Semiconductor packaging patch device with adjustable suction nozzle

Abstract

The invention relates to the technical field of semiconductor processing equipment, and particularly discloses a semiconductor packaging patch device with an adjustable suction nozzle, which comprises a patch processing machine, the front surface of the patch processing machine is rotatably provided with a sealing door through a hinge rotating shaft, the left side of the interior of the patch processing machine is provided with a feeding port, and the right side of the interior of the patch processing machine is provided with a discharging port; two linear guide rails are fixed on the right side above the discharging port, a discharging control plate is arranged between the two linear guide rails in a sliding mode, the chip mounting auxiliary unit is fixed on the right side in the chip mounting processing machine and comprises a chip mounting bottom frame, and a linear sliding rail is fixed on the top of the chip mounting bottom frame. Through the synergistic effect of a plurality of steering motors and a servo electric cylinder, the angle and the height of a suction nozzle can be accurately adjusted to adapt to semiconductor packaging patches of different shapes and sizes, the two material suction frames are used for adsorbing and positioning the outer circumferential surfaces and the inner circumferential surfaces of the semiconductor packaging patches respectively, the adsorption stability is greatly improved, and the production efficiency is improved. And the deviation and falling risks of the element in the chip mounting process are reduced, so that the chip mounting precision is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and specifically refers to a semiconductor packaging and chip mounter with an adjustable nozzle. Background Art

[0002] In the field of semiconductor packaging, a semiconductor packaging and chip mounter is a key device for connecting chips to substrates. With the rapid development of semiconductor technology, higher requirements are put forward for the accuracy, efficiency of packaging and chip mounting, and the adaptability to different specifications of semiconductor components.

[0003] Traditional semiconductor packaging and chip mounters have many limitations. In terms of nozzles, most nozzle structures are fixed and it is difficult to adapt to semiconductor components of different shapes and sizes. For example, for irregularly shaped chips or chips with smaller sizes, fixed nozzles cannot accurately adsorb them, resulting in unstable adsorption. During the chip mounting process, the components are prone to shift or fall off, seriously affecting the packaging quality. Moreover, the nozzles usually lack the functions of angle and height adjustment, and it is difficult to meet the process requirements for components that require chip mounting at a specific angle; in the feeding link, many devices rely on manual feeding or simple mechanical feeding methods, which are inefficient and prone to problems such as inaccurate feeding positions. Manual feeding not only consumes manpower but also is likely to cause inconsistent feeding speeds due to human factors, affecting the overall production rhythm. Simple mechanical feeding devices cannot be flexibly adjusted according to the changes of components and are difficult to adapt to diverse production requirements; some devices do not have perfect pretreatment for semiconductor components. For example, when applying flux, it is impossible to ensure that the flux is evenly coated on the surface of the components, affecting the welding quality. At the same time, the temperature control in the preheating link may be inaccurate, and it is impossible to effectively reduce the surface tension of the solder, resulting in poor wetting and spreading effects of the solder on the chip mounting surface and the pads, forming defective solder joints. Summary of the Invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a semiconductor packaging and chip mounter with an adjustable nozzle to solve the above-mentioned technical defects.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: A semiconductor packaging and chip mounter with an adjustable nozzle, comprising: A chip mounting processing machine, on the front of which a closing door is rotatably arranged through a hinge shaft. An upper feeding port is arranged on the left side inside, and a discharging port is arranged on the right side. Two linear guide rails are fixed above the discharging port on the right side, and a discharging control board is slidably arranged between the two linear guide rails; An automatic feeding unit is arranged at the top of the inner wall of the chip mounter, including a displacement drive frame. A drive motor is fixed on one side of the displacement drive frame, and a linear lead screw is rotatably arranged inside. The output shaft of the drive motor is connected to one end of the linear lead screw through meshing transmission gears. A displacement block threadedly connected to the linear lead screw is slidably arranged inside the displacement drive frame; A pretreatment unit is fixed on the left side inside the chip mounter, including a coating rack whose bottom is fixedly connected to the bottom of the inner wall of the chip mounter. A preheating rack is fixedly arranged on the top of the coating rack. The preheating rack is internally communicated with the coating rack, and sealing plates are slidably arranged above the interiors of both of them through electric sliders. A coating roller is rotatably arranged inside the coating rack through a built-in motor, and an electric heating plate is arranged inside the preheating rack; A chip mounting auxiliary unit is fixed on the right side inside the chip mounter, including a chip mounting bottom rack. A linear slide rail is fixed on the top of the chip mounting bottom rack, and a positioning rack whose bottom is slidably connected to the top of the linear slide rail is slidably arranged on the top. Positioning blocks are slidably arranged around the top of the positioning rack through servo linear slides.

