Laser cutting equipment for metal material machining

Abstract

The invention relates to the technical field of laser processing, in particular to laser cutting equipment for metal material processing, which comprises a bottom frame, a bottom plate is arranged in the bottom frame, a plurality of through holes are formed in the bottom plate, vertical columns are symmetrically arranged on two sides of the bottom frame, a top frame is jointly arranged at the upper ends of the plurality of vertical columns, and the bottom plate and the bottom frame are symmetrical and rotatably provided with a rotating shaft in a penetrating manner. A cross beam is arranged in the top frame in a sliding mode, a sliding block is arranged on the cross beam in a sliding mode, a laser transmitter is arranged at the lower end of the sliding block, a cooling piece is arranged on the laser transmitter and comprises circulation holes formed in a rotating shaft, connecting rings are arranged on the stand columns on the two sides through supports respectively, and the connecting rings are rotationally connected with the corresponding circulation holes. Water flow flows into the telescopic hose on the other side from the connecting pipe on one side of the fixing sleeve, then penetrates through the connecting ring on the other side to enter the circulating hole in the other side, and then returns into the bottom frame from the water inlet in the other side, so that circulation is formed.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and particularly to a laser cutting device for metal material processing. Background Art

[0002] Metal laser cutting is an advanced processing technology that uses a high-energy density laser beam to cut metal materials. This technology focuses the laser beam on the metal surface, causing the material to quickly melt, vaporize, or reach the ignition point, and blowing away the melted or vaporized substances with a high-pressure gas coaxial with the beam, thereby achieving precise cutting of metal materials.

[0003] Due to its high efficiency, precision, and flexibility, this technology has been widely used in modern manufacturing, especially in the field of metal processing with high requirements for precision and surface quality. Laser cutting is used to cut various metal sheets, tubes, and profiles. Its high efficiency and flexibility make laser cutting an indispensable part of mechanical manufacturing. For example, laser cutting can be used to manufacture various mechanical parts, such as gears, bearings, and shafts, which have high requirements for dimensional accuracy and surface quality.

[0004] For example, a laser cutting machine with multi-angle adjustment with the application number CN201910462826.2. This prior art includes a laser cutting machine main body, a cutting head, and a movable shaft. The lower end of the laser cutting machine main body is fixedly installed with a working support table, and the upper end of the laser cutting machine main body is provided with a support shaft. One side of the laser cutting machine main body is fixedly installed with a connecting wire, and one end of the connecting wire is provided with an operation control box. The upper surface of the laser cutting machine main body is provided with a movable placement table, and one side of the movable placement table is provided with a moving track. There are a moving support table, a rotating shaft, a movable placement table, and a moving track, which can facilitate the staff to move and operate the device, improve the flexibility of use, and at the same time enable the laser cutting machine to rotate flexibly. However, the disadvantage of this invention is that it has no heat dissipation structure, and the range of angle adjustment of the device is relatively small.

[0005] However, the above-mentioned prior art still has some defects when it comes to laser processing:

[0006] The rotation of the fan blades in the above-mentioned prior art drives the air flow, enabling the hot air in the heat dissipation outer frame to exchange heat with the outside air through the heat dissipation holes, dissipating heat from the laser cutting machine, and ensuring that the device will not be affected by overheating during long-term operation. However, in the actual application process, the high temperature during laser cutting comes from the laser emitter and the vicinity of the cutting point. The air flow driven by the fan blades mainly dissipates heat from the overall device. For local high-temperature areas such as the laser emitter and the vicinity of the cutting point, the traditional air flow method is difficult to achieve rapid and effective heat transfer, which may lead to too high local temperature, thereby affecting the stability of the laser emitter and the cutting quality.

[0007] Meanwhile, during the cutting process, the laser beam will form a cutting seam on the surface of the metal material. As the cutting progresses, the material will gradually peel off along the cutting seam, and some of the material will break into fine particles. These particles will be lifted by the air flow to form dust. The metal particles suspended in the air may deposit on various components of the laser cutting equipment, such as lenses, mirrors, and guide rails, affecting the accuracy and lifespan of the equipment.

