LED light source fluorescent glue arrangement method capable of reducing heat influence

Abstract

The invention relates to the technical field of LED light sources, and discloses an LED light source fluorescent glue arrangement method capable of reducing heat influence, which comprises the following steps of: 1) providing a substrate which is provided with a white wall and forms a light-emitting area in a surrounding manner; 2) arranging an LED chip in the light-emitting area; (3) the periphery of the light film layer is provided with a connecting part, the connecting part is fixed on the white wall, and the top opening is sealed by the fluorescent film layer; a heat insulation interval is formed between the fluorescent film layer and the LED chip; the LED chip is not wrapped by the fluorescent glue, in the light emitting process, the influence of heat emitted by the LED chip on the fluorescent film layer is small, the heat influence of the LED light source is reduced, the phenomena of cracking, deformation and the like of the fluorescent film layer are avoided, and the service life of the LED light source is greatly prolonged; in addition, the thickness change of the fluorescent film layer is small and can be regarded as uniform thickness arrangement, so that light rays emitted by the LED chip penetrate through the fluorescent film layer to irradiate outwards, the light spot effect is good, the light loss is reduced, and the lighting effect of the LED light source is improved.

Description

Technical Field

[0001] This invention patent relates to the technical field of LED light sources. Specifically, it relates to a method for arranging the fluorescent glue of an LED light source to reduce the thermal influence. Background Art

[0002] LED light sources are widely used in daily life. It includes a substrate, on which an LED chip is arranged. The light emitted by the LED chip needs to pass through the light-transmitting glue and then irradiate outward, so as to meet the set irradiation requirements.

[0003] In the prior art, when arranging the fluorescent glue on the substrate, generally the dispensing method is adopted to cover the LED chip with a fluorescent glue layer. The light emitted by the LED chip irradiates outward through the fluorescent glue layer. However, in this way, the fluorescent glue will wrap the entire LED chip. During the light emission of the LED chip, heat will be emitted outward, resulting in the fluorescent glue layer being prone to cracking and deformation, etc., greatly reducing the service life of the LED light source, and the thermal influence of the LED light source is relatively large. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for arranging the fluorescent glue of an LED light source to reduce the thermal influence, aiming to solve the problem of relatively large thermal influence of the LED light source in the prior art.

[0005] The present invention is implemented as follows. The method for arranging the fluorescent glue of an LED light source to reduce the thermal influence includes the following steps:

[0006] 1) Provide a substrate, on which there is a white wall arranged in a closed loop. The enclosure forms a light-emitting area, and the light-emitting area has a top opening arranged upward;

[0007] 2) Arrange an LED chip in the light-emitting area and electrically connect the LED chip to the substrate;

[0008] 3) Provide a fluorescent film layer made of fluorescent glue. The fluorescent film layer is in a sheet shape; the outer periphery of the fluorescent film layer has a connecting part arranged in a ring shape. The connecting part is fixed on the white wall from top to bottom. The fluorescent film layer closes the top opening; the fluorescent film layer is formed above the LED chip and has a heat insulation interval with the LED chip.

[0009] Further, in step 1), the white wall has an inner side wall facing the light-emitting area. Along the direction of the white wall from bottom to top, the inner side wall is arranged obliquely outward deviating from the light-emitting area.

[0010] Further, in step 1), the white wall and the substrate are integrally formed.

[0011] Further, in step 3), the fluorescent film layer has a suspended portion, the connecting portion surrounds the outer periphery of the suspended portion, the suspended portion is suspended above the LED chip, and there is the heat insulation interval between the suspended portion and the LED chip;

[0012] The bottom of the suspended portion bulges downward to form a plurality of strip-shaped protruding ribs, and the plurality of protruding ribs are arranged in a criss-cross pattern, and an enclosing area is formed by enclosing between adjacent protruding ribs.

[0013] Further, in step 3), the protruding ribs bulge downward in an arc shape, and the enclosing area faces away from the light-emitting area and is recessed upward.

[0014] Further, in step 3), the enclosing area is recessed upward to form a convex wall in a spherical shape.

[0015] Further, in step 1), the top of the white wall has a top surface, and a plurality of heat-conducting strips made of heat-conducting glue are arranged on the top surface. The plurality of heat-conducting strips are arranged at intervals around the circumference of the top surface, and there is a heat-conducting channel between adjacent heat-conducting strips;

[0016] In step 3), the connecting portion is fixedly butted on the plurality of heat-conducting strips from top to bottom, and there is a space between the connecting portion and the top of the white wall, and the connecting portion is formed above the heat-conducting channel.

