A method for manufacturing high-precision circuit boards based on material transfer

Abstract

This invention discloses a method for manufacturing a high-precision circuit board based on material transfer, comprising the following steps: taking a thick copper layer, attaching a micro-adhesive film layer, creating a dry film pattern layer on the other side, etching away a portion of the thick copper layer, removing the film, screen printing solder resist ink, baking and curing, polishing to form a solder resist ink pattern, pressing an insulating dielectric layer, peeling off the micro-adhesive film layer, a second etching to form a circuit pattern layer, surface treatment, and forming the high-precision circuit board. By using material transfer, a "reverse" processing flow is formed. First, a half-circuit layer is made, then solder resist ink is directly screen printed to form a solder resist pattern, and then the pattern is transferred to the insulating dielectric layer. The fabricated circuit pattern and solder resist pattern are etched to expose the fabricated circuit pattern and solder resist pattern. Only one alignment and exposure are required, which greatly improves the accuracy of circuit processing. The solder resist pattern does not undergo exposure and development processing, and there will be no irregular edge or side etching phenomenon. The overall processing flow is efficient and convenient, forming a high-precision circuit board product.

Description

Technical Field

[0001] This invention relates to the fields of printed circuit board design and printed circuit board processing, and in particular to a method for manufacturing a high-precision circuit board based on material transfer. Background Technology

[0002] Circuit boards are essential load-bearing components for electronic modules and are widely used in various fields, playing a fundamental role in circuit conduction and distribution.

[0003] With the development of technology, high-precision circuit boards are needed in some precision instrument fields. Currently, high-precision circuit boards are generally made by using circuit pattern transfer (i.e., pre-processing → dry film application → alignment and exposure → development → etching → film removal) to form circuit patterns, and then using solder resist pattern transfer (i.e., pre-processing → screen printing ink → pre-baking → alignment and exposure → development → curing) to form high-precision circuit boards.

[0004] However, this method is a traditional manufacturing method, which generally only controls the parameters in the processing, or controls the interrelated alignment patterns and alignment methods, the etching method and etching amount, and the methods and parameters of solder mask exposure and development to achieve high-precision processing results. On the one hand, this type of method is only a control method based on production processing and mathematical principles, and not a practical technical method. On the other hand, for high-precision circuit boards that require sensitive test pads, this type of method is also difficult to meet the processing accuracy requirements.

[0005] Based on the above background, this paper proposes a method for manufacturing high-precision circuit boards from the perspective of material utilization. Summary of the Invention

[0006] This invention aims to solve the problems of large processing errors and irregular solder pad and solder mask patterns caused by using existing technologies to fabricate circuit patterns and solder mask patterns. It provides a method for manufacturing high-precision circuit boards based on material reuse, the method comprising the following steps:

[0007] S10: Take a thick copper layer, attach a micro-adhesive film layer to one side of the thick copper layer, attach a dry film to the other side of the thick copper layer, and form a dry film pattern layer to form a pattern transfer structure.

[0008] S20: The pattern transfer structure is etched for the first time to remove part of the thick copper layer, forming a half-circuit layer and a half-copper layer. Then, the film is removed to form a half-circuit pattern structure.

[0009] S30: Screen print solder resist ink on one side of the half-circuit layer to fill the gaps in the circuit pattern of the half-circuit layer, then bake and cure, and polish. The solder resist ink forms a solder resist ink pattern after polishing, and the whole forms a solder resist ink pattern structure.

[0010] S40: An insulating dielectric layer is pressed onto one side of the solder resist ink pattern of the solder resist ink pattern structure, and then the micro-adhesive film layer is peeled off to form a copper surface transfer structure;

[0011] S50: The copper transfer structure is etched a second time to remove the half-copper layer, forming a circuit pattern layer, and then surface treated to form the high-precision circuit board.

[0012] Optionally, the thickness of the thick copper layer is from 50 μm to 350 μm.

[0013] Optionally, the thickness of the semi-copper layer is 5 μm to 50 μm.

[0014] Optionally, after the micro-adhesive layer is attached, a support layer is attached to one side of the micro-adhesive layer; before peeling off the micro-adhesive layer, the support layer is peeled off.

[0015] Optionally, the support layer is an FR-4 sheet material layer, a polytetrafluoroethylene layer, a polyimide layer, or an epoxy resin layer.

