Antenna module and communication device equipped with same

Abstract

An antenna module (100) is provided with: a dielectric substrate (130); a ground electrode (GND) disposed on the dielectric substrate; a plate-shaped first radiating element (121) disposed on the dielectric substrate so as to face the ground electrode; a plate-shaped second radiating element (122) which is disposed between the first radiating element and the ground electrode, has a larger size than the first radiating element, and has an opening (OPG2) formed in the center thereof; a first power supply wiring (141A) that passes through the second radiating element and is electrically coupled to the first radiating element at a position offset in the first direction with respect to the center of the first radiating element; a second power supply wiring (142B) electrically coupled to the second radiating element at a position shifted in a second direction different from the first direction with respect to the center of the second radiating element; and a via electrode (VG) that is connected to the ground electrode, passes through the opening of the second radiating element, and is electrically coupled to the center of the first radiating element.

Description

Technical Field

[0001] The present disclosure relates to an antenna module and a communication device equipped with the antenna module, and more specifically, to a technique for improving the isolation in the antenna module. Background Art

[0002] The following structure is disclosed in U.S. Patent Application Publication No. 2021 / 0367358 (Patent Document 1): In a dual-band and dual-polarization type patch antenna that can radiate two different radio waves and can radiate radio waves in two different polarization directions, in order to improve the isolation between the feeding pins of each radiating element, a grounding pin is connected to the central portion of the two stacked radiating elements.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: U.S. Patent Application Publication No. 2021 / 0367358 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] The antenna module as described above is sometimes used in mobile communication devices typified by portable phones or smartphones. In such a mobile communication device, in order to improve the communication quality and communication speed, communication using radio waves of multiple frequency bands is performed. On the other hand, the demand for improving the antenna characteristics remains high, and further improvement in the isolation between different frequency bands is sought.

[0008] The present disclosure has been made to solve such problems, and an object thereof is to improve the isolation between feeding ports in a dual-band type antenna module.

[0009] Solutions to the Problems

[0010] The antenna module according to the first aspect of the present disclosure includes: a dielectric substrate, a ground electrode disposed on the dielectric substrate, a first radiation element and a second radiation element having a flat plate shape, a first feeding line and a second feeding line, and a via electrode connected to the ground electrode. The first radiation element is disposed on the dielectric substrate facing the ground electrode. The second radiation element is disposed between the first radiation element and the ground electrode. The first feeding line penetrates the second radiation element and transmits a high-frequency signal to the first radiation element. The second feeding line transmits a high-frequency signal to the second radiation element. The first feeding line is electrically coupled to the first radiation element at a position offset in a first direction with respect to the center of the first radiation element. The second feeding line is electrically coupled to the second radiation element at a position offset in a second direction different from the first direction with respect to the center of the second radiation element. The size of the second radiation element is larger than the size of the first radiation element. An opening is formed in the central portion of the second radiation element. The via electrode penetrates the opening of the second radiation element and is electrically coupled to the central portion of the first radiation element.

[0011] The antenna module according to the second aspect of the present disclosure includes: a dielectric substrate, a ground electrode disposed on the dielectric substrate, a first radiation element and a second radiation element having a flat plate shape, a first feeding line and a second feeding line, and a via electrode connected to the ground electrode. The first radiation element is disposed on the dielectric substrate facing the ground electrode. The second radiation element is disposed between the first radiation element and the ground electrode. The first feeding line penetrates the second radiation element and transmits a high-frequency signal to the first radiation element. The second feeding line transmits a high-frequency signal to the second radiation element. The first feeding line is electrically coupled to the first radiation element at a position offset in a first direction with respect to the center of the first radiation element. The second feeding line is electrically coupled to the second radiation element at a position offset in a second direction different from the first direction with respect to the center of the second radiation element. The size of the second radiation element is larger than the size of the first radiation element. An opening is formed in the central portion of the second radiation element. The via electrode penetrates the opening of the second radiation element.

[0012] The antenna module according to the third aspect of the present disclosure includes: a dielectric substrate; a ground electrode disposed on the dielectric substrate; a first radiation element and a second radiation element having a flat plate shape; a first feeding line and a second feeding line; and a via electrode having a first end and a second end. The first radiation element is disposed on the dielectric substrate facing the ground electrode. The second radiation element is disposed between the first radiation element and the ground electrode. The first feeding line penetrates the second radiation element and transmits a high-frequency signal to the first radiation element. The second feeding line transmits a high-frequency signal to the second radiation element. The first feeding line is electrically coupled to the first radiation element at a position offset in a first direction with respect to the center of the first radiation element. The second feeding line is electrically coupled to the second radiation element at a position offset in a second direction different from the first direction with respect to the center of the second radiation element. The size of the second radiation element is larger than the size of the first radiation element. An opening is formed in the central portion of the second radiation element. The first end of the via electrode is connected to the ground electrode. The second end of the via electrode is located at the position of the second radiation element in the normal direction of the dielectric substrate, or at the position between the second radiation element and the first radiation element in the normal direction of the dielectric substrate. In a plan view from the normal direction of the dielectric substrate, the second end overlaps the opening.

[0013] Effects of the Invention

[0014] The antenna module according to the present disclosure includes two stacked radiation elements. The high-frequency signal to the radiation element on the high-frequency side (the first radiation element) passes through the radiation element on the low-frequency side (the second radiation element) and is transmitted to the first radiation element. Moreover, the via electrode connected to the ground electrode penetrates the opening formed in the central portion of the second radiation element and is electrically coupled to the central portion of the first radiation element. According to this structure, the current distribution in the second radiation element changes. Specifically, when a high-frequency signal is supplied to the first radiation element, the current in the second radiation element concentrates around the opening in the central portion. As a result, the current reaching the feeding point of the second radiation element from the feeding line to the first radiation element is reduced compared to the case where there is no such via electrode. Thereby, the isolation between the feeding ports can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a block diagram of a communication device using the antenna module according to Application Embodiment 1.

[0016] Figure 2 is Figure 1 a perspective view of the antenna module.

[0017] Figure 3 is Figure 1 a top view of the antenna module.

[0018] Figure 4 is viewed from arrow AR1Figure 3 The side perspective view of the antenna module

[0019] Figure 5 is a diagram for explaining the current distribution in the radiation element on the low-frequency side when feeding power to the radiation element on the high-frequency side in the antenna modules of Embodiment 1 and Comparative Example 1.

