An irregularly shaped packaging frame structure and its manufacturing method

Abstract

This invention discloses an irregularly shaped packaging frame structure including a chip body and a frame assembly. The frame assembly is disposed on the side of the chip body, and a base plate is disposed on the lower side of the frame assembly. The base plate is provided with pins electrically connected to the chip body, and the top of the chip body is exposed. A manufacturing method is also provided for manufacturing the aforementioned irregularly shaped packaging frame structure. The method includes the following steps: placing the chip body inside the frame assembly; electrically connecting the chip body to the pins on the base plate; and fixing the base plate to the frame assembly. The frame assembly used in this application for packaging the chip body has an exposed top structure, allowing the upper surface of the chip body to be completely exposed, reducing surface shading of the chip body, effectively preventing heat accumulation on the chip body, and ensuring the performance of the packaged chip body.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to an irregularly shaped packaging frame structure and its manufacturing method. Background Technology

[0002] An integrated chip refers to a chip that is first manufactured by integrating transistors into a specific functional chip, and then further integrated into a chip using semiconductor technology according to application requirements. A chip is a pre-manufactured wafer (die) with specific functions that can be combined and integrated; it is also called a "chiplet." Its functions may include general-purpose processors, memory, graphics processors, encryption engines, network interfaces, etc.

[0003] In the conventional chip packaging process, after the target chip is installed on the lower shell, an adhesive is applied directly to the lower shell, and then the upper shell is placed on top of the lower shell. The upper and lower shells are fixed together by the solidification of the adhesive. Since the upper and lower shells completely encapsulate the target chip, and because the thermal conductivity of the adhesive is poor, the heat dissipation capacity of the target chip to the outside world is weakened, which can easily cause heat accumulation in the target chip and result in performance degradation. Summary of the Invention

[0004] This invention provides an irregularly shaped packaging frame structure and its manufacturing method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] An irregularly shaped packaging frame structure includes a chip body and a frame assembly. The frame assembly is disposed on the side of the chip body, and a base plate is disposed on the lower side of the frame assembly. The base plate is provided with pins that are electrically connected to the chip body, and the top of the chip body is exposed.

[0007] Preferably, the frame assembly includes a side frame, and a top frame is provided on the upper side of the side frame, the top frame being perpendicular to the side frame;

[0008] A base frame is provided on the lower side of the side frame, and the base frame is perpendicular to the side frame. The top frame and the base frame are used to fix the chip body.

[0009] The chip body has a side wing on its side, which is located between the top frame and the bottom frame.

[0010] Preferably, a first limiting protection member is provided at the bend of the side frame and the top frame. The first limiting protection member has a hollow structure and its cross-section is in the shape of a hollow "7". The bend of the first limiting protection member abuts against the top surface and side surface of the side wing.

[0011] The thickness of the side wing is less than the thickness of the chip body;

[0012] A second limiting protection member is connected to the base frame. The top of the second limiting protection member is connected to the lower surface of the side wing. The second limiting protection member is located on the side of the chip body.

[0013] A pressure stabilizing component is connected to the base frame. A gap is formed between the lower side of the pressure stabilizing component and the upper surface of the second limiting protection component. A base plate is snapped between the pressure stabilizing component and the second limiting protection component. The base plate is located on the lower side of the chip body.

[0014] Preferably, a friction plate is provided on the base plate, and the friction plate is attached to the lower surface of the chip body;

[0015] The first limiting protection component has a reinforcing rib inside, and the reinforcing rib is located at the bend of the first limiting protection component;

[0016] A second shock absorber is provided between the upper side of the second limiting protective member and the side wing;

[0017] A first shock absorber is provided between the lower side of the second limiting protection component and the base plate.

[0018] Preferably, the base frame is provided with a groove, the side of the pressure stabilizing member is bent into the groove on the base frame, and the pressure stabilizing member and the second limiting protection member are fixedly connected to the base frame by a locking member.

[0019] Preferably, the top frame is fixedly connected to a stabilizing component, which is disposed above the chip body and is used to assist in fixing the chip body.

