A wireless communication chip packaging device

Abstract

The application discloses a kind of wireless communication chip packaging equipment, it is related to the field of semiconductor manufacturing technology.The present application includes rack, and the inner wall of rack is fixedly installed with rotating mechanism, and the output end of rotating mechanism is fixedly connected with turntable.The present application, through rotating mechanism drives turntable rotation, makes the chip on each station in turn through conveying, pickup, dispensing, patching, pressure and detection process, etc., makes chip quickly and accurately convert between different stations, reduces artificial intervention and waiting time between processes, greatly improves production efficiency, can satisfy the demand of mass production, through the design of hot air pump and cover, while carrying out pressure to the chip after patching, utilize hot air to accelerate the solidification of glue, effectively eliminate the gap and bubble between chip and substrate, improve the tightness and reliability of packaging, while the sealing ring of cover bottom ensures the pressure and temperature stability in the process of pressure, further guarantee the packaging quality.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically to a wireless communication chip packaging device. Background Technology

[0002] With the rapid development of wireless communication technology, the demand for wireless communication chips is constantly increasing. However, traditional chip packaging equipment has many problems, such as chip misalignment and inaccurate positioning during chip transport, resulting in low packaging yield; insufficient precision in processes such as dispensing and die bonding, which cannot meet the packaging requirements of miniaturized and highly integrated chips; and insufficient connection between the various functional modules of the equipment, resulting in low overall operating efficiency and increased production and time costs.

[0003] Therefore, a wireless communication chip packaging device is proposed. Summary of the Invention

[0004] The purpose of this invention is to provide a wireless communication chip packaging device in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention specifically adopts the following technical solution:

[0006] A wireless communication chip packaging device includes a rack, with a rotating mechanism fixedly installed on the inner wall of the rack. A turntable is fixedly connected to the output end of the rotating mechanism and is located inside the rotating mechanism. The top surface of the turntable has six equidistant slots, and a placement plate is fixedly installed in each slot to support and place the wireless communication chip. One side wall of the rack is provided with a chip conveying mechanism and a chip output mechanism, and the other side wall is provided with a surface mount conveying mechanism. Pick-up components are provided on the top surfaces of the chip conveying mechanism, the chip output mechanism, and the surface mount conveying mechanism to pick up and transport the wireless communication chip substrate, the surface mount chip, and the packaged wireless communication chip. A dispensing component is provided on the top surface of the rack to apply adhesive to the wireless communication chip substrate. A pressure application component is provided on the top surface of the rack to apply pressure to the surface mount wireless communication chip to eliminate gaps and air bubbles. A third side frame is fixedly installed on the top surface of the rack, and an X-ray detector is provided on the top surface of the third side frame to inspect the packaged wireless communication chip.

[0007] Furthermore, the rotating mechanism includes a crossbeam fixedly installed on the inner wall of the frame, and a first servo motor is fixedly installed on the bottom surface of the crossbeam. The output end of the first servo motor passes through the crossbeam and is fixedly connected to a connecting plate. The top surfaces of the turntable and the connecting plate are inserted into each other and fixed to each other by nuts.

[0008] Furthermore, the pickup assembly includes an aluminum profile frame fixedly installed on the top surfaces of the chip conveying mechanism, the chip output mechanism, and the surface mount conveying mechanism. A second servo motor is fixedly installed on one side wall of the aluminum profile frame, and a first threaded rod is fixedly connected to the output end of the second servo motor. A first guide rod is fixedly installed on both inner walls of the aluminum profile frame. A movable frame is threadedly fitted onto the surface of the first threaded rod, and the surfaces of the movable frame and the first guide rod are slidably arranged. A third servo motor is fixedly installed on one side wall of the movable frame, and a second threaded rod is fixedly connected to the output end of the third servo motor. A second guide rod is fixedly installed on the opposite side of the movable frame, and a movable block is threadedly fitted onto the surface of the second threaded rod. The movable block and the second guide rod are slidably arranged. A cylinder is fixedly installed on the bottom surface of the movable block, and a first mounting frame is fixedly installed on the end of the cylinder. A suction cup is provided on the first mounting frame.

[0009] Furthermore, the dispensing assembly includes a first side frame fixedly installed on the top surface of the frame, a first electric push rod fixedly installed on the top surface of the first side frame, a second mounting bracket fixedly connected to the output end of the first electric push rod, and a dispensing head fixedly inserted into the second mounting bracket, the output end of the dispensing head being connected to a glue supply pipe.

