Dual-power intelligent temperature regulating system based on semiconductor thermoelectric refrigeration technology

Abstract

The application relates to the field of semiconductor technology, in particular to a dual-power intelligent temperature regulating system based on semiconductor thermoelectric refrigeration technology, which is used for plants and solves the problems that manpower resources are occupied and watering quantity is not easy to control during plant irrigation and impurity removal operation, and provides the dual-power intelligent temperature regulating system based on the semiconductor thermoelectric refrigeration technology, which comprises a base, a soil groove is formed in the base, a collecting box is arranged on the base, a plurality of air holes are formed on the outer surface of the collecting groove, a U-shaped scraping frame capable of circularly moving is installed in the collecting groove, a plurality of scraping blades are installed on the U-shaped scraping frame, a spade blade is further installed at the bottom of the U-shaped scraping frame, when the U-shaped scraping frame circularly moves, the inner wall of the collecting groove can be scraped and cleaned, meanwhile, the scraping blades can move up and down, the spade blade can move left and right, and the U-shaped scraping frame can be cleaned; an electric control valve is arranged at the bottom of the collecting groove; the problems that manpower resources are occupied and watering quantity is not easy to control in the existing temperature regulating system can be solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a dual-power intelligent temperature control system based on semiconductor thermoelectric cooling technology. Background Technology

[0002] With the continuous development of technology, the demand for precise temperature control is increasing in many fields, such as heat dissipation of electronic devices, temperature control of medical equipment, food preservation, and potted plants. Semiconductor thermoelectric cooling technology, based on the Peltier effect, has advantages such as small size, light weight, no mechanical transmission parts, fast response speed, and switchable cooling and heating, and has been widely used in the field of temperature regulation. However, semiconductor thermoelectric technology has not yet been applied to potted plants. Some special ornamental plants need to grow at room temperature and require regular watering and cleaning. Currently, watering and cleaning are all done manually, which not only consumes manpower, but also easily leads to over- or under-watering.

[0003] Therefore, developing a temperature control system based on semiconductor thermoelectric refrigeration technology with high reliability and high intelligence is of great practical significance. Summary of the Invention

[0004] This invention addresses the current lack of application of semiconductor thermoelectric technology to potted plants, which leads to labor-intensive and difficult-to-control watering operations during irrigation and weeding. It provides a dual-power intelligent temperature control system based on semiconductor thermoelectric cooling technology to solve the problems of labor-intensive and difficult-to-control watering in existing temperature control systems, effectively resolving the issues mentioned in the background section.

[0005] The technical solution adopted by the present invention to solve the above problems is as follows:

[0006] A dual-power intelligent temperature control system based on semiconductor thermoelectric cooling technology includes a base with a soil trough inside. A collection box is mounted on the base, and a top cover is provided on the collection box. A thermoelectric semiconductor chip is mounted on the top cover. A collection trough is provided inside the collection box, and multiple ventilation holes are provided on the outer surface of the collection trough. A U-shaped scraper capable of circular motion is installed inside the collection trough. Multiple scraper blades are mounted on the U-shaped scraper, and a shovel blade is also installed at the bottom of the U-shaped scraper. When the U-shaped scraper moves in a circular motion, it can scrape the inner wall of the collection trough. At the same time, the scraper blades can move up and down, and the shovel blades can move left and right to clean the U-shaped scraper. An electrically controlled valve is provided at the bottom of the collection trough.

[0007] The base has a first slot that mates with the collection box, allowing the collection box to be detachably installed on the base. The collection box has a second slot that mates with the top cover, allowing the top cover to be detachably installed on the collection box.

[0008] The thermoelectric semiconductor chip has a heat sink on its upper surface and a water collection panel on its lower surface.

[0009] A motor is fixed to the inner wall of the collection tank, and a small spur gear is fixed to the output end of the motor. A gear ring meshes on the outer surface of the small spur gear, and the U-shaped scraper is fixed to one side of the lower end surface of the gear ring.

