Transparent display screen, preparation method thereof and head-mounted display equipment
By forming a driving unit and a light emitting unit on the substrate of a transparent display screen, and using a combination of a silicon substrate and a light-transmitting layer, the problem of insufficient brightness and resolution in the prior art is solved, and a transparent display effect with high brightness and high resolution is achieved.
Patent Information
- Application Number
- CN202311839981.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2025-07-08
AI Technical Summary
Existing microdisplays cannot achieve high brightness and high image resolution at the same time, silicon-based backplanes cannot achieve transparency, low-temperature polysilicon backplanes have low mobility and insufficient machining accuracy.
The driving unit and the light emitting unit are respectively formed on the first substrate and the second substrate, and the driving back plate and the display back plate are formed by filling the light transmitting layer to remove the non-light transmitting part, and a silicon substrate is used to achieve a high mobility and a small size driving unit, and a driving unit and a light emitting unit are made in combination with a semiconductor process.
The high brightness and high image resolution of the transparent display are achieved. The driving unit provides a large driving current and the light emitting unit reaches a smaller size, which improves the overall performance of the transparent display.
Smart Images

Figure CN120282626A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of display technologies, and particularly to a transparent display screen and a method for manufacturing the same. The present invention also relates to a head-mounted display device. Background Art
[0002] Light Emitting Diode (LED) display technology has been widely applied in fields such as Virtual Reality (VR) and Augmented Reality (AR) due to its advantages of self-luminescence, wide color gamut, high stability, and the ability to achieve high brightness and high image resolution.
[0003] Due to the special application scenarios of transparent display technology, the display screen is required to have higher brightness, image resolution, and transmittance, which cannot be achieved simultaneously by existing micro display screens. To achieve high brightness, a large driving current is required, and high image resolution requires small-sized devices. Since a silicon-based backplane can achieve relatively high mobility and high processing accuracy, the silicon-based driving backplane is the optimal choice, but the silicon-based backplane cannot be made transparent. A Low Temperature Poly-Silicon (LTPS) backplane can achieve high transmittance, but due to its low mobility and only micron-level processing accuracy, it cannot achieve high brightness and high image resolution. Summary of the Invention
[0004] The objective of the present invention is to provide a transparent display screen and a method for manufacturing the same, which can have relatively high brightness and relatively high image resolution. The present invention also provides a head-mounted display device.
[0005] To achieve the above objective, the present invention provides the following technical solutions:
[0006] A method for manufacturing a transparent display screen, comprising:
[0007] Forming a driving unit and a first light-transmitting layer on one side surface of a first substrate, and the first light-transmitting layer is filled between the driving units to form a driving backplane;
[0008] Forming a light-emitting unit and a second light-transmitting layer on one side surface of a second substrate, and the second light-transmitting layer is filled between the light-emitting units to form a display backplane;
[0009] Bonding and fixing the side surface of the driving backplane where the driving unit is formed to the side surface of the display backplane where the light-emitting unit is formed, such that the light-emitting units and the driving units are in one-to-one correspondence;
[0010] Remove the non-light-transmitting portions of the first substrate other than the driving units and remove the non-light-transmitting portions of the second substrate other than the light-emitting units.
[0011] Optionally, the first substrate includes a first silicon layer;
[0012] Forming the driving units on one side surface of the first substrate and forming the first light-transmitting layer includes:
[0013] Form the driving units on the first silicon layer of the first substrate, and remove the first silicon layer in other regions except the regions where the driving units are located;
[0014] Form the first light-transmitting layer in other regions except the regions where the driving units are located on the first substrate.
[0015] Optionally, the first substrate includes a second silicon layer on a side away from the driving units;
[0016] The removing the non-light-transmitting portions of the first substrate other than the driving units includes:
[0017] Remove the second silicon layer of the first substrate;
[0018] Bond and fix one side surface of the driving backplane away from the driving units to the light-transmitting plate.
