Earphone

Abstract

An earphone provided by the present invention comprises a housing having an accommodating cavity and a sound outlet communicating the accommodating cavity with the outside, the sound outlet is divided into at least two cavities, and the at least two cavities comprise a first sound outlet cavity; the first loudspeaker is accommodated in the accommodating cavity and is used for generating high-frequency sound; wherein the first sound outlet cavity extends towards the outside from the packaging sound production surface of the first loudspeaker so as to lead out high-frequency sound. According to the invention, the sound pressure level with the frequency range of more than 5kHz can be effectively improved, and the acoustic performance of the earphone is improved.

Description

Technical Field

[0001] The present invention relates to the field of electroacoustic conversion, and particularly to a headset.

Background Art

[0002] Headsets, especially Bluetooth headsets or TWS (True Wireless Stereo) headsets, have become increasingly popular among consumers in recent years due to their convenient wearing, hands-free operation, and diverse interaction methods. With the expansion of the consumer market, the application requirements for headset quality, especially for sound waves in the high-frequency band (such as 10 kHz - 40 kHz), are also getting higher and higher. For example, sound waves in the range of 10 kHz - 20 kHz can bring a richer auditory experience, and the ultrasonic band can scan the shape of a person's ear canal to customize a personalized auditory experience through algorithms. Therefore, the demand for high-performance speakers for the above frequencies is becoming increasingly urgent.

[0003] Existing headsets often adopt combined units. For example, a relatively small-sized speaker carries the high-frequency module, and a relatively large-sized traditional speaker carries the low-frequency vibration. Common combinations include multi-dynamic coil, multi-balanced armature, and hybrid.

[0004] Please refer to Figure 1 , taking a dual-dynamic coil combined headset as an example. To improve the bass listening experience and increase the sound pressure level (SPL), the size of the low-frequency speaker S1 that carries the low-frequency vibration is very large. Therefore, in a TWS headset, after assembly, the low-frequency speaker S1 has a large distance from the sound outlet A of the headset, which also results in a large distance between the high-frequency speaker S2 attached to the low-frequency speaker S1 and the sound outlet A. Moreover, the headset cavity causes the original resonance peak of the ear canal cavity to shift or decrease, thereby resulting in a lower sound pressure level in the high-frequency band.

[0005] Therefore, it is necessary to provide a headset that can improve the sound pressure level in the high-frequency band.

Summary of the Invention

[0006] The purpose of the present invention is to provide a headset to solve the technical problem of the lower sound pressure level in the high-frequency band in the prior art.

[0007] The technical solution of the present invention is as follows:

[0008] The present invention provides a headset, including:

[0009] A housing having a receiving cavity and a sound outlet communicating the receiving cavity with the outside, the sound outlet being divided into at least two cavities, and the at least two cavities including a first sound outlet cavity; and

[0010] A first speaker received in the receiving cavity for generating high-frequency sounds;

[0011] Wherein, the first sound outlet cavity extends from the encapsulation sound-emitting surface of the first loudspeaker towards the outside to export the high-frequency sound.

[0012] Preferably, the housing includes a housing having a first installation cavity and a bracket received in the first installation cavity, and the bracket has the accommodation cavity and the sound outlet;

[0013] The first loudspeaker is fixed to the bracket.

[0014] Preferably, the earphone further includes a first partition;

[0015] The first partition is received in the sound outlet and connected to the housing to divide the sound outlet into at least two such cavities;

[0016] The side of the first loudspeaker provided with the encapsulation sound-emitting surface faces the first partition; the first loudspeaker, the first partition and the housing enclose to form the first sound outlet cavity, or the first loudspeaker and the first partition enclose to form the first sound outlet cavity.

[0017] Preferably, the first partition and the housing are of an integral structure, and the first loudspeaker, the first partition and the housing enclose to form the first sound outlet cavity.

[0018] Preferably, the first partition is installed in the housing;

[0019] The first partition is a plate-shaped member, and the first loudspeaker, the first partition and the housing enclose to form the first sound outlet cavity; or the first partition is a tubular member.

