Photocurable composition with high silicon content

Abstract

A photocurable composition comprising a polymerizable material and a photoinitiator wherein the polymerizable material comprises at least one silicon-containing monomer having a structure of Formula (1) # imgabs0 # wherein R1, R2:-O-Si (CH3) 3, alkyl, aryl, or alkaryl; r3, R4:-O-Si (CH3) 3, an alkyl group, an aryl group, or an alkaryl group; r < 5 > is a C1-C5-alkyl group, an aryl group or an alkaryl group; r6:-R5-X, or X, or-O-Si (CH3) 3, or an alkyl group, or an aryl group, or an alkaryl group; x: acrylate or methacrylate; and n is 0-4. The amount of silicon (Si) in the photocurable composition is at least 15% by weight based on the total weight of the photocurable composition.

Description

Technical Field

[0001] The present invention relates to a photocurable composition, and particularly to a photocurable composition for inkjet adaptive planarization that is suitable for forming a photocurable layer with a high silicon content. Background Art

[0002] Inkjet adaptive planarization (IAP) is a process for planarizing the surface of a substrate (e.g., a wafer containing circuits) by ejecting droplets of a photocurable composition onto the surface of the substrate and bringing a flat overlay into direct contact with the added liquid to form a flat liquid layer. The flat liquid layer is typically cured under ultraviolet light irradiation, and after removing the overlay, a planar polymer surface is obtained, which can be subjected to subsequent processing steps such as baking, etching, and / or further deposition steps.

[0003] There is a need for improved IAP materials to obtain a planar photocurable layer with high corrosion resistance. Summary of the Invention

[0004] In one embodiment, the photocurable composition may include a photocurable composition comprising a polymerizable material and a photoinitiator, wherein the polymerizable material includes at least one silicon-containing monomer having the structure of formula (1),

[0005]

[0006] wherein, R1, R2: -O-Si(CH3)3, alkyl, aryl or alkaryl; R3, R4: -O-Si(CH3)3, alkyl, aryl or alkaryl; R5: C1-C5-alkyl, or aryl, or alkaryl; R6: -R5-X, or X, or –O-Si(CH3)3, or alkyl, or aryl, or alkaryl; X: acrylate or methacrylate; n: 0-4; and wherein the amount of silicon (Si) in the photocurable composition is at least 15% by weight based on the total weight of the photocurable composition.

[0007] In one aspect of the photocurable composition, the amount of Si may be at least 20% by weight based on the total weight of the photocurable composition.

[0008] In another aspect, the molecular weight of the silicon-containing monomer may be at least 100 g / mol and not greater than 800 g / mol.

[0009] In yet another aspect, the amount of the at least one silicon-containing monomer may be at least 60% by weight based on the total weight of the polymerizable material. In a specific aspect, the amount of the at least one silicon-containing monomer may be at least 60% by weight and not greater than 85% by weight based on the total weight of the polymerizable material.

[0010] In another embodiment, the viscosity of the photocurable composition may not be greater than 20 mPa·s.

[0011] In yet another embodiment, the amount of the polymerizable material may be at least 90% by weight based on the total weight of the photocurable composition.

[0012] In another aspect, the photocurable composition may be substantially free of solvents.

[0013] In one embodiment of the photocurable composition, the at least one silicon-containing monomer may include at least two different silicon-containing monomers.

[0014] In some aspects, the at least one silicon-containing monomer may be selected from the group consisting of:

[0015] Methacryloxymethyltris(trimethylsiloxy)silane (SiM1), 1,3-bis(3-methacryloxypropyl)tetrakis(trimethylsilyloxy)disiloxane (SiM2), 3-acryloxypropyltris(trimethylsilyloxy)silane (SiM3), (methacryloxymethyl)bis(trimethylsilyloxy)methylsilane (SiM4), 3-methacryloxypropylbis(trimethylsilyloxy)methylsilane (SiM5), (3-acryloxypropyl)methylbis(trimethylsilyloxy)silane (SiM6), methacryloxypropyltris(trimethylsilyloxy)silane (SiM7), acryloxymethyltrimethylsilane (SiM8), acryloxymethyltris(trimethylsilyloxy)silane (SiM9), 1,3-bis[(acryloxymethyl)phenethyl]tetramethyldisiloxane (SiM10), or any combination thereof.

