Thermocompression welding device and welding method thereof

Abstract

The invention discloses a thermocompression welding device and a welding method thereof, and particularly relates to the field of thermocompression welding, the thermocompression welding device comprises a machine base, a machine table is installed on the machine base, a welding mechanism is installed on the machine table, an electric appliance box is further installed on the machine table, a pressure head assembly is installed on the electric appliance box, the welding mechanism comprises a bearing table base, and a supporting base is installed on the bearing table base; one side of the supporting seat is provided with a soft board carrying table, the soft board carrying table is used for installing a hollowed-out board, a window is formed in the connecting end of the hollowed-out board, a suspension piece is arranged in the window in a suspended mode, and one side, away from the soft board carrying table, of the supporting seat is provided with a hard board carrying table. According to the invention, the plurality of suspended sheets are reversely supported through the bumps, so that the suspended sheets are prevented from being bent or broken due to pressure concentration when the bonding pad and the welding flux are pressed downwards, the window of the hollow plate is supported through the fixed supporting plate, the welding precision of the suspended sheets and the bonding pad is prevented from being influenced due to deformation of the window of the hollow plate, and the qualification rate of thermal compression welding of the hollow plate is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of thermocompression welding, and more specifically, the present invention relates to a thermocompression welding device and a welding method thereof. Background Art

[0002] Pulse thermocompression welding is mainly used to achieve the welding of special-shaped or flexible materials with high precision and low thermal damage, such as the dissimilar material connection between a PCB (rigid circuit board) and an FPC (flexible circuit board). A high-energy pulse current can be applied instantaneously during welding to rapidly heat a local area to the solder melting point (such as 200 - 300 °C) in a short heating time (millisecond level), avoiding carbonization or delamination of the PCB / FPC substrate due to continuous high temperature.

[0003] The FPC mainly includes single-sided boards and double-sided boards. Among them, the single-sided board has only a single layer of circuits and is suitable for simple circuit connections. When the circuit design only requires a single layer of circuits but the connection requires double-sided contacts, a special board type in the single-sided board needs to be used. The single copper double-sided board is also called a cut-out board. By opening windows in the flexible board substrate and arranging suspended finger circuits in the windows, the suspended finger circuits are convenient for double-sided contacts. This cut-out board not only retains the flexural resistance characteristics of the single-sided board but also has the double-sided contact function of the double-sided board.

[0004] When the prior art welds the finger circuits of the cut-out board to the pads of the PCB, first, the cut-out board is fixed on the welding table, then solder is applied to the upper surface of the finger circuits, then the pads of the PCB are aligned above the finger circuits, and then the pads of the PCB are heated and pressed down by a hot pressing head, so that the solder first melts and then solidifies, welding and fixing the pads and the finger circuits. Finally, the cut-out board is flipped to perform the same steps as above on the other side of the finger circuits.

[0005] However, in order to disperse the bending stress and avoid the hot pressing head at the window, the cut-out board needs to increase the length and width of the window, resulting in an increase in the overhang length of the finger circuits. Due to the depression at the window, in order to make the pads and the finger circuits fit tightly, it is necessary to increase the downward pressure of the hot pressing head. Therefore, during thermocompression welding, the suspended finger circuits at the solder joint positions with solder are bent or even broken due to pressure concentration at the solder joints of the suspended finger circuits, resulting in unqualified or damaged thermocompression welding of the cut-out board. Summary of the Invention

[0006] The thermocompression welding device and the welding method provided by the present invention aim to solve the problem that in the existing thermocompression welding device, when performing thermocompression welding on a cut-out board, due to the large window and long finger circuits of the cut-out board, the pressure of the hot pressing head is concentrated, resulting in bending or even breaking of the solder joints of the suspended finger circuits.

[0007] To achieve the above object, the present invention provides the following technical solution: A hot press welding device includes a machine base, on which a machine table is installed. A welding mechanism is installed on the machine table, and an electrical box is also installed on the machine table. A pressure head assembly is installed on the electrical box. The welding mechanism includes a bearing platform seat, on which a support seat is installed. On one side of the support seat, there is a flexible board carrier for installing a hollowed-out board. A window is provided at the connecting end of the hollowed-out board, and a suspended piece is suspended in the window. On the side of the support seat away from the flexible board carrier, there is a rigid board carrier for installing a PCB board. A solder pad is provided at the connecting end of the PCB board. The suspended piece of the hollowed-out board is fixedly welded to the solder pad of the PCB board through solder; A reverse support member is installed on the support seat, and the reverse support member is located on the side of the suspended piece away from the solder pad.

