Damping type industrial computer

Abstract

The invention relates to the related technical field of industrial control equipment, and discloses a damping type industrial computer which comprises a device shell, heat dissipation holes are formed in the side face of the device shell, the industrial computer is fixedly connected into the device shell, a heat dissipation device is movably connected to the bottom of the industrial computer, and a damping device is arranged at the bottom of the heat dissipation device. A connecting device is arranged in the side wall of the device shell, a connecting cover plate is rotationally connected to the device shell, and a connecting block is fixedly connected to the connecting cover plate; the device is provided with a damping device, a damping spring can reduce the amplitude after vibration occurs between the top connecting plate and the bottom connecting plate, so that the vibration effect in the vertical direction is reduced, a sliding block and a threaded rod can reduce the vibration effect in the horizontal direction, and the device is further provided with a connecting device which can block dust when the industrial computer is idle. And meanwhile, the baffle can also sweep dust on the heat dissipation holes and the baffle into a dust receiving plate at the bottom through friction with the heat dissipation holes.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial control equipment, and specifically relates to a shock-absorbing industrial computer. Background Technique

[0002] Industrial computers are the core of industrial automation equipment and basic equipment in the information industry. Traditionally, industrial computers are mainly used for the measurement, control, and management of industrial production processes. With the booming development of industries such as wireless network technology, information appliances, automobiles, and healthcare in recent years, industrial computers are playing an increasingly important role in these industries, which makes the demand and development of industrial computer products in the future industry market become more vigorous and rapid.

[0003] Publication No. CN208000535U discloses a convenient industrial control computer, including a housing and a drawer assembly and a cylinder arranged in the inner cavity of the housing; the drawer assembly includes: a face shell, a carrier board, a main board, a hard disk, a shock-absorbing seat, and a SATA seat; one side of the carrier board is connected to the panel, and the other side is connected to the housing through a cylinder output shaft, the main board is arranged in the card seat of the carrier board; the shock-absorbing seat is arranged above the main board; the hard disk is arranged on the shock-absorbing seat and is connected to the main board through a SATA seat arranged on the main board. The utility model provides a drawer-type engineering control computer with an efficient heat dissipation structure, which can facilitate the rapid maintenance of the engineering control computer and the rapid installation of the hard disk.

[0004] Existing industrial computers are slightly insufficient in terms of earthquake resistance. The internal components of industrial computers may be damaged due to vibration, thus affecting the normal use of industrial computers. At the same time, when industrial computers are idle, dust is likely to accumulate at the heat dissipation plate, thus affecting the heat dissipation performance. Summary of the Invention

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a shock-absorbing industrial computer to solve the problems existing in the above-mentioned background technique.

[0006] The present invention provides the following technical solution: a shock-absorbing industrial computer, including a device housing. Heat dissipation holes are provided on the side surface of the device housing. An industrial computer is fixedly connected inside the device housing. A heat dissipation device is movably connected to the bottom of the industrial computer. A shock-absorbing device is provided at the bottom of the heat dissipation device. A connecting device is provided inside the side wall of the device housing. The shock-absorbing device includes a top connecting plate. A shock-absorbing spring is fixedly connected to the bottom of the top connecting plate. The shock-absorbing spring can reduce the amplitude after vibration between the top connecting plate and the bottom connecting plate, thereby reducing the vibration effect in the vertical direction. The bottom of the shock-absorbing spring is fixedly connected to a bottom connecting plate. A threaded rod is rotatably connected to the inner side surface of the bottom connecting plate. A slider is threadedly connected to the threaded rod. The bottom of the slider is movably connected to a fixed block. The fixed block is fixedly connected to the bottom connecting plate. A fixed rod is fixedly connected to the side surface of the top connecting plate. A movable connecting rod is rotatably connected to the fixed rod. The other end of the movable connecting rod is rotatably connected to a connecting side rod. The connecting side rod is fixedly connected to the slider. When in use, after the top connecting plate vibrates, it will move up and down. When the top connecting plate moves downward, it will drive the fixedly connected fixed rod on the side to move downward. The fixed rod drives the movable connecting rod and the connecting side rod to move to both sides. The connecting side rod drives the slider fixedly connected to the side to slide along the fixed block to both sides. The slider and the threaded rod are used to reduce the vibration effect in the horizontal direction;