[0016] In certain aspects, the at least one silicon-containing monomer may include: methacryloxymethyltris(trimethylsiloxy)silane (SiM1), 1,3-bis(3-methacryloxypropyl)tetrakis(trimethylsilyloxy)disiloxane (SiM2), or 3-acryloxypropyltris(trimethylsilyloxy)silane (SiM3), or any combination thereof.

[0017] In one embodiment, the polymerizable composition may include at least one silicon-free polymerizable monomer. In one aspect, the silicon-free polymerizable monomer may include acrylate monomers. In certain aspects, the acrylate monomers may include benzyl acrylate (BA), isobornyl acrylate (IBOA), 1,5-pentanediol diacrylate (MPDA), dicyclopentadiene diacrylate (DCPA), tricyclodecane dimethanol diacrylate (A-DCP), 2-acrylic acid, 1-phenyl-1,2-ethanediyl ester (PHEDA), or any combination thereof.

[0018] In another embodiment, a laminate may include a substrate and a photocurable layer covering the substrate, wherein the photocurable layer is formed from the above-described photocurable composition.

[0019] In one embodiment, a method of forming a photocurable layer on a substrate may include: coating a layer of a photocurable composition on the substrate, wherein the photocurable composition includes a polymerizable material and at least one photoinitiator, wherein the polymerizable material includes at least one silicon-containing monomer having the structure of formula (1),

[0020]

[0021] wherein, R1, R2: -O-Si(CH3)3, alkyl, aryl or alkaryl; R3, R4: -O-Si(CH3)3, alkyl, aryl or alkaryl; R5: C1-C5-alkyl, or aryl, or alkaryl; R6: -R5-X, or X, or –O-Si(CH3)3, or alkyl, or aryl, or alkaryl; X: acrylate or methacrylate; n: 0-4; and wherein the amount of silicon (Si) in the photocurable composition is at least 15 wt% based on the total weight of the photocurable composition; contacting the photocurable composition with a template or a cover plate; irradiating the photocurable composition with light to form a photocurable layer; and removing the template or the cover plate from the photocurable layer.

[0022] In one aspect of the method, the amount of Si may be at least 20 wt% based on the total weight of the photocurable composition.

[0023] In another aspect of the method, the viscosity of the photocurable composition may be no greater than 20 mPa·s.

[0024] In yet another aspect of the method, the amount of the polymerizable material may be at least 90 wt% based on the total weight of the photocurable composition.

[0025] In another embodiment, a method of manufacturing an article may include: a coating step of coating a layer of a photocurable composition on a substrate, wherein the photocurable composition includes a polymerizable material and at least one photoinitiator, wherein the polymerizable material includes at least one silicon-containing monomer having the structure of formula (1),

[0026]

[0027] Among them, R1, R2: -O-Si(CH3)3, alkyl, aryl or alkaryl; R3, R4: -O-Si(CH3)3, alkyl, aryl or alkaryl; R5: C1-C5-alkyl, aryl, alkaryl; R6: -R5-X, or X, or –O-Si(CH3)3, or alkyl, or aryl, or alkaryl; X: acrylate or methacrylate; n: 0-4; and the amount of silicon (Si) in the photocurable composition is at least 15% by weight based on the total weight of the photocurable composition; a contacting step of bringing the photocurable composition into contact with a template or a cover plate; an irradiating step of irradiating the photocurable composition with light to form a photocured layer; a removing step of removing the template or the cover plate from the photocured layer; a forming step of forming a pattern on a substrate; a processing step of processing the substrate on which the pattern has been formed in the forming step; and a manufacturing step of manufacturing an article from the substrate processed in the processing step. Detailed Description

[0028] The following description is provided to assist in understanding the teachings disclosed herein and will focus on specific implementations and embodiments of the teachings. This focus is provided to assist in describing the teachings and should not be construed as a limitation on the scope or applicability of the teachings.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The materials, methods, and examples are illustrative only and not intended to be limiting. Many details regarding specific materials and processing behaviors are conventional within the scope not described herein and can be found in textbooks and other sources on imprinting and lithography techniques.

[0030] As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having,” or any other variation thereof are intended to cover non-exclusive inclusion. For example, a process, method, article, or apparatus that comprises a list of features is not necessarily limited to only those features but may include other features not expressly listed or inherent to the process, method, article, or apparatus.

