Electronic tester

Abstract

A test apparatus is described. Various components facilitate testing the functionality of the apparatus in order to maintain the movement of the vacuum wafer package without human supervision. These functions include a latch system that maintains the wafer package intact and a pressure sensing system that detects and relays pressure in the wafer package.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of October 5, 2021 and an application number of 202180068810.9.

[0002] Cross-reference to related applications

[0003] This application claims the priority of U.S. Provisional Patent Application No. 63 / 088,635, filed on October 7, 2020, the entire content of which is incorporated herein by reference. Background of the Invention 1) Field of the Invention

[0004] The present invention relates to a test device for testing microelectronic circuits.

[0005] 2) Discussion of Related Art

[0006] Microelectronic circuits are typically fabricated in and on semiconductor wafers. Such wafers are then "diced" or "cut" into individual die. Such die are typically mounted onto a support substrate to provide rigidity thereto and for electrical communication with the integrated circuit or microelectronic circuit of the die. The final package may include a package of the die, and the resulting package may then be shipped to a customer.

[0007] It is desirable to test the die or package before shipping it to a customer. Ideally, in order to identify defects that occur during early fabrication, the die should be tested at an early stage. Wafer-level testing can be achieved by providing a manipulator and a contactor having contacts and then using the manipulator to move the wafer so that the contacts on the wafer contact the contacts on the contactor. Power and electrical signals can then be provided to and from the microelectronic circuit formed in the wafer through the contactor.

[0008] According to various embodiments, a wafer includes a substrate such as a silicon substrate or a printed circuit board and one or more devices fabricated in or mounted to the substrate.

[0009] Alternatively, the wafer may be located within a removable wafer package having an electrical interface and a thermal chuck. Power and signals can be provided to and from the wafer through the electrical interface while thermally controlling the temperature of the wafer by heating or cooling the thermal chuck.

[0010] After the wafer is diced, it may be desirable to test the individual die again, and it may be desirable to test the die again after the die is mounted onto the support substrate. Summary of the Invention

[0011] The present invention provides a microelectronic circuit test package, comprising: a movable support structure including a first member and a second member for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second member, the contacts mating with the terminals to contact the terminals; a differential pressure chamber seal between the first member and the second member, the differential pressure chamber seal together with the surfaces of the first member and the second member forming a closed differential pressure chamber; a decompression channel formed through one of the first member and the second member, the decompression channel having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber; a pressure reducing valve connected to the decompression channel, opening of the pressure reducing valve allowing air to exit from the differential pressure chamber to cause the first member and the second member to move relatively towards each other to ensure proper contact between the contacts and the terminals, and closing the pressure reducing valve to prevent air from entering the differential pressure chamber; a first interface on the movable support structure and connected to the contacts for connecting to a second interface on a fixed structure when the movable support structure is held by the fixed structure; and a latching system including a first latching assembly, the first latching assembly may include a first part coupled to the first member, a second part engaging the second member, a connecting part having opposite ends respectively fixed to the first part and the second part to form a locking device, and an engaging mechanism, the engaging mechanism being connected to the locking device and operable to move the locking device between a locked position and an unlocked position, in the locked position, the locking device holding the first member and the second member locked in a closed position, and in the unlocked position, the locking device allowing the first member and the second member to move from a closed relationship to a spaced relationship.

[0012] The microelectronic circuit test package may include that the engaging mechanism moves the second member between a locked position and an unlocked position.

[0013] The microelectronic circuit test package may include that the second member rotates between a locked position and an unlocked position.

[0014] The microelectronic circuit test package may include that the engaging mechanism includes a surface on the first part, the surface forming a seat for contacting a surface on the jaw of a tool, the jaw of the tool being rotatable to rotate the first part, and the first part causing the second part to rotate through the connecting part to move between a locked position and an unlocked position.

[0015] The microelectronic circuit test package may include that the surface on the first part forming the seat is the outer surface of the first part.

[0016] The microelectronic circuit test package may include that the first part has a tool pin opening for aligning the pin of the tool with the first part.

[0017] A microelectronic circuit test package may include a second part having a body and at least a first fin extending from the body, wherein the first fin moves over the shoulder of a first component when moved to a first locked position and leaves the shoulder when moving away from the first locked position towards an unlocked position.

[0018] A microelectronic circuit test package may include a second component having a second fin extending from the body, wherein the second fin moves over the shoulder of the first component when moved to a second locked position and moves away from the shoulder when moving away from the second locked position towards an unlocked position.

[0019] A microelectronic circuit test package may include that a latching system may further include a tuning block mounted in a fixed position relative to the first component, the tuning block having a leveling surface, when the first fin is above the shoulder, the second fin is above the leveling surface, and the second part is adjustable relative to the first part to adjust the gap between the leveling surface and the second fin.

[0020] A microelectronic circuit test package may include that a latching system may further include a lock nut having threads that engage the threads on the connecting portion to adjust the second part rotationally relative to the connecting portion.

[0021] A microelectronic circuit test package may include that a latching system may further include a spacer between the tuning block and the first component to adjust the distance between the leveling surface and the first component.

[0022] A microelectronic circuit test package may include that a latching system may further include a latching mechanism having a latching surface that latches into a first latching recess to prevent the second component from moving out of the locked position, and the latching surface latches into a second latching recess to prevent the second component from moving out of the unlocked position.

[0023] A microelectronic circuit test package may include that the first latching recess and the second latching recess are located on the locking device.

[0024] A microelectronic circuit test package may include that the first latching recess and the second latching recess are located on the second part.

[0025] A microelectronic circuit test package may include that the first component includes a backplane and a signal distribution board, wherein a part of the signal distribution board is located between the backplane and the second component, the signal distribution board has an opening through which the connecting portion is inserted, the opening has a first dimension on an axis towards the center point of the signal distribution board, the first dimension is greater than a second dimension transverse to the axis, the connecting portion has a first part that is less than the first dimension in the direction of the axis to allow the signal distribution board and the backplane to thermally expand relative to each other, and the dimension of the first part is designed to slidably fit within the second dimension of the opening to prevent the signal distribution board from moving relative to the backplane in a direction transverse to the axis.

[0026] Microelectronic circuit testing may include that a connecting portion has a second part, the second part has a first thickness and a second thickness transverse to the first thickness, the first thickness may be assembled through an opening in the direction of the axis during the insertion, and the first thickness is greater than a second dimension of the opening, and the second thickness may be assembled through the second dimension of the opening during the insertion.

[0027] The microelectronic circuit test package may include that a latching system may further include a second latching assembly, wherein each corresponding latching assembly may include a first part engaging with a first component, a second part engaging with a second component, a connecting portion having opposite ends respectively fixed to the first part and the second part to form a locking device, and an engaging mechanism, the engaging mechanism being connected to the locking device and operable to move the locking device between a locked position and an unlocked position, in the locked position, the locking device holds the first component and the second component locked in a closed position, and in the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to a spaced relationship.

[0028] The microelectronic circuit test package may include that a first latching assembly and a second latching assembly have corresponding second parts on different sides of the second component.

[0029] The microelectronic circuit test package may include that a differential pressure chamber seal surrounds a contact and a terminal.

[0030] The microelectronic circuit test package may include that when the first component and the second component are separated, the differential pressure chamber seal is fixed to the first component.

[0031] The microelectronic circuit test package may include that the differential pressure chamber seal is a lip seal.

[0032] The microelectronic circuit test package may include that a pressure reducing valve is a pressure reducing check valve, a vacuum release channel is formed through a component having the pressure reducing check valve, the vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber, and further includes a second valve, the second valve being a vacuum release valve connected to the vacuum release channel, the opening of the vacuum release valve allows air to enter the differential pressure chamber, and the closing of the vacuum release valve prevents air from escaping from the differential pressure chamber.

[0033] The microelectronic circuit test package may include that a substrate is a wafer having a plurality of microelectronic circuits.

[0034] The microelectronic circuit test package may include that a contact is a pin, and each pin has a spring, and when the corresponding contact is pressed by a corresponding one of the terminals, the spring is pressed against its spring force.

[0035] The present invention also provides a test device, comprising: a movable support structure including a first member and a second member for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second member, the contacts mating with the terminals to contact the terminals; a differential pressure chamber seal between the first member and the second member, the differential pressure chamber seal and the surfaces of the first member and the second member forming a closed differential pressure chamber; a decompression channel formed through one of the first member and the second member, the decompression channel having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber; a pressure reducing valve connected to the decompression channel, the opening of the pressure reducing valve allowing air to exit the differential pressure chamber to cause the first member and the second member to move relative to each other to ensure proper contact between the contacts and the terminals, and the closing of the pressure reducing valve preventing air from entering the differential pressure chamber; a first interface on the movable support structure and connected to the contacts; a first latch assembly which may include a first part engaging with the first member, a second part engaging with the second member, a connecting part having opposite ends respectively fixed to the first part and the second part to form a locking device, and an engaging mechanism, the engaging mechanism being connected to the locking device and operable to move the locking device between a locked position and an unlocked position, in the locked position, the locking device holding the first member and the second member locked in a closed position, and in the unlocked position, the locking device allowing the first member and the second member to move from a closed relationship to a spaced relationship; a fixed structure, the movable support structure being receivable to be held by the fixed structure and removable from the fixed structure; a second interface on the fixed structure, the second interface being connected to the first interface when the movable support structure is held by the fixed structure and disconnected from the first interface when the movable support structure is removed from the fixed structure; and an electronic tester, the electronic tester being connected to the terminals through the second interface, the first interface and the contacts such that signals are transmitted between the electronic tester and the microelectronic circuit to test the microelectronic circuit.

[0036] The test device may include that the engaging mechanism moves the second member between a locked position and an unlocked position.

[0037] The test device may include that the second member rotates between a locked position and an unlocked position.

[0038] The test device may include that the engaging mechanism includes a surface on the first part, the surface forming a seat for contacting a surface on the jaws of a tool, the jaws of the tool being rotatable to rotate the first part, and the first part causing the second part to rotate through the connecting part to move between a locked position and an unlocked position.

[0039] The test device may include that the surface forming the seat on the first part is the outer surface of the first part.

[0040] The test device may include a first part having tool pin openings therein for aligning the pins of the tool with the first part.

[0041] The test device may include a second part having a body and at least a first flap extending from the body, wherein the first flap moves over the shoulder of the first part when moved to a first locked position and leaves the shoulder when moving away from the first locked position towards the unlocked position.

[0042] The test device may include a second part having a second flap extending from the body, wherein the second flap moves over the shoulder of the first part when moved to a second locked position and leaves the shoulder when moving away from the second locked position towards the unlocked position.

[0043] The test device may include that the latch system may further include a tuning block mounted in a fixed position relative to the first part, the tuning block having a leveling surface, when the first flap is above the shoulder, the second flap is above the leveling surface, and the second part is adjustable relative to the first part to adjust the gap between the leveling surface and the second flap.

[0044] The test device may include that the latch system may further include a lock nut having threads that engage the threads on the connecting part to adjust the second part rotationally relative to the connecting part.

[0045] The test device may include that the latch system may further include a spacer between the tuning block and the first part to adjust the distance between the leveling surface and the first part.

