Sintered body, electronic device, and sintered body production method

Abstract

The invention relates to the technical field of heat dissipation devices, and provides a sintered body, electronic equipment and a sintered body preparation method.The sintered body comprises a structural body and a cavity unit, and the structural body and the cavity unit are formed in the mode that a plurality of first particles and second particles are mixed, pressed and fixed to form a target body and then heated and sintered to a first state; the plurality of first granules are filled and fixed in a first area of the target body, the second granules are filled and fixed in a second area of the target body, the second area is not overlapped with the first area, and the first area surrounds the second area; the structural body comprises a target entity formed by bonding a plurality of first particles together and a conducted target channel, and the target entity and the target channel can be used for conducting heat; at the adjacent position of the first area and the second area, the target channel is at least partially communicated with the cavity unit, and the target entities are distributed around the cavity unit in the first area. The electronic equipment comprises the sintered body. The sintered body preparation method is used for preparing the sintered body.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation devices, and particularly to a sintered body, an electronic device, and a method for preparing a sintered body. Background Art

[0002] In heat dissipation devices of electronic devices, a sintered body is used to achieve heat dissipation. The sintered body is composed of a porous material to form a tubular body, with one side being an evaporation end and the other side being a condensation end. When one side is heated, the liquid in the tubular body evaporates, and the vapor flows to the other side under a pressure difference and releases heat.

[0003] However, in the sintered body in related technologies, the porosity is relatively small, and small pores will hinder the movement of water vapor, resulting in the inability to further reduce the thermal resistance of the evaporation end. Summary of the Invention

[0004] Embodiments of the present disclosure provide a sintered body, an electronic device, and a method for preparing a sintered body, which are used to solve the problem that in related capillary sintered bodies, the porosity is relatively small and it is difficult to further reduce the thermal resistance of the evaporation end.

[0005] The sintered body provided by the embodiments of the present disclosure includes a structural body and a cavity unit;

[0006] The structural body and the cavity unit are formed by heating and sintering a target body made by mixing and compacting a plurality of first granular materials and a second granular material to a first state,

[0007] wherein, the plurality of first granular materials are filled and fixed in a first region of the target body, the second granular material is filled and fixed in a second region of the target body, the second region does not overlap with the first region, and the first region surrounds the second region;

[0008] In the first state, the plurality of first granular materials are bonded to form the structural body in the first region, and the second granular material is ablated to form the cavity unit in the second region;

[0009] The structural body includes a target entity formed by bonding the plurality of first granular materials together and a target channel that is conductive, and the target entity and the target channel can be respectively used for conducting heat;

[0010] At the adjacent position of the first region and the second region, at least part of the target channel is in communication with the cavity unit, and the target entity is distributed around the cavity unit in the first region.

[0011] In an implementable manner, the sintered body further includes a raised body;

[0012] The second granular material includes a first substance and a second substance;

[0013] The cavity unit is formed after the first material is sintered and ablated in the second region;

[0014] The convex body is formed by sintering the second material in the second granular material in the cavity unit.

[0015] In an implementable embodiment, the convex body includes:

[0016] A first convex portion, one end of which is connected to the inner wall of the cavity unit, and the other end of which protrudes to form a target portion for increasing the surface area of the first convex portion;

[0017] A second convex portion, one end of which is connected to the target portion, and the other end of which extends and protrudes away from the target portion;

[0018] Wherein, the first convex portions protruding in multiple directions can be provided in one convex body;

[0019] The second convex portions protruding in multiple directions can be provided in one target portion

[0020] In addition, the embodiments of the present disclosure further provide an electronic device, and the electronic device includes:

[0021] A device body, in which a heating element is provided;

[0022] A heat dissipation member, which has a sealed cavity inside, one external end of which is thermally connected to the heating element, and the other external end forms a heat dissipation end;

[0023] A sintered body, which is filled and arranged in the sealed cavity;

[0024] An evaporation medium, at least partially filled and arranged in the sealed cavity;

[0025] Wherein, the sintered body includes a structure body and a cavity unit;

[0026] The structure body and the cavity unit are formed by mixing and pressing a plurality of first granular materials and second granular materials to form a target body and then heating and sintering to a first state,

[0027] Wherein, the plurality of first granular materials are filled and fixed in a first region of the target body, the second granular materials are filled and fixed in a second region of the target body, the second region does not overlap with the first region, and the first region surrounds the second region;

[0028] In the first state, the plurality of first granular materials are bonded and the structure body is formed in the first region, and the second granular materials are ablated and the cavity unit is formed in the second region;

[0029] The structure includes a target entity formed by the common bonding of the plurality of first pellets and a conductive target channel, and the target entity and the target channel can be respectively used for heat transfer;

[0030] At the adjacent position of the first region and the second region, the target channel is at least partially in communication with the cavity unit, and the target entity is distributed around the cavity unit in the first region.

[0031] In addition, an embodiment of the present disclosure also provides a method for preparing a sintered body, the method including:

[0032] Mixing and compacting a plurality of first pellets and second pellets to form a target body, and filling and fixing the plurality of first pellets in a first region of the target body, filling and fixing the second pellets in a second region of the target body, the second region not overlapping with the first region, and the first region surrounding the second region;

[0033] Heating and sintering the target body to a first state, and in the first state, the plurality of first pellets are bonded, and a structure is formed in the first region, the second pellets are melted, and a cavity unit is formed in the second region;

[0034] Wherein, the structure includes a target entity formed by the common bonding of the plurality of first pellets and a conductive target channel, and the target entity and the target channel can be respectively used for heat transfer;

[0035] At the adjacent position of the first region and the second region, the target channel is at least partially in communication with the cavity unit, and the target entity is distributed around the cavity unit in the first region.

[0036] In an implementable manner, the mixing and compacting the plurality of first pellets and second pellets to form a target body includes:

[0037] Mixing a first substance and a second substance to form the second pellets;

[0038] Wherein, under the ablation of the second pellets, the first substance disappears from the second region, and the second substance correspondingly forms a convex body located in the cavity unit,

[0039] The convex body can increase the heat exchange area and / or reduce the thermal resistance.

[0040] In an implementable embodiment, in the first state, at least a part of the surface of the first pellet is melted while the interior remains unmelted, the first substance in the second pellet is vaporized and disappears from the cavity unit through the target channel, and the second substance in the second pellet adheres to the target entity at the target position and extends toward the cavity unit to form the raised body.

[0041] The target position is located at the boundary between the first region and the second region.

[0042] In an implementable embodiment, resin and / or toner is used as the first substance in the second pellet;

[0043] Wherein, under the ablation of the second pellet, the resin evaporates and vaporizes from the second region and / or the toner is oxidized and vaporized from the second region to form the cavity unit.

