Antenna structure for near field communication and electronic device including the same

Abstract

An electronic device may include: a metal frame; a circuit board; at least one wireless communication circuit disposed on the circuit board; a near field communication (NFC) circuit disposed on the circuit board; a first switching circuit; and a second switching circuit. The metal frame may include: a conductive portion; a first connection portion formed in one direction from the conductive portion; a second connection portion formed in one direction from the conductive portion; and a ground portion formed in one direction from the conductive portion. The grounding part can be arranged between the first connecting part and the second connecting part on the basis of the conductive part.

Description

Technical Field

[0001] Various embodiments of the present invention relate to an antenna structure for short - range wireless communication and an electronic device including the antenna structure. Background Art

[0002] Near - field communication (NFC) is short - range contactless communication and is used for file transfer and secure connection between devices in a near range using the NFC standard protocol. Recently, card emulation functions and point - of - sale (POS) functions using NFC have been implemented in electronic devices, and convenient financial transactions can be carried out between consumers and merchants through NFC communication between terminals without a separate NFC POS.

[0003] The above information may be provided as related art for the purpose of helping to understand the present disclosure. No statement or determination is made as to whether any of the above information can be applied as prior art related to the present disclosure. Summary of the Invention

[0004] Technical Solution

[0005] An electronic device according to various embodiments is provided. The electronic device may include a metal frame, a circuit board, at least one wireless communication circuit disposed on the circuit board, a near - field communication (NFC) communication circuit disposed on the circuit board, a first switch circuit, and a second switch circuit. The metal frame may include a conductive member, a first connection member formed from the conductive member in one direction, a second connection member formed from the conductive member in one direction, and a ground member formed from the conductive member in one direction. The ground member may be disposed between the first connection member and the second connection member based on the conductive member. The first connection member of the metal frame may be electrically connected to at least one wireless communication circuit or the NFC communication circuit through the first switch circuit. The second connection member of the metal frame may be electrically connected to at least one wireless communication circuit or the NFC communication circuit through the second switch circuit. When the NFC communication circuit is electrically connected to the first connection member and the second connection member of the metal frame, a positive signal may be fed to the first connection member and a negative signal may be fed to the second connection member.

[0006] An electronic device according to various embodiments is provided. The electronic device may include a metal frame, a circuit board, and a near-field communication (NFC) communication circuit disposed on the circuit board. The metal frame may include a conductive portion, a first connection portion formed from the conductive portion in one direction, a second connection portion formed from the conductive portion in one direction, and a ground portion formed from the conductive portion in one direction. Based on the conductive portion, the ground portion may be disposed between the first connection portion and the second connection portion. The first connection portion of the metal frame may be electrically connected to the NFC communication circuit. The second connection portion of the metal frame may be electrically connected to the NFC communication circuit. A positive signal may be fed to the first connection portion, and a negative signal may be fed to the second connection portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a block diagram of an electronic device in a network environment.

[0008] Figure 2 illustrates an example of an antenna structure of a metal frame.

[0009] Figure 3a shows an example of a loop for near-field communication (NFC) in an antenna structure for a metal frame.

[0010] Figure 3b shows an example of a magnetic field of an NFC signal.

[0011] Figures 4a to 4b shows an example of an antenna structure shared by an NFC communication circuit and a wireless communication circuit.

[0012] Figure 5a , Figure 5b and Figure 5c are diagrams for explaining the principle of an antenna structure and a loop of an NFC communication circuit.

[0013] Figure 6 shows an example of a loop formed by an antenna structure and a wireless communication circuit.

[0014] Figure 7a and Figure 7b show an example of an antenna structure shared by an NFC communication circuit and a wireless communication circuit.

[0015] Figures 8a to 8b shows an example of an arrangement of an antenna structure for NFC.

[0016] Figures 9a to 9b shows an example of an antenna structure for NFC disposed at an upper end of an electronic device.

[0017] Figure 10a , Figure 10b and Figure 10cAn example in which an antenna structure for NFC is provided at the upper end of an electronic device is shown. Detailed implementation

[0018] The terms used in this disclosure are only for describing specific embodiments and are not intended to limit the scope of another embodiment. Unless the context clearly indicates otherwise, singular expressions may include plural expressions. The terms used herein (including technical or scientific terms) may have the same meaning as commonly understood by those of ordinary skill in the art described in this disclosure. Among the terms used in this disclosure, terms defined in a general dictionary may be interpreted as having the same or similar meanings as the context meanings in the related art, and are not interpreted as ideal or overly formal meanings unless clearly defined in this disclosure. In some cases, even the terms defined in this disclosure may not be interpreted as excluding embodiments of this disclosure.

[0019] In various embodiments of the disclosure described below, hardware methods are described as examples. However, since various embodiments of the disclosure include technologies using both hardware and software, various embodiments of the disclosure do not exclude software-based methods.

[0020] For ease of explanation, terms referring to components of an electronic device used in the following description (e.g., substrate, printed circuit board (PCB), flexible PCB (FPCB), printed board assembly (PBA), module, antenna, antenna element, circuit, processor, chip, element, or device), terms referring to the shape of components (e.g., structure, structural object, support part, contact part, or protrusion), terms referring to the connection part between structures (e.g., connection part, contact part, support part, contact structure, conductive member, or assembly), terms referring to the open structure of an antenna (e.g., slit, slot, or opening), terms referring to a circuit (e.g., PCB, FPCB, signal line, ground line, feed line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, distributor, coupler, or combiner), etc. are exemplified. Therefore, this disclosure is not limited to the terms described below, and another term having an equivalent technical meaning may be used. In addition, terms such as “… unit”, “… device”, “… object”, and “… structure” used below may mean at least one shaped structure or may mean a unit of processing function.

[0021] In addition, in the present disclosure, the terms "greater than" or "less than" may be used to determine whether a specific condition is met or achieved, but this is merely a description of an illustrative example and does not exclude the description of "greater than or equal to" or "less than or equal to". A condition described as "greater than or equal to" may be replaced with "greater than", a condition described as "less than or equal to" may be replaced with "less than", and a condition described as "greater than or equal to and less than" may be replaced with "greater than and less than or equal to". In addition, hereinafter, 'A' to 'B' refers to at least one of the elements from A (including A) to B (including B). Hereinafter, 'C' and / or 'D' refers to including at least one of 'C' or 'D', that is, {'C', 'D', and 'C and D'}.

[0022] Hereinafter, various embodiments of the present disclosure relate to an electronic device including a conductive part that operates as an NFC antenna radiator or a non-NFC antenna radiator when a circuit path changes. For example, various embodiments of the present disclosure describe a technique for using a conductive member of a frame at an upper end or a lower end of an electronic device as an antenna. The conductive member of the frame may be separated by a segmented part of the frame.

[0023] Figure 1 is a block diagram showing an electronic device 101 in a network environment 100 according to various embodiments.

[0024] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one component (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single component (e.g., the display module 160).

[0025] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled to the processor 120, and may perform various data processing or computations. According to an embodiment, as at least part of the data processing or computation, the processor 120 may store commands or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or a secondary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently of or in combination with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the secondary processor 123, the secondary processor 123 may be adapted to consume less power than the main processor 121 or be specific to a designated function. The secondary processor 123 may be implemented separately from or as part of the main processor 121.

[0026] The auxiliary processor 123 may replace the main processor 121 when the main processor 121 is in an inactive (e.g., sleep) state, or may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121 when the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) related to the function of the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. An artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, by the electronic device 101 that performs artificial intelligence or via a separate server (e.g., the server 108). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of them, but is not limited thereto. The artificial intelligence model may additionally or alternatively include a software structure in addition to the hardware structure.

[0027] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, input data or output data of software (e.g., the program 140) and commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0028] The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0029] The input module 150 may receive commands or data to be used by another component of the electronic device 101 (e.g., the processor 120) from the outside of the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0030] The sound output module 155 may output a sound signal to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing a recording. The receiver may be used for receiving an incoming call. According to an embodiment, the receiver may be implemented separately from the speaker or may be implemented as part of the speaker.

[0031] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure an intensity of a force caused by the touch.