[0008] In a preferred embodiment, the reverse support member includes a cushion block, on the top of which a convex block is fixedly provided, and the convex block abuts against the bottom surface of the suspended piece. A pressure sensor is installed inside the convex block, and a fixed support plate is installed on the cushion block, and the fixed support plate is located at the bottom of the hollowed-out board.

[0009] In a preferred embodiment, an installation seat is installed inside the electrical box, a pulse generator is installed on the installation seat, a fixed table is installed on one side of the installation seat, and a second linear driver is installed on the fixed table. The output end of the second linear driver is connected to the pressure head assembly.

[0010] In a preferred embodiment, the pressure head assembly includes a heating seat, a hot pressure head is installed at the bottom end of the heating seat, and a rigid board pressing block is provided on one side of the hot pressure head, and the rigid board pressing block is detachably connected to the heating seat.

[0011] In a preferred embodiment, a linear drive mechanism is installed on the machine table, the output end of the linear drive mechanism is connected to the bearing platform seat, a jig board is installed on the flexible board carrier, positioning blocks are provided at the edge of the jig board, and positioning grooves are provided on the flexible board carrier. The positioning blocks are positioned and connected to the positioning grooves through screws.

[0012] In a preferred embodiment, a side plate assembly is installed on the fixed support plate, the side plate assembly includes a first side plate and a second side plate, and the first side plate and the second side plate are respectively located on both sides of the suspended piece.

[0013] In a preferred embodiment, a movable support plate is provided on the cushion block, an opening is provided inside the fixed support plate, support columns are fixedly provided on both the first side plate and the second side plate, the support columns penetrate through the inside of the opening, and the support columns are fixedly connected to the movable support plate. A first linear driver is installed on the support seat, and the output end of the first linear driver is connected to the movable support plate.

[0014] In a preferred embodiment, a limiting groove is formed in the middle of the bump, limiting openings are formed at both ends of the movable supporting plate, and the limiting openings are adapted to both ends of the bump. The middle of the movable supporting plate is slidably arranged inside the limiting groove. Guide blocks are fixedly arranged on both sides of the cushion block, a guide post penetrates through the inside of the guide block, and the top end of the guide post is fixedly connected with the movable supporting plate.

[0015] In a preferred embodiment, receiving grooves are formed on the opposite sides of adjacent groups of first side plates and second side plates. Collection cavities are formed inside the first side plates and the second side plates. Flow guiding sheets are installed on one side of the collection cavity corresponding to the receiving groove, and a plugging block is detachably connected to the bottom of the collection cavity.

[0016] The present invention also provides a welding method for a hot pressing welding device, including the following steps: S1: Drive the bearing base to extend out through the linear driving mechanism, install the hollowed-out plate on the jig plate, apply solder on the suspended sheet, install the PCB board on the hard board carrier, and press the solder pads of the PCB board on the solder. S2: Drive the bearing base to retract below the hot pressing head assembly through the linear driving mechanism. Align the hot pressing head of the hot pressing head assembly with the solder pads of the PCB board and perform hot pressing. Support the suspended sheet from the bottom through the bump, support the window of the hollowed-out plate through the fixed supporting plate, and detect the pressure data of the hollowed-out plate in real time through the pressure sensor. S3: Drive the movable supporting plate to rise through the first linear driver, so that the top of the side plate assembly abuts against the PCB board, and adjacent groups of first side plates and second side plates respectively block both sides of the corresponding suspended sheet. S4: Drive the movable supporting plate to descend through the first linear driver. The first side plate and the second side plate move to the lower sides of both sides of the suspended sheet, and collect the molten solder overflowing from both sides of the suspended sheet through the receiving groove and the flow guiding sheet.

