Semiconductor module and method for manufacturing semiconductor module

Abstract

A semiconductor module (1) includes a substrate (34), a first connector (36), and a second connector (31). The first connector (36) is provided on the substrate (34). The second connector (31) is located on one end side of the optical fiber cable (32) and is optically connected to the first connector (36). In addition, the second connector (31) is provided with a main body part (31a) and a protruding part (31b). The main body (31a) accommodates the optical fiber cable (32) therein. The protruding part (31b) protrudes from the main body part (31a) and exposes the tip part of the optical fiber cable (32) from the second surface (31c).

Description

Technical Field

[0001] The disclosed embodiments relate to a semiconductor module and a method of manufacturing the semiconductor module. Background Art

[0002] Conventionally, a semiconductor module in which a semiconductor device (hereinafter, also referred to as an optical device) that converts an electrical signal into an optical signal is mounted on a substrate has been known. A fiber optic cable that transmits the converted optical signal from the optical device to the outside may be connected to the semiconductor module (see Patent Document 1).

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent No. 6311558 Summary of the Invention

[0006] The semiconductor module of the present disclosure includes a substrate, a first connector, and a second connector. The first connector is provided on the substrate. The second connector is located on one end side of the fiber optic cable and is optically connected to the first connector. Further, the second connector has a main body portion and a protruding portion. The main body portion houses the fiber optic cable therein. The protruding portion protrudes from the main body portion and exposes the tip portion of the fiber optic cable from a second surface. Brief Description of the Drawings

[0007] Figure 1 It is a perspective view when observing the semiconductor module of the embodiment obliquely from above.

[0008] Figure 2 It is a perspective view when observing the semiconductor module of the embodiment obliquely from below.

[0009] Figure 3 It is a cross-sectional view of the semiconductor module of the embodiment.

[0010] Figure 4 It is a top view of the first connector and the second connector of the embodiment.

[0011] Figure 5 It is a diagram for explaining the alignment process of the second connector of the embodiment.

[0012] Figure 6 It is a diagram for explaining the alignment process of the second connector of the embodiment.

[0013] Figure 7 It is a diagram for explaining the alignment process of the second connector of the embodiment.

[0014] Figure 8 It is a diagram for explaining the alignment process of the second connector of the embodiment.

[0015] Figure 9 It is a top view of the second connector of Other Embodiment 1.

[0016] Figure 10 It is a top view of the second connector of Other Embodiment 2.

[0017] Figure 11 It is a cross-sectional view of the first connector and the second connector of Other Embodiment 3.

[0018] Figure 12 It is a diagram for explaining the alignment process of the second connector of Other Embodiment 3.

[0019] Figure 13 It is a diagram for explaining the alignment process of the second connector of Other Embodiment 3. Specific Embodiment

[0020] Hereinafter, embodiments of the semiconductor module and the method for manufacturing the semiconductor module disclosed in the present application will be described with reference to the accompanying drawings. In addition, the present disclosure is not limited to the embodiments shown below. In addition, the respective embodiments can be appropriately combined within the range where the processing contents do not conflict. In addition, in the following respective embodiments, the same reference numerals are assigned to the same parts, and repeated descriptions are omitted.

[0021] In addition, in the embodiments shown below, expressions such as "constant", "orthogonal", "perpendicular", or "parallel" may be used, but these expressions do not need to be strictly "constant", "orthogonal", "perpendicular", or "parallel". That is, the above-mentioned respective expressions allow deviations such as manufacturing accuracy and setting accuracy.

[0022] In addition, in the respective drawings referred to below, for the sake of easy explanation, an orthogonal coordinate system in which the X-axis direction, the Y-axis direction, and the Z-axis direction that are mutually orthogonal are sometimes shown, and the positive direction of the Z-axis is set as the vertically upward direction.

[0023] Conventionally, a semiconductor module in which a semiconductor device (hereinafter, also referred to as an optical device) that converts an electrical signal into an optical signal is mounted on a substrate has been known. Sometimes, an optical fiber cable that transmits the converted optical signal from the optical device to the outside is connected to the semiconductor module.

[0024] However, in the above-mentioned prior art, there is a case where the bonding strength between the connector on the semiconductor device side and the connector on the optical fiber cable side is insufficient. As a result, the optical fiber cable may be detached from the semiconductor module.

