A data center negative pressure CDU

Abstract

The present invention discloses a data center negative pressure CDU, which belongs to the field of data center heat dissipation technology. The CDU includes a liquid supply tank, a vacuum pump, and components to be cooled. The vacuum pump and components to be cooled are both connected to the liquid supply tank, and the vacuum pump is connected to a gas-liquid separator. The liquid supply tank has a liquid storage chamber and a vacuum chamber that are interconnected. A first pump body is provided on the connecting pipeline between the liquid storage chamber and the vacuum chamber. Heat exchange components are connected to both ends of the liquid storage chamber. The liquid storage chamber and the vacuum chamber are respectively connected to the vacuum pump. A vacuum sub-pipeline connected to the gas-liquid separator is also provided on the vacuum pipeline between the vacuum chamber and the vacuum pump. A first valve is provided on the vacuum pipeline between the liquid storage chamber and the vacuum pump, as well as on the vacuum sub-pipeline, so that the absolute pressure in the vacuum chamber is lower than the absolute pressure in the liquid storage chamber. The present invention can effectively prevent leakage of the cooling medium, has a fast switching response, has a stable operating pressure, and has a good heat dissipation effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of data center heat dissipation, and in particular relates to a negative pressure CDU for a data center. Background Art

[0002] Cooling Distribution Units (CDUs) are thermal management devices based on liquid cooling technology. Their core task is to transfer heat generated in the data center to a cooling medium, which is then dissipated through the cooling system. Liquid-cooled CDUs, with their high efficiency, energy saving, and stability, provide an ideal cooling solution for modern data centers.

[0003] Current liquid-cooled CDUs mostly use positive pressure liquid supply. Once a leak occurs in the system, the cooling medium will leak into servers or other equipment that is not allowed to come into contact with the cooling medium, affecting data center operations.

[0004] Currently, some CDUs use negative pressure liquid supply to avoid cooling medium leakage, but there are problems such as unstable flow and poor heat dissipation effect. Summary of the Invention

[0005] The purpose of the present invention is to overcome the shortcomings of the existing technology and provide a data center negative pressure CDU with high integration, which can achieve pressures on both the supply and return sides lower than atmospheric pressure, effectively avoid leakage of the cooling medium, and have a fast switching response, making the operating pressure of the entire system more stable and ensuring the heat dissipation effect.

[0006] The object of the present invention is achieved through the following technical solutions:

[0007] A negative pressure CDU for a data center comprises a liquid supply tank, a vacuum pump, and a component to be cooled, wherein the vacuum pump and the component to be cooled are both connected to the liquid supply tank, and the vacuum pump is also connected to a gas-liquid separator;

[0008] Wherein, the liquid supply box has a liquid storage chamber and a vacuum chamber that are interconnected, a first pump body is provided on the communication pipeline between the liquid storage chamber and the vacuum chamber, one end of the to-be-cooled component is communicated with the liquid storage chamber, and the other end is communicated with the vacuum chamber, both ends of the liquid storage chamber are further connected to heat exchange components, the liquid storage chamber and the vacuum chamber are respectively communicated with the vacuum pump, a vacuum sub-pipeline that is communicated with the gas-liquid separator is further provided on the vacuum pipeline between the vacuum chamber and the vacuum pump, and a first valve is provided on the vacuum pipeline between the liquid storage chamber and the vacuum pump and on the vacuum sub-pipeline, so that the absolute pressure in the vacuum chamber is lower than the absolute pressure in the liquid storage chamber;

[0009] Through this embodiment, the liquid storage chamber supplies liquid to the part to be cooled, and provides a cooling medium for heat exchange with the part. The cooling medium after heat exchange flows back to the vacuum chamber. Under the action of the vacuum pump, the pressure on the water supply side and the return side are lower than the atmospheric pressure. Even if the system leaks, the cooling medium is guaranteed not to leak out. At the same time, the first pump body is used to draw the cooling medium flowing back into the vacuum chamber into the liquid storage chamber. The vacuum response is stable, which makes the system operating pressure more stable, makes the liquid supply more stable, and ensures the heat dissipation effect of the part to be cooled.

[0010] In one embodiment, the absolute pressure in the vacuum chamber ranges from 20 kPa to 30 kPa, and the absolute pressure in the liquid storage chamber ranges from 80 kPa to 90 kPa.

[0011] In one embodiment, pressure sensors are provided in both the vacuum chamber and the liquid storage chamber. Through this embodiment, the absolute pressures in the vacuum chamber and the liquid storage chamber are detected in real time to ensure the pressure stability of the system. The absolute pressure in the vacuum chamber can be adjusted by controlling the first pump body and the vacuum pump.