[0007] The connecting device includes a top plate. A spring damper is fixedly connected to the bottom of the top plate. A fixing plate is fixedly connected to the bottom of the spring damper. A clamping block is fixedly connected to the bottom of the fixing plate. A dust receiving plate is movably connected to the inner side surface of the clamping block. A movable plate is fixedly connected to the bottom of the top plate. Connecting holes are provided on the movable plate. A baffle is provided at the top position of each connecting hole. The baffle is fixedly connected to the movable plate. The fixing plate is fixedly connected to the device housing. A connecting cover plate is rotatably connected to the device housing. A connecting block is fixedly connected to the connecting cover plate. After the connecting cover plate is opened, the connecting block is separated from the connecting device, so that the top plate pops up upward through the spring damper. The top plate drives the movable plate fixedly connected to the bottom to move upward, driving the baffle originally covering the heat dissipation hole to move upward, so that the connecting hole at the bottom of the baffle reaches the position of the heat dissipation hole, which can help the device dissipate heat better. When the connecting cover plate is covered on the device housing, the top plate and the movable plate are pressed down through the connecting block, so that the baffle is again at the position of the heat dissipation hole. When the industrial computer is idle, it can prevent dust, and at the same time, the baffle can also sweep the dust on the heat dissipation hole and the baffle to the dust receiving plate at the bottom by friction with the heat dissipation hole.

[0008] Further, two positioning devices are fixedly connected to the outer shell of the device, two positioning holes are provided on the connection cover plate, and the positioning devices are movably connected to the positioning holes, facilitating fixation during installation.

[0009] Further, a connection buckle is fixedly connected to the side surface of the outer shell of the device, a lock buckle is fixedly connected to the side surface of the connection cover plate, a silica gel plate is fixedly connected to the inner side surface of the connection cover plate, the silica gel plate is movably connected to the inner wall of the outer shell of the device, and the connection buckle and the lock buckle are movably connected.

[0010] Further, the heat dissipation device includes a heat dissipation outer shell, a connection shaft is fixedly connected to the center of the heat dissipation outer shell, and a plurality of heat dissipation openings are provided on the side surface of the heat dissipation outer shell.

[0011] Further, a heat dissipation fan is arranged inside the heat dissipation outer shell, the heat dissipation fan is movably connected to the connection shaft, and a motor is arranged at the connection between the heat dissipation fan and the connection shaft.

[0012] Further, a connection cushion block is arranged on the side surface of the heat dissipation device, the connection cushion block is made of elastic rubber, the top height of the connection cushion block is slightly higher than that of the heat dissipation outer shell, the connection cushion block is arranged on the top of the top connection plate and fixedly connected to the top connection plate, and the top connection plate is movably connected to the outer shell of the device.

[0013] Further, the baffle is made of nylon, the baffle is fixedly connected to both side surfaces of the movable plate, the baffle has two layers, the inner layer is a dust-proof plate made of nylon, and the outer layer is a brush made of nylon. Nylon has good wear resistance and elasticity, a long service life, and is not easily deformed. It has a long service time and good cleaning effect when used as a dust-proof plate and a cleaning brush.

[0014] Further, the dust collection plate is movably connected to the outer shell of the device, and a handle is fixedly connected to the dust collection plate, facilitating the extraction at any time for cleaning the inside of the dust collection plate.

[0015] Beneficial effects:

[0016] 1. For this shock-absorbing industrial computer, the device is provided with a shock-absorbing device. When the top connection plate vibrates during use, it will move up and down. The shock-absorbing spring can reduce the amplitude of the vibration between the top connection plate and the bottom connection plate, thereby reducing the vibration effect in the vertical direction. When the top connection plate moves downward, it will drive the fixed rod fixedly connected to the side to move downward, and the fixed rod drives the movable connecting rod and the connecting side rod to move towards both side surfaces. The connecting side rod drives the slider fixedly connected to the side to slide along the fixed block towards both side surfaces, and the slider and the threaded rod are used to reduce the vibration effect in the horizontal direction.

[0017] 2. The shock-absorbing industrial computer is provided with a connecting device. After the connecting cover plate is opened, the connecting block is separated from the connecting device, so that the top plate pops up upward through the spring damper. The top plate drives the movable plate fixedly connected at the bottom to move upward, driving the baffle originally covering the heat dissipation holes to move upward, so that the connecting holes at the bottom of the baffle reach the positions of the heat dissipation holes, which can help the device dissipate heat better. When the connecting cover plate is covered on the device shell, the top plate and the movable plate are pressed down through the connecting block, so that the baffle is again at the position of the heat dissipation holes, which can prevent dust when the industrial computer is idle. At the same time, the baffle can also sweep the dust on the heat dissipation holes and the baffle to the dust receiving plate at the bottom by friction with the heat dissipation holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. is a schematic diagram of the overall structure of a shock-absorbing industrial computer proposed by the present invention;

[0019] Figure 2 FIG. is a schematic diagram of the internal structure of the device shell of a shock-absorbing industrial computer proposed by the present invention;

[0020] Figure 3 FIG. is a schematic diagram of the heat dissipation device and the shock absorption device of a shock-absorbing industrial computer proposed by the present invention;

[0021] Figure 4 FIG. is a schematic diagram of the connecting device of a shock-absorbing industrial computer proposed by the present invention.

