Heating control circuit and method, cooking equipment, storage medium and product

Abstract

The embodiment of the invention provides a heating control circuit and method, cooking equipment, a storage medium and a product. The heating control circuit comprises a detection circuit and a heating circuit, and the detection circuit is connected with the heating circuit; the detection circuit is used for being switched on when the heating control circuit is switched on and a detection function is started, and transmitting an infrared signal to a preset heating area; when an infrared reflection signal of a preset heating area is received, the infrared reflection signal is converted into a level signal, and the level signal is sent to the heating circuit; and the heating circuit is used for sending a first preset voltage to the preset heating area when receiving the level signal so as to heat the preset heating area. The detection result of the tableware in the preset heating area can be directly determined according to the received infrared reflection signal corresponding to the infrared signal, the method is simple and rapid, and the stability of the detection result is improved.

Description

Technical Field

[0001] The present application relates to the field of household appliances, and in particular, to a heating control circuit, a method, a cooking device, a storage medium, and a product. Background Art

[0002] During the process of a user using a cooking device, the cooking device needs to determine whether there are tableware (such as pots, bowls, etc.) above the heating panel to avoid safety accidents caused by heating without tableware.

[0003] In the related art, usually a pressure sensor is arranged inside the cooking device, and the pressure data above the cooking device is collected through the pressure sensor to identify whether there is tableware placed above the cooking device.

[0004] However, the cost of arranging a pressure sensor inside the cooking device is relatively high, and the sensing data of some utensils cannot be collected through the pressure sensor. Therefore, the detection accuracy obtained based on the pressure sensor is unstable, making the heating function of the cooking device unstable. Summary of the Invention

[0005] The present application provides a heating control circuit, a method, a cooking device, a storage medium, and a product to solve the problem of unstable detection accuracy of tableware by the cooking device.

[0006] In a first aspect, the present application provides a heating control circuit, which includes a detection circuit and a heating circuit, and the detection circuit is connected to the heating circuit;

[0007] The detection circuit is configured to conduct when the heating control circuit is powered on and the detection function is enabled, and emit an infrared signal to a preset heating area;

[0008] The detection circuit is further configured to convert the infrared reflection signal into a level signal when receiving the infrared reflection signal from the preset heating area, and send the level signal to the heating circuit;

[0009] The heating circuit is configured to send a first preset voltage to the preset heating area when receiving the level signal to heat the preset heating area.

[0010] In the present application, when the heating control circuit is powered on and the detection function is enabled, an infrared signal is emitted to a preset heating area, and when the infrared reflection signal from the preset heating area is received, the infrared reflection signal is converted into a level signal, and a first preset voltage is sent to the preset heating area to heat the preset heating area. The detection result of the presence of tableware in the preset heating area can be directly determined based on the infrared reflection signal corresponding to the infrared signal, which is simple and fast, and improves the stability of detection.

[0011] Optionally, the detection circuit includes a transmitting tube and a modulation circuit, and the transmitting tube is connected to the modulation circuit;

[0012] The modulation circuit is configured to conduct when the heating control circuit is powered on and the detection function is enabled, and send a first current signal to the transmitting tube;

[0013] The transmitting tube is configured to send the infrared signal to the preset heating area when receiving the first current signal.

[0014] In this application, the infrared signal is sent to the preset heating area through the transmitting tube only when the detection function is enabled to detect whether there is a tableware to be heated, which improves the detection accuracy, avoids redundant retrieval operations, and reduces power consumption.

[0015] Optionally, the detection circuit further includes a processing chip, and the modulation circuit includes a first capacitor, a first triode, and a second triode; the first capacitor is connected to the first pin of the processing chip, the second pin of the processing chip is connected to the first end of the first triode, the second end of the first triode is connected to the first end of the transmitting tube, the third end of the first triode is connected to the first end of the second triode, and the second end of the second triode is connected to the second end of the transmitting tube;

[0016] The first capacitor is configured to charge when the heating control circuit is powered on and the detection function is enabled, and send the first current signal to the processing chip after the charging is completed;

[0017] The processing chip is configured to send it to the first triode when receiving the first current signal;

[0018] The first triode is configured to conduct when receiving the first current signal and send the first current signal to the transmitting tube and the second triode;

[0019] The second triode is configured to conduct when receiving the first current signal and send the first current signal to the transmitting tube.

[0020] In this application, the detection circuit is conducted in time when the detection function is enabled, and the transmitting tube is woken up in time to send the infrared signal to the preset heating area to detect whether there is a tableware to be heated, improving the detection accuracy and detection efficiency.

[0021] Optionally, the transmitting tube includes an infrared diode, and the infrared diode is specifically configured to send a pulse signal to the preset heating area based on the first current signal when receiving the first current signal.

[0022] In this application, a pulse signal is sent through an infrared diode to detect whether there is a tableware to be heated, reducing the influence of visible light and other interference signals on the detection accuracy and improving the detection accuracy; moreover, the detection accuracy for non-transparent objects can be improved.