[0031] As used herein, unless otherwise expressly stated, “or” means inclusive or and not exclusive or. For example, condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or absent), A is false (or absent) and B is true (or present), and both A and B are true (or present).

[0032] In addition, the articles "a" or "an" are used to describe the elements and components described herein. This is done merely for convenience and to give a general sense of the scope of the invention. This description should be understood to include one or at least one, and the singular also includes the plural, unless it is obvious that it has a different meaning.

[0033] The present disclosure relates to a photocurable composition comprising a polymerizable material and a photoinitiator, wherein the polymerizable material comprises at least one silicon-containing monomer having the structure of formula (1):

[0034]

[0035] wherein, R1, R2: -O-Si(CH3)3, alkyl, aryl or alkaryl; R3, R4: -O-Si(CH3)3, alkyl, aryl or alkaryl; R5: C1-C5-alkyl, or aryl, or alkaryl; R6: -R5-X, or X, or –O-Si(CH3)3, or alkyl, or aryl, or alkaryl; X: acrylate or methacrylate; and n: 0-4. The amount of silicon (Si) in the photocurable composition can be at least 15% by weight based on the total weight of the photocurable composition.

[0036] As used herein, unless otherwise specified, the term "silicon-containing monomer" refers to a monomer belonging to the structure of formula (1).

[0037] In certain aspects, the amount of silicon in the photocurable composition can be at least 16% by weight based on the total weight of the photocurable composition, such as at least 17% by weight, at least 18% by weight, or at least 19% by weight or at least 20% by weight. In other aspects, the amount of silicon in the photocurable composition can be no more than 33% by weight, or no more than 30% by weight, or no more than 28% by weight, or no more than 25% by weight.

[0038] In certain aspects, the molecular weight of the silicon-containing monomer can be at least 100 g / mol, or at least 200 g / mol, or at least 300 g / mol, or at least 400 g / mol. In other aspects, the molecular weight of the silicon-containing monomer can be no more than 800 g / mol, or no more than 700 g / mol, or no more than 600 g / mol, or no more than 500 g / mol, or no more than 400 g / mol.

[0039] On the other hand, the amount of the at least one silicon-containing monomer can be at least 60% by weight, such as at least 65% by weight, or at least 70% by weight, or at least 80% by weight, or at least 90% by weight, or at least 95% by weight, or 100% by weight, based on the total weight of the polymerizable material. On the other hand, the amount of the silicon-containing monomer can be no greater than 99% by weight, or no greater than 95% by weight, or no greater than 90% by weight, or no greater than 85% by weight, of the total weight of the polymerizable material. In a particular aspect, the amount of the silicon-containing monomer can be at least 60% by weight and no greater than 85% by weight based on the total weight of the polymerizable material.

[0040] Non-limiting example structures of polymerizable monomers belonging to the structure of formula (1) containing silicon monomers can be:

[0041] Methacryloxymethyltris(trimethylsiloxy)silane (SiM1):

[0042]

[0043] 1,3-Bis(3-methacryloxypropyl)tetrakis(trimethylsilyloxy)disiloxane (SiM2):

[0044] 3-Acryloxypropyltris(trimethylsilyloxy)silane (SiM3):

[0045]

[0046] (Methacryloxymethyl)bis(trimethylsilyloxy)methylsilane (SiM4):

[0047] 3-Methacryloxypropylbis(trimethylsilyloxy)methylsilane (SiM5):

[0048] (3-Acryloxypropyl)methylbis(trimethylsilyloxy)silane (SiM6):

[0049] Methacryloxypropyltris(trimethylsilyloxy)silane (SiM7):

[0050]

[0051] Acryloxymethyltrimethylsilane (SiM8):

[0052]

[0053] Acryloxymethyltris(trimethylsilyloxy)silane (SiM9):

[0054]

[0055] or 1,3-bis[(acryloxymethyl)phenylethyl]tetramethyldisiloxane (SiM10):

[0056]

[0057] The photocurable composition of the present disclosure can be designed to have a low viscosity before curing. In one embodiment, the viscosity of the cured composition can be no greater than 30 mPa·s, or no greater than 25 mPa·s, or no greater than 20 mPa·s, or no greater than 15 mPa·s, or no greater than 10 mPa·s. In another specific embodiment, the viscosity can be at least 5 mPa·s. In a particularly preferred aspect, the viscosity of the photocurable composition can be from 5 mPa·s to no greater than 20 mPa·s. As used herein, all viscosity values are related to the viscosity measured by the Brookfield method using a Brookfield Viscometer at a temperature of 23°C.

