Test device and test box
By incorporating a temperature change device and a humidity control system in the test seat, the problem of slow temperature control and large temperature difference of the compressor is solved, and efficient and uniform high and low temperature testing is achieved to ensure the accuracy of the test results and energy-saving effect.
Patent Information
- Application Number
- CN202410047942.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-11
- Publication Date
- 2025-07-11
AI Technical Summary
Among the existing high and low temperature testing methods, the compressor temperature control speed is slow, the cooling time is long, and the temperature unevenness in the temperature box is poor, resulting in low test efficiency and large results errors.
The built-in temperature change device of the test seat is adopted to achieve temperature control through temperature change components, conductors and temperature change pipes. Combined with temperature sensors and control circuit boards, the incremental PID algorithm is used to optimize temperature changes, and combined with insulation parts and humidity controllers to ensure temperature uniformity and test accuracy.
The temperature change efficiency is accelerated, the temperature difference is reduced, the accuracy and reliability of the test results are improved, energy consumption is reduced, and fast and uniform high and low temperature testing is achieved.
Smart Images
Figure CN120294434A_ABST
Abstract
Description
Technical Field
[0001] This application is applied to the technical field of device testing, in particular to a testing device and a testing chamber. Background Art
[0002] Before leaving the factory, electronic devices often need to undergo various tests to determine whether their performance is qualified. Currently, high and low temperature testing is a very important testing link in the production testing process of electronic devices. Therefore, it is very important to create a high and low temperature environment that is fast and balanced for electronic device testing.
[0003] Currently, the commonly used method for high and low temperature testing in production testing is to place multiple electronic devices in a high and low temperature chamber. The chamber exchanges heat with air through a compressor to reduce the air temperature in the chamber to a specified temperature, thereby achieving low temperature testing. For high temperature, hot air is blown through a heating wire to heat the air in the chamber, thereby achieving high temperature testing.
[0004] However, the temperature control speed of the compressor is slow, resulting in a long cooling time, slow testing efficiency, and reduced production capacity. Moreover, the temperature control of the compressor and the temperature control of the hot air blown by the heating wire cannot ensure the temperature uniformity of all spaces inside the chamber, resulting in poor temperature uniformity and large temperature differences on the surface of the electronic device, and there are certain errors in the test results. Summary of the Invention
[0005] This application provides a testing device and a testing chamber to solve the problems of slow efficiency and large temperature difference in high and low temperature testing of electronic devices.
[0006] To solve the above technical problems, this application provides a testing device, including: a testing seat, a testing component, and a temperature-changing device. An installation groove is provided on the testing seat for installing the object to be tested. The testing component is fixedly arranged with the testing seat and extends into the installation groove to connect the object to be tested for testing. The temperature-changing device is fixedly arranged in the testing seat to change the ambient temperature of the object to be tested.
[0007] Among them, the testing seat includes a base and an upper cover. One end of the base is rotatably connected to one end of the upper cover; the installation groove is provided on the side of the base close to the upper cover, and a first cavity is provided in the base. The testing component is fixedly arranged in the first cavity; a pressing plate is provided on the side of the upper cover close to the base, and a second cavity is provided in the upper cover. The temperature-changing device is fixedly arranged in the second cavity; when testing the object to be tested, the upper cover rotates relative to the base until the pressing plate is in contact with the object to be tested.
[0008] Among them, the temperature-changing device includes a temperature-changing component, a conduction piece, and a temperature-changing pipeline. The temperature-changing component is attached to the side of the pressing plate away from the base; the temperature-changing pipeline penetrates the second cavity, and the conduction piece is arranged between the temperature-changing component and the temperature-changing pipeline and is in contact with the temperature-changing component and the temperature-changing pipeline respectively.
[0009] Among them, the variable-temperature pipeline includes a liquid inlet pipeline, a liquid outlet pipeline, an internal pipeline, and a power device; the liquid inlet pipeline, the internal pipeline, and the liquid outlet pipeline are connected in sequence, and the liquid inlet pipeline and the liquid outlet pipeline are inserted into the upper cover so that the internal pipeline is placed inside the second cavity; the power device is arranged inside the liquid inlet pipeline to drive the liquid in the variable-temperature pipeline to flow.
[0010] Among them, the variable-temperature component includes a variable-temperature sheet and a variable-temperature circuit board that are connected to each other, and the variable-temperature circuit board is also connected to the test component; the variable-temperature sheet is attached to the side of the pressing plate away from the base, and the variable-temperature circuit board is fixedly arranged inside the second cavity.
