A laser processing device capable of preventing the rupture of a thin TGV

Abstract

The present invention relates to the field of laser processing technology, and more specifically, to a laser processing device capable of preventing thin-film TGV (Through Hole) cracking. The device comprises a frame, a chassis fixedly mounted on the frame, a mounting plate fixedly connected to the upper portion of the front inner wall of the chassis, a laser emitter mounted on the bottom of the mounting plate driven by an XY axis control system, and used for laser through-hole processing in glass substrates; a feed frame and a discharge frame symmetrically fixedly mounted on the rear inner wall of the chassis, the feed frame and the discharge frame respectively used for feeding and discharging the glass substrates to be processed; and a water cooling unit disposed on the top of the frame. The present invention utilizes a water cooling unit to cool the processing table, and cooperates with a control mechanism to dynamically control the flow of cooling water through the placement table according to the heat generated at different positions during through-hole processing of the glass substrate, effectively controlling the thermal stress of the glass substrate during processing, thereby reducing the risk of cracking during through-hole processing of the glass substrate.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a laser processing device capable of preventing a thin TGV from breaking. Background Art

[0002] With the rapid development of semiconductor packaging technology, 3D integration, and microelectromechanical systems (MEMS), through-glass via (TGV) technology has occupied a key position in the advanced packaging field due to its excellent insulation properties, high-frequency response characteristics, and superior thermal stability. However, when it comes to laser processing of thin sheets, typically between 50 and 300 μm thick, the inherent brittleness and low thermal conductivity of glass materials can easily lead to localized thermal stress accumulation and mechanical vibration during processing, causing microcracks in the glass material and even overall breakage, thereby limiting production yield and processing efficiency.

[0003] While current laser processing equipment has been optimized to meet the specific requirements of TGV wafers, several key challenges remain. First, the rigid design of the cooling system—traditional, single-use circulating water or air cooling—is unable to adapt to the dynamically changing processing thermal field, resulting in uneven cooling and making it difficult to effectively control thermal stress in localized areas. Second, traditional vacuum adsorption or mechanical clamping methods are prone to inducing additional stress and have limited ability to suppress the high-frequency vibrations generated during processing, potentially exacerbating the risk of microcracks in the material. Therefore, we propose a laser processing device that prevents TGV wafer cracking to address these issues. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings of the prior art, the present invention provides a laser processing device that can prevent the thin TGV from breaking.

[0005] The technical implementation scheme of the present invention is: a laser processing equipment that can prevent the thin film TGV from breaking, comprising a frame, the frame is the load-bearing carrier of the equipment, a chassis is fixedly installed on the frame, the upper part of the inner wall of the front side of the chassis is fixedly connected to the mounting plate, the bottom of the mounting plate is driven by an XY axis control system to install a laser emitter, the XY axis control system is an existing driving technology equipment, and the laser emitter is used for laser through-hole glass substrates; it also includes a feeding frame and a discharging frame symmetrically fixedly arranged on the inner wall of the rear side of the chassis, the feeding frame and the discharging frame are respectively used for feeding and discharging the glass substrates to be processed, a water cooling unit is provided on the top of the frame, the water cooling unit is an existing circulating cooling water device, a processing table for placing the glass substrates to be processed is provided on the top of the water cooling unit shell, a transfer mechanism is provided between the feeding frame and the discharging frame in the chassis, the transfer mechanism is used to transfer the glass substrates between the feeding frame, the processing table and the discharging frame in sequence, the glass substrates fed at the feeding frame are transferred to the processing table for processing, and then the glass substrates processed on the processing table are placed on the processing table. The processing table includes a mounting frame fixedly mounted on the top of the water-cooling unit, the mounting frame is a hollow frame body and a placement table is fixedly mounted on the top, the placement table is a hollow table body and is used to carry the glass substrate to be processed, and an adsorption through-tube is densely arranged between the upper and lower surfaces of the placement table, the adsorption through-tube passes through the mounting frame at the bottom of the placement table, the bottom plate of the mounting frame is a perforated plate, and a plurality of adsorption fans are fixedly mounted inside the mounting frame, and the adsorption fans blow air downward to make the adsorption through-tube The air flow inside flows downward, and the glass substrate to be processed placed on the placement table will be stably adsorbed by the negative pressure generated in the adsorption tube. The two sides of the placement table are respectively connected with a water inlet channel and a water outlet channel. The water inlet channel and the water outlet channel are symmetrically provided with a plurality of connecting cavities connected to the interior of the placement table. The water inlet channel is connected to the water supply pipe of the water cooling unit through the water inlet pipe, and the water outlet channel is connected to the return pipe of the water cooling unit through the water outlet pipe. The table body of the placement table is provided with a regulating mechanism for regulating the water inlet and outlet amounts of the water inlet channel and the water outlet channel.