[0019] Optionally, the first substrate further includes a preset light-transmitting layer, and the preset light-transmitting layer is on a side of the second silicon layer close to the driving units;
[0020] The removing the second silicon layer of the first substrate includes:
[0021] Remove the second silicon layer by an etching method, wherein the preset light-transmitting layer is used as an etching barrier layer.
[0022] Optionally, bond and fix one side surface of the driving backplane away from the driving units to the light-transmitting plate by a bonding method.
[0023] Optionally, the removing the non-light-transmitting portions of the second substrate other than the light-emitting units includes: removing the second substrate from the display backplane.
[0024] Optionally, further include: forming a second electrode on one side surface of the display backplane where the second substrate is removed, and the second electrode corresponds to the light-emitting units.
[0025] Optionally, the bonding and fixing one side surface of the driving backplane where the driving units are formed to one side surface of the display backplane where the light-emitting units are formed includes:
[0026] Bond the side of the driving backplane forming the driving unit and the side of the display backplane forming the light-emitting unit together, and fix the driving backplane and the display backplane in a bonding manner through the first light-transmitting layer and the second light-transmitting layer.
[0027] Optionally, the bonding and fixing of the side of the driving backplane forming the driving unit and the side of the display backplane forming the light-emitting unit includes:
[0028] The driving unit includes a first metal layer, and the light-emitting unit includes a second metal layer. The driving unit and the light-emitting unit are electrically connected through the contact of the first metal layer and the second metal layer, and the first metal layer and the second metal layer are connected in a bonding manner.
[0029] Optionally, forming the light-emitting unit on one side of the second substrate includes:
[0030] Form an electron injection layer, a light-emitting layer, a hole injection layer, a first electrode layer, and the second metal layer on one side of the second substrate in sequence, and perform patterning to form the light-emitting unit.
[0031] A transparent display screen, comprising:
[0032] A driving backplane, at least including a driving unit and a first light-transmitting layer filled between the driving units;
[0033] A display backplane, at least including a light-emitting unit and a second light-transmitting layer filled between the light-emitting units;
[0034] The side of the driving backplane provided with the driving unit is bonded and fixed to the side of the display backplane provided with the light-emitting unit, and the light-emitting units and the driving units correspond to each other one by one.
[0035] Optionally, the side of the driving backplane provided with the driving unit is bonded to the side of the display backplane provided with the light-emitting unit, and the first light-transmitting layer and the second light-transmitting layer are connected in a bonding manner.
[0036] Optionally, the driving unit includes a first metal layer, the light-emitting unit includes a second metal layer, the first metal layer and the second metal layer are in contact to realize the electrical connection between the driving unit and the light-emitting unit, and the first metal layer and the second metal layer are connected in a bonding manner.
[0037] Optionally, it further includes:
[0038] A light-transmitting plate, and the side of the driving backplane away from the driving unit is fixed to the light-transmitting plate in a bonding manner.
[0039] A head-mounted display device includes an optical element and the transparent display screen described in any one of the above, wherein the optical element is disposed on a side of the display backplane of the transparent display screen away from the driving backplane.
[0040] As can be seen from the above technical solution, for a transparent display screen and a preparation method thereof provided by the present invention, the method includes: forming a driving unit and a first light-transmitting layer on one side surface of a first substrate, the first light-transmitting layer being filled between the driving units to form a driving backplane, and forming a light-emitting unit and a second light-transmitting layer on one side surface of a second substrate, the second light-transmitting layer being filled between the light-emitting units to form a display backplane, then bonding and fixing the side surface of the driving backplane where the driving units are formed to the side surface of the display backplane where the light-emitting units are formed, so that the light-emitting units and the driving units correspond to each other one by one, and further removing the non-light-transmitting portions of the first substrate except for the driving units and removing the non-light-transmitting portions of the second substrate except for the light-emitting units. For the transparent display screen and the preparation method thereof of the present invention, the first substrate and the second substrate can use silicon substrates, so that semiconductor processes can be used to form the driving units on the first substrate or form the light-emitting units on the second substrate, enabling the driving units and the light-emitting units to be made in relatively small sizes respectively, so that the display screen can have a high image resolution, and since the silicon substrate has a high mobility, the first substrate can use a silicon substrate, enabling the formed driving units to provide a large driving current, so that the display screen can have a high brightness. Therefore, the obtained transparent display screen can have a high brightness and a high image resolution.