[0020] Figure 6 is a diagram for explaining the isolation characteristics between the respective feeding ports in the antenna modules of Embodiment 1 and Comparative Example 1.

[0021] Figure 7 is the side perspective view of the antenna module of Modification 1.

[0022] Figure 8 is the side perspective view of the antenna modules of Modification 2 and Modification 3.

[0023] Figure 9 is a diagram for explaining the isolation characteristics in the antenna module of Modification 2.

[0024] Figure 10 is the side perspective view of the antenna module of Modification 4.

[0025] Figure 11 is a diagram for explaining the isolation characteristics in the antenna module of Modification 4.

[0026] Figure 12 is the side perspective view of the antenna module of Embodiment 2.

[0027] Figure 13 is the side perspective view of the antenna module of Modification 5. Detailed Embodiments

[0028] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In addition, the same or corresponding parts in the drawings are denoted by the same reference numerals, and their description will not be repeated.

[0029] [Embodiment 1]

[0030] (Basic Structure of Communication Device)

[0031] Figure 1 is a block diagram of a communication device 10 to which the antenna module 100 according to the present embodiment is applied. The communication device 10 is, for example, a portable terminal such as a mobile phone, a smartphone, or a tablet computer, or a personal computer having a communication function. An example of the frequency band of the radio wave used in the antenna module 100 according to the present embodiment is a radio wave in the millimeter wave band centered on, for example, 28 GHz, 39 GHz, and 60 GHz, but radio waves in frequency bands other than the above can also be applied.

[0032] Refer toFigure 1 The communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC 110 as an example of a feeding device and an antenna device 120. The communication device 10 up-converts an intermediate frequency signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120, and down-converts a high-frequency signal received by the antenna device 120 into an intermediate frequency signal and processes the signal through the BBIC 200.

[0033] The antenna device 120 includes a dielectric substrate 130 and a plurality of antenna elements 125 disposed on the dielectric substrate 130. In Figure 1 it, an example of an array structure in which four antenna elements 125 are arranged in a row on the dielectric substrate 130 is described, but the number of antenna elements 125 is not limited to this. A single antenna element 125 may be disposed on the dielectric substrate 130, or a structure in which a plurality of antenna elements 125 other than four are disposed may also be used. In addition, the antenna elements 125 may have a two-dimensional array structure.

[0034] The antenna elements 125 include flat radiation elements 121 and 122 having different sizes. The radiation elements 121 and 122 are patch antennas having a flat shape such as a circle, an ellipse, or a polygon. In Embodiment 1, an example in which each radiation element is a microstrip antenna having a substantially square shape will be described. As will be described later, the radiation elements 121 and 122 are arranged in a stacked manner on the dielectric substrate 130 so as to be separated from each other in the normal direction of the dielectric substrate 130. Figures 2 to 4 As described later, the radiation elements 121 and 122 are arranged in a stacked manner on the dielectric substrate 130 so as to be separated from each other in the normal direction of the dielectric substrate 130.

[0035] The size of the radiation element 121 is smaller than the size of the radiation element 122. Therefore, the frequency band of the radio wave radiated from the radiation element 121 is higher than the frequency band of the radio wave radiated from the radiation element 122. That is, the antenna module 100 is a so-called dual-band type antenna module capable of radiating radio waves of two different frequency bands. In the example of Embodiment 1, the frequency band of the radio wave radiated from the radiation element 121 is the 39 GHz band (37.0 GHz to 43.5 GHz), and the frequency band of the radio wave radiated from the radiation element 122 is the 28 GHz band (24.25 GHz to 29.5 GHz).

[0036] In addition, each of the radiation elements 121 and 122 is provided with two feeding points that are offset in different directions with respect to the center of the element, and high-frequency signals are supplied from the RFIC 110 to each feeding point. That is, the antenna module 100 is a so-called dual-polarization type antenna module that can radiate radio waves in two different polarization directions. In the example of Embodiment 1, each of the radiation elements 121 and 122 is configured to be able to radiate radio waves in two mutually orthogonal polarization directions (a first polarization direction and a second polarization direction).

[0037] The RFIC 110 includes four feeding circuits 110A to 110D. The feeding circuit 110A is a circuit for supplying a high-frequency signal for the first polarization direction of the radiation element 121. The feeding circuit 110B is a circuit for supplying a high-frequency signal for the second polarization direction of the radiation element 121. The feeding circuit 110C is a circuit for supplying a high-frequency signal for the first polarization direction of the radiation element 122. The feeding circuit 110D is a circuit for supplying a high-frequency signal for the second polarization direction of the radiation element 122. In addition, since the internal structures of the feeding circuits 110A to 110D are common, Figure 1 for the sake of easy explanation, only the detailed structure of the feeding circuit 110A is described, and the structures of the feeding circuits 110B to 110D are omitted. Hereinafter, the function of the feeding circuit 110A will be representatively described.

[0038] The feeding circuit 110A includes switches 111A to 111D, 113A to 113D, 117, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, a signal combiner / divider 116, a mixer 118, and an amplifier circuit 119.

[0039] When transmitting a high-frequency signal, the switches 111A to 111D and 113A to 113D are switched to the power amplifier 112AT to 112DT side, and the switch 117 is connected to the transmitting-side amplifier of the amplifier circuit 119. When receiving a high-frequency signal, the switches 111A to 111D and 113A to 113D are switched to the low-noise amplifier 112AR to 112DR side, and the switch 117 is connected to the receiving-side amplifier of the amplifier circuit 119.

[0040] The intermediate frequency signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and then up-converted by the mixer 118. The transmitted signal as a high-frequency signal after up-conversion is divided into four by the signal combiner / distributor 116 and fed to different radiating elements 121 through corresponding signal paths. The directivity of the radio wave output from the radiating element 121 can be adjusted by independently adjusting the phase shift degrees of the phase shifters 115A to 115D arranged in each signal path. In addition, the attenuators 114A to 114D adjust the intensity of the transmitted signal.

[0041] The received signal as a high-frequency signal received by each radiating element 121 is transmitted to the feeding circuit 110A of the RFIC 110, combined in the signal combiner / distributor 116 after passing through four different signal paths, down-converted to an intermediate frequency signal by the mixer 118, further amplified by the amplifier circuit 119, and then transmitted to the BBIC 200.