[0010] The U-shaped scraper is equipped with a movable upright. The scraper blade is fixed to the two end faces of the upright. The inner wall of the U-shaped scraper is slidably connected to an I-beam seat. The scraper blade is fixed to the I-beam seat. A first sliding pin is slidably connected to one side of the I-beam seat. A guide frame is fixed to the inner wall of the U-shaped scraper. The guide frame has an inclined groove that matches the first sliding pin. The upright has a vertical groove that matches the first sliding pin.

[0011] The lower end surface of the pole is fixed with a second sliding pin, and the inner wall of the bottom end of the collection tank is provided with a polygonal track groove that cooperates with the second sliding pin.

[0012] The bottom of the collection tank is also provided with a drain outlet, and an installation box is provided inside the drain outlet. On both sides of the installation box, there are protrusions that cooperate with the U-shaped scraper. On both sides of the bottom of the installation box, there are blocking doors. When the two protrusions move outward, the blocking doors can move outward to open the drain outlet.

[0013] The protrusions are slidably connected to the inner walls of the front and rear ends of the mounting box. The inner walls of the left and right ends of the mounting box are respectively provided with mounting grooves. The blocking doors are slidably connected to the corresponding mounting grooves. The bottom sides of the mounting grooves are respectively provided with first springs that cooperate with the blocking doors. Guide plates are respectively fixed to the end faces of the blocking doors. Two third sliding pins are fixed to the lower end surface of the protrusions. The guide plates are respectively provided with oblique keyways that cooperate with the third sliding pins.

[0014] The module of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology includes:

[0015] The dual power switching module connects to two independent power sources and automatically detects the power status and switches to backup battery power when the mains power fails.

[0016] The semiconductor thermoelectric cooling module consists of multiple semiconductor thermoelectric cooling chips, which achieve cooling or heating based on the magnitude and direction of the current; the temperature detection module uses a high-precision temperature sensor to collect temperature data and transmit it to the intelligent control module.

[0017] The intelligent control module receives temperature data and compares it with the preset target temperature. It adjusts the operating current of the semiconductor thermoelectric cooling module through PWM technology, while also monitoring the status of the dual power supply switching module and having communication capabilities.

[0018] The dual power supply switching module uses a power switching chip with overvoltage, undervoltage, and overcurrent protection functions, and automatically switches by detecting the mains power supply voltage and current; the cooling chips in the semiconductor thermoelectric cooling module are connected in series or parallel according to the required cooling and heating power; the temperature sensor in the temperature detection module is connected to the analog input pin of the intelligent control module through a shielded wire.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] In use, when the thermoelectric semiconductor chip is working, a thermal difference is formed between its two ends. The upper end of the chip is the hot side, allowing heat to dissipate around the plant, providing a suitable room temperature for its survival and growth. When the lower end of the chip is cooling, moisture in the air comes into contact with the water collection panel. Due to the lower temperature of the panel, the moisture condenses on it. When the water droplets become larger, they fall into the collection trough under gravity, thus collecting the moisture and dehumidifying it. A rotating valve releases water from the collection trough into the soil container, irrigating the plant. A battery and photovoltaic panel are also included. When the photovoltaic panel is working, it converts solar energy into electricity and stores it in the battery, which then powers the thermoelectric semiconductor and other electrical components. Attached Figure Description

[0021] Figure 1 This is an isometric view of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0022] Figure 2 This is a schematic diagram of the installation of the collection box in the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0023] Figure 3 This is a cross-sectional view of the base of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0024] Figure 4 This is a schematic diagram of the installation of the electrically controlled valve in the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0025] Figure 5 This is a schematic diagram of the collection box structure of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0026] Figure 6 This is a schematic diagram of the top cover structure of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0027] Figure 7 This is a cross-sectional view of the collection box of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0028] Figure 8 This is a schematic diagram of the gear ring installation of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0029] Figure 9 This is a schematic diagram of the I-beam mounting of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0030] Figure 10 This is a cross-sectional view of the mounting box of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0031] Figure 11 This is a schematic diagram of the installation of the blocking door in the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0032] The following are the components labeled in the diagram: 1-Base, 2-Collection box, 3-Soil trough, 4-Electrically controlled valve, 5-Ventilation hole, 6-Top cover, 7-Thermoelectric semiconductor chip, 8-Water collection panel, 9-Heat dissipation plate, 10-Motor, 11-Small spur gear, 12-Gear ring, 13-U-shaped scraper, 14-I-shaped base, 15-Scraper blade, 16-First sliding pin, 17-Guide frame, 18-Inclined groove, 19-Upright pole, 20-Vertical groove, 21-Shovel blade, 22-Second sliding pin, 23-Polygonal track groove, 24-Mounting box, 25-Protrusion seat, 26-Third sliding pin, 27-Guide plate, 28-Inclined keyway, 29-Blocking door, 30-Anti-detachment pad, 31-First spring, 32-Water level detector. Detailed Implementation

