Camera module

Abstract

The invention relates to the technical field of camera shooting equipment, and discloses a camera shooting module which comprises a base assembly, a shell, a lens assembly, a bearing part, an image sensor and a driving module, the base assembly comprises a base and a fixing part, and the fixing part is integrally arranged on the base and located on one side of the base; an accommodating cavity is formed between the shell and the base assembly; the lens assembly is fixed in the central opening of the shell; the bearing part is arranged in the accommodating cavity in a sliding manner; the image sensor is fixed on the bearing part; the driving module comprises a magnet assembly and a coil assembly; the bearing piece is provided with a first sliding groove, the fixing piece is provided with a second sliding groove, and a guiding piece is installed between the first sliding groove and the second sliding groove. A first limiting piece is arranged at the upper end of the first sliding groove, and a second limiting piece is arranged at the lower end of the second sliding groove and used for preventing the guiding piece from sliding out. Assembly steps and assembly errors can be reduced, and the perpendicularity between the fixing piece and the base is guaranteed; and the bearing part can be conveniently and smoothly installed, the assembling difficulty is reduced, and the product robustness is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of imaging devices, and in particular to an imaging module. Background Art

[0002] The voice coil motor (VCM) has the advantages of simple structure, small volume, low energy consumption, high acceleration, fast response speed, accurate displacement, and low price. Therefore, for the autofocus function of imaging devices, the voice coil motor is still a cost-effective solution at present.

[0003] The current imaging module generally includes a base assembly, a housing, a carrier, a lens assembly, a voice coil motor drive module, etc. Among them, the base assembly includes a base and a fixing member, and the base and the fixing member are of a split design. The base provides the lower stop point of the travel of the carrier, and the fixing member carries the coil, circuit board, etc. At the same time, the upper stop point of the travel of the carrier is set at the top of the fixing member. This results in the need to add a separate process for assembling the base and the fixing member when assembling the imaging module; moreover, when the fixing member is assembled with the base, the perpendicularity of the fixing member is relatively unstable. In addition, since the upper stop point of the travel is located at the top of the fixing member, it will also affect the assembly of the carrier.

[0004] Therefore, there is an urgent need for an imaging module to solve the above technical problems. Summary of the Invention

[0005] Based on the above, the purpose of the present invention is to provide an imaging module with fewer components, good structural strength, which can reduce the assembly steps and assembly errors, ensure the perpendicularity between the fixing member and the base; and facilitate the smooth installation of the carrier, reduce the assembly difficulty, and increase the product robustness.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] An imaging module, comprising:

[0008] A base assembly, the base assembly includes a base and a fixing member, the fixing member is integrally provided on the base and is located on one side of the base;

[0009] A housing, connected to the base assembly, a receiving cavity is formed between the housing and the base assembly, and the housing is provided with a central opening;

[0010] A lens assembly, fixed in the central opening of the housing;

[0011] A carrier, slidably arranged in the receiving cavity along a first direction;

[0012] An image sensor, fixed on one side of the carrier close to the base assembly, and the lens assembly and the image sensor are coaxially arranged;

[0013] A driving module, including a magnet assembly and a coil assembly, wherein the magnet assembly is arranged on one side of the carrier; the coil assembly is fixedly arranged in the accommodation cavity and is arranged opposite to the magnet assembly;

[0014] A first sliding groove is arranged on one side of the carrier close to the fixing member, and a second sliding groove is arranged on one side of the fixing member close to the carrier. A guiding member is installed between the first sliding groove and the second sliding groove to enable the carrier to be slidably connected with the fixing member; a first limiting member is arranged at the upper end of the first sliding groove, and a second limiting member is arranged at the lower end of the second sliding groove for preventing the guiding member from sliding out between the first sliding groove and the second sliding groove.

[0015] In some possible implementation manners, the outer shell and the fixing member are fixed by adhesion.

[0016] In some possible implementation manners, a dent structure is arranged on the surface of the fixing member away from the carrier for coating an adhesive to be adhesively fixed to the inner side wall of the outer shell.

[0017] In some possible implementation manners, the dent structure includes a plurality of grooves extending in the horizontal direction.

[0018] In some possible implementation manners, the base includes a side frame extending around the periphery of the outer shell and a bottom frame having an installation opening, and the fixing member is integrally arranged in the bottom frame; the base further includes a limiting block, the limiting block is connected to the inner side surface of the bottom frame and extends towards the inside of the installation opening, and the bottom surface of the carrier contacts the limiting block.

[0019] In some possible implementation manners, three such limiting blocks are arranged on the inner side surface of the bottom frame, one of the limiting blocks is located on the side opposite to the fixing member; the other two limiting blocks are located on both sides of the bottom frame, and the other two limiting blocks are respectively connected to two side parts of the fixing member in a one-to-one correspondence.

[0020] In some possible implementation manners, the coil assembly includes a circuit board, a coil support plate and a coil arranged in sequence, the coil is fixed on the coil support plate, a first lead wire is led out from the inner side of the coil, and a second lead wire is led out from the outer side; a first accommodation groove penetrating through the edge of the coil support plate is formed on one side of the coil support plate facing the coil, and the first lead wire passes out from the first accommodation groove and is electrically connected to the circuit board.

