Integrated circuit (IC) module, multi-interface IC card, and method of forming same

Abstract

An integrated circuit (IC) module (100) includes a lower substrate layer (104) having a hole (106), an IC chip (108) received within the hole, and an upper substrate layer (102) fixedly connected to the lower substrate layer and electrically connected to the IC chip, the upper substrate layer including a flat front main surface (109) and a flat rear main surface (110) parallel to each other, the upper substrate layer has a flat front main surface (112a-f, 113a-d), the flat rear main surface comprises a plurality of connection points (114) electrically connected with the IC chip, the plurality of connection points are electrically connected with a plurality of connection points (112a-f, 113a-d) on the flat front main surface of the upper substrate layer, and the IC module is in the shape of a prism, a cylinder or an elliptical cylinder.

Description

Technical Field

[0001] The present invention relates to an integrated circuit (IC) module, a multi-interface integrated circuit (IC) card (also referred to as a "smart card") having such an IC module, and a method of forming the IC module and the IC card. Background Art

[0002] Figures 1 and 2 illustrate an arrangement for forming an integrated circuit (IC) card (also referred to as a "smart card") in the prior art, with the overall reference numeral 10.

[0003] The smart card 10 has a plastic card 12 in which a cavity 14 is formed, for example, by milling. A loop antenna coil 16 is provided within the plastic card 12 to allow for non-contact (wireless) data transmission between the smart card 10 and an external card reader (not shown).

[0004] A conventional IC module (overall reference numeral 18) includes a lead frame 20 and is fixedly joined thereto. When the smart card 10 is assembled, one side of the lead frame 20 is exposed to the outside to allow data to be transmitted when an electrical connection is formed by contacting the lead frame 20 with an external card reader (not shown). The IC module 18 is fixedly joined and electrically connected to an IC chip 22, while the IC chip 22 is protected by an encapsulation (globe) 24 made of a protective material.

[0005] It can be seen that the cavity 14 has a double-layer structure. The lower layer structure is narrower and smaller in area than the upper layer structure. The lower layer structure is used to accommodate the IC chip 22 and the encapsulation 24, while the upper layer structure is used to accommodate and support the lead frame 20.

[0006] To fixedly join the IC module 18 to the plastic card 10 and establish an electrical connection between the lead frame 20 and the loop antenna coil 16, a conductive adhesive 26 is applied to the lead frame 20, and a heat-melt tape 28 is disposed between the exposed area of the loop antenna coil 16 and the conductive adhesive 26. During a heat treatment, the IC module 18 is fixedly joined (embedded) and electrically connected to the plastic card 12, as shown in Figure 2.

[0007] The conventional IC card 10 and its manufacturing method have the following drawbacks: 1. The IC module 18 physically contacts and is supported by the plastic card 12 only around a relatively narrow peripheral area. This weakens the physical connection between the IC module 18 and the plastic card 12, and thus weakens the physical strength of the IC card 10. 2. Forming the double-layer cavity 14 requires machining, which complicates the production process. 3. There is a space 30 in the lower layer structure of the cavity 14, which further weakens the physical strength of the IC card 10. Moisture may penetrate into the cavity 14, endangering the normal function of the IC card 10.

[0008] Accordingly, an object of the present invention is to provide an IC module, a multi-interface IC card, and a method of forming the IC module and the IC card to at least mitigate one of the above deficiencies, or at least provide a useful alternative to the public. Summary of the Invention

[0009] According to a first aspect of the present invention, there is provided an integrated circuit (IC) module, comprising a first substrate layer having a hole; an integrated circuit (IC) chip received in the hole of the first substrate layer; and a second substrate layer fixedly connected to the first substrate layer and electrically connected to the IC chip, wherein the second substrate layer includes: a substantially flat first major surface and a substantially flat second major surface, the first major surface and the second major surface being substantially parallel to each other, wherein the first major surface of the second substrate layer includes: a first plurality of connection points electrically connected to the IC chip, wherein the first plurality of connection points are electrically connected to a second plurality of connection points located on the second major surface of the second substrate layer, and wherein the IC module is in the shape of a prism, a cylinder, or an ellipsoid.