[0006] Optionally, the laser emitter includes a lifting cylinder assembled in the XY-axis control system, the piston rod of the lifting cylinder is downward and fixedly connected to a support plate, the support plate is equipped with a laser head for emitting through-hole laser, an outer tube is fixedly provided on the outside of the laser head, the outer tube covers the periphery of the laser head, an air intake plate with a through hole is provided between the outer tube and the bottom of the laser head, the tube body of the outer tube is connected to the outside with an exhaust pipe, and the exhaust pipe is used to connect to an external exhaust gas treatment device.

[0007] Optionally, the transfer mechanism includes a motor 1 fixedly mounted on the bottom of the chassis, a connecting plate fixedly connected to the output shaft of the motor 1, a short-stroke cylinder fixedly mounted on the connecting plate, a piston rod of the short-stroke cylinder fixedly connected to the transfer plate, an adsorption disk is mounted at the bottom end of the transfer plate, adsorption holes are densely arranged on the adsorption surface of the adsorption disk, a negative pressure fan is further mounted on the transfer plate, the negative pressure fan is connected to the adsorption disk on the transfer plate through a pipeline, and the adsorption disk cooperates with the negative pressure fan to adsorb the glass substrate to be transferred.

[0008] Optionally, the regulating mechanism includes a block 1 rotatably arranged in the connecting cavity between the placing table and the water inlet channel, the block 1 being symmetrically hinged in the corresponding connecting cavity, a spring 1 being provided between the block 1 and the placing table, the block 1 being blocked in the connecting cavity under the action of the spring 1, a block 2 being symmetrically hinged in the connecting cavity between the placing table and the water outlet channel, a spring 2 being provided between the block 2 and the water outlet channel, the block 2 being blocked in the connecting cavity under the action of the spring 2, a driving rod having the same number as the connecting cavities being slidably connected inside the placing table, one end of the driving rod being in contact with the block 1, and the other end of the driving rod being in contact with the block 2, a motor 2 being fixedly installed at the bottom of the placing table corresponding to each driving rod, the output shaft of the motor 2 being fixedly connected to the driving frame after passing through the bottom surface of the placing table, and the driving rod being provided with a convex rod which slides with the driving frame.

[0009] Optionally, temperature sensors are provided on all four sides of the table surface of the processing table, and the temperature sensors are used to sense temperature changes on the glass substrate. The temperature sensors include rotating rods hinged to the four sides of the placing table respectively, and motors are fixedly installed at the four corners of the outer edge of the bottom surface of the placing table. The rotating rod is driven by the motor installed at the bottom of the placing table. A heat conducting plate is hinged on one side of the rod end of the rotating rod. The heat conducting plate is arc-shaped and has a built-in thermocouple sensor. The thermocouple sensor is used to sense changes in heat conduction of the corresponding heat conducting plate. The thermocouple sensor electrically controls motor 2 through a built-in controller.

[0010] Optionally, the feed frame and the discharge frame are both docked with material racks near the material port of the chassis, and the material racks are used to stack and place multi-layer glass substrates. The bottom plates of the feed frame and the discharge frame are both provided with slots adapted for the material racks to slide up and down. Electric slide rails are fixedly provided on the inner walls of the chassis near the feed frame and the discharge frame, and the sliders of the electric slide rails are buckled to dock with the material racks.

[0011] Optionally, a slide groove is provided at the bottom of the frame of the feed frame and the discharge frame, and an electric drive conveyor belt 1 is provided in the slide groove of the feed frame. The electric drive conveyor belt 1 is used to transfer the glass substrate on the material rack to the transfer area of the transfer mechanism in the feed frame, and an electric drive conveyor belt 2 is provided in the slide groove of the discharge frame. The electric drive conveyor belt 2 is used to transfer the glass substrate transferred out by the transfer mechanism to the material rack in the discharge frame.

[0012] Optionally, a positioning plate is slidably provided on the bottom plate of one side of the feed frame and the discharge frame close to the processing table. The positioning plate is positioned on the bottom plate of the feed frame and the discharge frame by fastening the lock. The positioning plate is used to limit glass substrates of different sizes in the transfer area of the feed frame and the discharge frame.

[0013] Beneficial effects of the present invention:

[0014] 1. The present invention uses a water-cooling unit to cool the processing table, and cooperates with a control mechanism to dynamically control the flow of cooling water through the placement table according to the heat generated at different positions during the through-hole processing of the glass substrate, thereby effectively controlling the thermal stress of the glass substrate during the processing, thereby reducing the risk of cracking during the through-hole processing of the glass substrate.

