Half-wafer cutting machine for BC battery silicon wafer

Abstract

The invention discloses a half-wafer cutting machine for BC battery silicon wafers, which comprises a pick-and-place assembly, a silicon wafer conveying track and a half-wafer cutting mechanism, and is characterized in that the silicon wafer conveying track is connected with the pick-and-place assembly and the half-wafer cutting mechanism; the pick-and-place assembly comprises a transverse moving pick-and-place module, a silicon wafer jacking module and a partition paper jacking module; the silicon wafer conveying track clamps a silicon wafer flatly through a clamping plate arm, and the rear end of the silicon wafer conveying track is provided with a pick-and-place detection light source and a pick-and-place detection camera. The half-wafer cutting mechanism comprises a scribing support, a mechanical arm and a half-wafer output module, a jacking motor and a jacking frame are arranged on the scribing support, the jacking motor moves front and back along the scribing support, the driving end of the jacking motor is connected with a cam, and a scribing laser head and a scribing detection camera are arranged in the middle of the scribing support. According to the half-wafer cutting machine for the BC battery silicon wafer, the partition paper and the silicon wafer are taken at intervals, the qualified silicon wafer is subjected to middle laser cutting and slicing after detection, follow-up series welding treatment and automatic treatment with a tin bar are facilitated, and the productivity is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer cutting, and particularly to a half-piece cutting machine for BC cell silicon wafers. Background Art

[0002] Photovoltaic solar silicon wafers are the core part of a solar power generation system and also the most valuable part of a solar power generation system. The function of the silicon wafer is to convert solar energy into electrical energy, which is stored by a storage battery or directly powers a load. Currently, customers of BC cells (fully called back contact cells, which can be combined with multiple routes) need to cut a whole silicon wafer into half pieces and use welding wires for series welding. For the cutting part, it is required to automatically take out the stacked whole silicon wafers one by one and perform middle-position cutting on each piece to achieve production and manufacturing in a production line. Summary of the Invention

[0003] An object of the present invention is to provide a half-piece cutting machine for BC cell silicon wafers, which can automatically grasp each silicon wafer one by one, perform laser cutting treatment after determining the position, and facilitate subsequent series welding processing.

[0004] To achieve this purpose, the present invention adopts the following technical solutions:

[0005] A half-piece cutting machine for BC cell silicon wafers includes a pick-and-place component, a silicon wafer conveying track, and a half-piece cutting mechanism. The silicon wafer conveying track connects the pick-and-place component and the half-piece cutting mechanism;

[0006] The pick-and-place component includes a transverse pick-and-place module, a silicon wafer lifting module, and a spacer paper lifting module. A spacer paper grabbing plate and a silicon wafer grabbing plate are installed on the driving end of the transverse pick-and-place module. A silicon wafer cassette is connected to the driving end of the silicon wafer lifting module, and a spacer paper cassette is connected to the driving end of the spacer paper lifting module;

[0007] A silicon wafer clamping plate motor is installed below the middle of the silicon wafer conveying track. A clamping plate synchronous pulley is connected to the driving end of the silicon wafer clamping plate motor. The clamping plate synchronous pulley is in transmission connection with a clamping plate synchronous belt. Clamping plate arms are installed on the clamping plate synchronous belt. The two clamping plate arms are respectively on both sides of the silicon wafer conveying track. A pick-and-place detection light source is installed below the rear end of the silicon wafer conveying track, and a pick-and-place detection camera is installed above the rear end of the silicon wafer conveying track;

[0008] The half - piece cutting mechanism includes a scribing bracket, a manipulator, and a half - piece output module. A lifting motor and a lifting frame are arranged on the scribing bracket. The lifting motor moves back and forth along the scribing bracket. The driving end of the lifting motor is connected with a cam, and the cam is located in the middle of the lifting frame. A scribing laser head and a scribing detection camera are arranged in the middle of the scribing bracket. The half - piece output module includes a half - piece transverse movement module, a half - piece vertical movement module, and a half - piece suction rod. The half - piece vertical movement module is installed on the driving end of the half - piece transverse movement module, and the half - piece suction rod is installed on the driving end of the half - piece vertical movement module. A half - piece suction nozzle is fixed on the half - piece suction rod.

