Array substrate and electronic paper display panel
By setting an oblique reflector in the electron beam matrix test area of the array substrate, the problem of low accuracy in electrical detection of the array substrate is solved, and higher detection accuracy is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-03-31
AI Technical Summary
The low accuracy of electrical detection on existing array substrates leads to misjudgments of via continuity.
An oblique reflector is set in the electron beam matrix test area to ensure that the second pixel electrode in the electron beam matrix test area will not be reflected back to the electron detector area of the detection device, thereby avoiding misjudgment.
This improves the accuracy of electrical detection on the array substrate and reduces misjudgments of via continuity.
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Figure CN120255226B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and more particularly to an array substrate and an electronic paper display panel. Background Technology
[0002] The core of an electronic paper display panel mainly consists of two parts: an array substrate and an electronic paper reflective layer. The array substrate is mainly used to drive the electronic paper reflective layer and has a significant impact on the display quality of the electronic paper.
[0003] When manufacturing array substrates, traditional large-board electrical tests are required. The ATK electron beam detection device is mainly used to detect whether the vias between the pixel electrodes and active switches of the array substrate are conductive. However, the current structure of the array substrate has low accuracy in electrical testing. Summary of the Invention
[0004] The purpose of this application is to provide an array substrate and an electronic paper display panel to improve the accuracy of electrical detection of the array substrate.
[0005] This application discloses an array substrate, which includes a substrate, an active switching layer and a pixel electrode layer, wherein the active switching layer and the pixel electrode layer are sequentially disposed on the substrate; the pixel electrode layer includes a plurality of first pixel electrodes, and the array substrate includes a plurality of pixel unit regions, each of the pixel unit regions including an electron beam matrix test region;
[0006] Each pixel unit region of the active switching layer includes an active switch, a second pixel electrode, and a main common electrode. The first pixel electrode and the drain of the active switch are connected through a first via. The second pixel electrode is connected to the drain of the active switch. The second pixel electrode is located between the first pixel electrode and the main common electrode. The projections of the first pixel electrode, the second pixel electrode, and the main common electrode on the substrate overlap.
[0007] The first pixel electrode in the electron beam matrix test area is used to reflect electrons emitted by the detection device to determine whether the first via is conductive, and the second pixel electrode in the electron beam matrix test area will not reflect electrons back to the electron detector area of the detection device.
[0008] Optionally, the second pixel electrode includes a main body and an oblique reflective portion. The main body is disposed around the oblique reflective portion. The orthographic projection of the oblique reflective portion on the substrate covers the orthographic projection of the electron beam matrix test area on the substrate. The oblique reflective portion is used to reflect electrons emitted by the detection device out of the electron detector area.
[0009] Optionally, the oblique reflective portion includes a reflective main body and an electrode strip. The electrode strip is disposed on the side of the reflective main body away from the substrate. The electrode strip is triangular prism-shaped, and the side of the electrode strip away from the substrate is an inclined surface.
[0010] Optionally, the oblique reflective portion includes multiple electrode strips, both ends of which are connected to the main body. The electrode strips are triangular prisms, and the side of the electrode strips facing away from the substrate is an inclined surface.
[0011] Optionally, the second pixel electrode includes a main body and a cutout portion, the main body being disposed around the cutout portion, and the orthographic projection of the cutout portion on the substrate covering the orthographic projection of the electron beam matrix test area on the substrate.
[0012] Optionally, the active switching layer further includes a sub-pixel electrode, which is disposed on the same layer as the second pixel electrode and located within the electron beam matrix test area. The sub-pixel electrode is connected to the first pixel electrode through a second via.
[0013] Optionally, the active switching layer further includes a secondary common electrode, which is disposed on the same layer as the second pixel electrode and located within the electron beam matrix test area. The primary common electrode and the secondary common electrode are connected through a third via.
[0014] Optionally, the source, drain, and second pixel electrode of the active switch are disposed on the same layer, and the gate and main common electrode of the active switch are disposed on the same layer.
[0015] Optionally, the source, drain, and main common electrode of the active switch are disposed on the same layer, the gate and the second pixel electrode of the active switch are disposed on the same layer, and the second pixel electrode and the drain of the active switch are connected through a fourth via.
[0016] This application also discloses an electronic paper display panel, which includes an electronic paper reflective layer and an array substrate, wherein the electronic paper reflective layer is disposed on the array substrate.