[0033] The following are specific embodiments of the present invention, and the technical solutions of the present invention will be further described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0034] First embodiment:

[0035] like Figures 1-11As shown, this invention provides a dual-power intelligent temperature control system based on semiconductor thermoelectric cooling technology, including a base 1, a soil trough 3 inside the base 1, a collection box 2 on the base 1, a top cover 6 on the collection box 2, a thermoelectric semiconductor chip 7 mounted on the top cover 6, a collection groove inside the collection box 2, multiple ventilation holes 5 on the outer surface of the collection groove, a U-shaped scraper 13 capable of circular motion installed inside the collection groove, multiple scraper blades 15 installed on the U-shaped scraper 13, and a shovel blade 21 installed at the bottom of the U-shaped scraper 13. When the U-shaped scraper 13 moves in a circular motion, it can scrape the inner wall of the collection groove. At the same time, the scraper blades 15 can move up and down, and the shovel blade 21 can move left and right to clean the U-shaped scraper 13. An electric control valve 4 is provided at the bottom of the collection groove.

[0036] like Figures 1-11As shown, the base 1 supports the entire potted plant. A soil trough 3 contains soil, and the ornamental plant is planted in the soil. A thermoelectric semiconductor chip 7 is embedded in the top cover 6. The upper end of the thermoelectric semiconductor chip is the hot side, and the lower end is the cold side. When the thermoelectric semiconductor chip 7 is working, it heats the upper part of the top cover 6, thereby heating the surrounding environment of the plant and creating a suitable living environment. Simultaneously, the thermoelectric semiconductor chip 7 also cools the lower part of the top cover 6, allowing moisture in the air to come into contact with the water collection panel 8. Because the water collection panel 8 is at a lower temperature, the moisture in the air can condense on it. On the water collection panel 8, when water droplets condense to a large size, they fall into the collection trough under the action of gravity, thus collecting moisture from the air and dehumidifying the air during the collection process. The ventilation holes 5 accelerate the flow of air, thereby better collecting moisture from the air and dehumidifying it. The installed electric control valve 4 releases the water in the collection trough and provides regular irrigation for the plants, which can replace manual irrigation, saving time and effort. The electric control valve 4 can be set. The collection box 2 has a through hole in the middle to accommodate the plant stem and keep the soil ventilated. After prolonged use, the inner wall of the collection tank accumulates a large amount of dust. The U-shaped scraper 13, when moving in a circular motion, cleans the inner wall of the collection tank, effectively removing the dust. The circular motion also causes the scraper blade 15 to move up and down, and the shovel blade 21 to move left and right, further cleaning the dust adhering to the scraper 13. This results in a more thorough removal of dust from the collection tank, enabling fully automated cleaning and reducing the user's workload. Traditional methods of potted plant care often rely on... While ventilation can reduce humidity, it is greatly affected by the outdoor environment and is not very effective in enclosed spaces or extreme weather. As for irrigation, manual watering relies on manpower and is prone to over- or under-watering, which not only consumes manpower but also has an adverse effect on plant growth. By controlling the thermoelectric semiconductor chip 7 through a dual-power intelligent temperature control system in plant potting technology, it can not only automatically irrigate to reduce the consumption of manpower, but also control humidity and automatically heat, providing a good living environment for plants. In the event of a power outage, it can rely on a backup power source to operate, providing double protection for the plants.

[0037] The base 1 has a first slot that mates with the collection box 2, allowing the collection box 2 to be detachably mounted on the base 1. The collection box 2 has a second slot that mates with the top cover 6, allowing the top cover 6 to be detachably mounted on the collection box 2.

