Display module and electronic device

Abstract

The application provides a display module and an electronic device. The display module comprises a first display screen and a flexible circuit board. The flexible circuit board can be a functional device of the display screen. The first display screen comprises a display layer and a conductive layer arranged in a stack. The conductive layer is arranged on a side of the display layer away from a light-out surface. The display layer comprises a display panel and a connecting portion connected to the display panel. The flexible circuit board comprises a first portion and a second portion connected to each other. The connecting portion is connected to the second portion. The first portion of the flexible circuit board can be used as an electrically connected conductive area. The first portion is used to abut against the conductive layer under the elastic force of a grounding assembly to electrically connect the grounding assembly and the conductive layer, so that the first display screen is grounded. In this way, the flexible circuit board can not only be used as a functional device of the display screen, but also be used to ground the display screen. The flexible circuit board is reused, the design scheme of the electric connection is simplified, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of electronic equipment, and in particular to a display module and electronic equipment. BACKGROUND

[0002] With the development of electronic equipment such as mobile phones towards thinness, high reliability and long battery life, compact design of terminal electronic equipment monomer modules can greatly release the overall design space. In order to solve the problems of radiated spurious emission (RSE) and radio frequency interference, it is necessary to perform radio frequency grounding and signal dredging on conductive materials such as screens.

[0003] For example, a metal spring can be used to connect the conductive layer of the screen to the base of the overall metal frame, thereby achieving grounding of the conductive layer of the screen. The overall metal frame can be a middle frame or a metal shielding cover.

[0004] However, the contact between the metal spring and the display screen is a point contact, and the stress generated on the display screen is large, which can easily cause the display screen to be damaged and greatly affect the film printing. SUMMARY

[0005] Embodiments of the present application provide a display module and electronic equipment, which solve the problem that the grounding design of the display screen greatly affects the film printing.

[0006] To achieve the above-mentioned purpose, embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, a display module is provided, comprising: a first display screen and a flexible circuit board, the first display screen comprising a display layer and a conductive layer stacked, the conductive layer being arranged on a side of the display layer away from a light-emitting surface, the display layer comprising: a display panel, and a connecting portion connected to the display panel; the flexible circuit board comprising: a first portion and a second portion connected, the connecting portion being connected to the second portion, and the first portion being used to abut against the conductive layer under the action of an elastic force to electrically connect the conductive layer. Thus, the flexible circuit board can be a functional device of the display screen, the first portion of the flexible circuit board can be used as an electrical connection conduction area, and the electrical connection conduction area can be reliably electrically connected to the conductive layer under the action of the elastic force of the grounding assembly, thereby achieving reliable electrical connection between the display screen and the grounding assembly, and enabling radio frequency grounding and signal dredging on conductive materials such as screens. The influence of electric charge on antenna signals and display performance is reduced. The first portion of the circuit board assembly can disperse the elastic force of the grounding assembly to the surface, which can reduce or avoid the problem of screen film printing, thereby improving the reliability of the screen. Furthermore, the flexible circuit board can not only be used as a functional device of the display screen, but also be used for grounding the display screen, thereby achieving reuse of the flexible circuit board, simplifying the design scheme of electrical connection, and reducing production costs.

[0008] In an optional implementation, the first part includes a plurality of sides connected to each other, and an included angle between two adjacent sides is a rounded corner. In this way, the first part is designed with rounded corners, which can reduce or avoid screen film printing problems, thereby improving the reliability of the screen.

[0009] In an optional implementation, the first part includes a first metal layer, a first substrate, a first connecting layer, a third metal layer, a second substrate, and a second metal layer, the first metal layer is arranged on a side of the first substrate close to the first display screen, the second metal layer is arranged on a side of the first substrate close to the elastic member, and the first part includes a via, and the first metal layer is electrically connected to the second metal layer through the via. In this way, the first metal layer and the second metal layer can be made to be conductive under the action of the via, and the ground assembly can be electrically connected to the metal layer and the conductive layer of the first part.

[0010] In an optional implementation, the via is a plurality of vias, and the plurality of vias are arranged in an array. In this way, by arranging a plurality of vias, the stability of electrical connection can be further improved.

[0011] In an optional implementation, the first metal layer includes a plurality of first metal lines arranged in a first direction, the second metal layer includes a plurality of second metal lines arranged in a second direction, a projection of the first metal line on the substrate and a projection of the second metal line on the substrate have an overlapping region, and a projection of the via on the substrate overlaps the overlapping region. In this way, the first metal layer and the second metal layer use metal lines, and compared with using an entire layer of metal, the bending performance is better, so that the first part and the conductive layer are more closely attached, and the stability of electrical connection is improved.

[0012] In an optional implementation, the first direction and the second direction are parallel.

[0013] In an optional implementation, the first direction and the second direction intersect. In this way, the metal lines of different metal layers are overlapped at different angles, which is conducive to forming a multi-directional distribution of metal lines to form a metal line network, thereby meeting the stress distribution requirements of the metal layer in different directions and better improving the stability of electrical connection.

[0014] In an optional implementation, the projection of the first metal line on the substrate and the projection of the second metal line on the substrate are in a grid shape. In this way, the metal layer can be continuously distributed in multiple directions, which can better disperse stress, is conducive to reducing film printing, and can also provide sufficient conduction area.

[0015] In an alternative implementation, the display module further comprises a first connecting portion, the second portion is connected with the conductive layer through the first connecting portion, and the first connecting portion is configured to generate a gap between the first portion and the conductive layer, and the gap is configured to allow the first portion to move in the thickness direction of the first display screen in the gap under the elastic force of the elastic member until the first portion abuts against the conductive layer. Thus, the gap is provided between the first portion and the display screen, and the abutting force between the first portion and the display screen is provided by the grounding assembly only, so that the controllability is good, and the size parameters and the elastic force of the grounding assembly are facilitated to be designed. In addition, the gap can offset the errors generated in the processes of processing and assembling, and the film printing problem can be avoided or aggravated.

[0016] In an alternative implementation, the second portion comprises a first sub-portion and a second sub-portion connected with each other, the first sub-portion is connected with the first portion, and the second sub-portion and the third portion are stacked, the first connecting portion is arranged between the first sub-portion and the conductive layer, the second sub-portion is a metal layer close to one side of the first display screen, the connecting portion comprises a third portion and a fourth portion connected with each other, the third portion and the second sub-portion are stacked, and the fourth portion is connected with the display layer, and the third portion and the second sub-portion are connected close to one side of the first display screen. Thus, the second portion is divided into two sub-function portions, the gap can be formed in the second portion and the electrical connection with the display screen can be achieved, the reuse of the second portion is achieved, and the production cost is reduced.

[0017] In an alternative implementation, the second portion further comprises a shielding layer arranged between the first sub-portion and the first connecting portion. Thus, by arranging the shielding layer, the interference between the metal layers of the metal layer can be reduced, and the electromagnetic shielding performance is improved.

[0018] In an alternative implementation, the display module further comprises a second connecting layer and a support layer arranged between the third portion and the conductive layer, the second connecting layer is connected with the conductive layer, and the support layer is arranged between the second connecting layer and the third portion. Thus, the connecting layer and the support layer can be used to generate a preset distance between the first portion and the conductive layer, for example, to generate a gap between the first portion and the conductive layer.

[0019] In an alternative implementation, the first portion comprises a third sub-portion, a fourth sub-portion and a fifth sub-portion connected with each other, the third sub-portion is connected with the second portion, the display module further comprises a second connecting portion, the fifth sub-portion is connected with the conductive layer through the second connecting portion, and the fourth sub-portion is configured to abut against the conductive layer under the elastic force generated by the elastic member. Thus, the middle position of the first portion can abut against the conductive layer, the damage to the display screen caused by the edge position can be avoided, the screen film printing problem can be reduced or avoided, and thus the reliability of the screen can be improved.

[0020] In an optional implementation, the fourth sub-part has a smaller width than the third sub-part, and the fifth sub-part has a smaller width than the fourth sub-part. In this way, the fourth sub-part has a smaller width and better bending performance, and can better adhere to the conductive layer, thereby improving the electrical connection stability.

[0021] In an optional implementation, the first part has a cross-sectional shape including an I shape. In this way, the design of a wide left and right and a narrow middle can facilitate the conductive layer to abut against the display screen after being bent at the middle position.

[0022] In an optional implementation, the first part further includes a first plating layer and a second plating layer, the first plating layer is arranged on a side of the first part close to the first display screen, and the second plating layer is arranged on a side of the first part away from the first display screen. In this way, the plating layer can be used to improve the performance of the flexible circuit board, for example, to improve at least one of the corrosion resistance, wear resistance, electrical conductivity, or hardness.

[0023] In an optional implementation, the first part further includes a reinforcing plate arranged on a side of the second plating layer away from the first display screen. In this way, the extrusion resistance and film printing resistance of the first part can be further improved.