[0046] The test device may include that the latch system may further include a latching mechanism having a latching surface that latches into a first latching recess to prevent the second part from moving out of the locked position, and the latching surface latches into a second latching recess to prevent the second part from moving out of the unlocked position.

[0047] The test device may include that the first latching recess and the second latching recess are located on the locking device.

[0048] The test device may include that the first latching recess and the second latching recess are located on the second part.

[0049] The test device may include a first component including a backplane and a signal distribution board, wherein a part of the signal distribution board is located between the backplane and a second component. The signal distribution board has an opening through which a connecting portion is inserted. The opening has a first dimension along an axis toward the center point of the signal distribution board, and the first dimension is greater than a second dimension transverse to the axis. The connecting portion has a first part that is smaller than the first dimension in the direction of the axis to allow for thermal expansion of the signal distribution board and the backplane relative to each other, and the dimension of the first part is designed to slidably fit within the second dimension of the opening to prevent the signal distribution board from moving relative to the backplane in a direction transverse to the axis.

[0050] The test device may include that the connecting portion has a second part having a first thickness and a second thickness transverse to the first thickness. The first thickness may fit through the opening in the direction of the axis during the insertion and is greater than the second dimension of the opening, and the second thickness may fit through the second dimension of the opening during the insertion.

[0051] The test device may include that the latching system may further include a second latching assembly, wherein each latching assembly may have a first part engaging with the first component, a second part engaging with the second component, a connecting portion having opposite ends respectively fixed to the first part and the second part to form a locking device, and an engaging mechanism that is connected to the locking device and is operable to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first component and the second component locked in a closed position, and in the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to a spaced relationship.

[0052] The test device may include that the first latching assembly and the second latching assembly have respective second parts on different sides of the second component.

[0053] The test device may include that a differential pressure chamber seal surrounds the contact and the terminal.

[0054] The test device may include that when the first component and the second component are separated, the differential pressure chamber seal is fixed to the first component.

[0055] The test device may include that the differential pressure chamber seal is a lip seal.

[0056] The test device may include that the pressure reducing valve is a pressure reducing check valve. A vacuum release channel is formed through a component having the pressure reducing check valve. The vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber. The test device further includes a second valve, which is a vacuum release valve connected to the vacuum release channel. The opening of the vacuum release valve allows air to enter the differential pressure chamber, and the closing of the vacuum release valve prevents air from escaping from the differential pressure chamber.

[0057] The test device may include a fixing structure including a thermal chuck, and a second member of the movable support structure includes a thin chuck that contacts the thermal chuck to allow heat transfer between the movable support structure and the thermal chuck.

[0058] The test device may include a substrate that is a wafer having a plurality of microelectronic circuits.

[0059] The test device may include contacts that are pins, each pin having a spring that is pressed against its spring force when the corresponding contact is pressed by a corresponding one of the terminals.

[0060] The present invention also provides a method for testing a microelectronic circuit held by a substrate, including holding the substrate between a first member and a second member of a movable support structure, the second member having contacts against terminals of the substrate connected to the microelectronic circuit, wherein a decompression channel is formed through one of the first member and the second member, the decompression channel having an inlet opening at a differential pressure chamber and an outlet opening outside the differential pressure chamber, positioning a differential pressure chamber seal between the first member and the second member to form a closed chamber by the surfaces of the first member and the second member and the differential pressure chamber seal, opening a pressure reducing valve to allow air to leave the differential pressure chamber and reduce the pressure in the differential pressure chamber to cause the first member and the second member to move towards each other to ensure proper contact between the contacts and the terminals, closing the pressure reducing valve to prevent air from entering the differential pressure chamber, operating an engagement mechanism to move a locking device between a locked position and an unlocked position, in the locked position, the locking device holds the first member and the second member locked in a closed position, in the unlocked position, the locking device allows the first member and the second member to move from a closed relationship to a spaced relationship, the locking device may include a first part engaging with the first member, a second part engaging with the second member, a connecting part having opposite ends respectively fixed to the first part and the second part, receiving the movable support structure through the fixing structure, wherein a first interface on the movable support structure is connected to a second interface on the fixing structure, and transmitting signals between an electronic tester and the microelectronic circuit through the terminals, the contacts, and the first interface and the second interface to test the microelectronic circuit.

[0061] The method may include that the engagement mechanism moves the second member between a locked position and an unlocked position.

[0062] The method may include that the second member rotates between a locked position and an unlocked position.

[0063] The method may include that the engagement mechanism includes a surface on the first part that forms a seat for contacting a surface on the jaws of a tool, the jaws of the tool being rotatable to rotate the first part, and the first part rotates the second part through the connecting part to move between a locked position and an unlocked position.

[0064] The method may include that the surface on the first part where the seat is formed is the outer surface of the first part.

[0065] The method may include that the first part has a tool pin opening therein for aligning the pin of the tool with the first part.

[0066] The method may include that the second part has a body and at least a first fin extending from the body, wherein the first fin moves over the shoulder of the first part when moving to the first locked position and leaves the shoulder when moving away from the first locked position towards the unlocked position.

[0067] The method may include that the second part has a second fin extending from the body, wherein the second fin moves over the shoulder of the first part when moving to the second locked position and leaves the shoulder when moving away from the second locked position towards the unlocked position.

[0068] The method may include that the latch system may further include a tuning block mounted in a fixed position relative to the first part, the tuning block having a leveling surface, when the first fin is above the shoulder, the second fin is above the leveling surface, and the second part is adjustable relative to the first part to adjust the gap between the leveling surface and the second fin.

[0069] The method may include that the latch system may further include a lock nut having threads engaging the threads on the connecting part to adjust the second part rotationally relative to the connecting part.

[0070] The method may include that the latch system may further include positioning a spacer between the tuning block and the first part to adjust the distance between the leveling surface and the first part.

[0071] The method may include that the latch system may further include a latching mechanism having a latching surface that latches into a first latching recess to prevent the second part from moving away from the locked position, and the latching surface latches into a second latching recess to prevent the second part from moving away from the unlocked position.

[0072] The method may include that the first latching recess and the second latching recess are located on the locking device.

[0073] The method may include that the first latching recess and the second latching recess are located on the second part.

[0074] The method may include that a first component includes a backplane and a signal distribution board, wherein a part of the signal distribution board is located between the backplane and a second component. The signal distribution board has an opening through which a connecting portion is inserted. The opening has a first dimension on an axis toward the center point of the signal distribution board, and the first dimension is greater than a second dimension transverse to the axis. The connecting portion has a first part that is smaller than the first dimension in the direction of the axis to allow thermal expansion of the signal distribution board and the backplane relative to each other, and the dimension of the first part is designed to be slidably assembled within the second dimension of the opening to prevent the signal distribution board from moving relative to the backplane in a direction transverse to the axis.

[0075] The method may include that the connecting portion has a second part that has a first thickness and a second thickness transverse to the first thickness. The first thickness can be assembled through the opening in the axial direction during the insertion, and the first thickness is greater than the second dimension of the opening. The second thickness can be assembled through the second dimension of the opening during the insertion.

[0076] The method may include that a latching system may include a second latching assembly. Each corresponding latching assembly has: a first part engaged with the first component, a second part engaged with the second component, a connecting portion having opposite ends respectively fixed to the first part and the second part to form a locking device, and an engaging mechanism that is connected to the locking device and is operable to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first component and the second component locked in a closed position. In the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to a spaced relationship.

[0077] The method may include that the first latching assembly and the second latching assembly have respective second parts on different sides of the second component.

[0078] The method may include that a differential pressure chamber seal surrounds a contact and a terminal.

[0079] The method may include that when the first component and the second component are separated, the differential pressure chamber seal is fixed to the first component.

[0080] The method may include that a lip seal is used to create the differential pressure chamber seal.

[0081] The method may include that a pressure reducing valve is a pressure reducing check valve. A vacuum release channel is formed through a component having the pressure reducing check valve. The vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber. It also includes opening a second valve, which is a vacuum release valve connected to the vacuum release channel, to allow air to enter the differential pressure chamber.

[0082] The method may include that a fixing structure includes a thermal chuck, and the second component of the movable support structure includes a thin chuck.

[0083] The method may include that the substrate is a wafer having a plurality of microelectronic circuits.

[0084] The method may include that the contact is a pin, and each pin has a spring which is pressed against its spring force when the corresponding contact is pressed by a corresponding one of the terminals.

[0085] The present invention also provides a microelectronic circuit test package, which includes a movable support structure. The movable support structure includes a first member and a second member for holding a substrate therebetween. The substrate carries microelectronic circuits and has a plurality of terminals connected to the microelectronic circuits. A plurality of contacts on the second member, the contacts being matched with the terminals to contact the terminals. A differential pressure chamber seal between the first member and the second member, the differential pressure chamber seal and the surfaces of the first member and the second member together form a closed differential pressure chamber. A decompression channel formed through one of the first member and the second member, the decompression channel having an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber. A pressure reducing valve connected to the decompression channel, the opening of the pressure reducing valve allows air to leave the differential pressure chamber to move the first member and the second member towards each other relatively to ensure proper contact between the contacts and the terminals, and closing the pressure reducing valve to prevent air from entering the differential pressure chamber. A first interface on the movable support structure and connected to the contacts for connecting to a second interface on a fixed structure when the movable support structure is removably held by the fixed structure. A pressure sensor positioned to detect the pressure in the differential pressure chamber, and an electronic pressure sensor interface connected to the pressure sensor to communicate the pressure with an electronic tester.

[0086] The microelectronic circuit test package may include that the pressure sensor is positioned away from the differential pressure chamber, and a pressure sensing channel connects the differential pressure chamber with the pressure sensor.

[0087] The microelectronic circuit test package may include that the decompression channel is formed in the first member.

[0088] The microelectronic circuit test package may include that the first member includes a backplane and a signal distribution board, wherein a part of the signal distribution board is located between the backplane and the second member, and the pressure sensing channel is formed in the backplane.

[0089] The microelectronic circuit test package may include that the pressure sensing channel is formed through the signal distribution board.

[0090] The microelectronic circuit test package may include that the pressure sensor is fixed to the movable support structure.

[0091] The microelectronic circuit test package may include that when the first member and the second member are separated, the differential pressure chamber seal is fixed to the first member.

[0092] The microelectronic circuit test package may include that the differential pressure chamber seal is a lip seal.

[0093] The microelectronic circuit test package may include that the pressure reducing valve is a pressure reducing check valve, the vacuum release channel is formed through a component having the pressure reducing check valve, the vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber, and further includes a second valve, the second valve is a vacuum release valve connected to the vacuum release channel, the opening of the vacuum release valve allows air to enter the differential pressure chamber, and the closing of the vacuum release valve prevents air from escaping from the differential pressure chamber.

[0094] The microelectronic circuit test package may include that the substrate is a wafer having a plurality of microelectronic circuits.

[0095] The microelectronic circuit test package may include that the contact is a pin, and each pin has a spring, and when the corresponding contact is pressed by a corresponding one of the terminals, the spring is pressed against its spring force.