[0021] In some possible embodiments, the outer contour dimension of the coil support plate is larger than that of the coil; the coil has a first central hole, and a second central hole is formed in the coil support plate, and the dimension of the second central hole is smaller than that of the first central hole.

[0022] In some possible embodiments, the coil support plate is made of a metal soft magnetic material, and the shape of the coil support plate is a centrally symmetric figure; a second accommodation groove is further formed on one side of the coil support plate facing the coil, and the first accommodation groove and the second accommodation groove are symmetrically arranged about the center of the coil support plate or arranged by rotating 180 degrees about the axis of the second central hole.

[0023] In some possible embodiments, the depth of the first accommodation groove and the second accommodation groove is 20% - 40% of the thickness of the coil support plate; and / or,

[0024] the width of the first accommodation groove and the second accommodation groove is 5 - 10 times the diameter of the first lead wire; and / or,

[0025] The shapes of the first accommodation groove and the second accommodation groove are both arc-shaped, and the first accommodation groove and the second accommodation groove are arranged at the diagonal positions of the coil support plate.

[0026] In some possible embodiments, a first installation groove is provided on one side of the carrier close to the fixing member, and the magnet assembly is installed in the first installation groove; a second installation groove is provided on one side of the fixing member close to the carrier, and the coil assembly is installed in the second installation groove; and / or,

[0027] The carrier includes a moving through hole that longitudinally penetrates the carrier, the image sensor is located below the moving through hole, the lens assembly is located above the moving through hole, and the outer diameter of the lens assembly is smaller than the aperture of the moving through hole; and / or,

[0028] The coil assembly further includes a magnetic sensor, and the magnetic sensor is electrically connected to the circuit board; and / or,

[0029] The magnet assembly includes a shielding plate and at least one magnet, and each magnet is fixed on the shielding plate.

[0030] In some possible embodiments, the drive module further includes a bottom plate and a driver circuit, the bottom plate is fixed to the base, the driver circuit is installed on the bottom plate, and the driver circuit is electrically coupled to the image sensor and the coil assembly respectively.

[0031] Advantages of the present invention:

[0032] The base assembly of the present invention adopts an integral structure, with the fixing member integrally arranged on the base. This not only improves the structural strength, reduces the number of components, and is beneficial for cost savings, but also eliminates the assembly steps between the base and the fixing member, reduces the assembly difficulty, minimizes the assembly error, improves the positioning accuracy between the bearing member and the housing, and avoids the uncertainties during the assembly process. In addition, it ensures the perpendicularity between the fixing member and the base, avoiding the relatively unstable perpendicularity situation during the assembly of the fixing member and the base when using a split structure.

[0033] The present invention is provided with a first chute on the side of the bearing member close to the fixing member, and a second chute on the side of the fixing member close to the bearing member. A guiding member is installed between the first chute and the second chute to achieve the sliding connection between the bearing member and the fixing member. Moreover, the present invention is provided with a first limiting member at the upper end of the first chute of the bearing member and a second limiting member at the lower end of the second chute, thereby preventing the guiding member from sliding out between the first chute and the second chute. This setting avoids interfering with the assembly of the bearing member, facilitates the smooth installation of the bearing member, reduces the assembly difficulty, and increases the product robustness. Brief Description of the Drawings

[0034] Figure 1 is a schematic structural view of the camera module provided by Embodiment 1 of the present invention;

[0035] Figure 2 is a schematic structural view of the camera module provided by Embodiment 1 of the present invention after removing the housing and the lens assembly;

[0036] Figure 3 is an exploded view of the camera module provided by Embodiment 1 of the present invention;

[0037] Figure 4 is an exploded view of the bearing member and the magnet assembly provided by Embodiment 1 of the present invention;

[0038] Figure 5 is an exploded view of the base assembly, the coil assembly and the guiding member provided by Embodiment 1 of the present invention;

[0039] Figure 6 is a schematic structural view of the base assembly provided by Embodiment 1 of the present invention from a first angle;

[0040] Figure 7 is a schematic structural view of the base assembly provided by Embodiment 1 of the present invention from a second angle;

[0041] Figure 8 is a schematic structural view of the bearing member provided by Embodiment 1 of the present invention;

[0042] Figure 9 is a schematic structural view of the coil and the coil support plate provided by Embodiment 1 of the present invention from a first angle;

[0043] Figure 10 It is a schematic diagram of the second angle structure of the coil and the coil support plate provided in the first embodiment of the present invention;

[0044] Figure 11 It is a schematic diagram of the structure of the coil provided in the first embodiment of the present invention;

[0045] Figure 12 It is a schematic diagram of the structure of the coil support plate provided in the first embodiment of the present invention;

[0046] Figure 13 It is a schematic diagram of the assembled structure of the carrier and the metal cover provided in the second embodiment of the present invention;

[0047] Figure 14 It is an exploded view of the structure of the carrier and the metal cover provided in the second embodiment of the present invention;

[0048] Figure 15 It is a schematic diagram of the process flow of the forming process provided in the second embodiment of the present invention;

[0049] Figure 16 It is a schematic diagram of the structure of the metal plate with a preset shape provided in the second embodiment of the present invention;

[0050] Figure 17 It is a schematic diagram of the bent and formed structure of the metal plate provided in the second embodiment of the present invention.