[0041] A head-mounted display device provided by the present invention can achieve the above beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS
[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0043] Figure 1 It is a flowchart of a method for preparing a transparent display screen provided by an embodiment of the present invention;
[0044] Figure 2 It is a schematic longitudinal sectional view of a driving backplane obtained in a method for preparing a transparent display screen provided by an embodiment of the present invention;
[0045] Figure 3 It is a schematic longitudinal sectional view of a display backplane obtained in a method for preparing a transparent display screen provided by an embodiment of the present invention;
[0046] Figure 4Schematic longitudinal cross - sectional view of a transparent display screen obtained by a method for preparing a transparent display screen provided in an embodiment of the present invention.
[0047] Reference numerals in the accompanying drawings of the specification include:
[0048] 100 - first substrate, 101 - first light - transmissive layer, 102 - driving unit, 103 - first metal layer, 104 - preset light - transmissive layer, 105 - second silicon layer, 200 - second substrate, 201 - second light - transmissive layer, 202 - buffer layer, 203 - electron injection layer, 204 - light - emitting layer, 205 - hole injection layer, 206 - first electrode, 207 - second metal layer, 300 - light - transmissive plate. Detailed implementation manners
[0049] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
[0050] Reference may be made to Figure 1 , Figure 1 which is a flowchart of a method for preparing a transparent display screen provided in an embodiment. As shown in the figure, the method for preparing the transparent display screen includes the following steps:
[0051] S11: Form a driving unit 102 and a first light - transmissive layer 101 on one side of the first substrate 100. The first light - transmissive layer 101 is filled between the driving units 102 to form a driving backplane.
[0052] S12: Form a light - emitting unit and a second light - transmissive layer 201 on one side of the second substrate 200. The second light - transmissive layer 201 is filled between the light - emitting units to form a display backplane.
[0053] S13: Bond and fix the side of the driving backplane where the driving unit 102 is formed to the side of the display backplane where the light - emitting unit is formed, so that the light - emitting unit corresponds to the driving unit 102 one by one.
[0054] S14: Remove the non - light - transmissive part of the first substrate 100 except for the driving unit 102 and remove the non - light - transmissive part of the second substrate 200 except for the light - emitting unit.
[0055] The light-emitting unit is used to form the pixels of the transparent display screen. After the driving backplane and the display backplane are adhered, the driving units 102 correspond to the light-emitting units one by one. The driving units 102 are used to provide driving current to the light-emitting units to drive the light-emitting units to emit light. After the driving backplane and the display backplane are adhered, the non-light-transmitting parts of the first substrate 100 except the driving units 102 and the non-light-transmitting parts of the second substrate 200 except the light-emitting units are removed to obtain a transparent display screen.
[0056] In the method for preparing the transparent display screen of this embodiment, the first substrate and the second substrate can use silicon substrates, so that semiconductor processes can be used to form driving units on the first substrate or light-emitting units on the second substrate, enabling the driving units and the light-emitting units to be made in relatively small sizes respectively, and enabling the display screen to have a high image resolution. And the first substrate can use a silicon substrate, and the silicon substrate has a high mobility, so that the formed driving units can provide a large driving current, enabling the display screen to have a high brightness. Therefore, the obtained transparent display screen can have a high brightness and a high image resolution.
[0057] It should be noted that in practical applications, step S11 can be carried out first and then step S12, or step S12 can be carried out first and then step S11, or step S11 and step S12 can be carried out simultaneously.
[0058] In this embodiment, the structure of the driving unit 102 is not limited. The driving unit 102 can include, but is not limited to, a thin film field effect transistor (TFT).