[0025] Therefore, in order to overcome the above problems, the realization of a technology capable of improving the bonding strength of the optical fiber cable is expected.

[0026] <Overall Structure of the Semiconductor Module>

[0027] First, refer to Figure 1 and Figure 2 to describe the overall structure of the semiconductor module 1 of the embodiment. Figure 1 is a perspective view when observing the semiconductor module 1 of the embodiment from obliquely above, Figure 2 is a perspective view when observing the semiconductor module 1 of the embodiment from obliquely below.

[0028] In addition, in each of the following embodiments, the case where the semiconductor module 1 is an optical module in which the optical device 3 is mounted on the substrate is taken as an example for description, but the semiconductor module of the present disclosure is not necessarily an optical module.

[0029] As Figure 1 and Figure 2 shown, the semiconductor module 1 of the embodiment includes: a substrate 2, a plurality of optical devices 3 (optical devices 3a to 3d), and a heat dissipation member 4.

[0030] The substrate 2 has, for example, a plate shape that is quadrilateral in plan view. In addition to the plurality of optical devices 3a to 3d and the heat dissipation member 4, a power supply IC, a control IC, chip resistors, etc. that are not shown are also located on the first surface 21 (here, the upper surface) of the substrate 2. In addition, capacitors and coils, etc. that are not shown may also be located on the first surface 21 of the substrate 2.

[0031] A connector 25 is located on the second surface 22 (here, the lower surface) of the substrate 2. The substrate 2 is electrically connected to the motherboard via the connector 25.

[0032] The optical device 3 is a semiconductor device that converts an electrical signal into an optical signal. In addition, the optical device 3 may also convert an optical signal into an electrical signal. A second connector 31 is located on the upper surface of each optical device 3. The second connector 31 is connected to an optical connector 33 via a cable group composed of a plurality of optical fiber cables 32.

[0033] The heat dissipation member 4 is a so-called radiator and is located above the plurality of optical devices 3. In addition, the heat dissipation member 4 does not necessarily cover all of the plurality of optical devices 3 above. That is, as Figure 1 shown, the upper surfaces of the plurality of optical devices 3 may also be partially exposed from the heat dissipation member 4.

[0034] The heat dissipation member 4 is close to the plurality of optical devices 3 and releases the heat generated from the optical devices 3 to the outside of the semiconductor module 1. In addition, the heat dissipation member 4 may also be in direct contact with the optical devices 3. Or, the heat dissipation member 4 may also be in contact with the optical devices 3 via TIM (Thermal Interface Material). That is, the heat dissipation member 4 may also be thermally connected to the plurality of optical devices 3.

[0035] The heat dissipation member 4 may also be formed of a metal with a relatively high thermal conductivity such as aluminum, copper, or iron. TIM refers to a composite material containing a thermally conductive filler in a resin.

[0036] The heat dissipation member 4 has a plate-like portion 41, a plurality of leg portions 42, and a plurality of heat dissipation bodies 45. The plate-like portion 41 is a plate-like part disposed opposite to the first surface 21 of the substrate 2 with a gap therebetween. The plurality of leg portions 42 are provided on the plate-like portion 41. Specifically, the plurality of leg portions 42 extend from the plate-like portion 41 toward the substrate 2 and are in contact with the substrate 2 (mounted on the substrate 2).

[0037] These leg portions 42 are formed in a shape in which the thickness gradually increases from the plate-like portion 41 locally. The leg portions 42 may be integrated with the plate-like portion 41. The plurality of leg portions 42 may also be connected to the plate-like portion 41 and the substrate 2. The plurality of leg portions 42 extend along a certain direction (here, the X-axis direction).

[0038] The plurality of heat dissipation bodies 45 are located on the surface of the plate-like portion 41 opposite to the surface facing the substrate 2. In Figure 1 and Figure 2 an example in which the heat dissipation body 45 has a pin shape (that is, is a heat dissipation pin) is shown, but the heat dissipation body 45 may also be a plate shape (that is, a heat sink), for example.

[0039] There is a case where a blower such as a cooling fan (not shown) that blows air to the semiconductor module 1 is located on the negative X-axis side of the semiconductor module 1. This blower generates wind toward the positive X-axis direction.

[0040] The wind sent from the blower flows along the first surface 21 of the substrate 2 so that the wind blows onto the plurality of heat dissipation bodies 45 and passes through the ventilation path 100 formed between the substrate 2 and the plate-like portion 41 of the heat dissipation member 4.