[0023] Optionally, the detection circuit includes a receiving tube, a processing chip, and a demodulation circuit. The receiving tube is connected to the demodulation circuit, the demodulation circuit is connected to the third pin of the processing chip, and the fourth pin of the processing chip is connected to the heating circuit;

[0024] The receiving tube is configured to send the infrared reflection signal to the demodulation circuit when the infrared reflection signal is received;

[0025] The demodulation circuit is configured to conduct when the infrared reflection signal is received and send the infrared reflection signal to the processing chip;

[0026] The processing chip is configured to convert the infrared reflection signal into a level signal and send the level signal to the heating circuit when the infrared reflection signal is received.

[0027] In this application, the signal conversion operation is only performed when an infrared reflection signal is received, and the heating circuit is woken up by the level signal for heating operation, improving the detection accuracy while reducing the power consumption.

[0028] Optionally, the demodulation circuit includes a third triode, and the receiving tube includes an infrared photodiode; the third pin of the processing chip is connected to the first end of the receiving tube, the first end of the third triode, and the heating circuit, and the second end of the third triode is connected to the infrared photodiode;

[0029] The receiving tube is configured to send the infrared reflection signal to the third triode when the infrared reflection signal is received;

[0030] The third triode is configured to conduct when the infrared reflection signal is received and send the infrared reflection signal to the processing chip;

[0031] The processing chip is configured to convert the infrared reflection signal into the level signal and send it to the heating circuit when the infrared reflection signal is received.

[0032] Optionally, the heating circuit is further configured to disconnect when no level signal is received and stop sending the first preset voltage to the preset heating area.

[0033] In this application, when the infrared reflection signal of the preset heating area is not received, no level signal is sent to the heating circuit, and the heating circuit is disconnected when no level signal is received, so that the preset heating area cannot be heated through the heating circuit, avoiding the occurrence of safety accidents and improving safety while improving the detection accuracy.

[0034] Optionally, the heating circuit is further configured to send a second preset voltage to the preset heating area when the level signal is received and the working state of the heating circuit is in the heat preservation state; the second preset voltage is less than the first preset voltage.

[0035] In this application, when the infrared reflection signal of the preset heating area is received, the heating intensity of the preset area is controlled according to the working state set by the user, improving the user experience while improving the detection accuracy.

[0036] In a second aspect, this application provides a heating control method, which is applied to the heating control circuit in the first aspect and any one of the embodiments. The method includes:

[0037] When the power is turned on and the detection function is enabled, an infrared signal is emitted to the preset heating area;

[0038] When the infrared reflection signal of the preset heating area is received, the infrared reflection signal is converted into a level signal;

[0039] Based on the level signal, a first preset voltage is sent to the preset heating area to heat the preset heating area.

[0040] In a third aspect, this application provides an electronic device, including: a transmitting tube, a receiving tube, a memory, a processor, and a heating control circuit as in any one of the embodiments of the first aspect;

[0041] The memory is used to store a computer program; the processor is used to execute the computer program stored in the memory to implement the method in the second aspect.

[0042] In a fourth aspect, this application provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the method in the second aspect is implemented.

[0043] In a fifth aspect, this application provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the method in the second aspect is implemented.

[0044] The heating control circuit, method, cooking device, storage medium and product provided by this application detect that the circuit conducts when the heating control circuit is powered on and the detection function is enabled, and emits an infrared signal to a preset heating area. When an infrared reflection signal from the preset heating area is received, the infrared reflection signal is converted into a level signal, and the level signal is sent to the heating circuit. When the level signal is received, the heating circuit sends a first preset voltage to the preset heating area to heat the preset heating area. It is possible to directly determine the detection result that there is tableware in the preset heating area based on the infrared reflection signal corresponding to the infrared signal, which is simple and fast, and at the same time improves the stability of detection. Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions in this application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0046] Figure 1 Schematic diagram of the application of the related art tableware detection method provided by the embodiment of this application;

[0047] Figure 2 One of the structural schematic diagrams of the heating control circuit provided by the embodiment of this application;

[0048] Figure 3 Another structural schematic diagram of the heating control circuit provided by the embodiment of this application;

[0049] Figure 4 One of the structural schematic diagrams of the detection circuit provided by the embodiment of this application;

[0050] Figure 5 Another structural schematic diagram of the detection circuit provided by the embodiment of this application;

[0051] Figure 6 Structural schematic diagram of the heating circuit provided by the embodiment of this application;

[0052] Figure 7 Structural schematic diagram of the cooking device provided by the embodiment of this application;

[0053] Figure 8 Flow chart of the heating control method provided by the embodiment of this application;

[0054] Figure 9 Structural schematic diagram of the cooking device provided by the embodiment of this application.

[0055] Reference Signs:

[0056] 100 - Heating control circuit; 101 - Detection circuit; 102 - Heating circuit; 103 - Display circuit; 104 - Power supply circuit;

[0057] 1011 - Transmitting tube; 1012 - Modulation circuit; 1013 - Processing chip; 1014 - Receiving tube; 1015 - Demodulation circuit;

[0058] 10121 - First capacitor; 10122 - First triode; 10123 - Second triode;

[0059] 10111 - Infrared diode; 10141 - Infrared photosensitive diode; 10151 - Third triode.