[0058] In one embodiment, the polymerizable material of the photocurable composition can further include at least one silicon-free polymerizable monomer, such as one or more monofunctional and / or one or more polyfunctional polymerizable monomers.

[0059] In one aspect, the silicon-free polymerizable monomer can include acrylate monomers. As used herein, the term acrylate monomer refers to both unsubstituted and alkyl-substituted acrylates, such as methacrylates. Non-limiting examples of acrylate monomers can be benzyl acrylate (BA), isobornyl acrylate (IBOA), 1,5-pentanediol diacrylate (MPDA), dicyclopentadiene diacrylate (DCPA), tricyclodecane dimethanol diacrylate (A-DCP), 2-acrylic acid, 1-phenyl-1,2-ethanediyl ester (or phenylethylene glycol diacrylate) (PHEDA), bisphenol A dimethacrylate, m-xylene diacrylate, neopentyl glycol diacrylate, or any combination thereof.

[0060] In another aspect, the amount of at least one silicon-free monomer can be at least 5 wt%, or at least 10 wt%, or at least 15 wt%, or at least 20 wt%, or at least 25 wt% based on the total weight of the polymerizable material. In another aspect, the amount of the silicon-free monomer can be no greater than 40 wt%, or no greater than 35 wt%, or no greater than 30 wt%, or no greater than 25 wt%, or no greater than 20 wt% of the total weight of the polymerizable material.

[0061] The amount of the polymerizable material in the photocurable composition can be at least 50% by weight, such as at least 60% by weight, at least 70% by weight, or at least 80% by weight, or at least 90% by weight, or at least 95% by weight, based on the total weight of the photocurable composition. In another aspect, the amount of the polymerizable material can be no greater than 99% by weight, such as no greater than 97% by weight, no greater than 95% by weight, no greater than 90% by weight, no greater than 85% by weight, or no greater than 80% by weight, or no greater than 70% by weight. The amount of the polymerizable material can be a value between the above minimum and maximum values. In a particular aspect, the amount of the polymerizable material can be at least 70% by weight and no greater than 98% by weight.

[0062] In one embodiment, the photocurable composition of the present disclosure can be substantially free of solvents. As used herein, unless otherwise specified, the term solvent refers to a compound that can dissolve or disperse the polymerizable monomer but does not itself polymerize during the photocuring process of the photocurable composition. The term "substantially free of solvents" herein means that the amount of the solvent is no greater than 5% by weight of the total weight of the photocurable composition. In a particular aspect, the amount of the solvent can be no greater than 3% by weight, no greater than 2% by weight, no greater than 1% by weight of the total weight of the photocurable composition, or the photocurable composition can be free of solvents, except for inevitable impurities.

[0063] In another particular aspect, the photocurable composition can contain at least 5% by weight, or at least 8% by weight, at least 10% by weight, or at least 15% by weight, or at least 20% by weight of a solvent, based on the total weight of the photocurable composition. In another aspect, the amount of the solvent can be no greater than 30% by weight, or no greater than 20% by weight, no greater than 15% by weight, no greater than 10% by weight, no greater than 5% by weight, or no greater than 3% by weight of the total weight of the photocurable composition.

[0064] To initiate the photocuring of the composition upon exposure to light, one or more photoinitiators can be included in the photocurable composition. In one aspect, the curing can also be carried out by a combination of photocuring and thermal curing.

[0065] The photocurable composition can also contain one or more optional additives. Non-limiting examples of the optional additives can be stabilizers, dispersants, solvents, surfactants, inhibitors, or any combination thereof.

[0066] The photocurable composition of the present disclosure can be suitable for use in inkjet adaptive planarization (IAP) or nanoimprint lithography (NIL).

[0067] In one embodiment, the photocurable composition can be coated on a substrate to form a photocurable layer. As used herein, the combination of the substrate and the photocurable layer overlying the substrate is referred to as a laminate.

