Notebook computer heat dissipation module and notebook computer

Abstract

The invention discloses a notebook computer heat dissipation module and a notebook computer, and relates to the technical field of electronic products, and the notebook computer heat dissipation module comprises a fan shell, heat dissipation fins and a heat dissipation plate; the fan shell comprises a first shell body and a second shell body, and a containing cavity is defined by the first shell body and the second shell body. The heat dissipation fins are arranged on one side of the fan shell, and part of the heat dissipation fins are arranged in the containing cavity and connected with the first shell; partial structure of the heat dissipation pipe is arranged in the containing cavity and is attached to the heat dissipation fins and the second shell; according to the technical scheme, the occupied space of the notebook computer heat dissipation module can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic products, and particularly relates to a notebook cooling module and a notebook. Background Art

[0002] With the development of the thin and light and high-performance of notebook computers, the heat generated by the processor is constantly increasing, which puts higher requirements on the design of the notebook cooling module. The traditional notebook cooling module usually adopts a combined structure of a fan, heat dissipation fins and heat pipes. Its working principle is to provide air circulation through the fan to take away the heat on the surfaces of the heat dissipation fins and heat pipes, thereby reducing the temperature of the processor and surrounding components. However, the fan, heat dissipation fins and heat pipes of the existing notebook cooling module are usually independently designed, the connection method between components is relatively complex, and it occupies a large space, making it difficult to meet the strict requirements for space of thin and light notebooks. Summary of the Invention

[0003] The main object of the present invention is to provide a notebook cooling module and a notebook, aiming to reduce the occupied space of the notebook cooling module.

[0004] To achieve the above object, the notebook cooling module proposed by the present invention includes:

[0005] A fan housing, the fan housing includes a first housing and a second housing, and the first housing and the second housing enclose to form an accommodation cavity;

[0006] Heat dissipation fins, the heat dissipation fins are provided on one side of the fan housing, and a part of the structure of the heat dissipation fins is arranged in the accommodation cavity and connected to the first housing; and

[0007] A heat pipe, a part of the structure of the heat pipe is arranged in the accommodation cavity and is attached to the heat dissipation fins and the second housing.

[0008] In an embodiment, the notebook cooling module includes two fan housings, two heat dissipation fins and a plurality of heat pipes. Each heat dissipation fin is provided on one side of a fan housing, and each heat dissipation fin is connected to at least one heat pipe;

[0009] The notebook cooling module further includes a heat dissipation plate, the heat dissipation plate is arranged between the two fan housings, and one end of each heat pipe away from the heat dissipation fins is connected to the heat dissipation plate.

[0010] In an embodiment, the heat dissipation plate is formed with an accommodation groove, and each heat pipe is arranged in the accommodation groove.

[0011] In an embodiment, a thermal grease is provided on the side of the heat dissipation plate facing away from the heat pipes.

[0012] In one embodiment, a plurality of first mounting blocks are provided on the peripheral side of the heat dissipation plate, and the first mounting blocks are provided with first mounting holes.

[0013] In one embodiment, the heat dissipation fins include a first heat conduction portion and a second heat conduction portion connected to each other. The first heat conduction portion is inserted into the accommodation cavity and connected to the first housing.

[0014] Wherein, along the thickness direction of the fan housing, the second heat conduction portion protrudes from the fan housing.

[0015] In one embodiment, the heat dissipation fins are connected to the first housing by welding; and / or

[0016] Both the heat dissipation fins and the second housing are connected to the heat dissipation pipe by welding.

[0017] In one embodiment, the materials of the first housing and the second housing are copper; and / or

[0018] The material of the heat dissipation pipe is copper.

[0019] In one embodiment, a plurality of second mounting blocks are provided on the peripheral side of the fan housing, and the first mounting blocks are provided with second mounting holes.

[0020] The present invention also provides a notebook computer, including the notebook computer heat dissipation module as described above.

