Microelectronic industry gas uniformizing disc cleaning technology

Abstract

The invention relates to the technical field of electronic cleaning, and discloses a microelectronic industry gas uniformizing disc cleaning technology which is used for cleaning a gas uniformizing disc through the steps of material preparation before cleaning, rough cleaning vacuum chip removal, fine cleaning vacuum chip removal, spray cleaning, air knife liquid cutting, acid etching soaking cleaning, in-tank soaking rinsing, wind cutting centrifugal spin-drying, manual blanking detection and the like in sequence. The cleaning basket adopts an edge clamp avoiding the micropore part in the middle of the gas uniformizing disc, and parameters of each cleaning step are clear, such as frequency, vacuum degree and time of rough cleaning and fine cleaning vacuum chip removal, pressure and time of spray cleaning, workpiece rotating speed and the like. According to the technology, a degreasing-spraying-acid etching three-section cleaning technology is adopted to complete cleaning of the gas uniformizing disc, dirt such as dust and burrs on the surface of the gas uniformizing disc and in micropores can be effectively removed, and the cleaning quality is improved; labor investment and acid liquor consumption are reduced, and the cost is reduced; the production efficiency is improved; and the cleaning device is more environment-friendly and is suitable for cleaning the gas uniformizing discs of different models and specifications.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic cleaning, specifically to the cleaning technology of the gas distribution plate in the microelectronics industry. Background Art

[0002] In the microelectronics industry, the semiconductor gas distribution plate plays a crucial role. It can precisely mix, pressurize, purify, and transport various gases, providing a reliable, efficient, environmentally friendly, and high-quality gas mixing solution for the microelectronics process, and strongly promoting the development of the microelectronics industry. With the continuous progress of microelectronics technology and the continuous growth of market demand, the requirements for the cleaning quality of semiconductor gas distribution plates are also increasing day by day. At present, the existing cleaning process of the gas distribution plate usually uses strong acid corrosion and multiple ultra-pure water rinsing methods to remove dirt such as dust and burrs in the micro-holes. The specific process is as follows: Manually load 1 pcs of the cleaning material into the cleaning basket, and then manually transport the material through steps such as acid etching immersion, multiple rinsing, and centrifugal drying. After cleaning, it is also necessary to magnify and check for residual burrs in the micro-holes. If there are residues, they are manually removed and then re-cleaned until the cleaning is completed.

[0003] Although this existing cleaning process has the advantages of relatively small upfront capital investment in equipment and manual controllability during the cleaning process, it also has many obvious disadvantages: First, the entire cleaning process requires a large amount of manual operation, resulting in a large investment in personnel, slow cleaning speed, and low efficiency, thus greatly increasing the labor cleaning cost and operating cost of the product; Second, a large amount of acid is used during the cleaning process, and the amount of waste liquid discharged is also large, causing a greater impact on the environment; Third, the burrs in the micro-holes are often not completely removed after cleaning, and manual removal is required again, which not only increases the labor cost but also makes it difficult to ensure the consistency of the cleaning quality. Therefore, we have proposed the cleaning technology of the gas distribution plate in the microelectronics industry. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides the cleaning technology of the gas distribution plate in the microelectronics industry, which solves the above problems.

[0005] To achieve the above object, the present invention provides the following technical solution: The cleaning technology of the gas distribution plate in the microelectronics industry includes the following steps: S1: Prepare materials before cleaning, manually load and frame, clean 1 pcs each time, press the button to enter the basket, and automatically enter the cleaning basket for cleaning; S2: Coarse cleaning and vacuum chip removal, use degreasing agent for ultrasonic cleaning; S3: Fine cleaning and vacuum chip removal, use degreasing agent for ultrasonic cleaning; S4: Spray cleaning, use ultra-pure water circulating filtration to directly spray and clean both sides of the semiconductor gas distribution plate workpiece; S5: Air knife liquid cutting. After spray cleaning, use an air knife to quickly remove most of the water on the surface of the gas distributor plate. S6: Acid etching immersion cleaning. Adopt the bottom-in liquid feeding method to perform acid etching immersion cleaning on the semiconductor gas distributor plate workpiece, and then spray and rinse the front and back sides of the semiconductor gas distributor plate workpiece with ultrapure water to remove the residual acid on the surface. S7: Tank immersion rinsing. Adopt the bottom-in liquid feeding method to convey rinsing ultrapure water, perform ultrasonic rinsing on the semiconductor gas distributor plate workpiece, and then spray and rinse the front and back sides of the semiconductor gas distributor plate workpiece with ultrapure water. S8: Air knife cutting, centrifugal drying. S9: Manual blanking inspection.