[0017] Compared to existing array substrates, this application improves the accuracy of electrical detection of the array substrate by ensuring that the second pixel electrode in the electron beam matrix test area does not reflect electrons back to the electron detector area of the detection device. This avoids the situation where electrons are still detected even when the first via cannot properly conduct the first pixel electrode and the drain of the active switch, thus preventing a misjudgment of the first via as normally conducting. Attached Figure Description
[0018] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings:
[0019] Figure 1 This is a schematic diagram of a first type of electronic paper display panel according to an embodiment of this application;
[0020] Figure 2 This is a schematic diagram of a second type of electronic paper display panel according to an embodiment of this application;
[0021] Figure 3 This is a cross-sectional schematic diagram of an array substrate according to the first embodiment of this application;
[0022] Figure 4 This is a planar schematic diagram of an array substrate according to the first embodiment of this application;
[0023] Figure 5 This is a schematic diagram of a detection device;
[0024] Figure 6 This is a schematic diagram of an obliquely arranged reflective part according to the first embodiment of this application;
[0025] Figure 7 This is a schematic diagram of an oblique reflective portion according to the first embodiment of this application;
[0026] Figure 8 This is a schematic diagram of an active switch according to the first embodiment of this application;
[0027] Figure 9 This is a schematic diagram of an array substrate according to a second embodiment of this application;
[0028] Figure 10 This is a schematic diagram of an array substrate according to a third embodiment of this application;
[0029] Figure 11 This is a schematic diagram of a secondary common electrode according to a third embodiment of this application.
[0030] Among them, 10 is an electronic paper display panel; 20 is a common electrode; 30 is an electronic paper reflective layer; 31 is a microcapsule; 32 is a substrate layer; 33 is a microcup; 200 is an array substrate; 210 is a pixel unit region; 211 is a first pixel unit region; 212 is a second pixel unit region; 220 is an electron beam matrix testing region; 231 is a first direction; 232 is a second direction; 241 is a first sub-pixel unit region; 242 is a second sub-pixel unit region; 243 is a third sub-pixel unit region; 244 is a fourth sub-pixel unit region; 300 is a substrate; 310 is an active switching layer; 311 is a first metal layer; 312 is a first insulating layer; 313 is a second metal layer; 314 is a second insulating layer; 3 15. Passivation layer; 316. Data line; 317. Scan line; 320. Active switch; 321. Source; 322. Drain; 323. Gate; 324. Semiconductor layer; 400. Second pixel electrode; 410. Main body; 420. Oblique reflective part; 421. Reflective main body; 422. Electrode bar; 423. Inclined surface; 430. Hollowed-out part; 510. Main common electrode; 520. Sub-common electrode; 610. Sub-pixel electrode; 700. Pixel electrode layer; 710. First pixel electrode; 810. First via; 820. Second via; 830. Third via; 840. Fourth via; 900. Detection device; 910. Electron beam emission area; 920. Electron detector area. Detailed Implementation
[0031] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.
[0032] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of technical features indicated. Therefore, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.
[0033] In addition, terms such as “center,” “horizontal,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” that indicate orientation or positional relationship are based on the orientation or relative positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0034] Furthermore, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0035] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments.
[0036] Figure 1 This is a schematic diagram of a first type of electronic paper display panel according to an embodiment of this application. Figure 2 This is a schematic diagram of a second type of electronic paper display panel according to an embodiment of this application, as shown below. Figure 1-2 As shown, this application discloses an electronic paper display panel 10, which includes an electronic paper reflective layer 30 and an array substrate 200, wherein the electronic paper reflective layer 30 is disposed on the array substrate 200.
[0037] The electronic paper display panel 10 also includes a common electrode 20, which can be disposed on the side of the electronic paper reflective layer 30 away from the array substrate 200. An electric field is formed between the common electrode 20 layer and the pixel electrode layer 700 on the array substrate 200, driving the electronic paper reflective layer 30 to reflect or absorb light, thereby realizing the display of the image.