[0022] In the figure: 1. Device shell; 2. Connecting cover plate; 3. Silicone plate; 4. Industrial computer; 5. Heat dissipation device; 501. Connecting shaft; 502. Heat dissipation shell; 503. Heat dissipation port; 504. Heat dissipation fan; 6. Shock absorption device; 601. Top connecting plate; 602. Bottom connecting plate; 603. Shock absorption spring; 604. Slide block; 605. Fixed block; 606. Threaded rod; 607. Connecting side rod; 608. Movable connecting rod; 609. Fixed rod; 7. Connecting buckle; 8. Dust receiving plate; 9. Heat dissipation holes; 10. Connecting device; 1001. Top plate; 1002. Spring damper; 1003. Fixed plate; 1004. Clamping block; 1005. Movable plate; 1006. Connecting holes; 1007. Baffle; 11. Positioning device; 12. Connecting block; 13. Lock; 14. Positioning holes; 15. Connecting pads. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0024] Embodiment 1

[0025] Please refer to Figures 1-3 , a shock-absorbing industrial computer, including a device housing 1, a heat dissipation hole 9 is provided on the side of the device housing 1, an industrial computer 4 is fixedly connected inside the device housing 1, a heat dissipation device 5 is movably connected to the bottom of the industrial computer 4, a shock-absorbing device 6 is provided at the bottom of the heat dissipation device 5, and a connecting device 10 is provided inside the side wall of the device housing 1. The shock-absorbing device 6 includes a top connecting plate 601, a shock-absorbing spring 603 is fixedly connected to the bottom of the top connecting plate 601. The shock-absorbing spring 603 can reduce the amplitude after vibration between the top connecting plate 601 and the bottom connecting plate 602, thereby reducing the vibration effect in the vertical direction. The bottom of the shock-absorbing spring 603 is fixedly connected to a bottom connecting plate 602. A threaded rod 606 is rotatably connected to the inner side surface of the bottom connecting plate 602. A slider 604 is threadedly connected to the threaded rod 606. The bottom of the slider 604 is movably connected to a fixed block 605. The fixed block 605 is fixedly connected to the bottom connecting plate 602. A fixed rod 609 is fixedly connected to the side surface of the top connecting plate 601. A movable connecting rod 608 is rotatably connected to the fixed rod 609. The other end of the movable connecting rod 608 is rotatably connected to a connecting side rod 607. The connecting side rod 607 is fixedly connected to the slider 604. When in use, after the top connecting plate 601 vibrates, it will move up and down. When the top connecting plate 601 moves downward, it will drive the fixed rod 609 fixedly connected to the side surface downward. The fixed rod 609 drives the movable connecting rod 608 and the connecting side rod 607 to move toward both side surfaces. The connecting side rod 607 drives the slider 604 fixedly connected to the side surface to slide along the fixed block 605 toward both side surfaces, and the slider 604 and the threaded rod 606 are used to reduce the vibration effect in the horizontal direction.

[0026] Embodiment 2

[0027] Please refer to Figures 1-4, the connecting device 10 includes a top plate 1001. A spring damper 1002 is fixedly connected to the bottom of the top plate 1001. A fixing plate 1003 is fixedly connected to the bottom of the spring damper 1002. A clamping block 1004 is fixedly connected to the bottom of the fixing plate 1003. A dust receiving plate 8 is movably connected to the inner side surface of the clamping block 1004. A movable plate 1005 is fixedly connected to the bottom of the top plate 1001. Connecting holes 1006 are formed in the movable plate 1005. A baffle 1007 is arranged at the top position of each connecting hole 1006. The baffle 1007 is fixedly connected to the movable plate 1005. The fixing plate 1003 is fixedly connected to the device housing 1. A connecting cover plate 2 is rotatably connected to the device housing 1. A connecting block 12 is fixedly connected to the connecting cover plate 2. After the connecting cover plate 2 is opened, the connecting block 12 is separated from the connecting device 10, so that the top plate 1001 pops up upward through the spring damper 1002. The top plate 1001 drives the movable plate 1005 fixedly connected to the bottom upward, driving the baffle 1007 originally covering the heat dissipation holes 9 upward, so that the connecting holes 1006 at the bottom of the baffle 1007 reach the positions of the heat dissipation holes 9, which can help the device dissipate heat better. When the connecting cover plate 2 covers the device housing 1, the top plate 1001 and the movable plate 1005 are pressed down through the connecting block 12, so that the baffle 1007 is again at the position of the heat dissipation holes 9, which can prevent dust when the industrial computer 4 is idle. At the same time, the baffle 1007 can also sweep the dust on the heat dissipation holes 9 and the baffle 1007 to the dust receiving plate 8 at the bottom through friction with the heat dissipation holes 9.

