Vapor chamber assembly, preparation method of vapor chamber assembly and electronic equipment

Abstract

The invention provides a vapor chamber assembly, a preparation method of the vapor chamber assembly and electronic equipment, which are used for reducing the space occupation of a vapor chamber in the electronic equipment so as to help to realize the light and thin design of the electronic equipment. The vapor chamber assembly comprises a vapor chamber, a side frame, a battery cell cover plate and a battery cell, the side frame is fixedly connected to the vapor chamber, the battery cell cover plate is fixedly connected to the side, away from the vapor chamber, of the side frame, the battery cell cover plate, the vapor chamber and the side frame define a containing cavity, and the battery cell is installed in the containing cavity.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a vapor chamber assembly, a method for preparing the vapor chamber assembly, and an electronic device. Background Art

[0002] With the continuous development of science and technology, mobile phones and other electronic devices are widely used in people's daily life and work, and have become indispensable daily necessities. At present, electronic devices often use heat spreaders for heat dissipation. The heat spreader and the battery are often stacked inside the electronic device, occupying a large internal space of the electronic device, which is not conducive to the lightweight design of the electronic device. Summary of the invention

[0003] The present application provides a vapor chamber assembly, a method for preparing the vapor chamber assembly, and an electronic device, which are used to reduce the space occupied by the vapor chamber inside the electronic device, so as to help achieve a lightweight and thin design of the electronic device.

[0004] In a first aspect, the present application provides a heat spreader assembly, comprising a heat spreader, a side frame, a battery cell cover plate and a battery cell, wherein the side frame is fixedly connected to the heat spreader, the battery cell cover plate is fixedly connected to a side of the side frame facing away from the heat spreader, and together with the heat spreader and the side frame, forms a receiving cavity, and the battery cell is installed in the receiving cavity.

[0005] In the present application, a soaking plate, a side frame and a cell cover are used to enclose a receiving cavity, and the receiving cavity is used to receive the cell and the electrolyte to form a battery for an electronic device. That is, the soaking plate can be used as a part of the battery housing in the electronic device, which can reduce the internal space occupied by the battery housing in the electronic device. The soaking plate can occupy the original space of the battery housing, which can reduce the internal space occupied by the soaking plate in the electronic device, and help to achieve the thin and light design of the electronic device. Moreover, due to the sharing of the soaking plate and the battery housing, under the premise of the same volume of electronic equipment, a larger effective space can be reserved for the soaking plate, and the volume of the soaking plate can be increased to improve the heat dissipation performance of the soaking plate, which helps to improve the heat dissipation performance of the electronic device and improve the thermal experience of the electronic device. Furthermore, since the soaking plate is used as a battery housing, compared with the conventional battery housing, the soaking plate has a large strength, which can not only constrain the volume expansion of the cell, but also improve the structural strength of the battery, prevent the battery from extrusion and puncture and other safety problems, and effectively improve the reliability of the battery.

[0006] In one embodiment, the heat spreader includes a first cover plate, a second cover plate and a capillary structure, the second cover plate is mounted on the first cover plate and encloses the first cover plate to form a heat spreader cavity, and the capillary structure is disposed in the heat spreader cavity;

[0007] The side frame is fixedly connected to the second cover plate, and the battery cover plate is fixedly connected to a side of the side frame away from the second cover plate, and is enclosed with the second cover plate and the side frame to form a receiving cavity.

[0008] In this embodiment, the second cover plate, the side frame and the battery cell cover plate of the heat pipe are used to enclose a receiving cavity, and the battery cell and the electrolyte are received in the receiving cavity to form a battery of the electronic device. That is, the second cover plate can be reused as a part of the battery housing in the electronic device, which can reduce the space occupied by the battery housing in the internal space of the electronic device. The heat pipe can occupy the space originally occupied by the battery housing, which can reduce the space occupied by the heat pipe in the internal space of the electronic device, and contribute to the realization of the thin and light design of the electronic device. Moreover, due to the sharing of the cover plate of the heat pipe and the battery housing, on the premise of the same volume of the electronic device, a larger effective space can be reserved for the heat pipe, the volume of the heat pipe can be increased to improve the heat dissipation performance of the heat pipe, which helps to improve the heat dissipation performance of the electronic device and enhance the thermal experience of the electronic device. Furthermore, since the cover plate of the heat pipe is used as the battery housing, compared with the conventional battery housing, the cover plate of the heat pipe has high strength, which can not only restrain the volume expansion of the battery cell, but also improve the structural strength of the battery, prevent safety problems such as extrusion and puncture of the battery, and effectively improve the reliability of the battery.

[0009] In one implementation, the side frame and the second cover plate are integrally formed to simplify the preparation process of the heat pipe assembly and reduce the production cost of the heat pipe assembly. Exemplarily, the second cover plate and the side frame can be integrally formed by stamping at one time, or the second cover plate and the side frame can be integrally formed by etching at one time.

[0010] In one implementation, the heat pipe assembly further includes a first bonding layer, which is bonded between the side frame and the battery cell cover plate and surrounds the heat dissipation cavity and the battery cell to realize the assembly between the battery cell cover plate and the side frame.

[0011] In one implementation, the heat pipe assembly further includes a first welding part, which is fixedly connected between the side frame and the battery cell cover plate, surrounds the heat dissipation cavity and the battery cell, and is spaced from the battery cell to realize the assembly between the battery cell cover plate and the side frame. Exemplarily, the battery cell cover plate can be welded to the side frame by welding methods such as pressure welding, fusion welding or brazing. It should be noted that during the process of welding the battery cell cover plate to the side frame, the welding heat affected area should avoid the battery cell to prevent the welding process from affecting the battery cell and ensure the use reliability of the battery in the electronic device.

[0012] In one implementation, the side frame and the battery cell cover plate are integrally formed to simplify the preparation process of the heat pipe assembly and reduce the production cost of the heat pipe assembly. Exemplarily, the side frame and the battery cell cover plate can be integrally formed by machining or 3D printing. The machining methods include but are not limited to stamping or etching.

[0013] In one embodiment, the heat sink assembly further includes a second adhesive layer, which is adhesively bonded between the side frame and the heat sink, and is disposed around the heat dissipation cavity and the battery cell to achieve the assembly between the heat sink and the side frame.

[0014] In one embodiment, the heat sink assembly further includes a second welding portion, which is fixedly connected between the side frame and the heat sink, and is disposed around the heat dissipation cavity and the battery cell, and is spaced apart from the battery cell to achieve the assembly between the heat sink and the side frame. Exemplarily, the heat sink can be welded to the side frame by welding methods such as pressure welding, fusion welding or brazing. It should be noted that during the process of welding the heat sink to the side frame, the welding heat affected area should avoid the battery cell to prevent the welding process from affecting the battery cell and ensure the reliability of the battery in the electronic device.

[0015] In one embodiment, the side frame is provided with a first through hole and a second through hole, both of which penetrate the side frame along the thickness direction of the side frame and are spaced apart from each other.

[0016] The battery cell includes a positive electrode tab and a negative electrode tab, the positive electrode tab passes through the first through hole, and the negative electrode tab passes through the second through hole.

[0017] In one embodiment, the heat sink assembly further includes a protection circuit board, which is located on one side of the side frame and is electrically connected to the positive electrode tab and the negative electrode tab to avoid problems such as overcharging, over-discharging, over-current, short circuit and ultra-high temperature charge and discharge of the battery, and ensure the reliability of the battery in use.

[0018] In a second aspect, the present application provides an electronic device, which includes a middle frame and any one of the above heat sink assemblies. The middle frame is provided with a mounting hole, which penetrates the middle frame along the thickness direction of the middle frame. The heat sink is mounted on the middle frame and covers at least a part of the mounting hole, and at least a part of the battery cell is received in the mounting hole.