[0006] Further, a fixing block is fixed at the bottom of the displacement block. A connecting frame is rotatably arranged below the interior of the fixing block. A steering motor one is fixed on one side of the fixing block, and the output shaft of the steering motor one is fixedly connected to the upper part inside the connecting frame. A servo electric cylinder one is fixed inside the connecting frame. The bottom end of the driving shaft of the servo electric cylinder one is fixed with a mounting block. Steering motors two are fixed on both sides inside the mounting block, and the output shaft of each steering motor two is fixed with a rotating frame on one end. A servo electric cylinder two is fixed on one side of the rotating frame, and the bottom end of the driving shaft of the servo electric cylinder two is fixed with a movable frame.

[0007] Further, a helical gear one is fixed inside the movable frame. A rotating shaft with a helical gear two fixedly connected to one end and meshing with the tooth surface of the helical gear one is rotatably arranged around the interior of the movable frame. Limiting frames are fixed around the top of the inner wall of the movable frame. A suction material frame threadedly connected to the surface of the rotating shaft is slidably arranged at the bottom of the limiting frame. A rubber suction nozzle is movably arranged at the bottom of the suction material frame through a built-in servo micro electric cylinder.

[0008] Further, the sealing door is used to form a relatively enclosed processing environment during equipment operation, reduce external interference and provide safety protection.

[0009] Further, the coating roller is used to coat the flux on the surface of the semiconductor package chip, removing oxides on the surfaces of the chip and the substrate.

[0010] Further, the electric heating plate is used to preheat the semiconductor package chip to be processed by chip mounting, reducing the surface tension of the solder.

[0011] Further, the positioning blocks are used to position the semiconductor package chips placed on the top of the positioning rack, ensuring processing stability.

[0012] Furthermore, the first steering motor is used to control the front - and - back swing of the connecting frame to adjust the processing angle of the semiconductor package patch.

[0013] Furthermore, the second steering motor is used to control the horizontal rotation of the rotating frame to improve the flexibility of the processing angle of the semiconductor package patch.

[0014] Furthermore, the first servo cylinder and the second servo cylinder are respectively used to precisely control the positions of the mounting block and the movable frame in the vertical direction, and adjust the distance and height between the adsorption device and the semiconductor package patch.

[0015] The beneficial effects achieved by the present invention with the above - mentioned structure are as follows: 1. The adjustable nozzle structure of the present device, through the coordinated action of multiple steering motors and servo cylinders, can precisely adjust the angle and height of the nozzle to adapt to semiconductor package patches of different shapes and sizes. The two suction racks respectively adsorb and position the outer peripheral surface and the inner peripheral surface of the semiconductor package patch, greatly improving the adsorption stability, reducing the risk of component offset and dropping during the patching process, and thus significantly improving the patching accuracy.

[0016] 2. The automatic feeding unit can automatically adjust the position of the displacement block according to the signal of the feeding port to achieve automatic feeding operation for semiconductor package patches at different positions. The coating rack and the preheating rack of the pretreatment unit can perform flux coating and preheating treatment on different types of semiconductor package patches, and the closing plate can ensure the stability of the treatment environment. The positioning rack and the positioning block of the patching auxiliary unit can flexibly adjust their positions through the servo linear slide to adapt to semiconductor package patches of different sizes, enhancing the adaptability of the device to diverse production requirements.

[0017] 3. The feeding port can be connected to an automatic feeding device to achieve automatic feeding; the discharging port cooperates with a manipulator through a linear guide rail and a discharging control board to achieve automatic discharging. The entire processing process requires little manual intervention, reducing the manual operation time and greatly improving the processing efficiency of semiconductor package patching. In the pretreatment unit, the coating roller can evenly coat the flux on the surface of the semiconductor package patch, effectively removing oxides on the chip and substrate surfaces. The electric heating plate in the preheating rack can accurately control the preheating temperature, reducing the surface tension of the solder, enabling the solder to better wet and spread on the chip patching surface and the solder pads under the action of the flux, forming good solder joints and improving the welding quality and reliability. Description of the Drawings

