Power supply system

Abstract

A power supply system comprises a system board, a first-stage power supply module, a second-stage power supply module and a heat conduction structure. The system board comprises a processor. The processor is located on a first face of the system board. The first-stage power supply module is arranged on a second surface of the system board, and provides a target output voltage to the processor from a plurality of power electrodes of a mounting surface of the first-stage power supply system through a circuit wiring of the system board. The second-stage power supply module is arranged on the first-stage power supply module. The heat conduction structure is clamped between the first-stage power supply module and the second-stage power supply module. The two opposite sides of the heat conduction structure are in contact with the first-stage power supply module and the second-stage power supply module respectively.

Description

Technical Field

[0001] The present invention relates to a power supply system, and more particularly to a power supply system suitable for a vertical power delivery (VPD) configuration. Background Art

[0002] Due to the increasingly stringent power requirements of the graphics processing unit (GPU) and the central processing unit (CPU), the power supply module needs to meet various requirements such as a wide input range, a high input voltage, a high output power, high efficiency, high density, small size, light weight, and efficient heat dissipation. Currently, the power supply module powers the GPU / CPU through a lateral power delivery (LPD) method, and output capacitors are provided between the GPU / CPU and the power supply module, resulting in a long power distribution network (PDN) path and a large transient. Summary of the Invention

[0003] The present invention provides a power supply system suitable for a vertical power delivery configuration to solve the above problems.

[0004] According to an embodiment, the power supply system of the present invention includes a system board, a first-stage power supply module, a second-stage power supply module, and a heat conduction structure. The system board includes a processor. The processor is located on a first surface of the system board. The first-stage power supply module is disposed on a second surface of the system board and provides a target output voltage to the processor through circuit wiring of the system board from a plurality of power electrodes on an installation surface of the first-stage power supply system. The second-stage power supply module is disposed on the first-stage power supply module. The heat conduction structure is sandwiched between the first-stage power supply module and the second-stage power supply module. Opposite sides of the heat conduction structure are respectively in contact with the first-stage power supply module and the second-stage power supply module.

[0005] In an embodiment, the power supply system further includes a heat dissipation structure disposed outside the first-stage power supply module and the second-stage power supply module. The heat conduction structure is connected to the heat dissipation structure.

[0006] In an embodiment, the power supply system further includes a heat dissipation device disposed on a heat dissipation surface of the processor. The heat conduction structure passes through the system board and is connected to the heat dissipation device.

[0007] In one embodiment, the mounting surface of the first-stage power supply module is soldered to the system board, and the second-stage power supply module and the first-stage power supply module are stacked in sequence from away from the mounting surface to the mounting surface, such that the second-stage power supply module and the first-stage power supply module are powered in series in sequence.

[0008] In one embodiment, a voltage input terminal is only disposed on the second-stage power supply module, and a voltage output terminal is only disposed on the mounting surface of the first-stage power supply module.

[0009] In one embodiment, the voltage input terminal of the second-stage power supply module receives an input voltage transmitted and provided by a power line of a power supply unit.

[0010] In one embodiment, no voltage input terminal is disposed on the mounting surface of the first-stage power supply module.

[0011] In one embodiment, a conductive post is connected between the first-stage power supply module and the second-stage power supply module, and is configured to transmit an intermediate output voltage from the second-stage power supply module to the first-stage power supply module.

[0012] In one embodiment, the second-stage power supply module is configured to convert an input voltage into an intermediate output voltage, the first-stage power supply module is configured to convert the intermediate output voltage into the target output voltage, the target output voltage is less than the intermediate output voltage, and the intermediate output voltage is less than the input voltage.

[0013] In one embodiment, the processor is vertically stacked with the first-stage power supply module.

[0014] In one embodiment, the first-stage power supply module includes at least one sub-power supply module. Each sub-power supply module includes an upper circuit board, a lower circuit board, and an inductor. The lower circuit board is disposed opposite to the upper circuit board. The lower circuit board has a plurality of power electrodes. The plurality of power electrodes are disposed on a mounting surface of the lower circuit board. The plurality of power electrodes are configured to be mounted to a system board. The inductor is disposed between the upper circuit board and the lower circuit board. An upper surface of the inductor faces the upper circuit board. A lower surface of the inductor faces the lower circuit board. The inductor includes two primary windings and one secondary winding. Two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. The secondary winding is electrically connected in series via the upper circuit board and the lower circuit board or via the upper circuit board.

[0015] In one embodiment, two electrodes of each secondary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. The inductor further includes two connecting members. Two end portions of each connecting member are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board, so that the two secondary windings are electrically connected in series via the upper circuit board, the lower circuit board and the two connecting members.

[0016] In one embodiment, the two connecting members are disposed in a magnetic body of the inductor and are located on two opposite sides of the magnetic body.

[0017] In one embodiment, the inductor further includes two power conduction members. Two end portions of each power conduction member are respectively disposed on the upper surface and the lower surface of the inductor.