[0010] According to a second aspect of the present invention, there is provided a multi-interface integrated circuit (IC) card, comprising: at least one IC module, comprising a first substrate layer having a hole; an integrated circuit (IC) chip received in the hole of the first substrate layer; and a second substrate layer fixedly connected to the first substrate layer and electrically connected to the IC chip, wherein the second substrate layer includes: a substantially flat first major surface and a substantially flat second major surface, the first major surface and the second major surface being substantially parallel to each other, wherein the first major surface of the second substrate layer includes: a first plurality of connection points electrically connected to the IC chip, wherein the first plurality of connection points are electrically connected to a second plurality of connection points located on the second major surface of the second substrate layer, and wherein the IC module is in the shape of a prism, a cylinder, or an ellipsoid, at least one third substrate layer fixedly joined to the IC module; and a lead frame fixedly joined to the third substrate and electrically connected to the IC module, wherein the third substrate layer includes: a first communication interface and a second communication interface, the first communication interface being electrically connected to a first connection point and a second connection point among the second plurality of connection points on the second major surface of the second substrate layer of the IC module, and the second communication interface being electrically connected to a third connection point and a fourth connection point among the second plurality of connection points on the second major surface of the second substrate layer of the IC module.

[0011] According to a third aspect of the present invention, there is provided a method of forming an integrated circuit (IC) module, comprising providing a first substrate layer having holes; positioning an integrated circuit (IC) chip within the holes of the first substrate layer; and providing a second substrate layer having a substantially flat first major surface and a substantially flat second major surface, the first major surface and the second major surface being substantially parallel to each other, fixedly connecting the second substrate layer to the first substrate layer, electrically connecting a first plurality of connection points on the first major surface of the second substrate layer to the IC chip, wherein the first plurality of connection points are electrically connected to a second plurality of connection points located on the second major surface of the second substrate layer, and wherein the IC module is in the shape of a prism, a cylinder or an ellipsoid.

[0012] According to a fourth aspect of the present invention, there is provided a method of forming an integrated circuit (IC) card, comprising providing a first substrate layer having holes; positioning an integrated circuit (IC) chip within the holes of the first substrate layer; and providing a second substrate layer having a substantially flat first major surface and a substantially flat second major surface, the first major surface and the second major surface being substantially parallel to each other, fixedly connecting the second substrate layer to the first substrate layer, electrically connecting a first plurality of connection points on the first major surface of the second substrate layer to the IC chip, wherein the first plurality of connection points are electrically connected to a second plurality of connection points located on the second major surface of the second substrate layer, and wherein the IC module is in the shape of a prism, a cylinder or an ellipsoid, fixedly joining the IC module to a third substrate layer; electrically connecting a loop antenna coil of the third substrate layer to a first connection point and a second connection point of the second plurality of connection points on the second major surface of the second substrate layer of the IC module; fixedly joining a lead frame to the third substrate; and electrically connecting the lead frame to the IC module. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Embodiments of the present invention will now be described, by way of example only, in conjunction with the accompanying drawings, in which: FIG. 1 shows a schematic exploded cross-sectional view of a prior art integrated circuit (IC) card; FIG. 2 shows a schematic cross-sectional view of the prior art IC card of FIG. 1; Figure 3 shows a method of forming a multi-interface integrated circuit (IC) module according to an embodiment of the present invention; Figure 4 shows Figure 3 the front major surface of the upper substrate layer of Figure 5 shows Figure 3 the rear major surface of the upper substrate layer of Figure 6 showsFigure 3 The fixed bonding state of the IC module and the fitting substrate layer; Figure 7 shows Figure 6 The fitting substrate layer (fixedly bonded to the Figure 3 IC module) is sandwiched between the upper substrate and the lower substrate; Figure 8 shows a multi-layer structure including the Figure 7 fitting substrate layer; Figure 9 shows Figure 8 The front view of the lead frame of Figure 10 shows Figure 9 The rear view of the lead frame of Figure 11 shows Figure 8 The enlarged view of the connection between the lead frame in the multi-layer structure of Figure 3 and the IC module of Figure 12 shows the perspective view of the multi-interface integrated circuit (IC) module according to the present invention; Figure 13 shows Figure 12 The schematic exploded cross-sectional view of the IC card of Figure 14 shows Figure 12 The schematic cross-sectional view of the IC card of Detailed Description of the Invention

[0014] Figure 3 shows a method for forming a multi-interface (e.g., dual-interface) integrated circuit (IC) module (the overall reference numeral is 100) according to an embodiment of the present invention.

[0015] The IC module 100 includes an upper substrate layer 102, a lower substrate layer 104 having holes 106, and an IC chip 108. The IC chip 108 is received in the holes 106, and the IC module 100 is formed by laminating the upper substrate layer 102 and the lower substrate layer 104 with each other. It should be understood that in addition to the upper substrate layer 102 and the lower substrate layer 104, the IC module 100 may include one or more substrate layers, either between the upper substrate layer 102 and the lower substrate layer 104 or outside the upper substrate layer 102 and the lower substrate layer 104.