[0041] Moreover, in the embodiment, the wind blows onto the plurality of optical devices 3 located on the outlet side of the ventilation path 100, and the heat dissipation efficiency of the plurality of optical devices 3 can be further improved.

[0042] <Connection structure of optical fiber cable>

[0043] Next, with reference to Figure 3 and Figure 4 the connection structure of the optical fiber cable 32 in the semiconductor module 1 of the embodiment will be described. Figure 3 is a cross-sectional view of the semiconductor module 1 of the embodiment, Figure 4 and

[0044] As shown in Figure 3As shown, the optical device 3 of the embodiment has a substrate 34, an optical element 35, and a first connector 36. The optical element 35 is an example of a semiconductor element.

[0045] The substrate 34 supports various components (such as the optical element 35 and the first connector 36, etc.) that make up the optical device 3. The substrate 34 is, for example, a silicon substrate.

[0046] The optical element 35 is located, for example, on the main surface of the substrate 34. The optical element 35 includes an LD (laser diode), a driver, a receiver, etc., and converts an electrical signal into an optical signal. Additionally, the optical element 35 can also convert an optical signal into an electrical signal. Furthermore, the optical element 35 of the embodiment can also be composed of an LD, a driver, and a receiver separately.

[0047] The first connector 36 is located, for example, on the main surface of the substrate 34. The first connector 36 is optically connected to the optical element 35 via an unillustrated optical transmission path located on the substrate 34, etc.

[0048] The first connector 36 has a main body portion 36a, a plurality of optical pins 36b, and a cover member 36c. The main body portion 36a houses a plurality of optical pins 36b inside and supports the plurality of optical pins 36b in such a way that the optical pins 36b do not contact each other.

[0049] The optical pins 36b are optically connected to the optical transmission path extending from the optical element 35 and transmit optical signals. Additionally, the plurality of optical pins 36b are respectively optically connected to a plurality of optical fiber cables 32 housed in the second connector 31.

[0050] As Figure 3 shown, the optical pins 36b are located at positions extending toward the second connector 31 (for example, along the Z-axis direction). Furthermore, the optical pins 36b of the embodiment can also be located at positions inclined with respect to the Z-axis direction.

[0051] Additionally, as Figure 4 shown, the plurality of optical pins 36b are arranged, for example, along a specified first direction (the Y-axis direction in the figure).

[0052] The cover member 36c is located at a position covering the tip portions of the plurality of arranged optical pins 36b and protects the tip portions of the plurality of optical pins 36b. The cover member 36c is composed of a member capable of transmitting optical signals (such as optical glass, etc.). The second connector 31 is located at a position facing the cover member 36c (i.e., the plurality of optical pins 36b).

[0053] The cover member 36c and the second connector 31 are fixed by a fixing member 37. The fixing member 37 is composed of, for example, an adhesive capable of transmitting optical signals (such as UV curable resin, etc.).

[0054] The second connector 31 is located on one end side of a plurality of optical fiber cables 32 and is optically connected to the first connector 36. The second connector 31 has a main body portion 31a and a protruding portion 31b. The main body portion 31a houses a plurality of optical fiber cables 32 therein.

[0055] The protruding portion 31b is a portion protruding from the main body portion 31a. The protruding portion 31b protrudes, for example, from the main body portion 31a toward the side facing the first connector 36 (the negative Z-axis direction side in the figure). The protruding portion 31b may be integrally formed with the main body portion 31a, may be separately formed from the main body portion 31a, or may be joined to the main body portion 31a using a joining member or the like.

[0056] In addition, the protruding portion 31b has a bottom surface 31c and a plurality of side surfaces 31d. The bottom surface 31c is an example of a second surface and is a flat surface facing the first connector 36. The tip portions of the plurality of optical fiber cables 32 are exposed from the bottom surface 31c.

[0057] Furthermore, the tip portions of the plurality of optical fiber cables 32 do not necessarily have to be exposed from the bottom surface 31c. For example, they may be located near the bottom surface 31c inside the protruding portion 31b.

[0058] As Figure 4 shown, the bottom surface 31c of the embodiment is rectangular in plan view. The plurality of side surfaces 31d are surfaces that contact the respective sides of the rectangular bottom surface 31c and intersect the bottom surface 31c.