[0018] In one embodiment, the two power conduction members are disposed in a magnetic body of the inductor and are located on two opposite sides of the magnetic body.

[0019] In one embodiment, the first-stage power supply module includes a plurality of sub-power supply modules. The lower circuit boards of the plurality of sub-power supply modules are integrated into a single lower circuit board. The upper circuit boards of the plurality of sub-power supply modules are separated from each other.

[0020] In one embodiment, two electrodes of each secondary winding are disposed on the upper surface of the inductor and are connected to the upper circuit board, so that the two secondary windings are electrically connected in series via the upper circuit board.

[0021] In one embodiment, the first-stage power supply module includes at least one control electrode configured to receive a control signal from a power element on the upper circuit board via a signal connection structure.

[0022] In one embodiment, the first-stage power supply module includes a power controller disposed on the upper circuit board. The power controller transmits a control signal to a power element on the upper circuit board via the upper circuit board. There is no control electrode disposed on the lower circuit board. The control signal is only transmitted via the upper circuit board.

[0023] In one embodiment, the inductor has a symmetric structure.

[0024] In one embodiment, two power switches are disposed on the upper circuit board. The two power switches are connected in series at a switch pad to form a half-bridge power element or a full-bridge power element.

[0025] In one embodiment, the switch pad is electrically connected to one of the two electrodes of the primary winding disposed on the upper surface of the inductor. The other of the two electrodes of the primary winding disposed on the lower surface of the inductor is electrically connected to an output electrode of the lower circuit board. One of the two primary windings and one of the two power switches form a phase power output.

[0026] In one embodiment, the first-stage power supply module further includes a plurality of output capacitors. The lower surface of the inductor has a groove configured to accommodate the plurality of output capacitors.

[0027] In one embodiment, the first-stage power supply module further includes a plurality of input capacitors embedded in the upper surface of the inductor.

[0028] In one embodiment, the lower circuit board is provided with a plurality of output capacitors and no input capacitors, and the upper circuit board is provided with a plurality of input capacitors and no output capacitors.

[0029] In one embodiment, the first-stage power supply module includes at least one sub-power supply module. Each sub-power supply module includes an upper circuit board, a lower circuit board, and an inductor. The lower circuit board is disposed opposite the upper circuit board. The lower circuit board has a plurality of power electrodes. The plurality of power electrodes are disposed on a mounting surface of the lower circuit board. The plurality of power electrodes are configured to be mounted to a system board. The inductor is disposed between the upper circuit board and the lower circuit board. An upper surface of the inductor faces the upper circuit board. A lower surface of the inductor faces the lower circuit board. The inductor includes two primary windings and two secondary windings. Two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. Two electrodes of each secondary winding are disposed on the lower surface of the inductor and are connected to the lower circuit board, such that the secondary winding is electrically connected in series with the system board via the lower circuit board.

[0030] In one embodiment, a plurality of output capacitors are embedded in the lower circuit board.

[0031] In summary, the system board, the first-level power supply module, and the second-level power supply module are stacked on top of each other through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the heat conduction structure is sandwiched between the first-level power supply module and the second-level power supply module, the heat conduction structure can dissipate heat from the first-level power supply module and the second-level power supply module. In addition, in the first-level power supply module, the two electrodes of each primary winding are respectively arranged on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board, so that the power components on the upper circuit board can transmit power to the system board connected to the lower circuit board. In one embodiment, the secondary windings can be electrically connected in series via the upper circuit board and the lower circuit board or via the upper circuit board. In another embodiment, the secondary windings can be electrically connected in series via the lower circuit board and the system board. With the above configuration, the two primary windings and the two power switch elements can form a two-phase power output or two output voltages. Thus, the first-level power supply module of the present invention can be stacked with the system board through a vertical power supply configuration, thereby reducing the path and transient of the power distribution network. Since the first-level power supply module is stacked with the system board, the power transmission path can be minimized to reduce parasitic inductance and reduce the size of the system board.

[0032] The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings. Brief Description of the Drawings

[0033] Figure 1 A perspective view of a power supply module according to an embodiment of the present invention.

[0034] Figure 2 is Figure 1 an exploded view of the power supply module in

[0035] Figure 3 is Figure 1 an exploded view of the sub-power supply module in

[0036] Figure 4 is Figure 3 a perspective view of the inductor in

[0037] Figure 5 is Figure 3 a perspective view of the inductor after removing the thermal filler in

[0038] Figure 6 is Figure 1 a schematic diagram of a partial configuration of the power supply module in

[0039] Figure 7 is Figure 6Schematic diagram of the equivalent circuit of the power supply module in

[0040] Figure 8 Is a perspective view of an inductor according to another embodiment of the present invention.

[0041] Figure 9 Is a perspective view of a two-primary-winding and secondary-winding according to another embodiment of the present invention.