[0021] In the technical solution of the present invention, by designing the fan housing, the heat dissipation fins and the heat dissipation pipe as an integral structure, the fan housing not only provides air circulation but also serves as a medium for heat conduction, conducting heat from the heat dissipation fins and the heat dissipation pipe to the entire housing, thereby improving the heat conduction efficiency and avoiding heat accumulation. Part of the structures of the heat dissipation fins and the heat dissipation pipe are arranged in the accommodation cavity of the fan housing and are in contact with the first housing and the second housing of the fan housing, increasing the contact area between the heat dissipation fins and the heat dissipation pipe, shortening the heat conduction path, thereby improving the heat exchange efficiency, enabling the heat to be quickly transferred from the processor to the outside, and at the same time making the entire notebook computer heat dissipation module more compact, occupying less space, and meeting the strict requirements for space of thin and light notebook computers. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for describing the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0023] Figure 1Schematic diagram of a structural embodiment of the notebook heat dissipation module provided by the present invention;

[0024] Figure 2 Schematic diagram of a structural embodiment of another notebook heat dissipation module provided by the present invention;

[0025] Figure 3 Schematic diagram of a structural embodiment of yet another notebook heat dissipation module provided by the present invention;

[0026] Figure 4 Schematic diagram of the structure when a notebook heat dissipation module embodiment provided by the present invention is applied to a notebook.

[0027] Explanation of the reference numerals in the drawings:

[0028] 100, notebook heat dissipation module; 1, fan housing; 11, first housing; 12, second housing; 13, second mounting block; 2, heat dissipation fins; 21, first heat conduction part; 22, second heat conduction part; 3, heat dissipation tube; 4, heat dissipation plate; 41, first mounting block; 5, thermal grease.

[0029] The realization, functional features and advantages of the object of the present invention will be further described in conjunction with the embodiments with reference to the drawings. Specific embodiments

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0032] In addition, if the embodiments of the present invention involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, or scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] The present invention provides a notebook cooling module 100.

[0034] Please refer to Figures 1 to 4 , in an embodiment of the present invention, the notebook cooling module 100 includes a fan housing 1, heat dissipation fins 2, and a heat dissipation plate 4; the fan housing 1 includes a first housing 11 and a second housing 12, and the first housing 11 and the second housing 12 enclose a receiving cavity; the heat dissipation fins 2 are disposed on one side of the fan housing 1, and a part of the structure of the heat dissipation fins 2 is disposed in the receiving cavity and is connected to the first housing 11; a part of the structure of the heat dissipation tube 3 is disposed in the receiving cavity and is in contact with the heat dissipation fins 2 and the second housing 12.

[0035] In the technical solution of the present invention, by designing the fan housing 1, the heat dissipation fins 2, and the heat dissipation tube 3 as an integral structure, the fan housing 1 not only provides air circulation but also serves as a medium for heat conduction, conducting heat from the heat dissipation fins 2 and the heat dissipation tube 3 to the entire housing, thereby improving the heat conduction efficiency and avoiding heat accumulation. A part of the structures of the heat dissipation fins 2 and the heat dissipation tube 3 are disposed in the receiving cavity of the fan housing 1 and are in contact with the first housing 11 and the second housing 12 of the fan housing 1, increasing the contact area between the heat dissipation fins 2 and the heat dissipation tube 3 and shortening the heat conduction path, thereby improving the heat exchange efficiency, enabling heat to be quickly transferred from the processor to the outside, and at the same time making the entire notebook cooling module 100 more compact, occupying less space, and meeting the strict requirements for space of thin and light notebooks. In addition, due to the improvement of the heat conduction efficiency and heat exchange efficiency of the notebook cooling module 100, the fan can achieve effective heat dissipation at a lower rotational speed, thereby reducing fan noise and improving the user experience.

