Wafer glue uniformizing treatment method adopting slit glue supplying and uniformizing integrated structure

Abstract

The invention relates to the technical field of wafer processing, in particular to a wafer glue uniformizing treatment method adopting a slit glue supplying and uniformizing integrated structure, which comprises the following steps: pretreatment, autonomous centering and fixing, slit glue supplying, residual glue collecting and secondary glue uniformizing. The method comprises the following steps of: ensuring that the center of a wafer coincides with a rotating point, and then combining with a deflection type glue supply assembly to realize anti-blocking type convenient loading and unloading, and simultaneously realizing synchronous and different-amount glue supply treatment on different positions of the wafer in the radius length, so that not only can quick and uniform comprehensive glue supply and primary glue uniformizing treatment be realized, but also the use amount of photoresist can be reduced to the greatest extent, and the production efficiency is improved. And the rotary glue uniformizing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a method for spin coating a wafer using a slit glue supply and spin coating integrated structure. Background Art

[0002] As a key link in semiconductor manufacturing, the lithography process includes a series of precise steps such as wafer spin coating, exposure, development, hard baking, etching, and resist stripping. Among them, the spin coating step is particularly crucial, aiming to ensure that the photoresist can be evenly distributed on the wafer surface with an appropriate thickness, so as to ensure that the photoresist on the wafer surface can obtain a uniform and appropriate photosensitive effect during the subsequent exposure process.

[0003] Currently, the spin coating process often uses a motor-driven vacuum chuck to adsorb and rotate the wafer, and uses centrifugal force to evenly distribute the photoresist on the wafer surface. For example, a wafer spin coating device for a lithography machine with the publication number CN108646517A can ensure the horizontal fixation of the wafer by adjusting the level of the base, and achieve the uniformity of the photoresist coating thickness;

[0004] However, during the wafer placement stage in the spin coating process, there is still a lack of an effective auxiliary centering mechanism, which is difficult to ensure the precise coincidence of the wafer center and the rotation point, and easily leads to uneven spin coating and affects subsequent processing; in addition, the method of first dropping the glue and then rotating for spin coating is also difficult to perform preliminary spin coating while supplying the glue. During the processing of a large number of wafers, the low efficiency problem will seriously reduce the production capacity. Therefore, a solution is proposed herein. Summary of the Invention

[0005] The purpose of the present invention is to provide a method for spin coating a wafer using a slit glue supply and spin coating integrated structure to solve the above-mentioned technical defects.

[0006] The purpose of the present invention can be achieved by the following technical solutions: A method for spin coating a wafer using a slit glue supply and spin coating integrated structure includes the following steps:

[0007] S1: Pretreatment: Use a dust cleaning device to clean the dust and impurities on the wafer surface;

[0008] S2: Self-centering fixation: Use a glue supply and spin coating integrated device to adsorb and fix the wafer, and use the downward movement of the adsorption fixation to perform multi-point clamping on the wafer, and complete the centering rotation after the wafer is fixed;

[0009] S3: Slit glue supply: Through a slit glue outlet with a specific shape, perform synchronous and different amount glue supply processing at different positions on the radius length of the wafer, and combine with the low-speed rotation of the wafer to perform uniform and comprehensive glue supply and primary spin coating processing;

[0010] S4: Residual glue collection and secondary coating: The wafer rotates at high speed, and the centrifugal force is used to promote the photoresist to be further evenly coated. A small amount of excess residual glue is intercepted and collected, and discharged and recycled by multi-stage scraping;

[0011] The glue supply and glue leveling integrated device used in the above-mentioned processing method includes a fixing table, on which a centering fixing component for autonomous centering and clamping of the wafer is arranged, and a deflection glue supply component for different amounts at different positions on the radius length of the wafer;

[0012] A glue collecting cylinder which cooperates with the centering and fixing assembly to collect and discharge the residual glue is movably installed above the fixing platform.

[0013] Preferably, the centering and fixing assembly includes a rotating column rotatably mounted on a fixed platform, and a turntable is fixedly connected to the top of the rotating column, a plurality of accordion suction cups are fixedly mounted on the top of the turntable, and springs are installed inside the side walls of the accordion suction cups.