[0008] Based on this, under the statement of the above viewpoints, there is still room for improvement in the existing technology for the laser processing method. Summary of the Invention

[0009] To solve the above technical problems, the present application provides a laser cutting equipment for metal material processing, adopting the following technical solutions:

[0010] A laser cutting equipment for metal material processing includes a bottom frame. A bottom plate is arranged inside the bottom frame. A plurality of through holes are opened on the bottom plate. Columns are symmetrically arranged on both sides of the bottom frame. A top frame is jointly arranged at the upper ends of multiple columns. The bottom plate and the bottom frame are symmetrically and rotatably penetrated by a rotating shaft. The upper end of the rotating shaft rotatably penetrates the top frame and is threadedly connected thereto. A cross beam is slidably arranged inside the top frame. A sliding groove is opened on the cross beam. A sliding block is slidably arranged inside the sliding groove. A laser emitter is arranged at the lower end of the sliding block. A cooling component is arranged on the laser emitter;

[0011] The cooling component includes a circulation hole arranged inside the rotating shaft. An inlet is opened in the circulation hole inside the bottom frame. Connecting rings are respectively arranged on both sides of the columns through brackets. The connecting rings are rotatably connected to the corresponding circulation holes. A fixing sleeve is arranged on the laser emitter. Connecting pipes are symmetrically arranged on the fixing sleeve. A telescopic hose is arranged between the connecting pipes and the corresponding connecting rings.

[0012] Preferably, the cooling component further includes a ring sleeve rotatably arranged on the rotating shaft. The ring sleeve corresponds to the inlet. A water inlet pipe communicated with the ring sleeve is arranged inside the bottom frame through a bracket.

[0013] Preferably, a transmission shaft rotatably penetrating the top frame and threadedly connected to the cross beam is arranged on the top frame. A driving shaft rotatably arranged inside the sliding groove and threadedly connected to the sliding block is arranged inside the sliding groove.

[0014] Preferably, a downward pressing limiting component is arranged on the top frame;

[0015] The downward pressing limiting component includes downward pressing rods symmetrically penetrating the top frame. A downward pressing frame is jointly arranged at the lower ends of multiple downward pressing rods. A return spring is arranged between the downward pressing frame and the top frame.

[0016] Preferably, a high-transparency glass is arranged inside the downward pressing frame, and an avoidance groove corresponding to the rotating shaft is opened on the downward pressing frame.

[0017] Preferably, a water blocking frame is arranged on the downward pressing frame.

[0018] Preferably, an adjusting screw rod is rotatably inserted through the top frame and threadedly connected thereto. A lower limiting plate that is slidably and rotatably arranged on the rotating shaft and rotatably connected to the adjusting screw rod is located directly above the avoidance groove.

[0019] Preferably, a glass limiting member is arranged on the pressing frame;

[0020] The glass limiting member includes a picking and placing groove opened on one side of the pressing frame. The high-transparency glass is slidably arranged in the picking and placing groove, and a limiting telescopic plate that abuts against the high-transparency glass is arranged in the picking and placing groove.

[0021] Preferably, pin grooves are symmetrically opened on both sides of the limiting telescopic plate. Guide grooves that correspond to the pin grooves one by one are symmetrically opened on the pressing frame, and the upper ends of the guide grooves penetrate through the pressing frame. A pin block is slidably arranged in the guide grooves, and a pressing spring is arranged between one side of the pin block and the guide grooves.

[0022] Preferably, a guiding inclined surface is arranged on one side of the pin block.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. In the present invention, water flows from the connecting pipe on the other side of the fixed sleeve into the telescopic hose on the other side, then passes through the connecting ring on the other side and enters the circulation hole on the other side, and then returns to the bottom frame from the water inlet on the other side to form a cycle.

[0025] During the cycling process of the water, the heat generated by the laser emitter is continuously carried away, and continuous cycling is carried out by the water pump in the bottom frame to ensure that the laser emitter is always within a stable temperature range. The connection ring is connected to the telescopic hose, so as not to affect the rotation of the rotating shaft.

[0026] 2. When the present invention cuts a metal material, the laser emitter emits laser light that passes through the high-transparency glass to cut the metal material. The high-transparency glass serves as a physical barrier between the laser emitter and the metal material, and can prevent the molten slag, spatter, and smoke generated during the cutting process from polluting or damaging the laser emitter.