[0036] To improve the heat dissipation efficiency, in an embodiment of the present invention, please refer to Figure 1 and Figure 2, the notebook cooling module 100 includes two fan housings 1, two heat dissipation fins 2 and a plurality of heat dissipation tubes 3. Each heat dissipation fin 2 is disposed on one side of a fan housing 1, and each heat dissipation fin 2 is connected to at least one heat dissipation tube 3; the notebook cooling module 100 further includes a heat dissipation plate 4, and the heat dissipation plate 4 is disposed between the two fan housings 1. One end of each heat dissipation tube 3 away from the heat dissipation fin 2 is connected to the heat dissipation plate 4.

[0037] The design of the two fan housings 1 and the two heat dissipation fins 2 enables the notebook cooling module 100 to dissipate heat in multiple areas simultaneously, increasing the heat dissipation area and improving the overall heat dissipation efficiency. At the same time, the setting of the heat dissipation plate 4 enables the heat to be evenly distributed between the two fan housings 1, avoiding the problem of local overheating and improving the heat dissipation uniformity. And by connecting the heat dissipation tubes 3 to the heat dissipation plate 4, the structural stability of the entire notebook cooling module 100 is enhanced, making the notebook cooling module 100 more stable during operation and reducing the loosening of components caused by vibration or collision. In addition, the connection of the heat dissipation tubes 3 to the heat dissipation fins 2 and the heat dissipation plate 4 optimizes the heat conduction path, enabling the heat to be transferred from the processor to the heat dissipation fins 2 and the fan housings 1 more quickly, further improving the heat dissipation efficiency. In this embodiment, according to the actual usage requirements, one of the fan housings 1 is correspondingly provided with one heat dissipation tube 3, and the other fan housing 1 is correspondingly provided with two heat dissipation tubes 3; in other embodiments, the number of heat dissipation tubes 3 can also be set to other values.

[0038] Further, in an embodiment of the present invention, the heat dissipation plate 4 is formed with a receiving groove, and each heat dissipation tube 3 is disposed in the receiving groove. Placing the heat dissipation tubes 3 in the receiving groove can ensure the stability and fixation of the heat dissipation tubes 3, preventing the heat dissipation tubes 3 from shifting or being damaged due to vibration or collision during operation, thereby improving the reliability of the notebook cooling module 100. The contact area between the heat dissipation tubes 3 and the heat dissipation plate 4 is increased, and the design of the receiving groove enables the heat dissipation tubes 3 to fit more closely to the heat dissipation plate 4, thereby more effectively transferring the heat from the processor to the heat dissipation plate 4 and then dissipating it through the fan housings 1 and the heat dissipation fins 2. The design of the receiving groove enables the heat dissipation tubes 3 to be neatly arranged on the heat dissipation plate 4, reducing the mutual interference between the heat dissipation tubes 3 and making the entire notebook cooling module 100 more compact and tidy. The receiving groove of the heat dissipation plate 4 provides additional support for the heat dissipation tubes 3, enhancing the structural strength of the entire notebook cooling module 100 and making the notebook cooling module 100 more stable during operation.

[0039] Furthermore, in an embodiment of the present invention, please refer to Figure 2, on the side of the heat sink 4 facing away from the heat pipe 3, there is a thermal grease 5. The thermal grease 5 is used to fit with heat-generating components such as the processor or circuit board of the notebook. The thermal grease 5 fills the tiny gaps between the heat sink 4 and the heat-generating components, reducing the thermal resistance, enabling heat to be transferred more efficiently from the heat-generating components to the heat sink 4, and then dissipated through the heat pipe 3 and the fan housing 1. The thermal grease 5 can ensure a tight fit between the heat sink 4 and the heat-generating components, avoiding uneven heat transfer caused by surface irregularities, thereby improving the heat dissipation efficiency. Moreover, the thermal grease 5 is easy to apply and replace, making the maintenance of the notebook heat dissipation module 100 simpler. Users can easily perform maintenance according to their needs without the need for professional tools or skills. Among them, the position and quantity of the thermal grease 5 can be set according to actual usage requirements.