[0051] In the figure:

[0052] 1. Base assembly; 11. Base; 111. Side frame; 112. Bottom frame; 1121. Installation opening; 113. Limiting block; 12. Fixing member; 121. Second chute; 1212. Second limiting member; 122. Second installation groove; 123. Dent structure; 13. Image sensor; 14. Driver circuit; 15. Bottom plate; 2. Carrier; 21. First chute; 212. First limiting member; 22. First installation groove; 23. Moving through hole; 24. Anti-collision block; 25. Boss; 3. Magnet assembly; 31. Shielding plate; 32. Magnet; 4. Coil assembly; 41. Circuit board; 42. Coil support plate; 421. First accommodating groove; 4211. First extension section; 4212. Second extension section; 4213. Arc connecting section; 422. Second accommodating groove; 423. Second central hole; 43. Coil; 431. First lead wire; 432. Second lead wire; 433. First central hole; 44. Magnetic sensor; 5. Housing; 51. Central opening; 6. Guide member; 7. Lens assembly; 8. Metal cover; 81. Accommodating groove; 82. First side wall; 83. Long strip hole; 84. Reinforcing hole; 85. Notch. Detailed implementation manners

[0053] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only the parts related to the present invention are shown in the drawings, rather than all the structures.

[0054] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature not being in direct contact but being in contact through other features therebetween. Moreover, the first feature being "above", "above the", and "on the" second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "below the", and "under the" second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0056] In the description of the present invention, the orientation or positional relationship such as "above", "below", "left", and "right" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for differentiation in description and have no special meaning.

[0057] An embodiment of the present invention provides an imaging module, which can be applied to electronic products and realizes the automatic focusing or optical image stabilization function of the lens through the driving form of a voice coil motor.

[0058] Embodiment 1

[0059] As Figures 1 to 12As shown in the figure, this embodiment provides an imaging module, including a base assembly 1, a carrier 2, a housing 5, a lens assembly 7, an image sensor 13, and a driving module. The base assembly 1 includes a base 11 and a fixing member 12. The fixing member 12 is integrally provided on the base 11 and is located on one side of the base 11. Preferably, the fixing member 12 is perpendicular to the base 11. The housing 5 is connected to the base 11, and an accommodation cavity is formed between the housing 5 and the base assembly 1. The housing 5 is provided with a central opening 51, and the size of the central opening 51 is adapted to the size of the lens assembly 7. The lens assembly 7 is fixed in the central opening 51. The carrier 2 is slidably arranged in the accommodation cavity in the first direction. The first direction is specifically the optical axis direction of the lens assembly 7. The image sensor 13 is located in the accommodation cavity and is fixed on the side of the carrier 2 close to the base 11. The lens assembly 7 and the image sensor 13 are coaxially arranged. The carrier 2 can drive the image sensor 13 to move in the accommodation cavity along the optical axis direction, changing the distance between the image sensor 13 and the lens assembly 7, so as to adjust the focus of the lens. The image sensor 13 can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) sensor, and the image projected on the image sensor 13 can be captured, stored, and / or presented to the user. Further, the carrier 2 has an annular structure, and a moving through hole 23 is provided at its center. The moving through hole 23 penetrates the carrier 2 longitudinally. The image sensor 13 is located below the moving through hole 23, and the lens assembly 7 is located above the moving through hole 23, which enables light to pass through the lens assembly 7 and then through the moving through hole 23 to reach the image sensor 13 to obtain an image; moreover, the outer diameter of the lens assembly 7 is smaller than the aperture of the moving through hole 23, which enables the lens assembly 7 to smoothly pass through the moving through hole 23 when the carrier 2 drives the image sensor 13 to move.

[0060] The base assembly 1 of this embodiment adopts an integrated structure and is manufactured by an integral molding process. This not only improves the structural strength, reduces the number of components, and is beneficial to cost savings; but also eliminates the assembly steps between the base 11 and the fixing member 12, reduces the assembly difficulty, reduces the assembly error, improves the positioning accuracy between the carrier 2 and the housing 5, and avoids the uncertainty during the assembly process; in addition, it also ensures the perpendicularity between the fixing member 12 and the base 11, avoiding the unstable perpendicularity situation during the assembly of the fixing member 12 and the base 11 when using a split structure, and increasing the product robustness.

[0061] In this embodiment, by directly fixing the lens assembly 7 within the central opening 51 of the housing 5, light can directly pass through the lens assembly 7 to reach the image sensor 13, ensuring that under any circumstances, the normal passage of light will not be obstructed. In this embodiment, by first fixing the housing 5 and the lens assembly 7, during assembly, it is only necessary to ensure that the image sensor 13 and the lens assembly 7 are coaxial with the optical axis, which can ensure the assembly accuracy and is more conducive to the optimization of the assembly process. The lens assembly 7 may specifically include one or more lenses, which can focus light onto the image sensor 13 under their interaction.

[0062] In this embodiment, a drive module is adopted to drive the image sensor 13. The drive module includes a magnet assembly 3 and a coil assembly 4. The magnet assembly 3 is disposed on one side of the carrier 2 close to the fixing member 12, and the coil assembly 4 is disposed on one side of the fixing member 12 close to the carrier 2, and the coil assembly 4 is disposed opposite to the magnet assembly 3. Due to the close proximity between the magnet assembly 3 and the coil assembly 4, the coil assembly 4 can be excited by an electric current to generate a magnetic field that interacts with the magnetic field of the magnet assembly 3. The attractive or repulsive force between the magnetic fields drives the carrier 2 and the image sensor 13 to move upward or downward along the optical axis within the accommodation cavity, thereby adjusting the distance between the image sensor 13 and the lens assembly 7 to achieve the function of autofocus.