[0027] 3. During the laser cutting process of the present invention, water will quickly fill the gap cut by the laser beam. Due to the presence of water, the cutting area is surrounded by water, forming a relatively closed environment. Since the density and viscosity of water are much greater than those of air, the buoyancy and resistance of metal particles in water are relatively large, and it is difficult for them to freely rise as in air. The water medium effectively inhibits the rising of metal particles and keeps them in water instead of suspending in air. At the same time, water has excellent cooling performance and can quickly cool the metal particles and molten metal generated during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic structural diagram of the present invention.

[0029] Figure 2 is a schematic structural diagram of the top frame of the present invention.

[0030] Figure 3 is a schematic structural diagram of the cooling member of the present invention.

[0031] Figure 4 is the present invention Figure 3 partial enlarged view of part A.

[0032] Figure 5 is a cross-sectional view of the cooling member of the present invention.

[0033] Figure 6 is the present invention Figure 5 partial enlarged view of part B.

[0034] Figure 7 is the present invention Figure 5 partial enlarged view of part C.

[0035] Figure 8 is a schematic structural diagram of the downward pressing limiting member of the present invention.

[0036] Figure 9 is the present invention Figure 8 partial enlarged view of part D.

[0037] Figure 10 is a schematic structural diagram of the downward pressing frame of the present invention.

[0038] Figure 11 is a schematic structural diagram of the glass limiting member of the present invention.

[0039] Figure 12 is the present invention Figure 11 partial enlarged view of part E.

[0040] Figure 13 is a schematic structural diagram of the telescopic plate of the present invention.

[0041] Explanation of reference numerals: 1, bottom frame; 11, column; 2, bottom plate; 21, rotating shaft; 22, through hole; 3, top frame; 31, cross beam; 311, sliding groove; 32, sliding block; 4, laser emitter; 5, cooling member; 51, circulation hole; 512, water inlet; 52, connecting ring; 53, fixed sleeve; 54, connecting pipe; 55, telescopic hose; 56, ring sleeve; 57, water inlet pipe; 58, transmission shaft; 59, drive shaft; 6, downward pressing limiting member; 61, downward pressing rod; 62, downward pressing frame; 63, return spring; 64, high-transparency glass; 65, avoidance groove; 66, water blocking frame; 67, adjusting screw; 68, limiting plate; 7, glass limiting member; 71, picking and placing groove; 72, telescopic plate; 73, pin groove; 74, guide groove; 75, pin block; 76, pressing spring; 77, guiding inclined surface. Detailed Description of the Invention

[0042] The following will further elaborate on this application in conjunction with Figures 1 to 13 to provide a more detailed description of this application.

[0043] An embodiment of this application discloses a laser cutting device for metal material processing. By pushing aside water with glass, an anhydrous contact surface is formed, ensuring the penetrability of the laser beam and the cutting quality.

[0044] Embodiment 1:

[0045] Referring to Figure 1 and Figure 2 As shown, a laser cutting device for metal material processing includes a bottom frame 1. A bottom plate 2 is arranged inside the bottom frame 1. A plurality of through holes 22 are formed on the bottom plate 2. Columns 11 are symmetrically arranged on both sides of the bottom frame 1. A top frame 3 is jointly arranged at the upper ends of multiple columns 11. A cross beam 31 is slidably arranged inside the top frame 3. A sliding groove 311 is formed on the cross beam 31. A sliding block 32 is slidably arranged inside the sliding groove 311.

[0046] When cutting metal, first place the metal material on the bottom plate 2. Then, drive the transmission shaft 58 rotatably passing through the top frame 3 through a servo motor. The transmission shaft 58 drives it to move on the top frame 3 through a threaded connection with the cross beam 31. At the same time, drive the drive shaft 59 rotatably arranged inside the sliding groove 311 through a servo motor to rotate. The rotating drive shaft 59 will drive the sliding block 32 to move inside the sliding groove 311 through a threaded connection with it.