[0010] Furthermore, the pressure application assembly includes a second side frame fixedly installed on the top surface of the frame, a second electric push rod fixedly installed on the top surface of the second side frame, a connecting frame fixedly connected to the movable end of the second electric push rod, a cover fixedly connected to the end of the connecting frame, an air pipe provided on the surface of the cover, and a hot air pump fixedly connected to the top surface of the cover, the hot air pump being connected to the end of the air pipe.

[0011] Furthermore, a sealing ring is fixedly fitted at the bottom end of the cover, and the sealing ring is made of rubber material.

[0012] Furthermore, the cover is located above the through groove on the surface of the turntable, and when pressure is applied to the wireless communication chip, the bottom surface of the cover and the top surface of the turntable are in contact.

[0013] Furthermore, the X-ray detector is fixedly mounted on the turntable via a third side frame and located above a through slot on its surface.

[0014] The beneficial effects of this invention are as follows:

[0015] With precise adjustment of the multi-degree-of-freedom pick-up components, the chip substrate, the chip assembly, and the packaged chip can be picked up and transported accurately. The rotating mechanism drives the turntable to rotate, so that the chips at each station go through the processes of conveying, picking up, dispensing, mounting, pressurizing, and testing in sequence. This allows the chips to be quickly and accurately transferred between different stations, reducing manual intervention and waiting time between processes, greatly improving production efficiency and meeting the needs of large-scale production.

[0016] By using a hot air pump and enclosure design, pressure is applied to the chip after it is mounted, while hot air is used to accelerate the curing of the adhesive. This effectively eliminates gaps and air bubbles between the chip and the substrate, improving the tightness and reliability of the package. At the same time, the sealing ring at the bottom of the enclosure ensures stable pressure and temperature during the pressure application process, further guaranteeing the packaging quality.

[0017] X-ray inspection equipment can be used to inspect the internal structure of packaged chips, promptly identify and reject products with internal defects, such as poor connection between the chip and the substrate, internal voids or bubbles, etc., to ensure the quality stability of products leaving the factory and reduce the defect rate. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0019] Figure 2 This is a front view of the present invention;

[0020] Figure 3 This is a partial side view of the present invention;

[0021] Figure 4 This is a partial bottom view of the present invention;

[0022] Figure 5 This is a schematic diagram of the pressure application component of the present invention;

[0023] Figure 6 This is a schematic diagram of the pickup component of the present invention;

[0024] Figure 7 This is a schematic diagram of the rotating mechanism of the present invention;

[0025] Figure 8 This is a schematic diagram of the turntable of the present invention;

[0026] Reference numerals: 1. Frame; 2. Rotating mechanism; 201. Crossbeam; 202. First servo motor; 203. Connecting plate; 3. Turntable; 31. Placement plate; 4. Chip conveying mechanism; 5. Chip output mechanism; 6. SMT conveying mechanism; 7. Pickup assembly; 701. Aluminum profile frame; 702. Second servo motor; 703. First threaded rod; 704. First guide rod; 705. Movable frame; 706. Third servo motor; 707. Second threaded rod; 708. Movable block; 70 9. Second guide rod; 710. Cylinder; 711. First mounting bracket; 712. Suction cup; 8. Dispensing assembly; 801. First side frame; 802. First electric push rod; 803. Second mounting bracket; 804. Dispensing head; 805. Dispensing pipe; 9. Pressure assembly; 901. Second side frame; 902. Second electric push rod; 903. Connecting bracket; 904. Cover; 905. Air pipe; 906. Hot air pump; 907. Sealing ring; 10. Third side frame; 11. X-ray detector. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0029] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] In the description of the embodiments of the present invention, it should be noted that the terms "inner", "outer", "upper", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0031] like Figures 1 to 8 As shown, a wireless communication chip packaging device includes a rack 1, and a rotating mechanism 2 is fixedly installed on the inner wall of the rack 1. A turntable 3 is fixedly connected to the output end of the rotating mechanism 2, and the turntable 3 is located inside the rotating mechanism 2. Six equidistant through slots are formed on the top surface of the turntable 3, and placement plates 31 are fixedly installed in the through slots to support and place wireless communication chips. A chip conveying mechanism 4 and a chip output mechanism 5 are provided on one side wall of the rack 1, and a chip mounting conveying mechanism 6 is provided on the other side wall. The chip conveying mechanism 4 and the chip output mechanism 5... The top surface of the mounting and conveying mechanism 6 is provided with a pickup component 7 to pick up and transport the wireless communication chip substrate, the chip, and the packaged wireless communication chip. The top surface of the rack 1 is provided with a dispensing component 8 to apply adhesive to the wireless communication chip substrate. The top surface of the rack 1 is provided with a pressure application component 9 to apply pressure to the packaged wireless communication chip to eliminate gaps and air bubbles. A third side frame 10 is fixedly installed on the top surface of the rack 1, and an X-ray detector 11 is provided on the top surface of the third side frame 10 to inspect the packaged wireless communication chip. More specifically, during equipment operation, the picking component 7 picks up the chip substrate from the chip conveying mechanism 4 and places it at the corresponding position on the placement plate 31 on the surface of the turntable 3. The dispensing component 8 applies adhesive to the chip substrate. Then, the placement conveying mechanism 6 conveys the chip to the designated position, and the picking component 7 picks up the chip and places it on the adhesive-coated chip substrate. Subsequently, the pressure application component 9 applies pressure to the placed wireless communication chip to eliminate gaps and air bubbles, ensuring the tightness of the package. Then, the packaged chip is inspected by the X-ray detector 11 to ensure that its internal structure is free of defects. Finally, the picking component 7 picks up the packaged wireless communication chip onto the chip output mechanism 5. The rotating mechanism 2 drives the turntable 3 to rotate, so that the chips at each station sequentially undergo the processes of conveying, picking, dispensing, placement, pressure application, and inspection, realizing an automated packaging process.