[0063] The drive module of this embodiment further includes a base plate 15 and a driver circuit 14. The base plate 15 is fixed below the base 11, and the driver circuit 14 is mounted on the base plate 15. The driver circuit 14 is electrically coupled to the image sensor 13 and the coil assembly 4 respectively. The driver circuit 14, such as a driver IC, delivers power to the coil assembly 4 to excite the coil assembly 4 and generate a second magnetic field that interacts with the magnetic field of the magnet assembly 3. The driver IC can excite the coil assembly 4 in response to a control signal provided to the driver IC from an external controller such as a microprocessor or other data processing device. In some embodiments, the driver IC can adjust the magnetic field emitted from the coil assembly 4 to drive the carrier 2 to move upward or downward to an accurate position, for example, by reversing the direction of the current delivered to the coil assembly 4 (thus reversing the polarity of the magnetic field generated from the coil assembly 4) and adjusting the effective intensity of the magnetic field (e.g., using pulse width modulation) to adjust the amount of attractive or repulsive force between the magnet assembly 3 and the coil assembly 4, so that the magnet assembly 3 drives the image sensor 13 to move up and down through the carrier 2. The image sensor 13 can feedback the detected image information to the control module of the imaging device through the driver circuit 14. Further, the driver circuit 14 also has an elastic function, which can help the image sensor 13 to reset after movement and make the image sensor 13 more stable when moving up and down.

[0064] Optionally, a first sliding groove 21 is provided on one side of the carrier 2 opposite to the fixing member 12, and a second sliding groove 121 is provided on one side of the fixing member 12 opposite to the carrier 2. Both the first sliding groove 21 and the second sliding groove 121 extend along the optical axis direction of the lens assembly 7. A guiding member 6 is installed between the first sliding groove 21 and the second sliding groove 121, so that the carrier 2 can slide relative to the fixing member 12. With such a setting, the smoothness and running accuracy of the carrier 2 moving along the optical axis direction are increased, and the frictional resistance is reduced. Specifically, the guiding member 6 can be several ball bearings or a guiding column extending along the optical axis direction, both of which can play a good guiding role. Preferably, the guiding member 6 in this embodiment uses ball bearings for guiding.

[0065] Since the base assembly 1 in this embodiment is an integral structure, the carrier 2 needs to be assembled onto the base assembly 1 from above. If a limiting member is provided at the upper end of the second sliding groove 121 of the fixing member 12, it will interfere with the assembly of the carrier 2 and affect the assembly of the carrier 2. For this reason, in this embodiment, a first limiting member 212 is provided at the upper end of the first sliding groove 21 of the carrier 2, and a second limiting member 1212 is provided at the lower end of the second sliding groove 121, so as to prevent the guiding member 6 from sliding out between the first sliding groove 21 and the second sliding groove 121. With such a setting, interference with the assembly of the carrier 2 is avoided, the carrier 2 can be smoothly installed, the assembly difficulty is reduced, and the product robustness is increased.

[0066] The housing 5 in this embodiment is a housing structure with an opening on the lower side. The housing 5 is buckled on the base 11. The carrier 2, the fixing member 12, the image sensor 13, the magnet assembly 3, and the coil assembly 4 are all accommodated in the accommodation cavity. In this way, the housing 5 can form a good protection for the internal devices. Preferably, the material of the housing 5 is metal, and the shape of the housing 5 is a quadrilateral housing with an open lower end, which can be specifically manufactured by processes such as punching and bending of metal materials. The metal housing 5 can protect the camera module from electromagnetic interference (EMI) that may occur in the environment.

[0067] Preferably, the housing 5 and the fixing member 12 in this embodiment are fixed by bonding, and their assembly is simple and the connection is reliable. In the prior art, the surface of the fixing member 12 is usually smooth, which causes the glue to be difficult to adhere to the surface of the fixing member 12, thus affecting the bonding effect between the housing 5 and the fixing member 12. To solve the above problems, in this embodiment, a dent structure 123 is provided on the surface (i.e., the outer side) of the fixing member 12 away from the carrier 2. In this way, when the adhesive is coated on the outer side of the fixing member 12, the adhesive can remain and adhere in the dent structure 123, so as to achieve reliable bonding between the outer side of the fixing member 12 and the inner side wall of the housing 5.

[0068] Specifically, the above-mentioned indentation structure 123 includes a plurality of elongated grooves, and each groove extends along the horizontal direction, which enables the adhesive to better adhere to the outer side surface of the fixing member 12. Further, the above-mentioned plurality of grooves are uniformly arranged in an array form on the outer side surface of the fixing member 12 to increase the balance of the adhesion to the housing 5. In this embodiment, the adhesive is preferably glue.