[0020] Preferably, the earphone further includes a second partition;

[0021] The second partition includes a mounting portion and a first sound guiding tube portion connected to the mounting portion. The mounting portion is received in the accommodation cavity, and the first sound guiding tube portion is received in the sound outlet to divide the sound outlet into at least two such cavities;

[0022] The first loudspeaker is received in the mounting portion, and the side of the first loudspeaker provided with the encapsulation sound-emitting surface faces the first sound guiding tube portion. The first loudspeaker and the second partition enclose to form the first sound outlet cavity.

[0023] Preferably, the first loudspeaker is a packaged loudspeaker, and the first loudspeaker has a packaging shell;

[0024] The encapsulation housing includes an encapsulated sound - emitting face and a second sound - guiding tube portion connected to the encapsulated sound - emitting face. The second sound - guiding tube portion is received in the sound outlet to divide the sound outlet into at least two of the cavities; alternatively, the encapsulation housing includes an encapsulated sound - emitting face.

[0025] Preferably, the length of the first sound - outlet cavity is 200 μm to 9 mm.

[0026] Preferably, the length of the first sound - outlet cavity is 1 mm to 5 mm.

[0027] Preferably, the earphone further includes a second speaker for generating mid - low frequency sounds;

[0028] The sound outlet is divided into two of the cavities, and the two cavities further include a second sound - outlet cavity for guiding out the mid - low frequency sounds.

[0029] The beneficial effects of the present invention are as follows: The earphone of the present invention includes a housing having a receiving cavity and a sound outlet communicating the receiving cavity with the outside. The sound outlet is divided into at least two cavities, and the at least two cavities include a first sound - outlet cavity; and a first speaker received in the receiving cavity for generating high - frequency sounds. Among them, the first sound - outlet cavity extends from the encapsulated sound - emitting face of the first speaker towards the outside to guide out the high - frequency sounds. In this way, the high - frequency sounds generated by the first speaker are guided out by the first sound - outlet cavity, which can effectively increase the sound pressure level above 5 kHz and improve the acoustic performance of the earphone.

Description of the Drawings

[0030] Figure 1 It is a schematic structural diagram of an earphone in the related art;

[0031] Figure 2 It is a comparison chart of the sound - pressure - level frequency relationship curves of the earphone in the embodiment of the present invention and the earphone in the comparative example;

[0032] Figure 3 It is a three - dimensional structural diagram of the earphone in the embodiment of the present invention;

[0033] Figure 4 For Figure 3 It is a three - dimensional structural diagram of the earphone shown from another perspective;

[0034] Figure 5 For Figure 3 It is an exploded view of the earphone shown;

[0035] Figure 6 For Figure 3 It is a bottom view of the earphone shown;

[0036] Figure 7 For Figure 6 It is a cross - sectional view taken along line A - A of

[0037] Figure 8 Schematic diagram of the three-dimensional structure of the earphone according to an embodiment of the present invention;

[0038] Figure 9 is Figure 8 Schematic diagram of the three-dimensional structure of another perspective of the earphone shown;

[0039] Figure 10 is Figure 8 Bottom view of the earphone shown;

[0040] Figure 11 is Figure 8 Exploded view of the earphone shown;

[0041] Figure 12 Schematic diagram of the three-dimensional structure of the earphone according to an embodiment of the present invention;

[0042] Figure 13 is Figure 12 Schematic diagram of the three-dimensional structure of another perspective of the earphone shown;

[0043] Figure 14 is Figure 12 Exploded view of the earphone shown;

[0044] Figure 15 Schematic diagram of the three-dimensional structure of the earphone according to an embodiment of the present invention;

[0045] Figure 16 is Figure 15 Schematic diagram of the three-dimensional structure of another perspective of the earphone shown;

[0046] Figure 17 is Figure 15 Bottom view of the earphone shown;