[0020] Preferably, the stabilizing component includes a first top fixing plate, a first bottom contact plate, and an intermediate block. The side of the first top fixing plate is fixedly connected to the top frame. The lower surface of the first top fixing plate is provided with a concave arc surface. The intermediate block is embedded in the arc surface of the lower surface of the first top fixing plate. The intermediate block is in contact with the arc surface, and the intermediate block and the arc surface can slide. The lower surface of the intermediate block is fixedly connected to the first bottom contact plate. The first bottom contact plate is in contact with the upper surface of the chip body.

[0021] A plurality of fixing blocks are provided on the upper surface of the first bottom contact plate. The fixing blocks are located on the outer periphery of the intermediate block. An elastic element is fixedly connected to the fixing block, and the upper end of the elastic element is fixedly connected to the first top fixing plate.

[0022] A surrounding ring is provided on the side of the first bottom contact plate. The surrounding ring is located around the first top fixing plate. A side damping pad is provided between the side wall of the first top fixing plate and the surrounding ring.

[0023] The first top fixing plate is densely covered with grooves;

[0024] The first top fixing plate, the first bottom contact plate, and the intermediate block are all made of metal.

[0025] Preferably, the stabilizing component includes a second top fixing plate and a second bottom contact plate. The second top fixing plate is fixedly connected to the top frame. A central elastic element is provided at the center of the second top fixing plate. The lower end of the central elastic element is fixedly connected to the second bottom contact plate. The second bottom contact plate is attached to the upper surface of the chip body.

[0026] Below the second top fixing plate, there are four sets of first trapezoidal blocks, side elastic elements, and second trapezoidal blocks. A sliding rod is fixedly connected to the lower surface of the second top fixing plate. The sliding rod is slidably connected to the first trapezoidal blocks. The second trapezoidal blocks are fixedly connected to the second bottom contact plate. A side elastic element is provided between the first trapezoidal blocks and the second trapezoidal blocks.

[0027] The second trapezoidal block is fixedly connected to a linkage plate at its end. Two sets of linkage rods pass through the two sets of symmetrical linkage plates. Limiting rings are provided at both ends of the linkage rods. An elastic body is provided on the linkage rod between the limiting rings and the linkage plate. An elastic body is provided on the linkage rod between the two sets of linkage plates.

[0028] The edge-mounted elastic element includes a rigid element and a flexible element, and several groups of the rigid elements and flexible elements are arranged at intervals, with the flexible element bonded to the rigid element.

[0029] A method for manufacturing an irregularly shaped packaging frame, used to manufacture the aforementioned irregularly shaped packaging frame structure.

[0030] Preferably, it includes the following steps:

[0031] S1: Place the chip body inside the frame assembly;

[0032] S2: Electrically connect the chip body to the pins on the base plate;

[0033] S3: Securely connect the base plate to the frame assembly.

[0034] Compared with the prior art, the present invention has at least the following beneficial effects:

[0035] The frame component used in this application for packaging the chip body is an exposed top structure, which allows the upper surface of the chip body to be completely exposed, reducing the shading of the chip body surface, effectively preventing heat accumulation in the chip body, and ensuring the performance of the chip body after packaging. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0037] Figure 2 This is a schematic diagram of the structure of a stabilizing component of the present invention;

[0038] Figure 3 This is a schematic diagram of the second stabilizing component of the present invention;

[0039] Figure 4 This is a partial schematic diagram of the second stabilizing component structure of the present invention;

[0040] Figure 5 This is a schematic diagram of the side-mounted elastic element structure of the present invention.

[0041] In the diagram: 1. Chip body; 2. Base plate; 3. Side frame; 4. First limiting protection component; 5. Top frame; 6. Base frame; 7. Pressure stabilizing component; 8. Second limiting protection component; 9. Locking component; 10. First damping component; 11. Second damping component; 12. Friction plate; 21. First top fixing plate; 22. First bottom contact plate; 23. Intermediate block; 24. Curved surface; 25. Side damping pad; 26. Limiting groove; 27. Fixing block; 28. Elastic component; 29. ​​Second top fixing plate; 30. Second bottom contact plate; 31. Centrally placed elastic component; 32. First trapezoidal block; 33. Side elastic component; 34. Second trapezoidal block; 35. Linkage plate; 36. Limiting ring; 37. Sliding rod; 38. Linkage rod; 39. Side wing; 331. Rigid component; 332. Flexible component. Detailed Implementation