[0032] The audio module 170 may convert sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or may output sound via the sound output module 155 or a headset of an external electronic device (e.g., the electronic device 102) directly (e.g., wired) or wirelessly coupled to the electronic device 101.

[0033] The sensor module 176 may detect an operating state of the electronic device 101 (e.g., power or temperature) or an environmental state outside the electronic device 101 (e.g., a state of a user), and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface 177 may support one or more specified protocols for directly (e.g., wired) or wirelessly coupling the electronic device 101 to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0035] The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headset connector).

[0036] The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus, which can be recognized by the user via his tactile sense or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, an electric motor, a piezoelectric element, or an electrical stimulator.

[0037] The camera module 180 may capture a still image or a moving image. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0038] The power management module 188 may manage the power provided to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

[0039] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors that can operate independently of the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). Each corresponding one of these communication modules may be via a first network 198 (e.g., Bluetooth™, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may use the subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196 to identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199).

[0041] The wireless communication module 192 may support 5G networks and next-generation communication technologies after 4G networks, such as New Radio (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable and low-latency communication (URLLC). The wireless communication module 192 may support high frequency bands (e.g., mmWave bands) to achieve, for example, high data transfer rates. The wireless communication module 192 may support various technologies for ensuring performance in high frequency bands, such as, for example, beamforming, massive multiple-input and multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for achieving eMBB (e.g., 20 Gbps or greater), a loss coverage for achieving mMTC (e.g., 164 dB or less), or a U-plane latency for achieving URLLC (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or a round-trip of 1 ms or less).

[0042] The antenna module 197 may transmit signals or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive signals or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna, which includes a radiation element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 198 or the second network 199 may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Then, signals or power may be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiation element may be additionally formed as part of the antenna module 197.

[0043] According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to an embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the specified high frequency band.

[0044] At least some of the above components may be coupled to each other and transmit signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, a general-purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

[0045] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 coupled to a second network 199. Each of the electronic devices 102 or 104 may be a device of the same type or a different type from the electronic device 101. According to an embodiment, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 is to perform a function or service automatically or in response to a request from a user or another device, instead of performing the function or service or in addition to performing the function or service, the electronic device 101 may request one or more external electronic devices to perform at least a part of the function or service. One or more of the receiving external electronic devices may perform at least a part of the requested function or service, or an additional function or an additional service related to the request, and transmit the result of the performance to the electronic device 101. The electronic device 101 may provide the result as at least a part of a reply to the request with or without further processing of the result. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing techniques may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide an ultra-low latency service. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

[0046] Figure 2An example of an antenna structure of a metal frame according to an embodiment is shown. When the NFC antenna is positioned to face the rear surface of the electronic device 101, when NFC communication is performed between the electronic device 101 and another electronic device (e.g., the electronic device 101), the rear surfaces face each other, so it may be difficult for one device to view or operate the screen. To increase the convenience related to NFC, at least a part of the metal frame 210, which is a side member of the electronic device 101, can be used as an NFC antenna. Hereinafter, a region of the electronic device 101 including one end facing the upward direction (e.g., the (+)y-axis direction) may be referred to as the upper end region of the electronic device 101. A region of the electronic device 101 including one end facing the downward direction (e.g., the (-)y-axis direction) may be referred to as the lower end region of the electronic device 101. A region of the electronic device 101 including one end facing the lateral direction (e.g., the (-)x-axis direction or the (+)x-axis direction) may be referred to as the side region of the electronic device 101.

[0047] Referring to Figure 2 , the electronic device 101 may include a metal frame 210. In an embodiment, the volume key 203 or the power key 205 may be located on the side surface of the electronic device 101. In an embodiment, the metal frame 210 may include a plurality of conductive parts. For example, when a part of the metal frame 210 is located between non-conductive parts (e.g., the non-conductive part 212), the conductive parts may be separated. For example, the metal frame 210 may include a first conductive part 211 and a second conductive part 213.

[0048] According to an embodiment, the metal frame 210 may include a ground portion 230, a first connection portion 240, and / or a second connection portion 250. For example, the ground portion 230 may be formed in a direction from the second conductive portion 213 toward the inside of the electronic device 101. For example, in order to physically connect to a support member of the metal frame 210, the ground portion 230 may have a shape protruding from the second conductive portion 213. The ground portion 230 may be used to ground signals for wireless communication (e.g., NFC communication, non-NFC communication). In an embodiment, the metal frame 210 may include a first connection portion 240. The first connection portion 240 may refer to a region (e.g., a protrusion) formed in a direction from the second conductive portion 213 of the metal frame 210 toward the inside of the electronic device 101. For example, the first connection portion 240 may be electrically connected to a circuit board (e.g., a printed circuit board (PCB) or a printed board assembly (PBA)) on which a wireless communication circuit and an NFC communication circuit of the electronic device 101 are disposed. For example, an RF signal may be fed to the second conductive portion 213 through the first connection portion 240. The first connection portion 240 may be electrically connected to a point 241 of the support member through the ground portion 230. The first connection portion 240 may correspond to a (+) port, and the point 241 may correspond to a (-) port or ground (GND). The first connection portion 240 may be connected to the wireless communication circuit. In an embodiment, the metal frame 210 may include a second connection portion 250. The second connection portion 250 may refer to a region (e.g., a protrusion) formed in a direction from the second conductive portion 213 of the metal frame 210 toward the inside of the electronic device 101. For example, the second connection portion 250 may be electrically connected to a circuit board on which a wireless communication circuit and an NFC communication circuit of the electronic device 101 are disposed. For example, an RF signal may be fed to the second conductive portion 213 through the second connection portion 250. The second connection portion 250 may be electrically connected to a point 251 of the support member through the ground portion 230. The second connection portion 250 may correspond to a (+) port, and the point 251 may correspond to a (-) port or ground. The second connection portion 250 may be connected to the wireless communication circuit.

[0049] In an embodiment, if the feeding part of the electronic device 101 is connected to the first connection part 240, at least a part of the metal frame 210 including the second conductive part 213 may form a loop for operating as a first antenna 245. If the feeding part of the electronic device 101 is connected to the second connection part 250, at least a part of the metal frame 210 including the second conductive part 213 may form a loop for operating as a second antenna 255. The loop for the first antenna 245 and the loop for the second antenna 255 may be arranged side by side and may overlap each other at the ground part 230. The feeding part may be used to feed RF signals of a non-NFC communication circuit, but may also be used to feed RF signals of an NFC communication circuit. According to an embodiment, the electronic device 101 may perform NFC communication by feeding RF signals for NFC communication rather than RF signals for non-NFC communication to the first connection part 240 and the second connection part 250. In an embodiment, a switch circuit (or switch module) inside the electronic device 101 may be used to feed RF signals for NFC communication. For example, RF signals for non-NFC communication may be transmitted in a first frequency band (e.g., about 600 MHz or higher). For example, RF signals for NFC communication may be transmitted in a second frequency band (e.g., 14 MHz or less).

[0050] Figure 3a An example of a loop for near field communication (NFC) in a metal frame according to an embodiment is shown. For the same description between the drawings, the same reference numerals may be referred to.

[0051] Referring to Figure 3a , the metal frame of an electronic device (e.g., the electronic device 101) may include a first conductive part 211 and a second conductive part 213. For example, the second conductive part 213 may be arranged in one direction (e.g., the y-axis direction). For example, the first connection part 240 and the second connection part 250 may have a shape protruding from the second conductive part 213 in one direction (e.g., the x-axis direction). The electronic device 101 may feed a first signal to the first connection part 240. For example, the first connection part 240 may be electrically connected to the communication circuit of the electronic device 101 through physical contact (e.g., contact via a C-shaped clip) with a circuit board (e.g., a PCB or PBA) on which the communication circuit of the electronic device 101 is provided. The electronic device 101 may feed a second signal to the second connection part 250. For example, the second connection part 250 may be electrically connected through physical contact (e.g., contact via a C-shaped clip) with the circuit board on which the communication circuit of the electronic device 101 is provided.

