Wireless communication chip packaging equipment

Abstract

The invention discloses wireless communication chip packaging equipment, and relates to the technical field of semiconductor manufacturing. The device comprises a rack, a rotating mechanism is fixedly installed on the inner wall of the rack, and the output end of the rotating mechanism is fixedly connected with a rotating disc. According to the invention, the rotating disc is driven to rotate through the rotating mechanism, so that chips on each station are sequentially subjected to the working procedures of conveying, picking, dispensing, pasting, pressing, detecting and the like, the chips can be quickly and accurately switched among different stations, the waiting time of manual intervention and the working procedures is reduced, the production efficiency is greatly improved, the requirements of large-scale production can be met, and the production cost is reduced. Through the design of the hot air pump and the cover body, glue solidification is accelerated through hot air while pressure is applied to a chip after chip mounting, gaps and bubbles between the chip and a substrate are effectively eliminated, the packaging tightness and reliability are improved, meanwhile, the sealing ring at the bottom of the cover body ensures that the pressure and temperature are stable in the pressure applying process, and the sealing effect is good. And the packaging quality is further ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and specifically relates to a wireless communication chip packaging device. Background Art

[0002] At present, with the rapid development of wireless communication technology, the demand for wireless communication chips is increasing continuously. However, there are many problems in traditional chip packaging devices. For example, during the chip conveying process, the chips are prone to deviation and inaccurate positioning, resulting in a low packaging yield; the accuracy of processes such as dispensing and chip mounter is insufficient to meet the packaging requirements of miniaturized and highly integrated chips; the connection between the functional modules of the device is not tight enough, and the overall operation efficiency is low, increasing the production cost and time cost.

[0003] Therefore, a wireless communication chip packaging device is proposed. Summary of the Invention

[0004] The purpose of the present invention is: to solve the problems raised in the above background art, the present invention provides a wireless communication chip packaging device.

[0005] The present invention specifically adopts the following technical solutions to achieve the above purpose:

[0006] A wireless communication chip packaging device includes a frame, and a rotating mechanism is fixedly installed on the inner wall of the frame. The output end of the rotating mechanism is fixedly connected to a turntable, and the turntable is located inside the rotating mechanism. Six equally spaced through slots are opened on the top surface of the turntable, and a placement plate is fixedly installed in the through slots to support and place wireless communication chips. A chip conveying mechanism and a chip output mechanism are arranged on one side wall of the frame, and a chip mounter conveying mechanism is arranged on the other side wall. A picking component is arranged on the top surfaces of the chip conveying mechanism and the chip output mechanism and the top surface of the chip mounter conveying mechanism to pick up and transport wireless communication chip substrates, chip mounters, and packaged wireless communication chips. A dispensing component is arranged on the top surface of the frame to apply glue to the wireless communication chip substrate. A pressing component is arranged on the top surface of the frame to press the wireless communication chip after chip mounter to eliminate its gaps and bubbles. A third side frame is fixedly installed on the top surface of the frame, and an X-ray detector is arranged on the top surface of the third side frame to detect the packaged wireless communication chips.

[0007] Further, the rotating mechanism includes a cross frame fixedly installed on the inner wall of the frame, and a first servo motor is fixedly installed on the bottom surface of the cross frame. The output end of the first servo motor penetrates through the cross frame and is fixedly connected to a connecting disc. The top surfaces of the turntable and the connecting disc are inserted and fixed by nuts.

[0008] Further, the picking component includes an aluminum profile frame fixedly installed on the top surfaces of the chip conveying mechanism, the chip output mechanism, and the patch conveying mechanism. A second servo motor is fixedly installed on one side wall of the aluminum profile frame. The output end of the second servo motor is fixedly connected to a first threaded rod. First guide rods are fixedly installed on both inner walls of the aluminum profile frame. A movable frame is sleeved on the surface of the first threaded rod in a threaded manner, and the movable frame is slidably arranged on the surfaces of the first guide rods. A third servo motor is fixedly installed on one side wall of the movable frame. The output end of the third servo motor is fixedly connected to a second threaded rod. Second guide rods are fixedly installed on the opposite surfaces of the movable frame. A movable block is sleeved on the surface of the second threaded rod in a threaded manner, and the movable block is slidably arranged on the second guide rods. A cylinder is fixedly installed on the bottom surface of the movable block. The end of the cylinder is fixedly installed with a first mounting frame, and a suction cup is arranged on the first mounting frame.