[0042] In this invention, the terms "first," "second," etc., are used for descriptive purposes only and do not specifically refer to any order or sequence, nor are they intended to limit the invention. They are merely used to distinguish protective components or operations described using the same technical terms, and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Furthermore, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0043] Example 1

[0044] Please refer to Figure 1 A non-circular packaging frame structure includes a chip body 1 and a frame assembly. The frame assembly is disposed on the side of the chip body 1, and a base plate 2 is disposed on the lower side of the frame assembly. The base plate 2 is provided with pins that are electrically connected to the chip body 1, and the top of the chip body 1 is exposed.

[0045] A method for manufacturing an irregularly shaped packaging frame, used to manufacture the aforementioned irregularly shaped packaging frame structure.

[0046] Includes the following steps:

[0047] S1: Place the chip body 1 inside the frame assembly;

[0048] S2: Electrically connect the chip body 1 to the pins on the base plate 2;

[0049] S3: Securely connect the base plate 2 to the frame assembly.

[0050] The working principle and beneficial effects of the above scheme are as follows:

[0051] The frame component used in this application when packaging the chip body 1 is an exposed structure, which allows the upper surface of the chip body 1 to be completely exposed, reduces the shading of the chip body 1 surface, effectively avoids heat accumulation in the chip body 1, and ensures the performance of the chip body 1 after packaging.

[0052] Example 2

[0053] Please refer to Figure 1 Based on embodiment 1, the frame assembly includes a side frame 3, and a top frame 5 is provided on the upper side of the side frame 3, the top frame 5 being perpendicular to the side frame 3;

[0054] A base frame 6 is provided on the lower side of the side frame 3. The base frame 6 is perpendicular to the side frame 3. The top frame 5 and the base frame 6 are used to fix the chip body 1.

[0055] The chip body 1 has a side wing 39 on one side, which is located between the top frame 5 and the bottom frame 6.

[0056] The side frame 3 and the top frame 5 are provided with a first limiting protection member 4 at the bend. The first limiting protection member 4 has a cavity structure and the cross section of the first limiting protection member 4 is in the shape of a cavity "7". The bend of the first limiting protection member 4 abuts against the top surface and side surface of the side wing 39.

[0057] The thickness of the side wing 39 is lower than the thickness of the chip body 1;

[0058] A second limiting protection member 8 is connected to the base frame 6. The top of the second limiting protection member 8 is connected to the lower surface of the side wing 39. The second limiting protection member 8 is located on the side of the chip body 1.

[0059] A pressure stabilizing component 7 is connected to the base frame 6. A gap is formed between the lower side of the pressure stabilizing component 7 and the upper surface of the second limiting protection component 8. A base plate 2 is snapped between the pressure stabilizing component 7 and the second limiting protection component 8. The base plate 2 is located on the lower side of the chip body 1.

[0060] A friction plate 12 is provided on the base plate 2, and the friction plate 12 is attached to the lower surface of the chip body 1.

[0061] The first limiting protection member 4 is provided with a reinforcing rib inside, and the reinforcing rib is provided at the bend of the first limiting protection member 4;

[0062] A second shock absorber 11 is provided between the upper side of the second limiting protection member 8 and the side wing 39;

[0063] A first shock absorber 10 is provided between the lower side of the second limiting protection member 8 and the bottom plate 2.

[0064] The base frame 6 is provided with a groove, and the side of the pressure stabilizing member 7 is bent into the groove on the base frame 6. The pressure stabilizing member 7 and the second limiting protection member 8 are fixedly connected to the base frame 6 through the locking member 9.