[0038] See Figure 1When the electronic paper display panel 10 is a microcapsule 31 type electronic paper display panel 10, the electronic paper reflective layer 30 includes a plurality of microcapsules 31. Each microcapsule 31 is filled with electrophoretic particles and a colloidal suspension. The electrophoretic particles include black electrophoretic particles and white electrophoretic particles. The white electrophoretic particles are negatively charged, the black electrophoretic particles are positively charged, and the colloidal suspension is electrically neutral. When a negative charge is applied to the first pixel electrode 710, the black electrophoretic particles move downward and the white electrophoretic particles move upward under the action of the electric field, thus displaying a white state when viewed from above. When a positive charge is applied to the first pixel electrode 710, the black electrophoretic particles move upward and the white electrophoretic particles move downward under the action of the electric field, thus displaying a black state when viewed from above. Of course, colored electrophoretic particles, such as red, green, and blue electrophoretic particles, can also be filled into the microcapsules 31.
[0039] See Figure 2 When the electronic paper display panel 10 is a microcup 33 type electronic paper reflective layer 30, the electronic paper reflective layer 30 includes a base layer 32, on which a plurality of microcups 33 are disposed. Each microcup 33 corresponds to a pixel unit region 210. The microcup 33 is filled with electrophoretic particles and colloidal suspension, or the microcup 33 is filled with electrophoretic ink and colloidal suspension.
[0040] This application uses the example of a microcapsule-type electronic paper display panel 10 as an example for explanation and description.
[0041] This application also discloses an array substrate 200, which can be used in the electronic paper display panel 10 described above. Regarding the array substrate 200, this application provides the following design, which is specifically described through several embodiments:
[0042] Example 1:
[0043] Figure 3 This is a cross-sectional schematic diagram of an array substrate according to the first embodiment of this application. Figure 4 This is a planar schematic diagram of an array substrate according to the first embodiment of this application, combined with... Figure 3-4 As shown, this application discloses an array substrate 200, which includes a substrate 300, an active switching layer 310, and a pixel electrode layer 700. The active switching layer 310 and the pixel electrode layer 700 are sequentially disposed on the substrate 300. The pixel electrode layer 700 includes a plurality of first pixel electrodes 710. The array substrate 200 includes a plurality of pixel unit regions 210, and each pixel unit region 210 includes an electron beam matrix test region 220. In simple terms, an electron beam matrix test region 220 is defined within each pixel unit region 210.
[0044] Each pixel unit region 210 of the active switching layer 310 includes an active switch 320, a second pixel electrode 400, and a main common electrode 510. In simple terms, each pixel unit region 210 of the active switching layer is provided with an active switch 320, a second pixel electrode 400, and a main common electrode 510. The first pixel electrode 710 and the drain 322 of the active switch 320 are connected through a first via 810. The second pixel electrode 400 is connected to the drain 322 of the active switch 320 and is located between the first pixel electrode 710 and the main common electrode 510. The projections of the first pixel electrode 710, the second pixel electrode 400, and the main common electrode 510 on the substrate 300 overlap. The active switch 320 can be a dual-gate structure or a single-gate structure.
[0045] The first pixel electrode 710 in the electron beam matrix test area 220 is used to reflect electrons emitted by the detection device 900 to determine whether the first via 810 is conductive, and the second pixel electrode 400 in the electron beam matrix test area 220 will not reflect electrons back into the electron detector area 920 of the detection device 900.
[0046] For example, the active switching layer 310 includes a first metal layer 311, a first insulating layer 312, a second metal layer 313, a second insulating layer 314, and a passivation layer 315. The first metal layer 311 is disposed on the substrate 300, the first insulating layer 312 is disposed on the side of the first metal layer 311 away from the substrate 300, the second metal layer 313 is disposed on the side of the first insulating layer 312 away from the substrate 300, the second insulating layer 314 is disposed on the side of the second metal layer 313 away from the substrate 300, and the pixel electrode layer 700 is disposed on the side of the passivation layer 315 away from the substrate 300.
[0047] The second pixel electrode 400 is located within the second metal layer 313, the main common electrode 510 is located within the first metal layer 311, and a storage capacitor is formed between the main common electrode 510 and the second pixel electrode 400. The first via 810 penetrates the passivation layer 315 and the second insulating layer 314 so that the first pixel electrode 710 and the drain 322 can be connected.
[0048] The active switching layer 310 further includes a data line 316 and a scan line 317. Both the data line 316 and the scan line 317 are disposed on the substrate 300. The data line 316 and the scan line 317 are disposed in different layers. That is, when the data line 316 is located in the first metal layer 311, the scan line 317 is located in the second metal layer 313; when the data line 316 is located in the second metal layer 313, the scan line 317 is located in the first metal layer 311. The data line 316 and the scan line 317 are arranged in a crisscross pattern to divide multiple pixel unit regions 210. The data line 316 is connected to the source 321 of the active switch 320, and the scan line 317 is connected to the drain 322 of the active switch 320.