[0011] Among them, the test component includes a control circuit board and a plurality of probes; one end of each probe is connected to the control circuit board; the probes include a first probe and a second probe, and one end of the first probe away from the control circuit board extends to the installation groove to connect the object to be tested for testing. One end of the second probe away from the control circuit board extends into the second cavity to connect to the variable-temperature circuit board.
[0012] Among them, the variable-temperature device further includes a temperature sensor, and the temperature sensor is arranged on the side of the pressing plate close to the base, and the temperature sensor is coupled to the control circuit board.
[0013] Among them, a target pressing block is arranged on the pressing plate, and the position of the target pressing block corresponds to the position of the installation groove, so that when the upper cover and the base rotate relative to each other until they are closed, the target pressing block contacts the object to be tested.
[0014] Among them, heat insulation parts are adhesively and fixedly arranged on the four peripheral edges of the side of the base close to the upper cover and / or the side of the upper cover close to the base.
[0015] To solve the above technical problems, the present application also provides a test chamber, including: a box body, a humidity controller, and a plurality of test devices. The humidity controller is fixedly arranged on the box body to control the humidity in the cavity to be constant, and the plurality of test devices are arranged at intervals inside the box body; the test device includes the test device of any one of the above.
[0016] To solve the above technical problems, the test device of the present application includes a test base, a test component, and a variable-temperature device. An installation groove is arranged on the test base for installing the object to be tested. The test component is fixedly arranged on the test base and extends to the installation groove to connect the object to be tested for testing. The variable-temperature device is fixedly arranged inside the test base to change the ambient temperature of the object to be tested. Thus, the variable-temperature device is fixedly arranged inside the test base, so that the temperature change starts from the inside of the test base, and the object to be tested itself is placed in the installation groove of the test base. Therefore, the temperature change efficiency of the entire test device can be accelerated, and the temperature change starting from the inside of the test base can improve the temperature uniformity of the test base to a certain extent, ensure the surface temperature uniformity of the electronic device, reduce the temperature difference, and ensure the accuracy of the test results. Brief Description of the Drawings
[0017] Figure 1 is a schematic cross-sectional structure diagram of an embodiment of the testing device provided by the present application;
[0018] Figure 2 is a schematic structure diagram of a first state of an embodiment of the testing device provided by the present application;
[0019] Figure 3 is a schematic structure diagram of a second state of an embodiment of the testing device provided by the present application;
[0020] Figure 4 is a schematic structure diagram of an embodiment of the testing box provided by the present application. Detailed Description of the Embodiments
[0021] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0022] It should be noted that if there are directional indications (such as up, down, left, right, front, back,...) involved in the embodiments of the present application, then such directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If this specific posture changes, then such directional indications will also change accordingly.
[0023] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present application, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present application.
[0024] Please refer jointly to Figures 1-3 , Figure 1 is a schematic cross-sectional structure diagram of an embodiment of the testing device provided by the present application, Figure 2 is a schematic structure diagram of a first state of an embodiment of the testing device provided by the present application, Figure 3It is a schematic structural diagram of a second state of an embodiment of the test device provided by this application. Among them, the first state is the state where the base and the upper cover are opened, and the second state is the state where the base and the upper cover are closed.
[0025] The test device 100 of this embodiment includes: a test base 110, a test component 120, and a temperature-changing device 140.
[0026] An installation groove 115 is provided on the test base 110 for installing the object under test 200. Among them, the object under test 200 includes, but is not limited to, electronic devices such as chips, controllers, processors, drivers, and communication devices that need to be subjected to high and low temperature tests.
[0027] The test component 120 is fixedly arranged with the test base 110 and extends into the installation groove 115 to connect the object under test 200 for testing. The test component 120 is a device for testing the object under test 200, and corresponding performance tests are carried out by connecting the object under test 200 at the installation groove 115.
[0028] The temperature-changing device 140 is fixedly arranged inside the test base 110 to change the ambient temperature of the object under test 200. When the object under test 200 needs to be subjected to a high temperature test, the temperature-changing device 140 heats up to the specified temperature range of the high temperature test to provide a high temperature environment for the object under test 200. When the object under test 200 needs to be subjected to a low temperature test, the temperature-changing device 140 cools down to the specified temperature range of the low temperature test to provide a low temperature environment for the object under test 200.