[0052] According to an embodiment, the NFC communication circuit may feed a positive signal to the first connection part 240 and a negative signal to the second connection part 250. The first connection part 240 may correspond to the first port, and the second connection part 250 may correspond to the second port. The (+) terminal of the NFC communication circuit may be connected to the first port, and the (-) terminal of the NFC communication circuit may be connected to the second port. When RF signals with different polarities are fed to the first connection part 240 and the second connection part 250, a circuit path of the loop 310 may be formed in the order of the first connection part 240, the second conductive part 213, and the second connection part 250. For example, the loop 310 may be formed to surround a first loop (e.g., a loop for the first antenna 245) formed by the first connection part 240, a part of the second conductive part 213, the ground part 230, and the support member 350, and another loop (e.g., a loop for the second antenna 255) formed by the second connection part 250, the support member 350, the ground part 230, and another part of the second conductive part 213. For example, current may flow in a loop form within the loop 310 formed by the first connection part 240, the second conductive part 213, the second connection part 250, and the support member 350. For example, the current flowing along the loop 310 may be generated by the positive signal and the negative signal. In an embodiment, the loop 310 formed by at least a part of the metal frame 210 may operate as a loop antenna for NFC.

[0053] Figure 3b An example of the magnetic field of the NFC signal according to an embodiment is shown. The NFC signal means a radiation signal according to the feeding of the RF signal of the NFC communication circuit. For the same description between the drawings, the same reference numerals may be referred to.

[0054] Referring to Figure 3b , when the RF signal fed to the first connection part 240 is radiated, a relatively high magnetic field may be observed near the first connection part 240. When the RF signal fed to the second connection part 250 is radiated, a relatively high magnetic field may be observed near the second connection part 250. Additionally, a high magnetic field may be observed in the region between the first connection part 240 and the second connection part 250 other than the ground part 230. The magnetic field may be formed by the current flowing through the loop (e.g., the loop 310) between the first connection part 240 and the second connection part 250.

[0055] Figures 4a to 4b An example of the antenna structure shared by the NFC communication circuit and the wireless communication circuit according to an embodiment is shown. For the same description between the drawings, the same reference numerals may be referred to.

[0056] Referring to Figure 4a, the antenna structure 401 may include a metal frame 210. At least a part of the metal frame 210, which is a housing of an electronic device (e.g., the electronic device 101), may be disposed outside the electronic device 101. The first conductive part 211 and the second conductive part 213 of the metal frame 210 may be disposed outside the electronic device 101, and the non-conductive part 212 may be formed between the first conductive part 211 and the second conductive part 213.

[0057] According to an embodiment, at least a part of the metal frame 210 may include a protrusion (e.g., the first connection part 240 or the second connection part 250) for electrical connection between the circuit board and the second conductive part 213. In an embodiment, at least one wireless communication circuit may be disposed on the circuit board. At least one wireless communication circuit may be disposed in the circuit block 430 included in the circuit board. For example, the first connection part 240 of the metal frame 210 may include a protrusion protruding inward from the second conductive part 213. The first connection part 240 may be electrically connected to a wireless communication circuit (e.g., the first non-NFC communication circuit 411a or the NFC communication circuit 413) through the first feeding part 440 (e.g., contact via a C-shaped clip). For example, the second connection part 250 of the metal frame 210 may include a protrusion protruding inward from the second conductive part 213. The second connection part 250 may be connected to a wireless communication circuit (e.g., the second non-NFC communication circuit 411b or the NFC communication circuit 413) through the second feeding part 450 (e.g., contact via a C-shaped clip).

[0058] According to an embodiment, at least a part of the metal frame 210 may include a support area connected to the support member 350. The metal frame 210 may include a ground part 230 as the support area. The RF signal fed through the first connection part 240 or the second connection part 250 may generate a loop current through the part 213a of the second conductive part 213 and the part 213b of the second conductive part 213. Although not shown in Figure 4a , according to another embodiment, the ground part 230 is not always connected to the support member 350 and may be selectively short-circuited or connected through a switch circuit. The connection between the ground part 230 and the support member 350 through the switch circuit may be referred to Figure 5c for description. In addition, the metal frame 210 may include a support area 480a as the support area.

[0059] According to an embodiment, at least a part of the metal frame 210 may be electrically connected to a circuit board including the circuit block 430. For example, the circuit board may include a PCB. Additionally, for example, the circuit board may refer to a component in which a PCB is processed on at least a part of the metal frame 210, i.e., a PBA. Hereinafter, the circuit board may be referred to as a main board, a PBA, or a PCB.

[0060] According to an embodiment, at least one wireless communication circuit may be provided on a circuit board. The circuit block 430 may include the at least one wireless communication circuit. According to an embodiment, at least one non-NFC communication circuit may be provided on the circuit board. The circuit block 430 may include the at least one non-NFC communication circuit. For example, the at least one non-NFC communication circuit may include a first non-NFC communication circuit 411a and a second non-NFC communication circuit 411b. For example, the non-NFC communication circuit may include a radio frequency front end (RFFE) for cellular communication of a mobile network. According to an embodiment, the NFC communication circuit 413 may be provided on the circuit board. The NFC communication circuit 413 may feed a positive signal through a first port (e.g., a (+) terminal). The NFC communication circuit 413 may feed a negative signal through a second port (e.g., a (-) terminal).

[0061] According to an embodiment, the at least one non-NFC communication circuit may radiate an RF signal using an antenna structure including a second conductive part 213, a ground part 230, a first connection part 240, and a second connection part 250. For example, a first loop (e.g., a loop formed in the order of the first connection part 240, a part 213a of the second conductive part 213, the ground part 230, and the support member 350) may operate as an antenna of the first non-NFC communication circuit 411a. Due to the support area 480a of the metal frame 210, one side of the antenna structure 401 may have an enclosed structure. For example, the antenna structure including the enclosed structure may operate as a slot antenna or a slotted antenna. Additionally, for example, a second loop (e.g., a loop formed in the order of the second connection part 250, the support member 350, the ground part 230, and a part 213b of the second conductive part 213) may operate as an antenna of the second non-NFC communication circuit 411b. The other side of the antenna structure 401 may have an open structure, and the antenna structure including the open structure may operate as an inverted F antenna.

[0062] According to an embodiment, the NFC communication circuit 413 may share the antenna structure 401 of at least one non-NFC communication circuit. For example, a switching circuit (e.g., the first switching circuit 441 or the second switching circuit 451) may be used for compatibility between the NFC communication circuit 413 and at least one non-NFC communication circuit. For example, each switching circuit may be replaced with components (e.g., a switching module, a filter) having substantially the same technical functions. As an example, in the following drawings, the switching circuit is illustrated as a single switch. In an embodiment, in order to share the antenna structure 401, the first switching circuit 441 may be disposed on a circuit board. The circuit block 430 may include the first switching circuit 441. Through the first switching circuit 441, the first feeding portion 440 for the first connection portion 240 may be selectively electrically connected to a non-NFC communication circuit (e.g., the first non-NFC communication circuit 411a) or the NFC communication circuit 413. In an embodiment, in order to share the antenna structure 401, the second switching circuit 451 may be disposed on a circuit board. The circuit block 430 may include the second switching circuit 451. Through the second switching circuit 451, the second feeding portion 450 for the second connection portion 250 may be selectively electrically connected to a non-NFC communication circuit (e.g., the second non-NFC communication circuit 411b) or the NFC communication circuit 413. According to an embodiment, a processor (e.g., the processor 120) may be configured to select an NFC operation mode or a non-NFC operation mode by controlling the first switching circuit 441 and the second switching circuit 451.

[0063] Referring to Figure 4b , components of the circuit block 430 (e.g., the first non-NFC communication circuit 411a, the second non-NFC communication circuit 411a, or the NFC communication circuit 413) may be electrically connected to side members (e.g., the second conductive portion 213, the first connection portion 240, and the second connection portion 250) of the metal frame 210 of the electronic device (e.g., the electronic device 101). According to an embodiment, the first connection portion 240 may be connected to the first port (e.g., the (+) terminal) of the NFC communication circuit 413 through the first switching circuit 441. For example, a positive signal of the NFC communication circuit 413 may be fed to the first connection portion 240 through the first port. For example, the first connection portion 240 may be a feeding point. According to an embodiment, the second connection portion 250 may be connected to the second port (e.g., the (-) terminal) of the NFC communication circuit 413 through the second switching circuit 451. For example, a negative signal of the NFC communication circuit 413 may be fed to the second connection portion 250 through the second port. For example, the second connection portion 250 may be a feeding point.