[0024] In a second aspect, the present application provides an electronic device including a grounding assembly and a display module as described above. The grounding assembly includes an elastic member and a metal member, the elastic member is arranged between the first display screen and the metal member, one end of the elastic member is connected to the metal member, and the other end of the elastic member is in abutment with the first part. The first part is used to abut against the conductive layer under the elastic force generated by the elastic member to electrically connect the metal member and the conductive layer. In this way, the electronic device uses the display module described above, the display screen is electrically connected to the flexible circuit board, and the elastic member is electrically connected to the metal member. Under the elastic force of the elastic member, the first part of the flexible circuit board can be reliably electrically connected to the elastic member, thereby realizing reliable electrical connection between the display screen and the metal member. The flexible circuit board can be a flexible circuit board functional device of the display screen. On the original flexible circuit board frame, a design of an electrical connection conduction region with the elastic member is beneficial to simplify the design and reduce the production cost. The electrical connection function is stable, can perform radio frequency grounding and signal dredging on the conductive material such as the screen, and reduces the influence of electric charge on the antenna signal and the display performance of the display screen. At the same time, compared with the conductive foam, the working height and the contact area of the elastic member are smaller, and the occupied space is smaller, which is beneficial to reduce the thickness of the whole machine and improve the device layout space in the electronic device, thereby improving the space utilization. In addition, the first part of the circuit board assembly can disperse the elastic force of the elastic member to the surface, which can reduce or avoid the screen film printing problem, thereby improving the reliability of the screen. Moreover, the display screen electrical connection scheme provided in the embodiments of the present application has a simple structure and low cost.

[0025] In an optional implementation, the electronic device further includes a second display screen, which is a flexible screen foldable or unfoldable along the folding axis, the first display screen is arranged opposite to the second display screen, and the flexible circuit board, the elastic member and the metal member are arranged between the first display screen and the second display screen. Thus, the electronic device can be a dual-screen device, the first display screen can be an outer screen, and the grounding assembly can be used for grounding the first display screen.

[0026] In an optional implementation, the electronic device further includes a housing arranged opposite to the first display screen, and the flexible circuit board, the elastic member and the metal member are arranged between the housing and the first display screen. Thus, the electronic device can be a straight bar mobile phone.

[0027] In an optional implementation, the electronic device further includes a middle frame arranged on a side away from a light-emitting surface of the first display screen, and the metal member is arranged on the middle frame or the middle frame includes the metal member. Thus, the display screen can be grounded through the middle frame.

[0028] Embodiments of the present application provide a display module and an electronic device, the electronic device includes a middle frame, and the display module is connected with the middle frame. The display module includes a first display screen and a flexible circuit board, and the flexible circuit board can be a functional device of the display screen; the first display screen includes a display layer and a conductive layer arranged in a stack, the conductive layer is arranged on a side of the display layer away from a light-emitting surface, and the display layer includes a display panel and a connecting portion connected with the display panel; the flexible circuit board includes a first portion and a second portion connected with each other, the connecting portion is connected with the second portion, the first portion of the flexible circuit board can be used as an electrically connected conductive area, the first portion is used to abut against the conductive layer under the elastic force of the grounding assembly to electrically connect the grounding assembly and the conductive layer, so that the first display screen is grounded. The first portion of the circuit board assembly can disperse the elastic force of the grounding assembly to the surface, which can reduce or avoid screen film printing problems, thereby improving the reliability of the screen. In this way, the flexible circuit board can not only be used as a functional device of the display screen, but also be used for grounding the display screen, which realizes the reuse of the flexible circuit board, simplifies the design scheme of the electric connection, reduces the production cost, and the electric connection function is stable, can perform radio frequency grounding and signal dredging on the conductive material such as the screen, and reduces the influence of electric charge on the antenna signal and the display performance of the display screen.

[0029] In some embodiments, the first part includes a metal layer and a substrate, and the second part has more layers. A via can be provided in the first part, the via passing through at least the insulating layer of the first part. Under the action of the via, the surface of the first part and the metal layer of the ground can be made conductive, thereby allowing the grounding component to be electrically connected to the conductive layer through the metal layer of the first part.

[0030] In some embodiments, the electronic device further includes a first connecting portion, through which the second portion is connected to the conductive layer. The first connecting portion creates a gap between the first portion and the conductive layer. This gap allows the first portion to move along the thickness direction of the first display screen under the elastic force of the elastic member until it abuts against the conductive layer. Thus, the gap between the first portion and the display screen ensures that the force causing the first portion to abut against the display screen is provided solely by the grounding component, providing good controllability and facilitating the design of the grounding component's dimensions and elasticity. Furthermore, the gap can compensate for errors generated during processing and assembly, preventing or exacerbating film printing problems. Attached Figure Description

[0031] Figure 1 A schematic diagram of the disassembly structure of an electronic device provided in an embodiment of this application;

[0032] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application;

[0034] Figure 4 This is a cross-sectional view of an electronic device;

[0035] Figure 5 This is a schematic diagram of the structure of the first display screen;

[0036] Figure 6 for Figure 4 A schematic diagram of the conductive layer in the diagram;

[0037] Figure 7 This is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0038] Figure 8 for Figure 7 A schematic diagram of a flexible circuit board in operation.

[0039] Figure 9 for Figure 7 Another schematic diagram of the flexible circuit board in operation;

[0040] Figure 10A structural schematic diagram of a flexible circuit board provided by an embodiment of the present application;

[0041] Figure 11 A structural schematic diagram of another flexible circuit board provided by an embodiment of the present application;

[0042] Figure 12 A structural schematic diagram of a first part of a flexible circuit board provided by an embodiment of the present application;

[0043] Figure 13 Another structural schematic diagram of a first part of a flexible circuit board provided by an embodiment of the present application;

[0044] Figure 14 Another structural schematic diagram of a first part of a flexible circuit board provided by an embodiment of the present application;

[0045] Figure 15 Another structural schematic diagram of a first part of a flexible circuit board provided by an embodiment of the present application;

[0046] Figure 16 A projection schematic diagram of a metal layer of a flexible circuit board provided by an embodiment of the present application;

[0047] Figure 17 A top view of a first part of a flexible circuit board provided by an embodiment of the present application;

[0048] Figure 18 A sectional view of a first part of a flexible circuit board provided by an embodiment of the present application;

[0049] Figure 19 A structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0050] Figure 20 A schematic diagram of a flexible circuit board in a working state in Figure 19

[0051] Another schematic diagram of a flexible circuit board in a working state in Figure 21 Figure 19 A structural schematic diagram of an elastic member provided by an embodiment of the present application;

[0052] Figure 22 A structural schematic diagram of a conductive layer provided by an embodiment of the present application.

[0053] DETAILED DESCRIPTION Figure 23 In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0054] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0055] ​The terms "first", "second", etc. are used only for descriptive purposes and should not be construed as implying or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0056] In addition, in the present application, the orientation terms such as "upper", "lower", etc. are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, which can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0057] The electronic device provided by the embodiments of the present application can be a product with a display interface, such as a mobile phone, a display, a tablet computer, a vehicle-mounted computer, etc. The embodiments of the present application do not specially limit the specific form of the electronic device.

[0058] The electronic device provided by the embodiments of the present application can be a product with a display interface, such as a mobile phone, a display, a tablet computer, a vehicle-mounted computer, etc. The embodiments of the present application do not specially limit the specific form of the electronic device.

[0059] As shown in Figure 1 The electronic device 1 includes a display module 10, a middle frame 11, and a shell 12. The middle frame 11 is located between the display module 10 and the shell 12.

[0060] The display module 10 is used to display an image.

[0061] The display module 10, the middle frame 11, and the shell 12 can be respectively arranged at different layers in the thickness direction of the electronic device. These layers can be parallel to each other, and the plane where each layer is located can be referred to as the X-Y plane, and the direction perpendicular to the X-Y plane can be referred to as the Z direction. For example, the display module 10, the middle frame 11, and the shell 12 can be distributed in layers in the Z direction.

[0062] The display module 10 can include a display screen and a flexible printed circuit (FPC). The display screen can be connected to the FPC through a connector, and the FPC can be connected to the middle frame 11 through a connector. Figure 1The flexible circuit board shown is electrically connected to the printed circuit board (PCB) disposed on the middle frame 11. This allows the PCB to transmit display data to the display module 10 to control the display module 10 to display images.

[0063] The middle frame 11 is located between the display module 10 and the housing 12. The surface of the middle frame 11 away from the display module 10 is used to mount internal components such as batteries, printed circuit boards (PCBs), cameras, and antennas. After the housing 12 is closed with the middle frame 11, the aforementioned internal components are located between the housing 12 and the middle frame 11.

[0064] The housing 12 is connected to the middle frame 11 to form a cavity for accommodating the aforementioned electronic components such as the PCB, camera, and battery. This prevents external moisture and dust from entering the cavity and affecting the performance of the electronic components.

[0065] This application does not limit the structure of the mobile phone in its embodiments. In some embodiments of this application, such as... Figure 2 As shown, the phone can be a candybar phone.

[0066] Alternatively, the phone could also be a foldable phone. In some embodiments, such as Figure 3 As shown, the display screen of the foldable phone includes: a first display screen 200 and a second display screen 300, a mid-frame 11 (or support) and a housing.