[0044] In an implementable embodiment, a mixture of CuCl2 powder and nano-copper powder is used as the second substance in the second pellet;

[0045] Wherein, under the ablation of the second pellet, the CuCl2 powder undergoes a reduction reaction on the inner wall of the cavity unit to form the first raised part in the raised body, and the nano-copper powder adheres to the first raised part and forms the second raised part in the raised body.

[0046] In an implementable embodiment, making a target body by mixing and compacting a first pellet and a second pellet includes:

[0047] Mixing the first pellet and the second pellet and applying ultrasonic vibration so that there is no longer a gap between two adjacent first pellets that can accommodate another first pellet, and making the second pellets be distributed at substantially the same intervals under ultrasonic resonance.

[0048] In an implementable embodiment, making a target body by mixing and compacting a first pellet and a second pellet includes:

[0049] The selected particle size ratio of the first pellet to the second pellet is between 1:7500 and 1:1600. After mixing and compacting the two to make a target body, the outer surface of the second pellet is fixedly wound with a plurality of adjacent first pellets in sequence.

[0050] In an implementable embodiment, the sintered body preparation method further includes:

[0051] Heating the target body to a second state and then cooling and lowering the temperature of the target body to obtain a sintered body;

[0052] Wherein, in the second state, the interior of the first pellet is in a solid state, and the melted surface area of the first pellet is larger than the melted surface area of the first pellet in the first state.

[0053] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understandable through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] By referring to the accompanying drawings and reading the following detailed description, the above and other objects, features, and advantages of the exemplary embodiments of the present disclosure will become easily understandable. In the drawings, several embodiments of the present disclosure are shown in an exemplary rather than restrictive manner, wherein:

[0055] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0056] Figure 1 A schematic flowchart of a sintered body preparation method provided by an embodiment of the present disclosure is shown;

[0057] Figure 2 A schematic vertical sectional view of a sintered body provided by an embodiment of the present disclosure is shown;

[0058] Figure 3 A partial enlarged schematic view in the vertical section of a sintered body provided by an embodiment of the present disclosure is shown;

[0059] Figure 4 A schematic view of the stacking of a sintered body before sintering provided by an embodiment of the present disclosure is shown;

[0060] Figure 5 A scanning electron microscope micrograph of a sintered body provided by an embodiment of the present disclosure is shown;

[0061] Figure 6 A scanning electron microscope micrograph in a sintered body provided by an embodiment of the present disclosure is shown.

[0062] Description of the reference numerals in the drawings: 101, the first pellet; 102, the second pellet;

[0063] 1, the structure body; 11, the target entity; 12, the target channel;

[0064] 2, the cavity unit;

[0065] 3, the protrusion body; 31, the first protrusion part; 311, the target part; 32, the second protrusion part;

[0066] 4, the support body;

[0067] V, Total volume area; V1, First area; V2, Second area. Detailed implementation mode

[0068] To make the objectives, features, and advantages of the present disclosure more obvious and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present disclosure.

[0069] The embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings.

[0070] Combined with Figure 1 As shown, the embodiment of the present disclosure provides a sintered body, which includes a structure body 1 and a cavity unit 2; the structure body 1 and the cavity unit 2 are formed by heating and sintering to a first state after a target body is made by mixing and compacting a plurality of first granular materials 101 and a second granular material 102. For example, it can be combined with Figure 4 For further detailed description, the first granular material 101 can be but is not limited to a granular material with an average particle size between 20 nm and 50 nm, and the shape can be but is not limited to a cube shape, a polyhedron shape, a sphere shape, an ellipsoid shape, etc. The material can be but is not limited to elemental metals such as copper, aluminum, iron, or alloy materials. In this embodiment, copper powder particles with an average particle size of 25 nm or 35 nm or 45 nm are used as the first granular material 101 for illustrative purposes; the second granular material 102 can be but is not limited to a granular material with an average particle size between 80 μm and 150 μm, and the shape can also be but is not limited to a cube shape, a polyhedron shape, a sphere shape, an ellipsoid shape, etc. The material can be but is not limited to resin, carbon, plastic, etc. In this embodiment, resin particle spheres with an average particle size of 90 μm or 100 μm or 110 μm are used as the second granular material 102 for illustrative purposes. Moreover, when specifically mixing and compacting a plurality of first granular materials 101 and the second granular material 102 to form a target body, the first granular material 101 and the second granular material 102 can be fully stirred and mixed by a mixer, and placed in a container with a fixed volume for fixed-volume compression, so that the first granular material 101 and the second granular material 102 can be mixed and compacted to form a target body with a fixed shape and volume.

[0071] Among them, a plurality of first granular materials 101 are filled and fixed in the first area V1 of the target body, the second granular material 102 is filled and fixed in the second area V2 of the target body, the second area V2 does not overlap with the first area V1, and the first area V1 surrounds the second area V2; for example, it can be combined with Figure 4 For further detailed description, at this time Figure 4The positions occupied by multiple thick solid-line circles in [object] are the second region, denoted as V2. The second granular materials 102 can, but are not limited to, be filled in the positions occupied by each thick solid-line circle in a one-to-one correspondence manner. Figure 4 The positions occupied by multiple thick dashed-line rectangles in [object], minus the positions occupied by the thick solid-line circles, are the first region, denoted as V1. The first granular materials 101 can, but are not limited to, be filled in the fixed first region V1 with the maximum quantity, and the gaps formed between adjacent first granular materials 101 cannot accommodate other first granular materials 101. That is, the first region V1 is composed of two main parts: the entities of multiple first granular materials 101 and the gaps between multiple first granular materials 101. Moreover, the first region denoted as V1 plus the second region denoted as V2 constitutes the total volume region V of the target object.

[0072] In the first state, multiple first granular materials 101 are bonded to form a structure 1 in the first region V1, and the second granular materials 102 are melted to form cavity units 2 in the second region V2. The structure 1 includes a target entity 11 formed by bonding multiple first granular materials 101 together and a conductive target channel 12, and the target entity 11 and the target channel 12 can be respectively used for conducting heat. At the adjacent part between the first region V1 and the second region V2, the target channel 12 is at least partially in communication with the cavity units 2, and the target entity 11 is distributed around the cavity units 2 in the first region V1. For example, it can be combined with Figure 4 For further detailed description, when the target object is heated and sintered to the first state, multiple first granular materials 101 can be bonded to each other, and the bonding method of the first granular materials 101 to each other can be the local material melting and bonding of a certain thickness on the surface of the first granular materials 101. That is, when the target object is heated and sintered to the first state, the heating and sintering temperature at this time can, but is not limited to, just reach the critical melting temperature of the first granular materials 101.