[0015] 2. The present invention utilizes temperature sensing elements arranged on the four sides of the processing table to monitor the temperature changes at different positions on the glass substrate in real time. The thermocouple sensor can automatically adjust the amount of cooling water in the corresponding area according to the detected heat changes, thereby realizing dynamic cooling of the glass substrate during the laser through-hole processing.

[0016] 3. The present invention can also realize an integrated process of stacking, lifting and conveying glass substrates through the electric drive conveyor belt 1 and the electric drive conveyor belt 2, in combination with a material rack, an electric slide rail and a transfer mechanism, thereby improving the automation level of material conveying during laser through-hole processing of glass substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0018] Figure 2 This is a schematic diagram of the components of the present invention, including the chassis, laser transmitter, processing table, and transfer mechanism.

[0019] Figure 3 This is a diagram showing the connection relationship between the XY axis control system and the laser transmitter and other components of the present invention.

[0020] Figure 4 This is a diagram showing the connection relationship between the water-cooling unit, the mounting frame, and the placement table of the present invention.

[0021] Figure 5 Schematic diagram of the specific components inside the processing table of the present invention.

[0022] Figure 6 This is a schematic diagram of the components of the present invention, including the installation frame, placement table, adsorption fan, and control mechanism.

[0023] Figure 7 Schematic diagram of the placement platform, water inlet channel, stopper 1 and drive rod of the present invention.

[0024] Figure 8 This is a schematic diagram of the placement platform, water outlet channel, stopper 2 and driving rod of the present invention.

[0025] Figure 9 Schematic diagram of the specific components of the laser transmitter of the present invention.

[0026] Figure 10 This is a diagram showing the connection relationship between the rotating rod, motor, heat conducting plate and thermocouple sensor of the present invention.

[0027] Figure 11 It is a schematic diagram of the chassis, feed frame, discharge frame and material rack of the present invention.

[0028] Figure 12 It is a three-dimensional structural diagram of the specific components of the reproducing mechanism of the present invention.

[0029] Figure 13 It is a schematic diagram of the feed frame, material rack, electric slide rail and positioning plate of the present invention.

[0030] The meaning of the reference numerals in the figure: 100-glass substrate, 1-frame, 2-chassis, 3-mounting plate, 31-XY axis control system, 4-laser emitter, 41-lifting cylinder, 42-support plate, 43-laser head, 44-outer tube, 45-air inlet plate, 46-exhaust pipe, 5-feed frame, 51-electric drive conveyor belt 1, 6-discharge frame, 61-electric drive conveyor belt 2, 7-transfer mechanism, 71-motor 1, 72-connecting plate, 73-short-stroke cylinder, 74-transfer plate, 75-adsorption plate, 76-negative pressure fan, 8-water cooling unit, 81-water inlet pipe, 82-water outlet Tube, 9-processing table, 91-installation frame, 92-placing table, 921-adsorption pipe, 93-water inlet channel, 94-water outlet channel, 10-adsorption fan, 11-regulating mechanism, 111-block one, 112-spring one, 113-block two, 114-spring two, 115-driving rod, 116-motor two, 117-driving frame, 12-temperature sensing part, 121-rotating rod, 122-motor, 123-heat conducting plate, 124-thermocouple sensor, 13-material rack, 14-electric slide rail, 141-slider, 15-positioning plate, 151-fastening lock. DETAILED DESCRIPTION

[0031] First of all, it should be noted that in the various described embodiments, identical components are provided with identical reference numerals or identical component names, wherein the disclosure contained throughout the entire description can be transferred to the same components having the same reference numerals or identical component names. Positional designations selected in the description, such as top, bottom, lateral, etc., also refer to the directly described and illustrated figures and are transferred to the new position in the event of a change in position.