[0047] A laser emitter 4 is arranged at the lower end of the sliding block 32. The laser emitter 4 is used to emit a laser beam with high energy density for cutting. Therefore, the movement of the sliding block 32 directly controls the horizontal and vertical positions of the laser emitter 4, realizing the precise scanning of the laser beam on the metal material surface and the control of the cutting path.

[0048] The bottom plate 2 is symmetric with the bottom frame 1 and rotatably penetrates a rotating shaft 21. The upper end of the rotating shaft 21 rotatably penetrates the top frame 3 and is threadedly connected to it. The threaded connection between the rotating shaft 21 and the top frame 3 realizes the precise lifting of the top frame 3. By controlling the rotation of the rotating shaft 21, the fine adjustment of the height of the top frame 3 is realized, thereby controlling the distance between the laser emitter 4 and the metal material to ensure the cutting quality.

[0049] During the process of the laser emitter 4 cutting metal, a cooling component 5 is arranged on the laser emitter 4. The cooling component 5 designs cooling channels on the laser emitter 4, and cooling water circulates through these channels to take away heat.

[0050] Referring to Figure 3 , Figure 4 and Figure 5As shown, specifically, the cooling component 5 includes a circulation hole 51 provided inside the rotating shaft 21. An inlet 512 located inside the bottom frame 1 is formed in the circulation hole 51. Connecting rings 52 are respectively arranged on the two side columns 11 through brackets. The connecting ring 52 is rotatably connected to the corresponding circulation hole 51. A fixing sleeve 53 is arranged on the laser emitter 4. Connecting pipes 54 are symmetrically arranged on the fixing sleeve 53. A telescopic hose 55 is arranged between the connecting pipe 54 and the corresponding connecting ring 52.

[0051] Inject water into the bottom frame 1, and pump the water from the inlet 512 on one side into the circulation hole 51 on one side through a water pump. The water flow passes through the circulation hole 51 and the connecting ring 52 on one side and enters the telescopic hose 55 on one side, and then enters the fixing sleeve 53 through the telescopic hose 55 and the connecting pipe 54 on one side. The water flow cools the laser emitter 4 inside the fixing sleeve 53.

[0052] After that, the water flow flows into the telescopic hose 55 on the other side from the connecting pipe 54 on the other side of the fixing sleeve 53, then passes through the connecting ring 52 on the other side and enters the circulation hole 51 on the other side, and then returns to the bottom frame 1 from the inlet 512 on the other side to form a cycle.

[0053] During the circulation process, the water flow continuously takes away the heat generated by the laser emitter 4 and is continuously circulated by the water pump in the bottom frame 1 to ensure that the laser emitter 4 is always within a stable temperature range. It is connected through the connecting ring 52 and the telescopic hose 55, thus not affecting the rotation of the rotating shaft 21.

[0054] Refer to Figure 5 、 Figure 6 and Figure 7 As shown, a ring sleeve 56 is rotatably arranged on the rotating shaft 21. The ring sleeve 56 corresponds to the inlet 512. A water inlet pipe 57 communicated with the ring sleeve 56 is arranged in the bottom frame 1 through a bracket.

[0055] During the rotation of the rotating shaft 21, the ring sleeve 56 does not rotate under the normal support of the water inlet pipe 57. The water flow passes through the water inlet pipe 57 and enters the ring sleeve 56, and then passes through the inlet 512 in the ring sleeve 56 and enters the circulation hole 51, so that the water flow can stably enter the circulation hole 51. The water flow continuously enters the circulation hole 51 of the laser emitter 4, thereby achieving an efficient cooling effect.

[0056] Refer to Figure 8 、 Figure 9 and Figure 10 As shown, a downward pressing limiting component 6 is arranged on the top frame 3. The downward limiting component will limit the metal material on the bottom plate 2. The downward pressing limiting component 6 restricts its movement through contact with the metal material, thereby ensuring the stability and precision of the cutting process.

[0057] Specifically, the downward pressing limiting member 6 includes downward pressing rods 61 symmetrically inserted through the top frame 3. A downward pressing frame 62 is jointly provided at the lower ends of the plurality of downward pressing rods 61. A return spring 63 is provided between the downward pressing frame 62 and the top frame 3.