[0028] Two positioning devices 11 are fixedly connected to the device housing 1. Two positioning holes 14 are formed in the connecting cover plate 2. The positioning devices 11 and the positioning holes 14 are movably connected, which is more convenient for fixing during installation.

[0029] A connecting buckle 7 is fixedly connected to the side surface of the device housing 1. A lock buckle 13 is fixedly connected to the side surface of the connecting cover plate 2. A silica gel plate 3 is fixedly connected to the inner side surface of the connecting cover plate 2. The silica gel plate 3 is movably connected to the inner wall of the device housing 1. The connecting buckle 7 and the lock buckle 13 are movably connected.

[0030] The heat dissipation device 5 includes a heat dissipation housing 502. A connecting shaft 501 is fixedly connected to the center of the heat dissipation housing 502. A plurality of heat dissipation openings 503 are formed in the side surface of the heat dissipation housing 502.

[0031] A heat dissipation fan 504 is arranged inside the heat dissipation housing 502. The heat dissipation fan 504 is movably connected to the connecting shaft 501. A motor is arranged at the connection between the heat dissipation fan 504 and the connecting shaft 501.

[0032] A connecting cushion block 15 is arranged on the side surface of the heat dissipation device 5. The connecting cushion block 15 is made of elastic rubber. The top height of the connecting cushion block 15 is slightly higher than that of the heat dissipation housing 502. The connecting cushion block 15 is arranged on the top of the top connecting plate 601 and fixedly connected to the top connecting plate 601. The top connecting plate 601 is movably connected to the device housing 1.

[0033] The baffle 1007 is made of nylon. The baffle 1007 is fixedly connected to the two side surfaces of the movable plate 1005. The baffle 1007 is provided with two layers. The inner layer is a dust-proof plate made of nylon, and the outer layer is a brush made of nylon. Nylon has good wear resistance and elasticity, a long service life, and is not easy to deform. It has a long service time and good cleaning effect when used as a dust-proof plate and a cleaning brush.

[0034] The dust receiving plate 8 is movably connected to the device housing 1. A handle is fixedly connected to the dust receiving plate 8, which is convenient for cleaning the inside of the dust receiving plate 8 at any time after being pulled out.