[0064] Figures 5a to 5cIt is a diagram for explaining the principle of the loop of the antenna structure and the NFC communication circuit according to an embodiment. For the same description between the drawings, the same reference numerals can be referred to.

[0065] Referring to Figure 5a , an electronic device (e.g., electronic device 101) can be electrically connected to the NFC communication circuit 413 and the antenna structure 501 to perform NFC communication. In an embodiment, the NFC communication circuit 413 can generate a balanced signal. The NFC communication circuit 413 can output a positive signal through a first port (e.g., (+) terminal). The NFC communication circuit 413 can output a negative signal through a second port (e.g., (-) terminal). The first switch circuit 441 can selectively electrically connect the first non-NFC communication circuit 411a or the NFC communication circuit 413 to the first connection portion 240. If the first switch 411 electrically connects the NFC communication circuit 413 to the first connection portion 240, the NFC communication circuit 413 can feed a positive signal. The positive signal can be provided to the first connection portion 240 through the first switch circuit 441. When the first port (e.g., (+) terminal) and the second port (e.g., (-) terminal) of the NFC communication circuit 413 are connected through the first connection portion 240 and the second connection portion 250, a loop radiation current can be generated. For example, the loop current can flow along the first loop 540 (e.g., a loop formed in the order of the first connection portion 240, a portion 213a of the second conductive portion 213, the ground portion 230, and the support member 350). The second switch circuit 451 can selectively electrically connect the second non-NFC communication circuit 411b or the NFC communication circuit 413 to the second connection portion 250. If the second switch circuit 451 electrically connects the NFC communication circuit 413 to the second connection portion 250, the NFC communication circuit 413 can feed a negative signal. The negative signal can be provided to the second connection portion 250 through the second switch circuit 451. The loop current can flow along the second loop 550 (e.g., a loop formed in the order of the ground portion 230, a portion 213b of the second conductive portion 213, the second connection portion 250, and the support member 350).

[0066] According to an embodiment, in a case where it is difficult to generate a balanced signal in the NFC communication circuit 413, a balun can be additionally used. Through the balun, the signal of the NFC communication circuit 413 can output a positive signal and a negative signal. Through the balun, the NFC communication circuit 413 can transmit the positive signal to the first feeding portion 440, and can transmit the negative signal to the second feeding portion 450.

[0067] To implement the NFC antenna according to embodiments of the present disclosure, a first loop 540 and a second loop 550 formed by the metal frame 210 may be arranged side by side. Due to the common ground, the first loop 540 and the second loop 550 can be formed. When the first loop 540 and the second loop 550 are offset in a common ground region corresponding to the ground portion 230 overlapping the first loop 540 and the second loop 540, a radiation current having the entire loop 510 can be generated. Through the positive signal and the negative signal, the entire loop 510 can be formed on the antenna structure 501 in the order of the first connection portion 240, the second conductive portion 213, the second connection portion 250, and the support member 350. The entire loop 510 can surround the first loop 540 and the second loop 550.

[0068] In Figure 5a , some components (e.g., the first non-NFC communication circuit 411a and the second non-NFC communication circuit 411b, the first switch circuit 441 and the second switch circuit 451) are shown within some regions of the metal frame 210, but such illustration is merely a circuit description of some components of the metal frame 210 and does not mean that such some components should physically be located between at least a portion (e.g., the second conductive portion 250) of the metal frame 210 and at least a portion (e.g., the support member 350). For example, the first non-NFC communication circuit 411a, the second non-NFC communication circuit 411b, the first switch circuit 441, and the second switch circuit 451 may be disposed on a circuit board (e.g., a PBA integrally formed with the metal frame or a separate PCB) inside the electronic device 101.

[0069] Referring to Figure 5b , Figure 5a The connection structure of the NFC communication circuit 413 and the metal frame 210 in

[0070] can be represented by an electrical equivalent circuit. The first inductor 520a (L1) represents the inductor generated in the first loop 540, and the second inductor 520b (L2) represents the inductor generated in the second loop 550.

[0070] Referencing Figure 5c , a switch circuit 590 including switches or lumped elements (e.g., resistors, inductors, or capacitors) may be disposed in the region where the first loop 540 and the second loop 550 overlap. For example, the ground portion 230 may be selectively electrically connected to the ground through the switch circuit 590 including switches or lumped elements. According to another embodiment, a region of the metal frame may be short-circuited by turning on or off a switch.

[0071] In Figures 5a to 5cIn the above, in order to adaptively operate the NFC operation mode and the non-NFC operation mode, a switch has been illustrated, but the embodiments of the present disclosure are not limited thereto. According to an embodiment, if at least a part of the metal frame 210 is only used as an antenna for NFC, the switch may be omitted. At this time, the NFC circuit 413 may be electrically connected to the first connection part 240 through the first feeding part (for example, the first feeding part 440) and electrically connected to the second connection part 250 through the second feeding part (for example, the second feeding part 450) without a separate switch.

[0072] Figure 6 An example of the loop formation between the antenna structure and the wireless communication circuit according to an embodiment is shown. The antenna structure may include a first connection part 240, a second conductive part 213, a ground part 230, and a second connection part 250. For the same description between the drawings, the same reference numerals may be referred to.

[0073] Refer to Figure 6 Through at least one switch, the antenna structure may be connected to the NFC communication circuit 413 or another communication circuit. According to an embodiment, in the case where NFC communication is not performed, the first non-NFC communication circuit 411a and the second non-NFC communication circuit 411b may be electrically connected to the antenna structure through the switch. For example, through the first switch circuit (for example, the first switch circuit 441), the first connection part (for example, the first connection part 240) of the antenna structure may be electrically connected to the first non-NFC communication circuit 411a. Additionally, for example, through the second switch circuit (for example, the second switch circuit 451), the second connection part (for example, the second connection part 250) of the antenna structure may be electrically connected to the second non-NFC communication circuit 411b.

[0074] According to an embodiment, the first non-NFC communication circuit 411a may radiate a signal through the antenna 245 using the first loop (for example, the first loop 540). The inductance generated when the RF signal of the first non-NFC communication circuit 411a passes through the first loop 540 may be represented as L1. For example, the first loop 540 may be formed to flow in the order of the first connection part 240, a part 213a of the second conductive part 213, the ground part 230, and the support member 350.

[0075] According to an embodiment, the second non-NFC communication circuit 411b may radiate a signal through the antenna 255 using the second loop (for example, the second loop 550). The inductance generated when the RF signal of the second non-NFC communication circuit 411b passes through the second loop 550 may be represented as L2. For example, the second loop 550 may be formed to flow in the order of the ground part 230, a part 213b of the second conductive part 213, and the second connection part 250.

[0076] Figure 7a and Figure 7b shows an example of an antenna structure shared by an NFC communication circuit and a wireless communication circuit according to an embodiment. For the same description between the drawings, the same reference numerals can be referred to.

[0077] Referring to Figure 7a , the antenna structure 701 may include a metal frame 210. For example, when the electronic device 101 operates in a non-NFC operation mode, the antenna structure 701 may operate as an antenna for a first non-NFC communication circuit 411a and an antenna for a second non-NFC communication circuit 411b. At least a part of the antenna structure 701 may operate as an antenna for the first non-NFC communication circuit 411a. At least a part of the antenna structure 701 may operate as an antenna for the second non-NFC communication circuit 411a. The second conductive part 213 of the metal frame 210 may be connected to the support member 350 through the ground part 230. The ground part 230 may be used as a common ground for the two antennas.