[0060] The realization of the purpose of this application, functional features and advantages will be further described in conjunction with the embodiments with reference to the accompanying drawings. Through the above - mentioned accompanying drawings, the specific embodiments of this application have been shown, and there will be more detailed descriptions hereinafter. These drawings and text descriptions are not intended to limit the scope of the concept of this application in any way, but to illustrate the concept of this application to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0061] Here, the exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all the implementation manners consistent with this application. On the contrary, they are only examples of the devices and methods consistent with some aspects of this application as detailed in the appended claims.

[0062] See Figure 1 , during the process of a user using a cooking device, the cooking device needs to determine whether there are tableware (such as pots, bowls, etc.) above the heating panel to avoid safety accidents caused by heating without tableware.

[0063] In the related art, usually a pressure sensor is set inside the cooking device, and the pressure data above the cooking device is collected through the pressure sensor to identify whether there is tableware placed above the cooking device.

[0064] However, the cost of the pressure sensor is relatively high, and the pressure sensor cannot collect the sensing data of some utensils. Therefore, the detection accuracy obtained based on the pressure sensor is unstable, making the heating function of the cooking device unstable.

[0065] To solve the above problems, the embodiments of the present application provide a heating control circuit, a method, a cooking device, a storage medium, and a product. When the heating control circuit is powered on and the detection function is enabled, an infrared signal is emitted to a preset heating area. When the infrared reflection signal from the preset heating area is received, the infrared reflection signal is converted into a level signal, and a first preset voltage is sent to the preset heating area to heat the preset heating area. The detection result that there are tableware in the preset heating area can be directly determined based on the infrared reflection signal corresponding to the infrared signal, which is simple and fast, and at the same time improves the stability of detection.

[0066] In some embodiments, the heating control circuit 100 includes a detection circuit 101, a heating circuit 102, and a display circuit 103.

[0067] Figure 2 It is one of the structural schematic diagrams of the heating control circuit provided by the embodiments of the present application.

[0068] See Figure 2 , the heating control circuit 100 includes a detection circuit 101, a heating circuit 102, and a display circuit 103. The detection circuit 101 is connected to the heating circuit 102, the heating circuit 102 is connected to the display circuit 103, and the heating control circuit 100 is connected to the power supply circuit 104.

[0069] Specifically, the power supply circuit 104 is used to supply power to the heating control circuit 100 when the switch is turned on. That is, it powers on the heating control circuit 100. The display circuit 103 is used to display function menus (such as prompt information for enabling the detection function, etc.), LED lights, etc.

[0070] The present application does not limit the specific implementation forms of the display circuit 103 and the power supply circuit 104, as long as the display circuit 103 has the function of display and the power supply circuit 104 has the function of supplying power to the heating control circuit 100.

[0071] The detection circuit 101 is used to conduct when the heating control circuit 100 is powered on and the detection function is enabled, and emit an infrared signal to a preset heating area;

[0072] The detection circuit 101 is further used to convert the infrared reflection signal into a level signal when the infrared reflection signal from the preset heating area is received, and send the level signal to the heating circuit 102.

[0073] Specifically, the preset heating area refers to an area for preset tableware to be heated and capable of providing a heating function.

[0074] Exemplarily, when the heating control circuit 100 is the heating control circuit 100 inside the cooking device, the preset heating area may indicate the heating area on the panel of the cooking device that is preset for placing the tableware to be heated.

[0075] Specifically, the detection function means a function of identifying whether there is tableware to be heated in the preset heating area by emitting an infrared signal to the preset area and determining whether an infrared reflection signal from the preset heating area is received. At this time, the tableware to be heated serves as a reflecting surface and can reflect the infrared reflection signal when the infrared reflection signal is received.

[0076] Specifically, when the infrared reflection signal is received, it is determined that there is tableware to be heated in the preset heating area. At this time, the infrared reflection signal is converted into a level signal. The level signal is used to control the heating circuit 102 to send a first preset voltage to the preset heating area to heat the preset heating area.

[0077] Optionally, the level signal is a low-level signal, or the level signal is a high-level signal.

[0078] It can be understood that when the infrared reflection signal from the preset heating area is not received, no level signal is sent to the heating circuit 102, so that the heating circuit 102 can be controlled to stop heating the preset heating area.

[0079] The heating circuit 102 is configured to send a first preset voltage to the preset heating area to heat the preset heating area when receiving the level signal.

[0080] Optionally, the heating circuit 102 can receive the level signal through a single-chip microcomputer pin.

[0081] This application does not limit the specific implementation form of the heating circuit 102, as long as the heating circuit 102 has the function of heating the preset heating area.

[0082] It can be understood that based on the infrared signal, tableware to be heated of any material can be detected. For example, the tableware to be heated can be a metal tableware or a non-metal tableware.

[0083] In some embodiments, the detection circuit 101 includes a transmitting tube 1011, a modulation circuit 1012, and a processing chip 1013.

[0084] Figure 3 This is the second structural schematic diagram of the heating control circuit provided by the embodiment of the present application.

[0085] See Figure 3, the heating control circuit 100 includes a detection circuit 101, a heating circuit 102, and a display circuit 103. The detection circuit 101 is connected to the heating circuit 102, the heating circuit 102 is connected to the display circuit 103, and the heating control circuit 100 is connected to the power supply circuit 104. The detection circuit includes a transmitting tube 1012, a modulation circuit 1012, a processing chip 1013, a receiving tube 1014, and a demodulation circuit 1015. Among them, the transmitting tube 1011 is connected to the modulation circuit 1012. The modulation circuit 1012 is connected to the processing chip 1013, the receiving tube 1014 is connected to the demodulation circuit 1015, and the demodulation circuit 1015 is connected to the processing chip 1013.