[0032] The rotating mechanism 2 includes a crossbeam 201 fixedly installed on the inner wall of the frame 1, and a first servo motor 202 is fixedly installed on the bottom surface of the crossbeam 201. The output end of the first servo motor 202 passes through the crossbeam 201 and is fixedly connected to a connecting disk 203. The top surfaces of the turntable 3 and the connecting disk 203 are inserted into each other and fixed with nuts. More specifically, after the first servo motor 202 is powered on, its output end drives the connecting disk 203 to rotate. Since the top surfaces of the turntable 3 and the connecting disk 203 are inserted into each other and fixed with nuts, the rotation of the connecting disk 203 will drive the turntable 3 to rotate synchronously, so that the turntable 3 can rotate stably and accurately, thereby sequentially conveying the wireless communication chip located on the turntable 3 to each workstation for corresponding packaging operations.

[0033] The pickup assembly 7 includes an aluminum profile frame 701 fixedly mounted on the top surfaces of the chip delivery mechanism 4, the chip output mechanism 5, and the placement delivery mechanism 6. A second servo motor 702 is fixedly mounted on one side wall of the aluminum profile frame 701, and a first threaded rod 703 is fixedly connected to the output end of the second servo motor 702. First guide rods 704 are fixedly mounted on the inner walls of both sides of the aluminum profile frame 701. A movable frame 705 is threaded onto the surface of the first threaded rod 703. The surfaces of the movable frame 705 and the first guide rod 704 are slidably arranged. A third servo motor 706 is fixedly installed on one side wall of the movable frame 705. The output end of the third servo motor 706 is fixedly connected to a second threaded rod 707. A second guide rod 709 is fixedly installed on the opposite side of the movable frame 705. A movable block 708 is threadedly fitted on the surface of the second threaded rod 707. The movable block 708 and the second guide rod 709 are slidably arranged. A cylinder 710 is fixedly installed on the bottom surface of the movable block 708. A first mounting bracket 711 is fixedly installed on the end of the cylinder 710. A suction cup 712 is provided on the first mounting bracket 711. More specifically, when it is necessary to pick up or move wireless communication chips, chip substrates, or packaged chips, the second servo motor 702 is activated, driving the first threaded rod 703 to rotate, causing the movable frame 705 to move horizontally along the first guide rod 704 and adjust to a suitable position. The third servo motor 706 is activated, driving the second threaded rod 707 to rotate, causing the movable block 708 to move laterally along the second guide rod 709 to further adjust the position. The cylinder 710 extends or retracts, driving the first mounting frame 711 and the suction cup 712 to move up and down. The suction cup 712 picks up the target object through adsorption, and then moves it to the designated position and releases it along the opposite path, realizing precise picking and moving operations for different objects.

