Method for manufacturing metal member and metal sheet

Abstract

The invention provides a method for manufacturing a metal member and a metal sheet. Provided is a technique for forming metal members on a metal plate so that the metal members can be easily separated from the metal plate while maintaining the layout of each metal member and the metal plate around the metal member. A method for manufacturing a metal member includes: a first etching step of forming a recess in a metal plate by etching a first surface of the metal plate, and forming a part of the metal member in a thickness direction of the metal plate; a step for adhering a protective layer to the first surface; and a second etching step for forming a recess in the metal plate by etching a second surface of the metal plate on the opposite side from the first surface to which the protective layer is attached, and forming a remaining portion of the metal member in the thickness direction of the metal plate.

Description

[0001] This application is a divisional application of a Chinese patent application with an application date of August 9, 2021, an application number of 202110906769.X, and an invention title of "Method for Manufacturing Metal Components and Metal Sheet". Technical Field

[0002] The present invention relates to a method for manufacturing metal components and a metal sheet. Background Art

[0003] There is the following technology: In an etching process, a metal component is demolded (formed and demolded) and separated from a metal plate by etching treatment to form separate metal components. Then, an adhesive is transferred to the back surface of each separate metal component to manufacture a metal decorative label (see Patent Document 1).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2018-134774 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] However, in the technology described in Patent Document 1, since color printing is performed on the metal component after demolding and separation, the process is complicated, such as positioning to avoid disturbing the processing positions of the metal components in a scattered state. In addition, the following situation is not considered: Instead of demolding and separating the metal component, it is manufactured into a thin sheet while maintaining the overall layout including the metal plate around the metal component.

[0009] Therefore, the following technology is provided: Regarding the process of forming a metal component on a metal plate, while maintaining the layout of each metal component and the metal plate around it, the metal component is formed to be easily separable from the metal plate.

[0010] Solutions to the Problems

[0011] The present invention is a method for manufacturing metal components, including the following steps:

[0012] A first etching step of etching a first surface of a metal plate to form a recess in the metal plate and form a part of a metal component in the thickness direction of the metal plate;

[0013] A step of pasting a protective layer on the first surface; and

[0014] Second etching process: Etch the second surface of the metal plate, which is opposite to the first surface where the protective layer is pasted, to form a recess in the metal plate and form the remaining part of the metal component in the thickness direction of the metal plate.

[0015] Effects of the Invention

[0016] According to the present invention, the following technology can be provided: Regarding the process of forming a metal component on a metal plate, while maintaining the layout of each metal component and the metal plate around it, the metal component can be formed to be easily separable from the metal plate. Description of the Drawings

[0017] Figure 1A It is a flowchart showing an example of the manufacturing method of the metal component corresponding to the embodiment.

[0018] Figure 1B It is a flowchart showing an example of the etching process corresponding to the embodiment.

[0019] Figure 2 It is a diagram for explaining the manufacturing method of the metal component corresponding to the embodiment.

[0020] Figure 3 It is a diagram showing a structural example of the metal component corresponding to the embodiment.

[0021] Figure 4 It is a diagram showing a usage example of the metal component corresponding to the embodiment. Detailed Description of the Embodiment

[0022] Hereinafter, the embodiment will be described in detail with reference to the drawings. In addition, the following embodiment does not limit the invention described in the claims, and not all the feature combinations described in the embodiment are necessary for the invention. Two or more of the multiple features described in the embodiment can be arbitrarily combined. In addition, the same or similar structures are labeled with the same reference numerals, and repeated descriptions are omitted. In addition, in each figure, the up-down, left-right, inside-outside directions with respect to the paper surface are used as the up-down, left-right, inside-outside directions of the components (or assemblies) in this embodiment in the description herein.

[0023] First, according to Figure 1A the flowchart of Figure 2 the manufacturing method of the metal component corresponding to the embodiment of the invention will be described. Figure 1A It is a flowchart showing an example of the manufacturing method of the metal component corresponding to the embodiment. Figure 2 It is shown according to Figure 1A a diagram showing an example of the cross-section of the metal component manufactured according to the flowchart of

[0024] InFigure 1A In step S101, the first surface of a metal plate with a thickness of 0.1 mm to 0.15 mm, which is used as a raw material, is subjected to an etching process (corrosion process) to form a part of a metal component in the thickness direction of the metal plate. The metal plate can be made of stainless steel, for example, but it can also be other metals such as aluminum. Details of the etching process will be described later. Figure 1B As shown, the details will be described later.