[0059] The first light-transmitting layer 101 can play a role in insulating adjacent driving units 102. On the other hand, the first light-transmitting layer 101 can make the side of the driving backplane provided with the driving units 102 flat, that is, play a leveling role. Exemplarily, reference can be made to Figure 2 , Figure 2 FIG. is a schematic longitudinal sectional view of a driving backplane obtained in a method for preparing a transparent display screen provided in an embodiment. As shown in the figure, driving units 102 are formed on one side of the first substrate 100, and the first light-transmitting layer 101 is filled between the driving units 102. In this embodiment, the material of the first light-transmitting layer 101 is not limited, and in practical applications, it can be selected according to the requirements of light transmittance and insulation. The first light-transmitting layer 101 can adopt inorganic materials, including but not limited to silicon dioxide SiO2.
[0060] In some embodiments, the first substrate 100 includes a first silicon layer; forming the driving units 102 and the first light-transmitting layer 101 on one side of the first substrate 100 can be carried out through the following process, including the following steps:
[0061] S111: Form the driving unit 102 on the first silicon layer of the first substrate 100, and remove the first silicon layer in other areas outside the area where the driving unit 102 is located;
[0062] S112: Form the first light-transmitting layer 101 in other areas outside the area where the driving unit 102 is located on the first substrate 100.
[0063] In this embodiment, forming the driving unit 102 based on the first silicon layer of the first substrate 100 can enable the driving unit 102 to have a high mobility, enable the driving unit 102 to provide a large driving current to the light-emitting unit, and enable the transparent display screen to have a high brightness. Exemplarily, the mobility of the driving backplane can reach about 1000 v / cm·s. In this embodiment, the manufacturing process of forming the driving unit 102 on the first silicon layer of the first substrate 100 is not limited. The first silicon layer in other areas outside the area where the driving unit 102 is located can be removed by an etching method. In this embodiment, the manufacturing process of forming the first light-transmitting layer 101 in other areas outside the area where the driving unit 102 is located on the first substrate 100 is not limited, and methods such as Chemical Vapor Deposition (CVD) can be used but are not limited to.
[0064] In some embodiments, the first substrate 100 includes a second silicon layer 105 on the side away from the driving unit 102. Removing the non-light-transmitting part of the first substrate 100 except the driving unit 102 includes the following process, including the following steps:
[0065] S141: Remove the second silicon layer 105 of the first substrate 100;
[0066] S142: Bond and fix the side of the driving backplane away from the driving unit 102 to the light-transmitting plate 300.
[0067] During the process of preparing the driving unit 102 on the first substrate 100, the second silicon layer 105 plays a supporting role. The second silicon layer 105 is not light-transmitting, so finally the second silicon layer 105 of the first substrate 100 will be removed. Further, bond and fix the side of the driving backplane away from the driving unit 102 to the light-transmitting plate 300, and use the light-transmitting plate 300 as the supporting structure of the transparent display screen. Exemplarily, reference can be made to Figure 4 , Figure 4 a schematic longitudinal cross-sectional view of a transparent display screen obtained by a method for preparing a transparent display screen provided in an embodiment.
[0068] In some embodiments, the side of the driving backplane away from the driving unit 102 is fixedly bonded to the light-transmitting plate 300. Through a permanent bonding process, the light-transmitting plate 300 can be bonded to the driving backplane from which the non-light-transmitting second silicon layer 105 has been removed, so that the two are firmly fixed. In this embodiment, the material of the light-transmitting plate 300 is not limited and can be selected according to the light transmittance requirement and structural strength requirement of the light-transmitting plate 300. The light-transmitting plate 300 can be but is not limited to a glass plate.