[0059] Here, in the embodiment, as Figure 3 shown, by the second connector 31 having the protruding portion 31b, not only the bottom surface 31c but also the plurality of side surfaces 31d contribute to the engagement with the first connector 36. That is, in the embodiment, by the second connector 31 having the protruding portion 31b, the engagement area of the second connector 31 can be increased.

[0060] Thereby, the engagement strength between the first connector 36 and the second connector 31 can be improved. Therefore, according to the embodiment, the engagement strength of the optical fiber cables 32 can be improved.

[0061] In addition, in the embodiment, the protruding portion 31b may protrude toward the side facing the first connector 36. Thereby, the fixing member 37 can smoothly wind around the plurality of side surfaces 31d of the protruding portion 31b, and thus the engagement strength between the first connector 36 and the second connector 31 can be further improved.

[0062] Therefore, according to the embodiment, the engagement strength of the optical fiber cables 32 can be further improved.

[0063] In addition, in the embodiment, the surface roughness of at least one side surface 31d of the protruding portion 31b may also be greater than the surface roughness of the bottom surface 31c. Thereby, a so-called anchoring effect is generated between the side surface 31d with a large surface roughness and the fixing member 37, and thus the bonding strength between the first connector 36 and the second connector 31 can be further improved.

[0064] Therefore, according to the embodiment, the bonding strength of the optical fiber cable 32 can be further improved. In addition, in the embodiment, by reducing the surface roughness of the bottom surface 31c, the light transmission efficiency between the first connector 36 and the second connector 31 can be improved.

[0065] In addition, in the embodiment, the surface roughness of all the side surfaces 31d of the protruding portion 31b may also be greater than the surface roughness of the bottom surface 31c. Thereby, since an anchoring effect is generated between all the side surfaces 31d and the fixing member 37, the bonding strength between the first connector 36 and the second connector 31 can be further improved.

[0066] Therefore, according to the embodiment, the bonding strength of the optical fiber cable 32 can be further improved. In this case, the surface roughness Ra of the bottom surface 31c is 0.01 μm or less, and the surface roughness Ra of the side surface 31d may be 100 times or more and 500 times or less of the surface roughness Ra of the bottom surface 31c. Specifically, the surface roughness Ra of the side surface 31d may be 1 μm or more and 5 μm or less.

[0067] In addition, in the embodiment, the fixing member 37 such as an adhesive may be used to fix between the first connector 36 and the second connector 31. Thereby, since the first connector 36 and the second connector 31 can be simply fixed, the manufacturing cost of the semiconductor module 1 can be reduced.

[0068] In addition, in the embodiment, as Figure 3 shown, the fixing member 37 may also have a thin wall portion 37a and a thick wall portion 37b. The thin wall portion 37a is a portion of the fixing member 37 facing the bottom surface 31c. The thick wall portion 37b is located around the thin wall portion 37a and is a portion thicker than the thin wall portion 37a.

[0069] In this way, by the fixing member 37 having the thin wall portion 37a, the distance between the optical pin 36b and the optical fiber cable 32 can be shortened, and thus the light transmission efficiency between the first connector 36 and the second connector 31 can be improved.

[0070] In addition, by the fixing member 37 having the thick wall portion 37b, the bonding strength between the first connector 36 and the second connector 31 can be further improved.

[0071] <Second Connector Alignment Process>

[0072] Next, with reference to Figures 5 - 8 the alignment process of the second connector 31 in the manufacturing process of the semiconductor module 1 of the embodiment will be described in detail. Figures 5 - 8 It is a diagram for explaining the alignment process of the second connector 31 of the embodiment.

[0073] In the embodiment, first, as Figure 5 shown, the control unit of the manufacturing apparatus (not shown) tilts the second connector 31 in the semiconductor module 1 (refer to Figure 3 ) with respect to the second direction (X-axis direction in the figure) in which the optical fiber cable 32 extends, in a specified rotation direction R1.

[0074] Then, the first side 31e1 formed by the bottom surface 31c and the side surface 31d1 located on the negative X-axis side with respect to the bottom surface 31c is closer to the first connector 36 than the other sides. The side surface 31d1 is an example of the first side surface.

[0075] Next, as Figure 6 shown, the control unit of the manufacturing apparatus (not shown) moves the second connector 31 in a tilted state toward the first connector 36, and makes the first side 31e1 contact the main surface 36d of the cover member 36c in the first connector 36.