[0069] The base 11 of this embodiment includes a bottom frame 112 and a side frame 111 provided on the bottom frame 112. The fixing member 12 is integrally provided in the bottom frame 112. The bottom surface of the housing 5 can be adhesively connected to the bottom frame 112, and the side frame 111 surrounds the periphery of the housing 5. The connection method between the housing 5 and the base 11 makes the connection more firm; at the same time, the base 11 can provide a more accurate installation position for the housing 5, so that the lens assembly 7 on the housing 5 can quickly achieve optical axis coaxiality with the image sensor 13. There is an installation opening 1121 at the middle position of the bottom frame 112, and the size of the installation opening 1121 is smaller than the inner size of the side frame 111, so that a certain width of the bottom frame 112 can be exposed to receive the housing 5, reducing the manufacturing difficulty and increasing the product stability; and the installation opening 1121 can enable the coil assembly 4 to be electrically connected to the driver circuit 14.

[0070] The base 11 further includes a limiting block 113. One end of the limiting block 113 is connected to the inner side surface of the bottom frame 112, and the other end extends towards the inside of the installation opening 1121. The limiting block 113 is used to receive the carrier 2 and prevent the carrier 2 from moving out of the accommodation cavity. The limiting block 113 can limit the downward movement of the carrier 2. When the carrier 2 moves to the lowest position, the bottom surface of the carrier 2 is in abutting contact with the upper surface of the limiting block 113.

[0071] Optionally, the upper surface of the limiting block 113 can be higher than the upper surface of the bottom frame 112. Since the area of the limiting block 113 is small, it is easy to control its flatness. Thus, when the carrier 2 contacts the limiting block 113, the image sensor 13 can still maintain optical axis coaxiality with the lens assembly 7; moreover, the above setting can also prevent the glue from being squeezed onto the upper surface of the limiting block 113 when the housing 5 is adhesively connected to the base 11, which may affect the movement of the carrier 2.

[0072] In the prior art, the limiting block 113 is only connected to the inner side surface of the bottom frame 112 and is not fixed to other components, and there is a certain distance between the limiting block 113 and the fixing member 12. The area of the limiting block 113 is small, which makes it easy for the limiting block 113 to be bent or even broken when the carrier 2 moves downward and impacts the limiting block 113.

[0073] To solve the above problems, in this embodiment, three limiting blocks 113 are provided on the inner side of the bottom frame 112. One of the limiting blocks 113 is located on the side opposite to the fixing member 12; the other two limiting blocks 113 are symmetrically arranged on the two inner sides of the bottom frame 112, and these two limiting blocks 113 extend to be connected to the two side parts of the fixing member 12 respectively. The arrangement of the above three limiting blocks 113 can improve the balance of the impact force of the limiting blocks 113 by the bearing member 2 and increase the support stability of the bearing member 2; and the two limiting blocks 113 located on both sides are respectively connected to the fixing member 12, which can increase the structural strength of the limiting blocks 113, and the lengths of the limiting blocks 113 on both sides are also extended to a certain extent, thereby increasing the area of the limiting blocks 113, further improving the structural stability and bending resistance of the limiting blocks 113, and preventing the limiting blocks 113 from being bent or broken due to the impact of the bearing member 2.

[0074] Further, a first installation groove 22 is provided on the side of the bearing member 2 facing the fixing member 12, and the magnet assembly 3 is installed in the first installation groove 22. Optionally, the magnet assembly 3 includes a shielding plate 31 and at least one magnet 32. Each magnet 32 is fixed to the shielding plate 31 by means of bonding or the like, and after the combination of the magnets 32, a magnet surface facing the coil assembly 4 is formed. Optionally, one magnet 32 is used in this embodiment, and the magnet 32 has a magnet surface facing the coil assembly 4; a second installation groove 122 is provided on the side of the fixing member 12 facing the bearing member 2, and the coil assembly 4 is installed in the second installation groove 122, and the coil assembly 4 and the magnet assembly 3 are arranged opposite to each other.

[0075] The coil assembly 4 of this embodiment includes a circuit board 41, a coil support plate 42, a coil 43 and a magnetic sensor 44. The circuit board 41, the coil support plate 42 and the coil 43 are sequentially installed in the second installation groove 122 of the fixing member 12 from far away from the magnet assembly 3 to close to the magnet assembly 3; the coil 43 is fixed (such as by bonding) to the coil support plate 42 and is electrically connected to the circuit board 41, and the circuit board 41 provides a control signal and a driving current for the coil 43, etc.; the magnetic sensor 44 is located in the middle of the coil 43 and is electrically connected to the circuit board 41, and the magnetic sensor 44 is used to sense the change of the magnetic field. The circuit board 41 of this embodiment can be a flexible circuit board, a rigid circuit board or a flexible-rigid combined circuit board; when the circuit board 41 is a flexible circuit board, a reinforcing plate can also be provided to increase the strength of the flexible circuit board.

[0076] The coil 43 is usually wound with copper-clad wire. After winding, a first lead wire 431 is led out from the inner side thereof, and a second lead wire 432 is led out from the outer side. Both the first lead wire 431 and the second lead wire 432 are electrically connected to the circuit board 41. When assembling the coil assembly 4, the first lead wire 431 located inside the coil 43 needs to penetrate laterally outwards, so that the first lead wire 431 is clamped between the end face of the coil 43 and the coil support plate 42. This will cause interference between the first lead wire 431 and the coil support plate 42, resulting in excessive extrusion of the first lead wire 431 and even breaking the first lead wire 431, thus affecting the normal use of the camera module.

