Chip transfer mechanism of die bonder

Abstract

The present application relates to die bonder technical field, especially to a kind of die bonder chip transport mechanism, a kind of die bonder chip transport mechanism, including rack, linear drive mechanism, lifting mechanism and lifting platform, the front end of rack is provided with first connecting frame, the front end of first connecting frame is provided with second connecting frame, first position space is arranged between rack and first connecting frame, second position space is arranged between first connecting frame and second connecting frame, the rear end of lifting platform is provided with connecting portion, the top of connecting portion is provided with first position recess, first connecting frame is located in first position recess, the front end of lifting platform extends into second position space.The present application greatly reduces the possibility of metal dust and mechanical vibration due to friction, helps to prevent semiconductor products from being contaminated, improves the quality of final product, while the overall structure will not occupy the space of rack bottom, cleverly avoids position, is beneficial to the setting of various components at the bottom of rack.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonder, in particular to a die bonder chip transmission mechanism. BACKGROUND

[0002] In the semiconductor manufacturing process, the process of die bonder requires high precision and stability to ensure the quality and reliability of the final product. However, in the prior art, when the die bonder transmits the chip, it usually encounters some technical challenges.

[0003] Specifically, in the process of transmitting the chip, the moving assembly of the traditional die bonder often directly contacts with the track. This contact not only causes friction between metal parts, generating metal dust, but also causes mechanical vibration. Metal dust poses a potential threat to semiconductor products, as they can contaminate the chip surface, leading to a decrease in electrical performance or complete failure. In addition, vibration may cause the chips to scatter from the tray, increasing the loss rate during production and possibly affecting the long-term stability and maintenance cost of the equipment. SUMMARY

[0004] The present application aims to at least solve the technical problems existing in the prior art. To this end, the present application proposes a die bonder chip transmission mechanism that effectively avoids friction and vibration during transmission, ensuring the accuracy and stability of operation, thereby improving chip transmission efficiency and product quality, and reducing production loss.

[0005] According to some embodiments of the present application, a die bonder chip transmission mechanism includes a rack, a linear drive mechanism, a lifting mechanism, and a lifting platform. The front end of the rack is provided with a first connecting frame, the front end of the first connecting frame is provided with a second connecting frame, a first avoidance space is provided between the rack and the first connecting frame, a second avoidance space is provided between the first connecting frame and the second connecting frame, the linear drive mechanism is arranged at the top of the rack, the output end of the linear drive mechanism is connected with the lifting mechanism, the lifting mechanism is located in the first avoidance space, the output end of the lifting mechanism is connected with the lifting platform, the rear end of the lifting platform is provided with a connecting part, the top of the connecting part is provided with a first avoidance groove, the first connecting frame is located in the first avoidance groove, and the front end of the lifting platform extends into the second avoidance space.

[0006] According to some embodiments of the present application, a die bonder chip transmission mechanism has at least the following beneficial effects:

[0007] The first and second space-avoiding spaces are designed, so that the linear driving mechanism and the lifting mechanism avoid direct contact with the track or other fixed components during operation, thereby greatly reducing the possibility of metal dust and mechanical vibration caused by friction, helping to prevent the semiconductor product from being contaminated, ensuring that its electrical performance is not affected, protecting the chip from the risk of scattering due to vibration, thereby improving the quality of the final product, reducing maintenance costs, and the connecting part at the rear end of the lifting platform is provided with a first space-avoiding groove, and the first connecting frame is located in the first space-avoiding groove, so that the overall structure does not occupy the space at the bottom of the rack, and the space is avoided ingeniously, which is beneficial to the arrangement of various components at the bottom of the rack.

[0008] According to the chip transmission mechanism of the die bonder, the output end of the lifting mechanism is provided with a first connecting plate, the bottom of the first connecting plate is provided with a second connecting plate, the rear end of the lifting platform is provided with a positioning block on each side, a positioning groove is arranged between the two positioning blocks, and the bottom of the second connecting plate is connected with the bottom of the positioning groove.

[0009] According to the chip transmission mechanism of the die bonder, the positioning block is provided with a gas connecting port, the left and right ends of the connecting part are provided with a first gas flow channel, the rear end of the lifting platform is provided with a second gas flow channel, the second gas flow channel is arranged on the rear end of the lifting platform, the middle part of the lifting platform is provided with a containing space, a plurality of containing grooves are formed in the top of the lifting platform, the gas connecting port, the first gas flow channel, the second gas flow channel, the containing space and the containing grooves are sequentially communicated, and the containing grooves are arranged in an array.

[0010] According to the chip transmission mechanism of the die bonder, the second gas flow channel is arranged transversely, two first gas flow channels are respectively communicated with two ends of the second gas flow channel, the top of the first gas flow channel is provided with a long-strip-shaped notch, and the containing space is communicated with the second gas flow channel through the notch.