[0032] Example 1: A laser processing device capable of preventing TGV from cracking, such as Figures 1-6As shown, it includes a frame 1, which is the load-bearing carrier of the equipment. A chassis 2 is fixedly installed on the frame 1. The upper part of the inner wall of the front side of the chassis 2 is fixedly connected to the mounting plate 3. The bottom of the mounting plate 3 is driven by an XY axis control system 31 and is installed with a laser emitter 4. The XY axis control system 31 is an existing driving technology device. The laser emitter 4 is used for laser-through-hole glass substrates 100; it also includes a feeding frame 5 and a discharging frame 6 symmetrically fixedly arranged on the inner wall of the rear side of the chassis 2. The feeding frame 5 and the discharging frame 6 are respectively used for feeding and discharging the glass substrates 100 to be processed. A water cooling unit 8 is provided on the top of the frame 1. The water cooling unit 8 is an existing circulating cooling water device. A processing table 9 for placing the glass substrate 100 to be processed is provided on the top of the shell of the water cooling unit 8 , a transfer mechanism 7 is provided between the feeding frame 5 and the discharging frame 6 in the chassis 2. The transfer mechanism 7 is used to transfer the glass substrate 100 between the feeding frame 5, the processing table 9 and the discharging frame 6 in sequence. The glass substrate 100 fed from the feeding frame 5 is transferred to the processing table 9 for processing, and then the glass processed on the processing table 9 is transferred to the discharging frame 6 for discharging; the processing table 9 includes a mounting frame 91 fixedly mounted on the top of the water-cooling unit 8. The mounting frame 91 is a hollow frame body and a placement table 92 is fixedly assembled on the top. The placement table 92 is a hollow table body and is used to carry the glass substrate 100 to be processed. An adsorption through-tube 921 is densely arranged between the upper and lower surfaces of the placement table 92. The adsorption through-tube 921 passes through the mounting frame 91 at the bottom of the placement table 92. The bottom plate of the mounting frame 91 is a perforated plate, and a plurality of adsorption fans 10 are fixedly installed inside the mounting frame 91. The adsorption fans 10 blow air downward, so that the air flow in the adsorption pipe 921 flows downward, and the glass substrate 100 to be processed placed on the placement table 92 will be stably adsorbed by the negative pressure generated in the adsorption pipe 921. The two sides of the placement table 92 are respectively connected with a water inlet channel 93 and a water outlet channel 94. The water inlet channel 93 and the water outlet channel 94 are symmetrically provided with a plurality of connecting cavities connected to the interior of the placement table 92. The water inlet channel 93 is connected to the water supply pipe of the water cooling unit 8 through the water inlet pipe 81, and the water outlet channel 94 is connected to the return pipe of the water cooling unit 8 through the water outlet pipe 82; the placement table 92 is provided with a regulating water inlet channel 93 and a water outlet channel 9 The water inlet and outlet control mechanism 11, through the adsorption fan 10 and the adsorption pipe 921, ensures that the glass substrate 100 to be processed, which has been transferred to the processing table 9, can be firmly adsorbed on the placement table 92. When the XY-axis control system 31 drives the laser emitter 4 to perform through-hole processing on the glass substrate 100 on the placement table 92, the control mechanism 11 can adjust the flow rate of cooling water flowing through the placement table 92 through the water inlet channel 93 and the water outlet channel 94 according to the heat generated during through-hole processing at different positions of the glass substrate 100, so that the heat of the glass substrate 100 during through-hole processing can be effectively cooled, thereby effectively controlling the thermal stress in local areas of the glass substrate 100 and reducing the risk of cracking of the glass substrate 100 during through-hole processing.

[0033] like Figure 3 and Figure 9 As shown, the laser emitter 4 includes a lifting cylinder 41 assembled in the XY axis control system 31, the piston rod of the lifting cylinder 41 is downward and fixedly connected to the support plate 42, and the support plate 42 is equipped with a laser head 43 for emitting through-hole laser, and an outer tube 44 is fixedly provided on the outside of the laser head 43, and the outer tube 44 covers the outer periphery of the laser head 43. An air intake plate 45 with a through hole is provided between the outer tube 44 and the bottom of the laser head 43, and the tube body of the outer tube 44 is connected to the outside with an exhaust pipe 46, and the exhaust pipe 46 is used to connect to an external exhaust gas treatment equipment. The XY axis control system 31 cooperates with the lifting cylinder 41 to drive the three-dimensional displacement of the laser head 43, so that the laser head 43 can emit laser to perform through-hole processing on the glass substrate 100 on the placement table 92. During the through-hole processing, the exhaust pipe 46 connected to the exhaust gas treatment equipment can synchronously absorb the generated particulate matter, smoke, gaseous pollutants and other exhaust gases.

[0034] like Figure 2 、 Figure 11 and Figure 12 As shown, the transfer mechanism 7 includes a motor 71 fixedly mounted on the bottom of the chassis 2, a connecting plate 72 is fixedly connected to the output shaft of the motor 71, a short-stroke cylinder 73 is fixedly mounted on the connecting plate 72, a piston rod of the short-stroke cylinder 73 is fixedly connected to a transfer plate 74, an adsorption disc 75 is mounted on the bottom end of the transfer plate 74, adsorption holes are densely arranged on the adsorption surface of the adsorption disc 75, a negative pressure fan 76 is also mounted on the transfer plate 74, and the negative pressure fan 76 is connected to the adsorption plate 74 on the transfer plate 74 through a pipeline. The adsorption plate 75 cooperates with the negative pressure fan 76 to adsorb the glass substrate 100 to be transferred. After the short-stroke cylinder 73 drives the adsorption plate 75 of the transfer plate 74 downward to contact the surface of the glass substrate 100, the negative pressure fan 76 blows air to generate suction on the adsorption plate 75 and adsorb the glass substrate 100. After the short-stroke cylinder 73 drives the adsorption plate 75 upward to adsorb the glass substrate 100, the motor 1 71 drives the glass substrate 100 adsorbed by the adsorption plate 75 on the transfer plate 74 to rotate to complete the transfer.