[0073] Moreover, multiple first granular materials 101 can be bonded to each other in the first region V1 to form an integral structure 1. For example, it can be combined with Figure 2 For further detailed description, multiple first granular materials 101 are bonded to each other in the first region V1 to form an integral structure 1, which can enable heat conduction between any two first granular materials 101. That is, the heat conduction of this structure 1 has coherence. If multiple first granular materials 101 do not form an integral structure through interaction in the first region V1, then there will be "void positions" left between structures, and the "void positions" will affect the heat conduction effect between structures, and instead increase the thermal resistance of multiple first granular materials 101 in the first region V1.

[0074] In addition, the structure 1 not only includes the target entity 11 formed by the bonding of multiple first pellets 101, but also includes the target channels 12 formed by the filling gaps between the multiple first pellets 101 and being conductive. Since the initial filling gaps between the multiple first pellets 101 are staggered and conductive with each other, the formed target channels 12 as a whole are also staggered and conductive with each other. However, the actual heat transfer direction of the target channels 12 can be adapted to the conduction direction of the target channels 12. For example, when the sintered body transfers heat from Figure 2 the lowermost side in Figure 2 to the uppermost side in, although the target channels 12 include channel segments from bottom to top, obliquely upward channel segments, horizontal channel segments, etc., the gas formed by the vaporization of the heat-conducting liquid will diffuse from the "heat source side" to the "heat dissipation side" under the action of air pressure. In this way, when the gas diffuses, it is convenient to gradually fill and diffuse along the target channels 12. That is, the diffusion direction of the gas is the actual heat transfer direction of the target channels 12 and also the conduction direction of the target channels 12.

[0075] In addition, when the target body is heated and sintered to the first state, the second pellets 102 are melted and a cavity unit 2 is formed in the second region V2. At this time, the temperature for heating and sintering to the first state can be but is not limited to reaching the vaporization temperature of the second pellets 102. In this way, the second pellets 102 can be melted from the second region V2 by vaporization and discharged through the target channels 12, and the space originally occupied by the second pellets 102 correspondingly forms the cavity unit 2. By setting the second pellets 102 and melting them to form the cavity unit 2, the porosity of the sintered body can be greatly increased, and the thermal resistance of the evaporation end of the sintered body can be effectively improved.

[0076] Moreover, at the adjacent position of the first region V1 and the second region V2, the target channels 12 are at least partially conductive with the cavity unit 2. In this way, the gas flowing through the target channels 12 can enter the cavity unit 2 more quickly and condense and flow back better in the cavity unit 2 according to the "Bernoulli principle", further improving the heat conduction efficiency of the sintered body at the cavity unit 2; and the target entity 11 is distributed around the cavity unit 2 along the boundary of the first region V1, which can avoid the cavity unit 2 affecting the continuous extensibility of the target entity 11 and enable the target entity 11 to conduct heat continuously.

[0077] Moreover, the above-mentioned target entity 11 can be but not limited to being set as a capillary structure, so that the target entity 11 can continuously "suck" and guide the heat-conducting liquid through "capillary effect"; the above-mentioned target channel 12 can also be but not limited to a capillary channel, and the target channel 12 can guide and condense the gas formed by evaporation of the heat-conducting liquid, and can also make the liquid formed after the heat-conducting gas is condensed to adhere to the outer surface of the target entity 11 again, so that the target entity 11 and the target channel 12 can respectively realize the function of conducting heat.

[0078] In summary, the sintered body provided by the embodiment of the present disclosure is prepared by heating and sintering the target body to the first state, which not only forms the target entity 11 and the target channel 12 in the structure 1 in the first region V1, but also enables the second granular material 102 in the second region V2 to be correspondingly ablated to form a cavity unit 2, and the cavity unit 2 can greatly increase the porosity of the sintered body and effectively improve the thermal resistance of the sintered body; and the target channel 12 is connected to the cavity unit 2, which can also improve the flow velocity of the gas in the target channel 12 and improve the thermal conductivity according to the "Bernoulli principle"; the target entity 11 is distributed around the cavity unit 2 along the boundary of the first region V1, which avoids the cavity unit 2 affecting the continuous extensibility of the target entity 11, and does not affect the "capillary suction effect" of the target entity 11 on the thermal fluid. The sintered body can increase its own porosity and improve its own thermal resistance.

[0079] In addition, it is worth noting that the target entity 11 and the target channel 12 can be arranged to be interlaced with each other and together constitute the structure 1.

[0080] For example, combined with Figure 2 and Figure 3 To further explain in detail, the target entity 11 and the target channel 12 may be interlaced by, but not limited to, Figure 2 Each target channel 12 is located between two target entities 11, and each target entity 11 is located between two target channels 12. That is, any target entity 11 can have at least two target channels 12 sandwiching it outside, or any target channel 12 can have at least two target entities 11 sandwiching it outside, which can be understood as the above-mentioned target entities 11 and target channels 12 being staggered.

[0081] The specific arrangement of the target entity 11 and the target channel 12 can make the target entity 11 and the target channel 12 more evenly and staggeredly distributed in the structure 1, so that the target entity 11 in the structure 1 can form a more densely distributed capillary structure, which can better "suction" and guide the heat-conducting liquid through the "capillary effect"; the staggered arrangement of the target channel 12 and the target entity 11 can also increase the maximum contact area between the target channel 12 and the target entity 11, so that the heat-conducting gas in the target channel 12 can be attached to the outer surface of the target entity 11 more quickly after thermal condensation, further improving the structure 1's guiding performance for the heat-conducting liquid and the heat-conducting gas.

[0082] It can be understood that the present application does not specifically limit the relative setting manner of the target entity 11 and the target channel 12, that is, those skilled in the art can adjust their types according to actual conditions. The above situation is only an illustrative explanation of the ways in which the target part in the present application can be implemented, but is not limited to the situations recorded in the above embodiments.

[0083] In one embodiment, the sintered body may further include a protrusion 3; the second particulate material 102 may include a first substance and a second substance; the cavity unit 2 may be formed by sintering and ablating the first substance in the second area V2; the protrusion 3 may be formed in the cavity unit 2 by sintering the second substance in the second particulate material 102.

[0084] For example, combined with Figure 3 and Figure 5 As further described in detail, the second particulate material 102 can be prepared by mixing the first substance with the second substance, and when preparing the second particulate material 102, the first substance can be first heated to a liquid state, and then the powdered second substance can be mixed and added to the liquid first substance and stirred sufficiently so that the liquid first substance can be fully coated on the outer surface of the powdered second substance, and then the mixture of the two can be sprayed out by atomization and condensed to obtain the solid granular second particulate material 102.

[0085] Furthermore, when the target body is heated and sintered to the first state and the second particulate material 102 is correspondingly melted, the first substance wrapped around the outer surface of the second substance can disappear from the second region V2 by vaporization, and when the first substance vaporizes, the internal pressure of the second region V2 will be temporarily increased, so that the second substance can be correspondingly attached to the inner wall of the cavity unit 2 under the action of gas pressure, and correspondingly form a protrusion 3 that increases the heat exchange area and / or reduces thermal resistance.