[0038] like Figures 4-5 As shown, the collection box 2 and the first slot are interference fit, which allows the collection box 2 to be disassembled for regular soil replacement; the top cover 6 and the second slot are interference fit, which allows the top cover 6 to be disassembled for regular inspection of the inside of the collection box 2.

[0039] The thermoelectric semiconductor chip 7 has a heat sink 9 on its upper surface and a water collection panel 8 on its lower surface.

[0040] like Figure 6 As shown, the upper surface of the thermoelectric semiconductor chip 7 is the heat dissipation surface, and the lower surface is the cooling surface. One or more thermoelectric semiconductor chips 7 can be provided. Through the provided heat dissipation plate 9, the heating in the surrounding environment can be more uniform, and the heat dissipation efficiency of the thermoelectric semiconductor chip 7 can be accelerated. Through the provided water collection panel 8, the cooling surface of the thermoelectric semiconductor chip 7 can be sealed to prevent water from entering the thermoelectric semiconductor chip 7, and it can absorb heat from the surrounding environment to cool it down, so that the moisture in the air will condense on the water collection panel 8.

[0041] A motor 10 is fixedly connected to the inner wall of the collection tank. A small spur gear 11 is fixedly connected to the output end of the motor 10. A gear ring 12 meshes on the outer surface of the small spur gear 11. The U-shaped scraper 13 is fixedly connected to one side of the lower end surface of the gear ring 12.

[0042] like Figures 7-8 As shown, the motor 10 can provide rotational power to the small spur gear 11. The gear ring 12 is rotatably connected in the collection trough. When the gear ring 12 rotates, it can drive the U-shaped scraper 13 to move in a circular motion, thereby causing the U-shaped scraper 13 to move in a circular motion. The motor 10 is existing technology and will not be described in detail.

[0043] The U-shaped scraper 13 is equipped with a movable upright 19. The scraper blade 21 is fixedly connected to the two end faces of the upright 19. The inner wall of the U-shaped scraper 13 is slidably connected to the I-beam seat 14. The scraper blade 15 is fixedly connected to the I-beam seat 14. The first sliding pin 16 is slidably connected to one side of the I-beam seat 14. The inner wall of the U-shaped scraper 13 is fixedly connected to the guide frame 17. The guide frame 17 is provided with an inclined groove 18 that cooperates with the first sliding pin 16. The upright 19 is provided with a vertical groove 20 that cooperates with the first sliding pin 16.

[0044] like Figure 9 As shown, the I-beam base 14 can slide vertically on the inner wall of the U-shaped scraper 13, and the upright 19 can slide horizontally on the U-shaped scraper 13. The scraper blade 21 and scraper blade 15 are installed as shown. Figure 9As shown, one or more scraper blades 21 and 15 can be provided; the inner wall of the I-beam base 14 is provided with a small slider, which can slide left and right on the inner wall of the I-beam base 14. The first sliding pin 16 is fixed to the small slider, which means that the first sliding pin 16 can slide left and right on the inner wall of the I-beam base 14, and when the first sliding pin 16 moves up and down, it can drive the I-beam base 14 to move up and down; through the provided first sliding pin 16, guide frame 17, inclined groove 18, upright rod 19 and vertical groove 20, when the upright rod 19 moves to the right, under the engagement of the vertical groove 20 and the first sliding pin 16, the first sliding pin 16 can be driven. 6 moves to the right on the I-beam base 14. When the first sliding pin 16 moves to the right, it can move downward and to the right at the same time through the engagement with the inclined groove 18. When the first sliding pin 16 moves downward, it can drive the I-beam base 14 and the scraper 15 to move downward. Similarly, when the upright 19 and the scraper 21 move to the left, they can drive the first sliding pin 16, the I-beam base 14, the scraper 15 and so on to move upward synchronously. That is, when the upright 19 moves back and forth left and right, it can drive the scraper 21 to move back and forth left and right and the scraper 15 to move back and forth up and down, so as to clean the outer surface of the U-shaped scraper 13.

[0045] The lower end surface of the upright 19 is fixed with a second sliding pin 22, and the inner wall of the bottom end of the collection tank is provided with a polygonal track groove 23 that cooperates with the second sliding pin 22.