[0035] like Figure 11 and Figure 13As shown, the feed frame 5 and the discharge frame 6 are both docked with a material rack 13 near the material port of the chassis 2. The material rack 13 is used to stack and place the multi-layer glass substrates 100. The bottom plates of the feed frame 5 and the discharge frame 6 are both provided with slots adapted for the material rack 13 to slide up and down. The inner wall of the chassis 2 near the feed frame 5 and the discharge frame 6 is fixed with an electric slide rail 14. The slider 141 of the electric slide rail 14 is snap-fitted to the material rack 13. By assembling the material rack 13 into the feed frame 5 and the discharge frame 6 and the slider 141 of the corresponding electric slide rail 14, the material rack 13 is docked with the material rack 13. After that, the electric slide rail 14 intermittently drives the material rack 13 to rise and fall at equal distances at the corresponding electric drive conveyor belt 1 51 and electric drive conveyor belt 2 61, so that the multi-layer glass substrates 100 stacked on the material rack 13 are aligned with the electric drive conveyor belt 1 51 and the electric drive conveyor belt 2 61. Then, the glass substrates 100 on the material rack 13 in the feed frame 5 can be fed by the electric drive conveyor belt 1 51, and the glass substrates 100 discharged by the electric drive conveyor belt 1 51 in the discharge frame 6 can also be loaded onto the material rack 13, thereby improving the efficiency of processing the glass substrates 100 in and out.

[0036] like Figure 2 and Figure 11 As shown, a chute is provided at the bottom of the frame of the feed frame 5 and the discharge frame 6. An electric drive conveyor belt 1 51 is provided in the chute of the feed frame 5. The electric drive conveyor belt 1 51 is used to transfer the glass substrate 100 on the material rack 13 to the transfer area of the transfer mechanism 7 in the feed frame 5. An electric drive conveyor belt 2 61 is provided in the chute of the discharge frame 6. The electric drive conveyor belt 2 61 is used to transfer the glass substrate 100 transferred out by the transfer mechanism 7 to the material rack 13 in the discharge frame 6, thereby realizing the automatic transfer of the glass substrate 100 during through-hole processing.

[0037] like Figure 11 and Figure 13 As shown, a positioning plate 15 is slidably provided on the bottom plate of the feed frame 5 and the discharge frame 6 on one side close to the processing table 9. The positioning plate 15 is positioned on the bottom plate of the feed frame 5 and the discharge frame 6 by fastening the lock buckle 151. The positioning plate 15 is used to limit the glass substrates 100 of different sizes in the transfer area of the feed frame 5 and the discharge frame 6, so that the adsorption plate 75 on the transfer mechanism 7 can accurately adsorb and transfer glass substrates 100 of different sizes.

[0038] According to the size of the thin TGV glass substrate 100 to be processed, first slide and adjust the positioning plate 15 on the bottom plate of the feed frame 5 and the discharge frame 6, and then tighten the lock 151 to position the positioning plate 15 and adjust it to a position that matches the size of the glass substrate 100 to ensure that the glass substrate 100 is accurately aligned on the transfer area of the feed frame 5 and the discharge frame 6. Then, slide the rack 13 loaded with glass substrates 100 into the feed frame 5, and at the same time slide the empty rack 13 into the discharge frame 6 so that the rack 13 can be snapped into the corresponding The electric slide 14 is then activated on the slider 141 of the electric slide 14, and the electric slide 14 of the feed frame 5 is then activated. The electric slide 14 drives the material rack 13 to descend through the slider 141, so that a substrate to be processed loaded in the material rack 13 is aligned with the electric drive conveyor belt 1 51, and then the electric drive conveyor belt 1 51 in the feed frame 5 transports the glass substrate 100 to the designated transfer area of the transfer mechanism 7, and then the motor 1 71 is activated, and the motor 1 71 drives the connecting plate 72 to rotate around the output shaft, so that the short-stroke cylinder 73 and the transfer plate 74 move to the feed frame 5. Directly above the glass substrate 100 in the loading area, the piston rod of the short-stroke cylinder 73 drives the suction plate 75 at the bottom of the transfer plate 74 downward to contact the surface of the glass substrate 100. At this time, the negative pressure fan 76 is activated, and the dense suction holes on the surface of the suction plate 75 generate negative pressure, so that the suction plate 75 firmly adsorbs the glass substrate 100. The short-stroke cylinder 73 then lifts the adsorbed glass substrate 100. At the same time, the motor 71 drives the connecting plate 72 to rotate again, and the adsorbed glass substrate 100 is horizontally transferred to the placement table 92 of the processing table 9. The negative pressure fan 76 stops working, and the suction plate 75 releases the negative pressure, so that the glass substrate 100 is stably placed on the surface of the placement table 92. At the same time, the adsorption fan 10 inside the mounting frame 91 is activated, and a downward airflow is formed through the dense array of adsorption pipes 921, which generates a uniform negative pressure on the surface of the placement table 92, and the glass substrate 100 is tightly adsorbed and fixed on the placement table 92 to prevent displacement or vibration during laser processing. Then, laser through-hole processing is started on the glass substrate 100 on the placement table 92.