[0086] The second pellet 102 is made of two different materials. While ensuring that the second pellet 102 can be gasified and ablated, a raised body 3 can be correspondingly formed in the cavity unit 2 formed by its gasification and ablation, thereby further increasing the heat exchange area inside the cavity unit 2 and reducing the internal thermal resistance of the cavity unit 2.

[0087] It can be understood that the present application does not specifically limit the setting method of the raised body 3, that is, those skilled in the art can set and adjust its type according to the actual situation. The above situation is only an exemplary description of how the target part in the present application can be realized, but is not limited to the situations described in the above embodiments.

[0088] In an implementable manner, the embodiments of the present disclosure also provide another sintered body. The sintered body includes a structural body and a cavity unit 2. The structural body and the cavity unit 2 can be formed by heating and sintering a target body made by mixing and pressing a plurality of first pellets 101 and a second pellet 102 to a first state. Among them, a plurality of first pellets 101 can be filled and fixed in the first region V1 of the target body, and the second pellet 102 can be filled and fixed in the second region V2 of the target body. The second region V2 does not overlap with the first region V1, and the first region V1 surrounds the second region V2; in the first state, a plurality of first pellets 101 are bonded, and a plurality of structural bodies are formed in at least part of the first region V1. In this example, the plurality of structural bodies are not formed by bonding a plurality of first pellets together, but by bonding some of the first pellets among the plurality of first pellets to form a plurality of structural bodies. The structural body can include a target entity 11 and a conductive target channel 12. The second pellet 102 is ablated, and a cavity unit 2 is formed in the second region V2; and the target entity 11 and the target channel 12 can be respectively used to conduct heat; at the adjacent part of the first region V1 and the second region V2, the target channel 12 can be at least partially in communication with the cavity unit 2, and the target entity 11 is distributed around the cavity unit 2 in the first region V1; the sintered body can also include a raised body 3; the second pellet 102 includes a first substance and a second substance; the cavity unit 2 is formed after the first substance is sintered and ablated in the second region V2; the raised body 3 is formed by sintering the second substance in the second pellet 102 in the cavity unit 2.

[0089] In addition, it is worth noting that a plurality of raised bodies 3 can also be randomly or uniformly distributed on the inner wall of the cavity unit 2.

[0090] For example, in combination with Figure 3 and Figure 5To further explain in detail, the power for the protrusion 3 to attach and form on the inner wall of the cavity unit 2 is provided by the gas pressure of the first substance in the second particulate material 102, which can be sintered, gasified and ablated in the second area V2. When the second substance in the second particulate material 102 is randomly or uniformly distributed in the first substance, the second substance in the second particulate material 102 can be randomly or uniformly attached to the inner wall of the cavity unit 2 under the action of the gas pressure, so that the protrusion 3 can be randomly or uniformly formed on the inner wall of the cavity unit 2.

[0091] It is understandable that the present application does not specifically limit the arrangement of the protrusion 3 on the inner wall of the cavity unit 2, that is, those skilled in the art can adjust its type according to actual conditions. The above situation is only an illustrative explanation of the ways in which the target part in the present application can be realized, but is not limited to the situations described in the above embodiments.

[0092] In one embodiment, the protrusion 3 includes a first protrusion 31 and a second protrusion 32; one end of the first protrusion 31 is connected to the inner wall of the cavity unit 2, and the other end is protruded to form a target portion 311 for increasing the surface area of ​​the first protrusion 31; one end of the second protrusion 32 is connected to the target portion 311, and the other end is extended and protruded away from the target portion 311; wherein, a first protrusion 31 protruding along multiple directions can be provided in a protrusion body 3; and a second protrusion 32 protruding along multiple directions can be provided in a target portion 311.

[0093] For example, combined with Figure 3 and Figure 5 To further explain in detail, the protrusion 3 is configured to include a first protrusion 31 and a second protrusion 32, and one end of the first protrusion 31 is connected to the inner wall of the cavity unit 2, and the other end protrudes to form a target portion 311, so that the first protrusion 31 can be formed by the first part of the second substance, and the first part of the second substance can adopt micron (um) level granular material, for example, CuCl2 powder with a particle size of 1um. During the high-temperature sintering process, the CuCl2 powder will undergo a reduction reaction with H2 to form a micron-level copper element, and the copper element can be continuously accumulated in the inner wall of the cavity unit 2 to form the above-mentioned first protrusion 31.

[0094] In addition, one end of the second convex portion 32 is connected to the target portion 311, and the other end extends away from the target portion 311 in a convex manner. In this way, the second convex portion 32 can be formed by the second part of the second material, and the second part of the second material can use particulate materials at the nanometer (nm) level. For example, copper powder with a particle size of 50 nm. After the first convex portion 31 is generated through a reduction reaction, the nanometer-level copper powder particles can continue to accumulate and form in the target portion 311 of the first convex portion 31 to form the second convex portion 32. The second convex portion 32 and the first convex portion 31 can jointly form a structure similar to a secondary tree branch structure, thereby being able to further increase the outer surface area of the convex body 3, further improve the heat exchange area inside the cavity unit 2, and reduce the internal thermal resistance of the cavity unit 2.

[0095] In addition, it is worth noting that the sintered body may further include a support body 4; the support body 4 may be inserted into the structure body 1 along the heat conduction direction.

[0096] For example, in combination Figure 2 For further detailed description, the support body 4 may be, but is not limited to, set as a metal pillar, and a plurality of them may be arranged through the sintered body along the heat conduction direction. For example Figure 2 the support body 4 in [reference] is inserted correspondingly along the thickness direction of the structure body 1, that is, the thickness direction of the structure body 1 is the heat conduction direction.

[0097] Setting the above support body 4 can, on the one hand, improve the overall structural strength of the structure body 1, and on the other hand, the support body 4 can also be used for supporting connection with the outer shell wrapping member to prevent the outer shell wrapping member from squeezing and damaging the structure body 1.

[0098] It can be understood that the present application does not specifically limit the setting manner of the support body 4, that is, those skilled in the art can set and adjust its type according to the actual situation. The above situation is only an exemplary description of how the target part in the present application can be implemented, but is not limited to the situations described in the above embodiments.