[0065] The working principle and beneficial effects of the above scheme are as follows:

[0066] During packaging, the first limiting protection member 4 is first placed between the side frame 3 and the top frame 5, and the side wing 39 is attached to the first limiting protection member 4. The first limiting protection member 4 limits and protects the chip body 1. Then, the second limiting protection member 8 and the second shock absorber 11 are pressed onto the lower surface of the side wing 39, so that the second limiting protection member 8 is located on the side of the chip body 1 to fix and protect the chip body 1. The base plate 2 is placed on the lower surface of the chip body 1, and the friction plate 12 on the upper surface of the base plate 2 is attached to the lower surface of the chip body 1. Due to the large friction between the friction plate 12 and the chip body 1, the chip body 1 is difficult to move relative to the friction plate 12. By fixing the base plate 2, the relative stability of the position of the chip body 1 and the frame assembly is ensured. Then, the bent part of the pressure stabilizer 7 is inserted into the groove of the base frame 6, which not only makes the pressure stabilizer 7 firmly fixed, but also determines the position of the pressure stabilizer 7. The base frame 6, the pressure stabilizer 7 and the second limit protection member 8 are fixed together by the second top fixing plate 29, which ensures the structural stability of the frame assembly.

[0067] The first limiting protection component 4 of the cavity structure is equipped with reinforcing ribs, which can reduce the weight of the frame component and reduce the deformation, while ensuring the strength of the first limiting protection component 4 while maintaining a certain degree of flexibility.

[0068] Example 3

[0069] Please refer to Figure 2 Based on embodiments 1-2, the top frame 5 is fixedly connected with a stabilizing component, which is disposed above the chip body 1 and is used to assist in fixing the chip body 1.

[0070] The stabilizing component includes a first top fixing plate 21, a first bottom contact plate 22, and an intermediate block 23. The side of the first top fixing plate 21 is fixedly connected to the top frame 5. The lower surface of the first top fixing plate 21 is provided with a concave arc surface 24. The intermediate block 23 is embedded in the arc surface 24 on the lower surface of the first top fixing plate 21. The intermediate block 23 is in contact with the arc surface 24, and the intermediate block 23 and the arc surface 24 can slide. The lower surface of the intermediate block 23 is fixedly connected to the first bottom contact plate 22. The first bottom contact plate 22 is in contact with the upper surface of the chip body 1.

[0071] The upper surface of the first bottom contact plate 22 is provided with a plurality of fixing blocks 27. The fixing blocks 27 are disposed on the outer periphery of the intermediate block 23. An elastic element 28 is fixedly connected to the fixing block 27. The upper end of the elastic element 28 is fixedly connected to the first top fixing plate 21.

[0072] A surrounding ring is provided on the side of the first bottom contact plate 22. The surrounding ring is located around the first top fixing plate 21. A side damping pad 25 is provided between the side wall of the first top fixing plate 21 and the surrounding ring.

[0073] The first top fixing plate 21 is densely covered with grooves;

[0074] The first top fixing plate 21, the first bottom contact plate 22, and the intermediate block 23 are all made of metal.

[0075] The working principle and beneficial effects of the above scheme are as follows:

[0076] A stabilizing component is set on top of the chip body 1. The stabilizing component connects the chip body 1 to the frame component, which can effectively ensure the strength of the chip body 1 after packaging. The first top fixing plate 21, the first bottom contact plate 22, the intermediate block 23 are closely attached to the stabilizing component made of metal, which is attached to the chip body 1. The heat generated on the chip body 1 can be quickly transferred to the first top fixing plate 21. The dense grooves on the first top fixing plate 21 increase the contact area with the outside air, which can quickly and effectively dissipate heat from the chip body 1, ensuring that the chip body 1 is at a suitable operating temperature, ensuring the performance of the chip body 1, and avoiding the chip body 1 from throttling due to excessive temperature, which would lead to performance degradation.

[0077] Furthermore, when the package is subjected to external force, the frame assembly will drive the first top fixing plate 21 to move, while the chip body 1 inside the frame assembly will tend to stay still due to inertia. This causes the first bottom contact plate 22 to drive the intermediate block 23 to slide relative to the first top fixing plate 21. The side damping pad 25 and elastic element 28 are subjected to force to offset the impact, effectively ensuring the stability of the chip body 1 and avoiding damage.

[0078] Example 4

[0079] Please refer to Figures 3-5 Based on embodiments 1-2, the top frame 5 is fixedly connected with a stabilizing component, which is disposed above the chip body 1 and is used to assist in fixing the chip body 1.