[0069] In some embodiments, the first substrate 100 may further include a preset light-transmitting layer 104. The preset light-transmitting layer 104 is located on the side of the second silicon layer 105 close to the driving unit 102. The second silicon layer 105 of the first substrate 100 can be removed through the following process: the second silicon layer 105 is removed by an etching method, and the preset light-transmitting layer 104 is used as an etching stop layer. By using the preset light-transmitting layer 104 in the first substrate 100 as an etching stop layer, the etching uniformity and etching accuracy can be improved. In some embodiments, the preset light-transmitting layer 104 may have insulation properties, and the driving unit 102 in the first substrate 100 and the second silicon layer 105 can also be electrically isolated through the preset light-transmitting layer 104. The preset light-transmitting layer 104 can be an inorganic oxide layer, including but not limited to silicon dioxide SiO2.
[0070] In some embodiments, the first substrate 100 may include a first silicon layer, a preset light-transmitting layer 104, and a second silicon layer 105. The preset light-transmitting layer 104 is located between the first silicon layer and the second silicon layer 105. The driving unit 102 can be formed on the first silicon layer of the first substrate 100, and the second silicon layer 105 plays a supporting role during the process of fabricating the driving unit 102 on the first substrate 100. The first silicon layer can be called the top silicon and can be a silicon thin film on the surface layer of the first substrate 100. The second silicon layer 105 can be called the bottom silicon and is a bulk silicon on the bottom layer of the first substrate 100. When the preset light-transmitting layer 104 is made of an inorganic oxide, it can be called a buried oxide layer.
[0071] The second substrate 200 can be a silicon substrate, so that light-emitting units can be formed on the second substrate 200 by using semiconductor processes, enabling the light-emitting units to have a smaller size and enabling this transparent display screen to have a higher image resolution.
[0072] The second light-transmitting layer 201 can insulate adjacent light-emitting units. On the other hand, the second light-transmitting layer 201 can flatten the side of the display backplane where the light-emitting units are provided, that is, it plays a leveling role. Exemplarily, reference can be made to Figure 3 , Figure 3Schematic longitudinal cross-section of a display backplane obtained in a method for manufacturing a transparent display screen provided for an embodiment. In this embodiment, the material of the second light-transmitting layer 201 is not limited, and in practical applications, it can be selected according to light-transmission requirements and insulation requirements. The second light-transmitting layer 201 can be made of inorganic materials, including but not limited to silicon dioxide SiO2. Forming the second light-transmitting layer 201 on the second substrate 200 can use, but is not limited to, chemical vapor deposition (CVD) method.
[0073] In this embodiment, the structure of the light-emitting unit is not limited. In practical applications, it can be set according to the light-emitting requirements of the transparent display screen. In some embodiments, forming the light-emitting unit on one side of the second substrate 200 can be achieved through the following process: sequentially forming an electron injection layer 203, a light-emitting layer 204, a hole injection layer 205, and a first electrode layer 206 on one side of the second substrate 200, and patterning to form the light-emitting unit. Reference can be made in conjunction with Figure 3 as shown, Figure 3 shows the stacked structure of the electron injection layer 203, the light-emitting layer 204, the hole injection layer 205, and the first electrode layer 206. The first electrode layer 206 is used to form the anode of the light-emitting unit. In this embodiment, the materials of the electron injection layer 203, the light-emitting layer 204, the hole injection layer 205, and the first electrode layer 206 are not limited respectively, and in practical applications, they can be set according to the light-emitting requirements of the transparent display screen. In some embodiments, a buffer layer 202 can be formed between the second substrate 200 and the electron injection layer 203, and the buffer layer 202 is used to ensure the film-forming quality of each layer of the light-emitting unit.
[0074] In some embodiments, removing the non-light-transmitting part of the second substrate 200 except for the light-emitting unit includes: removing the second substrate 200 from the display backplane. If the second substrate 200 uses a silicon substrate, the silicon substrate is not light-transmitting, so the second substrate 200 is finally removed.
[0075] In some embodiments, this method for manufacturing a transparent display screen may further include: forming a second electrode on the side of the display backplane where the second substrate 200 is removed, and the second electrode corresponds to the light-emitting unit. The second electrode can be the cathode of the light-emitting unit.
