A packaging welding structure for a semiconductor device

Abstract

The present invention relates to the technical field of semiconductor device packaging and welding, and in particular to a packaging and welding structure of a semiconductor device, comprising a welding platform, a support frame and a support column fixed on the top of the welding platform, a pressure ring provided above the support column, a limiting frame fixed on the top of the pressure ring, a welding groove provided inside the limiting frame and the pressure ring, a holding mechanism provided inside the welding groove, a lifting ring provided on the outer side of the pressure ring, the pressure ring is connected to the lifting ring through a rotating mechanism, the lifting ring is connected to the support frame through the lifting mechanism, the rotating mechanism is used to drive the pressure ring to rotate, thereby adjusting the position of the holding mechanism, a blowing mechanism is provided on the limiting frame, the blowing mechanism is used to blow air to the semiconductor device; the present invention can play a blowing role on the semiconductor device and the substrate when performing semiconductor device packaging welding, can effectively avoid the influence of dust on the welding of the semiconductor device, and ensure the welding effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device packaging and welding, in particular to a semiconductor device packaging and welding structure. Background Art

[0002] Semiconductor packaging welding refers to the process of connecting the semiconductor chip to the package body (such as substrate, lead frame, etc.) through certain process means to achieve electrical interconnection and physical protection. This link is crucial to ensuring the performance, reliability and subsequent application of semiconductor devices.

[0003] In the prior art, when packaging and welding semiconductor devices, the pins on the semiconductor device are mostly aligned with the solder points on the substrate surface first, and then the semiconductor device is welded to the substrate surface through welding equipment. However, this welding method can easily cause the semiconductor device to shift during the welding process, reducing the welding accuracy. At the same time, the substrate and semiconductor device cannot be self-cleaned. The dust on the surface of the substrate has a certain impact on welding, which reduces the subsequent use effect of the semiconductor device. Summary of the Invention

[0004] The object of the present invention is to provide a packaging welding structure for a semiconductor device to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A packaging welding structure for semiconductor devices includes a welding platform, a support frame and a support column are fixed on the top of the welding platform, a pressure ring is provided above the support column, a limit frame is fixed on the top of the pressure ring, a welding groove is provided inside the limit frame and the pressure ring, a holding mechanism is provided inside the welding groove, the holding mechanism is used to hold the semiconductor device, a lifting ring is provided on the outside of the pressure ring, the pressure ring is connected to the lifting ring through a rotating mechanism, the lifting ring is connected to the support frame through the lifting mechanism, the rotating mechanism is used to drive the pressure ring to rotate, thereby adjusting the position of the holding mechanism, the lifting mechanism is used to drive the lifting ring to move up and down, and a blowing mechanism is provided on the limit frame, the blowing mechanism is used to blow air to the semiconductor device.

[0007] Preferably: the holding mechanism includes a pressing plate arranged on the inner side of the welding groove, and movable blocks are fixed to the ends of the pressing plates, one of the movable blocks is threadedly connected to a first threaded rod, and the first threaded rod is rotatably connected to the inner wall of the limit frame, and a limiting rod passes through the inside of the other movable block, and the limiting rod is fixedly connected to the inner wall of the limit frame, and a first motor is fixed to the outside of the limit frame, and the output end of the first motor is fixedly connected to one end of the first threaded rod.

[0008] Preferably: the lifting mechanism includes a second threaded rod threadedly connected to the lifting ring, a second motor is installed on the top of the support frame, the output end of the second motor is fixedly connected to one end of the second threaded rod, and a guide rod is fixed between the top of the support frame and the welding platform, the guide rod passes through the lifting ring and is slidably connected to the lifting ring.

[0009] Preferably: the rotating mechanism includes a third motor installed on the top of the pressure ring, the output end of the third motor passes through the pressure ring and is fixedly connected to a gear, a gear ring is fixed to the outside of the pressure ring, and the gear ring is engaged with the gear, wherein a support groove adapted to the pressure ring is provided on the inner wall of the lifting ring, and the side wall of the pressure ring is located inside the support groove and is slidably connected to the support groove.