[0042] The RFIC 110 is formed, for example, as a single-chip integrated circuit component including the above circuit structure. Alternatively, each feeding circuit may be formed as an independent integrated circuit component. Also, devices (switches, power amplifiers, low-noise amplifiers, attenuators, phase shifters) corresponding to each radiating element may be formed as a single-chip integrated circuit component according to the corresponding radiating element.

[0043] (Structure of the antenna module)

[0044] Next, use Figures 2 to 4 to describe the details of the structure of the antenna module 100 in Embodiment 1. Figure 2 is a perspective view of the antenna module 100 according to Embodiment 1. Figure 3 is a top view when observing the antenna module 100 from the normal direction of the dielectric substrate 130. Figure 4 is from Figure 3 is a side perspective view when observing the antenna module 100 from the direction of the arrow AR1 in

[0045] In addition, in Figure 2 and Figure 3 in order to facilitate understanding of the internal structure, the state after removing the dielectric of the dielectric substrate 130 is shown. Also, as Figure 3 shown, the normal direction of the dielectric substrate 130 and the radiating elements 121, 122 is set as the Z-axis direction, the direction along one of the two adjacent sides of the radiating elements 121, 122 is set as the X-axis, and the direction along the other side is set as the Y-axis. Sometimes the positive direction of the Z-axis in each figure is referred to as the upper side, and the negative direction is referred to as the lower side.

[0046] Refer to Figures 2 to 4, in addition to the RFIC 110, the antenna element 125, and the dielectric substrate 130, the antenna module 100 further includes feeding wirings 141A, 141B, 142A, 142B, a ground electrode GND, and via electrodes VG.

[0047] The dielectric substrate 130 is, for example, a low-temperature co-fired ceramic (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating a plurality of resin layers made of epoxy, polyimide, or the like, a multilayer resin substrate formed by laminating a plurality of resin layers made of liquid crystal polymer (LCP) having a relatively low dielectric constant, a multilayer resin substrate formed by laminating a plurality of resin layers made of fluorine-based resin, a multilayer resin substrate formed by laminating a plurality of resin layers made of PET (polyethylene terephthalate) material, or a ceramic multilayer substrate other than LTCC. In addition, the dielectric substrate 130 does not necessarily have a multilayer structure and may be a single-layer substrate.

[0048] At a position close to the upper surface 131 of the dielectric substrate 130, a radiating element 121 is disposed. The radiating element 121 may be disposed so as to be exposed on the surface of the dielectric substrate 130, or may be disposed in an internal layer of the dielectric substrate 130 as in the example of Figure 4 . At a position close to the lower surface 132 of the dielectric substrate 130, the ground electrode GND is disposed over the entire surface of the dielectric substrate 130. The radiating element 121 is disposed facing the ground electrode. In addition, the RFIC 110 is mounted on the lower surface 132 of the dielectric substrate 130 by means of solder bumps 160. Further, the RFIC 110 may be mounted on the dielectric substrate 130 using a connector disposed on the RFIC 110 instead of using solder bumps to mount on the dielectric substrate 130. Alternatively, the RFIC 110 may be disposed on a wiring substrate of a device on which the antenna module 100 is mounted, and a high-frequency signal may be supplied to the radiating element from there by means of a connector.

[0049] A radiating element 122 is disposed in the dielectric substrate 130 between the radiating element 121 and the ground electrode GND. The radiating element 122 is disposed facing the dielectric substrate 130 and the radiating element 121. As shown in Figure 3 , the radiating elements 121 and 122 are disposed such that the centers of the elements coincide with each other and overlap when the dielectric substrate 130 is viewed from the normal direction.

[0050] A high-frequency signal is supplied from the RFIC 110 to the radiating element 121 via the feeding wirings 141A and 141B. The feeding wiring 141A extends from the RFIC 110 in a dielectric layer on the lower surface 132 side of the ground electrode GND to below the radiating element 121, penetrates through the opening OP2A of the ground electrode GND and the radiating element 122 from there, and is connected to the feeding point SP1A of the radiating element 121. Similarly, the feeding wiring 141B extends from the RFIC 110 in a dielectric layer on the lower surface 132 side of the ground electrode GND to below the radiating element 121, penetrates through the opening OP2B of the ground electrode GND and the radiating element 122 from there, and is connected to the feeding point SP1B of the radiating element 121.

[0051] As Figure 3 shown, the feeding point SP1A is offset in the positive Y-axis direction with respect to the element center of the radiating element 121. By supplying a high-frequency signal to the feeding point SP1A, an electric wave polarized in the Y-axis direction is radiated from the radiating element 121 in the Z-axis direction. In addition, the feeding point SP1B is offset in the negative X-axis direction with respect to the element center of the radiating element 121. By supplying a high-frequency signal to the feeding point SP1B, an electric wave polarized in the X-axis direction is radiated from the radiating element 121 in the Z-axis direction.

[0052] A high-frequency signal is supplied from the RFIC 110 to the radiating element 122 via the feeding wirings 142A and 142B. The feeding wiring 142A extends from the RFIC 110 in a dielectric layer on the lower surface 132 side of the ground electrode GND to below the radiating element 122, penetrates through the ground electrode GND from there, and is connected to the feeding point SP2A of the radiating element 122. Similarly, the feeding wiring 142B extends from the RFIC 110 in a dielectric layer on the lower surface 132 side of the ground electrode GND to below the radiating element 122, penetrates through the ground electrode GND from there, and is connected to the feeding point SP2B of the radiating element 122.

[0053] As Figure 3 shown, the feeding point SP2A is offset in the negative Y-axis direction with respect to the element center of the radiating element 122. By supplying a high-frequency signal to the feeding point SP2A, an electric wave polarized in the Y-axis direction is radiated from the radiating element 122 in the Z-axis direction. In addition, the feeding point SP2B is offset in the positive X-axis direction with respect to the element center of the radiating element 122. By supplying a high-frequency signal to the feeding point SP2B, an electric wave polarized in the X-axis direction is radiated from the radiating element 122 in the Z-axis direction.