[0017] The beneficial effects of the present invention are as follows: The present invention reversely supports multiple suspended sheets through the bump, avoiding the bending or breaking of the suspended sheets due to pressure concentration when the solder pads and the solder are pressed down. The window of the hollowed-out plate is supported through the fixed supporting plate, avoiding the influence on the welding accuracy between the suspended sheet and the solder pad due to the deformation of the window of the hollowed-out plate, and ensuring the qualified rate of the hot pressing welding of the hollowed-out plate.

[0018] The present invention drives the movable supporting plate and the side plate assembly to rise through the first linear driver, so that the first side plate and the second side plate block both sides of the suspended sheet, facilitating the axial flow of the solder along the suspended sheet.

[0019] The present invention descends the first side plate and the second side plate, and the solder adhered to the sides of the first side plate and the second side plate is scraped onto the suspended sheet. A small amount of solder flows to both sides without additional pressure and is collected through the receiving groove, avoiding the difficulty of separating the bump from the suspended sheet due to the solder adhering to the bump. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 This is a schematic diagram of the machine structure of the present invention.

[0022] Figure 3 This is a schematic diagram of the flexible board carrier structure of the present invention.

[0023] Figure 4 This is a schematic diagram of the indenter assembly structure of the present invention.

[0024] Figure 5 This is a schematic top view of the installation of the perforated board of the present invention.

[0025] Figure 6 This is a schematic diagram of the end structure of the support base of the present invention.

[0026] Figure 7 This is a schematic three-dimensional structure diagram of the side plate assembly of the present invention.

[0027] Figure 8 This is a schematic sectional structure diagram of the second side plate of the present invention.

[0028] Figure 9 This is a schematic diagram of the fixed support plate structure of the present invention.

[0029] Figure 10 This is a schematic diagram of the spacer block structure of the present invention.

[0030] Figure 11 This is a schematic diagram of the welding method process of the present invention.

[0031] Reference numerals are: 1, machine base; 2, machine table; 3, welding mechanism; 31, bearing block; 32, support base; 321, spacer block; 322, pressure sensor; 323, limit groove; 324, convex block; 33, flexible board carrier; 331, fixture board; 332, positioning block; 333, positioning groove; 34, rigid board carrier; 35, fixed support plate; 351, opening; 36, side plate assembly; 361, first side plate; 362, second side plate; 363, material receiving groove; 364, collection cavity; 365, support column; 366, diversion sheet; 367, blocking block; 37, movable support plate; 371, limit port; 38, guide block; 381, guide post; 39, first linear driver; 4, electrical box; 41, mounting seat; 42, pulser; 43, second linear driver; 44, indenter assembly; 441, heating seat; 442, hot indenter; 443, rigid board pressing block; 5, fixed table; 6, linear drive mechanism; 7, perforated board; 71, suspended piece; 8, PCB board; 81, pad; 9, solder. DETAILED DESCRIPTION OF THE INVENTION

[0032] The present application will be further described in detail below with reference to the accompanying drawings. It is necessary to point out here that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the protection scope of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0033] Referring to the attached Figures 1 to 6 , a hot pressing welding device includes a machine base 1, a machine table 2 is installed on the machine base 1, a welding mechanism 3 is installed on the machine table 2, an electrical box 4 is also installed on the machine table 2, and a pressing head assembly 44 is installed on the electrical box 4. The welding mechanism 3 includes a bearing seat 31, a support seat 32 is installed on the bearing seat 31, a flexible board carrier 33 is provided on one side of the support seat 32, and the flexible board carrier 33 is used to install a hollow board 7. A window is opened at the connecting end of the hollow board 7, and a suspension piece 71 is suspended in the window. A rigid board carrier 34 is provided on the side of the support seat 32 away from the flexible board carrier 33, and the rigid board carrier 34 is used to install a PCB board 8. A solder pad 81 is provided at the connecting end of the PCB board 8. The suspension piece 71 of the hollow board 7 is fixedly welded to the solder pad 81 of the PCB board 8 through a solder 9; a reverse support member is installed on the support seat 32, and the reverse support member is located on the side of the suspension piece 71 away from the solder pad 81. When the pressing head assembly 44 presses down the PCB board 8 and the hollow board 7, the reverse support member provides reverse support for the hollow board 7.