[0076] Then, the control unit of the manufacturing apparatus measures the height position of the first side 31e1 when the first side 31e1 contacts the first connector 36.

[0077] Next, as Figure 7 shown, the control unit of the manufacturing apparatus (not shown) tilts the second connector 31 in the semiconductor module 1 (refer to Figure 3 ) with respect to the second direction (X-axis direction in the figure) in which the optical fiber cable 32 extends, in a rotation direction R2 opposite to the specified rotation direction R1.

[0078] Then, the second side 31e2 formed by the bottom surface 31c and the side surface 31d2 located on the positive X-axis side with respect to the bottom surface 31c is closer to the first connector 36 than the other sides. The side surface 31d2 is an example of the second side surface.

[0079] Next, as Figure 8 shown, the control unit of the manufacturing apparatus (not shown) moves the second connector 31 in a tilted state toward the first connector 36, and makes the second side 31e2 contact the main surface 36d of the cover member 36c in the first connector 36.

[0080] Then, the control unit of the manufacturing apparatus measures the height position of the second side 31e2 when the second side 31e2 contacts the first connector 36.

[0081] Next, the control unit of the manufacturing apparatus adjusts the inclination of the bottom surface 31c based on the height position of the first side 31e1 measured in the state shown by Figure 6 and the height position of the second side 31e2 measured in the state shown by Figure 8 .

[0082] Specifically, the control unit of the manufacturing apparatus adjusts the inclination of the bottom surface 31c based on the height position of the first side 31e1 and the height position of the second side 31e2 so that the bottom surface 31c and the main surface 36d of the lid member 36c are parallel in the XZ plane cross-section.

[0083] Thereby, the occurrence of inclination between the first connector 36 and the second connector 31 in the XZ plane cross-section can be reduced. Therefore, according to the embodiment, the alignment between the optical fiber cable 32 and the optical pin 36b can be achieved with high precision.

[0084] <Other Embodiments>

[0085] Next, the semiconductor module 1 of various other embodiments will be described with reference to Figures 9 - 13 . Figure 9 It is a top view of the second connector 31 of the other embodiment 1.

[0086] As shown in Figure 9 , in the other embodiment 1, the planar shape of the protruding portion 31b is different from that of the above embodiment. Specifically, in the other embodiment 1, the bottom surface 31c of the protruding portion 31b may be hexagonal instead of rectangular.

[0087] Thereby, since the area of the side surface 31d can be increased, the bonding area of the second connector 31 can be further increased.

[0088] Therefore, according to the other embodiment 1, since the bonding strength between the first connector 36 and the second connector 31 can be further improved, the bonding strength of the optical fiber cable 32 can be further improved. In addition, the bottom surface 31c of the protruding portion 31b may be a polygon such as an octagon.

[0089] Figure 10 It is a top view of the second connector 31 of the other embodiment 2. As shown in Figure 10 , in the other embodiment 2, the bottom surface 31c of the protruding portion 31b may be a rounded rectangle.

[0090] Thereby, since the area of the side surface 31d can be increased, the bonding area of the second connector 31 can be further increased.

[0091] Therefore, according to Other Embodiment 2, the joint strength between the first connector 36 and the second connector 31 can be further improved, and thus the joint strength of the optical fiber cable 32 can be further improved. In addition, the bottom surface 31c of the protruding portion 31b may also be oval.

[0092] Figure 11 is a cross-sectional view of the first connector 36 and the second connector 31 of Other Embodiment 3. As Figure 11 shown, in Other Embodiment 3, the cross-sectional shape of the protruding portion 31b is different from that of the above-described embodiment.

[0093] Specifically, in Other Embodiment 3, when viewed in a cross-section along the XZ plane, the protruding portion 31b may also be a tapered shape that tapers toward the top end of the bottom surface 31c.

[0094] Thus, by the second connector 31 having a tapered protruding portion 31b, not only the bottom surface 31c but also a plurality of side surfaces 31d contribute to the joint with the first connector 36. That is, in Other Embodiment 3, by the second connector 31 having a tapered protruding portion 31b, the joint area of the second connector 31 can be increased.

[0095] Thus, the joint strength between the first connector 36 and the second connector 31 can be improved. Therefore, according to Other Embodiment 3, the joint strength of the optical fiber cable 32 can be improved.