[0016] Figure 4 and Figure 5The flat front main surface 109 and the flat rear main surface 110 of the upper substrate layer 102 are respectively shown, and the two are parallel to each other. The front surface 109 has a total of ten electrical connection points 112a, 112b, 112c, 112d, 112e, and 112f (collectively referred to as "112a-f") and 113a, 113b, 113c, and 113d (collectively referred to as "113a-d"), and these electrical connection points are respectively electrically connected to ten corresponding electrical connection points 114 on the rear surface 110. The IC chip 108 is physically and electrically connected to the connection points 114 on the rear surface 110 of the upper substrate layer 102, and these connection points 114 are electrically connected to the connection points 112a-f on the front surface 109. The front surface 109 of the upper substrate layer 102 is also the front surface of the IC module 100. The electrical connection points 112a-f are used to be electrically connected to six pins of the IC chip 108. The total number of electrical connection points can also be more than ten, for example, in the case of using an 8-pin IC chip to form the IC module 100.

[0017] Figure 4 All ten electrical connection points 112a-f, 113a-d in are shown on the front surface 109 of the upper substrate layer 102. If necessary, some of these electrical connection points, such as the electrical connection points 113a-d, can be arranged on the rear surface 110 of the upper substrate layer 102.

[0018] The IC module 100 is in the shape of a thin sheet and is generally in the form of a rectangular prism, and it can also alternatively be in the form of a cylinder or an elliptical cylinder. In the form of a thin sheet that is generally in the form of a rectangular prism as shown in Figure 3 , the IC module 100 has two opposite flat main surfaces (one of which is the front surface 109 of the upper substrate layer 102), and these two opposite flat main surfaces are connected to each other by circumferential side walls perpendicular to the two. Figure 3 As shown in Figure 3 , the IC module 100 is fixedly joined to the inlay substrate layer 116, and the front surface 109 of the IC module 100 is exposed to the external environment. A copper ring antenna coil 118 is formed on the inlay substrate layer 116. Two free ends of the ring antenna coil 118 are respectively electrically connected to the electrical connection points 113a and 113b on the front surface 109 of the IC module 100, thereby allowing non-contact (wireless) data transmission between a reader (not shown) and a smart card formed by the inlay substrate layer 116.

[0019] As Figure 6 shown, the IC module 100 is fixedly joined to the inlay substrate layer 116, and the front surface 109 of the IC module 100 is exposed to the external environment. A copper ring antenna coil 118 is formed on the inlay substrate layer 116. Two free ends of the ring antenna coil 118 are respectively electrically connected to the electrical connection points 113a and 113b on the front surface 109 of the IC module 100, thereby allowing non-contact (wireless) data transmission between a reader (not shown) and a smart card formed by the inlay substrate layer 116.

[0020] As shown, a second communication interface 120 is provided on the hybrid substrate layer 116, and the second communication interface 120 is electrically connected to electrical connection points 113c and 113d on the front surface 109 of the IC module 100 via two wires 121, so that the second communication interface 120 can operate as another interface between the generated smart card and the external environment. Of course, if the second communication interface 120 has more electrical connection points to connect to the IC module 100, more electrical connection points can be provided on the IC module 100, and three or more wires 121 can be provided to electrically connect the IC module 100 and the second communication interface 120. The second communication interface 120 can be a fingerprint sensor for obtaining fingerprint details from a finger (such as a thumb) in physical contact with the fingerprint sensor. The second communication interface 120 can also be a light-emitting diode (LED) module for emitting light to communicate with the external environment.

[0021] To form a multi-interface (e.g., dual-interface) IC card according to the present invention (the overall reference numeral in Figure 12 is 200 in the drawings), then the hybrid substrate layer 116 is sandwiched between the upper substrate 122 and the lower substrate 124 (as Figure 7 shown), and the hybrid substrate layer 116 is fixedly joined to the upper substrate 122 and the lower substrate 124, for example, by lamination, to form a multi-layer structure 126 (as Figure 8 shown).

[0022] Then, the resulting multi-layer structure 126 is processed, for example, by a milling machine, to form a cavity 128 that passes through the upper substrate 122 until the front main surface 109 of the IC module 100 and the electrical connection points 112a-f and 113a-d are exposed to the external environment (see Figure 13 ). Then, a lead frame (not attached to the IC chip and not pre-joined to the IC module 100) 130 is disposed in the cavity 128 to fixedly join to the front main surface 109 of the IC module 100.