[0047] Figure 18 is Figure 15 Exploded view of the earphone shown;

[0048] Figure 19 is Figure 15 Exploded view of the earphone shown;

[0049] Figure 20 Schematic diagram of the three-dimensional structure of the earphone according to an embodiment of the present invention;

[0050] Figure 21 is Figure 20 Schematic diagram of the three-dimensional structure of another perspective of the earphone shown;

[0051] Figure 22 is Figure 20 Bottom view of the earphone shown;

[0052] Figure 23 is Figure 20Exploded view of the earphone shown

[0053] Figure 24 is Figure 20 Exploded view of the earphone shown

[0054] Figure 25 It is a comparison chart of the sound pressure level frequency relationship curve of the earphone in the embodiment of the present invention

Detailed implementation manners

[0055] The present invention will be further described below in conjunction with the drawings and embodiments

[0056] Please refer to Figures 3 to 24 , an embodiment of the present invention provides an earphone, which includes a housing 1 and a first speaker 2. The housing 1 has a receiving cavity 11 and a sound outlet 12. The sound outlet 12 communicates the receiving cavity 11 with the outside. The sound outlet 12 is divided into at least two cavities, and at least two cavities include a first sound outlet cavity 121. The first speaker 2 is received in the receiving cavity 11, and the first speaker 2 is used to generate high-frequency sounds. Among them, the first sound outlet cavity 121 extends from the encapsulated sound-emitting surface 21 of the first speaker 2 towards the outside, so as to derive the high-frequency sounds generated by the first speaker 2

[0057] In this embodiment, the sound outlet 12 is divided into at least two cavities, one of which is the first sound outlet cavity 121, and the cross-sectional area of the first sound outlet cavity 121 is smaller than the cross-sectional area of the sound outlet 12. The first sound outlet cavity 121 of the sound outlet 12 extends from the encapsulated sound-emitting surface 21 of the first speaker 2 towards the outside. That is to say, this embodiment can effectively shorten the distance between the first speaker 2 and the sound outlet 12. The high-frequency sounds generated by the first speaker 2 are derived by the first sound outlet cavity 121 of the sound outlet 12, which can effectively improve the sound pressure level in the frequency range above 5 kHz and improve the acoustic performance of the earphone

[0058] Please refer to Figure 2 shown, the curve S100 is the sound pressure level frequency relationship curve of the first speaker 2 in a preferred embodiment of the present invention, and the curve S200 is the sound pressure level frequency relationship curve of the first speaker in the comparative example. The difference between the comparative example and the embodiment is that the sound outlet is not divided into multiple cavities in the comparative example, that is, the first sound outlet cavity is not provided in the comparative example. From Figure 2 it can be seen that compared with the comparative example, the sound pressure level of the embodiment of the present invention in the frequency range of 5 kHz to 20 kHz has been substantially improved by about 10 dB

[0059] Exemplarily, the first speaker 2 can be a packaged micro speaker. In some examples, the first speaker 2 can be a MEMS (Micro-Electro-Mechanical System) speaker

[0060] In some embodiments, the earphone further includes a second speaker for generating mid-low frequency sounds. Exemplarily, the first speaker 2 and the second speaker may be respectively installed in the housing 1. It should be noted that the installation manners of the first speaker 2 and the second speaker can be set according to actual situations and will not be elaborated here.

[0061] In this embodiment, the sound outlet 12 can be divided into two cavities, including a first sound outlet cavity 121 and a second sound outlet cavity 122. The second sound outlet cavity 122 is used to export the mid-low frequency sounds generated by the second speaker.

[0062] As an embodiment, the second speaker can be a dynamic coil speaker.

[0063] In some embodiments, the housing 1 can be a split structure. The housing 1 may include a housing body 13 and a bracket 14, as shown in Figures 8 to 11 shown. The housing body 13 has a first installation cavity 131. The bracket 14 is received in the first installation cavity 131, and the bracket 14 has a receiving cavity 11 and a sound outlet 12. The first speaker 2 can be fixed to the bracket 14, and the second speaker can also be fixed to the bracket 14.