[0096] In addition, in Other Embodiment 3, by forming the protruding portion 31b into a tapered shape that tapers toward the top end of the bottom surface 31c, the alignment process of the second connector 31 can be performed with higher precision. Refer to Figure 12 and Figure 13 for an explanation of the reason.

[0097] Figure 12 and Figure 13 are diagrams for explaining the alignment process of the second connector 31 of Other Embodiment 3.

[0098] Similar to the above-described embodiment, in Other Embodiment 3, first, as Figure 12 shown, the control unit of a manufacturing apparatus (not shown) tilts the second connector 31 with respect to the second direction (the X-axis direction in the figure) in a specified rotation direction R1 (refer to Figure 5 ).

[0099] Then, a first side 31e1 formed by the bottom surface 31c and the side surface 31d1 located on the negative X-axis side with respect to the bottom surface 31c is closer to the first connector 36 than the other sides.

[0100] Next, the control unit of the manufacturing apparatus moves the second connector 31 in an inclined state toward the first connector 36, and brings the first side 31e1 into contact with the main surface 36d of the lid member 36c in the first connector 36.

[0101] Moreover, the control unit of the manufacturing apparatus measures the height position of the first side 31e1 when the first side 31e1 comes into contact with the first connector 36.

[0102] Here, in Other Embodiment 3, since the protruding portion 31b is conical in a cross-sectional view in the XZ plane, a first angle θ1 (see Figure 11 ) formed by the bottom surface 31c and the side surface 31d1 that comes into contact with the first side 31e1 is greater than 90°.

[0103] As a result, since the contact area of the first side 31e1 with respect to the main surface 36d of the lid member 36c can be increased, the control unit of the manufacturing apparatus can highly sensitively detect the contact of the first side 31e1 with the first connector 36.

[0104] That is, in Other Embodiment 3, by making the first angle θ1 formed by the bottom surface 31c and the side surface 31d1 greater than 90°, the control unit of the manufacturing apparatus can accurately measure the height position of the first side 31e1.

[0105] Next, as Figure 13 shown, the control unit of the manufacturing apparatus (not shown) inclines the second connector 31 in a direction opposite to a specified rotation direction R1 (see Figure 5 ) with respect to a second direction (the X-axis direction in the figure) to a rotation direction R2 (see Figure 7 ).

[0106] Then, a second side 31e2 formed by the bottom surface 31c and the side surface 31d2 located on the positive X-axis side with respect to the bottom surface 31c approaches the first connector 36 more than the other sides.

[0107] Next, the control unit of the manufacturing apparatus moves the second connector 31 in an inclined state toward the first connector 36, and brings the second side 31e2 into contact with the main surface 36d of the lid member 36c in the first connector 36.

[0108] Then, the control unit of the manufacturing apparatus measures the height position of the second side 31e2 when the second side 31e2 comes into contact with the first connector 36.

[0109] Here, in Other Embodiment 3, since the protruding portion 31b is conical in a cross-sectional view in the XZ plane, a second angle θ2 (see Figure 11 ) formed by the bottom surface 31c and the side surface 31d2 that comes into contact with the second side 31e2 is greater than 90°.

[0110] Accordingly, since the contact area of the second side 31e2 with respect to the main surface 36d of the lid member 36c can be increased, the control unit of the manufacturing apparatus can detect the contact of the second side 31e2 with the first connector 36 with high sensitivity.

[0111] That is, in Other Embodiment 3, by making the second angle θ2 formed by the bottom surface 31c and the side surface 31d2 greater than 90°, the control unit of the manufacturing apparatus can accurately measure the height position of the second side 31e2.

[0112] As described above, in Other Embodiment 3, by forming the protruding portion 31b in a conical shape in the cross-section in the XZ plane, the situation where an inclination is generated between the first connector 36 and the second connector 31 in the cross-section in the XZ plane can be further reduced.

[0113] Therefore, according to Other Embodiment 3, the optical fiber cable 32 and the optical pin 36b can be aligned with higher accuracy.

[0114] In addition, in Other Embodiment 3, the first angle θ1 formed by the bottom surface 31c and the side surface 31d1 and the second angle θ2 formed by the bottom surface 31c and the side surface 31d2 may also be different.

[0115] For example, in the alignment process, the first angle θ1 corresponding to the first side 31e1 that initially contacts the main surface 36d may also be greater than the second angle θ2 corresponding to the second side 31e2 that then contacts the main surface 36d.