[0096] The present invention also provides a test device, including: a movable support structure, the movable support structure includes a first component and a second component for holding a substrate therebetween, the substrate carries a microelectronic circuit and has a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts are matched with the terminals to contact the terminals; a differential pressure chamber seal between the first component and the second component, the differential pressure chamber seal and the surfaces of the first component and the second component together form a closed differential pressure chamber; a pressure reducing channel formed through one of the first component and the second component, the pressure reducing channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber; a pressure reducing valve connected to the pressure reducing channel, the opening of the pressure reducing valve allows air to come out of the differential pressure chamber to cause the first component and the second component to move relatively towards each other to ensure proper contact between the contacts and the terminals; and the closing of the pressure reducing valve prevents air from entering the differential pressure chamber; a first interface on the movable support structure and connected to the contacts; a fixed structure, the movable support structure is held by the fixed structure and can be removed from the fixed structure; a second interface on the fixed structure, when the movable support structure is held by the fixed structure, the second interface is connected to the first interface, and when the movable support structure is removed from the fixed structure, the second interface is disconnected from the first interface; an electronic tester, connected to the terminals through the second interface, the first interface and the contacts to transmit signals between the electronic tester and the microelectronic circuit to test the microelectronic circuit. A pressure sensor positioned to detect the pressure in the differential pressure chamber, and a pressure monitoring system including an electronic pressure sensor interface, the electronic pressure sensor interface is connected to the pressure sensor to communicate the pressure with the electronic tester.

[0097] The test device may include a pressure sensor positioned away from the differential pressure chamber, and a pressure sensing channel connecting the differential pressure chamber to the pressure sensor.

[0098] The test device may include a pressure relief channel formed in the first component.

[0099] The test device may include a first component including a backplane and a signal distribution board, wherein a portion of the signal distribution board is located between the backplane and the second component, and wherein the pressure sensing channel is formed in the backplane.

[0100] The test device may include a pressure sensing channel formed through the signal distribution board.

[0101] The test device may include a pressure sensor fixed to a movable support structure.

[0102] The test device may include a pressure monitoring system, which may include an electronic pressure connector interface on a fixed structure, and an electronic pressure sensor interface releasably contacting the electronic pressure connector interface to communicate pressure with an electronic tester.

[0103] The test device may include that the electronic pressure sensor interface includes at least a first contact, and the pressure monitoring system includes at least a first terminal, wherein when the movable support structure is received by the fixed structure, the first contact mates with the first terminal, and when the movable support structure is removed from the fixed structure, the first contact disengages from the first terminal.

[0104] The test device may include that the electronic pressure sensor interface is in a printed circuit board having a substrate, and the first contact is formed on the substrate.

[0105] The test device may include that the electronic pressure sensor interface includes at least a second contact, and the pressure monitoring system includes at least a second terminal, wherein when the movable support structure is received by the fixed structure, the second contact engages with the second terminal, and when the movable support structure is removed from the fixed structure, the second contact disengages from the second terminal.

[0106] The test device may include a differential pressure chamber seal surrounding the contacts and terminals.

[0107] The test device may include that when the first component and the second component are separated, the differential pressure chamber seal is fixed to the first component.

[0108] The test device may include that the differential pressure chamber seal is a lip seal.

[0109] The pressure reducing valve of the test device is a pressure reducing check valve. A vacuum release channel is formed through the component with the pressure reducing check valve. The vacuum release channel has an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber. The test device further includes a second valve, which is a vacuum release valve connected to the vacuum release channel. The opening of the vacuum release valve allows air to enter the pressure differential chamber, and the closing of the vacuum release valve prevents air from escaping from the pressure differential chamber.

[0110] The test device may include a fixed structure including a thermal chuck. The second component of the movable support structure includes a thin chuck. The thin chuck contacts the thermal chuck to allow heat transfer between the movable support structure and the thermal chuck.

[0111] The test device may include a substrate being a wafer having a plurality of microelectronic circuits.

[0112] The test device may include that the contacts are pins, and each pin has a spring. When the corresponding contact is pressed by a corresponding terminal, the spring is pressed against its spring force.

[0113] The present invention also provides a method for testing a microelectronic circuit held by a substrate, including holding the substrate between a first component and a second component of a movable support structure. The second component has contacts against terminals of the substrate connected to the microelectronic circuit. Wherein a pressure reducing channel is formed through one of the first component and the second component. The pressure reducing channel has an inlet opening at the pressure differential chamber and an outlet opening outside the pressure differential chamber. Position a pressure differential chamber seal between the first component and the second component to form a closed chamber by the surfaces of the first component and the second component and the pressure differential chamber seal. Open the pressure reducing valve to allow air to leave the pressure differential chamber and reduce the pressure in the pressure differential chamber so that the first component and the second component move towards each other to ensure proper contact between the contacts and the terminals. Close the pressure reducing valve to prevent air from entering the pressure differential chamber. Receive the movable support structure through the fixed structure, wherein a first interface on the movable support structure is connected to a second interface on the fixed structure. Transmit signals between an electronic tester and the microelectronic circuit through the terminals, contacts, and the first and second interfaces to test the microelectronic circuit. Detect the pressure in the pressure differential chamber of the pressure monitoring system and communicate the pressure with the electronic tester.

[0114] The method may include positioning the pressure sensor away from the pressure differential chamber, and a pressure sensing channel connecting the pressure differential chamber to the pressure sensor.

[0115] The method may include forming the pressure reducing channel in the first component.

[0116] The method may include that the first component includes a backplane and a signal distribution board, wherein a part of the signal distribution board is located between the backplane and the second component, and the pressure sensing channel is formed in the backplane.

[0117] The method may include forming a pressure sensing channel through a signal distribution board.

[0118] The method may include fixing a pressure sensor to a movable support structure.

[0119] The method may include that a pressure monitoring system may include an electronic pressure connector interface on a fixed structure, and an electronic pressure sensor interface may releasably contact the electronic pressure connector interface to communicate pressure with an electronic tester.

[0120] The method may include that the electronic pressure sensor interface includes at least a first contact, and the pressure monitoring system includes at least a first terminal. Wherein, when the movable support structure is received by the fixed structure, the first contact engages with the first terminal, and when the movable support structure is removed from the fixed structure, the first contact disengages from the first terminal.

[0121] The method may include that the electronic pressure sensor interface is in a printed circuit board having a substrate, and the first contact is formed on the substrate.

[0122] The method may include that the electronic pressure sensor interface includes at least a second contact, and the pressure monitoring system includes at least a second terminal. Wherein, when the movable support structure is received by the fixed structure, the second contact engages with the second terminal, and when the movable support structure is removed from the fixed structure, the second contact disengages from the second terminal.

[0123] The method may include that a differential pressure chamber seal surrounds the contacts and terminals.

[0124] The method may include that when the first component and the second component are separated, the differential pressure chamber seal is fixed to the first component.

[0125] The method may include generating a differential pressure chamber seal with a lip seal.

[0126] The method may include that the pressure reducing valve is a pressure reducing check valve, a vacuum release channel is formed through a component having the pressure reducing check valve, the vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber, and further includes opening a second valve, the second valve is a vacuum release valve connected to the vacuum release channel to allow air to enter the differential pressure chamber.

[0127] The method may include that the fixed structure includes a thermal chuck, and the second component of the movable support structure includes a thin chuck.

[0128] The method may include that the substrate is a wafer having a plurality of microelectronic circuits.

[0129] The method may include that the contacts are pins, and each pin has a spring, and when the corresponding contact is pressed by a corresponding terminal, the spring is pressed against its spring force. Description of the Drawings

[0130] The present invention will be further described by way of example with reference to the accompanying drawings, in which:

[0131] Figure 1 is a cross-sectional side view of a test device having a slot assembly according to an embodiment of the present invention;

[0132] Figure 2 is along Figure 1 a cross-sectional side view of the test device along line 2-2 in;

[0133] Figure 3 is along Figure 1 a cross-sectional side view of the test device along line 3-3 in;

[0134] Figure 4 is along Figure 2 and 3 a cross-sectional side view of the test device along line 4-4 in;

[0135] Figure 5A 、 5B and 5C are perspective views of the test device showing a removable wafer package being inserted into or removed from an oven defined by a frame;

[0136] Figure 6 is a timing diagram showing how a wafer package can be inserted and used to test the electronic devices of a wafer and then another wafer package inserted;

[0137] Figure 7 is a perspective view of the test device showing the insertion or removal of a slot assembly;

[0138] Figure 8A and 8B are cross-sectional side views showing the use of a support in the wafer package configuration described with respect to Figures 1-7 ;

[0139] Figure 9A 、 9B and 10 are side views showing the means for inserting a removable wafer package into and removing it from the oven;

[0140] Figure 11 is a perspective view seen from above the first wafer package;

[0141] Figure 12 is a perspective view seen from below the first wafer package;

[0142] Figure 13 is a cross-sectional view of the first wafer package along Figure 11 and 12 13-13 in;

[0143] Figure 14 is a cross-sectional view taken along 14-14 in Figure 13 of the first wafer package;

[0144] Figure 15 is a cross-sectional view taken along 15-15 in Figure 12 of the first wafer package;

[0145] Figure 16 is a view taken in the direction of arrow A in Figure 15 with its components removed;

[0146] Figure 17 is Figure 15 a cross-sectional view taken along 17-17 in

[0147] Figure 18a(i) and 18a(ii) is Figure 15 a view in the directions of arrows A and B in

[0148] Figure 18b(i) and 18b(ii) is similar to Figure 18a(i) and 18a(ii) with the latch mechanism in the locked position;

[0149] Figure 19 is a perspective view showing how a spacer is used to set the height of the fins of the latch mechanism;

[0150] Figure 20 is a perspective view of the components of the pressure monitoring system;

[0151] Figure 21 is a perspective view of other components of the pressure monitoring system;

[0152] Figure 22a and 22b are a perspective view and a side view of the components of the pressure monitoring system before engagement; and

[0153] Figure 23a and 23b are views similar to Figure 22a and 22b after the components of the pressure monitoring system are engaged. DETAILED DESCRIPTION

[0154] In the accompanying drawings Figure 1Shown is a test apparatus 10 according to an embodiment of the present invention, which includes (i) a fixed structure that includes a tester 12, a frame 14, a power bus 16, first and second slot assemblies 18A and 18B, a tester cable 20, a power cable 22, a cold liquid supply line 24A, a cold liquid return line 24B, a control liquid supply line 24C, a control liquid return line 24D, a vacuum line 24E, (ii) a movable device that includes first and second wafer packages 28A and 28B, and (iii) first and second wafers 30A and 30B. The first and second wafer packages 28A and 28B are described herein as "wafer packages", and their use is described as for testing wafers. It should be understood that the first and second wafers 28A and 28B can generally be used for testing microelectronic circuits and can be classified as "first and second microelectronic circuit test packages 28A and 28B".

[0155] The slot assembly 18A includes a slot assembly body 32, a thermal chuck 34, a temperature detector 36, a temperature changing device in the form of a heating resistor 38, a first slot assembly interface 40, and a plurality of second slot assembly interfaces, including a control interface 44, a power interface 46, and cold liquid supply interfaces 48A, cold liquid return interfaces 48B, control liquid supply interfaces 48C, control liquid return interfaces 48D, and vacuum interfaces 48E.

[0156] The first slot assembly interface 40 is located within the slot assembly body 32 and is mounted to the slot assembly body 32. The control interface 44, the power interface 46, and the second interfaces in the form of interfaces 48A to 48E are mounted in the left wall of the slot assembly body 32.