[0099] In addition, the embodiments of the present disclosure further provide a heat dissipation member, which includes a housing, a sintered body, and an evaporation medium; the interior of the housing has a sealed cavity; the sintered body is filled in the sealed cavity; the evaporation medium is at least partially filled in the sealed cavity;

[0100] Wherein, the sintered body includes a structure body 1 and a cavity unit 2; the structure body 1 and the cavity unit 2 are formed by heating and sintering a target body made by mixing and pressing a plurality of first particulate materials 101 and second particulate materials 102 to a first state. A plurality of first particulate materials 101 are filled and fixed in a first region V1 of the target body, and the second particulate materials 102 are filled and fixed in a second region V2 of the target body. The second region V2 does not overlap with the first region V1, and the first region V1 surrounds the second region V2;

[0101] In the first state, a plurality of first pellets 101 are bonded to form a structure 1 in a first region V1, and a second pellet 102 is melted to form a cavity unit 2 in a second region V2; the structure 1 includes a target entity 11 formed by bonding a plurality of first pellets 101 together and a conductive target channel 12, and the target entity 11 and the target channel 12 can be respectively used for conducting heat; at the adjacent position between the first region V1 and the second region V2, the target channel 12 is at least partially in communication with the cavity unit 2, and the target entity 11 is distributed around the cavity unit 2 in the first region V1.

[0102] The heat dissipation component provided by the embodiment of the present disclosure can be, but is not limited to, a heat dissipation vapor chamber, a heat dissipation pipe, etc. The housing of the heat dissipation component has a sealed cavity inside, and the sintered body and the evaporation medium are respectively arranged in the sealed cavity. The evaporation medium can be, but is not limited to, distilled water, alcohol, etc. In this way, the structure 1 in the sintered body can suck and evaporate the evaporation medium through "capillary action", and the target channel 12 and the cavity unit 2 in the sintered body can conduct and condense the gas after the evaporation medium is evaporated, so as to realize the function of heat conduction and heat dissipation.

[0103] The heat dissipation component provided by the embodiment of the present disclosure includes the sintered body provided by the above embodiment of the present disclosure, and can also achieve all the beneficial effects of the above sintered body, which will not be elaborated herein additionally.

[0104] In addition, the embodiment of the present disclosure also provides an electronic device, which includes a device body, a heat dissipation component, a sintered body and an evaporation medium; a heating element is provided in the device body; the interior of the heat dissipation component has a sealed cavity, one external end is thermally connected to the heating element, and the other external end forms a heat dissipation end; the sintered body is filled and arranged in the sealed cavity; the evaporation medium is at least partially filled and arranged in the sealed cavity;

[0105] Wherein, the sintered body includes a structure 1 and a cavity unit 2; the structure 1 and the cavity unit 2 are formed by mixing and pressing a plurality of first pellets 101 and second pellets 102 into a target body and then heating and sintering to the first state. A plurality of first pellets 101 are filled and fixed in a first region V1 of the target body, and second pellets 102 are filled and fixed in a second region V2 of the target body. The second region V2 does not overlap with the first region V1, and the first region V1 surrounds the second region V2;

[0106] In the first state, a plurality of first pellets 101 are bonded to form a structure 1 in a first region V1, and a second pellet 102 is melted to form a cavity unit 2 in a second region V2;

[0107] The structure 1 includes a target entity 11 formed by the common bonding of a plurality of first pellets 101 and a conductive target channel 12, and the target entity 11 and the target channel 12 can be respectively used for conducting heat; at the adjacent position of the first region V1 and the second region V2, the target channel 12 is at least partially in communication with the cavity unit 2, and the target entity 11 is distributed around the cavity unit 2 in the first region V1.

[0108] The electronic device provided by the embodiment of the present disclosure may be, but is not limited to, a notebook computer, a tablet computer, a desktop computer, etc. The electronic device includes a device body and the above heat dissipation member, wherein the device body has a heating element, one end of the heat dissipation member is thermally connected to the heating element, and the other end forms a heat dissipation end, so that the heat generated in the heating element can be conducted and dissipated through the heat dissipation member.

[0109] The electronic device provided by the embodiment of the present disclosure includes the sintered body provided by the above embodiment of the present disclosure, and can also achieve all the beneficial effects of the above sintered body, which will not be described in detail here.

[0110] In addition, the embodiment of the present disclosure also provides a method for preparing a sintered body, which includes:

[0111] Step S1 - Mix and compress a plurality of first pellets 101 and second pellets 102 to form a target body, and fill and fix the plurality of first pellets 101 in the first region V1 of the target body, and fill and fix the second pellets 102 in the second region V2 of the target body. The second region V2 does not overlap with the first region V1, and the first region V1 surrounds the second region V2;

[0112] For example, in combination with Figure 4 For further detailed description, the first pellet 101 may be, but is not limited to, copper powder particles, aluminum powder particles or other single metal particles with an average particle size in the range of 20 nm to 50 nm. For example, copper powder particles with an average particle size of 30 nm, 35 nm or 40 nm may be used. The second pellet 102 may be, but is not limited to, resin particles or carbon powder particles with an average particle size in the range of 80 μm to 150 μm. For example, resin particles with an average particle size of 90 μm, 110 μm or 130 μm may be used.

[0113] In step S1, the total volume region of the target body formed by mixing and compacting multiple first pellets 101 and second pellets 102 can be denoted as V, the second region occupied by the filling of the second pellets 102 is denoted as V2, and the remaining volume region after subtracting the second region V2 from the total volume region V of the target body is the first region V1. Multiple first pellets 101 can, but are not limited to, filling and fixing the first region V1 with the maximum quantity, and the gaps formed between two adjacent first pellets 101 can no longer accommodate other first pellets 101. That is, the first region V1 is composed of two main parts: the entities of multiple first pellets 101 and the gaps between multiple first pellets 101.

[0114] Step S2 - Heat and sinter the target body to the first state. In the first state, multiple first pellets 101 are bonded to form a structure 1 in the first region V1, and the second pellets 102 are melted away to form cavity units 2 in the second region V2.

[0115] Among them, the structure 1 includes a target entity 11 formed by the common bonding of multiple first pellets 101 and a conductive target channel 12, and the target entity 11 and the target channel 12 can be respectively used to conduct heat; at the adjacent part of the first region V1 and the second region V2, the target channel 12 is at least partially conductive to the cavity unit 2, and the target entity 11 is distributed around the cavity unit 2 in the first region V1.

[0116] For example, in combination with Figure 3 and further detailed description, when the target body is heated and sintered to the first state, multiple first pellets 101 can be bonded to each other, and the way of bonding between the first pellets 101 can be through the local melting and bonding of the surfaces of the first pellets 101. That is, when the target body is heated and sintered to the first state, the heating and sintering temperature at this time can, but is not limited to, just reach the critical melting temperature of the first pellets 101.

[0117] Moreover, multiple first pellets 101 can be bonded to each other in the first region V1 to form an integral structure 1. The structure 1 not only includes the target entity 11 formed by the common bonding of multiple first pellets 101, but also includes a conductive target channel 12 formed by the filling gaps between multiple first pellets 101. In this way, the target entity 11 can "suction" and guide the heat-conducting liquid through "capillary action", and the target channel 12 can correspondingly conduct, condense, and reflux the gas formed by the evaporation of the heat-conducting liquid, so that the target entity 11 and the target channel 12 can respectively realize the function of conducting heat.