[0016] Optionally, the dry film is a high-resolution dry film with a linewidth / line spacing ≤ 15μm / 15μm; the process of forming the dry film pattern layer involves exposing the dry film using an LDI exposure machine and then developing it.

[0017] Optionally, the baking and curing process involves baking at a temperature of 70°C to 80°C for 40 to 50 minutes, followed by baking at a temperature of 100°C to 125°C for 60 to 180 minutes.

[0018] Optionally, the insulating dielectric layer is a prepreg or a polyimide cover film.

[0019] Optionally, the laminated insulating dielectric layer is prepared by performing plasma activation processing on the solder resist ink pattern structure, followed by browning treatment, and then laminating the insulating dielectric layer.

[0020] Optionally, the heating rate of the pressing is 1.5℃ / min to 2.5℃ / min, and the pressing time is ≥20 minutes under the highest temperature condition of the material being pressed.

[0021] This invention utilizes dry film materials to first create a half-circuit layer, then directly screen-prints solder resist ink onto the half-circuit pattern to form a solder resist pattern. The pattern is then transferred to an insulating dielectric layer through reverse transfer. Finally, the half-copper layer is directly etched away, exposing the fabricated circuit pattern and solder resist pattern. During the processing, different materials are used for transfer, resulting in a process that requires only one alignment and exposure of the circuit pattern. The alignment and exposure accuracy of the circuit pattern is far greater than that of existing methods that require one alignment and exposure for the circuit pattern and two alignment and exposure for the solder resist pattern, significantly improving the accuracy of circuit processing. Furthermore, the solder resist ink is directly formed based on the conditions of the circuit pattern. The solder mask pattern is created and formed, and there are no microscopic gaps between it and the circuit pattern, which further improves the processing accuracy of the circuit pattern and the solder mask pattern. That is, by transforming the materials, the present invention forms a "reverse" processing process (different from the prior art) that first creates the solder mask pattern and then presses the insulating dielectric layer onto the solder mask layer and the half circuit layer. In fact, only the circuit pattern is created once, and all other processing is completed on the basis of the processing of the circuit pattern. The traditional solder mask pattern processing method is eliminated, thus significantly improving the accuracy of the circuit pattern and the solder mask pattern. The overall processing flow has the correlation between the front and back processes, and is efficient and convenient, and can produce high-precision circuit board products. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is a process flow diagram of the manufacturing method according to an embodiment of the present invention;

[0024] Figure 2 A cross-sectional schematic diagram showing the formation of the graphic transfer structure for an embodiment of the present invention;

[0025] Figure 3 A cross-sectional schematic diagram showing the formation of a half-circuit pattern structure for an embodiment of the present invention;

[0026] Figure 4 A cross-sectional schematic diagram showing the formation of a solder resist ink screen printing structure according to an embodiment of the present invention;

[0027] Figure 5 A cross-sectional schematic diagram showing the formation of a solder resist ink pattern structure according to an embodiment of the present invention;

[0028] Figure 6A cross-sectional schematic diagram showing the formation of the copper surface transfer structure according to an embodiment of the present invention;

[0029] Figure 7 A cross-sectional schematic diagram showing the formation of a circuit pattern etching structure for an embodiment of the present invention;

[0030] Figure 8 This is a cross-sectional schematic diagram of a high-precision circuit board fabricated according to an embodiment of the present invention.

[0031] Explanation of icon numbers:

[0032] 100. Pattern transfer structure; 110. Thick copper layer; 120. Micro-adhesive film layer; 130. Support layer; 140. Dry film pattern layer; 200. Half-circuit pattern structure; 1110. Half-circuit layer; 1120. Half-copper layer; 300. Solder resist ink screen printing structure; 310. Solder resist ink; 400. Solder resist ink pattern structure; 410. Solder resist ink pattern; 500. Copper surface transfer structure; 510. Insulating dielectric layer; 600. Circuit pattern etching structure; 1130. Circuit pattern layer; 700. High-precision circuit board; 710. Surface treatment layer.

[0033] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0036] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] Please see Figure 1 ; Figure 1This is a process flow diagram of the manufacturing method according to an embodiment of the present invention.

[0038] The method for manufacturing a high-precision circuit board according to embodiments of the present invention includes: Figure 1 The process flow, including the manufacturing process, is as follows. Please refer to the following text for details.

[0039] Please see Figure 2 ; Figure 2 A cross-sectional schematic diagram showing the formation of a graphic transfer structure for an embodiment of the present invention.