[0080] The stabilizing component includes a second top fixing plate 29 and a second bottom contact plate 30. The second top fixing plate 29 is fixedly connected to the top frame 5. A central elastic element 31 is provided at the center of the second top fixing plate 29. The lower end of the central elastic element 31 is fixedly connected to the second bottom contact plate 30. The second bottom contact plate 30 is attached to the upper surface of the chip body 1.

[0081] Below the second top fixing plate 29, there are four sets of first trapezoidal blocks 32, side elastic members 33, and second trapezoidal blocks 34. A sliding rod 37 is fixedly connected to the lower surface of the second top fixing plate 29. The sliding rod 37 is slidably connected to the first trapezoidal block 32. The second trapezoidal block 34 is fixedly connected to the second bottom contact plate 30. A side elastic member 33 is provided between the first trapezoidal block 32 and the second trapezoidal block 34.

[0082] The second trapezoidal block 34 is fixedly connected to a linkage plate 35 at its end. Two sets of linkage rods 38 pass through the two sets of symmetrical linkage plates 35. Limiting rings 36 are provided at both ends of the linkage rods 38. An elastic body is provided on the linkage rods 38 between the limiting rings 36 and the linkage plates 35. An elastic body is provided on the linkage rods 38 between the two sets of linkage plates 35.

[0083] The side-mounted elastic element 33 includes a rigid element 331 and a flexible element 332. Several sets of the rigid elements 331 and flexible elements 332 are arranged at intervals, and the flexible elements 332 are bonded to the rigid elements 331.

[0084] The working principle and beneficial effects of the above scheme are as follows:

[0085] A stabilizing component is set on top of the chip body 1. The stabilizing component connects the chip body 1 to the frame component, which can effectively ensure the strength of the chip body 1 after packaging.

[0086] When the package is subjected to external force, the frame assembly will drive the second top fixing plate 29 to move. The impact on the chip body 1 will be reduced by the central elastic member 31 and the side elastic member 33 set between the second top fixing plate 29 and the second bottom contact plate 30. The elastic member on the linkage rod 38 can further reduce the impact and ensure the stability of the chip body 1.

[0087] The inclined contact of the first trapezoidal block 32 and the second trapezoidal block 34 can simultaneously reduce the lateral and longitudinal impacts on the chip body 1, effectively ensuring the stability of the chip body 1 and preventing damage.

[0088] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An irregularly shaped packaging frame structure, characterized in that, Includes a chip body (1) and a frame assembly. The frame assembly is disposed on the side of the chip body (1). A base plate (2) is disposed on the lower side of the frame assembly. The base plate (2) is provided with pins that are electrically connected to the chip body (1). The top of the chip body (1) is exposed. The frame assembly includes a side frame (3), and a top frame (5) is provided on the upper side of the side frame (3), the top frame (5) being perpendicular to the side frame (3); A base frame (6) is provided on the lower side of the side frame (3). The base frame (6) is perpendicular to the side frame (3). The top frame (5) and the base frame (6) are used to fix the chip body (1). The chip body (1) is provided with a side wing (39) on its side, and the side wing (39) is disposed between the top frame (5) and the bottom frame (6); The side frame (3) and top frame (5) are provided with a first limiting protection member (4) at the bend. The first limiting protection member (4) is a cavity structure. The cross section of the first limiting protection member (4) is in the shape of a cavity "7". The bend of the first limiting protection member (4) abuts against the top surface and side surface of the side wing (39). The thickness of the side wing (39) is less than the thickness of the chip body (1); The base frame (6) is connected to a second limiting protection member (8), the top of the second limiting protection member (8) is connected to the lower surface of the side wing (39), and the second limiting protection member (8) is located on the side of the chip body (1). A pressure stabilizing component (7) is connected to the base frame (6). A gap is formed between the lower side of the pressure stabilizing component (7) and the upper surface of the second limiting protection component (8). A base plate (2) is snapped between the pressure stabilizing component (7) and the second limiting protection component (8). The base plate (2) is located on the lower side of the chip body (1). A friction plate (12) is provided on the base plate (2), and the friction plate (12) is attached to the lower surface of the chip body (1); The first limiting protection member (4) is provided with a reinforcing rib inside, and the reinforcing rib is provided at the bend of the first limiting protection member (4); A second shock absorber (11) is provided between the upper side of the second limiting protection member (8) and the side wing (39); A first shock absorber (10) is provided between the lower side of the second limiting protection member (8) and the bottom plate (2); The base frame (6) is provided with a groove, and the side of the pressure stabilizing member (7) is bent into the groove on the base frame (6). The pressure stabilizing member (7) and the second limiting protection member (8) are fixedly connected to the base frame (6) through the locking member (9).

