Bypass diode junction box

Abstract

The invention discloses a bypass diode junction box, and relates to the technical field of photovoltaic modules, and the specific structure of the bypass diode junction box comprises a frame assembly; the box body wraps the frame assembly, and a hollow area is formed in the box body; the frame assembly comprises two metal sheets which are arranged in a spaced mode, and the opposite ends of the two metal sheets are in an L shape. The crystal grain is arranged at the L-shaped end of one metal sheet; and one end of the jumper wire is installed on the crystal grain, and the other end is installed at the L-shaped end of the remaining metal sheet. According to the invention, the technical problems of high cost and insufficient heat dissipation performance of the junction box are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic modules, and in particular to a bypass diode junction box. Background Art

[0002] A bypass diode refers to a diode that is reversely connected in parallel at both ends of a solar silicon cell group in a battery module, which can effectively prevent the silicon cell from being burned due to the hot spot effect and is an important part of a photovoltaic solar module. The bypass diode is to prevent some of the solar cells from becoming a load due to occlusion under strong light and generating serious heat damage. It is generally used in bypass diodes of monocrystalline and polycrystalline photovoltaic (PV) panels to protect the photovoltaic cells at the overheating points when there are low shunt and high shunt impedances.

[0003] The existing frame structure in the bypass diode is usually the structure with the authorized announcement number of CN213878107U. The upper and lower surfaces of the frame are uneven, which is not conducive to subsequent cooperation with the junction box; moreover, the heat dissipation performance of the frame itself is insufficient, which has a certain impact on the performance of the bypass diode; at the same time, the existing junction box is usually secondary packaged, and the product quality cannot be well guaranteed. Summary of the Invention

[0004] The purpose of the present invention is to provide a bypass diode junction box, which solves the technical problems of high cost and insufficient heat dissipation performance of the junction box in the prior art.

[0005] An embodiment of the present application discloses a bypass diode junction box, including: A frame assembly; A box body that wraps the frame assembly, and a hollow area is provided on the box body; The frame assembly includes: Two metal sheets, the metal sheets are arranged at intervals, and the opposite ends of the two metal sheets are L-shaped; A grain, installed at the L-shaped end of one of the metal sheets; A jumper wire, one end of which is installed on the grain, and the other end is installed on the L-shaped end of the remaining metal sheet.

[0006] The present application designs the frame assembly, wherein the opposite ends of the metal sheets are L-shaped, which is convenient for subsequent installation of grains and also convenient for improving the heat dissipation performance of the product.

[0007] On the basis of the above technical solutions, the embodiment of the present application can also be improved as follows: Further, the upper surfaces of the two metal sheets are on the same horizontal plane, and the lower surfaces are on the same horizontal plane. The beneficial effect of adopting this step is that it is convenient for subsequent installation.

[0008] Further, buckles are installed at both ends of the box body. The beneficial effect of this step is to facilitate subsequent filling of materials.

[0009] Further, the box body is an integrally formed epoxy resin part. The beneficial effect of this step is that single encapsulation is adopted, which can better reduce the height of the product and thus improve the heat dissipation performance of the product.

[0010] Further, the box body includes: A transition section, which wraps the opposite ends of the two metal sheets; At least four connecting sections. The connecting sections are grouped in pairs and are respectively arranged on both sides of the connecting section. The connecting section is L-shaped. There is a gap between the horizontal parts of the connecting sections in the same group to form the hollow area. The vertical parts of the connecting sections in the same group are opposite to each other, and there is a gap between the vertical parts of the connecting sections in the same group. The beneficial effect of this step is that through the corresponding hollow area, it is beneficial to improve the heat dissipation performance of the product.

[0011] Further, the metal sheet includes: A substrate section, on which grains are installed; A pin section, located at one end of the substrate section away from the grains; A heat dissipation section, which is arranged at one end of the substrate section. The beneficial effect of this step is to perform heat dissipation treatment through the heat dissipation section to ensure the heat dissipation performance of the entire product.

[0012] Further, the heat dissipation sections of the two metal sheets are rotationally symmetric about the center of the box body. The beneficial effect of this step can ensure the heat dissipation effect of the product.

[0013] Further, grooves are formed on the outer side of the substrate section. The beneficial effect of this step is to facilitate better filling of sealant subsequently.