[0054] The via electrode VG connects the ground electrode GND to the radiation element 121. In other words, the lower-side end (the first end) of the via electrode VG is connected to the ground electrode GND, and the upper-side end (the second end) of the via electrode VG is connected to the radiation element 121. The via electrode VG passes through the opening OPG2 formed in the central portion of the radiation element 122 from the ground electrode GND and is connected to the center of the radiation element 121. In addition, in the opening OPG2, the via electrode VG does not contact the radiation element 122.

[0055] (Antenna characteristics)

[0056] In the stacked antenna module as described above, when a high-frequency signal is supplied to the high-frequency-side radiation element 121 through the feed wirings 141A and 141B, correspondingly, current also flows to the radiation element 122 that functions as a ground electrode for the radiation element 121. At this time, in the radiation element 122, when current flows through the path connecting the openings OP2A and OP2B that penetrate the radiation element 122 by the feed wirings 141A and 141B to the feed points SP2A and SP2B of the radiation element 122, sometimes coupling occurs between the high-frequency-side feed path and the low-frequency-side feed path, resulting in a decrease in the isolation characteristic.

[0057] Here, in the antenna module 100 of the first embodiment, as described above, the via electrode VG connected to the center of the radiation element 121 passes through the opening OPG2 formed in the central portion of the radiation element 122 and is connected to the ground electrode GND. In this way, when the via electrode VG at the ground potential approaches the opening OPG2 in a non-contact state, a capacitor is formed between the end of the opening OPG2 and the via electrode VG, so current concentrates at the end of the opening OPG2. In particular, in the case of a high-frequency signal, due to the edge effect, there is a tendency for current to concentrate at the end of a conductor, so through the configuration of the via electrode VG as described above, current becomes likely to concentrate at the end of the opening OPG2.

[0058] In this way, the current distribution on the radiation element 122 changes, and the current density increases at the ends of the openings OP2A and OP2B penetrated by the feed wirings 141A and 141B and the end of the opening OPG2 penetrated by the via electrode VG, as well as between these openings, while the current density in other parts decreases relatively. As a result, compared with the case where there is no via electrode VG, the current flowing through the path connecting the openings OP2A and OP2B that penetrate the radiation element 122 by the feed wirings 141A and 141B to the feed points SP2A and SP2B of the radiation element 122 decreases, and the isolation between the feed ports of different frequency bands can be improved.

[0059] Figure 5It is a diagram showing an example of a simulation of the current distribution in the low-frequency-side radiation element 122 when feeding the high-frequency-side radiation element 121 in the antenna module 100 of Embodiment 1 and the antenna module 100X of Comparative Example 1 that does not have via electrodes VG. In Figure 5 the arrows shown on the surface of the radiation element 122 indicate the direction of the current, and the size of the arrows indicates the intensity of the current.

[0060] As Figure 5 shown, in Comparative Example 1, the current intensity is high around the openings OP2A and OP2B through which the feeding wirings 141A and 141B pass, and the current between the opening OP2A and the opening OP2B also becomes slightly stronger.

[0061] On the other hand, in the structure of Embodiment 1, in addition to the openings OP2A and OP2B, the current intensity at the ends of the opening OPG2 through which the via electrodes VG pass becomes large. That is, the current concentrates near and around the openings OP2A, OP2B and the opening OPG2 of the radiation element 122. In addition, accordingly, the direction of the current flowing near the feeding points SP2A and SP2B of the radiation element 122 changes, and the current intensity slightly decreases. That is, the isolation between the feeding wirings 141A, 141B and the feeding wirings 142A, 142B is improved.

[0062] Figure 6 It is a diagram for explaining the simulation results of the isolation characteristics between the respective feeding ports of the antenna module 100 of Embodiment 1 and the antenna module 100X of Comparative Example 1. In Figure 6 each graph, the solid lines (LN10, LN12, LN14, LN16) represent the case of the antenna module 100 of Embodiment 1, and the dashed lines (LN11, LN13, LN15, LN17) represent the case of the antenna module 100X of Comparative Example 1. In addition, in Figure 6 the feeding ports corresponding to the feeding wirings 141A and 141B are represented by 39V and 39H, respectively, and the feeding ports corresponding to the feeding wirings 142A and 142B are represented by 28V and 28H, respectively. In addition, the high-frequency-side frequency band is represented by BW1, and the low-frequency-side frequency band is represented by BW2.

[0063] Referring to Figure 6 Chart (A) shows the isolation characteristics between the feeding wiring 142A and the feeding wiring 142B on the low-frequency side. In Chart (A), it can be seen that in the low-frequency-side frequency band BW2, the isolation characteristics of the antenna module 100 of Embodiment 1 are improved compared with those of the antenna module 100X of Comparative Example 1.

[0064] Graph (B) shows the isolation characteristics between the feed line 142A on the low-frequency side and the feed line 141B on the high-frequency side. In addition, Graph (C) shows the isolation characteristics between the feed line 142B on the low-frequency side and the feed line 141A on the high-frequency side. In both Graph (B) and Graph (C): Although the improvement effect in the frequency band BW1 is slightly smaller, in both the frequency bands BW1 and BW2, the isolation characteristics of the antenna module 100 are improved compared to the antenna module 100X.

[0065] Graph (D) shows the isolation characteristics between the feed line 141A on the high-frequency side and the feed line 141B. Also in Graph (D), in the high-frequency band BW1, the isolation characteristics of the antenna module 100 are improved compared to the antenna module 100X.

[0066] As described above, in a stacked dual-band and dual-polarization type antenna module, by providing an opening that penetrates the central portion of the radiation element formed on the low-frequency side and a via electrode that electrically connects the high-frequency side radiation element and the ground electrode, it is possible to improve the isolation characteristics between different polarization waves in the same frequency band and different frequency bands.

[0067] In addition, in the antenna module 100, both of the radiation elements 121 and 122 are of the dual-polarization type, but they do not necessarily have to be of the dual-polarization type. As long as the polarization directions of the radio waves radiated from the radiation element 121 and the radiation element 122 are different, the isolation characteristics can be improved even if each radiation element is a single-polarization type antenna module.