[0029] In this embodiment, by fixedly arranging the temperature-changing device 140 inside the test base 110, the temperature change starts from the inside of the test base 110, and the object under test 200 itself is placed in the installation groove 115 of the test base 110. Therefore, the temperature change efficiency of the entire test device 100 can be accelerated, and the temperature change starting from the inside of the test base 110 can improve the temperature uniformity of the test base 110 to a certain extent, ensure the surface temperature uniformity of the object under test 200, reduce the temperature difference, and ensure the accuracy of the test results.
[0030] Through the above structure, the test device of this application includes a test base, a test component, and a temperature-changing device. An installation groove is provided on the test base for installing the object under test. The test component is fixedly arranged with the test base and extends into the installation groove to connect the object under test for testing. The temperature-changing device is fixedly arranged inside the test base to change the ambient temperature of the object under test. Thus, the temperature-changing device is fixedly arranged inside the test base, so that the temperature change starts from the inside of the test base, and the object under test itself is placed in the installation groove of the test base. Therefore, the temperature change efficiency of the entire test device can be accelerated, and the temperature change starting from the inside of the test base can improve the temperature uniformity of the test base to a certain extent, ensure the surface temperature uniformity of the electronic device, reduce the temperature difference, and ensure the accuracy of the test results.
[0031] In some embodiments, the test socket 110 includes a base 112 and an upper cover 111. One end of the base 112 is rotatably connected to one end of the upper cover 111. Wherein, the base 112 and the upper cover 111 can be rotatably connected by a bearing, a hinge, or other rotatable connection means.
[0032] The installation groove 115 is provided on the side of the base 112 close to the upper cover 111. And a first cavity (not marked in the figure) is provided in the base 112, and the test component 120 is fixedly arranged in the first cavity.
[0033] A pressing plate 113 is provided on the side of the upper cover 111 close to the base 112, and a second cavity (not marked in the figure) is provided in the upper cover 111, and the temperature-changing device 140 is fixedly arranged in the second cavity.
[0034] When testing the object under test 200, the upper cover 111 and the base 112 rotate relative to each other until the pressing plate 113 is in contact with the object under test 200.
[0035] Specifically, when testing the object under test 200, first rotate the upper cover 111 until the test socket 110 is opened to expose the installation groove 115 on the base 112. After placing the object under test 200 in the installation groove 115, then rotate the upper cover 111 until the test socket 110 is closed, and make the pressing plate 113 of the upper cover 111 be in contact with the object under test 200 in the installation groove 115. After the test is completed, rotate the upper cover 111 again to open the test socket 110, and then take out the object under test 200.
[0036] Wherein, after the test socket 110 is closed, the pressing plate 113 is in contact with the object under test 200 in the installation groove 115, and the temperature change of the temperature-changing device 140 can be conducted through the contact of the pressing plate 113 to the object under test 200, thereby improving the temperature change efficiency and the temperature uniformity of the environment where the object under test 200 is located.
[0037] Wherein, the temperature-changing device 140 and the test component 120 are respectively accommodated in the upper cover 111 and the base 112, which can make the functions of the two devices not interfere with each other and be independent of each other.
[0038] In some embodiments, the temperature-changing device 140 includes a temperature-changing component 130, a conduction member 144, and a temperature-changing pipeline 145. The temperature-changing component 130 can self-cool or self-heat, so as to change the ambient temperature.
[0039] The temperature-variable component 130 is fitted on a side of the pressure plate 113 away from the base 112. When the test seat 110 is closed, the object under test 200 and the temperature-variable component 130 are respectively arranged on opposite sides of the pressure plate 113, which can shorten the heat transfer channel between the object under test 200 and the temperature-variable component 130, thereby accelerating the temperature change efficiency and improving the test efficiency.
[0040] The temperature-variable pipe 145 passes through the second cavity, and the conductive member 144 is disposed between the temperature-variable component 130 and the temperature-variable pipe 145, and is in contact with the temperature-variable component 130 and the temperature-variable pipe 145 respectively. The conductive member 144 is disposed between the temperature-variable component 130 and the temperature-variable pipe 145 to accelerate the heat conduction efficiency between the temperature-variable component 130 and the temperature-variable pipe 145. The conductive member 144 includes but is not limited to thermally conductive silica gel, thermally conductive gaskets, etc.
