Optical receiving subassembly and optical module

Abstract

The invention relates to the technical field of optical communication, and provides an optical receiving subassembly, which comprises an integrated substrate, a first optical surface, a second optical surface, a third optical surface and a supporting structure are integrated on the integrated substrate, the first optical surface is used for receiving and converging incident light, and the second optical surface is used for receiving and converging the incident light. The second optical surface is used for reflecting incident light to the third optical surface, the third optical surface refracts and outputs light reflected by the second optical surface, and the supporting structure is used for supporting an optical device. The invention further provides an optical module which comprises the optical receiving subassembly. According to the optical receiving sub-assembly, a structure with an optical characteristic and a structure with a supporting characteristic are integrated on the integrated substrate for integrated manufacturing, the simplification of an optical assembly manufacturing process and the reduction of material cost are realized, and when the optical receiving sub-assembly is applied to an optical module, the product cost can be remarkably reduced, and the comprehensive competitiveness is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of optical communication, and particularly to an optical receiving subassembly and an optical module. Background Art

[0002] In recent years, with the widespread construction of network service systems such as AI large models that require high-capacity and high-bandwidth, the requirements for the capacity of switches inside data centers have also become increasingly high. In high-speed optical modules, using multiple channels to increase the transmission capacity of the optical module is a common technical means. Among them, optical components based on the multiplexing and demultiplexing method of parallel light are widely used due to their technical characteristics such as simple coupling and modularization. At the same time, how to simplify the process and reduce the cost of the optical component itself has been a problem that has plagued the industry. Summary of the Invention

[0003] The purpose of the present invention is to provide an optical receiving subassembly and an optical module, which can at least solve some defects in the prior art.

[0004] To achieve the above purpose, the embodiments of the present invention provide the following technical solutions: An optical receiving subassembly includes an integrated substrate, on which a first optical surface, a second optical surface, a third optical surface, and a support structure are integrated. The first optical surface is used to receive and converge incident light, the second optical surface is used to reflect the incident light to the third optical surface, the third optical surface refracts and outputs the light reflected by the second optical surface, and the support structure is used to support optical devices.

[0005] Further, the integrated substrate has a groove, and the support structure is arranged on the bottom of the groove.

[0006] Further, the first optical surface, the second optical surface, and the third optical surface are integrated on the edge of one side of the groove.

[0007] Further, it further includes a PCB board. The integrated substrate is arranged on the PCB board. The bottom of the groove of the integrated substrate and the third optical surface both face the PCB board. The first optical surface is arranged on the wall of the groove, and the second optical surface is located outside the groove.

[0008] Further, an adhesive surface that can be bonded to the PCB board is provided on the edge outside the groove.

[0009] Further, the support structure includes a first support surface, a second support surface, and a third support surface. The first support surface, the second support surface, and the third support surface are arranged in sequence along the direction of the incident light path. A glass cover plate is arranged on the first support surface, a coupling lens is arranged on the second support surface, and an optical demultiplexer is arranged on the third support surface.

[0010] Further, the first support surface is recessed to form a V-groove structure for positioning an optical fiber, and the glass cover plate presses the optical fiber onto the V-groove structure.

[0011] Further, the glass cover plate is bonded to the first support surface through a first bonding position, the coupling lens is bonded to the second support surface through a second bonding position, and the optical demultiplexer is bonded to the third support surface through a third bonding position.

[0012] Further, an array lens is integrated on the first optical surface.

[0013] Another technical solution provided by an embodiment of the present invention is: an optical module includes the above-mentioned optical receiving sub-assembly.