[0040] For ease of installation, in an embodiment of the present invention, please refer to Figure 1 , on the peripheral side of the heat sink 4, there are a plurality of first mounting blocks 41, and the first mounting blocks 41 are provided with first mounting holes. The design of the first mounting blocks 41 and the first mounting holes enables the notebook heat dissipation module 100 to be conveniently installed on the body of the notebook computer. By passing screws or other fixing parts through the mounting holes, the notebook heat dissipation module 100 can be firmly fixed at the designated position. The plurality of first mounting blocks 41 are distributed on the peripheral side of the heat sink 4, ensuring that the notebook heat dissipation module 100 can be well supported and fixed in all directions, avoiding instability problems caused by single-point fixation. Moreover, the setting of the plurality of first mounting blocks 41 enables the notebook heat dissipation module 100 to adapt to different mounting positions and directions, providing greater mounting flexibility and meeting the heat dissipation requirements of different models of notebook computers. Through the first mounting holes, the notebook heat dissipation module 100 can be conveniently disassembled and reinstalled, facilitating maintenance, cleaning, or component replacement when needed.

[0041] Specifically, in an embodiment of the present invention, please refer to Figure 3, the heat dissipation fin 2 includes a first heat conduction part 21 and a second heat conduction part 22 connected to each other. The first heat conduction part 21 is inserted into the accommodation cavity and connected to the first housing 11. Wherein, along the thickness direction of the fan housing 1, the second heat conduction part 22 protrudes from the fan housing 1. The first heat conduction part 21 is directly inserted into the accommodation cavity of the fan housing 1 and connected to the first housing 11. This design enables heat to be quickly transferred from the heat dissipation fin 2 to the fan housing 1 and then dissipated through the air circulation of the fan, improving the heat conduction efficiency. The second heat conduction part 22 protrudes from the fan housing 1, increasing the contact area between the heat dissipation fin 2 and the external air, thereby improving the heat dissipation efficiency and enabling heat to be dissipated into the surrounding environment faster. The first heat conduction part 21 is inserted into the accommodation cavity, saving space and making the entire notebook heat dissipation module 100 more compact, suitable for the limited space of thin and light notebooks. Among them, the protruding second heat conduction part 22 can be designed into different shapes and sizes according to needs to adapt to the heat dissipation requirements of different heat-generating areas inside the notebook and provide more precise heat dissipation.

[0042] In order to ensure structural stability, in an embodiment of the present invention, the heat dissipation fin 2 is welded to the first housing 11; at the same time, both the heat dissipation fin 2 and the second housing 12 are welded to the heat dissipation pipe 3. Welding connection is a very firm connection method, which can ensure the tight connection between the heat dissipation fin 2 and the first housing 11 as well as the heat dissipation pipe 3, thereby improving the structural stability of the entire notebook heat dissipation module 100. And the welding connection can ensure good heat conduction between the heat dissipation fin 2, the first housing 11, the second housing 12 and the heat dissipation pipe 3, reducing the thermal resistance and enabling heat to be transferred and dissipated more efficiently. In addition, the welding connection can reduce the dependence on other fixing parts (such as screws, buckles, etc.), simplify the structure of the notebook heat dissipation module 100, and reduce the production cost and assembly complexity.

[0043] Specifically, in an embodiment of the present invention, the materials of the first housing 11 and the second housing 12 are copper; and the material of the heat dissipation pipe 3 is copper. Copper has very high heat conduction performance and can quickly transfer heat from the heat source to the heat dissipation fin 2 and the fan housing 1, thereby improving the heat conduction efficiency of the entire notebook heat dissipation module 100. The copper material has good mechanical strength and corrosion resistance, which can ensure that the first housing 11, the second housing 12 and the heat dissipation pipe 3 remain stable during long-term use and reduce the decline in heat dissipation performance caused by material aging or damage. And copper has good welding performance, which can ensure that the welding connection between the heat dissipation fin 2, the housing and the heat dissipation pipe 3 is firm and reliable, further improving the structural stability and heat conduction efficiency of the notebook heat dissipation module 100.