[0009] As a preferred technical solution, paper - separating lifting cylinders and wafer - lifting cylinders are respectively installed on both sides of the driving end of the transverse picking - placing module. The driving end of the paper - separating lifting cylinder is connected with the paper - separating grabbing plate, and the driving end of the wafer - lifting cylinder is connected with the wafer - grabbing plate.

[0010] As a preferred technical solution, a picking - placing limit arm is arranged at the rear end of the wafer conveying track, and the picking - placing limit arm moves along the front - rear direction.

[0011] As a preferred technical solution, a picking - placing cylinder is fixed on the wafer conveying track, and the driving end of the picking - placing cylinder is connected with the lower end of the picking - placing limit arm.

[0012] As a preferred technical solution, track wheels are rotatably connected to the wafer conveying track, and a track belt is drivingly connected between the track wheels. The track belt is located on both sides of the wafer conveying track.

[0013] As a preferred technical solution, a scribing front - rear module is installed at the lower end of the scribing bracket. The driving end of the scribing front - rear module is fixedly connected with the lifting motor. A cam moving hole is arranged in the middle of the lifting frame, and the cam is located in the cam moving hole.

[0014] As a preferred technical solution, an activity slot is arranged on the scribing bracket along the front - rear direction, and the upper end of the lifting frame passes through the activity slot.

[0015] As a preferred technical solution, a transfer bracket is arranged on one side of the scribing bracket. An adsorption cross - bar is installed on the transfer bracket, and there is a gap between two adjacent adsorption cross - bars.

[0016] As a preferred technical solution, a paper - separating replenishment box and a defective - product placement box are arranged on one side of the manipulator.

[0017] As a preferred technical solution, a horizontal slide is installed on the dicing bracket, an L-shaped support is connected to the horizontal slide, a vertical slide is installed on the L-shaped support, and the dicing laser head and the dicing detection camera are respectively installed on one of the vertical slides.

[0018] The beneficial effects of the present invention are as follows: A half-cutting machine for BC cell silicon wafers is provided. This half-cutting machine for BC cell silicon wafers takes separator paper and silicon wafers at intervals, and after detection, cuts the qualified silicon wafers into pieces by laser in the middle, which is convenient for subsequent series soldering with tin bars, and realizes automated processing to improve production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described in detail below with reference to the drawings and embodiments.

[0020] Figure 1 FIG. is a schematic diagram of the overall structure of a half-cutting machine for BC cell silicon wafers according to the embodiment;

[0021] Figure 2 FIG. is a combined structure diagram of the picking and placing component and the silicon wafer conveying track according to the embodiment;

[0022] Figure 3 FIG. is a schematic diagram of the structure of three groups of picking and placing components according to the embodiment;

[0023] Figure 4 FIG. is a schematic diagram of the structure of a single group of picking and placing components according to the embodiment;

[0024] Figure 5 FIG. is a schematic diagram of the structure of the transverse moving picking and placing module according to the embodiment;

[0025] Figure 6 FIG. is a rear-end structure diagram of the silicon wafer conveying track according to the embodiment;

[0026] Figure 7 FIG. is a schematic diagram of the structure of the half-cutting mechanism according to the embodiment;

[0027] Figure 8 FIG. is a first schematic diagram of the dicing bracket according to the embodiment;

[0028] Figure 9 FIG. is a second schematic diagram of the dicing bracket according to the embodiment;

[0029] Figure 10 FIG. is a schematic diagram of the structure of the half-piece output module according to the embodiment;

[0030] Figure 11 FIG. is a schematic diagram of the structure of the transfer bracket according to the embodiment.