[0077] To solve the above problems, in this embodiment, a first receiving groove 421 penetrating the edge of the coil support plate 42 is formed on the surface of the coil support plate 42 facing the coil 43, so as to facilitate receiving the first lead wire 431 that extends laterally outwards from the inner side of the coil 43. After the first lead wire 431 passes through the first receiving groove 421, it is electrically connected to the circuit board 41. In this way, interference between the first lead wire 431 and the coil support plate 42 is avoided, greatly reducing the risk of the first lead wire 431 being extruded or even broken, and ensuring the reliability of the use of the camera module.

[0078] In this embodiment, the outer contour shape of the coil support plate 42 is the same as that of the coil 43, and the outer contour dimension of the coil support plate 42 is larger than that of the coil 43; a first central hole 433 is formed by winding the coil 43, and a second central hole 423 is formed on the coil support plate 42. The size of the second central hole 423 is smaller than that of the first central hole 433. With such a setting, the coil 43 can be completely accommodated on the coil support plate 42, with a compact structure and reliable use.

[0079] In this embodiment, the coil support plate 42 is made of a metal soft magnetic material, which has the characteristics of low coercivity and high magnetic permeability, and is easy to be magnetized and demagnetized. Specifically, the coil support plate 42 can be made of iron-silicon alloy, soft ferrite, etc. When the magnet assembly 3, the carrier 2, and the image sensor 13 move along the optical axis direction and leave the initial position, there is a certain restoring force between the magnet assembly 3 and the coil support plate 42, which can make the magnet assembly 3, the carrier 2, and the image sensor 13 return to the initial position. To ensure the accuracy of the reset of the magnet assembly 3, the carrier 2, and the image sensor 13, in this embodiment, the shape of the coil support plate 42 is preferably a centrosymmetric figure, so that the magnetic force acting on the magnet assembly 3 is symmetric. Exemplarily, the coil support plate 42 can be circular, elliptical, rectangular, etc. Further, a second accommodation groove 422 is formed on the surface of the coil support plate 42 facing the coil 43, and the structure of the second accommodation groove 422 is the same as that of the first accommodation groove 421. The second accommodation groove 422 and the first accommodation groove 421 are symmetrically arranged about the center of the coil support plate 42, or the second accommodation groove 422 and the first accommodation groove 421 are arranged by rotating 180 degrees around the axis of the second central hole 423, so as to further ensure the weight balance of the coil support plate 42, make the magnetic force acting on the magnet assembly 3 symmetric, and increase the smoothness and accuracy of the movement of the magnet assembly 3, the carrier 2, and the image sensor 13; at the same time, setting the second accommodation groove 422 is also beneficial to reducing the product weight.

[0080] The thickness of the coil support plate 42 affects the magnitude of the Lorentz force on the magnet assembly 3. Specifically, the greater the thickness of the coil support plate 42, the greater the Lorentz force on the magnet assembly 3. To ensure sufficient driving force is provided to the magnet assembly 3, when fabricating the first receiving groove 421 and the second receiving groove 422, not too much of the thickness of the coil support plate 42 should be removed. In this embodiment, the depth of the first receiving groove 421 and the second receiving groove 422 is 20% - 40% of the thickness of the coil support plate 42. In this way, while providing an appropriate accommodation space for the first guiding wire 431, the loss of magnetic force can be minimized as much as possible. Preferably, the first receiving groove 421 and the second receiving groove 422 of this embodiment are fabricated by stamping. For ease of processing, the depth of the first receiving groove 421 and the second receiving groove 422 in this embodiment is set to 30% of the thickness of the coil support plate 42, that is, 30% of the thickness of the coil support plate 42 is removed. It should be noted that when the thickness of the coil support plate 42 itself is relatively thick, the depth of the first receiving groove 421 and the second receiving groove 422 can be greater than or equal to the diameter of the first guiding wire 431, so that the first guiding wire 431 can be completely buried in the first receiving groove 421; when the thickness of the coil support plate 42 itself is not large, the depth of the first receiving groove 421 and the second receiving groove 422 can be slightly less than the diameter of the first guiding wire 431. At this time, the first guiding wire 431 is partially accommodated in the first receiving groove 421, which can also play a role in reducing the interference and extrusion between the first guiding wire 431 and the coil support plate 42.

[0081] Furthermore, during the use and testing of the camera module, the first guiding wire 431 may move. Therefore, if the width of the first receiving groove 421 is set to be the same as the diameter of the first guiding wire 431, interference is likely to occur between the two. Therefore, in this embodiment, the width of the first receiving groove 421 is greater than the diameter of the first guiding wire 431. Preferably, the width of the first receiving groove 421 is 5 - 10 times the diameter of the first guiding wire 431 to provide sufficient movement space for the first guiding wire 431. To ensure structural symmetry, the width of the second receiving groove 422 is also 5 - 10 times the diameter of the first guiding wire 431, and the width of the second receiving groove 422 is the same as the width of the first receiving groove 421.