[0034] The dispensing assembly 8 includes a first side frame 801 fixedly mounted on the top surface of the rack 1. A first electric push rod 802 is fixedly mounted on the top surface of the first side frame 801. A second mounting bracket 803 is fixedly connected to the output end of the first electric push rod 802, and a dispensing head 804 is fixedly inserted into the second mounting bracket 803. The output end of the dispensing head 804 is connected to a glue supply pipe 805. More specifically, when dispensing is required on the wireless communication chip substrate, the first electric push rod 802 extends or retracts, driving the second mounting bracket 803 to move up and down, thereby adjusting the height of the dispensing head 804 to a suitable position. The glue supply pipe 805 delivers glue to the dispensing head 804, which accurately drips the glue onto the designated position on the chip substrate according to a preset program and path, completing the dispensing operation and preparing for the subsequent mounting process.

[0035] The pressure application assembly 9 includes a second side frame 901 fixedly mounted on the top surface of the rack 1. A second electric push rod 902 is fixedly mounted on the top surface of the second side frame 901. A connecting frame 903 is fixedly connected to the movable end of the second electric push rod 902. A cover 904 is fixedly connected to the end of the connecting frame 903. An air pipe 905 is provided on the surface of the cover 904, and a hot air pump 906 is fixedly connected to the top surface of the cover 904. The hot air pump 906 is connected to the end of the air pipe 905. More specifically, after the chip is mounted, the second electric push rod 902 extends, driving the connecting frame 903 to move downward, so that the sealing ring 907 at the bottom of the cover 904 is tightly fitted with the top surface of the turntable 3 to form a sealed space. The hot air pump 906 delivers hot air into the cover 904 through the air pipe 905 to heat the mounted chip, so that the adhesive can be cured quickly. At the same time, the pressure of the hot air applies a certain pressure to the chip, eliminating gaps and air bubbles between the chip and the substrate, ensuring the tightness and reliability of the package.

[0036] A sealing ring 907, made of rubber, is fixedly fitted at the bottom of the cover 904. More specifically, when the sealing ring 907 at the bottom of the cover 904 contacts the top surface of the turntable 3, the rubber sealing ring 907 has good elasticity and flexibility, which allows it to fit tightly against the surface of the turntable 3, effectively preventing hot air from leaking from the gap between the cover 904 and the turntable 3, ensuring stable pressure and temperature inside the cover 904, improving the pressure and heating effect, and guaranteeing the sealing quality.

[0037] The cover 904 is located above the through groove on the surface of the turntable 3. When pressure is applied to the wireless communication chip, the bottom surface of the cover 904 is in contact with the top surface of the turntable 3. More specifically, the position of the cover 904 is designed so that it is exactly above the through groove on the surface of the turntable 3. When pressure needs to be applied to the wireless communication chip located in the through groove, the cover 904 moves downward under the action of the second electric push rod 902 until its bottom surface is completely in contact with the top surface of the turntable 3, forming a closed chamber. This allows for uniform pressure and heating of the chip, ensuring the flatness and robustness of the chip packaging.

[0038] The X-ray inspection instrument 11 is fixedly mounted on the turntable 3 via the third side bracket 10 and is located above the through slot on its surface. More specifically, after the wireless communication chip completes the packaging process on the through slot of the turntable 3, the rotating mechanism 2 drives the turntable 3 to rotate, moving the packaged chip below the X-ray inspection instrument 11. The X-ray inspection instrument 11 emits X-rays to penetrate the chip package and detect whether there are defects in its internal structure, such as the connection between the chip and the substrate, and whether there are voids or bubbles, to ensure that the quality of the packaged chip meets the requirements.

[0039] In summary: During operation, the pick-up component 7 picks up the chip substrate from the chip conveying mechanism 4 and places it at the corresponding position on the placement plate 31 on the surface of the turntable 3. The dispensing component 8 applies adhesive to the chip substrate. Then, the placement conveying mechanism 6 conveys the chip to the designated position, where the pick-up component 7 picks up the chip and places it on the adhesive-coated chip substrate. Subsequently, the pressure application component 9 applies pressure to the placed wireless communication chip to eliminate gaps and air bubbles, ensuring the tightness of the package. Then, the packaged chip is inspected by the X-ray detector 11 to ensure that its internal structure is free of defects. Finally, the pick-up component 7 picks up the packaged wireless communication chip onto the chip output mechanism 5. The rotating mechanism 2 drives the turntable 3 to rotate, so that the chips at each station sequentially undergo the processes of conveying, picking up, dispensing, placement, pressure application, and inspection, realizing an automated packaging process.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection claimed by the appended claims and their equivalents is defined.