[0014] Further, no positioning holes are formed on the substrate section. The beneficial effect of this step is to better ensure the heat dissipation effect.

[0015] Further, there is a gap between the end of the substrate section and the inner wall of the vertical part of the connecting section.

[0016] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: 1. The present application designs the frame assembly. Through the flatness design, it is convenient to ensure the electrical performance of the frame assembly, thereby improving the quality of the product.

[0017] 2. The present application designs the metal sheet to have an L-shaped end, which is convenient for subsequent assembly of larger-sized grains, thereby improving the heat dissipation performance.

[0018] 3. The present application designs the box body and encapsulates it with epoxy resin, which can reduce the height and volume of the product and lower the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 Schematic diagram of the structure of a bypass diode junction box (without snap fasteners) according to a specific embodiment of the present invention; Figure 2 For Figure 1 Schematic diagram of the structure of the middle frame assembly (without trimming the ribs); Figure 3 Schematic diagram of the structure of a bypass diode junction box according to a specific embodiment of the present invention; Figure 4 Another schematic diagram of the structure of a bypass diode junction box (without snap fasteners) according to a specific embodiment of the present invention; Figure 5 For Figure 4 Schematic diagram of the structure of the middle frame assembly (without trimming the ribs); Figure 6 Schematic diagram of the structure of a bypass diode junction box according to a specific embodiment of the present invention; Reference numerals: 1 - Frame assembly; 2 - Box body; 3 - Hollow area; 4 - Snap fastener; 101 - Metal sheet; 102 - Chip; 103 - Jumper wire; 104 - Substrate section; 105 - Pin section; 106 - Heat dissipation section; 107 - Connecting rib; 108 - Groove; 201 - Transition section; 202 - Connection section. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] The following will describe in detail the embodiments of the technical solutions of the present invention with reference to the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention, so they are only examples and cannot be used to limit the protection scope of the present invention. It should be noted that unless otherwise specified, the technical terms or scientific terms used in this application should have the ordinary meanings understood by those skilled in the art to which the present invention belongs.

[0022] In this application, unless otherwise clearly specified and defined, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] To better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the specification drawings and specific embodiments.

[0024] Embodiment: As Figures 1-6 shown, the embodiment of the present application discloses a bypass diode junction box. Compared with the existing bypass diode junction box, the structure is simplified and the thickness is reduced. The form adopted in the present application is that the frame assembly is wrapped by epoxy resin, which can reduce the overall thickness, making it less than 13 mm, or even directly to 6 mm. In this way, the overall volume size can be reduced, facilitating the user to control the weight; at the same time, the frame assembly is in direct contact with the epoxy resin. Under the same size conditions, the size of the frame assembly can be increased, thereby increasing the heat dissipation area and further improving the heat dissipation effect.

[0025] The specific structure of the present application includes: Frame assembly 1. The frame assembly 1 is designed in the present application to be planar, which is convenient for reducing the shear force and thus improving the quality of the product; Box body 2, which wraps the frame assembly 1, and a hollow area 3 is provided on the box body 2. The box body 2 is made of epoxy resin. Compared with the existing structure in which the epoxy resin is encapsulated first and then the box body is connected, in the present application, the epoxy resin is directly used as the box body, which can simplify the structure and at the same time reduce the overall height of the product; at the same time, the hollow area 3 is convenient for the subsequent installation of the bus bar.

[0026] The structure of the present application is that the frame assembly 1 and the box body 2 are directly combined to form a component structure. Compared with the existing structure in which the frame assembly first needs to be encapsulated to form a diode and then combined with the box body 2 to form a component, the heat dissipation effect is better because the frame assembly 1 is in direct contact with the box body 2, and the heat dissipation effect is good; moreover, there is one less layer of encapsulation in the present application. Under the same size conditions, the overall size of the frame assembly 1 can be increased, which can not only assemble larger chips but also increase the heat dissipation area.

[0027] To improve the quality of the product, the frame assembly 1 in the present application includes: Two metal sheets 101, the metal sheets 101 are arranged at intervals, and the opposite ends of the two metal sheets 101 are L-shaped; A crystal grain 102 is installed at the L-shaped end of one of the metal sheets 101. The crystal grain 102 cooperates with the L-shaped part of the metal sheet, and can increase the heat dissipation area; A jumper 103, one end is installed on the crystal grain 102, and the other end is installed on the L-shaped end of the remaining metal sheet 101.