[0067] Among them, such as Figure 3 As shown, the second display screen 300 includes a first part A and a second part B. When the foldable screen phone is in a folded state (the angle between the first part A and the second part B of the second display screen 300 is 0°), the second display screen 300 is located on the inside, the first display screen 200 is located on the outside, and the first part A of the second display screen 300 is opposite to the second part B of the second display screen 300.

[0068] The first part A of the second display screen 300 is stacked with the first display screen 200, the second part B of the second display screen 300 is stacked with the housing 12, and the second display screen is positioned opposite to the first part A of the second display screen 300.

[0069] For performance optimization, the display screen on the electronic device is usually designed to be grounded, that is, the display screen is electrically connected with metal parts (such as a middle frame, a shielding cover, etc.) in the electronic device to form a ground return path, thereby realizing grounding of the display screen. For example, a user using the electronic device often has static electricity, and after contacting the electronic device, the static electricity will hit the display screen, causing electro-static discharge (ESD). In order to improve the anti-static ability of the display screen, the display screen is usually grounded. For another example, when the display screen is normally working, the electronic devices (such as light-emitting diodes, semiconductors, etc.) in the display screen will accumulate electric charges, or static electricity will be generated between the electronic device and the impact object after the electronic device falls. These electric charges will gradually accumulate on the display screen. If the electric charges accumulate too much on the display screen, it may affect the normal use of the display screen, such as causing the phenomenon of bright circle or light leakage due to the inability to effectively control the bright and dark of the local area of the display screen. Grounding the display screen can transfer the excess electric charges on the display screen, thereby avoiding the influence of the accumulation of too much electric charges on the display effect of the display screen. For another example, if an antenna is arranged between two display screens (such as the second display screen 300 and the first display screen 200) arranged opposite to each other, the electric charges on the display screens will cause the spurious problem of the antenna, such as radiated spurious emission. Grounding at least one display screen can transfer the electric charges on the display screen, which is beneficial to improving the radio frequency performance of the electronic device.

[0070] In some embodiments, the electric connection of the display screen can be realized by conductive foam. The conductive foam is a kind of foam material with conductive performance, which is realized by mixing fillers with good conductive performance, such as carbon fibers and copper powder, into the foam material to make the foam material have conductive characteristics. However, the conductive foam needs a large working height and contact area, for example, in order to solve the display screen film printing problem, the conventional design usually selects the conductive foam with an initial height of 1.5 mm and a working height of 0.5 mm-0.8 mm, for another example, in order to avoid the RSE problem, the conductive foam has a minimum design area requirement (such as a contact area of 2.5 mm*6.5 mm), and usually multiple conductive foams need to be arranged in the electronic device, which seriously affects the thickness of the whole machine and the device layout space. Moreover, the conductive foam is compressed when working, and the top screen force generated by each piece of conductive foam on the display screen is about 1 newton (symbol: N), and the more the number of conductive foams, the greater the top screen force. For example, when more than 6 pieces of conductive foam are arranged, a top screen force of more than 6 N will be generated. On the one hand, the conductive foam exerts a top screen force on the local display screen, which greatly affects the film printing. On the other hand, the current display screen and the shell of the electronic device are usually bonded by point gluing or back gluing, and the top screen force generated by the conductive foam causes the risk of screen delamination. Therefore, the display screen has a large risk of film printing and screen delamination, which affects the reliability of the screen.

[0071] In some embodiments, the metal spring has a low working height, and the metal spring can be used to electrically connect the display screen.

[0072] As shown in Figure 4 The electronic device includes a display screen 100, a metal spring 2001, and a metal piece 30. The display screen 100 includes a display layer 101 and a conductive layer 102 stacked together. The conductive layer 102 is arranged on a side of the display layer 101 away from a light-emitting surface. The metal spring 2001 is arranged between the display screen 100 and the metal piece 30.

[0073] In some embodiments, the display layer 101 has a multi-layer structure (i.e., a composite layer).

[0074] In some embodiments, the display layer 101 includes a polarizer 1011, a display panel 1012, and a protective layer 1013 stacked together. The display panel 1012 is arranged between the polarizer 1011 and the protective layer 1013. Figure 5 The display panel 1012 is a layer for realizing display functions, and can convert electrical signals into visual information. In some embodiments, the display panel 1012 is a panel (PNL).

[0075] The protective layer 1013 is used to connect the conductive layer 102. In some embodiments, the protective layer 1013 can be a back film (BF). For example, the protective layer 1013 can be made of poly-ethylene terephthalate (PET) or polyimide (PI).

[0076] In some embodiments, the display screen further includes a cover plate 1017. The cover plate 1017 is arranged on the polarizer 1011. The polarizer 1011 is arranged between the cover plate 1017 and the display panel 1012, and the display panel 1012 is arranged between the polarizer 1011 and the protective layer 1013. The polarizer 1011 is used to convert unpolarized light into polarized light or change the polarization direction of the polarized light.

[0077] In some embodiments, the display layer 101 further includes a third adhesive layer arranged between the cover plate 1017 and the polarizer 1011, and used to bond the cover plate 1017 and the polarizer 1011. For example, the third adhesive layer can be made of optical adhesive or double-sided grid adhesive.

[0078]

[0079] ​In some embodiments, the display layer 101 further comprises a fourth adhesive layer, which is arranged between the display panel 1012 and the protective layer 1013, and is used to bond the display panel 1012 and the protective layer 1013. For example, the fourth adhesive layer can be made of optical clear adhesive (OCA), double-sided grid adhesive, pressure sensitive adhesive (PSA), or the like.

[0080] In some embodiments, the display layer 101 further comprises a support layer 1015, which is arranged between the display layer 101 and the conductive layer 102, and is used to buffer and protect the display layer 101. The conductive layer 102 is used to electrically connect with the metal spring, and is used to conduct electricity.

[0081] For example, the material of the support layer 1015 can include at least one of thermoplastic polyurethane elastomer rubber (TPU), polypropylene, polyethylene terephthalate (PET), polyvinylidene fluoride, or foam.

[0082] For example, the material of the conductive layer 102 can include at least one of stainless steel, copper, titanium alloy, aluminum alloy, or silver.

[0083] In some embodiments, the display layer 101 further comprises an adhesive layer 1014, which is arranged between the protective layer 1013 and the support layer 1015, and is used to bond the support layer 1015 and the protective layer 1013.

[0084] In some embodiments, the display layer 101 further comprises an adhesive layer 1016, which is arranged between the support layer 1015 and the conductive layer 102, and is used to bond the support layer 1015 and the conductive layer 102.

[0085] For example, the material of the adhesive layer 1016 and / or the adhesive layer 1014 can be OCA, double-sided grid adhesive, or other conductive adhesive layer, or the like.

[0086] The conductive layer 102 is arranged on the side of the display layer 101 away from the light-emitting surface. The display layer 101 is used to display interface content, such as image and / or text data. The conductive layer 102 is used to realize the electrical connection of the display screen, and specifically, the conductive layer 102 is electrically connected with the metal spring. In some embodiments, the conductive layer 102 also serves as the support layer 1015 of the display layer 101, and is used to support.

[0087] The material of the conductive layer 102 can be a metal conductive material, such as stainless steel, titanium alloy, aluminum alloy, vinyl carbonate (VC), copper, silver, etc., or a non-metal conductive material, such as carbon fiber, carbon nanotube, titanium carbide, graphene, zinc oxide, and some conductive polymer materials, conductive ceramic materials, etc. For example, the conductive layer 102 is in a sheet shape.

[0088] It can be understood that Figure 5 The stack structure of the display layer 101 shown is only exemplary, and the stack structure of the display layer 101 of different types of electronic devices is also different, which will not be described one by one here.

[0089] In some embodiments, the conductive layer 102 can be a buffer heat dissipation film, which can also be called super clean foam (SCF). In other embodiments, the conductive layer 102 can be a support plate (for example, a foldable support plate) for providing support force for the display screen.

[0090] As shown in Figure 4 The metal spring 2001 is used to electrically connect the metal piece 30 and the conductive layer 102, so that the conductive layer 102 can be conductive with the metal piece 30 through the metal spring 2001.

[0091] In this way, the metal spring 2001 can be conductive with the metal protection layer 1013 on the back of the screen through the top stand, and finally realize the electrical connection of the display screen-metal spring 2001-metal piece 30, and realize the grounding of the display screen.

[0092] In some embodiments, a plurality of metal springs 2001 can be provided to be conductive with the conductive layer 102, for example, as shown in Figure 6 Four metal springs can be provided: a first metal spring 2001A, a second metal spring 2001B, a third metal spring 2001C, and a fourth metal spring 2001D.

[0093] However, the contact between the metal spring and the display screen is a point contact, and the stress generated on the display screen is large, which is easy to cause the screen to be pressed, and the impact on the film mark is large. When a plurality of metal springs are provided, the screen pressing force is larger, and the impact on the film mark is also larger.