[0118] In addition, when the target body is heated and sintered to the first state, the second particulate material 102 melts and a cavity unit 2 is formed in the second region V2. At this time, the temperature for heating and sintering to the first state can be, but is not limited to, the vaporization temperature of the second particulate material 102. In this way, the second particulate material 102 can melt from the second region V2 by vaporization and being discharged through the target channel 12, and the space originally occupied by the second particulate material 102 correspondingly forms the cavity unit 2.

[0119] Moreover, at the adjacent position of the first region V1 and the second region V2, the target channel 12 is at least partially in communication with the cavity unit 2. In this way, the gas diverted by the target channel 12 can enter the cavity unit 2 more quickly according to the "Bernoulli principle" and better condense and flow back in the cavity unit 2; the target entity 11 is distributed around the cavity unit 2 along the boundary of the first region V1. In this way, it can be avoided that the cavity unit 2 affects the continuous extensibility of the target entity 11, so that the target entity 11 can still continuously "suction" and guide the heat-conducting liquid through the "capillary effect".

[0120] In summary, for the sintered body preparation method provided by the embodiments of the present disclosure, the sintered body prepared after heating and sintering the target body to the first state not only forms fine pores 12 in the structure body 1 in the first region V1, but also enables the second particulate material 102 in the second region V2 to correspondingly melt and form the cavity unit 2, thereby greatly increasing the porosity of the sintered body and effectively improving the thermal resistance of the sintered body. Moreover, by providing the target channel 12 in communication with the cavity unit 2, the diversion speed of the gas in the target channel 12 can also be improved according to the "Bernoulli principle"; the target entity 11 is distributed around the cavity unit 2 along the boundary of the first region V1, avoiding the cavity unit 2 from affecting the continuous extensibility of the target entity 11 and not affecting the "capillary suction effect" of the target entity 11 on the heat-conducting liquid. This sintered body preparation method has the beneficial effects of simple operation steps, and the prepared sintered body can greatly increase the porosity of the sintered body and effectively improve the thermal resistance of the sintered body.

[0121] In an implementable manner, a plurality of first particulate materials 101 and the second particulate material 102 are mixed and solidified to form a target body, including:

[0122] Step S0 - mixing a first substance and a second substance and forming the second particulate material 102;

[0123] Wherein, under the melting action of the second particulate material 102, the first substance disappears from the second region V2, and the second substance correspondingly forms a protrusion 3 located in the cavity unit 2, and the protrusion 3 can increase the heat exchange area and / or reduce the thermal resistance.

[0124] For example, in combination with Figure 3 and Figure 6For a more detailed description, when mixing the first substance and the second substance, the first substance can be heated to a liquid state first, and then the powdered second substance can be mixed and added to the liquid first substance and stirred thoroughly, so that the liquid first substance can fully wrap around the outer surface of the powdered second substance. Then, by atomizing and condensing the mixture of the two, solid granular second pellets 102 can be obtained.

[0125] Moreover, when the target body is heated and sintered to the first state and the second pellets 102 correspondingly melt, the first substance wrapped around the outer surface of the second substance can disappear from the second region V2 in a vaporized manner, and when the first substance vaporizes, it will briefly increase the internal pressure of the second region V2, so that the second substance can correspondingly adhere to the inner wall of the cavity unit 2 under the action of air pressure and correspondingly form protrusions 3 that increase the heat transfer area and / or reduce the thermal resistance.

[0126] Through the above step S0, when preparing the second pellets 102, two different materials are used. While ensuring that the second pellets 102 can be vaporized and melted, protrusions 3 can also be correspondingly formed in the cavity unit 2 formed by their vaporization and melting, thereby further increasing the heat transfer area inside the cavity unit 2 and reducing the internal thermal resistance of the cavity unit 2.

[0127] In addition, the embodiment of the present disclosure also provides another method for preparing a sintered body, which includes:

[0128] Step S110 - Mix the first substance and the second substance and make them into second pellets 102;

[0129] Step S111 - Mix and compress a plurality of first pellets 101 and the second pellets 102 to make a target body, and make the plurality of first pellets 101 fill and fix in the first region V1 of the target body, and the second pellets 102 fill and fix in the second region V2 of the target body. The second region V2 does not overlap with the first region V1, and the first region V1 surrounds the second region V2;

[0130] Step S112 - Heat and sinter the target body to the first state, and in the first state, the plurality of first pellets 101 bond and form a plurality of structures in the first region V1, and the second pellets 102 melt and form a cavity unit 2 in the second region V2;

[0131] Wherein, the structure includes a target entity 11 and a conductive target channel 12, and the target entity 11 and the target channel 12 can be respectively used for conducting heat; at the adjacent position of the first region V1 and the second region V2, the target channel 12 is at least partially conductive to the cavity unit 2, and the target entity 11 is distributed around the cavity unit 2 in the first region V1.

[0132] Under the ablation of the second pellet 102, the first substance disappears from the second region V2, and the second substance correspondingly forms the protrusion 3 located in the cavity unit 2, and the protrusion 3 can increase the heat exchange area and / or reduce the thermal resistance.

[0133] In an implementable embodiment, in the first state, at least a part of the surface of the first pellet 101 melts and the inside does not melt, the first substance in the second pellet 102 vaporizes and disappears from the cavity unit 2 through the target channel 12, and the second substance in the second pellet 102 adheres to the target entity 11 at the target position and extends toward the cavity unit 2 to form the protrusion 3, and the target position is located at the boundary between the first region V1 and the second region V2.

[0134] For example, when the first pellet 101 is copper powder particles and the second pellet 102 is "resin shell + solid particles", when the target body is heated and sintered to the first state, the heating and sintering temperature at this time can be but is not limited to 200 °C, and this temperature can cause a certain thickness in the surface layer of the copper powder particles to be slightly melted, but the inside of the copper powder particles as a whole still remains solid and does not melt. In this way, every two adjacent copper powder particles will bond and finally form the target entity 11, and because the overall shape of the inside of the copper powder particles remains, the gaps between adjacent copper powder particles when stacked will not be completely filled by the copper material melted on the surface layer. After a small part of the gaps between adjacent copper powder particles are filled by the melted copper material, the target channel 12 can be correspondingly formed; the resin shell in the second pellet 102 can vaporize and escape through the target channel 12 at 200 °C and form in the cavity unit 2, and the solid particles in the second pellet 102 can react under the action of high temperature and high pressure at 200 °C, adhere to the target entity 11 at the boundary of the second region V2, and extend toward the cavity unit 2 to form the protrusion 3.

[0135] The above-defined setting method of the first pellet 101 and the second pellet 102 can ensure that the target body is heated and sintered to the first state to correspondingly form the target entity 11, the target channel 12, the cavity unit 2 and the protrusion 3.

