Manufacturing method for semiconductor refrigeration device and semiconductor refrigeration device

Abstract

The invention relates to the technical field of semiconductor refrigeration, and discloses a manufacturing method for a semiconductor refrigeration device, which comprises the following steps: grinding two opposite side surfaces of a thermoelectric sheet; the ground thermoelectric sheet is cut into particles, and thermoelectric particle pairs are obtained; the thermoelectric particle pair is installed on the substrate assembly, and a semiconductor chilling plate is obtained; and the semiconductor refrigeration sheet is installed on the aluminum plate assembly, and the semiconductor refrigeration device is obtained. The thermal resistance caused by welding is reduced by improving the flatness of the two ends of the thermoelectric particle pair, so that the refrigerating capacity of the semiconductor refrigerating device is improved. And the heat yield of the hot end of the semiconductor refrigeration device is reduced, so that the heat dissipation noise of the hot end of the semiconductor refrigeration device is reduced, and the energy consumption of a heat dissipation fan is reduced. The invention further discloses a semiconductor refrigeration device.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor refrigeration, for example, to a manufacturing method for a semiconductor refrigeration device and a semiconductor refrigeration device. Background Art

[0002] Currently, refrigeration appliances such as refrigerators and freezers are usually used to store items such as food materials, and the refrigeration system in the refrigeration appliances is made up of devices such as compressors, condensers, and evaporators, occupying a relatively large space.

[0003] In the related art, the cold end of a semiconductor refrigeration chip is used to provide a refrigeration function inside the refrigeration appliance. The semiconductor refrigeration chip is composed of a cold end substrate, a hot end substrate, and thermoelectric particle pairs disposed between the cold end substrate and the hot end substrate. The opposite ends of the thermoelectric particle pairs are respectively welded to the cold end substrate and the hot end substrate to form the semiconductor refrigeration chip. The semiconductor refrigeration chip is installed in the refrigeration device to achieve refrigeration.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:

[0005] Although the semiconductor refrigeration chip in the related art can achieve the refrigeration function, directly welding the thermoelectric particle pairs to the cold end substrate and the hot end substrate results in an increase in the thermal resistance at the connection between the thermoelectric particle pairs and the two end substrates, and thus a reduction in the refrigeration capacity of the semiconductor refrigeration chip.

[0006] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present application, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0007] To have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. This summary is not a comprehensive review, nor is it intended to identify key / important constituent elements or delineate the protection scope of these embodiments, but rather serves as a preface to the subsequent detailed description.

[0008] The embodiments of the present disclosure provide a manufacturing method for a semiconductor refrigeration device and a semiconductor refrigeration device, which improve the flatness of both ends of the thermoelectric particle pairs, reduce the thermal resistance caused by welding, so as to increase the refrigeration capacity of the semiconductor refrigeration device. And reduce the heat generation amount at the hot end of the semiconductor refrigeration device, so as to improve the heat dissipation noise at the hot end of the semiconductor refrigeration device, and reduce the energy consumption of the heat dissipation fan.

[0009] In some embodiments, a manufacturing method for a semiconductor refrigeration device is provided, including: grinding opposite two side surfaces of a thermoelectric sheet; granulating the ground thermoelectric sheet to obtain pairs of thermoelectric particles; mounting the pairs of thermoelectric particles on a substrate assembly to obtain a semiconductor refrigeration sheet; and mounting the semiconductor refrigeration sheet on an aluminum plate assembly to obtain a semiconductor refrigeration device.

[0010] Optionally, grinding opposite two side surfaces of the thermoelectric sheet includes: using a double-sided grinding device to grind opposite two side surfaces of the thermoelectric sheet.

[0011] Optionally, granulating the ground thermoelectric sheet to obtain pairs of thermoelectric particles includes: granulating the ground thermoelectric sheet according to a preset particle size to obtain pairs of thermoelectric particles.

[0012] Optionally, the substrate assembly includes a first substrate and a second substrate. Mounting the pairs of thermoelectric particles on the substrate assembly to obtain a semiconductor refrigeration sheet includes: welding a first end of the pairs of thermoelectric particles to the first substrate; welding a second end of the pairs of thermoelectric particles to the second substrate to obtain a semiconductor refrigeration sheet; wherein, the first end and the second end are oppositely arranged.