[0068] Surprisingly, it has been observed that the photocurable composition of the present disclosure can be applied such that the photocured layer formed from the photocurable composition can have high etch resistance. High etch resistance is an important property of resist materials in the fields of nanoimprint lithography (NIL) and inkjet adaptive planarization (IAP). For example, high etch resistance is required to obtain good pattern transfer in the range of less than 100 nm or even less than 20 nm. The photocurable composition can combine high etch resistance with low viscosity, a fast curing rate, and good strength of the cured resist. In addition, the stability of the photocurable composition (without an undesired curing reaction) can be observed for at least three months.

[0069] The present invention also relates to a method of forming a photocured layer. The method can include coating a layer of the above-described photocurable composition on the surface of a substrate, bringing the photocurable composition into contact with a template or a cover plate; irradiating the photocurable composition with light to form a photocured layer; and removing the template or the cover plate from the photocured layer.

[0070] The substrate and the cured layer can be subjected to additional processes, such as an etching process, to transfer an image into the substrate, the image corresponding to the pattern in one or both of the cured layer and / or the patterned layer below the cured layer. The substrate can further be subjected to known steps and processes for device (article) manufacturing, including, for example, curing, oxidation, layer formation, deposition, doping, planarization, etching, removal of formable materials, cutting, bonding, and encapsulation, etc.

[0071] The photocured layer can also be used as an interlayer insulating film of a semiconductor device, such as an LSI, a system LSI, a DRAM, an SDRAM, an RDRAM, or a D-RDRAM, or as a resist film used in a semiconductor manufacturing process.

[0072] Example

[0073] The following non-limiting examples illustrate the ideas described herein.

[0074] Example 1

[0075] Photocurable composition.

[0076] A photocurable composition is prepared, which includes different combinations and amounts of silicone monomers: methacryloxymethyltris(trimethylsiloxy)silane (SiM1), 1,3-bis(3-methacryloxypropyl)tetrakis(trimethylsilyloxy)disiloxane (SiM2), and 3-acryloxypropyltris(trimethylsilyloxy)silane (SiM3). In addition, the following silicon-free polymerizable monomers are used in the composition: dicyclopentadienyl diacrylate (DCPA), benzyl acrylate (BZA), dipentaerythritol penta / hexacrylate (DPHA), tricyclodecane dimethanol diacrylate (A-DCP), and 1-phenylethylene diacrylate (PHEDA). A detailed summary of the polymerizable monomers of each composition is shown in Table 1.

[0077] The photocurable composition also contains one or more photoinitiators and surfactants, and their types and amounts are also summarized in Table 1.

[0078] Table 1:

[0079]

[0080] Dry etching resistance

[0081] A photocurable film for testing etching resistance is prepared by printing a resist film on a silicon wafer using a J-FIL Imprint Tool I300, so that the film is completely cured during UV exposure. The thickness of the cured resist film is about 100 nm.

[0082] To measure the etching resistance, a Trion Oracle 3-chamber cluster system is used as an etching tool to perform dry etching in an oxygen / argon atmosphere. Two different dry etching chemistries have been tested: 1) etching using an oxygen / argon combination (O2 / Ar); and 2) etching using a combination of chlorine and oxygen (Cl2 / O2).

[0083] The following etching conditions are applied.

[0084] O2 / Ar etching: O2: 2 sccm (standard cubic centimeters per minute); argon: 10 sccm; RF power: 45 watts; pressure: 10 mTorr; etching time: 72 seconds; ICP: 0 watts.

[0085] Cl2 / O2 etching: Cl2: 54 sccm; O2: 9 sccm; RF power: 90 watts; pressure: 150 mTorr; etching time: 90 seconds; ICP: 0 watts.

[0086] Table 2 shows the measured etch rates converted to nm / min for the photo-cured samples S1 (made with a resist composition containing 26.5 wt% silicon), C1 (made with a resist composition containing 14.2 wt% silicon), and C8 (made with a resist composition containing no silicon). The comparative composition C8 contains 36 parts of IBOA, 21 parts of DCPA, 24 parts of BZA, and 20 parts of SR247 (crosslinker), as well as 3 parts of photoinitiator (1 part of Irgacure 907 + 2 parts of Irgacure 651 from BASF, USA), and 4 parts of surfactant (2.7 parts of FS2000M1 and 1.4 parts of FS2000M2), which are added as mold release agents. The viscosity of composition C8 at 23 °C is 7.0 mPa s.