[0017] Further, in step 3), a longitudinal ring is provided on the suspended portion, and the longitudinal ring is arranged around the circumference of the suspended portion; the top of the longitudinal ring is butted against the bottom of the suspended portion, and the bottom of the longitudinal ring is movably abutted against the inner side wall;

[0018] The bottom of the longitudinal ring is recessed upward to form a plurality of notch positions, and the plurality of notch positions are arranged at intervals around the circumference of the longitudinal ring, and there is a flat position between adjacent notch positions, and the flat position is movably abutted against the inner side wall.

[0019] Further, in step 1), a middle step is provided in the middle of the inner side wall, and the middle step is arranged around the circumference of the inner side wall; the bottom of the middle step has a horizontally arranged bottom surface, and the outer periphery of the middle step has an outer peripheral surface, and the outer peripheral surface is inclined in the same direction as the inner side wall; in step 3), the flat position is movably abutted against the outer peripheral surface and is located above the bottom surface.

[0020] Further, in step 3), the top of the fluorescent film layer is covered with a hard light-transmitting plate, and a plurality of annular grooves are provided on the top of the light-transmitting plate, and the annular grooves are arranged around the circumference of the light-transmitting plate, and the plurality of annular grooves are nested with each other at intervals;

[0021] After the fluorescent film layer covers the top opening, a light-transmitting grinding layer is formed by dispensing glue at the top of the light-transmitting plate. The bottom of the grinding layer is embedded in a plurality of annular grooves, and the top of the grinding layer protrudes in an arc shape.

[0022] Compared with the prior art, the method for arranging the fluorescent glue of the LED light source for reducing thermal influence provided by the present invention forms a white wall on the substrate, then arranges LED chips in the light-emitting area, and then caps the fluorescent film layer at the top opening of the white wall. There is a heat-insulating interval between the fluorescent film layer and the LED chips. The LED chips are not wrapped by the fluorescent glue, and the LED chips 200 are in a bare state. During the light-emitting process of the LED chips, the heat dissipated by them has little influence on the fluorescent film layer, reducing the thermal influence of the LED light source. The fluorescent film layer will not appear phenomena such as cracking and deformation, greatly improving the service life of the LED light source.

[0023] In addition, the thickness change of the fluorescent film layer is small and can be regarded as a uniform thickness arrangement. In this way, the light emitted by the LED chips passes through the fluorescent film layer and irradiates outward, with a good spot effect, reducing light loss, and improving the light efficiency of the LED light source. Description of the Drawings

[0024] Figure 1 is a sectional view of the structure for arranging the fluorescent glue of the LED light source for reducing thermal influence provided by the present invention;

[0025] Figure 2 is a sectional view of the fluorescent film layer provided by the present invention;

[0026] Figure 3 is Figure 1 an enlarged view of part A in Detailed Embodiments

[0027] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0028] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0029] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the accompanying drawings are only for illustrative purposes and should not be construed as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0030] Referring to Figures 1-3 as shown, it is a preferred embodiment provided by the present invention.

[0031] A method for arranging fluorescent glue of an LED light source for reducing thermal influence includes the following steps:

[0032] 1), Provide a substrate 100, on which there is a white wall 102 arranged in a closed loop, enclosing a light-emitting area 1022, and the light-emitting area 1022 has a top opening arranged upward;

[0033] 2), Arrange an LED chip 101 in the light-emitting area 1022 and electrically connect the LED chip 101 to the substrate 100; the LED chip 101 is arranged in the light-emitting area 1022 by die bonding and is electrically connected to the substrate 100 by arranging wires;

[0034] 3), Provide a fluorescent film layer 200 made of fluorescent glue, and the fluorescent film layer 200 is in sheet form; the outer periphery of the fluorescent film layer 200 has a connecting portion 2003 arranged in a ring, and the connecting portion 2003 is fixed on the white wall 102 from top to bottom, and the fluorescent film layer 200 closes the top opening; the fluorescent film layer 200 is formed above the LED chip 101 and has a heat insulation interval 206 between it and the LED chip 101.