[0064] Exemplarily, the earphone may further include internal structures such as a battery, a MEMS microphone, and a MEMS accelerometer. The internal structures such as the battery, the MEMS microphone, and the MEMS accelerometer can also be fixed to the bracket 14. It should be noted that the internal structures such as the battery, the MEMS microphone, and the MEMS accelerometer are prior arts and will not be elaborated here.

[0065] In some other embodiments, the housing 1 can be an integral structure, as shown in Figures 3 to 7 and Figures 12 to 24 shown.

[0066] In some embodiments, as shown in Figures 3 to 14 , the earphone may further include a first partition 3. The first partition 3 is received in the sound outlet 12, and the first partition 3 is connected to the housing 1, thereby dividing the sound outlet 12 into at least two cavities. In some examples, the first partition 3, the housing 1, and the first speaker 2 are hermetically enclosed to form the first sound outlet cavity 121. In some other examples, the first partition 3 and the first speaker 2 are hermetically enclosed to form the first sound outlet cavity 121.

[0067] In this embodiment, the first speaker 2 is directly docked to the first sound outlet cavity 121 of the sound outlet 12, effectively shortening the distance between the first speaker 2 and the sound outlet 12, which can effectively improve the sound pressure level above 5 kHz in the frequency range and improve the acoustic performance of the earphone.

[0068] In some embodiments, the first separator 3 and the housing 1 may be an integral structure. That is to say, the first separator 3 and the housing 1 may be integrally formed without being hermetically enclosed by means of glue, gaskets, etc., which simplifies the assembly process and can improve the reliability of the sealed connection between the first separator 3 and the housing 1.

[0069] As an embodiment, the housing 1 is Figures 3 to 7 the integral structure as shown. The first separator 3 is integrally formed with the entire housing 1. That is to say, the first separator 3 is a part of the housing 1 and is formed inside the housing 1. Exemplarily, the first separator 3 may be a curved surface structure. For example, the first separator 3 may be a curved surface structure with a C-shaped cross-section as Figure 6 shown. Alternatively, the first separator 3 may also be a planar structure. Or the first separator 3 may also be other shapes, which can be set according to the actual situation and will not be elaborated here.

[0070] In some examples, the first speaker 2 may be adhesively bonded to the first separator 3 and the housing 1 with glue, so as to avoid gaps at the connection between the first speaker 2 and the first separator 3 and at the connection between the first speaker 2 and the housing 1, enabling the first speaker 2 to be hermetically enclosed with the first separator 3 and the housing 1 reliably. The high-frequency sound generated by the first speaker 2 can only be led out into the human ear through the first sound outlet cavity 121, further improving the acoustic performance of the earphone.

[0071] In other embodiments, the first speaker 2 may also be hermetically enclosed with the first separator 3 and the housing 1 in other ways. For example, the first separator 3, the housing 1 and the first speaker 2 may also be hermetically enclosed with a gasket.

[0072] As an embodiment, the housing 1 is Figures 8 to 11 the split structure as shown. The housing 1 includes a housing body 13 and a bracket 14. The first separator 3 may be integrally formed with the bracket 14 and is formed inside the bracket 14. That is to say, the first separator 3 is a part of the bracket 14. Exemplarily, the first separator 3 may be a curved surface structure. For example, the first separator 3 may be a curved surface structure with a C-shaped cross-section as Figure 10 shown. Alternatively, the first separator 3 may also be a planar structure. Or the first separator 3 may also be other shapes, which can be set according to the actual situation and will not be elaborated here.

[0073] In some examples, the first speaker 2 can be hermetically enclosed with the first separator 3 and the bracket 14 by means of glue bonding or the like, so as to avoid gaps at the connection between the first speaker 2 and the first separator 3 and at the connection between the first speaker 2 and the bracket 14, enabling the first speaker 2 to be hermetically enclosed with the first separator 3 and the bracket 14 reliably. The high-frequency sound generated by the first speaker 2 can only be led into the human ear through the first sound outlet cavity 121, further improving the acoustic performance of the earphone.