[0041] Cold water or hot water can flow through the variable temperature pipe 145 to deal with different temperature changes. In a specific application scenario, when the test device 100 performs a low-temperature test, the variable temperature component 130 begins to cool down, and cold water flows through the variable temperature pipe 145, so that the heat at the test device 100 is taken away by the flow of cold water, accelerating the temperature drop efficiency, and ice water can also flow through the variable temperature pipe 145, while taking away the heat at the test device 100, it also further assists the test device 100 in cooling down, improves temperature balance, and provides a stable and reliable low-temperature test environment for the object under test 200. In a specific application scenario, when the test device 100 performs a high-temperature test, the variable temperature component 130 begins to heat up, and hot water flows through the variable temperature pipe 145, so that the test device 100 is heated up at the same time by the hot water and the heated variable temperature component 130, accelerating the temperature rise efficiency and improving temperature balance.
[0042] In some embodiments, the temperature-variable pipe 145 includes a liquid inlet pipe 141, a liquid outlet pipe 142, a built-in pipe 143, and a power device (not shown). The liquid inlet pipe 141, the built-in pipe 143, and the liquid outlet pipe 142 are connected in sequence, and the liquid inlet pipe 141 and the liquid outlet pipe 142 are inserted on the upper cover 111 so that the built-in pipe 143 is built into the second cavity.
[0043] The liquid inlet pipe 141 and the liquid outlet pipe 142 are arranged outside the test device 100, and they can be hoses for storage. The internal pipe 143 can be a rigid pipe, such as a brass pipe, a steel pipe or other metal pipe, which can quickly conduct heat and provide sufficient structural rigidity to maintain the structural stability of the variable temperature pipe 145 and reduce the impact on the test seat 110.
[0044] The power device can be arranged inside the liquid inlet pipe 141 to drive the liquid in the temperature-changing pipe 145 to flow. The power device can include a pump or other driving devices. And the power device is arranged outside the test seat 110 to reduce the volume of the test seat 110. The power device can also be arranged at other positions outside the test device 100, which is specifically set based on actual requirements.
[0045] In a specific application scenario, the temperature-changing pipe 145 can also be filled with a phase-change material. The temperature-changing pipe 145 can be in a sealed state, and the temperature is raised and lowered by using the heat absorption capacity and heat dissipation capacity of the phase-change material itself.
[0046] In some embodiments, the temperature-changing component 130 includes a temperature-changing sheet 131 and a temperature-changing circuit board 132 that are connected to each other. The temperature-changing circuit board 132 is also connected to the test component 120.
[0047] In a specific application scenario, the temperature-changing sheet 131 can include a semiconductor temperature-changing sheet, so as to realize both temperature reduction and temperature increase functions. In a specific application scenario, the temperature-changing sheet 131 can also include two sheets, namely a heating sheet and a condensation sheet, so as to realize the functions of temperature increase and temperature reduction respectively.
[0048] The temperature-changing circuit board 132 is also connected to the test component 120. The test component 120 supplies power to the temperature-changing circuit board 132. The temperature-changing circuit board 132 is used to supply power to the temperature-changing sheet 131 and control the start or stop of the temperature-changing sheet 131.
[0049] The temperature-changing sheet 131 is attached to the side of the pressing plate 113 away from the base 112 to change the temperature in contact with the pressing plate 113, and is transmitted to the object under test 200 in real time through the pressing plate 113 to improve the temperature change efficiency. The temperature-changing circuit board 132 is fixedly arranged in the second cavity, and the specific position can be set based on actual requirements and will not be limited here. Among them, the temperature-changing circuit board 132 can be fixed to the inner wall of the second cavity by screws.
[0050] In some embodiments, the test component 120 includes a control circuit board 121 and a plurality of probes 124; the control circuit board 121 is used to control the test of the entire test device 100 and the temperature change of the temperature-changing component 130.
[0051] One end of each probe 124 is connected to the control circuit board 121; the probe 124 includes a first probe 123 and a second probe 122. One end of the first probe 123 away from the control circuit board 121 extends to the installation groove 115 to connect the object under test 200 for testing. One end of the second probe 122 away from the control circuit board 121 extends to the second cavity to connect the temperature-changing circuit board 132.
[0052] The first probe 123 is respectively connected to the control circuit board 121 and the object under test 200 to perform high and low temperature tests through the control of the control circuit board 121. The second probe 122 is respectively connected to the control circuit board 121 and the temperature-changing circuit board 132 to control the temperature-changing circuit board 132 through the control circuit board 121, and then control the temperature-changing piece 131 to perform temperature change.
[0053] In some embodiments, the temperature-changing device 140 further includes a temperature sensor 160. The temperature sensor 160 is disposed on one side of the pressure plate 113 close to the base 112, and the temperature sensor 160 is coupled to the control circuit board 121.