[0009] Further, the dispensing component includes a first side frame fixedly installed on the top surface of the frame. A first electric push rod is fixedly installed on the top surface of the first side frame. The output end of the first electric push rod is fixedly connected to a second mounting frame, and a dispensing head is fixedly inserted into the second mounting frame. The output end of the dispensing head is connected to a glue supply pipe.

[0010] Further, the pressing component includes a second side frame fixedly installed on the top surface of the frame. A second electric push rod is fixedly installed on the top surface of the second side frame. The movable end of the second electric push rod is fixedly connected to a first threaded rod. The end of the connecting frame is fixedly connected to a cover body, and an air pipe is arranged on the surface of the cover body. A hot air pump is fixedly connected to the top surface of the cover body, and the hot air pump is connected to the end of the air pipe.

[0011] Further, the bottom end of the cover body is fixedly sleeved with an air pipe, and the air pipe is made of a rubber material.

[0012] Further, the cover body is located above the through groove on the surface of the turntable. When pressing the wireless communication chip, the bottom surface of the cover body is attached to the top surface of the turntable.

[0013] Further, the X-ray detector is fixedly installed on the turntable through a third side frame and is located above the through groove on its surface.

[0014] The beneficial effects of the present invention are as follows:

[0015] Through precise adjustment of the multi-degree-of-freedom picking component, the chip substrate, the patch, and the packaged chip can be accurately picked up and transported. The turntable is driven to rotate by the rotating mechanism, so that the chips at each station sequentially pass through processes such as conveying, picking, dispensing, patching, pressing, and detecting, enabling the chips to be quickly and accurately switched between different stations, reducing manual intervention and waiting time between processes, greatly improving production efficiency, and meeting the requirements of large-scale production;

[0016] Through the design of the hot air pump and the cover, while applying pressure to the chip after chip placement, hot air is used to accelerate the curing of the glue, effectively eliminating the gaps and bubbles between the chip and the substrate, improving the tightness and reliability of the packaging. At the same time, the sealing ring at the bottom of the cover ensures the stability of pressure and temperature during the pressing process, further guaranteeing the packaging quality;

[0017] Through the X-ray detector, the internal structure of the packaged chip can be detected, and products with internal defects such as poor connection between the chip and the substrate, internal voids or bubbles can be promptly discovered and removed, ensuring the quality stability of the products leaving the factory and reducing the defective rate. Brief Description of the Drawings

[0018] Figure 1 is a schematic three-dimensional structure diagram of the present invention;

[0019] Figure 2 is a front view of the present invention;

[0020] Figure 3 is a partial side view of the present invention;

[0021] Figure 4 is a partial bottom view of the present invention;

[0022] Figure 5 is a schematic diagram of the pressing assembly of the present invention;

[0023] Figure 6 is a schematic diagram of the picking assembly of the present invention;

[0024] Figure 7 is a schematic diagram of the rotating mechanism of the present invention;

[0025] Figure 8 is a schematic diagram of the turntable of the present invention;

[0026] Reference numerals: 1, frame; 2, rotating mechanism; 201, cross frame; 202, first servo motor; 203, connecting disk; 3, turntable; 31, placing plate; 4, chip conveying mechanism; 5, chip output mechanism; 6, patch conveying mechanism; 7, picking component; 701, aluminum profile frame body; 702, second servo motor; 703, first threaded rod; 704, first guide rod; 705, movable frame; 706, third servo motor; 707, second threaded rod; 708, movable block; 709, second guide rod; 710, cylinder; 711, first mounting frame; 712, suction cup; 8, dispensing component; 801, first side frame; 802, first electric push rod; 803, second mounting frame; 804, dispensing head; 805, glue supply pipeline; 9, pressing component; 901, second side frame; 902, second electric push rod; 903, connecting frame; 904, cover body; 905, air pipe; 906, hot air pump; 907, sealing ring; 10, third side frame; 11, X-ray detector. Detailed implementation mode

[0027] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts fall within the scope of protection of the present invention.