[0087] It can be seen that sample S1 has the best etch resistance to both etching substances O2 / Ar and Cl2 / O2 etching. Compared with sample S1, a lower Si content as in sample C1 results in lower etch resistance. For sample C8 containing no silicon, the lowest etch resistance (corresponding to the highest etch rate) was observed.

[0088] Table 2

[0089]

[0090]

[0091] Viscosity

[0092] The viscosities measured for all samples shown in Table 1 indicate that even the representative samples S1, S2, and S3 have very low viscosities, even below 10 mPa·s.

[0093] The viscosity was measured using a Brookfield viscometer LVDV-II+Pro with a spindle size of #18 at 200 rpm and 23 °C. For the viscosity test, approximately 6 - 7 mL of the sample liquid was added to the sample chamber, sufficient to cover the spindle head. For all viscosity tests, at least three measurements were made and the average value was calculated.

[0094] Silicon content calculation

[0095] The silicon content of the polymerizable material in the photo-curable composition is calculated according to the following equation: Si [wt%] = [∑w i (n i -M Si ) / Mi)]x100%, where M Si is the molecular weight of silicon, M i is the molecular weight of each complete monomer; n i is the molar amount of Si in each monomer; w iis the molar amount of each monomer in the complete composition. For example, w i = 0.5 means that each monomer accounts for 50% by weight in the composition.

[0096] The description and illustration of the embodiments described herein are intended to provide a general understanding of the structure of the various embodiments. The description and illustration are not intended as an exhaustive and comprehensive description of all elements and features of the devices and systems using the structures or methods described herein. Separate embodiments may also be provided in combination in a single embodiment, and conversely, various features described in the context of a single embodiment may be provided separately or in any sub-combination. Additionally, references to values stated in ranges include each value within that range. Many other embodiments will be apparent to those skilled in the art only after reading this specification. Other embodiments may be used and derived from the present disclosure, such that structural substitutions, logical substitutions, or other changes may be made without departing from the scope of the present disclosure. Accordingly, the present disclosure should be regarded as illustrative and not restrictive.

Claims

1. A photocurable composition comprising a polymerizable material and a photoinitiator, wherein, the polymerizable material comprises at least one silicon-containing monomer having the structure of formula (1), wherein, R1, R2: -O-Si(CH3)3, alkyl, aryl or alkaryl; R3, R4: -O-Si(CH3)3, alkyl, aryl or alkaryl; R5: C1-C5-alkyl, aryl, alkaryl; R6: -R5-X, or X, or –O-Si(CH3)3, or alkyl, or aryl, or alkaryl; X: acrylate or methacrylate; n: 0-4; and the amount of silicon (Si) in the photocurable composition is at least 15% by weight based on the total weight of the photocurable composition.

2. The photocurable composition according to claim 1, wherein The amount of Si is at least 20% by weight based on the total weight of the photocurable composition.

3. The photocurable composition according to claim 1, wherein, The molecular weight of the silicon-containing monomer is at least 100 g / mol and not more than 700 g / mol.

4. The photocurable composition according to claim 1, wherein, The amount of the at least one silicon-containing monomer is at least 60% by weight based on the total weight of the polymerizable material.

5. The photocurable composition according to claim 4, wherein, The amount of the at least one silicon-containing monomer is at least 60% by weight and not more than 85% by weight based on the total weight of the polymerizable material.

6. The photocurable composition according to claim 1, wherein, The viscosity of the photocurable composition is not more than 20 mPa·s.

7. The photocurable composition according to claim 1, wherein, The amount of the polymerizable material is at least 90% by weight based on the total weight of the photocurable composition.

8. The photocurable composition according to claim 1, wherein, The photocurable composition is substantially free of solvents.

9. The photocurable composition according to claim 1, wherein The at least one silicon-containing monomer comprises at least two different silicon-containing monomers.

