length of all the lines to be processed in each grid area, and the distribution density includes the total line segment length.

[0151] In some embodiments, the second acquisition module 1120 is configured to acquire the distribution density of the lines to be processed in the pattern to be processed in the following manner, including: acquiring the bounding boxes corresponding to all the lines to be processed in the pattern to be processed; acquiring the total line segment length of all the lines to be processed in each bounding box area, and the distribution density includes the total line segment length.

[0152] In some embodiments, the determination module 1130 is configured to determine whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed in the following manner, including: if there is an area where the distribution density is greater than a preset density threshold, it is confirmed that there is an easily ignitable area in the area to be processed, and the area corresponding to the distribution density greater than the preset density threshold is determined as the easily ignitable area.

[0153] In some embodiments, the determination module 1130 is configured to determine whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed, including: obtaining the interval distance between each line to be processed; obtaining the material type of the material to be processed, and determining a distance threshold according to the material type of the material to be processed; if there is an area where the distribution density is greater than the preset density threshold and the interval distance within the area is less than the distance threshold, then it is confirmed that there is an easily ignitable area in the area to be processed, and the area where the distribution density is greater than the preset density threshold and the interval distance is less than the distance threshold is determined as the easily ignitable area.

[0154] In some embodiments, the second acquisition module 1120 is further configured to, before acquiring the distribution density of the lines to be processed in the pattern to be processed, acquire the processing parameters corresponding to the pattern to be processed; perform a fire risk detection on the processing parameters to obtain a detection result; in the case where the detection result indicates that there is a fire risk in the processing parameters, output a second processing warning prompt for the processing parameters.

[0155] In some embodiments, the processing control device 1100 further includes a control module, and the control module is configured to, after there is an easily ignitable area in the area to be processed and a first processing warning prompt is output, in response to a confirmation operation for the first processing warning prompt, adjust the processing parameters of the pattern to be processed to obtain adjusted processing parameters; wherein, the processing parameters include at least one of the rated power of the laser head, the percentage of the output power to the rated power, and the moving speed of the laser head; process the pattern to be processed according to the adjusted processing parameters.

[0156] In some embodiments, the processing control device further includes a control module, and the control module is configured to, after there is an easily ignitable area in the area to be processed and a first processing warning prompt is output, in response to a confirmation operation for the first processing warning prompt, adjust the processing path of the pattern to be processed to obtain an adjusted processing path; process the pattern to be processed according to the adjusted processing path so that the multiple lines to be processed within the easily ignitable area are not processed continuously.

[0157] In some embodiments, adjusting the processing path of the pattern to be processed includes: inserting the processing order of the lines to be processed in other areas between the lines to be processed with adjacent processing orders within the easily ignitable area to obtain an adjusted processing path.

[0158] The processing control device 1100 can be used to implement any of the above embodiments of the processing control method, which will not be elaborated in detail here.

[0159] Embodiments of the present disclosure also provide an electronic device, including: a processor and a memory; the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory so that the electronic device executes the above-mentioned method. In some embodiments, the electronic device is a terminal device or a laser processing device.

[0160] Figure 12 FIG. shows a schematic structural diagram of a computer system of an electronic device suitable for implementing embodiments of the present application. It should be noted that Figure 12 The shown computer system 1200 of the electronic device is only an example, and should not impose any limitations on the functions and usage scopes of the embodiments of the present application.

[0161] As Figure 12 shown, the computer system 1200 includes a central processing unit (CPU) 1201, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 1202 or the program loaded from the storage section 1208 into the random access memory (RAM) 1203, such as executing the method in the above embodiments. In the random access memory 1203, various programs and data required for system operation are also stored. The central processing unit 1201, the read-only memory 1202, and the random access memory 1203 are connected to each other via a bus 1204. The input / output (I / O) interface 1205 is also connected to the bus 1204.

[0162] The following components are connected to the input / output interface 1205: an input portion 1206 including a keyboard, a mouse, etc.; an output portion 1207 including, for example, a cathode ray tube (CRT), a liquid crystal display (LCD), etc. and a speaker, etc.; a storage portion 1208 including a hard disk, etc.; and a communication portion 1209 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication portion 1209 performs communication processing via a network such as the Internet. A drive 1210 is also connected to the input / output interface 1205 as required. A removable medium 1211, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 1210 as required so that the computer program read from it can be installed into the storage portion 1208 as required.

[0163] In particular, according to the embodiments of the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of the present application include a computer program product that includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 1209, and / or installed from the removable medium 1211. When the computer program is executed by the central processing unit (CPU) 1201, various functions defined in the system of the present application are executed.

[0164] Embodiments of the present disclosure also provide a computer-readable storage medium, on which computer-readable instructions are stored. When the computer-readable instructions are executed by a processor of the computer, the computer is caused to execute the above-mentioned processing control method.

[0165] It should be noted that the computer-readable medium shown in the embodiments of the present application can be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, in which a computer-readable computer program is carried. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, and the computer-readable medium can send, propagate, or transmit a program for use by or in combination with an instruction execution system, apparatus, or device. The computer program included on the computer-readable medium can be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0166] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. Among them, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the above-mentioned module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order from that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, as well as the combination of blocks in the block diagram or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0167] The units described in the embodiments of the present application can be implemented in software or in hardware, and the described units can also be provided in a processor. Among them, the names of these units do not constitute a limitation to the units themselves in some cases.

