Temperature equalizing structure based on densely-piled dot matrixes and integrated manufacturing method of temperature equalizing structure
Through densely stacked dot matrix structures and SLM additive manufacturing technology, the problem of insufficient heat transfer performance and response speed of satellite temperature equalization boards is solved, and an efficient and low-cost satellite thermal control solution is realized, which is suitable for the temperature equalization needs of high-integrated satellites.
Patent Information
- Application Number
- CN202510384644.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2025-07-08
AI Technical Summary
The heat transfer performance and response speed of the existing satellite temperature equalization board are insufficient, which cannot meet the thermal control needs of high-integrated satellites. In addition, traditional solutions have problems such as huge system, high cost and poor reliability.
Using densely stacked dot matrix structure and combined with SLM additive manufacturing technology, a temperature-simultaneous structure based on densely stacked dot matrix is designed, including an outer shell, a temperature-intensive stacked dot matrix capillary layer and a pressure-bearing capillary layer, which can achieve rapid heat transfer through the evaporation and condensation of liquid thermally controlled working fluid.
It achieves efficient heat conduction and rapid response, meets the temperature uniformity requirements of high-integration satellites, is simple and easy to operate and low cost, and is suitable for large-scale production.
Smart Images
Figure CN120282413A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a temperature - equalizing structure based on a densely - packed lattice and an integrated manufacturing method thereof, belonging to the technical field of additive manufacturing of metal functional structures. Background Art
[0002] With the continuous progress of technology, satellite thermal control technology has developed rapidly. Among them, the satellite heat pipe, as an important thermal control component, can effectively control the temperature distribution inside the satellite, ensure the normal operation of each component of the satellite, and its heat transfer performance is crucial for the stable operation of important satellite payloads. At present, with the increase in the heat flux density of the core payload of high - integration satellites and the inherent requirement of the miniaturization of the whole satellite, the heat transfer performance index of the satellite heat pipe is also constantly improving. In addition, the satellite heat pipe should also have high reliability and stability, and be able to withstand various extreme conditions in the space environment, such as high and low temperatures, radiation, etc.
[0003] Traditional thermal control solutions often adopt schemes such as main / passive loop systems, phase - change energy - storage devices, powder - metallurgy cold plates, etc. Among them: (1) Traditional real - time dissipation main / passive loop systems have problems such as a large system scale, high interfacial thermal resistance, low one - dimensional heat transfer efficiency, and slow response. (2) Traditional phase - change energy - storage devices have bottlenecks such as low heat storage capacity and low conversion efficiency, and cannot achieve high - heat - flux and fast response. (3) Traditional powder - metallurgy cold plates have problems such as low sintering strength of porous capillary core materials, difficult porosity regulation, poor designability of capillary pore configurations, and insufficient heat storage capacity. Summary of the Invention
[0004] The technical problem solved by this application is: overcoming the deficiencies of the prior art, providing a temperature - equalizing structure based on a densely - packed lattice, and realizing an integrated additive manufacturing method for the temperature - equalizing structure of the densely - packed lattice.
[0005] The temperature - equalizing structure based on a densely - packed lattice prepared by the method of the present invention has higher heat conduction efficiency and response speed, and can better meet the temperature - equalizing requirements of high - integration satellite structures. At the same time, this method is simple and easy to operate, has low cost, can be mass - produced, and provides new possibilities for the development of satellite thermal control technology.
[0006] The technical solution provided by this application is as follows:
[0007] In the first aspect, a temperature - equalizing structure based on a densely - packed lattice is provided, including:
[0008] An outer shell, including an upper panel, a lower panel and side panels, the side panels are connected between the upper panel and the lower panel to make the outer shell form a closed structure, and there is a thermal control working medium inside;
[0009] The uniform-temperature densely packed lattice capillary layer is a lattice structure composed of multiple cells, with two layers provided. The two uniform-temperature densely packed lattice capillary layers are respectively connected to one side of the upper panel facing the lower panel and one side of the lower panel facing the upper panel;
[0010] The uniform-temperature densely packed lattice pressure-bearing capillary layer is a lattice structure composed of multiple cells, and is connected between the two uniform-temperature densely packed lattice capillary layers;
[0011] The internal cavity is the space inside the outer shell between the two uniform-temperature densely packed lattice capillary layers.