[0042] Figure 10 Is a perspective view of a sub-power supply module according to another embodiment of the present invention.

[0043] Figure 11 Is Figure 10 The side view of the sub-power supply module in

[0044] Figure 12 Is a perspective view of a sub-power supply module according to another embodiment of the present invention.

[0045] Figure 13 Is a perspective view of a sub-power supply module according to another embodiment of the present invention.

[0046] Figure 14 Is Figure 13 The internal perspective view of the sub-power supply module in

[0047] Figure 15 Is Figure 13 The perspective view of the sub-power supply module from another perspective in

[0048] Figure 16 Is a schematic diagram of a power supply system according to an embodiment of the present invention.

[0049] Wherein, the reference numerals are explained as follows:

[0050] 1: Power supply module

[0051] 1', 1": Sub-power supply module

[0052] 3, 50: System board

[0053] 5: Power supply system

[0054] 7: Power supply unit

[0055] 10: Upper circuit board

[0056] 12: Lower circuit board

[0057] 14: Inductor

[0058] 16: Power controller

[0059] 50a: First side

[0060] 50b: Second side

[0061] 52: First - stage power supply module

[0062] 54: Second - stage power supply module

[0063] 56: Heat - conducting structure

[0064] 58: Heat - dissipation structure

[0065] 60: Heat - dissipation device

[0066] 62: Conductive post

[0067] 70: Power cord

[0068] 140a, 140b, 140a', 140b': Primary winding

[0069] 142a, 142b, 142a', 142b': Secondary winding

[0070] 144: Magnetic body

[0071] 146a, 146b: Connecting piece

[0072] 148a, 148b: Power - conducting part

[0073] 150: Heat - conducting filler

[0074] 152a, 152b: Power component

[0075] 154: Signal connection structure

[0076] 156, 158: Groove

[0077] 500: Processor

[0078] 502: Heat - dissipation surface

[0079] 520: Mounting surface

[0080] 1400, 1402, 1420, 1422: Electrode

[0081] 1460, 1462, 1480, 1482: End part

[0082] 1520: Power switch

[0083] E1: Voltage input terminal

[0084] E2: Voltage output terminal

[0085] S1: Upper surface

[0086] S2: Lower surface

[0087] SW0, SW1, SW2, SW3: Switch pad

[0088] Vout: Output electrode

[0089] Vin: Input electrode

[0090] GND: Ground electrode

[0091] Cout: Output capacitor

[0092] Cin: Input capacitor

[0093] T00, T01, T10, T11, T20, T21, T30, T31: Contacts Detailed implementation manners

[0094] Please refer to Figures 1 to 7 , Figure 1 , which is a perspective view of the power supply module 1 according to an embodiment of the present invention, Figure 2 is Figure 1 the exploded view of the power supply module 1 in Figure 3 is Figure 1 the exploded view of the sub - power supply module 1' in Figure 4 is Figure 3 the perspective view of the inductor 14 in Figure 5 is Figure 3 the perspective view of the inductor 14 after removing the thermal conductive filler in Figure 6 is Figure 1 the schematic diagram of a partial configuration of the power supply module 1 in Figure 7 is Figure 6 the schematic diagram of the equivalent circuit of the power supply module 1 in

[0095] As Figures 1 to 3 shown, the power supply module 1 includes at least one sub - power supply module 1'. Each sub - power supply module 1' includes an upper circuit board 10, a lower circuit board 12, and an inductor 14. The lower circuit board 12 is disposed opposite to the upper circuit board 10, and the inductor 14 is disposed between the upper circuit board 10 and the lower circuit board 12. In this embodiment, the power supply module 1 may include multiple sub - power supply modules 1', wherein the lower circuit boards 12 of the multiple sub - power supply modules 1' can be integrated into a single lower circuit board 12, and the upper circuit boards 10 of the multiple sub - power supply modules 1' can be separated from each other. Therefore, the thermal stresses of the sub - power supply modules 1' do not interfere with each other, so as to reduce the overall thermal stress of the power supply module 1. However, the present invention is not limited to the embodiments shown in the figures. In another embodiment, the lower circuit boards 12 of the multiple sub - power supply modules 1' may also be separated from each other. In addition, the number of the sub - power supply modules 1' can be determined according to actual applications.

[0096] As Figures 3 to 6As shown, an upper surface S1 of the inductor 14 faces the upper circuit board 10, and a lower surface S2 of the inductor 14 faces the lower circuit board 12. In this embodiment, the inductor 14 may include two primary windings 140a, 140b and two secondary windings 142a, 142b, wherein the primary winding 140a and the secondary winding 142a form a pair of windings, and the primary winding 140b and the secondary winding 142b form another pair of windings. In practical applications, the inductor 14 may include a magnetic body 144 (e.g., a magnetic core), wherein the upper surface S1 and the lower surface S2 may be opposite surfaces of the magnetic body 144. The two primary windings 140a, 140b and the two secondary windings 142a, 142b may be molded in the magnetic body 144. The two primary windings 140a, 140b and the two secondary windings 142a, 142b are electrically insulated within the magnetic body 144. For example, the two primary windings 140a, 140b and the two secondary windings 142a, 142b may be arranged at intervals or coated with an insulating layer.