[0011] According to the chip transmission mechanism of the die bonder, a plurality of supporting columns are arranged in the containing space, and the upper and lower ends of the supporting columns are connected with the upper and lower ends of the containing space respectively.

[0012] According to the chip transmission mechanism of the die bonder, the output end of the linear driving mechanism is provided with a first fixing plate, the front end of the first fixing plate is provided with a second fixing plate, the second fixing plate extends into the first space-avoiding space, the bottom of the second fixing plate is provided with an assembly plate, and the lifting mechanism is arranged on the assembly plate.

[0013] According to the chip transmission mechanism of the die bonder according to some embodiments of the present application, the first connecting frame is provided with a first step portion near the top of one side of the second connecting frame, and the second connecting frame is provided with a second step portion near the top of one side of the first connecting frame, and the first step portion and the second step portion are arranged correspondingly.

[0014] According to the chip transmission mechanism of the die bonder according to some embodiments of the present application, the distance between the top of the first avoiding groove and the bottom of the first connecting frame is L1, the height of the first step portion and the height of the second step portion are both L2, and L1 is less than L2.

[0015] According to the chip transmission mechanism of the die bonder according to some embodiments of the present application, a plurality of third connecting plates are arranged between the first connecting frame and the second connecting frame, the bottom of each of the third connecting plates is concave upward to form a second avoiding groove, and the second avoiding groove is located at the top of the second avoiding space.

[0016] According to the chip transmission mechanism of the die bonder according to some embodiments of the present application, the stand is provided with a first boss and a second boss at the front end and the rear end respectively, the front end of the second connecting frame is provided with a third connecting frame, the third connecting frame is connected with the top of the first boss, the two ends of the frame are connected with the two second bosses respectively, a third avoiding groove is arranged between the first boss and the second boss, and the first avoiding space and the second avoiding space are both located at the top of the third avoiding groove.

[0017] Additional aspects and advantages of the present application will be made apparent from the following description of embodiments of the present application, which will be described in the following description of embodiments of the present application, which will be described in the following description of embodiments of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of embodiments, including the accompanying drawings.

[0019] Figure 1 The structure of the embodiment of the present application is shown in the figure.

[0020] Figure 2 The side view of the embodiment of the present application is shown in the figure.

[0021] Figure 3 The structure of the lifting mechanism of the embodiment of the present application is shown in the figure.

[0022] Figure 4 The cross-sectional view of the lifting mechanism of the embodiment of the present application is shown in the figure.

[0023] Figure 5 The structure of the embodiment of the present application is shown in the figure. Figure 4 The enlarged view of part A in the figure.

[0024] 1, rack, 2, linear driving mechanism, 3, lifting mechanism, 4, lifting platform, 5, first connecting frame, 6, second connecting frame, 7, first avoiding space, 8, second avoiding space, 9, connecting part, 10, first avoiding groove, 11, first connecting plate, 12, second connecting plate, 13, positioning block, 14, positioning groove, 15, gas connecting port, 16, first gas flow channel, 17, second gas flow channel, 18, notch, 19, accommodating space, 20, accommodating groove, 21, supporting column, 22, first fixed plate, 23, second fixed plate, 24, assembling plate, 25, first step part, 26, second step part, 27, third connecting plate, 28, second avoiding groove, 29, stand, 30, first boss, 31, second boss, 32, third connecting frame, 33, third avoiding groove. DETAILED DESCRIPTION

[0025] Embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the present application, and cannot be understood as a limitation of the present application.

[0026] In the description of the present application, it is understood that the orientation description, such as the orientation or position relationship indicated by up, down, left, right, front, back, etc. is based on the orientation or position relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and is not intended to indicate or imply that the modules or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0027] In the description of the present application, if there is a description of first, second, only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the sequence of indicated technical features.

[0028] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting, etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0029] As Figures 1-5 shown, the embodiment of the present application provides a die bonder chip conveying mechanism.

[0030] The chip conveying mechanism of a die bonder comprises a rack 1, a linear drive mechanism 2, a lifting mechanism 3 and a lifting platform 4, the front end of the rack 1 is provided with a first connecting frame 5, the front end of the first connecting frame 5 is provided with a second connecting frame 6, a first space 7 is arranged between the rack 1 and the first connecting frame 5, a second space 8 is arranged between the first connecting frame 5 and the second connecting frame 6, the linear drive mechanism 2 is arranged at the top of the rack 1, the output end of the linear drive mechanism 2 is connected with the lifting mechanism 3, the lifting mechanism 3 is located in the first space 7, the output end of the lifting mechanism 3 is connected with the lifting platform 4, the rear end of the lifting platform 4 is provided with a connecting part 9, the top of the connecting part 9 is provided with a first space recess 10, the first connecting frame 5 is located in the first space recess 10, and the front end of the lifting platform 4 extends into the second space 8.