[0046] like Figure 7 and Figure 9 As shown, when the U-shaped scraper 13 moves in a circular motion, it can drive the upright 19, the second sliding pin 22, etc. to move in a synchronous circular motion. With the cooperation of the polygonal track groove and the second sliding pin 22, when the U-shaped scraper 13, the upright 19, and the second sliding pin 22 move in a circular motion, the second sliding pin 22 can move back and forth left and right under the engagement with the polygonal track groove 23. That is, the second sliding pin 22 and the upright 19 move back and forth left and right, thereby driving the scraper blade 15 and the shovel blade 21 to move.

[0047] The bottom of the collection tank is also provided with a drain outlet, and an installation box 24 is provided inside the drain outlet. On both sides of the installation box 24, there are protrusions 25 that cooperate with the U-shaped scraper 13. On both sides of the bottom of the installation box 24, there are blocking doors 29. When the two protrusions 25 move outward, the blocking doors 29 can move outward to open the drain outlet.

[0048] like Figures 10-11As shown, the drain outlet can be opened when cleaning dust inside the collection tank, allowing dust to fall into the lower end, i.e., into the soil trough 3 or the outside, under gravity. The mounting box 24 is used to install components such as the protrusions 25 and the plugs 29. Under normal conditions, the two plugs 29 are in the innermost position, i.e., the drain outlet is closed. Rubber pads are also provided on the inner end faces of the two plugs 29 to enhance the sealing. When the U-shaped scraper 13 moves circumferentially to remove impurities from the collection tank, the U-shaped scraper 13 moves to a designated position and meets the corresponding two protrusions 25. Driven by the U-shaped scraper 13, the two protrusions 25 can move outward, driving the two protrusions 25 to move outward. The blocking door 29 moves outward to open, thereby discharging the dust scraped on the U-shaped scraper 13 to the outside. When the U-shaped scraper 13 disengages from the protrusion 25, the corresponding blocking door 29 and protrusion 25 can move inward to reset to their initial positions under the elastic force of the first spring 31. That is, the first spring 31 drives the blocking door 29, protrusion 25, etc., to move inward to close the drain outlet. The two protrusions 25 are set to different sizes. Since the inner and outer ends of the U-shaped scraper 13 have a radius difference, their circumferential movement speeds are also different. The two protrusions 25 of different sizes cooperate with the inner and outer ends of the U-shaped scraper 13 respectively, enabling the two protrusions 25 to move outward synchronously, thereby driving the blocking door 29 to open synchronously on both sides.

[0049] The protrusions 25 are slidably connected to the inner walls of the front and rear ends of the mounting box 24. The inner walls of the left and right ends of the mounting box 24 are respectively provided with mounting grooves. The blocking doors 29 are slidably connected to the corresponding mounting grooves. The bottom sides of the mounting grooves are respectively provided with first springs 31 that cooperate with the blocking doors 29. Guide plates 27 are fixedly connected to the end faces of the blocking doors 29. Two third sliding pins 26 are fixedly connected to the lower end surface of the protrusions 25. The guide plates 27 are respectively provided with oblique keyways 28 that cooperate with the third sliding pins 26.

[0050] like Figures 10-11 As shown, the mounting box 24 is positioned in the front-back, left-right, and right directions as follows: Figure 10 For illustration, the boss 25 is set on the inner walls of the left and right ends of the mounting box 24. The boss 25 can slide back and forth on the inner wall of the mounting box 24. The blocking door 29 is slidably connected to the inner wall of the mounting groove. Anti-detachment pads 30 are fixed to the outer end faces of the two blocking doors 29 respectively. The anti-detachment pads 30 are slidably connected to the inner wall of the mounting groove. The function of the anti-detachment pads 30 is to prevent the blocking door 29 from detaching from the mounting groove. One end of the first spring 31 is fixed to the anti-detachment pad 30, and the other end is fixed to the inner wall of the bottom end of the mounting groove. The first spring 31 always exerts an inward driving force on the anti-detachment pad 30 and the blocking door 29, so that the blocking door 29 is in the innermost end state under normal conditions. The installation and shape of the guide plate 27, the third sliding pin 26, and the oblique keyway 28 are as follows. Figure 11As shown, when the U-shaped scraper 13 moves circumferentially to meet the two protrusions 25 and causes the protrusions 25 to move outward, it can drive the third sliding pin 26 to move outward. When the third sliding pin 26 moves outward, it can drive the guide plate 27 and the blocking door 29 to move outward synchronously through engagement with the oblique keyway 28. When the blocking door 29 moves outward, it can open the drain outlet and compress the first spring 31. When the U-shaped scraper 13 moves to disengage from the protrusions 25, the blocking door 29 will move inward and reset under the elastic force of the first spring 31. The protrusions 25 will move inward and reset to their initial position. The collection tank is also equipped with a water level detector 32, which is used to detect the water level line in the collection tank. When the water level line reaches the specified height, it can trigger the water level detector 32 to trigger an alarm and power-off process, so that the thermoelectric semiconductor chip 7 stops working and prevents water from overflowing. The water level detector 32 is existing technology and will not be described in detail.