[0074] In some embodiments, the first separator 3 can be a split structure with the housing 1, that is to say, the first separator 3 is installed inside the housing 1, which can simplify the structure of the housing 1 and reduce the manufacturing cost and difficulty of the housing 1.

[0075] As an embodiment, the housing 1 is an integral structure, and the first separator 3 can be installed and fixed inside the housing 1.

[0076] Exemplarily, the housing 1 is an integral structure, and the first separator 3 can be a plate-like member, which can effectively simplify the structure of the first separator 3 and reduce the production cost of the first separator 3. The first separator 3, the housing 1 and the first speaker 2 are hermetically enclosed to form the first sound outlet cavity 121. In some examples, the first separator 3 can be a flat plate member. Or, the first separator 3 can be a curved plate member. For example, the first separator 3 can be a curved plate member with a C-shaped cross section. Or, the first separator 3 can also be a plate-like member of other shapes, which can be set according to the actual situation and will not be elaborated here.

[0077] In some examples, the first separator 3, the housing 1 and the first speaker 2 can be hermetically enclosed by means of glue bonding or the like, so as to avoid gaps at the connection between the first separator 3 and the housing 1, at the connection between the first separator 3 and the first speaker 2, and at the connection between the housing 1 and the first speaker 2, enabling the first separator 3, the housing 1 and the first speaker 2 to be hermetically enclosed reliably. The high-frequency sound generated by the first speaker 2 can only be led into the human ear through the first sound outlet cavity 121, further improving the acoustic performance of the earphone.

[0078] Exemplarily, the housing 1 is an integral structure, and the first separator 3 can be a tubular member. For example, the first separator 3 can be a columnar structure with a sealed ring around it. The first separator 3 has a first lumen 31 with openings at both ends. One end of the first separator 3 is connected to the side of the first speaker 2 where the sound-emitting surface 21 is encapsulated. The inner surface of the first separator 3, that is, the first lumen 31, the housing 1 and the first speaker 2 are hermetically enclosed to form the first sound outlet cavity 121. This embodiment is simpler to install and can improve the reliability of the hermetic enclosure.

[0079] In some examples, the first separator 3, the housing 1, and the first speaker 2 can be hermetically enclosed by means such as glue bonding, so as to avoid gaps at the joints between the first separator 3 and the first speaker 2, between the first separator 3 and the housing 1, and between the first speaker 2 and the housing 1, enabling the first separator 3, the housing 1, and the first speaker 2 to be hermetically enclosed. The high-frequency sound generated by the first speaker 2 can only be led into the human ear through the first sound outlet cavity 121, further improving the acoustic performance of the earphone.

[0080] In some other embodiments, the housing 1 is an integral structure, and the first separator 3 is a tubular member. The inner surface of the first separator 3, i.e., the first lumen 31, and the first speaker 2 are hermetically enclosed to form the first sound outlet cavity 121. The first separator 3 and the first speaker 2 can be hermetically enclosed by means such as glue bonding.

[0081] As an embodiment, the housing 1 is a split structure, and the housing 1 includes a housing body 13 and a bracket 14. The first separator 3 can be installed and fixed within the bracket 14.

[0082] Exemplarily, the housing 1 is a split structure, and the housing 1 includes a housing body 13 and a bracket 14. The first separator 3 can be a plate-like member, which can effectively simplify the structure of the first separator 3 and reduce the production cost of the first separator 3. The first separator 3, the bracket 14, and the first speaker 2 are hermetically enclosed to form the first sound outlet cavity 121. In some examples, the first separator 3 can be a flat plate member. Or, the first separator 3 can be a curved plate member. For example, the first separator 3 can be a curved plate member with a C-shaped cross-section. Or, the first separator 3 can also be a plate-like member of other shapes, which can be set according to the actual situation and will not be elaborated here.