[0013] Optionally, welding the first end of the pairs of thermoelectric particles to the first substrate includes: dotting solder on the first substrate; aligning the solder on the first substrate with a through hole of a mold; arranging the first end of the pairs of thermoelectric particles at corresponding solder points through the through hole of the mold; welding the pairs of thermoelectric particles to the first substrate; after welding, demolding the pairs of thermoelectric particles from the mold.

[0014] Optionally, welding the second end of the pairs of thermoelectric particles to the second substrate to obtain a semiconductor refrigeration sheet includes: dotting solder on the second substrate; aligning the solder on the second substrate with a through hole of a mold; arranging the second end of the pairs of thermoelectric particles at corresponding solder points through the through hole of the mold; welding the pairs of thermoelectric particles to the second substrate; after welding, demolding the pairs of thermoelectric particles from the mold to obtain a semiconductor refrigeration sheet.

[0015] Optionally, mounting the semiconductor refrigeration sheet on an aluminum plate assembly to obtain a semiconductor refrigeration device includes: setting thermal conductive silicone grease on the substrate assembly; arranging the aluminum plate assembly on one side of the substrate assembly so that the aluminum plate assembly is connected to the substrate assembly through the thermal conductive silicone grease.

[0016] Optionally, before grinding two ends of the thermoelectric sheet, it further includes: slicing a thermoelectric material to obtain a sheet-shaped thermoelectric material; electroplating nickel-tin on the surface of the sheet-shaped thermoelectric material to obtain a thermoelectric sheet.

[0017] Optionally, after installing the semiconductor refrigeration sheet and the aluminum plate assembly, the method further includes: providing a blocking portion around the outer periphery of the device obtained after installing the semiconductor refrigeration sheet and the aluminum plate assembly to obtain a semiconductor refrigeration device.

[0018] In some embodiments, a semiconductor refrigeration device is provided, which is manufactured by processing thermoelectric materials using the manufacturing method for a semiconductor refrigeration device described in any one of the above embodiments.

[0019] The manufacturing method for a semiconductor refrigeration device and the semiconductor refrigeration device provided in the embodiments of the present disclosure can achieve the following technical effects:

[0020] The manufacturing method for a semiconductor refrigeration device provided in the embodiment of the present disclosure improves the flatness of both ends of the thermoelectric material by grinding the two ends of the thermoelectric material. This improves the flatness of both ends of the thermoelectric particle pair obtained after the thermoelectric material is pelletized, so as to reduce the thermal resistance caused by welding the two ends of the thermoelectric particle pair to the substrate assembly. By reducing the thermal resistance of the semiconductor refrigeration sheet itself, the cooling capacity of the cold end of the semiconductor refrigeration device is increased. The heat generation of the hot end of the semiconductor refrigeration device is also reduced to improve the heat dissipation noise of the hot end of the semiconductor refrigeration device and reduce the energy consumption of the heat dissipation fan.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a schematic structural diagram of a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0024] Figure 2 yes Figure 1 A cross-sectional view of a semiconductor refrigeration device in the illustrated embodiment;

[0025] Figure 3 It is a flow chart of a method for manufacturing a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0026] Figure 4 is a flow chart of another method for manufacturing a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0027] Figure 5 is a flow chart of another method for manufacturing a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0028] Figure 6 It is a schematic flowchart of another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0029] Figure 7 It is a schematic flowchart of another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0030] Figure 8 It is a schematic flowchart of another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0031] Figure 9 It is a schematic flowchart of another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0032] Figure 10 It is a schematic flowchart of another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure;

[0033] Figure 11 It is a schematic flowchart of another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure.

[0034] Reference numerals:

[0035] 10, thermoelectric particle pairs; 20, first substrate; 30, second substrate; 40, first aluminum plate; 50, second aluminum plate; 60, enclosure part. Detailed implementation manners

[0036] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are only for reference and illustration purposes and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of explanation, multiple details are provided to provide a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, well-known structures and devices can be shown in a simplified manner.

[0037] The terms "first", "second", etc. in the specification, claims and above-mentioned drawings of the embodiments of the present disclosure are used to distinguish similar objects and do not necessarily need to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to implement the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0038] Unless otherwise stated, the term "plurality" means two or more.

[0039] In the embodiments of the present disclosure, the character " / " indicates an "or" relationship between the front and rear objects. For example, A / B means: A or B.

[0040] The term "and / or" is an associative relationship describing an object, indicating that there can be three relationships. For example, A and / or B means: A or B, or, the three relationships of A and B.