[0028] For further explanation of this part, compared with the existing frame, in this application, the opposite ends of the two metal sheets 101 are designed to be L-shaped for installing crystal grains. For example, when there are two crystal grains, the two crystal grains 102 are arranged in a staggered manner, that is, they are respectively arranged at both ends of the L-shape. Compared with the existing side-by-side arrangement method, it can better avoid the phenomenon of heat accumulation and improve the heat dissipation effect; During its installation, the installation method is similar to the existing one, and both are connected through jumpers, that is, one end of the jumper is connected to the crystal grain, and the other end is connected to the metal sheet 101 without installing the crystal grain.

[0029] Compared with the existing uneven frame components, the upper surfaces of the two metal sheets 101 in this application are on the same horizontal plane, and the lower surfaces are on the same horizontal plane. This improves the flatness and reduces the shear force that occurs after combining multiple frames, thereby causing problems with the electrical properties of the material. Because the existing unevenness is not conducive to mass production and there will be greater stress.

[0030] In this application, it needs to be connected to a wire later. In order to better ensure the connection stability, buckles 4 are installed at both ends of the box body 2 in this application. The buckles 4 ensure the connection stability of the wire and at the same time prevent the subsequent filling material from overflowing. At the same time, the buckles 4 in this application can be produced separately, then installed at both ends of the box body 2, and then the wire is installed; or they can be formed with the wire and then installed at both ends of the box body 2.

[0031] As mentioned in the preface, in order to reduce the overall height, simplify the structure, and improve the heat dissipation effect, the box body 2 in this application is an epoxy resin integrally formed part; in terms of the thermal conductivity W / (m·K), nylon is 0.25 - 0.3, PPE is 0.22, PS is 0.1 - 0.13, silicone rubber is 0.26, while epoxy resin reaches 1.0 - 2.5. Combined with the fact that the epoxy resin is in direct contact with the frame component, there is one less layer of contact material, which can better ensure the heat dissipation effect.

[0032] Similarly, the specific shape of the box body is also designed to ensure the electrical performance and at the same time facilitate subsequent installation; among them, the box body 2 includes: A transition section 201, which wraps the opposite ends of the two metal sheets 101; At least four connecting segments 202, with the connecting segments 202 grouped in pairs of two, respectively arranged on both sides of the connecting segments 202. The connecting segments 202 are L-shaped. There is a gap between the horizontal parts of the connecting segments 202 in the same group to form the hollow area 3. The vertical parts of the connecting segments 202 in the same group are opposite to each other, and there is a gap between the vertical parts of the connecting segments 202 in the same group. This hollow area 3 facilitates the subsequent assembly of other materials, such as busbars. At the same time, the connecting segments 202 wrap the subsequent heat dissipation segments, thereby further improving the heat dissipation performance, and the gaps facilitate subsequent production.

[0033] Furthermore, in order to ensure the quality of the product, the present application also designs the metal sheet 101. Specifically, the metal sheet 101 includes: A substrate segment 104, with the end of the substrate segment 104 being L-shaped; A pin segment 105, located at one end of the substrate segment 104 away from the crystal grain 102; A heat dissipation segment 106, arranged on one side of the substrate segment 104. The present application designs the metal sheet 101, adding a separate heat dissipation segment 106 to improve the heat dissipation performance. The heat dissipation segment 106 is strip-shaped and is located inside the box body 2, which facilitates heat dissipation.

[0034] During the processing of the present application, the original frame assembly 1 further includes a connecting rib 107, arranged between the heat dissipation segment 106 and the substrate segment 104. When the final product is formed, the connecting rib 107 is cut off.

[0035] The present application designs the metal sheet 101, which can better connect to the crystal grains and at the same time ensure the heat dissipation effect. Further, the heat dissipation segments 106 of the two metal sheets 101 are rotationally symmetric about the center of the box body 2, so as to form a heat dissipation channel and improve the heat dissipation effect.

[0036] The structure in the present application has various forms. One of them is as Figure 1 、 2 shown in the structure, and the other is as Figure 3 、 4 shown in the structure.