[0018] The drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention. In the drawings: Figure 1 It is a schematic diagram of the structure of the semiconductor package patching device with an adjustable nozzle according to the embodiment of the present invention; Figure 2 It is a schematic diagram of the internal structure of the chip mounter in the embodiment of the present invention; Figure 3 It is a schematic diagram of the structure of the pretreatment unit in the embodiment of the present invention; Figure 4 It is a schematic diagram of the structure of the chip mounting auxiliary unit in the embodiment of the present invention; Figure 5 It is a schematic diagram of the structure of the automatic feeding unit in the embodiment of the present invention; Figure 6 It is a schematic diagram of the structures of the displacement block, fixed block and connecting frame in the embodiment of the present invention; Figure 7 It is a schematic diagram of the structures of the suction rack and rubber suction nozzle in the embodiment of the present invention; Figure 8 It is a schematic diagram of the structures of the connecting frame, mounting block and rotating frame in the embodiment of the present invention.

[0019] In the figure, 1. Chip mounter; 2. Enclosure door; 3. Loading port; 4. Discharge port; 5. Linear guide rail; 6. Discharge control board; 7. Automatic feeding unit; 8. Pretreatment unit; 9. Chip mounting auxiliary unit; 10. Displacement drive frame; 11. Linear lead screw; 12. Driving motor; 13. Displacement block; 14. Fixed block; 15. Steering motor 1; 16. Connecting frame; 17. Servo cylinder 1; 18. Mounting block; 19. Steering motor 2; 20. Rotating frame; 21. Servo cylinder 2; 22. Movable frame; 23. Adjusting motor; 24. Helical gear 1; 25. Rotating shaft; 26. Helical gear 2; 27. Limiting frame; 28. Suction rack; 29. Rubber suction nozzle; 30. Coating rack; 31. Coating roller; 32. Preheating rack; 33. Electric heating plate; 34. Enclosure plate; 35. Chip mounting base frame; 36. Positioning frame; 37. Positioning block; 38. Linear slide rail. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0022] Embodiment 1 Please refer to Figures 1 to 8 As shown, a semiconductor packaging and chip mounting device with an adjustable nozzle includes: A chip mounting processing machine 1, on the front of which a closing door 2 is rotatably arranged through a hinge shaft. The closing door 2 is rotatably arranged on the front of the chip mounting processing machine 1 through a hinge shaft. Its function is to form a relatively enclosed processing environment during the operation of the device, reduce the interference of external dust, impurities, etc. on the semiconductor packaging and chip mounting process, and at the same time play a certain role in safety protection, preventing operators from accidentally contacting the internal moving parts during the operation of the device; on the left side inside the chip mounting processing machine 1, there is a loading port 3, and on the right side inside the chip mounting processing machine 1, there is also an unloading port 4. Above the unloading port 4 on the right side of the chip mounting processing machine 1, two linear guide rails 5 are fixedly arranged, and an unloading control plate 6 is slidably arranged between the two linear guide rails 5; it should be noted that the loading port 3 is located on the left side inside the chip mounting processing machine 1 and is the channel for semiconductor packaging and chip mounting components to enter the device. In practical applications, the loading port 3 can be connected to an automatic loading device, such as a conveyor belt, a vibrating disk, etc., to realize the automatic loading of semiconductor packaging and chip mounting components and improve production efficiency. The unloading port 4 is located on the right side inside the chip mounting processing machine 1 and is used to send out the semiconductor packages that have completed the packaging and chip mounting processing from the device. The two linear guide rails 5 on the right side cooperate with the unloading control plate 6. By driving the unloading control plate 6 to lift upward through the linear guide rails 5, the right side of the unloading port 4 is opened, so that the unloading port 4 communicates with the outside of the chip mounting processing machine 1, facilitating the robot on the right side to take out the processed semiconductor packages. This design realizes the automatic processing and unloading of semiconductor packaging and chip mounting, reduces manual intervention, and improves production efficiency.

[0023] Perform the loading operation on the semiconductor packaging and chip mounting components through the loading port 3. After completing the packaging and chip mounting processing of the semiconductor inside the chip mounting processing machine 1, drive the unloading control plate 6 to lift upward through the two linear guide rails 5, open the right side of the unloading port 4, and use the unloading port 4 to connect the inside and outside of the chip mounting processing machine 1, so as to cooperate with the robot arranged on the right side of the chip mounting processing machine 1 to take out the semiconductor packages inside the chip mounting processing machine 1, thereby realizing the automatic processing of semiconductor packaging and chip mounting, without manual operation, and greatly improving the processing efficiency of semiconductor packaging and chip mounting.