[0094] Therefore, the display module provided in the embodiments of the present application can reuse the flexible circuit board of the display screen, for example, an electrical connection conductive area can be provided on the flexible circuit board connected with the display panel, and the metal spring is elastically connected with the electrical connection conductive area, so as to realize the electrical connection of the display screen, while reducing the thickness of the whole machine, and improving the reliability of the screen and the device layout space in the electronic device.

[0095] Among them, the display module of the present application can include as Figure 2The display screen of the straight bar mobile phone shown can also include, for example Figure 3 The first display screen 200 of the double-screen mobile phone shown can be electrically connected to the conductive area, which can be arranged on the flexible circuit board connected to the display screen 100 as shown in Figure 2 The first display screen 200 of the double-screen mobile phone shown can be electrically connected to the conductive area, which can be arranged on the flexible circuit board connected to the display screen 100 as shown in Figure 3 The first display screen 200 of the double-screen mobile phone shown can be electrically connected to the conductive area, which can be arranged on the flexible circuit board connected to the display screen 100 as shown in Figure 2 The display screen 100 and the flexible circuit board shown are taken as examples for description.

[0096] Figure 7 A structural schematic diagram of a display module provided by an embodiment of the present application is shown in Figure 7 The display module includes a display screen 100 and a flexible circuit board 40. The display screen 100 includes a display layer 101 and a conductive layer 102 arranged in layers. The conductive layer 102 is arranged on the side of the display layer 101 away from the light-emitting surface.

[0097] The flexible circuit board 40 can be a flexible circuit board layer functional device of the display screen 100. The flexible circuit board 40 is connected to the display screen 100.

[0098] In some embodiments, the flexible circuit board 40 can include a first portion 401 and a second portion 402 connected in sequence as shown in Figures 7-9

[0099] The first portion 401 includes the above-mentioned electrically conductive area. The first portion 401 is used to abut against the conductive layer 102 under the action of the elastic force to electrically connect the conductive layer 102. For example, the first portion 401 can be elastically connected to the conductive layer 102 under the action of the elastic force of a grounding assembly (not shown in the figure, which can refer to 20 and 30 in FIG. 2) to electrically connect the grounding assembly and the conductive layer to achieve grounding. Figure 7 Figure 19 The display screen further includes a connecting portion 1010 connected to the display layer 101. In some embodiments, one end of the connecting portion 1010 is connected to the display panel in the display layer 101. A part of the connecting portion 1010 is connected to the second portion 402.

[0100] The flexible circuit board 40 can be connected to the driving circuit or the power supply circuit in the display screen 100 through the connecting portion 1010 to drive the first display screen to display images or supply power to the display screen.

[0101] The flexible circuit board 40 can be connected to the driving circuit or the power supply circuit in the display screen 100 through the connecting portion 1010 to drive the first display screen to display images or supply power to the display screen.

[0102] ​​The flexible circuit board 40 provided by the embodiment of the present application can be a functional device of the display screen, and the first part of the flexible circuit board can be used as an electrically connected and conductive area. Under the elastic force of the grounding assembly, the electrically connected and conductive area can be reliably electrically connected with the conductive layer, so as to realize reliable electrical connection between the display screen and the grounding assembly. The flexible circuit board can not only be used as a functional device of the display screen, but also be used for grounding the display screen, which simplifies the design scheme of electrical connection, reduces the production cost, and stabilizes the electrical connection function. In addition, the flexible circuit board can be used for radio frequency grounding and signal dredging of the conductive material such as the screen, so as to reduce the influence of electric charge on the antenna signal and the display performance of the display screen.

[0103] As shown in Figure 7 , the first part 401 has a gap H between the surface thereof facing the display screen and the surface of the display screen facing the first part 401. The gap H referred to in the embodiment is formed after the flexible circuit board 40 is assembled with the display screen. In the complete assembly state, after the first part 401 is subjected to the action force of the grounding assembly, the first part 401 will move or deform in the gap H along the thickness direction of the display screen, and the gap H can be eliminated.

[0104] That is to say, when the flexible circuit board 40 is in the initial state (i.e. the state when it is not assembled with other components), that is, when the first part 401 is not in abutment with the second end 203, the surface of the first part 401 facing the display screen and the surface of the second part 402 facing the display screen have a preset distance. When the flexible circuit board 40 is in the assembled state, the first part 401 moves in the gap H formed under the elastic force of the grounding assembly along the thickness direction of the display screen until it is in abutment with the display screen.

[0105] Since the first part 401 and the display screen have the gap H, the abutment force between the first part 401 and the display screen is only provided by the grounding assembly, which is good in controllability and facilitates the design of the size parameters and the elastic force of the grounding assembly. In addition, the existence of the gap H can offset the errors generated in the processes of processing and assembly, so as to avoid causing or aggravating the film printing problem. If no gap H is provided between the first part 401 and the display screen, and if there is an error in the process of processing and assembling the layers of the flexible circuit board 40, the surface of the first part 401 facing the display screen can be closer to the display screen than the surface of the second part 402 facing the display screen. After the flexible circuit board 40 is attached to the display screen, the first part 401 will exert a certain pressure on the local display screen, which will affect the film printing.

[0106] Figure 8 FIG. 2 is a working state diagram of the flexible circuit board 40 provided by the embodiment of the present application, Figure 9 FIG. 3 is another working state diagram of the flexible circuit board 40 provided by the embodiment of the present application. As shown in Figure 8 , Figure 9As shown, when the grounding assembly exerts a force on the first part 401, the first part 401 can move relative to the second part 402 towards the display screen, and finally contact the display screen and abut against the display screen under the elastic force of the grounding assembly, to realize reliable electrical connection between the first part 401 and the display screen.

[0107] In some embodiments, as shown in Figure 8 As shown, under the elastic force of the grounding assembly, the first part 401 deforms, the first part 401 is a curved surface, and the first part 401 abuts against the conductive layer 102.

[0108] In some other embodiments, as shown in Figure 9 As shown, under the elastic force of the grounding assembly, the first part 401 deforms, the first part 401 is a curved surface, and the curved surface is bent towards the grounding assembly, and the first part 401 abuts against the conductive layer 102.

[0109] In some embodiments, a connecting part can be arranged between the second part 402 and the conductive layer 102, and / or between the connecting part 1010 and the conductive layer 102, to generate the gap H.

[0110] For example, referring to Figures 7-9 As shown, the display module further includes a first connecting part 501 arranged on the side of the first shielding layer 4003 close to the display screen, for bonding the second part 402 to the display screen (for example, specifically the conductive layer 102), and the first connecting part 501 is used to generate a preset distance between the first part 401 and the conductive layer 102, for example, to generate the gap H between the first part 401 and the conductive layer 102.

[0111] In some embodiments, the first connecting part 501 can also be referred to as an adhesive, and the adhesive can be made of a low modulus material, which is beneficial to reduce the difficulty of the display screen downstroke. For example, the material of the first connecting part 501 can be optical glue, double-sided grid glue or insulating foam glue, etc. For example, the adhesive material of the first connecting part 501 can be selected as a low modulus adhesive material with a modulus less than 150 Kpa, for example, a foam adhesive.

[0112] The embodiments of the present application do not limit the size of the first connecting part 501. In some embodiments, the thickness of the first connecting part 501 is less than or equal to 0.15 mm, which reduces the step height formed by the first connecting part 501 on the conductive layer, and the height of the gap H between the first part 401 and the conductive layer 102 is less than or equal to 0.15 mm, so that the elastic member is more easily deformed to contact the conductive layer.

[0113] In some embodiments, the display module further comprises a connecting layer 502 and a supporting layer 70 which are stacked and arranged between the connecting portion 1010 and the conductive layer 102, the connecting layer 502 is connected with the conductive layer 102, and the supporting layer 70 is arranged between the connecting portion 1010 and the connecting layer 502. The connecting layer 502 and the supporting layer 70 can be used to generate a preset distance between the first portion 401 and the conductive layer 102, for example, to generate a gap H between the first portion 401 and the conductive layer 102.

[0114] The material of the connecting layer 502 is not limited in the embodiments of the present application. In some embodiments, the connecting layer 502 can be double-sided adhesive tape, which is used to connect the supporting layer 70 and the conductive layer 102.

[0115] The stack structure of the flexible circuit board 40 is not limited in the embodiments of the present application. In some embodiments, the flexible circuit board 40 comprises at least one metal layer.

[0116] Reference Figure 10 The flexible circuit board 40 can comprise a metal layer 41, a substrate 42 and a metal layer 43 which are stacked and arranged, the metal layer 41 and the metal layer 43 are respectively arranged on both sides of the substrate 42 in the thickness direction of the display screen, for example, the metal layer 41 is arranged on the side of the substrate 42 close to the display screen, and the metal layer 43 is arranged on the side of the substrate 42 away from the display screen.

[0117] In the embodiments, the substrate 42 can be used to support the metal layer 41 and the metal layer 43.