[0037] As Figures 1-3 shown, for further explanation of the heat dissipation segment 106, the heat dissipation segments of the two metal sheets 101 are rotationally symmetric about the center of the box body, so as to improve the heat dissipation performance. Specifically, as Figure 2As shown, one of the heat dissipation sections 106 is located on the upper side of the metal sheet 101, leaving a gap between it and the substrate section 104 of another metal sheet 101. The left end of its heat dissipation section 106 is in the same vertical plane as the left end of another metal sheet 101. Similarly, another heat dissipation section 106 is located on the lower side of the metal sheet 101, leaving a gap between it and the substrate section 104 of another metal sheet 101. The left end of its heat dissipation section 106 is in the same vertical plane as the left end of another metal sheet 101, thus ensuring the length of the heat dissipation section and improving the heat dissipation performance.

[0038] At this time, a groove 108 is provided on the outer side of the substrate section 104 (specifically, a groove 108 is provided at a position corresponding to the connecting rib 107). The groove 108 is located inside the heat dissipation section 106, and the groove 108 facilitates subsequent filling of fillers to further ensure the quality of the product.

[0039] Among them, no positioning holes are provided on the substrate section 104 because it is directly connected to the box body without being packaged into a diode, so there is no need for positioning, and this can also ensure the heat dissipation area.

[0040] The two metal sheets 101 in the embodiment of the present application are integrally formed, that is, both of them and the connecting rib are integrated. Specifically, a connecting rib 107 is provided between the heat dissipation section 106 of any one of the metal sheets 101 and another metal sheet 101, and it is cut off during subsequent processing so as to achieve the diode characteristics.

[0041] As Figures 4-6 shown, it is another structure. For further explanation of the heat dissipation section 106, the heat dissipation sections of the two metal sheets 101 are rotationally symmetric about the center of the box body to improve the heat dissipation performance. Specifically, as Figure 2 shown, one of the heat dissipation sections 106 is located on the upper side of the metal sheet 101, leaving a gap between it and the substrate section 104 of another metal sheet 101. Similarly, another heat dissipation section 106 is located on the lower side of the metal sheet 101, leaving a gap between it and the substrate section 104 of another metal sheet 101. In this structure, the length of the heat dissipation section 106 is also relatively long, exceeding the end of the substrate section.

[0042] The two metal sheets 101 in the present application are integrally formed, that is, both of them and the connecting rib are integrated. Specifically, a connecting rib 107 is provided between the heat dissipation section 106 of any one of the metal sheets 101 and another metal sheet 101, and it is cut off during subsequent processing so as to achieve the diode characteristics.

[0043] Among them, the width of the substrate section 104 is greater than that of the pin section 105; there is a gap between the end of the substrate section 104 and the inner wall of the vertical part of the connection section 202 to facilitate the passage of the filling material, thereby ensuring the quality of the product.

[0044] A further description is made for this application: The improvement points of this application are mainly divided into two parts, one part is the frame assembly, and the other part is the box body.

[0045] Regarding the frame assembly part: The metal sheet 101 in this application is of an integrated design, and the upper and lower surfaces of the metal sheet 101 are in the same plane, which can improve the flatness, reduce the shear force generated after the combination of multiple frames, avoid material electrical problems, and thus ensure the product quality; moreover, the high flatness is also convenient for production operations and integrated installation, which is beneficial to ensuring the efficient production of the product.

[0046] During the process of die assembly, the end of the metal sheet 101 in this application is L-shaped, which is beneficial to improving the heat dissipation performance; the box body in this application is integrally formed and encapsulated, eliminating the space occupied by the secondary installation and positioning of the traditional diode inside the line box, which can increase the area of the metal sheet, that is, the area of the copper sheet, and correspondingly, the size of the die also becomes larger. For example, the die welding size can be enlarged to 230 mil * 2 pieces, which is 28% larger than the traditional 180 mil; moreover, when placing, this application can adopt a staggered design. Compared with the traditional side-by-side method, the heat dissipation channel is wider, effectively improving the overcurrent capacity of the product.

[0047] The metal sheet 101 in this application is also provided with a heat dissipation section 106 for heat dissipation on both sides. The end of the heat dissipation section corresponds to the end of another metal sheet, which increases the length of the heat dissipation section and ensures the uniformity of heat; at the same time, in the subsequent structure of this application, the metal sheet is directly in contact with the epoxy resin, reducing the heat conduction path and improving the uniformity and efficiency of heat dissipation.