[0006] Preferably, in S1, the cleaning basket adopts edge clamps, and the clamp position avoids the middle micropore part of the gas distributor plate.

[0007] Preferably, in S2, the rough cleaning vacuum chip removal specifically includes: adopting ultrasonic cleaning technology, setting the cleaning frequency to 68KHz, keeping the vacuum degree at -50KPa, making the gas distributor plate hover and clean in the cleaning liquid through bottom vibration, controlling the time within 2 - 3min, and using a conventional degreasing agent for cleaning at room temperature.

[0008] Preferably, in S3, the fine cleaning vacuum chip removal specifically includes: adopting ultrasonic cleaning technology, setting the cleaning frequency to 68KHz, keeping the vacuum degree at -50KPa, making the gas distributor plate hover and clean in the cleaning liquid through bottom vibration, controlling the time within 2 - 3min, and using a conventional degreasing agent for cleaning at room temperature.

[0009] Preferably, in S4, the spray cleaning specifically includes: applying an ultrapure water circulation filtration system, with a spray pressure of 100KG (300bar), through the spray heads distributed on the upper and lower sides of the workpiece, adopting a direct spray mode to spray each side of the gas distributor plate for 5min, and at the same time, controlling the rotation speed of the workpiece base to be 1.00rpm and the coordinate rotation speed of the workpiece to be 5mm / sec.

[0010] Preferably, in S6, the acid etching immersion cleaning specifically includes: connecting the base of the gas distributor plate to the liquid inlet pipe, adopting the method of delivering acid liquid from the bottom upwards through the micropores for acid etching immersion cleaning, controlling the time within 2 - 3min, and adopting a slow inlet and fast discharge mode for the inlet and outlet liquid.

[0011] Preferably, in S7, the tank immersion rinsing specifically includes: connecting the base of the gas distributor plate to the liquid inlet pipe again, delivering rinsing ultrapure water from the bottom upwards through the micropores, and when the liquid level reaches 20mm above the workpiece surface, start ultrasonic rinsing for 5 - 6min.

[0012] Preferably, the spray rinsing of the semiconductor gas distributor workpiece with ultrapure water after the acid etching immersion cleaning in S6 and the tank immersion rinsing in S7 specifically includes: both use an ultrapure water circulation filtration system, with a spray pressure of 3-5 kg, and the spray rinsing time for both the front and back sides of the gas distributor workpiece is 5-6 min.

[0013] Preferably, the air knife and centrifugal drying in S8 specifically include: adopting a combination of air knife and centrifugal drying, and thoroughly removing the moisture on the surface of the gas distributor within 5-6 min to make it reach a dry state.

[0014] Preferably, for the rough cleaning vacuum chip removal in S2, the fine cleaning vacuum chip removal in S3, the spray cleaning in S4, the acid etching immersion cleaning in S6, and the tank immersion rinsing in S7, in the actual application process, according to different models and specifications of the gas distributor workpieces, some cleaning parameters can be appropriately adjusted to achieve the best cleaning effect.