[0118] The metal layer 41 comprises a first sub-region 41A arranged in the first portion and a second sub-region 41B arranged in the second portion. The substrate 42 comprises a first sub-region 42A arranged in the first portion and a second sub-region 42B arranged in the second portion. The metal layer 43 comprises a first sub-region 43A arranged in the first portion and a second sub-region 43B arranged in the second portion.

[0119] In some embodiments, the first portion 401 comprises a first sub-region 41A of the metal layer 41, a first sub-region 42A of the substrate 42 and a first sub-region 43A of the metal layer 43 which are stacked and arranged. The first sub-region 43A of the metal layer 43 is used to be electrically connected with the ground assembly.

[0120] The stack structure design of the first portion 401 can improve the strength and stability of the flexible circuit board 40 while ensuring the conductive performance of the flexible circuit board 40.

[0121] In some embodiments, reference Figure 10As shown, the first portion 401 can further include a plating layer 4001 and a plating layer 4002. The plating layer 4001 is disposed on the first sub-region 41A of the metal layer 41 close to the display screen, and the plating layer 4002 is disposed on the fifth portion of the metal layer 43 close to the grounding component. The plating layer 4001 and the plating layer 4002 are used to improve the performance of the flexible circuit board 40, such as at least one of the anti-corrosion performance, the wear resistance, the electrical conductivity, or the hardness.

[0122] For example, the plating layer 4001 and / or the plating layer 4002 can include at least one of a gold plating layer, a nickel plating layer, or a silver plating layer. The silver plating layer can improve the electrical conductivity of the flexible circuit board 40. The nickel plating layer can improve the anti-corrosion performance and the wear resistance of the flexible circuit board 40. The gold plating layer can improve the contact impedance and the electrical conductivity.

[0123] The embodiments of the present application do not limit the thickness of the plating layer. For example, the thickness of the plating layer is greater than or equal to 4 μm.

[0124] The second portion 402 and the first portion 401 each include, for example, the metal layer 41, the substrate 42, and the metal layer 43 which are stacked. For example, the second portion 402 includes the second sub-region 41B of the metal layer 41, the second sub-region 42B of the substrate 42, and the second sub-region 43B of the metal layer 43 which are stacked.

[0125] In some embodiments, the second portion further includes other stacked structures. For example, the second portion 402 can further include a metal layer 44 and a metal layer 45 which are stacked. Figure 10 As shown, the second portion 402 further includes the substrate 44 and the metal layer 45 which are stacked. The substrate 44 is disposed on the second sub-region 43B of the metal layer 43 away from the display screen, and the metal layer 45 is disposed on the substrate 44 away from the display screen.

[0126] In some embodiments, the second portion 402 includes a first sub-portion 402A and a second sub-portion 402B, and one of the conductive layers 102 in the connecting portion 1010 and the second sub-portion 402B is connected.

[0127] In some embodiments, the first sub-portion 402A further includes a first shielding layer 4003 which is disposed on the first sub-portion 402A close to the display screen.

[0128] In other embodiments, the second portion 402 further includes a second shielding layer which is disposed on the second portion close to the grounding component. The first shielding layer 4003 and the second shielding layer can play a protective role or cover the subsequent surface treatment.

[0129] Of course, in some embodiments, the second portion 402 can include one of the first shielding layer 4003 and the second shielding layer.

[0130] As shown in Figure 10 The first sub-part 402A includes: the first shielding layer 4003, the second sub-region 41B of the metal layer 41, the second sub-region 42B of the substrate 42, the second sub-region 43B of the metal layer 43, the first sub-region 44A of the substrate 44, and the first sub-region 45A of the metal layer 45, which are stacked.

[0131] The second sub-part 402B includes: the third sub-region 41C of the metal layer 41, the third sub-region 42C of the substrate 42, the third sub-region 43C of the metal layer 43, the second sub-region 44B of the substrate 44, and the second sub-region 45B of the metal layer 45, which are stacked. The third sub-region 41C of the metal layer 41 is not provided with a shielding layer on the surface, and the connecting part 1010 can be connected with the third sub-region 41C of the metal layer 41.

[0132] In this way, the processing requirement of the flexible circuit board 40 is low, and since the number of layers of the first part 401 is less than the number of layers of the second part 402, the local thinning of the flexible circuit board 40 is realized, the space saved can provide space for the working height of the grounding component, which is beneficial to reduce the thickness of the whole machine, and the inner cavity of the electronic device is large.

[0133] The thickness of the first part 401 is not limited in the embodiments of the present application. In some embodiments, the thickness of the first part ranges between 0.05-0.15mm. For example, the thickness of the first part is 0.1mm.

[0134] In some embodiments, the material of the first shielding layer 4003 and the second shielding layer can be an electromagnetic shielding (EMI) layer and a solder resist ink. By providing the shielding layer, the interference between the metal traces of different regions of the metal layer can be reduced, and the electromagnetic shielding performance can be improved.

[0135] In the above embodiments, the metal layer 41 and the metal layer 43 can be a single-layer structure or a multi-layer structure. For example, the metal layer 41 adopts a double-layer structure, and the metal layer 41 includes: a copper-clad layer provided on the substrate 42, and a metal plating layer provided on the copper-clad layer. The present application is not limited thereto. Alternatively, the flexible circuit board 40 can include the metal layer 41 or the metal layer 43.

[0136] The thickness of the copper-clad layer is greater than or equal to 6um, and the metal plating layer can be a copper plating layer, and the thickness of the copper plating layer is greater than or equal to 11um.

[0137] In some embodiments, the material of the substrate 42 mentioned above may include at least one of polyimide (PI), TPU, polypropylene, PET, or polyvinylidene fluoride. The materials of the substrate 42 and the support layer 70 may be the same or different; this application does not limit this.

[0138] In some embodiments, such as Figure 11 As shown, the circuit board may further include: a connection layer 46, a metal layer 47, and a substrate 48 stacked together, wherein the connection layer 46 is disposed below the substrate 42 and the substrate 48 is disposed above the metal layer 43.

[0139] Both the second part 402 and the first part 401 include, for example, a metal layer 41, a substrate 42, a connecting layer 46, a metal layer 47, a substrate 48, and a metal layer 43 stacked together.

[0140] The material of the connecting layer 46 is not limited in this application embodiment. In some implementations, the connecting layer 46 can be an adhesive to connect the substrate 42 and the metal layer 47.

[0141] The metal layer 41 includes a first sub-region 41A disposed in the first portion and a second sub-region 41B disposed in the second portion. The substrate 42 includes a first sub-region 42A disposed in the first portion and a second sub-region 42B disposed in the second portion. The connecting layer 46 includes a first sub-region 46A disposed in the first portion and a second sub-region 46B disposed in the second portion. The metal layer 47 includes a first sub-region 47A disposed in the first portion and a second sub-region 47B disposed in the second portion. The substrate 48 includes a first sub-region 48A disposed in the first portion and a second sub-region 48B disposed in the second portion. The metal layer 43 includes a first sub-region 43A disposed in the first portion and a second sub-region 43B disposed in the second portion.

[0142] like Figure 11 As shown, the first part 401 includes: a first sub-region 41A of a metal layer 41, a first sub-region 42A of a substrate 42, a first sub-region 46A of a connecting layer 46, a first sub-region 47A of a metal layer 47, a first sub-region 48A of a substrate 48, and a first sub-region 43A of a metal layer 43.

[0143] The second part 402 includes: a first sub-part 402A and a second sub-part 402B, wherein the connecting part 1010 and a conductive layer 102 in the second sub-part 402B are connected.

[0144] The first sub-part 402A includes: the second sub-region 41B of the metal layer 41, the second sub-region 42B of the substrate 42, the second sub-region 46B of the connecting layer 46, the second sub-region 47B of the metal layer 47, the second sub-region 48B of the substrate 48, the second sub-region 43B of the metal layer 43, the first sub-region 44A of the substrate 44 and the first sub-region 45A of the metal layer 45, which are stacked.

[0145] The second sub-part 402B includes: the third sub-region 41C of the metal layer 41, the third sub-region 42C of the substrate 42, the third sub-region 46C of the connecting layer 46, the third sub-region 47C of the metal layer 47, the third sub-region 48C of the substrate 48, the third sub-region 43C of the metal layer 43, the second sub-region 44B of the substrate 44 and the second sub-region 45B of the metal layer 45, which are stacked.

[0146] In some embodiments, the connecting part 1010 includes: a third part 1011 and a fourth part 1012, which are sequentially connected, the third part 1011 is stacked with the second part 402, and the fourth part 1012 is connected with the display screen. For example, the third part 1011 is arranged at the side of the second part 402 close to the display screen and is connected with the second part 402.

[0147] In order to improve the electrical connection performance of the first part 401. In some embodiments, a via hole 4010 can be arranged in the first part 401, under the action of the via hole 4010, the metal layer 41 and the metal layer 43 are in conduction, and then the ground assembly is electrically connected with the conductive layer 102 through the first part 401.

[0148] In some embodiments, the resistance between the upper and lower surfaces of the first part 401 provided with the via hole can be detected, and the resistance between the upper and lower surfaces is less than or equal to 1 ohm, for example, which can realize stable and good electrical signal conduction.