[0029] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0030] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "inner", "outer", "upper", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0031] Such asFigures 1 to 8 As shown in the figure, a wireless communication chip packaging device includes a frame 1. A rotating mechanism 2 is fixedly installed on the inner wall of the frame 1. The output end of the rotating mechanism 2 is fixedly connected to a turntable 3, and the turntable 3 is located inside the rotating mechanism 2. Six equally spaced through grooves are formed on the top surface of the turntable 3, and a placement plate 31 is fixedly installed in the through grooves to support the placement of wireless communication chips. A chip conveying mechanism 4 and a chip output mechanism 5 are arranged on one side wall of the frame 1, and a patch conveying mechanism 6 is arranged on the other side wall. A picking component 7 is arranged on the top surfaces of the chip conveying mechanism 4 and the chip output mechanism 5 and the top surface of the patch conveying mechanism 6 to pick up and transport the wireless communication chip substrate, patches, and the packaged wireless communication chips. A glue dispensing component 8 is arranged on the top surface of the frame 1 to apply glue to the wireless communication chip substrate. A pressing component 9 is arranged on the top surface of the frame 1 to press the patched wireless communication chip to eliminate its gaps and bubbles. An X-ray detector 11 is fixedly installed on the top surface of the third side frame 10 of the frame 1 to detect the packaged wire communication chips. More specifically, when the device is running, the picking component 7 picks up the chip substrate from the chip conveying mechanism 4 and places it at the corresponding position of the placement plate 31 on the surface of the turntable 3. The glue dispensing component 8 performs a glue application operation on the chip substrate. Subsequently, the patch conveying mechanism 6 conveys the patches to the designated position, and the picking component 7 picks up the patches and places them on the glued chip substrate. Subsequently, the pressing component 9 presses the patched wireless communication chip to eliminate its gaps and bubbles to ensure the tightness of the package. Then, the X-ray detector 11 detects the packaged chips to ensure that there are no defects in its internal structure. Finally, the picking component 7 picks up the packaged wireless communication chips onto the chip output mechanism 5, and the rotating mechanism 2 drives the turntable 3 to rotate, so that the chips at each station sequentially undergo processes such as conveying, picking, glue application, patching, pressing, and detection, realizing an automated packaging process.

[0032] The rotating mechanism 2 includes a cross frame 201 fixedly installed on the inner wall of the frame 1. A first servo motor 202 is fixedly installed on the bottom surface of the cross frame 201. The output end of the first servo motor 202 penetrates the cross frame 201 and is fixedly connected to a connecting disk 203. The top surfaces of the turntable 3 and the connecting disk 203 are inserted and fixed with nuts. More specifically, after the first servo motor 202 is powered on, its output end drives the connecting disk 203 to rotate. Since the top surfaces of the turntable 3 and the connecting disk 203 are inserted and fixed with nuts, the rotation of the connecting disk 203 will drive the turntable 3 to rotate synchronously, enabling the turntable 3 to rotate stably and precisely, so as to sequentially transport the wireless communication chips located on the turntable 3 to each station for corresponding packaging operations.

[0033] ​The picking component 7 includes an aluminum profile frame body 701 fixedly installed on the top surfaces of the chip conveying mechanism 4, the chip output mechanism 5, and the patch conveying mechanism 6. A second servo motor 702 is fixedly installed on one side wall of the aluminum profile frame body 701. The output end of the second servo motor 702 is fixedly connected to a first threaded rod 703. First guide rods 704 are fixedly installed on both inner walls of the aluminum profile frame body 701. A movable frame 705 is threadedly sleeved on the surface of the first threaded rod 703. The movable frame 705 and the surface of the first guide rod 704 are slidably arranged. A third servo motor 706 is fixedly installed on one side wall of the movable frame 705. The output end of the third servo motor 706 is fixedly connected to a second threaded rod 707. Second guide rods 709 are fixedly installed on the opposite surfaces of the movable frame 705. A movable block 708 is threadedly sleeved on the surface of the second threaded rod 707. The movable block 708 and the second guide rod 709 are slidably arranged. A cylinder 710 is fixedly installed on the bottom surface of the movable block 708. The end of the cylinder 710 is fixedly installed with a first mounting frame 711. A suction cup 712 is arranged on the first mounting frame 711. More specifically, when it is necessary to pick up or transport a wireless communication chip, a chip substrate, or a packaged chip, the second servo motor 702 is started to drive the first threaded rod 703 to rotate, so that the movable frame 705 moves horizontally along the first guide rod 704 and is adjusted to a suitable position. The third servo motor 706 is started to drive the second threaded rod 707 to rotate, so that the movable block 708 moves horizontally along the second guide rod 709 to further adjust the position. The cylinder 710 extends or retracts to drive the first mounting frame 711 and the suction cup 712 to move up and down. The suction cup 712 picks up the target object through adsorption, and then transports it to the designated position along the reverse path and releases it, realizing the precise picking and transporting operations of different objects.