[0035] The fluorescent film layer 200 can be prefabricated in sheet form and directly arranged on the white wall 102, and it can cover the top opening. The light emitted by the LED chip 101 directly passes through the fluorescent film layer 200 and irradiates outward, thereby obtaining the required lighting effect.

[0036] The method for arranging the phosphor glue of the LED light source with reduced thermal influence provided above forms a white wall 102 on the substrate 100, then arranges the LED chip 101 in the light-emitting area 1022, and then seals and covers the phosphor film layer 200 at the top opening of the white wall 102. There is a heat insulation interval 206 between the phosphor film layer 200 and the LED chip 101. The LED chip 101 is not wrapped by the phosphor glue, and the LED chip 101 is in a bare state. During the light-emitting process of the LED chip 101, the heat it emits has less influence on the phosphor film layer 200, reducing the thermal influence of the LED light source. The phosphor film layer 200 will not show phenomena such as cracking and deformation, greatly improving the service life of the LED light source.

[0037] In addition, the thickness change of the phosphor film layer 200 is small and can be regarded as a uniform thickness arrangement. In this way, the light emitted by the LED chip 101 passes through the phosphor film layer 200 and irradiates outward, with a good spot effect, reducing light loss and improving the light efficiency of the LED light source.

[0038] In this embodiment, in step 1), the white wall 102 has an inner side wall 1021 facing the light-emitting area 1022. Along the upward direction of the white wall 102, the inner side wall 1021 deviates from the light-emitting area 1022 and is arranged obliquely outward. In this way, part of the light emitted by the LED chip 101 is irradiated on the inner side wall 1021 and then, through the reflection of the inner side wall 1021, irradiates toward the phosphor film layer 200 and passes through the phosphor film layer 200 and irradiates outward, greatly improving the light efficiency of the LED light source.

[0039] In this embodiment, in step 1), the white wall 102 is integrally formed with the substrate 100. In this way, it is convenient for the forming of the substrate 100 and the white wall 102. Or, after the substrate 100 is formed, the white wall 102 can be formed on the substrate 100 through injection molding or the like.

[0040] In this embodiment, in step 3), the phosphor film layer 200 has a suspended portion 2005, and the connecting portion 2003 surrounds the outer periphery of the suspended portion 2005. The suspended portion 2005 is suspended above the LED chip and has the above-mentioned heat insulation interval 206 with the LED chip 101;

[0041] The bottom of the suspended portion 2005 bulges downward to form a plurality of strip-shaped protruding ribs 2001, and the plurality of protruding ribs 2001 are arranged in a crisscross manner. The adjacent protruding ribs 2001 enclose an enclosed area 2002.

[0042] By arranging a plurality of protruding ribs 2001, the support strength of the phosphor film layer 200 can be enhanced. When the phosphor film layer 200 is arranged on the top opening, it can avoid phenomena such as bending and deformation of the phosphor film layer 200 and maintain the overall structural stability of the phosphor film layer 200.

[0043] In this embodiment, in step 3), the protruding rib 2001 protrudes downward in an arc shape, and the enclosed area 2002 faces away from the light-emitting area 1022 and is recessed upward. In this way, the protruding rib 2001 and the enclosed area 2002 are arranged in a concave-convex manner away from each other, which can enhance the support strength of the fluorescent film layer 200, and can reflect the light emitted by the LED chip 101 in multiple ranges and positions, etc., so that the light transmitted through the fluorescent film layer 200 can be irradiated in multiple ranges.

[0044] In this embodiment, in step 3), the enclosed area 2002 is recessed upward to form a convex wall in a spherical shape. In this way, after the light emitted by the LED chip 101 enters the enclosed area 2002, under the condensing action of the convex wall, the light transmitted through the fluorescent film layer 200 can form a condensing effect after being irradiated outward, greatly improving the light efficiency of the LED light source.

[0045] In this embodiment, in step 1), the top of the white wall 102 has a top surface, and a plurality of heat-conducting strips 1028 made of heat-conducting glue are arranged on the top surface. The plurality of heat-conducting strips 1028 are arranged at intervals along the circumferential direction of the top surface, and there are heat-conducting channels between adjacent heat-conducting strips 1028;

[0046] In step 3), the connecting portion 2003 is fixedly butted on the plurality of heat-conducting strips 1028 from top to bottom. There is a gap between the connecting portion 2003 and the top of the white wall 102, and the connecting portion 2003 is formed above the heat-conducting channel.