[0014] Preferably, an air disc is provided below the turntable, and air pipe 1 is installed on the air disc, and air pipe 2 is connected to each organ suction cup. A vacuum generating device is installed at the bottom of the fixed platform, and the suction pipe of the vacuum generating device is connected to air pipe 1 through a rotating joint.

[0015] Preferably, a rotating sleeve rod is rotatably connected to the turntable and located between two adjacent accordion suction cups, and a supporting portion is fixedly connected to the rotating sleeve rod, and an adjusting rod is slidably connected to the rotating sleeve rod, an arc-shaped clamping plate is fixedly connected to the end of the adjusting rod, and a locking bolt that interferes with the adjusting rod is threadedly connected to the rotating sleeve rod.

[0016] Preferably, an outer gear ring is fixedly connected to the rotating column, a motor is mounted on the fixed platform via bolts, and a gear meshing with the outer gear ring is mounted on the output shaft of the motor.

[0017] Preferably, the deflected glue supply assembly includes a mounting column rotatably mounted on the glue collecting cylinder, a glue supply knife head is fixedly connected to the top of the mounting column, a glue storage cavity is provided inside the glue supply knife head, and a slit opening in a triangular structure is provided through the bottom of the glue storage cavity, and a glue inlet pipe is installed on the glue supply knife head.

[0018] Preferably, the inside of the glue storage chamber is slidably connected with a sealing plate, the glue supply knife head is threadedly mounted with a fixing bolt that contacts the sealing plate, the bottom of the sealing plate is fixedly connected with a rubber block that slidably contacts the slit, and the cross-section of the rubber block is a ﹞ structure.

[0019] Preferably, an electric push rod is fixedly connected to the fixed platform, and the piston rod end of the electric push rod is connected to the mounting column through a rotating seat, and the bottom of the rubber collecting cylinder is fixedly connected to a plurality of guide rods that slide with the fixed platform.

[0020] Preferably, an L-shaped guiding groove is formed on the annular outer wall of the mounting post, a fixing plate is fixedly connected to the top of the fixing table, and a guiding pin that slides in the L-shaped guiding groove is fixedly connected to the fixing plate.

[0021] Preferably, a splash-proof ring is rotatably installed on the top of the glue collecting cylinder, and a plurality of glue scraping plates that slide inside the glue collecting cylinder are fixedly connected to the splash-proof ring. A plurality of support rods are fixedly connected to the bottom of the turntable, and a glue scraping frame that slides with the corresponding glue scraping plate is fixedly connected to the support rods. A glue discharging pipe is installed at the bottom of the glue collecting cylinder.

[0022] The beneficial effects of the present invention are as follows:

[0023] (1) In the present invention, while the wafer is adsorbed and fixed by the vacuum generating device in combination with the bellows suction cup, the height of the bellows suction cup is reduced, so that the contact with the supporting block causes the rotating sleeve rod to carry the arc-shaped clamping plate to deflect upward, realizing the secondary clamping and fixing of the wafer. While further improving the clamping stability, it assists the wafer to be centered and placed, ensuring the coincidence of the center of the wafer and the rotation point, and then improving the uniformity of the glue supply and coating of the glue supply cutter head. Combined with the slit opening on the glue supply cutter head, different amounts of glue are synchronously supplied at different positions on the radius length of the wafer, and with the low-speed rotation of the wafer, it can not only achieve rapid, uniform and comprehensive glue supply and primary glue leveling treatment, but also minimize the amount of photoresist used and improve the efficiency of rotational glue leveling;

[0024] (2) In the present invention, the position of the arc-shaped clamping plate is adjusted by the movable installation of the adjusting rod, and the control of the glue discharging length dimension of the slit opening is realized by combining the adjustment of the position of the blocking plate, so that the glue supply and glue leveling treatment can be completed for wafers of different sizes, further expanding the application range of the device. In addition, through the rotation of the turntable and the lifting of the glue collecting cylinder, the surplus glue splashed out in small amounts can be intercepted and recycled by means of multi-stage scraping, improving the utilization rate of the photoresist. Description of the Drawings

[0025] The following further describes the present invention with reference to the drawings;

[0026] Figure 1 is a schematic structural diagram of the present invention;

[0027] Figure 2 is a schematic structural diagram of another perspective of the present invention;