[0076] In some embodiments, attaching and fixing the side of the driving backplane where the driving unit 102 is formed to the side of the display backplane where the light-emitting unit is formed includes: attaching the side of the driving backplane where the driving unit 102 is formed to the side of the display backplane where the light-emitting unit is formed, and bonding the driving backplane and the display backplane through the first light-transmitting layer 101 and the second light-transmitting layer 201.
[0077] In some embodiments, the side surface of the driving backplane forming the driving unit 102 and the side surface of the display backplane forming the light-emitting unit are bonded and fixed, which includes: the driving unit 102 includes a first metal layer 103, the light-emitting unit includes a second metal layer 207, the driving unit 102 and the light-emitting unit are electrically connected through the contact of the first metal layer 103 and the second metal layer 207, and the first metal layer 103 and the second metal layer 207 are connected in a bonding manner.
[0078] Correspondingly, forming a light-emitting unit on one side surface of the second substrate 200 may include the following process: an electron injection layer 203, a light-emitting layer 204, a hole injection layer 205, a first electrode layer 206, and a second metal layer 207 are sequentially formed on one side surface of the second substrate 200, and patterning is performed to form the light-emitting unit. The second metal layer 207 is used to form electrical traces to realize the electrical connection between the light-emitting unit and the driving unit 102, and can be bonded to the first metal layer 103 of the driving unit 102 through the second metal layer 207. In this embodiment, the materials of the first metal layer 103 and the second metal layer 207 are not limited respectively.
[0079] Exemplarily, reference can be made to Figure 4 As shown, the side surface of the driving backplane forming the driving unit 102 and the side surface of the display backplane forming the light-emitting unit are attached, so that the light-emitting unit and the driving unit 102 are in one-to-one correspondence. The driving backplane and the display backplane can be aligned and fixed through the bonding of the first light-transmitting layer 101 and the second light-transmitting layer 201, and through the bonding of the first metal layer 103 of the driving unit 102 and the second metal layer 207 of the light-emitting unit. The light-emitting unit and the driving unit 102 form a display area of the transparent display screen, and other areas of the display screen are transparent areas, forming a transparent display screen. This transparent display screen emits light from the side of the display backplane away from the driving backplane. In practical applications, the light-emitting unit can be made to have a micron or sub-micron size, which can increase the area ratio of the transparent area of the transparent display screen. Exemplarily, under the condition that this transparent display screen includes 300 pixels per inch, the area ratio of the transparent area ≥ 90%.
[0080] This embodiment also provides a transparent display screen, including:
[0081] A driving backplane, at least including a driving unit 102 and a first light-transmitting layer 101 filled between the driving units 102;
[0082] A display backplane, at least including a light-emitting unit and a second light-transmitting layer 201 filled between the light-emitting units;
[0083] One side of the driving backplane where the driving unit 102 is disposed is attached and fixed to one side of the display backplane where the light-emitting unit is disposed, and the light-emitting units and the driving unit 102 correspond to each other one by one.
[0084] The light-emitting units are used to form the pixels of the transparent display screen. After the driving backplane and the display backplane are attached, the driving unit 102 and the light-emitting units correspond to each other one by one. The driving unit 102 is used to provide driving current to the light-emitting units to drive the light-emitting units to emit light.
[0085] For the transparent display screen of this embodiment, the driving backplane and the display backplane can be separately fabricated and then attached to obtain the transparent display screen. When fabricating the driving backplane, a silicon substrate can be used, and when fabricating the display backplane, a silicon substrate can also be used, so that the driving unit or the light-emitting unit can be formed by using semiconductor processes, enabling the driving unit and the light-emitting unit to be respectively made in smaller sizes, so that the display screen can have a higher image resolution. Also, when fabricating the driving backplane, a silicon substrate can be used, and the silicon substrate has a high mobility, so that the formed driving unit can provide a large driving current, enabling the display screen to have a high brightness. Therefore, the transparent display screen can have a high brightness and a high image resolution.