[0157] The slot assembly 18A can be inserted into the frame 14 from left to right and removed from the frame 14 from right to left. The tester cable 20, the power cable 22, and the lines 24A to 24E are manually connected to the control interface 44, the power interface 46, and the interfaces 48A to 48E, respectively. Before removing the slot assembly 18A from the frame 14, the tester cable 20, the power cable 22, and the lines 24A to 24E are first manually disconnected from the control interface 44, the power interface 46, and the interfaces 48A to 48E, respectively.

[0158] The slot assembly 18A includes a main board 60 having test electronics, a plurality of channel module boards 62 having test electronics, a flexible connector 64, and a connection board 66. A control interface 44 and a power interface 46 are connected to the main board 60, and a thermal controller 50 is mounted to the main board 60. The channel module boards 62 are electrically connected to the main board 60. The flexible connector 64 connects the channel module boards 62 to the connection board 66. Control functions are provided through electrical conductors that connect the control interface 44 to the main board 60. Power is provided to the main board 60 through the power interface 46. Both power and control are provided from the main board 60 to the channel module boards 62 through conductors. The flexible connector 64 provides conductors that connect the channel module boards 62 to the connection board 66. The connection board 66 includes conductors that connect the flexible connector 64 to the first slot assembly interface 40. The first slot assembly interface 40 is thus connected to the control interface 44 and the power interface 46 through various conductors, such that power and control can be provided to the first slot assembly interface 40 through the control interface 44 and the power interface 46.

[0159] The second slot assembly 18B includes components similar to those of the first slot assembly 18A, and like reference numerals denote like components. The second slot assembly 18B is inserted into the frame 14, and the control interface 44, the power interface 46, and the interfaces 48A through 48E of the second slot assembly 18B are manually connected to a separate set of connection components that includes a separate tester cable 20, a separate power cable 22, and separate conduits 24A through 24E.

[0160] The wafer package 28A includes a wafer package body formed by a thin chuck 72 and a backplane 74. The wafer 30A has a plurality of microelectronic devices formed therein. The wafer 30A is inserted into the wafer package body between the thin chuck 72 and the backplane 74. The wafer package contacts 76 contact corresponding contacts (not shown) on the wafer 30A. The wafer package 28A further includes a wafer package interface 78 located on the backplane 74. Conductors in the backplane 74 connect the wafer package interface 78 to the wafer package contacts 76.

[0161] The wafer package 28A has a lip seal 77 (also referred to herein as a “differential pressure chamber seal”) connected between the backplane 74 and the thin chuck 72. A vacuum is applied to the area defined by the lip seal 77, the backplane 74, and the thin chuck 72. The vacuum holds the wafer package 28A together and ensures proper contact between the wafer package contacts 76 and the contacts on the wafer 30A.

[0162] The temperature detector 36 is located in the thermal chuck 34 and is thus close enough to the wafer 30A to detect the temperature of the wafer 30A within five degrees Celsius, preferably within one or two degrees Celsius of the wafer 30A.

[0163] The slot assembly 18A also has a door 82 which is connected to the slot assembly body 32 by a hinge 84. When the door 82 is rotated to the open position, the wafer package 28A can be inserted into the slot assembly body 32 via the door opening 86. The wafer package 28A is then lowered onto the thermal chuck 34, and the door 82 is closed. The thermal chuck 34 is mounted to the slot assembly body 32. Then the thermal chuck 34 substantially forms a holder with a wafer test bench.

[0164] The slot assembly 18A also has a thermal interface cavity seal 88 located between the thermal chuck 34 and the thin chuck 72. A vacuum is applied to the area defined by the thermal interface cavity seal 88, the thermal chuck 34, and the thin chuck 72 through the vacuum interface 48E and the vacuum line 90. Thus, a good thermal connection is provided between the thermal chuck 34 and the thin chuck 72. When the heating resistor 38 generates heat, the heat is conducted through the thermal chuck 34 and the thin chuck 72 to the wafer 30A. When the thermal chuck 34 is at a lower temperature than the wafer 30A, the heat is conducted in the opposite direction.

[0165] The wafer package interface 78 engages with the first slot assembly interface 40. Power and signals are provided to the wafer 30A through the first slot assembly interface 40, the wafer package interface 78, and the wafer package contacts 76. The performance of the devices within the wafer 30A is measured through the wafer package contacts 76, the wafer package interface 78, and the first slot assembly interface 40.

[0166] The door 82 of the slot assembly 18B in the closed position is shown. The front seal 100 is mounted on the upper surface of the slot assembly 18A and seals with the lower surface of the slot assembly 18B. The front seal 102 is mounted to the upper surface of the slot assembly 18B and seals with the lower surface of the frame 14. The continuously sealed front wall 104 is provided by the doors 82 of the slot assemblies 18A and 18B and the front seals 100 and 102.

[0167] The slot assembly 18A also includes a thermal controller 50. The temperature detector 36 is connected to the thermal controller 50 through a temperature feedback line 52. Electric power is provided to the heating resistor 38 through the power interface 46 and the power line 54, causing the heating resistor 38 to heat up. Then, the heating resistor 38 heats the thermal chuck 34 and the wafer 30A on the thermal chuck 34, and the heating resistor 38 is controlled by the thermal controller 50 based on the temperature detected by the temperature detector 36.

[0168] The thermal chuck 34 has a thermal fluid channel 224 formed therein. The thermal fluid channel 224 holds the thermal fluid. The thermal fluid is preferably a liquid rather than a gas because a liquid is incompressible and heat convects to or from the liquid more quickly. Different thermal fluids are used for different applications, and oil is used for the applications with the highest temperatures.

[0169] The control liquid supply and return pipelines 226 and 228 connect the opposite ends of the hot fluid channel 224 to the cold liquid supply and return interfaces 48C and 48D respectively. The heating resistor 38 serves as a heater, which is installed at the position of the heating hot chuck 34 to heat the hot fluid. By recirculating the hot fluid through the hot fluid channel 224, the hot chuck 222 provides a more uniform heat distribution to the hot chuck 34 and ultimately to the wafer 30A. The temperature of the fluid can also be controlled to heat or cool the hot chuck 34.

[0170] The test device 10 also includes a cooling system 240, a temperature control system 242, and a vacuum pump 244. Two cold liquid supply pipelines 24A connected to the first and second slot assemblies 18A and 18B are also connected to the cooling system 240 through a manifold (not shown). An additional manifold connects the cold liquid return pipeline 24B to the cooling system 240, the control liquid supply pipeline 24C to the temperature control system 242, the control liquid return pipeline 24D to the temperature control system 242, and the vacuum pipeline 24E to the vacuum pump 244. Each slot assembly 18A or 18B has its own cooling plate 246, which has its own fluid channel 248. The cooling system 240 circulates the fluid through the fluid channel 248 to cool the cooling plate 246. Then, the cooling plate 246 keeps the channel module plate 62 cooled. The temperature control system 242 circulates the fluid through the hot fluid channel 224 to control the temperature of the hot chuck 34 and transfer heat from or to the wafers 30A and 30B. The vacuum pump 244 supplies air under vacuum pressure to the vacuum pipeline 90.

[0171] The slot assembly 18A includes a separation seal 108 mounted on the upper surface of the slot assembly body 32 and above its inner wall 106. The separation seal 108 seals with the lower surface of the slot assembly 18B. The slot assembly 18B has a separation seal 110 mounted on the upper surface of its slot assembly body 32. The separation seal 108 seals with the lower surface of the frame 14. A continuously sealed separation wall 112 is provided by the inner walls 106 of the slot assemblies 18A and 18B and the separation seals 108 and 110.

[0172] Figure 2 Shown is Figure 1 the test device 10 in 2-2. The frame 14 defines a first closed-loop air path 120. Air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 120 into an open air path, where air at room temperature passes through the frame 14 without being recirculated. The closed-loop path is particularly useful in a clean room environment because it results in less particulate material being released into the air.

[0173] The test apparatus 10 further includes temperature changing devices in the form of a first fan 122, a first fan motor 124, and a water cooler 126.

[0174] The first fan 122 and the first fan motor 124 are mounted on the upper part of the first closed-loop air path 120. The water cooler 126 is mounted to the frame 14 within the upper part of the first closed-loop air path 120.

[0175] The wafer packages 28A and 28B are positioned together with the slot assemblies 18A and 18B and are located within the lower half of the first closed-loop air path 120.

[0176] In use, current is supplied to the first fan motor 124. The first fan motor 124 causes the first fan 122 to rotate. The first fan 122 causes air to circulate clockwise through the first closed-loop air path 120.

[0177] The water cooler 126 then cools the air in the first closed-loop air path 120. The air then flows over the slot assemblies 18A and 18B located above the wafer package 28A or 28B. Then, the wafer package 28A or 28B is cooled by convection using the air.

[0178] Figure 3 As shown Figure 1 The test apparatus 10 in 3-3 is shown. The frame 14 defines a second closed-loop air path 150. The test apparatus 10 further includes temperature changing devices in the form of a second fan 152, a second fan motor 154, and a water cooler 156. Figure 2 No electric heater or throttle is provided in. Air inlet and outlet openings (not shown) can be opened to turn the second closed-loop air path 150 into an open air path, where air at room temperature passes through the frame 14 without being recycled.

[0179] The closed-loop path is particularly useful in a clean room environment because it results in less particulate material being released into the air. The second fan 152 and the second fan motor 154 are located in the upper part of the second closed-loop air path 150. The water cooler 156 is located slightly downstream of the second fan 152 within the second closed-loop air path 150. The main board 60 and the channel module board 62 forming part of the slot assemblies 18A and 18B are located within the lower half of the second closed-loop air path 150.

[0180] In use, current is supplied to the second fan motor 154, and the second fan motor 154 rotates the second fan 152. Then, the second fan 152 causes air to be recycled clockwise through the second closed-loop air path 150. The air is cooled by the water cooler 156. Then, the cooled air passes over the main board 60 and the channel module board 62, such that heat is transferred from the main board 60 and the channel module board 62 to the air by convection.

[0181] Figure 1 The continuous sealed separation wall 112 shown separates Figure 2 the air recirculated through the first closed-loop air path 120 in Figure 3 from the air in the second closed-loop air path 150 in. Figure 1 The continuous sealed front wall 104 shown prevents air from escaping from the first closed-loop air path 120.

[0182] As Figure 2 and 3 shown, the same cooling system 240 used in Figure 1 is also used for the coolant cooler 126. As Figure 4 shown, the plenum 160 separates the first closed-loop air path 120 from the second closed-loop air path 150 in all areas except those provided by the continuous sealed separation wall 112. The frame 14 has a left wall 162 and a right wall 164 that further define the closed-loop air paths 120 and 150.