[0040] Step S10:

[0041] Take a thick copper layer 110, attach a micro-adhesive film layer 120 to one side of the thick copper layer 110, attach a dry film to the other side of the thick copper layer 110, and form a dry film pattern layer 140. The whole process forms a pattern transfer structure 100.

[0042] In this embodiment, through a "reverse" pattern processing and transfer method, the thick copper layer 110 can form a copper thickness base for the half-circuit layer 1110 and the half-copper layer 1120 during subsequent processing. The attached micro-adhesive film layer 120 can provide good support for the thick copper layer 110, forming a "pseudo" copper clad laminate structure, and preventing the thick copper layer 110 from bending, creases, pulling, tearing and other problems during processing.

[0043] In this embodiment, the thickness of the thick copper layer 110 is 50 μm to 350 μm, preferably 50 μm, 75 μm, or 100 μm.

[0044] The circuit boards are all manufactured based on the design data from the computer. The thick copper layer 110 in this embodiment is equivalent to thickening the copper layer of the prior art. Due to the use of the "reverse" processing process, the subsequent processing forms a half-circuit layer 1110 and a half-copper layer 1120. In fact, the thickness of the half-circuit layer 1110 is the thickness of the circuit pattern layer 1130 that needs to be formed in the end. Therefore, a portion of the copper thickness needs to be reserved during the processing to make the half-copper layer 1120. Therefore, a copper layer with a thicker copper thickness than that of the prior art method needs to be used, and it needs to be matched to the actual application process.

[0045] In this embodiment, the micro-adhesive layer 120 may be an acrylic micro-adhesive layer or an epoxy resin micro-adhesive layer. It is non-adhesive at room temperature and is applied to the board surface by high temperature and high pressure. It is resistant to acids and alkalis and high temperature (generally resistant to high temperature ≤200℃). It is a film that can be effectively peeled off. The micro-adhesive layer 120 can play a good supporting role during the processing and can be easily peeled off after processing.

[0046] In this embodiment, after the micro-adhesive layer 120 is attached, a support layer 130 is attached to one side of the micro-adhesive layer 120; before subsequently peeling off the micro-adhesive layer 120, the support layer 130 is peeled off first.

[0047] In this embodiment, the support layer 130 is an FR-4 sheet layer, a polytetrafluoroethylene layer, a polyimide layer, or an epoxy resin layer.

[0048] Preferably, the thickness of the support layer 130 is 50 μm to 1.0 mm, depending on the actual processing requirements.

[0049] When the selected thick copper layer 110 is relatively thin (e.g., 50μm to 105μm), if only the micro-adhesive layer 120 is attached, and the micro-adhesive layer 120 is also relatively thin (generally ≤100μm thick), problems such as bending and creases are still likely to occur. A support layer 130 can be used to further strengthen its structure. Generally, a commonly used board material is selected that can adhere to the micro-adhesive layer 120 and has compatibility with the circuit board body material. Furthermore, the support layer 130 can further protect the micro-adhesive layer 120 and prevent problems such as delamination during processing.

[0050] In this embodiment, the dry film is a high-resolution dry film with a line width / line spacing ≤ 15μm / 15μm; the dry film pattern layer 140 is formed by exposing the dry film with an LDI exposure machine and then developing it.

[0051] Using high-resolution dry film ensures high-precision processing of circuit patterns during pattern transfer. Combined with the direct laser imaging exposure of the LDI exposure machine, it effectively improves exposure accuracy and avoids problems such as light scattering and secondary exposure errors caused by film exposure.

[0052] Please see Figure 3 ; Figure 3 A cross-sectional schematic diagram showing the formation of a half-circuit pattern structure for an embodiment of the present invention.

[0053] Step S20:

[0054] The pattern transfer structure 100 is etched for the first time, removing part of the thick copper layer 110 to form a half-circuit layer 1110 and a half-copper layer 1120. Then, the film is removed to form the half-circuit pattern structure 200.

[0055] The thickness of the semi-circuit layer 1110 is the same as the thickness of the final circuit pattern layer 1130. The semi-copper layer 1120 provides overall support for the semi-circuit layer 1110 during processing, preventing the semi-circuit layer 1110 from scattering or tilting during subsequent screen printing of solder resist ink 310 and other processing.

[0056] In this embodiment, the thickness of the half-copper layer 1120 is 5 μm to 50 μm, preferably 10 μm, 15 μm, or 20 μm.