[0149] The length of the via hole 4010 in the first part 401 is not limited in the embodiments of the present application. In some embodiments, the first part 401 includes an insulating layer, for example, the substrate 42, the connecting layer 46 and the substrate 48 are all insulating layers, and the via hole 4010 penetrates all the insulating layers of the first part 401 in the thickness direction of the display screen.

[0150] The following is described by taking the structure that the first part 401 includes three metal layers as an example.

[0151] In some embodiments, as Figure 12As shown, the via 4010 is a through hole that penetrates the plating layer 4001, the first sub-region 41A of the metal layer 41, the first sub-region 42A of the substrate 42, the first sub-region 46A of the connecting layer 46, the first sub-region 47A of the metal layer 47, the first sub-region 48A of the substrate 48, the first sub-region 43A of the metal layer 43, and the plating layer 4002. In this embodiment, the via 4010 penetrates the entire first portion 401 in the thickness direction of the display screen. When the grounding component abuts against the plating layer 4002, the grounding component can be connected to the via 4010 through the plating layer 4002 and to the plating layer 4001 through the via 4010.

[0152] In other embodiments, such as Figure 13 As shown, the via 4010 is a blind via. The via 4010 penetrates the first sub-region 42A of the substrate 42, the first sub-region 46A of the connecting layer 46, the first sub-region 47A of the metal layer 47, the first sub-region 48A of the substrate 48, the first sub-region 43A of the metal layer 43, and the plating layer 4002. When the grounding component comes into contact with the plating layer 4002, the grounding component can be connected to the via 4010 through the plating layer 4002, and can also be connected to the metal layer 41 and the plating layer 4001 through the via 4010.

[0153] In some embodiments, in order to improve the compression resistance and film printing resistance of the first portion 401, a reinforcing plate 4005 may also be provided on the first portion 401.

[0154] For example, such as Figure 14 , Figure 15 As shown, the first part 401 also includes a reinforcing plate 4005, which is disposed on the side of the first part 401 away from the display screen 100.

[0155] This application embodiment does not limit the connection method between the reinforcing plate 4005 and the first part 401. In some embodiments, such as Figure 14 As shown, the reinforcing plate 4005 is connected to the plating layer 4002 via conductive adhesive 4004. The conductive adhesive 4004 can be a thermosetting adhesive, which can be cured through a chemical reaction. In this embodiment, the conductive adhesive 4004 is a thermosetting adhesive; referring to the structure using pressure-sensitive adhesive, this can better improve the stability of the radio frequency electrical connection.

[0156] In other embodiments, the reinforcing plate 4005 can be connected to the plating 4002 via surface mount technology (SMT), for example, by soldering. Figure 15As shown, a welding layer 4007 is arranged between the reinforcing plate 4005 and the plating layer 4002, and the reinforcing plate 4005 can be welded to the plating layer 4002 through the welding layer 4007. In some embodiments, the material of the welding layer 4007 is tin.

[0157] The material of the reinforcing plate is not limited in the embodiments of the present application. In some embodiments, the material of the reinforcing plate includes copper or stainless steel. The stainless steel can be a low magnetic type, such as SUS316.

[0158] In the embodiments, the reinforcing plate and the first part are connected by welding, which can be used in the scheme that the via hole is a blind hole, and the material of the welding layer does not contaminate the surface of the first part after being heated.

[0159] In some embodiments, in order to further improve the electrical conductivity of the first part 401, a plating layer 4006 can be arranged on the reinforcing plate 4005, and the plating layer 4006 is arranged on the side of the reinforcing plate 4005 away from the display screen 100.

[0160] In some embodiments, the first sub-region 43A of the metal layer 43 can be etched to form metal lines, which can improve the bending performance of the first part 401. For example, the first sub-region 43A of the metal layer 43 includes a plurality of first metal lines 43A1 arranged in a first direction, and the first sub-region 47A of the metal layer 47 includes a plurality of second metal lines 47A1 arranged in a second direction. The projection of the first metal line 43A1 on the substrate and the projection of the second metal line 47A1 on the substrate overlap in the region 4011.

[0161] The angle between the first direction and the second direction is not limited in the embodiments of the present application, as long as the projection of the first metal line on the substrate and the projection of the second metal line on the substrate have an overlapping region. In some embodiments, the first direction and the second direction are parallel.

[0162] In some embodiments, the first direction and the second direction intersect. For example, the projection of the first metal line 43A1 on the substrate and the projection of the second metal line 47A1 on the substrate form a grid shape.

[0163] For example, the first direction and the second direction are perpendicular, and the plurality of first metal lines 43A1 and the plurality of second metal lines 47A1 are arranged in a cross shape. Figure 16 As shown, the first direction is parallel to the y direction, and the second direction is parallel to the x direction.

[0164] In some embodiments, in order to improve the electrical connection performance of the first part 401, the via hole 4010 can be arranged at the intersection position of the metal lines. For example, the projection of the via hole 4010 on the substrate and the region 4011 have an overlapping region.

[0165] With reference to the structure shown in FIG. 1, the first sub-region 43A of the metal layer 43 includes a plurality of first metal lines 43A1 arranged along a first direction, and the first sub-region 47A of the metal layer 47 includes a plurality of second metal lines 47A1 arranged along a second direction. The projection of the first metal lines 43A1 on the substrate and the projection of the second metal lines 47A1 on the substrate overlap in the region 4011. The first direction and the second direction are perpendicular, and the plurality of first metal lines 43A1 and the plurality of second metal lines 47A1 are arranged in a cross manner. Figure 13 With reference to the structure shown in FIG. 1, the first sub-region 43A of the metal layer 43 includes a plurality of first metal lines 43A1 arranged along a first direction, and the first sub-region 47A of the metal layer 47 includes a plurality of second metal lines 47A1 arranged along a second direction. The projection of the first metal lines 43A1 on the substrate and the projection of the second metal lines 47A1 on the substrate overlap in the region 4011. The first direction and the second direction are perpendicular, and the plurality of first metal lines 43A1 and the plurality of second metal lines 47A1 are arranged in a cross manner. Figure 16 With reference to the structure shown in FIG. 1, the first sub-region 43A of the metal layer 43 includes a plurality of first metal lines 43A1 arranged along a first direction, and the first sub-region 47A of the metal layer 47 includes a plurality of second metal lines 47A1 arranged along a second direction. The projection of the first metal lines 43A1 on the substrate and the projection of the second metal lines 47A1 on the substrate overlap in the region 4011. The first direction and the second direction are perpendicular, and the plurality of first metal lines 43A1 and the plurality of second metal lines 47A1 are arranged in a cross manner.

[0166] The first portion 401 further includes a plurality of vias 4010, and the projection of the vias 4010 on the substrate overlaps the region 4011.

[0167] In the embodiment, the first portion 401 of the flexible circuit board 40 adopts a line-shaped distribution of woven nets of different layers of metal, which can disperse stress, is conducive to reducing film printing, and can also provide sufficient conduction area. By arranging the vias 4010 in the first portion 401, conduction of different layers can be achieved.

[0168] The number of the vias 4010 is not limited in the embodiments. In some embodiments, the first portion includes a plurality of vias 4010, and the plurality of vias 4010 are arranged in an array. The vias 4010 arranged in an array can be referred to as a via comb, and the number of the vias 4010 is greater than or equal to 6. For example, the cross-sectional length of the first portion is 2.5 mm, the width is 2.5 mm, and the number of the vias 4010 ranges from 9 to 16.

[0169] The line width of the first metal lines 43A1 and the second metal lines 47A1 is not limited in the embodiments. In some embodiments, the elastic connection region of the grounding assembly is within the range of the overlapping region of the projections of the first metal lines 43A1 and the second metal lines 47A1, which improves the stability of electrical connection.

[0170] The shape of the first portion 401 is not limited in the embodiments. In order to further reduce film printing, in some embodiments, the shape of the first portion 401 can be adjusted so that all the corners on the first portion 401 are rounded corners.

[0171] For example, the cross-sectional length of the first portion is 2.5 mm, the width is 2.5 mm, and the radius of the rounded corner is greater than or equal to 0.5 mm, so as to avoid the generation of sharp points on the surface of the conductive layer.

[0172] For example, Figure 17 A top view of the first portion 401 of the flexible circuit board 40 provided in the embodiments is shown in FIG. 1. As shown in FIG. 1, Figure 17As shown, the top view of the first part 401 includes: a first side 401a and a second side 401b, and the included angle between the first side 401a and the second side 401b is a rounded corner.

[0173] In some embodiments of this application, the first portion 401 includes a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface. The top surface is the surface of the first portion 401 adjacent to the display screen 100. The top surface may be, for example, made of a material such as... Figure 17 The bottom surface is the surface of the first portion 401 facing away from the display screen 100. In some embodiments, the shape of the bottom surface is the same as the shape of the surface of the first portion 401 near the display screen 100, for example, both adopting the shape shown. Figure 17 The shape shown.