[0041] The term "corresponding" can refer to an associative relationship or a binding relationship. A corresponding to B means that there is an associative relationship or a binding relationship between A and B.

[0042] In the actual use process of a thermoelectric cooler in the related art, while meeting the cooling demand of the refrigeration equipment, a large amount of heat is generated. In order to dissipate heat, a cooling fan is often arranged at the hot end of the thermoelectric cooler. To meet the heat dissipation requirement of the thermoelectric cooler, a relatively large power of the cooling fan is required, which in turn causes a large amount of noise generated by the cooling fan. To solve this noise problem, the embodiments of the present disclosure reduce the thermal resistance of the thermoelectric cooler itself, increase the refrigerating capacity at the cold end of the thermoelectric cooling device, and reduce the heat generation amount at the hot end of the thermoelectric cooling device, so as to improve the heat dissipation noise at the hot end of the thermoelectric cooling device and reduce the energy consumption of the cooling fan.

[0043] Combined with Figure 1 and Figure 2 shown, in some embodiments, a thermoelectric cooling device is provided, which is made of a thermoelectric material processed by the manufacturing method for a thermoelectric cooling device described in any of the following embodiments.

[0044] The thermoelectric cooling device provided by the embodiments of the present disclosure is as Figure 1 and Figure 2 shown. The thermoelectric cooling device is composed of a thermoelectric particle pair 10, a first substrate 20, a second substrate 30, a first aluminum plate 40, a second aluminum plate 50, and an enclosure part 60. The thermoelectric cooling device further includes a first interface and a second interface, and the first interface and the second interface are used to connect to a power source to realize the refrigeration function of the thermoelectric cooling device.

[0045] Specifically, one end of the opposite ends of the thermoelectric particle pair 10 is connected to the first substrate 20, and the other end of the opposite ends of the thermoelectric particle pair 10 is connected to the second substrate 30 to form a thermoelectric cooler. A first aluminum plate 40 is arranged on one side of the first substrate 20. Among them, the first aluminum plate 40 and the thermoelectric particle pair 10 are located at the opposite ends of the first substrate 20. A second aluminum plate 50 is arranged on one side of the second substrate 30. Among them, the second aluminum plate 50 and the thermoelectric particle pair 10 are located at the opposite ends of the second substrate 30. To form a thermoelectric cooling assembly. An enclosure part 60 is arranged around the outer peripheral side of the thermoelectric cooling assembly to obtain the thermoelectric cooling device as Figure 1 and Figure 2 shown.

[0046] Specifically, a plurality of thermoelectric particle pairs 10 are arranged between the first substrate 20 and the second substrate 30. The plurality of thermoelectric particle pairs 10 are connected in series to form a thermoelectric particle chain. One end of the thermoelectric particle chain is configured as a first interface, and the other end of the thermoelectric particle chain is configured as a second interface. When the first interface is connected to the positive electrode of the power supply, the second interface is connected to the negative electrode of the power supply. When the second interface is connected to the positive electrode of the power supply, the first interface is connected to the negative electrode of the power supply.

[0047] When a direct current flows through the semiconductor refrigeration device, the current sequentially flows through the first interface, the thermoelectric particle chain to the second interface. At this time, the first substrate 20 of the semiconductor refrigeration device serves as the cold-end substrate, and the second substrate 30 of the semiconductor refrigeration device serves as the hot-end substrate.

[0048] Alternatively, the current sequentially flows through the second interface, the thermoelectric particle chain to the first interface. At this time, the first substrate 20 of the semiconductor refrigeration device serves as the hot-end substrate, and the second substrate 30 of the semiconductor refrigeration device serves as the cold-end substrate.

[0049] Combined with Figure 1 and Figure 2 the semiconductor refrigeration device shown, an embodiment of the present disclosure provides a manufacturing method for a semiconductor refrigeration device. As shown in Figure 3 it includes:

[0050] S301, grinding the opposite two side surfaces of the thermoelectric sheet.

[0051] S302, granulating the ground thermoelectric sheet to obtain thermoelectric particle pairs.

[0052] S303, installing the thermoelectric particle pairs on a substrate assembly to obtain a semiconductor refrigeration sheet.

[0053] S304, installing the semiconductor refrigeration sheet on an aluminum plate assembly to obtain a semiconductor refrigeration device.