[0058] When cutting a metal material, the rotating shaft 21 drives the top frame 3 to move downward. The top frame 3 will drive the downward pressing frame 62 through the downward pressing rods 61, so that the high-transparency glass 64 provided in the downward pressing frame 62 presses on the metal material. At this time, the top frame 3 continues to press downward and compresses the return spring 63, so that the downward pressing frame 62 drives the high-transparency glass 64 to limit the metal material.

[0059] When cutting a metal material, the laser emitter 4 emits laser light that passes through the high-transparency glass 64 to cut the metal material. The high-transparency glass 64 serves as a physical barrier between the laser emitter 4 and the metal material, and can prevent the molten slag, spatter, and smoke generated during the cutting process from contaminating or damaging the laser emitter 4.

[0060] And an avoidance groove 65 corresponding to the rotating shaft 21 is opened on the downward pressing frame 62, which is used to avoid the movement path of the rotating shaft 21, ensuring that the rotating shaft 21 will not interfere with the downward pressing frame 62 during rotation. The avoidance groove 65 is opened on the side of the downward pressing frame 62 and corresponds to the installation position and movement path of the rotating shaft 21.

[0061] Since water is injected into the bottom frame 1, when the metal material is placed on the bottom plate 2, the metal material will be immersed in the water. When the downward pressing frame 62 drives the high-transparency glass 64 to press on the metal material, the high-transparency glass 64 continues to move downward to push the water around. The water flows around under the extrusion of the glass, and the water-blocking frame 66 provided on the downward pressing frame 62 can block the water from entering the upper end of the high-transparency glass 64.

[0062] The water between the contact surface of the high-transparency glass 64 and the metal material will be pushed away, forming a water-free contact surface. The water-free contact surface ensures that the laser beam can efficiently penetrate the high-transparency glass 64 and directly act on the surface of the metal material. At the same time, the water-free contact surface can avoid the influence of water on the cutting process, such as the interference of water vapor, bubbles, or impurities on the laser beam.

[0063] During the laser cutting process, the water will quickly fill the gap cut by the laser beam. Due to the presence of water, the cutting area is surrounded by water, forming a relatively closed environment. Since the density and viscosity of water are much greater than that of air, the buoyancy and resistance of metal particles in water are relatively large, and it is difficult to freely rise like in the air. The water medium effectively inhibits the rise of metal particles and keeps them in the water instead of floating in the air. At the same time, water has excellent cooling performance and can quickly cool the metal particles and molten metal generated during the cutting process.

[0064] The adjusting screw rod 67 is rotatably penetrated through the top frame 3 and is threadedly connected thereto. The lower limiting plate 68 which is rotationally connected to the adjusting screw rod 67 is slidably and rotationally arranged on the rotating shaft 21. The limiting plate 68 is located directly above the avoiding groove 65.

[0065] When the top frame 3 moves downward, the top frame 3 drives the limiting plate 68 to move downward synchronously through the adjusting screw rod 67. When the pressing frame 62 presses on the metal material, the top frame 3 continues to move downward until the limiting plate 68 contacts the upper end of the bottom frame 1. The top frame 3 cannot continue to move downward. The lower limiting plate 68 serves as a limiting device for the downward movement of the top frame 3, precisely controlling the lowest position of the top frame 3 and preventing it from moving downward excessively.

[0066] By rotating the adjusting screw rod 67, the adjusting screw rod 67 drives the limiting plate 68 to move through the threaded connection with the top frame 3, thereby adjusting the distance between the laser emitter 4 and the metal material. In addition, the limiting plate 68 can also ensure that the high-transparency glass 64 is not extruded by height. The presence of the limiting plate 68 ensures that the high-transparency glass 64 will not be extruded due to the excessive downward pressure of the top frame 3. Even when the top frame 3 continues to receive a downward force, the limiting plate 68 will prevent it from further descending, thereby protecting the high-transparency glass 64.

[0067] Embodiment 2:

[0068] Referring to Figure 10 、 Figure 11 、 Figure 12 and Figure 13 As shown, on the basis of Embodiment 1, a glass limiting member 7 is arranged on the pressing frame 62. The glass limiting member 7 limits the high-transparency glass 64. The high-transparency glass 64 can be disassembled and replaced through the glass limiting member 7 to select a high-transparency glass 64 with a suitable thickness according to the laser power and cutting requirements, avoiding excessive energy loss of the laser beam caused by too thick glass.