[0078] Unlike Figures 4a to 5a , in an embodiment, one side of the antenna structure 701 may be open like the other side of the antenna structure 701. For example, for the first non-NFC circuit 411a, without a support area 480a, a structure including the first connection part 240, a part 213a of the second conductive part 213, and the ground part 230 may operate as an inverted-F antenna. In substantially the same manner as Figures 4a to 5a , for the second non-NFC circuit 411b, a structure including the second connection part 250, a part 213b of the second conductive part 213, and the ground part 230 may operate as an inverted-F antenna.

[0079] When the electronic device 101 operates in an NFC operation mode, the NFC circuit 413 may be electrically connected to the antenna structure 701. In substantially the same manner as Figure 5a , a first loop 540 and a second loop 550 may be formed, and an entire loop 510 for NFC signals may be formed. For the electrical connection between the NFC circuit 413 and the antenna structure 701, the electrical equivalent circuit of Figure 5b may be referred to.

[0080] Referring to Figure 7b, the antenna structure 703 may include a metal frame 210. In an embodiment, when the electronic device 101 operates in a non-NFC operation mode, the antenna structure 703 may operate as an antenna for the first non-NFC communication circuit 411a and an antenna for the second non-NFC communication circuit 411b. For example, at least a part of the antenna structure 703 may operate as an antenna for the first non-NFC communication circuit 411a. For example, at least a part of the antenna structure 703 may operate as an antenna for the second non-NFC communication circuit 411a. The second conductive portion 213 of the metal frame 210 may be connected to the support member 350 through the ground portion 230. The ground portion 230 may be used as a common ground for the two antennas.

[0081] The first support member 580a may be disposed on one side of the antenna structure 703. A portion 213a of the second conductive portion 213 may be connected to the support member 350 through the first support member 580a. For the first non-NFC circuit 411a, the structure having an enclosed structure through the first support member 580a may include the first support member 580a, the first connection portion 240, the portion 213a of the second conductive portion 213, and the ground portion 230. This structure may operate as a slot antenna or a slit antenna. Different from Figures 4a to 5a According to an embodiment, the second support member 580b may be disposed on one side of the antenna structure 703. A portion 213b of the second conductive portion 213 may be connected to the support member 350 through the second support member 580b. For the second non-NFC circuit 411b, the structure having an enclosed structure through the second support member 580b may include the second support member 580b, the second connection portion 250, the portion 213b of the second conductive portion 213, and the ground portion 230. This structure may operate as a slot antenna or a slit antenna.

[0082] When the electronic device 101 operates in the NFC operation mode, the NFC circuit 413 may be electrically connected to the antenna structure 703. In a manner substantially the same as Figure 5a above, the first loop 540 and the second loop 550 may be formed, and the entire loop 510 for the NFC signal may be formed. For the electrical connection between the NFC circuit 413 and the antenna structure 703, reference may be made to Figure 5b the electrical equivalent circuit.

[0083] Figures 8a to 8b An example of the arrangement of the antenna structure for NFC is shown. Here, the antenna structure for NFC may include Figures 4a to 7bThe ground portion 230, the first connection portion 240, the second conductive portion 213, and / or the second connection portion 250 described in [reference]. According to an embodiment, the second conductive portion 213, which is a portion of the metal frame 210 disposed outside the electronic device 101, may operate as a radiator, and a radiation current of the NFC signal flows through the radiator by feeding a positive signal to the first connection portion 240 and feeding a negative signal to the second connection portion 250.

[0084] Reference Figure 8a , the electronic device 101 may include two antenna structures for NFC. According to an embodiment, the electronic device 101 may include antenna structures in at least two of a plurality of regions (e.g., a first region 810, a second region 820, a third region 830, and a fourth region 840). For example, a first antenna structure for NFC may be disposed in the first region 810 of the side surface 801 of the electronic device 101, where the volume keys 203 and the power key 205 are disposed in the first region 810. In addition, a second antenna structure 820 for NFC may be disposed in the second region 820 of the other side surface 802 opposite to the side surface 801 of the electronic device 101. Since the first antenna structure 810 for NFC and the second antenna structure 820 for NFC are disposed in different directions, the region to which the NFC signal is radiated may be expanded.

[0085] For example, the antenna structure may be disposed in the third region 830. Regarding the antenna structure, reference may be made to Figures 9a to 9b the description of the antenna structure. In addition, for example, the antenna structure may be disposed in the fourth region 840. Regarding the antenna structure, reference may be made to Figures 10a to 10c the description of the antenna structure. By Figures 9a to 10c the antenna structure, the antenna structure for non-NFC and the antenna structure for NFC may coexist in the electronic device 101.

[0086] Reference Figure 8b , the electronic device 101 may include two antenna structures for NFC. The electronic device 101 may perform NFC communication with another electronic device (e.g., the electronic device 102) through one of the antenna structures for NFC disposed on both sides 801 and 802 of the electronic device 101. For example, a user of the electronic device 101 may use the NFC function with another electronic device while watching the display. As an example 850, the electronic device 101 may perform NFC communication with another electronic device through the antenna structure on the side where a key (e.g., the volume key 203 or the power key 205) is disposed. As another example 860, the electronic device 101 may perform NFC communication with another electronic device through the antenna structure on the side opposite to the side where a key (e.g., the volume key 203 or the power key 205) is disposed.

[0087] Since the hardware keys (e.g., volume key 203 or power key 205) are located at positions where an antenna structure for NFC according to an embodiment of the present disclosure is formed, a user can recognize the hardware keys as indicators in which the NFC antenna is disposed. For example, since the antenna structure for NFC uses a part of a metal frame near the hardware key disposed on one side as the NFC antenna, the position of the NFC antenna can be clearly recognized by the user.

[0088] In Figure 2 a to Figure 8b structures for operating as an antenna for NFC by using a part (e.g., second conductive part 213) formed on one side of the metal frame 210 as a radiator are described. The structure according to an embodiment of the present disclosure can use conductive parts located at the upper end or the lower end of the electronic device 101 and the side surface of the electronic device 101 as radiators for NFC signals. Hereinafter, an example of forming an antenna structure for NFC according to an embodiment of the present disclosure in the upper end of the electronic device 101 will be described with reference to Figures 9a to 10c FIG.

[0089] Figures 9a to 9b FIG. shows an example in which an antenna structure for NFC according to an embodiment is disposed at the upper end of an electronic device (e.g., electronic device 101). The metal frame 210 of the electronic device 101 may include a plurality of conductive parts. For example, the conductive parts may be segmented by non-conductive parts, which are segmented parts. The conductive parts to be described later may refer to the conductive parts among the plurality of conductive parts that are disposed at the upper end (e.g., in the (+)y-axis direction) of the electronic device 101.

[0090] Referring to Figure 9a FIG., the metal frame 210 may include a conductive part 913 disposed at the upper end of the electronic device 101 (e.g., a region of the electronic device 101 including an end facing the (+)y-axis direction). In an embodiment, the first connection part 240 may be formed to face the inside of the electronic device 101 from the conductive part 913. In an embodiment, the second connection part 250 may be formed to face the inside of the electronic device 101 from the conductive part 913. The ground part 230 may be disposed between the conductive part 913 and the support member 910 of the metal frame 210. For example, since the ground part 230, which is a common ground path, is located near an outer corner of the electronic device 101, the operation area of the NFC function can be extended. According to an embodiment, the ground part 230 may be integrally formed with the conductive part 913 and the support member 910. The support member 910 may include a first feeding part 440 and a second feeding part 450. The first feeding part 440 may be electrically connected to the first connection part 240. Although in Figure 9aAlthough not shown in the figure, the first feeding part 440 may include an elastic structure (e.g., a C-shaped clip), and may be electrically connected to the first connection part 240 through the elastic structure. The second feeding part 450 may be electrically connected to the second connection part 250. The second feeding part 450 may include an elastic structure (e.g., a C-shaped clip), and may be electrically connected to the second connection part 250 through the elastic structure.

[0091] Referring Figure 9b , the support member 910 of the metal frame 210 may be electrically connected to a circuit board including the circuit block 430. As an example, the circuit board may be provided together with the support member 910 in the form of a PBA. As another example, the circuit board (e.g., the circuit block 430) may be provided as a separate PCB on the surface of the support member 910. The first non-NFC communication circuit 411a and the second non-NFC communication circuit 411b may be included in the circuit board. In addition, the NFC communication circuit 413 may be provided on the circuit board. The NFC communication circuit 413 may feed a positive signal through the first switch circuit 441 and the first feeding part 440. The NFC communication circuit 413 may feed a negative signal through the second switch circuit 451 and the second feeding part 450.