[0012] Further, the outer shell is formed by an aluminum alloy skin with a wall thickness of 1.0 - 2.0 mm and can withstand an internal pressure of 1 - 3 MPa formed after the evaporation of the liquid thermal control working medium.
[0013] Further, the thickness of the uniform-temperature densely packed lattice capillary layer is 3 - 6 mm.
[0014] Further, the uniform-temperature densely packed lattice pressure-bearing capillary layer is a cylindrical structure with a diameter of Φ10 - 15 mm; the uniform-temperature densely packed lattice pressure-bearing capillary layer occupies less than 40% of the volume of the gap space.
[0015] Further, the pore size of the uniform-temperature densely packed lattice capillary layer is 20 μm - 30 μm, and the porosity is 40% - 80%.
[0016] Further, the cell size of the uniform-temperature densely packed lattice capillary layer is 2 mm - 4 mm, and the cell rod diameter is 0.4 - 0.6 mm.
[0017] Further, the pore size of the uniform-temperature densely packed lattice pressure-bearing capillary layer is 15 μm - 20 μm, and the porosity is 20% - 40%.
[0018] Further, the cell size of the uniform-temperature densely packed lattice pressure-bearing capillary layer is 2 mm - 4 mm, and the cell rod diameter is 0.6 - 1 mm.
[0019] In a second aspect, an integrated manufacturing method for a uniform-temperature structure based on a densely packed lattice is provided, including:
[0020] S1: Determine the uniform-temperature structure model based on the load-bearing requirements, temperature distribution requirements, geometric shape and size, as well as material properties and structural forms of the uniform-temperature structure;
[0021] S2: Check the uniform-temperature structure model to ensure that its actual performance meets the expected design;
[0022] S3: Design the SLM additive manufacturing process for the verified temperature-equalizing structure model, and form the temperature-equalizing structure according to the SLM additive manufacturing process design to obtain a heat pipe.
[0023] S4: Perform corresponding post-treatment and heat treatment on the heat pipe to obtain a post-treated heat pipe.
[0024] S5: Weld and block the liquid filling pipe of the post-treated heat pipe, and perform leak detection. After passing the detection, fill the heat control working medium through the liquid filling pipe.
[0025] S6: Weld and seal the liquid filling pipe, and remove the excess on the outer side of the heat pipe.
[0026] S7: Perform surface treatments such as conductive anodic oxidation on the outer surface of the heat pipe.
[0027] Further, the SLM additive manufacturing process design includes: adding rounded corners at the stress concentration positions of the temperature-equalizing structure model, adding liquid filling pipe interfaces for the liquid heat control working medium, the size of the liquid filling pipe interface being an outer diameter of Φ6mm, an inner diameter of Φ3mm, and a length of 8mm, and adding welding and sealing margins.
[0028] The heat pipes are closely arranged in space through a lattice to form a porous temperature-equalizing structure with controllable pore space distribution and scale. The dense stacked lattice is located inside the sealed housing of the heat pipe. The adsorbed liquid working medium evaporates into a gas when heated, flows to the condensation side under the drive of the pressure difference, condenses into a liquid, and then returns to the evaporation area through the dense stacked lattice porous temperature-equalizing structure, so as to realize the spontaneous and efficient transfer of heat in a cycle. The rapid heat conduction in the horizontal two-dimensional direction is realized through lattice capillarity, and the rapid heat conduction of the upper and lower panels can be realized through pressure-bearing capillarity, so as to realize rapid heat conduction in the three-dimensional direction and have a fast response speed.