[0057] Since the half-copper layer 1120 only serves to connect the half-circuit layer 1110 as a whole, and needs to be completely etched away in the subsequent second etching, the thickness of the half-copper layer 1120 should not be too thick. Otherwise, problems such as difficulty in etching quickly in the second etching, uneven etching, and material waste may occur.

[0058] Please see Figure 4 and Figure 5 ; Figure 4 A cross-sectional schematic diagram showing the formation of a solder resist ink screen printing structure according to an embodiment of the present invention; Figure 5 A cross-sectional schematic diagram showing the formation of a solder resist ink pattern structure according to an embodiment of the present invention.

[0059] Step S30:

[0060] Please see Figure 4 Solder resist ink 310 is screen-printed on one side of the half-circuit layer 1110 to fill the gaps in the circuit pattern of the half-circuit layer 1110, forming a solder resist ink screen-printed structure 300; please refer to Figure 5 The solder resist ink screen printing structure 300 is baked and cured, and then polished. The solder resist ink 310 is polished to form a solder resist ink pattern 410, and the whole is formed into a solder resist ink pattern structure 400.

[0061] Since the first etching forms a half-circuit layer 1110, the etched area forms a groove pattern (that is, the gap of the subsequent circuit pattern layer 1130). At this time, solder resist ink 310 is directly screen-printed onto the surface, that is, the groove is filled with solder resist ink 310, and after baking, curing and polishing, a solder resist ink pattern 410 is formed. The whole process does not need to consider the screen printing thickness, screen printing accuracy and screen printing coverage area of ​​solder resist ink 310. It is only necessary to ensure that the solder resist ink 310 and the groove are completely filled without voids or bubbles. There is no need to perform alignment and exposure processing, which greatly improves the processing accuracy of solder resist ink pattern 410.

[0062] It is worth noting that when screen printing solder resist ink 310, a dotted screen printing method can be used to improve the accuracy of the solder resist ink 310 screen printing. After the solder resist ink 310 is screen printed, the solder resist ink screen printing structure 300 can be placed in a vacuum chamber for vacuuming, or placed in a micro-vibration device for micro-vibration processing, so as to effectively remove any air bubbles that may be hidden in the solder resist ink 310, and ensure that the solder resist ink 310 and the groove are completely filled without voids or air bubbles.

[0063] In this embodiment, the baking curing is performed by baking at a temperature of 70°C to 80°C for 40 to 50 minutes, followed by baking at a temperature of 100°C to 125°C for 60 to 180 minutes.

[0064] If a high temperature is used for baking directly, the outer layer ink may cure too quickly, affecting the curing effect of the inner ink. Therefore, a method of low-temperature pre-baking followed by high-temperature baking is used to achieve a uniform and slow curing process for the ink.

[0065] Please see Figure 6 ; Figure 6 A cross-sectional schematic diagram showing the formation of the copper surface transfer structure according to an embodiment of the present invention.

[0066] Step S40:

[0067] An insulating dielectric layer 510 is pressed onto one side of the solder resist pattern 410 of the solder resist pattern structure 400, and then the micro-adhesive film layer 120 is peeled off to form a copper surface transfer structure 500.

[0068] Optionally, if a support layer 130 is provided, the support layer 130 is peeled off before the micromolecular layer 120 is peeled off.

[0069] The laminated insulating dielectric layer 510 is the dielectric layer required by the circuit board itself. In this embodiment, the "reverse" processing process of first making the circuit and ink and then laminating the insulating dielectric layer 510 is achieved. This step realizes the process of transferring the copper surface from one side to the other side. The overall processing achieves the effect of one-time high-precision processing of the circuit pattern layer 1130 and the solder resist ink pattern 410.

[0070] In this embodiment, the insulating dielectric layer 510 is a prepreg or a polyimide cover film.

[0071] The material of the insulating dielectric layer 510 can be selected according to the actual situation. Generally, epoxy resin composite glass fiber material is used. If a flexible circuit board is required in the end, polyimide cover film material can be used.

[0072] Alternatively, the prepreg is a high-flow prepreg with an adhesive content of 65% to 75%.

[0073] High-adhesive-content prepreg exhibits stronger adhesion and better flowability during high-temperature and high-pressure pressing, enabling it to form a good bond with the solder resist ink graphic structure 400. This prevents poor adhesion from causing cracks, delamination, or even board bursting during subsequent applications.