[0054] The manufacturing method for a semiconductor refrigeration device provided by the embodiment of the present disclosure improves the flatness of both ends of the thermoelectric material by grinding both ends of the thermoelectric material. Furthermore, the flatness of both ends of the thermoelectric particle pairs obtained after granulating the thermoelectric material is improved, so as to reduce the thermal resistance brought by welding both ends of the thermoelectric particle pairs to the substrate assembly respectively. By reducing the thermal resistance of the semiconductor refrigeration sheet itself, the refrigerating capacity of the cold end of the semiconductor refrigeration device is improved. And the heat generation amount at the hot end of the semiconductor refrigeration device is reduced, so as to improve the heat dissipation noise at the hot end of the semiconductor refrigeration device and reduce the energy consumption of the heat dissipation fan.

[0055] Combined with Figure 4 shown, an embodiment of the present disclosure provides another manufacturing method for a semiconductor refrigeration device, including:

[0056] S401, Use a double-sided grinding device to grind the opposite two side surfaces of the thermoelectric sheet.

[0057] S402, Granulate the ground thermoelectric sheet to obtain pairs of thermoelectric particles.

[0058] S403, Install the pairs of thermoelectric particles on a substrate assembly to obtain a semiconductor refrigeration sheet.

[0059] S404, Install the semiconductor refrigeration sheet on an aluminum plate assembly to obtain a semiconductor refrigeration device.

[0060] In this embodiment, by using a double-sided grinding device to grind the opposite two side surfaces of the thermoelectric sheet, the flatness of the opposite two side surfaces of the thermoelectric sheet is improved. Furthermore, the flatness at both ends of the pairs of thermoelectric particles obtained after granulating the thermoelectric material is improved, so as to reduce the thermal resistance brought by welding the two ends of the pairs of thermoelectric particles to the substrate assembly respectively, and improve the refrigerating capacity at the cold end of the semiconductor refrigeration device. And reduce the heat generation amount at the hot end of the semiconductor refrigeration device, so as to improve the heat dissipation noise at the hot end of the semiconductor refrigeration device, and reduce the energy consumption of the heat dissipation fan.

[0061] Specifically, the double-sided grinding device can simultaneously provide a grinding function for the opposite two side surfaces of the thermoelectric sheet, so as to reduce the time for grinding one surface and then the other surface of the opposite two side surfaces of the thermoelectric sheet in sequence.

[0062] Combined with Figure 5 As shown, another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure includes:

[0063] S501, Perform a grinding process on the opposite two side surfaces of the thermoelectric sheet.

[0064] S502, Granulate the ground thermoelectric sheet according to a preset particle size to obtain pairs of thermoelectric particles.

[0065] S503, Install the pairs of thermoelectric particles on a substrate assembly to obtain a semiconductor refrigeration sheet.

[0066] S504, Install the semiconductor refrigeration sheet on an aluminum plate assembly to obtain a semiconductor refrigeration device.

[0067] In this embodiment, by granulating the ground thermoelectric sheet according to a preset particle size, pairs of thermoelectric particles with a preset size are obtained, and the opposite two side surfaces of the pairs of thermoelectric particles have high flatness. So as to reduce the thermal resistance brought by welding during the process of installing the pairs of thermoelectric particles on the substrate assembly, and improve the refrigerating capacity at the cold end of the semiconductor refrigeration device. And reduce the heat generation amount at the hot end of the semiconductor refrigeration device, so as to improve the heat dissipation noise at the hot end of the semiconductor refrigeration device, and reduce the energy consumption of the heat dissipation fan.

[0068] Specifically, when manufacturing a thermoelectric sheet, the thickness and height of the thermoelectric sheet are processed, and the thickness and height of the processed thermoelectric sheet are the same as the thickness and height of a preset particle size. In this way, when cutting the thermoelectric sheet into particles, the thermoelectric sheet only needs to be cut into particles according to a preset length to obtain thermoelectric particle pairs that meet the preset particle size, reducing the problem of a relatively high complexity in the manufacturing process caused by multiple treatments of the sheet.

[0069] Combined with Figure 6 As shown, another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure includes:

[0070] S601, performing a grinding process on opposite two side surfaces of the thermoelectric sheet.

[0071] S602, cutting the ground thermoelectric sheet into particles to obtain thermoelectric particle pairs.

[0072] S603, welding a first end of the thermoelectric particle pair to a first substrate.

[0073] S604, welding a second end of the thermoelectric particle pair to a second substrate to obtain a semiconductor refrigeration sheet. Among them, the first end and the second end are oppositely arranged.