[0097] Two electrodes 1400, 1402 of each of the primary windings 140a, 140b are respectively arranged on the upper surface S1 and the lower surface S2 of the inductor 14, and are respectively connected to the upper circuit board 10 and the lower circuit board 12. Further, the electrode 1400 of each of the primary windings 140a, 140b is arranged on the upper surface S1 of the inductor 14 and is connected to the upper circuit board 10; the electrode 1402 of each of the primary windings 140a, 140b is arranged on the lower surface S2 of the inductor 14 and is connected to the lower circuit board 12.

[0098] As Figure 6 shown Figure 7 As shown, the secondary windings 142a, 142b may be electrically connected in series via the upper circuit board 10 and the lower circuit board 12. In this embodiment, two electrodes 1420, 1422 of each of the secondary windings 142a, 142b are respectively arranged on the upper surface S1 and the lower surface S2 of the inductor 14, and are respectively connected to the upper circuit board 10 and the lower circuit board 12. Further, the electrode 1420 of each of the secondary windings 142a, 142b is arranged on the upper surface S1 of the inductor 14 and is connected to the upper circuit board 10; the electrode 1422 of each of the secondary windings 142a, 142b is arranged on the lower surface S2 of the inductor 14 and is connected to the lower circuit board 12.

[0099] In this embodiment, the inductor 14 may further include two connection members 146a and 146b. Two end portions 1460 and 1462 of each of the connection members 146a and 146b are respectively disposed on the upper surface S1 and the lower surface S2 of the inductor 14, and are respectively connected to the upper circuit board 10 and the lower circuit board 12. Further, the end portion 1460 of each of the connection members 146a and 146b is disposed on the upper surface S1 of the inductor 14 and is connected to the upper circuit board 10; the end portion 1462 of each of the connection members 146a and 146b is disposed on the lower surface S2 of the inductor 14 and is connected to the lower circuit board 12.

[0100] As Figure 6 shown, the electrode 1420 of the secondary winding 142a can be electrically connected to the end portion 1460 of the connection member 146a via the upper circuit board 10, the electrode 1422 of the secondary winding 142a can be electrically connected to the end portion 1462 of the connection member 146b via the lower circuit board 12, and the electrode 1420 of the secondary winding 142b can be electrically connected to the end portion 1460 of the connection member 146b via the upper circuit board 10, so that the secondary windings 142a and 142b are electrically connected in series via the upper circuit board 10, the lower circuit board 12 and the two connection members 146a and 146b. It should be noted that the electrode 1420 of the secondary winding 142b of a sub-power supply module 1' can be electrically connected to the end portion 1462 of the connection member 146a of an adjacent sub-power supply module 1' via the lower circuit board 12, so that the two adjacent sub-power supply modules 1' are electrically connected to each other.

[0101] In this embodiment, the inductor 14 may further include two power conductors 148a and 148b. Two end portions 1480 and 1482 of each of the power conductors 148a and 148b are respectively disposed on the upper surface S1 and the lower surface S2 of the inductor 14, and are respectively connected to the upper circuit board 10 and the lower circuit board 12. Further, the end portion 1480 of each of the power conductors 148a and 148b is disposed on the upper surface S1 of the inductor 14 and is connected to the upper circuit board 10; the end portion 1482 of each of the power conductors 148a and 148b is disposed on the lower surface S2 of the inductor 14 and is connected to the lower circuit board 12.

[0102] In this embodiment, the two connection members 146a and 146b can be disposed on opposite sides of the inductor 14 and are covered by a heat-conducting filler 150. Similarly, the two power conductors 148a and 148b can also be disposed on opposite sides of the inductor 14 and are covered by the heat-conducting filler 150. Therefore, the inductor 14 can be a symmetric structure. No connection members and power conductors are provided on the other two sides of the inductor 14, thereby simplifying the manufacturing process of the inductor 14 and reducing the manufacturing cost.

[0103] In this embodiment, two power components 152a and 152b can be disposed on the upper circuit board 10. The power components 152a and 152b can be Dr.MOS mainly composed of a driver IC (driver IC) and a metal-oxide-semiconductor field-effect transistor (MOSFET), but are not limited thereto. The sub-power supply module 1' can include at least one control electrode configured to receive control signals from the power components 152a and 152b on the upper circuit board 10 via a signal connection structure 154. The signal connection structure 154 can shorten the signal transmission path to make the operation more stable. Each of the power components 152a and 152b can include two power switches 1520, where the two power switches 1520 are disposed on the upper circuit board 10 and are serially connected at a switch pad to form a half-bridge power component or a full-bridge power component. As Figure 7 shown, the two power switches 1520 of the power component 152a of a sub-power supply module 1' are serially connected at a switch pad SW0, the two power switches 1520 of the power component 152b of a sub-power supply module 1' are serially connected at a switch pad SW1, the two power switches 1520 of the power component 152a of another sub-power supply module 1' are serially connected at a switch pad SW2, and the two power switches 1520 of the power component 152b of another sub-power supply module 1' are serially connected at a switch pad SW3.