[0074] Further optionally, the prepreg is formed by stacking a high-flow prepreg and a low-flow prepreg, wherein the high-flow prepreg faces the solder resist pattern 410; the low-flow prepreg has an adhesive content of 50% to 60%; preferably, the thickness of the high-flow prepreg is 10 μm to 50 μm.

[0075] If the board needs to have strong rigidity and stable expansion and contraction performance, a low-flow prepreg is required as the insulating medium layer 510. However, the low-flow prepreg has a low adhesive content, and the bonding force between it and the solder resist pattern structure 400 after lamination is weak. Therefore, a high-flow prepreg is placed between the solder resist pattern structure 400 and the low-flow prepreg to improve the bonding force between the layers.

[0076] In this embodiment, the insulating dielectric layer 510 is laminated by performing plasma activation processing on the solder resist ink pattern structure 400, followed by browning treatment, and then laminating the insulating dielectric layer 510; the heating rate of the lamination is 1.5℃ / min to 2.5℃ / min, and the lamination time is ≥20 minutes under the highest temperature condition of the lamination material.

[0077] When laminating the insulating dielectric layer 510, since there are semi-circuit layer 1110 and solder resist ink pattern 410 on the surface, which are copper material and solder resist ink 310 material respectively, plasma activation treatment is first used to make the solder resist ink pattern 410 form a uniform and rough activated surface. Then, browning treatment is used to make the semi-circuit layer 1110 form a uniform and rough surface, providing high-reliability lamination processing conditions for lamination.

[0078] In this pressing method, the heating rate of the pressing is 1.5℃ / min to 2.5℃ / min, and the pressing time is ≥20 minutes under the highest temperature condition of the pressing material, preferably 23 minutes, 25 minutes, or 30 minutes.

[0079] The process of laminating the insulating dielectric layer 510 generally relies on three main parameters: temperature, time, and pressure. The lamination curve is generally a process of "heating and pressurizing → maintaining the highest temperature and pressure → cooling and depressurizing". In this embodiment, due to the "reverse" processing, the insulating dielectric layer 510 is laminated to the surface of the solder resist ink pattern structure 400. To ensure the lamination effect and guarantee the interlayer bonding force, a slow heating method is adopted in the "heating and pressurizing" stage. This allows the insulating dielectric layer 510 to fully transform from a glassy state to a rubbery state, that is, to enable the insulating dielectric layer 510 to form better fluidity and adhesion, thereby improving the interlayer bonding force after lamination. After reaching the highest temperature, the lamination time is ≥20 minutes under the highest temperature condition of the lamination material. That is, a relatively long lamination time at the highest temperature is selected, which can further improve the adhesion between the insulating dielectric layer 510 and the solder resist ink pattern structure 400, thereby improving the interlayer bonding force.

[0080] Since the insulating dielectric layer 510 is made of different materials depending on the actual application requirements, the maximum pressing temperature is not a fixed or limited parameter, and is set according to the material conditions.

[0081] Please see Figure 7 and Figure 8 ; Figure 7 A cross-sectional schematic diagram showing the formation of a circuit pattern etching structure for an embodiment of the present invention; Figure 8 This is a cross-sectional schematic diagram of a high-precision circuit board fabricated according to an embodiment of the present invention.

[0082] Step S50:

[0083] The copper transfer structure 500 is etched a second time to remove the half copper layer 1120, forming the circuit pattern layer 1130, forming the circuit pattern etched structure 600, and then surface treated to form the surface treatment layer 710, forming the high-precision circuit board 700.

[0084] As can be seen, the second etching is a direct etching of the half-copper layer 1120, which is an additional copper layer. Therefore, there is no need to use the pattern transfer method during etching (i.e., there is no need to use the dry film application → exposure → etching → development → film removal process). Thus, the alignment and exposure will not affect the circuit pattern layer 1130. The surface treatment layer 710 can effectively improve the conductivity, oxidation resistance, wear resistance and high precision performance of the circuit pattern layer 1130.

[0085] In this embodiment, before surface treatment, the etched circuit pattern structure 600 is baked at a temperature of 120°C to 135°C for 30 to 60 minutes to completely remove internal stress within the board and make the board more dimensionally stable during application.