[0092] According to an embodiment, the positive signal of the NFC communication circuit (e.g., the NFC communication circuit 413) may be sent to the first connection part 240 through the first feeding part 440. The negative signal of the NFC communication circuit (e.g., the NFC communication circuit 413) may be sent to the second connection part 250 through the second feeding part 450. Since the grounding part 230 serves as an antenna ground, the first loop 940 may be formed in the order of the first connection part 240, a part of the conductive part 913, the grounding part 230, and the support member 910. A part of the conductive part 913 may radiate NFC signals along the first loop 940 through the electromagnetic field formed at the upper end of the electronic device 101. The second loop 950 may be formed in the order of the grounding part 230, another part of the conductive part 913, the second connection part 250, and the support member 910. Another part of the conductive part 913 may radiate NFC signals along the second loop 950 through the electromagnetic field formed on one side of the electronic device 101. The operation area of the NFC function may be extended.

[0093] Since the direction of the current flowing through the conductive portion 913 in the first loop 940 is the same as the direction of the current flowing through the conductive portion 913 in the second loop 950, the entire loop of the NFC communication circuit 413 can be formed in the order of the first connection portion 240, the conductive portion 913, and the second connection portion 250. The potential at the first connection portion 240 can be formed to be higher than the potential at the second connection portion 250. For example, the current can flow in the order of the first connection portion 240, the conductive portion 913, and the second connection portion 250. According to an embodiment, the electronic device 101 can transmit an NFC signal to the outside through the radiation current flowing along the conductive portion 913.

[0094] Figure 10a , Figure 10b and Figure 10c shows an example in which an antenna structure for NFC is provided at the upper end of an electronic device.

[0095] Referring to Figure 10a , the metal frame 210 may include a conductive portion 1013 provided at the upper end of the electronic device 101 (e.g., a region of the electronic device 101 including an end facing the (+) y-axis direction). The first connection portion 240 may be formed to face the inside of the electronic device 101 from the conductive portion 1013. The second connection portion 250 may be formed to face the inside of the electronic device 101 from the conductive portion 1013. A ground portion 1030 may be provided between the conductive portion 1013 and the support member 1010 of the metal frame 210. According to an embodiment, the ground portion 1030 may be integrally formed with the conductive portion 1013. The support member 1010 may include a first feeding portion 440 and a second feeding portion 450. The first feeding portion 440 may be electrically connected to the first connection portion 240. Although Figure 10a is not shown, the first feeding portion 440 may be electrically connected to the first connection portion 240 through electrical contact with a separate structure (e.g., a C-shaped clip). The second feeding portion 450 may be electrically connected to the second connection portion 250. The second feeding portion 450 may be electrically connected to the second connection portion 250 through electrical contact with a separate structure (e.g., a C-shaped clip).

[0096] Referring to Figure 10b, the support member 1010 of the metal frame 210 may be electrically connected to a circuit board including a circuit block 430. As an example, the circuit board may be provided in the form of a PBA together with the support member 1010. As another example, the circuit board may be provided as a separate PCB on the surface of the support member 1010. For example, the first non-NFC communication circuit 411a and the second non-NFC communication circuit 411b may be included in the circuit board. In addition, the NFC communication circuit 413 may be provided in the circuit board. The NFC communication circuit 413 may feed a positive signal through the first switch circuit 441 and the first feed portion 440. The NFC communication circuit 413 may feed a negative signal through the second switch circuit 451 and the second feed portion 450.

[0097] According to an embodiment, the positive signal of the NFC communication circuit (e.g., the NFC communication circuit 413) may be sent to the first connection portion 240 through the first feed portion 440. The negative signal of the NFC communication circuit (e.g., the NFC communication circuit 413) may be sent to the second connection portion 250 through the second feed portion 450. According to an embodiment, the switch circuit 1045 may be connected to the ground portion 1030. The ground portion 1030 may be short-circuited or used as a ground through the switch circuit 1045. The current may flow in the order of the first connection portion 240, a part of the conductive portion 1013, and the ground portion 1030. The current may flow in the order of the ground portion 1030, another part of the conductive portion 1013, and the second connection portion 250. That is, the direction of the current flowing through the conductive portion 1013 through the first connection portion 240 and the direction of the current flowing through the conductive portion 1013 through the second connection portion 250 may be the same as each other. The entire loop for the NFC communication circuit 413 may be formed in the order of the first connection portion 240, the conductive portion 1013, and the second connection portion 250. According to an embodiment, the electronic device 101 may transmit an NFC signal to the outside through the radiation current flowing along the conductive portion 1013.

[0098] Referring to Figure 10c , according to an embodiment, the switch circuit 1065 may be connected to the ground portion 1030. The switch circuit 1065 may be provided on the circuit board. The switch circuit 1065 may selectively connect to the ground or the first non-NFC communication circuit 411a.

[0099] When the electronic device 101 is in the NFC operation mode, the NFC communication circuit 413 can be electrically connected to the conductive part 1013 through the first switch circuit 441 and the second switch circuit 451. The signal fed in the NFC communication circuit 413 can be radiated through the conductive part 1013. In this case, the switch circuit 1065 can be connected to the ground. However, when the electronic device 101 is in the non-NFC operation mode, the switch circuit 1065 can be connected to the first non-NFC communication circuit 411a. For example, when the RF signal of the first non-NFC communication circuit 411a is fed to the ground part 1030, the electronic device 101 can perform wireless communication. Additionally, for example, when the RF signal of the second non-NFC communication circuit 411b is fed to the second connection part 250, the electronic device 101 can perform wireless communication.

[0100] According to various embodiments, the electronic device 101 may include a metal frame 210, a circuit board (e.g., circuit block 430), at least one wireless communication circuit 411a and 411b disposed on the circuit board, a near field communication (NFC) communication circuit 413 disposed on the circuit board, a first switch circuit 441, and a second switch circuit 451. The metal frame 210 may include a conductive part 213, a first connection part 240 formed in one direction from the conductive part 213, a second connection part 250 formed in one direction from the conductive part 213, and a ground part 230 formed in one direction from the conductive part 213. The ground part 230 may be disposed between the first connection part 240 and the second connection part 250 based on the conductive part 213. The first connection part 240 of the metal frame 210 may be electrically connected to at least one wireless communication circuit or the NFC communication circuit 413 through the first switch circuit 441. The second connection part 250 of the metal frame 210 may be electrically connected to at least one wireless communication circuit or the NFC communication circuit 413 through the second switch circuit 451. When the NFC communication circuit 413 is electrically connected to the first connection part 240 and the second connection part 250 of the metal frame 210, a positive signal may be fed to the first connection part 240, and a negative signal may be fed to the second connection part 250.

[0101] According to an embodiment, the conductive part 213 may be spaced apart from the support member 350 of the metal frame 210 by a predetermined distance. The ground part 230 may be arranged to connect the conductive part 213 and the support member 350 of the metal frame 210.

[0102] According to an embodiment, the first feeding part 440 of the support member 350 may be electrically connected to the first connection part 240. The second feeding part 450 of the support member 350 may be electrically connected to the second connection part 250.

[0103] According to an embodiment, at least one wireless communication circuit may include a first non-NFC communication circuit 411a and a second non-NFC communication circuit 411b. A first feeding part 440 may be selectively connected to the first non-NFC communication circuit 411a or the NFC communication circuit 413 through a first switching circuit 441. A second feeding part 450 may be selectively connected to the second non-NFC communication circuit 411b or the NFC communication circuit 413 through a second switching circuit 451.

[0104] According to an embodiment, the electronic device 101 may include a ground switch 590 connected to one end of a conductive part 213. The conductive part 213 may be spaced apart from a support member 350 of the metal frame 210 by a predetermined distance. The ground switch 590 may be configured to selectively connect or disconnect one end of the conductive part 213 and the support member 350.