[0086] In some embodiments, one side of the driving backplane where the driving unit 102 is disposed is attached to one side of the display backplane where the light-emitting unit is disposed, and the first light-transmitting layer 101 and the second light-transmitting layer 201 are connected in a bonding manner.
[0087] In some embodiments, the driving unit 102 includes a first metal layer 103, and the light-emitting unit includes a second metal layer 207. The first metal layer 103 and the second metal layer 207 are in contact to realize the electrical connection between the driving unit 102 and the light-emitting unit, and the first metal layer 103 and the second metal layer 207 are connected in a bonding manner.
[0088] Exemplarily, reference can be made to Figure 4 As shown, one side of the driving backplane where the driving unit 102 is formed is attached to one side of the display backplane where the light-emitting unit is formed, so that the light-emitting units and the driving unit 102 correspond to each other one by one. The driving backplane and the display backplane can be aligned and fixed by the bonding of the first light-transmitting layer 101 and the second light-transmitting layer 201, and by the bonding of the first metal layer 103 of the driving unit 102 and the second metal layer 207 of the light-emitting unit. The light-emitting units and the driving unit 102 form the display area of the transparent display screen, and the other areas of the display screen are transparent areas, forming a transparent display screen. This transparent display screen emits light from the side of the display backplane away from the driving backplane.
[0089] In some embodiments, the transparent display screen may further include: a light-transmitting plate 300, and one side surface of the driving backplane away from the driving unit 102 is attached to and fixed to the light-transmitting plate 300. Thus, the light-transmitting plate 300 can be used as the support structure of the transparent display screen. Additionally, in some embodiments, one side surface of the driving backplane away from the driving unit 102 is fixed to the light-transmitting plate 300 in a bonding manner. The light-transmitting plate 300 and the driving backplane can be bonded through a permanent bonding process to firmly fix the two.
[0090] This embodiment also provides a head-mounted display device, including an optical element and the transparent display screen according to any one of the above embodiments. Among them, the optical element is disposed on one side of the display backplane of the transparent display screen away from the driving backplane.
[0091] For the head-mounted display device of this embodiment, the transparent display screen adopted can separately manufacture the driving backplane and the display backplane and then bond the two to obtain the transparent display screen. When manufacturing the driving backplane, a silicon substrate can be used, and when manufacturing the display backplane, a silicon substrate can also be used. This enables the driving unit or the light-emitting unit to be formed by semiconductor processes, allowing the driving unit and the light-emitting unit to achieve relatively small sizes respectively, so that the display screen can have a high image resolution. And when manufacturing the driving backplane, a silicon substrate can be used. The silicon substrate has a high mobility, enabling the formed driving unit to provide a large driving current, so that the display screen can have a high brightness. Therefore, the transparent display screen of this head-mounted display device can have a high brightness and a high image resolution.
[0092] The head-mounted display device of this embodiment can be a virtual reality head-mounted display device or an augmented reality head-mounted display device.
[0093] The above has introduced in detail a transparent display screen, its preparation method, and a head-mounted display device provided by the present invention. Specific examples are used herein to elaborate on the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principles of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.
Claims
1. A method for preparing a transparent display screen, characterized in that, Comprising: A driving unit and a first light-transmitting layer are formed on one side of a first substrate. The first light-transmitting layer is filled between the driving units to form a driving backplane. A light-emitting unit and a second light-transmitting layer are formed on one side of a second substrate. The second light-transmitting layer is filled between the light-emitting units to form a display backplane. The side of the driving backplane where the driving unit is formed is bonded and fixed to the side of the display backplane where the light-emitting unit is formed, so that the light-emitting units and the driving units are in one-to-one correspondence. The non-light-transmitting portions of the first substrate other than the driving unit are removed, and the non-light-transmitting portions of the second substrate other than the light-emitting unit are removed.
2. The method for preparing a transparent display screen according to claim 1, wherein, The first substrate includes a first silicon layer. The forming of the driving unit and the first light-transmitting layer on one side of the first substrate includes: The driving unit is formed on the first silicon layer of the first substrate, and the first silicon layer in other regions except the region where the driving unit is located is removed. The first light-transmitting layer is formed in other regions of the first substrate except the region where the driving unit is located.