[0049] Figure 5 A schematic diagram of a detection device, combined with Figure 5 As shown, Figure 5 The black particles in the middle represent electrons, and the one-way arrows indicate the direction of electron movement. For example, the detection device 900 has multiple electron beam emission areas 910 and multiple electron detector areas 920. The electron beam emission areas 910 are used to emit electrons vertically toward the electron beam matrix test area 220, and the electron detector areas 920 are used to receive electrons reflected back from the first pixel electrode 710.
[0050] Each electron detector region 920 corresponds one-to-one with the electron beam matrix test region 220. Simply put, the electron beam emission region 910 and the electron detector region 920 are located directly above the electron beam matrix test region 220. This ensures that the electron detector region 920 does not receive electrons reflected back from other pixel unit regions 210.
[0051] During testing, the first pixel electrode 710 needs to be charged first. For example, all the first pixel electrodes 710 are charged with a positive voltage. Then, the detection device 900 emits electrons toward the first pixel electrodes 710 in the electron beam matrix test area 220. When the first pixel electrode 710 is charged with a positive voltage, it will reflect the electrons back. The electron detector area 920 of the detection device 900 will receive the reflected electrons, thereby inferring that the first via 810 is normally conductive and the first pixel electrode 710 can be charged.
[0052] When the first pixel electrode 710 is not charged, it will not reflect electrons. The electron detector area 920 of the detection device 900 will not receive the reflected electrons, thus inferring that the first via 810 is abnormal and cannot charge the first pixel electrode 710.
[0053] See Figure 3 and Figure 4Since the electronic paper display panel 10 requires a relatively large storage capacitor, in order to increase the storage capacitor of each pixel unit area 210, the usual practice is to reduce the distance between the first pixel electrode 710 and the main common electrode 510. Therefore, a second pixel electrode 400 is set on the second metal layer 313, and a storage capacitor is formed between the second pixel electrode 400 and the main common electrode 510, thereby increasing the capacitance of each pixel unit area 210.
[0054] This approach results in the simultaneous presence of a second pixel electrode 400 and a main common electrode 510 below the first pixel electrode 710 in the electron beam matrix test area 220. During testing, the main common electrode 510 is not energized and therefore does not reflect electrons. However, since the second pixel electrode 400 is connected to the drain 322 of the active switch 320, it can still be energized even if the first via 810 malfunctions. Consequently, the electrons emitted by the detection device 900 are reflected back by the second pixel electrode 400. This means that regardless of whether the first via 810 malfunctions, the electron detector area 920 of the detection device 900 will receive the reflected electrons, leading to detection failure.
[0055] Compared to existing array substrates, this application improves the detection accuracy of the array substrate 200 by preventing the second pixel electrode 400 in the electron beam matrix test area 220 from reflecting electrons back into the electron detector area 920 of the detection device 900. This avoids the situation where electrons are still detected even when the first via 810 cannot properly conduct the first pixel electrode 710 and the drain 322 of the active switch 320, thus preventing the misjudgment that the first via 810 is normally conducting.
[0056] In order to prevent the second pixel electrode 400 in the electron beam matrix test area 220 from reflecting electrons back into the electron detector area 920 of the detection device 900, this embodiment adopts an inclined surface 423 on the upper surface of the second pixel electrode 400 in the electron beam matrix test area 220, thereby realizing the reflection of electrons into areas outside the electron detector area 920.
[0057] Specifically, the second pixel electrode 400 includes a main body 410 and an oblique reflective portion 420. The main body 410 is disposed around the oblique reflective portion 420. The orthogonal projection of the oblique reflective portion 420 on the substrate 300 covers the orthogonal projection of the electron beam matrix test area 220 on the substrate 300. The oblique reflective portion 420 is used to reflect electrons emitted by the detection device 900 outward from the electron detector area 920.
[0058] Even if the first via 810 fails to conduct and the first pixel electrode 710 fails to charge, during testing, the oblique reflective part 420 can reflect electrons to a position outside the electron detector area 920. Therefore, the electrons reflected back by the second pixel electrode 400 will not be received by the electron detector area 920, thus enabling the determination of whether the first via 810 has a conduction abnormality.