[0015] Compared with the prior art, the present invention provides a cleaning technology for gas distributors in the microelectronics industry, having the following beneficial effects: Significantly improved cleaning effect: Through the rough cleaning and fine cleaning vacuum chip removal steps, using ultrasonic technology and degreasing and defatting agents, the dust, oil stains and other attached dirt on the surface of the gas distributor are effectively removed; the spray cleaning can remove most of the visible burrs in the micropores, and the acid etching immersion cleaning and the tank immersion rinsing further remove the surface attached dirt and the invisible tiny burrs in the pores. This technology uses a three-stage cleaning technology of degreasing - spraying - acid etching to complete the cleaning of the gas distributor, comprehensively improving the cleanliness of the gas distributor; The parameters of each cleaning step are clear and controllable, such as the frequency, vacuum degree, time of ultrasonic cleaning, the pressure, time, workpiece rotation speed of spray cleaning, etc., ensuring that each cleaning can achieve a stable and high-quality effect, and reducing the product quality differences caused by inconsistent cleaning.

[0016] Effectively reduce costs: The use of an automatic loading basket cleaning and handling device reduces the manual operation links and lowers the manual cleaning cost; from the loading and framing before cleaning to the connection of each cleaning step, and then to the final unloading and inspection, some processes are automated, reducing the dependence on a large number of manual workers; The acid etching immersion cleaning adopts a bottom-in liquid feeding method and a slow-in fast-out mode, specifically cleaning the micropores, reducing the consumption of acid solution. At the same time, the degreasing and spraying steps before acid etching remove most of the dirt, further reducing the consumption of acid solution during the acid etching process and lowering the operating cost.

[0017] Greatly improve production efficiency: The entire cleaning process is reasonably designed, and each step is closely connected without the need for repeated cleaning. For example, the spray cleaning can quickly remove most of the visible burrs, avoiding the complexity and time consumption of subsequent acid etching treatment, making the production rhythm meet the production requirements, greatly shortening the cleaning time, and improving the production efficiency; Due to the reduction in the amount of acid solution used, the corresponding amount of waste liquid discharged is also significantly reduced, thereby reducing environmental pollution. At the same time, the use of the ultra-pure water circulation filtration system improves the utilization rate of water resources, meeting environmental protection requirements.

[0018] The cleaning basket uses edge clamps, and the clamp position avoids the middle micro-hole part of the air distribution plate, preventing damage to the micro-holes during the clamping process, ensuring the original structure and performance of the air distribution plate, and improving the yield rate of the product. Brief Description of the Drawings

[0019] Figure 1 This is a schematic diagram of the cleaning technical process of the air distribution plate in the microelectronics industry according to the present invention. Detailed Embodiments

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figure 1 , the cleaning technology of the air distribution plate in the microelectronics industry includes the following specific steps: S1: Preparation before cleaning The operator needs to first perform the preparation work before cleaning. Manually load and frame the air distribution plate to be cleaned, with only 1 piece (pcs) loaded each time to ensure the accuracy of the cleaning process. When framing, the cleaning basket used adopts edge clamps, and it is necessary to ensure that the clamp position avoids the middle micro-hole part of the air distribution plate to prevent the clamp from damaging the micro-holes. After the framing is completed, the operator presses the button to enter the basket, and the air distribution plate will automatically enter the cleaning basket, thus starting the subsequent cleaning process.

[0022] S2: Coarse cleaning and vacuum chip removal This step uses ultrasonic technology combined with degreasing and defatting agents for cleaning. The specific operation is as follows: Adopt ultrasonic cleaning technology, set the cleaning frequency to 68KHz, and keep the vacuum degree at -50KPa. Through bottom vibration, the air distribution plate is suspended and cleaned in the cleaning liquid containing conventional degreasing agent. The cleaning process is carried out at room temperature, and the time is controlled within 2 - 3 minutes. During this period, the cavitation effect of ultrasonic waves and the action of the degreasing agent can effectively remove the attached dirt such as dust and oil on the surface of the air distribution plate.