[0047] By arranging the heat-conducting strips 1028, after the connecting portion 2003 is arranged on the top of the white wall 102, the connecting portion 2003 directly abuts against the heat-conducting strips 1028, so that a heat-conducting channel is formed between the connecting portion 2003 and the top of the white wall 102, which can dissipate the heat generated by the LED chip 101 in the light-emitting area 1022, and can ensure that the connection between the fluorescent film layer 200 and the white wall 102 is more stable.

[0048] In this embodiment, in step 3), a longitudinal ring 2004 arranged longitudinally is provided on the suspended portion 2005. The longitudinal ring 2004 is arranged along the circumferential direction of the suspended portion 2005; the top of the longitudinal ring 2004 is butted against the bottom of the suspended portion 2005, and the bottom of the longitudinal ring 2004 is movably abutted against the inner-facing side wall 1021;

[0049] The bottom of the longitudinal ring 2004 is recessed upward to form a plurality of notch positions. The plurality of notch positions are arranged at intervals along the circumferential direction of the longitudinal ring 2004, and there is a flat position between adjacent notch positions. The flat position is movably abutted against the inner-facing side wall 1021.

[0050] By arranging the longitudinal ring 2004, during the process of arranging the fluorescent film layer 200, the longitudinal ring 2004 can play a role in longitudinal positioning to ensure that the fluorescent film layer 200 can be accurately installed and arranged. Secondly, when the fluorescent film layer 200 is arranged on the white wall 102, the longitudinal ring 2004 is formed in the light-emitting area 1022 and surrounds the outer periphery of the LED chip 101. In this way, part of the light emitted by the LED chip 101 can pass through the longitudinal ring 2004 and then irradiate on the inner-facing wall 1021 for reflection, or directly be reflected through the longitudinal ring 2004, thereby enhancing the multi-position and multi-mode reflection of the light emitted by the LED chip 101 and greatly improving the light efficiency of the LED light source.

[0051] By arranging the notch, it is convenient for the heat in the light-emitting area 1022 to flow, and it will not form a closed area inside the light-emitting area 1022, which is convenient for the heat dissipation of the LED light source.

[0052] In this embodiment, in step 1), a middle step is provided in the middle of the inner-facing wall 1021, and the middle step is arranged around the circumference of the inner-facing wall 1021; the bottom of the middle step has a horizontally arranged bottom surface 1025, and the outer periphery of the middle step has an outer peripheral surface 1024, and the outer peripheral surface 1024 is inclined in the same direction as the inner-facing wall 1021; in step 3), the flat position is movably abutted on the outer peripheral surface 1024 and is located above the bottom surface 1025.

[0053] Since the outer peripheral surface 1024 is inclined, during the process of arranging the fluorescent film layer 200, the flat surface can be abutted on the outer peripheral surface 1024 and, under the guidance of the outer peripheral surface 1024, be stably arranged downward, thereby realizing the automatic arrangement and positioning of the fluorescent film layer 200 and facilitating the arrangement and installation of the fluorescent film layer 200.

[0054] In this embodiment, in step 3), the top of the fluorescent film layer 200 is covered with a hard light-transmitting plate 201, and a plurality of annular grooves 202 are provided on the top of the light-transmitting plate 201. The annular grooves 202 are arranged around the circumference of the light-transmitting plate 201, and the plurality of annular grooves 202 are arranged in a nested manner at intervals.

[0055] When the fluorescent film layer 200 covers the top opening, a light-transmitting grinding layer 203 is formed by dispensing glue on the top of the light-transmitting plate 201. The bottom of the grinding layer 203 is embedded in the plurality of annular grooves 202, and the top of the grinding layer 203 protrudes in an arc shape.

[0056] By arranging the light-transmitting plate 201, and the light-transmitting plate 201 being in a hard state, the fluorescent film layer 200 and the light-transmitting plate 201 are of an integral structure, thus ensuring the overall strength of the fluorescent film layer 200 and avoiding the phenomenon of deformation of the fluorescent film layer 200; secondly, by arranging the abrasion-resistant top layer 203 on the light-transmitting plate 201, it can play a role in protecting the entire LED light source and the fluorescent film layer 200.