[0034] It should be noted that the solder pad 81 is protruded, the solder 9 is made of tin solder or other hot pressing welding materials, the width of the reverse support member is slightly smaller than the width of the suspension piece 71, and positioning holes are provided on the rigid board carrier 34 for positioning the PCB board 8.

[0035] Further, the reverse support member includes a cushion block 321, a convex block 324 is fixedly provided on the top of the cushion block 321, and the convex block 324 abuts against the bottom surface of the suspension piece 71. A pressure sensor 322 is installed inside the convex block 324, and a fixed support plate 35 is installed on the cushion block 321, and the fixed support plate 35 is located at the bottom of the hollow board 7.

[0036] It should be noted that the cushion block 321 is detachably installed on the support seat 32, and the fixed support plate 35 is fixed at a position slightly above the middle of the convex block 324.

[0037] Still further, an installation seat 41 is installed inside the electrical box 4, a pulsator 42 is installed on the installation seat 41, a fixed table 5 is installed on one side of the installation seat 41, a second linear driver 43 is installed on the fixed table 5, and the output end of the second linear driver 43 is connected to the pressing head assembly 44.

[0038] It should be noted that the pulsator 42 is electrically connected to the second linear driver 43, and this electrical connection is a common operation for those skilled in the art.

[0039] Furthermore, the indenter assembly 44 includes a heating base 441. A hot indenter 442 is installed at the bottom end of the heating base 441. A rigid board pressing block 443 is provided on one side of the hot indenter 442, and the rigid board pressing block 443 is detachably connected to the heating base 441.

[0040] It should be noted that a heater is provided inside the heating base 441. The heater is connected to the hot indenter 442. The hot indenter 442 is a component made of heat-conducting material, and the rigid board pressing block 443 is a component made of rubber material.

[0041] Furthermore, a linear driving mechanism 6 is installed on the machine table 2. The output end of the linear driving mechanism 6 is connected to the bearing platform 31. A jig plate 331 is installed on the flexible board carrier 33. Positioning blocks 332 are provided at the edge of the jig plate 331. Positioning grooves 333 are formed on the flexible board carrier 33. The positioning blocks 332 are positioned and connected to the positioning grooves 333 through screws.

[0042] It should be noted that the positioning blocks 332 press down on the edge of the hollowed-out plate 7 on the jig plate 331 for positioning.

[0043] In this embodiment, the implementation scenario is specifically as follows: The bearing platform 31 is driven by the linear driving mechanism 6 to move away from the electrical box 4. The hollowed-out plate 7 is placed on the jig plate 331. The edge of the hollowed-out plate 7 is pressed down by the positioning blocks 332 for positioning. Solder 9 is applied on the suspended piece 71. The PCB board 8 is installed on the rigid board carrier 34 and fixed through the positioning holes. At this time, the convex block 324 extends into the window of the hollowed-out plate 7 from the bottom and abuts against the bottom of the suspended piece 71. The fixed support plate 35 supports outside the window of the hollowed-out plate 7. The hot indenter 442 indirectly heats the solder 9 to make it in a hot-melt state, so that the solder 9 flows between the suspended piece 71 and the pad 81. The second linear driver 43 presses down to make the suspended piece 71 and the pad 81 closely fit. After the solder 9 cools and solidifies, the hot pressing welding is completed. The hot indenter 442 is removed, and the bearing platform 31 is driven by the linear driving mechanism 6 to extend out. Then the hollowed-out plate 7 and the PCB board 8 can be taken off. Overall, the convex block 324 provides reverse support for multiple suspended pieces 71, avoiding the bending or breaking of the suspended suspended pieces 71 due to concentrated pressure when the pads 81 and the solder 9 are pressed down. The fixed support plate 35 supports the window of the hollowed-out plate 7, avoiding the influence on the welding accuracy between the suspended piece 71 and the pad 81 due to the deformation of the window of the hollowed-out plate 7, and ensuring the qualified rate of the hot pressing welding of the hollowed-out plate 7.

[0044] Refer to the attached drawings of the specification Figures 5 to 10 , in the hot pressing stage, the flowing solder 9 will overflow to both sides, resulting in the solder 9 sticking to the convex block 324. After the solder 9 cools and solidifies, it is difficult to separate the convex block 324 from the suspended piece 71.