10. The photocurable composition according to claim 1, wherein, The at least one silicon-containing monomer is selected from the following group: Methacryloxymethyltris(trimethylsiloxy)silane (SiM1), 1,3-Bis(3-methacryloxypropyl)tetrakis(trimethylsilyloxy)disiloxane (SiM2), 3-Acryloxypropyltris(trimethylsilyloxy)silane (SiM3), (Methacryloxymethyl)bis(trimethylsilyloxy)methylsilane (SiM4), 3-Methacryloxypropylbis(trimethylsilyloxy)methylsilane (SiM5), (3-Acryloxypropyl)methylbis(trimethylsilyloxy)silane (SiM6), Methacryloxypropyltris(trimethylsilyloxy)silane (SiM7), Acryloxymethyltrimethylsilane (SiM8), Acryloxymethyltris(trimethylsilyloxy)silane (SiM9), 1,3-Bis[(acryloxymethyl)phenethyl]tetramethyldisiloxane (SiM10), or any combination thereof.

11. The photocurable composition according to claim 10, wherein The at least one silicon-containing monomer comprises: Methacryloxymethyltris(trimethylsiloxy)silane (SiM1), 1,3-Bis(3-methacryloxypropyl)tetrakis(trimethylsilyloxy)disiloxane (SiM2) or 3-Acryloxypropyltris(trimethylsilyloxy)silane (SiM3), or any combination thereof.

12. The photocurable composition according to claim 1, wherein, The polymerizable material further comprises at least one silicon-free polymerizable monomer.

13. The photocurable composition according to claim 12, wherein, The silicon-free polymerizable monomer comprises an acrylate monomer.

14. The photocurable composition according to claim 13, wherein, The acrylate monomers include benzyl acrylate (BA), isobornyl acrylate (IBOA), 1,5-pentanediol diacrylate (MPDA), dicyclopentadienyl diacrylate (DCPA), tricyclodecane dimethanol diacrylate (A-DCP), 1-phenyl-1,2-ethanediyl acrylate (PHEDA), or any combination thereof.

15. A laminate, the laminate comprising a substrate and a photocurable layer covering the substrate, wherein, The photocurable layer is formed from the photocurable composition as claimed in claim 1.

16. A method of forming a photocurable layer on a substrate, comprising: coating a layer of the photocurable composition on the substrate, wherein the photocurable composition comprises a polymerizable material and at least one photoinitiator, wherein, the polymerizable material comprises at least one silicon-containing monomer having the structure of formula (1), wherein, R1, R2: -O-Si(CH3)3, alkyl, aryl or alkaryl; R3, R4: -O-Si(CH3)3, alkyl, aryl or alkaryl; R5: C1-C5-alkyl, aryl, alkaryl; R6: -R5-X, or X, or –O-Si(CH3)3, or alkyl, or aryl, or alkaryl; X: acrylate or methacrylate; n: 0-4; and the amount of silicon (Si) in the photocurable composition is at least 15% by weight based on the total weight of the photocurable composition; bringing the photocurable composition into contact with a template or a cover plate; irradiating the photocurable composition with light to form a photocurable layer; and removing the template or the cover plate from the photocurable layer.

17. The method according to claim 16, wherein The amount of Si is at least 20% by weight based on the total weight of the photocurable composition.

18. The method according to claim 16, wherein The viscosity of the photocurable composition is not more than 20 mPa·s.

19. The method according to claim 16, wherein The amount of the polymerizable material is at least 90% by weight based on the total weight of the photocurable composition.

20. A method of manufacturing an article, comprising: a coating step of coating a layer of the photocurable composition on a substrate, wherein the photocurable composition comprises a polymerizable material and at least one photoinitiator, wherein, the polymerizable material comprises at least one silicon-containing monomer having the structure of formula (1), wherein, R1, R2: -O-Si(CH3)3, alkyl, aryl or alkaryl; R3, R4: -O-Si(CH3)3, alkyl, aryl or alkaryl; R5: C1-C5-alkyl, aryl, alkaryl; R6: -R5-X, or X, or –O-Si(CH3)3, or alkyl, or aryl, or alkaryl; X: acrylate or methacrylate; n: 0-4; and the amount of silicon (Si) in the photocurable composition is at least 15% by weight based on the total weight of the photocurable composition; a contact step of bringing the photocurable composition into contact with a template or a cover plate; an irradiation step of irradiating the photocurable composition with light to form a photocurable layer; a removal step of removing the template or the cover plate from the photocurable layer; a forming step of forming a pattern on the substrate; a processing step of processing the substrate on which the pattern has been formed in the forming step; and a manufacturing step of manufacturing an article from the substrate processed in the processing step.

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