[0028] Figure 3 is a schematic diagram of the cooperation between the centering and fixing assembly and the glue collecting cylinder of the present invention;

[0029] Figure 4 is a schematic structural diagram of the centering and fixing assembly of the present invention;

[0030] Figure 5 It is a schematic installation diagram of the rotating sleeve rod of the present invention;

[0031] Figure 6 It is a schematic structural diagram of the fixed table of the present invention;

[0032] Figure 7 It is a schematic structural diagram of the glue supply cutter head of the present invention;

[0033] Figure 8 It is a schematic structural diagram of the plugging plate of the present invention;

[0034] Figure 9 It is a schematic cooperation diagram of the plugging plate and the glue supply cutter head of the present invention.

[0035] Legend description:

[0036] 1. Fixed table; 11. Fixed plate; 12. Guide pin;

[0037] 2. Centering and fixing assembly; 21. Rotating column; 22. Turntable; 23. Bellows suction cup; 24. Air disc; 25. Vacuum generating device; 26. Rotating sleeve rod; 27. Material supporting part; 28. Adjusting rod; 29. Arc-shaped clamping plate;

[0038] 3. Deflection type glue supply assembly; 31. Mounting column; 32. Glue supply cutter head; 33. Slit opening; 34. Plugging plate; 35. Rubber plug; 36. Electric push rod; 37. L-shaped guide groove;

[0039] 4. Glue collecting cylinder; 41. Splash-proof ring; 42. Glue scraping plate; 43. Support rod; 44. Glue scraping frame. Specific embodiments

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0041] Embodiment 1: Please refer to Figures 1 - 5 As shown, for the situation where there is a lack of an effective auxiliary centering processing mechanism, it is difficult to ensure the precise coincidence of the center of the wafer and the rotation point, which easily leads to uneven glue spreading and affects subsequent processing, the following solutions can be adopted to solve it;

[0042] In this embodiment, the wafer spin coating processing method adopting the slit glue supply and spin coating integrated structure is realized by relying on the glue supply and spin coating integrated device. The glue supply and spin coating integrated device includes a fixed table 1. A centering and fixing component 2 for autonomously centering and clamping the wafer is arranged on the fixed table 1, and a deflecting glue supply component 3 for supplying glue in different positions and amounts along the radius length of the wafer. Above the fixed table 1, a glue collecting cylinder 4 that cooperates with the centering and fixing component 2 to collect and discharge the remaining glue is movably installed.

[0043] The centering and fixing component 2 includes a rotating column 21 rotatably installed on the fixed table 1. The top of the rotating column 21 is fixedly connected with a turntable 22. A plurality of bellows suction cups 23 are fixedly installed on the top of the turntable 22. Place the wafer on the tops of the plurality of bellows suction cups 23 on the turntable 22, and by pumping the air in each bellows suction cup 23, the wafer is fixed by negative pressure adsorption. Before fixing, use a dust cleaning device to clean the dust and impurities on the surface of the wafer to improve the fixing and spin coating effects.

[0044] A spring is installed inside the side wall of the bellows suction cup 23. The spring is provided to increase the supporting force of the bellows suction cup 23 on the wafer, and when the bellows suction cup 23 adsorbs the wafer and the arc-shaped clamping plate 29 pushes the wafer to move for centering, it helps to improve the contact effect between the top of the bellows suction cup 23 and the wafer, avoiding the problem of reduced fixing effect caused by the separation of the two.

[0045] A gas plate 24 is arranged below the turntable 22. An air pipe 1 is installed on the gas plate 24, and an air pipe 2 is connected between the air pipe 1 and each bellows suction cup 23. A vacuum generating device 25 is installed at the bottom of the fixed table 1, and the suction pipe of the vacuum generating device 25 is connected to the air pipe 1 through a rotary joint.

[0046] The air pipe 1 passes through the inside of the rotating column 21 and is combined with a rotary joint to avoid interfering with the rotation of the rotating column 21. The vacuum generating device 25 extracts the air in each bellows suction cup 23 through the rotary joint, the air pipe 1, the gas plate 24 and the air pipe 2, so as to fix the wafer by negative pressure adsorption. During the adsorption and fixing process, as the gas in the bellows suction cup 23 decreases, it causes its height to drop and drives the wafer to move downward, compressing the spring.