[0045] To solve this problem, the following technical solutions are also provided: A side plate assembly 36 is installed on the fixed pallet 35. The side plate assembly 36 includes a first side plate 361 and a second side plate 362, and the first side plate 361 and the second side plate 362 are respectively located on both sides of the suspended piece 71.

[0046] It should be noted that the surfaces of the first side plate 361 and the second side plate 362 facing the suspended piece 71 are smooth surfaces, and anti-sticking treatment is performed on these side surfaces.

[0047] Furthermore, a movable pallet 37 is provided on the cushion block 321. An opening 351 is formed inside the fixed pallet 35. Support columns 365 are fixedly provided on both the first side plate 361 and the second side plate 362. The support columns 365 penetrate through the inside of the opening 351, and the support columns 365 are fixedly connected to the movable pallet 37. A first linear driver 39 is installed on the support seat 32, and the output end of the first linear driver 39 is connected to the movable pallet 37.

[0048] It should be noted that when the first linear driver 39 drives the first side plate 361 and the second side plate 362 to rise through the movable pallet 37, the tops of the first side plate 361 and the second side plate 362 are in contact with the bottom surface of the PCB board 8. When the movable pallet 37 drives the first side plate 361 and the second side plate 362 to descend, the tops of the first side plate 361 and the second side plate 362 are lower than the top surface height of the suspended piece 71.

[0049] Still further, a limiting groove 323 is formed in the middle of the convex block 324. Limiting ports 371 are formed at both ends of the movable pallet 37, and the limiting ports 371 are adapted to the two ends of the convex block 324. The middle part of the movable pallet 37 is slidably arranged inside the limiting groove 323. Guide blocks 38 are fixedly provided on both sides of the cushion block 321. A guide post 381 penetrates through the inside of the guide block 38, and the top end of the guide post 381 is fixedly connected to the movable pallet 37.

[0050] It should be noted that the movable pallet 37 is in an H shape. Its middle part is assembled with the limiting groove 323 to play a role in lateral limitation, and the guide blocks 38 and the guide posts 381 play a guiding role during vertical movement.

[0051] Still further, receiving grooves 363 are formed on the opposite sides of two adjacent groups of the first side plate 361 and the second side plate 362. Collection cavities 364 are formed inside both the first side plate 361 and the second side plate 362. A diversion piece 366 is installed on one side of the collection cavity 364 corresponding to the receiving groove 363. A blocking block 367 is detachably connected to the bottom of the collection cavity 364.

[0052] It should be noted that the cross-section of the receiving groove 363 is in an L shape, and the upper surface of the diversion piece 366 is an inclined surface.

[0053] In this embodiment, the implementation scenario is specifically as follows: In the hot pressing stage, the movable platen 37 and the side plate assembly 36 are driven by the first linear actuator 39 to rise, so that the first side plate 361 and the second side plate 362 block both sides of the suspended piece 71, facilitating the solder 9 to flow along the axial direction of the suspended piece 71. Before the solder 9 solidifies, the downward pressure of the hot pressing head 442 is removed, and the first side plate 361 and the second side plate 362 are lowered. The solder 9 adhered to the sides of the first side plate 361 and the second side plate 362 is scraped onto the suspended piece 71. A small amount of solder 9 flows to both sides without additional pressure and is collected through the material receiving groove 363. The solder 9 is collected into the interior of the collection cavity 364 through the diversion piece 366. Subsequently, the plug block 367 is removed to clear out and reuse the solder 9 collected inside the collection cavity 364. The flowing solder 9 is blocked by the first side plate 361 and the second side plate 362 from overflowing to both sides. By lowering the first side plate 361 and the second side plate 362, the solder 9 adhered to their surfaces is scraped off and left on the suspended piece 71. The small amount of solder 9 that overflows without additional pressure on both sides is collected through the collection cavity 364, preventing the bump 324 from being difficult to separate from the suspended piece 71 due to the adhesion of the solder 9.

[0054] Working principle: I. The linear drive mechanism 6 drives the bearing block 31 to move away from the electrical box 4, places the hollow plate 7 on the jig plate 331, locates the edge of the hollow plate 7 by pressing down the positioning block 332, applies the solder 9 on the suspended piece 71, and installs the PCB board 8 on the hard board stage 34 and fixes it through the positioning holes.