[0035] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A shock-absorbing industrial computer, comprising a device housing (1), characterized in that: On the side of the device housing (1), heat dissipation holes (9) are provided. Inside the device housing (1), an industrial computer (4) is fixedly connected. At the bottom of the industrial computer (4), a heat dissipation device (5) is movably connected. At the bottom of the heat dissipation device (5), a shock absorption device (6) is provided. Inside the side wall of the device housing (1), a connection device (10) is provided. The shock absorption device (6) includes a top connecting plate (601). At the bottom of the top connecting plate (601), a shock absorption spring (603) is fixedly connected. The shock absorption spring (603) can reduce the amplitude after vibration occurs between the top connecting plate (601) and the bottom connecting plate (602), thereby reducing the vibration effect in the vertical direction. At the bottom of the shock absorption spring (603), a bottom connecting plate (602) is fixedly connected. On the inner side surface of the bottom connecting plate (602), a threaded rod (606) is rotatably connected. A slider (604) is threadedly connected to the threaded rod (606). At the bottom of the slider (604), a fixed block (605) is movably connected. The fixed block (605) is fixedly connected to the bottom connecting plate (602). On the side surface of the top connecting plate (601), a fixed rod (609) is fixedly connected. An active connecting rod (608) is rotatably connected to the fixed rod (609). At the other end of the active connecting rod (608), a connecting side rod (607) is rotatably connected. The connecting side rod (607) is fixedly connected to the slider (604). During use, after the top connecting plate (601) vibrates, it will move up and down. When the top connecting plate (601) moves downward, it will drive the fixed rod (609) fixedly connected to the side surface to move downward. The fixed rod (609) drives the active connecting rod (608) and the connecting side rod (607) to move towards both side surfaces. The connecting side rod (607) drives the slider (604) fixedly connected to the side surface to slide along the fixed block (605) towards both side surfaces. The vibration effect in the horizontal direction is reduced through the slider (604) and the threaded rod (606); The connecting device (10) includes a top plate (1001). A spring damper (1002) is fixedly connected to the bottom of the top plate (1001). A fixing plate (1003) is fixedly connected to the bottom of the spring damper (1002). A clamping block (1004) is fixedly connected to the bottom of the fixing plate (1003). A dust receiving plate (8) is movably connected to the inner side surface of the clamping block (1004). A movable plate (1005) is fixedly connected to the bottom of the top plate (1001). A connection hole (1006) is formed in the movable plate (1005). A baffle (1007) is arranged at the top position of each connection hole (1006). The baffle (1007) is fixedly connected to the movable plate (1005). The fixing plate (1003) is fixedly connected to the device housing (1). A connection cover plate (2) is rotatably connected to the device housing (1). A connection block (12) is fixedly connected to the connection cover plate (2). After the connection cover plate (2) is opened, the connection block (12) is separated from the connecting device (10), so that the top plate (1001) pops up upward through the spring damper (1002). The top plate (1001) drives the movable plate (1005) fixedly connected to the bottom to move upward, driving the baffle (1007) originally covering the heat dissipation holes (9) to move upward, so that the connection holes (1006) at the bottom of the baffle (1007) reach the positions of the heat dissipation holes (9), which can help the device dissipate heat better. When the connection cover plate (2) is covered on the device housing (1), the top plate (1001) and the movable plate (1005) are pressed down through the connection block (12), so that the baffle (1007) is again in the position of the heat dissipation holes (9), which can prevent dust when the industrial computer (4) is idle. At the same time, the baffle (1007) can also sweep the dust on the heat dissipation holes (9) and the baffle (1007) to the bottom dust receiving plate (8) by friction with the heat dissipation holes (9).

2. The shock-absorbing industrial computer according to claim 1, characterized in that: Two positioning devices (11) are fixedly connected to the device housing (1). Two positioning holes (14) are formed in the connection cover plate (2). The positioning devices (11) and the positioning holes (14) are movably connected.

3. The shock-absorbing industrial computer according to claim 1, characterized in that: A connection buckle (7) is fixedly connected to the side surface of the device housing (1). A lock buckle (13) is fixedly connected to the side surface of the connection cover plate (2). A silica gel plate (3) is fixedly connected to the inner side surface of the connection cover plate (2). The silica gel plate (3) is movably connected to the inner wall of the device housing (1). The connection buckle (7) and the lock buckle (13) are movably connected.

4. A shock-absorbing industrial computer according to claim 1, characterized in that: The heat dissipation device (5) includes a heat dissipation housing (502). A connection shaft (501) is fixedly connected to the center of the heat dissipation housing (502). A plurality of heat dissipation openings (503) are formed in the side surface of the heat dissipation housing (502).

5. The shock-absorbing industrial computer according to claim 4, characterized in that: A heat dissipation fan (504) is arranged inside the heat dissipation housing (502). The heat dissipation fan (504) is movably connected to the connection shaft (501). A motor is arranged at the connection of the heat dissipation fan (504) and the connection shaft (501).

6. The shock-absorbing industrial computer according to claim 5, wherein: A connecting cushion block (15) is arranged on the side of the heat dissipation device (5). The connecting cushion block (15) is made of elastic rubber. The top height of the connecting cushion block (15) is slightly higher than that of the heat dissipation housing (502). The connecting cushion block (15) is arranged on the top of the top connecting plate (601) and fixedly connected to the top connecting plate (601). The top connecting plate (601) is movably connected to the device housing (1).

7. The shock-absorbing industrial computer according to claim 1, characterized in that: The baffle plate (1007) is made of nylon. The baffle plate (1007) is fixedly connected to both side surfaces of the movable plate (1005). The baffle plate (1007) has two layers. The inner layer is a dust-proof plate made of nylon, and the outer layer is a brush made of nylon.

8. The shock-absorbing industrial computer according to claim 1, characterized in that: The dust receiving plate (8) is movably connected to the device housing (1). A handle is fixedly connected to the dust receiving plate (8).

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