[0019] In the present application, a receiving cavity is formed by enclosing the heat sink, the side frame and the battery cell cover, and the battery cell and the electrolyte are received in the receiving cavity to form the battery of the electronic device. That is, the heat sink can be used as a part of the battery housing in the electronic device, which can reduce the internal space occupied by the battery housing in the electronic device. The heat sink can occupy the space originally occupied by the battery housing, which can reduce the internal space occupied by the heat sink in the electronic device, and is helpful to realize the thin and light design of the electronic device. Moreover, due to the sharing of the heat sink and the battery housing, on the premise of the same volume of the electronic device, a larger effective space can be reserved for the heat sink, the volume of the heat sink can be increased to improve the heat dissipation performance of the heat sink, which is helpful to improve the heat dissipation performance of the electronic device and enhance the thermal experience of the electronic device. Furthermore, since the heat sink is used as the battery housing, compared with the conventional battery housing, the heat sink has high strength, which can not only restrict the volume expansion of the battery cell, but also improve the structural strength of the battery, prevent safety problems such as extrusion and puncture of the battery, and effectively improve the reliability of the battery.

[0020] In one embodiment, the middle frame includes a middle plate and a frame, the middle plate is provided with a mounting hole, and the frame is fixedly connected to the middle plate and arranged around the middle plate;

[0021] The electronic device also includes a circuit board and a heating device. The circuit board is installed on a side of the middle plate away from the heat spreader and is electrically connected to the battery cell. The heating device is installed on a surface of the circuit board facing the middle plate.

[0022] In one embodiment, the middle plate is further provided with an avoidance hole, and the avoidance hole penetrates the middle plate along the thickness direction of the middle plate;

[0023] The heat spreader covers at least a portion of the avoidance hole, and the heating device is arranged in the avoidance hole and contacts the heat spreader. The heat spreader can evenly distribute the heat generated by the heating device when it is working, which helps to improve the heat dissipation efficiency of the heating device.

[0024] In one embodiment, the middle frame is further provided with a first fixing hole, and the side frame is provided with a second fixing hole, the second fixing hole penetrates the frame along the height direction of the frame and is connected with the first fixing hole;

[0025] The electronic device also includes a fastener, which is inserted into the first fixing hole and the second fixing hole and fixedly connected to the side frame and the middle frame to achieve assembly between the heat spreader assembly and the middle frame.

[0026] In a third aspect, the present application provides a method for preparing a vapor chamber assembly, comprising:

[0027] Provide heat sink, side frame, cell cover and cell;

[0028] The heat spreader, the side frame, the cell cover and the cell are combined, the heat spreader, the side frame and the cell cover are enclosed to form a receiving cavity, and the cell is installed in the receiving cavity.

[0029] In the present application, a receiving cavity is formed by enclosing a heat spreader, a side frame and a cell cover, and the receiving cavity is used to receive the cell and the electrolyte to form a battery for an electronic device. That is, the heat spreader can be used as a part of the battery housing in the electronic device, which can reduce the internal space occupied by the battery housing in the electronic device. The heat spreader can occupy the original space of the battery housing, which can reduce the internal space occupied by the heat spreader in the electronic device, and help to achieve a lightweight design of the electronic device.

[0030] In one embodiment, in the step of providing a vapor chamber, a side frame, a cell cover plate, and a cell, the side frame is fixedly connected to the vapor chamber;

[0031] The steps of assembling the vapor chamber, the side frame, the cell cover plate and the cell include:

[0032] Assemble the heat sink, side frame and battery cell;

[0033] Fix the cell cover plate to the side of the side frame away from the heat sink plate.

[0034] In one implementation, in the steps of providing the heat sink plate, the side frame, the cell cover plate, and the cell, the side frame is fixedly connected to the cell cover plate;

[0035] In the steps of combining the heat sink plate, the side frame, the cell cover plate, and the cell, it includes:

[0036] Combine the side frame, the cell cover plate, and the cell;

[0037] Fix the heat sink plate to the side of the side frame away from the cell cover plate.

[0038] In one implementation, in the steps of combining the heat sink plate, the side frame, the cell cover plate, and the cell, it includes:

[0039] Fix the side frame to the heat sink plate;

[0040] Combine the heat sink plate, the side frame, and the cell;

[0041] Fix the cell cover plate to the side of the side frame away from the heat sink plate.

[0042] In one implementation, in the steps of combining the heat sink plate, the side frame, the cell cover plate, and the cell, it includes:

[0043] Fix the side frame to the cell cover plate;

[0044] Combine the side frame, the cell cover plate, and the cell;

[0045] Fix the heat sink plate to the side of the side frame away from the cell cover plate.

[0046] In this application, a receiving cavity is formed by enclosing the heat sink plate, the side frame, and the cell cover plate, and the cell and the electrolyte are received in the receiving cavity to form the battery of the electronic device. That is, the heat sink plate can be used as a part of the battery housing in the electronic device, which can reduce the space occupied by the battery housing in the internal space of the electronic device. The heat sink plate can occupy the space originally occupied by the battery housing, which can reduce the space occupied by the heat sink plate in the internal space of the electronic device, and contribute to the realization of the thin and light design of the electronic device. Moreover, due to the sharing of the heat sink plate and the battery housing, on the premise of the same volume of the electronic device, a larger effective space can be reserved for the heat sink plate, the volume of the heat sink plate can be increased to improve the heat dissipation performance of the heat sink plate, which helps to improve the heat dissipation performance of the electronic device and enhance the thermal experience of the electronic device. Furthermore, since the heat sink plate is used as the battery housing, compared with the conventional battery housing, the heat sink plate has high strength, which can not only restrain the volume expansion of the cell, but also improve the structural strength of the battery, prevent safety problems such as extrusion and puncture of the battery, and effectively improve the reliability of the battery. Description of the Drawings

[0047] To more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for the embodiments of the present application will be described below.

[0048] Figure 1 is a schematic structural diagram of the first electronic device provided by the present application;

[0049] Figure 2 is Figure 1 a schematic partial structural diagram of the electronic device shown;

[0050] Figure 3 is Figure 2 a schematic structural diagram of the electronic device shown from another angle;

[0051] Figure 4 is Figure 2 a schematic exploded structural diagram of the electronic device shown;

[0052] Figure 5 is Figure 2 a schematic structural diagram of the electronic device shown after being cut along the I-I line;

[0053] Figure 6 is Figure 5 a schematic structural diagram of the electronic device shown after being cut along the II-II line;

[0054] Figure 7 is Figure 4 a schematic exploded structural diagram of the vapor chamber assembly in the electronic device shown;

[0055] Figure 8 is Figure 7 a schematic structural diagram of the vapor chamber and the side frame in the vapor chamber assembly shown;

[0056] Figure 9 is Figure 8 a schematic structural diagram of the vapor chamber and the side frame shown from another angle;

[0057] Figure 10 is Figure 8 a schematic structural diagram of the vapor chamber shown after being cut along the III-III line;

[0058] Figure 11 is a schematic structural diagram of the second electronic device provided by the present application after being cut along the II-II line;

[0059] Figure 12 is a schematic partial structural diagram of the third electronic device provided by the present application;

[0060] Figure 13 is Figure 12 a schematic structural diagram of the electronic device shown after being cut along the IV-IV line;

[0061] Figure 14 is Figure 12 A schematic structural diagram of the middle frame of the electronic device shown;

[0062] Figure 15 is Figure 12 A schematic structural diagram of the vapor chamber and the side frame of the vapor chamber assembly in the electronic device shown;

[0063] Figure 16 A schematic structural diagram of the fourth electronic device provided by the present application after being cut along the II-II position;