[0051] Second embodiment:

[0052] Most temperature control systems rely on a single power supply. When the power supply fails or becomes unstable, the temperature control system will not function properly, affecting the normal operation of the equipment. On the other hand, existing temperature control systems have a low level of intelligence and often cannot automatically and accurately adjust the temperature according to changes in ambient temperature and load, resulting in low temperature regulation accuracy and low energy efficiency.

[0053] The module of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology includes:

[0054] The dual power switching module connects to two independent power sources and automatically detects the power status and switches to backup battery power when the mains power fails.

[0055] The semiconductor thermoelectric cooling module consists of multiple semiconductor thermoelectric cooling chips, which achieve cooling or heating based on the magnitude and direction of the current; the temperature detection module uses a high-precision temperature sensor to collect temperature data and transmit it to the intelligent control module.

[0056] The intelligent control module receives temperature data and compares it with the preset target temperature. It adjusts the operating current of the semiconductor thermoelectric cooling module through PWM technology, while also monitoring the status of the dual power supply switching module and having communication capabilities.

[0057] Implementation of the dual power supply switching module: A power switching chip with overvoltage, undervoltage, and overcurrent protection functions is selected, such as the RT9711 14-pin power management chip. It has multiple practical functions such as overvoltage protection, undervoltage protection, and overcurrent protection, which can fully meet the system's requirements for stable power switching and protection. The RT9711 power management chip is existing technology and will not be described in detail. The mains power supply and the backup battery power supply are respectively connected to the corresponding pins of the switching chip. By writing a program, the voltage and current of the mains power supply are monitored in real time by the internal detection circuit of the chip. When an abnormality in the mains power supply is detected, the switching logic is triggered to connect the backup battery power supply to the system power supply circuit.

[0058] Assembly of semiconductor thermoelectric cooling module: Select an appropriate number of semiconductor thermoelectric cooling chips according to the required cooling and heating power, and connect the cooling chips in series or parallel to meet the system's current and voltage requirements. When connecting the cooling chips, pay attention to the correct connection of the positive and negative terminals to ensure that the current can pass through the cooling chips in the expected direction.

[0059] Installation of the temperature detection module: Install the high-precision temperature sensor at the critical location where precise temperature control is required, such as the surface of the object being cooled or heated, or the hot and cold ends of the semiconductor thermoelectric refrigeration module. The output pin of the sensor is connected to the analog input pin of the intelligent control module through a shielded wire to reduce the influence of external interference on temperature data acquisition. The temperature sensor can be a PT100 platinum resistance temperature sensor or a MEMS temperature sensor. The sensor is existing technology and will not be described in detail.

[0060] Programming of the intelligent control module: Based on the STM32F407 series microprocessor, the hardware design of the intelligent control module is carried out, a minimum system is built, and the control program is written using C language or other suitable programming languages ​​to realize temperature data acquisition, processing and comparison, PWM signal generation and adjustment, dual power supply status monitoring and switching control, and communication functions. Reasonable temperature control algorithms, such as PID control algorithms, are set in the program to improve the accuracy and stability of temperature control.