[0012] In one embodiment, the heat exchange assembly includes a heat exchanger, one side of the heat exchanger is connected to both ends of the liquid storage chamber, and the other side is connected to both ends of the cold source;

[0013] Through this embodiment, the liquid storage chamber in the liquid supply box remains connected to the heat exchange component, ensuring that the cooling medium therein can promptly exchange heat with the cold source to cool down after exchanging heat with the part to be cooled and heating up, thereby ensuring the heat dissipation effect on the part to be cooled.

[0014] In one embodiment, a first heat exchange pipeline and a second heat exchange pipeline connected to the heat exchanger are respectively provided at both ends of the liquid storage chamber, a circulation pump and a first filter are sequentially provided on the first heat exchange pipeline, a first temperature sensor is provided on the connecting pipeline between the liquid storage chamber and the component to be cooled, and a second valve is provided on the outlet pipeline connecting the cold source and the heat exchanger, and the second valve is electrically connected to the first temperature sensor;

[0015] Through this embodiment, the first temperature sensor is set to detect the temperature of the cooling medium entering the part to be cooled in real time. When it is detected that its temperature exceeds the preset value, the water flow rate on the cold source side is increased by adjusting the opening of the second valve, thereby accelerating the cooling speed of the cooling medium in the liquid storage chamber and ensuring the heat dissipation effect of the part to be cooled.

[0016] In one embodiment, a flow sensor is further provided on the communication pipeline between the liquid storage chamber and the component to be cooled.

[0017] In one embodiment, a vacuum breaking valve is further provided in the liquid storage chamber;

[0018] According to this embodiment, the vacuum breaker valve can be opened when the absolute pressure in the liquid storage chamber is less than 80 kPa to prevent the device from being damaged by vacuum, and can be closed when the absolute pressure in the liquid storage chamber is greater than 90 kPa.

[0019] In one embodiment, the first pump body is a submersible axial flow pump.

[0020] In one embodiment, a second filter is further provided on the outlet pipe connecting the cold source and the heat exchanger.

[0021] In one embodiment, second temperature sensors are provided on the connecting pipes between the heat exchanger and the liquid storage chamber at both ends, and on the connecting pipes between the heat exchanger and the cold source at both ends.

[0022] The beneficial effects of the present invention are:

[0023] The liquid storage chamber and vacuum chamber in the liquid supply tank are interconnected and are each connected to a vacuum pump. After the absolute pressure of the liquid storage chamber is pumped to 80kPa-90kPa, the vacuum chamber is further evacuated to reduce the absolute pressure therein to 20kPa-30kPa, so that the pressure on both the water supply side and the return side is lower than the atmospheric pressure, effectively preventing leakage of the cooling medium. The cooling medium returning to the vacuum chamber is pumped into the liquid storage tank using a submersible axial flow pump for continued heat exchange and liquid supply. The entire CDU system has a high degree of integration and a fast switching response, making the operating pressure of the entire system more stable and ensuring the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be described in more detail below based on embodiments and with reference to the accompanying drawings, wherein:

[0025] Figure 1 shows a schematic diagram of the system of the present invention;

[0026] In the drawings, like reference numerals are used for like parts, but the drawings are not necessarily true to scale.

[0027] Reference numerals:

[0028] 1-Liquid storage chamber, 2-Vacuum chamber, 3-Vacuum pump, 4-Part to be cooled, 5-Gas-liquid separator, 6-Submersible axial flow pump, 7-First electric two-way valve, 8-Second electric two-way valve, 9-First pressure sensor, 10-Second pressure sensor, 11-Vacuum breaking valve, 12-Heat exchanger, 13-Temperature sensor, 14-Flow sensor, 15-Electric regulating valve, 16-Circulation pump. DETAILED DESCRIPTION

[0029] The present invention will be further described below with reference to the accompanying drawings.

[0030] The present invention provides a data center negative pressure CDU, such as Figure 1 As shown, it includes a liquid supply tank, a vacuum pump 3 and a workpiece to be cooled 4. The vacuum pump 3 and the workpiece to be cooled 4 are both connected to the liquid supply tank, and the vacuum pump 3 is also connected to a gas-liquid separator 5;

[0031] The liquid supply box includes a liquid storage chamber 1 and a vacuum chamber 2 that are interconnected. A first pump body is provided on the communication pipeline between the liquid storage chamber 1 and the vacuum chamber 2. One end of the component 4 to be cooled is connected to the liquid storage chamber 1, and the other end is connected to the vacuum chamber 2. Heat exchange components are also connected to both ends of the liquid storage chamber 1. The liquid storage chamber 1 and the vacuum chamber 2 are respectively connected to a vacuum pump 3. A vacuum sub-pipeline that is connected to a gas-liquid separator 5 is also provided on the vacuum pipeline between the vacuum chamber 2 and the vacuum pump 3. A first valve is provided on the vacuum pipeline between the liquid storage chamber 1 and the vacuum pump 3 and on the vacuum sub-pipeline to ensure that the absolute pressure in the vacuum chamber 2 is lower than the absolute pressure in the liquid storage chamber 1.