[0104] In this embodiment, the lower circuit board 12 can have a plurality of power electrodes, and the plurality of power electrodes are disposed on a mounting surface of the lower circuit board 12, where the plurality of power electrodes are configured to be mounted to a system board 3 (such as Figure 1 shown). In practical applications, the system board 3 can be a server equipped with a central processing unit (CPU), a graphics processing unit (GPU), a random access memory (RAM), a hard disk drive (HDD), a solid state disk (SSD), a network interface, etc. As Figure 6 shown, the power electrodes can include a plurality of output electrodes Vout, a plurality of input electrodes Vin, and a plurality of ground electrodes GND.

[0105] In this embodiment, the power supply module 1 can further include a plurality of output capacitors Cout and a plurality of input capacitors Cin. The output capacitors Cout can be disposed on the lower circuit board 12. As Figure 4As shown, the lower surface S2 of the inductor 14 may have a groove 156 configured to accommodate a plurality of output capacitors Cout. In this embodiment, the primary windings 140a, 140b, the secondary windings 142a, 142b, the connectors 146a, 146b, and / or the power conductors 148a, 148b may protrude from the magnetic body 144 to form the groove 156 therebetween. In addition, the input capacitor Cin may be disposed on the upper circuit board 10 and surround the power components 152a, 152b. In this embodiment, the lower circuit board 12 may be provided with a plurality of output capacitors Cout without an input capacitor, and the upper circuit board 10 may be provided with a plurality of input capacitors Cin without an output capacitor.

[0106] As Figure 6 shown Figure 7 As shown, T00, T01, T10, T11, T20, T21, T30, and T31 represent a plurality of contacts of the secondary windings 142a, 142b of the two-sub power supply module 1'. The secondary windings 142a, 142b of the two-sub power supply module 1' are electrically connected in series via the upper circuit board 10, the lower circuit board 12, and the connectors 146a, 146b. In addition, the switch pad SW0 is electrically connected to one of the two electrodes 1400, 1402 of the primary winding 140a provided on the upper surface S1 of the inductor 14, and the other of the two electrodes 1400, 1402 of the primary winding 140a provided on the lower surface S2 of the inductor 14 is electrically connected to the output electrode Vout of the lower circuit board 12. It should be noted that the switch pads SW1, SW2, and SW3 are connected to the primary winding 140a or 140b in the same manner as the switch pad SW0, and will not be elaborated here. Therefore, in one sub power supply module 1', one of the two primary windings 140a, 140b and one of the two power switches 1520 form a one-phase power output, such that the two primary windings 140a, 140b and the two power switches 1520 can form a two-phase power output. Each phase power output can be powered in parallel by the circuit layout of the lower circuit board 12 or the system board 3.

[0107] With the above configuration, the power supply module 1 of the present invention can be stacked with the system board 3 through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the power supply module 1 is stacked with the system board 3, the power transmission path can be minimized to reduce the parasitic inductance and decrease the size of the system board.

[0108] Please refer to Figure 8 , Figure 8 which is a perspective view of the inductor 14 according to another embodiment of the present invention.

[0109] As Figure 8 shown, the two connecting members 146a, 146b and the two power conducting members 148a, 148b can be disposed within the magnetic body 144 of the inductor 14 and located on two opposite sides of the magnetic body 144.

[0110] Please refer to Figure 9 , Figure 9 which is a perspective view of the two primary windings 140a', 140b' and the two secondary windings 142a', 142b' according to another embodiment of the present invention.

[0111] Figure 5 The two primary windings 140a, 140b and the two secondary windings 142a, 142b shown in Figure 9 can be replaced by the two primary windings 140a', 140b' and the two secondary windings 142a', 142b' shown in Figure 3 . After replacement, the two electrodes 1420, 1422 of each secondary winding 142a', 142b' are disposed on the upper surface S1 of the inductor 14 and connected to the upper circuit board 10 (as Figure 5 and Figure 6 shown), such that the two secondary windings 142a', 142b' are electrically connected in series via the upper circuit board 10. Therefore,

[0112] Please refer to Figure 10 and Figure 11 , Figure 10 which is a perspective view of the sub-power supply module 1' according to another embodiment of the present invention, Figure 11 and Figure 10 is a side view of the sub-power supply module 1' in

[0113] As Figure 10 and Figure 11As shown, the sub-power supply module 1' further includes a power controller 16 disposed on the upper circuit board 10. The power controller 16 transmits control signals to the power components 152a, 152b on the upper circuit board 10 via the circuit wiring of the upper circuit board 10. In this embodiment, no control electrodes are provided on the lower circuit board 12, and the control signals are only transmitted via the upper circuit board 10. Therefore, the control signals to be transmitted by the signal connection structure 154 are fewer, enabling the signal connection structure 154 to become smaller. In addition, a groove 158 may be formed on the upper surface S1 of the inductor 14 and configured to accommodate the input capacitor Cin. Thereby, the input capacitor Cin can be disposed on two opposite sides of the upper circuit board 10 to increase the number of input capacitors Cin according to actual requirements.