[0055] II. The bump 324 extends from the bottom into the window of the hollow plate 7 and abuts against the bottom of the suspended piece 71, and the fixed platen 35 supports outside the window of the hollow plate 7.

[0056] III. The first linear actuator 39 drives the movable platen 37 and the side plate assembly 36 to rise, so that the first side plate 361 and the second side plate 362 block both sides of the suspended piece 71.

[0057] IV. The solder 9 is indirectly heated by the hot pressing head 442 to make it in a hot melt state, so that the solder 9 flows between the suspended piece 71 and the pad 81. The second linear actuator 43 presses down to make the suspended piece 71 and the pad 81 fit tightly. After the solder 9 solidifies, the hot pressing welding is completed.

[0058] V. Remove the hot pressing head 442 and lower the first side plate 361 and the second side plate 362. The solder 9 adhered to the sides of the first side plate 361 and the second side plate 362 is scraped onto the suspended piece 71. A small amount of solder 9 flows to both sides without additional pressure and is collected through the material receiving groove 363. The linear drive mechanism 6 drives the bearing block 31 to extend, and the hollow plate 7 and the PCB board 8 can be removed.

[0059] Refer to the attached description Figure 11 The present invention also provides a welding method for a hot press welding device, comprising the following steps: S1: Drive the bearing seat 31 to extend through the linear drive mechanism 6, install the hollow plate 7 on the jig plate 331, apply the solder 9 on the suspended piece 71, install the PCB board 8 on the hard board stage 34, and press the pad 81 of the PCB board 8 on the solder 9; S2: Drive the bearing seat 31 to retract below the hot press head assembly 44 through the linear drive mechanism 6, align the hot press head 442 of the hot press head assembly 44 with the pad 81 of the PCB board 8 and perform hot pressing, support the suspended piece 71 from the bottom through the bump 324, support the window of the hollow plate 7 through the fixed support plate 35, and detect the pressure data of the hollow plate 7 in real time through the pressure sensor 322; S3: Drive the movable support plate 37 to rise through the first linear driver 39, so that the top of the side plate assembly 36 abuts against the PCB board 8, and the adjacent two groups of first side plates 361 and second side plates 362 respectively block both sides of the corresponding suspended piece 71; S4: Drive the movable support plate 37 to descend through the first linear driver 39, move the first side plate 361 and the second side plate 362 to the lower sides of both sides of the suspended piece 71, and collect the molten solder 9 overflowing from both sides of the suspended piece 71 through the material receiving groove 363 and the flow guiding piece 366.

[0060] The above embodiments only represent several implementation manners of the present invention, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention.

Claims

1. A hot press welding device, characterized in that: It includes a machine base (1), on which a machine table (2) is installed. A welding mechanism (3) is installed on the machine table (2), and an electrical box (4) is also installed on the machine table (2). A pressing head assembly (44) is installed on the electrical box (4). The welding mechanism (3) includes a base seat (31), on which a support seat (32) is installed. On one side of the support seat (32), there is a flexible board carrier (33), and the flexible board carrier (33) is used for installing a hollowed-out board (7). A window is opened at the connecting end of the hollowed-out board (7), and a suspended piece (71) is suspended in this window; On the side of the support seat (32) away from the flexible board carrier (33), there is a rigid board carrier (34), and the rigid board carrier (34) is used for installing a PCB board (8). A solder pad (81) is provided at the connecting end of the PCB board (8). The suspended piece (71) of the hollowed-out board (7) and the solder pad (81) of the PCB board (8) are welded and fixed by solder (9); A reverse support member is installed on the support seat (32), and the reverse support member is located on the side of the suspended piece (71) away from the solder pad (81).

2. The hot pressing welding device according to claim 1, characterized in that: The reverse support member includes a cushion block (321). A convex block (324) is fixedly provided at the top of the cushion block (321), and the convex block (324) abuts against the bottom surface of the suspended piece (71). A pressure sensor (322) is installed inside the convex block (324). A fixed support plate (35) is installed on the cushion block (321), and the fixed support plate (35) is located at the bottom of the hollowed-out board (7).