[0068] The "radiation elements 121 and 122" in Embodiment 1 respectively correspond to the "first radiation element" and the "second radiation element" in the present disclosure. The "feed lines 141A and 141B" in Embodiment 1 respectively correspond to the "first feed line" and the "third feed line" in the present disclosure. The "feed lines 142A and 142B" in Embodiment 1 respectively correspond to the "second feed line" and the "fourth feed line" in the present disclosure. In Embodiment 1, the "positive direction of the Y-axis" and the "negative direction of the Y-axis" respectively correspond to the "first direction" and the "fourth direction" in the present disclosure, and the "negative direction of the X-axis" and the "positive direction of the X-axis" respectively correspond to the "second direction" and the "third direction" in the present disclosure.

[0069] (Modification Examples 1 to 3)

[0070] In the antenna module 100 of Embodiment 1, the via electrode VG has a structure directly connected to the radiation element 121, but the via electrode VG only needs to be electrically coupled to the radiation element 121 and does not necessarily have to be directly connected. Figure 7 It is a side perspective view of the antenna module 100A of Modification Example 1. In the antenna module 100A,Figure 4 The through electrode VG in the antenna module 100 of Embodiment 1 shown is replaced with a through electrode VG1. Except for the through electrode VG1, the structure is the same as that of Figure 4 the same. In Figure 7 , the description of the elements that are the same as those of Figure 4 will not be repeated.

[0071] The through electrode VG1 is not directly connected to the radiation element 121, and is capacitively coupled to the radiation element 121 by a flat electrode 170 arranged facing the radiation element 121.

[0072] In addition, the position of the flat electrode 170, that is, the position of the upper end portion (second end portion) of the through electrode VG1, may also be the same position as that of the radiation element 122 in the normal direction of the dielectric substrate 130, or any position between the radiation element 122 and the radiation element 121. At this time, when viewed from above in the normal direction of the dielectric substrate 130, the second end portion of the through electrode VG1 overlaps with the opening OPG2 of the radiation element 122.

[0073] In addition, the position of capacitive coupling in the through electrode is not limited to the portion at the boundary with the radiation element 121. For example, the structure may also be as follows: as in Figure 8 the antenna module 100B of Modification Example 2 and the antenna module 100C of Modification Example 3, the through electrode is divided in the middle, and capacitive coupling is performed at the divided portion.

[0074] The through electrode VG2 in the antenna module 100B of Modification Example 2 includes a first portion VG2A connected to the ground electrode GND and a second portion VG2B connected to the radiation element 121. The first portion VG2A and the second portion VG2B are capacitively coupled in the layer between the radiation element 121 and the radiation element 122.

[0075] The through electrode VG3 in the antenna module 100C of Modification Example 3 includes a first portion VG3A connected to the ground electrode GND and a second portion VG3B connected to the radiation element 121. The first portion VG3A and the second portion VG3B are capacitively coupled in the layer between the radiation element 122 and the ground electrode GND.

[0076] Figure 9 is a diagram showing an example of the isolation characteristic of the antenna module 100B in the above Modification Example 2. In Figure 9 , regarding the isolation characteristics between the low-frequency side feed line 142A and the feed line 142B in the antenna module 100B, and the isolation characteristics between the low-frequency side feed line 142B and the high-frequency side feed line 141A, a comparison with the antenna module 100 of Embodiment 1 is shown. InFigure 9 Among them, the solid lines (LN20, LN22) are for the antenna module 100B of Modification 2, and the dashed lines (LN21, LN23) are for the antenna module 100 of Embodiment 1.

[0077] As Figure 9 shown, whether between the feeding wirings 142A and 142B in the frequency band BW2 or between the feeding wirings 141A and 142B in the frequency bands BW1 and BW2, the isolation characteristic of the antenna module 100B of Modification 2 is improved compared to the antenna module 100 of Embodiment 1.

[0078] As described above, in the structure where the via electrode is capacitively coupled partially, it is also possible to concentrate the current on the end portion of the opening OPG2 of the radiating element 122 by making the opening OPG2 formed in the central portion of the radiating element 122 have a structure through which the via electrode passes, as described in Figure 5 , thereby improving the isolation characteristic between the feeding ports. In addition, depending on the position of the capacitive coupling in the via electrode, the phase of the current flowing through the via electrode may change. Therefore, there is a case where the position of the capacitive coupling suitable for improving the isolation characteristic varies according to the frequency band of the radio wave to be radiated. In other words, by setting the position of the capacitive coupling according to the frequency band of the radio wave to be radiated, the isolation characteristic can be adjusted.

[0079] (Modification 4)

[0080] In each of the above-described embodiments, the structure is such that the via electrode extends linearly from the ground electrode GND toward the radiating element 121. In Modification 4, a structure is described in which the vias of different layers constituting the via electrode are offset between the ground electrode GND and the radiating element 121.

[0081] Figure 10 is a side perspective view of the antenna module 100D of Modification 4. In the antenna module 100D, the via electrode VG in the antenna module 100 of Embodiment 1 is replaced with a via electrode VG4, and other structures are the same as those of the antenna module 100D. In Figure 10 , the description of the elements that are not repeated with Figure 4 will not be repeated.

[0082] Refer to Figure 10, the via electrode VG4 has a structure in which a plurality of vias and a plurality of strip-shaped flat electrodes are alternately arranged. Therefore, when the antenna module 100D is viewed from the side, with respect to the via electrode VG4, between the ground electrode GND and the radiating element 121, the vias of different layers constituting the via electrode VG4 are offset. In other words, the via electrode VG4 is arranged in a zigzag shape from the ground electrode GND toward the radiating element 121. At this time, by adjusting the length of the flat electrode, the path length of the via electrode VG4 can be changed. When the path length of the via electrode VG4 changes, the inductance value of the via electrode VG4 changes and the impedance changes. Therefore, by changing the shape of the via electrode VG4 according to the frequency band of the radiated radio wave or the like, the isolation characteristic can be adjusted.

[0083] In addition, in Figure 10 , for the sake of easy explanation of the structure of the via electrode VG4, the flat electrodes in the via electrode VG4 are drawn in a manner extending along Figure 10 the horizontal direction therein (i.e., the direction from the feeding point SP1A to SP1B). However, in the case where the antenna module 100D is of a dual-polarization type, in order to make the influence on two polarization waves uniform, it is preferable that the extending direction of the flat electrodes of the via electrode VG4 is the direction forming a position where the distance from the feeding point SP1A is equal to the distance from the feeding point SP1B. In other words, the flat electrodes of the via electrode VG4 preferably extend along Figure 3 the direction of the arrow AR1 therein.