[0048] This application is designed with a groove 108, which can fill the sealant more efficiently.

[0049] Regarding the box body part: The box body in this application is integrally encapsulated, which can improve the quality and efficiency, shorten the production process, reduce the processing risks caused during the processing and installation of the diode in the line box, and at the same time, the overall airtightness of the integrally encapsulated material is relatively good; This application is provided with a hollowed-out area to provide a wide heat dissipation channel and improve the heat capacity of the material; at the same time, this application uses epoxy resin encapsulation, and the thermal conductivity is higher than that of traditional PPE, nylon, and PS, thereby improving the heat dissipation effect.

[0050] This application designs the size of the box body to reduce its thickness. Specifically, the thickness is reduced from 13 - 18 mm to 6 mm, which can reduce the volume, achieve lightweight, reduce the overall material usage, and with one-piece encapsulation, it can also avoid the risks during secondary encapsulation.

[0051] When this application tests the ability of power-on temperature rise, at the same current, the temperature drops by 10 °C, and the over-current capacity per unit area of the crystal grains is effectively improved.

[0052] Attached test data: Performed in accordance with the IEC61215 MQT18 test standard, select crystal grains of the same size, 2 crystal grain suppliers, and each test 2 groups for comparison:

[0053] It can be concluded from the above table that for No. 3, 4, 7, and 8, that is, the 75&T = 1H value of the product in this embodiment is larger, and the resulting temperature is lower, thus reflecting that the product in the embodiment of this application has a better heat dissipation effect.

[0054] In the description of the present invention, a large number of specific details are set forth. However, it can be understood that the embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and technologies are not shown in detail so as not to obscure the understanding of this specification. In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0055] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered by the scope of the claims and the specification of the present invention.

Claims

1. A bypass diode junction box, characterized in that, Comprising: Frame component (1); Box body (2), wrapping the frame component (1), and a hollow area (3) is provided on the box body (2); The frame component (1) includes: Two metal sheets (101), the metal sheets (101) are arranged at intervals, and the opposite ends of the two metal sheets (101) are L-shaped; Crystal grains (102), installed at the L-shaped end of one of the metal sheets (101); Jumper wires (103), one end is installed on the crystal grains (102), and the other end is installed on the L-shaped end of the remaining metal sheet (101).

2. The bypass diode junction box according to claim 1, wherein The upper surfaces of the two metal sheets (101) are on the same horizontal plane, and the lower surfaces are on the same horizontal plane.

3. The bypass diode junction box according to claim 1, characterized in that, Clasps (4) are installed at both ends of the box body (2).

4. The bypass diode junction box according to claim 1, wherein The box body (2) is an epoxy resin integrally formed part.

5. The bypass diode junction box according to claim 4, characterized in that The box body (2) includes: Transition section (201), wrapping the opposite ends of the two metal sheets (101); At least four connecting sections (202), the connecting sections (202) are grouped in pairs, and are respectively arranged on both sides of the connecting sections (202). The connecting sections (202) are L-shaped. A gap is formed between the horizontal parts of the connecting sections (202) in the same group to form the hollow area. The vertical parts of the connecting sections (202) in the same group are opposite to each other, and a gap is left between the vertical parts of the connecting sections (202) in the same group.

6. The bypass diode junction box according to claim 5, characterized in that, The metal sheet (101) includes: Substrate section (104), on which crystal grains are installed; Pin section (105), located at one end of the substrate section (104) away from the crystal grains (102); Heat dissipation section (106), arranged at one end of the substrate section (104).

7. The bypass diode junction box according to claim 6, wherein, The heat dissipation sections (106) of the two metal sheets (101) are rotationally symmetric about the center of the box body (2).

8. The bypass diode junction box according to claim 6, wherein, A groove (108) is provided on the outer side of the substrate section (104).

9. The bypass diode junction box according to claim 6, characterized in that, A gap is left between the end of the substrate section (104) and the inner wall of the vertical part of the connecting section (202).

10. The bypass diode junction box according to claim 6, wherein, No positioning holes are provided on the substrate section (104).

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