[0024] Automatic feeding unit 7, an automatic feeding unit 7 is provided at the top of the inner wall of the chip mounter 1. The automatic feeding unit 7 includes a displacement driving frame 10. The displacement driving frame 10 is fixedly provided at the top of the inner wall of the chip mounter 1. And a driving motor 12 is fixedly provided on one side of the displacement driving frame 10. A linear lead screw 11 is rotatably provided inside the displacement driving frame 10. And transmission gears that mesh with each other are fixedly provided at one end of the output shaft of the driving motor 12 and the linear lead screw 11 respectively; the output shaft of the driving motor 12 and one end of the linear lead screw 11 are connected by transmission gears that mesh with each other. When the driving motor 12 is started, the rotation of its output shaft is transmitted to the linear lead screw 11 through the transmission gears, causing the linear lead screw 11 to rotate. The rotation direction and speed of the linear lead screw 11 are precisely controlled by the driving motor 12, so as to achieve precise control of the movement of the displacement block 13. A displacement block 13 is also slidably provided inside the displacement driving frame 10. And the inside of the displacement block 13 is threadedly connected to the surface of the linear lead screw 11. It should be noted that during semiconductor packaging chip mounter processing, the semiconductor packaging chip component is lifted upward through the loading port 3. At this time, the linear lead screw 11 is controlled to rotate clockwise by the output shaft of the driving motor 12. During the clockwise rotation of the linear lead screw 11, the displacement block 13 slides along the linear lead screw 11 inside the displacement driving frame 10 to the side of the loading port 3, and the automatic feeding unit 7 is used to perform an automatic feeding operation on the semiconductor packaging chip component inside the discharge port 4.

[0025] Pretreatment unit 8, a pretreatment unit 8 is fixedly provided on the left side inside the chip mounter 1. The pretreatment unit 8 includes a coating rack 30 and a preheating rack 32. The bottom of the coating rack 30 is fixedly connected to the bottom of the inner wall of the chip mounter 1. And a preheating rack 32 is fixedly provided on the top of the coating rack 30. The inside of the preheating rack 32 is communicated with the inside of the coating rack 30. And sealing plates 34 are slidably provided above the inside of the preheating rack 32 and the coating rack 30 through electric sliders respectively. A coating roller 31 is rotatably provided inside the coating rack 30 through a built-in motor. And a flux delivery conduit is communicated with the inside of the coating roller 31. Among them, a plurality of flux discharge holes are provided on the surface of the coating roller 31. After flux is fed into the inside of the coating roller 31 through the flux delivery conduit and the flux is sent out through the flux discharge holes, the coating roller 31 is used to coat the flux on the surface of the semiconductor packaging chip, removing oxides on the surfaces of the chip and the substrate, and improving the quality and reliability of welding; then the semiconductor packaging chip to be processed is preheated inside the preheating rack 32 by the electric heating plate 33, reducing the surface tension of the solder, so that the solder is more likely to wet and spread on the chip bonding surface and the solder pad under the action of the flux, forming good solder joints.

[0026] It should be noted that the bottom of the coating rack 30 is fixed to the bottom of the inner wall of the chip mounter 1, and a coating roller 31 is rotatably arranged inside through a built-in motor. A flux delivery conduit is connected to the inside of the coating roller 31, and a number of flux discharge holes are arranged on the surface. The flux enters the inside of the coating roller 31 through the delivery conduit and then is sent out through the discharge holes. When the semiconductor package chip passes by the coating roller 31, the coating roller 31 rotates under the drive of the motor to evenly coat the flux on the surface of the semiconductor package chip. The function of the flux is to remove the oxides on the surfaces of the chip and the substrate, improving the quality and reliability of soldering; the preheating rack 32 is fixed to the top of the coating rack 30, and its inside is communicated with the inside of the coating rack 30. Above the inside of both the preheating rack 32 and the coating rack 30, a closing plate 34 is slidably arranged through an electric slider. The closing plate 34 can slide under the drive of the electric slider to control the opening and closing of the access channels of the coating rack 30 and the preheating rack 32, ensuring a relatively stable internal environment during the flux coating and preheating processes. An electric heating plate 33 is arranged inside the preheating rack 32 to preheat the semiconductor package chip to be processed by the chip mounter. The purpose of preheating is to reduce the surface tension of the solder, making it easier for the solder to wet and spread on the chip bonding surface and the pads under the action of the flux, forming good solder joints.