[0039] Example 2: Based on Example 1, Figure 5-Figure 8As shown, the regulating mechanism 11 includes a stopper 111 rotatably arranged in the communication cavity between the placement platform 92 and the water inlet channel 93, the stopper 111 is symmetrically hinged in the corresponding communication cavity, a spring 112 is provided between the stopper 111 and the placement platform 92, and the stopper 111 is blocked in the communication cavity under the action of the spring 112, and a stopper 2 113 is symmetrically hinged in the communication cavity between the placement platform 92 and the water outlet channel 94, a spring 2 114 is provided between the stopper 2 113 and the water outlet channel 94, and the stopper 2 113 is blocked in the communication cavity under the action of the spring 2 114, and the placement platform 92 is internally slidably connected with a driving rod 115 having the same number as the communication cavity, one end of the driving rod 115 is in contact with the stopper 111, and the other end of the driving rod 115 is in contact with the stopper 111 Block 113 is in contact with each other, and a motor 2 116 is fixedly installed at the bottom of the placement table 92 corresponding to each driving rod 115. The output shaft of motor 2 116 passes through the bottom surface of the placement table 92 and is fixedly connected to the driving frame 117. The driving rod 115 is provided with a protruding rod that slides with the driving frame 117. By controlling the motor 2 116 in different areas, the motor 2 116 rotates and presses the protruding rod on the driving rod 115 through the driving frame 117. The driving rod 115 can drive the block 111 and the block 2 113 in the connecting cavity of different areas to open, so that the cooling water flow in different areas of the water inlet channel 93 is changed, and the glass substrate 100 on the placement table 92 is cooled in different areas, so as to better adapt to the dynamically changing processing heat field of the glass substrate 100 during through-hole processing.

[0040] like Figure 3 、 Figure 4 and Figure 10 As shown, temperature sensing elements 12 are provided on all four sides of the table surface of the processing table 9. The temperature sensing elements 12 are used to sense temperature changes on the glass substrate 100. The temperature sensing elements 12 include rotating rods 121 hinged to the four sides of the placement table 92 respectively. Motors 122 are fixedly installed at the four corners of the outer edge of the bottom surface of the placement table 92. The rotating rods 121 are driven by the motor 122 installed at the bottom of the placement table 92. A heat conducting plate 123 is hinged to one side of the rod end of the rotating rod 121. The heat conducting plate 123 is arc-shaped and has a built-in thermocouple sensor 124. The thermocouple sensor 124 is used to sense changes in heat conduction of the corresponding heat conducting plate 123. The thermocouple sensor 124 is electrically controlled by a built-in controller. The second motor 116 is controlled, and the four-sided rotating rod 121 is driven by the motor 122 to contact the outer side of the glass substrate 100 on the placement table 92 through the heat conducting plate 123. The thermocouple sensor 124 is used to monitor the heat change of the corresponding heat conducting plate 123 in real time, thereby sensing the heat at different positions on the glass substrate 100 during through-hole processing. The thermocouple sensor 124 controls the rotation of the second motor 116 near the heat source through the controller, so that the opening angle of the first block 111 and the second block 113 in the connecting cavity at the corresponding heat source changes, so that the cooling water can flow into the heat source concentrated area more, thereby achieving dynamic cooling of the glass substrate 100 processed by laser through-hole.