[0031] Figures 1 to 11 Wherein:

[0032] 1. Wafer conveying track; 2. Transverse moving picking and placing module; 3. Wafer lifting module; 4. Separator paper lifting module; 5. Separator paper gripping plate; 6. Wafer gripping plate; 7. Wafer cassette; 8. Separator paper cassette; 9. Wafer clamping plate motor; 10. Clamping plate synchronous pulley; 11. Clamping plate synchronous belt; 12. Clamping plate arm; 13. Picking and placing detection light source; 14. Picking and placing detection camera; 15. Separator paper suction nozzle; 16. Back blowing nozzle; 17. Separator paper lifting cylinder; 18. Wafer lifting cylinder; 19. Anti-overlapping sensor; 20. Clamping plate guide wheel; 21. Picking and placing wafer limiting arm; 22. Picking and placing wafer cylinder; 23. Track wheel; 24. Track belt; 25. Dicing bracket; 26. Manipulator; 27. Half wafer output module; 28. Lifting motor; 29. Lifting frame; 30. Cam; 31. Dicing laser head; 32. Dicing detection camera; 33. Half wafer transverse moving module; 34. Half wafer vertical moving module; 35. Half wafer suction rod; 36. Half wafer suction nozzle; 37. Adsorption plate; 38. Dicing front and back module; 39. Activity slot; 40. Transfer bracket; 41. Adsorption cross bar; 42. Separator paper replenishment box; 43. Defective placement box; 44. Horizontal slide table; 45. L-shaped support; 46. Vertical slide table; 47. Wafer. Detailed implementation manners

[0033] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation manners.

[0034] As Figures 1 to 11 shown, in this embodiment, a half wafer dicing machine for BC battery wafers includes a picking and placing component, a wafer conveying track 1 and a half wafer dicing mechanism. The wafer conveying track 1 is connected to the picking and placing component and the half wafer dicing mechanism;

[0035] The pick-and-place component includes a horizontal pick-and-place module 2, a wafer lifting module 3, and a spacer paper lifting module 4. A spacer paper gripping plate 5 and a wafer gripping plate 6 are installed on the driving end of the horizontal pick-and-place module 2. A wafer cassette 7 is connected to the driving end of the wafer lifting module 3. A spacer paper cassette 8 is connected to the driving end of the spacer paper lifting module 4. Below the middle of the wafer conveying track 1, a wafer clamping plate motor 9 is installed. A clamping plate synchronous pulley 10 is connected to the driving end of the wafer clamping plate motor 9. The clamping plate synchronous pulley 10 is drivingly connected to a clamping plate synchronous belt 11. Clamping plate arms 12 are installed on the clamping plate synchronous belt 11. The two clamping plate arms 12 are respectively on both sides of the wafer conveying track 1. Below the rear end of the wafer conveying track 1, a pick-and-place detection light source 13 is installed. Above the rear end of the wafer conveying track 1, a pick-and-place detection camera 14 is installed. The half-piece cutting mechanism includes a scribing bracket 25, a manipulator 26, and a half-piece output module 27. A lifting motor 28 and a lifting frame 29 are arranged on the scribing bracket 25. The lifting motor 28 moves back and forth along the scribing bracket 25. The driving end of the lifting motor 28 is connected to a cam 30. The cam 30 is in the middle of the lifting frame 29. A scribing laser head 31 and a scribing detection camera 32 are arranged in the middle of the scribing bracket 25. The half-piece output module 27 includes a half-piece horizontal movement module 33, a half-piece vertical movement module 34, and a half-piece suction rod 35. The half-piece vertical movement module 34 is installed on the driving end of the half-piece horizontal movement module 33. The half-piece suction rod 35 is installed on the driving end of the half-piece vertical movement module 34. A half-piece suction nozzle 36 is fixed on the half-piece suction rod 35.