[0023] S3: Washing and vacuum chip removal The fine cleaning and vacuum debris removal step is similar to the rough cleaning. The ultrasonic cleaning technology is also adopted, with the frequency set at 68KHz and the vacuum degree maintained at -50KPa. Through the bottom vibration method, the air distribution plate hovers and cleans in the conventional degreasing agent cleaning solution at room temperature for 2 - 3 minutes. This step is a further supplement and improvement to the rough cleaning, ensuring that the dirt on the surface is removed more thoroughly.

[0024] S4: Spray cleaning Use the ultra-pure water circulation filtration system for spray cleaning. Set the spray pressure to 100KG (300bar). Through the spray heads distributed on the upper and lower surfaces of the workpiece, spray the front and back surfaces of the air distribution plate for 5 minutes each in the direct spray mode. At the same time, control the rotation speed of the workpiece base to be 1.00rpm and the coordinate rotation speed of the workpiece to be 5mm / sec. Such operations can make the spray cleaning more comprehensive and uniform, effectively removing most of the visible burrs in the micro-holes (observed under a 120 - fold microscope).

[0025] S5: Air knife liquid cutting After spray cleaning, immediately use the air knife to perform liquid cutting on the surface of the air distribution plate. The air knife can quickly remove most of the water on the surface of the air distribution plate, reduce the influence of water on the acid concentration during subsequent acid etching immersion cleaning, improve the acid etching effect, and also shorten the subsequent drying time.

[0026] S6: Acid etching immersion cleaning and ultra-pure water spray rinsing Connect the base of the air distribution plate to the inlet pipe, and perform acid etching immersion cleaning by delivering acid solution from the bottom upwards through the micro-holes. Control the acid etching immersion time within 2 - 3 minutes, and adopt the slow inlet and fast discharge mode for the inlet and outlet of the liquid. This targeted cleaning method can reduce the consumption of acid solution and accurately remove the dirt in the micro-holes. After the acid etching immersion is completed, use the ultra-pure water circulation filtration system to perform spray rinsing on the front and back surfaces of the air distribution plate workpiece for 5 - 6 minutes at a spray pressure of 3 - 5 kg, aiming to remove the residual acid solution on the surface and prevent the residual acid solution from corroding the air distribution plate.

[0027] S7: Tank immersion rinsing and ultra-pure water spray rinsing Connect the base of the air distribution plate to the inlet pipe again, and deliver rinsing ultra-pure water from the bottom upwards through the micro-holes. When the liquid level reaches 20mm above the surface of the workpiece, start ultrasonic rinsing for 5 - 6 minutes. The synergistic effect of ultrasonic rinsing and bottom liquid inlet can further remove the dirt attached to the surface of the air distribution plate and the invisible micro-burrs in the holes (invisible under a 120 - fold microscope). Then, also use the ultra-pure water circulation filtration system to perform spray rinsing on the front and back surfaces of the air distribution plate workpiece for 5 - 6 minutes at a spray pressure of 3 - 5 kg to ensure that there is no residual acid solution on the surface.

[0028] S8: Air knife cutting and centrifugal drying Adopt a combination of air shear and centrifugal drying to completely remove the moisture on the surface of the gas distributor plate within 5-6 minutes, making the gas distributor plate reach a dry state, which is convenient for subsequent detection and use.

[0029] S9: Manual blanking detection After the cleaning is completed, the operator manually takes out the gas distributor plate from the equipment and conducts a comprehensive inspection. The inspection contents include the cleanliness of the surface of the gas distributor plate, the residue in the micro-holes, etc., to ensure that the cleaned gas distributor plate meets the usage standards of the microelectronics industry.

[0030] Parameter adjustment: In the actual application process, due to the differences in the micro-hole density, dirtiness degree, etc. of gas distributor plate workpieces of different models and specifications, for steps such as rough cleaning vacuum chip removal in S2, fine cleaning vacuum chip removal in S3, spray cleaning in S4, acid etching immersion cleaning in S6, and tank immersion rinsing in S7, some cleaning parameters can be appropriately adjusted according to specific situations. For example, for gas distributor plates with a larger micro-hole density or a more serious dirtiness degree, the cleaning time can be appropriately extended, the spray pressure can be increased, or the ultrasonic power can be adjusted, etc., to achieve the best cleaning effect.