[0029] In summary, the present application at least includes the following beneficial technical effects:
[0030] (1) Through the structural design of the dense stacked lattice, a temperature-equalizing structure based on the dense stacked lattice is realized, which has higher heat conduction efficiency and can better meet the temperature-equalizing requirements of high-integration satellite structures.
[0031] (2) Based on the SLM forming process method, an integrated manufacturing method for the temperature-equalizing structure based on the dense stacked lattice can be realized, which is simple and easy to operate, has low cost, and the reliability and stability of manufacturing are greatly improved, and large-scale production can be realized. Description of the Drawings
[0032] Figure 1 Schematic diagram of the temperature-equalizing structure of the dense stacked lattice.
[0033] Description of the reference numerals in the drawings: 1 - outer housing, 2 - isothermal densely packed lattice capillary layer, 3 - isothermal densely packed lattice pressure-bearing capillary layer, 4 - internal cavity, 5 - densely packed lattice cell. Detailed implementation manners
[0034] To make the objectives, technical solutions and advantages of the present invention clearer, the following will further describe in detail the disclosed implementation manners of the present invention with reference to the drawings.
[0035] The embodiment of the present application discloses a temperature-equalizing structure based on a densely packed lattice, as Figure 1 shown, which includes an outer housing 1, an isothermal densely packed lattice capillary layer 2, an isothermal densely packed lattice pressure-bearing capillary layer 3, and an internal cavity 4.
[0036] The outer housing 1 includes an upper panel, a lower panel, and side panels. The side panels are connected between the upper panel and the lower panel to make the outer housing 1 form a closed structure. The outer housing 1 is a closed structure formed by an aluminum alloy skin with a wall thickness of 1.0 - 2.0 mm, which prevents the internal thermal control working medium from leaking and can withstand an internal pressure of 1 - 3 MPa formed after the evaporation of the liquid working medium.
[0037] The uniform-temperature densely-packed lattice capillary layer 2 serves as a liquid working medium channel and is generally attached to the inner sides of the upper and lower panels of the outer casing 1, with a typical thickness of 3 - 6 mm; there is a gap between the two uniform-temperature densely-packed lattice capillary layers 2; a plurality of uniform-temperature densely-packed lattice pressure-bearing capillary layers 3 are evenly connected between the two uniform-temperature densely-packed lattice capillary layers 2. The uniform-temperature densely-packed lattice pressure-bearing capillary layer 3 serves as a load-bearing columnar structure between the upper and lower panels. The uniform-temperature densely-packed lattice pressure-bearing capillary layer 3 occupies less than 40% of the gap space volume. The typical column diameter of the uniform-temperature densely-packed lattice pressure-bearing capillary layer 3 is Φ10 - 15 mm, and its pores take into account the transmission function of the liquid working medium in the lattice capillaries near the upper and lower panels to the upper and lower panels; the distribution density of the uniform-temperature densely-packed lattice pressure-bearing capillary layer 3 is determined according to the load-bearing requirements. The typical unit cells of the uniform-temperature densely-packed lattice capillary layer 2 and the uniform-temperature densely-packed lattice pressure-bearing capillary layer 3 are configurations such as BCC, BCC-Z, Dodecahedron, BCC-ZH, BCC-H, etc. Among them, the unit cell size of the uniform-temperature densely-packed lattice capillary layer 2 varies from 2 mm to 4 mm, the unit cell rod diameter varies from 0.4 to 0.6 mm, the pore size formed varies from 20 μm to 30 μm, and the porosity varies from 40% to 80%; the unit cell size of the uniform-temperature densely-packed lattice pressure-bearing capillary layer 3 varies from 2 mm to 4 mm, the unit cell rod diameter varies from 0.6 to 1 mm, the pore size formed varies from 15 μm to 20 μm, and the porosity varies from 20% to 40%. The gap between the uniform-temperature densely-packed lattice capillary layers 2 forms an internal cavity 4 after removing the space occupied by the uniform-temperature densely-packed lattice pressure-bearing capillary layer 3. The internal cavity 4 is the gas channel after the liquid working medium evaporates. The technical principle is as follows: The heat of the heating component installed on the outer casing 1 is conducted through the outer casing 1 to the liquid working medium contained in the lattice capillary core. The liquid working medium absorbs heat and evaporates into gas. The gaseous working medium flows to the distal low-temperature area under the action of the pressure difference in the internal cavity and condenses into liquid at the distal end. The liquid flows back to the heat source under the driving of the capillary action of the capillary core, forming an internal cycle of the thermal control working medium and conducting away the heat.