[0064] Figure 17 A schematic exploded view of the vapor chamber assembly of the fourth electronic device provided by the present application;

[0065] Figure 18 A schematic structural diagram of the fifth electronic device provided by the present application after being cut along the II-II position;

[0066] Figure 19 A schematic exploded view of the vapor chamber assembly of the fifth electronic device provided by the present application;

[0067] Figure 20 A schematic structural diagram of the sixth electronic device provided by the present application after being cut along the I-I position;

[0068] Figure 21 A schematic structural diagram of the middle frame of the sixth electronic device provided by the present application;

[0069] Figure 22 A process flow chart of the preparation method of the first vapor chamber assembly provided by the present application;

[0070] Figure 23 is Figure 22 A process flow chart for preparing the vapor chamber and the side frame in the preparation method of the vapor chamber assembly shown;

[0071] Figure 24 is Figure 22 A process flow chart for preparing the battery cell in the preparation method of the vapor chamber assembly shown;

[0072] Figure 25 is Figure 24 A process flow chart for preparing the positive electrode plate in the steps of preparing the battery cell shown;

[0073] Figure 26 is Figure 24 A process flow chart for preparing the negative electrode plate in the steps of preparing the battery cell shown;

[0074] Figure 27 is Figure 22The process flow diagram of combining the vapor chamber, side frame, battery cell cover plate, and battery cell in the preparation method of the vapor chamber assembly shown;

[0075] Figure 28 is Figure 27 The structural schematic diagram of combining the battery cell with the vapor chamber and side frame in the step of combining the vapor chamber, side frame, battery cell cover plate, and battery cell shown;

[0076] Figure 29 The process flow diagram of preparing the vapor chamber in the second preparation method of the vapor chamber assembly of the present application;

[0077] Figure 30 The process flow diagram of combining the vapor chamber, side frame, battery cell cover plate, and battery cell in the second preparation method of the vapor chamber assembly of the present application;

[0078] Figure 31 is Figure 30 The structural schematic diagram of combining the battery cell with the side frame and battery cell cover plate in the step of combining the vapor chamber, side frame, battery cell cover plate, and battery cell shown. Detailed implementation manners

[0079] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application.

[0080] Please refer to Figures 1 to 3 , Figure 1 which is the structural schematic diagram of the first electronic device 1000 provided by the present application, Figure 2 is Figure 1 The partial structural schematic diagram of the electronic device 1000 shown, Figure 3 is Figure 2 The structural schematic diagram of the electronic device 1000 shown from another angle.

[0081] The electronic device 1000 can be electronic products such as mobile phones, tablet computers, laptop computers, vehicle-mounted devices, smart watches, smart bracelets, and POS machines (point of sales terminals). Next, the present application will be described by taking the electronic device 1000 as a mobile phone as an example. Among them, for the convenience of description, the width direction of the electronic device 1000 is defined as the X-axis direction, the length direction of the electronic device 1000 is defined as the Y-axis direction, and the thickness direction of the electronic device 1000 is defined as the Z-axis direction, and the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other in pairs.

[0082] It should be noted that the qualifying words regarding relative position relationships such as parallel and perpendicular mentioned in this application are all in view of the current technological level, rather than the absolute and strict definitions in the mathematical sense. A small deviation is allowed, and approximate parallel and approximate perpendicular are both acceptable. For example, when A is parallel to B, it means that A is parallel to B or approximately parallel to B, and the included angle between A and B can be between 0 degrees and 10 degrees. For example, when A is perpendicular to B, it means that A is perpendicular to B or approximately perpendicular to B, and the included angle between A and B can be between 80 degrees and 100 degrees.

[0083] The electronic device 1000 includes a housing 100, a display screen 200, a circuit board 300, a heating device 400, and a heat sink assembly 500. The display screen 200, the circuit board 300, the heating device 400, and the heat sink assembly 500 are all installed in the housing 100.

[0084] Please refer to Figure 4 , Figure 4 is Figure 2 the exploded structural schematic diagram of the electronic device 1000 shown.

[0085] The housing 100 includes a middle frame 110 and a rear cover 120. The rear cover 120 is installed on one side of the middle frame 110. The middle frame 110 is provided with a mounting hole 111, an avoidance hole 112, and a first assembly hole 113. The mounting hole 111, the avoidance hole 112, and the first assembly hole 113 all penetrate the middle frame 110 along the thickness direction of the middle frame 110 (the Z-axis direction shown in the figure). Along the length direction of the middle frame 110 (the Y-axis direction shown in the figure), the avoidance hole 112 is located on one side of the mounting hole 111 and is communicated with the mounting hole 111. In some other embodiments, the avoidance hole 112 may not be communicated with the mounting hole 111, that is, the avoidance hole 112 may be arranged at intervals from the mounting hole 111. The first assembly hole 113 is arranged at intervals from both the mounting hole 111 and the avoidance hole 112. Exemplarily, there are four first assembly holes 113, and the four first assembly holes 113 are arranged at intervals around the mounting hole 111.

[0086] In this embodiment, the middle frame 110 includes a middle plate 114 and a frame 115. The frame 115 is connected to the middle plate 114 and surrounds the middle plate 114. Wherein, the middle plate 114 is provided with a mounting hole 111 and an avoidance hole 112, and the mounting hole 111 and the avoidance hole 112 both penetrate the middle plate 114 along the thickness direction of the middle plate 114 (the Z-axis direction shown in the figure).

[0087] In the thickness direction of the middle frame 110 (the Z-axis direction shown in the figure), the rear cover 120 is installed on one side of the middle frame 110 and covers the mounting hole 111, the avoidance hole 112, and the first assembly hole 113. Specifically, in the thickness direction of the frame 115 (the Z-axis direction shown in the figure), the rear cover 120 is installed on one side of the frame 115 and covers the middle plate 114. Among them, the rear cover 120 can be the battery cover of the electronic device 1000.

[0088] The display screen 200 is installed on the side of the middle frame 110 facing away from the rear cover 120. That is, the display screen 200 and the rear cover 120 are respectively installed on opposite sides of the middle frame 110. When the user uses the electronic device 1000, the display screen 200 faces the user, and the rear cover 120 faces away from the user. Exemplarily, the display screen 200 can be a liquid crystal display (LCD) or an organic light-emitting diode display (OLED), etc.

[0089] Please refer to Figure 5 and Figure 6 , Figure 5 is Figure 2 the schematic structural diagram of the electronic device 1000 after being cut along the I-I position, Figure 6 is Figure 5 the schematic structural diagram of the electronic device 1000 after being cut along the II-II position. Among them, "being cut along the I-I position" means being cut along the plane where the I-I line is located, and the same understanding can be made for other similar descriptions in this article.

[0090] The circuit board 300, the heating device 400, and the heat sink assembly 500 are all installed on the middle frame 110. Specifically, the circuit board 300 is installed on the side of the middle plate 114 facing away from the display screen 200, is disposed opposite to the avoidance hole 112, and is electrically connected to the display screen 200. Among them, the circuit board 300 can be the mainboard of the electronic device 1000. The heating device 400 is located between the display screen 200 and the circuit board 300, is installed on the circuit board 300, is electrically connected to the circuit board 300, and also passes through the avoidance hole 112. Among them, the heating device 400 can be the central processing unit (CPU) of the electronic device 1000. For example, the heating device 400 can be a system on chip (SoC). The heating device 400 can send a display signal to the display screen 200 through the circuit board 300, and the display screen 200 receives the display signal and displays information such as images or texts according to the display signal.