[0174] When the flexible circuit board 40 is in operation, the first part 401 abuts against the conductive layer 102 under the action of the grounding component. The top surface of the first part 401 abuts against the conductive layer 102. The top surface includes multiple side edges, and the included angle between two adjacent side edges is rounded. In this way, the rounded corner design can effectively reduce film printing.

[0175] Figure 18 This is a cross-sectional schematic diagram of the first portion 401 of the flexible circuit board 40 provided in an embodiment of this application. Figure 18 As shown, the first portion 401 includes a third sub-portion 4012, a fourth sub-portion 4013, and a fifth sub-portion 4014 connected sequentially in a direction away from the second portion. The width of the fourth sub-portion 4013 is smaller than the width of the third sub-portion 4012, and the width of the fourth sub-portion 4013 is smaller than the width of the fifth sub-portion 4014. Therefore, the fourth sub-portion has a smaller width, better bending performance, and can better adhere to the conductive layer, improving the stability of the electrical connection.

[0176] In some embodiments, such as Figure 9 As shown, the display module also includes a second connecting portion 503. The fifth sub-part 4014 is connected to the conductive layer 102 via the second connecting portion 503. The second region is used to abut against the conductive layer under the elastic force generated by the elastic member. The material of the third connecting portion 503 can be referred to the description of the first connecting portion 501, and will not be repeated here.

[0177] For example, see Figure 18 The first portion 401 has an I-shaped cross-section. The third sub-part 4012 has a width of d1 along the x-direction, the fourth sub-part 4013 has a width of d2 along the x-direction, and the fifth sub-part 4014 has a width of d3 along the x-direction, where d2 is less than d1 and d2 is less than d3. Therefore, the fourth sub-part has a smaller width, better bending performance, and can better fit with the conductive layer, improving the stability of the electrical connection.

[0178] The embodiments of the present application also provide an electronic device, as shown in Figure 19 The electronic device includes a display module and a grounding assembly. The display module is as shown in Figures 7-9 The grounding assembly includes an elastic member 20 and a metal member 30. The elastic member 20 is arranged between the display screen 100 and the metal member 30.

[0179] The embodiments of the present application do not limit the structure of the electronic device. In some embodiments, as shown in Figure 2 The electronic device further includes a housing 12, which is arranged opposite to the display screen 100. The flexible circuit board 40, the elastic member 20 and the metal member 30 are arranged between the housing 12 and the display screen 100, and the electrically conductive connection area can be arranged on the flexible circuit board connected to the display screen 100 as shown in Figure 2

[0180] In some embodiments, the electronic device adopts a double-sided screen structure as shown in Figure 3 The electronic device includes a first display screen 200 and a second display screen 300. The second display screen 300 is a flexible screen that can be folded or unfolded along a folding axis. The first display screen 200 is arranged opposite to the second display screen 300. The flexible circuit board 40, the elastic member 20 and the metal member 30 are arranged between the first display screen 200 and the second display screen 300. The electrically conductive connection area can be arranged on the flexible circuit board connected to the first display screen 200 as shown in Figure 3 The embodiments are described by taking the display screen 100 and the flexible circuit board as shown in Figure 2

[0181] In some embodiments, the elastic member 20 includes a first end 201, a second end 203 and a deformation section 202 between the first end 201 and the second end 203. The first end 201 is connected to the metal member 30. The second end 203 is in abutment with the first part 401 under the elastic force generated by the deformation section 202, so as to electrically connect the elastic member 20 and the conductive layer 102.

[0182] In some embodiments, the second end 203 is in point contact with the first part 401, and the first part 401 is in surface contact with the display screen.

[0183] ​​In this embodiment, the display screen is electrically connected to the flexible circuit board 40, and the elastic element 20 is electrically connected to the metal element 30. Under the elastic force of the elastic element 20, the first part 401 of the flexible circuit board 40 can be reliably electrically connected to the elastic element 20, thereby achieving a reliable electrical connection between the display screen and the metal element 30. The flexible circuit board 40 can be a flexible circuit board functional device of the display screen. Designing an electrically connected conductive area with the elastic element 20 on the original flexible circuit board frame simplifies the design, reduces production costs, and ensures stable electrical connection. It can perform radio frequency grounding and signal conduction for conductive materials such as the screen, reducing the impact of charge on antenna signals and display performance.

[0184] Meanwhile, compared to conductive foam, the elastic element 20 has a smaller working height and contact area, occupying less space, which helps reduce the overall thickness and improve the layout space of components within the electronic device, thus increasing space utilization. Furthermore, the first part 401 of the circuit board assembly can distribute the elastic force of the elastic element 20 across the surface, reducing or avoiding screen printing problems, thereby improving screen reliability. Moreover, the display screen electrical connection solution provided in this application embodiment has a simple structure and low cost.

[0185] Figure 22 This is a schematic diagram of the structure of an elastic element 20 provided in an embodiment of this application, as shown below. Figure 22 As shown, the elastic element 20 includes a first end 201, a second end 203, and a deformation segment 202. The deformation segment 202 is located between the first end 201 and the second end 203 and can undergo elastic deformation. In some embodiments, the deformation segment 202 is a curved sheet, which can store and release energy by bending when an external force is applied to it. For example, the shape of the deformation segment 202 can be arc-shaped. In this embodiment, the first end 201 is a fixed end, the second end 203 is a free end, and the deformation segment 202 can undergo elastic deformation. Therefore, the elastic element 20 has a single cantilever design, which can ensure the stability of the electrical connection.

[0186] In some embodiments, the surface of the second end 203 facing the display screen includes an arc surface that protrudes towards the display screen. When the second end 203 abuts against the first portion 401, it is actually the arc surface that contacts the first portion 401. The arc surface design ensures the reliability of the electrical connection between the second end 203 and the first portion 401.

[0187] In some embodiments, the second end 203 includes at least a portion of a sphere. Exemplarily, the second end 203 is spherical or hemispherical.

[0188] In some embodiments, the first end 201 includes a welding portion for welding to the metal part 30.

[0189] The elastic element 20 provided in this application embodiment occupies a significantly smaller dimension in the thickness direction of the display screen, which is beneficial for reducing the overall thickness of the device. The elastic element 20 provided in this application embodiment also significantly reduces the top force on the screen, which helps improve film printing issues and reduces the risk of screen delamination. Furthermore, electrical connections to the display screen generally require multiple grounding points. If conductive foam is used to electrically connect the display screen, to prevent the screen from detaching, the adhesive area and glue application area need to be widened to hold the screen in place, which leads to an increase in the black border of the screen. However, by using the elastic element 20 provided in this application to electrically connect the display screen, the top force generated by the elastic element 20 is small, which can greatly reduce the risk of screen delamination, improve screen reliability, improve the black border of the screen, and enhance the overall competitiveness of the device.

[0190] In addition, since the top screen force generated by the elastic element 20 is relatively small, it is beneficial to design a thinner display screen while ensuring screen reliability, such as reducing the thickness and / or number of display screen layers, so as to achieve a thinner and lighter design for electronic devices.

[0191] Figure 20 This is a schematic diagram of the working state of a flexible circuit board 40 provided in an embodiment of this application. Figure 21 This is a schematic diagram illustrating the working state of another flexible circuit board 40 provided in an embodiment of this application. Figure 20 , Figure 21 As shown, when the second end 203 of the elastic member 20 applies a force to the first part 401, the first part 401 can move relative to the second part 402 towards the display screen, eventually coming into contact with the display screen and abutting against the display screen under the elastic force of the elastic member 20, thus achieving a reliable electrical connection between the first part 401 and the display screen.

[0192] In some embodiments, such as Figure 20 As shown, under the elastic force of the elastic element 20, the first part 401 deforms. The first part 401 is an arc surface and abuts against the conductive layer 102.

[0193] In other embodiments, such as Figure 21 As shown, under the elastic force of the elastic member 20, the first part 401 deforms. The first part 401 is a curved surface, and the bending direction of the curved surface is towards the metal member 30. The first part 401 abuts against the conductive layer 102.

[0194] This application does not limit the number of electrically conductive areas used for grounding in the flexible circuit board. Multiple electrically conductive areas can be provided on the flexible circuit board. For example, such as... Figure 23 As shown, the flexible circuit board 40 has two electrical connection conductive areas: a first electrical connection conductive area 401A and a second electrical connection conductive area 401B.

[0195] The metal piece 30 can be of various types. As an example, the metal piece 30 can be a shielding cover. The shielding cover can be used to protect internal components of an electronic device from external radiation and interference. In some embodiments, the shielding cover can be disposed on and electrically connected to a circuit board. Since the elastic piece 20 has a small working height requirement, the use of the elastic piece 20 on the shielding cover can improve the utilization of the circuit board.

[0196] As another example, the metal piece 30 can be a middle frame, for example Figure 1 the middle frame shown in FIG. 1.

[0197] In some embodiments, the lower surface of the conductive layer 102, the lower surface of the first portion 401, the elastic piece 20, and the middle frame collectively define a cavity.