[0054] In a specific application scenario, the control circuit board 121 collects the temperature information inside the test seat 110 through the temperature sensor 160. Using the target temperature and the actual temperature as the error value, it controls the output of the temperature-changing piece 131 through the incremental PID control algorithm, so as to realize the temperature rise and fall of the test seat 110 to reach the specified temperature, reduce environmental interference and stabilize at the specified temperature, and ensure the uniformity of the test environment temperature.
[0055] Wherein, the number of the temperature sensors 160 can be one or more, and can be specifically set based on actual needs, which is not limited herein.
[0056] In some embodiments, a target pressing block 114 is disposed on the pressure plate 113. The position of the target pressing block 114 corresponds to the position of the mounting groove 115, so that when the upper cover 111 rotates relative to the base 112 until it is closed, the target pressing block 114 contacts the object under test 200.
[0057] By setting the target pressing block 114 to directly contact the object under test 200, the temperature change of the temperature-changing piece 131 behind the target pressing block 114 can be conducted specifically through the target pressing block 114, thereby further accelerating the environmental temperature change efficiency of the object under test 200 and ensuring the uniformity of the surface temperature of the object under test 200, reducing the temperature difference, so as to ensure the accuracy of the test results.
[0058] In a specific application scenario, the temperature sensor 160 is preferably disposed near the target pressing block 114 to measure the temperature near the object under test 200 and improve the accuracy of the environmental temperature measurement of the object under test 200.
[0059] In some embodiments, heat-insulating members (not shown in the figure) are adhesively and fixedly disposed on the four peripheral edges of one side of the base 112 close to the upper cover 111 and / or one side of the upper cover 111 close to the base 112. The heat-insulating members can include heat-insulating cotton and / or aluminum foil paper.
[0060] By arranging a heat preservation member at the edge of the base 112 and / or the upper cover 111, when the upper cover 111 is closed, the heat preservation member can fill the gap between the base 112 and the upper cover 111, so that the entire test seat 110 is sealed and insulated, reducing heat exchange loss, improving cooling and heating efficiency, improving temperature control efficiency, improving energy saving effect, and ensuring the temperature balance of the test environment in contact with the object under test 200. Moreover, when multiple test devices 100 perform different tests at the same time, the arrangement of the heat preservation member can also reduce the mutual influence between different test devices 100.
[0061] Through the above structure, the test device 100 of this embodiment fixes the temperature change device 140 in the test socket 110, so that the temperature change starts from the inside of the test socket 110, and the object 200 itself is placed in the installation groove 115 of the test socket 110, so that the temperature change efficiency of the entire test device 100 can be accelerated, and the temperature change starting from the inside of the test socket 110 can improve the temperature balance of the test socket 110 to a certain extent, ensure the uniformity of the surface temperature of the electronic equipment, reduce the temperature difference, and ensure the accuracy of the test results. The temperature-changing device 140 includes a temperature-changing component 130, a conducting member 144, and a temperature-changing pipe 145. When the test device 100 performs a low-temperature test, the temperature-changing component 130 starts to cool down, and cold water flows through the temperature-changing pipe 145, so that the heat at the test device 100 is taken away by the flow of cold water, and the temperature-drop efficiency is accelerated. Ice water can also flow through the temperature-changing pipe 145, and in the case of taking away the heat at the test device 100, it further assists the test device 100 in cooling down, improves the temperature balance, and provides a stable and reliable low-temperature test environment for the object under test 200. When the test device 100 performs a high-temperature test, the temperature-changing component 130 starts to heat up, and hot water flows through the temperature-changing pipe 145, so that the test device 100 is heated up at the same time by the hot water and the heated temperature-changing component 130, and the temperature rise efficiency is accelerated, and the temperature balance is improved. The temperature-changing sheet 131 is disposed on a side of the pressing plate 113 away from the base 112 to change the temperature of the pressing plate 113 and transmit the temperature to the object 200 in real time by using the target pressing block 114 to further improve the temperature change efficiency.
[0062] See also Figure 4 , Figure 4 The test box 400 of this embodiment includes: a box body 410 , a humidity controller 420 and a plurality of test devices 100 .
[0063] The humidity controller 420 is fixedly installed on the box body 410 to control the humidity in the box body 410 to be constant. Since there will be problems of frosting and condensed water during low-temperature tests, which are likely to cause the test device 100 to be damaged by water ingress, damaging the test device 100 or the object under test, therefore, by controlling the humidity in the box body 410 at a low level through the humidity controller 420, the phenomena of frosting and condensed water can be reduced, the situation of the test device 100 being damaged by water ingress and damaging the test device 100 or the object under test can be reduced, and the test reliability can be improved.