[0091] The vapor chamber assembly 500 is located on the same side of the display screen 200 as the circuit board 300 and the heating device 400, and is installed on the middle plate 114, and covers at least part of the mounting hole 111 and at least part of the avoidance hole 112, and is in contact with the heating device 400. In this embodiment, the vapor chamber assembly 500 covers the opening of the mounting hole 111 toward the display screen 200 and the opening of the avoidance hole 112 toward the display screen 200, and is penetrated in the mounting hole 111. In some other embodiments, the vapor chamber assembly 500 may not be penetrated in the mounting hole 111, and this application does not make any specific restrictions on this.

[0092] Please also read Figure 7 , Figure 7 yes Figure 4 A schematic diagram of the exploded structure of the vapor chamber assembly 500 in the electronic device 1000 is shown.

[0093] The heat spreader assembly 500 includes a heat spreader 510, a side frame 520, a cell cover plate 530, a cell 540, an electrolyte (not shown) and a protective circuit board 550. The heat spreader 510 is located between the middle plate 114 and the display screen 200, and is installed on the middle plate 114, and covers the mounting hole 111 and the avoidance hole 112. Exemplarily, the heat spreader 510 can be inserted into the mounting hole 111. The side frame 520 is located on the side of the heat spreader 510 away from the display screen 200, and is fixedly connected to the heat spreader 510. Among them, at least part of the side frame 520 is accommodated in the mounting hole 111. The cell cover plate 530 is located on the side of the side frame 520 away from the heat spreader 510, and is fixedly connected to the side frame 520, and is enclosed with the heat spreader 510 and the side frame 520 to form a receiving cavity 501. Among them, at least part of the cell cover plate 530 is accommodated in the mounting hole 111. The battery cell 540 and the electrolyte are both contained in the containing cavity 501, and at least part of the battery cell 540 is immersed in the electrolyte. Along the length direction of the heat spreader assembly 500 (the Y-axis direction in the figure), the protection circuit board 550 is located on one side of the side frame 520 and the battery cell cover plate 530, and is electrically connected to the battery cell 540 and the circuit board 300.

[0094] In this embodiment, a heat sink 510, a side frame 520, and a battery cell cover plate 530 are used to enclose a receiving cavity 501, and the receiving cavity 501 is used to receive a battery cell 540 and an electrolyte to form a battery of the electronic device 1000. That is, the heat sink 510 can be used as a part of the battery housing in the electronic device 1000, which can reduce the occupancy of the battery housing in the internal space of the electronic device 1000. The heat sink 510 can occupy the space originally occupied by the battery housing, and can reduce the occupancy of the heat sink 510 in the internal space of the electronic device 1000, which helps to achieve the thin and light design of the electronic device 1000. Moreover, due to the sharing of the heat sink 510 and the battery housing, on the premise of the same volume of the electronic device 1000, a relatively large effective space can be reserved for the heat sink 510, which can be used for the structural optimization design of the steam space and the capillary structure of the heat sink 510. The increase in the steam space can reduce the steam flow resistance, which helps to increase the heat dissipation area and the uniform temperature performance of the heat sink 510. The increase in the capillary force of the capillary structure can improve the liquid reflux efficiency, thereby improving the heat dissipation performance of the heat sink 510, which helps to improve the heat dissipation performance of the electronic device 1000 and enhance the thermal experience of the electronic device 1000. Furthermore, since the heat sink 510 is used as the battery housing, compared with the conventional battery housing, the heat sink 510 has high strength, which can not only restrain the volume expansion of the battery cell 540, but also improve the structural strength of the battery, prevent safety problems such as extrusion and puncture of the battery, and effectively improve the reliability of the battery.

[0095] Please refer to Figure 8 and Figure 9 , Figure 8 is Figure 7 a schematic structural diagram of the heat sink 510 and the side frame 520 in the heat sink assembly 500 shown in Figure 9 is Figure 8 a schematic structural diagram of the heat sink 510 and the side frame 520 from another angle shown in

[0096] The heat sink 510 is provided with a second assembly hole 511. The second assembly hole 511 penetrates the heat sink 510 along the thickness direction of the heat sink 510 and is communicated with the first assembly hole 113. Among them, the second assembly hole 511 is located at the edge of the heat sink 510. Exemplarily, there are four second assembly holes 511, and the four second assembly holes 511 are spaced apart from each other. Each second assembly hole 511 is communicated with a first assembly hole 113. In addition, the electronic device 1000 further includes a plurality of fixing members (not shown in the figure). Each fixing member passes through the first assembly hole 113 and the second assembly hole 511 and is fixedly connected to the middle frame 110 and the heat sink 510 to achieve the assembly between the heat sink 510 and the middle frame 110, and further achieve the assembly between the heat sink assembly 500 and the middle frame 110. Among them, there are four fixing members, and each fixing member passes through a first assembly hole 113 and a second assembly hole 511. Exemplarily, the fixing member can be a screw or a bolt.

[0097] Please also read Figure 10 , Figure 10 yes Figure 8 The structure diagram of the heat spreader 510 after being cut apart along III-III is shown.

[0098] The heat spreader 510 includes a first cover plate 512, a second cover plate 513, a capillary structure 514 and a plurality of support columns 515. The first cover plate 512 is mounted on the middle plate 114, covers the mounting hole 111 and the avoidance hole 112, and contacts the heating device 400. The first cover plate 512 is provided with a second assembly hole 511, and the second assembly hole 511 passes through the first cover plate 512 along the thickness direction of the first cover plate 512 (Z-axis direction shown in the figure). The second cover plate 513 is penetrated in the mounting hole 111, and is mounted on the first cover plate 512, and is enclosed with the first cover plate 512 to form a heat spreader cavity 516. The capillary structure 514 and the plurality of support columns 515 are both provided in the heat spreader cavity 516. Specifically, the capillary structure 514 is provided on the surface of the second cover plate 513 facing the first cover plate 512. Exemplarily, the capillary structure 514 can be a capillary structure such as a wire mesh, copper powder or a groove. The plurality of support columns 515 are disposed on the surface of the first cover plate 512 facing the second cover plate 513 , and abut against the surface of the second cover plate 513 facing the first cover plate 512 , and are spaced apart from each other.

[0099] The side frame 520 is located on the side of the second cover plate 513 away from the first cover plate 512, and is fixedly connected to the second cover plate 513. Among them, the side frame 520 and the second cover plate 513 can be integrally formed to simplify the preparation process of the heat spreader assembly 500 and reduce the production cost of the heat spreader assembly 500. It should be noted that in the preparation process of the heat spreader 510, the first cover plate 512 and the support column 515 can be formed at one time by stamping, and the second cover plate 513 and the side frame 520 can also be formed at one time by stamping. Alternatively, the first cover plate 512 and the support column 515 can be formed at one time by etching, and the second cover plate 513 and the side frame 520 can also be formed at one time by etching, so as to ensure the hardness and strength of the first cover plate 512 and the second cover plate 513, which helps to improve the overall strength of the heat spreader 510.

[0100] The side frame 520 is provided with a first through hole 521 and a second through hole 522. The first through hole 521 and the second through hole 522 both penetrate the side frame 520 along the thickness direction of the side frame 520 and connect the receiving cavity 501 with the external environment. Specifically, the first through hole 521 and the second through hole 522 are both located at one end of the side frame 520 facing the circuit board 300 and the heating device 400. Along the width direction of the side frame 520 (the X-axis direction in the figure), the first through hole 521 and the second through hole 522 are arranged in sequence and spaced from each other.