[0036] In the wafer cassette 7, the wafers 47 and the spacer papers are stacked in an interleaved manner, effectively protecting the wafers 47 from scratching each other. The horizontal pick-and-place module 2 synchronously controls the spacer paper gripping plate 5 and the wafer gripping plate 6 to move left and right, and places the grabbed wafers 47 into the wafer conveying track 1. At this time, the spacer paper gripping plate 5 also moves to the wafer cassette 7 to grab the spacer paper. When the spacer paper gripping plate 5 returns the spacer paper to the spacer paper cassette 8, the wafer gripping plate 6 also returns to the wafer cassette 7 to grab the wafers 47, and reciprocates for interleaved processing.

[0037] The wafers 47 on the wafer conveying track 1 move backward. The wafer clamping plate motor 9 controls the clamping plate synchronous pulley 10 to rotate, so that the clamping plate synchronous belt 11 drives the clamping plate arms 12 to move closer to the middle of the wafer conveying track 1, straightening the inclined and offset wafers 47, so that when above the pick-and-place detection light source 13, the pick-and-place detection camera 14 can perform fragment detection and position detection on the wafers 47.

[0038] According to the shooting of the pick-and-place detection camera 14, the manipulator 26 grabs the qualified whole silicon wafer 47 onto the scribing bracket 25 and is supported by the lifting frame 29. During the forward and backward movement of the lifting frame 29 along the scribing bracket 25, when the whole silicon wafer 47 approaches the scribing laser head 31, the lifting motor 28 controls the cam 30 to rotate, so that the lifting frame 29 is briefly lifted, and the whole silicon wafer 47 on the lifting frame 29 is closer to the scribing laser head 31, so as to completely and accurately divide the whole silicon wafer 47 from the middle. After the scribing detection camera 32 detects the completion of cutting, the half-wafer horizontal translation module 33 and the half-wafer vertical translation module 34 on the half-wafer output module 27 control the half-wafer suction rod 35 to adsorb the double half-wafers and move them to the rear.

[0039] Paper separation suction nozzles 15 are installed around the paper separation grabbing plate 5, and reverse blowing nozzles 16 are installed around the silicon wafer grabbing plate 6. When grabbing the silicon wafer 47 and the paper separation, they are both lifted by the suction nozzles for adsorption. The reverse blowing nozzles 16 blow the paper separation downward to prevent the stacking of multiple silicon wafers.

[0040] Paper separation lifting cylinders 17 and silicon wafer lifting cylinders 18 are respectively installed on both sides of the driving end of the horizontal translation pick-and-place module 2. The driving end of the paper separation lifting cylinder 17 is connected to the paper separation grabbing plate 5, and the driving end of the silicon wafer lifting cylinder 18 is connected to the silicon wafer grabbing plate 6. In order to ensure that each time the paper separation and the silicon wafer 47 are grabbed, it will not affect other current structures, the paper separation lifting cylinder 17 is used to control the paper separation grabbing plate 5 to put down the paper separation into the paper separation magazine 8, and the silicon wafer lifting cylinder 18 is used to control the silicon wafer grabbing plate 6 to put down the silicon wafer 47 onto the silicon wafer conveying track 1.

[0041] An anti-stacking sensor 19 is installed above the middle of the silicon wafer conveying track 1. The anti-stacking sensor 19 is used to detect whether there is a situation of multiple silicon wafers stacked, and can also check whether there is still paper separation adhesion, ensuring that the subsequent photographing function can proceed smoothly.

[0042] Paper clamping guide wheels 20 are distributed along the front-back direction on the paper clamping arm 12. When the paper clamping arms 12 are closed, the paper clamping guide wheels 20 are used to reduce the hard contact between the paper clamping arms 12 and the side of the silicon wafer 47, protecting the integrity of the silicon wafer 47.