[0086] Among them, the modulation circuit 1012 is used to conduct when the heating control circuit 100 is powered on and the detection function is enabled, and send a first current signal to the transmitting tube 1011;

[0087] The transmitting tube 1011 is used to send an infrared signal to a preset heating area when receiving the first current signal.

[0088] Specifically, the first current signal can be used to control the transmitting tube to send an infrared signal to the preset heating area.

[0089] Based on this, when the detection function is enabled, the modulation circuit 1012 does not send the first current signal to the transmitting tube 1011, so that the transmitting tube 1011 does not send an infrared signal to the preset heating area, that is, the detection operation of whether there is a tableware to be heated in the preset heating area is not performed.

[0090] Optionally, the processing chip 1013 is a processor including multiple pins. The demodulation circuit 1015 is connected to the first pin, the second pin, and the third pin (DA) of the processing chip 1013, and the fourth pin of the processing chip 1013 is connected to the heating circuit 102.

[0091] The receiving tube 1014 is used to send to the demodulation circuit 1015 when receiving an infrared reflection signal;

[0092] The demodulation circuit 1015 is used to conduct when receiving an infrared reflection signal and send the infrared reflection signal to the processing chip 1013;

[0093] The processing chip 1013 is used to convert the infrared reflection signal into a level signal and send the level signal to the heating circuit 102 when receiving the infrared reflection signal.

[0094] Specifically, when the receiving tube 1014 receives the infrared reflection signal of the preset heating area, it is determined that there is tableware to be heated in the preset heating area, and the infrared reflection signal of the preset heating area is sent to the demodulation circuit 1015.

[0095] Specifically, the demodulation circuit 1015 sends the received infrared reflection signal to the processing chip 1013, so that the processing chip 1013 converts the infrared reflection signal into a level signal, and then controls the heating circuit 102 to heat a preset heating area according to the level signal.

[0096] In some embodiments, the modulation circuit 1012 in the detection circuit 101 includes a first capacitor 10121, a first triode 10122, and a second triode 10123.

[0097] Figure 4 One of the structural schematic diagrams of the detection circuit provided by the embodiments of the present application.

[0098] See Figure 4 , the detection circuit includes a transmitting tube 1012, a modulation circuit 1012, a processing chip 1013, a receiving tube 1014, and a demodulation circuit 1015. The modulation circuit 1012 includes a first capacitor 10121, a first triode 10122, and a second triode 10123. The first capacitor 10121 is connected to the processing chip 1013. The processing chip 1013 is connected to the first end of the first triode 10122. The second end of the first triode 10122 is connected to the first end of the transmitting tube 1011. The third end of the first triode 10122 is connected to the first end of the second triode 10123. The second end of the second triode 10123 is connected to the second end of the transmitting tube 1011. The receiving tube 1014 is connected to the demodulation circuit 1015, and the demodulation circuit 1015 is connected to the processing chip 1013.

[0099] The first capacitor 10121 is used to charge when the heating control circuit 100 is powered on and the detection function is enabled, and after the charging is completed, send a first current signal to the processing chip 1013;

[0100] The processing chip 1013 is used to send it to the first triode 10122 when receiving the first current signal;

[0101] The first triode 10122 is used to conduct when receiving the first current signal and send the first current signal to the second triode 10123;

[0102] The second triode 10123 is used to conduct when receiving the first current signal and send the first current signal to the transmitting tube 1011.

[0103] Specifically, when the heating control circuit 100 is powered on and the detection function is enabled, the first capacitor 10121 starts to charge. After the charging of the first capacitor 10121 is completed, it starts to discharge. At this time, the first capacitor 10121 sends a first current signal to the processing chip 1013. The processing chip 1013 sends a first current signal to the first triode 10122 to make it conduct, and sends a first current signal to the second triode 10123. The second triode 10123 conducts when receiving the first current signal and sends a first current signal to the emitting tube 1011. In this way, the emitting tube 1011 can be started through the above current transmission process, so as to send an infrared signal to the preset heating area through the emitting tube 1011.

[0104] In some embodiments, the emitting tube 1011 includes an infrared diode 10111, and the infrared diode 10111 is specifically configured to send a pulse signal to the preset heating area based on the first current signal when receiving the first current signal.

[0105] Optionally, the infrared signal can also be referred to as an infrared pulse signal. The discharge time of the first capacitor 10121 can be used as the width of the infrared pulse signal emitted by the emitting tube 1011. In the powered-on state, the first capacitor charges and discharges cyclically. Based on this, the emitting tube 1011 can emit infrared pulse signals cyclically.

[0106] Optionally, the emission frequency of the infrared pulse signal emitted by the emitting tube 1011 can be specifically set according to actual requirements.

[0107] In some embodiments, a receiving tube is configured to send to a demodulation circuit when receiving an infrared reflection signal;

[0108] The demodulation circuit is configured to conduct when receiving an infrared reflection signal and send the infrared reflection signal to the processing chip;

[0109] The processing chip is configured to convert the infrared reflection signal into a level signal and send the level signal to the heating circuit when receiving the infrared reflection signal.