[0183] Figure 5A , 5B and 5C show how the wafer packages 30C, 30D, and 30E can be inserted or removed at any time while all other wafer packages are used to test the devices of the wafer and can be in various temperature ramp states. Figure 6 This concept is shown in more detail. At time T1, the first wafer package is inserted into the frame 14, while the second wafer package is located outside the frame 14. At time T1, heating of the first wafer package is started. Between T1 and T2, the temperature of the first wafer package increases from room temperature, i.e., approximately 22 °C, to a test temperature that is 50 °C to 150 °C higher than room temperature at T2. At T2, power is applied to the first wafer package, and the device in the first wafer package is tested. At T3, the second wafer package is inserted into the frame 14, and heating of the second wafer package is started. At T4, the test of the first wafer package is terminated. At T4, cooling of the first wafer package is also started. At T5, the second wafer package reaches the test temperature, power is supplied to the second wafer package, and the wafer in the second wafer package is tested. At T6, the second wafer package reaches a temperature close to room temperature and is removed from the frame 14. Then, a third wafer package can be inserted in place of the first wafer package. At T7, the test of the second wafer package is terminated, and its cooling is started. At T8, the second wafer package has cooled to room temperature or close to room temperature and is removed from the frame 14.

[0184] Different tests can be performed at different temperatures. For example, a wafer package can be inserted and tested at room temperature. Another test can be performed during the temperature rise. Further tests can be performed at elevated temperatures. Further tests can be performed during the temperature drop. Two of these tests can be a single test running from one temperature stage to the next.

[0185] As Figure 7 shown, a slot assembly 18A can be removed or inserted into the frame 14. The slot assembly 18A can be inserted or removed while other slot assemblies in the frame 14 are used to test the devices of the wafer, as referenced Figure 6 described.

[0186] As Figure 8A shown, further shown are a signal distribution board 500, a contactor 502, a plurality of pins 504, a contactor compression ring 506, a fastener 508, and a post 510.

[0187] The signal distribution board 500 is mainly made of an insulating material and has a circuit (not shown) formed therein. Contacts 512 are formed on the lower side 514 of the signal distribution board 500. Threaded openings 516 are formed in the lower side 514.

[0188] The contactor 502 has a plurality of pin openings 518, a post opening 520, and a fastener opening 522 that extend from the upper side 524 through the contactor to the lower side 526. Each pin opening 518 has a first portion 528 and a second portion 530. When viewed in a plan view, both the first and second portions 528 and 530 are circular. The first portion 528 has a larger diameter than the second portion 530. When viewed in Figure 8A a cross-sectional side view of

[0189] The post opening 520 has a first portion 534 and a second portion 536. When viewed in a plan view, both the first portion 534 and the second portion 536 are circular. The diameter of the first portion 534 is greater than the diameter of the second portion 536. Because the diameter of the first portion 534 is greater than the diameter of the second portion 536, when viewed in Figure 8A a cross-sectional side view of

[0190] Each pin 504 includes a conductive holder portion 542, a helical spring 544, and first and second end members 546 and 548. The first end member 546 has a first interior 550 and a first end 552. The second end member 548 has a second interior 554 and a second end 556. The helical spring 544 and the first and second interiors 550 and 554 are held by the holder portion 542, with the helical spring 544 positioned between the first and second interiors 550 and 554. The first and second ends 552 and 556 project from the upper and lower ends of the holder portion 542, respectively.

[0191] The upper surface of the first end 552 forms a terminal 560. The lower end of the second end 556 forms a contact 562. The helical spring 544 and the first and second end members 546 and 548 are made of metal and thus are made of a conductive material. The helical spring 544 and the first and second end members 546 and 548 form a conductor capable of conducting current between the terminal 560 and the contact 562.

[0192] The corresponding pins are inserted through the upper side 524 into the corresponding pin openings 518. The second end 556 is slightly smaller than the second portion 530 so that it passes through the second portion 530 and projects from the lower side 526. The holder portion 542 is slightly narrower than the first portion 528 but wider than the second portion 530 to prevent the pin 504 from falling out of the lower side 526. When the pin 504 is fully inserted into the pin opening 518 and before the contactor 502 is mounted to the signal distribution board 500, the first end 552 still projects above the upper side 524 of the contactor 502.

[0193] The post 510 has a base 564, a force transfer portion 566, and a force transmission portion 568. The post 510 is made of a single piece of metal or other material selected because of its strength compared to the strength and brittleness of the ceramic material of the contactor 502.

[0194] The post 510 is inserted through the upper side 524 into the post opening 520. The base 564 and the force transfer portion 566 are slightly narrower than the second portion 536. The force transmission portion 568 is slightly narrower than the first portion 534 but wider than the second portion 536. The lower surface 570 of the force transmission portion 568 abuts against the platform 538. Thereby preventing the post 510 from falling off the lower side 526.

[0195] The post 510 has a surface 572 which, when the post 510 is fully inserted as Figure 8A shown, is in a plane parallel to and below the surface of the lower side 526. When the post 510 is fully inserted, the force transmission portion 568 has a surface 574 in the same plane as the upper side 524.

[0196] The signal distribution board 500 is positioned on top of the contactor 502. Each contact 512 contacts a respective one of the terminals 560. Since the terminals 560 are in a plane above the plane of the upper side 524, the lower side 514 is initially spaced apart from the upper side 524.

[0197] The fastener 508 has a threaded shaft 578 and a head 580. The contactor compression ring 506 has a ring opening 582. The contactor compression ring 506 is located on the lower surface 584 of the contactor 502. The threaded shaft 578 is inserted from the bottom through the ring opening 582 and then through the fastener opening 522. The head 580 contacts the lower surface of the contactor compression ring 506. The head 580 is then rotated so that the threads on the threaded shaft 578 are screwed into the threads on the threaded opening 516. The threading action moves the signal distribution board 500 closer to the contactor 502 and the contactor compression ring 506. The lower side 514 eventually contacts the upper side 524. The contact 512 moves the first end member 546 downward into the pin opening 518 until the terminal 560 is in the same plane as the upper side 524. The helical spring 544 is compressed and thus slightly deformed to allow the first end member 546 to move relatively toward the second end member 548.

[0198] The lower side 514 has a portion that stops against a surface 574 that is part of the forming post 510. Since the post 510 abuts against the signal distribution board 500, the post 510 is in a position to transfer force to the signal distribution board 500 through the surface 572.

[0199] The first wafer 32A has a plurality of electronic devices formed therein. Each electronic device has a plurality of terminals 588 at the upper surface 590 of the first wafer 32A. When the backplane 74 and the first wafer 32A are placed together, the first wafer 32A is aligned with the backplane 74 to ensure that each terminal 588 contacts a respective one of the contacts 562.

[0200] A vacuum pressure is generated in the region between the upper surface 590 and the lower side 526, while the pressure below the lower surface 592 of the thin chuck 72 and the upper surface 594 of the signal distribution board 500 is maintained at atmospheric pressure. The pressure difference generates equal and opposite forces F1 and F2 on the signal distribution board 500 and the thin chuck 72.

[0201] As Figure 8BAs shown, forces F1 and F2 cause the backplate 74 to move relatively towards the first wafer 32A and the thin chuck 72. The helical springs 544 are compressed more to allow the second end piece 548 to move into the pin opening 518. Each helical spring 544 deforms against its spring force, e.g., F3. However, the force F1 is still greater than the sum of all the forces F3 added together. The upper surface 590 finally abuts against the surface 572 of the support 564. Since the post 510 abuts against the signal distribution board 500, the support 564 prevents the upper surface 590 from moving closer and contacting the lower side 526 of the contactor 502. The first wafer 32A transfers the force F4 to the support 564. The force transfer portion 566 transfers the force F4 through the second portion 536 of the post opening 520. The force transmission portion 568 receives the force F4 from the force transfer portion 566 and transmits the force F4 to the signal distribution board 500 via the surface 574.

[0202] Therefore, it can be seen that the force F4 is not borne by the contactor 502, thus preventing stresses that could damage the brittle ceramic material of the contactor 502. Instead, the force F4 is directly transferred from the electronic device in the form of the first wafer 32A through the post 510 to the signal distribution board 500.

[0203] In Figure 8A and 8B In the illustrated embodiment, the contactor 502 serves as a support plate having a post opening 520 therethrough. The signal distribution board 500 serves as a backing structure on the first side of the support plate and at least includes a circuit board having contacts 512. The pins 504 serve as conductors having contacts 562 to contact terminals 588 on an electronic device located on the second side of the support plate, the second side being opposite the first side of the support plate. The holder portion 542 serves as part of the conductor held by the support plate. The conductor also has a terminal 560 connected to the contact 512 on the signal distribution board 500. A spring in the form of a helical spring 544 is provided. The thin chuck 72 serves as a force generating device on one side of the electronic device in the form of the first wafer 32A opposite the support plate. The force generating device and the support plate are movable relative to each other to move the electronic device closer to the support plate and deform the spring. The post 510 has a support 564 having a surface 572 in a plane spaced from the plane of the surface of the support plate to prevent the electronic device from moving closer to the support plate; a force transfer portion 566 that extends at least partially through the post opening 520 from the support 564; and a force transmission portion 568 that extends from the force transfer portion 566 and is held by the backing structure.

[0204] Figure 9A A portion of the test device 10 is shown for inserting a wafer package into each slot assembly, e.g., into the slot assembly 18A, and removing the same therefrom. Figure 9AThe components of the test device 10 shown are components of a fixed structure, including a frame 300, a portion of the first slot assembly 18A, a first slot assembly interface 40, a holding structure 302, a horizontal conveying device 304, a vertical conveying device 306, a push rod blade 308, and a locking mechanism 310.

[0205] The frame 300 includes a first mounting member 312 and a second mounting member 314 spaced apart from each other. The horizontal conveying device 304 is a slider mounted between the first and second mounting members 312 and 314. The holding structure 302 is mounted for sliding movement along the horizontal conveying device 304. Opposite ends of the push rod blade 308 are respectively mounted to the first and second mounting members 312 and 314.

[0206] The locking mechanism 310 includes a connecting rod 316, a control rod 318, and a pressing rod 320. The control rod 318 is mounted to the first mounting member 312 at a pivot connection portion 322. The vertical conveying device 306 is a rigid beam. A connecting member 324 connects the center points of the vertical conveying device 306 and the push rod blade 308 to each other. The pressing rod 320 has a first connecting rod 326 rotatably connected to the control rod 318 and a second connecting rod 328 rotatably connected to one end of the vertical conveying device 306. In Figure 9A In the unlocked configuration shown, a wire 330 connects the pivot connection portion 322 to the second connecting rod 328, and the first connecting rod 326 is on the left side of the wire 330.

[0207] In use, a first wafer package 28A is located on the holding structure 302. Then, the first wafer package 28A and the holding structure 302 are moved together from left to right into the first slot assembly 18A. The placement and movement of the first wafer package 28A can be performed manually or can be performed using a robot.

[0208] The holding structure 302 slides along the horizontal conveying device 304. The connecting rod 316 connects one end of the control rod 318 to the holding structure 302. When the holding structure 302 moves horizontally along the horizontal conveying device 304, the connecting rod 316 causes the control rod 318 to rotate counterclockwise about the pivot connection portion 322.

[0209] The first link 326 rotates counterclockwise together with the control lever 318. The press bar 320 converts the movement of the first link 326 into a downward movement of the second link 328. First, the downward movement is minimal, but when the first wafer package 28A is fully inserted into the first slot assembly 18A, the vertical movement becomes more significant, and the vertical conveyor 306 engages the first wafer package 28A with the first slot assembly 18A. The horizontal conveyor 304 is thus operable to horizontally move the first wafer package 28A from a first position into the first slot assembly 18A to a second position, and the vertical conveyor 306 is operable to move the first wafer package 28A and the first slot assembly 18A relative to each other in a first vertical direction to engage the slot assembly interface 40 with the wafer package interface on the first wafer package 28A.