[0034] The dispensing component 8 includes a first side frame 801 fixedly installed on the top surface of the frame 1. A first electric push rod 802 is fixedly installed on the top surface of the first side frame 801. The output end of the first electric push rod 802 is fixedly connected to a second mounting frame 803. A dispensing head 804 is fixedly inserted into the second mounting frame 803. A glue supply pipe 805 is connected to the output end of the dispensing head 804. More specifically, when it is necessary to dispense glue on a wireless communication chip substrate, the first electric push rod 802 extends or retracts to drive the second mounting frame 803 to move up and down, so as to adjust the height of the dispensing head 804 to a suitable position. The glue supply pipe 805 transports the glue to the dispensing head 804. The dispensing head 804 precisely drops the glue at the designated position of the chip substrate according to the preset program and path, completing the dispensing operation and preparing for the subsequent patch process.

[0035] The pressing component 9 includes a second side frame 901 fixedly installed on the top surface of the frame 1. A second electric push rod 902 is fixedly installed on the top surface of the second side frame 901. The movable end of the second electric push rod 902 is fixedly connected to a first threaded rod 703. The end of the connecting frame 903 is fixedly connected to a cover body 904. An air pipe 905 is arranged on the surface of the cover body 904. And a hot air pump 906 is fixedly connected to the top surface of the cover body 904. The hot air pump 906 is connected to the end of the air pipe 905. More specifically, after the chip is pasted, the second electric push rod 902 extends, driving the connecting frame 903 to move downward, so that the sealing ring 907 at the bottom of the cover body 904 is in close contact with the top surface of the turntable 3, forming a sealed space. The hot air pump 906 conveys hot air into the cover body 904 through the air pipe 905, heating the pasted chip, so that the glue cures quickly. At the same time, the pressure of the hot air applies a certain pressure to the chip, eliminating the gap and bubbles between the chip and the substrate, ensuring the tightness and reliability of the package.

[0036] An air pipe 905 is fixedly sleeved at the bottom end of the cover body 904, and the air pipe 905 is made of rubber material. More specifically, when the sealing ring 907 at the bottom of the cover body 904 contacts the top surface of the turntable 3, the rubber sealing ring 907 has good elasticity and flexibility, can closely fit the surface of the turntable 3, effectively preventing the hot air from leaking from the gap between the cover body 904 and the turntable 3, ensuring the stability of the pressure and temperature inside the cover body 904, improving the pressing and heating effects, and guaranteeing the packaging quality.

[0037] The cover body 904 is located above the through groove on the surface of the turntable 3. When pressing the wireless communication chip, the bottom surface of the cover body 904 fits the top surface of the turntable 3. More specifically, the position of the cover body 904 is designed so that it is exactly above the through groove on the surface of the turntable 3. When it is necessary to press the wireless communication chip located in the through groove, the cover body 904 moves downward under the drive of the second electric push rod 902 until its bottom surface completely fits the top surface of the turntable 3, forming a closed chamber, performing uniform pressing and heating treatment on the chip, and ensuring the flatness and firmness of the chip package.

[0038] The X-ray detector 11 is fixedly installed on the turntable 3 through the third side frame 10 and is located above the through groove on its surface. More specifically, when the wireless communication chip completes the packaging process on the through groove of the turntable 3, the rotating mechanism 2 drives the turntable 3 to rotate, moving the packaged chip under the X-ray detector 11. The X-ray detector 11 emits X-rays to penetrate the chip package, detecting whether there are defects in its internal structure, such as the connection situation between the chip and the substrate, whether there are voids or bubbles, etc., ensuring that the quality of the packaged chip meets the requirements.

[0039] In summary: When the device is operating, the picking component 7 picks up the chip substrate from the chip conveying mechanism 4 and places it at the corresponding position of the placing plate 31 on the surface of the turntable 3. The chip substrate is subjected to glue application operation by the glue dispensing component 8. Subsequently, the chip mounter conveying mechanism 6 conveys the chip mounter to the designated position, and the picking component 7 picks up the chip mounter and places it on the glue-applied chip substrate. Then, the pressing component 9 presses the wireless communication chip after chip mounter placement to eliminate its gaps and bubbles and ensure the tightness of the package. Then, the packaged chip is detected by the X-ray detector 11 to ensure that there are no defects in its internal structure. Finally, the packaged wireless communication chip is picked up by the picking component 7 and placed on the chip output mechanism 5. The rotation mechanism 2 drives the turntable 3 to rotate, enabling the chips at each working station to sequentially undergo processes such as conveying, picking, glue application, chip mounter placement, pressing, and detection, thus realizing an automated packaging process.