[0047] Rotating sleeve rods 26 are rotatably connected between adjacent two bellows suction cups 23 on the turntable 22. A material supporting part 27 is fixedly connected to the rotating sleeve rod 26, and an adjusting rod 28 is slidably connected to the rotating sleeve rod 26. The end of the adjusting rod 28 is fixedly connected with an arc-shaped clamping plate 29. When the wafer moves downward and touches the material supporting part 27 on each rotating sleeve rod 26, the rotating sleeve rod 26 deflects, and the arc-shaped clamping plate 29 moves upward to contact the side wall of the wafer, so as to push the wafer to move for centering treatment.

[0048] In addition, through the multi-point contact between the wafer and the multiple material supporting parts 27, the horizontality after the disc is fixed can be assisted in being corrected, thereby ensuring the uniformity during spin coating. A locking bolt that abuts against the adjusting rod 28 is threadedly connected to the rotating sleeve rod 26. By rotating the locking bolt, the adjusting rod 28 is pulled to move within the rotating sleeve rod 26, and the distance between the arc-shaped clamping plate 29 and the rotating sleeve rod 26 is adjusted, so as to complete the self-centering clamping of wafers of different sizes.

[0049] An external gear ring is fixedly connected to the rotating column 21. A motor is installed on the fixed table 1 through bolts, and a gear meshing with the external gear ring is installed on the output shaft of the motor. The motor drives the rotating column 21 to rotate through the meshing gears, and the rotating column 21 drives the turntable 22 and the wafer to rotate.

[0050] Embodiment 2: Please refer to Figures 1 - 9 As shown, for the problem that it is difficult to perform preliminary spin coating while supplying glue when using the method of first dripping glue and then spin coating, and further improving the spin coating efficiency, the following solution can be adopted;

[0051] In this embodiment, the deflecting glue supply assembly 3 includes a mounting column 31 rotatably mounted on the glue collecting cylinder 4. A glue supply cutter head 32 is fixedly connected to the top of the mounting column 31. A glue storage cavity is formed inside the glue supply cutter head 32, and a slit opening 33 with a triangular structure is formed through the bottom of the glue storage cavity. A glue inlet pipe is installed on the glue supply cutter head 32;

[0052] Photoresist is filled into the glue storage cavity through the glue inlet pipe, and then discharged through the slit opening 33 and contacts the wafer. Due to the triangular structure of the slit opening 33, the photoresist performs synchronous and different amounts of glue supply treatment at different positions in the radial length of the wafer, so as to meet the different glue amounts required at different positions in the radial length of the wafer after it rotates one week, thereby completing the overall glue supply treatment. And during the glue supply process, the discharged photoresist is initially spin coated by the glue supply cutter head 32, which can further improve the subsequent spin coating efficiency.

[0053] A blocking plate 34 is slidably connected inside the glue storage cavity. A fixing bolt that abuts against the blocking plate 34 is threadedly installed on the glue supply cutter head 32. By rotating the fixing screw, the blocking plate 34 is pulled to move within the glue storage cavity, and the blocking length of the slit opening 33 by the blocking plate 34 is adjusted to cope with the glue supply treatment of wafers of different sizes, and to avoid the problem that part of the photoresist is directly discharged when supplying glue to wafers of different sizes;

[0054] A rubber plug 35 that slides against the slit opening 33 is fixedly connected to the bottom of the plugging plate 34. The cross-section of the rubber plug 35 is in a ﹞ structure. Through the rubber plug 35 with the ﹞ structure, during the sliding process of the rubber plug 35, it can always slide against both sides of the slit opening 33, thereby further assisting the plugging plate 34 to increase the control of the glue discharging length of the slit opening 33, and then achieving better control of the glue discharging amount, and minimizing the use amount of photoresist supply to the greatest extent.

[0055] An electric push rod 36 is fixedly connected to the fixing table 1. The end of the piston rod of the electric push rod 36 is connected to the mounting column 31 through a rotating seat. While the electric push rod 36 drives the mounting column 31 and carries the glue supply cutter head 32 to descend, it synchronously carries the glue collecting cylinder 4 to descend. A plurality of guide rods that slide with the fixing table 1 are fixedly connected to the bottom of the glue collecting cylinder 4, which is used to increase the lifting stability of the glue collecting cylinder 4.