[0110] In some embodiments, the demodulation circuit 1015 includes a third triode 10151, and the receiving tube 1014 includes an infrared photosensitive diode 10141.

[0111] Figure 5 This is the second structural schematic diagram of the detection circuit provided by the embodiment of the present application.

[0112] See Figure 5, the detection circuit 101 includes a transmitting tube 1012, a modulation circuit 1012, a processing chip 1013, a receiving tube 1014, and a demodulation circuit 1015. Among them, the transmitting tube 1012 is connected to the modulation circuit 1012, and the modulation circuit 1012 is connected to the processing chip 1013. The transmitting tube 1012 includes an infrared diode 10111, the receiving tube 1014 includes an infrared photosensitive diode 10151, the processing chip 1013 is connected to the first end of the infrared diode 10111, the first end of the third triode 10151, and the heating circuit 102, and the second end of the third triode 10151 is connected to the infrared photosensitive diode 10151.

[0113] The receiving tube is configured to send an infrared reflection signal to the third triode when receiving the infrared reflection signal;

[0114] The third triode is configured to conduct when receiving the infrared reflection signal and send the infrared reflection signal to the processing chip;

[0115] The processing chip is configured to convert the infrared reflection signal into a level signal and send it to the heating circuit when receiving the infrared reflection signal.

[0116] Specifically, when the receiving tube 1014 receives the infrared reflection signal of the preset heating area, it is determined that there is a tableware to be heated in the preset heating area. The receiving tube sends the infrared reflection signal to the third triode 10151 to make the third triode 10151 conduct, and sends the infrared reflection signal to the processing chip 1013. The processing chip 1013 converts the infrared reflection signal into a level signal and sends it to the heating circuit 102.

[0117] In some embodiments, the heating circuit is further configured to disconnect when not receiving the level signal and stop sending the first preset voltage to the preset heating area.

[0118] It can be understood that when the receiving tube 1014 does not receive the infrared reflection signal of the preset heating area, the third triode 10151 is not conducting. At this time, the processing chip 1013 cannot send the level signal to the heating circuit 102, and the heating circuit disconnects when not receiving the level signal, that is, it is impossible to heat the preset heating area through the heating circuit, avoiding safety accidents, thereby improving the safety while improving the detection accuracy.

[0119] Figure 6 It is a schematic structural diagram of the detection circuit 101 provided by the embodiment of the present application.

[0120] See Figure 6 , the detection circuit 101 includes: a transmitting tube 1012, a modulation circuit 1012, a processing chip 1013 (such as Figure 6The U3 shown in [description], receiving tube 1014, demodulation circuit 1015. Among them, the transmitting tube 1012 includes an infrared diode 10111 (such as Figure 6 P9 shown in [description], the receiving tube 1014 includes an infrared photosensitive diode 10151 (such as Figure 6 P8 shown in [description]. The modulation circuit 1012 includes a first capacitor 10121 (such as Figure 6 C7 shown in [description]), a first triode 10122 (such as Figure 6 Q4 shown in [description]), a second triode 10123 (such as Figure 6 Q2 shown in [description]), and the demodulation circuit 1015 includes a third triode 10151 (such as Figure 6 Q3 shown in [description]).

[0121] Among them, the first capacitor 10121 is connected to the first pin of the processing chip 1013 (such as Figure 6 pin VCC shown in [description]), the second pin of the processing chip 1013 (such as Figure 6 pin CA shown in [description]) is connected to the first end of the first triode 10122 (such as Figure 6 Q4-B shown in [description]), the second end of the first triode 10122 (such as Figure 6 Q4-C shown in [description]) is connected to the first end of the infrared diode 10111, and the third end of the first triode 10122 (such as Figure 6 Q4-E shown in [description]) is connected to the first end of the second triode 10123 (such as Figure 6 Q2-E shown in [description]), and the second end of the second triode 10123 (such as Figure 6 Q2-C shown in [description]) is connected to the second end of the infrared diode 10111.

[0122] Among them, the third pin of the processing chip (such as Figure 6 pin CD shown in [description]) is connected to the first end of the infrared photosensitive diode 10151 and the first end of the third triode (such as Figure 6 Q3-C shown in [description]), and the second end of the third triode (such as Figure 6 Q3-B shown in [description]) is connected to the infrared photosensitive diode 10151.

[0123] Among them, the demodulation circuit further includes a fourth triode (such as Figure 6 Q1 shown in [description]), a fifth triode (such as Figure 6 Q5 shown in [description]).

[0124] Among them, the detection circuit further includes Q3, Q5, R19, R21, R11, R12, etc., and the above components are connected to the processing chip 1013 (such as Figure 6The U3 shown in the figure can form a switching circuit, and the switching circuit is used to perform the function of converting the infrared reflection signal into a level signal.

[0125] Continue to refer to Figure 6 The detection circuit may further include an electrolytic filter capacitor C6, a clamping diode D6, and diodes D4, D5; resistors R10, R13, R14, R15, R16, R17, R18, R20, R21, R22, R23, R24, R25, R26, R27, R28, R29; a triode Q6; capacitors C3, C4, C5, C8, etc. The above-mentioned components are all components used to implement the detection function in the detection circuit.