[0105] According to an embodiment, among a plurality of conductive parts of the metal frame 210, the conductive part 213 may be disposed on a side where the power button 205 or the volume button 203 of the electronic device 101 is located.

[0106] According to an embodiment, among a plurality of conductive parts of the metal frame 210, the conductive part 213 may be provided at an upper end of the electronic device 101.

[0107] According to an embodiment, at least one wireless communication circuit may include a first non-NFC communication circuit 411a and a second non-NFC communication circuit 411b. The conductive part 213 may include a first conductive part 213a and a second conductive part 213b. When the first switching circuit 441 is connected to the first non-NFC communication circuit 411a, the first conductive part 213a, the first connection part 240, and the ground part 230 may operate as an inverted-F antenna of the first non-NFC communication circuit 411a. When the second switching circuit 451 is connected to the second non-NFC communication circuit 411b, the second conductive part 213b, the second connection part 250, and the ground part 230 may operate as an inverted-F antenna of the second non-NFC communication circuit 411b.

[0108] According to an embodiment, the conductive part 213 may be spaced apart from the support member 350 of the metal frame 210 by a predetermined distance. The at least one wireless communication circuit may include a first non-NFC communication circuit 411a and a second non-NFC communication circuit 411b. The conductive part 213 may include a first conductive part 213a and a second conductive part 213b. The conductive part 213 may include a first support member that connects the first conductive part 213a to the support member 350. When the first switch circuit 441 is connected to the first non-NFC communication circuit 411a, the first support member, the first conductive part 213a, the first connection part 240, and the ground part 230 may operate as a slot antenna of the first non-NFC communication circuit 411a. When the second switch circuit 451 is connected to the second non-NFC communication circuit 411b, the second conductive part 213b, the second connection part 250, and the ground part 230 may operate as an inverted-F antenna of the second non-NFC communication circuit 411b.

[0109] According to an embodiment, the conductive part 213 may be spaced apart from the support member 350 of the metal frame 210 by a predetermined distance. The at least one wireless communication circuit may include a first non-NFC communication circuit 411a and a second non-NFC communication circuit 411b. The conductive part 213 may include a first conductive part 213a and a second conductive part 213b. The conductive part 213 may include a first support member that connects the first conductive part 213a to the support member 350.

[0110] The conductive part 213 may include a second support member that connects the second conductive part 213b to the support member 350.

[0111] When the first switch circuit 441 is connected to the first non-NFC communication circuit 411a, the first support member, the first conductive part 213a, the first connection part 240, and the ground part 230 may operate as a slot antenna of the first non-NFC communication circuit 411a. When the second switch circuit 451 is connected to the second non-NFC communication circuit 411b, the second support member, the second conductive part 213b, the second connection part 250, and the ground part 230 may operate as a slot antenna of the first non-NFC communication circuit 411a.

[0112] According to an embodiment, the electronic device 101 may further include at least one processor 120 disposed on a circuit board. When the at least one processor 120 operates in the NFC mode, the first switch circuit 441 and the second switch circuit 451 may be electrically connected to the NFC communication circuit 413. The NFC communication circuit 413 may be configured to generate a positive signal and a negative signal.

[0113] According to an embodiment, the conductive portion 213 may include a first conductive portion 213a disposed in a direction from the ground portion 230 toward the first connection portion 240, and a second conductive portion 213b disposed in a direction from the ground portion 230 toward the second connection portion 250. When the NFC communication circuit 413 is electrically connected to the first connection portion 240 and the second connection portion 250 of the metal frame 210, the direction of the current flowing through the first conductive portion 213a may be the same as the direction of the current flowing through the second conductive portion 213b.

[0114] According to an embodiment, based on the positive signal and the negative signal, the potential of the first conductive portion 213a may be formed to be higher than the potential of the second conductive portion 213b.

[0115] According to an embodiment, the NFC communication circuit 413 may be a balanced circuit. According to the differential mode of the balanced circuit, the first terminal of the NFC communication circuit 413 may be configured to output a positive signal, and the negative second terminal of the NFC communication circuit 413 may be configured to output a negative signal.

[0116] According to an embodiment, the electronic device 101 may further include a balun circuit. The balun circuit may be configured to generate a positive signal and a negative signal based on the signal of the NFC communication circuit 413.

[0117] According to an embodiment, the circuit board may include a printed circuit board (PCB) disposed on one surface of the support member 350 of the metal frame 210 or a printed board assembly (PBA) integrally formed with the support member 350 of the metal frame 210.

[0118] According to an embodiment, the metal frame 210 may include another conductive portion 213, a third connection portion formed from the another conductive portion 213, a fourth connection portion formed from the another conductive portion 213, and another ground portion 230 formed from the another conductive portion 213 in one direction. The another ground portion 230 may be disposed between the third connection portion and the fourth connection portion along the another conductive portion 213. The third connection portion and the fourth connection portion may be electrically connected to the circuit board. The third connection portion and the fourth connection portion of the metal frame 210 may be electrically connected to the NFC communication circuit 413.

[0119] According to an embodiment, the conductive portion 213 may be disposed on one side of the electronic device 101. The another conductive portion 213 may be disposed on the other side opposite to the one side of the electronic device 101.

[0120] According to an embodiment, the first connection portion 240 may be electrically connected to the circuit board via a C-shaped clip. The second connection portion 250 may be electrically connected to the circuit board via a C-shaped clip.

[0121] According to various embodiments, an electronic device 101 may include a metal frame 210, a circuit board, and a near field communication (NFC) communication circuit 413 disposed on the circuit board. The metal frame 210 may include a conductive portion 213, a first connection portion 240 formed from the conductive portion 213 in one direction, a second connection portion 250 formed from the conductive portion 213 in one direction, and a ground portion 230 formed from the conductive portion 213 in one direction. Based on the conductive portion 213, the ground portion 230 may be disposed between the first connection portion 240 and the second connection portion 250. The first connection portion 240 of the metal frame 210 may be electrically connected to the NFC communication circuit 413. The second connection portion 250 of the metal frame 210 may be electrically connected to the NFC communication circuit 413. A positive signal may be fed to the first connection portion 240, and a negative signal may be fed to the second connection portion 250.

[0122] A method according to an embodiment described in the claims or the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0123] In the case of implementation as software, a computer-readable storage medium for storing one or more programs (software modules) may be provided. The one or more programs stored in the computer-readable storage medium are configured to be executed by one or more processors in the electronic device. The one or more programs include instructions that cause the electronic device to execute a method according to an embodiment described in the claims or the specification of the present disclosure.

[0124] Such a program (software module, software) may be stored in a random access memory, a non-volatile memory including a flash memory, a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic disk storage device, a compact disc-ROM (CD-ROM), an optical storage device (digital versatile disc (DVD) or other formats), or a magnetic tape cartridge. Alternatively, it may be stored in a memory configured with a combination of some or all of them. In addition, a plurality of configured memories may be included.

[0125] In addition, the program may be stored in an attachable storage device that may be accessed through a communication network such as the Internet, an intranet, a local area network (LAN), a wide area network (WAN), or a storage area network (SAN) or a combination thereof. Such a storage device may be connected to a device implementing an embodiment of the present disclosure through an external port. In addition, a separate storage device on the communication network may also be connected to a device implementing an embodiment of the present disclosure.

[0126] In the above specific embodiments of the present disclosure, according to the presented specific embodiments, the components included in the present disclosure are expressed in singular or plural. However, the singular or plural expressions are appropriately selected according to the scenarios presented for ease of explanation, and the present disclosure is not limited to singular or plural components, and even components expressed in plural can be configured in singular, or components expressed in singular can be configured in plural.

[0127] Meanwhile, specific embodiments have been described in the detailed description of the present disclosure, and of course, various modifications are possible without departing from the scope of the present disclosure.