[0083] In some examples, the first separator 3, the bracket 14, and the first speaker 2 can be hermetically enclosed by means such as glue bonding, so as to avoid gaps at the joints between the first separator 3 and the bracket 14, between the first separator 3 and the first speaker 2, and between the bracket 14 and the first speaker 2, enabling the first separator 3, the bracket 14, and the first speaker 2 to be reliably hermetically enclosed. The high-frequency sound generated by the first speaker 2 can only be led into the human ear through the first sound outlet cavity 121, further improving the acoustic performance of the earphone.

[0084] Exemplarily, the housing 1 is a split structure. The housing 1 includes a housing body 13 and a bracket 14. The first partition member 3 can be a tubular member. For example, the first partition member 3 can be a columnar structure with a sealed perimeter in a ring shape. The first partition member 3 has a first lumen 31 with openings at both ends. One end of the first partition member 3 is connected to the side of the first speaker 2 where the sound-emitting surface 21 is encapsulated. The inner surface of the first lumen 31 of the first partition member 3, the bracket 14, and the first speaker 2 enclose and seal to form a first sound-emitting cavity 121. This implementation is simpler to install and can improve the reliability of the enclosed seal.

[0085] In some examples, the first speaker 2, the first partition member 3, and the bracket 14 can be enclosed and sealed by means such as glue bonding, so as to avoid gaps at the connection between the first speaker 2 and the first partition member 3, the connection between the first speaker 2 and the bracket 14, and the connection between the first partition member 3 and the bracket 14. This enables the first partition member 3, the bracket 14, and the first speaker 2 to be enclosed and sealed. The high-frequency sound generated by the first speaker 2 can only be led out through the first sound-emitting cavity 121 and into the human ear, further improving the acoustic performance of the earphone.

[0086] In some other embodiments, the housing 1 is a split structure. The housing 1 includes a housing body 13 and a bracket 14. The first partition member 3 is a tubular member. The inner surface of the first lumen 31 of the first partition member 3 and the first speaker 2 enclose and seal to form a first sound-emitting cavity 121. The first partition member 3 and the first speaker 2 can be enclosed and sealed by means such as glue bonding.

[0087] In some embodiments, please refer to Figure 3 、 Figure 7 、 Figure 8 and Figure 12 As shown in, in order to improve the assembly accuracy, the side of the first speaker 2 where the sound-emitting surface 21 is encapsulated is partially embedded in the housing 1 and partially embedded in the first partition member 3, so as to achieve precise assembly of the first speaker 2 with the housing 1 and the first partition member 3.

[0088] In some embodiments, the earphone further includes a second partition member 4. Please refer to Figures 15 to 19。The second separator 4 includes a mounting portion 41 and a first sound guiding tube portion 42, and the first sound guiding tube portion 42 is connected to the mounting portion 41. The mounting portion 41 has a second mounting cavity 411, the first sound guiding tube portion 42 has a second tube cavity 421, and the second tube cavity 421 communicates with the second mounting cavity 411 and the outside. The mounting portion 41 is received in the receiving cavity 11, and the first sound guiding tube portion 42 is received in the sound outlet 12 to divide the sound outlet 12 into at least two cavities. The first speaker 2 is received in the second mounting cavity 411, and the side of the first speaker 2 provided with the encapsulated sounding surface 21 faces the first sound guiding tube portion 42. The first speaker 2 and the second separator 4 are hermetically enclosed to form a first sound outlet cavity 121.

[0089] In this embodiment, the second separator 4 and the first speaker 2 are hermetically enclosed to form a first sound outlet cavity 121. That is to say, the first speaker 2 is directly docked to the first sound outlet cavity 121 of the sound outlet 12, effectively shortening the distance between the first speaker 2 and the sound outlet 12, and can effectively improve the sound pressure level in the frequency range above 5 kHz, improving the acoustic performance of the earphone. Moreover, mounting the first speaker 2 in the second separator 4 further improves the assembly accuracy of the first speaker 2 and the second separator 4, further ensuring that the first speaker 2 and the second separator 4 can be hermetically enclosed. The high-frequency sound generated by the first speaker 2 can only be led out into the human ear through the first sound outlet cavity 121, further improving the acoustic performance of the earphone.