[0027] The chip mounting auxiliary unit 9 is also fixedly arranged on the right side inside the chip mounter 1. The chip mounting auxiliary unit 9 includes a chip mounting bottom rack 35. The chip mounting bottom rack 35 is fixedly arranged on the right side inside the chip mounter 1, and a linear slide rail 38 is fixedly arranged on the top of the chip mounting bottom rack 35. A positioning rack 36 is also slidably arranged on the top of the chip mounting bottom rack 35, and the bottom of the positioning rack 36 is slidably connected to the top of the linear slide rail 38. Positioning blocks 37 are also slidably arranged around the top of the positioning rack 36 through servo linear stages; by placing the semiconductor package chip on the top of the positioning rack 36, the semiconductor package chip is positioned by the positioning blocks 37 slidably arranged around the top of the positioning rack 36 to ensure the stability of the semiconductor package chip during the processing.

[0028] Specifically, a fixed block 14 is also fixedly arranged at the bottom of the displacement block 13, and a connecting frame 16 is rotatably arranged below the interior of the fixed block 14. The displacement block 13 is threadedly connected to the linear lead screw 11. When the linear lead screw 11 rotates, the displacement block 13 will slide along the linear lead screw 11 inside the displacement driving frame 10. A fixed block 14 is fixed to the bottom of the displacement block 13. As the displacement block 13 slides, the fixed block 14 and the structure connected below it for adsorbing the semiconductor packaging patch will also move accordingly, thereby realizing the automatic feeding operation of the semiconductor packaging patch. A first steering motor 15 is fixedly arranged on one side of the fixed block 14, and one end of the output shaft of the first steering motor 15 is fixedly connected to the upper part inside the connecting frame 16. The fixed block 14 is fixed to the bottom of the displacement block 13, and the connecting frame 16 is rotatably arranged below the interior of the fixed block 14. One end of the output shaft of the first steering motor 15 is fixedly connected to the upper part inside the connecting frame 16. By controlling the output shaft of the first steering motor 15, the connecting frame 16 swings back and forth below the interior of the fixed block 14, thereby adjusting the processing angle of the semiconductor packaging patch, so that the semiconductor packaging patch can be processed in a subsequent operation at a suitable angle. By controlling the output shaft of the first steering motor 15, the connecting frame 16 swings back and forth below the interior of the fixed block 14, thereby adjusting the processing angle of the semiconductor packaging patch; a first servo cylinder 17 is also fixedly arranged inside the connecting frame 16, and a mounting block 18 is fixedly arranged at the bottom end of the driving shaft of the first servo cylinder 17. The first servo cylinder 17 is fixed inside the connecting frame 16, and a mounting block 18 is fixedly arranged at the bottom end of its driving shaft. The first servo cylinder 17 can accurately control the position of the mounting block 18 in the vertical direction to adjust the distance between the adsorption device and the semiconductor packaging patch, ensuring the accuracy of the adsorption operation. A second steering motor 19 is fixedly arranged on both sides inside the mounting block 18, and a rotating frame 20 is fixedly arranged at one end of the output shaft of each of the two second steering motors 19. According to the angle requirements of the semiconductor packaging patch, the output shaft of the second steering motor 19 can control the rotating frame 20 to rotate horizontally, further improving the flexibility of the processing angle of the semiconductor packaging patch, so that the adsorption device can better adapt to semiconductor packaging patches with different shapes and angle requirements. A second servo cylinder 21 is fixedly arranged on one side of each of the two rotating frames 20, and a movable frame 22 is fixedly arranged at the bottom end of the driving shaft of each of the two second servo cylinders 21. The second servo cylinder 21 can control the position of the movable frame 22 in the vertical direction to further adjust the height of the adsorption device to meet the adsorption requirements of semiconductor packaging patches with different thicknesses.Inside both of the two movable frames 22, a first helical gear 24 is fixedly arranged. One end of the output shaft of each of the two first helical gears 24 is also fixedly provided with a first helical gear 24. Rotating shafts 25 are rotatably arranged around the inside of the movable frame 22. One end of each of the four rotating shafts 25 is fixedly provided with a second helical gear 26. The tooth surfaces of the four second helical gears 26 are meshed and driven with the tooth surfaces of the first helical gear 24. Around the top of the inner wall of the movable frame 22, limiting frames 27 are fixedly arranged. Sliding suction frames 28 are slidably arranged at the bottoms of the four limiting frames 27. The interiors of the four suction frames 28 are respectively threadedly connected to the surfaces of the four rotating shafts 25. At the bottoms of the four suction frames 28, rubber suction nozzles 29 are movably arranged through built-in servo micro-cylinders. The top of the rubber suction nozzle 29 is connected and controlled through a negative pressure pump. The bottom of the rubber suction nozzle 29 is provided with a plurality of adsorption holes. On the surface of each rotating shaft 25, two suction frames 28 are arranged at intervals. When the rotating shaft 25 rotates, the suction frame 28 will slide along the limiting frame 27 to realize the position adjustment of the suction frame 28. On the surface of each rotating shaft 25, two suction frames 28 are arranged at intervals. The outer peripheral surface and the inner peripheral surface of the semiconductor packaging patch are respectively adsorbed and positioned by the two suction frames 28. The bottom of the suction frame 28 is movably provided with a rubber suction nozzle 29 through a built-in servo micro-cylinder. The top of the rubber suction nozzle 29 is connected and controlled through a negative pressure pump, and the bottom is provided with a plurality of adsorption holes. When the negative pressure pump works, the rubber suction nozzle 29 generates negative pressure through the adsorption holes to realize the adsorption of the semiconductor packaging patch. The servo micro-cylinder can control the small movement of the rubber suction nozzle 29 in the vertical direction to further adjust the adsorption position and adsorption force.