[0010] Preferably: the blowing mechanism includes an air pressure cylinder passing through a pressure ring, the air pressure cylinder is fixedly connected to the pressure ring, wherein a piston is slidably connected inside the air pressure cylinder, a push rod is fixed on the top of the piston, the push rod passes through the top of the air pressure cylinder and is slidably connected to the top of the air pressure cylinder, an air pipe is connected above the piston and on the side wall of the air pressure cylinder, a plurality of air holes are provided on the inner wall of the limit frame, the air holes are connected to the air pipe, a push rod is fixed to the bottom of the piston, a fixed cylinder is fixed to the bottom of the air pressure cylinder, the push rod passes through the bottom of the air pressure cylinder and the fixed cylinder, a baffle is fixed at the lower end of the push rod, the baffle is connected to the bottom of the fixed cylinder through a first elastic component, wherein a fixing component is provided inside the fixed cylinder, and the fixing component is used to fix the push rod.

[0011] Preferably: the fixing assembly includes a groove arranged on the inner wall of the air pressure cylinder, a card block is slidably connected inside the groove, one end of the card block is connected to the inner wall of the groove through a second elastic component, and the other end of the card block is in contact with the side wall of the push rod, wherein the side wall of the push rod is provided with a card groove adapted to the card block, and the card block is traction-connected with a traction component, which is used to pull the card block so that the card block no longer fixes the push rod.

[0012] Preferably: the traction component includes a push block arranged above the fixed cylinder, the end of the push block extends to the outside of the fixed cylinder, a slide rod is fixed to the bottom of the push block, the lower end of the slide rod extends into the interior of the fixed cylinder and is slidably connected to the fixed cylinder, wherein a traction rope is fixed to the lower end of the slide rod, and the other end of the traction rope extends into the interior of the groove and is fixedly connected to the clamping block, and an extrusion block for extruding the push block is fixed on the top of the welding platform, the extrusion block is arranged in a ring shape, and a clearance groove is provided on the inner side of the extrusion block and the surface of the welding platform.

[0013] Compared with the prior art, the present invention has the following beneficial effects: the present invention presses the semiconductor device on the substrate surface by means of a pressing plate, which can effectively improve the stability of the semiconductor device during welding. At the same time, the position and orientation of the pressing plate can be adjusted, so that the pressing plate can press and hold semiconductor devices at different positions, thereby increasing the scope of application and facilitating the welding of semiconductor devices by workers.

[0014] The present invention drives the pressure plate and the air pressure cylinder downward by the pressure ring. When the pressure ring moves downward to a certain position, the extrusion ring on the top of the welding platform squeezes the push block, and the push block drives the slide rod to move upward relative to the fixed cylinder. The slide rod pulls the card block through the traction rope. When the pressure plate just completes the pressure holding of the semiconductor device, the traction rope just pulls the card block into the groove, and the limit of the card block is lost. The piston quickly squeezes the gas above the air pressure cylinder, and the gas inside the air pressure cylinder quickly enters the air pipe, so that the gas can be discharged from the air hole at a faster speed, which has a flushing and blowing effect on the semiconductor device and the substrate, can effectively avoid the influence of dust on the welding of semiconductor devices, and ensure the welding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the overall structure of an embodiment of the present invention.

[0016] Figure 2 Schematic diagram of the lifting ring connection structure in an embodiment of the present invention.

[0017] Figure 3 Schematic diagram of the connection structure between the pressure ring and the lifting ring in the embodiment of the present invention Figure 1 .

[0018] Figure 4 Schematic diagram of the connection structure between the pressure ring and the lifting ring in the embodiment of the present invention Figure 2 .

[0019] Figure 5 Schematic diagram of the pressure plate connection structure in an embodiment of the present invention.

[0020] Figure 6 Schematic diagram of the external structure of the air pressure cylinder in an embodiment of the present invention.

[0021] Figure 7 This is a cross-sectional view of the internal structure of the air pressure cylinder and the fixed cylinder in an embodiment of the present invention.

[0022] Figure 8 for Figure 7 Enlarged view of point A in the middle.