[0114] Please refer to Figure 12 , Figure 12 which is a perspective view of the sub-power supply module 1' according to another embodiment of the present invention.

[0115] As Figure 12 shown, the groove 158 described above may be omitted from the sub-power supply module 1', and a plurality of input capacitors Cin may be embedded in the upper surface S1 of the inductor 14.

[0116] Please refer to Figures 13 to 15 , Figure 13 which is a perspective view of the sub-power supply module 1” according to another embodiment of the present invention, Figure 14 and Figure 13 is an internal perspective view of the sub-power supply module 1” in Figure 15 , Figure 13 and is a perspective view of the sub-power supply module 1” in

[0117] Figure 1 The sub-power supply module 1' shown can be Figure 13 replaced with the sub-power supply module 1” shown. The main difference between the sub-power supply module 1” and the above-mentioned sub-power supply module 1' is that the two electrodes 1420, 1422 of each secondary winding 142a, 142b are disposed on the lower surface S2 of the inductor 14 and connected to the lower circuit board 12 (as Figure 14 shown), such that the secondary windings 142a, 142b are electrically connected in series with the system board 3 via the lower circuit board 12. In this embodiment, a plurality of output capacitors Cout may be embedded in the lower circuit board 12, as Figure 15 shown.

[0118] Please refer to Figure 16 , Figure 16 which is a schematic diagram of a power supply system 5 according to an embodiment of the present invention.

[0119] As Figure 16As shown, the power supply system 5 includes a system board 50, a first-stage power supply module 52, a second-stage power supply module 54, a heat conduction structure 56, a heat dissipation structure 58, and a heat dissipation device 60. The system board 50 includes a processor 500, the processor 500 is located on a first surface 50a of the system board 50, and the first-stage power supply module 52 is disposed on a second surface 50b of the system board 50, where the first surface 50a and the second surface 50b are opposite. In this embodiment, the system board 50 can be a server equipped with a central processing unit (CPU), a graphics processing unit (GPU), a random access memory (RAM), a hard disk drive (HDD), a solid-state disk (SSD), a network interface, etc., and the processor 500 can be a central processing unit, a graphics processing unit, or a similar component. The second-stage power supply module 54 is disposed on the first-stage power supply module 52. The heat conduction structure 56 is sandwiched between the first-stage power supply module 52 and the second-stage power supply module 54, where opposite two sides of the heat conduction structure 56 are respectively in contact with the first-stage power supply module 52 and the second-stage power supply module 54. Thus, the system board 50, the first-stage power supply module 52, and the second-stage power supply module 54 are stacked on each other through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the heat conduction structure 56 is sandwiched between the first-stage power supply module 52 and the second-stage power supply module 54, the heat conduction structure 56 can dissipate heat from the first-stage power supply module 52 and the second-stage power supply module 54.

[0120] The heat dissipation structure 58 is disposed outside the first-stage power supply module 52 and the second-stage power supply module 54, where the heat conduction structure 56 is connected to the heat dissipation structure 58. In practical applications, the heat conduction structure 56 and the heat dissipation structure 58 can be combined into a heat dissipation mechanism, such as a cold plate, a heat pipe, a radiator, or a combination thereof, to dissipate heat from the first-stage power supply module 52 and the second-stage power supply module 54.

[0121] The heat dissipation device 60 is disposed on a heat dissipation surface 502 of the processor 500 and is configured to dissipate heat from the processor 50. In practical applications, the heat dissipation device 60 can be a cold plate, a heat pipe, a radiator, or a combination thereof. The heat dissipation structure 58 can pass through the system board 50 and be connected to the heat dissipation device 60, so that the heat dissipation structure 58 can conduct heat to the heat dissipation device 60 for heat dissipation.

[0122] In this embodiment, an installation surface 520 of the first-level power supply module 52 is welded to the system board 50, and the second-level power supply module 54 and the first-level power supply module 52 are stacked in sequence from far away from the installation surface 520 to the installation surface 520, so that the second-level power supply module 54 and the first-level power supply module 52 are serially powered in sequence. Since the first-level power supply module 52 and the system board 50 are stacked on each other, the processor 500 is vertically stacked with the first-level power supply module 52.