[0032] Specifically, the absolute pressure range in the vacuum chamber 2 is 20 kPa to 30 kPa, and the absolute pressure range in the liquid storage chamber 1 is 80 kPa to 90 kPa;

[0033] It should be noted that the liquid storage chamber 1 and the vacuum chamber 2 in the liquid supply box are connected to each other, and the two are connected to a vacuum pump 3 respectively. After the system completes the liquid injection, the second electric two-way valve 8, namely V202, is opened, the first electric two-way valve 7, namely V201, is closed, and the vacuum pump 3 is started to evacuate the liquid storage chamber 1 and the vacuum chamber 2. When the absolute pressure reaches the preset value, the second electric two-way valve 8, namely V202, is closed, and the vacuum chamber 2 is continued to be evacuated to make the absolute pressure inside it reach 20kPa-30kPa. At this time, the cooling medium enters the liquid storage chamber 1. The cooling medium enters the component to be cooled 4, which is a server in this embodiment. After passing through the server, it enters the vacuum chamber 2. The submersible axial flow pump 6 is used to forcibly pump the cooling medium returned to the vacuum chamber 2 into the liquid storage chamber 1, thereby realizing the circulation of the cooling medium between the server and the component. In this process, the pressure on both the water supply side and the return side can be lower than the atmospheric pressure, effectively preventing the leakage of the cooling medium. The entire CDU system has a high degree of integration and a fast switching response, making the operating pressure of the entire system more stable, ensuring the heat dissipation effect of the server, and preventing the server from not being able to obtain timely heat dissipation when the pressure is unstable;

[0034] In one embodiment, pressure sensors are provided in both the vacuum chamber 2 and the liquid storage chamber 1, and a vacuum breaking valve 11 is also provided in the liquid storage chamber 1;

[0035] Specifically, if Figure 1As shown, a first pressure sensor 9 is provided in the liquid storage chamber 1, and a second pressure sensor 10 is provided in the vacuum chamber 2, so as to detect in real time whether the absolute pressures in the liquid storage chamber 1 and the vacuum chamber 2 are within a preset range. When the absolute pressure in the liquid storage chamber 1 is less than 80 kPa, the vacuum breaking valve 11 is opened, and when it is greater than 90 kPa, the vacuum breaking valve 11 is closed to prevent the liquid supply tank from being damaged due to vacuum. In the vacuum chamber 2, when it is monitored that the absolute pressure in the vacuum chamber 2 is greater than 30 kKa, the pressure of the vacuum chamber 2 can be reduced by increasing the displacement of the vacuum pump 3 to ensure that the absolute pressure of the vacuum chamber 2 is not greater than 30 kPa. When it is detected that the absolute pressure in the vacuum chamber 2 is less than 20 kPa, the first electric two-way valve 7 is briefly opened and then closed, that is, the short opening and closing of V201 is repeated multiple times, and this operation ensures that the absolute pressure in the vacuum chamber 2 is not less than 20 kPa.

[0036] In this embodiment, if Figure 1 As shown, the first pump body is a submersible axial flow pump 6, and the heat exchange component includes a heat exchanger 12. One side of the heat exchanger 12 is connected to the two ends of the liquid storage chamber 1, and the other side is connected to the two ends of the cold source. The two ends of the liquid storage chamber 1 are respectively provided with a first heat exchange pipeline and a second heat exchange pipeline connected to the heat exchanger 12. A circulation pump 16 and a first filter Z01 are sequentially provided on the first heat exchange pipeline. A temperature sensor 13 is provided on the connecting pipeline between the liquid storage chamber 1 and the component to be cooled 4. A second valve is provided on the outlet pipeline connecting the cold source and the heat exchanger 12. The second valve is electrically connected to the temperature sensor 13. A second filter Z02 is also provided on the outlet pipeline connecting the cold source and the heat exchanger 12.

[0037] It should be noted that after the cooling medium exchanges heat with the component to be cooled 4, i.e., the server, and flows back to the vacuum chamber 2, the cooling medium in the vacuum chamber 2 is forcibly pumped back to the liquid storage chamber 1 by the submersible axial flow pump 6. The cooling medium in the liquid storage chamber 1 exchanges heat with the cold source through the first heat exchange pipeline, the first filter Z01, and the heat exchanger 12 under the action of the circulation pump 16. The cooled cooling medium then passes through the second heat exchange pipeline and returns to the liquid storage chamber 1. The temperature sensor 13 provided on the connecting pipeline between the server and the liquid storage chamber 1 monitors the temperature of the cooling medium entering the server in real time. When the temperature of the cooling medium exceeds a preset value, the opening of the second valve is controlled, i.e., the flow rate of the cold source is increased to quickly cool the cooling medium. The cold source first passes through the second filter and then flows into the heat exchanger 12.