[0090] As an embodiment, the second separator 4 can be an integrally formed structure. Or, in other embodiments, the second separator 4 can also be a split structure, that is, the first sound guiding tube portion 42 is mounted on the mounting portion 41.

[0091] As an embodiment, the second separator 4 can be a plastic material structural member formed by injection molding, or stereolithography (such as 3D printing), etc. Or, the second separator 4 can also be a metal material structural member formed by stamping, or casting, etc. Or, the second separator 4 can also be a silicone material structural member formed by pressing, or the second separator 4 can also be a structural member formed by other methods, which can be set according to actual situations and will not be elaborated here. Exemplarily, the first speaker 2 can be snapped into the second separator 4.

[0092] In some embodiments, the first speaker 2 can be a packaged speaker, and the first speaker 2 has a packaging shell 5, so as to effectively ensure the acoustic performance of the earphone.

[0093] As an embodiment, please refer to Figures 20 to 24, the encapsulation housing 5 includes an encapsulated sound - emitting face 51 and a second sound - guiding tube portion 52. The second sound - guiding tube portion 52 is connected to the encapsulated sound - emitting face 51, and the second sound - guiding tube portion 52 is received in the sound outlet 12, thereby dividing the sound outlet 12 into at least two cavities. The first sound - outlet cavity 121 is enclosed and sealed by the encapsulated sound - emitting face 51 of the first speaker 2 and the second sound - guiding tube portion 52. This embodiment can not only effectively protect the first speaker 2, but also simplify the assembly steps and reduce the production cost.

[0094] In other embodiments, the encapsulation housing 5 may only include the encapsulated sound - emitting face 51 and not include the second sound - guiding tube portion 52.

[0095] In some embodiments, please refer to Figure 7 As shown, the first sound - outlet cavity 121 may be located in front of the encapsulated sound - emitting face 21 of the first speaker 2. As an example, the first sound - outlet cavity 121 may be located directly in front of the encapsulated sound - emitting face 21 of the first speaker 2, or the first sound - outlet cavity 121 may be located obliquely in front of the encapsulated sound - emitting face 21 of the first speaker 2, or the first sound - outlet cavity 121 may be located on the side of the encapsulated sound - emitting face 21 of the first speaker 2.

[0096] In some embodiments, the cross - sectional shape of the first sound - outlet cavity 121 may be an olive - shaped as Figure 6 shown. In other embodiments, the cross - sectional shape of the first sound - outlet cavity 121 may also be other shapes. For example, the cross - sectional shape of the first sound - outlet cavity 121 may also be circular, square, oval or irregular, etc.

[0097] In some embodiments, the first sound - outlet cavity 121 may be a straight - tube shape with the same size from front to back. In other embodiments, the first sound - outlet cavity 121 may be a horn - shaped with a smaller rear end and a larger front end, or the first sound - outlet cavity 121 may be a conical shape with a larger rear end and a smaller front end, or the first sound - outlet cavity 121 may be a spindle - shaped with the same size at the front and rear ends and a larger middle part, etc.

[0098] In some embodiments, the length L of the first sound - outlet cavity 121 may be 200μm - 9mm. Among them, the length direction is the front - to - back direction. As an example, the length L of the first sound - outlet cavity 121 may be, but not limited to, 200μm, 300μm, 500μm, 800μm, 1mm, 3mm, 5mm, 6mm, 8mm, or 9mm.

[0099] In some preferred embodiments, the length L of the first sound - outlet cavity 121 may be 1mm - 5mm. As an example, the length L of the first sound - outlet cavity 121 may be, but not limited to, 1mm, 2mm, 2.5mm, 3mm, 4.5mm, or 5mm.