[0056] An L-shaped guiding groove 37 is formed on the outer circumferential wall of the mounting column 31. The L-shaped guiding groove 37 includes a vertical section and an inclined section. A fixing plate 11 is fixedly connected to the top of the fixing table 1, and a guiding pin 12 that slides with the L-shaped guiding groove 37 is fixedly connected to the fixing plate 11. The electric push rod 36 drives the mounting column 31 and carries the glue collecting cylinder 4 to descend. During the descending process, the guiding pin 12 slides in the inclined section of the L-shaped guiding groove 37, causing the mounting column 31 to carry the glue supply cutter head 32 to deflect by 90°, so that the glue supply cutter head 32 first deflects to directly above the top of the adsorbed and fixed wafer;

[0057] The guiding pin 12 slides into the vertical section, restricting the deflection and descent of the mounting column 31 until the distance between the glue supply cutter head 32 and the wafer is equal to the coating thickness. The glue supply cutter head 32 performs primary glue leveling treatment on the discharged photoresist. After the glue supply is completed, the electric push rod 36 drives the mounting column 31 to rise, causing the glue collecting cylinder 4 and the glue supply cutter head 32 to rise, and the glue supply cutter head 32 deflects in the reverse direction to return, moving away from directly above the top of the wafer, thereby achieving the effect of convenient loading and unloading with anti-blocking.

[0058] A splash-proof ring 41 is rotatably installed at the top of the glue collecting cylinder 4. As the glue collecting cylinder 4 rises, the glue collecting cylinder 4 and the splash-proof ring 41 are sleeved around the wafer for four-sided shielding. The motor drives the turntable 22 to rotate at a high speed, causing the photoresist that is uneven at the head and tail sections of the slit coating to be evenly spread through rotation for secondary glue leveling treatment;

[0059] A plurality of scraping plates 42 that slide inside the glue collecting cylinder 4 are fixedly connected to the splash-proof ring 41. A small amount of excess photoresist is thrown onto the inner wall of the glue collecting cylinder 4 and the scraping plates 42. The small amount of excess splashed glue is intercepted and collected, and is discharged and recycled by a multi-stage scraping method. A plurality of support rods 43 are fixedly connected to the bottom of the turntable 22, and scraping frames 44 that slide with the corresponding scraping plates 42 are fixedly connected to the support rods 43;

[0060] By rotating the turntable 22, the rubber scraping plate 42 is driven to rotate in combination with the supporting rod 43 and the rubber scraping frame 44, so as to scrape and clean the glue on the inner wall of the glue collecting cylinder 4. A glue discharging pipe is installed at the bottom of the glue collecting cylinder 4, and the scraped photoresist is discharged and recycled through the glue discharging pipe. Then, with the downward movement of the glue collecting cylinder 4, the rubber scraping frame 44 moves upward relative to the rubber scraping plate 42, so as to scrape and clean the glue on the rubber scraping plate 42.

[0061] Embodiment 3: Please refer to Figures 1 - 9 As shown, the present invention also proposes a wafer spin coating method adopting a slit glue supply and spin coating integrated structure, including the following steps:

[0062] S1: Pretreatment: Use a dust cleaning device to clean the dust and impurities on the surface of the wafer.

[0063] S2: Self-centering fixation: Use a glue supply and spin coating integrated device to adsorb and fix the wafer, and use the downward movement of the adsorption and fixation to perform multi-point clamping on the wafer, and complete the centering rotation after the wafer is fixed.

[0064] Place the wafer on the top of a plurality of bellows suction cups 23 on the turntable 22. The vacuum generating device 25 extracts the air in each bellows suction cup 23 through the rotary joint, the first air pipe, the air disc 24 and the second air pipe, so as to perform negative pressure adsorption and fixation on the wafer. During the adsorption and fixation process, as the gas in the bellows suction cup 23 decreases, it causes its height to drop and carry the wafer to move downward. The wafer contacts the material supporting part 27 on each rotating sleeve rod 26, causing the rotating sleeve rod 26 to deflect. The arc-shaped clamping plate 29 moves upward to contact the side wall of the wafer, so as to push the wafer to move for centering treatment.