[0059] The oblique reflective portion 420 includes a reflective main body portion 421 and an electrode crossbar 422. The electrode crossbar 422 is disposed on the side of the reflective main body portion 421 away from the substrate 300, and the electrode crossbar 422 is triangular prism-shaped, with the side of the electrode crossbar 422 away from the substrate 300 being an inclined surface 423.
[0060] In simple terms, multiple electrode strips 422 are set on the top of the oblique reflective part 420. The side of the electrode strips 422 facing away from the substrate 300 is an inclined surface 423. Therefore, it will exert an oblique force on the electrons emitted to the first pixel electrode 710 in the electron beam matrix test area 220, thereby reflecting the electrons to areas outside the electron detector area 920.
[0061] Furthermore, since it is not necessary to hollow out the oblique reflective portion 420, the overlap area between the first pixel electrode 710 and the second pixel electrode 400 will not be reduced, and the storage capacitance in a single pixel unit region 210 will not be reduced.
[0062] Since the detection device 900 detects the entire array substrate 200 simultaneously, and the pixel unit regions 210 on the array substrate 200 are arranged in a matrix, each pixel unit region 210 in the detection device 900 has an independent electron detector region 920 above it. After receiving the reflected electrons, each independent electron detector region 920 can determine which coordinate of the first via 810 of the first pixel electrode 710 in the pixel unit region 210 has a problem.
[0063] Two adjacent pixel unit regions 210 are defined as the first pixel unit region 211 and the second pixel unit region 212. Since the electrons reflected from the electron beam matrix test region 220 in the first pixel unit region 211 may be received by the electron detector region 920 above the electron beam matrix test region 220 in the second pixel unit region 212, resulting in incorrect judgment, this application also improves the inclined surface 423.
[0064] Specifically, the direction of extension from the middle of the oblique reflective portion 420 toward the edge is defined as the first direction 231. Each of the electrode strips 422 in each pixel unit region 210 is arranged in parallel, and the slope of the inclined surface 423 of the electrode strips 422 gradually decreases along the first direction 231.
[0065] In this way, the reflected electrons can be controlled to be positioned between the electron detector area 920 corresponding to the first pixel electrode 710 unit area and the electron detector area 920 corresponding to the second pixel unit area 212. This ensures that the electrons reflected from the electron beam matrix test area 220 in the first pixel unit area 211 will not be received by the electron detector area 920 above the electron beam matrix test area 220 in the second pixel unit area 212, thereby improving the accuracy of detection.
[0066] This application can also adjust the direction of the inclined surface 423. Figure 6 This is a schematic diagram of an obliquely arranged reflective portion according to the first embodiment of this application, as shown below. Figure 6 As shown, four sub-pixel unit regions 210 arranged in a grid pattern are defined as the first sub-pixel unit region 241, the second sub-pixel unit region 242, the third sub-pixel unit region 243, and the fourth sub-pixel unit region 244. The first sub-pixel unit region 241 and the fourth sub-pixel unit region 244 are located diagonally opposite each other, as are the second sub-pixel unit region 242 and the third sub-pixel unit region 243. The inclined surface 423 of the electrode strip 422 in the first sub-pixel unit region 241 faces the fourth sub-pixel unit region 244, and the electrode strip 422 in the fourth sub-pixel unit region 244... The inclined surface 423 of the electrode strip 422 in the second sub-pixel unit region 242 faces the first sub-pixel unit region 241; the inclined surface 423 of the electrode strip 422 in the second sub-pixel unit region 242 faces the third sub-pixel unit region 243, and the inclined surface 423 of the electrode strip 422 in the third sub-pixel unit region 243 faces the second sub-pixel unit region 242; simply put, the inclined surface 423 of the electrode strip 422 in each pixel unit region 210 faces the same direction as the diagonal of the pixel unit region 241, in other words, the length direction of the electrode strip 422 is the same as the diagonal of the pixel unit region 241.