[0210] In Figure 9A , the control lever 318 is shown in an unlocked position, where the first link 326 is located on a first side of a line 330 connecting the pivot connection 322 and the second link 328. The control lever 318 rotates from Figure 9A the unlocked position shown through a compression position, in which the push rod blade 308 is deformed by the vertical conveyor 306 through the connection 324 by bending the push rod blade 308 against its spring force, and the first link 326 is in line with the pivot connection 322 and the second link 328. The control lever 318 continues to rotate from the compression position to the locked position, as shown in Figure 9B and 10 . In the locked position, the first link 326 is on the right side of the line 330, and thus on a second side of the line 330 opposite the first side. Since the first link 326 has passed through the line 330 and the push rod blade 308 has been deformed against its spring force, the first wafer package 28A is locked in position against the slot assembly interface 40.

[0211] By moving the holding structure 302 from right to left, the system can be unlocked. The control lever 318 rotates clockwise, and the first link 326 moves from right to left passing through the line 330. The vertical conveyor 306 moves upward, i.e., in a second vertical direction opposite to the first vertical direction, to release the first wafer package 28A from the slot assembly interface 40. Further movement of the holding structure 302 along the horizontal conveyor 304 causes the removal of the first wafer package

[0212] Figure 11 and 12 show other components of the first wafer package 28A, including a pressure relief check valve 600, a vacuum release check valve 602, components of a latch system including first, second, third, and fourth latch assemblies 604A to 604D, and an electronic pressure sensor interface 606 forming part of a pressure monitoring system.

[0213] Figure 13 is a cross-sectional view taken along Figure 11 and 12 in FIG. 13-13. A pressure relief passage 608 is formed in the backplate 74. The pressure relief passage 608 has an outlet opening 610 and an intermediate position 612 that are in the same plane. The outlet opening 610 is connected to a pressure relief check valve 600. The intermediate position 612 is closer to the center point of the backplate 74 than the outlet opening 610. The pressure relief passage 608 is formed by first drilling four passages in the backplate 74 and then closing one end of three of the passages, so that the formed pressure relief passage 608 is completely isolated from the atmospheric pressure outside the backplate 74.

[0214] Figure 14 is Figure 13 a cross-sectional view taken along 14-14 in FIG. The pressure relief passage 608 continues downward from the intermediate position 612 through the support plate 74 and the signal distribution plate 500. The pressure relief passage 608 has an inlet opening 624 that communicates with a differential pressure chamber 622. A lip seal 77 is located in a groove of the thin chuck 72. The differential pressure chamber 622 is jointly formed by the thin chuck 72 that forms the lower side of the differential pressure chamber 622, the contactor 502, the contactor compression ring 506, the signal distribution plate 500 that forms the upper side of the differential pressure chamber 622, and the lip seal 77 that forms the connection between the upper and lower sides of the differential pressure chamber 622. The lip seal 77 is completely circular and completely surrounds the contactor 502 and the wafer located between the contactor 502 and the thin chuck 72.

[0215] Figure 14 The components shown form a movable support structure 626. The movable support structure 626 has a first component 628 including the signal distribution plate 500 and the backplate 74, and a second component 630 including the thin chuck 72.

[0216] In use, the first component 628 is separated from the second component 630. Then the wafer is placed on the thin chuck 72. Then the first component 628 is positioned on the second component 630. The upper peripheral edge of the lip seal 77 contacts the signal distribution plate 500. The wafer is thus held in the movable support structure 626.

[0217] Now referring jointly to Figure 13 and 14 , a pump is connected to the pressure relief check valve 600. Then the pressure relief check valve 600 is opened. The pressure relief passage 608 may initially be at atmospheric pressure, and the pump then reduces the pressure within the pressure relief passage 608. The differential pressure chamber 622 is exposed to a pressure below atmospheric pressure. The outer surface of the first wafer package 28A remains exposed to atmospheric pressure. Because a pressure difference is generated between the differential pressure chamber 622 and the outer surface of the first wafer package 28A, the spring within the contactor 502 compresses, as shown in reference to Figure 8BThe lip seal 77 is made of an elastomeric material that compresses the lip seal against its spring force. Since the lip seal 77 is compressed against its spring force, an improved seal is created between the lip seal 77 and the signal distribution plate 500, thereby maintaining the pressure within the differential pressure chamber 622. The pressure relief check valve 600 is then closed, isolating the pressure relief passage 608 from the external atmospheric pressure. The pump can then be disconnected from the pressure relief check valve 600.

[0218] The first wafer package 28A, which contains the wafer, can now be moved within the manufacturing environment without being connected to a pump or a tester. If the wafer needs to be removed subsequently, a positive pressure can be applied to the Figure 11 and 12 vacuum release check valve 602 as shown. The vacuum release check valve 602 is spring-loaded and requires a predetermined amount of pressure to be applied before it can be opened. Air can then flow through the vacuum release passage in the backplane 74 to the differential pressure chamber 622, bringing the differential pressure chamber 622 to atmospheric pressure. The first and second components 628 and 630 can then be separated from each other, and the wafer can be removed. When a new wafer is loaded into the first wafer package 28A and when it is necessary to reduce the pressure within the differential pressure chamber 622 using the pressure relief check valve 600, the vacuum release check valve 602 is subsequently closed.

[0219] Figure 15 is Figure 12 a cross-sectional view taken at 15-15 in. The first latch assembly 604A includes a first part 640, a second part 642, a connecting part 644, an engaging mechanism 646, a tuning block 648, a lock nut 650, a spacer 652A, a gasket 652B, and a snap mechanism 654.

[0220] The first part 640 and the connecting part 644 are machined as a single piece and are thus fixed to each other. The first part 640 has a length 660 and a width 662. Only half of the width 662 is shown in the cross-section. The length 660 is greater than the width 662. The length 660 is also greater than the diameter of the connecting part 644. The first part 640 has a tool pin opening 664 formed therein.

[0221] The second part 642 has a body 666 and first and second fins 668A and 668B extending from the body 666. The second part 642 has a length 670 and a width 672 that includes the fins 668A and 668B. Only half of the width 672 is shown in the cross-section. Since the first and second fins 668A and 668B form part of the length 670 but not part of the width 672, the length 670 is much greater than the width 672. The body 666 also has an opening 674 into which the connecting part 644 can be inserted.

[0222] The connecting portion 644 includes a first part 678 and a second part 680. The second part 680 has external threads formed thereon.

[0223] The engaging mechanism 646 is formed by opposing surfaces that define the width 662 of the first portion 640. The opposing surfaces forming the engaging mechanism 646 are parallel to each other to facilitate the engagement of the parallel surfaces on the jaws of a tool that can subsequently rotate the first portion 640.

[0224] The tuning block 648 is mounted to the spacer 652A in a fixed position. The thin chuck 72 includes a metal portion 682 and a protective sheet 684. The protective sheet 684 forms a shoulder 686 on the thin chuck 72. The spacer 652B is located between the spacer 652A and the signal distribution board 500. Only a single spacer 652B is shown. Additional spacers are typically inserted one on top of the other until the leveling surface 690 of the tuning block 648 is at the same vertical height as the shoulder 686.

[0225] The snap mechanism 654 includes a retainer body 694, a spherical ball 696, and a spring 698. The body 666 of the second portion 642 forms part of the snap mechanism 654 because the body 666 has a first snap recess 700A formed therein.

[0226] The retainer body 694 has an outer surface with threads 702 thereon. The retainer body 694 also has an end with a slot 704 formed therein that can receive a tool such as a screwdriver. The spring 698 is located within the retainer body 694. The spherical ball 696 is positioned within the mouth of the retainer body 694. The mouth of the retainer body 694 has a slightly reduced size to prevent the spherical ball 696 from falling out of the retainer body 694. The outer surface of the spherical ball 696 forms a snap surface 706. The threads 702 engage complementary threads within the tuning block 648. A tool such as a screwdriver is inserted into the slot 704 and then rotated to adjust how far the snap surface 706 is spaced from the tuning block 648.

[0227] The intermediate protection member 708 is inserted into complementary grooves on the upper surface of the backplane 74. Openings 710, 712, and 714 are respectively formed in the intermediate protection member 708, the backplane 74, and the signal distribution board 500. The second portion 680 of the connecting portion 644 is inserted from above through the openings 710, 712, and 714. The length 660 of the first portion 640 is greater than the length of any one of the openings 710, 712, and 714 in the same direction, which prevents the first portion 640 from entering the openings 710, 712, and 714. The lower surface of the first portion 640 rests on the upper surface formed within the intermediate protection member 708. Then, the first portion 678 of the connecting portion 644 is located within the openings 710, 712, and 714, and the second portion 680 of the connecting portion 644 is located below the openings 710, 712, and 714. Then, the spring-loaded washer 720, the spacer 652B, and the spacer 652A are positioned on the connecting portion 644 from below. Then, the second portion 642 is positioned on the connecting portion 644 from below. The opening 674 forms a sliding fit with the outer diameter of the thread on the second portion 680 of the connecting portion 644.

[0228] When the second portion 642 slides in the upward direction on the connecting portion 644, the first snap recess 700A also contacts the snap surface 706. The spherical ball 696 moves a small amount from right to left against the spring force of the spring 698. Then, the lock nut 650 engages with the protruding end of the second portion 680. The rotation of the lock nut 650 causes the body 666 of the second portion 642 to be tightened against the spring force of the washer 720. A feeler gauge or other instrument can be used to determine the clearance between the second flap 668B and the leveling surface 690. The lock nut 650 can be rotated until an acceptable clearance is formed between the second flap 668B and the leveling surface 690. This clearance is generally the same as the desired clearance between the first flap 668A and the shoulder 686. Then, the locking device is formed by the first portion 640, the second portion 642, and the connecting portion 644.

[0229] When the lock nut 650 rotates, the first snap recess 700A also moves upward. The first snap recess 700A is an elongated slot. When the second portion 642 continues to move upward as the lock nut 650 continues to rotate, the snap surface 706 and the first snap recess 700A can thus slide over each other.

[0230] As shown in the attached drawings, when the first latch assembly 604A is assembled, the thin chuck 72 is in place. Additionally, there is a negative pressure in the differential pressure chamber 622. By placing the first wafer package 28A in a compressed state, it is possible to measure whether the first and second fins 668A and 668B are equidistant from the shoulder 686 and the leveling surface 690. As long as the leveling surface 690 has been set at the correct height using one or more shims such as shim 652B, the first latch assembly 604A can also be assembled in place without the thin chuck 72 by simply measuring the spacing between the second fin 668B and the leveling surface 690.

[0231] Figure 16 is a view along Figure 15 direction A in, but only shows the connection portion 644 and the signal distribution board 500.

[0232] The opening 712 has a first dimension 724 on an axis 726 towards the center point of the signal distribution board 500, which is greater than a second dimension 728 transverse to the axis 726. The first portion 678 of the connection portion 644 is smaller than the first dimension 724 in the direction of the axis 726 to allow for thermal expansion of the signal distribution board 500 and the backplane 74 (see Figure 15 ) relative to each other. The dimension of the first portion 678 is set to slidably fit within the second dimension 728 to prevent the signal distribution board 500 from moving relative to the backplane 74 in a direction transverse to the axis 726.