[0023] As Figure 13As shown in more detail in, the upper main surface 131a of the lead frame 130 is at least partially made of a conductive material such as metal, for example copper, and the opposite lower main surface 131b is also at least partially made of a conductive material such as metal, for example copper. The upper main surface 131a and the lower main surface 131b are electrically connected to each other via conductive vias 131c that penetrate the body of the lead frame 130 (for example, electroplating the peripheral walls of the vias 131c using a conductive material such as metal, for example copper). With this arrangement, the upper main surface 131a of the lead frame 130 can be used as a physical interface with an external card reader (not shown), whereby an electrical connection can be established between the card reader and the IC chip 108 of the IC module 100 via the following: the vias 131c, the lower main surface 131b, the corresponding connection points 114 on the rear surface 110 of the upper substrate layer 102 of the IC module 100, the conductive adhesive material 132 (to be discussed later), and the connection points 112a-f on the front main surface 109 of the IC module 100.

[0024] Figure 9 and 10 respectively show a front view and a rear view of the lead frame 130. The upper main surface 131a of the lead frame 130 is the same as that of a conventional lead frame in that it is also divided into six conductive regions, as shown by A, B, C, D, E, and F in Figure 9 . Electrical connection points A', B', C', D', E', and F' are formed on the lower main surface 131b of the lead frame 130, and each electrical connection point is electrically connected to the corresponding conductive regions A, B, C, D, E, and F. However, in view of the arrangement and positioning of the connection points 112a-f on the front main surface 109 of the IC module 100, as shown in Figure 10 . Each of the conductive regions D', E', and F' on the lower main surface 131b of the lead frame 130 is connected to the corresponding electrical connection points D”, E”, and F” on the lower main surface 131b of the lead frame 130. The electrical connection points A', B', C', D”, E”, and F” are positioned and arranged such that when the lead frame 130 is fixedly engaged with the front main surface 109 of the IC module 100, these electrical connection points are electrically connected to the connection points 112a-f on the front main surface 109 of the IC module 100.

[0025] As Figure 11 shown in more detail in, in order to facilitate the physical connection and electrical connection between the lead frame 130 and the front main surface 109 of the IC module 100, a conductive adhesive material, such as an anisotropic conductive (ACF) film or tape 132, is provided between the front main surface 109 of the IC module 100 and the lower main surface 131b of the lead frame 130. During the lamination process, the IC module 100 and the lead frame 130 are fixedly engaged and electrically connected to each other through the ACF tape 132 to form as shown inFigure 12 The IC card 200 shown.

[0026] As Figure 13 and Figure 14 shown, when forming the multi-interface IC card 200 according to the present invention, the IC module 100 having the IC chip 108 is first formed in the multi-layer structure 126 and electrically connected to the loop antenna coil 118. Then, the lead frame 130 is fixedly joined and electrically connected to the IC module 100 through the ACF tape 132 (and thus fixedly joined and electrically connected to the IC card 200). Similarly, the second communication interface 120 is also fixedly joined and electrically connected to the wire 121 through the ACF tape 132 (and thus fixedly joined and electrically connected to the IC card 200). It can be seen that compared with the prior art arrangements shown in FIGS. 1 and 2, the cavity 128 of the present invention has only a single-layer structure and has vertical side walls surrounding the cavity 128 to accommodate the IC module 100 and the lead frame 130, thus simplifying the milling process. In addition, the front main surface 109 of the IC module 100 is generally flat, which is convenient for supporting the lead frame 130 and joining with the lead frame 130. In addition, the physical connection and electrical connection between the IC module 100 and the loop antenna coil 118 are also enhanced.

[0027] It should be understood that the above embodiments only show examples in which the present invention can be implemented, and various modifications and / or adjustments can be made to the above embodiments without departing from the spirit of the present invention.

[0028] It should also be understood that for the sake of clarity, certain features of the present invention described in the context of separate embodiments can be combined and provided in a single embodiment. Conversely, for the sake of brevity, the various features of the present invention described in the context of a single embodiment can also be presented separately or in any suitable sub-combination.