3. The hot pressing and welding device according to claim 2, characterized in that: An installation seat (41) is installed inside the electrical box (4). A pulse generator (42) is installed on the installation seat (41). A fixed platform (5) is installed on one side of the installation seat (41). A second linear driver (43) is installed on the fixed platform (5), and the output end of the second linear driver (43) is connected to the pressing head assembly (44).

4. The hot pressing welding device according to claim 3, characterized in that: The pressing head assembly (44) includes a heating seat (441). A hot pressing head (442) is installed at the bottom end of the heating seat (441). A rigid board pressing block (443) is provided on one side of the hot pressing head (442), and the rigid board pressing block (443) is detachably connected to the heating seat (441).

5. A hot press welding device according to claim 4, characterized in that: A linear drive mechanism (6) is installed on the machine table (2), and the output end of the linear drive mechanism (6) is connected to the base seat (31). A jig board (331) is installed on the flexible board carrier (33). Positioning blocks (332) are provided at the edge of the jig board (331). Positioning grooves (333) are opened on the flexible board carrier (33), and the positioning blocks (332) are positioned and connected to the positioning grooves (333) by screws.

6. The hot pressing and welding device according to claim 5, characterized in that: A side plate assembly (36) is installed on the fixed support plate (35). The side plate assembly (36) includes a first side plate (361) and a second side plate (362), and the first side plate (361) and the second side plate (362) are respectively located on both sides of the suspended piece (71).

7. The hot pressing welding device according to claim 6, characterized in that: An active pallet (37) is provided on the cushion block (321). An opening (351) is formed inside the fixed pallet (35). Support columns (365) are fixedly provided on both the first side plate (361) and the second side plate (362). The support columns (365) penetrate inside the opening (351), and the support columns (365) are fixedly connected to the active pallet (37). A first linear driver (39) is installed on the support base (32), and the output end of the first linear driver (39) is connected to the active pallet (37).

8. A hot press welding device according to claim 7, characterized in that: A limiting groove (323) is formed in the middle of the bump (324). Limiting openings (371) are formed at both ends of the active pallet (37), and the limiting openings (371) are adapted to both ends of the bump (324). The middle of the active pallet (37) is slidably arranged inside the limiting groove (323). Guide blocks (38) are fixedly provided on both sides of the cushion block (321). Guide columns (381) penetrate inside the guide blocks (38), and the top ends of the guide columns (381) are fixedly connected to the active pallet (37).

9. A hot pressing welding device according to claim 8, characterized in that: On the opposite sides of two adjacent groups of the first side plates (361) and the second side plates (362), material receiving grooves (363) are formed. Collection cavities (364) are formed inside both the first side plates (361) and the second side plates (362). A diversion piece (366) is installed on one side of the collection cavity (364) corresponding to the material receiving groove (363). A plugging block (367) is detachably connected to the bottom of the collection cavity (364).

10. A welding method of the hot press welding device as described in claim 9, characterized in that, It includes the following steps: S1: Drive the bearing block (31) to extend out through the linear drive mechanism (6), install the hollow plate (7) on the jig plate (331), apply the solder (9) on the suspended piece (71), install the PCB board (8) on the hard board stage (34), and press the pads (81) of the PCB board (8) on the solder (9). S2: Drive the bearing block (31) to retract below the hot pressing head assembly (44) through the linear drive mechanism (6). The hot pressing head (442) of the hot pressing head assembly (44) aligns with the pads (81) of the PCB board (8) and performs hot pressing. Support the suspended piece (71) from the bottom through the bump (324), support the window of the hollow plate (7) through the fixed pallet (35), and detect the pressure data of the hollow plate (7) in real time through the pressure sensor (322). S3: Drive the active pallet (37) to rise through the first linear driver (39), so that the top of the side plate assembly (36) abuts against the PCB board (8), and two adjacent groups of the first side plates (361) and the second side plates (362) respectively block both sides of the corresponding suspended piece (71). S4: Drive the active pallet (37) to descend through the first linear driver (39). The first side plates (361) and the second side plates (362) move to the lower sides of both sides of the suspended piece (71), and collect the molten solder (9) overflowing from both sides of the suspended piece (71) through the material receiving grooves (363) and the diversion pieces (366).

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