[0082] To better adapt to the actual routing of the first guiding wire 431, in this embodiment, the shape of the first accommodating groove 421 is preferably arc-shaped. Specifically, the first accommodating groove 421 includes: a first extension section 4211, a second extension section 4212, and an arc-shaped connecting section 4213 connecting the first extension section 4211 and the second extension section 4212, where the included angle between the first extension section 4211 and the second extension section 4212 is an obtuse angle, and the second extension section 4212 penetrates through the edge of the coil support plate 42. The shape of the second accommodating groove 422 is the same as that of the first accommodating groove 421, which will not be elaborated in this embodiment. Further, the first accommodating groove 421 and the second accommodating groove 422 are arranged at diagonal positions of the coil support plate 42. Such an arrangement facilitates connecting the first guiding wire 431 to the circuit board 41 after leading it out along the first accommodating groove 421 and is convenient for the processing of the grooves. Of course, in other embodiments, the shape of the first accommodating groove 421 can also be linear or polyline-shaped, etc., and is not limited to this embodiment.

[0083] In this embodiment, a plurality of anti-collision blocks 24 are further provided on the top and / or side of the carrier 2. When the camera module is subjected to external impacts or severe vibrations, the anti-collision blocks 24 can play a role in shock absorption and buffering; at the same time, the anti-collision blocks 24 can limit and buffer the movement of the carrier 2, reduce the impact force between the carrier 2 and the housing 5 during the movement of the carrier 2, and improve the shock absorption and noise reduction performance of the camera module. Preferably, the anti-collision blocks 24 are made of elastic materials such as silica gel, rubber or resin, so as to better absorb the impact force generated by vibrations and protect the camera module from the influence of vibrations.

[0084] Embodiment Two

[0085] This embodiment provides another camera module, whose structure is basically the same as that in Embodiment One, except that the camera module in this embodiment further includes a metal cover 8.

[0086] In the prior art, a large amount of heat is generated during the operation of the image sensor 13. However, at present, most of the carriers 2 carrying the image sensor 13 in the camera module are made of plastic materials. Although plastic has the advantages of low cost, light weight and easy processing and molding, its heat dissipation performance is poor. Due to the low heat dissipation of the plastic carrier 2, the heat generated by the image sensor 13 cannot be dissipated in time and effectively, resulting in an increase in the temperature around the image sensor 13. The too high temperature will not only affect the normal operation of the image sensor 13 and reduce the image quality, such as problems like increased noise and color distortion, but may also shorten the service life of the image sensor 13 and even damage the entire camera module.

[0087] To solve the above problems, as Figures 13 to 14As shown in the figure, in this embodiment, the camera module further includes a metal cover 8. The metal cover 8 is provided with a receiving groove 81. A long hole 83 is provided at the connecting portion between the bottom of the receiving groove 81 and the first side wall 82 of the receiving groove 81. The side wall of the receiving groove 81 is provided with a plurality of strengthening holes 84. The receiving groove 81 covers the outer wall of the carrier 2. The outer wall of the carrier 2 is provided with a plurality of bosses 25, and the plurality of bosses 25 are respectively located in the long hole 83 and the plurality of strengthening holes 84. By using the receiving groove 81 of the metal cover 8 to cover the carrier 2, when the image sensor 13 generates heat, the heat of the image sensor 13 can be dissipated through the carrier 2 and the metal cover 8. The metal cover 8 improves the heat dissipation performance of the carrier 2, and the heat generated by the image sensor 13 can be effectively dissipated, improving the performance of the camera module. Furthermore, the bosses 25 on the outer wall of the carrier 2 are respectively located in the long hole 83 and the strengthening holes 84, which improves the assembly strength between the carrier 2 and the metal cover 8. When the camera module is in use or during a drop test, it prevents the carrier 2 from separating from the metal cover 8, improving the reliability of the camera module.

[0088] Preferably, a notch 85 is provided at one end of the first side wall 82 facing away from the bottom of the groove, and a boss 25 is provided in the notch 85. After the carrier 2 is connected to the metal cover 8, the bosses 25 in the long hole 83 and the boss 25 in the notch 85 respectively abut against both ends of the first side wall 82 along the first direction, thereby being able to limit the relative shaking of the metal cover 8 with respect to the carrier 2 along the first direction and improving the connection strength between the carrier 2 and the metal cover 8.

[0089] In the prior art, the metal cover 8 is often processed by a stretching forming process. Before forming, holes are provided at the corners of the receiving groove 81 of the metal cover 8 to facilitate forming and cooperation with plastic parts. During the stretching forming process, the holes are easily damaged or deformed, and the accuracy is poor. If the holes are deformed, it will affect the strength of the carrier 2, resulting in a phenomenon that the carrier 2 and the metal cover 8 are not properly fitted. During testing, it is easy to cause the carrier 2 to deform or break.

[0090] To solve the above problems, as Figures 15 to 17 shown, this embodiment also provides a forming process for manufacturing the carrier 2 and the metal cover 8 in the above camera module. The forming process includes the following steps:

[0091] S1. Fabricate a metal plate with a preset shape, and the preset shape is the shape after the metal cover 8 is unfolded;

[0092] S2. Machine the strengthening holes 84 and the notches 85 at the preset positions on the metal plate;

[0093] S3. Bend the metal plate to form the metal cover 8, and form the long hole 83 of the formed metal cover 8;

[0094] S4. The metal cover 8 is subjected to insert injection molding in an injection mold to form the carrier 2. Protrusions 25 of the carrier 2 are formed in both the reinforcing holes 84, the notches 85 and the long holes 83.