[0038] An integrated manufacturing method for a uniform-temperature structure based on a densely-packed lattice is as follows:
[0039] Step 1: Based on the load-bearing requirements of the heat pipe, design a suitable micro-lattice support structure, such as micro-lattice beams, columns, etc., according to the geometric shape and size of the structural plate to ensure the load-bearing stability of the capillary uniform-temperature structural plate.
[0040] Step 2: Based on the temperature distribution requirements of the heat pipe, calculate the temperature distribution and temperature change rate according to the material properties and structural form of the structural plate. According to the calculation results, design the lattice capillaries and pressure-bearing capillaries of the structural plate to build a porous uniform-temperature structure with suitable pore sizes and porosities.
[0041] Step 3: Check the thermal design and mechanism design of the structural plate by experimentally measuring parameters such as temperature distribution, heat flux, and pressure resistance coefficient to ensure that its actual performance meets the expected design requirements. The layer thickness of the uniform-temperature densely stacked lattice capillary layer 2 is determined according to the required heat capacity; the porosity of the uniform-temperature densely stacked lattice capillary layer 2 is determined according to the required heat transfer rate;
[0042] Step 4: Conduct SLM additive manufacturing process design on the verified heat pipe design model, such as adding fillets to the stress concentration positions, adding liquid working medium filling tube interfaces (typical dimensions are outer diameter Φ6mm, inner diameter Φ3mm, and length 8mm), adding friction stir welding sealing margins (typical margin 1 - 2mm), etc., to meet the requirements of SLM forming manufacturing of the heat pipe and subsequent integrated processing and forming.
[0043] Step 5: After completing the SLM forming manufacturing process, perform corresponding post-treatment and heat treatment on the heat pipe to remove excess slag and residual supports. The typical heat treatment system for aluminum alloy is a temperature of 280 - 300°C and a time of 2h - 4h.
[0044] Step 6: Weld and block the filling tube, and perform helium mass spectrometry leak detection (leak rate < 10 -8 Pa·s). After passing the inspection, fill the ammonia working medium.
[0045] Step 7: Perform welding and sealing through friction stir welding, and machine-process to remove the outer margin of the heat pipe.
[0046] Step 8: Perform surface treatments such as conductive anodic oxidation on the outer surface of the heat pipe.
[0047] Step 9: Test the performance of the additively manufactured heat pipe structure, including tests on mechanical properties, thermal properties, etc., to ensure that it meets the design requirements.
[0048] The content not described in detail in the specification of this application belongs to the well-known technology of those skilled in the art.
[0049] The above has described this application in detail in combination with specific embodiments and exemplary examples, but these descriptions should not be construed as limiting this application. Those skilled in the art understand that without departing from the spirit and scope of this application, various equivalent replacements, modifications, or improvements can be made to the technical solutions of this application and their implementation manners, and these all fall within the scope of this application. The protection scope of this application is subject to the appended claims.