[0101] The battery cell cover plate 530 is located on the side of the side frame 520 away from the second cover plate 513, and is fixedly connected to the second cover plate 513, and encloses a receiving cavity 501 with the second cover plate 513 and the side frame 520. In this embodiment, the heat sink assembly 500 further includes a first adhesive layer 560, which is located between the side frame 520 and the battery cell cover plate 530, and is connected between the side frame 520 and the battery cell cover plate 530, and is disposed around the receiving cavity 501 and the battery cell 540. In other words, the battery cell cover plate 530 is assembled with the side frame 520 through the first adhesive layer 560. Exemplarily, the first adhesive layer 560 can be a double-sided adhesive tape or other adhesive layers that can play an adhesive role.

[0102] Please refer to Figure 7 and Figure 9 , the battery cell 540 has a positive electrode tab 541 and a negative electrode tab 542. Along the width direction of the battery cell 540 (the X-axis direction shown in the figure), the positive electrode tab 541 and the negative electrode tab 542 are arranged in sequence and are spaced apart from each other. Specifically, the positive electrode tab 541 passes through the first through hole 521, and the negative electrode tab 542 passes through the second through hole 522. The protection circuit board 550 is electrically connected to the positive electrode tab 541 and the negative electrode tab 542 to realize the electrical connection between the protection circuit board 550 and the battery cell 540. The protection circuit board 550 can avoid problems such as overcharging, over-discharging, over-current, short circuit, and ultra-high temperature charging and discharging of the battery, and ensure the use reliability of the battery.

[0103] In this embodiment, the second cover plate 513, the side frame 520 and the battery cell cover plate 530 of the heat sink 510 enclose a receiving cavity 501, and the receiving cavity 501 is used to receive the battery cell 540 and the electrolyte to form the battery of the electronic device 1000. That is, the second cover plate 513 can be reused as a part of the battery housing in the electronic device 1000, which can reduce the occupancy of the internal space of the electronic device 1000 by the battery housing. The heat sink 510 can occupy the space of the original battery housing, which can reduce the occupancy of the internal space of the electronic device 1000 by the heat sink 510, and is helpful to realize the thin and light design of the electronic device 1000. Moreover, due to the sharing of the heat sink 510 and the battery housing, on the premise of the same volume of the electronic device 1000, a larger effective space can be reserved for the heat sink 510, the volume of the heat sink 510 can be increased to improve the heat dissipation performance of the heat sink 510, which is helpful to improve the heat dissipation performance of the electronic device 1000 and enhance the thermal experience of the electronic device 1000. Furthermore, since the heat sink 510 is used as the battery housing, compared with the conventional battery housing, the heat sink 510 has high strength, which can not only restrain the volume expansion of the battery cell 540, but also improve the structural strength of the battery, prevent safety problems such as extrusion and puncture of the battery, and can effectively improve the reliability of the battery.

[0104] Please refer to Figure 11 , Figure 11It is a schematic cross-sectional view of the second electronic device 1000 provided by the present application along II-II.

[0105] The difference between the electronic device 1000 shown in this embodiment and the above-mentioned first electronic device 1000 is that the heat pipe assembly 500 further includes a second welding portion 570. The second welding portion 570 is fixedly connected between the side frame 520 and the battery cell cover plate 530, surrounds the receiving cavity 501 and the battery cell 540, and is spaced apart from the battery cell 540. Among them, the second welding portion 570 is embedded in the battery cell cover plate 530. Exemplarily, the battery cell cover plate 530 can be welded to the side frame 520 by welding methods such as pressure welding, fusion welding or brazing. It should be noted that during the process of welding the battery cell cover plate 530 to the side frame 520, welding can be performed from the side or the bottom surface of the joint surface between the battery cell cover plate 530 and the side frame 520, so that the heat affected area of the welding is avoided from the battery cell 540, preventing the welding process from affecting the battery cell 540 and ensuring the use reliability of the battery in the electronic device 1000.

[0106] Please refer to Figures 12 to 15 , Figure 12 It is a partial structural schematic diagram of the third electronic device 1000 provided by the present application, Figure 13 It is Figure 12 a schematic cross-sectional view of the electronic device 1000 shown along IV-IV, Figure 14 It is Figure 12 a schematic structural diagram of the middle frame 110 of the electronic device 1000 shown, Figure 15 It is Figure 12 a schematic structural diagram of the heat pipe 510 and the side frame 520 of the heat pipe assembly 500 in the electronic device 1000 shown.

[0107] The difference between the electronic device 1000 shown in this embodiment and the above-mentioned first and second electronic devices 1000 is that the middle frame 110 is further provided with a first fixing hole 116, and the opening of the first fixing hole 116 is located on the surface of the middle frame 110 facing the back cover 120. Specifically, the first fixing hole 116 is located at the edge of the middle plate 114. Among them, there are two first fixing holes 116, and along the width direction of the middle frame 110, the two first fixing holes 116 are respectively located on opposite sides of the mounting hole 111.

[0108] The side frame 520 is further provided with a second fixing hole 523. The second fixing hole 523 penetrates the side frame 520 along the height direction of the side frame 520 (the Z-axis direction shown in the figure) and communicates with the first fixing hole 116. Among them, there are two second fixing holes 523, and along the width direction of the side frame 520, the two second fixing holes 523 are respectively located on opposite sides of the receiving cavity 501 and are both spaced apart from the receiving cavity 501. Each second fixing hole 523 communicates with one first fixing hole 116.

[0109] In addition, the electronic device 1000 further includes a fastener 600. The fastener 600 passes through the first fixing hole 116 and the second fixing hole 523 and is fixedly connected to the middle frame 110 and the side frame 520 to achieve the assembly between the heat sink plate 510 and the middle frame 110. Among them, there are two fasteners 600, and each fastener 600 passes through one first fixing hole 116 and one second fixing hole 523. Exemplarily, the fastener 600 can be a structural member such as a screw or a bolt that can play a fastening role.

[0110] Please refer to Figure 16 and Figure 17 , Figure 16 FIG. is a schematic cross-sectional view of the fourth electronic device 1000 provided by the present application along the II-II section, Figure 17 FIG. is an exploded structural schematic view of the heat sink plate assembly 500 in the fourth electronic device 1000 provided by the present application.

[0111] The difference between the electronic device 1000 shown in this embodiment and the above-mentioned first electronic device 1000 is that the heat sink plate 510 and the side frame 520 are relatively independent structural members, and the side frame 520 and the battery cell cover plate 530 are integrally formed to simplify the preparation process of the heat sink plate assembly 500 and reduce the production cost of the heat sink plate assembly 500. Exemplarily, the side frame 520 and the battery cell cover plate 530 can be integrally formed by machining or 3D printing, and the machining methods include but are not limited to stamping or etching.

[0112] In this embodiment, the electronic device 1000 further includes a second adhesive layer 580. The second adhesive layer 580 is located between the heat sink plate 510 and the side frame 520, and is connected between the heat sink plate 510 and the side frame 520 and surrounds the accommodation cavity 501 and the battery cell 540. In other words, the heat sink plate 510 is assembled with the side frame 520 through the second adhesive layer 580. Exemplarily, the second adhesive layer 580 can be a double-sided adhesive or other adhesive layers that can play an adhesive role.

[0113] In some other embodiments, the electronic device 1000 may also include a second welding portion. The second welding portion is fixedly connected between the heat sink plate 510 and the side frame 520, surrounds the accommodation cavity 501 and the battery cell 540, and is spaced apart from the battery cell 540. The present application does not specifically limit the assembly method between the heat sink plate 510 and the side frame 520. It should be noted that during the process of welding the heat sink plate 510 to the side frame 520, welding can be performed from the side of the joint surface between the heat sink plate 510 and the side frame 520, so that the heat affected area of the welding is avoided from the battery cell 540, preventing the welding process from affecting the battery cell 540 and ensuring the use reliability of the battery in the electronic device 1000.