[0029] The outer peripheral surface and the inner peripheral surface of the semiconductor packaging patch are respectively adsorbed and positioned by the two suction frames 28, so as to ensure the adsorption stability of the semiconductor packaging patch. And when performing the semiconductor packaging patch operation, according to the angle of the semiconductor packaging patch, the output shaft of the second steering motor 19 is used to control the rotating frame 20 to rotate horizontally, further improving the flexibility of the processing angle of the semiconductor packaging patch.

[0030] Embodiment 2 Specifically, in this embodiment, a working method of a semiconductor packaging patch device with an adjustable suction nozzle is also disclosed, including the following steps: Step 1: Feeding preparation and equipment startup: Check the overall condition of the patch processing machine 1 to ensure that all components are firmly installed without damage or looseness. Turn on the patch processing machine 1 and perform initialization settings on the equipment, including self-checking and calibration of each motor, sensor, etc., to make the equipment enter the working state. Connect the automatic feeding device to the feeding port 3 and debug it to ensure that the semiconductor packaging patch components can be smoothly conveyed to the position of the feeding port 3. Close the closing door 2 to create a relatively closed and clean processing environment, reducing external interference and safety hazards; Step 2. Loading operation: The semiconductor packaging and chip components are conveyed to the loading port 3 through an automatic loading device. After the sensor set at the loading port 3 detects that the components are in place, it triggers a corresponding signal and prepares to send the components into the internal of the chip mounter 1. The loading mechanism (using existing technologies, such as a lifting cylinder, etc.) set inside the loading port 3 lifts the semiconductor packaging and chip components upward so that they reach the position where they can be grabbed by the automatic feeding unit 7; Step 3. Automatic feeding: After receiving the signal indicating that the loading is completed, the drive motor 12 in the automatic feeding unit 7 starts, and its output shaft rotates. The linear lead screw 11 is driven to rotate clockwise through the transmission gear. The displacement block 13 is threadedly connected to the linear lead screw 11. When the linear lead screw 11 rotates, the displacement block 13 slides along the linear lead screw 11 inside the displacement drive frame 10 towards the loading port 3. The fixed block 14 at the bottom of the displacement block 13 and the adsorption structure connected below it move to the upper part of the semiconductor packaging and chip components; Step 4. Adsorption and angle adjustment: The steering motor 1 on one side of the fixed block 14 starts, and its output shaft controls the connecting frame 16 to swing back and forth below the fixed block 14. According to the preset processing angle requirements of the semiconductor packaging and chip components, the inclination angle of the connecting frame 16 is adjusted. The servo cylinder 1 inside the connecting frame 16 starts, and its drive shaft extends or retracts to precisely control the position of the mounting block 18 in the vertical direction, so that the adsorption device keeps an appropriate distance from the semiconductor packaging and chip components; The steering motors 2 on both sides inside the mounting block 18 start according to the shape and angle requirements of the semiconductor packaging and chip components, and their output shafts control the rotating frame 20 to rotate horizontally to further adjust the angle of the adsorption device and improve the adaptability to different shape and angle requirements. The servo cylinder 2 on one side of the rotating frame 20 starts, and its drive shaft controls the movable frame 22 to move in the vertical direction to adjust the height of the adsorption device to adapt to the thickness of the semiconductor packaging and chip components. The bevel gear 1 inside the movable frame 22 rotates, and through the meshing transmission with the bevel gear 2, drives the four rotating shafts 25 to rotate synchronously. When the rotating shafts 25 rotate, the suction frame 28 threadedly connected to them slides at the bottom of the limit frame 27 to adjust the position of the suction frame 28. The rubber suction nozzles 29 at the bottom of the suction frame 28 adjust their positions through the built-in servo micro-cylinders so that they are aligned with the outer peripheral surface and inner peripheral surface of the semiconductor packaging and chip