[0136] In an implementable embodiment, resin and / or carbon powder is used as the first substance in the second pellet 102; wherein, under the ablation of the second pellet 102, the resin evaporates and vaporizes from the second region V2, and / or the carbon powder oxidizes and vaporizes from the second region V2 to form the cavity unit 2.

[0137] When resin is used as the first substance in the second pellet 102, the heating and sintering temperature in the first state can be but is not limited to be set at 200 °C, so that the resin in the second pellet 102 can be ablated by means of heat-induced vaporization. That is, at this time, the first substance in the second pellet 102 undergoes vaporization ablation through a physical change.

[0138] When carbon powder is used as the first substance in the second particulate material 102, the heating and sintering temperature in the first state can also be but not limited to being set at 200°C, so that the carbon powder in the second particulate material 102 can be ablated by reacting with oxygen in the air under heat to produce carbon dioxide gas, that is, the first substance in the second particulate material 102 is gasified and ablated through chemical changes.

[0139] It can be understood that the present application does not specifically limit the setting method of the first substance in the second granular material 102, nor does it specifically limit the specific ablation method of the first substance, that is, those skilled in the art can adjust the type according to actual conditions. The above situation is only an illustrative explanation of the ways in which the target part in the present application can be achieved, but is not limited to the situations described in the above embodiments.

[0140] In one possible implementation manner, CuCl2 powder and nano-copper powder are mixed as the second substance in the second particulate material 102; wherein, under the ablation effect of the second particulate material 102, the CuCl2 powder undergoes a reduction reaction on the inner wall of the cavity unit 2 to form a first protrusion 31 in the protrusion 3, and the nano-copper powder adheres to the first protrusion 31 and forms a second protrusion 32 in the protrusion 3.

[0141] For example, CuCl2 powder and nano-copper powder can be mixed in a certain ratio and used as the second substance in the second particle material 102. In this way, when the first substance in the second particle material 102 produces high-pressure gas ablation at high temperature, the CuCl2 powder will undergo a reduction reaction with H2 during the high-temperature sintering process to form a copper element. The copper element can be continuously accumulated on the inner wall of the cavity unit 2 to form the above-mentioned first protrusion 31. At the same time, the nano-copper powder will adhere to the surface of the first protrusion 31 to form a second protrusion 32.

[0142] Moreover, the first protrusion 31 and the second protrusion 32 can form a two-level tree-like structure, and the first protrusion 31 can be specifically set to a micrometer (um) level size, and the second protrusion 32 can be specifically set to a nanometer (nm) level size.

[0143] Of course, the second substance in the second particle material 102 may also be other substances, or single-component CuCl2 powder or single-component nano copper powder, as long as it can adhere to the inner wall of the cavity unit 2 under high temperature and high pressure to form a convex structure.

[0144] In one embodiment, the first granular material 101 and the second granular material 102 are mixed and compacted to form a target body, including:

[0145] Mix the first particulate material 101 with the second particulate material 102 and apply ultrasonic vibration so that there is no longer a gap between two adjacent first particulate materials 101 that can accommodate another first particulate material 101, and the second particulate material 102 is distributed at substantially the same intervals under ultrasonic resonance.

[0146] During the mixing process of the first particulate material 101 and the second particulate material 102, ultrasonic vibration is applied. On the one hand, the vibration effect of the ultrasonic wave can fully compact the first particulate material 101 and the second particulate material 102 to ensure that the gap between the first particulate materials 101 can no longer accommodate other first particulate materials 101; on the other hand, a specific frequency of ultrasonic wave can be correspondingly selected according to the size of the second particulate material 102, so that the ultrasonic wave can resonate with the second particulate material 102 and diffuse in a specific direction and specific shape, so that the second particulate material 102 can be distributed in the target body at substantially the same intervals.

[0147] Of course, ultrasonic waves that do not resonate with the frequency of the second particulate material 102 can also be used. In this way, the ultrasonic vibration only compacts the first particulate material 101 and the second particulate material 102, and the second particulate material 102 can be randomly distributed in the target body.

[0148] In an implementable embodiment, mixing and consolidating the first particulate material 101 and the second particulate material 102 to form a target body includes:

[0149] The particle size ratio of the selected first particulate material 101 to the second particulate material 102 is between 1:7500 and 1:1600. For example, the particle size ratio of the first particulate material 101 to the second particulate material 102 can specifically be 1:7000 or 1:45000 or 1:3000 or 1:1000, etc. After mixing and consolidating the two to form a target body, a plurality of adjacent first particulate materials 101 are fixedly wound around the outer surface of the second particulate material 102.

[0150] For example, in combination with Figure 4 For further detailed description, the first particulate material 101 can be but is not limited to copper powder particles or other metal particles with a particle size range of 20 nm to 50 nm, and the second particulate material 102 can be but is not limited to resin particles or carbon powder particles with a particle size range of 80 μm to 150 μm, etc., so that the particle size ratio of the first particulate material 101 to the second particulate material 102 can be correspondingly controlled between 1:7500 and 1:1600.

[0151] In addition, after the first pellets 101 and the second pellets 102 are mixed and consolidated to form a target body, multiple first pellets 101 can be wound around the outer periphery of the second pellet 102 in a manner of mutual support and abutment. And when the target body is in the first state of heating and sintering, the second pellet 102 vaporizes and melts to correspondingly form a cavity unit 2. However, at the same time, the surfaces of the first pellets 101 slightly melt and bond to each other. Therefore, multiple first pellets 101 will bond to each other to form a partial target entity 11 closely wound around the outer periphery of the cavity unit 2, and there will be no problem that the first pellets 101 collapse into the cavity unit 2.

[0152] In an implementable embodiment, the sintered body preparation method further includes:

[0153] Step S3 - heating and sintering the target body to a second state, and then cooling and lowering the temperature of the target body to obtain a sintered body;

[0154] Wherein, in the second state, the inside of the first pellet 101 is in a solid state, and the melted surface area of the first pellet 101 is larger than the melted surface area of the first pellet 101 in the first state.

[0155] For example, in Figure 1 For further detailed description, in this step S3, the target body is heated and sintered to the second state. The temperature for heating and sintering to the second state can be higher than the temperature in the first state. And at this temperature, the surface layer of the first pellet 101 can be further deeply melted, so that the melted surface area of the first pellet 101 is larger than the melted surface area of the first pellet 101 in the first state. In this way, the first pellets 101 in the target entity 11 obtained in the first state can be further bonded. However, the gaps when adjacent copper powder particles are stacked will not be completely filled by the copper material further melted on the surface layer, so as to ensure that the target channel 12 can still exist normally.