[0065] S3: Slit glue supply: Through a slit glue outlet with a specific shape, perform synchronous and different amount glue supply treatment on different positions of the wafer in the radial length, and combine with the low-speed rotation of the wafer to perform uniform and comprehensive glue supply and primary spin coating treatment.

[0066] The electric push rod 36 drives the mounting column 31 and carries the glue collecting cylinder 4 to move downward. During the downward movement, through the sliding of the guide pin 12 in the L-shaped guide groove 37, the mounting column 31 is made to carry the glue supply cutter head 32 to deflect by 90°. First, the glue supply cutter head 32 deflects to directly above the adsorbed and fixed wafer, and then the deflection is restricted and it descends until the distance between the glue supply cutter head 32 and the wafer is equal to the coating thickness. Fill the photoresist into the glue storage cavity through the glue inlet pipe, and then discharge it through the slit opening 33 and contact the wafer. Through the triangular structure of the slit opening 33, the photoresist performs synchronous and different amount glue supply treatment on different positions of the wafer in the radial length.

[0067] The motor drives the rotating column 21 to rotate slowly through the meshing gears and the external toothed ring. The rotating column 21 drives the turntable 22 and the wafer to rotate, completing the full glue supply process. During the glue supply process, the discharged photoresist is initially leveled by the glue supply cutter head 32.

[0068] S4: Residual glue collection and secondary leveling: The wafer rotates at a high speed, and the centrifugal force promotes the further uniform coating of the photoresist. A small amount of the excess residual glue thrown out is intercepted and collected, and a multi-stage scraping method is used to discharge and recycle it.

[0069] After the glue supply is completed, the electric push rod 36 drives the mounting column 31 to move upward, causing the glue collection cylinder 4 and the glue supply cutter head 32 to rise. And the glue supply cutter head 32 deflects in the reverse reset direction. The glue collection cylinder 4 combines with the anti-splash ring 41 to perform a sleeve-type four-sided shielding on the wafer. The motor drives the turntable 22 to rotate at a high speed, so that the photoresist that is uneven at the head and tail of the slit coating is flattened and leveled again through rotation.

[0070] A small amount of excess photoresist is thrown onto the inner wall of the glue collection cylinder 4 and the scraping plate 42. Through the rotation of the turntable 22, the scraping plate 42 is driven to rotate in combination with the support rod 43 and the scraping frame 44, so as to scrape and clean the glue on the inner wall of the glue collection cylinder 4, and it is discharged and recycled through the glue discharge pipe. Then, with the downward movement of the glue collection cylinder 4, the scraping frame 44 moves upward relative to the scraping plate 42, so as to scrape and clean the glue on the scraping plate 42.

[0071] S5: Rotate the locking bolt, pull the adjusting rod 28 to move within the rotating sleeve rod 26, adjust the distance between the arc-shaped clamping plate 29 and the rotating sleeve rod 26, and complete the self-centering clamping of wafers of different sizes. Rotate the fixing screw, pull the blocking plate 34 to move within the glue storage cavity, and adjust the blocking length of the blocking plate 34 for the slit opening 33 to cope with the glue supply treatment of wafers of different sizes.

[0072] The above is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A wafer spin coating method using a slit glue supply and spin coating integrated structure, characterized in that, The following steps are involved: S1： Pretreatment: Use dust cleaning equipment to clean the dust and impurities on the surface of the wafer; S2: Autonomous centering and fixing: The wafer is fixed by adsorption using the integrated glue supply and glue leveling device, and the wafer is clamped at multiple points by the descending motion of adsorption and fixing to complete the centering rotation after the wafer is fixed; S3: Slit glue supply: Through the specific shape of the slit glue outlet, the wafer is synchronously supplied with different amounts of glue at different positions on the radius length, and combined with the low-speed rotation of the wafer, uniform full glue supply and initial glue leveling are performed; S4: Residual glue collection and secondary coating: The wafer rotates at high speed, and the centrifugal force is used to promote the photoresist to be further evenly coated. A small amount of excess residual glue is intercepted and collected, and discharged and recycled by multi-stage scraping; The integrated glue supply and glue leveling device used in the above-mentioned processing method comprises a fixing table (1), on which a centering fixing component (2) for autonomously centering and clamping a wafer is arranged, and a deflection glue supply component (3) for performing different amounts of glue supply at different positions on the radial length of the wafer; A rubber collecting cylinder (4) is movably installed above the fixed platform (1) and cooperates with the centering fixed component (2) to collect and discharge the residual rubber.