[0074] S605, installing the semiconductor refrigeration sheet on an aluminum plate assembly to obtain a semiconductor refrigeration device.

[0075] In this embodiment, by welding the first end of the thermoelectric particle pair to the first substrate, the installation of the thermoelectric particle pair and the first substrate is completed. By welding the second end of the thermoelectric particle pair to the second substrate, the installation of the thermoelectric particle pair and the second substrate is completed. Moreover, the end faces of the first end and the second end of the thermoelectric particle pair have high flatness, thereby reducing the thermal resistance at the welding joints between the thermoelectric particle pair and the first substrate and the second substrate, increasing the refrigerating capacity at the cold end of the semiconductor refrigeration device, reducing the heat generation amount at the hot end of the semiconductor refrigeration device, improving the heat dissipation noise at the hot end of the semiconductor refrigeration device, and reducing the energy consumption of the heat dissipation fan.

[0076] Combined with Figure 7 As shown, another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure includes:

[0077] S701, performing a grinding process on opposite two side surfaces of the thermoelectric sheet.

[0078] S702, cutting the ground thermoelectric sheet into particles to obtain thermoelectric particle pairs.

[0079] S703, dotting solder on the first substrate.

[0080] S704, aligning the solder on the first substrate with the through holes of the mold.

[0081] S705, arrange the first ends of the thermoelectric particle pairs at corresponding solder points through the through-holes of the mold.

[0082] S706, weld the thermoelectric particle pairs to the first substrate.

[0083] S707, after welding, demold the thermoelectric particle pairs from the mold.

[0084] S708, weld the second ends of the thermoelectric particle pairs to the second substrate to obtain a semiconductor refrigeration chip. Wherein, the first end and the second end are arranged oppositely.

[0085] S709, install the semiconductor refrigeration chip on the aluminum plate assembly to obtain a semiconductor refrigeration device.

[0086] In this embodiment, solder is dotted on the first substrate to facilitate the welding between the thermoelectric particle pairs and the first substrate. By using the through-holes of the mold to arrange the first ends of the thermoelectric particle pairs at the corresponding solder points, the accuracy of welding between the thermoelectric particle pairs and the first substrate is improved.

[0087] Combined Figure 8 As shown, another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure includes:

[0088] S801, perform grinding treatment on opposite two side surfaces of the thermoelectric sheet.

[0089] S802, granulate the ground thermoelectric sheet to obtain thermoelectric particle pairs.

[0090] S803, weld the first ends of the thermoelectric particle pairs to the first substrate.

[0091] S804, dot solder on the second substrate.

[0092] S805, align the solder on the second substrate with the through-holes of the mold.

[0093] S806, arrange the second ends of the thermoelectric particle pairs at corresponding solder points through the through-holes of the mold.

[0094] S807, weld the thermoelectric particle pairs to the second substrate.

[0095] S808, after welding, demold the thermoelectric particle pairs from the mold to obtain a semiconductor refrigeration chip. Wherein, the first end and the second end are arranged oppositely.

[0096] S809, install the semiconductor refrigeration chip on the aluminum plate assembly to obtain a semiconductor refrigeration device.

[0097] In this embodiment, solder is dotted on the second substrate to facilitate the welding between the thermoelectric particle pair and the second substrate. By using the through holes of the mold to arrange the second ends of the thermoelectric particle pairs at the corresponding solder points, the accuracy of the welding between the thermoelectric particle pairs and the second substrate is improved.

[0098] Combined Figure 9 As shown, another manufacturing method for a semiconductor refrigeration device provided by an embodiment of the present disclosure includes:

[0099] S901, grinding the opposite two side surfaces of the thermoelectric sheet.

[0100] S902, granulating the ground thermoelectric sheet to obtain thermoelectric particle pairs.

[0101] S903, installing the thermoelectric particle pairs on the substrate assembly to obtain a semiconductor refrigeration sheet.

[0102] S904, setting thermal conductive silicone grease on the substrate assembly.

[0103] S905, setting the aluminum plate assembly on one side of the substrate assembly, and connecting the aluminum plate assembly and the substrate assembly through the thermal conductive silicone grease.