components. The negative pressure pump starts, and the rubber suction nozzles 29 generate negative pressure through the adsorption holes at the bottom to firmly adsorb the semiconductor packaging and chip components; Step Five, Pretreatment: The automatic feeding unit 7 holding the semiconductor package and patch components transfers the components above the coating rack 30 of the pretreatment unit 8. The electric slider inside the coating rack 30 starts, driving the closing plate 34 to slide open. The semiconductor package and patch components descend into the coating rack 30. The built-in motor inside the coating rack 30 drives the coating roller 31 to rotate. The flux enters the coating roller 31 through the flux delivery conduit and is sent out from the discharge holes on its surface, evenly coating the surface of the semiconductor package and patch components to remove the oxides on the chip and substrate surfaces. After the flux is coated, the semiconductor package and patch components rise and leave the coating rack 30, and the closing plate 34 slides closed. The automatic feeding unit 7 transfers the components above the preheating rack 32. The electric slider of the preheating rack 32 opens the closing plate 34, and the components descend into the preheating rack 32. The electric heating plate 33 inside the preheating rack 32 preheats the components to reduce the surface tension of the solder. After the preheating is completed, the components rise and leave the preheating rack 32, and the closing plate 34 closes; Step Six, Patch Auxiliary Positioning: The automatic feeding unit 7 transfers the pretreated semiconductor package and patch components above the positioning rack 36 of the patch auxiliary unit 9. The servo linear slides at the four corners of the top of the positioning rack 36 start, driving the positioning blocks 37 to slide to appropriate positions to prepare for receiving the semiconductor package and patch components. The automatic feeding unit 7 adjusts its position and places the semiconductor package and patch components on the top of the positioning rack 36. The positioning blocks 37 slide towards the middle under the drive of the servo linear slides to accurately position the semiconductor package and patch components, ensuring their stability during subsequent processing; Step Seven, Encapsulation and Patching Processing: The patching processing mechanism (using existing technology, including soldering heads, patching heads, etc.) set inside the patching machine 1 starts, and performs encapsulation and patching processing operations on the semiconductor package and patch components positioned on the positioning rack 36 according to the preset process parameters, such as soldering the chip and the substrate, etc. During the processing, the sensors of the equipment continuously monitor the processing status, such as parameters like temperature, pressure, position, etc., and feed the data back to the control system to ensure the accuracy and stability of the processing. If there is an abnormality, the control system adjusts the equipment operation parameters in a timely manner or issues an alarm; Step Eight, Discharging: After the encapsulation and patching processing is completed, the automatic feeding unit 7 moves above the positioning rack 36, and the suction nozzle re-adsorbs the processed semiconductor packages. The two linear guides 5 on the right side of the patching machine 1 start, driving the discharge control plate 6 to lift upwards, opening the right side of the discharge port 4. The automatic feeding unit 7 transfers the suction nozzle holding the semiconductor packages to the position of the discharge port 4, releases the semiconductor packages, and enables them to be sent out of the patching machine 1 through the discharge port 4. The manipulator set on the right side of the patching machine 1 grabs the semiconductor packages for subsequent packaging, inspection and other processes. After the discharging is completed, the discharge control plate 6 descends under the drive of the linear guide 5 to close the discharge port 4, and the equipment is ready for the next round of feeding, processing and other operations.

[0031] Meanwhile, the content not described in detail in this specification belongs to the prior art well known to those skilled in the art.

[0032] It should be noted that, in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0033] The foregoing has shown and described the basic principles, main features and advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Accordingly, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

[0034] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments understandable to those skilled in the art.