[0031] In the cleaning technology of the gas distributor plate for the microelectronics industry in the present invention, a three-stage cleaning technology is adopted: a degreasing-spraying-acid etching three-stage cleaning technology. Each stage has a clear division of labor and works synergistically, effectively improving the cleaning effect. The degreasing stage removes the surface oil and dust, the spraying stage removes most of the visible burrs, and the acid etching stage precisely removes the dirt in the micro-holes, ensuring the cleaning quality of the gas distributor plate.

[0032] Design of the cleaning basket fixture: The cleaning basket adopts edge fixtures, and the fixture positions cleverly avoid the middle micro-hole part of the gas distributor plate, avoiding damage to the micro-holes during the clamping process, and at the same time ensuring the stability of the gas distributor plate during the cleaning process and improving the reliability of the cleaning.

[0033] Adopt the bottom liquid inlet cleaning method: Both the acid etching immersion cleaning and the tank immersion rinsing adopt the method of using a bottom liquid inlet pipe to specifically clean the micro-holes, which is the biggest innovation point of this technical method. This method can make the cleaning liquid directly act on the micro-holes, reduce the usage amount of acid liquid and ultrapure water, and at the same time precisely remove the dirt, greatly improving the cleaning efficiency and quality.

[0034] According to gas distributor plates of different models and specifications, some cleaning parameters can be appropriately adjusted to achieve the best cleaning effect.

[0035] Through the rough cleaning vacuum chip removal in step S2 and the fine cleaning vacuum chip removal in step S3, the attached dirt such as dust can be effectively removed; through the spray cleaning in step S4 and the air knife liquid cutting in step S5, most of the visible burrs (under 120 - fold microscope) in the micro - holes can be removed; through the acid etching immersion cleaning in step S6 and the in - tank immersion rinsing in step S7, the attached dirt on the surface and the invisible micro - burrs in the holes can be removed, greatly reducing the error of the air - distributing plate micro - holes caused by the invisible (120 - fold microscope) burrs, significantly improving the cleaning quality of the air - distributing plate, ensuring its performance and stability in the micro - electronics industry, and making the cleaning effect significantly improved.

[0036] Cost reduction and environmental protection: By adopting the automatic cleaning and handling device, the labor input is reduced, and the labor cleaning cost is lowered; at the same time, by optimizing the cleaning process, the usage amount of acid and the waste liquid discharge amount are reduced, which not only reduces the operation cost but also mitigates the impact on the environment, achieving a win - win situation for economic and environmental benefits.

[0037] Improving production efficiency: The cleaning process of the present invention has been verified and does not require repeated cleaning. Each cleaning step is closely connected, and the production rhythm meets the production requirements, greatly shortening the cleaning time, improving the production efficiency, and meeting the high - efficiency requirements for the cleaning of the air - distributing plate in the micro - electronics industry.

[0038] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. The cleaning technology of the gas distribution plate in the microelectronics industry is characterized in that It includes the following steps: S1: Prepare materials before cleaning, manually load the frame, clean 1 pcs each time, press the basket loading button, and automatically load it into the cleaning basket for cleaning; S2: Coarse cleaning with vacuum chip removal, and use degreasing agent for ultrasonic cleaning; S3: Fine cleaning with vacuum chip removal, and use degreasing agent for ultrasonic cleaning; S4: Spray cleaning, use ultra-pure water circulation filtration to directly spray and clean both the front and back sides of the semiconductor gas distributor workpiece; S5: Air knife liquid cutting, after spray cleaning, use the air knife to quickly remove most of the water on the surface of the gas distributor; S6: Acid etching immersion cleaning, adopt the bottom-up liquid inlet method to carry out acid etching immersion cleaning on the semiconductor gas distributor workpiece, and then spray rinse both the front and back sides of the semiconductor gas distributor workpiece with ultra-pure water to remove the residual acid on the surface; S7: In-tank immersion rinsing, adopt the bottom-up liquid inlet method to transport rinsing ultra-pure water, ultrasonically rinse the semiconductor gas distributor workpiece, and then spray rinse both the front and back sides of the semiconductor gas distributor workpiece with ultra-pure water; S8: Air knife cutting, centrifugal drying; S9: Manually unload and inspect.