[0104] In this embodiment, by setting thermal conductive silicone grease on one side of the substrate assembly and connecting the aluminum plate assembly and the substrate assembly through the thermal conductive silicone grease, good thermal conductivity can be achieved between the aluminum plate assembly and the substrate assembly. After the heat and cold generated by the thermoelectric material are transferred to the substrate assembly, they are transferred from the substrate assembly to the aluminum plate assembly to realize the refrigeration function and heating function of the semiconductor refrigeration device, and improve the refrigeration efficiency and heating efficiency of the semiconductor refrigeration device.

[0105] Optionally, the aluminum plate assembly includes a first aluminum plate and a second aluminum plate. Setting the aluminum plate assembly on one side of the substrate assembly and connecting the aluminum plate assembly and the substrate assembly through the thermal conductive silicone grease includes: installing the first substrate and the first aluminum plate. Installing the second substrate and the second aluminum plate.

[0106] Optionally, installing the first substrate and the first aluminum plate includes: setting thermal conductive silicone grease on one side of the first substrate; wherein, the thermal conductive silicone grease and the thermoelectric particle pair are located on opposite sides of the first substrate. Setting an adhesive on one side of the first substrate; wherein the adhesive and the thermoelectric particle pair are located on opposite sides of the first substrate. Setting the first aluminum plate on one side of the first substrate, and connecting the first aluminum plate and the first substrate through the thermal conductive silicone grease and the adhesive; wherein, the first substrate and the first aluminum plate are located on opposite sides of the thermal conductive silicone grease.

[0107] In this embodiment, the first aluminum plate and the first substrate are connected by thermal conductive silicone grease and an adhesive to achieve the installation of the first aluminum plate and the first substrate. Moreover, when the adhesive is provided, there is likely to be a gap between the first substrate and the first aluminum plate. Setting the thermal conductive silicone grease can reduce the gap between the first substrate and the first aluminum plate to improve the heat transfer efficiency between the first substrate and the first aluminum plate.

[0108] Optionally, installing the second substrate and the second aluminum plate includes: disposing thermal conductive silicone grease on one side of the second substrate; wherein, the thermal conductive silicone grease and the thermoelectric particle pair are located on opposite sides of the second substrate. Disposing the adhesive on one side of the second substrate; wherein the adhesive and the thermoelectric particle pair are located on opposite sides of the second substrate. Disposing the second aluminum plate on one side of the second substrate, and the second aluminum plate and the second substrate are connected by thermal conductive silicone grease and an adhesive; wherein, the first substrate and the first aluminum plate are located on opposite sides of the thermal conductive silicone grease.

[0109] In this embodiment, the second aluminum plate and the second substrate are connected by thermal conductive silicone grease and an adhesive to achieve the installation of the second aluminum plate and the second substrate. Moreover, when the adhesive is provided, there is likely to be a gap between the second substrate and the second aluminum plate. Setting the thermal conductive silicone grease can reduce the gap between the second substrate and the second aluminum plate to improve the heat transfer efficiency between the second substrate and the second aluminum plate.

[0110] Optionally, installing the first substrate and the first aluminum plate includes: connecting the first substrate and the first aluminum plate by a bolt structure.

[0111] In this embodiment, the bolt structure is provided to achieve the installation of the first substrate and the first aluminum plate. Moreover, because the bolt structure is provided, the gap between the first substrate and the first aluminum plate is small, which can reduce the thermal resistance brought by setting the thermal conductive silicone grease, thereby further improving the cooling capacity of the cold end of the semiconductor refrigeration device. And reduce the heat generation at the hot end of the semiconductor refrigeration device to improve the heat dissipation noise at the hot end of the semiconductor refrigeration device and reduce the energy consumption of the cooling fan.

[0112] Optionally, installing the second substrate and the second aluminum plate includes: connecting the second substrate and the second aluminum plate by a bolt structure.

[0113] In this embodiment, the bolt structure is provided to achieve the installation of the second substrate and the second aluminum plate. Moreover, because the bolt structure is provided, the gap between the second substrate and the second aluminum plate is small, which can reduce the thermal resistance brought by setting the thermal conductive silicone grease, thereby further improving the cooling capacity of the cold end of the semiconductor refrigeration device. And reduce the heat generation at the hot end of the semiconductor refrigeration device to improve the heat dissipation noise at the hot end of the semiconductor refrigeration device and reduce the energy consumption of the cooling fan.

[0114] Combined with Figure 10As shown, an embodiment of the present disclosure provides another manufacturing method for a semiconductor refrigeration device, including:

[0115] S1001, slicing the thermoelectric material to obtain sheet-shaped thermoelectric materials;

[0116] S1002, electroplating nickel-tin on the surface of the sheet-shaped thermoelectric materials to obtain thermoelectric sheets.