[0084] Alternatively, in addition to the structure in which the via electrode has vias offset between two layers, a portion that is capacitively coupled to the via electrode may be provided as in Modifications 1 to 3, and the capacitance value and the inductance value may be changed together to adjust the isolation characteristic.

[0085] Figure 11 is a diagram for explaining the isolation characteristic in the antenna module 100D of Modification 4. In Figure 11 , as an example, the isolation characteristic between the high-frequency side feeding wiring 141A and the low-frequency side feeding wiring 142B is shown. In Figure 11 , the solid line LN30 represents the case of the antenna module 100D of Modification 4, and the dashed line LN31 represents the case of the antenna module 100 of Embodiment 1.

[0086] As Figure 11 shown, in the high-frequency side frequency band BW1, the isolation characteristics of both are of the same degree, but in the low-frequency side frequency band BW2, the isolation characteristic of the antenna module 100D of Modification 4 is improved compared to the isolation characteristic of the antenna module 100.

[0087] By adopting a structure in which the path electrodes formed between the ground electrode GND and the radiating element 121 in different layers are offset as described above, the isolation characteristic can be improved compared to the case where the path electrode is linear.

[0088] [Embodiment 2]

[0089] In Embodiment 1 and Modifications 1 to 4, a structure in which two feeding elements are arranged in a stacked manner has been described. In Embodiment 2 and Modification 5 described later, the following structure will be described: In addition to the two feeding elements, a non-feeding element is also arranged in a stacked manner.

[0090] Figure 12 FIG. 10 is a side perspective view of the antenna module 100E according to Embodiment 2. In the antenna module 100E, the following structure is adopted: On the basis of the antenna module 100 of Embodiment 1, a radiating element 123 is further arranged at a position closer to the upper surface 131 of the dielectric substrate 130 than the radiating element 121. In addition, in the antenna module 100E, instead of the feeding wirings 141A, 141B and the path electrode VG of the antenna module 100, feeding wirings 143A, 143B and a path electrode VG5 are provided.

[0091] In the antenna module 100E, the radiating element 121 is a non-feeding element, and the radiating element 123 is a feeding element. Openings OPG1, OP1A, and OP1B are formed in the radiating element 121.

[0092] The feeding wiring 143A penetrates through the opening OP2A of the radiating element 122 and the opening OP1A of the radiating element 121 from the RFIC 110 and is connected to the feeding point SP3A of the radiating element 123. The feeding wiring 143B penetrates through the opening OP2B of the radiating element 122 and the opening OP1B of the radiating element 121 from the RFIC 110 and is connected to the feeding point SP3B of the radiating element 123. In addition, the path electrode VG5 penetrates through the opening OPG2 formed in the central portion of the radiating element 122 and the opening OPG1 formed in the central portion of the radiating element 121 and is capacitively coupled to the center of the radiating element 123. In addition, the path electrode VG5 may also be capacitively coupled to the radiating element 123.

[0093] The size of the radiation element 123 is smaller than that of the radiation element 121. Therefore, by supplying a high-frequency signal corresponding to the resonance frequency of the radiation element 123 to the radiation element 123 via the feeding wirings 143A and 143B, radio waves in a frequency band higher than that of the radiation element 121 are radiated from the radiation element 123. In addition, by supplying a high-frequency signal corresponding to the resonance frequency of the radiation element 121 to the feeding wirings 143A and 143B, radio waves are radiated from the radiation element 121. In other words, the antenna module 100E can function as a triple-band type antenna module capable of radiating radio waves in three different frequency bands (for example, 28 GHz, 39 GHz, and 60 GHz).

[0094] In addition, by setting the resonance frequency of the radiation element 123 to a frequency (for example, 46 GHz) that is slightly higher than the frequency band of the radiation element 121 and at which the radiation element 121 can also resonate, the frequency band of the radiation element 121 can be substantially expanded.

[0095] In addition, the "radiation elements 121, 122, 123" in Embodiment 2 respectively correspond to the "third radiation element", "second radiation element", and "first radiation element" in the present disclosure. The "feeding wiring 143A" and "feeding wiring 143B" in Embodiment 2 respectively correspond to the "first feeding wiring" and "third feeding wiring" in the present disclosure.

[0096] (Modification 5)

[0097] In Modification 5, the following structure is described: a non-fed element is arranged at a position on the upper surface side of the dielectric substrate with respect to the two feeding elements.

[0098] Figure 13 is a side perspective view of the antenna module 100F of Modification 5. In the antenna module 100F, similar to the antenna module 100E of Embodiment 2, the following structure is provided: a radiation element 123 having a size smaller than that of the radiation element 122 is further arranged at a position on the upper surface 131 side of the dielectric substrate 130 with respect to the radiation element 121. However, in the antenna module 100F, the radiation elements 121 and 122 are feeding elements, and the radiation element 123 is configured as a non-fed element.

[0099] More specifically, in the radiation element 121, similar to the antenna module 100 of Embodiment 1, high-frequency signals are respectively supplied to the feeding points SP1A and SP1B through the feeding wirings 141A and 141B. In addition, in the radiation element 122, high-frequency signals are respectively supplied to the feeding points SP2A and SP2B through the feeding wirings 142A and 142B. The via electrode VG5 penetrates through the opening OPG2 formed in the center of the radiation element 122 and the opening OPG1 formed in the center of the radiation element 121 and is electrically coupled to the center of the radiation element 123.

[0100] In the case of the antenna module 100F, a high-frequency signal cannot be independently supplied to the radiation element 123 as in the antenna module 100E of the second embodiment. In the antenna module 100F, the size of the radiation element 123 is set to be slightly smaller than the size of the radiation element 121, and is configured such that when a high-frequency signal is supplied to the radiation element 121, the radiation element 123 resonates together therewith. Thereby, the frequency band of the radiation element 121 can be expanded to the high-frequency side.

[0101] In addition, the "radiation elements 121, 122, 123" in Modification 5 respectively correspond to the "first radiation element", "second radiation element", and "fourth radiation element" in the present disclosure.