[0014] Compared with the prior art, the beneficial effects of the present invention are: by integrating both the structure with optical characteristics and the structure with support characteristics on an integrated substrate for integrated manufacturing, the manufacturing process of optical components is simplified and the material cost is reduced. Applying this optical receiving sub-assembly to an optical module can significantly reduce the product cost and enhance the comprehensive competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of an optical receiving sub-assembly provided by an embodiment of the present invention;

[0016] Figure 2 It is a schematic structural diagram of an optical module provided by an embodiment of the present invention;

[0017] Figure 3 It is a schematic optical path diagram;

[0018] Figure 4 It is a first perspective schematic diagram of an integrated substrate of an optical receiving sub-assembly provided by an embodiment of the present invention;

[0019] Figure 5 It is a second perspective schematic diagram of an integrated substrate of an optical receiving sub-assembly provided by an embodiment of the present invention;

[0020] Figure 6 It is a third perspective schematic diagram of an integrated substrate of an optical receiving sub-assembly provided by an embodiment of the present invention;

[0021] Figure 7 It is an enlarged schematic diagram of the assembly of an optical fiber and an integrated substrate of an optical receiving sub-assembly provided by an embodiment of the present invention;

[0022] Figure 8 It is a schematic diagram of setting a glass block on an integrated substrate in an assembly method of an optical receiving sub-assembly provided by an embodiment of the present invention;

[0023] Figure 9 Schematic diagram of an optical receiving sub - assembly assembly method provided by an embodiment of the present invention in cooperation with a circulator;

[0024] Figure 10 Optical path schematic diagram of an optical demultiplexer of an optical receiving sub - assembly provided by an embodiment of the present invention;

[0025] In the reference numerals: 1 - PCB board; 101 - detector; 102 - trans - impedance amplifier; 2 - optical receiving sub - assembly; 21 - integrated substrate; 2101 - first optical surface; 2102 - second optical surface; 2103 - third optical surface; 2104 - bonding surface; 2105 - third bonding position; 2106 - second bonding position; 2107 - first bonding position; 2108 - V - groove structure; 2109 - mesa structure; 2110 - groove edge; 22 - optical demultiplexer; 23 - coupling lens; 24 - glass cover plate; 25 - optical fiber; 26 - adapter; 27 - glass block; 2701 - incident surface; 3 - bracket. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] Embodiment 1:

[0028] Please refer to Figures 1 to 6, an embodiment of the present invention provides a light receiving subassembly 2, including an integrated substrate 21, on which a first optical surface 2101, a second optical surface 2102, a third optical surface 2103 and a supporting structure are integrated, the first optical surface 2101 is used to receive incident light and converge, the second optical surface 2102 is used to reflect the incident light to the third optical surface 2103, the third optical surface 2103 refracts and outputs the light reflected by the second optical surface 2102 and outputs it, and the supporting structure is used to support optical devices. In this embodiment, by integrating the structure with optical characteristics and the structure with supporting characteristics on the integrated substrate 21 for integrated production, the simplification of the optical component production process and the reduction of material costs are achieved, and the light receiving subassembly 2 is applied to the optical module, which can significantly reduce the product cost and improve the overall competitiveness. Specifically, in the prior art, it is necessary to design lenses, reflecting prisms, etc. to receive incident light, and more assembly processes and materials are required. In this embodiment, the components for receiving incident light are cleverly integrated on the integrated substrate 21, simplifying the materials and assembly steps of the product. Similarly, the integrated support structure on the integrated substrate 21 can also be used to support the required optical devices, which also simplifies the assembly of the product. Preferably, the integrated substrate 21 can be made by injection molding process, with its own optical properties and support properties, and the typical optical refractive index is 1.5. The direction of the optical path is specifically that the incident light first enters the first optical surface 2101, and the array lens integrated on the first optical surface 2101 converges the parallel light from the optical demultiplexer 22. The spacing between the lenses of the array lens can be adjusted according to the actual product needs. Then the incident light entering the first optical surface 2101 will be turned about 90° on the second optical surface 2102 and then converged and output through the third optical surface 2103. The third optical surface 2103 is preferably provided with a lens, which can be set according to product needs. An optical anti-reflection film layer is preferably provided on the first optical surface 2101, and an optical total reflection film layer is preferably provided on the second optical surface 2102. The wavelength of the film layer is concentrated in the 1260-1360nm band.