[0086] In summary, this embodiment first fabricates a half-circuit layer 1110 by taking a thicker copper layer 110 than the circuit pattern in the design data, and then directly fabricates the solder resist pattern 410 and transfers it onto the insulating dielectric layer 510. Through reverse processing, a high-precision circuit board 700 is formed. In this process, a micro-adhesive film layer 120 is used to support the half-circuit layer 1110 and the solder resist pattern 410. The entire processing only requires one dry film alignment and exposure, which greatly improves the circuit processing accuracy. The solder resist pattern 410 does not need to be aligned or exposed, and there will be no irregular edges or side etching phenomena. Moreover, the solder resist pattern 410 is formed to fill the gaps between the circuits, and there are no tiny gaps between it and the circuit pattern. The overall processing accuracy is high, and the processing flow is efficient and convenient. It can produce high-precision circuit boards with pad and solder resist pattern 410 accuracy requirements of ±5μm.

[0087] It is worth noting that the high-precision circuit board 700 of this embodiment can also be used to further fabricate a multi-layer circuit board structure. That is, prepare more than two circuit pattern etched structures 600, and take a number of adhesive layer semi-cured sheets and arrange the circuit pattern etched structures 600 and a number of semi-cured sheets alternately in the layout of a multi-layer circuit board. Then, press them together, and then perform drilling, electroplating, outer layer patterning and other processing to form a multi-layer circuit board.

[0088] It is worth noting that, due to the precision of the circuit board design and manufacturing process, the actual structure and dimensions of each layer, such as the thickness and line width, are at the micrometer level. If the accompanying drawings are made according to the enlarged scale of the actual structure, the illustrations will be unclear. Therefore, in order to more clearly and intuitively show the implementation process of the manufacturing method of this embodiment, the accompanying drawings of this embodiment are all enlarged schematic diagrams of the technical features, and do not represent the actual size of the structure, nor are they enlarged diagrams of the actual structure at the same scale.

[0089] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural transformations made using the contents of the specification and drawings of the present invention under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of the present invention.

Claims

1. A method for manufacturing a high-precision circuit board based on material conversion, characterized by, The manufacturing method comprises the following steps: S10: taking a thick copper layer, the thickness of the thick copper layer is 50-350 μm; attaching a micro-adhesive film layer to one side of the thick copper layer, then attaching a support layer to one side of the micro-adhesive film layer, attaching a dry film to the other side of the thick copper layer, and manufacturing a dry film pattern layer, thus manufacturing a pattern transfer structure as a whole; S20: performing first etching on the pattern transfer structure to etch away part of the thickness of the thick copper layer, thus forming a semi-circuit layer and a semi-copper layer, then performing film stripping, thus forming a semi-circuit pattern structure as a whole; the thickness of the semi-copper layer is 5-50 μm; S30: silk printing a solder resist ink to one side of the semi-circuit layer to fill the gaps of the circuit pattern of the semi-circuit layer, then baking and curing, and polishing, the solder resist ink forms a solder resist ink pattern after polishing, thus forming a solder resist ink pattern structure as a whole; S40: pressing an insulating medium layer to one side of the solder resist ink pattern of the solder resist ink pattern structure, then stripping the support layer, and then stripping the micro-adhesive film layer, thus forming a copper surface transfer structure; the insulating medium layer is a prepreg or a polyimide cover film, the prepreg is formed by stacking a high-flow prepreg and a low-flow prepreg, and the high-flow prepreg faces the solder resist ink pattern; the low-flow prepreg has a glue content of 50-60%; the pressing of the insulating medium layer is performed after plasma activation processing and brown processing of the solder resist ink pattern structure; S50: performing second etching on the copper surface transfer structure to etch away the semi-copper layer, thus forming a circuit pattern layer and performing surface treatment, thus forming the high-precision circuit board.

2. The method of claim 1, wherein the material conversion is based on a high-precision circuit board. The support layer is an FR-4 plate layer, a polytetrafluoroethylene layer, a polyimide layer, or an epoxy resin layer.

3. The method of claim 1, wherein the material conversion is performed by a laser beam. The dry film has a line width / line spacing of ≤15 μm / 15 μm; the manufacturing of the dry film pattern layer is performed by exposing the dry film to light using an LDI exposure machine, and then developing.

4. The method of claim 1, wherein the material conversion is performed by a laser beam. The baking and curing are performed by baking at a temperature of 70-80 °C for 40-50 minutes, and then baking at a temperature of 100-125 °C for 60-180 minutes.

5. The method for manufacturing a high-precision circuit board based on material transfer as described in claim 1, characterized in that, The pressing has a temperature rising rate of 1.5-2.5 °C / min, and the pressing time at the maximum temperature of the material is ≥20 min.

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