[0023] In the figure: 1-support frame; 2-welding platform; 3-holding mechanism; 31-first threaded rod; 32-first motor; 33-moving block; 34-pressing plate; 35-limiting rod; 4-lifting mechanism; 41-guide rod; 42-second threaded rod; 43-second motor; 5-rotating mechanism; 51-gear; 52-gear ring; 53-third motor; 54-support groove; 6-blasting mechanism; 61-air hole; 62-air pressure Cylinder; 63-resist rod; 64-fixed cylinder; 65-trachea; 66-push rod; 67-first elastic component; 68-baffle; 69-push block; 610-piston; 611-slide rod; 612-traction rope; 613-second elastic component; 614-block; 615-slot; 616-extrusion block; 617-allowance slot; 7-pressing ring; 8-limiting frame; 9-lifting ring; 10-welding slot; 11-support column. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0025] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0026] In one embodiment, see Figure 1 、 Figure 2 、 Figure 3 and Figure 4 A packaging welding structure for semiconductor devices includes a welding platform 2, a support frame 1 and a support column 11 are fixed on the top of the welding platform 2, a pressure ring 7 is provided above the support column 11, a limiting frame 8 is fixed on the top of the pressure ring 7, a welding groove 10 is provided inside the limiting frame 8 and the pressure ring 7, a holding mechanism 3 is provided inside the welding groove 10, and the holding mechanism 3 is used to hold the semiconductor device, a lifting ring 9 is provided on the outside of the pressure ring 7, the pressure ring 7 is connected to the lifting ring 9 through a rotating mechanism 5, and the lifting ring 9 is connected to the support frame 1 through a lifting mechanism 4, the rotating mechanism 5 is used to drive the pressure ring 7 to rotate, thereby adjusting the position of the holding mechanism 3, and the lifting mechanism 4 is used to drive the lifting ring 9 to move up and down, and a blowing mechanism 6 is provided on the limiting frame 8, and the blowing mechanism 6 is used to blow air to the semiconductor device.

[0027] In this embodiment, when the device is soldering a semiconductor device, the substrate is first placed on top of the support column 11, the semiconductor device (such as a chip) is placed on the surface of the substrate, and the pins on the semiconductor device are aligned with the solder joints. After the placement is completed, the rotating mechanism 5 drives the pressure ring 7 to rotate, thereby adjusting the position of the holding mechanism 3 inside the welding groove 10. After the position of the holding mechanism 3 is adjusted, the lifting mechanism 4 drives the lifting ring 9 to move downward, and the lifting ring 9 drives the pressure ring 7 to move downward. The holding mechanism 3 inside the welding groove 10 presses the semiconductor device to the surface of the substrate, which can effectively avoid the shaking phenomenon generated during the welding process of the semiconductor device and ensure the welding effect of the semiconductor device. After the semiconductor device is pressed, the staff can use the welding tool to solder the semiconductor device to the surface of the substrate inside the welding groove 10. After the holding mechanism 3 presses the semiconductor device to the surface of the substrate, the blowing mechanism 6 inside the limit frame 8 blows air to the surface of the semiconductor device, which has a blowing effect on the semiconductor device and the substrate, which can effectively avoid the influence of dust on the welding of the semiconductor device and ensure the welding effect.

[0028] See also Figure 5 The pressing mechanism 3 includes a pressing plate 34 arranged on the inner side of the welding groove 10, and a moving block 33 is fixed to each end of the pressing plate 34, one of the moving blocks 33 is threadedly connected to the first threaded rod 31, and the first threaded rod 31 is rotatably connected to the inner wall of the limiting frame 8, and a limiting rod 35 passes through the inside of the other moving block 33, and the limiting rod 35 is fixedly connected to the inner wall of the limiting frame 8. A first motor 32 is fixed to the outside of the limiting frame 8, and the output end of the first motor 32 is fixedly connected to one end of the first threaded rod 31;

[0029] When welding semiconductor devices, the first motor 32 drives the first threaded rod 31 to rotate, and the threaded connection between the first threaded rod 31 and the moving block 33 drives the pressure plate 34 to move horizontally, so that the pressure plate 34 can press and hold chips at different positions, effectively improving the applicability of the device. The limiting rod 35 can limit the pressure plate 34 through the moving block 33, effectively improving the stability of the pressure plate 34 when moving.