[0043] A pick-and-place limit arm 21 is arranged at the rear end of the silicon wafer conveying track 1. The pick-and-place limit arm 21 moves along the front-back direction. A pick-and-place cylinder 22 is fixed on the silicon wafer conveying track 1. The driving end of the pick-and-place cylinder 22 is connected to the lower end of the pick-and-place limit arm 21. Under the action of the pick-and-place cylinder 22, the pick-and-place limit arm 21 retracts to position the silicon wafer 47 at a position where the image can be photographed.

[0044] A track wheel 23 is rotatably connected to the silicon wafer conveying track 1, and a track belt 24 is drivingly connected between the track wheels 23. The track belt 24 is located on both sides of the silicon wafer conveying track 1. During the conveying process of the silicon wafer conveying track 1, the rotating track wheel 23 controls the movement of the track belt 24, driving the silicon wafer 47 to move forward in parallel.

[0045] An adsorption plate 37 is installed on the movable end of the manipulator 26, and the adsorption plate 37 is used to grasp the whole silicon wafer 47.

[0046] A slicing front and rear module 38 is installed at the lower end of the slicing bracket 25. The driving end of the slicing front and rear module 38 is fixedly connected to the lifting motor 28. A cam moving hole is provided in the middle of the lifting frame 29. The cam 30 is located in the cam moving hole. An activity groove 39 is provided on the slicing bracket 25 along the front and rear directions. The upper end of the lifting frame 29 passes through the activity groove 39. The slicing front and rear module 38 controls the lifting frame 29 to move back and forth. When the lifting motor 28 controls the lifting frame 29 to rise through the cam 30, the height of the upper end of the lifting frame 29 is higher than the activity groove 39 on the slicing bracket 25, and the lifting frame 29 can move along the activity groove 39, driving the silicon wafer 47 to perform laser cutting treatment.

[0047] A number of adsorption hole positions are provided at the upper end of the lifting frame 29. The adsorption hole positions firmly adsorb and fix the silicon wafer 47 to prevent deviation and accurately perform laser cutting.

[0048] A transfer bracket 40 is provided on one side of the slicing bracket 25. An adsorption cross bar 41 is installed on the transfer bracket 40. There is a gap between two adjacent adsorption cross bars 41. The half-piece output module 27 places the cut double half-pieces on the adsorption cross bar 41 for fixation. Subsequently, the stringer inserts the tracks into the gaps between the adsorption cross bars 41 and then raises the double half-pieces to take them away.

[0049] A separator replenishment box 42 and a defective placement box 43 are provided on one side of the manipulator 26. When the manipulator 26 detects whether the whole silicon wafer 47 at the front end meets the requirements, the defective silicon wafer 47 will be placed in the defective placement box 43, and they are placed in a spaced manner with one layer of separator and one layer of silicon wafer 47. The separator is taken out from the separator replenishment box 42 and placed in the defective placement box 43 to separate and protect each layer of silicon wafer 47.

[0050] A horizontal slide 44 is installed on the slicing bracket 25. An L-shaped support 45 is connected to the horizontal slide 44. A vertical slide 46 is installed on the L-shaped support 45. The slicing laser head 31 and the slicing detection camera 32 are respectively installed on a vertical slide 46. The positions of the slicing laser head 31 and the slicing detection camera 32 are finely adjusted by using the horizontal slide 44 and the vertical slide 46 to adapt to the position of the silicon wafer 47 to be sliced.

[0051] All the modules involved in this application are linear modules.

[0052] It should be noted that the above specific embodiments are only the preferred embodiments of the present invention and the technical principles applied. Any changes or substitutions that are easily conceivable by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention.