Claims
1. A temperature equalizing structure based on a densely packed dot matrix, characterized in that, Comprising: An outer housing (1), including an upper panel, a lower panel, and side panels. The side panels are connected between the upper panel and the lower panel to form a closed structure for the outer housing (1), and there is a thermal control working fluid inside. A uniform temperature densely packed lattice capillary layer (2), which is a lattice structure composed of multiple cells. There are two layers, and the two uniform temperature densely packed lattice capillary layers (2) are respectively connected to one side of the upper panel facing the lower panel and one side of the lower panel facing the upper panel. A uniform temperature densely packed lattice pressure-bearing capillary layer (3), which is a lattice structure composed of multiple cells and is connected between the two uniform temperature densely packed lattice capillary layers (2). An internal cavity (4), which is the space inside the outer housing (1) located between the two uniform temperature densely packed lattice capillary layers (2).
2. The uniform temperature structure based on a densely packed lattice according to claim 1, characterized in that: The outer housing (1) is formed by an aluminum alloy skin with a wall thickness of 1.0 - 2.0 mm and can withstand an internal pressure of 1 - 3 MPa formed after the evaporation of the liquid thermal control working fluid.
3. The uniform temperature structure based on densely packed lattices according to claim 1, characterized in that: The thickness of the uniform temperature densely packed lattice capillary layer (2) is 3 - 6 mm.
4. A temperature equalizing structure based on a densely packed lattice according to claim 1, characterized in that: The uniform temperature densely packed lattice pressure-bearing capillary layer (3) is a cylindrical structure with a diameter of Φ10 - 15 mm; the uniform temperature densely packed lattice pressure-bearing capillary layer (3) occupies less than 40% of the volume of the gap space.
5. A temperature equalizing structure based on a densely packed lattice according to claim 1, characterized in that: The pore size of the uniform temperature densely packed lattice capillary layer (2) is 20 μm - 30 μm, and the porosity is 40% - 80%.
6. The isothermal structure based on densely packed lattices according to claim 5, wherein: The cell size of the uniform temperature densely packed lattice capillary layer (2) is 2 mm - 4 mm, and the cell rod diameter is 0.4 - 0.6 mm.
7. A temperature equalizing structure based on a densely packed lattice according to claim 1, characterized in that: The pore size of the uniform temperature densely packed lattice pressure-bearing capillary layer (3) is 15 μm - 20 μm, and the porosity is 20% - 40%.
8. The uniform temperature structure based on a densely packed lattice according to claim 7, characterized in that: The cell size of the uniform temperature densely packed lattice pressure-bearing capillary layer (3) is 2 mm - 4 mm, and the cell rod diameter is 0.6 - 1 mm.
9. An integrated manufacturing method of a temperature equalizing structure based on a densely packed lattice according to any one of claims 1-8, characterized in that, Comprising: S1: Based on the load-bearing requirements of the uniform temperature structure, temperature distribution needs, geometric shape and size, as well as material properties and structural forms, determine the uniform temperature structure model. S2: Check the uniform temperature structure model to ensure that its actual performance meets the expected design. S3: Conduct SLM additive manufacturing process design on the checked uniform temperature structure model, and form the uniform temperature structure according to the SLM additive manufacturing process design to obtain a heat pipe. S4: Conduct corresponding post-treatment and heat treatment on the heat pipe to obtain a treated heat pipe. S5: Weld and block the liquid filling pipe of the treated heat pipe, and conduct leak detection. After passing the detection, fill the thermal control working fluid through the liquid filling pipe. S6: Weld and seal the liquid filling pipe, and remove the excess on the outside of the heat pipe. S7: Conduct surface treatments such as conductive anodic oxidation on the outer surface of the heat pipe.
10. An integrated manufacturing method of a temperature equalizing structure based on a densely packed lattice according to claim 9, characterized in that, The SLM additive manufacturing process design includes: adding rounded corners at the stress concentration positions of the uniform temperature structure model, adding liquid filling pipe interfaces for the liquid thermal control working fluid. The size of the liquid filling pipe interface is an outer diameter of Φ6 mm, an inner diameter of Φ3 mm, and a length of 8 mm, and adding welding and sealing allowances.