[0030] See also Figure 1 and Figure 2 The lifting mechanism 4 includes a second threaded rod 42 threadedly connected to the lifting ring 9, a second motor 43 is installed on the top of the support frame 1, and the output end of the second motor 43 is fixedly connected to one end of the second threaded rod 42. A guide rod 41 is fixed between the top of the support frame 1 and the welding platform 2, and the guide rod 41 passes through the lifting ring 9 and is slidably connected to the lifting ring 9;

[0031] When welding semiconductor devices, the second motor 43 drives the second threaded rod 42 to rotate, and the threaded connection between the second threaded rod 42 and the lifting ring 9 drives the lifting ring 9 to move downward. The lifting ring 9 drives the holding mechanism 3 to move downward through the pressing ring 7, so that the holding mechanism 3 can press the semiconductor device tightly against the surface of the substrate, avoiding the shaking phenomenon generated during the welding process of the semiconductor device and ensuring the welding effect of the semiconductor device. The guide rod 41 can play a limiting role on the lifting ring 9, effectively improving the stability of the lifting ring 9 when moving up and down.

[0032] See also Figure 3 and Figure 4 The rotating mechanism 5 includes a third motor 53 installed on the top of the pressure ring 7. The output end of the third motor 53 passes through the pressure ring 7 and is fixedly connected to the gear 51. A gear ring 52 is fixed to the outside of the pressure ring 7. The gear ring 52 is engaged with the gear 51. A supporting groove 54 adapted to the pressure ring 7 is provided on the inner wall of the lifting ring 9. The side wall of the pressure ring 7 is located inside the supporting groove 54 and is slidably connected to the supporting groove 54.

[0033] When welding semiconductor devices, the gear 51 is driven to rotate by the third motor 53, and the engagement of the gear 51 with the gear ring 52 drives the pressure ring 7 to rotate. While the pressure ring 7 rotates, it can adjust the direction of the pressure plate 34, thereby preventing the pressure plate 34 from passing over the pins, thereby avoiding interference with the welding of the semiconductor device by the pressure plate 34, and facilitating the welding of the semiconductor device by the staff.

[0034] See also Figure 5 、 Figure 6 and Figure 7 The blowing mechanism 6 includes an air pressure cylinder 62 that passes through the pressure ring 7, and the air pressure cylinder 62 is fixedly connected to the pressure ring 7, wherein the air pressure cylinder 62 is slidably connected to a piston 610 inside the air pressure cylinder 62, and a push rod 63 is fixed to the top of the piston 610. The push rod 63 passes through the top of the air pressure cylinder 62 and is slidably connected to the top of the air pressure cylinder 62. An air pipe 65 is connected above the piston 610 and on the side wall of the air pressure cylinder 62. A plurality of air holes 61 are provided on the inner wall of the limiting frame 8, and the air holes 61 are communicated with the air pipe 65. A push rod 66 is fixed to the bottom of the piston 610, and a fixed cylinder 64 is fixed to the bottom of the air pressure cylinder 62. The push rod 66 passes through the bottom of the air pressure cylinder 62 and the fixed cylinder 64, and a baffle 68 is fixed to the lower end of the push rod 66. The baffle 68 is connected to the bottom of the fixed cylinder 64 through a first elastic component 67, wherein a fixing component is provided inside the fixed cylinder 64, and the fixing component is used to fix the push rod 66;

[0035] When the pressure ring 7 moves upward, it also drives the air cylinder 62 to move upward. When the pressure ring 7 rises to a certain position, the top of the support frame 1 squeezes the push rod 63, and the push rod 63 drives the piston 610 to move inside the air cylinder 62. The piston 610 drives the push rod 66 to move downward relative to the air cylinder 62, so that the first elastic component 67 is in a stretched state. The first elastic component 67 can be a spring. When the pressure ring 7 rises to the highest position, the fixing assembly just completes the fixation of the push rod 66. When the pressure ring 7 moves downward, even if the support frame 1 does not squeeze the push rod 63, the push rod 66 cannot be reset under the action of the fixing assembly. When the holding mechanism 3 just completes the holding of the semiconductor device, the fixing assembly is automatically released. The push rod 66 is fixed, and the push rod 66 is quickly reset under the action of the baffle 68 and the first elastic component 67, thereby driving the piston 610 to move upward rapidly inside the air pressure cylinder 62. The piston 610 squeezes the gas above it, and the gas inside the air pressure cylinder 62 enters the air pipe 65 and is finally discharged from the air hole 61 on the inner wall of the limit frame 8, thereby playing a flushing and blowing role on the semiconductor device and the substrate, which can effectively avoid the influence of dust on the welding of the semiconductor device and ensure the welding effect. After the semiconductor device is pressed, the flushing and blowing mechanism 6 will blow air to the semiconductor device and the substrate, which can effectively avoid the offset phenomenon of the semiconductor device caused by airflow and ensure the welding accuracy.