2. The wafer spin coating method using the slit glue supply and spin coating integrated structure according to claim 1, wherein The centering and fixing assembly (2) comprises a rotating column (21) rotatably mounted on a fixing platform (1), a rotating disc (22) being fixedly connected to the top of the rotating column (21), a plurality of accordion suction cups (23) being fixedly mounted on the top of the rotating disc (22), and a spring being installed inside the side wall of the accordion suction cups (23).

3. The wafer spin coating processing method using the slit glue supply and spin coating integrated structure according to claim 2, characterized in that, An air disc (24) is provided below the turntable (22), and an air pipe 1 is installed on the air disc (24), and an air pipe 2 is connected to each organ suction cup (23). A vacuum generating device (25) is installed at the bottom of the fixed platform (1), and the suction pipe of the vacuum generating device (25) is connected to the air pipe 1 through a rotating joint.

4. The wafer spin coating processing method using the slit glue supply and spin coating integrated structure according to claim 2, wherein, A rotating sleeve rod (26) is rotatably connected to the rotating disk (22) and is located between two adjacent accordion suction cups (23). A material supporting portion (27) is fixedly connected to the rotating sleeve rod (26), and an adjusting rod (28) is slidably connected thereto. An arc-shaped clamping plate (29) is fixedly connected to the end of the adjusting rod (28). A locking bolt that contacts the adjusting rod (28) is threadedly connected to the rotating sleeve rod (26).

5. The wafer spin coating processing method using the slit-based glue supply and spin coating integrated structure according to claim 2, wherein An outer gear ring is fixedly connected to the rotating column (21), a motor is mounted on the fixed platform (1) via bolts, and a gear meshing with the outer gear ring is mounted on the output shaft of the motor.

6. The wafer spin coating processing method using the slit glue supply and spin coating integrated structure according to claim 2, wherein The deflection-type glue supply assembly (3) comprises a mounting column (31) rotatably mounted on the glue collecting cylinder (4); a glue supply knife head (32) is fixedly connected to the top of the mounting column (31); a glue storage cavity is provided inside the glue supply knife head (32); a slit opening (33) in a triangular structure is provided through the bottom of the glue storage cavity; and a glue inlet pipe is installed on the glue supply knife head (32).

7. The wafer spin coating processing method using the slit glue supply and spin coating integrated structure according to claim 6, characterized in that, A plugging plate (34) is slidably connected inside the glue storage cavity. A fixing bolt that abuts against the plugging plate (34) is threadedly installed on the glue supply cutter head (32). A rubber plug block (35) that slidably abuts against the slit opening (33) is fixedly connected to the bottom of the plugging plate (34), and the cross-section of the rubber plug block (35) is in a ﹞ structure.

8. The wafer spin coating processing method using the slit glue supply and spin coating integrated structure according to claim 6, characterized in that, An electric push rod (36) is fixedly connected to the fixing table (1), and the end of the piston rod of the electric push rod (36) is connected to the mounting column (31) through a rotating seat. A plurality of guide rods that slide on the fixing table (1) are fixedly connected to the bottom of the glue collecting cylinder (4).

9. The wafer spin coating method using the slit glue supply and spin coating integrated structure according to claim 6, wherein, An L-shaped guiding groove (37) is formed on the outer circumferential wall of the mounting column (31). A fixing plate (11) is fixedly connected to the top of the fixing table (1), and a guiding pin (12) that slides in the L-shaped guiding groove (37) is fixedly connected to the fixing plate (11).

10. The wafer spin coating processing method using the slit glue supply and spin coating integrated structure according to claim 2, characterized in that, A splash-proof ring (41) is rotatably installed on the top of the glue collecting cylinder (4), and a plurality of scraping plates (42) that slide inside the glue collecting cylinder (4) are fixedly connected to the splash-proof ring (41). A plurality of support rods (43) are fixedly connected to the bottom of the turntable (22), and a scraping frame (44) that slides with the corresponding scraping plate (42) is fixedly connected to the support rods (43). A drain pipe is installed at the bottom of the glue collecting cylinder (4).

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