[0116] In this way, by increasing the first angle θ1, the contact of the initially contacting first side 31e1 with the first connector 36 can be detected with higher sensitivity.

[0117] In addition, by making the second angle θ2 smaller than the first angle θ1, the size of the protruding portion 31b in the X-axis direction can be reduced, and thus the size of the second connector 31 can be reduced.

[0118] In addition, in the Figure 11 example, the case where both the first angle θ1 and the second angle θ2 are greater than 90° is shown, but the present disclosure is not limited to this example. For example, the first angle θ1 may be greater than 90° and the second angle θ2 may also be 90°.

[0119] In addition, although not shown, in Other Embodiment 3, in the case of a cross-section in the YZ plane, the protruding portion 31b may also be a conical shape that tapers toward the top of the bottom surface 31c.

[0120] In other words, in Other Embodiment 3, the angle formed by the bottom surface 31c and the side surface 31d3 on the positive Y-axis side (refer to Figure 4 ) and the angle formed by the bottom surface 31c and the side surface 31d4 on the negative Y-axis side (refer toFigure 4 ) The formed angles can also be all greater than 90°.

[0121] Thus, in the alignment process of the second connector 31, the height position of the edge between the bottom surface 31c and the side surface 31d3 can be measured with high precision, and the height position of the edge between the bottom surface 31c and the side surface 31d4 can be measured with high precision.

[0122] Therefore, according to the third embodiment, the situation where an inclination is generated between the first connector 36 and the second connector 31 in the sectional view of the YZ plane can be reduced.

[0123] As described above, the embodiments of the present disclosure have been described, but the present disclosure is not limited to the above embodiments, and various changes can be made without departing from the gist thereof.

[0124] Those skilled in the art can easily derive more effects and other modes. Therefore, the broader modes of the present disclosure are not limited to the specific details and representative embodiments shown and described above. Therefore, various changes can be made without departing from the spirit or scope of the general inventive concept defined by the claims and their equivalents.

[0125] In addition, the present technology can also adopt the following structure.

[0126] (1) A semiconductor module, wherein,

[0127] It has:

[0128] A substrate;

[0129] A first connector disposed on the substrate; and

[0130] A second connector located on one end side of the optical fiber cable and optically connected to the first connector;

[0131] The second connector has:

[0132] A main body portion that houses the optical fiber cable therein; and

[0133] A protruding portion that protrudes from the main body portion, and the tip portion of the optical fiber cable is exposed from the second surface.

[0134] (2) The semiconductor module according to (1) above, wherein,

[0135] The protruding portion protrudes toward the side facing the first connector.

[0136] (3) The semiconductor module according to (1) or (2) above, wherein,

[0137] The first connector has a plurality of optical pins arranged along a specified first direction.

[0138] When viewed in a cross-section of a plane perpendicular to the specified first direction, the protruding portion is a tapered shape that tapers towards the top of the second surface.

[0139] (4) The semiconductor module according to (3), wherein

[0140] The protruding portion has a first side surface and a second side surface that intersect with a second direction in which the optical fiber cable extends from the main body portion.

[0141] A first angle formed by the second surface and the first side surface is different from a second angle formed by the second surface and the second side surface.

[0142] (5) The semiconductor module according to any one of (1) to (4) above, wherein

[0143] When viewed in a cross-section of a plane perpendicular to a second direction in which the optical fiber cable extends from the main body portion, the protruding portion is a tapered shape that tapers towards the top of the second surface.

[0144] (6) The semiconductor module according to any one of (1) to (5) above, wherein

[0145] The protruding portion has a plurality of side surfaces that intersect with the second surface.

[0146] The surface roughness of at least one side surface is greater than the surface roughness of the second surface.

[0147] (7) The semiconductor module according to any one of (1) to (6) above, wherein

[0148] It further has a fixing member that is located between the first connector and the second connector and fixes the first connector and the second connector.

[0149] (8) The semiconductor module according to (7) above, wherein

[0150] The fixing member has:

[0151] A thin wall portion facing the second surface; and

[0152] A thick wall portion that is located around the thin wall portion and is thicker than the thin wall portion.