[0095] Among them, the metal cover 8 is drilled before molding and formed by a bending process. The metal cover 8 is formed by a bending process. Compared with the stretching process, the manufacturing difficulty of the metal cover 8 is reduced, the accuracy of the reinforcing holes 84, the notches 85 and the long holes 83 is improved, the probability of product abnormality is reduced. The carrier 2 is formed by insert injection molding on the metal cover 8, which increases the connection strength between the metal cover 8 and the carrier 2, prevents the metal cover 8 from falling off, and reduces the uncertainty in the production process. Moreover, a long hole 83 with a relatively large size and high precision can be formed at the connection part between the bottom of the receiving groove 81 and the first side wall 82 of the receiving groove 81.

[0096] Obviously, the above-mentioned embodiments of the present invention are only examples for clearly explaining the present invention, and are not intended to limit the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. An imaging module, characterized in that, Comprising: A base assembly, the base assembly includes a base and a fixing member, the fixing member is integrally provided on the base and is located on one side of the base; A housing, connected to the base assembly, a receiving cavity is formed between the housing and the base assembly, and the housing is provided with a central opening; A lens assembly, fixed in the central opening of the housing; A carrier, slidably arranged in the receiving cavity along a first direction; An image sensor, fixed on one side of the carrier close to the base assembly, and the lens assembly is coaxially arranged with the image sensor; A driving module, including a magnet assembly and a coil assembly, the magnet assembly is arranged on one side of the carrier; the coil assembly is fixedly arranged in the receiving cavity and is arranged opposite to the magnet assembly; A first sliding groove is arranged on one side of the carrier close to the fixing member, a second sliding groove is arranged on one side of the fixing member close to the carrier, and a guiding member is installed between the first sliding groove and the second sliding groove to enable the carrier to be slidably connected to the fixing member; a first limiting member is arranged at the upper end of the first sliding groove, and a second limiting member is arranged at the lower end of the second sliding groove for blocking the guiding member from sliding out between the first sliding groove and the second sliding groove.

2. The camera module according to claim 1, wherein The housing and the fixing member are fixed by bonding.

3. The camera module according to claim 2, wherein, A dent structure is arranged on the surface of the fixing member far from the carrier for coating an adhesive to be adhesively fixed to the inner side wall of the housing.

4. The camera module according to claim 3, wherein, The dent structure includes a plurality of grooves extending in the horizontal direction.

5. The camera module according to claim 1, wherein The base includes a side frame extending around the periphery of the housing and a bottom frame having an installation opening, the fixing member is integrally arranged in the bottom frame; the base further includes a limiting block, the limiting block is connected to the inner side surface of the bottom frame and extends towards the inside of the installation opening, and the bottom surface of the carrier contacts the limiting block.

6. The camera module according to claim 5, wherein, Three limiting blocks are arranged on the inner side surface of the bottom frame, one of the limiting blocks is located on the side opposite to the fixing member; the other two limiting blocks are located on both sides of the bottom frame, and the other two limiting blocks are respectively connected to the two side parts of the fixing member.

7. The camera module according to claim 1, wherein The coil assembly includes a circuit board, a coil support plate and a coil arranged in sequence, the coil is fixed on the coil support plate, a first lead wire is led out from the inner side of the coil, and a second lead wire is led out from the outer side; a first receiving groove penetrating through the edge of the coil support plate is formed on the surface of the coil support plate facing the coil, and the first lead wire passes out from the first receiving groove and is electrically connected to the circuit board.

8. The camera module according to claim 7, characterized in that, The outer contour dimension of the coil support plate is larger than the outer contour dimension of the coil; the coil has a first central hole, and a second central hole is formed on the coil support plate, and the dimension of the second central hole is smaller than the dimension of the first central hole.

9. The camera module according to claim 8, wherein The coil support plate is made of a metal soft magnetic material, and the shape of the coil support plate is a centrosymmetric figure; a second receiving groove is further formed on the surface of the coil support plate facing the coil, and the first receiving groove and the second receiving groove are symmetrically arranged about the center of the coil support plate or are arranged by rotating 180 degrees about the axis of the second central hole.

10. The camera module according to claim 9, wherein, The depths of the first accommodation groove and the second accommodation groove are 20% to 40% of the thickness of the coil support plate; and / or, The widths of the first accommodation groove and the second accommodation groove are 5 to 10 times the diameter of the first guiding wire; and / or, The shapes of the first accommodation groove and the second accommodation groove are both arc-shaped, and the first accommodation groove and the second accommodation groove are arranged at diagonal positions of the coil support plate.

11. The imaging module according to claim 7, wherein A first installation groove is provided on one side of the carrier close to the fixing member, and the magnet assembly is installed in the first installation groove; a second installation groove is provided on one side of the fixing member close to the carrier, and the coil assembly is installed in the second installation groove; and / or, The carrier includes a moving through hole that longitudinally penetrates the carrier, the image sensor is located below the moving through hole, the lens assembly is located above the moving through hole, and the outer diameter of the lens assembly is smaller than the aperture of the moving through hole; and / or, The coil assembly further includes a magnetic sensor, and the magnetic sensor is electrically connected to the circuit board; and / or, The magnet assembly includes a shielding plate and at least one magnet, and each magnet is fixed on the shielding plate.

12. The camera module according to claim 1, wherein The driving module further includes a bottom plate and a driver circuit. The bottom plate is fixed to the base, the driver circuit is installed on the bottom plate, and the driver circuit is electrically coupled to the image sensor and the coil assembly respectively.

Images