[0067] Since the distance between the oblique reflective portion 420 in the adjacent first sub-pixel unit region 241 and the oblique reflective portion 420 in the second sub-pixel unit region 242 is d1, and the distance between the oblique reflective portion 420 in the first sub-pixel unit region 241 and the oblique reflective portion 420 in the fourth sub-pixel unit region 244 is d2, and since the distance d2 is greater than d1, by changing the orientation of the tilted surface 423, such as the oblique reflective portion 420 in the first sub-pixel unit region 241 causing electrons to be reflected towards the oblique reflective portion 420 in the adjacent fourth sub-pixel unit region 244, rather than towards the second sub-pixel unit region 242, and since the distance d2 is large enough, interference between adjacent pixel electrode regions is further prevented, improving the accuracy of detection, and there is no need to adjust the position of the electron detector region 920 of the detection device 900.
[0068] Of course, in order to avoid the situation where electrons reflected from the electron beam matrix test area 220 in the first pixel unit area 211 may be received by the electron detector area 920 above the electron beam matrix test area 220 in the second pixel unit area 212, thus causing incorrect judgment, the position of the oblique reflective part 420 can also be adjusted.
[0069] Figure 7 This is a schematic diagram of an oblique reflective portion according to the first embodiment of this application, as shown below. Figure 7 As shown, two adjacent pixel unit regions 210 are defined as the first pixel unit region 211 and the second pixel unit region 212. Each of the electrode strips 422 in different pixel unit regions 210 is also arranged in parallel. The width direction of the electrode strips 422 is defined as the second direction 232. The oblique reflective portions 420 in the first pixel unit region 211 and the oblique reflective portions 420 in the second pixel unit region 212 adjacent to each other in the second direction 232 are arranged vertically and vertically staggered.
[0070] That is, the oblique reflective portion 420 in the first pixel unit region 211 is located in the upper half of the first pixel unit region 211, and the oblique reflective portion 420 in the second pixel unit region 212 is located in the lower half of the second pixel unit region 212; or the oblique reflective portion 420 in the first pixel unit region 211 is located in the lower half of the first pixel unit region 211, and the oblique reflective portion 420 in the second pixel unit region 212 is located in the upper half of the second pixel unit region 212.
[0071] In this way, even if the electrode strip 422 of the first pixel unit region 211 reflects electrons above the second pixel unit region 212, the electrons are reflected to the upper and lower sides of the electron detector region 920 corresponding to the second pixel unit region 212, and are not received by the electron detector region 920, thereby improving the detection accuracy.
[0072] See Figure 3 The active switch 320 can be either a top-gate active switch 320 or a bottom-gate active switch 320. When the active switch 320 is a bottom-gate active switch 320, the source 321, the drain 322, and the second pixel electrode 400 of the active switch 320 are disposed on the same layer, and the gate 323 and the main common electrode 510 of the active switch 320 are disposed on the same layer.
[0073] In simple terms, the source 321, drain 322, and second pixel electrode 400 of the active switch 320 are all located on the second metal layer 313, and the gate 323 and main common electrode 510 of the active switch 320 are all located on the first metal layer 311. The active switch 320 also includes a semiconductor layer 324, which is located between the second metal layer 313 and the first insulating layer 312. The semiconductor layer 324 connects the source 321 and drain 322 of the active switch 320, and the gate 323 controls the conduction and de-conduction of the source 321 and drain 322.
[0074] By adopting a bottom-gate active switch 320, i.e., the gate 323 is on the first metal layer 311, the drain 322 can be disposed on the same layer as the second pixel electrode 400. In this way, when the second pixel electrode 400 and the drain 322 are connected, there is no need to open vias, which reduces the process difficulty and improves the yield of the array substrate 200.
[0075] Figure 8 This is a schematic diagram of an active switch according to the first embodiment of this application, as shown below. Figure 8 As shown, when the active switch 320 is a top-gate active switch 320, the source 321, the drain 322, and the main common electrode 510 of the active switch 320 are disposed on the same layer, the gate 323 and the second pixel electrode 400 of the active switch 320 are disposed on the same layer, and the second pixel electrode 400 and the drain 322 of the active switch 320 are connected through the fourth via 840.
[0076] In simple terms, the source 321, drain 322, and main common electrode 510 of the active switch 320 are all located on the first metal layer 311, and the gate 323 and the second pixel electrode 400 of the active switch 320 are both located on the second metal layer 313. The active switch 320 also includes a semiconductor layer 324, which is located between the substrate 300 and the first metal layer 311 and connects the source 321 and drain 322 of the active switch 320. The gate 323 controls the conduction and cutoff of the source 321 and drain 322, and the fourth via 840 penetrates the first insulating layer 312 to connect the second pixel electrode 400 and the drain 322 of the active switch 320.