[0198] In the embodiments of the present application, there are various assembly methods for the display screen electrical connection scheme.

[0199] As an example, the elastic piece 20 can be connected (e.g., welded) to the metal piece 30 (e.g., the shielding cover, the middle frame, etc.), and the flexible circuit board 40 can be connected (e.g., by adhesive or insulating foam) to the display screen, for example, the first sub-portion of the second portion 402 of the flexible circuit board 40 is connected to the layer (e.g., SCF layer, VC layer, or stainless steel layer, etc.) of the display screen closest to the circuit board, and the connection portion of the display screen is connected to the second sub-portion of the second portion of the flexible circuit board 40, for example, the metal layers of the third portion of the connection portion and the second sub-portion are stacked and connected. Then, the display screen connected with the flexible circuit board 40 and the metal piece 30 connected with the elastic piece 20 are assembled together, and the second end 203 of the elastic piece 20 abuts against the first portion 401 (e.g., the central region of the first portion 401) of the flexible circuit board 40. Since the first portion 401 is in contact with or has a small gap with the display screen, under the elastic force of the elastic piece 20, the second end 203 exerts a force on the first portion 401 to deform the first portion 401 and abut against the display screen, thereby forming a complete electrical connection scheme.

[0200] In some embodiments, the display screen can be a flexible screen (i.e., the screen can be bent and folded), or a rigid screen (i.e., the screen cannot be bent and folded).

[0201] The embodiment of the present application provides a display module and an electronic device, the electronic device comprises a middle frame, and the display module is connected with the middle frame. The display module comprises a first display screen and a flexible circuit board, and the flexible circuit board can be a functional device of the display screen; the first display screen comprises a display layer and a conductive layer which are arranged in a stack, and the conductive layer is arranged on a side of the display layer away from a light-out surface; the display layer comprises a display panel and a connecting portion connected with the display panel; the flexible circuit board comprises a first portion and a second portion connected with each other, and the connecting portion is connected with the second portion; the first portion of the flexible circuit board can be used as an electrically connected conductive area, and the first portion is used for abutting against the conductive layer under the elastic force of a grounding assembly to electrically connect the grounding assembly and the conductive layer, so that the first display screen is grounded. Wherein, the first portion of the circuit board assembly can disperse the elastic force of the grounding assembly to the surface, which can reduce or avoid the screen film printing problem, thereby improving the reliability of the screen. In this way, the flexible circuit board can not only be used as a functional device of the display screen, but also be used for grounding the display screen, the reuse of the flexible circuit board is realized, the design scheme of the electric connection is simplified, the production cost is reduced, the electric connection function is stable, the radio frequency grounding and signal dredging of the conductive material such as the screen can be realized, and the influence of the electric charge on the antenna signal and the display performance of the display screen is reduced.

[0202] In some embodiments, the first portion comprises a metal layer and a substrate, the second portion has more layers, a via hole can be arranged on the first portion, the via hole at least passes through the insulating layer of the first portion, and the surface of the first portion and the metal layer of the ground can be conductive under the action of the via hole, so that the grounding assembly can be electrically connected with the conductive layer through the metal layer of the first portion.

[0203] In some embodiments, the electronic device further comprises a first connecting portion, the second portion is connected with the conductive layer through the first connecting portion, and the first connecting portion is used for generating a gap between the first portion and the conductive layer; the gap is used for the movement of the first portion in the gap along the thickness direction of the first display screen under the elastic force of the elastic member until the abutment with the conductive layer. Thus, the gap is arranged between the first portion and the display screen, so that the abutment force between the first portion and the display screen is only provided by the grounding assembly, the controllability is good, and the size parameters and the elastic force of the grounding assembly are convenient to design. In addition, the existence of the gap can offset the errors generated in the processes such as processing and assembly, and the film printing problem can be avoided or aggravated.

[0204] The above merely describes the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A display module, characterized by The display module comprises: a first display screen and a flexible circuit board, the first display screen comprises a display layer and a conductive layer arranged in layers, the conductive layer is arranged on the side of the display layer away from the light-emitting surface, and the display layer comprises a display panel and a connecting portion connected to the display panel; the flexible circuit board comprises a first portion and a second portion connected to each other, the connecting portion is connected to the second portion, the first portion is in abutment with a grounding assembly, the grounding assembly comprises an elastic member and a metal member, the elastic member is arranged between the first display screen and the metal member, one end of the elastic member is connected to the metal member, and the other end of the elastic member is in abutment with the first portion; the first portion is used to abut against the conductive layer under the elastic force of the elastic member to electrically connect the conductive layer.

2. The display module of claim 1, wherein, The first portion comprises a plurality of side edges connected to each other, and the included angle between adjacent two side edges is a rounded angle.

3. The display module of claim 1 or 2, wherein, The first portion comprises a first metal layer, a first base material, a first connecting layer, a third metal layer, a second base material and a second metal layer arranged in layers, the first metal layer is arranged close to the first display screen, and the first portion comprises a via, and the first metal layer is connected to the second metal layer through the via.

4. The display module of claim 3, wherein, The via is a plurality of vias, and the plurality of vias are arranged in an array.

5. The display module of claim 3, wherein, The first metal layer comprises a plurality of first metal lines arranged in a first direction, the second metal layer comprises a plurality of second metal lines arranged in a second direction, the projection of the first metal line on the base material and the projection of the second metal line on the base material have an overlapping region, and the projection of the via on the base material overlaps with the overlapping region.

6. The display module of claim 5, wherein, The first direction and the second direction are parallel.

7. The display module of claim 5, wherein, The first direction and the second direction intersect.

8. The display module of claim 7, wherein, The projection of the first metal line on the base material and the projection of the second metal line on the base material are in a grid shape.

9. The display module of any of claims 1-2 or 4-8, wherein, The display module further comprises a first connecting portion, the second portion is connected to the conductive layer through the first connecting portion, the first connecting portion is used to generate a gap between the first portion and the conductive layer, and the gap is used for the first portion to move in the thickness direction of the first display screen in the gap under the elastic force of the elastic member until the first portion abuts against the conductive layer.

10. The display module of claim 9, wherein, The second portion comprises a first sub-portion and a second sub-portion connected to each other, the first sub-portion is connected to the first portion, the first connecting portion is arranged between the first sub-portion and the conductive layer, the second sub-portion is a metal layer close to one side of the first display screen, the connecting portion comprises a third portion and a fourth portion connected to each other, the third portion is arranged on the side of the second portion close to the first display screen, the second sub-portion and the third portion are arranged in layers, and the fourth portion is connected to the display layer; and the third portion is connected to the second portion.

11. The display module of claim 10, wherein, The second portion further comprises a shielding layer arranged between the first sub-portion and the first connecting portion.

12. The display module of claim 10, wherein, The display module further includes: a second connecting layer and a support layer disposed between the third part and the conductive layer, wherein the second connecting layer is connected to the conductive layer and the support layer is disposed between the second connecting layer and the third part.

13. The display module of any of claims 1-2, 4-8, 11, or 12, wherein, The first part includes a third sub-part, a fourth sub-part, and a fifth sub-part connected to each other. The third sub-part is connected to the second part. The display module also includes a second connecting part. The fifth sub-part is connected to the conductive layer through the second connecting part. The fourth sub-part is used to abut against the conductive layer under the elastic force generated by the elastic member.

14. The display module of claim 13, wherein, The width of the fourth sub-part is smaller than the width of the third sub-part, and the width of the fourth sub-part is smaller than the width of the fifth sub-part.

15. The display module of claim 14, wherein, The cross-sectional shape of the first part includes: I-shape.

16. The display module of any one of claims 1-2, 4-8, 11-12, 14, or 15, wherein, The first part further includes: a first coating and a second coating, wherein the first coating is disposed on the side of the first part closer to the first display screen, and the second coating is disposed on the side of the first part away from the first display screen.

17. The display module of claim 16, wherein, The first part further includes a reinforcing plate disposed on the side of the second coating away from the first display screen.

18. An electronic device, comprising: include: A grounding assembly and a display module as described in any one of claims 1-17, wherein the grounding assembly comprises: an elastic element and a metal element, the elastic element being disposed between the first display screen and the metal element; One end of the elastic element is connected to the metal element, and the other end abuts against the first part. The first part is used to abut against the conductive layer under the elastic force generated by the elastic element, so as to electrically connect the metal element and the conductive layer.

19. The electronic device of claim 18, wherein, The electronic device further includes a second display screen, which is a flexible screen that can be folded or unfolded along the folding axis. The first display screen and the second display screen are disposed opposite each other, and the elastic member and the metal member are disposed between the first display screen and the second display screen.

20. The electronic device of claim 18 or 19, wherein, The electronic device further includes a housing, which is disposed opposite to the first display screen, and the flexible circuit board, the elastic element, and the metal element are disposed between the housing and the first display screen.

21. The electronic device of claim 18 or 19, wherein, The electronic device further includes a mid-frame, which is disposed on a side away from the light-emitting surface of the first display screen, and the metal component is disposed on the mid-frame, or the mid-frame includes the metal component.

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