[0036] See also Figure 7 and Figure 8 The fixing assembly includes a groove provided on the inner wall of the air pressure cylinder 62, and a block 614 is slidably connected inside the groove. One end of the block 614 is connected to the inner wall of the groove through a second elastic component 613, and the other end of the block 614 is in contact with the side wall of the push rod 66, wherein a slot 615 adapted to the block 614 is provided on the side wall of the push rod 66, and the block 614 is traction-connected with a traction component, which is used to pull the block 614 so that the block 614 no longer fixes the push rod 66;

[0037] When the pressure ring 7 moves upward, it also drives the air cylinder 62 to move upward. When the pressure ring 7 rises to a certain position, the top of the support frame 1 squeezes the push rod 63, and the push rod 63 drives the piston 610 to move inside the air cylinder 62. When the pressure ring 7 rises to the highest position, the block 614 is aligned with the slot 615. The block 614 automatically enters the slot 615 under the action of the second elastic component 613, thereby fixing the push rod 66. When the pressure ring 7 moves downward, even if the support frame 1 does not squeeze the push rod 63, the push rod 66 cannot be reset, thereby ensuring the stability of the piston 610. The second elastic component 613 can be a spring.

[0038] See also Figure 2 and Figure 8The traction component includes a push block 69 arranged above the fixed cylinder 64, the end of the push block 69 extends to the outside of the fixed cylinder 64, and a slide rod 611 is fixed to the bottom of the push block 69. The lower end of the slide rod 611 extends into the interior of the fixed cylinder 64 and is slidably connected to the fixed cylinder 64, wherein a traction rope 612 is fixed to the lower end of the slide rod 611, and the other end of the traction rope 612 extends into the groove and is fixedly connected to the clamping block 614. An extrusion block 616 for extruding the push block 69 is fixed to the top of the welding platform 2. The extrusion block 616 is arranged in an annular shape, and a clearance groove 617 is provided on the inner side of the extrusion block 616 and the surface of the welding platform 2;

[0039] When the pressing ring 7 moves downward to a certain position, the extrusion block 616 on the top of the welding platform 2 squeezes the push block 69, so that the push block 69 drives the slide bar 611 to move upward relative to the fixed cylinder 64, and the slide bar 611 pulls the card block 614 through the traction rope 612. When the pressing mechanism 3 completes the pressing of the semiconductor device, the traction rope 612 just pulls the card block 614 into the groove, and the card block 614 is lost. The piston 610 is quickly reset under the action of the first elastic component 67, and the piston 610 quickly squeezes the gas above the air cylinder 62. The gas inside the air cylinder 62 quickly enters the air pipe 65, and then the gas can be discharged from the air hole 61 at a faster speed, ensuring the blowing effect on the semiconductor device and the substrate. Among them, through the setting of the give way groove 617, the pressing ring 7 can smoothly drive the air cylinder 62 to move downward, avoiding the interference of the welding platform 2 on the downward movement of the air cylinder 62.