[0029] See also Figures 1 to 6 The integrated substrate 21 has a groove, and the support structure is arranged on the bottom of the groove. In this embodiment, a groove is designed on the integrated substrate 21, and the support structure can be arranged in the groove. When the integrated substrate 21 is flipped on the PCB board 1 (i.e., as shown in FIG. Figure 6 The thickness of the integrated substrate 21 can be cleverly used to set various optical devices. At the same time, the thickness of the groove can also be used to design the step design of the third optical surface 2103, so that there is a certain distance between the third optical surface 2103 and the PCB board 1, so that it is convenient for light to be output to the PCB board 1.

[0030] To further optimize the above solution, please refer toFigures 1 to 6 On one side edge 2110 of the groove, the first optical surface 2101, the second optical surface 2102, and the third optical surface 2103 are integrated. On one side edge 2110 of the groove, each optical surface is integrated. This side edge 2110 is the side edge of the third support surface of the groove away from the second support surface, that is, the light path first passes through the first support surface, the second support surface, the third support surface, and then reaches this side edge 2110.

[0031] Please refer to Figures 1 to 6 The optical receiving subassembly 2 further includes a PCB board 1. The integrated substrate 21 is disposed on the PCB board 1. The bottom of the groove of the integrated substrate 21 and the third optical surface 2103 both face the PCB board 1. The first optical surface 2101 is disposed on the groove wall of the groove, and the second optical surface 2102 is located outside the groove. In this embodiment, the bottom of the groove facing the PCB board 1 can use the depth of the groove or the thickness of the integrated substrate 21 to set each optical device. The third optical surface 2103 facing the PCB board 1 can emit light to the PCB board 1. The first optical surface 2101 is disposed on the inner side wall of the groove, and can receive incident light in the first time. After the incident light passes through the first optical surface 2101, it will be reflected on the second optical surface 2102 outside the groove to reflect the light to the third optical surface 2103.

[0032] Please refer to Figures 1 to 6 On the edge outside the groove, there is an adhesive surface 2104 that can be bonded to the PCB board 1. In this embodiment, the integrated substrate 21 and the PCB board 1 can be conveniently fixed through the adhesive surface 2104. There can be multiple adhesive surfaces 2104, such as Figure 5 as shown.

[0033] Please refer to Figures 1 to 6, the support structure includes a first support surface, a second support surface, and a third support surface. The first support surface, the second support surface, and the third support surface are arranged in sequence along the direction of the incident optical path. A glass cover plate 24 is installed on the first support surface, a coupling lens 23 is installed on the second support surface, and a demultiplexer 22 is installed on the third support surface. Preferably, the first support surface is recessed to form a V-groove structure 2108 for positioning the optical fiber, and the glass cover plate 24 presses the optical fiber 25 onto the V-groove structure 2108. The glass cover plate 24 is bonded to the first support surface through a first bonding position 2107, the coupling lens 23 is bonded to the second support surface through a second bonding position 2106, and the demultiplexer 22 is bonded to the third support surface through a third bonding position 2105. In this embodiment, the demultiplexer 22 is fixed to the integrated substrate 21 through epoxy glue. The integrated substrate 21 is also provided with a V-groove for placing the optical fiber 25, and is pressed by the glass cover plate 24. The optical fiber 25, the glass cover plate 24, and the V-groove on the integrated substrate 21 are bonded and fixed through epoxy glue. The third bonding surface 2104 is used for bonding the demultiplexer 22, the second bonding surface 2104 is used for bonding the coupling lens 23, and the first bonding surface 2104 is used for bonding the glass cover plate 24. The V-groove structure 2108 on the integrated substrate 21 is used for positioning the cladding part of the optical fiber, and is pressed by the glass cover plate 24. The three are bonded and fixed through epoxy glue. The integrated substrate 21 is further provided with a mesa structure 2109 on the side of the first support surface away from the second support surface. The bonding surface 2104 is set to bond the coating part of the optical fiber 25 to ensure that the optical fiber 25 will not break due to stress bending. The optical fiber 25 is connected to the adapter 26.