[0233] The second portion 680 of the connection portion 644 has a first thickness 730 and a second thickness 732. The first thickness 730 can fit through the opening 712 in the direction of the axis 726, and the first thickness 730 is greater than the second dimension 728 of the opening 712. The second thickness 732 is transverse to the first thickness 730 and can fit through the second dimension 728 of the opening 712. Because the second dimension 728 is relatively large, it allows threads to be formed on it and it remains relatively strong. The entire second portion 680 is located below the opening 712, which allows the connection portion 644 to rotate about its longitudinal axis without the second portion 680 getting stuck on the relatively narrow opening 712. The first portion 678 has a circular cross-section with a diameter not greater than the second dimension 728, which allows the first portion 678 to rotate freely within the relatively narrow second dimension 728 of the opening 712.

[0234] Additional openings 734 are formed in the signal distribution board 500 for additional fixation of the shims. The openings 734 are proportioned similarly to the opening 712, having a longer dimension on an axis 736 towards the center point of the signal distribution board 500. When used in a manufacturing environment, the anchors passing through the openings 734 do not have to rotate, and the dimensions of the openings 734 are only for allowing thermal expansion of the signal distribution board 500 relative to the backplane 74.

[0235] Figure 17 For Figure 15 a cross-sectional view taken along line 17-17 in [reference], the retainer 740 is inserted through Figure 16 the opening 734 of [component] to fix the spacer 652A and the gasket 652B to the back plate 74. The retainer 740 includes a bolt and a nut, with the head of the bolt on one side and the nut on the opposite side.

[0236] The body 666 has a circular outer surface 742 on which first, second, third, and fourth snap-in recesses 700A to 700D are formed. The snap surface 706 of the spherical sphere 696 is located within the first snap-in recess 700A, which prevents the body 666 from rotating. The opening 674 within the body 666 is keyed to receive the shape of the second part 680 such that if the body 666 remains stationary, the second part 680 cannot rotate.

[0237] A small amount of torque is required to rotate the body 666 and move the spherical sphere 696 out of the first snap-in recess 700A. If the body 666 is rotated clockwise, the snap surface 706 rides on the circular outer surface 742 between the first snap-in recess 700A and the second snap-in recess 700B. When the body 666 rotates, the second part 680 rotates the same angle as the body 666. When the body 666 approaches a 90-degree rotation, the snap surface 706 snaps into the second snap-in recess 700B. Then, the second snap-in recess 700B prevents the rotation of the body 666 and the second part 680. The first to fourth snap-in recesses 700A to 700D gently lock the body 666 at four different rotation angles, including 0 degrees, 90 degrees, 180 degrees, and 270 degrees.

[0238] Figure 18a(i) and 18a(ii) are views along the directions of arrows A and B in [reference], but the locking device is rotated to the unlocked position. The operator can compare the orientation of the first part 640 with the reference 750 on the upper surface of the thin chuck 72. In Fig. 18a(ii), it is shown that the first latch assembly 604A is unlocked. The shoulder 686 is not obstructed by the first flap 668A or the second flap 668B from below. The flaps 668A and 668B are held in the position shown in Fig. 18a(i) by Figure 15 the snap mechanism 654 shown in [[reference]]. The pressure within the first wafer package 28A can be reduced, and the thin chuck 72 can be removed to insert or replace the wafer. After the wafer is replaced, the pressure within the first wafer package 28A is reduced again to hold the first wafer package 28A together. Figure 15 and 17

[0239] ​When the first wafer package 28A is fully assembled, further fault protection may be required such that electrical contact with the wafer is maintained even if the negative pressure within the first wafer package 28A cannot be maintained due to a system failure. The operator may use a tool (not shown) having jaws and pins. The pins are inserted into the tool pin openings 664. The tool pin openings 664 are tapered such that the deeper the pins are inserted into the tool pin openings 664, the more the tool becomes aligned with the first portion 640. The operator then engages the opposing parallel surfaces of the jaws of the tool with the opposing parallel surfaces formed by the engagement mechanism 646. Once the tool is engaged with the engagement mechanism 646, the operator rotates the tool and the tool rotates the first portion 640. The connecting portion 644 and the second portion 642 and their first and second fins 668A and 668B rotate with the first portion 640. Refer to Figure 17 , the latching surface 706 moves away from the fourth latching recess 700D and slides on the circular outer surface 742. The latching surface 706 then latches into the first latching recess 700A.

[0240] Figure 18b(i) and 18b(ii) Shows the first latch assembly after the first portion 640 and the second portion 642 have been rotated 90 degrees at an angle 752. The operator can see that the orientation of the first portion 640 matches the locked position shown by the reference numeral 750. The first fin 668A is now located above the shoulder 686, which prevents the thin chuck 72 from moving away from the rest of the wafer package 28A in the vertically downward direction. The second fin 668B is located on the tuning block 648. By rotating the first portion 640 90 degrees clockwise or counterclockwise, the first fin 668A can be disengaged from the shoulder 686. Either of the fins 668A or 668B can be used to lock the thin chuck 72 in place.

[0241] Figure 19 Shows how one or more shims 652B to 652F are used to adjust the height of the leveling surface 690 of the tuning block 648. Ideally, the tuning block 648 should be at the same height as the shoulder 686. Since the tuning block 648 is mounted to the spacer 652A, the tuning block 648 moves up and down with the spacer 652A as more shims 652B to 652F are inserted. If the leveling surface 690 is below the shoulder 686, more shims can be inserted to raise the leveling surface 690, or if the leveling surface 690 is above the height of the shoulder 686, shims can be removed.

[0242] The engagement mechanism 646 is conveniently located directly on the first portion 640. In another arrangement, the engagement mechanism can be formed directly on the second portion 642 or directly on the connecting portion 644.

[0243] In another embodiment, the engaging mechanism can be a mechanism separate from the first part 640, the second part 642, and the connecting part 644. For example, a worm gear can be formed on the connecting part 644, and the engaging mechanism can be a separate rotatable mechanism that rotates the worm gear.

[0244] The engaging mechanism can also be located between the first part 640 and the connecting part 644. For example, the first flap 668A can pivot downward away from the shoulder 686 and pivot backward toward the shoulder 686 using a cam system located between the first part 640 and the connecting part 644. Such a cam system as the engaging mechanism can alternatively be located between the connecting part 644 and the second part 642. Or, the connecting part 644 can be made into two pieces, and the engaging mechanism can connect the two pieces and adjust the spacing between the two pieces, and the spacing adjustment can pivot the flap.

[0245] The first latch assembly 604A mainly uses an incompressible and non-flexible material. In an alternative embodiment, a belt or other flexible material can be used for the same or similar purpose.

[0246] Instead of having the engaging mechanism 646 on the outer surface of the first part 640, the engaging mechanism can alternatively be on the inner surface of any part.

[0247] Referring again to Figure 12 , the first, second, third, and fourth latch assemblies 604A to 604D are the same except for their respective positions and orientations. The first and third latch assemblies 604A and 604C are located on opposite sides of the thin chuck 72, and the second and fourth latch assemblies 604B and 604D are located on opposite sides of the thin chuck 72. Since the latch assemblies 604A to 604D are located on more than one side of the thin chuck 72, that is, they cover more than 180 degrees around the circumference of the thin chuck 72, they can hold all sides of the thin chuck 72 in place together around its entire circumference.

[0248] The latch system provided by the first, second, third, and fourth latch assemblies 604A to 604D helps make the movement of the first wafer package 28A in the manufacturing environment easier without the need for human supervision. Without the latch system, human supervision is required to determine when the negative pressure inside the first wafer package 28A fails and when the wafer 28A separates. The latch system provides a structural fail-safe to prevent the first wafer package 28A from coming apart even if air is drawn into it from the outside.

[0249] Figure 20 , 21 , 22a and 22b show other components of the pressure monitoring system, including the pressure sensing channel 760 ( Figure 21 ), the pressure sensor 762 ( Figure 22a and 22b ), referring toFigure 11 The described electronic pressure sensor interface 606( Figure 20 、 21 、22a and 22b)), the electronic pressure connector interface 764, the mounting bracket 766, the ribbon cable 768 having first and second connectors 770 and 772 at its opposite ends( Figure 20 、 22a and 22b), the connector block 774 and the reinforcement plate 776( Figure 20 ).

[0250] The pressure sensing channel 760 is formed in the backplane 74 in a manner similar to that of the described pressure relief channel 608. The pressure sensing channel 760 has Figure 13 a first end within the differential pressure chamber 622 as shown in Figure 14 . The pressure sensing channel 760 has a second end opposite the first end near the outer edge of the backplane 74.

[0251] The electronic pressure sensor interface 606 is in the form of a printed circuit board having a substrate 780 and a plurality of contacts, including first, second, and third contacts 782A, 782B, and 782C formed on the substrate 780.

[0252] The pressure sensor 762 is mounted to the substrate 780 on the side opposite the first, second, and third contacts 782A, 782B, and 782C. The pressure sensor 762 is electrically connected to the first, second, and third contacts 782A, 782B, and 782C through the substrate 780. The pressure sensor 762 is capable of sensing the pressure of a gas (in this case air) and converting the pressure into an electrical signal, where the magnitude of the pressure is indicated by the magnitude of the signal or another variable. A diaphragm that displaces a known distance as the pressure increases or decreases can be used to conveniently detect the pressure. Other pressure sensors are also within the scope of the present invention, such as pressure sensors using piezoelectric crystals or pressure sensors using strain gauges. In the case of a moving diaphragm, for example, by moving an induction coil, the movement can be converted into a voltage, and the amplitude of the voltage then indicates the displacement and thus the pressure. The pressure sensor can be, for example, the MLX90809 sold by Melexis (www.melexis.com)). The electronic pressure sensor interface 606 is mounted to the backplane 74 using fasteners 784. The diaphragm of the pressure sensor 762 is then exposed to air at the second end of the pressure sensing channel 760. The pressure sensor 762 can thus sense the pressure within the differential pressure chamber 622.

[0253] The electronic pressure connector interface 764 has a board 790 and a plurality of terminals, including a first terminal 792A to a sixth terminal 792F fixed to the board 790. The board 790 is mounted to a mounting bracket 766 by fasteners 794. A reinforcement plate 776 is fixed between two pusher blades 308. The mounting bracket 766 is fixed to the reinforcement plate 776 by fasteners 796. The slot assembly body 32 forms part of a fixing structure together with the pusher blades 308 and the reinforcement plate 776, and the electronic pressure connector interface 764 is thus mounted to the fixing structure.

[0254] A connector block 774 is mounted to the slot assembly body 32. Connectors 770 and 772 are respectively connected to the electronic pressure connector interface 764 and the connector block 774. The first to sixth terminals 792A to 792F are connected to a pressure sensing plate of an electronic tester through a first connector 770, a ribbon cable 768, and a second connector 772.