[0057] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. Method for arranging fluorescent glue of LED light source with reduced thermal influence, characterized in that, It includes the following steps: 1). Provide a substrate, on which there is a white wall arranged in a closed loop, and the enclosure forms a light-emitting area, and the light-emitting area has a top opening arranged upward; 2). Arrange LED chips in the light-emitting area and electrically connect the LED chips to the substrate; 3). Provide a fluorescent film layer made of fluorescent glue, and the fluorescent film layer is sheet-shaped; the outer periphery of the fluorescent film layer has a connecting portion arranged in a ring shape, and the connecting portion is fixed on the white wall from top to bottom, and the fluorescent film layer closes the top opening; the fluorescent film layer is formed above the LED chips and has a heat insulation interval with the LED chips.

2. The method for arranging the fluorescent glue of the LED light source with reduced thermal influence according to claim 1, characterized in that In step 1), the white wall has an inner side wall facing the light-emitting area, and along the upward direction of the white wall, the inner side wall is inclined outwardly deviating from the light-emitting area.

3. The method for arranging the phosphor glue of the LED light source with reduced thermal influence according to claim 2, wherein, In step 1), the white wall and the substrate are integrally formed.

4. The method for arranging the phosphor glue of the LED light source with reduced thermal influence according to claim 2, wherein In step 3), the fluorescent film layer has a suspended portion, the connecting portion surrounds the outer periphery of the suspended portion, the suspended portion is suspended above the LED chips, and there is the heat insulation interval between the suspended portion and the LED chips; The bottom of the suspended portion protrudes downward to form a plurality of strip-shaped protruding ribs, and the plurality of protruding ribs are arranged in a criss-cross pattern, and an enclosed area is formed by enclosing between adjacent protruding ribs.

5. The method for arranging the phosphor glue of the LED light source with reduced thermal influence according to claim 4, wherein, In step 3), the protruding ribs protrude downward in an arc shape, and the enclosed area faces away from the light-emitting area and is recessed upward.

6. The method for arranging the phosphor glue of the LED light source with reduced thermal influence according to claim 5, characterized in that, In step 3), the enclosed area is recessed upward to form a convex wall in a spherical shape.

7. The method for arranging the phosphor glue of the LED light source with reduced thermal influence according to any one of claims 2 to 6, characterized in that, In step 1), the top of the white wall has a top surface, and a plurality of heat-conducting strips made of heat-conducting glue are arranged on the top surface, and the plurality of heat-conducting strips are arranged at intervals around the circumference of the top surface, and there is a heat-conducting channel between adjacent heat-conducting strips; In step 3), the connecting portion is fixed and butted on the plurality of heat-conducting strips from top to bottom, and there is a space between the connecting portion and the top of the white wall, and the connecting portion is formed above the heat-conducting channel.

8. The method for arranging the fluorescent glue of the LED light source with reduced thermal influence according to claim 4, wherein In step 3), a longitudinal ring arranged longitudinally is provided on the suspended portion, and the longitudinal ring surrounds the circumference of the suspended portion; the top of the longitudinal ring is butted against the bottom of the suspended portion, and the bottom of the longitudinal ring is movably abutted against the inner side wall; The bottom of the longitudinal ring is recessed upward to form a plurality of notch positions, and the plurality of notch positions are arranged at intervals around the circumference of the longitudinal ring, and there is a flat position between adjacent notch positions, and the flat position is movably abutted against the inner side wall.

9. The method for arranging the phosphor glue of the LED light source with reduced thermal influence according to claim 8, characterized in that, In step 1), a middle step is provided in the middle of the inner side wall, and the middle step surrounds the circumference of the inner side wall; the bottom of the middle step has a horizontally arranged bottom surface, and the outer periphery of the middle step has an outer peripheral surface, and the outer peripheral surface is inclined in the same direction as the inner side wall; in step 3), the flat position is movably abutted against the outer peripheral surface and is located above the bottom surface.

10. The method for arranging the phosphor glue of the LED light source with reduced thermal influence according to any one of claims 2 to 6, characterized in that, In step 3), the top of the fluorescent film layer is covered with a hard light-transmitting plate, and a plurality of annular grooves are provided on the top of the light-transmitting plate, and the annular grooves are arranged around the circumference of the light-transmitting plate, and the plurality of annular grooves are nested with each other at intervals; After the fluorescent film layer covers the top opening, a light-transmitting grinding top layer is formed by dispensing glue at the top of the light-transmitting plate. The bottom of the grinding top layer is embedded in a plurality of annular grooves, and the top of the grinding top layer protrudes in an arc shape.

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