[0117] S1003, performing grinding treatment on the opposite two side surfaces of the thermoelectric sheets.

[0118] S1004, granulating the ground thermoelectric sheets to obtain pairs of thermoelectric particles.

[0119] S1005, installing the pairs of thermoelectric particles on a substrate assembly to obtain a semiconductor refrigeration chip.

[0120] S1006, installing the semiconductor refrigeration chip on an aluminum plate assembly to obtain a semiconductor refrigeration device.

[0121] In this embodiment, by slicing the thermoelectric material, it is convenient to grind both ends of the thermoelectric sheet using tools, reducing the problem that it is inconvenient to grind both ends of the thermoelectric material due to its too large volume. This improves the flatness of both ends of the thermoelectric sheet. Furthermore, it realizes improving the flatness of both ends of the pairs of thermoelectric particles obtained after granulating the thermoelectric sheet, reducing the thermal resistance brought by welding both ends of the pairs of thermoelectric particles to the substrate assembly respectively, and improving the refrigeration capacity of the semiconductor refrigeration device.

[0122] Moreover, by electroplating nickel-tin on the surface of the thermoelectric sheet, the surface of the pairs of thermoelectric particles obtained by granulating the thermoelectric sheet has nickel-tin, improving the installation reliability of the pairs of thermoelectric particles on the substrate assembly.

[0123] Specifically, since it is very difficult to directly solder semiconductor materials, the electroplated nickel-tin layer ensures the welding reliability between the pairs of thermoelectric particles and the substrate assembly.

[0124] Optionally, before electroplating nickel-tin on the surface of the sheet-shaped thermoelectric materials, it further includes: spraying nickel on the surface of the sheet-shaped thermoelectric materials. In this way, the bonding force between the sprayed nickel layer and the sheet-shaped thermoelectric materials is very strong, and the bonding force between the electroplated nickel-tin layer and the sprayed nickel layer is also very strong, further improving the installation reliability of the pairs of thermoelectric particles on the substrate assembly.

[0125] Combined Figure 11 As shown, an embodiment of the present disclosure provides another manufacturing method for a semiconductor refrigeration device, including:

[0126] S1101, performing grinding treatment on the opposite two side surfaces of the thermoelectric sheets.

[0127] S1102, pelletizing the ground thermoelectric sheet to obtain thermoelectric particle pairs.

[0128] S1103, installing the thermoelectric particle pair on the substrate assembly to obtain a semiconductor cooling sheet.

[0129] S1104, installing the semiconductor refrigeration sheet on the aluminum plate assembly to obtain a semiconductor refrigeration device.

[0130] S1105, a retaining portion is provided around the outer circumference of the device obtained after the semiconductor refrigeration sheet and the aluminum plate assembly are installed to obtain a semiconductor refrigeration device.

[0131] In this embodiment, a retaining portion is provided on the outer circumference of the device obtained after the semiconductor cooling sheet and the aluminum plate assembly are installed, so as to improve the installation strength of the semiconductor cooling sheet and the aluminum plate assembly. Thus, the obtained semiconductor cooling device has a higher mechanical strength, reduces the problem of damage to the semiconductor cooling device, and increases the service life of the semiconductor cooling device.

[0132] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural, logical, electrical, process and other changes. The embodiments represent only possible changes. Unless explicitly required, separate components and functions are optional, and the order of operation may vary. The parts and features of some embodiments may be included in or replace the parts and features of other embodiments. Moreover, the words used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and the claims, unless the context clearly indicates, the singular forms of "a", "an" and "the" are intended to include plural forms as well. Similarly, the term "and / or" as used in this application refers to any and all possible combinations of listings containing one or more associated ones. In addition, when used in the present application, the term "comprise" and its variants "comprises" and / or comprising refer to the presence of stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the presence of other identical elements in the process, method or device comprising the elements. In this article, each embodiment may focus on the differences from other embodiments, and the same and similar parts between the various embodiments may refer to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, then the relevant parts can refer to the description of the method part.

[0133] Those skilled in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner can depend on the specific application and design constraints of the technical solution. The skilled person can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of the embodiments of the present disclosure. The skilled person can clearly understand that for the convenience and conciseness of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0134] In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, equipment, etc.) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units can be merely a logical function division, and there can be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Additionally, the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces, and the indirect couplings or communication connections of the devices or units can be in electrical, mechanical, or other forms. The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to implement this embodiment. Additionally, in the embodiments of the present disclosure, the functional units can be integrated in one processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit.