[0061] The dual power supply switching module uses a power switching chip with overvoltage, undervoltage, and overcurrent protection functions, and automatically switches by detecting the mains power supply voltage and current; the cooling chips in the semiconductor thermoelectric cooling module are connected in series or parallel according to the required cooling and heating power; the temperature sensor in the temperature detection module is connected to the analog input pin of the intelligent control module through a shielded wire.

[0062] Working Principle: After system startup, the dual power switching module first detects the status of the mains power supply. If the mains power is normal, it supplies power to the system and simultaneously charges the backup battery. The temperature detection module continuously collects temperature data and sends it to the intelligent control module. The intelligent control module compares the current temperature with the preset target temperature. When the current temperature is higher than the target temperature, the intelligent control module increases the cooling current of the thermoelectric cooling module through PWM control. The cold end of the cooling chip absorbs heat to lower the ambient temperature, while the heat generated at the hot end is dissipated by the heat dissipation module. When the current temperature is lower than the target temperature, the intelligent control module changes the current direction, switching the thermoelectric cooling module to heating mode to heat the environment. Throughout the process, the intelligent control module adjusts the operating parameters of the thermoelectric cooling module in real time according to temperature changes to achieve precise temperature control. If the mains power fails, the dual power switching module quickly switches to the backup battery power to ensure uninterrupted system operation until the mains power returns to normal or the backup battery is depleted. When the backup battery is low, the intelligent control module can send an alarm to the user through the communication module.

[0063] The dual power switching module design ensures continuous operation of the system even in the event of mains power failure or instability, greatly improving the reliability of the temperature control system. Through the collaborative work of a high-precision temperature sensor and intelligent control module, combined with advanced control algorithms, precise temperature regulation can be achieved. The system can automatically adjust the operating status of the thermoelectric cooling module according to changes in ambient temperature and load, realizing intelligent temperature control. Simultaneously, it has the ability to communicate with external devices, facilitating remote monitoring and operation by users, improving user experience and equipment management convenience. The intelligent control module dynamically adjusts the operating power of the thermoelectric cooling module according to actual temperature requirements, avoiding unnecessary energy consumption. The intelligent speed regulation design of the heat dissipation module further improves energy utilization efficiency and reduces system operating costs.

[0064] In use, when the thermoelectric semiconductor chip 7 is working, it heats the upper part of the top cover 6, thereby heating the surrounding environment of the plant and creating a suitable living environment. Simultaneously, the thermoelectric semiconductor chip 7 cools the lower part of the top cover 6, allowing moisture in the air to contact the water collection panel 8. Due to the lower temperature of the water collection panel 8, moisture in the air condenses on it. When the water droplets become larger, they fall into the collection trough under gravity, thus collecting moisture from the air and dehumidifying the air during the collection process. The installed electronically controlled valve 4 releases water from the collection trough and provides regular irrigation for the plants, replacing manual irrigation and saving time and effort. The U-shaped scraper 13, when moving in a circular motion, cleans the inner wall of the collection trough, removing dust adhering to it. When moving in a circular motion, the scraper 15 moves up and down, and the shovel 21 moves left and right, cleaning the dust adhering to the U-shaped scraper 13, thus making the dust inside the collection tank cleaner. This fully automated cleaning reduces the labor intensity of users. Traditional plant pot care methods often use ventilation to reduce humidity. However, ventilation is greatly affected by the outdoor environment and is not effective in enclosed spaces or extreme weather. As for irrigation, manual watering relies on manpower and is prone to over- or under-watering, which not only consumes manpower but also has an adverse effect on plant growth. By controlling the thermoelectric semiconductor chip 7 through a dual-power intelligent temperature control system, plant pot technology can not only automatically irrigate to reduce manpower consumption, but also control humidity and automatically heat, providing a good living environment for plants. In the event of a power outage, it can rely on a backup power source to provide double protection for the plants.