[0126] It can be understood that the parameters of the components shown in the detection circuit in Figure 6 such as the resistance value of the resistor and the capacitance of the capacitor, etc., can be specifically set according to actual needs.

[0127] Except for the first capacitor 10121, the first triode 10122; the second triode 10123; the infrared diode 10111; the infrared photosensitive diode 10141; the third triode 10151, and the processing chip 1013, the quantity and type of other components can also be increased, decreased, replaced, etc. according to actual needs.

[0128] As Figure 6 The working process of the detection circuit 101 shown is as follows: When the heating control circuit 100 is powered on and the detection function is enabled, the modulation circuit 1012 is powered on, and the capacitor C7 starts to charge. After C7 finishes charging, it starts to discharge. At this time, the pin SB in the processing chip 1013 is set to 0, the pin RB is set to 1, the pin QB is set to 0, the pin CA = 0, the triode Q4 conducts, and the emitter P9 emits an infrared pulse signal. C7 cycles of charging and discharging, and the emitter P9 cycles of emitting infrared pulse signals. At the same time, the demodulation circuit 1015 is powered on, the pin SA = 1, the pin DA = 1, the pin RA = 1, the falling edge of the pin CA triggers, the pin QA = 0, the triodes Q1 and Q5 are cut off, the output signal OUT of the detection circuit = 1, and the detection result indicator D5 is not lit; when the receiving tube P8 receives the infrared reflection signal, the triodes Q2 and Q3 conduct, the pin DA of the processing chip 1013 = 1, the pin QA = 1, the triodes Q1 and Q5 conduct, the output signal OUT of the detection circuit = 0, and the detection result indicator D5 is lit, indicating that the tableware to be heated in the preset heating area is detected. At this time, OUT = 0 can indicate a level signal to control the heating circuit 102 to heat the preset heating area.

[0129] Figure 7 It is a schematic structural diagram of the cooking device provided by the embodiment.

[0130] See Figure 7 , the cooking device includes a base, a detection function switch, a hob spring, a hob assembly, a support spring, a support, and a panel. A preset heating area is provided on the heating panel.

[0131] Among them, the hob spring, the hob assembly, the support spring, and the support are used to connect the panel and the base to support the panel. The panel is used to place the tableware to be heated.

[0132] Two handles are installed on the base, and a transmitting tube and a receiving tube are arranged near the handles. The transmitting tube is used to send an infrared signal to the preset heating area on the panel, and the receiving tube is used to receive the infrared reflection signal of the preset heating area.

[0133] The detection function switch is used to control the start and stop of the transmitting tube sending the infrared signal, and the start and stop of the receiving tube receiving the infrared reflection signal. A heating control circuit is laid at a position on the base corresponding to the preset heating area. The base is also provided with a fan, and the fan is used to dissipate heat from the base.

[0134] Optionally, the transmitting tube and the receiving tube can be arranged in an area on the panel other than the preset heating area. The transmitting tube and the receiving tube are parallel to the panel, and the distance between the transmitting tube, the receiving tube and the preset heating area can be greater than a first threshold value, and the first threshold value can be set according to actual needs. For example, the first threshold value is 2 cm, or the first threshold value is 30 cm. The installation height of the transmitting tube and the receiving tube should be lower than the height of the tableware to be heated.

[0135] In some embodiments, the heating circuit 102 is further configured to send a second preset voltage to the preset heating area when receiving a level signal and the working state of the heating circuit 102 is in the heat preservation state; the second preset voltage is less than the first preset voltage.

[0136] Specifically, when the heating control circuit 100 is powered on and the detection function is turned on, the working state of the heating circuit 102 can include a heating state and a heat preservation state.

[0137] Among them, when the working state of the heating circuit 102 is in the heating state and a level signal is received, the heating circuit 102 sends a first preset voltage to the preset heating area to heat the preset heating area.

[0138] Specifically, when the working state of the heating circuit 102 is in the heat preservation state and a level signal is received, the heating circuit 102 sends a second preset voltage less than the first preset voltage to the preset heating area to keep the tableware in the preset heating area warm.

[0139] It can be understood that when a level signal is received and the preset heating area is heated through the heating circuit 102, it is possible to continue to determine whether to stop heating by whether a level signal is received. That is, during the heating process, if a level signal is continuously received, the preset heating area continues to be heated. During the heating process, if the reception of the level signal stops, the heating of the preset heating area stops.

[0140] Optionally, the heating control circuit further includes a standby state. In the standby state, if a level signal is received, it enters the working state and starts the heating function to heat the preset heating area. If a level signal is received, it enters the prohibited heating state and stops heating the preset heating area.

[0141] In this application, when the heating control circuit is powered on and the detection function is enabled, an infrared signal is emitted to the preset heating area. When the infrared reflection signal of the preset heating area is received, the infrared reflection signal is converted into a level signal. When the working state of the heating circuit is in the heat preservation state, a second preset voltage is sent to the preset heating area to keep the preset heating area warm. The detection result of the presence of tableware in the preset heating area can be directly determined based on the infrared reflection signal corresponding to the infrared signal, improving the stability of detection while improving the control of the heating degree of the preset heating area and enhancing the user experience.