Claims

1. An integrated circuit (IC) module, comprising: A first substrate layer having holes; An integrated circuit (IC) chip accommodated within the holes of the first substrate layer; And A second substrate layer fixedly connected to the first substrate layer and electrically connected to the IC chip, Wherein, the second substrate layer includes: a substantially flat first major surface and a substantially flat second major surface, the first major surface and the second major surface being substantially parallel to each other, Wherein, the first major surface of the second substrate layer includes: a first plurality of connection points electrically connected to the IC chip, Wherein, the first plurality of connection points are electrically connected to a second plurality of connection points located on the second major surface of the second substrate layer, and Wherein, the IC module is in the shape of a prism, a cylinder or an elliptical cylinder.

2. The module according to claim 1, wherein A first connection point and a second connection point among the second plurality of connection points on the second major surface of the second substrate layer are adapted to be electrically connected to a first communication interface.

3. The module according to claim 2, wherein The first communication interface includes a loop antenna coil.

4. The module according to claim 2 or 3, wherein A third connection point and a fourth connection point among the second plurality of connection points on the second major surface of the second substrate layer are adapted to be electrically connected to a second communication interface.

5. The module according to claim 4, wherein, The second communication interface includes a fingerprint sensor.

6. A multi-interface integrated circuit (IC) card, comprising: At least one IC module according to claim 1; At least one third substrate layer fixedly joined to the IC module; And A lead frame fixedly joined to the third substrate layer and electrically connected to the IC module, Wherein, the third substrate layer includes: a first communication interface and a second communication interface, The first communication interface is electrically connected to a first connection point and a second connection point among the second plurality of connection points on the second major surface of the second substrate layer of the IC module, The second communication interface is electrically connected to a third connection point and a fourth connection point among the second plurality of connection points on the second major surface of the second substrate layer of the IC module.

7. The card according to claim 6, wherein The first communication interface includes a loop antenna coil.

8. The card according to claim 6 or 7, wherein The second communication interface includes a fingerprint sensor or a light emitting diode (LED) module.

9. The card according to any one of claims 6 to 8, wherein The card includes a cavity having substantially vertical sidewalls, at least a portion of the lead frame and the IC module being accommodated within the cavity.

10. The card according to any one of claims 6 to 9, wherein, The lead frame is fixedly joined to the third substrate layer and electrically connected to the IC module via an anisotropic conductive film or tape.

11. The card according to any one of claims 6 to 10, wherein The second communication interface is fixedly joined to the third substrate and electrically connected to the IC module via an anisotropic conductive film or tape.

12. A method of forming an integrated circuit (IC) module, comprising: Providing a first substrate layer having holes; Positioning an integrated circuit (IC) chip within the holes of the first substrate layer; And Providing a second substrate layer having a substantially flat first major surface and a substantially flat second major surface, the first major surface and the second major surface being substantially parallel to each other, Fixing the second substrate layer to the first substrate layer, Electrically connecting a first plurality of connection points on the first major surface of the second substrate layer to the IC chip, Among them, the first plurality of connection points are electrically connected to a second plurality of connection points located on the second main surface of the second substrate layer, and Among them, the IC module is in the shape of a prism, a cylinder or an ellipsoid cylinder.

13. The method according to claim 12, the method further comprising: Electrically connect a first connection point and a second connection point among the second plurality of connection points on the second main surface of the second substrate layer to a first communication interface.

14. The method according to claim 13, wherein, The first communication interface includes a loop antenna coil.

15. The method according to claim 13 or 14, further comprising: Electrically connect a third connection point and a fourth connection point among the second plurality of connection points on the second main surface of the second substrate layer to a second communication interface.

16. The method according to claim 15, wherein, The second communication interface includes a fingerprint sensor.

17. A method of forming an integrated circuit (IC) card, wherein, Comprising: Fixedly bond the IC module formed according to claim 12 to a third substrate layer; Electrically connect the loop antenna coil of the third substrate layer to a first connection point and a second connection point among the second plurality of connection points on the second main surface of the second substrate layer of the IC module; Fixedly bond a lead frame to the third substrate; and Electrically connect the lead frame to the IC module.

18. The method according to claim 17, wherein, The first communication interface includes a loop antenna coil.

19. The method according to claim 18 or 19, wherein The second communication interface includes a fingerprint sensor.

20. The method according to any one of claims 17 to 19, wherein The card includes a cavity having substantially vertical sidewalls, and at least a portion of the lead frame and the IC module are received in the cavity.

21. The method according to any one of claims 17 to 20, the method further comprising: Fixedly bond the lead frame to the third substrate and electrically connect it to the IC module via an anisotropic conductive film or tape.

22. The method according to any one of claims 17 to 21, the method further comprising: Fixedly bond the second communication interface to the third substrate and electrically connect it to the IC module via an anisotropic conductive film or tape.

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