3. The method for preparing a transparent display screen according to claim 1, wherein The first substrate includes a second silicon layer on the side away from the driving unit. The removing of the non-light-transmitting portions of the first substrate other than the driving unit includes: The second silicon layer of the first substrate is removed. The side of the driving backplane away from the driving unit is bonded and fixed to a light-transmitting plate.
4. The method for manufacturing a transparent display screen according to claim 3, characterized in that, The first substrate further includes a preset light-transmitting layer, and the preset light-transmitting layer is on the side of the second silicon layer close to the driving unit. The removing of the second silicon layer of the first substrate includes: The second silicon layer is removed by an etching method, where the preset light-transmitting layer is used as an etching barrier layer.
5. The method for preparing a transparent display screen according to claim 3, wherein The side of the driving backplane away from the driving unit is fixed to the light-transmitting plate by a bonding method.
6. The method for preparing a transparent display screen according to claim 1, wherein The removing of the non-light-transmitting portions of the second substrate other than the light-emitting unit includes: removing the second substrate from the display backplane.
7. The method for preparing a transparent display screen according to claim 6, wherein Further comprising: A second electrode is formed on the side of the display backplane where the second substrate is removed, and the second electrode corresponds to the light-emitting unit.
8. The method for preparing a transparent display screen according to claim 1, wherein The bonding and fixing of the side of the driving backplane where the driving unit is formed to the side of the display backplane where the light-emitting unit is formed includes: The side of the driving backplane where the driving unit is formed is bonded to the side of the display backplane where the light-emitting unit is formed, and the driving backplane and the display backplane are fixed by a bonding method through the first light-transmitting layer and the second light-transmitting layer.
9. The method for preparing a transparent display screen according to claim 1, wherein The bonding and fixing of the side of the driving backplane where the driving unit is formed to the side of the display backplane where the light-emitting unit is formed includes: The driving unit includes a first metal layer, the light-emitting unit includes a second metal layer, the driving unit and the light-emitting unit are electrically connected through the contact of the first metal layer and the second metal layer, and the first metal layer and the second metal layer are connected by a bonding method.
10. The method for preparing a transparent display screen according to claim 9, wherein The forming of the light-emitting unit on one side of the second substrate includes: An electron injection layer, a light-emitting layer, a hole injection layer, a first electrode layer, and the second metal layer are sequentially formed on one side surface of the second substrate, and are patterned to form the light-emitting unit.
11. A transparent display screen, characterized in that, Comprising: A driving backplane, at least including a driving unit and a first light-transmitting layer filled between the driving units; A display backplane, at least including a light-emitting unit and a second light-transmitting layer filled between the light-emitting units; One side surface of the driving backplane provided with the driving unit is attached and fixed to one side surface of the display backplane provided with the light-emitting unit, and the light-emitting unit and the driving unit are in one-to-one correspondence.
12. The transparent display screen according to claim 11, wherein One side surface of the driving backplane provided with the driving unit is attached to one side surface of the display backplane provided with the light-emitting unit, and the first light-transmitting layer and the second light-transmitting layer are connected in a bonding manner.
13. The transparent display screen according to claim 11, characterized in that The driving unit includes a first metal layer, the light-emitting unit includes a second metal layer, the first metal layer and the second metal layer are in contact to realize electrical connection between the driving unit and the light-emitting unit, and the first metal layer and the second metal layer are connected in a bonding manner.
14. The transparent display screen according to any one of claims 11 to 13, characterized in that, Further comprising: A light-transmitting plate, and one side surface of the driving backplane away from the driving unit is fixed to the light-transmitting plate in a bonding manner.
15. A head-mounted display device, characterized in that, Comprising an optical element and the transparent display screen according to any one of claims 11 to 14, wherein the optical element is disposed on a side of the display backplane of the transparent display screen away from the driving backplane.