[0168] The present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements the processing control method as described above. The computer-readable storage medium may be included in the electronic device described in the above embodiments, or may exist separately and not be assembled into the electronic device.

[0169] The above content is only a preferred exemplary embodiment of the present application and is not used to limit the implementation of the present application. Those of ordinary skill in the art can easily make corresponding changes or modifications according to the main concept and spirit of the present application. Therefore, the protection scope of the present application should be subject to the protection scope required by the claims.

Claims

1. A processing control method, characterized in that, Including: Obtain the pattern to be processed; Obtain the distribution density of the lines to be processed in the pattern to be processed; Determine whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed; If there is an easily ignitable area in the area to be processed, output a first processing warning prompt.

2. The method according to claim 1, characterized in that, The obtaining the distribution density of the lines to be processed in the pattern to be processed includes: Divide the pattern to be processed into grid areas of the same size according to a preset size; Obtain the total line segment length of all the lines to be processed in each grid area, and the distribution density includes the total line segment length.

3. The method according to claim 1, characterized in that, The obtaining the distribution density of the lines to be processed in the pattern to be processed includes: Obtain the bounding boxes corresponding to all the lines to be processed in the pattern to be processed; Obtain the total line segment length of all the lines to be processed in each bounding box area, and the distribution density includes the total line segment length.

4. The method according to any one of claims 1 to 3, characterized in that, The determining whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed includes: If there is an area where the distribution density is greater than the preset density threshold, then confirm that there is an easily ignitable area in the area to be processed, and determine the area corresponding to the distribution density greater than the preset density threshold as the easily ignitable area.

5. The method according to any one of claims 1 to 3, characterized in that, The determining whether there is an easily ignitable area in the area to be processed according to the distribution density of the lines to be processed includes: Obtain the interval distance between each line to be processed; Obtain the material type of the material to be processed, and determine a distance threshold according to the material type of the material to be processed; If there is an area where the distribution density is greater than the preset density threshold and the interval distance in the area is less than the distance threshold, then confirm that there is an easily ignitable area in the area to be processed, and determine the area where the distribution density is greater than the preset density threshold and the interval distance is less than the distance threshold as the easily ignitable area.

6. The method according to any one of claims 1 to 3, characterized in that Before obtaining the distribution density of the lines to be processed in the pattern to be processed, the method further includes: Obtain the processing parameters corresponding to the pattern to be processed; Perform a fire risk detection on the processing parameters to obtain a detection result; In the case where the detection result is that the processing parameters have a fire risk, output a second processing warning prompt for the processing parameters.

7. The method according to any one of claims 1 to 3, characterized in that, After the outputting the first processing warning prompt if there is an easily ignitable area in the area to be processed, the method further includes: In response to a confirmation operation for the first processing warning prompt, adjust the processing parameters of the pattern to be processed to obtain adjusted processing parameters; wherein, the processing parameters include at least one of the rated power of the laser head, the percentage of the output power to the rated power, and the moving speed of the laser head; Process the pattern to be processed according to the adjusted processing parameters.

8. The method according to any one of claims 1 to 3, characterized in that, After the outputting the first processing warning prompt if there is an easily ignitable area in the area to be processed, the method further includes: In response to a confirmation operation for the first processing warning prompt, adjust the processing path of the to-be-processed pattern to obtain an adjusted processing path; Process the to-be-processed pattern according to the adjusted processing path, so that the multiple to-be-processed lines in the easily ignitable area are not processed continuously.

9. The method according to claim 8, characterized in that, The adjustment of the processing path of the to-be-processed pattern includes: Insert the processing order of the to-be-processed lines in other areas between the to-be-processed lines adjacent in the processing order in the easily ignitable area to obtain an adjusted processing path.

10. A processing control device, characterized in that, The device includes: A first acquisition module configured to acquire a to-be-processed pattern; A second acquisition module configured to acquire the distribution density of the to-be-processed lines in the to-be-processed pattern; A determination module configured to determine whether there is an easily ignitable area in the to-be-processed area according to the distribution density of the to-be-processed lines; A warning prompt module configured to output a first processing warning prompt if there is an easily ignitable area in the to-be-processed area.

11. A laser processing device, characterized in that, The laser processing equipment includes: A laser processing head; A communication component, the communication component is used to receive a processing instruction corresponding to the to-be-processed pattern, and the processing instruction is obtained based on the processing control method according to any one of claims 1 to 9; and A controller, the controller controls the laser processing head to process the to-be-processed material based on the processing instruction corresponding to the to-be-processed pattern.

12. A processing system, characterized in that, The system includes: Laser processing equipment, including a laser processing head, a communication component and a controller; A terminal device communicating with the laser processing equipment, the terminal device is used to execute the processing control method according to any one of claims 1 to 9.

13. A computer-readable storage medium, characterized in that, Computer-readable instructions are stored thereon, and when the computer-readable instructions are executed by a processor of a computer, the computer is made to execute the processing control method according to any one of claims 1 to 9.

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