[0156] The first pellet 101 further melts in the second state. More melted surface materials can increase the contact area between two adjacent first pellets 101. And the melted surface materials can further improve the structural stability of the target entity 11 after cooling and lowering the temperature, so that the target entity 11 can finally obtain a sintered body with the required structural strength after cooling and lowering the temperature.

[0157] For example, when the first pellet 101 is set as copper powder particles, the sintering temperature in the first state can be set at 200°C, and the sintering temperature in the second state can be set at 900°C. In this way, it can be ensured that the surface of the copper powder particles in the second state will be further melted, but the inside of the copper powder particles is still in a solid state, ensuring that the target entity 11 obtained in the first state will not be burned and melted, and the target channel 12 will not be completely filled.

[0158] References to "embodiments" in this specification mean that a particular feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive of other embodiments. Those skilled in the art will understand explicitly and implicitly that the embodiments described herein can be combined with other embodiments.

[0159] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, "a plurality of" means two or more unless otherwise specifically defined.

[0160] As described above, the above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present disclosure and should be covered by the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A sintered body, comprising: a structure body and a cavity unit, which are formed by heating and sintering a target body made by mixing and compacting a plurality of first granular materials and a second granular material to a first state; wherein, the plurality of first granular materials are filled and fixed in a first region of the target body, the second granular material is filled and fixed in a second region of the target body, the second region does not overlap with the first region, and the first region surrounds the second region; in the first state, the plurality of first granular materials are bonded to form the structure body in the first region, and the second granular material is ablated to form the cavity unit in the second region; the structure body includes a target entity formed by bonding the plurality of first granular materials together and a conductive target channel, and the target entity and the target channel can be respectively used for conducting heat; at an adjacent position between the first region and the second region, the target channel is at least partially in communication with the cavity unit, and the target entity is distributed around the cavity unit in the first region.

2. The sintered body according to claim 1, further comprising a protrusion; the second granular material includes a first substance and a second substance; the cavity unit is formed after the first substance in the second region is sintered and ablated; the protrusion is formed by sintering the second substance in the second granular material in the cavity unit.

3. The sintered body according to claim 2, wherein the protrusion includes: a first protrusion portion, one end of which is connected to the inner wall of the cavity unit, and the other end protrudes to form a target portion for increasing the surface area of the first protrusion portion; a second protrusion portion, one end of which is connected to the target portion, and the other end extends and protrudes away from the target portion; wherein, the first protrusion portion that can protrude in multiple directions can be provided in one protrusion body; the second protrusion portion that can protrude in multiple directions can be provided in one target portion.

4. An electronic device, comprising: a device body, in which there is a heating element; a heat dissipation member, which has a sealed cavity inside, one external end is thermally connected to the heating element, and the other external end forms a heat dissipation end; a sintered body, which is filled and arranged in the sealed cavity; an evaporation medium, at least partially filled and arranged in the sealed cavity; wherein, the sintered body includes a structure body and a cavity unit; the structure body and the cavity unit are formed by heating and sintering a target body made by mixing and compacting a plurality of first granular materials and a second granular material to a first state; wherein, the plurality of first granular materials are filled and fixed in a first region of the target body, the second granular material is filled and fixed in a second region of the target body, the second region does not overlap with the first region, and the first region surrounds the second region; in the first state, the plurality of first granular materials are bonded to form the structure body in the first region, and the second granular material is ablated to form the cavity unit in the second region; the structure body includes a target entity formed by bonding the plurality of first granular materials together and a conductive target channel, and the target entity and the target channel can be respectively used for conducting heat; At the adjacent position of the first region and the second region, the target channel is at least partially in communication with the cavity unit, and the target entity is distributed around the cavity unit in the first region.

5. A method for preparing a sintered body, comprising: Mixing and compacting a plurality of first granular materials and a second granular material to form a target body, and filling and fixing the plurality of first granular materials in a first region of the target body, and filling and fixing the second granular material in a second region of the target body, the second region not overlapping with the first region, and the first region surrounding the second region; Heating the target body to a first state, and in the first state, the plurality of first granular materials are bonded to form a structure in the first region, and the second granular material is melted away to form a cavity unit in the second region; Wherein the structure includes a target entity formed by bonding the plurality of first granular materials together and a conductive target channel, and the target entity and the target channel can be respectively used for heat conduction; At the adjacent position of the first region and the second region, the target channel is at least partially in communication with the cavity unit, and the target entity is distributed around the cavity unit in the first region.

6. The method for preparing a sintered body according to claim 5, wherein the step of mixing and compacting a plurality of first granular materials and a second granular material to form a target body includes: Mixing a first substance and a second substance to form the second granular material; Wherein, under the ablation effect of the second granular material, the first substance disappears from the second region, and the second substance correspondingly forms a convex body located in the cavity unit, The convex body can increase the heat exchange area and / or reduce the thermal resistance.

7. The method for preparing a sintered body according to claim 6, wherein in the first state, at least part of the surface of the first granular material melts and the inside does not melt, the first substance in the second granular material is vaporized and disappears from the cavity unit through the target channel, and the second substance in the second granular material adheres to the target entity at the target position and extends towards the cavity unit to form the convex body, The target position is located at the boundary between the first region and the second region.

8. The method for preparing a sintered body according to claim 6, wherein resin and / or carbon powder is used as the first substance in the second granular material; Among them, Under the ablation effect of the second granular material, the resin evaporates and vaporizes from the second region and / or the carbon powder is oxidized and vaporized from the second region to form the cavity unit.

9. The method for preparing a sintered body according to claim 7, wherein a mixture of CuCl2 powder and nano copper powder is used as the second substance in the second granular material; Among them, Under the ablation effect of the second granular material, the CuCl2 powder undergoes a reduction reaction on the inner wall of the cavity unit to form a first convex part in the convex body, and the nano copper powder adheres to the first convex part and forms a second convex part in the convex body.

10. The method for preparing a sintered body according to claim 5, wherein the step of mixing and compacting a plurality of first granular materials and a second granular material to form a target body includes: Mix the first particulate material with the second particulate material and apply ultrasonic vibration so that there is no longer a gap between two adjacent first particulate materials that can accommodate another first particulate material, and the second particulate materials are distributed at substantially the same intervals under ultrasonic resonance.

11. The method for preparing a sintered body according to claim 5, wherein mixing and compacting the first particulate material and the second particulate material to form a target body includes: The particle size ratio of the selected first particulate material to the second particulate material is between 1:7500 and 1:1600. After mixing and compacting the two to form a target body, a plurality of adjacent first particulate materials are fixedly wound around the outer surface of the second particulate material.

12. The method for preparing a sintered body according to any one of claims 5 to 8 further includes: Heating the target body to a second state and then cooling the target body to obtain a sintered body; Wherein, in the second state, the interior of the first particulate material is solid, and the surface melting area of the first particulate material is greater than the surface melting area of the first particulate material in the first state.

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