[0034] Please refer to Figures 1 to 6 , a detector 101 and a transimpedance amplifier 102 are provided on the PCB board 1. The optical receiving sub-assembly 2 is fixedly coupled to the circuit board through active coupling. To reduce the stress of the optical fiber 25 in the optical receiving sub-assembly 2, a bracket 3 is also provided on the PCB board 1. The optical fiber 25 is set to be longer, and the optical fiber 25 is wound around in the bracket 3 to relieve the stress of the optical fiber 25 and improve the product reliability.

[0035] Please refer to Figures 1 to 6 , an embodiment of the present invention provides an optical module, including an optical transmitting sub-assembly and the above-mentioned optical receiving sub-assembly 2. Applying the above-mentioned optical receiving sub-assembly 2 to the optical module can significantly reduce the product cost and improve the comprehensive competitiveness.

[0036] Embodiment Two:

[0037] Please refer to Figures 1 to 10, an embodiment of the present invention further provides an assembly method for an optical receiving sub - assembly 2, which is the assembly method of the optical receiving sub - assembly 2 in Embodiment 1. The specific steps are as follows: S1, fabricate an integrated substrate 21; S2, process the optical fiber 25 to expose the cladding of the optical fiber 25 and ensure that the cut surface of the optical fiber 25 is flat; S3, fix the processed optical fiber 25 on the integrated substrate 21; S4, use a circulator to couple the lens on the integrated substrate 21; S5, assemble other optical devices on the integrated substrate 21 to complete the fabrication of the optical receiving sub - assembly 2. In this embodiment, self - collimating optical coupling is achieved through a circulator, and passive assembly of the integrated substrate 21 is carried out to realize the assembly of the components, improve the fabrication efficiency, and reduce the overall cost. Specifically, the integrated substrate 21 prepared in step S1 is the structure of the integrated substrate 21 in Embodiment 1. After processing the optical fiber 25, it is fixed on the integrated substrate 21, and then a circulator is used for lens coupling, thereby realizing self - collimating optical coupling, which can both couple and collimate the optical path.

[0038] Please refer to Figures 1 to 10 , in step S2, strip the optical fiber 25 in a partial - length region to expose the cladding of the optical fiber 25, and perform laser cutting on the optical fiber 25 to ensure that the cut surface of the optical fiber 25 is flat. In this embodiment, the processing method for the optical fiber 25 is stripping and laser cutting.

[0039] Please refer to Figures 1 to 10 , in step S3, place the region of the optical fiber 25 after removing the cladding in the V - groove structure 2108 of the integrated substrate 21, move it back and forth to make the cut surface of the optical fiber 25 flush with the side surface of the V - groove structure 2108, then use a glass cover plate 24 to press - fit the optical fiber 25 in the V - groove structure 2108 and fix it with epoxy glue. In this embodiment, after processing the optical fiber 25, place the optical fiber 25 in the V - groove structure 2108 of the integrated substrate 21, adjust it and then fix it with the glass cover plate 24.