[0114] Please refer to Figure 18 and Figure 19 ,Figure 18 FIG. Figure 18 is a schematic cross-sectional view of the fifth electronic device 1000 provided by the present application along II-II. Figure 19 FIG. Figure 19 is an exploded structural schematic view of the heat pipe assembly 500 in the fifth electronic device 1000 provided by the present application.

[0115] The difference between the electronic device 1000 shown in this embodiment and the above four electronic devices 1000 is that the heat pipe 510, the side frame 520, and the battery cell cover plate 530 are relatively independent structural members. The electronic device 1000 includes a first adhesive layer 560 and a second adhesive layer 580. The first adhesive layer 560 is located between the side frame 520 and the battery cell cover plate 530, and is connected between the side frame 520 and the battery cell cover plate 530, and is disposed around the accommodation cavity 501 and the battery cell 540. In other words, the battery cell cover plate 530 is assembled with the side frame 520 through the first adhesive layer 560. Exemplarily, the first adhesive layer 560 can be a double-sided adhesive or other adhesive layers that can play an adhesive role. In some other embodiments, the electronic device 1000 may also include a first welding portion, which is fixedly connected between the battery cell cover plate 530 and the side frame 520, and is disposed around the accommodation cavity 501 and is spaced apart from the battery cell 540. The present application does not specifically limit the assembly manner between the battery cell cover plate 530 and the side frame 520.

[0116] The second adhesive layer 580 is located between the heat pipe 510 and the side frame 520, and is connected between the heat pipe 510 and the side frame 520, and is disposed around the accommodation cavity 501 and the battery cell 540. In other words, the heat pipe 510 is assembled with the side frame 520 through the second adhesive layer 580. Exemplarily, the second adhesive layer 580 can be a double-sided adhesive or other adhesive layers that can play an adhesive role. In some other embodiments, the electronic device 1000 may also include a second welding portion, which is fixedly connected between the heat pipe 510 and the side frame 520, and is disposed around the accommodation cavity 501 and is spaced apart from the battery cell 540. The present application does not specifically limit the assembly manner between the heat pipe 510 and the side frame 520.

[0117] Please refer to Figure 20 and Figure 21 Figure 20 FIG. Figure 20 is a schematic cross-sectional view of the sixth electronic device 1000 provided by the present application along I-I. Figure 21 FIG. Figure 21 is a structural schematic view of the middle frame 110 of the sixth electronic device 1000 provided by the present application.

[0118] The difference between the electronic device 1000 shown in this embodiment and the above five types of electronic devices 1000 is that the middle frame 110 is provided with a mounting hole 111. That is, the middle frame 110 is not provided with an avoidance hole 112. The circuit board 300 and the heat-generating device 400 are both located on the side of the middle plate 114 away from the heat sink assembly 500. The heat-generating device 400 is located between the circuit board 300 and the middle plate 114 and can be in contact with the middle plate 114. In some other embodiments, the electronic device 1000 may further include a third adhesive layer (not shown in the figure), which is located between the heat sink 510 and the middle plate 114 and is adhered between the heat sink 510 and the middle plate 114 to achieve the assembly between the heat sink 510 and the middle frame 110. Exemplarily, the third adhesive layer may be a double-sided tape or other structural members with an adhesive function.

[0119] Please refer to Figure 22 , Figure 22 which is the process flow chart of the preparation method of the first heat sink assembly provided by this application.

[0120] In this embodiment, the preparation method of the heat sink assembly is used to prepare the heat sink assembly 500 in the first to third types of electronic devices 1000 described above. The preparation method of the heat sink assembly includes step S1 and step S2.

[0121] Step S1: Provide a heat sink 510, a side frame 520, a battery cell cover plate 530, and a battery cell 540. In this embodiment, the side frame 520 is fixedly connected to the heat sink 510, as Figure 7 and Figure 9 shown. Among them, the side frame 520 is provided with a first through hole 521 and a second through hole 522. Both the first through hole 521 and the second through hole 522 penetrate the side frame 520 along the thickness direction of the side frame 520 and communicate the accommodation cavity 501 with the external environment. Along the width direction of the side frame 520 (the X-axis direction shown in the figure), the first through hole 521 and the second through hole 522 are arranged in sequence and are spaced apart from each other. The battery cell 540 has a positive electrode tab 541 and a negative electrode tab 542. Along the width direction of the battery cell 540 (the X-axis direction shown in the figure), the positive electrode tab 541 and the negative electrode tab 542 are arranged in sequence and are spaced apart from each other. Specifically, step S1 may include the preparation steps of the heat sink 510 and the side frame 520, the preparation step of the battery cell cover plate 530, and the preparation step of the battery cell 540.

[0122] In the preparation step of the battery cell cover plate 530, the battery cell cover plate 530 can be prepared by machining methods such as stamping. It should be noted that the preparation steps of the heat sink 510 and the side frame 520, the preparation step of the battery cell cover plate 530, and the preparation step of the battery cell 540 can be carried out successively or simultaneously, and this application does not make specific limitations on this.

[0123] Please refer to Figure 23 , Figure 23 which isFigure 22 The process flow chart of preparing the vapor chamber 510 and the side frame 520 in the preparation method of the shown vapor chamber assembly.

[0124] The preparation steps of the vapor chamber 510 and the side frame 520 include steps S11 to S15.

[0125] Step S11, provide a first cover plate 512, a second cover plate 513 and a side frame 520, and the side frame 520 is fixedly connected to the second cover plate 513, as Figure 10 shown. Exemplarily, the side frame 520 and the second cover plate 513 can be integrally formed. Among them, the first cover plate 512, the second cover plate 513 and the side frame 520 can be formed by stamping process. At this time, the second cover plate 513 and the side frame 520 can be formed at one time by stamping, or the first cover plate 512, the second cover plate 513 and the side frame 520 can be formed by etching process. At this time, the second cover plate 513 and the side frame 520 can be formed at one time by etching.

[0126] Step S12, provide a capillary structure 514 on the surface of the second cover plate 513 facing away from the side frame 520.

[0127] Step S13, install the first cover plate 512 on the side of the second cover plate 513 facing away from the side frame 520. The first cover plate 512 and the second cover plate 513 enclose a vapor chamber 516, and the capillary structure 514 is located in the vapor chamber 516. Among them, the first cover plate 512 can be installed on the second cover plate 513 by welding. Exemplarily, the first cover plate 512 can be installed on the second cover plate 513 by snap, bonding or welding, etc. The present application does not make specific limitations on this.

[0128] Step S14, inject water into the vapor chamber 516 and evacuate the vapor chamber 516.

[0129] Step S15, flatten the seals of the first cover plate 512 and the second cover plate 513.

[0130] Please refer to Figure 24 , Figure 24 is Figure 22 the process flow chart of preparing the battery cell 540 in the preparation method of the shown vapor chamber assembly.

[0131] The preparation steps of the battery cell 540 include steps S16 to S18.

[0132] Step S16, provide a positive electrode sheet and a negative electrode sheet. Among them, step S16 includes the preparation steps of the positive electrode sheet and the negative electrode sheet. It should be noted that the preparation steps of the positive electrode sheet and the negative electrode sheet can be carried out successively or simultaneously. The present application does not make specific limitations on this.

[0133] Please refer toFigure 25 , Figure 25 is Figure 24 The process flow chart of preparing the positive electrode sheet in the steps of preparing the battery cell 540 shown in the figure.

[0134] The preparation steps of the positive electrode sheet include step S161 to step S164.

[0135] Step S161, provide the positive electrode current collector and the positive electrode coating.

[0136] Step S162, coat the positive electrode coating on the surface of the positive electrode current collector to obtain a positive electrode sheet preform.

[0137] Step S163, roll press the positive electrode sheet preform to obtain a positive electrode sheet intermediate.