[0153] (9) A method for manufacturing a semiconductor module, wherein

[0154] Including an alignment process that aligns a first connector and a second connector, the first connector being provided on a first surface of a substrate, the second connector having a protruding portion that protrudes from a main body portion that internally houses an optical fiber cable and the tip portion of the optical fiber cable being exposed from a second surface.

[0155] The alignment process includes:

[0156] A process of inclining the second connector in a specified rotational direction with respect to a second direction in which the optical fiber cable extends from the main body portion, and bringing a first edge formed by the second surface and a first side surface intersecting the second surface into contact with the first connector to measure the height position of the first edge;

[0157] A process of inclining the second connector in a rotational direction opposite to the specified rotational direction with respect to the second direction, and bringing a second edge formed by the second surface and a second side surface located on the opposite side of the first side surface into contact with the first connector to measure the height position of the second edge; and

[0158] A process of adjusting the inclination of the second surface based on the height position of the first edge and the height position of the second edge.

[0159] Description of Reference Numerals

[0160] 1 Semiconductor module

[0161] 2 Substrate

[0162] 21 First surface

[0163] 3, 3a - 3d Optical device

[0164] 31 Second connector

[0165] 31a Main body portion

[0166] 31b Protruding portion

[0167] 31c Bottom surface (an example of the second surface)

[0168] 31d Side surface

[0169] 31d1 Side surface (an example of the first side surface)

[0170] 31d2 Side surface (an example of the second side surface)

[0171] 31e1 First edge

[0172] 31e2 Second edge

[0173] 32 Optical fiber cable

[0174] 35 Optical element (an example of a semiconductor element)

[0175] 36 First connector

[0176] 36a Main body part

[0177] 36b Optical pin

[0178] 36c Cover member

[0179] θ1 First angle

[0180] θ2 Second angle

[0181] R1, R2 Rotation directions

Claims

1. A semiconductor module, wherein, having: a substrate; a first connector disposed on the substrate; and a second connector located on one end side of an optical fiber cable and optically connected to the first connector; the second connector having: a main body portion that houses the optical fiber cable therein; and a protruding portion that protrudes from the main body portion and exposes a tip portion of the optical fiber cable from a second surface.

2. The semiconductor module according to claim 1, wherein the protruding portion protrudes toward a side facing the first connector.

3. The semiconductor module according to claim 1 or 2, wherein the first connector has a plurality of optical pins arranged along a prescribed first direction, when viewed in a cross-section by a plane perpendicular to the prescribed first direction, the protruding portion is a tapered shape that tapers toward a tip of the second surface.

4. The semiconductor module according to claim 3, wherein the protruding portion has a first side surface and a second side surface that intersect a second direction in which the optical fiber cable extends from the main body portion, a first angle formed by the second surface and the first side surface is different from a second angle formed by the second surface and the second side surface.

5. The semiconductor module according to any one of claims 1 to 4, wherein when viewed in a cross-section by a plane perpendicular to a second direction in which the optical fiber cable extends from the main body portion, the protruding portion is a tapered shape that tapers toward a tip of the second surface.

6. The semiconductor module according to any one of claims 1 to 5, wherein the protruding portion has a plurality of side surfaces that intersect the second surface, a surface roughness of at least one side surface is greater than a surface roughness of the second surface.

7. The semiconductor module according to any one of claims 1 to 6, wherein it further has a fixing member that is located between the first connector and the second connector and fixes the first connector and the second connector.

8. The semiconductor module according to claim 7, wherein the fixing member has: a thin wall portion facing the second surface; and a thick wall portion located around the thin wall portion and thicker than the thin wall portion.

9. A method of manufacturing a semiconductor module, wherein it includes an alignment step in which a first connector and a second connector are aligned, the first connector is disposed on a first surface of a substrate, and the second connector has a protruding portion that protrudes from a main body portion that houses an optical fiber cable therein and exposes a tip portion of the optical fiber cable from a second surface, the alignment step includes the following steps: tilting the second connector in a prescribed rotation direction with respect to a second direction in which the optical fiber cable extends from the main body portion, and bringing a first side formed by the second surface and a first side surface that intersects the second surface into contact with the first connector to measure a height position of the first side; tilting the second connector in a rotation direction opposite to the prescribed rotation direction with respect to the second direction, and bringing a second side formed by the second surface and a second side surface located on an opposite side of the first side surface into contact with the first connector to measure a height position of the second side; and Adjust the inclination of the second surface based on the height positions of the first side and the second side.

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