[0142] The technical solution of this application and how the technical solution of this application solves the above technical problems will be described in detail below with specific embodiments. These several specific embodiments below can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of this application will be described below with reference to the drawings.

[0143] Figure 8 is a schematic flowchart of the heating control method provided by this application, as Figure 8 shown, the method includes:

[0144] S101. When the power is turned on and the detection function is enabled, an infrared signal is emitted to the preset heating area.

[0145] Specifically, the above step S101 can be implemented by the detection circuit of the heating control circuit.

[0146] S102. When the infrared reflection signal of the preset heating area is received, the infrared reflection signal is converted into a level signal.

[0147] Specifically, the above step S101 can be implemented by the detection circuit of the heating control circuit.

[0148] S103. Based on the level signal, send a first preset voltage to the preset heating area to heat the preset heating area.

[0149] Specifically, the above step S101 can be implemented by the heating circuit of the heating control circuit.

[0150] In one implementation, S101 includes:

[0151] When the power is turned on and the detection function is enabled, send a first current signal;

[0152] Based on the first current signal, send the infrared signal to the preset heating area.

[0153] Specifically, the above steps can be implemented by the infrared diode 10111 and the infrared reflection diode 10141 of the detection circuit 101 in the heating control circuit 100.

[0154] In one implementation, when the power is turned on and the detection function is enabled, sending a first current signal includes:

[0155] When the power is turned on and the detection function is enabled, charge the first capacitor, and after the first capacitor is charged, send the first current signal.

[0156] Specifically, the above steps can be implemented by the demodulation circuit 1012 of the detection circuit 101 in the heating control circuit 100.

[0157] In one implementation, based on the first current signal, sending the infrared signal to the preset heating area includes:

[0158] Based on the first current signal, send a pulse signal to the preset heating area.

[0159] Specifically, the above steps can be implemented by the infrared diode 10111 of the detection circuit 101 in the heating control circuit 100.

[0160] In one implementation, the method further includes:

[0161] When receiving an infrared reflection signal, convert the infrared reflection signal into a level signal;

[0162] When the working state is in the heat preservation state, send a second preset voltage to the preset heating area; the second preset voltage is less than the first preset voltage.

[0163] Specifically, the above steps can be implemented by the heating circuit 102 in the heating control circuit 100.

[0164] The heating control method provided by the embodiment of the present application emits an infrared signal to a preset heating area when the heating control circuit is powered on and the detection function is enabled. When an infrared reflection signal from the preset heating area is received, the infrared reflection signal is converted into a level signal, and a first preset voltage is sent to the preset heating area to heat the preset heating area. The detection result that there are tableware in the preset heating area can be directly determined based on the infrared reflection signal corresponding to the infrared signal, which is simple and fast, and improves the stability of detection.

[0165] Figure 9 It is a schematic structural diagram of the cooking device provided by the present application. As Figure 9 shown, the cooking device 200 provided in this embodiment includes: at least one processor 201, a memory 202, a transmitting tube 203, and a receiving tube 204.

[0166] Optionally, the cooking device 200 further includes a communication component 205. Among them, the processor 201, the memory 202, the transmitting tube 203, the receiving tube 204, and the communication component 205 are connected through a bus 204.

[0167] In a specific implementation process, at least one processor 201 executes the computer-executable instructions stored in the memory 202, so that at least one processor 201 executes the above method.

[0168] For the specific implementation process of the processor 201, reference can be made to the above method embodiment, and its implementation principle and technical effect are similar, which will not be elaborated here in this embodiment.

[0169] In the above embodiment, it should be understood that the processor may be a central processing unit (Central Processing Unit, CPU), or other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in combination with the invention can be directly embodied as being executed by a hardware processor, or executed by a combination of hardware and software modules in the processor.

[0170] The memory may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (Non-volatile Memory, NVM), such as at least one disk memory.

[0171] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the buses in the drawings of this application are not limited to only one bus or one type of bus.

[0172] This application also provides a computer program product, including a computer program, which implements the above method when executed by a processor.

[0173] This application also provides a computer-readable storage medium, in which computer-executable instructions are stored, and when the processor executes the computer-executable instructions, the above method is implemented.

[0174] The above-readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as a static random access memory (SRAM), an electrically erasable programmable read-only memory (EEPROM), an erasable programmable read-only memory (EPROM), a programmable read-only memory (PROM), a read-only memory (ROM), a magnetic memory, a flash memory, a magnetic disk, or an optical disk. The readable storage medium can be any available medium accessible by a general-purpose or special-purpose computer.

[0175] An exemplary readable storage medium is coupled to the processor, so that the processor can read information from the readable storage medium and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can be located in an Application Specific Integrated Circuit (ASIC). Of course, the processor and the readable storage medium can also exist as discrete components in the device.

[0176] The division of units is only a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some interfaces, and the indirect coupling or communication connection of the device or unit can be in an electrical, mechanical, or other form.

[0177] The unit described as a separation component may or may not be physically separated. The component displayed as a unit may or may not be a physical unit, that is, it may be located in one place or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0178] In addition, in each embodiment of the present invention, each functional unit may be integrated in a processing unit, may be physically present separately for each unit, or two or more units may be integrated in one unit.