[0138] Step S164, cut the positive electrode sheet intermediate to obtain the positive electrode sheet.

[0139] Please refer to Figure 26 , Figure 26 is Figure 24 The process flow chart of preparing the negative electrode sheet in the steps of preparing the battery cell 540 shown in the figure.

[0140] The preparation steps of the negative electrode sheet include step S165 to step S168.

[0141] Step S165, provide the negative electrode current collector and the negative electrode coating.

[0142] Step S166, coat the negative electrode coating on the surface of the negative electrode current collector to obtain a negative electrode sheet preform.

[0143] Step S167, roll press the negative electrode sheet preform to obtain a negative electrode sheet intermediate.

[0144] Step S168, cut the negative electrode sheet intermediate to obtain the negative electrode sheet.

[0145] Step S17, perform sheet making and winding on the positive electrode sheet and the negative electrode sheet to obtain a battery cell preform.

[0146] Step S18, perform core pressing and glue pasting on the battery cell preform to obtain the battery cell 540.

[0147] Step S2, combine the heat sink 510, the side frame 520, the battery cell cover plate 530 and the battery cell 540. The heat sink 510, the side frame 520 and the battery cell cover plate 530 enclose to form a receiving cavity 501, and the battery cell 540 is installed in the receiving cavity 501. Among them, the positive electrode tab 541 passes through the first through hole 521 of the side frame 520, and the negative electrode tab 542 passes through the second through hole 522 of the side frame 520.

[0148] Please refer to Figure 27 , Figure 27Yes Figure 22 The process flow chart of combining the vapor chamber 510, the side frame 520, the battery cell cover plate 530, and the battery cell 540 in the preparation method of the vapor chamber assembly shown.

[0149] In this embodiment, step S2 includes step S21 and step S22.

[0150] Step S21, combine the battery cell 540 with the vapor chamber 510 and the side frame 520, as Figure 28 shown. Among them, the positive electrode tab 541 passes through the first through hole 521 of the side frame 520 (as Figure 9 shown), and the negative electrode tab 542 passes through the second through hole 522 of the side frame 520 (as Figure 9 shown).

[0151] Step S22, install the battery cell cover plate 530 on the side of the side frame 520 facing away from the vapor chamber 510. Exemplarily, the battery cell cover plate 530 can be installed on the side frame 520 by means of gluing, welding, or buckling.

[0152] In addition, the preparation method of the vapor chamber assembly 500 further includes a series of steps such as pouring electrolyte into the accommodation cavity 503, forming, grading, battery performance inspection, vapor chamber performance inspection, and appearance inspection of the vapor chamber assembly 500, and storing the vapor chamber assembly 500 in the warehouse. The specific details of each step can refer to the relevant steps in the existing vapor chamber and battery preparation processes, and will not be elaborated here.

[0153] The present application also provides a second preparation method of the vapor chamber assembly, which is used to prepare the vapor chamber assembly 500 in the fourth electronic device 1000 described above. The difference between the preparation method of the vapor chamber assembly shown in this embodiment and the above-mentioned first preparation method of the vapor chamber assembly is that in step S1, the side frame 520 is fixedly connected to the battery cell cover plate 530, as Figure 19 shown. Exemplarily, the side frame 520 and the battery cell cover plate 530 are integrally formed. Specifically, step S1 may include the preparation steps of the vapor chamber 510, the preparation steps of the battery cell cover plate 530 and the side frame 520, and the preparation steps of the battery cell 540.

[0154] In the preparation steps of the battery cell cover plate 530 and the side frame 520, machining methods such as stamping or etching, or 3D printing and other methods can be used to prepare the battery cell cover plate 530 and the side frame 520. The preparation steps of the battery cell 540 can refer to the above-mentioned preparation steps S16 to S18 of the battery cell 540, and will not be elaborated here. It should be noted that the preparation steps of the vapor chamber 510, the preparation steps of the battery cell cover plate 530 and the side frame 520, and the preparation steps of the battery cell 540 can be carried out successively or simultaneously, and the present application does not make specific limitations on this.

[0155] Please refer to Figure 29 ,Figure 29 It is a process flow chart for manufacturing the heat pipe 510 in the second method for manufacturing a heat pipe assembly of the present application.

[0156] The manufacturing steps of the heat pipe 510 include steps S11' to S15'.

[0157] Step S11', provide a first cover plate 512 and a second cover plate 513. Among them, the first cover plate 512 and the second cover plate 513 can be formed by a stamping process, or the first cover plate 512 and the second cover plate 513 can be formed by an etching process. At this time, the second cover plate 513 and the side frame 520 can be formed in one step by etching.

[0158] Step S12', arrange a capillary structure 514 on the surface of the second cover plate 513.

[0159] Step S13', install the first cover plate 512 on the second cover plate 513. Among them, the first cover plate 512 and the second cover plate 513 enclose a heat pipe cavity 516, and the capillary structure 514 is located in the heat pipe cavity 516. Exemplarily, the first cover plate 512 can be installed on the second cover plate 513 by welding.

[0160] Step S14', inject water into the heat pipe cavity 516 and evacuate the heat pipe cavity 516.

[0161] Step S15', flatten the seals of the first cover plate 512 and the second cover plate 513.

[0162] Please refer to Figure 30 , Figure 30 It is a process flow chart for combining the heat pipe 510, the side frame 520, the battery cell cover plate 530, and the battery cell 540 in the second method for manufacturing a heat pipe assembly of the present application.

[0163] In this embodiment, step S2 includes step S21' and step S22'.

[0164] Step S21', combine the battery cell 540 with the side frame 520 and the battery cell cover plate 530, as Figure 31 shown. Among them, the positive electrode tab 541 passes through the first through hole 521 of the side frame 520, and the negative electrode tab 542 passes through the second through hole 522 of the side frame 520.

[0165] Step S22', install the heat pipe 510 on the side of the side frame 520 away from the battery cell cover plate 530. Exemplarily, the heat pipe 510 can be installed on the side frame 520 by gluing, welding, or buckling.

[0166] The present application also provides a third method for manufacturing a vapor chamber assembly, which is used to manufacture the vapor chamber assembly 500 in the fifth electronic device 1000 described above. The difference between the method for manufacturing the vapor chamber assembly shown in this embodiment and the first and second methods for manufacturing the vapor chamber assembly is that in step S1, the manufacturing steps of the vapor chamber 510 can refer to the manufacturing steps of the vapor chamber 510 in the second method for manufacturing the vapor chamber assembly described above. In the manufacturing steps of the side frame 520, the side frame 520 can be manufactured by stamping or etching, etc. In the manufacturing steps of the cell cover plate 530, the manufacturing steps of the cell cover plate 530 in the first method for manufacturing the vapor chamber assembly described above can be referred to.

[0167] In this embodiment, the difference between step S2 and step S2 in the first method for manufacturing the vapor chamber assembly described above is that before step 21, step S2 further includes step S20 of combining the vapor chamber 510 and the side frame 520. Specifically, the second cover plate 513 of the vapor chamber 510 is combined with the side frame 520. Among them, the second cover plate 513 and the side frame 520 can be combined by means of adhesives, welding, buckles or screws, etc.

[0168] The present application also provides a fourth method for manufacturing a vapor chamber assembly, which is used to manufacture the vapor chamber assembly 500 in the fifth electronic device 1000 described above. The difference between the method for manufacturing the vapor chamber assembly shown in this embodiment and the first and second methods for manufacturing the vapor chamber assembly is that in step S1, the manufacturing steps of the vapor chamber 510 can refer to the manufacturing steps of the vapor chamber 510 in the second method for manufacturing the vapor chamber assembly described above. In the manufacturing steps of the side frame 520, the side frame 520 can be manufactured by stamping or etching, etc. In the manufacturing steps of the cell cover plate 530, the manufacturing steps of the cell cover plate 530 in the first method for manufacturing the vapor chamber assembly described above can be referred to.