[0069] Specifically, the glass limiting member 7 includes a placing and removing groove 71 opened on one side of the pressing frame 62. The high-transparency glass 64 is slidably arranged in the placing and removing groove 71. A limiting telescopic plate 72 that abuts against the high-transparency glass 64 is arranged in the placing and removing groove 71.

[0070] Pin grooves 73 are symmetrically opened on both sides of the limiting telescopic plate 72. Guide grooves 74 that correspond to the pin grooves 73 one by one are symmetrically opened on the pressing frame 62. The upper ends of the guide grooves 74 penetrate through the pressing frame 62. Pin blocks 75 are slidably arranged in the guide grooves 74.

[0071] When installing the high-transparency glass 64, first insert the high-transparency glass 64 from the picking and placing slot 71 into the lower pressing frame 62, and then insert the telescopic plate 72 into the picking and placing slot 71. During the insertion of the telescopic plate 72, both sides of the telescopic plate 72 will contact the guiding inclined surface 77 provided on one side of the pin block 75, causing the pin block 75 to compress the tightening spring 76 provided between one side of it and the guide groove 74, so that the telescopic plate 72 can smoothly enter the picking and placing slot 71.

[0072] At this time, the compressed tightening spring 76 will push the pin block 75 into the pin slot 73 to limit the telescopic plate 72. The telescopic end of the telescopic plate 72 will press against one side of the high-transparency glass 64, causing the telescopic end of the telescopic plate 72 to contract into the fixed end of the telescopic plate 72 to store potential energy, so as to limit the high-transparency glass 64 in the lower pressing frame 62.

[0073] When disassembling the high-transparency glass 64, toggle the pin block 75 from the upper end of the guide groove 74 to compress the tightening spring 76 so that it exits the pin slot 73, releasing the restriction on the telescopic plate 72. At this time, the potential energy stored by the telescopic end of the telescopic plate 72 will push the telescopic plate 72 out of the picking and placing slot 71, and then the high-transparency glass 64 can be taken out from the picking and placing slot 71, realizing the stable fixation and convenient disassembly of the high-transparency glass 64, and ensuring the safety and convenience of the high-transparency glass 64 during the installation and disassembly process.

[0074] The implementation principle of the present invention is as follows:

[0075] (1): When cutting the metal, first place the metal material on the bottom plate 2. The top frame 3 will drive the lower pressing frame 62 through the lower pressing rod 61, so that the high-transparency glass 64 provided in the lower pressing frame 62 presses on the metal material. At this time, the top frame 3 continues to press down and compress the return spring 63, so that the lower pressing frame 62 drives the high-transparency glass 64 to limit the metal material.

[0076] (2): When cutting the metal material, the laser emitter 4 emits laser light to cut the metal material through the high-transparency glass 64. The high-transparency glass 64 serves as a physical barrier between the laser emitter 4 and the metal material, which can prevent the molten slag, spatter and smoke generated during the cutting process from polluting or damaging the laser emitter 4.

[0077] (3): Water flows from the connecting pipe 54 on the other side of the fixed sleeve 53 into the telescopic hose 55 on the other side, then passes through the connecting ring 52 on the other side and enters the flow hole 51 on the other side, and then returns to the bottom frame 1 from the water inlet 512 on the other side to form a cycle.

[0078] During the cycle, the water continuously takes away the heat generated by the laser emitter 4 and is continuously circulated by the water pump in the bottom frame 1 to ensure that the laser emitter 4 is always within a stable temperature range.

[0079] (4): Move the pin block 75 to compress the spring 76 and withdraw it from the pin groove 73, thereby releasing the restriction on the telescopic plate 72. At this time, the potential energy stored in the telescopic end of the telescopic plate 72 will push the telescopic plate 72 out of the loading and unloading groove 71, and then the high-transmittance glass 64 can be taken out from the loading and unloading groove 71, thereby achieving a stable fixation and convenient removal of the high-transmittance glass 64, ensuring the safety and convenience of the high-transmittance glass 64 during the installation and removal process.