[0179] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in each embodiment of the present invention. The aforementioned storage medium includes: various media such as USB flash drives, external hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0180] Those of ordinary skill in the art can understand that all or part of the steps for implementing the above method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps including the above method embodiments; and the aforementioned storage medium includes: various media such as ROM, RAM, magnetic disks, or optical discs that can store program codes.

[0181] Finally, it should be noted that: After considering the specification and practicing the invention disclosed herein, those skilled in the art will easily think of other implementation schemes of the present invention. The present invention aims to cover any variations, uses, or adaptive changes of the present invention, which follow the general principles of the present invention and include common general knowledge or conventional technical means in the technical field not disclosed in the present invention. It is not limited to the exact structure described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is only limited by the appended claims.

Claims

1. A heating control circuit, characterized in that, The heating control circuit includes a detection circuit and a heating circuit, and the detection circuit is connected to the heating circuit; The detection circuit is configured to conduct when the heating control circuit is powered on and the detection function is enabled, and emit an infrared signal to a preset heating area; The detection circuit is further configured to convert the infrared reflection signal into a level signal and send the level signal to the heating circuit when receiving the infrared reflection signal from the preset heating area; The heating circuit is configured to send a first preset voltage to the preset heating area to heat the preset heating area when receiving the level signal; 2. The heating control circuit according to claim 1, wherein, The detection circuit includes a transmitting tube and a modulation circuit, and the transmitting tube is connected to the modulation circuit; The modulation circuit is configured to conduct when the heating control circuit is powered on and the detection function is enabled, and send a first current signal to the transmitting tube; The transmitting tube is configured to send the infrared signal to the preset heating area when receiving the first current signal; 3. The heating control circuit according to claim 2, wherein, The detection circuit further includes a processing chip, and the modulation circuit includes a first capacitor, a first triode, and a second triode; the first capacitor is connected to the first pin of the processing chip, the second pin of the processing chip is connected to the first end of the first triode, the second end of the first triode is connected to the first end of the transmitting tube, the third end of the first triode is connected to the first end of the second triode, and the second end of the second triode is connected to the second end of the transmitting tube; The first capacitor is configured to charge when the heating control circuit is powered on and the detection function is enabled, and send the first current signal to the processing chip after the charging is completed; The processing chip is configured to send it to the first triode when receiving the first current signal; The first triode is configured to conduct when receiving the first current signal and send the first current signal to the transmitting tube and the second triode; The second triode is configured to conduct when receiving the first current signal and send the first current signal to the transmitting tube; 4. The heating control circuit according to claim 3, characterized in that, The transmitting tube includes an infrared diode, and the infrared diode is specifically configured to send a pulse signal to the preset heating area based on the first current signal when receiving the first current signal; 5. The heating control circuit according to claim 1, characterized in that, The detection circuit includes a receiving tube, a processing chip, and a demodulation circuit. The receiving tube is connected to the demodulation circuit, the demodulation circuit is connected to the third pin of the processing chip, and the fourth pin of the processing chip is connected to the heating circuit; The receiving tube is configured to send it to the demodulation circuit when receiving the infrared reflection signal; The demodulation circuit is configured to conduct when receiving the infrared reflection signal and send the infrared reflection signal to the processing chip; The processing chip is configured to convert the infrared reflection signal into a level signal and send the level signal to the heating circuit when receiving the infrared reflection signal; 6. The heating control circuit according to claim 5, characterized in that, The demodulation circuit includes a third triode, and the receiving tube includes an infrared photosensitive diode; the third pin of the processing chip is connected to the first end of the receiving tube, the first end of the third triode, and the heating circuit, and the second end of the third triode is connected to the infrared photosensitive diode; The receiving tube is configured to send the infrared reflection signal to the third triode when receiving the infrared reflection signal; The third triode is configured to conduct when receiving the infrared reflection signal and send the infrared reflection signal to the processing chip; The processing chip is configured to convert the infrared reflection signal into the level signal and send it to the heating circuit when receiving the infrared reflection signal.

7. The heating control circuit according to claim 1, characterized in that The heating circuit is further configured to disconnect when not receiving the level signal and stop sending the first preset voltage to the preset heating area.

8. The heating control circuit according to claim 1, wherein, The heating circuit is further configured to send a second preset voltage to the preset heating area when receiving the level signal and the working state of the heating circuit is in the heat preservation state; the second preset voltage is less than the first preset voltage.

9. A heating control method, characterized in that, Applied to the heating control circuit according to any one of claims 1 to 8, the method includes: When the power is turned on and the detection function is enabled, emitting an infrared signal to the preset heating area; When receiving the infrared reflection signal of the preset heating area, converting the infrared reflection signal into a level signal; Based on the level signal, sending a first preset voltage to the preset heating area to heat the preset heating area.

10. A cooking device, characterized in that, Comprising: A transmitting tube, a receiving tube, a memory, a processor, and the heating control circuit according to any one of claims 1 to 8.

11. A computer-readable storage medium, characterized in that, A computer program is stored in the computer-readable storage medium, and when the computer program is executed by the processor, it is used to implement the method according to claim 9.

12. A computer program product, characterized in that, The computer program product includes a computer program, and when the computer program is executed by the processor, it implements the method according to claim 9.

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