[0041] During processing, the support plate 42 is first driven vertically downward by the lifting cylinder 41, so that the laser head 43 and the outer tube 44 covering its periphery are close to the surface of the glass substrate 100, and the XY axis control system 31 is cooperated to accurately control the movement of the laser head 43 along the XY plane according to the preset path. At the same time, the laser head 43 emits a high-energy laser beam to perform through-hole processing on the glass substrate 100. During the through-hole processing, the air inlet plate 45 at the bottom of the outer tube 44 allows external air to enter, and the exhaust gas treatment equipment connected to the exhaust pipe 46 continuously sucks, thereby removing particulate matter, smoke and harmful gases generated by laser ablation. At the same time, the cooling water in the water cooling unit 8 flows into the water inlet channel 93 through the water inlet pipe 81, and enters the interior of the placement table 92 through the multiple groups of connecting cavities in the water inlet channel 93. After flowing through the interior of the placement table 92, the cooling water flows into the water outlet pipe 82 from the multiple groups of connecting cavities in the water outlet channel 94, and finally flows back to the water cooling unit 8 from the water outlet pipe 82 for cooling circulation. In this process, the cooling water will absorb the laser-processed glass substrate 10 0 generated. During the cooling process, the motor 122 in the temperature sensing element 12 is activated, and the motor 122 drives the rotating rod 121 to rotate. The rotating rod 121 drives the arc-shaped heat conducting plate 123 to contact the edge of the glass substrate 100. The built-in thermocouple sensor 124 monitors the surface temperature distribution of the substrate in real time. When the thermocouple sensor 124 detects that the temperature of a certain area is abnormally high, the controller immediately sends a command to the motor 2 116 of the corresponding area. The motor 2 116 synchronously drives the driving frame 117 to rotate and press the protruding rod on the driving rod 115. The driving rod 115 will simultaneously overcome the spring 112 and the spring 2 114 to push and pull the stopper 111 and the stopper 2 113, forcing the stopper 111 and the stopper 2 113 to generate an angular deflection in the corresponding connecting cavity, thereby increasing the flow rate of cooling water in the area, thereby specifically enhancing the heat dissipation efficiency of the placement table 92, thereby dynamically regulating and effectively balancing the thermal field distribution on the glass substrate 100 during processing, and avoiding micro cracks or breakage caused by local thermal stress concentration.

[0042] After the laser through-hole processing is completed, the adsorption fan 10 in the installation frame 91 stops running, and the glass substrate 100 is released from the negative pressure adsorption state. Then the short-stroke cylinder 73 of the transfer mechanism 7 drives the adsorption plate 75 to descend again and adsorb the finished substrate on the placement table 92. At the same time, the motor 1 71 drives the connecting plate 72 to rotate above the discharge frame 6, and the negative pressure fan 76 releases the adsorption force, and the finished substrate is placed stably on the electric drive conveyor belt 2 61 of the discharge frame 6. The electric drive conveyor belt 2 61 is started to transport the substrate to the material rack 13 inside the discharge frame 6, and the electric slide rail 14 of the discharge frame 6 intermittently descends according to the stacking height to realize the automatic stacking and storage of multiple layers of finished substrates on the material rack 13. At the same time, the electric slide rail 14 of the feed frame 5 synchronously controls the material rack 13 to rise again, so that the next substrate to be processed is aligned with the feed port of the electric drive conveyor belt 1 51, ready to enter a new round of processing cycle.