[0080] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser cutting device for metal material processing, comprising a bottom frame (1), a bottom plate (2) is arranged inside the bottom frame (1), and a plurality of through holes (22) are opened on the bottom plate (2), and it is characterized in that: On both sides of the bottom frame (1), there are symmetrically arranged columns (11). At the upper ends of multiple columns (11), a top frame (3) is jointly arranged. The bottom plate (2) is symmetric with the bottom frame (1) and is rotatably penetrated by a rotating shaft (21). The upper end of the rotating shaft (21) rotatably penetrates the top frame (3) and is threadedly connected thereto. A cross beam (31) is slidably arranged in the top frame (3). A sliding groove (311) is opened on the cross beam (31). A sliding block (32) is slidably arranged in the sliding groove (311). A laser emitter (4) is arranged at the lower end of the sliding block (32). A cooling member (5) is arranged on the laser emitter (4). The cooling member (5) includes a circulation hole (51) arranged in the rotating shaft (21). An inlet (512) located in the bottom frame (1) is opened in the circulation hole (51). Connecting rings (52) are respectively arranged on both sides of the columns (11) through brackets. The connecting rings (52) are rotatably connected to the corresponding circulation holes (51). A fixing sleeve (53) is arranged on the laser emitter (4). Connecting pipes (54) are symmetrically arranged on the fixing sleeve (53). A telescopic hose (55) is arranged between the connecting pipes (54) and the corresponding connecting rings (52).

2. The laser cutting device for metal material processing according to claim 1, wherein: The cooling member (5) further includes a collar (56) rotatably arranged on the rotating shaft (21). The collar (56) corresponds to the inlet (512). A water inlet pipe (57) communicated with the collar (56) is arranged in the bottom frame (1) through a bracket.

3. A laser cutting device for metal material processing according to claim 1, characterized in that: A transmission shaft (58) threadedly connected to the cross beam (31) is rotatably penetrated through the top frame (3). A driving shaft (59) threadedly connected to the sliding block (32) is rotatably arranged in the sliding groove (311).

4. A laser cutting device for metal material processing according to claim 3, characterized in that: A downward pressing limiting member (6) is arranged on the top frame (3). The downward pressing limiting member (6) includes downward pressing rods (61) symmetrically penetrated through the top frame (3). A downward pressing frame (62) is jointly arranged at the lower ends of multiple downward pressing rods (61). A return spring (63) is arranged between the downward pressing frame (62) and the top frame (3).

5. A laser cutting device for metal material processing according to claim 4, characterized in that: A high-transparency glass (64) is arranged in the downward pressing frame (62), and an avoidance groove (65) corresponding to the rotating shaft (21) is opened on the downward pressing frame (62).

6. A laser cutting device for metal material processing according to claim 2, characterized in that: A water blocking frame (66) is arranged on the downward pressing frame (62).

7. A laser cutting device for metal material processing according to claim 5, characterized in that: An adjusting screw (67) threadedly connected to the top frame (3) is rotatably penetrated through the top frame (3). A lower limiting plate (68) slidably and rotatably arranged on the rotating shaft (21) and rotatably connected to the adjusting screw (67) is located directly above the avoidance groove (65).

8. A laser cutting device for metal material processing according to claim 7, characterized in that: A glass limiting member (7) is arranged on the downward pressing frame (62). The glass limiting member (7) includes a taking and placing groove (71) opened on one side of the downward pressing frame (62). The high-transparency glass (64) is slidably arranged in the taking and placing groove (71). A limiting telescopic plate (72) in contact with the high-transparency glass (64) is arranged in the taking and placing groove (71).

9. The laser cutting device for metal material processing according to claim 8, wherein: Pin grooves (73) are symmetrically opened on both sides of the limiting telescopic plate (72). Guide grooves (74) corresponding to the pin grooves (73) one by one are symmetrically opened on the downward pressing frame (62). The upper ends of the guide grooves (74) penetrate through the downward pressing frame (62). Pin blocks (75) are slidably arranged in the guide grooves (74). A pressing spring (76) is arranged between one side of the pin block (75) and the guide groove (74).

10. A laser cutting device for metal material processing according to claim 1, characterized in that: One side of the pin block (75) is provided with a guiding inclined surface (77).

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