[0040] Please refer to Figures 1 to 10 , in step S4, before coupling the coupling lens 23, first place the glass block 27 at the bonding position on the integrated substrate 21. The incident surface 2701 of the glass block 27 is coated with a total - reflection film layer for specular reflection of the O - band wavelength. Preferably, in step S4, connect the optical receiving sub - assembly 2 with the coupling lens 23 to the second port of the circulator through the optical fiber 25, connect the light source to the first port of the circulator through the optical fiber 25 to supply light, connect the power meter to the third port of the circulator, and adjust the angle and position of the coupling lens 23 through a coupling algorithm to perform self - collimating coupling on the coupling lens 23. In this embodiment, this step is the specific step for coupling the coupling lens 23, such as Figure 8As shown, before the coupling lens 23 performs coupling, the glass block 27 is placed on the third bonding position 2105 of the substrate. The incident surface 2701 of the glass block 27 is coated with a total reflection film layer for specular reflection for the O-band wavelength. As Figure 9 As shown, for the component of the coupling lens 23, it is connected to the second port of the circulator through the optical fiber 25. The light source is connected to the light source through the optical fiber 25 from the first port of the circulator to supply light, and the power meter is connected to the third port of the circulator. Through the coupling algorithm, the angle and position of the coupling lens 23 are adjusted to perform the coupling of the coupling lens 23. The characteristic of the coupling is to utilize the reversibility of the circulator optical path to perform self-collimation coupling on the coupling lens 23, supply the power of the point light source, and monitor the power meter value of the coupling, so that the coupling lens 23 is actively coupled to the optimal position to achieve optical path collimation.

[0041] Please refer to Figures 1 to 10 , in the step S5, when the optical device is the optical demultiplexer 22, the optical demultiplexer 22 is passively coupled to the bonding position of the integrated substrate 21, and the side is aligned with the side of the substrate for assembly. In this embodiment, after the coupling of the coupling lens 23 is completed, the optical demultiplexer 22 is assembled to the third bonding position 2105 of the substrate by passive coupling, and the side is aligned with the side of the substrate for assembly. There is a fixed deviation between the center of the V-groove structure 2108 on the integrated substrate 21 and the optical axis center of the array lens, and this deviation is Figure 10 the deviation in the vertical direction of the optical axes of the common port of the left optical demultiplexer 22 and the optical port of the rightmost upper channel in

[0042] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical receiving subassembly, characterized in that: It includes an integrated substrate, on which a first optical surface, a second optical surface, a third optical surface and a support structure are integrated. The first optical surface is used to receive and converge incident light. The second optical surface is used to reflect the incident light to the third optical surface. The third optical surface refracts and outputs the light reflected by the second optical surface. The support structure is used to support the optical device.

2. The optical receiving subassembly according to claim 1, wherein: The integrated substrate has a groove, and the support structure is arranged on the bottom of the groove.

3. The optical receiving subassembly according to claim 2, characterized in that: The first optical surface, the second optical surface and the third optical surface are integrated on the edge of one side of the groove.

4. The optical receiving subassembly according to claim 2, wherein: It further includes a PCB board. The integrated substrate is arranged on the PCB board. The bottom of the groove of the integrated substrate and the third optical surface both face the PCB board. The first optical surface is arranged on the wall of the groove, and the second optical surface is located outside the groove.

5. The optical receiving subassembly according to claim 2, characterized in that: An adhesive surface that can be bonded to the PCB board is arranged on the edge outside the groove.

6. The optical receiving subassembly according to claim 1, wherein: The support structure includes a first support surface, a second support surface and a third support surface. The first support surface, the second support surface and the third support surface are arranged in sequence along the direction of the incident light path. A glass cover plate is arranged on the first support surface. A coupling lens is arranged on the second support surface. An optical demultiplexer is arranged on the third support surface.

7. The optical receiving subassembly according to claim 6, wherein: The first support surface is recessed to form a V-groove structure, which is used to position the optical fiber, and the glass cover plate presses the optical fiber on the V-groove structure.

8. The optical receiving subassembly according to claim 6, wherein: The glass cover plate is bonded to the first support surface through a first bonding position. The coupling lens is bonded to the second support surface through a second bonding position. The optical demultiplexer is bonded to the third support surface through a third bonding position.

9. The optical receiving subassembly according to claim 1, characterized in that: An array lens is integrated on the first optical surface.

10. An optical module, characterized in that: It includes a light receiving sub-assembly according to any one of claims 1-9.

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