[0025] Here, referring to Figure 2 , Figure 2 In (A) of Figure 2 , a metal plate 200 used as a raw material is shown. The thickness of the metal plate 200 is shown enlarged for easy explanation, but the actual thickness is 0.1 mm to 0.15 mm. When the upper surface of the metal plate 200 is used as the first surface and the etching process is applied to the metal plate 200, as shown in

[0026] Returning to Figure 1A the description of Figure 2 , in the next step S102, an adhesive film is pasted on the first surface as a protective layer. This adhesive film is a protective layer used to prevent the first surface from being eroded when etching the second surface, and a film with acid resistance that will not be eroded by the etching process can be used. The acid-resistant film has a thickness of 0.4 mm, for example, and is formed by an adhesive layer and a PET substrate. The first surface is bonded to the PET substrate through the adhesive layer, so as to protect the first surface from the subsequent etching process. Here,

[0027] Returning to Figure 1A the description of Figure 2As shown in (D), a recess is formed in a manner that connects to a part of the recesses in the recess 201 formed in S101, and a portion corresponding to the contour of the metal part is penetrated to form a through-hole 203, and the metal part is completed. The etching process is performed in the above manner. The area surrounded by the through-hole 203 constitutes the metal part 204. Patterns or the like are formed on the first surface of the metal part 204 in the recesses 201 other than the above-mentioned part of the recesses that connect to the recesses formed in S103. Through the etching process on the second surface, each metal part 204 is cut off from the metal plate 200. However, since the adhesive film 202 is pasted on the first surface in advance, each metal part 204 does not separate or detach from the metal plate 200 but remains integrated.

[0028] Return to Figure 1A Regarding the description in, in the next S104, an adhesive is pasted on the second surface of the metal plate. The adhesive can be a known material, but an adhesive with a higher adhesive force than the adhesive layer of the adhesive film 202 pasted as the protective layer on the first surface needs to be used. This is to prevent the metal part from adhering to the adhesive film 202 side when the PET substrate of the adhesive film 202 is peeled off. Figure 2 (E) shows a case where the adhesive 205 is pasted on each metal part 204.

[0029] Return to Figure 1A Regarding the description in, in the next S105, a release film is pasted on the adhesive on the second surface of the metal plate as a release layer. Figure 2 (F) shows a case where the release film 206 is pasted on the adhesive 205. Since the adhesive force of the adhesive 205 is stronger than the adhesive force of the adhesive layer of the adhesive film 202, when the adhesive film 202 is peeled off, the metal part 204 remains on the release film 206 side, and the other part of the metal plate separates from the metal part 204 together with the adhesive film 202. Thus, by peeling off the adhesive film 202, only the metal part 204 is separated to the release film 206 side, and by peeling off each metal part 204 from the release film 206, it is used as a metal label.

[0030] In addition, although not described in Figure 1A , the first surface can also be colored after S101 and before the process of S102. In this case, in S102, the adhesive film is pasted on the colored first surface. Also, in Figure 1A , a case is shown where the process of forming the release layer on the second surface of the metal plate is implemented in two steps, S104 and S105. However, it can also be set as one step by using a release film pasted with an adhesive.

[0031] Next, refer to Figure 1B to explain Figure 1ADetails of the etching processes in S101 and S103. First, in S111, the surface of the metal plate serving as the base material is cleaned. In the subsequent S112, a photoresist is laminated on the back surface of the metal plate. In the subsequent S113, after covering the metal plate with a photomask corresponding to the outline and pattern of the metal component to be formed, ultraviolet rays are irradiated. As a result, the photoresist in the portion not shielded by the photomask becomes photosensitive, and the pattern of the photomask is transferred. In the subsequent S114, a developing process is performed by removing the photoresist in the portion that was not photosensitive in S113 with a chemical. As a result, the required portion is in a masked state. In the subsequent S115, a chemical for dissolving the metal (etchant) is applied to the result of the developing process in S114 to dissolve the unmasked portion, thereby forming the outline portion or pattern of the metal component. In the subsequent S116, the resist is peeled off and cleaned, and then dried.

[0032] Next, with reference to Figure 3 an example of the structure of a metal component manufactured by the manufacturing method of Figure 1A is shown. Figure 3 (A) of Figure 2 shows a structural example of the first surface side of a thin sheet 300 including three metal components. The thin sheet 300 includes metal components 301, 302, and 303. The outline of each metal component is defined by the through-hole 203 of Figure 2 . In addition, the patterns 304 to 306 formed on each metal component are formed by the recess 201 of Figure 2 . A bonding film 202 of Figure 3 is pasted on the first surface of the thin sheet 300. Since the bonding film 202 is made of a PET base material, it is transparent and is shown as a semi-transparent slanted area in

[0033] Figure 3 (B) of Figure 2 shows a structural example of the second surface side of a thin sheet 300 including three metal components. Adhesives 205 are respectively pasted on the metal components 301, 302, and 303 of the thin sheet 300, and a release film 206 is pasted thereon. In addition, similar to the case of the first surface, the outline of each metal component is defined by the through-hole 203 of Figure 3In the case of the circled numbers in (B), it is also possible that the middle number is formed by the recess 201 obtained through S101, and the outer circular contour is formed by the through-hole 203 obtained through S101 and S103. In this case, it is also possible that an adhesive 205 is pasted on the identification number, and when the adhesive film 202 is peeled off, the identification number adheres to the side of the release film 206. In this case, even when the adhesive film 202 is peeled off, the identification numbers of the respective metal components remain, so it is easy to identify the metal components. Additionally, it is also possible that the identification number is formed only in the etching process on the second surface of S103. In this case, when the adhesive film 202 is peeled off, the identification number remains on the side of the sheet 300 and is separated from the corresponding metal component.