[0038] Furthermore, a flow sensor 14 is provided on the connecting pipe between the liquid storage chamber 1 and the part to be cooled 4, that is, the flow of the cooling medium flowing into the server is monitored by the flow sensor 14 provided between the liquid storage chamber 1 and the server to collect heat exchange data and facilitate the adjustment of the inflow of the cold source.

[0039] In one embodiment, Figure 1As shown, a temperature sensor 13 is provided between the part to be cooled 4 and the vacuum chamber 2 for monitoring the temperature of the cooling medium after heat exchange with the part to be cooled 4. Temperature sensors 13 are provided on the connecting pipes between the heat exchanger 12 and the liquid storage chamber 1 at both ends, as well as on the connecting pipes between the heat exchanger 12 and the cold source at both ends. That is, the temperature of the cooling medium before and after passing through the heat exchanger 12 is monitored, and the temperature of the cold source before and after passing through the heat exchanger 12 is monitored. It is convenient to adjust the opening of the electric regulating valve 15 in time according to the monitored temperature information, that is, adjust the opening of V301, so as to keep the temperature of the cooling medium stable, so as to provide stable heat dissipation for the part to be cooled 4;

[0040] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "inside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0041] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely illustrative of the principles and applications of the invention. It should be understood that many modifications may be made to the illustrative embodiments, and that other arrangements may be devised, without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in ways other than those described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be employed in conjunction with other described embodiments.

Claims

1. A data center negative pressure CDU, characterized in that: It includes a liquid supply tank, a vacuum pump and a workpiece to be cooled, wherein the vacuum pump and the workpiece to be cooled are both connected to the liquid supply tank, and the vacuum pump is also connected to a gas-liquid separator; wherein the liquid supply box comprises a liquid storage chamber and a vacuum chamber that are interconnected, a first pump body is provided on the communicating pipeline between the liquid storage chamber and the vacuum chamber, one end of the component to be cooled is communicated with the liquid storage chamber, and the other end is communicated with the vacuum chamber, both ends of the liquid storage chamber are connected to a heat exchange component, the liquid storage chamber and the vacuum chamber are communicated with the vacuum pump respectively, a vacuum sub-pipeline that is communicated with the gas-liquid separator is further provided on the vacuum pipeline between the vacuum chamber and the vacuum pump, a first valve is provided on the vacuum pipeline between the liquid storage chamber and the vacuum pump and on the vacuum sub-pipeline, the absolute pressure range in the vacuum chamber is 20 kPa to 30 kPa, and the absolute pressure range in the liquid storage chamber is 80 kPa to 90 kPa, so that the absolute pressure in the vacuum chamber is lower than the absolute pressure in the liquid storage chamber, a vacuum breaking valve is further provided in the liquid storage chamber, the vacuum breaking valve opens when the absolute pressure in the liquid storage chamber is lower than 80 kPa, and closes when the absolute pressure in the liquid storage chamber is higher than 90 kPa; The heat exchange assembly includes a heat exchanger, one side of the heat exchanger is connected to the two ends of the liquid storage chamber, and the other side is connected to the two ends of the cold source; A first temperature sensor is provided on the communication pipeline between the liquid storage chamber and the component to be cooled, and a second valve is provided on the outlet pipeline communicating between the cold source and the heat exchanger. The second valve is electrically connected to the first temperature sensor.

2. A data center negative pressure CDU according to claim 1, characterized in that: Pressure sensors are provided in both the vacuum chamber and the liquid storage chamber.

3. A data center negative pressure CDU according to claim 2, characterized in that: A first heat exchange pipeline and a second heat exchange pipeline connected to the heat exchanger are respectively provided at both ends of the liquid storage cavity. A circulation pump and a first filter are sequentially provided on the first heat exchange pipeline.

4. The data center negative pressure CDU according to claim 1, characterized in that: A flow sensor is also provided on the communication pipeline between the liquid storage chamber and the component to be cooled.

5. The data center negative pressure CDU according to claim 1, characterized in that: The first pump body is a submersible axial flow pump.

6. The data center negative pressure CDU according to claim 3, characterized in that: A second filter is also provided on the outlet pipeline connecting the cold source and the heat exchanger.

7. The data center negative pressure CDU according to claim 3, characterized in that: Second temperature sensors are provided on the connecting pipelines between the heat exchanger and the liquid storage chamber at both ends, and on the connecting pipelines between the heat exchanger and the cold source at both ends.

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