[0077] The first via 810 penetrates the passivation layer 315, the first insulating layer 312, and the second insulating layer 314 to connect the first pixel electrode 710 and the drain 322 of the active switch 320.
[0078] Example 2:
[0079] Figure 9 This is a schematic diagram of an array substrate according to a second embodiment of this application, as shown below. Figure 9 As shown, unlike the first embodiment, the oblique reflective part 420 of this embodiment includes multiple electrode strips 422. Specifically, both ends of the electrode strips 422 are connected to the main body part 410. The electrode strips 422 are triangular prisms, and the side of the electrode strips 422 facing away from the substrate 300 is an inclined surface 423.
[0080] In simple terms, the oblique reflective part 420 is composed of strip-shaped electrode strips 422, which can reflect electrons to a position outside the electron detector area 920, so that they are not received by the electron detector area 920.
[0081] Compared to the approach of including the oblique reflective portion 420 as a reflective body portion 421 and an electrode strip 422, this embodiment reduces the manufacturing difficulty by simply setting the oblique reflective portion 420 as multiple strips.
[0082] Example 3:
[0083] Figure 10 This is a schematic diagram of an array substrate according to a third embodiment of this application, as shown below. Figure 10As shown, unlike the first embodiment, this embodiment directly removes the second pixel electrode 400 of the electron beam matrix test area 220. Specifically, the second pixel electrode 400 includes a main body 410 and a hollowed-out portion 430. The main body 410 is disposed around the hollowed-out portion 430, and the orthogonal projection of the hollowed-out portion 430 on the substrate 300 covers the orthogonal projection of the electron beam matrix test area 220 on the substrate 300.
[0084] Compared to the first embodiment, which uses multiple electrode strips 422 on the top of the oblique reflective portion 420 to reflect electrons to a position outside the electron detector region 920, this embodiment removes the second pixel electrode 400 from the electron beam matrix test region 220, thereby avoiding the presence of the second pixel electrode 400 in the electron beam matrix test region 220 and its impact on the test.
[0085] However, since the electronic paper display panel 10 requires a large capacity storage capacitor, the storage capacitor of each pixel unit will decrease after the second pixel electrode 400 is removed. Therefore, in this embodiment, a sub-pixel electrode 610 is also provided on the second metal layer 313 corresponding to the electron beam matrix test area 220. Specifically, the active switching layer 310 also includes a sub-pixel electrode 610. The sub-pixel electrode 610 is disposed on the same layer as the second pixel electrode 400, and the sub-pixel electrode 610 is located in the electron beam matrix test area 220. The sub-pixel electrode 610 is connected to the first pixel electrode 710 through a second via 820.
[0086] By setting a sub-pixel electrode 610 on the second metal layer 313 corresponding to the electron beam matrix test area 220, and by directly connecting the sub-pixel electrode 610 to the first pixel electrode 710 through the second via 820, the distance between the first pixel electrode 710 and the main common electrode 510 in the electron beam matrix test area 220 is reduced, thereby increasing the storage capacitance.
[0087] Figure 11 This is a schematic diagram of a secondary common electrode according to a third embodiment of this application, as shown below. Figure 11 As shown, it is also possible to provide a secondary common electrode 520 on the second metal layer 313 corresponding to the electron beam matrix test area 220. Specifically, the active switching layer 310 also includes a secondary common electrode 520. The secondary common electrode 520 is disposed on the same layer as the second pixel electrode 400, and the secondary common electrode 520 is located within the electron beam matrix test area 220. The main common electrode 510 and the secondary common electrode 520 are connected through a third via 830.
[0088] By setting a secondary common electrode 520 on the second metal layer 313 corresponding to the electron beam matrix test area 220, and by directly connecting the secondary common electrode 520 to the main common electrode 510 through a third via 830, the distance between the first pixel electrode 710 and the main common electrode 510 in the electron beam matrix test area 220 is reduced, thereby increasing the storage capacitance.
[0089] It should be noted that the limitations on each step involved in this solution are not considered as limiting the order of steps, provided that they do not affect the implementation of the specific solution. The steps listed first can be executed first, later, or even simultaneously. As long as this solution can be implemented, it should be considered to fall within the scope of protection of this application.
[0090] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.
[0091] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.