[0034] In Figure 3 An example of the identification number is shown by reference numerals 307 to 309 in (B), but the method of assigning the identification number is not limited to the circled numbers shown here and can be in any form. Thus, the metal components can be used as components when making model toys. Additionally, the position where the identification number is assigned can also be near the metal component associated with the identification number, or it can also be on the second surface side of the metal component. In this case, since the identification number is assigned on the adhesive surface side of the metal component, the number does not appear on the surface, so it does not affect the appearance of the metal component. At this time, the depth of the recess forming the identification number can be shallower than the depth formed by the recess 201.

[0035] Figure 3 (C) shows the state after the metal components 301 to 303 are respectively removed from the adhesive film 202 and the release film 206. The metal components 301 to 303 removed from the release film 206 etc. like this are called metal stickers, decorative stickers, etched stickers, etc., and can be used as components of model toys such as plastic models, for example. Since these stickers have an adhesive pasted on the back, there is no need to paste them on the surface of the model toy using an instant adhesive etc. as in the past.

[0036] Figure 4 Shows usage examples of the metal components 301 to 303. Figure 4 (A) shows a usage example of the metal component 301. Similarly, Figure 4 (B) shows a usage example of the metal component 302. Figure 4 (C) shows a usage example of the metal component 303. In this way, it can adhere to the respective components of model toys such as plastic models to represent air vents etc. However, the utilization method of the metal components manufactured by the method corresponding to this embodiment is not limited to this, and it can also be used to decorate the surface of model toys such as plastic models, and can also be used as a mark or logo for car models, vehicle models. Additionally, the appearance of the metal component is not limited to Figure 3 and Figure 4As shown, it can have an appearance representing any pattern, figure, number, character, animal, plant, etc.

[0037] According to the manufacturing method of the metal component corresponding to the above-described embodiment, there is no need for a connection portion called a gate that was previously required to connect the metal component to the thin sheet. The gate was provided to prevent the metal components from scattering, but when separating the metal components from the thin sheet, the gates had to be cut one by one, which was cumbersome. In addition, cutting the gates also had technical requirements, so in order to cut them cleanly, correspondingly skilled techniques were required. The metal component obtained by the manufacturing method of this embodiment is not connected to the thin sheet by means of a gate, but can be directly used by peeling off from the adhesive film and the release film, so the metal component can be used simply and in a clean state.

[0038] In addition, the adhesive film used to prevent erosion during the manufacturing process protects the surface of the metal component even after the product is completed, so each metal component can be maintained in a flawless state like new until each metal component is used.

[0039] The invention is not limited to the above-described embodiment, and various modifications / changes can be made within the scope of the gist of the present invention.

Claims

1. A manufacturing method of a metal component, comprising the following steps: A first etching step of etching a first surface of a metal plate to form a recess in the metal plate, and forming a part of the metal component in the thickness direction of the metal plate; A step of pasting a protective layer on the first surface; And A second etching step of etching a second surface of the metal plate, which is opposite to the first surface with the protective layer pasted thereon, to form a recess in the metal plate, and forming the remaining part of the metal component in the thickness direction of the metal plate.

2. The manufacturing method according to claim 1, wherein In the second etching step, a recess connected to a part of the recesses formed in the first etching step is formed, thereby forming a through hole, and the through hole forms the contour of the metal component, The metal component is configured to be separable from the metal plate through the through hole.

3. The manufacturing method according to claim 2, wherein The recesses other than the part of the recesses formed in the first etching step form a pattern on the surface of the metal component.

4. The manufacturing method according to claim 2 or 3, wherein In the second etching step, only the recesses for forming the through hole are formed.

5. The manufacturing method according to claim 2 or 3, wherein In the second etching step, identification information for identifying the metal component is further formed.

6. The manufacturing method according to any one of claims 1 to 5, wherein The metal component has an appearance representing a pattern, a number, a figure, a character, an animal, or a plant.

7. The manufacturing method according to any one of claims 1 to 6, wherein After the first etching step and before the step of pasting the protective layer, a step of coloring the first surface is further included.

8. The manufacturing method according to any one of claims 1 to 7, wherein After the second etching step, a step of pasting a release layer on the second surface of the metal component is further included.

9. The manufacturing method according to claim 8, wherein The step of pasting the release layer includes the following steps: On the second surface, forming an adhesive layer on the metal component; and On the second surface, pasting the release layer on the metal component with the adhesive layer therebetween.

10. The manufacturing method according to claim 8 or 9, wherein The adhesive force of the protective layer to the first surface is weaker than the adhesive force of the release layer to the second surface.

11. A metal sheet, comprising a metal component, wherein The metal component has a recess on the first surface side of the metal sheet, The first surface of the metal sheet is covered with a protective layer, On the second surface side of the metal component, which is opposite to the first surface of the metal sheet, a release layer is pasted with an adhesive therebetween.

12. The metal sheet according to claim 11, wherein The adhesive force of the protective layer to the first surface is weaker than the adhesive force of the adhesive.

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