[0064] A plurality of test devices 100 are arranged at intervals in the box body 410; the test device 100 includes the test device 100 of any of the above embodiments.
[0065] During the test, the test processes among the plurality of test devices 100 are independent of each other. The number of test devices 100 used can be flexibly selected. By setting the heat preservation parts, the mutual influence among the plurality of test devices 100 can be reduced, the temperature control efficiency can be improved, and the energy-saving effect can be achieved.
[0066] Through the above structure, the test chamber 400 of this embodiment solves the frosting problem through the humidity control system; at the same time, the temperature of a single test device 100 is raised and lowered by using heat preservation materials and a variable temperature device, reducing the volume of temperature rise and fall, improving the temperature control efficiency, and saving power consumption; and an incremental PID algorithm is used for temperature control, and rapid temperature control can be achieved through this system, reducing the temperature rise and fall time and ensuring temperature balance.
[0067] The above are only the implementation manners of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, shall be equally included in the patent protection scope of the present application.
Claims
1. A testing device, characterized in that, Comprising: A test socket, on which an installation groove is provided for installing the object to be tested; A test component, which is fixedly arranged with the test socket and extends into the installation groove to connect the object to be tested for testing; A temperature-changing device, which is fixedly arranged in the test socket to change the ambient temperature of the object to be tested.
2. The testing device according to claim 1, wherein The test socket includes a base and an upper cover, and one end of the base is rotatably connected to one end of the upper cover; The installation groove is arranged on the side of the base close to the upper cover, and a first cavity is arranged in the base, and the test component is fixedly arranged in the first cavity; A pressing plate is arranged on the side of the upper cover close to the base, and a second cavity is arranged in the upper cover, and the temperature-changing device is fixedly arranged in the second cavity; When testing the object to be tested, the upper cover rotates relative to the base until the pressing plate is in contact with the object to be tested.
3. The testing device according to claim 2, wherein The temperature-changing device includes a temperature-changing component, a conduction piece and a temperature-changing pipeline, The temperature-changing component is attached to the side of the pressing plate away from the base; The temperature-changing pipeline penetrates through the second cavity, the conduction piece is arranged between the temperature-changing component and the temperature-changing pipeline, and is in contact with the temperature-changing component and the temperature-changing pipeline respectively.
4. The test device according to claim 3, wherein, The temperature-changing pipeline includes an inlet pipeline, an outlet pipeline, an internal pipeline and a power device; The inlet pipeline, the internal pipeline and the outlet pipeline are connected in sequence, and the inlet pipeline and the outlet pipeline are inserted into the upper cover so that the internal pipeline is placed in the second cavity; The power device is arranged in the inlet pipeline to drive the liquid in the temperature-changing pipeline to flow.
5. The testing device according to claim 3, characterized in that, The temperature-changing component includes a temperature-changing sheet and a temperature-changing circuit board connected to each other, and the temperature-changing circuit board is also connected to the test component; The temperature-changing sheet is attached to the side of the pressing plate away from the base, and the temperature-changing circuit board is fixedly arranged in the second cavity.
6. The testing device according to claim 5, wherein, The test component includes a control circuit board and a plurality of probes; One end of each probe is connected to the control circuit board; The probe includes a first probe and a second probe. One end of the first probe away from the control circuit board extends into the installation groove to connect the object to be tested for testing. One end of the second probe away from the control circuit board extends into the second cavity to connect the temperature-changing circuit board.
7. The test device according to claim 6, wherein The temperature-changing device further includes a temperature sensor, which is arranged on the side of the pressing plate close to the base, and the temperature sensor is coupled to the control circuit board.
8. The test device according to claim 2, wherein A target pressing block is arranged on the pressing plate, and the position of the target pressing block corresponds to the position of the installation groove, so that when the upper cover and the base rotate relative to each other until they are closed, the target pressing block contacts the object to be tested.
9. The test device according to claim 2, wherein Heat insulation parts are fitted and fixedly arranged on the four peripheral edges of the side of the base close to the upper cover and / or the side of the upper cover close to the base.
10. A test chamber, characterized in that, Comprising: A box body; A humidity controller, which is fixedly arranged on the box body to control the humidity in the cavity to be constant humidity; Multiple test devices, and a plurality of the test devices are arranged at intervals in the box body; The test device includes the test device according to any one of claims 1-9 above.