[0043] Those skilled in the art should understand that the above embodiments do not limit the present invention in any form, and any technical solutions obtained by equivalent replacement or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A laser processing device capable of preventing TGV thin film from cracking, comprising a frame (1) with a chassis (2) fixedly mounted on the top, a mounting plate (3) fixedly connected to the upper portion of the chassis (2), and a laser emitter (4) mounted on the bottom of the mounting plate (3) via an XY axis control system (31); The laser emitter (4) includes a lifting cylinder (41) assembled in an XY-axis control system (31), the piston rod of the lifting cylinder (41) faces downward and is fixedly connected to a support plate (42), a laser head (43) is assembled on the support plate (42), an outer tube (44) is fixedly arranged on the outer side of the laser head (43), the outer tube (44) covers the outer periphery of the laser head (43), an air intake plate (45) with a through hole is arranged between the outer tube (44) and the bottom of the laser head (43), and an air extraction pipe (46) is arranged on the body of the outer tube (44) to be connected to the outside; Its characteristics are: It also includes a feed frame (5) and a discharge frame (6) fixedly mounted on the rear side of the chassis (2); a water cooling unit (8) is provided on the top of the frame (1); a processing table (9) is provided on the top of the water cooling unit (8); and a transfer mechanism (7) is provided in the chassis (2); The transfer mechanism (7) includes a motor 1 (71) fixedly mounted on the bottom of the chassis (2), a connecting plate (72) fixedly connected to the output shaft of the motor 1 (71), a short-stroke cylinder (73) fixedly mounted on the connecting plate (72), a transfer plate (74) fixedly connected to the piston rod of the short-stroke cylinder (73), an adsorption disk (75) mounted on the bottom of the plate end of the transfer plate (74), adsorption holes densely arranged on the adsorption surface of the adsorption disk (75), and a negative pressure fan (76) mounted on the transfer plate (74), the negative pressure fan (76) being connected to the adsorption disk (75) on the transfer plate (74) through a pipeline; The processing table (9) includes a mounting frame (91) fixedly mounted on the top of the water-cooling unit (8), a placement table (92) is fixedly assembled on the top of the mounting frame (91), adsorption pipes (921) are densely arrayed between the upper and lower surfaces of the placement table (92), the adsorption pipes (921) pass through the mounting frame (91) at the bottom of the placement table (92), an adsorption fan (10) is fixedly mounted inside the mounting frame (91), and the placement table (92) is respectively connected to a water inlet channel (93) and a water outlet channel (94) on both sides, and the water inlet channel (93) and the water outlet channel (94) are symmetrically provided with a plurality of connecting cavities connected to the placement table (92), the water inlet channel (93) is connected to the water supply pipe of the water-cooling unit (8) through the water inlet pipe (81), and the water outlet channel (94) is connected to the water return pipe of the water-cooling unit (8) through the water outlet pipe (82); The placing table (92) is provided with a regulating mechanism (11) inside the table body for regulating the flow of the water inlet channel (93) and the water outlet channel (94); The regulating mechanism (11) includes a stopper (111) rotatably arranged in the communication cavity between the placement platform (92) and the water inlet channel (93), the stopper (111) is symmetrically hinged in the corresponding communication cavity, a spring (112) is provided between the stopper (111) and the placement platform (92), a stopper (113) is symmetrically hinged in the communication cavity between the placement platform (92) and the water outlet channel (94), a spring (114) is provided between the stopper (113) and the water outlet channel (94), the placement platform (92) The internal sliding connection is provided with driving rods (115) having the same number as the connecting cavities, one end of the driving rod (115) contacts the first stopper (111), and the other end of the driving rod (115) contacts the second stopper (113). A second motor (116) is fixedly installed at the bottom of the placement table (92) corresponding to each driving rod (115), and the output shaft of the second motor (116) passes through the bottom surface of the placement table (92) and is fixedly connected to the driving frame (117). The driving rod (115) is provided with a protruding rod that slides with the driving frame (117).

2. A laser processing device capable of preventing TGV from cracking according to claim 1, characterized in that: Temperature sensing elements (12) are provided on all four sides of the table surface of the processing table (9). The temperature sensing elements (12) are used to sense temperature changes on the glass substrate (100). The temperature sensing elements (12) include rotating rods (121) hinged to the four sides of the placement table (92), and motors (122) are fixedly installed at the four corners of the outer edge of the bottom surface of the placement table (92). The rotating rods (121) are driven by the motor (122) installed at the bottom of the placement table (92). A heat conducting plate (123) is hinged on one side of the rod end of the rotating rod (121). The heat conducting plate (123) is built with a thermocouple sensor (124). The thermocouple sensor (124) is used to sense changes in heat conducted by the corresponding heat conducting plate (123). The thermocouple sensor (124) electrically controls the motor 2 (116) through a built-in controller.

3. A laser processing device capable of preventing TGV from cracking according to claim 2, characterized in that: The feed frame (5) and the discharge frame (6) are both docked with a material rack (13) near the material port of the chassis (2). The material rack (13) is used to stack and place multiple layers of glass substrates (100). The bottom plates of the feed frame (5) and the discharge frame (6) are both provided with slots adapted for the material rack (13) to slide up and down. The inner wall of the chassis (2) near the feed frame (5) and the discharge frame (6) is fixed with an electric slide rail (14). The slider (141) of the electric slide rail (14) is snap-fitted to dock with the material rack (13).

4. A laser processing device capable of preventing TGV from cracking according to claim 3, characterized in that: The bottom of the feed frame (5) and the discharge frame (6) are provided with a chute, and the chute of the feed frame (5) is provided with an electric drive transmission belt 1 (51), and the chute of the discharge frame (6) is provided with an electric drive transmission belt 2 (61).

5. A laser processing device capable of preventing TGV from cracking according to claim 4, characterized in that: A positioning plate (15) is slidably provided on the bottom plate of one side of the feed frame (5) and the discharge frame (6) close to the processing table (9), and the positioning plate (15) is provided with a fastening lock (151) positioned on the bottom plate of the feed frame (5) and the discharge frame (6).

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