[0040] Working principle: When the device is welding semiconductor devices, the substrate is first placed on the top of the support column 11, the semiconductor device (such as a chip) is placed on the surface of the substrate, and the pins on the semiconductor device are aligned with the solder joints. After placement, the lifting ring 9 is driven downward by the threaded connection between the second threaded rod 42 and the lifting ring 9, and the lifting ring 9 drives the pressure plate 34 and the air pressure cylinder 62 to move downward through the pressure ring 7. When the pressure ring 7 moves downward to a certain position, the extrusion block 616 on the top of the welding platform 2 squeezes the push block 69, so that the push block 69 drives the slide rod 611 to move upward relative to the fixed cylinder 64, and the slide rod 611 pulls the card block 614 through the traction rope 612. When the pressure plate 34 completes the pressure holding of the semiconductor device, the traction rope 612 just pulls the card block 614 into the groove, and the card block 614 loses its limit, and the piston 610 squeezes quickly The gas above the air cylinder 62 and the gas inside the air cylinder 62 quickly enter the air pipe 65, so that the gas can be discharged from the air hole 61 at a faster speed, which has a blowing effect on the semiconductor device and the substrate, and can effectively avoid the influence of dust on the welding of semiconductor devices, thereby ensuring the welding effect. In addition, the present invention can also drive the pressure plate 34 to move horizontally through the threaded connection between the first threaded rod 31 and the moving block 33, so that the pressure plate 34 can press and hold chips at different positions, effectively improving the scope of application of the device, and can also drive the pressure ring 7 to rotate through the engagement of the gear 51 and the gear ring 52. While the pressure ring 7 rotates, it can adjust the direction of the pressure plate 34, thereby avoiding the pressure plate 34 passing over the pin, avoiding the interference of the pressure plate 34 on the welding of the semiconductor device, and facilitating the welding of the semiconductor device by the staff.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor device packaging welding structure, comprising a welding platform; characterized in that: A support frame and a support column are fixed on the top of the welding platform, a pressure ring is provided above the support column, a limiting frame is fixed on the top of the pressure ring, a welding groove is provided inside the limiting frame and the pressure ring, a holding mechanism is provided inside the welding groove, and the holding mechanism is used to hold the semiconductor device, a lifting ring is provided on the outside of the pressure ring, the pressure ring is connected to the lifting ring through a rotating mechanism, and the lifting ring is connected to the support frame through the lifting mechanism, the rotating mechanism is used to drive the pressure ring to rotate, thereby adjusting the position of the holding mechanism, and the lifting mechanism is used to drive the lifting ring to move up and down, and a blowing mechanism is provided on the limiting frame, and the blowing mechanism is used to blow air to the semiconductor device; The cam is fixedly provided with a first end for sliding the piston into the air filter, and the second end for sliding the piston into the air filter is fixedly provided with a first end for sliding the piston into the air filter, and the second end for sliding the piston into the air filter, and the second end for sliding the piston into the air filter, and the second end for sliding the piston into the air filter. The fixing assembly includes a groove provided on the inner wall of the air pressure cylinder, a card block is slidably connected inside the groove, one end of the card block is connected to the inner wall of the groove through a second elastic component, and the other end of the card block is in contact with the side wall of the push rod, wherein the side wall of the push rod is provided with a card slot adapted to the card block, and the card block is traction-connected with a traction component, which is used to pull the card block so that the card block no longer fixes the push rod; The traction component includes a push block arranged above the fixed cylinder, the end of the push block extends to the outside of the fixed cylinder, a slide rod is fixed to the bottom of the push block, the lower end of the slide rod extends into the interior of the fixed cylinder and is slidably connected to the fixed cylinder, wherein a traction rope is fixed to the lower end of the slide rod, and the other end of the traction rope extends into the interior of the groove and is fixedly connected to the clamping block, and an extrusion block for extruding the push block is fixed on the top of the welding platform, the extrusion block is arranged in a ring shape, and a give way groove is provided on the inner side of the extrusion block and the surface of the welding platform.

2. The semiconductor device packaging welding structure according to claim 1, characterized in that: The holding mechanism includes a pressing plate arranged on the inner side of the welding groove, and moving blocks are fixed to the ends of the pressing plates, one of the moving blocks is threadedly connected to a first threaded rod, and the first threaded rod is rotatably connected to the inner wall of the limit frame, and the other moving block has a limiting rod passing through it, and the limiting rod is fixedly connected to the inner wall of the limit frame, and a first motor is fixed to the outside of the limit frame, and the output end of the first motor is fixedly connected to one end of the first threaded rod.

3. The semiconductor device packaging welding structure according to claim 1, characterized in that: The lifting mechanism includes a second threaded rod threadedly connected to the lifting ring, a second motor is installed on the top of the support frame, the output end of the second motor is fixedly connected to one end of the second threaded rod, and a guide rod is fixed between the top of the support frame and the welding platform, the guide rod passes through the lifting ring and is slidably connected to the lifting ring.

4. The semiconductor device packaging welding structure according to claim 1, characterized in that: The rotating mechanism includes a third motor installed on the top of the pressure ring, the output end of the third motor passes through the pressure ring and is fixedly connected to a gear, a gear ring is fixed to the outside of the pressure ring, and the gear ring is engaged with the gear, wherein a support groove adapted to the pressure ring is provided on the inner wall of the lifting ring, and the side wall of the pressure ring is located inside the support groove and is slidably connected to the support groove.

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