2. The microelectronic industry air distribution plate cleaning technology according to claim 1, characterized in that, In S1, the cleaning basket adopts edge clamps, and the clamp position avoids the middle micro-hole part of the gas distributor.

3. The microelectronic industry air distribution plate cleaning technology according to claim 1, wherein The specific steps of the coarse cleaning with vacuum chip removal in S2 include: adopt ultrasonic cleaning technology, set the cleaning frequency to 68KHz, keep the vacuum degree at -50KPa, make the gas distributor hover in the cleaning liquid for cleaning by bottom vibration, control the time within 2 - 3min, and use conventional degreasing agent for cleaning at room temperature.

4. The microelectronic industry air distribution plate cleaning technology according to claim 1, wherein The specific steps of the fine cleaning with vacuum chip removal in S3 include: adopt ultrasonic cleaning technology, set the cleaning frequency to 68KHz, keep the vacuum degree at -50KPa, make the gas distributor hover in the cleaning liquid for cleaning by bottom vibration, control the time within 2 - 3min, and use conventional degreasing agent for cleaning at room temperature.

5. The microelectronic industry gas distributor cleaning technology according to claim 1, wherein The specific steps of the spray cleaning in S4 include: use the ultra-pure water circulation filtration system, with a spray pressure of 100KG (300bar), through the spray heads distributed on both the upper and lower sides of the workpiece, adopt the direct spray mode to spray both the front and back sides of the gas distributor for 5min each, and at the same time, control the rotation speed of the workpiece base to be 1.00rpm and the coordinate rotation speed of the workpiece to be 5mm / sec.

6. The microelectronic industry air distribution plate cleaning technology according to claim 1, wherein, The specific steps of the acid etching immersion cleaning in S6 include: connect the base of the gas distributor to the inlet pipe, adopt the method of transporting acid liquid from the bottom through the micro-holes for acid etching immersion cleaning, control the time within 2 - 3min, and adopt the slow inlet and fast discharge mode for the inlet and outlet liquid.

7. The microelectronic industry gas distributor cleaning technology according to claim 1, characterized in that, The specific steps of the in-tank immersion rinsing in S7 include: connect the base of the gas distributor to the inlet pipe again, transport rinsing ultra-pure water from the bottom through the micro-holes, and start ultrasonic rinsing for 5 - 6min when the liquid level reaches 20mm above the workpiece surface.

8. The microelectronic industry gas distributor cleaning technology according to claim 1, wherein, The specific steps of spraying and rinsing the semiconductor gas distributor workpiece with ultra-pure water after the acid etching immersion cleaning in S6 and the in-tank immersion rinsing in S7 include: both use the ultra-pure water circulation filtration system, with a spray pressure of 3 - 5 kg, and spray and rinse both the front and back sides of the gas distributor workpiece for 5 - 6min.

9. The microelectronic industry gas distributor cleaning technology according to claim 1, characterized in that The specific steps of air knife cutting and centrifugal drying in S8 include: adopt the combined method of air knife cutting and centrifugal drying to completely remove the water on the surface of the gas distributor within 5 - 6min and make it reach the dry state.

10. The microelectronic industry gas distributor cleaning technology according to claim 1, characterized in that, For the rough cleaning and vacuum chip removal in S2, fine cleaning and vacuum chip removal in S3, spray cleaning in S4, acid etching immersion cleaning in S6, and tank immersion rinsing in S7, during actual application, according to the air distribution plate workpieces of different models and specifications, some cleaning parameters can be appropriately adjusted to achieve the best cleaning effect.

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