Claims

1. A dual-power intelligent temperature control system based on semiconductor thermoelectric cooling technology, comprising a base (1), characterized in that: The base (1) has a soil trough (3) inside, a collection box (2) is provided on the base (1), a top cover (6) is provided on the collection box (2), a thermoelectric semiconductor chip (7) is installed on the top cover (6), a collection trough is provided inside the collection box (2), a number of ventilation holes (5) are provided on the outer surface of the collection trough, a U-shaped scraper (13) capable of circular motion is installed inside the collection trough, a number of scraper blades (15) are installed on the U-shaped scraper (13), and a shovel blade (21) is also installed at the bottom of the U-shaped scraper (13). When the U-shaped scraper (13) moves in a circular motion, it can clean the inner wall of the collection trough. At the same time, the scraper blades (15) can move up and down, and the shovel blades (21) can move left and right to clean the U-shaped scraper (13); an electric control valve (4) is provided at the bottom of the collection trough. The thermoelectric semiconductor chip (7) has a heat sink (9) on its upper surface and a water collection panel (8) on its lower surface. The U-shaped scraper (13) is equipped with a movable upright (19), and the scraper blade (21) is fixedly connected to the two end faces of the upright (19). The inner wall of the U-shaped scraper (13) is slidably connected to the I-beam (14), and the scraper blade (15) is fixedly connected to the I-beam (14). The I-beam (14) is slidably connected to one side of the I-beam (14). The inner wall of the U-shaped scraper (13) is fixedly connected to the guide frame (17), and the guide frame (17) is provided with an inclined groove (18) that cooperates with the first sliding pin (16). The upright (19) is provided with a vertical groove (20) that cooperates with the first sliding pin (16). The lower end surface of the upright (19) is fixed with a second sliding pin (22), and the inner wall of the bottom end of the collection tank is provided with a polygonal track groove (23) that cooperates with the second sliding pin (22).

2. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology as described in claim 1, characterized in that: The base (1) has a first slot that matches the collection box (2), so that the collection box (2) can be detachably installed on the base (1). The collection box (2) has a second slot that matches the top cover (6), so that the top cover (6) can be detachably installed on the collection box (2).

3. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology as described in claim 1, characterized in that: A motor (10) is fixed to the inner wall of the collection tank. A small spur gear (11) is fixed to the output end of the motor (10). A gear ring (12) meshes on the outer surface of the small spur gear (11). The U-shaped scraper (13) is fixed to one side of the lower end surface of the gear ring (12).

4. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology as described in claim 1, characterized in that: The bottom of the collection tank is also provided with a drain outlet, and an installation box (24) is provided inside the drain outlet. On both sides of the installation box (24) are protrusions (25) that cooperate with the U-shaped scraper (13). On both sides of the bottom of the installation box (24) are blocking doors (29). When the two protrusions (25) move outward, the blocking doors (29) can move outward to open the drain outlet.

5. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology as described in claim 4, characterized in that: The protrusions (25) are slidably connected to the inner walls of the front and rear ends of the mounting box (24). The inner walls of the left and right ends of the mounting box (24) are respectively provided with mounting grooves. The blocking doors (29) are slidably connected to the corresponding mounting grooves. The bottom sides of the mounting grooves are respectively provided with first springs (31) that cooperate with the blocking doors (29). Guide plates (27) are fixedly connected to the end faces of the blocking doors (29). Two third sliding pins (26) are fixedly connected to the lower end surface of the protrusions (25). The guide plates (27) are respectively provided with oblique keyways (28) that cooperate with the third sliding pins (26).

6. The module of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology as described in claim 1, characterized in that: include; The dual power switching module connects to two independent power sources and automatically detects the power status and switches to backup battery power when the mains power fails. The semiconductor thermoelectric cooling module consists of multiple semiconductor thermoelectric cooling chips, which achieve cooling or heating based on the magnitude and direction of the current; the temperature detection module uses a high-precision temperature sensor to collect temperature data and transmit it to the intelligent control module. The intelligent control module receives temperature data and compares it with the preset target temperature. It adjusts the operating current of the semiconductor thermoelectric cooling module through PWM technology, while also monitoring the status of the dual power supply switching module and having communication capabilities.

7. The module of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology as described in claim 6, characterized in that: The dual power supply switching module uses a power switching chip with overvoltage, undervoltage, and overcurrent protection functions, and automatically switches by detecting the mains power supply voltage and current; the cooling chips in the semiconductor thermoelectric cooling module are connected in series or parallel according to the required cooling and heating power; the temperature sensor in the temperature detection module is connected to the analog input pin of the intelligent control module through a shielded wire.

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