[0135] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a portion of code, which contains one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions noted in the blocks may occur in a different order than noted in the accompanying drawings. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. Each block in the block diagram and / or flowchart, and combinations of blocks in the block diagram and / or flowchart, may be implemented by a dedicated hardware-based system that performs the specified functions or actions, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A manufacturing method for a semiconductor refrigeration device, characterized in that, Including: Grinding the opposite two side surfaces of the thermoelectric sheet; Pelletizing the ground thermoelectric sheet to obtain pairs of thermoelectric particles; Mounting the pairs of thermoelectric particles on a substrate assembly to obtain a semiconductor refrigeration sheet; Mounting the semiconductor refrigeration sheet on an aluminum plate assembly to obtain a semiconductor refrigeration device.

2. The manufacturing method for a semiconductor refrigeration device according to claim 1, characterized in that, Grinding the opposite two side surfaces of the thermoelectric sheet includes: Using a double-sided grinding device to grind the opposite two side surfaces of the thermoelectric sheet.

3. The manufacturing method for a semiconductor refrigeration device according to claim 1, characterized in that, Pelletizing the ground thermoelectric sheet to obtain pairs of thermoelectric particles includes: Pelletizing the ground thermoelectric sheet according to a preset particle size to obtain pairs of thermoelectric particles.

4. The manufacturing method for a semiconductor refrigeration device according to any one of claims 1 to 3, characterized in that, The substrate assembly includes a first substrate and a second substrate. Mounting the pairs of thermoelectric particles on the substrate assembly to obtain a semiconductor refrigeration sheet includes: Welding the first ends of the pairs of thermoelectric particles to the first substrate; Welding the second ends of the pairs of thermoelectric particles to the second substrate to obtain a semiconductor refrigeration sheet; Wherein, the first ends and the second ends are oppositely arranged.

5. The manufacturing method for a semiconductor refrigeration device according to claim 4, wherein Welding the first ends of the pairs of thermoelectric particles to the first substrate includes: Dotting solder on the first substrate; Aligning the solder on the first substrate with the through holes of the mold; Arranging the first ends of the pairs of thermoelectric particles at corresponding solder points through the through holes of the mold; Welding the pairs of thermoelectric particles to the first substrate; After welding, demolding the pairs of thermoelectric particles from the mold.

6. The manufacturing method for a semiconductor refrigeration device according to claim 4, characterized in that, Welding the second ends of the pairs of thermoelectric particles to the second substrate to obtain a semiconductor refrigeration sheet includes: Dotting solder on the second substrate; Aligning the solder on the second substrate with the through holes of the mold; Arranging the second ends of the pairs of thermoelectric particles at corresponding solder points through the through holes of the mold; Welding the pairs of thermoelectric particles to the second substrate; After welding, demolding the pairs of thermoelectric particles from the mold to obtain a semiconductor refrigeration sheet.

7. The manufacturing method for a semiconductor refrigeration device according to any one of claims 1 to 3, characterized in that, Mounting the semiconductor refrigeration sheet on an aluminum plate assembly to obtain a semiconductor refrigeration device includes: Setting thermal conductive silicone grease on the substrate assembly; Arranging the aluminum plate assembly on one side of the substrate assembly so that the aluminum plate assembly is connected to the substrate assembly through the thermal conductive silicone grease.

8. The manufacturing method for a semiconductor refrigeration device according to any one of claims 1 to 3, characterized in that, Before grinding the two ends of the thermoelectric sheet, it further includes: Slicing the thermoelectric material to obtain a sheet-shaped thermoelectric material; Electroplating nickel-tin on the surface of the sheet-shaped thermoelectric material to obtain a thermoelectric sheet.

9. The manufacturing method for a semiconductor refrigeration device according to any one of claims 1 to 3, characterized in that, After mounting the semiconductor refrigeration sheet and the aluminum plate assembly, it further includes: Surrounding a perimeter portion on the outer peripheral side of the device obtained after mounting the semiconductor refrigeration sheet and the aluminum plate assembly to obtain a semiconductor refrigeration device.

10. A semiconductor refrigeration device, characterized in that, Prepared from thermoelectric materials processed by the manufacturing method for a semiconductor refrigeration device according to any one of claims 1 to 9.

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