[0040] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A wireless communication chip packaging device, characterized in that, It includes a frame (1), and a rotating mechanism (2) is fixedly installed on the inner wall of the frame (1). The output end of the rotating mechanism (2) is fixedly connected to a turntable (3), and the turntable (3) is located inside the rotating mechanism (2). Six equally spaced through grooves are formed on the top surface of the turntable (3), and a placement plate (31) is fixedly installed in the through grooves to support the placement of wireless communication chips. A chip conveying mechanism (4) and a chip output mechanism (5) are arranged on one side wall of the frame (1), and a patch conveying mechanism (6) is arranged on the other side wall. A picking component (7) is arranged on the top surfaces of the chip conveying mechanism (4) and the chip output mechanism (5) and the top surface of the patch conveying mechanism (6) to pick and transport the wireless communication chip substrate, patches, and the packaged wireless communication chips. A dispensing component (8) is arranged on the top surface of the frame (1) to apply glue to the wireless communication chip substrate. A pressing component (9) is arranged on the top surface of the frame (1) to press the patched wireless communication chips to eliminate their gaps and bubbles. A third side frame (10) is fixedly installed on the top surface of the frame (1), and an X-ray detector (11) is arranged on the top surface of the third side frame (10) to detect the packaged wire communication chips.

2. The wireless communication chip packaging device according to claim 1, wherein The rotating mechanism (2) includes a cross frame (201) fixedly installed on the inner wall of the frame (1). A first servo motor (202) is fixedly installed on the bottom surface of the cross frame (201). The output end of the first servo motor (202) penetrates through the cross frame (201) and is fixedly connected to a connecting disk (203). The top surfaces of the turntable (3) and the connecting disk (203) are inserted and fixed with nuts.

3. A wireless communication chip packaging device according to claim 1, characterized in that The picking component (7) includes an aluminum profile frame body (701) fixedly installed on the top surfaces of the chip conveying mechanism (4) and the chip output mechanism (5) and the top surface of the patch conveying mechanism (6). A second servo motor (702) is fixedly installed on one side wall of the aluminum profile frame body (701). The output end of the second servo motor (702) is fixedly connected to a first threaded rod (703). First guide rods (704) are fixedly installed on both inner walls of the aluminum profile frame body (701). A movable frame (705) is threadedly sleeved on the surface of the first threaded rod (703), and the movable frame (705) is slidably arranged on the surfaces of the first guide rods (704). A third servo motor (706) is fixedly installed on one side wall of the movable frame (705). The output end of the third servo motor (706) is fixedly connected to a second threaded rod (707). Second guide rods (709) are fixedly installed on the opposite surfaces of the movable frame (705). A movable block (708) is threadedly sleeved on the surface of the second threaded rod (707), and the movable block (708) is slidably arranged on the second guide rods (709). A cylinder (710) is fixedly installed on the bottom surface of the movable block (708). The end of the cylinder (710) is fixedly installed with a first mounting bracket (711), and a suction cup (712) is arranged on the first mounting bracket (711).

4. A wireless communication chip packaging device according to claim 1, characterized in that, The dispensing assembly (8) includes a first side frame (801) fixedly installed on the top surface of the frame (1). A first electric push rod (802) is fixedly installed on the top surface of the first side frame (801). The output end of the first electric push rod (802) is fixedly connected to a second mounting frame (803). A dispensing head (804) is fixedly inserted into the second mounting frame (803). The output end of the dispensing head (804) is connected to a glue supply pipe (805).

5. A wireless communication chip packaging device according to claim 1, characterized in that, The pressing assembly (9) includes a second side frame (901) fixedly installed on the top surface of the frame (1). A second electric push rod (902) is fixedly installed on the top surface of the second side frame (901). The movable end of the second electric push rod (902) is fixedly connected to a first threaded rod (703). The end of the connecting frame (903) is fixedly connected to a cover body (904). An air pipe (905) is arranged on the surface of the cover body (904). A hot air pump (906) is fixedly connected to the top surface of the cover body (904). The hot air pump (906) is connected to the end of the air pipe (905).

6. The wireless communication chip packaging device according to claim 5, wherein, The bottom end of the cover body (904) is fixedly sleeved with an air pipe (905), and the air pipe (905) is made of rubber material.

7. A wireless communication chip packaging device according to claim 5, characterized in that, The cover body (904) is located above the through groove on the surface of the turntable (3). When pressing on the wireless communication chip, the bottom surface of the cover body (904) is in contact with the top surface of the turntable (3).

8. The wireless communication chip packaging device according to claim 1, wherein, The X-ray detector (11) is fixedly installed on the turntable (3) through a third side frame (10) and is located above the through groove on its surface.

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