Claims

1. A wireless communication chip packaging device, characterized in that, The system includes a frame (1), and a rotating mechanism (2) is fixedly installed on the inner wall of the frame (1). A turntable (3) is fixedly connected to the output end of the rotating mechanism (2), and the turntable (3) is located inside the rotating mechanism (2). The top surface of the turntable (3) has six equally spaced through slots, and a placement plate (31) is fixedly installed in the through slots to support the placement of wireless communication chips. A chip conveying mechanism (4) and a chip output mechanism (5) are provided on one side wall of the frame (1), and a chip mounting conveying mechanism (6) is provided on the other side wall. Pick-up components (7) are provided on the top surfaces of the chip conveying mechanism (4) and the chip output mechanism (5) and the top surface of the chip mounting conveying mechanism (6) to pick up and transport the wireless communication chip substrate, the chip, and the packaged wireless communication chip. A dispensing component (8) is provided on the top surface of the frame (1) to apply adhesive to the wireless communication chip substrate. The top surface of the frame (1) is provided with a pressure-applying component (9) to apply pressure to the wireless communication chip after it is patched to eliminate gaps and air bubbles. The top surface of the frame (1) is fixedly installed with a third side frame (10), and the top surface of the third side frame (10) is provided with an X-ray detector (11) to inspect the packaged wireless communication chip. The pressure-applying component (9) includes a second side frame (901) fixedly installed on the top surface of the frame (1). The top surface of the second side frame (901) is fixedly installed with a second electric push rod (902). The movable end of the second electric push rod (902) is fixedly connected to a connecting frame (903). The end of the connecting frame (903) is fixedly connected to a cover (904). The surface of the cover (904) is provided with an air pipe (905), and the top surface of the cover (904) is fixedly connected with a hot air pump (906). The hot air pump (906) is connected to the end of the air pipe (905).

2. The wireless communication chip packaging device according to claim 1, characterized in that, The rotating mechanism (2) includes a crossbeam (201) fixedly installed on the inner wall of the frame (1), and a first servo motor (202) is fixedly installed on the bottom surface of the crossbeam (201). The output end of the first servo motor (202) passes through the crossbeam (201) and is fixedly connected to a connecting plate (203). The top surfaces of the turntable (3) and the connecting plate (203) are inserted and fixed to each other by nuts.

3. The wireless communication chip packaging device according to claim 1, characterized in that, The pickup assembly (7) includes an aluminum profile frame (701) fixedly installed on the top surface of the chip delivery mechanism (4), the chip output mechanism (5), and the top surface of the chip placement mechanism (6). A second servo motor (702) is fixedly installed on one side wall of the aluminum profile frame (701). A first threaded rod (703) is fixedly connected to the output end of the second servo motor (702). A first guide rod (704) is fixedly installed on the inner walls of both sides of the aluminum profile frame (701). A movable frame (705) is threaded onto the surface of the first threaded rod (703). The surfaces of the movable frame (705) and the first guide rod (704) are slidably arranged. A third servo motor (706) is fixedly installed on one side wall of the frame (705). The output end of the third servo motor (706) is fixedly connected to a second threaded rod (707). A second guide rod (709) is fixedly installed on the opposite side of the movable frame (705). A movable block (708) is threadedly fitted on the surface of the second threaded rod (707). The movable block (708) and the second guide rod (709) are slidably arranged. A cylinder (710) is fixedly installed on the bottom surface of the movable block (708). A first mounting frame (711) is fixedly installed on the end of the cylinder (710). A suction cup (712) is provided on the first mounting frame (711).

4. The wireless communication chip packaging device according to claim 1, characterized in that, The dispensing assembly (8) includes a first side frame (801) fixedly installed on the top surface of the frame (1). A first electric push rod (802) is fixedly installed on the top surface of the first side frame (801). A second mounting bracket (803) is fixedly connected to the output end of the first electric push rod (802). A dispensing head (804) is fixedly inserted into the second mounting bracket (803). The output end of the dispensing head (804) is connected to a glue supply pipe (805).

5. The wireless communication chip packaging device according to claim 1, characterized in that, The bottom end of the cover (904) is fixedly fitted with a sealing ring (907), and the sealing ring (907) is made of rubber material.

6. The wireless communication chip packaging device according to claim 1, characterized in that, The cover (904) is located above the through groove on the surface of the turntable (3). When pressure is applied to the wireless communication chip, the bottom surface of the cover (904) and the top surface of the turntable (3) are in contact.

7. The wireless communication chip packaging device according to claim 1, characterized in that, The X-ray detector (11) is fixedly mounted on the turntable (3) via the third side frame (10) and located above the through slot on its surface.

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