[0123] In this embodiment, a voltage input terminal E1 is only provided on the second-level power supply module 54, and a voltage output terminal E2 is only provided on the installation surface 520 of the first-level power supply module 52. In other words, no voltage input terminal is provided on the installation surface 520 of the first-level power supply module 52. In addition, a power line 70 of a power supply unit 7 is connected to the voltage input terminal E1 of the second-level power supply module 54, and a conductive column 62 is connected to the first-level power supply module 52 and the second-level power supply module 54.

[0124] During the operation of the power supply system 5, the voltage input terminal E1 of the second-level power supply module 54 receives an input voltage transmitted and provided by the power line 70 of the power supply unit 7. The second-level power supply module 54 is configured to convert the input voltage into an intermediate output voltage. The conductive column 62 is configured to transmit the intermediate output voltage from the second-level power supply module 54 to the first-level power supply module 52. The first-level power supply module 52 is configured to convert the intermediate output voltage into a target output voltage. Then, the first-level power supply module 52 provides the target output voltage to the processor 500 through a circuit wiring of the system board 50 from a plurality of power electrodes on the installation surface 520. In this embodiment, the first-level power supply module 52 can be implemented by the above-mentioned power supply module 1, which will not be elaborated here. In addition, the second-level power supply module 54 mainly includes a main board, a control board, a transformer located between the main board and the control board, and other related voltage conversion components.

[0125] In this embodiment, the target output voltage is less than the intermediate output voltage, and the intermediate output voltage is less than the input voltage. For example, the input voltage can be 48V, the intermediate output voltage can be 6V, and the target output voltage can be 1V. It should be noted that the input voltage, the intermediate output voltage, and the target output voltage can be determined according to actual applications, and the present invention is not limited to the above embodiments.

[0126] In summary, the system board, the first-stage power supply module, and the second-stage power supply module are stacked on top of each other through a vertical power delivery (VPD) configuration, thereby reducing the path and transient of the power distribution network (PDN). Since the heat conduction structure is sandwiched between the first-stage power supply module and the second-stage power supply module, the heat conduction structure can dissipate heat from the first-stage power supply module and the second-stage power supply module. In addition, in the first-stage power supply module, the two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board, so that the power components on the upper circuit board can transmit power to the system board connected to the lower circuit board. In one embodiment, the secondary windings can be electrically connected in series via the upper circuit board and the lower circuit board or via the upper circuit board. In another embodiment, the secondary windings can be electrically connected in series via the lower circuit board and the system board. With the above configuration, the two primary windings and the two power switch elements can form a two-phase power output or two output voltages. Thus, the first-stage power supply module of the present invention can be stacked with the system board through a vertical power supply configuration, thereby reducing the path and transient of the power distribution network. Since the first-stage power supply module is stacked with the system board, the power transmission path can be minimized to reduce the parasitic inductance and reduce the size of the system board.

[0127] The above are only the preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the present invention.

Claims

1. A power supply system, comprising: A system board, including a processor located on a first surface of the system board; A first-stage power supply module, disposed on a second surface of the system board, and providing a target output voltage to the processor from a plurality of power electrodes on an installation surface of the first-stage power supply system via a circuit wiring on the system board; A second-stage power supply module, disposed on the first-stage power supply module; And A heat conduction structure, sandwiched between the first-stage power supply module and the second-stage power supply module, with opposite two sides of the heat conduction structure respectively contacting the first-stage power supply module and the second-stage power supply module.

2. The power supply system according to claim 1, further comprising a heat dissipation structure, disposed outside the first-stage power supply module and the second-stage power supply module, wherein the heat conduction structure is connected to the heat dissipation structure.

3. The power supply system according to claim 2, further comprising a heat dissipation device, disposed on a heat dissipation surface of the processor, wherein the heat dissipation structure passes through the system board and is connected to the heat dissipation device.

4. The power supply system according to claim 1, wherein the installation surface of the first-stage power supply module is welded to the system board, and the second-stage power supply module and the first-stage power supply module are stacked in sequence from away from the installation surface to the installation surface, such that the second-stage power supply module and the first-stage power supply module supply power in series in sequence.

5. The power supply system according to claim 4, wherein a voltage input terminal is only disposed on the second-stage power supply module, and a voltage output terminal is only disposed on the installation surface of the first-stage power supply module.

6. The power supply system according to claim 5, wherein the voltage input terminal of the second-stage power supply module receives an input voltage transmitted and provided by a power line of a power supply unit.

7. The power supply system according to claim 4, wherein no voltage input terminal is disposed on the installation surface of the first-stage power supply module.

8. The power supply system according to claim 1, wherein a conductive column is connected between the first-stage power supply module and the second-stage power supply module, and is configured to transmit an intermediate output voltage from the second-stage power supply module to the first-stage power supply module.

9. The power supply system according to claim 1, wherein the second-stage power supply module is configured to convert an input voltage into an intermediate output voltage, the first-stage power supply module is configured to convert the intermediate output voltage into the target output voltage, the target output voltage is less than the intermediate output voltage, and the intermediate output voltage is less than the input voltage.