[0044] Furthermore, in an embodiment of the present invention, please refer to Figure 1, a plurality of second mounting blocks 13 are provided on the peripheral side of the fan housing 1, and the first mounting block 41 is provided with a second mounting hole. The design of the second mounting blocks 13 and the second mounting holes enables the fan housing 1 to be conveniently mounted on the body of the notebook computer, providing more mounting positions and direction options and enhancing the flexibility of mounting. The plurality of second mounting blocks 13 are distributed on the peripheral side of the fan housing 1 to ensure that the fan housing 1 can be well supported and fixed in all directions, avoiding instability problems caused by single-point fixing. Through the second mounting hole, the fan housing 1 can be conveniently disassembled and reinstalled, facilitating maintenance, cleaning, or component replacement when needed.

[0045] The present invention also provides a notebook computer, which includes the above-mentioned notebook computer heat dissipation module 100. The specific structure of the notebook computer heat dissipation module 100 refers to the above-mentioned embodiments. Since this notebook computer adopts all the technical solutions of the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be elaborated herein one by one.

[0046] The above are only exemplary embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made by using the content of the specification and drawings of the present invention under the technical concept of the present invention, or direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A notebook cooling module, characterized in that, Comprising: A fan housing, the fan housing includes a first housing and a second housing, and the first housing and the second housing enclose to form a receiving cavity; Heat dissipation fins, the heat dissipation fins are provided on one side of the fan housing, and a part of the structure of the heat dissipation fins is arranged in the receiving cavity and is connected to the first housing; And A heat dissipation tube, a part of the structure of the heat dissipation tube is arranged in the receiving cavity and is attached to the heat dissipation fins and the second housing.

2. The notebook heat dissipation module according to claim 1, wherein The notebook heat dissipation module includes two of the fan housings, two of the heat dissipation fins and a plurality of the heat dissipation tubes. Each of the heat dissipation fins is arranged on one side of one of the fan housings, and each of the heat dissipation fins is connected to at least one of the heat dissipation tubes; The notebook heat dissipation module further includes a heat dissipation plate, the heat dissipation plate is arranged between the two fan housings, and one end of each of the heat dissipation tubes away from the heat dissipation fins is connected to the heat dissipation plate.

3. The notebook heat dissipation module according to claim 2, wherein The heat dissipation plate is formed with a receiving groove, and each of the heat dissipation tubes is arranged in the receiving groove.

4. The notebook heat dissipation module according to claim 3, wherein, A thermal grease is provided on the side of the heat dissipation plate facing away from the heat dissipation tubes.

5. The notebook heat dissipation module according to claim 2, wherein, A plurality of first mounting blocks are provided on the periphery of the heat dissipation plate, and the first mounting blocks are provided with first mounting holes.

6. The notebook heat dissipation module according to claim 1, wherein, The heat dissipation fins include a first heat conduction part and a second heat conduction part connected to each other. The first heat conduction part is inserted into the receiving cavity and is connected to the first housing; Wherein, along the thickness direction of the fan housing, the second heat conduction part protrudes from the fan housing.

7. The notebook heat dissipation module according to claim 1, wherein The heat dissipation fins are connected to the first housing by welding; and / or Both the heat dissipation fins and the second housing are connected to the heat dissipation tube by welding.

8. The notebook heat dissipation module according to claim 1, wherein, The materials of the first housing and the second housing are copper; and / or The material of the heat dissipation tube is copper.

9. The notebook heat dissipation module according to claim 1, wherein A plurality of second mounting blocks are provided on the periphery of the fan housing, and the first mounting blocks are provided with second mounting holes.

10. A notebook, characterized in that, Including the notebook heat dissipation module according to any one of claims 1 to 9.

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