Claims

1. A half-sheet cutting machine for BC cell silicon wafers, characterized in that, It includes a pick-and-place component, a silicon wafer conveying track, and a half-piece cutting mechanism. The silicon wafer conveying track connects the pick-and-place component and the half-piece cutting mechanism; The pick-and-place component includes a transverse pick-and-place module, a silicon wafer lifting module, and a spacer paper lifting module. A spacer paper gripping plate and a silicon wafer gripping plate are installed on the driving end of the transverse pick-and-place module. A silicon wafer cassette is connected to the driving end of the silicon wafer lifting module. A spacer paper cassette is connected to the driving end of the spacer paper lifting module; A silicon wafer clamping motor is installed below the middle of the silicon wafer conveying track. A clamping synchronous pulley is connected to the driving end of the silicon wafer clamping motor. The clamping synchronous pulley is drivingly connected to a clamping synchronous belt. Clamping arms are installed on the clamping synchronous belt. The two clamping arms are respectively on both sides of the silicon wafer conveying track. A pick-and-place detection light source is installed below the rear end of the silicon wafer conveying track. A pick-and-place detection camera is installed above the rear end of the silicon wafer conveying track; The half-piece cutting mechanism includes a scribing bracket, a manipulator, and a half-piece output module. A lifting motor and a lifting frame are provided on the scribing bracket. The lifting motor moves back and forth along the scribing bracket. A cam is connected to the driving end of the lifting motor. The cam is in the middle of the lifting frame. A scribing laser head and a scribing detection camera are provided in the middle of the scribing bracket. The half-piece output module includes a half-piece transverse movement module, a half-piece vertical movement module, and a half-piece suction rod. The half-piece vertical movement module is installed on the driving end of the half-piece transverse movement module. The half-piece suction rod is installed on the driving end of the half-piece vertical movement module. A half-piece suction nozzle is fixed on the half-piece suction rod.

2. The half-sheet cutting machine for BC cell silicon wafers according to claim 1, characterized in that, Spacer paper lifting cylinders and silicon wafer lifting cylinders are respectively installed on both sides of the driving end of the transverse pick-and-place module. The driving end of the spacer paper lifting cylinder is connected to the spacer paper gripping plate. The driving end of the silicon wafer lifting cylinder is connected to the silicon wafer gripping plate.

3. A half-sheet cutting machine for BC cell silicon wafers according to claim 1, characterized in that, Pick-and-place wafer limiting arms are provided at the rear end of the silicon wafer conveying track. The pick-and-place wafer limiting arms move in the front-rear direction.

4. A half-sheet cutting machine for BC cell silicon wafers according to claim 3, characterized in that, A pick-and-place wafer cylinder is fixed on the silicon wafer conveying track. The driving end of the pick-and-place wafer cylinder is connected to the lower end of the pick-and-place wafer limiting arm.

5. A half-piece cutting machine for BC cell silicon wafers according to claim 1, characterized in that, Track wheels are rotatably connected to the silicon wafer conveying track. A track belt is drivingly connected between the track wheels. The track belt is located on both sides of the silicon wafer conveying track.

6. The half-sheet cutting machine for BC cell silicon wafers according to claim 1, characterized in that, A scribing front-rear module is installed at the lower end of the scribing bracket. The driving end of the scribing front-rear module is fixedly connected to the lifting motor. A cam moving hole is provided in the middle of the lifting frame. The cam is in the cam moving hole.

7. A half-sheet cutting machine for BC cell silicon wafers according to claim 1, characterized in that, An activity groove is provided on the scribing bracket in the front-rear direction. The upper end of the lifting frame passes through the activity groove.

8. A half-sheet cutting machine for BC cell silicon wafers according to claim 1, characterized in that, A transfer bracket is provided on one side of the scribing bracket. An adsorption cross bar is installed on the transfer bracket. There is a gap between adjacent two adsorption cross bars.

9. A half-sheet cutting machine for BC cell silicon wafers according to claim 1, characterized in that, A spacer paper replenishing box and a defective product placement box are provided on one side of the manipulator.

10. A half-piece cutting machine for BC cell silicon wafers according to claim 1, characterized in that, A horizontal slide is installed on the scribing bracket. An L-shaped support is connected to the horizontal slide. A vertical slide is installed on the L-shaped support. The scribing laser head and the scribing detection camera are respectively installed on one vertical slide.

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