Claims

1. A semiconductor packaging and pasting device with an adjustable suction nozzle, characterized in that, Including: A chip mounter (1), on the front of which a closing door (2) is rotatably arranged through a hinge shaft. There is a loading port (3) on the left side inside, and an unloading port (4) on the right side. On the right side, above the unloading port (4), two linear guide rails (5) are fixed. An unloading control board (6) is slidably arranged between the two linear guide rails (5); An automatic feeding unit (7), arranged at the top of the inner wall of the chip mounter (1), including a displacement driving frame (10). On one side of the displacement driving frame (10), a driving motor (12) is fixed. A linear lead screw (11) is rotatably arranged inside. The output shaft of the driving motor (12) is connected to one end of the linear lead screw (11) through meshing transmission gears. A displacement block (13) threadedly connected to the linear lead screw (11) is slidably arranged inside the displacement driving frame (10); A pretreatment unit (8), fixed on the left side inside the chip mounter (1), including a paint rack (30) whose bottom is fixedly connected to the bottom of the inner wall of the chip mounter (1). A preheating rack (32) is fixedly arranged on the top of the paint rack (30). The preheating rack (32) is internally connected to the paint rack (30), and above both of them, a closing plate (34) is slidably arranged through an electric slider. Inside the paint rack (30), a paint roller (31) is rotatably arranged through a built-in motor. An electric heating plate (33) is arranged inside the preheating rack (32); A chip mounting auxiliary unit (9), fixed on the right side inside the chip mounter (1), including a chip mounting bottom rack (35). A linear slide rail (38) is fixed on the top of the chip mounting bottom rack (35). A positioning rack (36) whose bottom is slidably connected to the top of the linear slide rail (38) is slidably arranged on the top. Around the top of the positioning rack (36), positioning blocks (37) are slidably arranged through servo linear stages.

2. The semiconductor packaging and pasting device with an adjustable nozzle according to claim 1, wherein A fixing block (14) is fixed at the bottom of the displacement block (13). A connecting frame (16) is rotatably arranged below the fixing block (14). A steering motor one (15) is fixed on one side of the fixing block (14). The output shaft of the steering motor one (15) is fixedly connected to the upper part inside the connecting frame (16). A servo electric cylinder one (17) is fixed inside the connecting frame (16). The bottom end of the driving shaft of the servo electric cylinder one (17) is fixed with a mounting block (18). Steering motors two (19) are fixed on both sides inside the mounting block (18). One end of the output shaft of the steering motor two (19) is fixed with a rotating frame (20). A servo electric cylinder two (21) is fixed on one side of the rotating frame (20). The bottom end of the driving shaft of the servo electric cylinder two (21) is fixed with a movable frame (22).

3. The semiconductor packaging and pasting device with an adjustable nozzle according to claim 2, characterized in that, An inclined gear one (24) is fixed inside the movable frame (22). A rotating shaft (25) with an inclined gear two (26) fixed at one end and meshing with the tooth surface of the inclined gear one (24) is rotatably arranged around the inside of the movable frame (22). Limiting frames (27) are fixed around the top of the inner wall of the movable frame (22). A suction rack (28) threadedly connected to the surface of the rotating shaft (25) is slidably arranged at the bottom of the limiting frame (27). A rubber suction nozzle (29) is movably arranged at the bottom of the suction rack (28) through a built-in servo micro electric cylinder.

4. The semiconductor packaging and pasting device with an adjustable nozzle according to claim 1, characterized in that, The closed door (2) is used to form a relatively closed processing environment during the operation of the equipment, reduce external interference and provide safety protection.

5. The semiconductor packaging and pasting device with an adjustable nozzle according to claim 1, characterized in that, The coating roller (31) is used to coat the flux on the surface of the semiconductor package patch to remove oxides on the surfaces of the chip and the substrate.

6. The semiconductor packaging and pasting device with an adjustable suction nozzle according to claim 1, wherein, The electric heating plate (33) is used to preheat the semiconductor package patch to be processed by patch, reducing the surface tension of the solder.

7. The semiconductor packaging and pasting device with an adjustable suction nozzle according to claim 1, characterized in that, The positioning block (37) is used to position the semiconductor package patch placed on the top of the positioning frame (36) to ensure the stability of processing.

8. The semiconductor packaging and pasting device with an adjustable nozzle according to claim 2, characterized in that, The steering motor one (15) is used to control the front-back swing of the connecting frame (16) to adjust the processing angle of the semiconductor package patch.

9. The semiconductor packaging and pasting device with an adjustable nozzle according to claim 2, wherein, The steering motor two (19) is used to control the horizontal rotation of the rotating frame (20) to improve the flexibility of the processing angle of the semiconductor package patch.

10. The semiconductor packaging and pasting device with an adjustable nozzle according to claim 2, characterized in that, The servo cylinder one (17) and the servo cylinder two (21) are respectively used to precisely control the positions of the mounting block (18) and the movable frame (22) in the vertical direction, and adjust the distance and height between the adsorption device and the semiconductor package patch.

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