[0102] [Aspect]

[0103] (First item) An antenna module according to one aspect includes: a dielectric substrate; a ground electrode disposed on the dielectric substrate; a first radiation element and a second radiation element having a flat plate shape; a first feeding wiring and a second feeding wiring; and a via electrode connected to the ground electrode. The first radiation element is disposed on the dielectric substrate facing the ground electrode. The second radiation element is disposed between the first radiation element and the ground electrode. The first feeding wiring penetrates the second radiation element and transmits a high-frequency signal to the first radiation element. The second feeding wiring transmits a high-frequency signal to the second radiation element. The first feeding wiring is electrically coupled to the first radiation element at a position offset in a first direction with respect to the center of the first radiation element. The second feeding wiring is electrically coupled to the second radiation element at a position offset in a second direction different from the first direction with respect to the center of the second radiation element. The size of the second radiation element is larger than the size of the first radiation element. An opening is formed in the central portion of the second radiation element. The via electrode penetrates the opening of the second radiation element and is electrically coupled to the central portion of the first radiation element.

[0104] (Second item) In the antenna module according to the first item, the via electrode is connected to the first radiation element.

[0105] (Third item) In the antenna module according to the first item, the via electrode is capacitively coupled to the first radiation element.

[0106] (Fourth item) In the antenna module according to any one of the first to third items, the via electrode includes: a first portion connected to the ground electrode; and a second portion capacitively coupled to the first portion and disposed between the first portion and the first radiation element.

[0107] (Fifth item) In the antenna module according to any one of the first to fourth items, the via electrode has the following structure: between the ground electrode and the first radiation element, the vias of different layers constituting the via electrode are offset.

[0108] (Item 6) The antenna module according to any one of Items 1 to 5 further includes a third feeding wiring that penetrates the second radiating element and transmits a high-frequency signal to the first radiating element. The third feeding wiring is electrically coupled to the first radiating element at a position offset in a third direction with respect to the center of the first radiating element.

[0109] (Item 7) The antenna module according to Item 6 further includes a fourth feeding wiring that transmits a high-frequency signal to the second radiating element. The fourth feeding wiring is electrically coupled to the second radiating element at a position offset in a fourth direction different from the second direction with respect to the center of the second radiating element.

[0110] (Item 8) In the antenna module according to Item 7, when viewed from the normal direction of the dielectric substrate, the center of the first radiating element overlaps with the center of the second radiating element. The third direction is a direction opposite to the second direction with respect to the center of the first radiating element. The fourth direction is a direction opposite to the first direction with respect to the center of the first radiating element.

[0111] (Item 9) In the antenna module according to Item 8, when viewed from the normal direction of the dielectric substrate, the first direction is orthogonal to the third direction.

[0112] (Item 10) The antenna module according to Item 1 further includes a flat third radiating element disposed between the first radiating element and the second radiating element. The first feeding wiring and the via electrode penetrate the third radiating element and reach the first radiating element. The size of the third radiating element is larger than the size of the first radiating element and smaller than the size of the second radiating element.

[0113] (Item 11) In the antenna module according to Item 1, the dielectric substrate has a first surface and a second surface facing each other. The ground electrode is disposed at a position closer to the second surface than the first radiating element. The antenna module further includes a flat fourth radiating element disposed at a position closer to the first surface than the first radiating element. The size of the fourth radiating element is smaller than the size of the first radiating element.

[0114] (Item 12) In the antenna module according to Item 11, the via electrode penetrates the first radiating element and is electrically coupled to the central portion of the fourth radiating element.

[0115] (Item 13) The antenna module according to one aspect includes: a dielectric substrate; a ground electrode disposed on the dielectric substrate; a first radiation element and a second radiation element having a flat plate shape; a first feeding line and a second feeding line; and a via electrode connected to the ground electrode. The first radiation element is disposed on the dielectric substrate facing the ground electrode. The second radiation element is disposed between the first radiation element and the ground electrode. The first feeding line penetrates the second radiation element and transmits a high-frequency signal to the first radiation element. The second feeding line transmits a high-frequency signal to the second radiation element. The first feeding line is electrically coupled to the first radiation element at a position offset in a first direction with respect to the center of the first radiation element. The second feeding line is electrically coupled to the second radiation element at a position offset in a second direction different from the first direction with respect to the center of the second radiation element. The size of the second radiation element is larger than that of the first radiation element. An opening is formed in the central portion of the second radiation element. The via electrode penetrates the opening of the second radiation element.

[0116] (Item 14) The antenna module according to one aspect includes: a dielectric substrate; a ground electrode disposed on the dielectric substrate; a first radiation element and a second radiation element having a flat plate shape; a first feeding line and a second feeding line; and a via electrode having a first end portion and a second end portion. The first radiation element is disposed on the dielectric substrate facing the ground electrode. The second radiation element is disposed between the first radiation element and the ground electrode. The first feeding line penetrates the second radiation element and transmits a high-frequency signal to the first radiation element. The second feeding line transmits a high-frequency signal to the second radiation element. The first feeding line is electrically coupled to the first radiation element at a position offset in a first direction with respect to the center of the first radiation element. The second feeding line is electrically coupled to the second radiation element at a position offset in a second direction different from the first direction with respect to the center of the second radiation element. The size of the second radiation element is larger than that of the first radiation element. An opening is formed in the central portion of the second radiation element. The first end portion of the via electrode is connected to the ground electrode. The second end portion of the via electrode is located at the position of the second radiation element in the normal direction of the dielectric substrate, or at the position between the second radiation element and the first radiation element in the normal direction of the dielectric substrate. In a plan view from the normal direction of the dielectric substrate, the second end portion overlaps with the opening.

[0117] (Item 15) The antenna module according to any one of Items 1 to 14 further includes a feeding device for supplying a high-frequency signal to the first radiation element and the second radiation element.

[0118] (Item 16) The communication device according to one aspect includes the antenna module according to any one of Items 1 to 15.

[0119] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The scope of the present invention is represented by the claims, rather than by the description of the above embodiments, and the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the claims.

[0120] Description of Reference Numerals

[0121] 10: Communication device; 100, 100A to 100F, 100X: Antenna module; 110: RFIC; 110A to 110D: Feeding circuit; 111A to 111D, 113A to 113D, 117: Switch; 112AR to 112DR: Low-noise amplifier; 112AT to 112DT: Power amplifier; 114A to 114D: Attenuator; 115A to 115D: Phase shifter; 116: Signal combiner / divider; 118: Mixer; 119: Amplification circuit; 120: Antenna device; 121 to 123: Radiating element; 125: Antenna element; 130: Dielectric substrate; 131: Upper surface; 132: Lower surface; 141A to 1413A, 141B to 143B: Feeding wiring; 160: Solder bump; 170: Flat electrode; 200: BBIC; BW1, BW2: Frequency band; GND: Ground electrode; OP1A, OP1B, OP2A, OP2B, OPG1, OPG2: Opening; SP1A to SP3A, SP1B to SP3B: Feeding point; VG, VG1 to VG5: Path electrode; VG2A, VG3A: First part; VG2B, VG3B: Second part.