[0169] In this embodiment, the difference between step S2 and step S2 in the second method for manufacturing the vapor chamber assembly described above is that before step 21', step S2 further includes step S20' of combining the side frame 520 and the cell cover plate 530. Among them, the side frame 520 and the cell cover plate 530 can be combined by means of adhesives, welding, buckles or screws, etc.

[0170] In this embodiment, a heat sink 510, a side frame 520, and a battery cell cover plate 530 are used to enclose a receiving cavity 501, and the receiving cavity 501 is used to receive a battery cell 540 and an electrolyte to form a battery of the electronic device 1000. That is, the heat sink 510 can be used as a part of the battery housing in the electronic device 1000, which can reduce the occupancy of the battery housing in the internal space of the electronic device 1000. The heat sink 510 can occupy the space originally occupied by the battery housing, and can reduce the occupancy of the heat sink 510 in the internal space of the electronic device 1000, which helps to achieve the thin and light design of the electronic device 1000. Moreover, due to the sharing of the heat sink 510 and the battery housing, on the premise of the same volume of the electronic device 1000, a larger effective space can be reserved for the heat sink 510, and the volume of the heat sink 510 can be increased to improve the heat dissipation performance of the heat sink 510, which helps to improve the heat dissipation performance of the electronic device 1000 and enhance the thermal experience of the electronic device 1000. Furthermore, since the heat sink 510 is used as the battery housing, compared with the conventional battery housing, the heat sink 510 has high strength, which can not only restrain the volume expansion of the battery cell 540, but also improve the structural strength of the battery, prevent safety problems such as extrusion and puncture of the battery, and effectively improve the reliability of the battery.

[0171] The above description is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, and all of them should be covered by the protection scope of the present application; without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A vapor chamber assembly, characterized in that, It includes a vapor chamber, a side frame, a battery cell cover plate, and a battery cell. The side frame is fixedly connected to the vapor chamber. The battery cell cover plate is fixedly connected to the side of the side frame away from the vapor chamber, and together with the vapor chamber and the side frame, it encloses a receiving cavity, and the battery cell is installed in the receiving cavity.

2. The heat sink assembly according to claim 1, wherein The vapor chamber includes a first cover plate, a second cover plate, and a capillary structure. The second cover plate is installed on the first cover plate, and together with the first cover plate, it encloses a vapor chamber, and the capillary structure is arranged in the vapor chamber; The side frame is fixedly connected to the second cover plate. The battery cell cover plate is fixedly connected to the side of the side frame away from the second cover plate, and together with the second cover plate and the side frame, it encloses the receiving cavity.

3. The heat sink assembly according to claim 2, wherein, The side frame and the second cover plate are integrally formed.

4. The heat pipe assembly according to claim 2 or 3, characterized in that The vapor chamber assembly further includes a first adhesive layer, which is bonded between the side frame and the battery cell cover plate and surrounds the vapor chamber and the battery cell.

5. The heat sink assembly according to claim 2 or 3, characterized in that, The vapor chamber assembly further includes a first welding part, which is fixedly connected between the side frame and the battery cell cover plate, surrounds the vapor chamber and the battery cell, and is spaced from the battery cell.

6. The heat sink assembly according to claim 1 or 2, characterized in that The side frame and the battery cell cover plate are integrally formed.

7. The heat sink assembly according to claim 6, wherein The vapor chamber assembly further includes a second adhesive layer, which is bonded between the side frame and the vapor chamber and surrounds the vapor chamber and the battery cell.

8. The heat sink assembly according to claim 6, wherein, The vapor chamber assembly further includes a second welding part, which is fixedly connected between the side frame and the vapor chamber, surrounds the vapor chamber and the battery cell, and is spaced from the battery cell.

9. The heat sink assembly according to any one of claims 1 to 8, characterized in that, The side frame is provided with a first through hole and a second through hole. Both the first through hole and the second through hole penetrate the side frame along the thickness direction of the side frame and are spaced from each other; The battery cell includes a positive electrode tab and a negative electrode tab. The positive electrode tab passes through the first through hole, and the negative electrode tab passes through the second through hole.

10. The heat pipe assembly according to claim 9, wherein, The vapor chamber assembly further includes a protection circuit board, which is located on one side of the side frame and is electrically connected to the positive electrode tab and the negative electrode tab.

11. An electronic device, characterized in that, It includes a middle frame and the vapor chamber assembly according to any one of claims 1 to 10. The middle frame is provided with a mounting hole, and the mounting hole penetrates the middle frame along the thickness direction of the middle frame. The vapor chamber is installed on the middle frame and covers at least part of the mounting hole, and at least part of the battery cell is received in the mounting hole.

12. The electronic device according to claim 11, wherein The middle frame includes a middle plate and a frame. The middle plate is provided with the mounting hole, and the frame is fixedly connected to the middle plate and surrounds the middle plate; The electronic device further includes a circuit board and a heating device. The circuit board is installed on the side of the middle plate away from the vapor chamber and is electrically connected to the battery cell, and the heating device is installed on the surface of the circuit board facing the middle plate.

13. The electronic device according to claim 12, wherein The middle plate is further provided with an avoidance hole, and the avoidance hole penetrates the middle plate along the thickness direction of the middle plate; The vapor chamber covers at least part of the avoidance hole, and the heating device passes through the avoidance hole and contacts the vapor chamber.

14. The electronic device according to any one of claims 11 to 13, characterized in that, The middle frame is further provided with a first fixing hole, and the side frame is provided with a second fixing hole, the second fixing hole penetrates the frame along the height direction of the frame and is communicated with the first fixing hole; The electronic device further includes a fastener, which is inserted through the first fixing hole and the second fixing hole and fixedly connected to the side frame and the middle frame.

15. A preparation method of a heat pipe assembly, characterized in that, include: Provide heat sink, side frame, cell cover and cell; The heat spreader, the side frame, the cell cover plate and the cell are combined, the heat spreader, the side frame and the cell cover plate are enclosed to form a receiving cavity, and the cell is installed in the receiving cavity.

16. The preparation method of the heat pipe assembly according to claim 15, characterized in that, In the step of providing a vapor chamber, a side frame, a cell cover plate and a cell, the side frame is fixedly connected to the vapor chamber; The step of combining the heat spreader, the side frame, the cell cover plate and the cell comprises: Assembling the battery cell with the heat spreader and the side frame; The cell cover plate is fixedly connected to a side of the side frame away from the heat spreader.

17. The manufacturing method of the heat pipe assembly according to claim 15, characterized in that In the step of providing a heat spreader, a side frame, a cell cover plate and a cell, the side frame is fixedly connected to the cell cover plate; The step of combining the heat spreader, the side frame, the cell cover plate and the cell comprises: Assembling the battery cell with the side frame and the battery cell cover plate; The heat spreader is fixedly connected to a side of the side frame that is away from the battery cell cover plate.

18. The preparation method of the heat pipe assembly according to claim 15, wherein The step of combining the heat spreader, the side frame, the cell cover plate and the cell comprises: The side frame is fixedly connected to the heat sink; Assembling the battery cell with the heat spreader and the side frame; The cell cover plate is fixedly connected to a side of the side frame away from the heat spreader.

19. The preparation method of the heat pipe assembly according to claim 15, characterized in that, The step of combining the heat spreader, the side frame, the cell cover plate and the cell comprises: The side frame is fixedly connected to the battery cell cover plate; Assembling the battery cell with the side frame and the battery cell cover plate; The heat spreader is fixedly connected to a side of the side frame that is away from the battery cell cover plate.

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