[0031] The first space 7 and the second space 8 are designed, so that the linear drive mechanism 2 and the lifting mechanism 3 avoid direct contact with the track or other fixed parts during operation, thereby greatly reducing the possibility of metal dust and mechanical vibration caused by friction, helping to prevent the semiconductor product from being contaminated, ensuring that the electrical performance is not affected, protecting the chip from the risk of scattering due to vibration, thereby improving the quality of the final product and reducing the maintenance cost. Meanwhile, the connecting part 9 at the rear end of the lifting platform 4 is provided with the first space recess 10, and the first connecting frame 5 is located therein, so that the overall structure does not occupy the space at the bottom of the rack 1, and the space is cleverly avoided, which is beneficial to the arrangement of various components at the bottom of the rack 1.

[0032] The chip conveying mechanism of a die bonder comprises a rack 1, a linear drive mechanism 2, a lifting mechanism 3 and a lifting platform 4, the front end of the rack 1 is provided with a first connecting frame 5, the front end of the first connecting frame 5 is provided with a second connecting frame 6, a first space 7 is arranged between the rack 1 and the first connecting frame 5, a second space 8 is arranged between the first connecting frame 5 and the second connecting frame 6, the linear drive mechanism 2 is arranged at the top of the rack 1, the output end of the linear drive mechanism 2 is connected with the lifting mechanism 3, the lifting mechanism 3 is located in the first space 7, the output end of the lifting mechanism 3 is connected with the lifting platform 4, the rear end of the lifting platform 4 is provided with a connecting part 9, the top of the connecting part 9 is provided with a first space recess 10, the first connecting frame 5 is located in the first space recess 10, and the front end of the lifting platform 4 extends into the second space 8.

[0033] The positioning block 13 is provided with a gas connection port 15, the left and right ends of the connecting part 9 are provided with a first gas flow channel 16, the rear end of the lifting platform 4 is provided with a second gas flow channel 17, the second gas flow channel 17 is transversely arranged, the two first gas flow channels 16 are respectively communicated with the two ends of the second gas flow channel 17, the top of the first gas flow channel 16 is provided with a long strip-shaped notch 18, and the accommodating space 19 is communicated with the second gas flow channel 17 through the notch 18. The middle part of the lifting platform 4 is provided with an accommodating space 19, the top of the lifting platform 4 is provided with a plurality of accommodating grooves 20, the gas connection port 15, the first gas flow channel 16, the second gas flow channel 17, the accommodating space 19 and the accommodating groove 20 are sequentially communicated, and the accommodating grooves 20 are arranged in an array. Specifically, the gas connection port 15 is arranged on the positioning block 13, the first and second gas flow channels 16 and 17, the accommodating space 19 and the accommodating groove 20 are arranged on the lifting platform 4, a complete gas flow path is formed, the chip can be adsorbed in the accommodating groove 20, and the stability of chip transmission is greatly improved.

[0034] The chip transmission mechanism of the solid crystal machine comprises a positioning block 13, a connecting part 9, a lifting platform 4, a first avoiding space 7, a linear driving mechanism 2, a lifting mechanism 3 and a second avoiding space 8.

[0035] The chip transmission mechanism of the solid crystal machine comprises a positioning block 13, a connecting part 9, a lifting platform 4, a first avoiding space 7, a linear driving mechanism 2, a lifting mechanism 3 and a second avoiding space 8.

[0036] The first connecting frame 5 is provided with a first step portion 25 on one side of the top thereof close to the second connecting frame 6, the second connecting frame 6 is provided with a second step portion 26 on one side of the top thereof close to the first connecting frame 5, and the first step portion 25 is correspondingly arranged with the second step portion 26. Specifically, the first connecting frame 5 and the second connecting frame 6 are provided with corresponding step portions, so that the lifting platform 4 can be lifted between the two step portions, and the range of the lifting platform 4 moving forward and backward is limited.

[0037] The first connecting frame 5 is provided with a first step portion 25 on one side of the top thereof close to the second connecting frame 6, the second connecting frame 6 is provided with a second step portion 26 on one side of the top thereof close to the first connecting frame 5, and the first step portion 25 is correspondingly arranged with the second step portion 26. Specifically, the first connecting frame 5 and the second connecting frame 6 are provided with corresponding step portions, so that the lifting platform 4 can be lifted between the two step portions, and the range of the lifting platform 4 moving forward and backward is limited.