Claims

1. An antenna module, comprising: A dielectric substrate; A ground electrode disposed on the dielectric substrate; A first radiation element in a flat plate shape, disposed on the dielectric substrate facing the ground electrode; A second radiation element in a flat plate shape, disposed between the first radiation element and the ground electrode; A first feeding wiring passing through the second radiation element to transmit a high-frequency signal to the first radiation element; A second feeding wiring for transmitting a high-frequency signal to the second radiation element; And A via electrode connected to the ground electrode, wherein the first feeding wiring is electrically coupled to the first radiation element at a position offset in a first direction with respect to the center of the first radiation element, the second feeding wiring is electrically coupled to the second radiation element at a position offset in a second direction different from the first direction with respect to the center of the second radiation element, the size of the second radiation element is larger than the size of the first radiation element, an opening is formed in the central portion of the second radiation element, the via electrode passes through the opening of the second radiation element and is electrically coupled to the central portion of the first radiation element.

2. The antenna module according to claim 1, wherein the via electrode is connected to the first radiation element.

3. The antenna module according to claim 1, wherein the via electrode is capacitively coupled to the first radiation element.

4. The antenna module according to any one of claims 1 to 3, wherein the via electrode includes: A first portion connected to the ground electrode; and A second portion capacitively coupled to the first portion and disposed between the first portion and the first radiation element.

5. The antenna module according to any one of claims 1 to 4, wherein the via electrode has the following structure: between the ground electrode and the first radiation element, the vias of different layers constituting the via electrode are offset.

6. The antenna module according to any one of claims 1 to 5, wherein a third feeding wiring is further provided, the third feeding wiring passes through the second radiation element to transmit a high-frequency signal to the first radiation element, the third feeding wiring is electrically coupled to the first radiation element at a position offset in a third direction different from the first direction with respect to the center of the first radiation element.

7. The antenna module according to claim 6, wherein a fourth feeding wiring is further provided, the fourth feeding wiring transmits a high-frequency signal to the second radiation element, the fourth feeding wiring is electrically coupled to the second radiation element at a position offset in a fourth direction different from the second direction with respect to the center of the second radiation element.

8. The antenna module according to claim 7, wherein in a plan view from the normal direction of the dielectric substrate, the center of the first radiation element overlaps with the center of the second radiation element, the third direction is a direction opposite to the second direction with respect to the center of the first radiation element, The fourth direction is a direction opposite to the first direction with respect to the center of the first radiating element.

9. The antenna module according to claim 8, wherein When viewed from the normal direction of the dielectric substrate, the first direction is orthogonal to the third direction, and the second direction is orthogonal to the fourth direction.

10. The antenna module according to claim 1, wherein It further includes a third radiating element in a flat plate shape, and the third radiating element is disposed between the first radiating element and the second radiating element. The first feeding wiring and the via electrode penetrate through the third radiating element and reach the first radiating element. The size of the third radiating element is larger than the size of the first radiating element, and the size of the third radiating element is smaller than the size of the second radiating element.

11. The antenna module according to claim 1, wherein The dielectric substrate has a first surface and a second surface facing each other. The ground electrode is disposed at a position closer to the second surface side than the first radiating element. The antenna module further includes a fourth radiating element in a flat plate shape disposed at a position closer to the first surface side than the first radiating element. The size of the fourth radiating element is smaller than the size of the first radiating element.

12. The antenna module according to claim 11, wherein The via electrode penetrates through the first radiating element and is electrically coupled to the central portion of the fourth radiating element.

13. An antenna module, comprising: A dielectric substrate; A ground electrode disposed on the dielectric substrate; A first radiating element in a flat plate shape disposed on the dielectric substrate facing the ground electrode; A second radiating element in a flat plate shape disposed between the first radiating element and the ground electrode; A first feeding wiring that penetrates through the second radiating element and transmits a high-frequency signal to the first radiating element; A second feeding wiring that transmits a high-frequency signal to the second radiating element; And A via electrode connected to the ground electrode, wherein the first feeding wiring is electrically coupled to the first radiating element at a position offset in a first direction with respect to the center of the first radiating element. The second feeding wiring is electrically coupled to the second radiating element at a position offset in a second direction different from the first direction with respect to the center of the second radiating element. The size of the second radiating element is larger than the size of the first radiating element. An opening is formed in the central portion of the second radiating element. The via electrode penetrates through the opening of the second radiating element.

14. An antenna module, comprising: A dielectric substrate; A ground electrode disposed on the dielectric substrate; A first radiating element in a flat plate shape disposed on the dielectric substrate facing the ground electrode; A second radiating element in a flat plate shape disposed between the first radiating element and the ground electrode; A first feeding wiring that penetrates through the second radiating element and transmits a high-frequency signal to the first radiating element; A second feeding wiring that transmits a high-frequency signal to the second radiating element; And A via electrode having a first end portion and a second end portion. Among them, the first feeding wiring is electrically coupled to the first radiating element at a position offset in a first direction with respect to the center of the first radiating element. The second feeding wiring is electrically coupled to the second radiating element at a position offset in a second direction different from the first direction with respect to the center of the second radiating element. The size of the second radiating element is larger than the size of the first radiating element. An opening is formed in the central portion of the second radiating element. The first end of the via electrode is connected to the ground electrode. The second end of the via electrode is located at the position of the second radiating element in the normal direction of the dielectric substrate, or at the position between the second radiating element and the first radiating element in the normal direction of the dielectric substrate. In a plan view from the normal direction of the dielectric substrate, the second end overlaps with the opening.

15. The antenna module according to any one of claims 1 to 14, wherein a feeding device is further provided, and the feeding device is configured to supply a high-frequency signal to the first radiating element and the second radiating element.

16. A communication device, comprising the antenna module according to any one of claims 1 to 15.

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