10. The power supply system according to claim 1, wherein the processor and the first-stage power supply module are vertically stacked.

11. The power supply system according to claim 1, wherein the first-stage power supply module includes at least one sub-power supply module, and each sub-power supply module includes: An upper circuit board; A lower circuit board, disposed opposite to the upper circuit board, the lower circuit board having a plurality of power electrodes, the plurality of power electrodes being disposed on an installation surface of the lower circuit board, and the plurality of power electrodes being configured to be mounted to a system board; and An inductor is disposed between the upper circuit board and the lower circuit board. An upper surface of the inductor faces the upper circuit board, and a lower surface of the inductor faces the lower circuit board. The inductor includes two primary windings and one secondary winding. Two electrodes of each primary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. The secondary winding is electrically connected in series via the upper circuit board and the lower circuit board or via the upper circuit board.

12. The power supply system according to claim 11, wherein two electrodes of each secondary winding are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board. The inductor further includes two connecting members. Two end portions of each connecting member are respectively disposed on the upper surface and the lower surface of the inductor, and are respectively connected to the upper circuit board and the lower circuit board, such that the secondary winding is electrically connected in series via the upper circuit board, the lower circuit board and the two connecting members.

13. The power supply system according to claim 12, wherein the two connecting members are disposed in a magnetic body of the inductor and are located on opposite sides of the magnetic body.

14. The power supply system according to claim 11, wherein the inductor further includes two power conduction members. Two end portions of each power conduction member are respectively disposed on the upper surface and the lower surface of the inductor.

15. The power supply system according to claim 14, wherein the two power conduction members are disposed in a magnetic body of the inductor and are located on opposite sides of the magnetic body.

16. The power supply system according to claim 11, wherein the first-stage power supply module includes a plurality of sub-power supply modules. The lower circuit boards of the plurality of sub-power supply modules are integrated into a single lower circuit board, and the upper circuit boards of the plurality of sub-power supply modules are separated from each other.

17. The power supply system according to claim 11, wherein two electrodes of each secondary winding are disposed on the upper surface of the inductor and are connected to the upper circuit board, such that the secondary winding is electrically connected in series via the upper circuit board.

18. The power supply system according to claim 11, wherein the sub-power supply module includes at least one control electrode configured to receive a control signal from a power element on the upper circuit board via a signal connection structure.

19. The power supply system according to claim 11, wherein the first-stage power supply module includes a power controller disposed on the upper circuit board. The power controller transmits a control signal to a power element on the upper circuit board via the upper circuit board. No control electrode is disposed on the lower circuit board, and the control signal is only transmitted via the upper circuit board.

20. The power supply system according to claim 11, wherein the inductor is of a symmetric structure.

21. The power supply system according to claim 11, wherein two power switches are disposed on the upper circuit board. The two power switches are connected in series at a switch pad to form a half-bridge power element or a full-bridge power element.

22. The power supply system as claimed in claim 21, wherein the switch pad is electrically connected to one of the two electrodes of the primary winding disposed on the upper surface of the inductor, and the other of the two electrodes of the primary winding disposed on the lower surface of the inductor is electrically connected to an output electrode of the lower circuit board, and one of the two primary windings and one of the two power switches form a phase power output.

23. The power supply system as claimed in claim 11, wherein the first-stage power supply module further includes a plurality of output capacitors, and the lower surface of the inductor has a groove configured to accommodate the plurality of output capacitors.

24. The power supply system as claimed in claim 11, wherein the first-stage power supply module further includes a plurality of input capacitors embedded in the upper surface of the inductor.

25. The power supply system as claimed in claim 11, wherein the lower circuit board is provided with a plurality of output capacitors without input capacitors, and the upper circuit board is provided with a plurality of input capacitors without output capacitors.

26. The power supply system as claimed in claim 1, wherein the first-stage power supply module includes at least one sub-power supply module, and each sub-power supply module includes: an upper circuit board; a lower circuit board disposed opposite to the upper circuit board, the lower circuit board having a plurality of power electrodes, the plurality of power electrodes being disposed on a mounting surface of the lower circuit board, and the plurality of power electrodes being configured to be mounted to a system board; and an inductor disposed between the upper circuit board and the lower circuit board, an upper surface of the inductor facing the upper circuit board, a lower surface of the inductor facing the lower circuit board, the inductor including two primary windings and two secondary windings, two electrodes of each primary winding being respectively disposed on the upper surface and the lower surface of the inductor and respectively connected to the upper circuit board and the lower circuit board, two electrodes of each secondary winding being disposed on the lower surface of the inductor and connected to the lower circuit board, such that the secondary winding is electrically connected in series with the system board via the lower circuit board.

27. The power supply system as claimed in claim 26, wherein a plurality of output capacitors are embedded in the lower circuit board.

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