[0038] The first connecting frame 5 is provided with a first step portion 25 on one side of the top thereof close to the second connecting frame 6, the second connecting frame 6 is provided with a second step portion 26 on one side of the top thereof close to the first connecting frame 5, and the first step portion 25 is correspondingly arranged with the second step portion 26. Specifically, the first connecting frame 5 and the second connecting frame 6 are provided with corresponding step portions, so that the lifting platform 4 can be lifted between the two step portions, and the range of the lifting platform 4 moving forward and backward is limited.

[0039] The first connecting frame 5 is provided with a first step portion 25 on one side of the top thereof close to the second connecting frame 6, the second connecting frame 6 is provided with a second step portion 26 on one side of the top thereof close to the first connecting frame 5, and the first step portion 25 is correspondingly arranged with the second step portion 26. Specifically, the first connecting frame 5 and the second connecting frame 6 are provided with corresponding step portions, so that the lifting platform 4 can be lifted between the two step portions, and the range of the lifting platform 4 moving forward and backward is limited.

[0040] In some embodiments, the linear drive mechanism 2 employs a U-shaped linear motor.

[0041] While the embodiments of the application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the following claims and their equivalents.

Claims

1. A die bonder chip transfer mechanism, characterized in that: The device includes a frame, a linear drive mechanism, a lifting mechanism, and a lifting platform. A first connecting frame is located at the front end of the frame, and a second connecting frame is located at the front end of the first connecting frame. A first clearance space is provided between the frame and the first connecting frame, and a second clearance space is provided between the first connecting frame and the second connecting frame. The linear drive mechanism is located at the top of the frame, and its output end is connected to the lifting mechanism. The lifting mechanism is located within the first clearance space, and its output end is connected to the lifting platform. A connecting portion is located at the rear end of the lifting platform, and a first clearance groove is provided at the top of the connecting portion. The first connecting frame is located within the first clearance groove, and the front end of the lifting platform extends into the second clearance space.

2. The die bonder chip transfer mechanism according to claim 1, characterized in that: The output end of the lifting mechanism is provided with a first connecting plate, and the bottom of the first connecting plate is provided with a second connecting plate. Positioning blocks are provided on both sides of the rear end of the lifting platform, and a positioning groove is provided between the two positioning blocks. The bottom of the second connecting plate is connected to the bottom of the positioning groove.

3. The die bonder chip transfer mechanism according to claim 2, characterized in that: Each positioning block is provided with a gas connection port, and the left and right ends of the connection part are provided with a first gas flow channel. The rear end of the lifting platform is provided with a second gas flow channel. The middle part of the lifting platform is provided with a receiving space, and the top of the lifting platform is provided with multiple receiving slots. The gas connection port, the first gas flow channel, the second gas flow channel, the receiving space and the receiving slots are connected in sequence, and the receiving slots are distributed in an array.

4. The die bonder chip transfer mechanism according to claim 3, characterized in that: The second gas flow channel is arranged horizontally, and the two first gas flow channels are respectively connected to the two ends of the second gas flow channel. The top of the first gas flow channel is provided with an elongated notch, and the accommodating space is connected to the second gas flow channel through the notch.

5. The die bonder chip transfer mechanism according to claim 3, characterized in that: The accommodating space is provided with multiple support columns, and the upper and lower ends of the support columns are respectively connected to the upper and lower ends of the accommodating space.

6. The die bonder chip transfer mechanism according to claim 1, characterized in that: The output end of the linear drive mechanism is provided with a first fixing plate, the front end of the first fixing plate is provided with a second fixing plate, the second fixing plate extends into the first clearance space, the bottom of the second fixing plate is provided with an assembly plate, and the lifting mechanism is provided on the assembly plate.

7. The die bonder chip transfer mechanism according to claim 1, characterized in that: The first connecting frame has a first step on the top of the side near the second connecting frame, and the second connecting frame has a second step on the top of the side near the first connecting frame. The first step and the second step are provided correspondingly.

8. The die bonder chip transfer mechanism according to claim 7, characterized in that: The distance between the top of the first recess and the bottom of the first connecting frame is L1, the height of the first step and the height of the second step are both L2, and L1 is less than L2.

9. A die bonder chip transfer mechanism according to claim 1, characterized in that: A plurality of third connecting plates are provided between the first connecting frame and the second connecting frame. The bottom of each third connecting plate is recessed upward to form a second clearance groove, which is located at the top of the second clearance space.

10. A die bonder chip transfer mechanism according to claim 1, characterized in that: The device includes two uprights, each with a first protrusion and a second protrusion at its front and rear ends, respectively. A third connecting frame is provided at the front end of the second connecting frame and is connected to the top of the first protrusion. Both ends of the frame are connected to the two second protrusions, respectively. A third clearance groove is provided between the first protrusion and the second protrusion, with both the first clearance space and the second clearance space located at the top of the third clearance groove.

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