Claims

1. An electronic device (101), comprising: A metal frame (210); A circuit board; At least one wireless communication circuit (411a, 411b) disposed on the circuit board; A near field communication (NFC) communication circuit (413) disposed on the circuit board; A first switch circuit (441); And A second switch circuit (451), Wherein, the metal frame (210) includes: A conductive portion (213), a first connection portion (240) formed from the conductive portion (213) in one direction, a second connection portion (250) formed from the conductive portion (213) in one direction, and a ground portion (230) formed from the conductive portion (213) in one direction, Wherein, the ground portion (230) is disposed between the first connection portion (240) and the second connection portion (250) based on the conductive portion (213), Wherein, the first connection portion (240) of the metal frame (210) is electrically connected to the at least one wireless communication circuit or the NFC communication circuit (413) through the first switch circuit (441), Wherein, the second connection portion (250) of the metal frame (210) is electrically connected to the at least one wireless communication circuit or the NFC communication circuit (413) through the second switch circuit (451), and Wherein, when the NFC communication circuit (413) is electrically connected to the first connection portion (240) and the second connection portion (250) of the metal frame (210), a positive signal is fed to the first connection portion (240), and a negative signal is fed to the second connection portion (250).

2. The electronic device (101) according to claim 1, Among them, The conductive portion (213) is spaced apart from a support member (350) of the metal frame (210) by a predetermined distance, and Wherein, the ground portion (230) is disposed to connect the conductive portion (213) and the support member (350) of the metal frame (210).

3. The electronic device (101) according to claims 1 to 2, Among them, A first feeding portion (440) of the support member (350) is electrically connected to the first connection portion (240), and Wherein, a second feeding portion (450) of the support member (350) is electrically connected to the second connection portion (250).

4. The electronic device (101) according to claims 1 to 3, Among them, The at least one wireless communication circuit includes a first non-NFC communication circuit (411a) and a second non-NFC communication circuit (411b), Wherein, the first feeding portion (440) is selectively connected to the first non-NFC communication circuit (411a) or the NFC communication circuit (413) through the first switch circuit (441), and Among them, the second feeding part (450) is selectively connected to the second non-NFC communication circuit (411b) or the NFC communication circuit (413) through the second switching circuit (451).

5. The electronic device (101) according to claims 1 to 4, further comprising: A ground switch (590) connected to one end of the conductive part (213), wherein the conductive part (213) is spaced apart from the support member (350) of the metal frame (210) by a predetermined distance, and wherein the ground switch (590) is configured to selectively connect or disconnect one end of the conductive part (213) and the support member (350).

6. The electronic device (101) according to any one of claims 1 to 5, wherein, Among the plurality of conductive parts of the metal frame (210), the conductive part (213) is disposed on the side where the power key (205) or the volume key (203) of the electronic device (101) is located.

7. The electronic device (101) according to any one of claims 1 to 6, wherein, Among the plurality of conductive parts of the metal frame (210), the conductive part (213) is disposed at the upper end of the electronic device (101).

8. The electronic device (101) according to claims 1 to 7, Among them, The at least one wireless communication circuit includes a first non-NFC communication circuit (411a) and a second non-NFC communication circuit (411b), wherein the conductive part (213) includes a first conductive part (213a) and a second conductive part (213b), wherein when the first switching circuit (441) is connected to the first non-NFC communication circuit (411a), the first conductive part (213a), the first connection part (240), and the ground part (230) operate as an inverted-F antenna of the first non-NFC communication circuit (411a), and wherein when the second switching circuit (451) is connected to the second non-NFC communication circuit (411b), the second conductive part (213b), the second connection part (250), and the ground part (230) operate as an inverted-F antenna of the second non-NFC communication circuit (411b).

9. The electronic device (101) according to claims 1 to 8, Among them, The conductive part (213) is spaced apart from the support member (350) of the metal frame (210) by a predetermined distance, wherein the at least one wireless communication circuit includes a first non-NFC communication circuit (411a) and a second non-NFC communication circuit (411b), wherein the conductive part (213) includes a first conductive part (213a), a second conductive part (213b), and a first support member connecting the first conductive part (213a) and the support member (350). Wherein, when the first switch circuit (441) is connected to the first non-NFC communication circuit (411a), the first support member, the first conductive portion (213a), the first connection portion (240), and the ground portion (230) operate as a slot antenna of the first non-NFC communication circuit (411a), and Wherein, when the second switch circuit (451) is connected to the second non-NFC communication circuit (411b), the second conductive portion (213b), the second connection portion (250), and the ground portion (230) operate as an inverted-F antenna of the second non-NFC communication circuit (411b).

10. The electronic device (101) according to claims 1 to 9, Among them, The conductive portion (213) is spaced apart from the support member (350) of the metal frame (210) by a predetermined distance, Wherein the at least one wireless communication circuit includes a first non-NFC communication circuit (411a) and a second non-NFC communication circuit (411b), Wherein the conductive portion (213) includes a first conductive portion (213a), a second conductive portion (213b), a first support member connecting the first conductive portion (213a) to the support member (350), and a second support member connecting the second conductive portion (213b) to the support member (350), Wherein, when the first switch circuit (441) is connected to the first non-NFC communication circuit (411a), the first support member, the first conductive portion (213a), the first connection portion (240), and the ground portion (230) operate as a slot antenna of the first non-NFC communication circuit (411a), and Wherein, when the second switch circuit (451) is connected to the second non-NFC communication circuit (411b), the second support member, the second conductive portion (213b), the second connection portion (250), and the ground portion (230) operate as a slot antenna of the first non-NFC communication circuit (411a).

11. The electronic device (101) according to claims 1 to 10, further comprising: At least one processor (120) disposed on the circuit board, Wherein, when the at least one processor (120) operates in the NFC mode, the first switch circuit (441) and the second switch circuit (451) are electrically connected to the NFC communication circuit (413), and Wherein the NFC communication circuit (413) is configured to generate the positive signal and the negative signal.

12. The electronic device (101) according to claims 1 to 11, Among them, The conductive portion (213) includes a first conductive portion (213a) disposed along a direction from the ground portion (230) towards the first connection portion (240), and a second conductive portion (213b) disposed along a direction from the ground portion (230) towards the second connection portion (250), Wherein, when the NFC communication circuit (413) is electrically connected to the first connection portion (240) and the second connection portion (250) of the metal frame (210), the direction of the current flowing through the first conductive portion (213a) is the same as the direction of the current flowing through the second conductive portion (213b), and Wherein, according to the positive signal and the negative signal, the potential of the first conductive portion (213a) is formed to be higher than the potential of the second conductive portion (213b).

13. The electronic device (101) according to claims 1 to 12, Among them, The metal frame (210) further includes another conductive portion (213), a third connection portion formed from the another conductive portion (213), a fourth connection portion formed from the another conductive portion (213), and another ground portion (230) formed from the another conductive portion (213) in one direction, Wherein the another ground portion (230) is disposed between the third connection portion and the fourth connection portion along the another conductive portion (213), The third connection portion and the fourth connection portion are electrically connected to the circuit board, Wherein, the third connection portion and the fourth connection portion of the metal frame (210) are electrically connected to the NFC communication circuit (413), Wherein, the conductive portion (213) is disposed on one side of the electronic device (101), and Wherein, the another conductive portion (213) is disposed on the other side opposite to the one side of the electronic device (101).

14. The electronic device (101) according to claims 1 to 13, Among them, The first connection portion (240) is electrically connected to the circuit board via a C-shaped clip, and Wherein, the second connection portion (250) is electrically connected to the circuit board via a C-shaped clip.

15. An electronic device (101), comprising: A metal frame (210); A circuit board; And A near field communication NFC communication circuit (413) disposed on the circuit board; Wherein, the metal frame (210) includes: A conductive portion (213); A first connection portion (240) formed from the conductive portion (213) in one direction; A second connection portion (250) formed from the conductive portion (213) in one direction; and A ground portion (230) formed from the conductive portion (213) in one direction, Wherein, the ground portion (230) is disposed between the first connection portion (240) and the second connection portion (250) based on the conductive portion (213), Wherein, the first connection portion (240) of the metal frame (210) is electrically connected to the NFC communication circuit (413), The second connection portion (250) of the metal frame (210) is electrically connected to the NFC communication circuit (413), and Wherein, a positive signal is fed to the first connection portion (240), and a negative signal is fed to the second connection portion (250).

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