Claims
1. An array substrate, characterized by, The array substrate comprises a substrate, an active switch layer and a pixel electrode layer, the active switch layer and the pixel electrode layer are sequentially arranged on the substrate; the pixel electrode layer comprises a plurality of first pixel electrodes, the array substrate comprises a plurality of pixel unit regions, each of the pixel unit regions comprises an electron beam matrix test region; Each of the pixel unit regions of the active switch layer comprises an active switch, a second pixel electrode and a common electrode, the first pixel electrode and the drain of the active switch are connected through a first via, the second pixel electrode is connected with the drain of the active switch, the second pixel electrode is located between the first pixel electrode and the common electrode, the projections of the first pixel electrode, the second pixel electrode and the common electrode on the substrate overlap; The first pixel electrode in the electron beam matrix test region is used for reflecting the electrons emitted by a detection device, so as to determine whether the first via is conductive, and the second pixel electrode in the electron beam matrix test region does not reflect the electrons back into the electron detector region of the detection device; The second pixel electrode comprises a main body part and an oblique reflection part, the main body part is arranged around the oblique reflection part, the orthographic projection of the oblique reflection part on the substrate covers the orthographic projection of the electron beam matrix test region on the substrate, and the oblique reflection part is used for reflecting the electrons emitted by the detection device to the outside of the electron detector region.
2. The array substrate of claim 1, wherein, The oblique reflection part comprises a reflection main body part and an electrode horizontal strip, the electrode horizontal strip is arranged on the side of the reflection main body part away from the substrate, the electrode horizontal strip is in the shape of a triangular prism, and the side of the electrode horizontal strip away from the substrate is an inclined surface.
3. The array substrate of claim 1, wherein, The oblique reflection part comprises a plurality of electrode horizontal strips, both ends of the electrode horizontal strip are connected with the main body part, the electrode horizontal strip is in the shape of a triangular prism, and the side of the electrode horizontal strip away from the substrate is an inclined surface.
4. An array substrate, characterized by, The array substrate comprises a substrate, an active switch layer and a pixel electrode layer, the active switch layer and the pixel electrode layer are sequentially arranged on the substrate; the pixel electrode layer comprises a plurality of first pixel electrodes, the array substrate comprises a plurality of pixel unit regions, each of the pixel unit regions comprises an electron beam matrix test region; Each of the pixel unit regions of the active switch layer comprises an active switch, a second pixel electrode and a common electrode, the first pixel electrode and the drain of the active switch are connected through a first via, the second pixel electrode is connected with the drain of the active switch, the second pixel electrode is located between the first pixel electrode and the common electrode, the projections of the first pixel electrode, the second pixel electrode and the common electrode on the substrate overlap; The first pixel electrode in the electron beam matrix test region is used for reflecting the electrons emitted by a detection device, so as to determine whether the first via is conductive, and the second pixel electrode in the electron beam matrix test region does not reflect the electrons back into the electron detector region of the detection device; The second pixel electrode comprises a main body part and a hollow part, the main body part is arranged around the hollow part, and a projection of the hollow part on the substrate covers a projection of the electron beam matrix test region on the substrate.
5. The array substrate of claim 4, wherein, The active switch layer further comprises a sub-pixel electrode, the sub-pixel electrode is arranged in the same layer as the second pixel electrode, and the sub-pixel electrode is located in the electron beam matrix test region, and the sub-pixel electrode is connected to the first pixel electrode through a second via.
6. The array substrate of claim 4, wherein, The active switch layer further comprises a sub-common electrode, the sub-common electrode is arranged in the same layer as the second pixel electrode, and the sub-common electrode is located in the electron beam matrix test region, and the main common electrode and the sub-common electrode are connected through a third via.
7. The array substrate according to any one of claims 1 to 6, wherein, The source of the active switch, the drain of the active switch and the second pixel electrode are arranged in the same layer, and the gate of the active switch and the main common electrode are arranged in the same layer.
8. The array substrate according to any one of claims 1 to 6, wherein, The source of the active switch, the drain of the active switch and the main common electrode are arranged in the same layer, and the gate of the active switch and the second pixel electrode are arranged in the same layer, and the second pixel electrode is conductive to the drain of the active switch through a fourth via.
9. An electronic paper display panel, characterized by, The electronic paper display panel comprises an electronic paper reflection layer and the array substrate as claimed in any one of claims 1-8, and the electronic paper reflection layer is arranged on the array substrate.
Citation Information
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