[0255] Figure 23a and 23b Illustrated is the engagement of the electronic pressure sensor interface 606 with the electronic pressure connector interface 764 when a first wafer package 28A is inserted into the slot assembly. First, second, and third contacts 782A, 782B, and 782C respectively contact a first, second, and third terminal 792A, 792B, and 792C. Further movement of the electronic pressure sensor interface 606 causes the first, second, and third contacts 782A, 782B, and 782C to respectively engage with the fourth, fifth, and sixth terminals 792D, 792E, and 792F. The first contact 782A thus contacts both the first terminal 792A and the fourth terminal 792D. Similarly, each of the contacts 782B and 782C contacts two of the terminals 792B, 792C, 792E, and 792F.

[0256] The terminals 792A to 792F can be elastically pressed relative to the board 790 to ensure proper contact with the contacts 782A to 782C. The ribbon cable 768 allows for a small amount of movement of the reinforcement plate 776 relative to the slot assembly body 32 when inserting the first wafer package 28A.

[0257] When the wafer is being tested, the pressure within the differential pressure chamber 622 can be monitored throughout the process. If the wafer test fails, the tester can be programmed to determine whether such a test may be the result of a negative pressure failure within the differential pressure chamber 622.

[0258] Although certain exemplary embodiments have been described and illustrated in the drawings, it should be understood that these embodiments are merely illustrative and not limiting of the invention, and the invention is not limited to the specific constructions and arrangements shown and described, as modifications can be envisioned by those of ordinary skill in the art.

Claims

1. A microelectronic circuit test package, comprising: A movable support structure including a first member and a second member for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; A plurality of contacts on the second member, the contacts being adapted to mate with the terminals to contact the terminals; A differential pressure chamber seal between the first member and the second member, the differential pressure chamber seal together with the surfaces of the first member and the second member forming a closed differential pressure chamber; A first channel formed through one of the first member and the second member, the first channel having a first opening at the differential pressure chamber and a second opening outside the differential pressure chamber; A valve connected to the first channel, opening of the valve allowing gas to flow through the first channel and closing of the valve preventing the gas from flowing through the first channel; A first interface on the movable support structure and connected to the contacts for connection to a second interface on a fixed structure when the movable support structure is removably held by the fixed structure; And A fixing system including a first fixing assembly having: A first part engaging with the first member; A second part engaging with the second member; and A connecting part having opposite ends respectively fixed to the first part and the second part to form a locking device.

2. The microelectronic circuit test package according to claim 1, wherein, The first fixing assembly includes: An engaging mechanism connected to the locking device and operable to move the locking device between a locked position and an unlocked position, in the locked position, the locking device holding the first member and the second member locked in a closed position, and in the unlocked position, the locking device allowing the first member and the second member to move from a closed relationship to a spaced relationship.

3. The microelectronic circuit test package according to claim 2, wherein, The engaging mechanism moves the second member between the locked position and the unlocked position.

4. The microelectronic circuit test package according to claim 3, wherein, The second member rotates between the locked position and the unlocked position.

5. The microelectronic circuit test package according to claim 4, wherein, The second member rotates about an axis perpendicular to the substrate between the locked position and the unlocked position.

6. The microelectronic circuit test package according to claim 4, wherein, The engaging mechanism includes a surface on the first member forming a seat for contact with a surface on the jaws of a tool, the jaws of the tool being rotatable to rotate the first part, and the first part causing the second part to rotate via the connecting part to move between the locked position and the unlocked position.

7. The microelectronic circuit test package according to claim 6, wherein, The surface on the first part forming the seat is an outer surface of the first part.

8. The microelectronic circuit test package according to claim 7, wherein, The first part has a tool pin opening therein for aligning a pin of the tool with the first part.

9. The microelectronic circuit test package according to claim 4, wherein, The second part has a body and at least a first flap extending from the body, wherein the first flap moves over a shoulder of the first member when moving to a first locked position and leaves the shoulder when moving away from the first locked position towards the unlocked position.

10. The microelectronic circuit test package according to claim 9, wherein, The second part has a second flap extending from the body, wherein the second flap moves over the shoulder of the first component when moving to the second locked position and leaves the shoulder when moving away from the second locked position towards the unlocked position.

11. The microelectronic circuit test package according to claim 10, wherein, The fixing system further comprises: A tuning block, which is mounted in a fixed position relative to the first component. The tuning block has a leveling surface. When the first flap is above the shoulder, the second flap is above the leveling surface. The second part is adjustable relative to the first part to adjust the gap between the leveling surface and the second flap.

12. The microelectronic circuit test package according to claim 1, wherein, The fixing system further comprises: A locking nut, which has a thread engaging with the thread on the connecting portion to adjust the second part rotationally relative to the connecting portion.

13. The microelectronic circuit test package according to claim 11, wherein, The fixing system further comprises: A spacer, which is between the tuning block and the first component to adjust the distance between the leveling surface and the first component.

14. The microelectronic circuit test package according to claim 11, wherein, The fixing system further comprises: A snap mechanism, which has a snap surface that snaps into a first snap recess to prevent the second component from moving away from the locked position and snaps into a second snap recess to prevent the second component from moving away from the unlocked position.

15. The microelectronic circuit test package according to claim 14, wherein, The first snap recess and the second snap recess are located on the locking device.

16. The microelectronic circuit test package according to claim 15, wherein, The first snap recess and the second snap recess are located on the second part.

17. The microelectronic circuit test package according to claim 4, wherein, The first component includes a back plate and a signal distribution plate, wherein a part of the signal distribution plate is between the back plate and the second component. The signal distribution plate has an opening through which the connecting portion is inserted. The opening has a first dimension on an axis towards the center point of the signal distribution plate, and the first dimension is greater than a second dimension transverse to the axis. The connecting portion has a first part, which is smaller than the first dimension in the direction of the axis to allow the signal distribution plate and the back plate to thermally expand relative to each other, and the dimension of the first part is designed to slidably fit within the second dimension of the opening to prevent the signal distribution plate from moving relative to the back plate in a direction transverse to the axis.

18. The microelectronic circuit test package according to claim 17, wherein, The connecting portion has a second part, which has a first thickness and a second thickness transverse to the first thickness. The first thickness can fit through the opening in the direction of the axis during the insertion and is greater than the second dimension of the opening. The second thickness can fit through the second dimension of the opening during the insertion.

19. The microelectronic circuit test package according to claim 1, wherein, The fixing system includes: A second fixing assembly, wherein each corresponding fixing assembly has: A first part, which engages with the first component; A second part, which engages with the second component; and A connecting portion, which has opposite ends respectively fixed to the first part and the second part to form a locking device.

20. The microelectronic circuit test package according to claim 19, wherein, The second fixing assembly includes: A joining mechanism, which is connected to the locking device and is operable to move the locking device between a locked position and an unlocked position. In the locked position, the locking device holds the first component and the second component locked in the closed position. In the unlocked position, the locking device allows the first component and the second component to move from the closed relationship to the spaced relationship.

21. The microelectronic circuit test package according to claim 19, wherein, The first fixing component and the second fixing component have corresponding second parts on different sides of the second component.

22. The microelectronic circuit test package according to claim 1, wherein, The differential pressure chamber seal surrounds the contact and the terminal.

23. The microelectronic circuit test package according to claim 1, wherein, When the first component and the second component are separated, the differential pressure chamber seal is fixed to the first component.

24. The microelectronic circuit test package according to claim 1, wherein, The differential pressure chamber seal is a lip seal.

25. The microelectronic circuit test package according to claim 1, wherein, The first channel is a pressure relief channel, the first opening is an inlet opening, the second opening is an outlet opening, the valve is a pressure relief valve, the gas is air allowed to leave the differential pressure chamber to move the first component and the second component relatively towards each other to ensure proper contact between the contact and the terminal, and the closing of the pressure relief valve prevents air from entering the differential pressure chamber.

26. The microelectronic circuit test package according to claim 25, wherein, The pressure relief valve is a pressure relief check valve. A vacuum release channel is formed through the component having the pressure relief check valve. The vacuum release channel has an inlet opening at the differential pressure chamber and an outlet opening outside the differential pressure chamber. The microelectronic circuit test package further includes: A second valve, which is a vacuum release valve connected to the vacuum release channel. The opening of the vacuum release valve allows air to enter the differential pressure chamber, and the closing of the vacuum release valve prevents air from escaping from the differential pressure chamber.

27. The microelectronic circuit test package according to claim 1, wherein, The substrate is a wafer having a plurality of microelectronic circuits.

28. The microelectronic circuit test package according to claim 1, wherein, The contact is a pin, and each pin has a spring that is pressed against its spring force when the corresponding contact is pressed by a corresponding one of the terminals.

29. A test device, comprising: A movable support structure, including a first component and a second component for holding a substrate therebetween. The substrate carries microelectronic circuits and has a plurality of terminals connected to the microelectronic circuits. A plurality of contacts, which are on the second component and match the terminals to contact the terminals. A differential pressure chamber seal, which is between the first component and the second component. The differential pressure chamber seal and the surfaces of the first component and the second component form a closed differential pressure chamber. A first channel, which is formed through one of the first component and the second component. The first channel has a first opening at the differential pressure chamber and an outlet and a second opening outside the differential pressure chamber. A valve, which is connected to the first channel. The opening of the valve allows gas to flow through the first channel, and the closing of the valve prevents air from flowing through the first channel. A first interface, which is on the movable support structure and is connected to the contacts for connecting to a second interface on a fixed structure when the movable support structure is removably held by the fixed structure. A fixing system having a first fixing component, the first fixing component having: A first part that engages with a first component; A second part that engages with a second component; A connecting part having opposite ends respectively fixed to the first part and the second part to form a locking device; A fixing structure, wherein the movable support structure can be received and held by the fixing structure and can be removed from the fixing structure; A second interface on the fixing structure, the second interface being connected to the first interface when the movable support structure is held by the fixing structure, and the second interface being disconnected from the first interface when the movable support structure is removed from the fixing structure; And An electronic tester that is connected to the terminal through the second interface, the first interface, and the contact, such that a signal is transmitted between the electronic tester and the microelectronic circuit to test the microelectronic circuit.

30. A method for testing a microelectronic circuit held by a substrate, comprising: Holding the substrate between a first component and a second component of a movable support structure, the second component having contacts against terminals of the substrate, the terminals being connected to the microelectronic circuit, wherein a first channel is formed through one of the first component and the second component, the first channel having a first opening at the pressure difference chamber and a second opening outside the pressure difference chamber; Positioning a pressure difference chamber seal between the first component and the second component to form a closed cavity by the surfaces of the first component and the second component and the pressure difference chamber seal; Opening a valve to allow gas to flow through the first channel; Closing the valve to prevent gas from flowing through the first channel; Moving a locking device from an unlocked position to a locked position, in the unlocked position, the locking device allows the first component and the second component to move from a closed relationship to a spaced relationship, in the locked position, the locking device holds the first component and the second component locked in the closed position, the locking device comprising: A first part that engages with the first component; A second part that engages with the second component; A connecting part having opposite ends respectively fixed to the first part and the second part; Receiving the movable support structure through the fixing structure, wherein a first interface on the movable support structure is connected to a second interface on the fixing structure; Transmitting a signal between the electronic tester and the microelectronic circuit through the terminals, contacts, and the first and second interfaces to test the microelectronic circuit; Removing the movable support structure from the fixing structure; and Moving the locking device from the locked position to the unlocked position, in the locked position, the locking device holds the first component and the second component locked in the closed position, in the unlocked position, the locking device allows the first component and the second component to move from the closed relationship to the spaced relationship.

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