[0100] Please refer to Figure 25 This is the sound pressure level frequency relationship curve of Embodiment 1, where curve S300, curve S400, and curve S500 are the sound pressure level frequency relationship curves under different lengths of the first sound output cavity 121. From Figure 25 it can be seen that in the embodiments of the present invention, the length of the first sound output cavity 121 can be set according to actual needs, so as to adjust the sound pressure level in the frequency range above 5 kHz, broaden the utilization rate of sounds in the frequency range above 5 kHz, and thus bring a richer auditory experience.

[0101] It should be noted that in other embodiments, the cross-sectional shape of the first sound output cavity 121, or the material of the structural member that encloses and forms the first sound output cavity 121 in a sealed manner, etc. can also be set according to actual needs, so as to adjust the sound pressure level in the frequency range above 5 kHz, broaden the utilization rate of sounds in the frequency range above 5 kHz, and thus bring a richer auditory experience.

[0102] The above are only the embodiments of the present invention. It should be pointed out here that for those of ordinary skill in the art, without departing from the creative concept of the present invention, improvements can still be made, but these all fall within the protection scope of the present invention.

Claims

1. An earphone, characterized in that, Comprising: A housing having a receiving cavity and a sound outlet communicating the receiving cavity with the outside, the sound outlet being divided into at least two cavities, the at least two cavities including a first sound outlet cavity; And A first speaker received in the receiving cavity for generating high-frequency sound; Wherein, the first sound outlet cavity extends from the encapsulated sounding surface of the first speaker towards the outside to conduct the high-frequency sound.

2. The earphone according to claim 1, wherein The housing includes a housing body having a first mounting cavity and a bracket received in the first mounting cavity, the bracket having the receiving cavity and the sound outlet; The first speaker is fixed to the bracket.

3. The earphone according to claim 1 or 2, characterized in that, The earphone further includes a first partition member; The first partition member is received in the sound outlet and connected to the housing to divide the sound outlet into at least two of the cavities; The side of the first speaker provided with the encapsulated sounding surface faces the first partition member; The first speaker, the first partition member and the housing enclose to form the first sound outlet cavity, or, the first speaker and the first partition member enclose to form the first sound outlet cavity.

4. The earphone according to claim 3, wherein, The first partition member and the housing are of an integral structure, and the first speaker, the first partition member and the housing enclose to form the first sound outlet cavity.

5. The earphone according to claim 3, wherein, The first partition member is installed in the housing; The first partition member is a plate-like member, and the first speaker, the first partition member and the housing enclose to form the first sound outlet cavity; or, the first partition member is a tubular member.

6. The earphone according to claim 1, characterized in that, The earphone further includes a second partition member; The second partition member includes a mounting portion and a first sound guiding tube portion connected to the mounting portion, the mounting portion is received in the receiving cavity, and the first sound guiding tube portion is received in the sound outlet to divide the sound outlet into at least two of the cavities; The first speaker is received in the mounting portion, and the side of the first speaker provided with the encapsulated sounding surface faces the first sound guiding tube portion, and the first speaker and the second partition member enclose to form the first sound outlet cavity.

7. The earphone according to claim 1, characterized in that, The first speaker is a packaged speaker, and the first speaker has a packaging housing; The packaging housing includes a packaged sounding surface portion and a second sound guiding tube portion connected to the packaged sounding surface portion, the second sound guiding tube portion is received in the sound outlet to divide the sound outlet into at least two of the cavities; or, the packaging housing includes a packaged sounding surface portion.

8. The earphone according to claim 1, wherein, The length of the first sound outlet cavity is 200 μm to 9 mm.

9. The earphone according to claim 8, wherein The length of the first sound outlet cavity is 1 mm to 5 mm.

10. The earphone according to claim 1, characterized in that, The earphone further includes a second speaker for generating mid-low frequency sound; The sound outlet is divided into two of the cavities, and the two cavities further include a second sound outlet cavity for conducting the mid-low frequency sound.

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