2. The irregularly shaped packaging frame structure according to claim 1, characterized in that, The top frame (5) is fixedly connected to a stabilizing component, which is disposed above the chip body (1) and is used to assist in fixing the chip body (1).

3. The irregularly shaped packaging frame structure according to claim 2, characterized in that, The stabilizing component includes a first top fixing plate (21), a first bottom contact plate (22), and an intermediate block (23). The side of the first top fixing plate (21) is fixedly connected to the top frame (5). The lower surface of the first top fixing plate (21) is provided with a concave arc surface (24). The intermediate block (23) is embedded in the arc surface (24) of the lower surface of the first top fixing plate (21). The intermediate block (23) is in contact with the arc surface (24), and the intermediate block (23) and the arc surface (24) can slide. The lower surface of the intermediate block (23) is fixedly connected to the first bottom contact plate (22). The first bottom contact plate (22) is in contact with the upper surface of the chip body (1). The upper surface of the first bottom contact plate (22) is provided with a plurality of fixing blocks (27), the fixing blocks (27) are disposed on the outer periphery of the intermediate block (23), and an elastic element (28) is fixedly connected to the fixing block (27), the upper end of the elastic element (28) is fixedly connected to the first top fixing plate (21); A surrounding ring is provided on the side of the first bottom contact plate (22), the surrounding ring is located on the periphery of the first top fixing plate (21), and a side damping pad (25) is provided between the side wall of the first top fixing plate (21) and the surrounding ring; The first top fixing plate (21) is densely covered with grooves; The first top fixing plate (21), the first bottom contact plate (22), and the intermediate block (23) are all made of metal.

4. The irregularly shaped packaging frame structure according to claim 2, characterized in that, The stabilizing component includes a second top fixing plate (29) and a second bottom contact plate (30). The second top fixing plate (29) is fixedly connected to the top frame (5). A central elastic element (31) is provided at the center of the second top fixing plate (29). The lower end of the central elastic element (31) is fixedly connected to the second bottom contact plate (30). The second bottom contact plate (30) is attached to the upper surface of the chip body (1). Below the second top fixing plate (29), there are four sets of first trapezoidal blocks (32), side elastic members (33), and second trapezoidal blocks (34). A sliding rod (37) is fixedly connected to the lower surface of the second top fixing plate (29). The sliding rod (37) is slidably connected to the first trapezoidal block (32). The second trapezoidal block (34) is fixedly connected to the second bottom contact plate (30). A side elastic member (33) is provided between the first trapezoidal block (32) and the second trapezoidal block (34). The second trapezoidal block (34) is fixedly connected to a linkage plate (35) at its end. Two sets of linkage rods (38) pass through the two sets of symmetrical linkage plates (35). Limiting rings (36) are provided at both ends of the linkage rods (38). An elastic body is provided on the linkage rods (38) between the limiting rings (36) and the linkage plates (35). An elastic body is provided on the linkage rods (38) between the two sets of linkage plates (35). The side-mounted elastic element (33) includes a rigid element (331) and a flexible element (332), and several sets of the rigid elements (331) and flexible elements (332) are arranged at intervals, with the flexible element (332) bonded to the rigid element (331).

5. A method for manufacturing an irregularly shaped packaging frame, characterized in that, Used to manufacture an irregularly shaped packaging frame structure as described in any one of claims 1-4.

6. The method for manufacturing an irregularly shaped packaging frame according to claim 5, characterized in that, Includes the following steps: S1: Place the chip body (1) inside the frame assembly; S2: Electrically connect the chip body (1) to the pins on the base plate (2); S3: Fix the base plate (2) to the frame assembly.

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